A microchannel liquid-cooled cold plate radiator

Abstract

The present invention discloses a microchannel liquid-cooled cold plate radiator, comprising: a liquid collecting chamber structure, a microchannel cold plate, a nozzle inlet and a nozzle outlet; the nozzle inlet and the nozzle outlet are located at the top of the liquid collecting chamber structure, and the nozzle inlet is connected to the liquid collecting chamber of the liquid collecting chamber structure; the microchannel cold plate is fixed at the bottom of the liquid collecting chamber structure; the nozzle outlet passes through the liquid collecting chamber structure and is connected to the microchannel on the microchannel cold plate; wherein a jet hole array is arranged at the bottom of the liquid collecting chamber structure; when working, the coolant is introduced from the nozzle inlet, and after being integrated and diverted by the liquid collecting chamber, it enters the jet hole array to form a jet-like fluid and enters several microchannels of the microchannel cold plate, and flows out from the nozzle outlet through several microchannels; wherein the number of jet holes near the nozzle outlet is greater than the number of jet holes near the nozzle inlet. The difference in heat exchange effect between the nozzle inlet and the nozzle outlet is reduced, and the problem of uneven temperature distribution of chips at different positions is improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of radiators, and in particular to a microchannel liquid-cooled cold plate radiator. Background Art

[0002] As the power density and integration of semiconductor chips continue to increase, the thermal management problem caused by the ultra-high heat flux density generated during continuous high-load operation has become one of the main bottlenecks restricting their performance improvement. If the excess heat cannot be removed quickly and effectively, the performance and life of the chip will be greatly reduced, and there is even a risk of the chip burning.

[0003] At present, for the heat dissipation of semiconductor chips in servers, a microchannel liquid-cooled cold plate radiator combining jets and microchannels is usually used for heat dissipation; however, in the microchannel liquid-cooled cold plate radiator in the prior art, the heat exchange effect of the chip near the nozzle inlet is better due to the faster flow rate of the coolant at the nozzle inlet; and the less water flows toward the nozzle outlet, the less heat is taken away, and the worse the heat exchange effect is, resulting in a large difference in the heat exchange effect between the nozzle inlet and the nozzle outlet, thereby causing uneven temperature distribution of the chip at different positions. Summary of the invention

[0004] The embodiment of the present invention provides a microchannel liquid-cooled cold plate radiator to reduce the difference in heat exchange effect between a nozzle inlet and a nozzle outlet, and improve the problem of uneven temperature distribution of chips at different positions.

[0005] The embodiment of the present invention provides a microchannel liquid-cooled cold plate radiator, comprising: a liquid collecting chamber structure, a microchannel cold plate, a nozzle inlet and a nozzle outlet;

[0006] The nozzle inlet and the nozzle outlet are located at the top of the liquid collecting chamber structure, and the nozzle inlet is communicated with the liquid collecting chamber of the liquid collecting chamber structure; the microchannel cold plate is fixed to the bottom of the liquid collecting chamber structure; the nozzle outlet passes through the liquid collecting chamber structure and is communicated with the microchannel on the microchannel cold plate;

[0007] The bottom of the liquid collecting chamber structure is provided with a jet hole array; when working, the coolant is introduced from the nozzle inlet, integrated and split through the liquid collecting chamber, enters the jet hole array to form a jet-like fluid, enters a plurality of microchannels of the microchannel cold plate, and flows out from the nozzle outlet through the plurality of microchannels;

[0008] The number of the jet holes near the nozzle outlet is greater than the number of the jet holes near the nozzle inlet.

[0009] The technical solution provided by the embodiment of the present invention sets the number of jet holes near the nozzle outlet to be greater than the number of jet holes near the nozzle inlet, so that the jets passing through a smaller number of jet holes can ensure the heat exchange effect of the chip at the inlet while distributing most of the liquid into the jet holes near the nozzle outlet, thereby reducing the difference in heat exchange effect between the nozzle inlet and the nozzle outlet, improving the problem of uneven chip temperature distribution at different positions, and ensuring the overall heat exchange effect of the CPU chip.

[0010] Furthermore, the surface of the microchannel cold plate away from the liquid collecting chamber structure is in contact with at least one chip to be cooled; and the vertical projection of the jet hole array on the microchannel cold plate at least partially overlaps with the vertical projection of the chip to be cooled on the microchannel cold plate.

[0011] The technical solution provided by the embodiment of the present invention is to set the vertical projection of the jet hole array on the microchannel cold plate to at least partially overlap the vertical projection of the chip to be cooled on the microchannel cold plate, so that the area of ​​the microchannel cold plate where the coolant entering the liquid collecting cavity impacts after passing through the jet holes is at least a part of the heat exchange area of ​​the chip to be cooled, and the chip to be cooled is directly cooled, thereby improving the heat dissipation efficiency of the chip to be cooled.

[0012] Furthermore, a vertical projection of the chip to be cooled on the microchannel cold plate is located within a vertical projection of the jet hole array on the microchannel cold plate.

[0013] The technical solution provided by the embodiment of the present invention is to set the vertical projection of the chip to be cooled on the microchannel cold plate, which is located within the vertical projection of the jet hole array on the microchannel cold plate, so that the coolant entering the liquid collecting cavity is ejected through the jet holes and then impacts the entire heat exchange area of ​​the chip to be cooled, that is, the jet holes are distributed above the entire chip to be cooled, and the entire chip to be cooled can be directly cooled, thereby further improving the cooling efficiency of the chip to be cooled. In addition, the jet hole plate is designed for the CPU chip that needs to be cooled, and only the array jet holes are designed at the CPU chip, which reduces the structural design and thus reduces the unnecessary power consumption loss.

[0014] Furthermore, a microchannel fin array is arranged on the surface of the microchannel cold plate close to the liquid collecting chamber structure; the microchannel fin array is used to form a number of through microchannels on the surface of the cold plate close to the liquid collecting chamber structure; the jet holes at the bottom of the liquid collecting chamber structure correspond to the several microchannels respectively.

[0015] According to the technical solution provided by the embodiment of the present invention, the surface of the microchannel cold plate has a microchannel fin array, and a plurality of through-going microchannels are formed on the surface of the cold plate close to the liquid collecting chamber structure through the microchannel fin array, which can facilitate the circulation of the coolant, thereby improving the heat dissipation efficiency of the heat dissipation chip.

[0016] Furthermore, the jet holes at the bottom of the liquid collecting chamber structure include multiple first jet holes and multiple second jet holes; the hole area of ​​the first jet holes is larger than the hole area of ​​the second jet holes; the first jet holes are arranged closer to the nozzle outlet, and the second jet holes are arranged closer to the nozzle inlet.

[0017] According to the technical solution provided by the embodiment of the present invention, the array jet holes are distributed with two sizes of holes. Since there are fewer jet holes at the nozzle inlet, some small-sized jet holes are arranged here to ensure a suitable amount of incident fluid at the nozzle inlet.

[0018] Furthermore, the jet holes at the bottom of the liquid collecting chamber structure include a plurality of first jet holes and a plurality of second jet holes; the hole area of ​​the first jet holes is greater than the hole area of ​​the second jet holes; wherein the number of the first jet holes close to the nozzle outlet is greater than the number of the first jet holes close to the nozzle inlet; and, relative to the nozzle inlet, the second jet holes are closer to the nozzle outlet.

[0019] According to the technical solution provided by the embodiment of the present invention, the array jet holes are distributed with two sizes of hole types. The first jet holes can be arranged near the nozzle inlet and the nozzle outlet. The number of the first jet holes near the nozzle inlet is greater than the number of the first jet holes near the nozzle outlet, thereby increasing the jet flow rate out of the nozzle outlet. By adding some small-sized jet holes near the nozzle outlet, the jet flow rate out of the nozzle outlet can be further increased. At the same time, the heat exchange difference between the nozzle outlet and the nozzle inlet can be finely and accurately adjusted through the small-sized jet holes, thereby preventing the jet flow rate out of the large nozzle outlet from increasing excessively.

[0020] Furthermore, the microchannel fin array includes a plurality of pin-fin fins; in an area of ​​the microchannel cold plate close to the nozzle outlet, at least two jet holes are provided on the top edge of each pin-fin fin.

[0021] The technical solution provided by the embodiment of the present invention is that in the area of ​​the microchannel cold plate close to the nozzle outlet, at least two jet holes will be focused near each microchannel fin, which can increase the coolant flow rate of the microchannel at the nozzle outlet, thereby reducing the difference in heat exchange effect between the nozzle inlet and the nozzle outlet, improving the problem of uneven chip temperature distribution at different positions, and ensuring the overall heat exchange effect of the CPU chip.

[0022] Furthermore, the nozzle inlet and the nozzle outlet are located on the center line of the surface where the top of the liquid collecting chamber structure is located, and are located on opposite sides of the top of the liquid collecting chamber structure; wherein, the width of the microchannel near the nozzle outlet is greater than the width of the microchannel near the nozzle inlet.

[0023] The technical solution provided by the embodiment of the present invention is that since the temperature of the chip near the nozzle outlet is prone to overheating, in order to ensure the heat exchange effect of the chip here, the width of the microchannel in the center of the chip near the nozzle outlet is increased, so that the jet fluid passing through the corresponding jet hole can pass more through the microchannel here, thereby enhancing the convective heat transfer effect.

[0024] Furthermore, the microchannel cold plate includes a heat exchange area and an edge area surrounding the heat exchange area; the chip to be cooled contacts the microchannel cold plate located in the heat exchange area; at least part of the vertical projection of the nozzle inlet on the microchannel cold plate is located in the heat exchange area; at least part of the vertical projection of the nozzle outlet on the microchannel cold plate is located in the heat exchange area.

[0025] According to the technical solution provided by the embodiment of the present invention, the nozzle inlet and the nozzle outlet are arranged above the heat exchange area of ​​the microchannel cold plate, and the chip to be cooled is fixed to the heat exchange area of ​​the microchannel cold plate, so that most of the coolant entering from the nozzle inlet flows to the nozzle outlet through the heat exchange area to cool the chip to be cooled.

[0026] Further, the heat exchange zone includes a first area and a second area and a third area located on opposite sides of the first area; the second area is closer to the nozzle outlet, and the third area is closer to the nozzle inlet; wherein the cross-sectional area of ​​the microchannel fins located in the second area is smaller than the cross-sectional area of ​​the microchannel fins located in the first area; the cross-sectional area of ​​the microchannel fins located in the first area is smaller than the cross-sectional area of ​​the microchannel fins located in the third area.

[0027] The technical solution provided by the embodiment of the present invention is that since the temperature of the chip near the nozzle outlet is prone to overheating, in order to ensure the heat exchange effect of the chip here, the microchannel fins in the center of the chip near the nozzle outlet are smaller, so that the microchannel width in the center of the chip near the nozzle outlet is larger, and the microchannel fins in the center of the chip near the nozzle inlet are larger, so that the microchannel width in the center of the chip near the nozzle outlet is smaller, thereby further reducing the difference in heat exchange effect between the nozzle inlet and the nozzle outlet, improving the problem of uneven chip temperature distribution at different positions, and ensuring the overall heat exchange effect of the CPU chip.

[0028] Further, the cross-sectional area of ​​the microchannel fins located in the edge region is larger than the cross-sectional area of ​​the microchannel fins located in the heat exchange region.

[0029] According to the technical solution provided by the embodiment of the present invention, since the chip to be cooled is fixed in the heat exchange area of ​​the microchannel cold plate, the cross-sectional area of ​​the microchannel fins located in the edge area is larger than the cross-sectional area of ​​the microchannel fins located in the heat exchange area, thereby hindering the coolant from flowing to the edge area, so that more coolant can flow into the heat exchange area of ​​the microchannel cold plate, thereby ensuring the heat exchange efficiency of the heat exchange area.

[0030] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 It is a schematic diagram of the three-dimensional structure of a microchannel liquid-cooled cold plate radiator provided by an embodiment of the present invention;

[0033] Figure 2 is a perspective view of the internal structure of a microchannel liquid-cooled cold plate radiator provided by an embodiment of the present invention;

[0034] Figure 3 It is a structural block diagram of a microchannel liquid-cooled cold plate radiator provided by an embodiment of the present invention;

[0035] Figure 4 yes Figure 2 A front view of the structure shown;

[0036] Figure 5 yes Figure 2 a side view of the structure shown;

[0037] Figure 6 yes Figure 2 a top view of the structure shown;

[0038] Figure 7 It is a structural schematic diagram of a microchannel cold plate provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0040] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0041] The embodiment of the present invention provides a microchannel liquid-cooled cold plate radiator, referring to Figure 1 to Figure 6 , the microchannel liquid-cooled cold plate radiator 100 comprises: a liquid collecting chamber structure 30, a microchannel cold plate 70, a nozzle inlet 1 and a nozzle outlet 2;

[0042] The nozzle inlet 1 and the nozzle outlet 2 are located at the top of the liquid collecting chamber structure 30, and the nozzle inlet 1 is connected to the liquid collecting chamber 3 of the liquid collecting chamber structure 30; the microchannel cold plate 70 is fixed to the bottom of the liquid collecting chamber structure 30; the nozzle outlet 2 penetrates the liquid collecting chamber structure 30 and is connected to the microchannel 7 on the microchannel cold plate 70;

[0043] The bottom of the liquid collecting chamber structure 30 is provided with a jet hole array; when working, the coolant is introduced from the nozzle inlet 1, integrated and divided through the liquid collecting chamber 3, and enters the jet hole array to form a jet-like fluid, enters the several microchannels 7 of the microchannel cold plate 70, and flows out from the nozzle outlet 2 through the several microchannels 7; the jet hole array includes a plurality of jet holes 301;

[0044] The number of the jet holes 301 close to the nozzle outlet 2 is greater than the number of the jet holes 301 close to the nozzle inlet 1 .

[0045] Specifically, the liquid collecting chamber structure 30 is a hollow cavity structure, and a nozzle inlet 1 and a nozzle outlet 2 are provided on the top thereof. The nozzle inlet 1 is the coolant inlet, and the nozzle outlet 2 is the coolant outlet. The nozzle inlet 1 is connected to the hollow cavity (liquid collecting chamber 3) inside the liquid collecting chamber structure 30. The nozzle outlet 2 runs through the liquid collecting chamber structure 30 and is connected to the microchannel 7 in the microchannel cold plate 70 located below the liquid collecting chamber structure 30. The bottom surface of the liquid collecting chamber structure 30 is provided with jet holes to form a jet hole plate 4 with a jet hole array. The microchannel cold plate 70 is plate-shaped, and a plurality of microchannels 7 passing through the top surface are provided on the top surface. The material of the microchannel cold plate 70 can be copper, and the bottom of the microchannel cold plate 70 is seamlessly bonded to the heat source chip (10) to conduct the heat of the heat source chip (10), limit the directional flow of the liquid after the jet, and minimize the mutual influence of adjacent jet nozzles.

[0046] During operation, the coolant is introduced from the nozzle inlet 1, integrated and split through the liquid collecting chamber 3, enters the jet hole array to form a jet-like fluid, enters the several microchannels 7 of the microchannel cold plate 70, and flows out from the nozzle outlet 2 through the several microchannels 7. Among them, the number of jet holes near the nozzle outlet 2 is greater than the number of jet holes near the nozzle inlet 1. By setting the number of jet holes 301 near the nozzle outlet 2 to be greater than the number of jet holes 301 near the nozzle inlet 1, the coolant entering the liquid collecting chamber 3 is ejected through a smaller number of jet holes 301 at the nozzle inlet 1, and is ejected through a larger number of jet holes 301 at the nozzle outlet 2. Since the flow rate of the fluid at the nozzle inlet 1 is relatively fast, the jet through a relatively small number of jet holes 301 can ensure the heat exchange effect of the chip 10 to be cooled at the inlet, while being able to distribute most of the liquid into the jet holes 301 near the nozzle outlet 2, thereby reducing the difference in heat exchange effect between the nozzle inlet 1 and the nozzle outlet 2, improving the problem of uneven temperature distribution of the chip 10 to be cooled at different positions, and ensuring the overall heat exchange effect of the CPU chip.

[0047] The microchannel liquid-cooled cold plate radiator provided in the embodiment of the present invention, by setting the number of jet holes 301 near the nozzle outlet 2 to be greater than the number of jet holes 301 near the nozzle inlet 1, can ensure the heat exchange effect of the chip at the inlet while allocating most of the liquid to the jet holes 301 near the nozzle outlet 2, thereby reducing the difference in heat exchange effect between the nozzle inlet 1 and the nozzle outlet 2, improving the problem of uneven temperature distribution of the chip 10 to be cooled at different positions, and ensuring the overall heat exchange effect of the CPU chip.

[0048] Based on the above embodiments, Figure 4 and Figure 6In one embodiment of the present invention, the surface of the microchannel cold plate 70 away from the liquid collecting chamber structure 30 is in contact with at least one chip 10 to be cooled; the vertical projection of the jet hole array on the microchannel cold plate 70 at least partially overlaps with the vertical projection of the chip 10 to be cooled on the microchannel cold plate 70.

[0049] Specifically, jet refers to the process in which a fluid continues to flow after passing through one or more holes and leaving the solid boundary, impacting another solid wall surface, taking away the heat of the other solid wall surface, and leaving the heat exchange surface. The vertical projection of the jet hole array on the microchannel cold plate 70 is set to overlap at least partially with the vertical projection of the chip 10 to be cooled on the microchannel cold plate 70, so that the coolant entering the liquid collecting chamber 3 is impacted by the microchannel cold plate 70 after passing through the jet holes (the first jet hole 5 and the second jet hole 6) and contacts at least part of the chip 10 to be cooled on the surface away from the liquid collecting chamber structure 30. In other words, the area of ​​the microchannel cold plate 70 impacted by the coolant entering the liquid collecting chamber 3 after passing through the jet holes is the heat exchange area of ​​at least part of the chip 10 to be cooled, so that at least part of the chip 10 to be cooled is cooled by the coolant ejected at the first time, rather than by the coolant after being heated by the microchannel cold plate 70, thereby improving the heat dissipation efficiency of the chip 10 to be cooled.

[0050] Further, refer to Figure 6 The vertical projection of the chip 10 to be cooled on the microchannel cold plate 70 is located within the vertical projection of the jet hole array on the microchannel cold plate 70 .

[0051] Specifically, by setting the vertical projection of the chip 10 to be cooled on the microchannel cold plate 70, it is located within the vertical projection of the jet hole array on the microchannel cold plate 70, so that the coolant entering the liquid collecting chamber 3 is ejected through the jet holes and then impacts the entire heat exchange area of ​​the chip 10 to be cooled, that is, the jet holes are distributed above the entire chip 10 to be cooled, and the entire chip 10 to be cooled can be directly cooled, thereby further improving the cooling efficiency of the chip 10 to be cooled. In addition, the jet hole plate 4 is designed for the CPU chip that needs to be cooled, and the jet hole array is only set at the CPU chip, which reduces the structural design and thus reduces the unnecessary power loss.

[0052] Based on the above embodiments, in one embodiment of the present invention, reference is made to Figure 7 , and combined with Figure 6 A microchannel fin array is arranged on the surface of the microchannel cold plate 70 close to the liquid collecting chamber structure 30; the microchannel fin array is used to form a plurality of through microchannels 7 on the surface of the cold plate close to the liquid collecting chamber structure 30; the jet holes at the bottom of the liquid collecting chamber structure 30 correspond to the plurality of microchannels 7 respectively.

[0053] Specifically, the surface of the microchannel cold plate 70 has a microchannel fin array, which includes a plurality of pin-fin fins 701 arranged in an array, and the pin-fin fins 701 are between adjacent microchannels 7. The jet holes at the bottom of the liquid collecting chamber structure 30 correspond to a plurality of microchannels 7, respectively, so that the jets from the jet holes enter the microchannels 7. The microchannel fin array forms a plurality of through microchannels 7 on the surface of the cold plate near the liquid collecting chamber structure 30, which can facilitate the circulation of the coolant, thereby improving the heat dissipation efficiency of the heat dissipation chip 10.

[0054] Based on the above embodiments, in one embodiment of the present invention, please continue to refer to Figure 6 The jet holes at the bottom of the liquid collecting chamber structure 30 include multiple first jet holes 5 and multiple second jet holes 6; the hole area of ​​the first jet hole 5 is larger than the hole area of ​​the second jet hole 6; the number of the first jet holes near the nozzle outlet 2 is greater than or equal to the number of the first jet holes near the nozzle inlet 1; the second jet holes are located near the nozzle outlet 2.

[0055] Specifically, the array jet holes are distributed with two sizes of hole types. The first jet holes 5 can be arranged near the nozzle inlet 1 and the nozzle outlet 2. The number 5 of the first jet holes near the nozzle inlet 1 is greater than or equal to the number of the first jet holes 5 near the nozzle outlet 2, thereby increasing the jet flow rate out of the nozzle outlet 2. On this basis, some small-sized second jet holes 6 are added near the nozzle outlet 2, which can further increase the jet flow rate at the nozzle outlet 2. At the same time, the heat exchange difference between the nozzle outlet 2 and the nozzle inlet 1 can be finely and accurately adjusted through the small-sized second jet holes 6, thereby preventing the jet flow rate at the large nozzle outlet 2 from increasing excessively.

[0056] On the basis of the above embodiments, in another embodiment of the present invention, the jet holes at the bottom of the liquid collecting chamber structure 30 include multiple first jet holes and multiple second jet holes; the hole area of ​​the first jet hole is larger than the hole area of ​​the second jet hole; the first jet hole is arranged closer to the nozzle outlet 2, and the second jet hole is arranged closer to the nozzle inlet 1 (not shown).

[0057] Specifically, the array jet holes are distributed with two sizes of holes. Since there are fewer jet holes at the nozzle inlet 1, a small-sized jet hole is set at the nozzle inlet 1 to ensure an appropriate amount of incident fluid at the nozzle inlet 1, reduce the difference in heat exchange effects between the nozzle inlet 1 and the nozzle outlet 2, improve the problem of uneven temperature distribution of the chip 10 at different positions, and ensure the overall heat exchange effect of the CPU chip.

[0058] Based on the above embodiments, in one embodiment of the present invention, please continue to refer to Figure 6 and Figure 7The microchannel fin array includes a plurality of pin-fin fins 701; in the area of ​​the microchannel cold plate 70 close to the nozzle outlet 2, at least two jet holes are arranged on the top edge of each pin-fin fin (8 / 9).

[0059] Specifically, in the area of ​​the microchannel cold plate 70 near the nozzle outlet 2, at least two jet holes are focused near each pin-fin fin (8 / 9), and the at least two jet holes can be first jet holes 5 with a larger hole area, or second jet holes 6 with a smaller hole area, or part of the first jet holes 5 and part of the second jet holes 6. In the area of ​​the microchannel cold plate 70 near the nozzle outlet 2, at least two jet holes are focused near each pin-fin fin (8 / 9), which can increase the coolant flow rate of the microchannel 7 at the nozzle outlet 2, thereby reducing the difference in heat exchange effects at the nozzle inlet 1 and the nozzle outlet 2, improving the problem of uneven temperature distribution of the chip 10 at different positions, and ensuring the overall heat exchange effect of the CPU chip.

[0060] Based on the above embodiments, in one embodiment of the present invention, reference is made to Figure 1 to Figure 3 ,and Figure 6 The nozzle inlet 1 and the nozzle outlet 2 are located on the center line of the surface where the top of the liquid collecting chamber structure 30 is located, and are located on opposite sides of the top of the liquid collecting chamber structure 30; wherein, the width of the microchannel 7 near the nozzle outlet 2 is greater than the width of the microchannel 7 near the nozzle inlet 1.

[0061] Specifically, since the temperature of the chip 10 near the nozzle outlet 2 is prone to overheating, in order to ensure the heat exchange effect of the chip 10 here, the width of the microchannel 7 at the center of the chip 10 to be cooled near the nozzle outlet 2 is increased, so that the jet fluid passing through the corresponding jet hole 301 can pass more through the microchannel 7 here, thereby enhancing the convective heat exchange effect. In addition, the nozzle inlet 1 and the nozzle outlet 2 are located on the center line of the surface where the top of the liquid collecting chamber structure 30 is located, and are located on opposite sides of the top of the liquid collecting chamber structure 30. After the coolant enters the nozzle inlet 1, it can flow from one end of the liquid collecting chamber structure 30 to the other opposite end. The jet holes 301 at the bottom of the liquid collecting chamber structure 30 are symmetrically arranged according to the center line. After the coolant passes through the jet holes, the jet amount at different positions is symmetrically distributed according to the center line, so that the heat exchange area on the microchannel cold plate 70 can be divided into two areas with equal or approximately equal heat exchange efficiency according to the center line, improving the problem of uneven temperature distribution of the chip 10 to be cooled at different positions above and below the microchannel cold plate 70.

[0062] Exemplary, reference Figure 6, four nuts 11 are installed on the four corners of the microchannel cold plate 70; the microchannel cold plate 70 is attached to 9 chips 10 to be cooled, wherein the 9 chips 10 to be cooled have a jet array composed of correspondingly arranged first jet holes 5 and / or second jet holes 6; after the impact liquid enters the nozzle inlet 1, it passes through the jet holes 5 and 6, and then enters the microchannel 7 after becoming a jet-like fluid, and flows out to the surroundings through the microchannel 7, wherein three fins 8, 9 and 13 of different sizes are included between the microchannels 7, and the impact liquid finally flows out through the nozzle outlet 2.

[0063] On the basis of the above embodiments, in one embodiment of the present invention, the microchannel cold plate 70 includes a heat exchange area and an edge area surrounding the heat exchange area; the chip 10 to be cooled contacts the microchannel cold plate 70 located in the heat exchange area; at least part of the vertical projection of the nozzle inlet 1 on the microchannel cold plate 70 is located in the heat exchange area; at least part of the vertical projection of the nozzle outlet 2 on the microchannel cold plate 70 is located in the heat exchange area.

[0064] Specifically, the nozzle inlet 1 and the nozzle outlet 2 are arranged above the heat exchange area of ​​the microchannel cold plate 70, and the chip 10 to be cooled is fixed to the heat exchange area of ​​the microchannel cold plate 70, so that in the process of the coolant entering from the nozzle inlet 1 and flowing to the nozzle outlet 2, most of the coolant flows through the heat exchange area to dissipate the heat of the chip 10 to be cooled.

[0065] On the basis of the above embodiments, in one embodiment of the present invention, the heat exchange zone includes a first area and a second area and a third area located on opposite sides of the first area; the second area is closer to the nozzle outlet 2, and the third area is closer to the nozzle inlet 1; wherein the cross-sectional area of ​​the microchannel fins 8 located in the second area is smaller than the cross-sectional area 9 of the microchannel fins located in the first area; the cross-sectional area of ​​the microchannel fins 9 located in the first area is smaller than the cross-sectional area of ​​the microchannel fins located in the third area 13.

[0066] Specifically, since the temperature of the chip 10 near the nozzle outlet 2 is prone to overheating, in order to ensure the heat exchange effect of the chip 10 here, the cross-sectional area of ​​the microchannel fin 8 near the nozzle outlet 2 is set to be smaller, so that the width of the microchannel 7 of 8 near the nozzle outlet 2 is larger, and the cross-sectional area of ​​the microchannel fin 13 near the nozzle inlet 1 is larger, so that the width of the microchannel 7 near the nozzle outlet 2 is smaller, thereby further reducing the difference in heat exchange effects between the nozzle inlet 1 and the nozzle outlet 2, improving the problem of uneven temperature distribution of the chips 10 to be cooled at different positions, and ensuring the overall heat exchange effect of the CPU chip.

[0067] Furthermore, the cross-sectional area of ​​the microchannel fins 14 located in the edge area is greater than the cross-sectional area of ​​the microchannel fins (8 / 9 / 13) located in the heat exchange area. It can be understood that, since the heat dissipation chip 10 is fixed to the heat exchange area of ​​the microchannel cold plate 70, the cross-sectional area of ​​the microchannel fins 14 located in the edge area is greater than the cross-sectional area of ​​the microchannel fins (8 / 9 / 13) located in the heat exchange area, which can hinder the coolant from flowing to the edge area, so that the coolant can flow more into the heat exchange area of ​​the microchannel cold plate 70, thereby ensuring the heat exchange efficiency of the heat exchange area.

[0068] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A microchannel liquid-cooled cold plate radiator, characterized in that: include: A liquid collecting chamber structure, a microchannel cold plate, a nozzle inlet and a nozzle outlet; The nozzle inlet and the nozzle outlet are located at the top of the liquid collecting chamber structure, and the nozzle inlet is communicated with the liquid collecting chamber of the liquid collecting chamber structure; the microchannel cold plate is fixed to the bottom of the liquid collecting chamber structure; the nozzle outlet passes through the liquid collecting chamber structure and is communicated with the microchannel on the microchannel cold plate; The bottom of the liquid collecting chamber structure is provided with a jet hole array; when working, the coolant is introduced from the nozzle inlet, integrated and split through the liquid collecting chamber, enters the jet hole array to form a jet-like fluid, enters a plurality of microchannels of the microchannel cold plate, and flows out from the nozzle outlet through the plurality of microchannels; wherein the number of the jet holes near the nozzle outlet is greater than the number of the jet holes near the nozzle inlet; A microchannel fin array is arranged on the surface of the microchannel cold plate on one side close to the liquid collecting chamber structure; the microchannel fin array is used to form a plurality of through-going microchannels on the surface of the cold plate on one side close to the liquid collecting chamber structure; the microchannel cold plate includes a heat exchange area and an edge area surrounding the heat exchange area, and the cross-sectional area of ​​the microchannel fins located in the edge area is larger than the cross-sectional area of ​​the microchannel fins located in the heat exchange area.

2. The microchannel liquid-cooled cold plate radiator according to claim 1, characterized in that: The surface of the microchannel cold plate away from the liquid collecting chamber structure is in contact with at least one chip to be cooled; the vertical projection of the jet hole array on the microchannel cold plate at least partially overlaps with the vertical projection of the chip to be cooled on the microchannel cold plate.

3. The microchannel liquid-cooled cold plate radiator according to claim 2, characterized in that: The jet holes at the bottom of the liquid collecting chamber structure correspond to a plurality of microchannels respectively.

4. The microchannel liquid-cooled cold plate radiator according to claim 2, characterized in that: The vertical projection of the chip to be cooled on the microchannel cold plate is located within the vertical projection of the jet hole array on the microchannel cold plate.

5. The microchannel liquid-cooled cold plate radiator according to claim 2, characterized in that: The jet holes at the bottom of the liquid collecting chamber structure include a plurality of first jet holes and a plurality of second jet holes; the hole area of ​​the first jet holes is greater than the hole area of ​​the second jet holes; The number of the first jet holes near the nozzle outlet is greater than the number of the first jet holes near the nozzle inlet; and the second jet holes are closer to the nozzle outlet relative to the nozzle inlet; Alternatively, the first jet hole is arranged closer to the nozzle outlet, and at least part of the second jet hole is arranged closer to the nozzle inlet.

6. The microchannel liquid-cooled cold plate radiator according to claim 3, characterized in that: The microchannel fin array includes a plurality of pin-fin-shaped fins; In an area of ​​the microchannel cold plate close to the nozzle outlet, at least two jet holes are provided on the top edge of each of the pin-fin-shaped fins.

7. The microchannel liquid-cooled cold plate radiator according to claim 6, characterized in that: The nozzle inlet and the nozzle outlet are located on the center line of the surface where the top of the liquid collecting chamber structure is located, and are located on opposite sides of the top of the liquid collecting chamber structure; Wherein, the width of the microchannel close to the nozzle outlet is greater than the width of the microchannel close to the nozzle inlet.

8. The microchannel liquid-cooled cold plate radiator according to claim 7, characterized in that: The chip to be cooled is in contact with the microchannel cold plate located in the heat exchange area; at least part of the vertical projection of the nozzle inlet on the microchannel cold plate is located in the heat exchange area; at least part of the vertical projection of the nozzle outlet on the microchannel cold plate is located in the heat exchange area.

9. The microchannel liquid-cooled cold plate radiator according to claim 8, characterized in that: The heat exchange area includes a first area and a second area and a third area located on opposite sides of the first area; the second area is closer to the nozzle outlet, and the third area is closer to the nozzle inlet; Among them, the cross-sectional area of ​​the microchannel fins located in the second region is smaller than the cross-sectional area of ​​the microchannel fins located in the first region; the cross-sectional area of ​​the microchannel fins located in the first region is smaller than the cross-sectional area of ​​the microchannel fins located in the third region.

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