Laser automatic soldering method and device

Abstract

The present invention is applicable to the field of metal soldering technology, and provides a laser automatic soldering control system, including: a high-definition camera, an image acquisition module, a welding parameter module, a three-dimensional control module, a welding head control module, a wireless communication module, an alarm, a memory, a control center, and a smart phone; the high-definition camera, the image acquisition module, the welding parameter module, the three-dimensional control module, the welding head control module, the wireless communication module, the alarm, and the memory are respectively connected to the control center; the smart phone is automatically networked with the wireless communication module through the Internet of Things or the Internet within the scope of the Internet of Things or the Internet. The present invention can automatically correct the solder position point, automatically solder, automatically transpose, and automatically detect the solder point, and can be intelligently controlled and networked monitored, and can speed up the processing speed of solder, improve the quality of solder, reduce the cost of solder, and thus improve the efficiency of solder processing.

Description

Technical Field

[0001] The invention belongs to the technical field of metal soldering, and more specifically, relates to a laser automatic soldering method and a device thereof. Background Art

[0002] Traditional soldering equipment is mainly semi-automatic, while in the field of laser soldering, two-dimensional laser soldering machines have been widely used in the flat soldering of various products. However, with the development of the industry, there has been a demand for soldering of three-dimensional curved workpieces. In order to meet such a demand, three-dimensional soldering equipment that can perform soldering on three-dimensional curved workpieces has begun to appear on the market. Since the soldering process of the current three-dimensional soldering equipment is not mature enough, there is a lot of redundant time between the various process actions when the equipment is soldering the curved workpiece, resulting in a long overall operating time. Especially when multiple devices need to be controlled to work at the same time, the redundant time between the soldering process will significantly reduce the progress of the soldering operation, resulting in the actual production capacity of the equipment being lower than its planned production capacity, and there is a problem of low processing efficiency. Summary of the invention

[0003] In order to solve the deficiencies in the prior art, the purpose of the present invention is to provide a laser automatic soldering method and device, which can automatically correct the solder position point, automatically solder, automatically change positions, and automatically detect solder points by setting a high-definition camera, an image acquisition module, a welding parameter module, a three-dimensional control module, a welding head control module, and a wireless communication module. It can perform intelligent control and network monitoring, speed up the soldering processing speed, improve the soldering quality, reduce the soldering cost, thereby improving the soldering processing efficiency, and solving the problem that the actual production capacity of the soldering equipment is lower than its theoretical production capacity and the processing efficiency is insufficient.

[0004] In order to achieve the above object, the technical solution adopted by the present invention is:

[0005] A laser automatic soldering method comprises the following steps:

[0006] S10, after the workpiece to be soldered is installed, the image information of the workpiece to be soldered is obtained through a high-definition camera and transmitted to a welding parameter module;

[0007] S20, outputting soldering process parameters and soldering instructions to the three-dimensional control module through the welding parameter module according to the clamping completion information of the workpiece to be soldered;

[0008] S30, the three-dimensional control module drives the robot arm to move to the target soldering position point according to the laser soldering instruction, determines the soldering position point corresponding to the workpiece to be soldered, and transmits it to the welding head control module;

[0009] S40, the welding head control module controls the soldering head to solder the workpiece to be soldered until the soldering is completed and transmitted to the high-definition camera;

[0010] S50, obtaining image information of the completed soldering points and soldering quality on the workpiece to be soldered by a high-definition camera, and transmitting the image information to an image acquisition module;

[0011] S60, the image acquisition module identifies the number of solder points and the quality of the solder according to the image information of the completed solder points and the solder quality on the workpiece to be soldered, and transmits it to the control center;

[0012] S70, the control center compares the actual soldering points and soldering quality with the soldering distribution points and soldering quality standards stored in the memory: if they are consistent, the machine is shut down; if they are inconsistent, the alarm is transmitted to the alarm and the welding parameter module is notified to continue soldering until the soldering is qualified.

[0013] Furthermore, before the step S30 of "controlling the robot arm to move to the target soldering position", the following steps are also included:

[0014] S301, obtaining, through an image acquisition module, the three-dimensional reference coordinates in the three-dimensional model corresponding to the workpiece to be soldered and a solder point running track layout diagram corresponding to the soldering;

[0015] S302, determining the corresponding three-dimensional reference coordinates of the soldering operation trajectory diagram of each soldering point on the three-dimensional model through the three-dimensional control module;

[0016] S303, controlling the robot arm through the welding head control module to calibrate the initial position according to the three-dimensional coordinates, and determining the target soldering point corresponding to the robot arm.

[0017] Furthermore, the step S30 of "determining the soldering position point corresponding to the workpiece to be soldered" also includes:

[0018] S31, obtaining image information of the workpiece to be soldered by a high-definition camera, and determining the number of solder points and / or the shape of solder points of the workpiece to be soldered;

[0019] S32, identifying the solder point layout area corresponding to the workpiece to be soldered according to the number of solder points and / or the shape of solder points through the image acquisition module.

[0020] Further explanation, before executing step S40 "controlling the electric welding head to solder the workpiece to be soldered", the following steps are also included:

[0021] S41, obtaining the position corresponding to the solder point layout area map through the image acquisition module, and setting the soldering processing parameters through the welding parameter module;

[0022] S42, controlling the robot arm to place the soldering points and soldering parameters at corresponding positions on the workpiece to be soldered through the three-dimensional control module;

[0023] S43, controlling the welding head control module to perform soldering processing on the soldering point layout area according to the soldering point layout diagram and the soldering processing parameters;

[0024] S44, after the laser soldering operation is completed through the high-definition camera, determine the next solder point area corresponding to the workpiece to be soldered, and return to execute steps S41 to S43 until all solder points corresponding to the workpiece to be soldered are completed.

[0025] A laser automatic soldering method of the present invention also includes a laser automatic soldering control system, including: a high-definition camera, an image acquisition module, a welding parameter module, a three-dimensional control module, a welding head control module, a wireless communication module, an alarm, a memory, a control center, and a smart phone; the high-definition camera, the image acquisition module, the welding parameter module, the three-dimensional control module, the welding head control module, the wireless communication module, the alarm, and the memory are respectively connected to the control center; the smart phone is automatically networked with the wireless communication module through the Internet of Things or the Internet within the scope of the Internet of Things or the Internet;

[0026] When the actual solder points and their solder quality are inconsistent with the stored solder distribution points and their solder quality standards, the alarm automatically sounds an alarm and transmits it to the welding parameter module;

[0027] The memory is responsible for storing information of the high-definition camera, image acquisition module, welding parameter module, three-dimensional control module, welding head control module, and storage of solder distribution points and solder quality standards;

[0028] The wireless communication module is provided with an Internet of Things module, which can automatically form a network within the scope of the Internet of Things or the Internet, and connect to the wireless network of the smartphone, and is responsible for sending and receiving wireless network signals;

[0029] The high-definition camera is responsible for obtaining image information of whether the workpiece to be soldered meets the clamping requirements and the completed solder points on the workpiece and their soldering quality, and transmits it to the welding parameter module or the image acquisition module;

[0030] The image acquisition module identifies the information of the number of solder points and the quality of the solder based on the image information of the completed solder points and the solder quality on the workpiece to be soldered, and transmits it to the welding parameter module or the control center;

[0031] The welding parameter module outputs the soldering process parameters to the three-dimensional control module according to the clamping completion information of the workpiece to be soldered;

[0032] The control center is responsible for information transmission among the high-definition camera, image acquisition module, welding parameter module, three-dimensional control module, and welding head control module. It is the hub of the system and compares the actual solder points and their solder quality with the stored solder distribution points and their solder quality standards. If they are consistent, the machine will be shut down; if they are inconsistent, the information will be transmitted to the alarm and notified to the welding parameter module.

[0033] Furthermore, the three-dimensional control module controls the position change of the welding head by controlling the up-down, left-right, and front-back position movement of the lifting frame, the left-right movable frame, and the front-back movable frame, and transmits the position change to the welding head control module.

[0034] Furthermore, the welding head control module is responsible for the specific processing of the solder by the welding head until the soldering is completed and transmitted to the high-definition camera.

[0035] The present invention also provides a laser automatic soldering device, which is realized by the above-mentioned laser automatic soldering method.

[0036] Furthermore, the present invention provides a laser automatic soldering device, comprising: a frame, a clamping platform, a mechanical arm, a machine head, a display screen, and a protective cover; the frame is provided with a clamping platform and a mechanical arm; the mechanical arm comprises a lifting frame with a slide groove on the front, a left-right movable frame with grooves at the upper and lower ends, and a front-back movable frame composed of a telescopic frame; a high-definition camera and a soldering head with a laser head are provided on the machine head; the display screen is provided on the back of the lifting frame, and an integrated chip is provided therein; the integrated chip is provided with an image acquisition module, a welding parameter module, a three-dimensional control module, a welding head control module, a wireless communication module, an alarm, a memory, and a control center; the protective cover is a transparent protective cover, which is provided on the frame;

[0037] One end of the clamping table is connected to the lifting frame of the robot arm; the back of the lifting frame is connected to the display screen; the lifting frame is fixedly connected to one end of the front and rear moving frame through the sliding groove in the middle of the front face; the lower end of the left and right moving frame is fixedly connected to the other end of the front and rear moving frame; a groove is symmetrically arranged at the upper and lower ends of the left and right moving frames, and is connected to the machine head through its groove, and a motor I is arranged inside the lifting frame, which can drive the front and rear moving frames to move up and down in the sliding groove in the middle of the front face of the lifting frame; a motor II is arranged in the machine head, which can control the machine head to move left and right in the grooves at the upper and lower ends of the left and right moving frames; a motor III is arranged in the left and right moving frames, which can extend and retract the front and rear moving frames.

[0038] Furthermore, a laser automatic soldering device provided by the present invention also includes a computer device and a computer-readable storage medium; the computer device includes a memory and various functional modules, the memory stores a computer program, and when the various functional modules execute the computer program, the steps of any one of the above-mentioned laser automatic soldering methods are implemented; the computer-readable storage medium stores a computer program, and when the computer program is executed by the various functional modules, the steps of any one of the above-mentioned laser automatic soldering methods are implemented.

[0039] The beneficial effects of the present invention compared with the prior art are as follows:

[0040] By setting up high-definition cameras, image acquisition modules, welding parameter modules, three-dimensional control modules, welding head control modules, and wireless communication modules, the solder position points can be automatically corrected, soldering can be performed automatically, position can be automatically changed, and solder points can be automatically detected. Intelligent control and network monitoring can be performed, which can speed up the soldering processing speed, improve the soldering quality, and reduce the soldering cost, thereby improving the soldering processing efficiency and solving the problem that the actual production capacity of the soldering equipment is lower than its theoretical production capacity and the processing efficiency is insufficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or exemplary technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] In the illustrations of the present application, "up", "down", "left", "right", "front" and "back" refer to positions moving in opposite directions on the "lifting frame", "left and right moving frame" and "front and back moving frame", respectively, unless otherwise clearly and specifically defined.

[0043] Figure 1 It is a schematic diagram of the method flow of the present invention;

[0044] Figure 2 It is a schematic diagram before step S30 in the method flow of the present invention;

[0045] Figure 3 It is a schematic diagram of the decomposition of step S30 in the method flow of the present invention;

[0046] Figure 4 It is a schematic diagram before step S40 in the method flow of the present invention;

[0047] Figure 5 It is a schematic diagram of the system module of the present invention;

[0048] Figure 6 It is a schematic diagram of the structure of the soldering device of the present invention.

[0049] Among them, the main marks of the drawings in the figure are:

[0050] 1-frame; 2-clamping table; 3-mechanical arm; 31-lifting frame; 311-slide; 32-left and right moving frame;

[0051] 321-groove; 33-front and rear moving frame; 4-machine head; 41-high-definition camera; 42-soldering head; 5-display screen; 6-protective cover. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0053] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments:

[0054] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0055] It should be noted that when a module is referred to as being "disposed on" another module, it can be directly on the other module or indirectly on the other module. When a module is referred to as being "connected to" another module, it can be directly connected to the other module or indirectly connected to the other module.

[0056] In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0057] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances. The terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0058] See also Figure 1 The present invention provides a laser automatic soldering method, comprising the following steps:

[0059] S10, when the operator inputs the soldering processing parameters through the display screen 5 and starts the power button, the protective cover 5 is opened, the workpiece to be soldered is installed, and the image information of whether the clamping of the workpiece to be soldered meets the requirements is obtained through the high-definition camera, and is transmitted to the welding parameter module;

[0060] S20, outputting soldering process parameters and soldering instructions to the three-dimensional control module through the welding parameter module according to the clamping completion information of the workpiece to be soldered;

[0061] S30, the three-dimensional control module drives the robot arm 3 to move to the target soldering position according to the laser soldering instruction, determines the soldering position point corresponding to the workpiece to be soldered, and transmits it to the welding head control module;

[0062] Further explanation, after the robot arm 3 is calibrated for the workpiece to be soldered and the target moving position is determined, the head 4 controls the robot arm 3 to move to the target soldering position to perform soldering operations on the workpiece to be soldered while waiting to receive the laser soldering instruction initiated by the operator; the three-dimensional control module controls the control motor to drive the front and rear moving frame 33 to move up and down in the slide groove 311 of the lifting frame 31 according to the welding process parameters, and at the same time drives the front and rear moving frame 33 to extend and retract forward and backward, and drives the head 4 to slide left and right in the groove 321 in the left and right moving frame 32, and controls the head 4 to move up and down, slide left and right, and extend and retract front and back within the maximum range to ensure that the solder head 42 reaches the soldering point at the set three-dimensional position.

[0063] See also Figure 2 , further illustrating that before "controlling the robot arm 3 to move to the target soldering position" in step S30, the following steps are also included:

[0064] S301, obtaining the three-dimensional reference coordinates in the three-dimensional model corresponding to the workpiece to be soldered and the solder point layout diagram corresponding to the soldering through the image acquisition module;

[0065] S302, determining the corresponding three-dimensional reference coordinates of the soldering operation trajectory diagram of each soldering point on the three-dimensional model through the three-dimensional control module;

[0066] S303, controlling the robot arm 3 to perform initial position calibration based on the three-dimensional reference coordinates through the welding head control module, and determining the target soldering position corresponding to the calibrated robot arm 3 according to the corresponding coordinates.

[0067] To further illustrate, by establishing a three-dimensional model of the product to be processed and ensuring that the coordinates of the three-dimensional model and the product to be processed are consistent, the three-dimensional reference coordinates of the three-dimensional model are used as the position calibration reference of the robot arm 3, and the corresponding coordinates of the solder point layout diagram simulated and drawn on the three-dimensional model are used as the target soldering position reference of the robot arm 3. After the position of the robot arm 3 is calibrated, when the welding head control module receives the laser soldering instruction, the robot arm 3 is controlled to move to the corresponding target soldering position for soldering.

[0068] See also Figure 3 , further explained, the step S30 of "determining the soldering position point corresponding to the workpiece to be soldered" also includes:

[0069] S31, obtaining image information of the workpiece to be soldered by a high-definition camera, and determining the number of solder points and / or the shape of solder points of the workpiece to be soldered;

[0070] S32, identifying the solder point layout area corresponding to the workpiece to be soldered according to the number of solder points and / or the shape of solder points through the image acquisition module.

[0071] To further illustrate, the identification of the workpiece to be soldered can be performed by using the high-definition camera 41 on the machine head 4 to obtain the number of solder points in the workpiece to be soldered and the actual image information of the solder points, and the image information is compared with the pre-stored solder quality standard image. When the actual image information is compared with the quality standard image information, if they are consistent, it is qualified; if they are inconsistent, re-soldering is performed according to the standard image.

[0072] To further illustrate, the pre-stored solder quality standard images include images corresponding to different solder points on different workpieces to be soldered.

[0073] It is further explained that the high-definition camera can shoot at a 360-degree angle, and can capture images of various solder points of the workpiece to be soldered from multiple different angles, identify different solder points of the workpiece to be soldered at different angles, and thus more accurately and comprehensively identify the solder points and shapes of the workpiece to be soldered, or based on obtaining multiple images of the solder points of the workpiece to be soldered taken from different angles, identify the workpiece to be soldered by multi-angle matching, and then determine the various solder points of the workpiece to be soldered.

[0074] To further illustrate, if the solder point positions of the workpieces to be soldered are different, the shapes corresponding to the solder point positions can be the same or different, the solder point positions of the workpieces to be soldered are different, the solder point position layout diagrams corresponding to the solder point positions can be the same or different, and the soldering processing parameters can be the same or different.

[0075] S40, the welding head control module controls the electric welding head to solder the workpiece to be soldered until the soldering is completed and transmitted to the high-definition camera;

[0076] See also Figure 4 , further illustrating that before executing step S40 "controlling the electric welding head to solder the workpiece to be soldered", the following steps are also included:

[0077] S41, obtaining the position corresponding to the solder point layout area map through the image acquisition module, and setting the soldering processing parameters through the welding parameter module;

[0078] S42, controlling the robot arm 3 to be placed at a corresponding position on the workpiece to be soldered according to the solder point and its soldering parameters through the three-dimensional control module;

[0079] S43, controlling the welding head control module to perform soldering processing on the soldering point layout area according to the soldering point layout diagram and the soldering processing parameters;

[0080] S44, after the laser soldering operation is completed through the high-definition camera, the next solder point area corresponding to the workpiece to be soldered is determined, and the step of obtaining the solder position points and soldering processing parameters corresponding to the solder point area is returned to execute until the soldering operation is completed in all solder point layout areas corresponding to the workpiece to be soldered.

[0081] To further illustrate, by determining the solder position points and their soldering processing parameters corresponding to all solder point layout areas of the workpiece to be soldered, the robot arm 3 is controlled to place them on the workpiece to be soldered according to the solder position points and their soldering parameters, so that the solder position points and their soldering processing parameters perform soldering operations on the solder position point layout areas, thereby completing laser soldering operations on all solder position point layout areas corresponding to the workpiece to be soldered, and there is no need to manually place each solder position point layout area corresponding to the workpiece to be soldered one by one. By controlling the robot arm 3 to place them on the workpiece to be soldered according to the solder position points and their soldering processing parameters corresponding to the solder position point layout areas, the solder head can automatically perform continuous soldering on each solder position point layout area of ​​the workpiece to be soldered until the laser soldering operation is completed on all solder position point layout areas corresponding to the workpiece to be soldered.

[0082] It is further explained that the control of the robot arm 3 to move to the target solder point position, wherein the robot arm 3 maintains the posture after position calibration during the movement, also includes: obtaining the solder processing parameters generated after the solder position point layout diagram is drawn on the three-dimensional model; controlling the laser head to perform soldering on the workpiece to be soldered according to the solder processing parameters.

[0083] It is further explained that after the soldering head calibrates the robot arm 3 and determines the target soldering position point of the robot arm 3, it controls the robot arm 3 to move to the target soldering position point when receiving the laser soldering instruction. When the robot arm 3 moves to the target soldering position point, the laser head obtains the soldering processing parameters generated after the soldering position point layout diagram is drawn on the three-dimensional model, so as to perform soldering on the workpiece to be soldered on the clamping table 2 according to the soldering processing parameters.

[0084] Further explanation, the solder processing parameters include solder position points, solder output power and solder time corresponding to each solder position point; the solder head 42 moves between each solder position point according to the solder time and with the solder output power, thereby completing the processing of the workpiece to be soldered.

[0085] It is further explained that after the solder head 42 is aligned with each position point of the workpiece to be soldered, the soldering operation is performed on the workpiece to be soldered, thereby realizing the processing of the workpiece to be soldered, shortening the device debugging time, and reducing the difficulty of alignment between the workpiece to be soldered and the solder head.

[0086] To further illustrate, all solder point layout areas of the workpiece to be soldered correspond to the solder position point layout areas and their soldering processing parameters respectively, and the robot arm 3 is controlled to be placed on the workpiece to be soldered according to the solder position points, so that the solder position point layout area is opposite to the solder head 42, so that the solder head 42 performs laser soldering operation on the solder position point layout area according to the solder position point layout diagram and its soldering processing parameters, thereby completing the laser soldering operation for all solder position point layout area diagrams corresponding to the workpiece to be soldered, and there is no need to manually place each solder position point layout area corresponding to the processed product one by one. By controlling the robot arm 3 to place the workpiece to be soldered according to the solder position point layout area and its soldering processing parameters, the solder head 42 can automatically and continuously solder each solder position point layout area of ​​the workpiece to be soldered, thereby realizing automated and intelligent soldering and improving the soldering work efficiency.

[0087] S50, acquiring image information of the completed soldering points and soldering quality on the workpiece to be soldered by a high-definition camera, and transmitting the image information to an image acquisition module;

[0088] S60, the image acquisition module identifies the number of solder points and the quality of the solder according to the image information of the completed solder points and the solder quality on the workpiece to be soldered, and transmits it to the control center;

[0089] S70, the control center compares the actual soldering points and soldering quality with the soldering distribution points and soldering quality standards stored in the memory: if they are consistent, the machine is shut down; if they are inconsistent, the alarm is transmitted to the alarm and the welding parameter module is notified to continue soldering until the soldering is qualified.

[0090] Please refer to Figure 5 The present invention also provides a laser automatic soldering control system, comprising: a high-definition camera, an image acquisition module, a welding parameter module, a three-dimensional control module, a welding head control module, a wireless communication module, an alarm, a memory, a control center, and a smart phone; the high-definition camera, the image acquisition module, the welding parameter module, the three-dimensional control module, the welding head control module, the wireless communication module, the alarm, and the memory are respectively connected to the control center; the smart phone is automatically networked with the wireless communication module through the Internet of Things or the Internet within the scope of the Internet of Things or the Internet.

[0091] When the actual soldering points and soldering quality are inconsistent with the stored soldering distribution points and soldering quality standards, the alarm automatically sounds an alarm and transmits it to the welding parameter module.

[0092] The memory is responsible for storing information of the high-definition camera, the image acquisition module, the welding parameter module, the three-dimensional control module, the welding head control module, and the solder distribution points and the solder quality standards.

[0093] The wireless communication module is provided with an Internet of Things module, which can automatically form a network within the scope of the Internet of Things or the Internet, and connect to the wireless network of a smart phone, and is responsible for sending and receiving wireless network signals.

[0094] The high-definition camera is responsible for obtaining image information of whether the clamping of the workpiece to be soldered meets the requirements and the completed solder points on the workpiece and their soldering quality, and transmits it to the welding parameter module or the image acquisition module.

[0095] The image acquisition module identifies the information of the number of solder points and the quality of the solder based on the image information of the completed solder points and the solder quality on the workpiece to be soldered, and transmits it to the welding parameter module or the control center.

[0096] The welding parameter module outputs the soldering process parameters to the three-dimensional control module according to the clamping completion information of the workpiece to be soldered.

[0097] The control center is responsible for information transmission among the high-definition camera, image acquisition module, welding parameter module, three-dimensional control module, and welding head control module. It is the hub of the system and compares the actual solder points and their solder quality with the stored solder distribution points and their solder quality standards. If they are consistent, the machine will be shut down; if they are inconsistent, the information will be transmitted to the alarm and notified to the welding parameter module.

[0098] To further explain, the solder quality standards include: 1) Solder material quality standards: Solder materials are generally composed of metal alloys such as tin, copper, zinc, and nickel in different proportions as the main components. The higher the tin content, the better the welding quality. This is the premise for purchasing solder materials and is not included in the inspection standards after soldering; 2) Environmental performance quality standards: Environmental requirements for solder. Solders that meet relevant environmental protection standards in terms of lead-free rate, toxic substance content, and volatile organic compound content will be certified. This is also the premise for purchasing solder material requirements and is not included in the inspection standards after soldering; 3) Appearance surface quality standards: The appearance of solder points should be neat and free of impurities, smooth surface, no oxidation, deformation or cracks and other defects; 4) Welding performance quality standards: The solder joint molding should be flat, free of holes and cracks, the weld should generally meet the specified model and diameter requirements, and the solder joint strength and resistance value of the solder should meet the corresponding national standards or customer requirements.

[0099] The three-dimensional control module controls the position change of the welding head by controlling the up-down, left-right, and front-back position movement of the lifting frame 3, the left-right movable frame 4, and the front-back movable frame 5, and transmits it to the welding head control module.

[0100] The welding head control module is responsible for the specific processing of the soldering by the welding head until the soldering is completed and transmitted to the high-definition camera.

[0101] How the system works:

[0102] When soldering starts, the system starts running. After the workpiece to be soldered is clamped, the high-definition camera is used to obtain image information of whether the clamping of the workpiece to be soldered meets the requirements, and the information is passed to the welding parameter module; then the welding parameter module outputs the soldering process parameters to the three-dimensional control module according to the clamping completion information of the workpiece to be soldered; then the three-dimensional control module controls the up-down, left-right, and front-to-back position movement of the lifting frame 31, the left-right moving frame 32, and the front-to-back moving frame 33 according to the welding process parameters to control the position change of the soldering head 42, and passes it to the welding head control module; then the welding head control module controls the electric welding head to solder the workpiece to be soldered until the soldering is completed. The work is completed and passed to the high-definition camera; then the high-definition camera obtains the image information of the completed solder points and the solder quality on the workpiece to be soldered and passes it to the image acquisition module; then the image acquisition module recognizes the information of the number of solder points and the quality status of the solder according to the image information of the completed solder points and the solder quality on the workpiece to be soldered, and passes it to the control center; then the control center compares the actual solder points and their solder quality with the solder distribution points and their solder quality standards stored in the memory: if they are consistent, the machine is stopped; if they are inconsistent, the alarm is passed to the alarm, and the welding parameter module is notified to continue soldering until the solder is qualified.

[0103] When the operator or manager is outdoors or away from home, within the scope of the Internet of Things or the Internet, he or she can use a smart phone to automatically connect to the wireless communication module through the Internet of Things or the Internet, and then control or monitor the soldering status of the device.

[0104] The present invention also provides a laser automatic soldering device, which is realized by the above-mentioned laser automatic soldering method.

[0105] Please refer to Figure 6 Further, a laser automatic soldering device provided by the present invention comprises a frame 1, a clamping platform 2, a mobile mechanical arm 3, a head 4, a display screen 5, and a protective cover 6; the frame 1 is provided with a clamping platform 2 and a mobile mechanical arm 3; the mobile mechanical arm 3 comprises a lifting frame 31 with a slide groove 311 on the front, a left and right moving frame 32 with grooves 321 at the upper and lower ends, and a front and rear moving frame 33 composed of a telescopic frame; the head 4 is provided with a high-definition camera 41 and a soldering head 42 with a laser head; the display screen 5 is arranged on the back of the lifting frame 31, and an integrated chip is arranged inside; the integrated chip is provided with an image acquisition module, a welding parameter module, a three-dimensional control module, a welding head control module, a wireless communication module, an alarm, a memory, and a control center; the protective cover 6 is a transparent protective cover, which is arranged on the frame 1, and can monitor the action of automatic soldering at any time, and can also prevent the soldering sparks from harming the surrounding human body.

[0106] One end of the clamping table 2 is connected to the lifting frame 31 of the mobile robot arm 3; the back of the lifting frame 31 is connected to the display screen 5; the lifting frame 31 is fixedly connected to one end of the front and rear moving frame 33 through the slide groove 311 in the middle of its front face; the lower end of the left and right moving frame 32 is fixedly connected to the other end of the front and rear moving frame 33; the upper and lower ends of the left and right moving frames 32 are symmetrically provided with a groove 321, and are connected to the head 4 through its groove 321, and a motor I is provided inside the lifting frame 31, which can drive the front and rear moving frame 33 to move up and down in the slide groove 311 in the middle of the front face of the lifting frame 31; the head 4 is provided with a motor II to control the head 4 to move left and right in the grooves 321 at the upper and lower ends of the left and right moving frames 32; the left and right moving frames 32 are provided with a motor III to allow the front and rear moving frames 33 to extend and retract.

[0107] Further explanation: the specific structure and shape of the laser automatic soldering device provided by the present invention will not be described in detail here. Since our company has obtained the patent protection of "A laser soldering device with visual detection (publication number: CN217452502U)", the structure of the present invention is upgraded and modified on the basis of the mechanism of this patent. Therefore, the specific structural content of the present invention is not within the scope of protection of the present invention.

[0108] A laser automatic soldering device provided by the present invention also includes a computer device and a computer-readable storage medium; the computer device includes a memory and various functional modules, the memory stores a computer program, and when the various functional modules execute the computer program, the steps of the laser automatic soldering method described in any one of the above are implemented; the computer-readable storage medium stores a computer program, and when the computer program is executed by the various functional modules, the steps of the laser automatic soldering method described in any one of the above are implemented.

[0109] Mechanical working principle:

[0110] When the operator sets the processing parameters through the display screen 5 and presses the power button to turn on the machine, the protective cover 6 is opened, and the workpiece to be soldered is installed. Then, according to the process parameters of the soldering, the motor is controlled to drive the front and rear movable frame 33 to extend and retract forward and backward, and drive it to move up and down in the slide groove 311 of the lifting frame 31, and at the same time drive the head 4 to slide left and right in the groove 321 in the left and right movable frame 32. In this way, the head 4 is controlled to move up and down, slide left and right, and extend and retract forward and backward within the maximum range to ensure that the soldering head 42 reaches the soldering point at the set three-dimensional position, and then soldering is started. After the soldering is completed, it is automatically detected. If it is unqualified, soldering is continued until it is qualified.

[0111] It is obvious to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present application.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application can be modified or replaced by equivalents, and all should be included in the scope of protection of the present application.

Claims

1. A laser automatic soldering method, characterized in that: Applied to a laser automatic soldering control system, the system includes a high-definition camera, an image acquisition module, a welding parameter module, a three-dimensional control module, a welding head control module, a wireless communication module, an alarm, a memory, a control center, and a smart phone; the high-definition camera, the image acquisition module, the welding parameter module, the three-dimensional control module, the welding head control module, the wireless communication module, the alarm, and the memory are respectively connected to the control center; the smart phone is automatically networked with the wireless communication module through the Internet of Things or the Internet within the scope of the Internet of Things or the Internet; When the actual solder points and their solder quality are inconsistent with the stored solder distribution points and their solder quality standards, the alarm automatically sounds an alarm and transmits it to the welding parameter module; The memory is responsible for storing information of the high-definition camera, image acquisition module, welding parameter module, three-dimensional control module, welding head control module, and storage of solder distribution points and solder quality standards; The wireless communication module is provided with an Internet of Things module, which can automatically form a network within the scope of the Internet of Things or the Internet, and connect to the wireless network of the smartphone, and is responsible for sending and receiving wireless network signals; The high-definition camera is responsible for obtaining image information of whether the workpiece to be soldered meets the clamping requirements and the completed solder points on the workpiece and their soldering quality, and transmits it to the welding parameter module or the image acquisition module; The image acquisition module identifies the information of the number of solder points and the quality of the solder based on the image information of the completed solder points and the solder quality on the workpiece to be soldered, and transmits it to the welding parameter module or the control center; The welding parameter module outputs the soldering process parameters to the three-dimensional control module according to the clamping completion information of the workpiece to be soldered; The control center is responsible for the information transmission of the high-definition camera, image acquisition module, welding parameter module, three-dimensional control module, and welding head control module. It is the hub of the system and compares the actual solder points and their solder quality with the stored solder distribution points and their solder quality standards: if they are consistent, the machine will be shut down; if they are inconsistent, the alarm will be transmitted and the welding parameter module will be notified; The three-dimensional control module controls the position change of the electric welding head by controlling the up-down, left-right, and front-back position movement of the lifting frame, the left-right movable frame, and the front-back movable frame, and transmits the position change to the welding head control module; The welding head control module is responsible for the specific processing of the welding head until the welding is completed and transmitted to the high-definition camera; The soldering method comprises the following steps: S10, after the workpiece to be soldered is installed, the image information of the workpiece to be soldered is obtained through a high-definition camera and transmitted to a welding parameter module; S20, outputting soldering process parameters and soldering instructions through the welding parameter module according to the clamping completion information of the workpiece to be soldered, and transmitting them to the three-dimensional control module; S30, the three-dimensional control module drives the robot arm to move to the target soldering position point according to the laser soldering instruction, determines the soldering position point corresponding to the workpiece to be soldered, and transmits it to the welding head control module; S40, the welding head control module controls the soldering head to solder the workpiece to be soldered until the soldering is completed and transmitted to the high-definition camera; S50, obtaining image information of the completed soldering points and soldering quality on the workpiece to be soldered by a high-definition camera, and transmitting the image information to an image acquisition module; S60, the image acquisition module identifies the number of solder points and the quality of the solder according to the image information of the completed solder points and the solder quality on the workpiece to be soldered, and transmits it to the control center; S70, the control center compares the actual soldering points and soldering quality with the soldering distribution points and soldering quality standards stored in the memory: if they are consistent, the machine is shut down; if they are inconsistent, the alarm is transmitted to the alarm and the welding parameter module is notified to continue soldering until the soldering is qualified; Before "controlling the robot arm to move to the target soldering position" in step S30, the following steps are also included: S301, obtaining, through an image acquisition module, the three-dimensional reference coordinates in the three-dimensional model corresponding to the workpiece to be soldered and a solder point running track layout diagram corresponding to the soldering; S302, determining the corresponding three-dimensional reference coordinates of the soldering operation trajectory diagram of each soldering point on the three-dimensional model through the three-dimensional control module; S303, controlling the robot arm to calibrate the initial position according to the three-dimensional coordinates through the welding head control module, and determining the target soldering point corresponding to the robot arm; The step S30 of "determining the soldering position point corresponding to the workpiece to be soldered" also includes: S31, obtaining image information of the workpiece to be soldered by a high-definition camera, and determining the number of solder points and / or the shape of solder points of the workpiece to be soldered; S32, identifying the solder point layout area corresponding to the workpiece to be soldered according to the number of solder points and / or the shape of solder points by an image acquisition module; Before the step S40 of "controlling the electric welding head to solder the workpiece to be soldered", the following steps are also included: S41, obtaining the position corresponding to the solder point layout area map through the image acquisition module, and setting the soldering processing parameters through the welding parameter module; S42, controlling the robot arm to place the soldering points and soldering parameters at corresponding positions on the workpiece to be soldered through the three-dimensional control module; S43, controlling the welding head control module to perform soldering processing on the soldering point layout area according to the soldering point layout diagram and the soldering processing parameters; S44, after the laser soldering operation is completed through the high-definition camera, determine the next solder point area corresponding to the workpiece to be soldered, and return to execute steps S41 to S43 until all solder points corresponding to the workpiece to be soldered are completed.

2. A laser automatic soldering method according to claim 1, characterized in that: The control system also includes a computer device and a computer-readable storage medium; the computer device includes a memory and various functional modules, the memory stores a computer program, and when the various functional modules execute the computer program, the steps of the laser automatic soldering method described in claim 1 are implemented; the computer-readable storage medium stores a computer program, and when the computer program is executed by the various functional modules, the steps of the laser automatic soldering method described in claim 1 are implemented.

3. A laser automatic soldering device, characterized in that : It is realized by adopting a laser automatic soldering method described in claims 1-2 above.

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