A diamond wire multi-wire saw for silicon wafer cutting

Abstract

The present invention belongs to the technical field of silicon wafer processing, and provides a diamond wire multi-wire cutting machine for silicon wafer cutting, comprising a base, on which a collecting box and a back plate are fixedly mounted, and on which four groups of winding rollers distributed in a rectangular shape are rotatably mounted, and on which multiple groups of cutting wires are commonly arranged, so as to solve the technical problem in the prior art that impurities enter the filtered coolant during cutting and subsequent flushing, thereby affecting the subsequent recycling of cooling. When in use, the present invention conveys air into a cleaning pipe, and the air is sprayed downward onto the cutting line through an air jet pipe, and the powder impurities remaining on the cutting line are blown down by the high-speed circulating air, and the powder impurities are moved downward into a placement box under the blowing of the air, thereby realizing active cleaning of the powder impurities on the cutting line. The present invention can be widely used in active cleaning operation scenarios of moving wires.

Description

Technical Field

[0001] The invention belongs to the technical field of silicon wafer processing, and in particular relates to a diamond wire multi-wire sawing machine for silicon wafer cutting. Background Art

[0002] The diamond wire cutting machine uses a unidirectional or reciprocating motion of the diamond wire to create a relative grinding motion between the diamond wire and the object being cut, thereby achieving the purpose of cutting. Its cutting principle is similar to that of a bow saw, and it is an important tool for processing silicon wafers.

[0003] The existing diamond wire cutting machine does not have a proper way to deal with the debris generated by cutting silicon materials during use, which is easy to cause blockage and equipment damage. In response to the above technical problems, the applicant has retrieved some existing technologies, such as the Chinese patent with patent publication number CN113858463A. When in use, the coolant recovery tank is located below the cutting position. When the diamond wire cuts the material on the extrusion block, powdery impurities will be generated. At this time, some powder impurities will move with the diamond wire. When the diamond wire leaves the cutting position, there is no material to exert force on the dust impurities attached to the diamond wire. In addition, the air resistance encountered by the subsequent movement of the diamond wire will cause the powder impurities attached to the diamond wire to separate from the diamond wire. Since the diamond wire gives the powder impurities an initial velocity, the powder impurities will continue to move and fall downward into the recovery tank below. At the same time, the subsequent flushing nozzle will flush the impurities into the recovery tank when flushing into the extrusion block, which will cause the coolant in the recovery tank to be mixed with more impurities, affecting the subsequent reuse of the coolant. Summary of the invention

[0004] The purpose of the present invention is to provide a diamond wire multi-wire saw for silicon wafer cutting, aiming to solve the technical problem in the prior art that impurities enter the filtered coolant during cutting and subsequent rinsing, affecting the subsequent cooling and recycling.

[0005] The present invention is implemented as follows: a multi-wire diamond wire saw for silicon wafer cutting, comprising a base, a collecting box and a back plate fixedly mounted on the base, four groups of winding rollers distributed in a rectangular shape rotatably mounted on the back plate, multiple groups of cutting wires are commonly arranged on the four groups of winding rollers, a rotating power member driving one group of winding rollers to rotate is arranged on the back plate, and a water spraying assembly for spraying a cooling liquid to a cutting position is arranged on the back plate;

[0006] A placement box driven by a telescopic part is arranged in the collection box, a pad is fixedly installed in the middle of the placement box, and slots for the cutting line to pass through are opened on the side walls on both sides of the placement box. A plurality of groups of cleaning tubes are arranged on the back plate, and the number of the cleaning tubes is the same as the number of the cutting lines. The cleaning tubes are located directly above the corresponding cutting lines and are parallel to the horizontal section of the cutting lines. A side of the cleaning tube close to the corresponding cutting line is connected to a plurality of groups of air jet tubes pointing to the cutting lines, and the plurality of groups of cleaning tubes are connected to a blower fixedly installed on the back plate.

[0007] Further technical solution: The inner bottom surface of the placement box is provided with a slope structure with a higher inner side and a lower outer side located on both sides of the pad, and both ends of the placement box are connected to a collection pipe, and a collection bag is provided at one end of the collection pipe away from the placement box.

[0008] Further technical solution: a second bracket is fixedly installed on the back plate, a jet box is slidably installed on the vertical section of the second bracket, the jet box is connected to multiple groups of cleaning pipes, and the jet box is connected to the hair dryer.

[0009] Further technical solution: the water spray assembly includes a first bracket, the first bracket is fixedly mounted on the back plate and pointing to the base, a water spray box is slidably mounted on the first bracket, when the placement box moves upward, it contacts the water spray box and pushes the water spray box to move upward, a plurality of water spray pipes are connected to the water spray box, the water spray pipes correspond to the cutting lines one by one and the water spray pipes are located directly above the cutting position of the cutting lines, the water spray box is connected to a water pump fixedly mounted on the base, and the water pump is connected to an external coolant container.

[0010] Further technical solution: two groups of horizontal plates are fixedly installed on the jet box, a third bracket is slidably installed on the two groups of horizontal plates, and multiple groups of collecting boxes corresponding to the cutting lines are fixedly installed on the horizontal section of the third bracket. The cross-section of the collecting box is a U-shaped structure and covers the cutting line from below the corresponding cutting line, and the end face of the side wall of the collecting box is in contact with the surface of the cleaning tube.

[0011] Further technical solution: the distance from the inner bottom surface of the collecting box to the cutting line gradually increases in the direction away from the pad, and gaps are provided between both ends of the collecting box and the cutting line.

[0012] Further technical solution: a plurality of groups of collection boxes are commonly fixedly installed with a recovery box at one end away from the pad, the recovery box is connected to the plurality of collection boxes, the position where the recovery box is connected to the collection box is located in an area on the collection box away from the cutting line, the collection box is connected to an exhaust fan fixedly installed on the back plate, two groups of blowing pipes are connected to the air outlet end of the exhaust fan, and the two groups of blowing pipes extend into the collection pipe respectively.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. Air is transported into the cleaning pipe, and the air is sprayed downward onto the cutting line through the air jet pipe. The powder impurities remaining on the cutting line are blown down by the high-speed air circulation. The powder impurities move downward into the placement box under the blowing of the air, so as to realize the active cleaning of the powder impurities on the cutting line, avoid the powder impurities flying caused by the accumulation and separation when the powder impurities move with the cutting line, and avoid the flying cutting impurities from entering the collection box downward, so as to ensure the cleanliness of the coolant in the collection box below, which is conducive to the subsequent reuse of the coolant.

[0015] 2. The collecting box covers the bottom of the cutting line. After the powder impurities are separated from the cutting line, they will move downward away from the cutting line 5 and move into the recovery box. Driven by the air, the powder impurities separated from the cutting line will enter the collecting box, thereby realizing further collection of the powder impurities separated from the cutting line, preventing the dust separated during the air blowing process from entering the coolant below or flying into the environment at will, further improving the cleanliness of the coolant below, and facilitating the subsequent recycling of the coolant.

[0016] 3. Ensure the cleanliness of the cutting wire after cutting by cleaning the cutting wire, so as to prevent the cutting impurities from moving with the cutting wire and adhering to the winding roller, thereby preventing the accumulation of impurities on the winding roller from affecting the rotation of the cutting wire, ensuring the stability of the cutting wire during operation and improving the cutting quality.

[0017] 4. The air can further cool the cutting wire while cleaning it, further improving the cooling speed and cooling effect of the cutting wire, ensuring that the cutting wire is always used in a low temperature state, and increasing the life of the cutting wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure from the first viewing angle of the present invention.

[0019] Figure 2 It is a schematic diagram of the structure from a second viewing angle of the present invention.

[0020] Figure 3 It is a schematic structural diagram of the first viewing angle of the placement box in the present invention.

[0021] Figure 4 It is a schematic diagram of the second viewing angle structure of the placement box in the present invention.

[0022] Figure 5 It is a schematic diagram of the structure of the cleaning tube in the present invention.

[0023] Figure 6 for Figure 2 A magnified schematic diagram of the A1 region in the middle.

[0024] Figure 7 It is a schematic diagram of the structure of the collecting box and the cleaning tube in the present invention.

[0025] Figure 8 It is a schematic diagram of the structure of the collecting box in the present invention.

[0026] In the attached drawings: 1. base; 2. collection box; 3. back plate; 4. winding roller; 5. cutting line; 6. telescopic member; 7. placement box; 8. card slot; 9. pad; 10. collection pipe; 11. collection bag; 12. rotating power member; 13. first bracket; 14. water spray box; 15. water spray pipe; 16. water pump; 17. second bracket; 18. jet box; 19. cleaning pipe; 20. jet pipe; 21. hair dryer; 22. horizontal plate; 23. third bracket; 24. collection box; 25. recovery box; 26. exhaust fan; 27. blow pipe; 28. water spray assembly. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0028] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0029] like Figure 1-Figure 6 As shown, a diamond wire multi-wire sawing machine for silicon wafer cutting provided by the present invention comprises a base 1, a collecting box 2 and a back plate 3 are fixedly mounted on the base 1, four groups of winding rollers 4 distributed in a rectangular shape are rotatably mounted on the back plate 3, a plurality of cutting wires 5 are commonly arranged on the four groups of winding rollers 4, a rotating power member 12 for driving one group of winding rollers 4 to rotate is arranged on the back plate 3, and a water spraying assembly 28 for spraying a cooling liquid to the cutting position is arranged on the back plate 3;

[0030] A placement box 7 driven by a telescopic member 6 is provided in the collection box 2, a pad 9 is fixedly installed in the middle of the placement box 7, and slots 8 for the cutting line 5 to pass through are opened on the side walls of both sides of the placement box 7, and an inclined surface structure with a high inner side and a low outer side is provided on the bottom surface of the placement box 7, which is located on both sides of the pad 9. Both ends of the placement box 7 are connected with a collection pipe 10, and a collection bag 11 is provided at one end of the collection pipe 10 away from the placement box 7. A plurality of groups of cleaning pipes 19 are provided on the back plate 3, and the number of cleaning pipes 19 is the same as the number of cutting lines 5. The cleaning pipe 19 is located directly above the corresponding cutting line 5 and the cleaning pipe 19 is parallel to the horizontal section of the cutting line 5. The side of the cleaning pipe 19 close to the corresponding cutting line 5 is connected with a plurality of groups of jet pipes 20 pointing to the cutting line 5, and the plurality of groups of cleaning pipes 19 are connected to a hair dryer 21 fixedly installed on the back plate 3. A second bracket 17 is fixedly installed on the back plate 3, and a jet box 18 is slidably installed on the vertical section of the second bracket 17. The jet box 18 is connected to the plurality of groups of cleaning pipes 19, and the jet box 18 is connected to the hair dryer 21.

[0031] In actual application of this embodiment, the material to be cut is placed on the pad 9 and fixed, and the placement box 7 is driven to move upward by the telescopic member 6 so that the material is close to the cutting line 5. The rotating power member 12 drives one group of winding rollers 4 to rotate, so that the cutting line 5 rotates. When the lower horizontal section of the cutting line 5 contacts the material, the cutting can be performed. When cutting, the cutting line 5 can move downward in the card slot 8. When cutting, the coolant is sprayed from the top of the material cutting position by the water spray assembly 28. The coolant will flow downward along the material to cool and lubricate the cutting position, and the coolant will also flush The coolant flows downward to the bottom of the placing box 7 and then flows downward along the inclined structure, and finally leaves the placing box 7 through the collecting tube 10. The coolant carries the powder impurities with it during the flow of the coolant. After the coolant falls from the collecting tube 10, it enters the collecting bag 11. The powder impurities in the coolant are filtered and collected by the collecting bag 11. The coolant that passes through the collecting bag 11 is gathered in the collecting box 2. The coolant in the collecting box 2 can be reused later. After long-term use, the collecting bag 11 can be removed from the collecting tube 10 for cleaning.

[0032] During cutting, the blower 21 delivers air to the jet box 18, and then the air flows into the cleaning tube 19 and is sprayed downward onto the cutting line 5 through the jet tube 20, and the powder impurities remaining on the cutting line 5 are blown off by the high-speed circulating air, and the powder impurities move downward into the placement box 7 under the blowing of the air, so that the powder impurities on the cutting line 5 are actively cleaned, and the powder impurities are prevented from scattering due to the accumulation and separation when the powder impurities move with the cutting line 5, and the scattered cutting impurities are prevented from entering the collection box 2 downward, so as to ensure the cleanliness of the coolant in the collection box 2 below, which is conducive to the subsequent reuse of the coolant. The cleaning of the wire 5 ensures the cleanliness of the cutting wire 5 after cutting, thereby preventing cutting impurities from moving with the cutting wire 5 and adhering to the winding roller 4, thereby preventing the accumulation of impurities on the winding roller 4 from affecting the rotation of the cutting wire 5, ensuring the stability of the cutting wire 5 during operation, and improving the cutting quality. At the same time, the air can further cool the cutting wire 5 while cleaning the cutting wire 5, further improving the cooling speed and cooling effect of the cutting wire 5, ensuring that the cutting wire 5 is always used in a low temperature state, and improving the life of the cutting wire 5. When the cutting is completed, the telescopic part 6 moves downward to separate the material from the cutting wire 5, and the material can be replaced later.

[0033] In an example of the present embodiment, the rotating power part 12 is a motor, and of course it can also be other parts that can output rotational power, such as a hydraulic motor, which drives the cutting line 5 to rotate through the motor, and the telescopic part 6 is an electric telescopic rod, and of course it can also be other parts that can actively change the length, such as a hydraulic cylinder, which drives the placement box 7 to move up and down through electric telescopic movement.

[0034] like Figure 1 , Figure 2 As shown, a diamond wire multi-wire saw for silicon wafer cutting provided by the present invention, the water spray assembly 28 includes a first bracket 13, the first bracket 13 is fixedly mounted on the back plate 3 and points to the base 1, a water spray box 14 is slidably mounted on the first bracket 13, when the placement box 7 moves upward, it contacts the water spray box 14 and pushes the water spray box 14 to move upward, a plurality of water spray pipes 15 are connected to the water spray box 14, the water spray pipes 15 correspond to the cutting lines 5 one by one and the water spray pipes 15 are located directly above the cutting position of the cutting lines 5, the water spray box 14 is connected to a water pump 16 fixedly mounted on the base 1, and the water pump 16 is connected to an external coolant container.

[0035] In actual application of this embodiment, in the initial state, the water spray box 14 is located at the bottom of the first bracket 13. At this time, the water spray pipe 15 is located above the cutting line 5 and a gap is set with the cutting line 5. When the placement box 7 moves upward to make the cutting line 5 cut the material, the water pump 16 draws the coolant and transports it to the water spray box 14. The coolant flows out through each water spray pipe 15 and falls to the cutting position of the corresponding cutting line 5, thereby lubricating and cooling the cutting position. The placement box 7 drives the material to continue to rise and contact with the water spray box 14. At this time, the placement box 7 will push the water spray box 14 to rise synchronously, so that the water spray pipe 15 is always located above the material cutting position to continuously spray coolant, thereby ensuring the continuous supply of coolant.

[0036] like Figure 1 , Figure 2 , Figure 5-Figure 8 As shown, a diamond wire multi-wire saw for silicon wafer cutting provided by the present invention, two groups of horizontal plates 22 are fixedly installed on the jet box 18, and a third bracket 23 is slidably installed on the two groups of horizontal plates 22. A plurality of collecting boxes 24 corresponding to the cutting lines 5 are fixedly installed on the horizontal section of the third bracket 23. The collecting boxes 24 have a U-shaped cross-section and cover the corresponding cutting lines 5 from below. The side wall end face of the collecting box 24 contacts the surface of the cleaning tube 19.

[0037] Specifically, the distance from the inner bottom surface of the collecting box 24 to the cutting line 5 gradually increases in the direction away from the pad 9 , and gaps are provided between both ends of the collecting box 24 and the cutting line 5 .

[0038] Specifically, a recovery box 25 is fixedly installed on one end of the multiple groups of collection boxes 24 away from the pad 9, and the recovery box 25 is connected to the multiple groups of collection boxes 24. The position where the recovery box 25 is connected to the collection box 24 is located in the area of ​​the collection box 24 away from the cutting line 5. The collection box 24 is connected to the exhaust fan 26 fixedly installed on the back plate 3, and two groups of blowing pipes 27 are connected to the air outlet end of the exhaust fan 26. The two groups of blowing pipes 27 extend into the collection pipe 10 respectively.

[0039] In actual application of this embodiment, the exhaust fan 26 extracts the air in the recovery box 25 and sprays it out through the blowing pipe 27. After the cutting line 5 enters the collecting box 24, the powder impurities carried on it are separated from the cutting line 5 and move downward under the action of the air flowing downward from the top. At the same time, when the cutting line 5 moves, the powder impurities will be given an initial velocity to move along the cutting line 5. At the same time, since the air in the recovery box 25 is extracted by the exhaust fan 26, the air in the collecting box 24 will flow toward the area connected to the recovery box 25 at this time, and then the powder impurities will move downward away from the cutting line 5 after separating from the cutting line 5, and move into the recovery box 25 at the same time, so that the powder impurities separated from the cutting line 5 will enter the collecting box 24 driven by the air, thereby realizing the collection of the powder impurities separated from the cutting line 5, preventing the separated dust from entering the coolant below or scattering into the environment at will, further improving the cleanliness of the coolant below, and facilitating the subsequent recycling of the coolant;

[0040] The powder impurities are extracted along with the air in the recovery box 25 by the exhaust fan 26 and then transported to the collecting pipe 10 through the blowing pipe 27. Since the lower end of the blowing pipe 27 is inserted into the collecting bag 11, the air will pass through the collecting bag 11 and leave, and the dust will be intercepted by the collecting bag 11. When the air passes through the collecting bag 11, it can accelerate the outflow of the coolant in the collecting bag 11.

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0042] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A diamond wire multi-wire sawing machine for silicon wafer cutting, comprising a base (1), on which a collecting box (2) and a back plate (3) are fixedly mounted, characterized in that: Four groups of winding rollers (4) arranged in a rectangular shape are rotatably mounted on the back plate (3); a plurality of cutting lines (5) are arranged on the four groups of winding rollers (4); a rotating power member (12) is arranged on the back plate (3) for driving one of the groups of winding rollers (4) to rotate; and a water spraying assembly (28) is arranged on the back plate (3) for spraying a cooling liquid toward the cutting position; The collecting box (2) is provided with a placing box (7) driven by a telescopic member (6), a pad (9) is fixedly installed in the middle of the placing box (7), and slots (8) for the cutting line (5) to pass through are provided on the side walls of both sides of the placing box (7), and a plurality of cleaning tubes (19) are provided on the back plate (3), the number of the cleaning tubes (19) is the same as the number of the cutting lines (5), the cleaning tubes (19) are located directly above the corresponding cutting lines (5) and the cleaning tubes (19) are parallel to the horizontal section of the cutting lines (5), the side of the cleaning tube (19) close to the corresponding cutting line (5) is connected to a plurality of jet tubes (20) pointing to the cutting lines (5), and the plurality of cleaning tubes (19) are connected to a blower (21) fixedly installed on the back plate (3); The back plate (3) is fixedly mounted with a second bracket (17), the second bracket (17) is slidably mounted with a jet box (18) on the vertical section, the jet box (18) is connected to the plurality of cleaning tubes (19), and the jet box (18) is connected to the hair dryer (21); Two groups of horizontal plates (22) are fixedly mounted on the jet box (18), a third bracket (23) is slidably mounted on the two groups of horizontal plates (22), a plurality of collection boxes (24) corresponding to the cutting lines (5) are fixedly mounted on the horizontal section of the third bracket (23), the collection boxes (24) having a U-shaped cross-section and covering the cutting lines (5) from below the corresponding cutting lines (5), and the side wall end surface of the collection box (24) contacts the surface of the cleaning tube (19).

2. The diamond wire multi-wire saw for silicon wafer cutting according to claim 1, characterized in that: The inner bottom surface of the placement box (7) is provided with an inclined surface structure with a higher inner side and a lower outer side located on both sides of the pad (9); both ends of the placement box (7) are connected to a collection pipe (10); and a collection bag (11) is provided at one end of the collection pipe (10) away from the placement box (7).

3. The diamond wire multi-wire sawing machine for silicon wafer cutting according to claim 1, characterized in that: The water spray assembly (28) comprises a first bracket (13), the first bracket (13) being fixedly mounted on the back plate (3) and pointing towards the base (1), a water spray box (14) being slidably mounted on the first bracket (13), the placement box (7) contacting the water spray box (14) when moving upward and pushing the water spray box (14) to move upward, a plurality of groups of water spray pipes (15) being connected to the water spray box (14), the water spray pipes (15) corresponding to the cutting lines (5) one by one and the water spray pipes (15) being located directly above the cutting position of the cutting lines (5), and the water spray box (14) being connected to a water pump (16) fixedly mounted on the base (1).

4. The diamond wire multi-wire sawing machine for silicon wafer cutting according to claim 1, characterized in that: The distance from the inner bottom surface of the collecting box (24) to the cutting line (5) gradually increases in a direction away from the pad (9), and gaps are provided between both ends of the collecting box (24) and the cutting line (5).

5. The diamond wire multi-wire sawing machine for silicon wafer cutting according to claim 1, characterized in that: A recovery box (25) is fixedly mounted on one end of the plurality of collection boxes (24) away from the backing plate (9); the recovery box (25) is connected to the plurality of collection boxes (24); the location where the recovery box (25) is connected to the collection box (24) is located in a region of the collection box (24) away from the cutting line (5); the collection box (24) is connected to an exhaust fan (26) fixedly mounted on the back plate (3); two groups of blowing pipes (27) are connected to the air outlet end of the exhaust fan (26); the two groups of blowing pipes (27) extend into the collection pipe (10) respectively.

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