A fully automatic double-sided exposure machine and high-precision alignment method

Abstract

The invention provides a full-automatic double-sided exposure machine and a high-precision alignment method, belonging to the technical field of exposure machines. The machine comprises a frame, a double-sided solder resist table frame, a Y-axis conveying mechanism and a control system. The frame is provided with an alignment area and an exposure area. The upper and lower parts of the alignment area are both provided with visual inspection mechanisms. The double-sided solder resist table frame comprises a bottom frame, a middle frame, an upper frame, a frame opening component, an upper alignment component and a lower alignment component. The middle frame comprises a middle frame lower plate and a middle frame upper plate. Based on the detection result of the visual inspection mechanism, the upper alignment component is used to move the middle frame to align an upper film with an upper target point of a PCB board, and the lower alignment component is used to move the middle frame upper plate to align a lower film with a lower target point of the PCB board. In the invention, the PCB board and two film sheets are aligned and exposed under the same temperature and humidity environment conditions, which not only improves the production efficiency, but also can achieve better consistency and improve the yield rate. In addition, the upper and lower alignments can be performed simultaneously, which greatly improves the alignment efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of exposure machines, and in particular to a fully automatic double-sided exposure machine and a high-precision alignment method. Background Art

[0002] In the circuit manufacturing process of PCB, in addition to accurate alignment, the use of optical exposure to transfer images between photoresist and printed circuit boards is also one of the key technologies. The light source quality and exposure accuracy of the exposure machine directly determine the quality of graphic transfer, and are one of the most important indicators of PCB quality. The production capacity of traditional exposure machines is about 90 pieces per hour. Due to the limitations of alignment accuracy and exposure quality, the production efficiency of exposure machines is limited, and the production cost has remained high. Now there is an urgent need to provide a more efficient and high-precision exposure machine. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings and deficiencies of the prior art and to provide a fully automatic double-sided exposure machine and a high-precision alignment method.

[0004] The technical solution adopted by the present invention is as follows: In the first aspect, the present application provides a fully automatic double-sided exposure machine, including a frame, a double-sided solder resist frame, a Y-axis conveying mechanism and a control system, wherein the frame is provided with an alignment area and an exposure area, and the Y-axis conveying mechanism spans the alignment area and the exposure area, and is used to drive the double-sided solder resist frame to switch between the alignment area and the exposure area, and the upper and lower parts of the alignment area are provided with visual inspection mechanisms, respectively referred to as an upper visual inspection mechanism and a lower visual inspection mechanism, and the double-sided solder resist frame includes a bottom frame, a middle frame, an upper frame, a frame opening component, an upper alignment component and a lower alignment component, and the middle part of the upper frame is provided with The upper glass, a film sheet is arranged on the lower surface of the upper glass, the middle frame includes a middle frame lower plate and a middle frame upper plate, the lower glass is arranged in the middle of the middle frame upper plate, and another film sheet is arranged on the upper surface of the lower glass. The upper visual inspection mechanism is used to detect the position deviation of the upper film and the four alignment target points on the upper surface of the PCB board, and the lower visual inspection mechanism is used to detect the position deviation of the lower film and the four alignment target points on the lower surface of the PCB board. Based on the detection result of the visual inspection mechanism, the upper alignment component is used to move the middle frame to align the upper film with the upper target point of the PCB board, and the lower alignment component is used to move the middle frame upper plate to align the lower film with the lower target point of the PCB board.

[0005] In some embodiments, the frame opening assembly is used to allow the upper frame to rotate around its hinged side so that it has an open state and a closed state. The frame opening assembly includes a frame opening cylinder, a frame opening arm and a frame opening linkage shaft. One end of the frame opening cylinder is hinged to the bottom frame, and the other end is hinged to the frame opening arm. One end of the frame opening arm is hinged to the bottom frame, and the end hinged to the frame opening arm is provided with a linkage slide. One frame opening linkage shaft is provided on each side of the upper frame, and the frame opening linkage shaft slides with the linkage slide. The initial end of the linkage slide is provided with a guide portion, and the rear end thereof is provided with a limiting portion. When opening the frame, the frame opening cylinder drives the frame opening arm to rotate upward, and the frame opening linkage shaft slides along the rear side of the linkage slide of the guide portion, and the front side of the upper frame is gradually lifted until the upper frame is in an open state, at which time the frame opening linkage shaft abuts against the limiting portion.

[0006] In some embodiments, two support components are provided on each side of the bottom frame. When the upper frame is in a closed state, the support components support the upper frame so that it is arranged in parallel with the middle frame. The support components include a mounting frame, a support plate and a Z-axis adjustment structure. The mounting frame is arranged on the bottom frame, and the support plate is slidably arranged along the Z-axis direction relative to the mounting frame. The Z-axis adjustment structure is used to adjust the height of the support plate in the Z-axis direction to ensure that the upper frame is horizontal when it is in a closed state.

[0007] In some embodiments, a Y-axis guiding assembly is arranged between the bottom frame and the upper frame, and the Y-axis guiding assembly is used to guide the upper frame when the upper frame is closed to prevent it from being offset in the Y-axis direction. It includes a first mounting seat fixed on the bottom frame, and two first guiding blocks are arranged at intervals at the top end of the first mounting seat, and the first guiding blocks can be adjusted along the Y-axis direction relative to the first mounting seat, and the top end of the first mounting seat is provided with limiting protrusions on the front and rear sides of the two first guiding blocks in the Y-axis direction, and the limiting protrusions are provided with a pressing bolt and a locking nut, and the end of the pressing bolt abuts against the first guiding block, and a guiding roller is rotatably arranged on the first guiding block on the side where the two first guiding blocks are close to each other, and the guiding roller is arranged to roll along the Y-axis direction, and guiding inclined surfaces are arranged on both sides of the guiding roller on the first guiding block, and a guiding socket is formed between the two guiding rollers, and guiding plugs are provided on both sides of the middle of the upper frame corresponding to the guiding plugs.

[0008] In some embodiments, an X-axis guiding assembly is arranged between the bottom frame and the upper frame, and the X-axis guiding assembly is used to guide the upper frame when the upper frame is closed to prevent it from being offset in the X-axis direction. The X-axis guiding assembly includes a second mounting seat, and a second guiding block is arranged on the second mounting seat. The second guiding block can be adjusted along the X-axis direction relative to the second mounting seat. This adjustment structure is the same as the first guiding block, and is also provided with a pressing bolt and a locking nut. A guiding roller is arranged on the side of the second guiding block facing the upper frame, and the guiding roller is arranged to roll along the X-axis direction. Guiding blocks are arranged on both sides of the front end of the upper frame.

[0009] In some embodiments, the visual detection mechanism includes four CCD visual detection devices that can move along the XYZ axes, the four CCD visual detection devices are grouped in pairs and are respectively arranged on both sides of the frame, the visual detection mechanism includes a first movable arm, a second movable arm, a visual Y-axis conveying assembly, a visual X-axis conveying assembly and a visual Z-axis conveying assembly, the first movable arm is connected to the frame through the visual Y-axis conveying assembly so that it can move along the Y-axis direction, the second movable arm is connected to the first movable arm through the visual X-axis conveying assembly so that it can move along the X-axis direction, and the CCD visual detection device is connected to the second movable arm through the visual Z-axis conveying assembly so that it can move along the Z-axis direction.

[0010] In some embodiments, the upper alignment component includes two first Y-axis modules and one first X-axis module, and the first Y-axis module and the first X-axis module are both arranged between the middle frame lower plate and the bottom frame, wherein the two first Y-axis modules are respectively arranged on both sides of the middle frame lower plate and the front end of the bottom frame, and the first X-axis module is arranged on either side of the middle frame lower plate and the rear end of the bottom frame; the lower alignment component includes two second Y-axis modules and one second X-axis module, and the second Y-axis module and the second X-axis module are both arranged between the middle frame lower plate and the middle frame upper plate, wherein the two second Y-axis modules are respectively arranged on both sides of the middle of the middle frame lower plate and the middle frame upper plate, the second X-axis module is arranged in the middle of the middle frame lower plate and the rear end of the middle frame upper plate, and the auxiliary module is arranged in the middle of the middle frame lower plate and the front end of the middle frame upper plate, and each module adopts a UVW alignment platform.

[0011] In some embodiments, an upper reinforcing mechanism and a lower reinforcing mechanism are provided on the frame, which are used to strengthen the stability of the first moving arm in the upper visual detection mechanism and the lower visual detection mechanism, respectively.

[0012] In the second aspect, the present application provides a high-precision alignment method, including a correction alignment module and a prediction module, through which the correction alignment module obtains the final correction coordinates. The prediction module is based on machine learning and has a position compensation function. It first calculates the compensation value , and then the optimized final coordinates are obtained ;

[0013] The prediction method of the prediction module includes the following steps:

[0014] Step S1: Obtain the target coordinates. The CCD visual detection device obtains the coordinates of the alignment target and the feature target, which are obtained three times in total:

[0015] The first time is to obtain the coordinates of the alignment target point before the alignment module is aligned. , the coordinates of the characteristic target are ;

[0016] The second time is obtained after the correction and alignment module corrects the deviation and alignment. The coordinates of the alignment target are , the coordinates of the characteristic target are ;

[0017] The third time is after vacuuming, the coordinates of the target point are , the coordinates of the characteristic target are ;

[0018] Among them, the alignment target points are the target points on the PCB board, and the PCB board has four on the upper and lower surfaces respectively; the characteristic target points are the target points on the upper film and the lower film, and the upper film has four on the lower surface and four on the upper surface of the lower film;

[0019] Step S2: Calculate the offset;

[0020] first:

[0021] The offset of the feature target relative to the alignment target in the X direction: ;

[0022] The offset of the feature target relative to the alignment target in the Y direction: ;

[0023] Second time:

[0024] The offset of the feature target relative to the alignment target in the X direction: ;

[0025] The offset of the feature target relative to the alignment target in the Y direction: ;

[0026] Third time:

[0027] The offset of the feature target relative to the alignment target in the X direction: ;

[0028] The offset of the feature target relative to the alignment target in the Y direction: ;

[0029] Step S3: condition judgment;

[0030] First distance ;

[0031] Second distance ;

[0032] The third distance ;

[0033] Similarly, calculate the other three sets of distance values ​​on the same surface;

[0034] Then calculate the distance change:

[0035] , ;

[0036] , ;

[0037] Among them, if , then proceed to the subsequent steps, otherwise, re-correct the alignment;

[0038] Step S4: Calculate the difference between the first and third offsets;

[0039] The difference between the two offsets in the X direction: ;

[0040] The difference between the two offsets in the Y direction: ;

[0041] Step S5: historical data analysis, using historical data to calculate the mean and standard value of the offset difference;

[0042] The average value of the historical offset difference in the X direction: ;

[0043] The average value of the historical offset difference in the Y direction: ;

[0044] Where N is the total number of historical data, For the i The X-direction offset of the secondary alignment, For the i The Y-direction offset of the secondary alignment;

[0045] Standard deviation of historical offsets in the X direction: ;

[0046] Standard deviation of historical offset in the Y direction: ;

[0047] Step S6: predicting the compensation value of the offset;

[0048] Predicted compensation value of X-direction offset: ;

[0049] Predicted compensation value of Y-direction offset: ;

[0050] in, and To adjust the coefficient, adjustments are made based on machine learning;

[0051] Step S7: Calculate the final offset;

[0052] Final offset in X direction: ;

[0053] Final offset in the Y direction: ;

[0054] Step S8: Obtain the optimized final coordinates;

[0055] Final coordinate in the X direction: ; Final coordinate in Y direction: ;

[0056] Optimize the final coordinates: ).

[0057] In some embodiments, the adjustment factor and The optimization method comprises the following steps:

[0058] Step A1: After implementing the prediction method, the alignment is performed only once in combination with the compensation value, and then the target coordinates are obtained after vacuuming. The coordinates of the aligned target are , the coordinates of the characteristic target are ;

[0059] Step A2: Calculate the offset;

[0060] The offset of the feature target relative to the alignment target in the X direction: ;

[0061] The offset of the feature target relative to the alignment target in the Y direction: ;

[0062] Step A3: Condition judgment, setting threshold ;

[0063] Perform conditional judgment to confirm the validity of the new offset: if ; If the condition is met, the offset compensation value is valid and the current and ;

[0064] If the condition is not met, the optimization adjustment coefficient is used;

[0065] Step A4: Optimize adjustment coefficients and ;

[0066] Step A41: Establishing a data model;

[0067] Configure the learning rate: ; Configure momentum factor:

[0068] Configure the upper and lower limits of the adjustment factor: and ;

[0069] Step A42: Initialize the momentum variable, ;

[0070] Step A43: Calculate the offset change and the absolute difference between the new and old offsets:

[0071] ; ;

[0072] Step A44: Calculate the relative rate of change;

[0073] ;in, is a small value, such as 1e-5, to avoid division by zero;

[0074] Step A44: Update momentum, , ;

[0075] in, and is to convert the previous momentum or Momentum Factor Attenuation is performed;

[0076] Step A45: Update the adjustment coefficient, , ;

[0077] Step A46: Limit the adjustment coefficient range, , ; If the update result exceeds the maximum value , it is set to the maximum value; if it is lower than the minimum value , it is set to the minimum value.

[0078] The beneficial effects of the present invention are as follows: 1. In the present invention, the PCB board and the two films are exposed in the same temperature and humidity environment, which not only improves the production efficiency, but also achieves better consistency, improves the yield rate, and simplifies the equipment structure.

[0079] 2. In the present invention, the upper and lower alignment can be performed simultaneously, which greatly improves the efficiency of alignment.

[0080] 3. The present invention provides a high-precision alignment method, which, with the help of the alignment compensation function of the prediction module, solves the problem of reduced production efficiency due to multiple calculations and corrections due to factors such as vacuuming, CCD verticality, and board warping errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, without paying creative labor, other drawings obtained based on these drawings still belong to the scope of the present invention.

[0082] Figure 1 It is a schematic diagram of a fully automatic double-sided exposure machine in the present invention; Figure 2 It is a schematic diagram of a double-sided solder resist frame in the present invention; Figure 3 An exploded view of the double-sided solder mask frame of the present invention; Figure 4 It is a partial schematic diagram of the open frame assembly in the present invention; Figure 5 It is a partial schematic diagram of the double-sided solder resist frame in the present invention; Figure 6 A schematic diagram of the arrangement of the first alignment component and the second alignment component in the present invention; Figure 7 It is a partial schematic diagram of the upper frame in the present invention; Figure 8 Schematic diagram of the X-axis guide assembly of the present invention; Fig. 9 It is a partial schematic diagram of the visual detection mechanism in the present invention; Fig.10 It is a partial schematic diagram of the lower reinforcing mechanism in the present invention; Fig.11 is a schematic diagram of an upper reinforcement mechanism in the present invention; Fig.12 It is a partial schematic diagram of the upper reinforcement mechanism in the present invention; Fig.13 It is a schematic diagram of a staggered overlapping structure of the upper reinforcing mechanism in the present invention; Fig.14 It is a schematic diagram of another staggered overlapping structure of the upper reinforcing mechanism in the present invention; Fig.15 is a schematic diagram of another upper reinforcement mechanism in the present invention; Fig.16 Flow chart of the prediction method in the present invention. DETAILED DESCRIPTION

[0083] The following description provides specific application scenarios and requirements of this specification, with the purpose of enabling those skilled in the art to make and use the contents of this specification. Various local modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but to the widest scope consistent with the claims.

[0084] In the description of the present application, it should be noted that, unless otherwise expressly specified and limited, the terms "longitudinal", "transverse", "radial", "length", "width", "thickness", "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. These terms are mainly for better describing the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0085] Secondly, the terms "first", "second" and similar words do not indicate any order, quantity or importance, but are only used to distinguish different components and should not be understood as limitations on the embodiments of the present application.

[0086] In addition, the terms "installed", "set", "provided with", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components.

[0087] For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0088] Regarding the drawings of the present application, it should be clearly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of the present specification. It should also be understood that the drawings are not drawn to scale.

[0089] Embodiment 1:

[0090] In this application, if Figure 1 As shown, the X-axis, Y-axis and Z-axis are set for ease of description.

[0091] like Figures 1 to 16As shown, this embodiment provides a fully automatic double-sided exposure machine, including a frame 1, a double-sided solder resist frame 2, a Y-axis conveying mechanism 3 and a control system, wherein the frame 1 is provided with an alignment area 100 and an exposure area 101, and the Y-axis conveying mechanism 3 spans the alignment area 100 and the exposure area 101, and is used to drive the double-sided solder resist frame 2 to switch between the alignment area 100 and the exposure area 101, and the upper and lower parts of the alignment area 100 are provided with visual inspection mechanisms 4, which are respectively referred to as an upper visual inspection mechanism and a lower visual inspection mechanism. The visual inspection mechanism 4 includes four CCD visual inspection devices 40 that can move along the XYZ axis. The four CCD visual inspection devices 40 are grouped in pairs and are respectively arranged on both sides of the frame 1. The upper and lower parts of the exposure area 101 are provided with exposure mechanisms 5, which are respectively called upper exposure mechanism and lower exposure mechanism. Through this arrangement, the PCB board and the two films are exposed in the same temperature and humidity environment conditions, which not only improves the production efficiency, but also can achieve better consistency, improve the yield rate, and simplify the equipment structure.

[0092] Among them, there are two double-sided solder resist frames 2, which can be called an upper frame and a lower frame. The Y-axis conveying mechanism 3 includes an upper conveying component and a lower conveying component. The upper frame is installed on the upper conveying component, and the lower frame is installed on the lower conveying component. The upper conveying component and the lower conveying component drive the upper frame and the lower frame to alternately enter the exposure area 101. The upper conveying component and the lower conveying component can adopt a conveying device or module commonly used in the technical field. For example, it includes a driving motor, a gearbox, a synchronous wheel, a synchronous belt, a frame slide rail and a frame slider. The frame slide rail is arranged on both sides of the frame 1 along the Y-axis direction and spans the alignment area 100 and the exposure area 101. The double-sided solder resist frame 2 is slidably connected to the frame slide rail through the frame slider, and the double-sided solder resist frame 2 is connected to the synchronous belt. The driving motor is connected to the synchronous wheel through the gearbox. The rotation of the synchronous wheel can drive the double-sided solder resist frame 2 to move in the Y-axis direction through the synchronous belt. Through the above arrangement, alignment and exposure can be carried out simultaneously, which greatly improves production efficiency.

[0093] An upper lighting assembly is arranged above the upper stage frame, and a lower lighting assembly is arranged below the lower stage frame, and the lighting assembly provides sufficient light for visual inspection.

[0094] like Figures 2 to 8 As shown, the double-sided solder mask frame 2 includes a bottom frame 20, a middle frame 21, an upper frame 22, a frame opening assembly 23, an upper alignment assembly 24 and a lower alignment assembly 25. The two sides of the bottom frame 20 are slidably connected to the frame slide rails through frame sliders, and the rear side of the upper frame 22 is hinged to the bottom frame 20. In this embodiment, along the Y-axis direction, the alignment area 100 is located on the front side of the frame 1, the exposure area 101 is located on the rear side of the frame 1, and the front side of the frame 1 is provided with an opening for loading and unloading materials in the alignment area 100.

[0095] Among them, Figure 3 and Figure 4 As shown, the frame opening component 23 is used to allow the upper frame 22 to rotate around its hinged side so that it has an open state and a closed state. Preferably, the frame opening component 23 is arranged on both sides of the upper frame 22 and the bottom frame 20, so that the upper frame 22 is more stable when opened and closed. Specifically, the frame opening component 23 includes a frame opening cylinder 230, a frame opening arm 231 and a frame opening linkage shaft 232. One end of the frame opening cylinder 230 is hinged to the bottom frame 20, and the other end is hinged to the frame opening arm 231. One end of the frame opening arm 231 is hinged to the bottom frame 20, and the end thereof hinged to the frame opening arm 231 is provided with a linkage slide 233. One of the two sides of the upper frame 22 is provided with a The frame opening linkage shaft 232 is slidably matched with the linkage slide 233. The frame opening linkage shaft 232 can also be rotatably set on both sides of the upper frame 22. The initial end of the linkage slide 233 is provided with a guide portion 2330, and the rear end thereof is provided with a limiting portion 2331. When opening the frame, the frame opening cylinder 230 drives the frame opening arm 231 to rotate upward, and the frame opening linkage shaft 232 slides along the rear side of the guide portion 2330 and the linkage slide 233, and the front side of the upper frame 22 is gradually lifted until the upper frame 22 is in an opened state. At this time, the frame opening linkage shaft 232 is abutted against the limiting portion 2331. By adopting the present frame opening assembly 23, the frame opening action is smooth and has low noise.

[0096] Secondly, if Figure 5 As shown, the bottom frame 20 is provided with a support assembly 26. Preferably, two support assemblies 26 are provided on each side of the bottom frame 20, that is, they are distributed in a quadrilateral shape. When the upper frame 22 is in a closed state, the support assembly 26 supports the upper frame 22 so that it is arranged in parallel with the middle frame 21. The key point is to ensure that the PCB board is arranged in parallel with the two films, thereby ensuring the accuracy of the alignment. Preferably, the bottom frame 20, the middle frame 21 and the upper frame 22 are all arranged horizontally. The support assembly 26 includes a mounting frame 260, a support plate 261 and a Z-axis adjustment structure 262. The mounting frame 260 is arranged on the bottom frame 20. The support plate 261 is arranged to slide relative to the mounting frame 260 along the Z-axis direction. The Z-axis adjustment structure 262 is used to adjust the height of the support plate 261 in the Z-axis direction to ensure that the upper frame 22 is horizontal when it is in a closed state. Among them, there can be multiple Z-axis adjustment structures 262, such as a structure using a motor, a screw rod and a slider, or a structure in which a cylinder is directly connected to the support plate 261. In addition, it can also assist the upper frame 22 in opening.

[0097] like Figure 5As shown, a Y-axis guide component 27 and an X-axis guide component 28 are provided between the bottom frame 20 and the upper frame 22. The Y-axis guide component 27 is used to guide the upper frame 22 when the upper frame 22 is closed to prevent it from deflecting in the Y-axis direction. Specifically, there are three Y-axis guide components 27, which are respectively arranged on both sides of the middle of the bottom frame 20 and the upper frame 22 and in the middle of the back side of the bottom frame 20 and the upper frame 22. It includes a first mounting seat 270 fixed on the bottom frame 20, and two first guide blocks 271 are arranged at intervals at the top end of the first mounting seat 270. The first guide block 271 can be adjusted along the Y-axis direction relative to the first mounting seat 270. The structure for realizing this adjustment can be that an oblong hole is provided on the first guide block 271, and a threaded hole is correspondingly provided on the first mounting seat 270, and a bolt is passed through the oblong hole to connect with the threaded hole. The top end of the first mounting seat 270 is in the Y-axis direction. Limiting protrusions 272 are provided on the front and rear sides of the two first guiding blocks 271 upwards, and the limiting protrusions 272 are provided with a pressing bolt 273 and a locking nut 274. The end of the pressing bolt 273 abuts against the first guiding block 271 to prevent the first guiding block 271, which has been adjusted in position, from retreating during guiding. A guiding roller 275 is rotatably provided on the first guiding block 271 at a side where the two first guiding blocks 271 are close to each other. The guiding roller 275 is rollingly arranged along the Y-axis direction. Guiding inclined surfaces 276 are provided on both sides of the guiding roller 275 on the first guiding block 271, and a guiding socket 278 is formed between the two guiding rollers 275. Guiding plug blocks 277 are provided on both sides of the middle of the upper frame 22 corresponding to the guiding plug blocks 277. The guiding roller 275 and the guiding inclined surface 276 can guide the guiding plug block 277 to quickly insert into the guiding socket 278, thereby improving the guiding speed.

[0098] like Figure 8 As shown, the X-axis guiding assembly 28 is used to guide the upper frame 22 when the upper frame 22 is closed to prevent it from offset in the X-axis direction. Specifically, there are two X-axis guiding assemblies 28, which are respectively arranged on both sides of the bottom frame 20 and the front end of the upper frame 22. The front end of the upper frame 22 is the end away from its hinge end. The X-axis guiding assembly 28 includes a second mounting seat 280, and a second guiding block 282 is arranged on the second mounting seat 280. The second guiding block 282 can be adjusted along the X-axis direction relative to the second mounting seat 280. This adjustment structure is the same as the first guiding block 271, and is also provided with a pressing bolt 273 and a locking nut 274. A guiding roller 275 is arranged on the side of the second guiding block 282 facing the upper frame 22, and the guiding roller 275 is arranged to roll along the X-axis direction. Guiding protrusions 281 are arranged on both sides of the front end of the upper frame 22.

[0099] The Y-axis guiding assembly 27 and the X-axis guiding assembly 28 ensure that the upper frame 22 is in a correct position relative to the bottom frame 20 when in the closed state, thereby improving the accuracy of subsequent alignment.

[0100] An upper glass 220 is disposed in the middle of the upper frame 22 , and a film sheet is disposed on the lower surface of the upper glass 220 , generally by vacuum adsorption.

[0101] The middle frame 21 includes a middle frame lower plate 211 and a middle frame upper plate 212. A lower glass 210 is arranged in the middle of the middle frame upper plate 212. Another film sheet is arranged on the upper surface of the lower glass 210, generally by vacuum adsorption thereon. An inflation strip 29 is arranged on the outer periphery of the lower glass 210 on the middle frame upper plate 212. The inflation strip 29 is inflated by an air supply device. When the upper frame 22 is in a closed state, a sealed cavity is formed between the upper frame 22 and the middle frame upper plate 212.

[0102] like Fig. 9 As shown, the visual inspection mechanism 4 includes a first movable arm 41, a second movable arm 42, a visual Y-axis conveying assembly 43, a visual X-axis conveying assembly 44 and a visual Z-axis conveying assembly 45. The first movable arm 41 is connected to the frame 1 through the visual Y-axis conveying assembly 43 so that it can move along the Y-axis direction. The second movable arm 42 is connected to the first movable arm 41 through the visual X-axis conveying assembly 44 so that it can move along the X-axis direction. The CCD visual inspection device 40 is connected to the second movable arm 42 through the visual Z-axis conveying assembly 45 so that it can move along the Z-axis direction. Each conveying assembly can adopt a structure of a motor, a synchronous belt, a synchronous wheel and a connecting block, or a structure of a cylinder, a slider and a slide rail, or a structure of a motor, a screw rod and a slider, etc.

[0103] In this embodiment, two sliders are arranged in parallel at one end of the first movable arm 41, and are connected to a slide rail arranged on the frame 1 through the sliders. At the same time, a motor, a synchronous belt and a synchronous wheel are used as driving components, and the synchronous belt is connected to the first movable arm 41 by a connecting block. The double sliders can improve the stability of the first movable arm 41 during movement, thereby improving the detection accuracy of the CCD visual detection device 40.

[0104] Among them, four alignment target points are set on the upper and lower surfaces of the PCB board, respectively called the upper target point and the lower target point, and the two film sheets are respectively called the upper film and the lower film. The upper visual inspection mechanism is used to detect the position deviation between the upper film and the four alignment target points on the upper surface of the PCB board, and the lower visual inspection mechanism is used to detect the position deviation between the lower film and the four alignment target points on the lower surface of the PCB board. Based on the detection result of the visual inspection mechanism 4, the upper alignment component 24 is used to move the middle frame 21 to align the upper film with the upper target point of the PCB board, and the lower alignment component 25 is used to move the middle frame upper plate 212 to align the lower film with the lower target point of the PCB board. Preferably, the upper and lower alignments are carried out simultaneously, which greatly improves the efficiency of the alignment.

[0105] Specifically, Figure 6As shown, the upper alignment component 24 includes two first Y-axis modules 240 and one first X-axis module 241. In the present embodiment, the first Y-axis module 240 and the first X-axis module 241 are both arranged between the middle frame lower plate 211 and the bottom frame 20, wherein the two first Y-axis modules 240 are respectively arranged on both sides of the middle frame lower plate 211 and the front end of the bottom frame 20, and the first X-axis module 241 is arranged on either side of the middle frame lower plate 211 and the rear end of the bottom frame 20.

[0106] Specifically, Figure 6 As shown, the lower alignment component 25 includes two second Y-axis modules 250 and a second X-axis module 251. In the present embodiment, the second Y-axis module 250 and the second X-axis module 251 are both arranged between the middle frame lower plate 211 and the middle frame upper plate 212, wherein the two second Y-axis modules 250 are respectively arranged on both sides of the middle of the middle frame lower plate 211 and the middle frame upper plate 212, and the second X-axis module 251 is arranged in the middle of the rear ends of the middle frame lower plate 211 and the middle frame upper plate 212. Secondly, the middle of the middle frame lower plate 211 and the front end of the middle frame upper plate 212 is arranged in the middle of the auxiliary module 252 to assist the middle frame upper plate 212 in moving for alignment.

[0107] Among them, the above modules adopt servo alignment system, such as UVW alignment platform. Servo alignment system is an important and key component in the alignment platform. Its accuracy determines the alignment accuracy and speed of the alignment platform. The servo alignment system mainly realizes movement in the X, Y, and Z directions, and rotation around the Z direction. The movement gap in each direction is as small as possible, but the movement in each direction must be smooth and reliable. The ball screw pair, bearings, and linear units are selected with high precision grades, and the connecting shaft and sleeve are precision-machined in pairs. In order to eliminate the matching clearance of the linear unit as much as possible, two sets of linear units are installed in the X and Y directions.

[0108] A PIN needle positioning and adjustment mechanism is provided on the lower plate 211 of the middle frame. The above-mentioned alignment component, PIN needle positioning and adjustment mechanism and related visual alignment methods and algorithms can refer to the semi-automatic solder mask exposure machine disclosed in the patent with publication number CN215449885U in the prior art, or a double-sided automatic alignment LED semi-automatic exposure machine disclosed in the patent with publication number CN218213788U, or an exposure machine 8CCD double-sided simultaneous alignment method disclosed in the patent with publication number CN105278263B, or an independent solder mask alignment table frame and exposure machine disclosed in the patent with publication number CN106054542B, or a PCB exposure machine with correction and equalization alignment method disclosed in the patent with publication number CN103217876B, etc.

[0109] The exposure mechanism 5 includes a light source assembly and a heat dissipation system. The exposure mechanism 5 is fixed to the upper and lower sides of the double-sided solder resist frame 2 entering the exposure area 101 to expose the front and back sides of the PCB board in the double-sided solder resist frame 2 respectively.

[0110] For heat dissipation requirements, the light source assembly is fixedly mounted on the heat dissipation system, and the heat dissipation system is used to dissipate the heat of the light source assembly.

[0111] The heat dissipation system includes an air cooling system and a water cooling system, wherein the water cooling system is in direct contact with the light source assembly, and includes a plurality of coolers interconnected with each other, each cooler being connected by a water cooling pipe, and the light source assembly is fittedly arranged on the lower surface of the cooler to dissipate heat, and a light source control board is arranged on the upper surface of the cooler, which is covered by the air cooling system, and further relies on air cooling to reduce the temperature, adopting a double cooling method, so as to minimize the temperature inside the exposure machine and extend the life of the light source assembly.

[0112] Among them, the light source component 50 adopts an ultraviolet LED lamp array and adopts an array distribution. Specifically, you can refer to a new type of LED ultraviolet exposure machine light source system disclosed in the patent with publication number CN103592821B, or the ultraviolet LED exposure machine optical exposure lighting system and ultraviolet LED exposure machine disclosed in the patent with publication number CN103513518B.

[0113] The frame 1 is provided with a shading component, and a partition 6 is provided between the exposure area 101 and the alignment area 100. The shading component is arranged on the partition 6 and forms a sealed exposure space with the frame 1 to reduce the brightness of the exposure area 101 and thereby improve the exposure effect.

[0114] The shading assembly includes an upper shading assembly and a lower shading assembly that are independent of each other. An upper driving mechanism is provided between the upper shading assembly and the machine body, and a lower driving mechanism is provided between the lower shading assembly and the machine body. The design of the two sets of shading assemblies satisfies the independent control of the two-layer double-sided solder mask frame 2, and shortens the time of opening the shading assembly as much as possible, thereby improving the switching speed of the double-sided solder mask frame 2. Regarding the exposure mechanism 5 and the shading assembly, reference can be made to the semi-automatic solder mask exposure machine disclosed in the patent with publication number CN215449885U in the prior art.

[0115] Embodiment 2:

[0116] like Figures 10 to 14As shown, based on Example 1, although the first movable arm 41 in the visual inspection mechanism 4 is connected to the double slide rails on the frame 1 through double sliders, since the first movable arm 41 is relatively long and the visual X-axis conveying assembly 44, the visual Z-axis conveying assembly 45 and the CCD visual inspection device 40 arranged thereon are relatively heavy as a whole, especially when the CCD visual inspection device 40 moves on the first movable arm 41, it is easy to cause the first movable arm 41 to tilt and vibrate during the movement, thereby affecting the positioning accuracy.

[0117] Therefore, the frame 1 is provided with an upper reinforcing mechanism 7 and a lower reinforcing mechanism 8, which are used to respectively enhance the stability of the first moving arm 41 in the upper visual inspection mechanism and the lower visual inspection mechanism.

[0118] In this embodiment, the lower reinforcing mechanism 8 includes a lower reinforcing rod 80 arranged along the Y-axis direction, at least one end of the lower reinforcing rod 80 is fixed to the frame 1, and preferably, both ends of the lower reinforcing rod 80 are fixed to the frame 1, and the lower reinforcing rod 80 is arranged in the middle of the four CCD visual detection devices 40 of the lower visual detection mechanism, that is, the four CCD visual detection devices 40 are located on both sides of the lower reinforcing rod 80 in pairs, and lower guide grooves 81 are arranged on both sides of the lower reinforcing rod 80. The four first movable arms 41 in the lower visual detection mechanism are all provided with lower guide wheels, which slide and cooperate with the lower guide grooves 81, and do not affect the smoothness of the movement of the first movable arms 41. By setting the lower reinforcing mechanism 8, the four first movable arms 41 in the lower visual detection mechanism are prevented from tilting when the CCD visual detection device 40 is working, thereby greatly improving the positioning accuracy.

[0119] Secondly, when the upper frame 22 is opened, the four first movable arms 41 of the upper visual inspection mechanism are all moved to the rear of the upper frame 22 to avoid affecting the upward opening of the front side of the upper frame 22. Therefore, in the upper visual inspection mechanism, since the upper frame 22 needs to be opened for loading and unloading, the installation space of the upper reinforcement mechanism 7 is affected.

[0120] In this embodiment, the upper reinforcing mechanism 7 includes a fixed bracket 70, a first stable bracket 71 and a second stable bracket 72. The fixed bracket 70 is fixed to the frame 1, and a linear translation module 73 is arranged on it along the Y-axis direction. The linear translation module 73 is located in the middle of the four first movable arms 41 of the upper visual detection mechanism. Since the four upper target points are generally located at the four corners of the PCB board, the linear translation module 73 is arranged in this way without affecting the illumination of the upper lighting component during detection.

[0121] The linear translation module 73 includes at least one reinforcing slider 730. The linear translation module 73 adopts a high-speed, high-stability mobile module commonly used in the field of automation equipment technology. The first stable bracket 71 is connected to the reinforcing slider 730, or is directly fixed to one end of the fixed bracket 70 close to the partition 6. The ends of the two first moving arms 41 located on the rear side of the upper visual detection mechanism slide and cooperate with the first stable bracket 71. Specifically, a first pulley is provided at the end of the first moving arm 41, and first slide grooves are provided on both sides of the first stable bracket 71 corresponding to the first pulley. Since the two CCD visual detection devices 40 located on the rear side of the upper visual detection mechanism are used to detect the two located on the rear side of the upper target, they only need to move within a certain range. However, in order to facilitate the overall assembly, debugging and maintenance, it is preferred that the first stable bracket 71 is connected to the reinforcing slider 730, but the first stable bracket 71 only needs to be moved to the specified position, and does not need to be moved when the upper frame 22 is opened and closed and the CCD visual detection device 40 is operating. In this embodiment, the connection between the first stable bracket 71 and the reinforcing slider 730 is taken as an example.

[0122] Among them, the fixed bracket 70 includes a first fixed rod 700, a second fixed rod 701 and two fixed vertical rods 702, one end of the first fixed rod 700 is fixed to the partition 6, the second fixed rod 701 is arranged at the other end of the first fixed rod 700 and is perpendicular to it, and both ends of the second fixed rod 701 are connected to the frame 1 through the fixed vertical rods 702.

[0123] Since the two CCD visual detection devices 40 located on the front side of the upper visual detection mechanism need to be moved to the rear of the upper frame 22 when the upper frame 22 is opened, in the present embodiment, the second stable bracket 72 is connected to the reinforcing slider 730, and the ends of the two first movable arms 41 located on the front side of the upper visual detection mechanism slide and cooperate with the second stable bracket 72. Specifically, a first pulley is provided at the end of the first movable arm 41, and first slide grooves are provided on both sides of the second stable bracket 72 corresponding to the first pulley.

[0124] Through the above arrangement, both ends of the first movable arm 41 are effectively supported without affecting the movement of the CCD visual inspection device 40 and the opening and closing of the upper frame 22, which greatly improves the stability and reliability of the CCD visual inspection device 40 during operation.

[0125] In this embodiment, the control system controls the linear translation module 73 so that the first stable bracket 71 and the second stable bracket 72 and the corresponding stable brackets move synchronously or in advance, and it is necessary to avoid collision between the first pulley and the first and end ends of the first slide groove.

[0126] Furthermore, in order to avoid increasing the size of the alignment area 100 in the Y-axis direction, the second stabilizing bracket 72 can be made to at least partially overlap with the first stabilizing bracket 71 when it moves to the rear of the upper frame 22. If overlap is required, the first stabilizing bracket 71 and the second stabilizing bracket 72 can be misaligned in the X-axis direction or the Z-axis direction. Specifically, if it is a conventional setting, a connecting rod should be provided between the first stabilizing bracket 71 and the second stabilizing bracket 72 to connect with the corresponding reinforcing slider 730. However, in this embodiment, in order to better misalign and overlap, the first stabilizing bracket 71 is provided on the upper side of the first stabilizing bracket 71. A first connecting rod 74 is upwardly arranged on the side near the partition 6 and connected to the corresponding reinforcing slider 730, and a second connecting rod 75 is upwardly arranged on the side away from the partition 6 of the second stable bracket 72 and connected to the corresponding reinforcing slider 730, and the first stable bracket 71 and the second stable bracket 72 are misaligned in the Z-axis direction, which can be achieved by setting a length difference between the first connecting rod 74 and the second connecting rod 75. Preferably, the length of the first connecting rod 74 is greater than that of the second connecting rod 75, so that when the second stable bracket 72 moves toward the partition 6, it will be located above the first stable bracket 71 and overlap with it.

[0127] Secondly, an opening 76 is provided on the first connecting rod 74 on the moving track of the second stable bracket 72, and the opening 76 allows the second stable bracket 72 to pass through, so that the size of the alignment area 100 in the Y-axis direction can be minimized, thereby reducing the distance that the double-sided solder mask frame 2 needs to move.

[0128] Another staggered overlapping structure is: the first stable bracket 71 and the second stable bracket 72 are staggered in the X-axis direction. In this embodiment, a staggered channel 77 is arranged in the middle of the first stable bracket 71 along the Y-axis direction. When the second stable bracket 72 moves toward the partition 6, the second stable bracket 72 can pass through the staggered channel 77 to overlap with the first stable bracket 71. It should be understood that the staggered channel 77 can also be arranged on the second stable bracket 72. In addition, the staggered position of the first stable bracket 71 and the second stable bracket 72 in the X-axis direction can also be left-right staggered, that is, the second stable bracket 72 passes through one side of the first stable bracket 71.

[0129] Embodiment three:

[0130] like Fig.15As shown, based on the first embodiment and the second embodiment, another upper reinforcing mechanism 7 is proposed, which also includes a fixed bracket 70, and a linear translation module 73 is arranged on the fixed bracket 70 along the Y-axis direction, and the linear translation module 73 is located in the middle of the four first movable arms 41 of the upper visual inspection mechanism, and the linear translation module 73 includes a reinforcing slider 730, and a connecting shaft 780 is arranged downward along the Z-axis direction on the reinforcing slider 730, and the lower end of the connecting shaft 780 is hinged to two stabilizing rods 781, and the two stabilizing rods 781 are hinged to the connecting shaft 780 to form a fork frame, and second pulleys 782 are arranged at both ends of the stabilizing rod 781, and the four first movable arms 41 in the upper visual inspection mechanism are all provided with a side facing the connecting shaft 780 to slide with the second pulley 782. The second slide groove 783 is arranged along the X-axis direction. The CCD visual inspection device 40 is installed on the opposite side of the second slide groove on the first movable arm 41 to avoid affecting the movement of the CCD visual inspection device 40 in the X-axis direction. When the upper visual inspection mechanism is in operation, the reinforcing slider 730 on the linear translation module 73 does not move, and the four first movable arms 41 in the upper visual inspection mechanism move corresponding to the four upper target points. Generally, during inspection, the two first movable arms 41 on the front side and the two first movable arms 41 on the rear side of the upper visual inspection mechanism are far apart. At this time, the end of the stabilizing bar 781 is also close to the end of the first movable arm 41, which just improves the stability of the first movable arm 41, thereby improving the inspection accuracy of the CCD visual inspection device 40.

[0131] Secondly, when it is necessary to open the upper frame 22 for loading and unloading, the control system controls the linear translation module 73 to move the connecting shaft 780 backward. At the same time, the four first movable arms 41 in the upper visual inspection mechanism also move backward synchronously, and the distance between the two first movable arms 41 on the same side is reduced, and the end of the stabilizing rod 781 moves toward the head end of the first movable arm 41.

[0132] Through this arrangement, the fork-type structure can reduce the size of the alignment area 100 in the Y-axis direction to a greater extent after being retracted.

[0133] Embodiment 4:

[0134] In the second and third embodiments, the problem of alignment accuracy is solved by structural improvement, and in the present embodiment, the alignment method is optimized to further improve the alignment accuracy.

[0135] The alignment process of the fully automatic double-sided exposure machine in the first embodiment can be as follows: first, the lower film is placed on the lower glass 210, and the PCB board is placed on the PIN needle positioning and adjustment mechanism, and then the middle frame upper plate 212 is moved by the lower alignment component 25, so that the PCB board and the lower film are aligned, and then the upper frame 22 is closed to move the upper film to above the PCB board, and then the middle frame 21 is moved by the lower alignment component 25, so that the PCB board and the upper film are aligned; of course, it can also be: after the upper film, PCB board and lower film are all placed in the specified position, the upper and lower parts are aligned at the same time, and finally the upper frame 22 and the middle frame upper plate 212 are vacuumed to perform the exposure process.

[0136] However, due to factors such as vacuuming, CCD verticality, and board warping errors, secondary errors may occur. Therefore, secondary deviation correction and alignment are required after vacuuming to achieve higher alignment accuracy.

[0137] However, such repeated alignment and multiple calculations for correction will inevitably lead to longer time and reduced efficiency.

[0138] Based on the first embodiment, this embodiment provides a high-precision alignment method, which includes a correction alignment module and a prediction module. The correction alignment module refers to the correction equalization alignment method of the PCB exposure machine disclosed in the patent with publication number CN103217876B. The correction alignment module can obtain the final coordinate of the correction. ;

[0139] The prediction module is based on machine learning and has a position compensation function, which can calculate the compensation value , and then the optimized final coordinates are obtained ; In this way, only one alignment is required to achieve high-precision alignment efficiency and quality, improving exposure quality while enhancing productivity.

[0140] The prediction method of the prediction module includes the following steps:

[0141] Step S1: Obtaining the coordinates of the target point. The CCD visual detection device 40 obtains the coordinates of the alignment target point and the coordinates of the feature target point, which are obtained three times in total:

[0142] The first time is to obtain the coordinates of the alignment target point before the alignment module is aligned. , the coordinates of the characteristic target are ;

[0143] The second time is obtained after the correction and alignment module corrects the deviation and alignment. The coordinates of the alignment target are , the coordinates of the characteristic target are ;

[0144] The third time is after vacuuming, the coordinates of the target point are , the coordinates of the characteristic target are ;

[0145] Among them, the alignment target points are the target points on the PCB board, and the PCB board has four on the upper and lower surfaces respectively; the characteristic target points are the target points on the upper film and the lower film, and the upper film has four on the lower surface and four on the upper surface of the lower film;

[0146] Step S2: Calculate the offset;

[0147] first:

[0148] The offset of the feature target relative to the alignment target in the X direction: ;

[0149] The offset of the feature target relative to the alignment target in the Y direction: ;

[0150] Second time:

[0151] The offset of the feature target relative to the alignment target in the X direction: ;

[0152] The offset of the feature target relative to the alignment target in the Y direction: ;

[0153] Third time:

[0154] The offset of the feature target relative to the alignment target in the X direction: ;

[0155] The offset of the feature target relative to the alignment target in the Y direction: ;

[0156] Step S3: condition judgment;

[0157] First distance ;

[0158] Second distance , if accurate alignment, ;

[0159] The third distance ;

[0160] Similarly, calculate the other three sets of distance values ​​on the same surface;

[0161] Then calculate the distance change:

[0162] , ;

[0163] , ;

[0164] Among them, if , then proceed to the subsequent steps, otherwise, re-correct the alignment.

[0165] Step S4: Calculate the difference between the first and third offsets;

[0166] The difference between the two offsets in the X direction: ;

[0167] The difference between the two offsets in the Y direction: ;

[0168] Step S5: historical data analysis, using historical data to calculate the mean and standard value of the offset difference;

[0169] The average value of the historical offset difference in the X direction: ;

[0170] The average value of the historical offset difference in the Y direction: ;

[0171] Where N is the total number of historical data, For the i The X-direction offset of the secondary alignment, For the i The Y-direction offset of the secondary alignment;

[0172] Standard deviation of historical offsets in the X direction: ;

[0173] Standard deviation of historical offset in the Y direction: ;

[0174] Step S6: predicting the compensation value of the offset;

[0175] Predicted compensation value of X-direction offset: ;

[0176] Predicted compensation value of Y-direction offset: ;

[0177] in, and To adjust the coefficient, adjustments are made based on machine learning;

[0178] Step S7: Calculate the final offset;

[0179] Final offset in X direction: ;

[0180] Final offset in the Y direction: ;

[0181] Step S8: Obtain the optimized final coordinates;

[0182] Final coordinate in the X direction: ;

[0183] Final coordinate in Y direction:

[0184] Optimize the final coordinates: ).

[0185] Among them, the adjustment coefficient and The optimization method comprises the following steps:

[0186] Step A1: After implementing the prediction method, only one alignment is performed in combination with the compensation value, and then the target coordinates are obtained after vacuuming. The coordinates of the aligned target are , the coordinates of the characteristic target are ;

[0187] Step A2: Calculate the offset;

[0188] The offset of the feature target relative to the alignment target in the X direction: ;

[0189] The offset of the feature target relative to the alignment target in the Y direction: ;

[0190] Step A3: Condition judgment, setting threshold ;

[0191] Perform conditional judgment to confirm the validity of the new offset: if ; If the condition is met, the offset compensation value is valid and the current and .

[0192] If the condition is not met, the optimization adjustment coefficient is used;

[0193] Step A4: Optimize adjustment coefficients and ;

[0194] Step A41: Establishing a data model;

[0195] Configure the learning rate: , which is a hyperparameter that controls the speed of adjustment. Higher values ​​result in fast adjustments, while lower values ​​make the adjustment process smoother and slower.

[0196] Configure Momentum Factor: , the momentum factor is used to smooth the update process and is usually between 0 and 1.

[0197] Configure the upper and lower limits of the adjustment factor: and ;

[0198] Step A42: Initialize momentum variable;

[0199] ;

[0200] Step A43: Calculate the offset change;

[0201] Calculate the absolute difference between the old and new offsets:

[0202] ;

[0203] ;

[0204] Step A44: Calculate the relative rate of change;

[0205] ;in, is a small value, such as 1e-5, to avoid division by zero;

[0206] Step A44: Update momentum;

[0207] , ;

[0208] in, and is to convert the previous momentum or Momentum Factor Attenuation.

[0209] Step A45: Update the adjustment coefficient, , ;

[0210] Step A46: limiting the adjustment coefficient range;

[0211] , ;

[0212] Ensure that the updated coefficients and Keep it within the set range. If the update result exceeds the maximum value , it is set to the maximum value; if it is lower than the minimum value , then set it to the minimum value to ensure the stability and rationality of the system.

[0213] By combining momentum and adaptive learning rate, we can more effectively adjust and The introduction of momentum enables the algorithm to remember past trends, thereby reducing shocks and accelerating convergence. At the same time, the adaptive learning rate method makes the adjustment more flexible, which can adapt to different offset situations and improve the overall optimization effect.

[0214] In summary, after reading this detailed disclosure, those skilled in the art will appreciate that the foregoing detailed disclosure may be presented only by way of example and may not be restrictive. Although not explicitly stated herein, those skilled in the art will appreciate that the requirements of this application encompass various reasonable changes, improvements and modifications to the embodiments. These changes, improvements and modifications are intended to be proposed by the present application and are within the spirit and scope of the exemplary embodiments of the present application.

[0215] In addition, it should be understood that in the foregoing description of the embodiments of the present application, in order to help understand a feature and for the purpose of simplifying the present application, the present application combines various features in a single embodiment, drawing or its description. However, this does not mean that the combination of these features is necessary. When reading the present application, it is entirely possible for a person skilled in the art to mark out a part of the devices as a separate embodiment. In other words, the embodiments in the present application can also be understood as the integration of multiple secondary embodiments. This is also true when the content of each secondary embodiment is less than all the features of a single aforementioned disclosed embodiment.

[0216] Finally, it should be understood that the embodiments of the application disclosed herein are explanations of the principles of the embodiments of the present application. Other modified embodiments are also within the scope of the present application. Therefore, the embodiments disclosed in the present application are merely examples and not limitations. Those skilled in the art can adopt alternative configurations according to the embodiments in the present application to implement the application in the present application. Therefore, the embodiments of the present application are not limited to the embodiments accurately described in the application.

Claims

1. A fully automatic double-sided exposure machine, comprising a frame, a double-sided solder resist frame, a Y-axis conveying mechanism and a control system, wherein the frame is provided with an alignment area and an exposure area, the Y-axis conveying mechanism spans the alignment area and the exposure area, and is used to drive the double-sided solder resist frame to switch between the alignment area and the exposure area, It is characterized in that The upper and lower parts of the alignment area are both provided with visual inspection mechanisms, which are respectively referred to as the upper visual inspection mechanism and the lower visual inspection mechanism. The double-sided solder resist frame comprises a bottom frame, a middle frame, an upper frame, an opening frame assembly, an upper alignment assembly and a lower alignment assembly. An upper glass is arranged in the middle of the upper frame, and a film sheet is arranged on the lower surface of the upper glass. The middle frame comprises a middle frame lower plate and a middle frame upper plate. A lower glass is arranged in the middle of the middle frame upper plate, and another film sheet is arranged on the upper surface of the lower glass. The upper visual inspection mechanism is used to detect the position deviation of the upper film and the four alignment target points on the upper surface of the PCB board, and the lower visual inspection mechanism is used to detect the position deviation of the lower film and the four alignment target points on the lower surface of the PCB board. Based on the detection result of the visual inspection mechanism, the upper alignment assembly is used to move the middle frame to align the upper film with the upper target point of the PCB board, and the lower alignment assembly is used to move the middle frame upper plate to align the lower film with the lower target point of the PCB board.

2. A fully automatic double-sided exposure machine according to claim 1, It is characterized in that The frame opening assembly is used to allow the upper frame to rotate around its hinged side so that it has an open state and a closed state. The frame opening assembly comprises a frame opening cylinder, a frame opening arm and a frame opening linkage shaft. One end of the frame opening cylinder is hinged to the bottom frame, and the other end is hinged to the frame opening arm. One end of the frame opening arm is hinged to the bottom frame, and one end of the frame opening arm is hinged to the bottom frame. A linkage slide is provided at one end of the frame opening linkage shaft, and the frame opening linkage shaft slides with the linkage slide. A guide portion is provided at the initial end of the linkage slide, and a limited portion is provided at the rear end thereof. When opening the frame, the frame opening cylinder drives the frame opening arm to rotate upward, and the frame opening linkage shaft slides along the rear side of the linkage slide of the guide portion, and the front side of the upper frame is gradually lifted until the upper frame is in the open state, at which time the frame opening linkage shaft abuts against the limit portion.

3. The fully automatic double-sided exposure machine according to claim 1, It is characterized in that Two support assemblies are respectively arranged on both sides of the bottom frame. When the upper frame is in a closed state, the support assemblies support the upper frame so that it is arranged in parallel with the middle frame. The support assemblies include a mounting frame, a support plate and a Z-axis adjustment structure. The mounting frame is arranged on the bottom frame, and the support plate is slidably arranged along the Z-axis direction relative to the mounting frame. The Z-axis adjustment structure is used to adjust the height of the support plate in the Z-axis direction to ensure that the upper frame is horizontal when it is in a closed state.

4. The fully automatic double-sided exposure machine according to claim 1, It is characterized in that The y-axis guide assembly is arranged between the bottom frame and the upper frame, and the y-axis guide assembly is used to guide the upper frame to prevent it from offsetting in the y-axis direction when the upper frame is closed. It includes a first mounting seat fixed on the bottom frame, and two first guide blocks are arranged at intervals on the top end of the first mounting seat, and the first guide block can be adjusted along the y-axis direction relative to the first mounting seat, and the top end of the first mounting seat is provided with limiting protrusions on the front and rear sides of the two first guide blocks in the y-axis direction, and the limiting protrusions are provided with a pressing bolt and a locking nut, and the end of the pressing bolt abuts against the first guide block, and a guiding roller is rotatably arranged on the first guide block on the side where the two first guide blocks are close to each other, and the guiding roller is arranged to roll along the y-axis direction, and guiding inclined surfaces are arranged on both sides of the guiding roller on the first guide block, and a guiding socket is formed between the two guiding rollers, and guiding plugs are provided on the two sides corresponding to the guiding plugs in the middle of the upper frame.

5. A fully automatic double-sided exposure machine according to claim 1 or 4, It is characterized in that An X-axis guiding assembly is arranged between the bottom frame and the upper frame, and the X-axis guiding assembly is used to guide the upper frame when the upper frame is closed to prevent it from being offset in the X-axis direction. The X-axis guiding assembly includes a second mounting seat, and a second guiding block is arranged on the second mounting seat. The second guiding block can be adjusted along the X-axis direction relative to the second mounting seat. This adjustment structure is the same as the first guiding block, and is also provided with a pressing bolt and a locking nut. A guiding roller is arranged on the side of the second guiding block facing the upper frame, and the guiding roller is arranged to roll along the X-axis direction. Guiding blocks are arranged on both sides of the front end of the upper frame.

6. The fully automatic double-sided exposure machine according to claim 1, It is characterized in that The visual detection mechanism includes four CCD visual detection devices that can move along the XYZ axes. The four CCD visual detection devices are grouped in pairs and are respectively arranged on both sides of the frame. The visual detection mechanism includes a first movable arm, a second movable arm, a visual Y-axis conveying assembly, a visual X-axis conveying assembly and a visual Z-axis conveying assembly. The first movable arm is connected to the frame through the visual Y-axis conveying assembly so that it can move along the Y-axis direction. The second movable arm is connected to the first movable arm through the visual X-axis conveying assembly so that it can move along the X-axis direction. The CCD visual detection device is connected to the second movable arm through the visual Z-axis conveying assembly so that it can move along the Z-axis direction.

7. The fully automatic double-sided exposure machine according to claim 1, It is characterized in that The upper alignment component includes two first Y-axis modules and one first X-axis module, and the first Y-axis module and the first X-axis module are both arranged between the middle frame lower plate and the bottom frame, wherein the two first Y-axis modules are respectively arranged at both sides of the middle frame lower plate and the front end of the bottom frame, and the first X-axis module is arranged on either side of the middle frame lower plate and the rear end of the bottom frame; the lower alignment component includes two second Y-axis modules and one second X-axis module, and the second Y-axis module and the second X-axis module are both arranged between the middle frame lower plate and the middle frame upper plate, wherein the two second Y-axis modules are respectively arranged at both sides of the middle of the middle frame lower plate and the middle frame upper plate, the second X-axis module is arranged in the middle of the middle frame lower plate and the rear end of the middle frame upper plate, and the middle of the middle frame lower plate and the front end of the middle frame upper plate is arranged on an auxiliary module, and each module adopts a UVW alignment platform.

8. The fully automatic double-sided exposure machine according to claim 6, It is characterized in that The frame is provided with an upper reinforcing mechanism and a lower reinforcing mechanism, which are used to respectively enhance the stability of the first moving arm in the upper visual detection mechanism and the lower visual detection mechanism.

9. High-precision alignment method, It is characterized in that It includes the correction and alignment module and the prediction module. The correction and alignment module is used to obtain the final coordinates of the correction. The prediction module is based on machine learning and has a position compensation function. It first calculates the compensation value , and then the optimized final coordinates are obtained ; The prediction method of the prediction module includes the following steps: Step S1: Obtain the target coordinates. The CCD visual detection device obtains the coordinates of the alignment target and the feature target, which are obtained three times in total: The first time is to obtain the coordinates of the alignment target point before the alignment module is aligned. , the coordinates of the characteristic target are ; The second time is obtained after the correction and alignment module corrects the deviation and alignment. The coordinates of the alignment target are , the coordinates of the characteristic target are ; The third time is after vacuuming, the coordinates of the target point are , the coordinates of the characteristic target are ; Among them, the alignment target points are the target points on the PCB board, and the PCB board has four on the upper and lower surfaces respectively; the characteristic target points are the target points on the upper film and the lower film, and the upper film has four on the lower surface and four on the upper surface of the lower film; Step S2: Calculate the offset; first: The offset of the feature target relative to the alignment target in the X direction: ; The offset of the feature target relative to the alignment target in the Y direction: ; Second time: The offset of the feature target relative to the alignment target in the X direction: ; The offset of the feature target relative to the alignment target in the Y direction: ; Third time: The offset of the feature target relative to the alignment target in the X direction: ; The offset of the feature target relative to the alignment target in the Y direction: ; Step S3: condition judgment; First distance ; Second distance ; The third distance ; Similarly, calculate the other three sets of distance values ​​on the same surface; Then calculate the distance change: ， ； ， ； Among them, if , then proceed to the subsequent steps, otherwise, re-correct the alignment; Step S4: Calculate the difference between the first and third offsets; The difference between the two offsets in the X direction: ; The difference between the two offsets in the Y direction: ; Step S5: historical data analysis, using historical data to calculate the mean and standard value of the offset difference; The average value of the historical offset difference in the X direction: ; The average value of the historical offset difference in the Y direction: ; Where N is the total number of historical data, For the i The X-direction offset of the secondary alignment, For the i The Y-direction offset of the secondary alignment; Standard deviation of historical offsets in the X direction: ; Standard deviation of historical offset in the Y direction: ; Step S6: predicting the compensation value of the offset; Predicted compensation value of X-direction offset: ; Predicted compensation value of Y-direction offset: ; in, and To adjust the coefficient, adjustments are made based on machine learning; Step S7: Calculate the final offset; Final offset in X direction: ; Final offset in the Y direction: ; Step S8: Obtain the optimized final coordinates; Final coordinate in the X direction: ; Final coordinate in Y direction: Optimize the final coordinates: ).

10. The high-precision alignment method according to claim 9, It is characterized in that About the adjustment factor and The optimization method comprises the following steps: Step A1: After implementing the prediction method, the alignment is performed only once in combination with the compensation value, and then the target coordinates are obtained after vacuuming. The coordinates of the aligned target are , the coordinates of the characteristic target are ; Step A2: Calculate the offset; The offset of the feature target relative to the alignment target in the X direction: ; The offset of the feature target relative to the alignment target in the Y direction: ; Step A3: Condition judgment, setting threshold ; Perform conditional judgment to confirm the validity of the new offset: if ; If the condition is met, the offset compensation value is valid and the current and ; If the condition is not met, the optimization adjustment coefficient is used; Step A4: Optimize adjustment coefficients and ; Step A41: Establishing a data model; Configure the learning rate: ; Configure the momentum factor: Configure the upper and lower limits of the adjustment factor: and ; Step A42: Initialize momentum variable; ； Step A43: Calculate the offset change; Calculate the absolute difference between the old and new offsets: ； ； Step A44: Calculate the relative rate of change; ;in, Used to avoid division by zero; Step A44: Update momentum, , ; in, and is to convert the previous momentum or Momentum Factor Attenuation is performed; Step A45: Update the adjustment coefficient, , ; Step A46: Limit the adjustment coefficient range, , ; If the update result exceeds the maximum value , it is set to the maximum value; if it is lower than the minimum value , it is set to the minimum value.

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