Chip packaging device and method with pressure plate structure

Abstract

The present invention relates to a chip packaging device and method with a pressure plate structure, and relates to the field related to chip packaging. The chip packaging device with a pressure plate structure comprises a base plate and a shell detachably mounted on the base plate, a column is fixed to the side end of the base plate, the column is located on the inner side of the shell, a support plate, the support plate is slidably mounted on the side of the column toward the center of the base plate, a base, a main shaft is fixed to the top of the base, the base is rotatably connected to the end of the support plate away from the column through the main shaft, and transmission arms are installed on both sides of the base through sliding components. The present invention is used for re-wire bonding when a production line needs to be modified due to damage to the tin bar, and the device of the present invention has a compact structure and occupies a small space, and can be directly used on a desktop. The problem of tin bar bulging during wire bonding is solved by pressing the pressure plate, and the invention has a relatively high degree of automation.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging, and in particular to a chip packaging device and method with a pressure plate structure. Background Art

[0002] Chip packaging includes processes such as wire bonding, wafer cutting, and photolithography. Wire bonding is a process that uses thin metal wires and utilizes heat, pressure, and ultrasonic energy to tightly weld the metal wires to the substrate pads to achieve electrical interconnection between the chip and the substrate and information exchange between chips.

[0003] During the wire bonding process, the tin bar connecting the base and the chip is usually in a raised state, which makes it very easy for the tin bar to be damaged in the subsequent process. The damage of the tin bar directly affects the normal operation of the chip. Therefore, after completing the whole set of processes, a test will be performed before the final capping step to ensure the normal operation of the chip. Usually, when this step is reached, the cutting step has been completed, that is, it is a separate chip, but the capping has not been performed. In this process, the defect caused by the damage of the chip tin bar at the detection point needs to be wire bonded separately, which is also called repair on the production line.

[0004] During repair, since there is no wire bonding equipment for repair, engineers usually repair it manually based on experience. First, the damaged tin bar needs to be removed, then observed under a microscope, and finally the wires are soldered with an electric soldering iron. The efficiency is extremely low. Among them, the most tedious step is the wire soldering step. Because the chip is small in size and difficult to observe and operate, the operator needs to have sufficient experience, has high limitations, and is also dangerous when using an electric soldering iron.

[0005] A wire bonding device and packaging equipment were disclosed through searching, with announcement number: CN220604614U. The equipment was not designed for repair, and the above-mentioned problem of tin bar bulge was not solved. Summary of the invention

[0006] The object of the present invention is to provide a chip packaging device and method with a pressure plate structure to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solutions:

[0008] A chip packaging device with a pressure plate structure, comprising:

[0009] A bottom plate and a shell detachably mounted on the bottom plate, wherein a column is fixed to a side end of the bottom plate, and the column is located inside the shell;

[0010] A support plate, the support plate being slidably mounted on one side of the column toward the center of the bottom plate;

[0011] A base, a main shaft is fixed on the top of the base, the base is rotatably connected to the end of the support plate away from the column through the main shaft, transmission arms are installed on both sides of the base through sliding components, and solder components are installed on the two transmission arms;

[0012] The support plate is equipped with a driving assembly for driving the base to intermittently rotate at equal angles, and the base is equipped with a pressing assembly for driving the transmission arm to descend at two points;

[0013] A limiting member is fixed on the bottom plate, and a center of the limiting member is coaxially arranged with the main shaft.

[0014] As a further solution of the present invention: the sliding assembly includes a special-shaped slide groove opened on both sides of the base, two No. 1 grooves are vertically opened on the special-shaped slide groove, and a No. 2 groove connected to the No. 1 groove is horizontally opened on the top of the No. 1 groove;

[0015] A guide rod is slidably installed in the No. 1 groove and the No. 2 groove, a No. 1 top plate is coaxially fixed to the top of the guide rod in the No. 1 groove, a No. 2 top plate is coaxially fixed to the end of the guide rod in the No. 2 groove, and a spring is sleeved on the guide rod;

[0016] A linkage block is also slidably installed in the special-shaped slide groove, and the linkage block is fixed to the transmission arm;

[0017] Electromagnets are symmetrically fixed in the second slot.

[0018] As a further solution of the present invention: the pressing assembly comprises a force-bearing plate fixed to opposite sides of the two transmission arms, and a convex block integrally formed therewith is provided on the same side of the two force-bearing plates;

[0019] Cams are arranged on both sides of the base, and the two cams are coaxially fixed through a rotating shaft. A first gear and a second gear that mesh with each other are also arranged on both sides of the base. The first gear is coaxially fixed with the rotating shaft of the cam, and the second gear is rotatably installed on both sides of the base. Pushing plates are coaxially fixed on the opposite sides of the two second gears, and the rotating shaft of the cam is connected to a driving member installed on the base;

[0020] Linking plates are provided on both sides of the base, and a No. 2 slider is fixed on the opposite side of the two linking plates, and the No. 2 slider is slidably matched with the No. 2 slide grooves opened on both sides of the base, and a No. 1 slider is fixed on one end of the two linking plates facing the transmission arm, and the No. 1 slider is slidably matched with the No. 3 slide groove opened on the transmission arm;

[0021] Wherein, a force-bearing block integrally formed therewith is provided on the opposite side of the two linkage plates, and the force-bearing block cooperates with the pushing plate;

[0022] One end of the cam protrusion and the end of the pushing plate are both rotatably mounted with rollers.

[0023] As a further solution of the present invention: the driving member comprises a mounting groove provided on the base, a No. 4 gear is rotatably mounted in the mounting groove, and the No. 4 gear is meshed with a No. 3 gear coaxially fixed on the cam shaft;

[0024] A No. 2 motor is fixed on the base, and an output shaft of the No. 2 motor is connected to a rotating shaft of a No. 4 gear through a No. 2 transmission chain.

[0025] As a further solution of the present invention: the solder assembly includes a material roller rotatably mounted on the base, and a guide roller cooperating with the material roller is rotatably mounted on one side of the transmission arm;

[0026] A triggering member is fixed between the two transmission arms, and the triggering member is electrically connected to a heating member fixed to the end of the transmission arm;

[0027] Wherein, a feeding trough is provided on the transmission arm.

[0028] As a further solution of the present invention: a pressure plate is fixed to the side of the transmission arm away from the column, and grooves cooperating with the pressure plate are formed on four sides of the limiting member.

[0029] As a further solution of the present invention: the driving assembly comprises a driven plate coaxially fixed on the second gear, and a driving plate cooperating therewith is rotatably mounted on one side of the driven plate;

[0030] A first motor is fixed at the bottom of the support plate, and an output shaft of the first motor is connected to the rotating shaft of the active disk through a No. 1 transmission chain.

[0031] A chip packaging method with a pressure plate structure, wherein the chip packaging method with a pressure plate structure adopts the chip packaging device with a pressure plate structure according to any one of claims 1 to 4, and is characterized in that it comprises the following steps:

[0032] S1. Place the sheet in the limiting part;

[0033] S2, realizing the motion state required for welding through the cooperation of the pressing component and the sliding component;

[0034] S3. Tin is provided during welding through the soldering assembly and heating. After welding is completed on one side of the material plate, the driving assembly drives the base to rotate and welds the other three sides. After welding is completed, the material plate is taken out to complete the wire bonding work of the material plate.

[0035] Compared with the prior art, the invention has the following beneficial effects: the invention is used for re-wire bonding when the production line needs to be modified due to the damage of the solder bar, and the device of the invention has a compact structure and occupies a small space, and can be directly used on the desktop;

[0036] Secondly, the present invention solves the problem of tin bar bulging during wire bonding by pressing the pressure plate, and the invention has a relatively high degree of automation. Automatic operation can be completed by simply placing the material in the groove, thereby solving the problem of insufficient operator experience and at the same time solving the problem of engineers being scalded due to improper operation due to insufficient experience. The invention is relatively practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the overall structure of a chip packaging device with a pressure plate structure.

[0038] Figure 2 for Figure 1 Schematic diagram of the structure inside the middle shell.

[0039] Figure 3 for Figure 2 Schematic diagram of the structure of the middle part.

[0040] Figure 4 It is a structural schematic diagram of a sliding component in a chip packaging device with a pressure plate structure.

[0041] Figure 5 for Figure 4 A partial enlarged view of point A in the middle.

[0042] Figure 6 It is a schematic diagram of the structure of the connecting plate in the chip packaging device with a pressing plate structure.

[0043] Figure 7 This is a schematic diagram of the structure of the feed trough on the transmission arm.

[0044] Figure 8 It is a schematic diagram of the structure of a driving component in a chip packaging device with a pressure plate structure.

[0045] Fig. 9 It is a structural schematic diagram of a driving component in a chip packaging device with a pressure plate structure.

[0046] Fig.10 for Fig. 9 Structural breakdown diagram.

[0047] Fig.11 It is a schematic diagram of the structure of a pressure plate and a groove in a chip packaging device with a pressure plate structure.

[0048] In the figure: 1, bottom plate; 2, shell; 3, column; 4, support plate; 5, No. 1 slide; 6, first motor; 7, No. 1 transmission chain; 8, active disk; 9, driven disk; 10, groove; 11, transmission arm; 12, trigger; 13, pressure plate; 14, limiter; 15, base; 16, force plate; 17, bump; 18, cam; 19, No. 1 gear; 20, No. 2 motor; 21, main shaft; 22, No. 2 gear; 23, push Plate; 24, interlocking plate; 25, material roller; 26, tin bar; 27, guide roller; 28, No. 2 slide; 29, special-shaped slide; 30, spring; 31, guide rod; 32, No. 1 top plate; 33, No. 2 top plate; 34, electromagnet; 35, No. 1 slider; 36, No. 3 slide; 37, No. 2 slider; 38, feed trough; 39, No. 3 gear; 40, No. 4 gear; 41, No. 2 transmission chain; 42, No. 3 slider; 43, interlocking block. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] In addition, when an element in the present invention is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

[0051] For example, see Figures 1 to 11 , a chip packaging device with a pressure plate structure, comprising:

[0052] A bottom plate 1 and a shell 2 detachably mounted on the bottom plate 1, a column 3 is fixed to a side end of the bottom plate 1, and the column 3 is located inside the shell 2;

[0053] A support plate 4, the support plate 4 is slidably mounted on the side of the column 3 facing the center of the bottom plate 1; a third slider 42 is fixed to the side of the support plate 4 facing the column 3, and the support plate 4 is slidably matched with the first slide groove 5 provided on the column 3 through the third slider 42;

[0054] A base 15, a main shaft 21 is fixed on the top of the base 15, the base 15 is rotatably connected to the end of the support plate 4 away from the column 3 through the main shaft 21, and transmission arms 11 are installed on both sides of the base 15 through sliding components, and solder components are installed on the two transmission arms 11;

[0055] The support plate 4 is provided with a driving assembly for driving the base 15 to intermittently rotate at equal angles, and the base 15 is provided with a pressing assembly for driving the transmission arm 11 to descend at two points;

[0056] The limiting member 14 is fixed on the bottom plate 1 , and the center of the limiting member 14 is coaxially arranged with the main shaft 21 .

[0057] In the embodiment of the present invention, it can be clearly observed from the attached images provided that the base plate and the chip located at the center of the base plate are installed in the stopper 14, and multiple groups of welding points are set at the edge of the chip. Among them, the chip and the welding points are welded to achieve the connection between the chip and the substrate welding points, so that the circuit between the two is connected. This process is called wire bonding in the field of chip packaging;

[0058] In the present invention, unprocessed chips and base boards are collectively referred to as material boards for ease of description.

[0059] In the actual working process, it is first necessary to open the housing 2 of the device and place the material sheet into the limiting member 14 through the feeding port. The main function of the limiting member 14 is to accurately position the material sheet so that its position will not change during the operation.

[0060] Then, through the coordinated action of the solder assembly and the pressing assembly, the base plate and the chip of the material plate are welded through the tin bar. After completing the welding work on one side, with the help of the driving assembly, the main shaft 21 and the base 15 can be rotated 90°, so as to realize the welding work of the material plate near the other side. Through the precise coordination between the solder assembly, the pressing assembly and the driving assembly, the wire bonding work of the material plate can be completed efficiently and accurately, and any potential safety risks are effectively avoided in this process.

[0061] The sliding assembly includes a special-shaped slide groove 29 opened on both sides of the base 15, and two No. 1 grooves are vertically opened on the special-shaped slide groove 29, and a No. 2 groove connected to the No. 1 groove is horizontally opened on the top of the No. 1 groove;

[0062] A guide rod 31 is slidably installed in the first groove and the second groove. A first top plate 32 is coaxially fixed to the top of the guide rod 31 in the first groove, and a second top plate 33 is coaxially fixed to the end of the guide rod 31 in the second groove. A spring 30 is sleeved on the guide rod 31.

[0063] A linkage block 43 is also slidably mounted in the special-shaped slide groove 29, and the linkage block 43 is fixed to the transmission arm 11;

[0064] An electromagnet 34 is symmetrically fixed in the second slot.

[0065] In the embodiment of the present invention, please refer to Figure 5 , for the convenience of naming the left slot No. 1 slot No. 1 and the other slot No. 2, in the initial state, the linkage block 43 is located at the junction of slot No. 1 and slot No. 2;

[0066] When the pressing assembly is working, the linkage block 43 has two motion states:

[0067] State 1: The downward force is applied to the transmission arm 11 by the pressing assembly to drive the linkage block 43 to descend vertically, so that it descends vertically along its path under the guidance of the slot 1, and at the same time drives the guide rod 31 and the No. 1 top plate 32 in the slot 1 to descend, thereby compressing the spring 30, so that the spring 30 reserves elastic potential energy;

[0068] When the force driving the transmission arm 11 to descend disappears, the elastic potential energy stored in the release spring 30 drives the transmission arm 11, the guide rod 31, the first top plate 32, and the linkage block 43 to rise upright until they return to the initial position;

[0069] State 2: When the pressing assembly is working, the transmission arm 11 and the linkage block 43 are driven to move along the No. 2 groove. When the linkage block 43 moves, the No. 2 top plate 33 and the guide rod 31 in the No. 2 groove are driven to move. When the No. 2 top plate 33 and the linkage block 43 move to the end of the stroke, the No. 2 top plate 33 is adsorbed by the working electromagnet 34, so that the linkage block 43 is located above the groove 2. When the No. 2 top plate 33 moves, the spring 30 in the No. 2 groove is also compressed to store a certain amount of elastic potential energy.

[0070] Then, a downward force is applied to the transmission arm 11 and the linkage block 43 through the pressing assembly, so as to drive the No. 1 top plate 32 and the guide rod 31 in the second slot to descend through the linkage block 43, and at the same time, the spring 30 in the second slot is compressed to store its elastic potential energy. When the downward force applied to the transmission arm 11 and the linkage block 43 disappears, the No. 1 top plate 32, the guide rod 31 and the linkage block 43 in the second slot are driven to rise to the highest point by releasing the elastic potential energy of the spring 30 in the second slot, and then the electromagnet 34 is turned off to lose the adsorption of the No. 2 top plate 33, so as to drive the No. 2 top plate 33 and the linkage block 43 to move horizontally to the initial position by releasing the elastic potential energy of the spring 30 in the second slot;

[0071] By combining the above-mentioned state 1 and state 2, the linkage block 43 is reset after being vertically lowered, then moves horizontally to the end of the stroke and then lowers again, and finally resets to the initial state. The movement state of the linkage block 43 is the movement state of the transmission arm 11.

[0072] It should be noted that a control module for controlling the electromagnet 34 to be turned off / on is installed on the base 15, and the control module is connected to the control system of the present invention. Since the control system is not within the scope of protection of the present invention, it will not be elaborated on here.

[0073] It should also be noted that in order to illustrate the described content more clearly, in the figure, the linkage block 43 appears to be detached during the movement. The main reason is to clearly illustrate the structure. There are many ways to ensure that the linkage block 43 will not detach during the sliding process, such as setting a limit strip on the outside of the special-shaped slide groove 29.

[0074] In the second embodiment, the pressing assembly comprises a force-bearing plate 16 fixed to opposite sides of the two transmission arms 11, and a convex block 17 integrally formed therewith is disposed on the same side of the two force-bearing plates 16;

[0075] Cams 18 are provided on both sides of the base 15, and the two cams 18 are coaxially fixed through a rotating shaft. A first gear 19 and a second gear 22 that mesh with each other are also provided on both sides of the base 15. The first gear 19 is coaxially fixed with the rotating shaft of the cam 18, and the second gear 22 is rotatably installed on both sides of the base 15. A push plate 23 is coaxially fixed on the opposite sides of the two second gears 22, and the rotating shaft of the cam 18 is connected to a driving member installed on the base 15;

[0076] The base 15 is provided with linkage plates 24 on both sides, and a second slider 37 is fixed on the opposite side of the two linkage plates 24, and the second slider 37 is slidably matched with the second slide groove 28 opened on both sides of the base 15. The two linkage plates 24 are fixed with a first slider 35 at one end facing the transmission arm 11, and the first slider 35 is slidably matched with the third slide groove 36 opened on the transmission arm 11;

[0077] Wherein, a force bearing block integrally formed therewith is disposed on the opposite side of the two linkage plates 24, and the force bearing block cooperates with the pushing plate 23;

[0078] Rollers are rotatably mounted on one protruding end of the cam 18 and the end of the pushing plate 23 .

[0079] In the embodiment of the present invention, please refer to Figure 3 and Figure 6 , when the driving member is working, the rotating shaft of the cam 18 is driven to rotate, so that the cam 18 and the first gear 19 are synchronously driven to rotate through the rotation of the cam 18;

[0080] The cam 18 of the present invention has two motion states when rotating in two directions, and its motion cooperates with the sliding assembly of the present invention, and its motion states are as follows:

[0081] State 1: When the cam 18 rotates counterclockwise, it abuts against the force-bearing plate 16 and pushes the force-bearing plate 16 to stand down by the rotation force of the cam 18, and when the force-bearing plate 16 stands down, the transmission arm 11 is driven to stand down with it;

[0082] When the transmission arm 11 moves vertically and downwardly, the linkage plate 24 is not driven to follow the movement, because the linkage plate 24 is horizontally slidably mounted on the base 15, and the linkage plate 24 and the transmission arm 11 are in a vertical sliding state. Therefore, when the transmission arm 11 moves vertically and downwardly, the linkage plate 24 is in a prohibited state;

[0083] State 2: When the cam 18 rotates clockwise, the meshing with the second gear 22 drives the second gear 22 to rotate relatively therewith, and when the second gear 22 rotates, the push plate 23 is driven to rotate, and the rotation of the push plate 23 drives the linkage plate 24 to move in a direction away from the transmission arm 11, that is, horizontal movement. At the same time, the movement of the linkage plate 24 drives the transmission arm 11 to follow the linkage plate 24. After the transmission arm 11 moves horizontally to the end of the stroke, the cam 18 rotates to abut against the protrusion 17, and then the subsequent rotation force of the cam 18 drives the protrusion 17, the force plate 16, and the transmission arm 11 to be vertically lowered;

[0084] The above-mentioned state 1 and state 2 realize the required motion state of the linkage block 43 in the sliding assembly, which is also the motion state of the transmission arm 11;

[0085] It should be noted that the protrusion 17 in this embodiment is not located at one end or the other end of the force-bearing plate 16 based on the positions of the substrate and the chip. Since the height of the chip is higher than the substrate, the contact stroke of the transmission arm 11 with the substrate when it descends will be longer. The present invention solves the problem of the slightly longer contact stroke of the transmission arm 11 with the substrate when it descends by arranging the protrusion 17 on the force-bearing plate 16 so that the downward pressure of the cam 18 remains unchanged.

[0086] It should also be noted that the rollers on the cam 18 and the push plate 23 of the present invention are used to reduce the friction during contact and fit, so as to increase the service life.

[0087] The driving member includes a mounting groove formed on the base 15, in which a fourth gear 40 is rotatably mounted, and the fourth gear 40 is meshed with a third gear 39 coaxially fixed on the rotating shaft of the cam 18;

[0088] A second motor 20 is fixed on the base 15 , and an output shaft of the second motor 20 is connected to a rotating shaft of a fourth gear 40 via a second transmission chain 41 .

[0089] In the embodiment of the present invention, when the No. 2 motor 20 is working, the output shaft drives the No. 4 gear 40 to rotate through the No. 2 transmission chain 41, so as to drive the rotating shaft of the cam 18 to rotate through the engagement of the No. 4 gear 40 with the No. 3 gear 39, and at the same time increase the torque during rotation through the engagement of the No. 4 gear 40 with the No. 2 transmission chain 41.

[0090] The solder assembly includes a material roller 25 rotatably mounted on the base 15, and a guide roller 27 cooperating with the material roller 25 is rotatably mounted on one side of the transmission arm 11;

[0091] A trigger member 12 is fixed between the two transmission arms 11, and the trigger member 12 is electrically connected to a heating member fixed to the end of the transmission arm 11;

[0092] Wherein, a feeding trough 38 is provided on the transmission arm 11 .

[0093] In the embodiment of the present invention, a tin bar 26 is wound around the material roller 25, the tin bar 26 is inserted into the material feeding trough 38, and the end of the tin bar 26 is exposed outside the material feeding trough 38, and two guide rollers 27 are used to guide the tin bar 26 to ensure smooth transportation of the tin bar 26;

[0094] When the transmission arm 11 descends to the welding point, the end of the tin bar 26 abuts against the substrate / chip, and the trigger 12 drives the heating element to work for heating, and the end of the tin bar 26 is melted by heating. After the tin bar 26 melts, the heating component stops working, so that the end of the tin bar 26 is welded and fixed to the welding point. When the transmission arm 11 moves subsequently, it will drive the material roller 25 to perform wire laying processing. After the transmission arm 11 moves to another welding point, it descends and heats the tin bar 26 again through the heating element to melt it again, so that the melting point is welded and fixed to the subsequent welding point. When the normal contact point of the tin bar 26 has not completed cooling, the transmission arm 11 rises to cut off the tin bar 26, so that the base is connected to the chip through the tin bar 26;

[0095] When the transmission arm 11 moves, the material roller 25 releases the wire. Since the end of the tin bar 26 is fixed by welding, there is a pulling force when the transmission arm 11 moves, thereby making the material roller 25 square.

[0096] A pressing plate 13 is fixed to the side of the transmission arm 11 away from the column 3 , and grooves 10 cooperating with the pressing plate 13 are formed on four sides of the limiting member 14 .

[0097] In the embodiment of the present invention, when welding, as shown in FIG. @, the substrate is welded first, and the lowering of the transmission arm 11 drives the pressing plate 13 to lower, and the stopper 14 is used to accommodate the pressing plate 13 to prevent the pressing plate 13 from interfering with the groove 10 during the lowering process;

[0098] After completing the basic welding, the tin bar 26 is pulled toward the chip. When performing the secondary welding, the lowering of the transmission arm 11 drives the pressing plate 13 to lower and press the raised part of the tin bar 26.

[0099] Since the small section of solder bar 26 used for connecting the substrate and the chip is in an arc-shaped raised state after welding, it is very easy to be damaged and broken during the subsequent packaging process. The problem can be effectively solved by pressing the pressing plate 13 downward.

[0100] Embodiment 3, the driving assembly comprises a driven disc 9 coaxially fixed on the second gear 22, and a driving disc 8 cooperating therewith is rotatably mounted on one side of the driven disc 9;

[0101] A first motor 6 is fixed to the bottom of the support plate 4 , and an output shaft of the first motor 6 is connected to the rotating shaft of the active disk 8 through a first transmission chain 7 .

[0102] In the embodiment of the present invention, when the first motor 6 is working, the output shaft drives the driving disc 8 to rotate through the first transmission chain 7, and the driving disc 8 rotates one circle to drive the driven disc 9 to rotate 90°, and the driving disc 8 is locked when it does not drive the driven disc 9 to rotate, and when the driven disc 9 rotates, the base 15 is driven to rotate through the main shaft 21;

[0103] The driving plate 8 and the driven plate 9 in the present invention are used for the Maltese cross movement in the prior art. Since it is a relatively mature prior art, no further explanation will be given here.

[0104] It should be noted that the first transmission chain 7 and the second transmission chain 41 in the present invention use synchronous belts.

[0105] The column 3 of the present invention is also equipped with an electric push rod for driving the support plate 4 to rise / fall upright. The movable rod of the electric push rod is fixed to the support plate 4. The rise / fall of the support plate 4 is achieved through the operation of the electric push rod. The rise of the support plate 4 is used to drive the base 15 and the parts installed on the base 15 to rise as a whole, so as to facilitate the placement of the material plate into the limit member 14. The electric push rod is not shown in the figure. Of course, other equivalent structures can also be used instead, and the present invention is not specifically limited here.

[0106] The present invention also provides a chip packaging method with a pressure plate structure, wherein the chip packaging method with a pressure plate structure adopts the chip packaging device with a pressure plate structure, and comprises the following steps:

[0107] S1, placing the sheet in the limiting member 14;

[0108] S2, realizing the motion state required for welding through the cooperation of the pressing component and the sliding component;

[0109] S3. Tin is provided for welding through the soldering assembly and heating. After welding is completed on one side of the material plate, the driving assembly drives the base 15 to rotate and welds the other three sides. After welding is completed, the material plate is taken out to complete the wire bonding work of the material plate.

[0110] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0111] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chip packaging device with a pressure plate structure, characterized in that: include: A base plate (1) and a shell (2) detachably mounted on the base plate (1), a column (3) being fixed to a side end of the base plate (1), and the column (3) being located on the inner side of the shell (2); A support plate (4), the support plate (4) being slidably mounted on one side of the column (3) facing the center of the bottom plate (1); A base (15), a main shaft (21) being fixed on the top of the base (15), the base (15) being rotatably connected to an end of the support plate (4) away from the column (3) via the main shaft (21), transmission arms (11) being installed on both sides of the base (15) via sliding components, and solder components being installed on both transmission arms (11); The support plate (4) is provided with a driving assembly for driving the base (15) to intermittently rotate at equal angles, and the base (15) is provided with a pressing assembly for driving the transmission arm (11) to descend at two points; A limiting member (14), the limiting member (14) being fixed on the bottom plate (1), and the center of the limiting member (14) being coaxially arranged with the main shaft (21); The sliding assembly comprises a special-shaped slide groove (29) provided on both sides of the base (15), wherein two first grooves are vertically provided on the special-shaped slide groove (29), and a second groove communicating with the first groove is horizontally provided on the top of the first groove; A guide rod (31) is slidably mounted in both the No. 1 groove and the No. 2 groove, a No. 1 top plate (32) is coaxially fixed to the top of the guide rod (31) in the No. 1 groove, a No. 2 top plate (33) is coaxially fixed to the end of the guide rod (31) in the No. 2 groove, and a spring (30) is sleeved on the guide rod (31); A linkage block (43) is also slidably mounted in the special-shaped slide groove (29), and the linkage block (43) is fixed to the transmission arm (11); An electromagnet (34) is symmetrically fixed in the second slot; The pressing assembly comprises a force-bearing plate (16) fixed to opposite sides of the two transmission arms (11), and a convex block (17) integrally formed therewith is provided on the same side of the two force-bearing plates (16); Cams (18) are provided on both sides of the base (15), and the two cams (18) are coaxially fixed via a rotating shaft. A first gear (19) and a second gear (22) that mesh with each other are also provided on both sides of the base (15), and the first gear (19) is coaxially fixed with the rotating shaft of the cam (18). The second gear (22) is rotatably mounted on both sides of the base (15). A push plate (23) is coaxially fixed on opposite sides of the two second gears (22), and the rotating shaft of the cam (18) is connected to a driving member mounted on the base (15); Linking plates (24) are provided on both sides of the base (15), and a second slider (37) is fixed on the opposite side of the two linking plates (24), and the second slider (37) is slidably matched with the second slide groove (28) provided on both sides of the base (15). A first slider (35) is fixed on one end of the two linking plates (24) facing the transmission arm (11), and the first slider (35) is slidably matched with the third slide groove (36) provided on the transmission arm (11); Wherein, a force-bearing block integrally formed therewith is provided on the opposite side of the two linkage plates (24), and the force-bearing block cooperates with the pushing plate (23); Rollers are rotatably mounted on the protruding end of the cam (18) and the end of the pushing plate (23).

2. The chip packaging device with a pressure plate structure according to claim 1, characterized in that: The driving member comprises an assembly groove formed on the base (15), a fourth gear (40) being rotatably mounted in the assembly groove, the fourth gear (40) being meshed with a third gear (39) coaxially fixed on the rotating shaft of the cam (18); A No. 2 motor (20) is fixed on the base (15), and an output shaft of the No. 2 motor (20) is connected to a rotating shaft of a No. 4 gear (40) via a No. 2 transmission chain (41).

3. The chip packaging device with a pressure plate structure according to claim 2, characterized in that: The solder assembly comprises a material roller (25) rotatably mounted on the base (15), and a guide roller (27) cooperating with the material roller (25) is rotatably mounted on one side of the transmission arm (11); A trigger component (12) is fixed between the two transmission arms (11), and the trigger component (12) is electrically connected to a heating component fixed to the end of the transmission arm (11); Wherein, a material supply trough (38) is provided on the transmission arm (11).

4. The chip packaging device with a pressure plate structure according to claim 3, characterized in that: A pressure plate (13) is fixed to the side of the transmission arm (11) away from the column (3), and grooves (10) cooperating with the pressure plate (13) are formed on four sides of the limiting member (14).

5. The chip packaging device with a pressure plate structure according to claim 3, characterized in that: The driving assembly comprises a driven disc (9) coaxially fixed to the second gear (22), and a driving disc (8) cooperating therewith is rotatably mounted on one side of the driven disc (9); A first motor (6) is fixed to the bottom of the support plate (4), and an output shaft of the first motor (6) is connected to the rotating shaft of the active disk (8) via a first transmission chain (7).

6. A chip packaging method with a pressure plate structure, wherein the chip packaging method with a pressure plate structure adopts the chip packaging device with a pressure plate structure according to any one of claims 1 to 5, characterized in that: The following steps are involved: S1, placing the material plate in the limiting member (14); S2, realizing the motion state required for welding through the cooperation of the pressing component and the sliding component; S3. The soldering assembly and heating are used to provide tin during welding. After welding is completed on one side of the material plate, the driving assembly drives the base (15) to rotate, and welding is performed on the other three sides. After welding is completed, the material plate is taken out to complete the wire bonding work of the material plate.

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