Chip cooling device and electronic equipment

Abstract

The present application provides a chip heat dissipation device and an electronic device, and relates to the field of electronic device heat dissipation technology. The chip heat dissipation device provided by the present application includes: a circuit board, a first chip element and a second chip element are provided on the circuit board, and the heat generation of the first chip element is greater than the heat generation of the second chip element; a radiator, including: a heat dissipation shell and heat dissipation fins, the heat dissipation shell is fixedly connected to the circuit board, and the inner side of the heat dissipation shell defines a main heat dissipation cavity, a liquid return cavity and a liquid outlet cavity that are interconnected, and the main heat dissipation cavity, the liquid return cavity and the liquid outlet cavity are all provided with heat dissipation fins, and the liquid return cavity and the liquid outlet cavity are respectively connected to an external cooling device to form a circulation loop, and a phase-change heat-absorbing medium flows in the circulation loop; the first chip element and the second chip element are both in thermal contact with the heat dissipation shell, and the first chip element is arranged opposite to the main heat dissipation cavity. The chip heat dissipation device provided by the present application achieves efficient heat dissipation by phase-changing the phase-change heat-absorbing medium to exchange heat with the circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a chip heat dissipation device and electronic equipment. Background Art

[0002] As the core component of electronic devices, chips generate a lot of heat during operation. If the heat cannot be effectively dissipated, the chip temperature will be too high, which will not only affect the performance of electronic devices, but may also cause chip damage. Therefore, chip heat dissipation is very important.

[0003] In the prior art, air cooling or single-phase liquid cooling is usually used to dissipate heat from the chip. Air cooling relies on fans and heat sinks to dissipate heat from the chip through air convection. Single-phase liquid cooling relies on a cooling medium to dissipate heat from the chip through convection. However, both air cooling and single-phase liquid cooling have insufficient heat dissipation capacity for high heat dissipation scenarios such as AI accelerator cards. Summary of the invention

[0004] The present application provides a chip heat dissipation device and an electronic device to solve the problem of insufficient heat dissipation capacity of air cooling and single-phase liquid cooling for high heat dissipation scenarios such as AI accelerator cards.

[0005] In a first aspect, the present application provides a chip heat dissipation device, comprising: a circuit board, on which a first chip element and a second chip element are provided, the heat generation of the first chip element is greater than the heat generation of the second chip element; a radiator, comprising: a heat dissipation shell and heat dissipation fins, the heat dissipation shell is fixedly connected to the circuit board, the inner side of the heat dissipation shell defines a main heat dissipation chamber, a liquid return chamber and a liquid outlet chamber that are interconnected, the main heat dissipation chamber, the liquid return chamber and the liquid outlet chamber are all provided with heat dissipation fins, the liquid return chamber and the liquid outlet chamber are respectively connected to an external cooling device to form a circulation loop, and a phase change heat absorption medium flows in the circulation loop; the first chip element and the second chip element are both in thermal contact with the heat dissipation shell, and the first chip element is arranged opposite to the main heat dissipation chamber.

[0006] Among them, the heat dissipation shell includes: a main shell, one end of the main shell has an opening; a base plate assembly, the base plate assembly is sealed at the opening, and the circuit board is arranged on the side of the base plate assembly along the third direction facing away from the main shell; flow channel partition ribs, there are two flow channel partition ribs, one of which is arranged between the return liquid chamber and the main heat dissipation chamber, and the other is arranged between the liquid outlet chamber and the main heat dissipation chamber.

[0007] One end of the main shell along the second direction is also provided with a liquid outlet and a liquid return port, the liquid outlet is connected to the liquid outlet cavity, the liquid return port is connected to the liquid return cavity, and the height of the liquid return port in the third direction is lower than the height of the liquid outlet in the third direction.

[0008] The liquid return port includes: a first liquid return section and a second liquid return section, the first liquid return section extends along the second direction, the second liquid return section is located on the side of the first liquid return section facing the liquid return cavity, and the extension direction of the second liquid return section is inclined toward the bottom wall of the liquid return cavity compared to the second direction.

[0009] In the chip heat dissipation device provided in the embodiment of the present application, the heat generated by the first chip element and the second chip element is transferred to the phase-change heat-absorbing medium through the heat dissipation shell and the heat dissipation fins. Specifically, the phase-change heat-absorbing medium circulating in the circulation loop absorbs the heat from the first chip element and the second chip element when flowing through the main heat dissipation cavity, undergoes a phase change, and enters the external cooling device through the liquid outlet cavity. After being cooled by the external cooling device, it enters the heat dissipation shell again through the liquid return cavity, and in this cycle, efficient heat dissipation of the first chip element and the second chip element is achieved.

[0010] The circuit board transfers the generated heat to the bottom plate assembly, which conducts heat to the phase change heat absorbing medium through the bottom plate assembly for efficient heat dissipation. At the same time, the return liquid chamber, the main heat dissipation chamber and the liquid outlet chamber are isolated by flow channel partition ribs, realizing the partial separation of the hot and cold channels.

[0011] The phase-change heat absorbing medium enters the liquid return cavity through the liquid return port, flows through the main heat dissipation cavity, and is discharged through the liquid outlet cavity and the liquid outlet. The height difference design between the liquid return port and the liquid outlet helps to improve the continuity and directionality of the flow of the phase-change heat absorbing medium. Gravity and the natural flow characteristics of the fluid help to improve the flow continuity of the phase-change heat absorbing medium when it flows into the liquid return cavity.

[0012] Optionally, in the chip heat dissipation device as described above, the arrangement density of the heat dissipation fins in the liquid return cavity and the liquid outlet cavity is smaller than the arrangement density of the heat dissipation fins in the main heat dissipation cavity.

[0013] With this arrangement, the heat dissipation fins in the liquid return chamber and the liquid outlet chamber can effectively reduce the flow resistance of the phase change heat absorption medium in the liquid return chamber and the liquid outlet chamber, while the heat dissipation fins in the main heat dissipation chamber can effectively improve the heat exchange efficiency between the phase change heat absorption medium and the circuit board, and effectively promote the flow of the phase change heat absorption medium from the main heat dissipation chamber to the liquid outlet chamber.

[0014] Optionally, in the chip heat dissipation device as described above, the liquid return chamber, the main heat dissipation chamber and the liquid outlet chamber are arranged along the first direction, and the liquid return chamber, the main heat dissipation chamber and the liquid outlet chamber all extend along the second direction.

[0015] The liquid return chamber, the main heat dissipation chamber and the liquid outlet chamber are arranged along the first direction to provide a flow path for the phase change heat absorption medium, and the extension along the second direction provides a flow and accommodation space for the phase change heat absorption medium.

[0016] Optionally, in the chip heat dissipation device as described above, the return liquid chamber and the liquid outlet chamber are respectively located on both sides of the main heat dissipation chamber along the first direction, there are at least two second chip elements, and the at least two second chip elements are respectively located on both sides of the first chip element along the first direction, one of the second chip elements is arranged adjacent to the return liquid chamber, and the other second chip element is arranged adjacent to the liquid outlet chamber.

[0017] With this arrangement, the phase-change heat-absorbing medium can circulate along the liquid return cavity, the main heat dissipation cavity and the liquid outlet cavity in sequence. In addition, each second chip component is arranged adjacent to the liquid return cavity and the liquid outlet cavity, so that the heat dissipation fins in the liquid return cavity and the liquid outlet cavity assist in heat dissipation of the second chip component, effectively improving the heat dissipation effect.

[0018] Optionally, in the chip heat dissipation device as described above, both ends of the flow channel partition rib are welded to the main shell and the base plate assembly respectively; and / or, one end of the heat dissipation fin facing away from the base plate assembly is welded to the main shell.

[0019] The welding connection method can improve the connection stability between the flow channel partitions and the heat dissipation fins and the main shell and the base plate assembly, and prevent the phase change heat absorption medium from generating high temperature and high pressure to cause damage to the chip heat dissipation device.

[0020] Optionally, in the chip heat dissipation device as described above, the liquid return chamber includes a first balancing chamber, a heat exchange chamber and a second balancing chamber arranged in sequence along the liquid return direction in the liquid return chamber, and the heat dissipation fins in the liquid return chamber are all arranged in the heat exchange chamber.

[0021] The first balancing chamber separates impurities from the replenished phase-change heat-absorbing medium; the heat exchange chamber is the area where the phase-change heat-absorbing medium and the heat dissipation fins exchange heat; the second balancing chamber receives the phase-change heat-absorbing medium after heat exchange, providing buffering and regulation for the stable operation of the circulation loop.

[0022] Optionally, in the chip cooling device as described above, the cooling fins in the liquid return cavity are divided into a first fin group, a second fin group and a third fin group, and the first fin group, the second fin group and the third fin group are arranged sequentially in the heat exchange cavity along the reflux direction of the phase change heat absorption medium.

[0023] By arranging the first fin group, the second fin group and the third fin group in sequence, local overheating caused by uneven flow velocity of the phase-change heat-absorbing medium or concentrated heat load is avoided, so that the temperature distribution in the heat exchange cavity is more uniform.

[0024] Optionally, as described above, the chip heat dissipation device, the base plate assembly includes a first base plate and a second base plate, the first base plate covers the main shell, the portion of the first base plate corresponding to the main heat dissipation cavity is provided with an avoidance hole, the second base plate is fixedly arranged on the side of the first base plate facing away from the main shell, the heat dissipation fins in the main heat dissipation cavity pass through the avoidance hole and are connected to the second base plate; the first chip element is in thermal contact with the second base plate, and the second chip element is in thermal contact with the first base plate.

[0025] With this arrangement, the split design of the first base plate and the second base plate and the heat dissipation fins in the main heat dissipation cavity enables the first base plate and the second base plate to conduct heat to the second chip element and the first chip element in a targeted manner, thereby improving the heat dissipation effect of the first chip element and the second chip element.

[0026] Optionally, in the chip heat dissipation device as described above, a first heat conducting member is provided between the first chip element and the second base plate; and / or a second heat conducting member is provided between the second chip element and the first base plate.

[0027] The first heat conducting member and the second heat conducting member are provided to effectively improve the heat conduction efficiency between the first chip element and the second base plate, and between the second chip element and the first base plate, thereby improving the heat dissipation effect.

[0028] Optionally, in the chip cooling device as described above, the phase change heat absorption medium is a gas-liquid phase change medium.

[0029] With this arrangement, the phase-change heat-absorbing medium can more effectively absorb heat from the circuit board, thereby improving the heat dissipation effect.

[0030] In a second aspect, the present application provides an electronic device, comprising the above-mentioned chip heat dissipation device.

[0031] The chip heat dissipation device and electronic device provided by the present application rapidly absorb the heat transferred from the circuit board to the heat dissipation housing by flowing a phase-change heat-absorbing medium through the main heat dissipation cavity. After absorbing the heat, the phase-change heat-absorbing medium undergoes a phase change. Then, the phase-change heat-absorbing medium flows through the liquid outlet cavity in the form of a two-phase mixed state to an external cooling device for cooling treatment. After the cooling treatment, the phase-change heat-absorbing medium re-enters the main heat dissipation cavity through the liquid return cavity to absorb the heat generated by the circuit board. The phase-change heat-absorbing medium absorbs heat again and undergoes a phase change, and so on. Thus, the phase-change heat-absorbing medium circulates in the liquid return cavity, the main heat dissipation cavity, the liquid outlet cavity and the external cooling device, and undergoes a phase change in the main heat dissipation cavity to exchange heat with the circuit board, thereby achieving efficient heat dissipation of the circuit board. In addition, the circuit board transfers the generated heat to the bottom plate assembly, and the bottom plate assembly conducts heat to the phase-change heat-absorbing medium for efficient heat dissipation. At the same time, the liquid return cavity, the main heat dissipation cavity and the liquid outlet cavity are isolated by flow channel partition ribs, thereby achieving partial separation of the hot and cold channels. In addition, the phase-change heat-absorbing medium enters the liquid return cavity through the liquid return port, flows through the main heat dissipation cavity, and is discharged through the liquid outlet cavity and the liquid outlet. The height difference design between the liquid return port and the liquid outlet helps to improve the continuity and directionality of the flow of the phase-change heat-absorbing medium. Gravity and the natural flow characteristics of the fluid help to improve the flow continuity of the phase-change heat-absorbing medium when it flows into the liquid return cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0033] Figure 1 A schematic diagram of the structure of a chip heat dissipation device provided in an embodiment of the present application;

[0034] Figure 2 for Figure 1 A structural diagram from another perspective;

[0035] Figure 3 for Figure 1 Side view of

[0036] Figure 4 for Figure 1 Bottom view of

[0037] Figure 5 for Figure 4 Sectional view of the AA section;

[0038] Figure 6 for Figure 4 Sectional view of the middle BB section;

[0039] Figure 7 A schematic diagram of the flow of the phase-change heat-absorbing medium in the main heat dissipation cavity, the liquid return cavity and the liquid outlet cavity provided in an embodiment of the present application.

[0040] Description of reference numerals:

[0041] 10: Circuit board;

[0042] 11: first chip component; 12: second chip component; 13: reinforcement ring;

[0043] 20: Radiator;

[0044] 100: heat dissipation housing;

[0045] 110: main heat dissipation cavity;

[0046] 120: liquid return chamber; 121: first balance chamber; 122: heat exchange chamber; 123: second balance chamber;

[0047] 130: liquid outlet cavity;

[0048] 140: main housing; 141: open port; 142: liquid outlet; 143: liquid return port; 1431: first liquid return section; 1432: second liquid return section;

[0049] 150: bottom plate assembly; 151: first bottom plate; 1511: avoidance through hole; 152: second bottom plate; 1521: connection part;

[0050] 160: flow channel partition;

[0051] 200: cooling fins;

[0052] 210: first fin group;

[0053] 220: second fin group;

[0054] 230: third fin group;

[0055] 300: first heat conducting member;

[0056] 400: second heat conducting member.

[0057] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0058] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0059] As the core component of electronic devices, chips generate a lot of heat during operation. If the heat cannot be effectively dissipated, the chip temperature will be too high, which will not only affect the performance of electronic devices, but may also cause chip damage. Therefore, chip heat dissipation is very important.

[0060] In the prior art, air cooling or single-phase circulating liquid cooling is usually used to dissipate heat from the chip. Air cooling relies on fans and heat sinks to dissipate heat from the chip through air convection. Single-phase circulating liquid cooling relies on cooling media to transfer heat through convection, absorb the heat released by the chip and discharge it to dissipate heat from the chip.

[0061] However, due to the poor thermal conductivity of air, the efficiency of air cooling is low. Single-phase circulating liquid cooling only absorbs the heat released by the chip through the coolant, and the coolant always remains in liquid state, that is, the coolant does not undergo phase change and only absorbs the sensible heat generated by the chip. Therefore, both air cooling and liquid cooling have the problem of insufficient heat dissipation capacity for high heat dissipation scenarios such as AI accelerator cards, and single-phase liquid cooling also has the problem of requiring load drive and supporting infrastructure.

[0062] In view of the above technical problems, the embodiments of the present application provide a chip heat dissipation device and an electronic device, wherein a phase-change heat-absorbing medium flows through the main heat dissipation cavity to quickly absorb the heat transferred from the circuit board to the heat dissipation housing, and the phase-change heat-absorbing medium undergoes phase change after absorbing the heat. Then, the phase-change heat-absorbing medium flows through the liquid outlet cavity to the external cooling device in the form of a two-phase mixed state for cooling treatment. After the cooling treatment, the phase-change heat-absorbing medium re-enters the main heat dissipation cavity through the liquid return cavity to absorb the heat generated by the circuit board, and the phase-change heat-absorbing medium absorbs heat again and undergoes phase change, and the cycle continues. Thus, the phase-change heat-absorbing medium circulates in the liquid return cavity, the main heat dissipation cavity, the liquid outlet cavity, and the external cooling device, and undergoes phase change in the main heat dissipation cavity to exchange heat with the circuit board, thereby achieving efficient heat dissipation of the circuit board.

[0063] In addition, the circuit board transfers the generated heat to the bottom plate assembly, which conducts heat to the phase change heat absorbing medium through the bottom plate assembly for efficient heat dissipation. At the same time, the return liquid chamber, the main heat dissipation chamber and the liquid outlet chamber are isolated by flow channel partition ribs, realizing partial separation of the hot and cold channels.

[0064] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0065] See also Figures 1 to 7 The present application provides a chip heat dissipation device, comprising: a circuit board 10, on which a first chip element 11 and a second chip element 12 are arranged, and the heat generation of the first chip element 11 is greater than the heat generation of the second chip element 12; a heat sink 20, comprising: a heat dissipation shell 100 and heat dissipation fins 200, the heat dissipation shell 100 is fixedly connected to the circuit board 10, and the inner side of the heat dissipation shell 100 defines a main heat dissipation chamber 110, a liquid return chamber 120 and a liquid outlet chamber 130 that are interconnected, and the main heat dissipation chamber 110, the liquid return chamber 120 and the liquid outlet chamber 130 are all provided with heat dissipation fins 200, and the liquid return chamber 120 and the liquid outlet chamber 130 are respectively connected to an external cooling device to form a circulation loop, and a phase change heat absorption medium flows in the circulation loop; the first chip element 11 and the second chip element 12 are both in thermal contact with the heat dissipation shell 100, and the first chip element 11 is arranged opposite to the main heat dissipation chamber 110.

[0066] In some embodiments, the circuit board 10 stably carries the first chip component 11 and the second chip component 12. The circuit board 10 not only ensures the transmission of electrical signals between the chip components, but also optimizes the heat conduction path through a reasonable layout. That is, for the first chip component 11 with a large heat generation, the first chip component 11 is arranged relative to the main heat dissipation cavity 110, so that the first chip component 11 can more effectively exchange heat with the heat sink 20, thereby reducing the risk of damage to the circuit board 10 due to overheating.

[0067] It should be noted that the heat dissipation housing 100 is not only firmly connected to the circuit board 10 to form a tight heat exchange interface, but also the inside of the heat dissipation housing 100 is divided into a main heat dissipation chamber 110, a liquid return chamber 120 and a liquid outlet chamber 130. The main heat dissipation chamber 110, the liquid return chamber 120 and the liquid outlet chamber 130 are interconnected to form an efficient circulation system. The main heat dissipation chamber 110 directly faces the first chip component 11, ensuring that the heat emitted by the first chip component 11 can be quickly captured and transferred to the phase-change heat absorption medium (not shown in the figure), and the second chip component 12 also transfers heat to the phase-change heat absorption medium in the heat dissipation housing 100 through heat conduction contact with the heat dissipation housing 100. Therefore, the circuit board 10 exchanges heat with the phase-change heat absorption medium through contact with the heat dissipation housing 100 to achieve heat dissipation of the circuit board 10.

[0068] Furthermore, the provision of the heat dissipation fins 200 enhances the heat dissipation effect. Each heat dissipation fin 200 covers the main heat dissipation cavity 110, the liquid return cavity 120 and the liquid outlet cavity 130. When the first chip component 11 and the second chip component 12 transfer heat to the heat dissipation housing 100, each heat dissipation fin 200 in the heat dissipation housing 100 absorbs heat from the first chip component 11 and the second chip component 12, thereby improving the heat dissipation effect on the circuit board 10.

[0069] Among them, the connection design between the liquid return chamber 120 and the liquid outlet chamber 130 and the external cooling device (not shown in the figure) enables the heat dissipation housing 100 and the external cooling device to form a closed-loop circulation circuit. Such a design enables the phase-change heat-absorbing medium to continuously circulate in the circulation circuit, continuously absorbing and taking away the heat generated by the first chip component 11 and the second chip component 12. At the same time, by providing an external cooling device, it is ensured that the phase-change heat-absorbing medium can be effectively cooled during the circulation process, thereby maintaining the long-term stable operation state of the radiator 20.

[0070] It should be noted that the purpose of the external cooling device, such as a water-cooling row, a water-cooling plate, a refrigeration unit, etc., is to achieve cooling treatment of the phase-change heat-absorbing medium, and this embodiment does not limit this.

[0071] For specific implementation, see Figure 7In the circulation loop of the radiator 20, the phase-change heat-absorbing medium has the characteristic of undergoing phase change at a specific temperature (such as changing from liquid to gas), so that it can absorb and store a large amount of heat. During the circulation process, when the phase-change heat-absorbing medium flows through the main heat dissipation cavity 110, it will quickly absorb the heat transferred from the circuit board 10 to the heat dissipation housing 100, and the phase-change heat-absorbing medium undergoes phase change after absorbing the heat. Subsequently, the phase-change heat-absorbing medium flows through the liquid outlet cavity 130 in the form of a two-phase mixed state to the external cooling device for cooling treatment. After the cooling treatment, the phase-change heat-absorbing medium re-enters the main heat dissipation cavity 110 through the liquid return cavity 120 to absorb the heat generated by the circuit board 10, and the phase-change heat-absorbing medium absorbs heat again and undergoes phase change, and the cycle continues. With such a design, compared with the air cooling or single-phase liquid cooling heat dissipation methods in the prior art, the phase change heat absorption medium will absorb a large amount of latent heat during the phase change process, with higher heat exchange efficiency and stronger uniformity of heat exchange surface temperature. The phase change heat absorption medium undergoes phase change in the main heat dissipation cavity 110 to exchange heat with the circuit board 10, with high heat exchange efficiency, thereby improving the heat dissipation effect. Therefore, it can meet the application requirements of high heat dissipation scenarios such as AI accelerator cards.

[0072] See also Figure 4 and Figure 5 In the embodiment of the present application, the arrangement density of the heat sink fins 200 in the liquid return cavity 120 and the liquid outlet cavity 130 is smaller than the arrangement density of the heat sink fins in the main heat sink cavity 110 .

[0073] It should be noted that the heat sink fins 200 in the liquid return chamber 120 are designed with a relatively low arrangement density, which effectively reduces the fluid resistance in the liquid return chamber 120. When the phase-change heat absorbing medium enters the liquid return chamber 120 after being cooled by the external cooling device, the relatively low density of the heat sink fins 200 can ensure the smooth flow of the phase-change heat absorbing medium, thereby improving the circulation efficiency of the circulation loop. At the same time, it also avoids the fluid disturbance and noise problems caused by the excessive flow rate of the phase-change heat absorbing medium during the liquid return process, thereby ensuring the stable operation of the circulation loop.

[0074] Furthermore, the liquid outlet cavity 130 also adopts a relatively sparse arrangement of the heat dissipation fins 200. By reducing the density of the heat dissipation fins 200, the residence time of the two-phase mixed phase change heat absorption medium in the liquid outlet cavity 130 can be reduced, and the two-phase mixed phase change heat absorption medium is promoted to move heat out of the radiator 20 more quickly, thereby achieving efficient heat dissipation of the circuit board 10.

[0075] In contrast, the heat sink fins 200 in the main heat sink cavity 110 are arranged at a higher density. The main heat sink cavity 110 is the core area for heat exchange, and the dense layout of the heat sink fins 200 can increase the heat dissipation area and improve the heat exchange efficiency. When the phase-change heat-absorbing medium flows through the main heat sink cavity 110, the phase-change heat-absorbing medium absorbs heat from the circuit board 10 and undergoes a phase change. The heat sink fins 200 can guide the phase-change heat-absorbing medium to be more evenly distributed in the main heat sink cavity 110, and enhance the disturbance of the phase-change heat-absorbing medium between the heat sink fins 200, thereby promoting the heat absorption and heat transfer of the phase-change heat-absorbing medium, so that the two-phase mixed phase-change heat-absorbing medium can flow more quickly to the liquid outlet cavity 130.

[0076] See also Figure 5 In the embodiment of the present application, the liquid return chamber 120, the main heat dissipation chamber 110 and the liquid outlet chamber 130 are arranged along the first direction, and the liquid return chamber 120, the main heat dissipation chamber 110 and the liquid outlet chamber 130 all extend along the second direction.

[0077] It can be understood that the liquid return chamber 120, the main heat dissipation chamber 110 and the liquid outlet chamber 130 are arranged along the first direction, which not only ensures the smooth flow of the phase change heat absorption medium in the liquid return chamber 120, the main heat dissipation chamber 110 and the liquid outlet chamber 130, but also enables the entire heat dissipation process to proceed smoothly along a predetermined path.

[0078] Among them, see Figure 1 , the first direction corresponds to Figure 1 The second direction corresponds to the X-axis direction Figure 1 The Y-axis direction in the third direction corresponds to Figure 1 The Z-axis direction.

[0079] Furthermore, the liquid return chamber 120, the main heat dissipation chamber 110, and the liquid outlet chamber 130 are all extended along the second direction, thereby providing a space for accommodating the phase-change heat absorbing medium and also providing a space for placing the heat dissipation fins 200. In the main heat dissipation chamber 110, as the phase change process proceeds, the phase-change heat absorbing medium gradually absorbs heat and undergoes a phase change conversion, while the volume expands. Since the main heat dissipation chamber 110 extends along the second direction, the main heat dissipation chamber 110 has enough space for the phase-change heat absorbing medium to expand, thereby avoiding problems such as pressure increase or leakage of the phase-change heat absorbing medium due to insufficient space in the main heat dissipation chamber 110.

[0080] See also Figure 5 In the embodiment of the present application, the liquid return chamber 120 and the liquid outlet chamber 130 are respectively located on both sides of the main heat dissipation chamber 110 along the first direction, there are at least two second chip components 12, and at least two second chip components 12 are respectively located on both sides of the first chip component 11 along the first direction, one of the second chip components 12 is arranged adjacent to the liquid return chamber 120, and the other second chip component 12 is arranged adjacent to the liquid outlet chamber 130.

[0081] In a specific implementation, the liquid return chamber 120 and the liquid outlet chamber 130 are arranged on both sides of the main heat dissipation chamber 110 and extend along the first direction. Such a design ensures that the phase change heat absorption medium forms a closed-loop flow path in the circulation loop, and the phase change heat absorption medium after cooling is received from the liquid return chamber 120, and the phase change heat absorption medium exchanges heat through the main heat dissipation chamber 110, and finally flows out through the liquid outlet chamber 130, and the cycle continues.

[0082] It should be noted that at least two second chip components 12 are arranged on both sides of the first chip component 11 and are also arranged along the first direction. Specifically, one of the second chip components 12 is arranged adjacent to the liquid return cavity 120, and the heat generated by the second chip component 12 can be transferred to the heat dissipation fins 200 in the liquid return cavity 120 and the main heat dissipation cavity 110 through the heat dissipation housing 100 for heat dissipation. The other second chip component 12 is adjacent to the liquid outlet cavity 130, and the heat generated by the second chip component 12 can be transferred to the heat dissipation fins 200 in the liquid outlet cavity 130 and the main heat dissipation cavity 110 through the heat dissipation housing 100 for heat dissipation.

[0083] See also Figure 5 In the embodiment of the present application, the heat dissipation housing 100 includes: a main housing 140, one end of the main housing 140 has an opening 141; a bottom plate assembly 150, the bottom plate assembly 150 is sealed at the opening 141, and the circuit board 10 is arranged on the side of the bottom plate assembly 150 along the third direction facing away from the main housing 140; flow channel partition ribs 160, there are two flow channel partition ribs 160, one of the flow channel partition ribs 160 is arranged between the return liquid chamber 120 and the main heat dissipation chamber 110, and the other flow channel partition rib 160 is arranged between the liquid outlet chamber 130 and the main heat dissipation chamber 110.

[0084] In specific implementation, the bottom plate assembly 150 is tightly sealed to the opening 141, which enhances the sealing of the heat dissipation housing 100 and prevents the phase-change heat-absorbing medium from generating high temperature and high pressure under high power consumption, thereby causing problems such as failure, poor flatness, and even leakage and cracking of the chip heat dissipation device. At the same time, the circuit board 10 is cleverly placed on the side of the bottom plate assembly 150 facing away from the main housing 140. With such a design, the circuit board 10 can quickly conduct the heat generated by the circuit board 10 to the main heat dissipation cavity 110 through the good thermal conductivity of the bottom plate assembly 150, thereby achieving rapid transfer and dissipation of heat, ensuring the normal operating temperature of the circuit board 10, and improving the reliability of the radiator 20.

[0085] In some embodiments, the flow channel partition ribs 160 are respectively placed between the liquid return chamber 120, the liquid outlet chamber 130 and the main heat dissipation chamber 110, and the flow channel partition ribs 160 play the role of isolating the liquid return chamber 120, the liquid outlet chamber 130 and the main heat dissipation chamber 110, thereby realizing the separation of the cold and hot channels. At the same time, the flow channel partition ribs 160 do not completely isolate and seal the liquid return chamber 120, the liquid outlet chamber 130 and the main heat dissipation chamber 110, but while realizing the separation of the cold and hot channels, an entrance and exit (not shown in the figure) are retained between the liquid return chamber 120, the liquid outlet chamber 130 and the main heat dissipation chamber 110 to allow the liquid return chamber 120, the liquid outlet chamber 130 and the main heat dissipation chamber 110 to be connected to each other. As a result, the flow path of the phase change heat absorption medium is optimized, so that the phase change heat absorption medium can fully contact the heat source in the main heat dissipation chamber 110 to perform efficient heat exchange. Such a design improves the heat dissipation efficiency. At the same time, the solid structure of the flow channel partition ribs 160 also enhances the overall strength of the heat dissipation housing 100 and improves the durability of the radiator 20.

[0086] In addition, the flow channel partition ribs 160 can also be set to four, six, etc., and each flow channel partition rib 160 is evenly arranged along the second direction between the return liquid chamber 120 and the main heat dissipation chamber 110, and between the liquid outlet chamber 130 and the main heat dissipation chamber 110. The purpose is to partially isolate the return liquid chamber 120, the liquid outlet chamber 130 and the main heat dissipation chamber 110, and partially connect them to ensure the smooth flow of the phase change heat absorption medium in the heat dissipation shell 100, and this embodiment is not limited here.

[0087] See also Figure 5 In the embodiment of the present application, the two ends of the flow channel partition rib 160 are respectively welded to the main shell 140 and the base plate assembly 150; and / or, the end of the heat sink fin 200 away from the base plate assembly 150 is welded to the main shell 140.

[0088] It can be understood that the phase change heat absorption medium undergoes phase change in the main heat dissipation cavity 110 to generate a large saturated vapor pressure, and the flow channel partition rib 160 is connected to the main shell 140 and the bottom plate assembly 150 by welding, thereby ensuring a tight connection between the flow channel partition rib 160 and the main shell 140 and the bottom plate assembly 150, effectively preventing leakage of the phase change heat absorption medium due to looseness or deformation, and ensuring the reliability and stability of the radiator 20.

[0089] Similarly, the end of the heat sink fin 200 facing away from the base plate assembly 150 is welded to the main shell 140, which enhances the stability of the heat sink fin 200, prevents it from falling off or deforming due to vibration or external force, and ensures the operational reliability of the heat sink fin 200.

[0090] In addition, the heat sink fins 200 may be integrally formed with the base plate assembly 150, or may be fixedly connected to the base plate assembly 150 by welding, with the purpose of fixing the heat sink fins 200 and the base plate assembly 150, which is not limited in this embodiment.

[0091] See also Figure 1 and Figure 3 In the embodiment of the present application, a liquid outlet 142 and a liquid return port 143 are further provided at one end of the main shell 140 along the second direction, the liquid outlet 142 is connected to the liquid outlet cavity 130, the liquid return port 143 is connected to the liquid return cavity 120, and the height of the liquid return port 143 in the third direction is lower than the height of the liquid outlet 142 in the third direction.

[0092] It can be understood that the connection between the liquid outlet 142 and the liquid outlet cavity 130, and the connection between the liquid return port 143 and the liquid return cavity 120, ensures the smooth flow of the phase-change heat absorbing medium. This design enables the phase-change heat absorbing medium to form a clear circulation path in the radiator 20, that is, after absorbing heat from the main heat dissipation cavity 110, it flows out through the liquid outlet cavity 130, and after external cooling treatment, it enters the liquid return cavity 120 through the lower liquid return port 143 and re-participates in the circulation. Therefore, gravity assists the flow of the phase-change heat absorbing medium, which helps to improve the circulation efficiency.

[0093] Furthermore, after the phase-change heat absorbing medium absorbs heat and undergoes phase change in the main heat dissipation cavity 110, the temperature of the phase-change heat absorbing medium rises, the density decreases, and the phase-change heat absorbing medium tends to flow upward, and then is discharged from the heat dissipation housing 100 through the liquid outlet 142. The cooled low-temperature phase-change heat absorbing medium enters through the lower liquid return port 143 and re-participates in the circulation. The height difference design between the liquid outlet 142 and the liquid return port 143 ensures the continuity of the flow of the phase-change heat absorbing medium.

[0094] It should be noted that during the cooling process of the phase-change heat absorbing medium, the accumulation of bubbles and impurities may affect the heat dissipation efficiency and even cause failure of the radiator 20. Setting the liquid return port 143 at a lower position helps to discharge bubbles and impurities from the system during the liquid return process of the phase-change heat absorbing medium, thereby improving the stability and reliability of the radiator 20.

[0095] See also Figure 4 and Figure 6 In the embodiment of the present application, the liquid return port 143 includes: a first liquid return section 1431 and a second liquid return section 1432, the first liquid return section 1431 extends along the second direction, the second liquid return section 1432 is located on the side of the first liquid return section 1431 facing the liquid return chamber 120, and the extension direction of the second liquid return section 1432 is inclined toward the bottom wall side of the liquid return chamber 120 compared to the second direction.

[0096] The first liquid return section 1431 extends along the second direction, providing a smooth liquid return path for the phase-change heat absorbing medium, ensuring that the phase-change heat absorbing medium can flow along a predetermined direction, reducing turbulence and resistance at the entrance of the liquid return port 143, and thus improving the flow efficiency of the phase-change heat absorbing medium.

[0097] Furthermore, the second liquid return section 1432 is located on the side of the first liquid return section 1431 facing the liquid return chamber 120, and the extension direction of the second liquid return section 1432 is inclined toward the bottom wall side of the liquid return chamber 120 (i.e., the side of the liquid return chamber 120 away from the circuit board 10). Thus, by utilizing gravity and the flow characteristics of the fluid, the phase change heat absorption medium can flow more smoothly into the liquid return chamber 120, and the realization of the gravity difference is ensured.

[0098] In addition, the inclined second liquid return section 1432 also helps to reduce the accumulation of bubbles and impurities. During the flow of the phase change heat absorbing medium, bubbles and impurities are more easily brought to the bottom or edge of the liquid return chamber 120, reducing the influence of bubbles and impurities on the heat dissipation effect.

[0099] See also Figure 6 In the embodiment of the present application, the liquid return chamber 120 includes a first balancing chamber 121, a heat exchange chamber 122 and a second balancing chamber 123 arranged in sequence along the liquid return direction in the liquid return chamber 120, and the heat dissipation fins 200 in the liquid return chamber 120 are all arranged in the heat exchange chamber 122.

[0100] It can be understood that the phase change heat absorption medium replenished through the liquid return port 143 is separated from impurities and bubbles through the first balancing chamber 121; the heat exchange chamber 122 is the area where the phase change heat absorption medium and the heat sink fins 200 exchange heat, ensuring that heat can be efficiently transferred to the phase change heat absorption medium; the second balancing chamber 123 is used to receive the phase change heat absorption medium after heat exchange, providing buffering and regulation for the stable operation of the circulation loop.

[0101] Among them, the heat dissipation fins 200 are all arranged in the heat exchange cavity 122, which can maximize the use of the heat exchange area and improve the heat transfer efficiency.

[0102] See also Figure 6 In the embodiment of the present application, the heat dissipation fins 200 in the liquid return cavity 120 are divided into a first fin group 210, a second fin group 220 and a third fin group 230. The first fin group 210, the second fin group 220 and the third fin group 230 are sequentially arranged in the heat exchange cavity 122 along the reflux direction of the phase change heat absorption medium.

[0103] It should be noted that this segmented layout of the heat dissipation fins 200 is conducive to optimizing the heat exchange efficiency. The first fin group 210 first contacts the phase-change heat absorption medium with a relatively low temperature that has just entered the heat exchange chamber 122, and performs preliminary heat exchange, so that the temperature of the phase-change heat absorption medium gradually increases. Subsequently, the phase-change heat absorption medium flows through the second fin group 220. The second fin group 220 can be set to have an arrangement density greater than the first fin group 210. As a result, the second fin group 220 has a larger heat exchange area, so that the phase-change heat absorption medium can quickly absorb and disperse a large amount of heat. Finally, the phase-change heat absorption medium passes through the third fin group 230 for further heat exchange, thereby improving the overall heat exchange efficiency.

[0104] Furthermore, the segmented layout of the heat dissipation fins 200 helps to balance the temperature distribution in the heat exchange cavity 122. By arranging the first fin group 210, the second fin group 220 and the third fin group 230 in sequence, the local overheating problem caused by the uneven flow rate of the phase-change heat absorption medium or the concentrated heat load can be avoided. The first fin group 210, the second fin group 220 and the third fin group 230 can perform targeted heat exchange according to the temperature characteristics of the phase-change heat absorption medium at different stages, so that the temperature distribution in the heat exchange cavity 122 is more uniform, and the service life of the radiator 20 is extended.

[0105] See also Figure 5 In the embodiment of the present application, the base plate assembly 150 includes a first base plate 151 and a second base plate 152. The first base plate 151 covers the main shell 140. The portion of the first base plate 151 corresponding to the main heat dissipation cavity 110 is provided with an avoidance through hole 1511. The second base plate 152 is fixedly arranged on the side of the first base plate 151 facing away from the main shell 140. The heat dissipation fins 200 in the main heat dissipation cavity 110 pass through the avoidance through hole 1511 and are connected to the second base plate 152. The first chip component 11 is in thermal contact with the second base plate 152, and the second chip component 12 is in thermal contact with the first base plate 151.

[0106] In some embodiments, the double bottom plate structure of the first bottom plate 151 and the second bottom plate 152 effectively improves the integration and space utilization of the heat sink 20. The first bottom plate 151 serves as a cover for the main housing 140 and also performs a heat conduction function. The second chip component 12 is in thermal contact with the first bottom plate 151, so that the heat generated by the second chip component 12 can be transferred to the heat dissipation housing 100 through the first bottom plate 151 to achieve heat dissipation of the second chip component 12.

[0107] Furthermore, the second base plate 152 is used to connect to the heat dissipation fins 200 in the main heat dissipation cavity 110, and the first chip element 11 is in thermal contact with the second base plate 152, so that the heat generated by the first chip element 11 can be directly transferred to the main heat dissipation cavity 110 through the second base plate 152, thereby effectively improving the heat transfer efficiency.

[0108] Among them, through the design of the avoidance through hole 1511, the heat dissipation fin 200 of the main heat dissipation cavity 110 can be directly installed in the main heat dissipation cavity 110 through the avoidance through hole 1511, and the heat dissipation fin 200 adopts a split design with the main heat dissipation cavity 110. At the same time, the split design of the first bottom plate 151 and the second bottom plate 152 enables the first bottom plate 151 and the second bottom plate 152 to conduct heat to the second chip component 12 and the first chip component 11 in a targeted manner, so as to improve the heat dissipation effect of the second chip component 12 and the first chip component 11.

[0109] It should be noted that both ends of the second bottom plate 152 have connecting parts 1521, and the connecting parts 1521 are used to be welded to the first bottom plate 151. Specifically, the connecting parts 1521 and the first bottom plate 151 can be vacuum brazed or continuously tunnel furnace welded. After welding, CNC (Computerized Numerical Control) processing is performed to avoid the connecting parts 1521 from interfering with the installation of the reinforcement ring 13, thereby ensuring that the second bottom plate 152 meets the use requirements.

[0110] In addition, the first chip component 11 is mounted on the circuit board 10 via the reinforcement ring 13 . By providing the reinforcement ring 13 , the warping problem of the first chip component 11 can be avoided.

[0111] See also Figure 5 In the embodiment of the present application, a first heat conducting member 300 is provided between the first chip component 11 and the second base plate 152 ; and / or a second heat conducting member 400 is provided between the second chip component 12 and the first base plate 151 .

[0112] The provision of the first heat-conducting member 300 improves the thermal conductivity. The first heat-conducting member 300 may be a phase change film (PCM). When the first chip element 11 generates heat during operation, the first heat-conducting member 300 can utilize the latent heat characteristics of phase change to effectively absorb and store the heat from the first chip element 11, thereby forming an efficient thermal buffer layer between the first chip element 11 and the second base plate 152. The first heat-conducting member 300 absorbs the heat of the first chip element 11 and conducts the heat to the second base plate 152, thereby improving the thermal conduction efficiency between the first chip element 11 and the second base plate 152.

[0113] In addition, the uniformity of heat conduction is enhanced by providing the first heat conducting member 300. Since the heat is evenly distributed in the first heat conducting member 300 during the phase change process, the formation of local hot spots is avoided, making the temperature distribution on the surface of the first chip element 11 more uniform, reducing the thermal stress problem caused by excessive temperature gradient, and further protecting the structural integrity of the first chip element 11.

[0114] It is understandable that the first heat conducting member 300 may also be an ultra-thin, super-conductive carbon fiber heat conducting pad, but this embodiment is certainly not limited thereto.

[0115] Furthermore, by providing a second heat-conducting member 400 between the second chip element 12 and the first base plate 151, the heat conduction efficiency can be further improved. The second heat-conducting member 400 can be a carbon fiber thermal pad with good thermal conductivity. Of course, the second heat-conducting member 400 can also be other structures with good thermal conductivity, which is not limited in this embodiment. The second heat-conducting member 400, with its excellent thermal conductivity, ensures that the heat generated by the second chip element 12 can be quickly and efficiently transferred to the first base plate 151, and then the heat is discharged from the radiator 20 through the phase-change heat-absorbing medium in the circulation loop.

[0116] In the embodiment of the present application, the phase change heat absorption medium is a gas-liquid phase change medium.

[0117] It should be noted that the gas-liquid phase change medium has good heat absorption capacity. During the phase change process, the gas-liquid phase change medium changes from liquid to gas (or vice versa), and this change is accompanied by the absorption or release of a large amount of latent heat. Therefore, using the gas-liquid phase change medium in the heat sink 20 can more effectively absorb the heat from the circuit board 10, thereby improving the heat dissipation effect of the circuit board 10.

[0118] For specific implementation, see Figure 7 , the gas-liquid phase change medium enters the liquid return cavity 120 through the liquid return port 143 in liquid state, and then enters the main heat dissipation cavity 110 along the liquid return cavity 120, absorbs the heat transferred to the main heat dissipation cavity 110 through the first bottom plate 151 and the second bottom plate 152 and undergoes a phase change, and part of the liquid gas-liquid phase change medium vaporizes after absorbing heat to generate steam pressure. Under the impetus of the steam pressure, the liquid gas-liquid phase change medium begins to circulate in the heat dissipation housing 100 again. The greater the power consumption of the chip heat dissipation device, the greater the steam pressure, the greater the driving force, and the more obvious the convective heat exchange effect of the liquid gas-liquid phase change medium (that is, the liquid gas-liquid phase change medium is forced to convectively exchange heat through the steam pressure), and then the gas-liquid phase change medium enters the liquid outlet cavity 130 in a gas-liquid mixed state, and is discharged from the heat dissipation housing 100 through the liquid outlet port 142 to enter the external cooling device. After being cooled by the external cooling device, the gas-liquid phase change medium enters the liquid return cavity 120 again through the liquid return port 143 in liquid state, and the cycle is repeated. Furthermore, the driving force generated by the steam pressure drives the gas-liquid phase change medium to conduct convective heat exchange, so that the chip cooling device provided by the present application does not require additional load driving facilities.

[0119] Based on the above embodiments, an embodiment of the present application further provides an electronic device, comprising the chip heat dissipation device provided by any of the above embodiments.

[0120] The chip heat dissipation device has been described in detail in the above embodiments and will not be described again here.

[0121] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0122] It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0123] In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0124] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).

[0125] In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0126] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip heat dissipation device, characterized in that: include: A circuit board (10), wherein a first chip component (11) and a second chip component (12) are provided on the circuit board (10), and the heat generated by the first chip component (11) is greater than the heat generated by the second chip component (12); The heat sink (20) comprises: a heat sink housing (100) and heat sink fins (200), the heat sink housing (100) being fixedly connected to the circuit board (10), the inner side of the heat sink housing (100) defining a main heat sink chamber (110), a liquid return chamber (120) and a liquid outlet chamber (130) which are interconnected, the main heat sink chamber (110), the liquid return chamber (120) and the liquid outlet chamber (130) being provided with heat sink fins (200), the liquid return chamber (120) and the liquid outlet chamber (130) being respectively connected to an external cooling device to form a circulation loop, and a phase-change heat-absorbing medium flowing in the circulation loop; The first chip component (11) and the second chip component (12) are both in thermal contact with the heat dissipation housing (100), and the first chip component (11) is arranged opposite to the main heat dissipation cavity (110); The heat dissipation housing (100) comprises a main housing (140), a bottom plate assembly (150) and flow channel partition ribs (160); one end of the main housing (140) has an opening (141); the bottom plate assembly (150) is sealed at the opening (141); the circuit board (10) is arranged on a side of the bottom plate assembly (150) facing away from the main housing (140) along a third direction; there are two flow channel partition ribs (160), one of which is arranged between the liquid return chamber (120) and the main heat dissipation chamber (110), and the other of which is arranged between the liquid outlet chamber (130) and the main heat dissipation chamber (110); A liquid outlet (142) and a liquid return port (143) are further provided at one end of the main housing (140) along the second direction, the liquid outlet (142) being in communication with the liquid outlet cavity (130), the liquid return port (143) being in communication with the liquid return cavity (120), and the height of the liquid return port (143) in the third direction being lower than the height of the liquid outlet (142) in the third direction; The liquid return port (143) comprises: a first liquid return section (1431) and a second liquid return section (1432); the first liquid return section (1431) extends along the second direction; the second liquid return section (1432) is located on a side of the first liquid return section (1431) that faces the liquid return chamber (120); and an extension direction of the second liquid return section (1432) is inclined toward a bottom wall side of the liquid return chamber (120) compared to the second direction.

2. The chip heat dissipation device according to claim 1, characterized in that: The arrangement density of the heat dissipation fins (200) in the liquid return cavity (120) and the liquid outlet cavity (130) is smaller than the arrangement density of the heat dissipation fins (200) in the main heat dissipation cavity (110).

3. The chip heat dissipation device according to claim 1, characterized in that: The liquid return chamber (120), the main heat dissipation chamber (110), and the liquid outlet chamber (130) are arranged along a first direction, and the liquid return chamber (120), the main heat dissipation chamber (110), and the liquid outlet chamber (130) all extend along a second direction.

4. The chip heat dissipation device according to claim 3, characterized in that: The liquid return chamber (120) and the liquid outlet chamber (130) are respectively located on two sides of the main heat dissipation chamber (110) along the first direction. There are at least two second chip elements (12), and the at least two second chip elements (12) are respectively located on both sides of the first chip element (11) along the first direction, wherein one of the second chip elements (12) is arranged adjacent to the liquid return cavity (120), and the other second chip element (12) is arranged adjacent to the liquid outlet cavity (130).

5. The chip heat dissipation device according to claim 1, characterized in that: The two ends of the flow channel partition rib (160) are respectively welded to the main shell (140) and the bottom plate assembly (150); and / or, One end of the heat dissipation fin (200) facing away from the bottom plate assembly (150) is welded to the main housing (140).

6. The chip heat dissipation device according to claim 1, characterized in that: The liquid return chamber (120) comprises a first balancing chamber (121), a heat exchange chamber (122), and a second balancing chamber (123) arranged in sequence along a liquid return direction in the liquid return chamber (120); the heat dissipation fins (200) in the liquid return chamber (120) are all arranged in the heat exchange chamber (122).

7. The chip heat dissipation device according to claim 6, characterized in that: The heat dissipation fins (200) in the liquid return cavity (120) are divided into a first fin group (210), a second fin group (220) and a third fin group (230). The first fin group (210), the second fin group (220) and the third fin group (230) are arranged in sequence in the heat exchange cavity (122) along the reflux direction of the phase-change heat absorption medium.

8. The chip heat dissipation device according to claim 1, characterized in that: The bottom plate assembly (150) comprises a first bottom plate (151) and a second bottom plate (152); the first bottom plate (151) covers the main housing (140); a portion of the first bottom plate (151) corresponding to the main heat dissipation cavity (110) is provided with an avoidance through hole (1511); The second bottom plate (152) is fixedly arranged on a side of the first bottom plate (151) facing away from the main housing (140), and the heat dissipation fins (200) in the main heat dissipation cavity (110) pass through the avoidance through holes (1511) and are connected to the second bottom plate (152); The first chip component (11) is in thermal contact with the second base plate (152), and the second chip component (12) is in thermal contact with the first base plate (151).

9. The chip heat dissipation device according to claim 8, characterized in that: A first heat conducting member (300) is provided between the first chip element (11) and the second base plate (152); and / or, A second heat conducting member (400) is provided between the second chip element (12) and the first base plate (151).

10. The chip heat dissipation device according to any one of claims 1 to 9, characterized in that: The phase change heat absorbing medium is a gas-liquid phase change medium.

11. An electronic device, characterized in that: A chip heat dissipation device comprising any one of claims 1-10.

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