A semiconductor chip high-speed mounting device and a method of using the same

Abstract

The present invention provides a semiconductor chip high-speed mounting device and a method of using the same, and belongs to the field of semiconductor chip processing technology. The semiconductor chip high-speed mounting device includes a base, a No. 1 material tray, a No. 2 material tray and a mounting mechanism, a bracket is fixedly installed on the surface of the base, the No. 1 material tray and the No. 2 material tray are rotatably installed on the surface of the base, a substrate is fixedly installed on the surface of the base, and a plurality of PCB boards are placed on the surface of the substrate. The present invention sets a mounting mechanism, an electric telescopic rod is extended, the second gear is meshed with the third gear, the motor drives the turntable to rotate, and the No. 1 material tray is driven to rotate synchronously through the second gear, and multiple chips are grabbed at the same time, and then the electric telescopic rod is contracted, the first gear is meshed with the first tooth plate, and when the turntable rotates, the first gear can also drive the slide to move along the direction of the first tooth plate, and the chips adsorbed by one end of the suction cylinder are sequentially attached to the surface of the PCB board, and multiple chips can be mounted at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip processing, and in particular to a semiconductor chip high-speed mounting device and a method for using the same. Background Art

[0002] Semiconductor chip processing equipment involves the precise placement and fixing of tiny semiconductor chips onto circuit boards or other substrates. This process usually requires high-precision and high-reliability automated equipment to take the chips out of the feeder and accurately place them at the target location. It usually includes a precision robotic arm and multiple nozzles or fixtures to complete the precise placement of a large number of chips in a short time. The key performance indicators of the placement machine include placement accuracy, speed, and the size and type of chips that can be processed.

[0003] The existing semiconductor chip processing placement equipment is mainly composed of robotic arms, which have many moving parts and therefore require more maintenance and upkeep, resulting in higher production costs. In addition, the robotic arms move slowly, affecting production efficiency. Summary of the invention

[0004] In order to make up for the above deficiencies, the present invention provides a semiconductor chip high-speed mounting device and a method of using the device, which overcomes the above technical problems or at least partially solves the above problems.

[0005] The present invention is achieved in that:

[0006] The present invention provides a semiconductor chip high-speed mounting device, comprising a base, a first material tray, a second material tray and a mounting mechanism, wherein a bracket is fixedly mounted on the surface of the base, the first material tray and the second material tray are rotatably mounted on the surface of the base, a substrate is fixedly mounted on the surface of the base, a plurality of PCB boards are placed on the surface of the substrate, and the mounting mechanism comprises:

[0007] A slide seat, the slide seat is slidably mounted in the inner cavity of the bracket, and a sleeve is rotatably mounted in the inner cavity of the slide seat;

[0008] A first rotating shaft, the first rotating shaft is inserted into the inner cavity of the sleeve, and a rotating disk is fixedly installed at one end of the first rotating shaft;

[0009] The mounting seat is symmetrically fixedly mounted on the side wall of the turntable, a cylinder is fixedly mounted on the surface of the turntable, a suction cup is slidably mounted in the inner cavity of the cylinder, a piston is fixedly mounted at one end of the suction cup, and the piston is slidably mounted in the inner cavity of the cylinder.

[0010] In a preferred solution, a first slide groove is provided in the inner cavity of the bracket, the slide seat is slidably installed in the inner cavity of the first slide groove, a motor is fixedly installed on the side wall of the slide seat, the output end of the motor is fixedly connected to the sleeve, a plurality of spline teeth are fixedly installed on the surface of the first rotating shaft, a tooth groove is provided in the inner cavity of the sleeve, and the spline teeth are slidably connected to the tooth groove.

[0011] In a preferred solution, an electric telescopic rod is fixedly mounted on the side wall of the slide seat, an arc-shaped slider is fixedly mounted on the output end of the electric telescopic rod, a second slide groove is provided on the side wall of the turntable, the arc-shaped slider is slidably connected to the second slide groove, a first gear is fixedly mounted on the surface of the first rotating shaft, a first tooth plate is fixedly mounted on the side wall of the bracket, and the first gear is matched with the first tooth plate.

[0012] In a preferred solution, an air pump is fixedly installed in the inner cavity of the mounting seat, the air outlet end of the air pump is connected to the cylinder, a first spring is fixedly installed in the inner cavity of the cylinder, and the other end of the first spring is fixedly connected to the piston.

[0013] In a preferred solution, a second gear is fixedly mounted on the side wall of the turntable, a second rotating shaft is fixedly mounted on the surface of the No. 1 material tray and the No. 2 material tray, a third gear is fixedly mounted on the surface of the second rotating shaft, and the third gear is adapted to the second gear.

[0014] In a preferred solution, a correction mechanism is installed on the surface of the cylinder for adjusting the chip position. The correction mechanism includes a connecting ring and a positioning plate. The connecting ring is fixedly installed on the surface of the suction cylinder. A third slide groove is symmetrically opened in the inner cavity of the connecting ring. A positioning plate is slidably installed in the inner cavity of the third slide groove.

[0015] In a preferred solution, a support rod is fixedly mounted on the surface of the positioning plate, a fourth slide groove is opened on the surface of the support rod, a first connecting rod is slidably mounted in the inner cavity of the fourth slide groove, a second tooth plate is fixedly mounted on the other end of the first connecting rod, a third tooth plate is symmetrically fixedly mounted on the side wall of the piston, a fourth gear is symmetrically rotatably mounted in the inner cavity of the cylinder, and both the second tooth plate and the third tooth plate are meshed with the fourth gear.

[0016] In a preferred solution, a fixing mechanism is provided on the surface of the substrate for clamping and fixing the PCB board; the fixing mechanism includes a support plate, a push plate and a clamping block, the support plate is slidably installed in the inner cavity of the substrate, the push plate and the clamping block are symmetrically slidably installed in the inner cavity of the substrate, and a second spring is fixedly installed between the push plate and the clamping block.

[0017] In a preferred solution, a second connecting rod is fixedly installed on the bottom of the support plate, a limiting block is fixedly installed on the other end of the second connecting rod, a third spring is sleeved on the surface of the second connecting rod, one end of the third spring is fixedly connected to the support plate, and the other end of the third spring is fixedly connected to the base plate, a third connecting rod is fixedly installed on the bottom of the push plate, a fourth tooth plate is fixedly installed on the side wall of the third connecting rod, a fifth tooth plate is fixedly installed on the bottom of the limiting block, a fifth gear is rotatably installed on the inner cavity of the base plate, and the fourth tooth plate and the fifth tooth plate are both meshed with the fifth gear.

[0018] A semiconductor chip processing and mounting method, applicable to the above-mentioned semiconductor chip high-speed mounting equipment, comprises the following steps:

[0019] S1: Grabbing of chips; the electric telescopic rod is extended to push the turntable toward the No. 1 material tray, so that the second gear is meshed with the third gear, the turntable is driven by the motor to rotate, and the third gear and the No. 1 material tray are driven to rotate synchronously through the second gear, and multiple chips are grabbed at the same time. When the lower end of the suction cup contacts the chip, the air pump is pumped to form a negative pressure in the cylinder, and the chip is adsorbed on one end of the suction cup to complete the grabbing of the chip;

[0020] S2: chip correction; after the chip is adsorbed on one end of the suction cylinder, the suction cylinder is blocked. Then, under the negative pressure inside the cylinder, the piston drives the suction cylinder to move toward the inner cavity of the cylinder, and the third gear plate moves synchronously, driving the fourth gear to rotate, thereby driving the second gear plate to drive the support rod to move toward the cylinder, and finally the chip is clamped and positioned through the positioning plate;

[0021] S3: patch; the electric telescopic rod is contracted to drive the turntable to move toward the bracket, so that the first gear is meshed with the first tooth plate. When the motor drives the turntable to rotate, the first gear can also drive the slide to move along the first tooth plate, so that the chip adsorbed by one end of the suction cylinder is sequentially attached to the surface of the PCB board; and when the chip contacts the surface of the PCB board, the air pump injects air into the cylinder, and pushes the piston and the suction cylinder to move toward the outer cavity of the cylinder, so that the chip is attached to the surface of the PCB board, and the patch work is completed.

[0022] The invention provides a semiconductor chip high-speed mounting device and a method for using the same, the beneficial effects of which include:

[0023] 1. By setting a mounting mechanism, the electric telescopic rod is extended to push the turntable to move toward the No. 1 material tray, so that the second gear is meshed with the third gear, and the motor drives the sleeve to rotate, driving the turntable to rotate, and the second gear drives the third gear and the No. 1 material tray to rotate synchronously, and multiple chips are grabbed at the same time. When the lower end of the suction cup contacts the chip, the air pump is evacuated to adsorb the chip on one end of the suction cup, and the chip is grabbed; then the electric telescopic rod is contracted to engage the first gear with the first tooth plate, and when the motor drives the turntable to rotate, the first gear can also drive the slide to move along the direction of the first tooth plate, and the chip adsorbed on one end of the suction cup is sequentially attached to the surface of the PCB board, so that multiple chips can be mounted at the same time, and the equipment maintenance cost is low, and it is convenient to use.

[0024] 2. By setting up a deviation correction mechanism, when the suction cup contacts the chip and adsorbs the chip on one end of the suction cup, the suction cup is blocked. Under the action of the negative pressure inside the cylinder, the piston drives the suction cup to move toward the inner cavity of the cylinder, the first spring is compressed, and the third gear plate moves synchronously with the piston, driving the fourth gear to rotate, thereby driving the second gear plate to drive the support rod to move toward the cylinder. Finally, the chip is clamped and positioned through the positioning plate to prevent the chip position from being offset when grabbing the chip, thereby ensuring the quality of the patch.

[0025] 3. By setting a fixing mechanism, when the chip adsorbed by one end of the suction cylinder contacts the surface of the PCB board, the air pump injects air into the cylinder and pushes the piston and the suction cylinder to move toward the outer cavity of the cylinder to attach the chip to the surface of the PCB board. At this time, the suction cylinder will exert a downward force on the PCB board and the support plate, and the third spring will contract, and the support plate will drive the PCB board to move downward, driving the fifth tooth plate to move downward, thereby driving the fifth gear to rotate, thereby driving the fourth tooth plate to drive the push plate to move toward the clamping block, so that the second spring is further compressed, thereby further clamping and fixing the PCB board through the clamping block to prevent the PCB board from shifting during patching and ensure the patch quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be regarded as limiting the scope. For those skilled in the art, other relevant drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 is a front perspective view provided by an embodiment of the present invention;

[0028] Figure 2 A side perspective view of an embodiment of the present invention is provided;

[0029] Figure 3 A side view of an embodiment of the present invention is provided;

[0030] Figure 4 A cross-sectional view of a cylinder provided for an embodiment of the present invention;

[0031] Figure 5 The embodiments of the present invention provide Figure 4 Enlarged view of point A in the middle;

[0032] Figure 6 An exploded diagram of a mounting mechanism provided in an embodiment of the present invention;

[0033] Figure 7 An exploded diagram of a deviation correction mechanism provided in an embodiment of the present invention;

[0034] Figure 8 A cross-sectional view of a substrate provided for an embodiment of the present invention;

[0035] Fig. 9 The embodiments of the present invention provide Figure 8 Enlarged view of point B in the middle;

[0036] Fig.10 An exploded view of a fixing mechanism provided in an embodiment of the present invention;

[0037] In the figure: 1, base; 2, bracket; 3, No. 1 material tray; 4, No. 2 material tray; 5, substrate; 6, PCB board; 7, mounting mechanism; 701, slide seat; 702, first slide slot; 703, sleeve; 704, motor; 705, first rotating shaft; 706, spline teeth; 707, tooth groove; 708, turntable; 709, electric telescopic rod; 710, arc-shaped slider; 711, second slide slot; 712, first gear; 713, first tooth plate; 714, mounting seat; 715, air pump; 716, cylinder; 717, suction cup; 718, piston; 719, first spring; 720, second Gear; 721, second rotating shaft; 722, third gear; 8, deviation correction mechanism; 801, connecting ring; 802, third slide groove; 803, positioning plate; 804, support rod; 805, fourth slide groove; 806, first connecting rod; 807, second tooth plate; 808, third tooth plate; 809, fourth gear; 9, fixing mechanism; 901, support plate; 902, second connecting rod; 903, limit block; 904, third spring; 905, push plate; 906, clamping block; 907, second spring; 908, third connecting rod; 909, fourth tooth plate; 910, fifth tooth plate; 911, fifth gear. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] Reference Figure 1-Figure 10 As shown, the present invention provides a technical solution: a semiconductor chip high-speed mounting device, including a base 1, a first material tray 3, a second material tray 4 and a mounting mechanism 7, a bracket 2 is fixedly mounted on the surface of the base 1, the first material tray 3 and the second material tray 4 are rotatably mounted on the surface of the base 1, a number of chips are placed on the surface of the first material tray 3 and the second material tray 4, a substrate 5 is fixedly mounted on the surface of the base 1, a number of PCB boards 6 are placed on the surface of the substrate 5, the mounting mechanism 7 includes a slide 701, a first rotating shaft 705 and a mounting seat 714, the slide 701 is slidably mounted on the inner cavity of the bracket 2, a first slide groove 702 is opened in the inner cavity of the bracket 2, and the slide 701 is slidably mounted in the inner cavity of the first slide groove 702, A sleeve 703 is rotatably installed in the inner cavity of the slide 701, which is used to drive the first rotating shaft 705 to rotate. A motor 704 is fixedly installed on the side wall of the slide 701. The output end of the motor 704 is fixedly connected to the sleeve 703, which is used to drive the sleeve 703 to rotate. The first rotating shaft 705 is inserted into the inner cavity of the sleeve 703. A plurality of spline teeth 706 are fixedly installed on the surface of the first rotating shaft 705. The inner cavity of the sleeve 703 is provided with tooth grooves 707. The spline teeth 706 are slidably connected with the tooth grooves 707. With the cooperation of the spline teeth 706 and the tooth grooves 707, the sleeve 703 can drive the first rotating shaft 705 to rotate while the first rotating shaft 705 can also move laterally in the sleeve 703 for extension and retraction.

[0040] Reference Figure 1-Figure 5 As shown, in a preferred embodiment, a turntable 708 is fixedly installed at one end of the first rotating shaft 705, and an electric telescopic rod 709 is fixedly installed on the side wall of the slide 701 for driving the turntable 708. An arc-shaped slider 710 is fixedly installed on the output end of the electric telescopic rod 709. A second slide groove 711 is provided on the side wall of the turntable 708. The arc-shaped slider 710 is slidably connected with the second slide groove 711. A first gear 712 is fixedly installed on the surface of the first rotating shaft 705, and a first tooth plate 713 is fixedly installed on the side wall of the bracket 2. The first gear 712 is adapted to the first tooth plate 713. When the electric telescopic rod 709 is contracted, the turntable 708 can be driven to move toward the bracket 2, so that the first gear 712 is meshed with the first tooth plate 713. When the motor 704 drives the turntable 708 to rotate, the slide 701 can also be driven to move along the direction of the first tooth plate 713 through the first gear 712.

[0041] Reference Figure 1-Figure 5 As shown, in a preferred embodiment, a mounting seat 714 is symmetrically fixedly mounted on the side wall of the turntable 708, a cylinder 716 is fixedly mounted on the surface of the turntable 708, a suction cup 717 is slidably mounted in the inner cavity of the cylinder 716 for grabbing chips, a piston 718 is fixedly mounted at one end of the suction cup 717 for driving the suction cup 717, the piston 718 is slidably mounted in the inner cavity of the cylinder 716, an air pump 715 is fixedly mounted in the inner cavity of the mounting seat 714 for pumping air, an air outlet end of the air pump 715 is connected to the cylinder 716, a first spring 719 is fixedly mounted in the inner cavity of the cylinder 716, the other end of the first spring 719 is fixedly connected to the piston 718, under the action of the first spring 719, the piston 718 is driven to drive the suction cup 717 to move toward the outer cavity of the cylinder 716.

[0042] Reference Figure 1-Figure 5 As shown, in a preferred embodiment, a second gear 720 is fixedly installed on the side wall of the turntable 708, a second rotating shaft 721 is fixedly installed on the surface of the No. 1 material tray 3 and the No. 2 material tray 4, a third gear 722 is fixedly installed on the surface of the second rotating shaft 721, and the third gear 722 is adapted to the second gear 720. When the electric telescopic rod 709 is extended, the turntable 708 is pushed to move toward the No. 1 material tray 3, so that the second gear 720 is engaged with the third gear 722. The turntable 708 can be rotated to drive the No. 1 material tray 3 to rotate synchronously to grab the chip.

[0043] In a preferred embodiment, when in use, a number of chips are placed on the surfaces of the No. 1 material tray 3 and the No. 2 material tray 4, and the electric telescopic rod 709 is extended to push the turntable 708 to move toward the No. 1 material tray 3, so that the second gear 720 is meshed with the third gear 722, and the sleeve 703 is driven to rotate by the motor 704. With the cooperation of the spline teeth 706 and the tooth grooves 707, when the first rotating shaft 705 moves horizontally in the sleeve 703, the first rotating shaft 705 can also be driven to rotate, thereby driving the turntable 708 to rotate, and the third gear 722 and the No. 1 material tray 3 are driven to rotate synchronously through the second gear 720, and multiple chips are grabbed at the same time. When the lower end of the suction cylinder 717 contacts the chip, the air pump 715 is evacuated to form a negative pressure in the cylinder 716 to adsorb the chip. At one end of the suction cylinder 717, the chip is grabbed; then, the electric telescopic rod 709 is contracted to drive the turntable 708 to move toward the bracket 2, so that the first gear 712 is meshed with the first tooth plate 713. When the motor 704 drives the turntable 708 to rotate, the first gear 712 can also drive the slide 701 to move along the first tooth plate 713, so that the chip adsorbed by one end of the suction cylinder 717 is attached to the surface of the PCB board 6 in sequence; and when the chip contacts the surface of the PCB board 6, the air pump 715 injects air into the cylinder 716, and pushes the piston 718 and the suction cylinder 717 to move toward the outer cavity of the cylinder 716, so that the chip is attached to the surface of the PCB board 6, and the patch work is completed. Multiple chips can be mounted at the same time, and the mounting is performed at a high speed. The equipment has low maintenance costs and is easy to use.

[0044] Reference Figure 1-Figure 7 As shown, in a preferred embodiment, a correction mechanism 8 is installed on the surface of the cylinder 716 for adjusting the chip position. The correction mechanism 8 includes a connecting ring 801 and a positioning plate 803. The connecting ring 801 is fixedly installed on the surface of the suction cylinder 717. The inner cavity of the connecting ring 801 is symmetrically provided with a third slide groove 802. The inner cavity of the third slide groove 802 is slidably provided with a positioning plate 803 for adjusting the chip position.

[0045] Reference Figure 1-Figure 7 As shown, in a preferred embodiment, a support rod 804 is fixedly installed on the surface of the positioning plate 803 for driving the positioning plate 803, a fourth slide groove 805 is opened on the surface of the support rod 804, and a first connecting rod 806 is slidably installed in the inner cavity of the fourth slide groove 805 for driving the support rod 804, a second tooth plate 807 is fixedly installed on the other end of the first connecting rod 806, a third tooth plate 808 is symmetrically fixedly installed on the side wall of the piston 718, a fourth gear 809 is symmetrically rotatably installed in the inner cavity of the cylinder 716 for driving the second tooth plate 807 and the third tooth plate 808 to move relative to each other, and the second tooth plate 807 and the third tooth plate 808 are both meshed with the fourth gear 809.

[0046] In a preferred embodiment, when the suction cup 717 contacts the chip and adsorbs the chip on one end of the suction cup 717, the suction cup 717 is blocked. Then, under the action of the negative pressure inside the cylinder 716, the driving piston 718 drives the suction cup 717 to move toward the inner cavity of the cylinder 716, the first spring 719 is compressed, and the third gear plate 808 moves synchronously with the piston 718, driving the fourth gear 809 to rotate, thereby driving the second gear plate 807 to drive the support rod 804 to move closer to the cylinder 716, and finally the chip is clamped and positioned through the positioning plate 803 to prevent the chip position from being offset when grabbing the chip, thereby ensuring the quality of the patch.

[0047] Reference Figure 1-Figure 10 As shown, in a preferred embodiment, a fixing mechanism 9 is provided on the surface of the substrate 5 for clamping and fixing the PCB board 6; the fixing mechanism 9 includes a support plate 901, a push plate 905 and a clamping block 906, the support plate 901 is slidably installed in the inner cavity of the substrate 5 for placing the PCB board 6, the push plate 905 and the clamping block 906 are symmetrically slidably installed in the inner cavity of the substrate 5 for fixing the PCB board 6, a second spring 907 is fixedly installed between the push plate 905 and the clamping block 906, under the action of the second spring 907, the push plate 905 and the clamping block 906 are driven to move relative to each other, and the clamping block 906 is made to be close to the side wall of the PCB board 6, so as to clamp and fix the PCB board 6.

[0048] Reference Figure 1-Figure 10 As shown, in a preferred embodiment, a second connecting rod 902 is fixedly installed on the bottom of the support plate 901, and a limiting block 903 is fixedly installed on the other end of the second connecting rod 902. A third spring 904 is sleeved on the surface of the second connecting rod 902 for driving the support plate 901. One end of the third spring 904 is fixedly connected to the support plate 901, and the other end of the third spring 904 is fixedly connected to the base plate 5. Under the action of the third spring 904, the support plate 901 is driven to move upward, and a third connecting rod 908 is fixedly installed on the bottom of the push plate 905. A fourth tooth plate 909 is fixedly installed on the side wall of the third connecting rod 908, and a fifth tooth plate 910 is fixedly installed on the bottom of the limiting block 903. A fifth gear 911 is rotatably installed in the inner cavity of the base plate 5 for driving the fourth tooth plate 909 and the fifth tooth plate 910 to move relative to each other, and the fourth tooth plate 909 and the fifth tooth plate 910 are both meshed with the fifth gear 911.

[0049] In a preferred solution, during patching, when the chip adsorbed by one end of the suction cylinder 717 contacts the surface of the PCB board 6, the air pump 715 injects air into the cylinder 716 and pushes the piston 718 and the suction cylinder 717 to move toward the outer cavity of the cylinder 716 to attach the chip to the surface of the PCB board 6. At this time, the suction cylinder 717 applies a downward force to the PCB board 6 and the support plate 901, the third spring 904 contracts, the support plate 901 drives the PCB board 6 to move downward, drives the fifth gear plate 910 to move downward, thereby driving the fifth gear 911 to rotate, thereby driving the fourth gear plate 909 to drive the push plate 905 to move toward the clamping block 906, so that the second spring 907 is further compressed, thereby further clamping and fixing the PCB board 6 through the clamping block 906 to prevent the PCB board 6 from deflecting during patching and ensure the patch quality.

[0050] A semiconductor chip processing and mounting method, applicable to a semiconductor chip high-speed mounting device, comprises the following steps:

[0051] S1: Grabbing of chips; the electric telescopic rod 709 is extended to push the turntable 708 to move toward the first tray 3, so that the second gear 720 is meshed with the third gear 722, and the turntable 708 is driven to rotate by the motor 704, and the third gear 722 and the first tray 3 are driven to rotate synchronously by the second gear 720, and multiple chips are grabbed at the same time. When the lower end of the suction cylinder 717 contacts the chip, the air pump 715 is evacuated to form a negative pressure in the cylinder 716, and the chip is adsorbed on one end of the suction cylinder 717, and the chip is grabbed;

[0052] S2: chip deviation correction; after the chip is adsorbed on one end of the suction cylinder 717, the suction cylinder 717 is blocked, and under the negative pressure inside the cylinder 716, the piston 718 drives the suction cylinder 717 to move toward the inner cavity of the cylinder 716, and the third gear plate 808 moves synchronously, driving the fourth gear 809 to rotate, thereby driving the second gear plate 807 to drive the support rod 804 to move toward the cylinder 716, and finally the chip is clamped and positioned through the positioning plate 803;

[0053] S3: patch; by contracting the electric telescopic rod 709, the turntable 708 is driven to move toward the bracket 2, so that the first gear 712 is meshed with the first tooth plate 713. When the motor 704 drives the turntable 708 to rotate, the slide 701 can also be driven to move along the first tooth plate 713 through the first gear 712, and the chip adsorbed by one end of the suction cylinder 717 is sequentially attached to the surface of the PCB board 6; and when the chip contacts the surface of the PCB board 6, the air pump 715 injects air into the cylinder 716, and pushes the piston 718 and the suction cylinder 717 to move toward the outer cavity of the cylinder 716, so that the chip is attached to the surface of the PCB board 6, and the patch work is completed.

[0054] Specifically, the working process or working principle of the semiconductor chip high-speed mounting equipment is as follows: when in use, a number of chips are placed on the surfaces of the No. 1 material tray 3 and the No. 2 material tray 4, and the electric telescopic rod 709 is extended to push the turntable 708 to move toward the No. 1 material tray 3, so that the second gear 720 is meshed with the third gear 722, and the sleeve 703 is driven to rotate by the motor 704. With the cooperation of the spline teeth 706 and the tooth grooves 707, when the first rotating shaft 705 moves horizontally in the sleeve 703, it can also drive the first rotating shaft 705 to rotate, thereby driving the turntable 708 to rotate, and the third gear 722 and the No. 1 material tray 3 are driven to rotate synchronously through the second gear 720, and multiple chips are grabbed at the same time. When the lower end of the suction tube 717 contacts the chip, the air pump 715 is evacuated, and the cylinder 7 16 forms negative pressure, and the chip is adsorbed on one end of the suction cylinder 717, and the chip is captured; then, the electric telescopic rod 709 is contracted, and the turntable 708 is driven to move toward the bracket 2, so that the first gear 712 is meshed with the first tooth plate 713. When the motor 704 drives the turntable 708 to rotate, the slide 701 can also be driven to move along the direction of the first tooth plate 713 through the first gear 712, and the chip adsorbed on one end of the suction cylinder 717 is sequentially attached to the surface of the PCB board 6; and when the chip contacts the surface of the PCB board 6, the air pump 715 injects air into the cylinder 716, and pushes the piston 718 and the suction cylinder 717 to move toward the outer cavity of the cylinder 716, so that the chip is attached to the surface of the PCB board 6, and the patch work is completed. Multiple chips can be mounted at the same time, and the equipment maintenance cost is low, and it is convenient to use.

[0055] When the suction cup 717 contacts the chip and absorbs the chip onto one end of the suction cup 717, the suction cup 717 is blocked. Then, under the negative pressure inside the cylinder 716, the piston 718 is driven to drive the suction cup 717 to move toward the inner cavity of the cylinder 716, the first spring 719 is compressed, and the third gear plate 808 moves synchronously with the piston 718, driving the fourth gear 809 to rotate, thereby driving the second gear plate 807 to drive the support rod 804 to move toward the cylinder 716, and finally the chip is clamped and positioned through the positioning plate 803 to prevent the chip position from being offset when grabbing the chip, thereby ensuring the quality of the patch.

[0056] When the chip adsorbed by one end of the suction cylinder 717 contacts the surface of the PCB board 6, the air pump 715 injects air into the cylinder 716 and pushes the piston 718 and the suction cylinder 717 to move toward the outer cavity of the cylinder 716 to attach the chip to the surface of the PCB board 6. At this time, the suction cylinder 717 applies a downward force to the PCB board 6 and the support plate 901, and the third spring 904 contracts. The support plate 901 drives the PCB board 6 to move downward, and drives the fifth gear plate 910 to move downward, thereby driving the fifth gear 911 to rotate, thereby driving the fourth gear plate 909 to drive the push plate 905 to move toward the clamping block 906, so that the second spring 907 is further compressed, so that the PCB board 6 is further clamped and fixed by the clamping block 906 to prevent the PCB board 6 from deflecting during the patch, thereby ensuring the patch quality.

[0057] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0058] It should be noted that the motor 704 and the electric telescopic rod 709 are devices or equipment existing in the prior art, or are devices or equipment that can be realized in the prior art. Their power supply, specific composition and principles are clear to those skilled in the art, so they are not described in detail.

Claims

1. A semiconductor chip high-speed mounting device, characterized in that: The invention comprises a base (1), a first material tray (3), a second material tray (4) and a mounting mechanism (7), wherein a bracket (2) is fixedly mounted on the surface of the base (1), the first material tray (3) and the second material tray (4) are rotatably mounted on the surface of the base (1), a substrate (5) is fixedly mounted on the surface of the base (1), and a plurality of PCB boards (6) are placed on the surface of the substrate (5), and the mounting mechanism (7) comprises: A slide seat (701), the slide seat (701) being slidably mounted in the inner cavity of the bracket (2), and a sleeve (703) being rotatably mounted in the inner cavity of the slide seat (701); A first rotating shaft (705), the first rotating shaft (705) being inserted into the inner cavity of the sleeve (703), and a rotating disk (708) being fixedly mounted on one end of the first rotating shaft (705); A mounting seat (714), the mounting seat (714) being symmetrically fixedly mounted on the side wall of the rotating disk (708), a cylinder (716) being fixedly mounted on the surface of the rotating disk (708), a suction cylinder (717) being slidably mounted in the inner cavity of the cylinder (716), a piston (718) being fixedly mounted at one end of the suction cylinder (717), and the piston (718) being slidably mounted in the inner cavity of the cylinder (716); An electric telescopic rod (709) is fixedly mounted on the side wall of the slide seat (701), an arc-shaped slider (710) is fixedly mounted on the output end of the electric telescopic rod (709), a second slide groove (711) is provided on the side wall of the rotating disk (708), the arc-shaped slider (710) is slidably connected to the second slide groove (711), a first gear (712) is fixedly mounted on the surface of the first rotating shaft (705), a first tooth plate (713) is fixedly mounted on the side wall of the bracket (2), and the first gear (712) is matched with the first tooth plate (713); A second gear (720) is fixedly mounted on the side wall of the rotating disk (708); a second rotating shaft (721) is fixedly mounted on the surface of the first material tray (3) and the second material tray (4); a third gear (722) is fixedly mounted on the surface of the second rotating shaft (721); and the third gear (722) is matched with the second gear (720).

2. A semiconductor chip high-speed mounting device according to claim 1, characterized in that: The bracket (2) has an inner cavity provided with a first slide groove (702), the slide seat (701) is slidably mounted in the inner cavity of the first slide groove (702), a motor (704) is fixedly mounted on the side wall of the slide seat (701), an output end of the motor (704) is fixedly connected to a sleeve (703), a plurality of spline teeth (706) are fixedly mounted on the surface of the first rotating shaft (705), a tooth groove (707) is provided in the inner cavity of the sleeve (703), and the spline teeth (706) are slidably connected to the tooth groove (707).

3. A semiconductor chip high-speed mounting device according to claim 2, characterized in that: An air pump (715) is fixedly mounted in the inner cavity of the mounting seat (714); an air outlet end of the air pump (715) is in communication with the cylinder (716); a first spring (719) is fixedly mounted in the inner cavity of the cylinder (716); the other end of the first spring (719) is fixedly connected to the piston (718).

4. A semiconductor chip high-speed mounting device according to claim 3, characterized in that: The cylinder (716) is provided with a deviation correction mechanism (8) on its surface for adjusting the position of the chip. The deviation correction mechanism (8) comprises a connecting ring (801) and a positioning plate (803). The connecting ring (801) is fixedly mounted on the surface of the suction cylinder (717). The inner cavity of the connecting ring (801) is symmetrically provided with a third slide groove (802). The inner cavity of the third slide groove (802) is provided with a positioning plate (803) for sliding installation.

5. The semiconductor chip high-speed mounting device according to claim 4, characterized in that: A support rod (804) is fixedly mounted on the surface of the positioning plate (803), a fourth slide groove (805) is opened on the surface of the support rod (804), a first connecting rod (806) is slidably mounted in the inner cavity of the fourth slide groove (805), a second tooth plate (807) is fixedly mounted on the other end of the first connecting rod (806), a third tooth plate (808) is symmetrically fixedly mounted on the side wall of the piston (718), a fourth gear (809) is symmetrically rotatably mounted in the inner cavity of the cylinder (716), and the second tooth plate (807) and the third tooth plate (808) are both meshed with the fourth gear (809).

6. The semiconductor chip high-speed mounting device according to claim 5, characterized in that: A fixing mechanism (9) is provided on the surface of the substrate (5) for clamping and fixing the PCB board (6); the fixing mechanism (9) comprises a support plate (901), a push plate (905) and a clamping block (906); the support plate (901) is slidably mounted in the inner cavity of the substrate (5); the push plate (905) and the clamping block (906) are symmetrically slidably mounted in the inner cavity of the substrate (5); a second spring (907) is fixedly mounted between the push plate (905) and the clamping block (906).

7. The semiconductor chip high-speed mounting equipment according to claim 6, characterized in that: A second connecting rod (902) is fixedly mounted on the bottom of the supporting plate (901), a limiting block (903) is fixedly mounted on the other end of the second connecting rod (902), a third spring (904) is sleeved on the surface of the second connecting rod (902), one end of the third spring (904) is fixedly connected to the supporting plate (901), and the other end of the third spring (904) is fixedly connected to the base plate (5), a third connecting rod (908) is fixedly mounted on the bottom of the push plate (905), a fourth tooth plate (909) is fixedly mounted on the side wall of the third connecting rod (908), a fifth tooth plate (910) is fixedly mounted on the bottom of the limiting block (903), a fifth gear (911) is rotatably mounted on the inner cavity of the base plate (5), and the fourth tooth plate (909) and the fifth tooth plate (910) are both meshed with the fifth gear (911).

8. A semiconductor chip processing and mounting method, applicable to the semiconductor chip high-speed mounting equipment as claimed in claim 7, characterized in that: The steps include: S1: Grabbing of chips; the electric telescopic rod (709) is extended to push the turntable (708) to move toward the first material tray (3), so that the second gear (720) is meshed with the third gear (722), the turntable (708) is driven to rotate by the motor (704), and the third gear (722) and the first material tray (3) are driven to rotate synchronously by the second gear (720), and multiple chips are grabbed at the same time. When the lower end of the suction cylinder (717) contacts the chip, the air pump (715) is evacuated to form a negative pressure in the cylinder (716), and the chip is adsorbed on one end of the suction cylinder (717), thereby completing the grabbing of the chip; S2: chip deviation correction; after the chip is adsorbed on one end of the suction cylinder (717), the suction cylinder (717) is blocked, and under the action of the negative pressure inside the cylinder (716), the piston (718) is driven to drive the suction cylinder (717) to move toward the inner cavity of the cylinder (716), and the third tooth plate (808) moves synchronously, driving the fourth gear (809) to rotate, thereby driving the second tooth plate (807) to drive the support rod (804) to move toward the cylinder (716), and finally the chip is clamped and positioned through the positioning plate (803); S3: patching; the electric telescopic rod (709) is retracted to drive the rotating disk (708) to move in the direction of the bracket (2), so that the first gear (712) and the first tooth plate (713) are meshed, and when the motor (704) drives the rotating disk (708) to rotate, the first gear (712) drives the slide seat (701) to move in the direction of the first tooth plate (713), and the chips adsorbed by one end of the suction cylinder (717) are sequentially attached to the surface of the PCB board (6); and when the chip contacts the surface of the PCB board (6), the air pump (715) injects air into the cylinder (716), and pushes the piston (718) and the suction cylinder (717) to move toward the outer cavity of the cylinder (716), so that the chip is attached to the surface of the PCB board (6), and the patching work is completed.

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