A semiconductor packaging chip discharge device

Abstract

The present invention discloses a semiconductor package chip discharge device, which relates to the technical field related to package chip discharge devices, and comprises a workbench and a first belt conveyor arranged on the workbench for loading package chips, a mounting plate is fixedly mounted on the workbench, a discharge mechanism for discharging package chips is arranged on the mounting plate, and a disc is arranged through the discharge mechanism, a track groove is opened on the disc and a sliding disc is arranged in the track groove, a dividing mechanism is arranged on the workbench and a dividing disc is arranged through the dividing mechanism, and the track groove is composed of a first elliptical slide groove, a first circular slide groove, a second elliptical slide groove and a second circular slide groove of the same width; the present invention takes the packaged chips out of the dividing disc, and arranges them in an orderly manner on the second belt conveyor when transferring them, and will not cause agitation to the packaged chips, thereby reducing damage to the packaged chips during transportation, and is simple to operate and easy to use.

Description

Technical Field

[0001] The present invention relates to the technical field related to packaged chip discharge devices, and in particular to a semiconductor packaged chip discharge device. Background Art

[0002] Chip packaging is a process in which the chip is encapsulated in a shell, which protects the chip while providing it with circuit connection, mechanical fixation, anti-interference and other functions. After the chip is packaged, a discharge device is needed to transport the packaged chip to the test area for testing and packaging of the packaged chip.

[0003] Common discharge devices are mostly vibration plates or conveyor belts. The vibration plate drives the chips along a spiral track through a continuously rotating chassis, and pushes the chips with incorrect postures back to the bottom of the vibration plate during the movement, and then continues to arrange them randomly. This method will cause the chips to be constantly stirred in the vibration plate, which can easily damage the packaged chips. The conveyor belt cannot arrange the packaged chips in an orderly manner, which is not convenient for orderly discharge and transportation of the packaged chips, and is not convenient for subsequent inspection, packaging and other operations on the packaged chips. Summary of the invention

[0004] In order to solve the defects in the prior art, the present invention provides a semiconductor packaging chip discharge device.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0006] The present invention discloses a semiconductor package chip discharge device, comprising a workbench and a first belt conveyor arranged on the workbench for loading packaged chips, wherein a mounting plate is fixedly mounted on the workbench, a discharge mechanism for discharging packaged chips is arranged on the mounting plate, and a disc is arranged through the discharge mechanism, a track groove is opened on the disc and a sliding disc is arranged in the track groove, a material distribution mechanism is arranged on the workbench, and a material distribution disc is arranged through the material distribution mechanism;

[0007] The track groove is composed of a first elliptical groove, a first circular groove, a second elliptical groove and a second circular groove of the same width, the first circular groove and the second circular groove are symmetrically distributed, and the centers of the first circular groove and the second circular groove are located on the same central axis as the center of the disk, the first elliptical groove and the second elliptical groove are symmetrically distributed, the first elliptical groove, the first circular groove, the second elliptical groove and the second circular groove are connected end to end, and each intersection adopts a smooth transition;

[0008] The workbench is provided with a second belt conveyor for conveying packaged chips.

[0009] As a preferred technical solution of the present invention, the discharging mechanism includes a first servo motor fixedly mounted on a mounting plate, a rotating shaft is rotatably mounted on the mounting plate, and one end of the rotating shaft is fixedly connected to the output end of the first servo motor, and the other end of the rotating shaft is fixedly connected to the disc, a rotating handle is fixedly mounted on the mounting plate, and a connecting rod is fixedly mounted on the rotating handle, an end of the connecting rod away from the rotating handle is rotatably connected to the sliding disc, and the sliding disc cooperates to slide in the track groove, a first guide groove is provided at one end of the rotating handle close to the material distribution disc, a clamping column is slidably mounted in the first guide groove, and a connecting block is fixedly mounted on the clamping column, a plurality of sliding rods are fixedly mounted on the connecting block, and the same substrate is fixedly mounted on the bottom ends of the plurality of sliding rods, a pneumatic clamping unit is provided on the substrate, and a moving unit for driving the substrate to move laterally is provided on the mounting plate.

[0010] As a preferred technical solution of the present invention, the moving unit includes two mounting bases fixedly mounted on a mounting plate, and two guide rods are slidably mounted between the two mounting bases, one end of the two guide rods is fixedly mounted with the same limit plate, the other end of the two guide rods is fixedly mounted with the same fixed plate, a linkage rod is rotatably mounted on the mounting plate, the two guide rods are fixedly mounted with the same driving plate, and the driving plate is located between the two mounting bases, a pin rod is fixedly mounted on the driving plate, and a second guide groove for cooperating with the pin rod is provided at one end of the linkage rod close to the pin rod, the pin rod slides in the second guide groove, a fan-shaped cam is fixedly mounted on the rotating shaft, the fan cam is in contact with the linkage rod, and the fixed plate slides on the outer surface of a plurality of sliding rods.

[0011] As a preferred technical solution of the present invention, a damping spring is fixedly installed between the driving plate and one of the mounting bases.

[0012] As a preferred technical solution of the present invention, a limiting disk is fixedly mounted on one end of the clamping column away from the connecting block.

[0013] As a preferred technical solution of the present invention, the pneumatic clamping unit includes a cylinder fixedly installed in a base plate, a push plate fixedly installed at the output end of the cylinder, hinged rods are hinged on both sides of the push plate, the two hinged rods are symmetrically distributed, and a clamping claw for clamping the packaged chip is hinged at one end of the hinged rod away from the push plate on the same side.

[0014] As a preferred technical solution of the present invention, a guide rod is fixedly installed in the cavity of the substrate, and the two clamping claws slide on the outer surface of the guide rod.

[0015] As a preferred technical solution of the present invention, the material dividing mechanism includes a second servo motor fixedly mounted on the lower surface of the workbench, the material dividing plate is rotatably mounted on the workbench and fixedly connected to the output end of the second servo motor, a plurality of material storage troughs are provided on the material dividing plate, and the plurality of material storage troughs are distributed in a circular and uniform array, and each of the material storage troughs is provided with a first claw opening for cooperating with a clamp.

[0016] As a preferred technical solution of the present invention, guide plates are provided on both sides of the first belt conveyor, and a material guiding channel for the packaged chips to pass through is formed between the two guide plates.

[0017] As a preferred technical solution of the present invention, a support plate used in conjunction with a material distribution plate is fixedly installed on the workbench, a rib for limiting the packaged chip is fixedly installed on the support plate, a feed port is provided on the rib directly opposite the material guide channel, a second claw opening used in conjunction with the first claw opening is provided on the rib directly below the clamp, and the width of the feed port is equal to the width of the material guide channel and is adapted to the size of the packaged chip.

[0018] The beneficial effects of the present invention are:

[0019] 1. This semiconductor packaged chip discharge device, by setting a discharge mechanism, a first servo motor drives the rotating shaft and the disc to rotate, the rotation of the disc drives the sliding disc to move relatively in the track groove, when the sliding disc moves in the front half of the first elliptical slide groove, it will drive the substrate and the pneumatic clamping unit arranged on the substrate to follow and move downward, and perform a clamping operation on the chip placed on the distribution plate, when the sliding disc moves to the second half of the first elliptical slide groove, it drives the packaged chip clamped by the pneumatic clamping unit to move upward, and takes the packaged chip out of the distribution plate, which will not cause agitation to the packaged chip, reduces the damage of the packaged chip during transportation, is simple to operate, and is easy to use.

[0020] 2. This type of semiconductor packaged chip discharge device, by setting a pneumatic clamping unit and a moving unit, when the sliding plate is in the second elliptical slide groove, in the front half of the second elliptical slide groove, the sliding plate drives the pneumatic clamping unit to move downward and releases the clamping and fixation of the packaged chip through the pneumatic clamping unit, so that the packaged chips can be placed on the second belt conveyor in an orderly manner. In the second half of the second elliptical slide groove, the sliding plate will drive the pneumatic clamping unit to move upward, thereby realizing the taking and placing operations of the packaged chips.

[0021] 3. This type of semiconductor packaging chip discharge device, by setting a moving unit and a track groove, when the sliding disk moves to the first annular slide groove in the track groove, the fan cam follows the rotation of the disk so that one side of the fan cam contacts the linkage rod and gradually pushes the linkage rod as the linkage rod rotates, causing the linkage rod to rotate. The rotation of the linkage rod drives the driving plate to move horizontally under the cooperation of the second guide groove and the pin rod, thereby transferring the packaged chips clamped by the pneumatic clamping unit from the material distribution disk to the top of the second belt conveyor in an orderly manner, so that the packaged chips can be arranged in an orderly manner on the second belt conveyor at intervals laterally.

[0022] 4. This semiconductor packaged chip discharge device, by setting a moving unit and a track groove, when the sliding disk moves to the second elliptical slide groove in the track groove, the fan surface of the fan cam fits with the linkage rod, so that the fan cam will not drive the linkage rod to move during the rotation process, so that the pneumatic clamping unit can stably and accurately place the packaged chips on the second belt conveyor at orderly intervals, which is convenient for subsequent inspection, packaging and other operations of the packaged chips; when the sliding disk moves to the second annular slide groove in the track groove, the fan cam follows the rotation of the disk so that the other side of the fan cam gradually breaks away from contact with the linkage rod, and the drive plate drives the drive plate to reset under the elastic action of the damping spring, so that the pneumatic clamping unit can be reset to facilitate the next material picking operation, with a simple structure and easy use.

[0023] 5. This semiconductor packaged chip discharge device is provided with a pneumatic clamping unit. The contraction of the cylinder drives the push plate to move upward. The upward movement of the push plate drives the clamping claws on both sides to approach each other through the hinged rods on both sides, so that the packaged chip between the two clamping claws can be clamped and fixed. Conversely, the push plate is driven downward by the extension and contraction of the cylinder, which can drive the two clamping claws away from each other to release the clamping of the packaged chip.

[0024] 6. This type of semiconductor packaged chip discharge device, by setting up a material dividing mechanism, the second servo motor drives the material dividing plate to rotate, and the rotation of the material dividing plate drives the packaged chips placed in the storage tank to follow the movement, and the packaged chips are transported to the bottom of the clamping claws, and the packaged chips are evenly loaded to ensure the continuity of the packaging chip loading operation, thereby improving the transportation efficiency of the packaged chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0026] Figure 1 It is a schematic diagram of the overall structure of a semiconductor packaging chip discharge device of the present invention;

[0027] Figure 2 It is a schematic structural diagram of a discharge mechanism of a semiconductor packaging chip discharge device of the present invention;

[0028] Figure 3 It is a schematic diagram of the fan-shaped cam structure of a semiconductor packaging chip discharge device of the present invention;

[0029] Figure 4 It is a schematic structural diagram of a moving unit of a semiconductor packaging chip discharge device of the present invention;

[0030] Figure 5 The present invention is a semiconductor packaging chip discharge device Figure 4 A schematic diagram of the structure enlargement in the middle;

[0031] Figure 6 It is a schematic diagram of the track groove structure of a semiconductor packaging chip discharge device of the present invention;

[0032] Figure 7 It is a front view of the track groove structure of a semiconductor packaging chip discharge device of the present invention;

[0033] Figure 8 It is a schematic diagram of the structure of a first servo motor of a semiconductor packaging chip discharge device of the present invention;

[0034] Fig. 9 It is a schematic diagram of the structure of a pneumatic clamping unit of a semiconductor packaging chip discharge device of the present invention;

[0035] Fig.10 It is a structural schematic diagram of a material distribution mechanism of a semiconductor packaging chip discharging device of the present invention;

[0036] Fig.11 The present invention is a schematic diagram of the structure of a material distribution plate of a semiconductor packaging chip discharging device.

[0037] In the figure: 1, workbench; 2, first belt conveyor; 3, mounting plate; 4, discharge mechanism; 41, disc; 42, track groove; 421, first elliptical slide groove; 422, first annular slide groove; 423, second elliptical slide groove; 424, second annular slide groove; 43, first servo motor; 44, rotating shaft; 45, rotary handle; 46, connecting rod; 47, sliding disc; 48, first guide groove; 49, clamping column; 410, connecting block; 411, sliding rod; 412, base plate; 413, pneumatic clamping unit; 4131, cylinder; 4132, push plate; 4133, hinged rod; 4134, clamp Claw; 4135, guide rod; 414, moving unit; 4141, mounting base; 4142, guide rod; 4143, limit plate; 4144, fixing plate; 4145, linkage rod; 4146, driving plate; 4147, pin rod; 4148, second guide groove; 4149, fan-shaped cam; 415, limit plate; 416, damping spring; 5, material distribution mechanism; 51, material distribution plate; 52, second servo motor; 53, material storage trough; 54, first claw mouth; 55, support plate; 56, retaining edge; 57, feed port; 58, second claw mouth; 6, second belt conveyor; 7, guide plate; 8, material guide channel. DETAILED DESCRIPTION

[0038] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0039] Example: Figure 1-11 As shown, a semiconductor package chip discharge device of the present invention comprises a workbench 1 and a first belt conveyor 2 arranged on the workbench 1 for loading packaged chips, a mounting plate 3 is fixedly mounted on the workbench 1, a discharge mechanism 4 for discharging packaged chips is arranged on the mounting plate 3, and a disc 41 is arranged through the discharge mechanism 4, a track groove 42 is opened on the disc 41, and a sliding disc 47 is arranged on the track groove 42, a material distribution mechanism 5 is arranged on the workbench 1, and a material distribution disc 51 is arranged through the material distribution mechanism 5; the track groove 42 consists of a first elliptical slide groove 421, a first circular slide groove 422, and a second elliptical slide groove 421 of the same width. The first annular chute 422 and the second annular chute 424 are symmetrically distributed, and the centers of the first annular chute 422 and the second annular chute 424 are located on the same central axis as the center of the disk 41; the first elliptical chute 421 and the second elliptical chute 423 are symmetrically distributed, and the first elliptical chute 421, the first annular chute 422, the second elliptical chute 423 and the second annular chute 424 are connected end to end and smooth transition is adopted at each intersection; a second belt conveyor 6 for conveying packaged chips is provided on the workbench 1.

[0040] In detail, the discharging mechanism 4 drives the disc 41 to rotate, and the rotation of the disc 41 drives the sliding disc 47 to move relatively in the track groove 42. As the disc 41 rotates, when the sliding disc 47 is located in the first annular groove 422 or the second annular groove 424 in the track groove 42, since the center of the first annular groove 422 and the center of the second annular groove 424 are both located on the same central axis as the center of the disc 41, when the sliding disc 47 moves in the first annular groove 422 and the second annular groove 424, the distance between the center of the sliding disc 47 and the center of the disc 41 remains unchanged. At this time, the position of the sliding disc 47 does not change. When the sliding disc 47 is located in the first annular groove 422 or the second annular groove 424 in the track groove 42, When the sliding disk 47 is in the first elliptical groove 421 or the second elliptical groove 423, the distance between the center of the sliding disk 47 and the center of the disk 41 will change with the rotation of the disk 41, thereby driving the sliding disk 47 to move up and down. Specifically, when the sliding disk 47 moves in the front half of the first elliptical groove 421 or the front half of the second elliptical groove 423, the distance between the center of the sliding disk 47 and the center of the disk 41 gradually increases, thereby driving the sliding disk 47 to move downward. When moving in the rear half of the first elliptical groove 421 or the rear half of the second elliptical groove 423, the distance between the center of the sliding disk 47 and the center of the disk 41 gradually decreases, thereby driving the sliding disk 47 to move upward from the lowest point.

[0041] Further, such as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 and Fig. 9 As shown, the discharging mechanism 4 includes a first servo motor 43 fixedly mounted on the mounting plate 3, a rotating shaft 44 is rotatably mounted on the mounting plate 3, and one end of the rotating shaft 44 is fixedly connected to the output end of the first servo motor 43, and the other end of the rotating shaft 44 is fixedly connected to the disc 41, a rotating handle 45 is fixedly mounted on the mounting plate 3, and a connecting rod 46 is fixedly mounted on the rotating handle 45, and one end of the connecting rod 46 away from the rotating handle 45 is rotatably connected to the sliding disc 47, and the sliding disc 47 cooperates to slide on the track In the track groove 42, a first guide groove 48 is opened at one end of the rotary handle 45 close to the material distribution plate 51, a clamping column 49 is slidably installed in the first guide groove 48, and a connecting block 410 is fixedly installed on the clamping column 49, a plurality of sliding rods 411 are fixedly installed on the connecting block 410, and the bottom ends of the plurality of sliding rods 411 are fixedly installed with the same base plate 412, a pneumatic clamping unit 413 is arranged on the base plate 412, and a moving unit 414 for driving the base plate 412 to move horizontally is arranged on the mounting plate 3.

[0042] In detail, the first servo motor 43 drives the rotating shaft 44 and the disk 41 to rotate, and the rotation of the disk 41 drives the sliding disk 47 to move relatively in the track groove 42. When the sliding disk 47 moves in the front half of the first elliptical slide groove 421, the rotation of the disk 41 drives the sliding disk 47 to move downward. When the sliding disk 47 moves downward, it will drive the rotary handle 45 to rotate through the connecting rod 46. The rotation of the rotary handle 45 drives the connecting block 410 to move downward under the cooperation of the first guide groove 48 and the clamping column 49, and then drives the base plate 412 and the pneumatic clamping unit 413 arranged on the base plate 412 to follow the downward movement, and clamps the chip placed on the distribution plate 51. When the sliding plate 47 moves to the second half of the first elliptical slide groove 421, it will drive the sliding plate 47 to move upward, and then drive the packaged chip clamped by the pneumatic clamping unit 413 to move upward, and take the packaged chip out of the distribution plate 51 without causing agitation to the packaged chip, thereby reducing the damage of the packaged chip during the transportation process. The operation is simple and convenient to use.

[0043] When the sliding plate 47 moves into the first annular slide groove 422, the sliding plate 47 does not move up and down, and the moving unit 414 drives the substrate 412 to move, thereby moving the packaged chip clamped and fixed by the pneumatic clamping unit 413 from above the material distribution plate 51 to above the second belt conveyor 6;

[0044] When the sliding plate 47 moves into the second elliptical slot 423 in sequence, in the first half of the second elliptical slot 423, the sliding plate 47 moves downward with the rotation of the disc 41, thereby driving the pneumatic clamping unit 413 to move downward and release the clamping and fixing of the packaged chip through the pneumatic clamping unit 413, placing the packaged chip on the second belt conveyor 6, and in the second half of the second elliptical slot 423, the sliding plate 47 moves upward with the rotation of the disc 41, thereby driving the pneumatic clamping unit 413 to move upward;

[0045] When the sliding plate 47 moves into the second annular slide groove 424, the sliding plate 47 does not move up and down, and the moving unit 414 drives the substrate 412 and the pneumatic clamping unit 413 to move, and moves the pneumatic clamping unit 413 from above the second belt conveyor 6 to above the material distribution plate 51, so as to facilitate the next pick-up and placement operation of the packaged chip;

[0046] Therefore, as the disc 41 rotates, the pneumatic clamping unit 413 can be driven to repeatedly perform packaged chip clamping and extraction, packaged chip transfer, packaged chip placement and pneumatic clamping unit 413 resetting operations. The packaged chips clamped by the pneumatic clamping unit 413 can be intermittently and orderly transferred from the distribution disc 51 to the second belt conveyor 6, so that the packaged chips are arranged in an orderly manner on the second belt conveyor 6, which is convenient for subsequent inspection, packaging and other operations on the packaged chips, and the packaged chips will not be stirred, thereby reducing damage to the packaged chips during transportation. The operation is simple and easy to use.

[0047] Further, such as Figure 2 , Figure 3 , Figure 4 and Figure 8 As shown, the mobile unit 414 includes two mounting bases 4141 fixedly mounted on the mounting plate 3, and two guide rods 4142 are slidably mounted between the two mounting bases 4141, one end of the two guide rods 4142 is fixedly mounted with a same limit plate 4143, and the other end of the two guide rods 4142 is fixedly mounted with a same fixed plate 4144, a linkage rod 4145 is rotatably mounted on the mounting plate 3, and the two guide rods 4142 are fixedly mounted with a same driving plate 4146, and the driving plate 4146 is located between the two mounting bases 4141. A pin rod 4147 is fixedly mounted on the driving plate 4146, and a second guide groove 4148 is provided at one end of the linkage rod 4145 close to the pin rod 4147 for cooperating with the pin rod 4147. The pin rod 4147 slides in the second guide groove 4148, and a fan-shaped cam 4149 is fixedly mounted on the rotating shaft 44. The fan-shaped cam 4149 is in fit with the linkage rod 4145. The fixed plate 4144 slides on the outer surfaces of several sliding rods 411, and a damping spring 416 is fixedly mounted between the driving plate 4146 and one of the mounting bases 4141.

[0048] In detail, the rotating shaft 44 drives the disc 41 to rotate and drives the sector cam 4149 to rotate synchronously. As the disc 41 rotates, when the sliding disc 47 moves to the first elliptical slide groove 421 in the track groove 42, during this process, the linkage rod 4145 is out of contact with the sector cam 4149, so that the sector cam 4149 will not drive the linkage rod 4145 to move in the process of following the rotation of the disc 41, so that the positions of the substrate 412 and the pneumatic clamping unit 413 will not be affected by the rotation of the sector cam 4149, thereby ensuring that the pneumatic clamping unit 413 can smoothly and accurately clamp and take the packaged chip;

[0049] When the sliding plate 47 moves to the first annular slide groove 422 in the track groove 42, the fan-shaped cam 4149 rotates with the disc 41 so that one side of the fan-shaped cam 4149 contacts the linkage rod 4145 and gradually pushes the linkage rod 4145 as the linkage rod 4145 rotates, so that the linkage rod 4145 rotates, and the linkage rod 4145 rotates, and the driving plate 4146 moves horizontally under the cooperation of the second guide groove 4148 and the pin rod 4147. The driving plate 4146 moves horizontally through the guide rod 4142, and drives the fixing plate 4144 to move horizontally under the cooperation of the first guide groove 48, and drives the substrate 412 and the pneumatic clamping unit 413 to move horizontally, so that the packaged chips clamped by the pneumatic clamping unit 413 are orderly transferred from the material distribution plate 51 to the top of the second belt conveyor 6;

[0050] When the sliding plate 47 moves to the second elliptical sliding groove 423 in the track groove 42, the fan-shaped surface of the fan-shaped cam 4149 fits with the linkage rod 4145, so that the fan-shaped cam 4149 will not drive the linkage rod 4145 to move during the rotation process, thereby ensuring the stability of the lateral position of the substrate 412 and the pneumatic clamping unit 413, so that the pneumatic clamping unit 413 can stably and accurately place the packaged chip on the second belt conveyor 6, which is convenient for subsequent inspection, packaging and other operations of the packaged chip. The structure is simple and easy to use.

[0051] When the sliding disk 47 moves to the second annular slide groove 424 in the track groove 42, the fan cam 4149 rotates with the disk 41 so that the other side of the fan cam 4149 gradually disengages from the linkage rod 4145, and the driving plate 4146 drives the driving plate 4146 and the fixed plate 4144 to reset under the elastic action of the damping spring 416, thereby resetting the pneumatic clamping unit 413 to facilitate the next material picking operation. The structure is simple and easy to use.

[0052] Among them, Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, a limiting plate 415 is fixedly installed on one end of the clamping column 49 away from the connecting block 410 . The limiting plate 415 can prevent the clamping column 49 from being separated from the first guide groove 48 .

[0053] Among them, Figure 2 , Figure 8 and Fig. 9 As shown, the pneumatic clamping unit 413 includes a cylinder 4131 fixedly installed in the base plate 412, and a push plate 4132 is fixedly installed at the output end of the cylinder 4131. Both sides of the push plate 4132 are hinged with hinged rods 4133, and the two hinged rods 4133 are symmetrically distributed. The end of the hinged rod 4133 away from the push plate 4132 on the same side is hinged with a clamping claw 4134 for clamping the packaged chip.

[0054] Specifically, the push plate 4132 is driven upward by the contraction of the cylinder 4131, and the upward movement of the push plate 4132 drives the clamping claws 4134 on both sides to approach each other through the hinged rods 4133 on both sides, so that the packaged chip between the two clamping claws 4134 can be clamped and fixed. Conversely, the push plate 4132 is driven downward by the extension and contraction of the cylinder 4131, which can drive the two clamping claws 4134 away from each other to release the clamping of the packaged chip.

[0055] Further, such as Fig. 9 As shown, a guide rod 4135 is fixedly installed in the cavity of the base plate 412, and the two clamping jaws 4134 slide on the outer surface of the guide rod 4135. By setting the guide rod 4135, the movement of the clamping jaws 4134 can be guided and limited to ensure the stability of the clamping jaws 4134 during the movement.

[0056] Among them, Figure 1 , Fig.10 and Fig.11 As shown, the material dividing mechanism 5 includes a second servo motor 52 fixedly mounted on the lower surface of the workbench 1, a material dividing plate 51 is rotatably mounted on the workbench 1 and fixedly connected to the output end of the second servo motor 52, a plurality of material storage slots 53 are provided on the material dividing plate 51, and the plurality of material storage slots 53 are evenly distributed in a circular array, and each material storage slot 53 is provided with a first claw opening 54 used to cooperate with the clamping jaw 4134, and the second servo motor 52 drives the material dividing plate 51 to rotate, and the rotation of the material dividing plate 51 drives the packaged chips placed in the material storage slot 53 to follow the movement, and the packaged chips are transported to the bottom of the clamping jaw 4134, and the packaged chips are evenly loaded, thereby ensuring the continuity of the loading operation of the packaged chips, thereby improving the transportation and transfer efficiency of the packaged chips.

[0057] Among them, Figure 1 As shown, guide plates 7 are provided on both sides of the first belt conveyor 2, and a material guide channel 8 for the packaged chips to pass through is formed between the two guide plates 7. The material guide plates are provided to facilitate guiding the packaged chips on the first belt conveyor 2 so that the packaged chips can accurately enter the material guide channel 8.

[0058] Among them, Fig.10 and Fig.11As shown, a support plate 55 used in conjunction with a material distribution plate 51 is fixedly installed on the workbench 1, and a rib 56 for limiting the packaged chip is fixedly installed on the support plate 55. A feed port 57 is provided on the rib 56 directly opposite to the material guide channel 8, and a second claw opening 58 used in conjunction with the first claw opening 54 is provided on the rib 56 directly below the clamp 4134. The width of the feed port 57 is equal to the width of the material guide channel 8 and is adapted to the size of the packaged chip. By setting the rib 56, the packaged chip can be limited when the distribution plate 51 rotates and drives the packaged chip to rotate, so as to prevent the packaged chip from falling off the distribution plate 51 during the rotation. By setting the feed port 57, it is convenient for the packaged chip to enter the material storage slot 53 on the distribution plate 51 from the material guide channel 8. The second claw opening 58 and the first claw opening 54 are used in conjunction with each other, so that the clamp 4134 can clamp and take the packaged chip. The structure is simple and easy to use.

[0059] During operation, the packaged chips to be transported are placed on the first belt conveyor 2, and the first belt conveyor 2 transports the packaged chips to the storage tank 53 on the material distribution plate 51 through the material guide channel 8. The second servo motor 52 drives the material distribution plate 51 to rotate, and the rotation of the material distribution plate 51 drives the packaged chips placed in the storage tank 53 to follow the movement, and the packaged chips are transported to the bottom of the clamping claw 4134, and the packaged chips are evenly loaded. At the same time, the first servo motor 43 drives the rotating shaft 44 and the disc 41 to rotate, and the rotation of the disc 41 drives the sliding plate 47 to move relatively in the track groove 42;

[0060] When the sliding plate 47 moves in the first half of the first elliptical slide groove 421, the disc 41 rotates to drive the sliding plate 47 to move downward. When the sliding plate 47 moves downward, it drives the handle 45 to rotate through the connecting rod 46. The handle 45 rotates under the cooperation of the first guide groove 48 and the clamping column 49, drives the connecting block 410 to move downward, and then drives the base plate 412 to follow the downward movement, so that the two clamping claws 4134 are respectively inserted into the first claw opening 54 and the second claw opening 58, and then the contraction of the control cylinder 4131 drives the push plate 4132 to move upward. The push plate 4132 moves upward and drives the clamping claws 4134 on both sides to approach each other through the hinge rods 4133 on both sides, so that the packaged chip between the two clamping claws 4134 can be clamped and fixed. When the sliding plate 47 moves in the second half of the first elliptical slide groove 421, it drives the sliding plate 47 to move upward, and then drives the packaged chip clamped by the clamping claws 4134 to move upward, and the packaged chip is taken out from the material distribution plate 51 without causing agitation to the packaged chip, thereby reducing the damage of the packaged chip during the transportation process. The operation is simple and convenient to use.

[0061] The rotating shaft 44 drives the disc 41 to rotate and drives the sector cam 4149 to rotate synchronously. As the disc 41 rotates, the sliding disc 47 moves to the first elliptical slide groove 421 in the track groove 42. During this process, the linkage rod 4145 is out of contact with the sector cam 4149, so that the sector cam 4149 does not drive the linkage rod 4145 to move in the process of following the rotation of the disc 41, so that the positions of the substrate 412 and the pneumatic clamping unit 413 are not affected by the rotation of the sector cam 4149, thereby ensuring that the pneumatic clamping unit 413 can smoothly and accurately clamp the packaged chip.

[0062] When the sliding plate 47 moves into the first annular sliding groove 422 in sequence, the sector cam 4149 rotates with the disc 41 so that one side of the sector cam 4149 contacts the linkage rod 4145 and gradually pushes the linkage rod 4145 as the linkage rod 4145 rotates, so that the linkage rod 4145 rotates. The linkage rod 4145 rotates and drives the driving plate 4146 to move horizontally under the cooperation of the second guide groove 4148 and the pin rod 4147. The driving plate 4146 moves horizontally through the guide rod 4142 to drive the fixing plate 4144 to move, thereby driving the substrate 412 and the pneumatic clamping unit 413 to move horizontally, and the packaged chips clamped by the pneumatic clamping unit 413 are orderly transferred from the material distribution plate 51 to the top of the second belt conveyor 6.

[0063] When the sliding plate 47 moves into the second elliptical slot 423 in sequence, in the front half of the second elliptical slot 423, the sliding plate 47 moves downward with the rotation of the disc 41, thereby driving the clamping claw 4134 to move downward and driving the push plate 4132 to move downward through the extension and contraction of the cylinder 4131, thereby driving the two clamping claws 4134 to move away from each other to release the clamping and fixing of the packaged chip, and placing the packaged chip on the second belt conveyor 6. In the rear half of the second elliptical slot 423, the sliding plate 47 rotates with the disc 41 The fan-shaped cam 4149 moves upward, thereby driving the clamping jaw 4134 to move upward. During this process, the fan-shaped surface of the fan-shaped cam 4149 fits with the linkage rod 4145, so that the fan-shaped cam 4149 will not drive the linkage rod 4145 to move during the rotation process, thereby ensuring the stability of the lateral position of the substrate 412 and the clamping jaw 4134, so that the clamping jaw 4134 can stably and accurately place the packaged chip on the second belt conveyor 6, which is convenient for subsequent testing, packaging and other operations of the packaged chip. The structure is simple and easy to use.

[0064] When the sliding disk 47 moves sequentially to the second annular groove 424 in the track groove 42, the fan cam 4149 follows the rotation of the disk 41 so that the other side of the fan cam 4149 gradually disengages from the linkage rod 4145, and the driving plate 4146 drives the driving plate 4146 and the fixed plate 4144 to reset under the elastic action of the damping spring 416, thereby resetting the clamping jaw 4134 and preparing for the next operation.

[0065] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor package chip discharge device, comprising a workbench (1) and a first belt conveyor (2) arranged on the workbench (1) for loading packaged chips, characterized in that: A mounting plate (3) is fixedly mounted on the workbench (1); a discharge mechanism (4) for discharging packaged chips is provided on the mounting plate (3); a disc (41) is provided via the discharge mechanism (4); a track groove (42) is provided on the disc (41); a sliding disc (47) is provided in the track groove (42); a material distribution mechanism (5) is provided on the workbench (1); and a material distribution disc (51) is provided via the material distribution mechanism (5); The track groove (42) is composed of a first elliptical groove (421), a first circular groove (422), a second elliptical groove (423) and a second circular groove (424) of the same width, the first circular groove (422) and the second circular groove (424) are symmetrically distributed, and the centers of the first circular groove (422) and the second circular groove (424) are located on the same central axis as the center of the disk (41), the first elliptical groove (421) and the second elliptical groove (423) are symmetrically distributed, the first elliptical groove (421), the first circular groove (422), the second elliptical groove (423) and the second circular groove (424) are connected end to end, and each intersection adopts a smooth transition; The discharging mechanism (4) comprises a first servo motor (43) fixedly mounted on a mounting plate (3); a rotating shaft (44) is rotatably mounted on the mounting plate (3); one end of the rotating shaft (44) is fixedly connected to an output end of the first servo motor (43); the other end of the rotating shaft (44) is fixedly connected to a disc (41); a rotating handle (45) is fixedly mounted on the mounting plate (3); a connecting rod (46) is fixedly mounted on the rotating handle (45); an end of the connecting rod (46) away from the rotating handle (45) is rotatably connected to a sliding disc (47); and the sliding disc (47) cooperates to slide on the rotating handle (45). In the track groove (42), a first guide groove (48) is provided at one end of the rotary handle (45) close to the material distribution plate (51), a clamping column (49) is slidably mounted in the first guide groove (48), and a connecting block (410) is fixedly mounted on the clamping column (49), a plurality of sliding rods (411) are fixedly mounted on the connecting block (410), a same base plate (412) is fixedly mounted at the bottom ends of the plurality of sliding rods (411), a pneumatic clamping unit (413) is provided on the base plate (412), and a moving unit (414) for driving the base plate (412) to move horizontally is provided on the mounting plate (3); The workbench (1) is provided with a second belt conveyor (6) for conveying packaged chips.

2. A semiconductor package chip discharge device according to claim 1, characterized in that: The mobile unit (414) comprises two mounting bases (4141) fixedly mounted on the mounting plate (3), and two guide rods (4142) are slidably mounted between the two mounting bases (4141), one end of the two guide rods (4142) is fixedly mounted with a same limit plate (4143), and the other ends of the two guide rods (4142) are fixedly mounted with a same fixed plate (4144), a linkage rod (4145) is rotatably mounted on the mounting plate (3), and the two guide rods (4142) are fixedly mounted with a same drive plate (4146), and the drive plate (4146) Located between two mounting bases (4141), a pin rod (4147) is fixedly mounted on the driving plate (4146), a second guide groove (4148) for matching with the pin rod (4147) is formed at one end of the linkage rod (4145) close to the pin rod (4147), the pin rod (4147) slides in the second guide groove (4148), a sector cam (4149) is fixedly mounted on the rotating shaft (44), the sector cam (4149) is in contact with the linkage rod (4145), and the fixed plate (4144) slides on the outer surfaces of a plurality of slide rods (411).

3. A semiconductor package chip discharge device according to claim 2, characterized in that: A damping spring (416) is fixedly mounted between the driving plate (4146) and one of the mounting bases (4141).

4. The semiconductor package chip discharge device according to claim 1, characterized in that: A limiting disk (415) is fixedly mounted on one end of the clamping column (49) away from the connecting block (410).

5. The semiconductor package chip discharge device according to claim 1, characterized in that: The pneumatic clamping unit (413) comprises a cylinder (4131) fixedly mounted in a base plate (412); a push plate (4132) is fixedly mounted on the output end of the cylinder (4131); hinged rods (4133) are hinged on both sides of the push plate (4132); the two hinged rods (4133) are symmetrically distributed; and a clamping claw (4134) for clamping a packaged chip is hinged on one end of the hinged rod (4133) away from the push plate (4132) on the same side.

6. The semiconductor package chip discharge device according to claim 5, characterized in that: A guide rod (4135) is fixedly installed in the cavity of the base plate (412), and the two clamping claws (4134) both slide on the outer surface of the guide rod (4135).

7. The semiconductor package chip discharge device according to claim 6, characterized in that: The material distribution mechanism (5) comprises a second servo motor (52) fixedly mounted on the lower surface of the workbench (1); the material distribution plate (51) is rotatably mounted on the workbench (1) and fixedly connected to the output end of the second servo motor (52); a plurality of material storage troughs (53) are provided on the material distribution plate (51); the plurality of material storage troughs (53) are evenly distributed in a circular array; each of the material storage troughs (53) is provided with a first jaw opening (54) for use with a clamping jaw (4134).

8. The semiconductor package chip discharge device according to claim 7, characterized in that: Guide plates (7) are provided on both sides of the first belt conveyor (2), and a material guide channel (8) for the packaged chips to pass through is formed between the two guide plates (7).

9. The semiconductor package chip discharge device according to claim 8, characterized in that: A support plate (55) for use with a material distribution plate (51) is fixedly mounted on the workbench (1); a retaining edge (56) for limiting the position of the packaged chip is fixedly mounted on the support plate (55); a feed opening (57) is provided on the retaining edge (56) directly opposite the material guide channel (8); a second claw opening (58) for use with the first claw opening (54) is provided on the retaining edge (56) directly below the clamping claw (4134); the width of the feed opening (57) is equal to the width of the material guide channel (8) and is adapted to the size of the packaged chip.

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