A thermal management method and system for IGBT module

Abstract

The invention discloses a thermal management method and system for an IGBT module, and relates to the technical field of IGBT modules. The thermal management system of the IGBT module comprises an equipment frame, an IGBT module body is fixedly installed inside the equipment frame, heat dissipation fins are fixedly installed inside the equipment frame, a temperature detector is fixedly installed on the surface of the heat dissipation fins, and further comprises: a heat dissipation device, the heat dissipation device comprises an air inlet pipe, a heat dissipation fan, a guide pipe, a fixing plate, a receiving rod, a protrusion, a filter plate and a vibration block, the air inlet pipe is fixedly penetrated through the inner and outer walls of the equipment frame, the thermal management system of the IGBT module passes through the gaps between the heat dissipation fins one by one through the guide pipe, so as to improve the heat dissipation effect on the IGBT module body, and drives the filter plate to vibrate under the action of the vibration block and the protrusion, so as to effectively shake off foreign matter and impurities accumulated on the surface of the filter plate, so as to avoid the foreign matter and impurities being accumulated on the surface for a long time and affecting the heat dissipation effect on the IGBT module body.

Description

Technical Field

[0001] The present invention relates to the technical field of IGBT modules, and in particular to a thermal management method and system for an IGBT module. Background Art

[0002] IGBT modules are usually composed of multiple IGBT chips, each of which is composed of multiple PNP and NPN transistors in series. These transistors are controlled by metal-oxide-semiconductor field-effect transistors (MOSFETs). IGBT modules generate a lot of heat in high-power and high-current applications, so effective heat dissipation is one of the key factors to ensure stable operation and extend the life of the module.

[0003] The patent with patent announcement number CN115295514B relates to an IGBT module heat dissipation component, including an IGBT module; a shell for installing the IGBT module, the IGBT module is movably installed in the shell, the bottom of the shell is buckled with a bottom plate, and a heat dissipation component is arranged in the shell, the horizontal block fixedly connected on the extruded triangular stopper rotates with the axis of its rotation connection as the axis, when the triangular stopper passes through the node of the insulating double-section column, the triangular stopper loses the limit of the insulating double-section column and rotates to the initial position under the action of the torsion spring and is stuck in the node, thereby limiting and fixing the insulating double-section column, thereby fixing the IGBT module fixedly connected to the lower end of the insulating double-section column, in addition to being fixedly connected to the insulating double-section column and the insulating rod, the fixed IGBT module itself is suspended, thereby effectively facilitating heat dissipation in various areas of the IGBT module, preventing heat concentration in a dead corner of a contact surface of a traditional IGBT module, and facilitating the installation of the device.

[0004] In the above patent, the fixed IGBT module is suspended in addition to being fixedly connected to the insulating double-section column and the insulating rod, so that it can effectively facilitate the heat dissipation of various areas of the IGBT module. However, during the heat dissipation process, too much foreign matter and impurities will accumulate on the surface of the vent, thereby affecting the flow of air and affecting the heat dissipation, making it difficult to discharge the heat in time. Therefore, a thermal management method and system for an IGBT module with better heat dissipation effect is designed. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention provides a thermal management method and system for an IGBT module, which solves the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: a thermal management system for an IGBT module, comprising an equipment frame, an IGBT module body is fixedly installed inside the equipment frame, heat sink fins are fixedly installed inside the equipment frame, a temperature detector is fixedly installed on the surface of the heat sink fins, and also comprises: a heat sink, the heat sink comprises an air inlet pipe, a heat dissipation fan, a guide pipe, a fixing plate, a receiving rod, a convex block, a filter plate and a vibration block, the heat sink fins can quickly discharge the emitted heat under the action of the guide pipe, thereby improving the heat dissipation effect of the IGBT module body and avoiding local temperature overheating. The air inlet duct is fixedly installed through the inner and outer walls of the equipment frame, the cooling fan is fixedly installed on the inner wall of the air inlet duct, the guide duct is fixedly installed through the inner and outer walls of the air inlet duct, the fixed plate is fixedly installed on the inner wall of the air inlet duct, the receiving rod slides through the left and right walls of the fixed plate, the protrusion is fixedly installed on the output end of the cooling fan, the filter plate 1 is slidably installed on the inner wall of the air inlet duct, the vibration block is fixedly installed on the side of the filter plate 1 close to the cooling fan, the end of the receiving rod close to the filter plate 1 is fixedly connected to the filter plate 1, the output end of the cooling fan rotates to drive the protrusion to rotate, the protrusion rotates to contact the vibration block and generates vibration.

[0007] According to the above technical solution, an air outlet is provided on the surface of the equipment frame, a breathable plate is fixedly installed inside the air outlet, a detection module and a control module are arranged inside the temperature detector, and the control module is electrically connected to the cooling fan. When the detection module inside the temperature detector detects that the temperature on the surface of the cooling fin exceeds the threshold value.

[0008] According to the above technical solution, a spring is arranged between the filter plate 1 and the fixed plate, the shape of the protrusion is set to be semicircular, the shape of the vibration block is set to be semicircular, and the vibration block moves into the motion trajectory of the protrusion. At this time, the output end of the cooling fan rotates to drive the protrusion to rotate, and the protrusion rotates to contact the vibration block and generate vibration.

[0009] According to the above technical solution, it also includes an adsorption device, which is arranged on the surface of the air inlet pipe, and the adsorption device includes a movable plate and a baffle, the movable plate is slidably installed on the bottom of the inner wall of the air inlet pipe, the baffle is slidably installed on the bottom of the inner wall of the air inlet pipe, the movable plate is fixedly connected to the side of the filter plate 1 close to the cooling fan, and the baffle is fixedly connected to the side of the filter plate 1 away from the cooling fan. The adsorption device also includes an adsorption frame, a filter plate 2, a vent, an adsorption hole, a receiving plate and a rotating plate. The movement of the filter plate 1 drives the movable plate to move, and the movement of the movable plate removes the obstruction of the vent. When filter plate one moves, the baffle plate is driven to move as well, and the movement of the baffle plate contacts the obstruction of the adsorption hole. The adsorption frame is slidably installed under the air inlet pipe, and the filter plate two is fixedly installed inside the adsorption frame. The vent hole is provided under the inner wall of the air inlet pipe, and the adsorption hole is provided under the inner wall of the air inlet pipe. The receiving plate is fixedly installed under the filter plate two, and the rotating plate is rotatably installed on the surface of the receiving plate to prevent the shaken-off foreign matter and impurities from escaping nearby and being re-adsorbed onto the surface of the filter plate one, so that the filter plate one is repeatedly blocked, thereby increasing the risk of damage to the IGBT module body due to high temperature.

[0010] According to the above technical solution, the ventilation hole is located on the right side of filter plate one, and the adsorption hole is located on the left side of filter plate one. The cooling fan will adsorb the shaken-off foreign matter and impurities into the interior of the adsorption frame through the ventilation hole and the adsorption hole, thereby collecting the foreign matter and impurities.

[0011] According to the above technical solution, a torsion spring is arranged between the rotating plate and the receiving plate, and a through hole is opened on the surface of the filter plate 2. The rotating plate is reset by the torsion spring after the adsorption is completed, so as to prevent foreign matter and impurities collected inside the adsorption frame from being sucked out again and causing blockage of the filter plate 1, thereby further reducing subsequent maintenance costs.

[0012] According to the above technical scheme, it also includes a limit device, which is arranged on the surface of the equipment frame, and the limit device includes a card block and a partition. A slide groove is opened on the surface of the equipment frame, and the card block is slidably installed inside the slide groove, and the partition is slidably installed on the outer wall of the equipment frame. The limit device also includes an L-shaped baffle rod and a telescopic elastic rod. The adsorption frame moves to contact and squeeze the card block to move, and the card block moves to squeeze the telescopic elastic rod to contract. The L-shaped baffle rod is fixedly installed on a side of the filter plate away from the cooling fan, and the telescopic elastic rod is fixedly installed on the inner wall of the slide groove. The free end of the telescopic elastic rod is fixedly connected to the card block. After the adsorption frame is installed, the card block is reset under the action of the telescopic elastic rod, thereby realizing the fixation of the adsorption frame.

[0013] According to the above technical solution, the surface of the block is set as a bevel surface, the block is fixed through the inner and outer walls of the partition, a movable groove is opened on the surface of the air inlet pipe, and the L-shaped baffle is slidably connected to the inner wall of the movable groove. When the filter plate moves, the L-shaped baffle drives the movement of the L-shaped baffle, and the L-shaped baffle moves to contact the block and limit it.

[0014] A method for managing a thermal management system of an IGBT module comprises the following steps:

[0015] Step 1: The heat generated by the IGBT module body when it is working will be transferred to the heat sink fins. When the detection module inside the temperature detector detects that the temperature on the surface of the heat sink fins exceeds the threshold, the cooling fan will be started through the control module;

[0016] Step 2: The output end of the cooling fan rotates to draw the outside air into the air inlet pipe, and passes through the gaps between the cooling fins one by one through the guide pipe, and then is discharged through the air permeable plate on the surface of the equipment frame;

[0017] Step 3: When too much foreign matter and impurities accumulate on the surface of filter plate 1, it will affect the filtering effect of filter plate 1. At this time, filter plate 1 will move closer to the cooling fan under the action of the cooling fan;

[0018] Step 4: The movement of the filter plate drives the vibration block to move toward the direction close to the cooling fan, and the vibration block moves into the motion track of the protrusion. At this time, the output end of the cooling fan rotates to drive the protrusion to rotate;

[0019] Step 5: The convex block rotates to contact the vibration block and generate vibration. The vibration can effectively shake off the foreign matter and impurities accumulated on the surface of the filter plate, avoiding the foreign matter and impurities from accumulating on the surface for a long time and affecting the heat dissipation effect of the IGBT module body.

[0020] The present invention provides a thermal management method and system for an IGBT module, which has the following beneficial effects:

[0021] (1) The thermal management system of the IGBT module uses a cooling fan and a guide tube to draw outside air through the gaps between the cooling fins one by one, thereby improving the heat dissipation effect on the IGBT module body and avoiding damage caused by local overtemperature. At the same time, when foreign matter and impurities accumulate on the surface of the filter plate, the filter plate moves under the action of the cooling fan and drives the vibration block to move. The vibration block moves into the motion trajectory of the protrusion. At this time, the output end of the cooling fan rotates to drive the protrusion to rotate. The protrusion rotates and contacts the vibration block and generates vibration, effectively shaking off the foreign matter and impurities accumulated on the surface of the filter plate, avoiding the long-term accumulation of foreign matter and impurities on its surface, affecting the heat dissipation effect of the IGBT module body, and thereby increasing the risk of damage to the IGBT module body due to high temperature.

[0022] (2) In the thermal management system of the IGBT module, the movement of the filter plate drives the movement of the movable plate and the baffle plate. The movement of the movable plate and the baffle plate removes the obstruction of the vent holes and the adsorption holes, so that the cooling fan can adsorb the shaken-off foreign matter and impurities into the interior of the adsorption frame through the vent holes and the adsorption holes, thereby collecting the foreign matter and impurities and preventing the shaken-off foreign matter and impurities from escaping nearby and being re-adsorbed onto the surface of the filter plate. At the same time, the rotating plate is reset by the torsion spring after the adsorption is completed, thereby preventing the foreign matter and impurities collected inside the adsorption frame from being re-sucked out and causing the filter plate to be blocked, further reducing the subsequent maintenance costs.

[0023] (3) The thermal management system of the IGBT module is fixed by the block and the telescopic spring rod during installation to prevent the adsorption frame from shaking or detaching from the bottom of the air inlet pipe during the adsorption of foreign matter and impurities, resulting in foreign matter and impurities not being collected in time, thereby increasing the risk of filter plate 1 being blocked. At the same time, the movement of the partition can effectively prevent foreign matter and impurities from entering the interior of the slideway and causing blockage, thereby affecting the fixation of the adsorption frame. When filter plate 1 is shaking off foreign matter, filter plate 1 moves to limit the block through the L-shaped baffle, which can prevent the adsorption frame from being pulled out during the shaking off of foreign matter and impurities and causing foreign matter and impurities to enter the back of filter plate 1 through the vent, thereby increasing the subsequent maintenance cost and the risk of the IGBT module body during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the position structure of the IGBT module body and the heat dissipation fins of the present invention;

[0026] Figure 3 This is a schematic diagram of the position structure of the guide tube and the heat dissipation fins of the present invention;

[0027] Figure 4 This is a schematic diagram of the internal structure of the air inlet pipe of the present invention;

[0028] Figure 5 For the present invention Figure 4 The enlarged structural diagram of part A in the middle;

[0029] Figure 6 This is a schematic diagram of the position structure of the filter plate and the movable plate of the present invention;

[0030] Figure 7 This is a schematic diagram of the position structure of the air inlet pipe and the adsorption frame of the present invention;

[0031] Figure 8 For the present invention Figure 7 The enlarged structural diagram of part B in the middle;

[0032] Fig. 9This is a schematic diagram of the position structure of the air inlet pipe and the L-shaped baffle rod of the present invention;

[0033] Fig.10 For the present invention Fig. 9 Schematic diagram of the enlarged structure of part C in the middle.

[0034] In the figure: 1. Equipment frame; 2. IGBT module body; 3. Heat sink fins; 4. Temperature detector; 5. Air inlet pipe; 6. Cooling fan; 7. Guide pipe; 8. Fixed plate; 9. Receiver rod; 10. Bump; 11. Filter plate 1; 12. Vibrating block; 13. Air outlet; 14. Breathable plate; 15. Spring; 161. Moving plate; 162. Baffle; 163. Adsorption frame; 164. Filter plate 2; 165. Ventilation hole; 166. Adsorption hole; 167. Receiver plate; 168. Rotating plate; 169. Through hole; 171. Block; 172. Partition; 173. Slide; 174. L-shaped baffle; 175. Telescopic spring rod; 176. Moving slot. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] See also Figure 1-Figure 10One embodiment of the present invention is: a thermal management system for an IGBT module, comprising a device frame 1, an IGBT module body 2 is fixedly installed inside the device frame 1, a heat sink fin 3 is fixedly installed inside the device frame 1, a temperature detector 4 is fixedly installed on the surface of the heat sink fin 3, and also comprising: a heat dissipation device, the heat dissipation device comprises an air inlet pipe 5, a heat dissipation fan 6, a guide pipe 7, a fixing plate 8, a receiving rod 9, a protrusion 10, a filter plate 11 and a vibration block 12, the heat dissipation fin 3 can quickly discharge the dissipated heat under the action of the guide pipe 7, improve the heat dissipation effect of the IGBT module body 2, and avoid damage caused by excessive local temperature, the air inlet pipe 5 is fixedly penetrated through the inner and outer walls of the device frame 1, and the heat dissipation fan 6 is fixedly installed on the air inlet pipe 5 The inner wall of the air inlet pipe 5 is fixedly penetrated by the inner and outer walls of the air inlet pipe 5, the fixing plate 8 is fixedly installed on the inner wall of the air inlet pipe 5, the receiving rod 9 slides through the left and right walls of the fixing plate 8, the protrusion 10 is fixedly installed on the output end of the cooling fan 6, the filter plate 11 is slidably installed on the inner wall of the air inlet pipe 5, the vibration block 12 is fixedly installed on the side of the filter plate 11 close to the cooling fan 6, and the end of the receiving rod 9 close to the filter plate 11 is fixedly connected to the filter plate 11. The output end of the cooling fan 6 rotates to drive the protrusion 10 to rotate. The protrusion 10 rotates to contact the vibration block 12 and generate vibration. The vibration can effectively shake off the foreign matter and impurities accumulated on the surface of the filter plate 11, so as to avoid the foreign matter and impurities accumulating on its surface for a long time and affecting the heat dissipation effect of the IGBT module body 2.

[0037] An air outlet 13 is provided on the surface of the equipment frame 1, and an air-permeable plate 14 is fixedly installed inside the air outlet 13. A detection module and a control module are provided inside the temperature detector 4, and the control module is electrically connected to the cooling fan 6. When the detection module inside the temperature detector 4 detects that the temperature on the surface of the cooling fin 3 exceeds the threshold value, the cooling fan 6 is started through the control module, and the output end of the cooling fan 6 rotates to suck the outside air into the inside of the air inlet pipe 5.

[0038] A spring 15 is arranged between the filter plate 11 and the fixed plate 8, the shape of the protrusion 10 is set to be semicircular, the shape of the vibration block 12 is set to be semicircular, and the vibration block 12 moves into the movement trajectory of the protrusion 10. At this time, the output end of the cooling fan 6 rotates to drive the protrusion 10 to rotate, and the protrusion 10 rotates to contact the vibration block 12 and generate vibration.

[0039] A method for managing a thermal management system of an IGBT module comprises the following steps:

[0040] Step 1: The heat generated by the IGBT module body 2 during operation is transferred to the heat sink fins 3. When the detection module inside the temperature detector 4 detects that the temperature on the surface of the heat sink fins 3 exceeds the threshold, the heat sink fan 6 is started through the control module;

[0041] Step 2: The output end of the cooling fan 6 rotates to draw the outside air into the air inlet pipe 5, and passes through the gaps between the cooling fins 3 one by one through the guide pipe 7, and then is discharged through the air permeable plate 14 on the surface of the equipment frame 1;

[0042] Step 3: When too much foreign matter and impurities are accumulated on the surface of the filter plate 11, the filtering effect of the filter plate 11 will be affected. At this time, the filter plate 11 will move towards the direction close to the cooling fan 6 under the action of the cooling fan 6;

[0043] Step 4: The filter plate 11 moves to drive the vibration block 12 to move toward the direction close to the cooling fan 6. The vibration block 12 moves into the motion track of the protrusion 10. At this time, the output end of the cooling fan 6 rotates to drive the protrusion 10 to rotate;

[0044] Step 5: The convex block 10 rotates to contact the vibration block 12 and generates vibration. The vibration can effectively shake off the foreign matter and impurities accumulated on the surface of the filter plate 11, so as to prevent the foreign matter and impurities from accumulating on the surface for a long time and affecting the heat dissipation effect of the IGBT module body 2.

[0045] When the present embodiment is working: the heat generated when the IGBT module body 2 is working will be transferred to the heat sink fins 3. When the detection module inside the temperature detector 4 detects that the temperature on the surface of the heat sink fins 3 exceeds the threshold value, the heat sink fan 6 will be started through the control module. The output end of the heat sink fan 6 rotates to draw the outside air into the inside of the air inlet pipe 5, and passes through the gaps between the heat sink fins 3 one by one through the guide pipe 7, and then is discharged through the air permeable plate 14 on the surface of the equipment frame 1. The heat sink fins 3 can quickly discharge the dissipated heat under the action of the guide pipe 7, thereby improving the heat dissipation effect on the IGBT module body 2 and avoiding damage caused by excessive local temperature. At the same time, the outside air is filtered out of foreign matter and impurities through the filter plate 11. When too much foreign matter and impurities accumulate on the surface of the filter plate 11, it will affect the filtering effect of the filter plate 11. At this time, the filter plate 11 will move toward the direction close to the cooling fan 6 under the action of the cooling fan 6. The movement of the filter plate 11 drives the vibration block 12 to move toward the direction close to the cooling fan 6. The vibration block 12 moves into the movement trajectory of the protrusion 10. At this time, the output end of the cooling fan 6 rotates to drive the protrusion 10 to rotate. The protrusion 10 rotates to contact the vibration block 12 and generate vibration. The vibration can effectively shake off the foreign matter and impurities accumulated on the surface of the filter plate 11, thereby preventing foreign matter and impurities from accumulating on its surface for a long time and affecting the heat dissipation effect of the IGBT module body 2, thereby increasing the risk of the IGBT module body 2 being damaged due to high temperature.

[0046] See also Figure 1-Figure 10On the basis of the above embodiment, another embodiment of the present invention further includes an adsorption device, which is arranged on the surface of the air inlet pipe 5, and the adsorption device includes a movable plate 161 and a baffle 162. The movable plate 161 is slidably installed on the bottom of the inner wall of the air inlet pipe 5, and the baffle 162 is slidably installed on the bottom of the inner wall of the air inlet pipe 5. The movable plate 161 is fixedly connected to the side of the filter plate 11 close to the cooling fan 6, and the baffle 162 is fixedly connected to the side of the filter plate 11 away from the cooling fan 6. The adsorption device also includes an adsorption frame 163, a filter plate 2 164, a vent 165, an adsorption hole 166, a receiving plate 167 and a rotating plate 168. The movement of the filter plate 11 drives the movable plate 161 to move, and the movement of the movable plate 161 releases To block the air vent 165, the filter plate 11 moves while driving the baffle 162 to move, and the baffle 162 moves to contact the adsorption hole 166. The adsorption frame 163 is slidably installed under the air inlet pipe 5, and the filter plate 164 is fixedly installed inside the adsorption frame 163. The air vent 165 is opened under the inner wall of the air inlet pipe 5, and the adsorption hole 166 is opened under the inner wall of the air inlet pipe 5. The receiving plate 167 is fixedly installed under the filter plate 164, and the rotating plate 168 is rotatably installed on the surface of the receiving plate 167 to prevent the shaken-off foreign matter and impurities from escaping nearby and being re-adsorbed onto the surface of the filter plate 11, so that the filter plate 11 is repeatedly blocked, thereby increasing the risk of damage to the IGBT module body 2 due to high temperature.

[0047] The vent hole 165 is located on the right side of the filter plate 11, and the adsorption hole 166 is located on the left side of the filter plate 11. The cooling fan 6 will adsorb the shaken-off foreign matter and impurities into the interior of the adsorption frame 163 through the vent hole 165 and the adsorption hole 166, thereby collecting the foreign matter and impurities.

[0048] A torsion spring is arranged between the rotating plate 168 and the receiving plate 167, and a through hole 169 is opened on the surface of the filter plate 164. The rotating plate 168 is reset by the torsion spring after the adsorption is completed, so as to prevent the foreign matter and impurities collected inside the adsorption frame 163 from being sucked out again and causing the filter plate 11 to be blocked, thereby further reducing the subsequent maintenance cost.

[0049] The device also includes a limiting device, which is arranged on the surface of the device frame 1. The limiting device includes a block 171 and a partition 172. A slide groove 173 is opened on the surface of the device frame 1. The block 171 is slidably installed inside the slide groove 173. The partition 172 is slidably installed on the outer wall of the device frame 1. The limiting device also includes an L-shaped blocking rod 174 and a telescopic elastic rod 175. The adsorption frame 163 moves to contact and squeeze the block 171 to move. The block 171 moves to squeeze the telescopic elastic rod 175 to shrink. The L-shaped blocking rod 174 is fixedly installed on the filter On the side of plate 11 away from the cooling fan 6, the telescopic elastic rod 175 is fixedly installed on the inner wall of the slide groove 173, and the free end of the telescopic elastic rod 175 is fixedly connected to the block 171. After the adsorption frame 163 is installed, the block 171 is reset under the action of the telescopic elastic rod 175, thereby fixing the adsorption frame 163, avoiding the adsorption frame 163 from shaking or detaching from the bottom of the air inlet pipe 5 during the adsorption of foreign matter and impurities, resulting in foreign matter and impurities not being collected in time, thereby increasing the risk of filter plate 11 being blocked.

[0050] The surface of the block 171 is set as a bevel surface, and the block 171 is fixed through the inner and outer walls of the partition 172. A movable groove 176 is opened on the surface of the air inlet pipe 5, and the L-shaped blocking rod 174 is slidably connected to the inner wall of the movable groove 176. The movement of the filter plate 11 drives the L-shaped blocking rod 174 to move. The L-shaped blocking rod 174 moves to contact the block 171 and limit it, which can prevent the adsorption frame 163 from being pulled out during the shaking off of foreign matter and impurities and allow foreign matter and impurities to enter the back of the filter plate 11 through the vent 165, thereby increasing the subsequent maintenance cost and the risk of the IGBT module body 2 during use.

[0051] When the present embodiment is working, the movement of the filter plate 11 drives the moving plate 161 to move, and the moving plate 161 moves to remove the obstruction of the vent hole 165. The movement of the filter plate 11 drives the baffle plate 162 to move, and the baffle plate 162 moves to contact the obstruction of the adsorption hole 166. When the obstruction of the vent hole 165 and the adsorption hole 166 is removed, the cooling fan 6 will adsorb the shaken foreign matter and impurities into the interior of the adsorption frame 163 through the vent hole 165 and the adsorption hole 166, so as to collect the foreign matter and impurities, and prevent the shaken foreign matter and impurities from escaping nearby and being re-adsorbed onto the surface of the filter plate 11, so that the filter plate 11 1 is repeatedly blocked, thereby increasing the risk of the IGBT module body 2 being damaged by high temperature, extending the service life of the equipment and reducing the subsequent maintenance cost. At the same time, in the process of adsorbing foreign matter and impurities, the filter plate 164 can effectively prevent foreign matter and impurities from entering the back of the filter plate 11 through the vent hole 165 and entering the interior of the equipment frame 1 through the guide pipe 7, maintaining the stability of the working environment of the IGBT module body 2. At the same time, the rotating plate 168 is reset by the torsion spring after the adsorption is completed, avoiding the foreign matter and impurities collected in the adsorption frame 163 from being sucked out again to cause the filter plate 11 to be blocked, further reducing the subsequent maintenance cost.

[0052] When the adsorption frame 163 needs to be installed, the adsorption frame 163 moves to contact and squeeze the card block 171 to move, and the card block 171 moves to squeeze the telescopic elastic rod 175 to shrink. When the adsorption frame 163 is installed, the card block 171 is reset under the action of the telescopic elastic rod 175, thereby fixing the adsorption frame 163 to prevent the adsorption frame 163 from shaking or escaping from the bottom of the air inlet pipe 5 during the adsorption of foreign matter and impurities, resulting in foreign matter and impurities not being collected in time, thereby increasing the risk of filter plate 11 being blocked. At the same time, the movement of the card block 171 drives the partition 172 to move, and the partition 17 2 movement can effectively prevent foreign matter and impurities from entering the interior of the slide slot 173 and causing blockage, thereby affecting the fixation of the adsorption frame 163. At the same time, when the surface of the filter plate 11 is blocked by foreign matter and impurities and then moves, the movement of the filter plate 11 drives the L-shaped blocking rod 174 to move. The L-shaped blocking rod 174 moves to contact the card block 171 and limit it, which can prevent the adsorption frame 163 from being pulled out during the process of shaking off the foreign matter and impurities and causing the foreign matter and impurities to enter the back of the filter plate 11 through the vent hole 165, thereby increasing the subsequent maintenance cost and the risk of the IGBT module body 2 during use.

[0053] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A thermal management system for an IGBT module, comprising a device frame (1), an IGBT module body (2) being fixedly mounted inside the device frame (1), a heat sink fin (3) being fixedly mounted inside the device frame (1), a temperature detector (4) being fixedly mounted on the surface of the heat sink fin (3), characterized in that: Also includes: A heat dissipation device, the heat dissipation device comprising an air inlet pipe (5), a heat dissipation fan (6), a guide pipe (7), a fixing plate (8), a receiving rod (9), a protrusion (10), a filter plate 1 (11) and a vibration block (12), the air inlet pipe (5) being fixedly passed through the inner and outer walls of the equipment frame (1), the heat dissipation fan (6) being fixedly mounted on the inner wall of the air inlet pipe (5), the guide pipe (7) being fixedly passed through the inner and outer walls of the air inlet pipe (5), the fixing plate (8) being fixedly mounted on the inner wall of the air inlet pipe (5), the receiving rod (9) being slidably passed through the left and right walls of the fixing plate (8), the protrusion (10) being fixedly mounted on the output end of the heat dissipation fan (6), the filter plate 1 (11) being slidably mounted on the inner wall of the air inlet pipe (5), the vibration block (12) being fixedly mounted on a side of the filter plate 1 (11) close to the heat dissipation fan (6), and the end of the receiving rod (9) close to the filter plate 1 (11) being fixedly connected to the filter plate 1 (11); An adsorption device, the adsorption device is arranged on the surface of the air inlet pipe (5), the adsorption device comprises a movable plate (161) and a baffle (162), the movable plate (161) is slidably mounted on the bottom of the inner wall of the air inlet pipe (5), the baffle (162) is slidably mounted on the bottom of the inner wall of the air inlet pipe (5), the movable plate (161) is fixedly connected to a side of the filter plate 1 (11) close to the cooling fan (6), and the baffle (162) is fixedly connected to a side of the filter plate 1 (11) away from the cooling fan (6); A limiting device, the limiting device is arranged on the surface of the equipment frame (1), the limiting device comprises a clamping block (171) and a partition (172), a sliding groove (173) is provided on the surface of the equipment frame (1), the clamping block (171) is slidably mounted inside the sliding groove (173), and the partition (172) is slidably mounted on the outer wall of the equipment frame (1).

2. The thermal management system of an IGBT module according to claim 1, characterized in that: An air outlet (13) is provided on the surface of the equipment frame (1), a ventilation plate (14) is fixedly installed inside the air outlet (13), a detection module and a control module are arranged inside the temperature detector (4), and the control module is electrically connected to the cooling fan (6).

3. A thermal management system for an IGBT module according to claim 2, characterized in that: A spring (15) is provided between the filter plate 1 (11) and the fixing plate (8), the shape of the protrusion (10) is set to be semicircular, and the shape of the vibration block (12) is set to be semicircular.

4. The thermal management system of an IGBT module according to claim 3, characterized in that: The adsorption device further comprises an adsorption frame (163), a second filter plate (164), a vent hole (165), an adsorption hole (166), a receiving plate (167) and a rotating plate (168); the adsorption frame (163) is slidably mounted below the air inlet pipe (5); the second filter plate (164) is fixedly mounted inside the adsorption frame (163); the vent hole (165) is provided below the inner wall of the air inlet pipe (5); the adsorption hole (166) is provided below the inner wall of the air inlet pipe (5); the receiving plate (167) is fixedly mounted below the second filter plate (164); and the rotating plate (168) is rotatably mounted on the surface of the receiving plate (167).

5. The thermal management system of an IGBT module according to claim 4, characterized in that: The ventilation hole (165) is located on the right side of the filter plate one (11), and the adsorption hole (166) is located on the left side of the filter plate one (11).

6. The thermal management system of an IGBT module according to claim 5, characterized in that: A torsion spring is provided between the rotating plate (168) and the receiving plate (167), and a through hole (169) is provided on the surface of the second filter plate (164).

7. The thermal management system of an IGBT module according to claim 6, characterized in that: The limiting device also includes an L-shaped blocking rod (174) and a telescopic elastic rod (175), wherein the L-shaped blocking rod (174) is fixedly mounted on a side of the filter plate 1 (11) away from the cooling fan (6), and the telescopic elastic rod (175) is fixedly mounted on the inner wall of the slide groove (173), and the free end of the telescopic elastic rod (175) is fixedly connected to the clamping block (171).

8. The thermal management system of an IGBT module according to claim 7, characterized in that: The surface of the clamping block (171) is arranged as a beveled surface, the clamping block (171) is fixedly passed through the inner and outer walls of the partition (172), a movable groove (176) is provided on the surface of the air inlet pipe (5), and the L-shaped blocking rod (174) is slidably connected to the inner wall of the movable groove (176).

9. A method for managing a thermal management system of an IGBT module, using the thermal management system of an IGBT module according to claim 8, characterized in that: The following steps are involved: Step 1: The heat generated by the IGBT module body (2) during operation is transferred to the heat sink fins (3). When the detection module inside the temperature detector (4) detects that the temperature on the surface of the heat sink fins (3) exceeds a threshold value, the control module starts the heat sink fan (6); Step 2: The output end of the cooling fan (6) rotates to draw outside air into the air inlet pipe (5), and passes through the gaps between the cooling fins (3) one by one through the guide pipe (7), and then is discharged through the air permeable plate (14) on the surface of the equipment frame (1); Step 3: When too much foreign matter and impurities accumulate on the surface of the filter plate 1 (11), the filtering effect of the filter plate 1 (11) will be affected. At this time, the filter plate 1 (11) will move towards the cooling fan (6) under the action of the cooling fan (6); Step 4: The filter plate 1 (11) moves to drive the vibration block (12) to move in a direction close to the cooling fan (6), and the vibration block (12) moves into the motion track of the protrusion (10). At this time, the output end of the cooling fan (6) rotates to drive the protrusion (10) to rotate; Step 5: The protrusion (10) rotates to contact the vibration block (12) and generates vibration. The vibration can shake off foreign matter and impurities accumulated on the surface of the filter plate 1 (11), thereby preventing foreign matter and impurities from accumulating on the surface for a long time and affecting the heat dissipation effect of the IGBT module body (2).

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