A transmission system for improving the transmission efficiency of wafers in ion implanters

Abstract

The present invention discloses a transmission system for improving the transmission efficiency of wafers of an ion implanter, belonging to the technical field of wafer transmission systems, and comprising: a preparation tooling module, which is internally divided into a plurality of tooling stations, each of which is provided with a bearing mechanism; a loading port module, which is arranged in front of the preparation tooling module, and the loading port modules are arranged in a plurality; a suspension pick-up and delivery arm, which is erected above each of the loading port modules, and the loading port module is provided with a material transportation system; in the present invention, the pulse airflow action adopted by the bearing mechanism can detect the wafer clamping stability, thereby identifying and judging whether a vacuum manipulator assembly can safely flip and move the wafer, so that the wafer can directly skip the temporary carrier module when being transported from the front transfer module to the rear transfer module, thereby reducing unnecessary repeated actions, thereby improving the transmission efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer transmission systems, in particular to a transmission system for improving the transmission efficiency of wafers of an ion implanter. Background Art

[0002] Ion implanters are crucial precision equipment in the manufacture of semiconductor devices. They use high-voltage accelerator technology to accelerate specific elements in the form of ions to energy levels ranging from hundreds of kiloelectronvolts to several megaelectronvolts, and then precisely inject these ions into a specified area of ​​a semiconductor material (such as a silicon wafer) to change the electrical properties of the area. Currently, the wafer transmission system inside the ion implanter mostly uses a vacuum manipulator to transport the wafer horizontally, such as the invention patent with patent number CN103021916B. This transmission method uses a lifting plate to lift the wafer horizontally and transfer the wafer smoothly to the ion implantation target table. Since there is no clamping limit for the wafer, the wafer transmission method is single, and the wafer needs to be placed on a wafer tray or a wafer carrier during displacement at different workstations, resulting in the vacuum manipulator needing to repeat the pick-up and delivery action during transportation, affecting the transmission efficiency. In addition, the pick-up and delivery method is single, and the wafer is prone to vibration and fall, and it is impossible to increase the speed accordingly during transmission.

[0003] Therefore, it is necessary to provide a transmission system for improving the wafer transmission efficiency of an ion implanter to solve the problems raised in the above background technology. Summary of the invention

[0004] To achieve the above object, the present invention provides the following technical solution: a transmission system for improving the transmission efficiency of wafers in an ion implanter, characterized in that it comprises:

[0005] Prepare a tooling module, wherein a plurality of tooling stations are divided therein, and each of the tooling stations is provided with a carrying mechanism;

[0006] A loading port module is arranged in front of the preparation tooling module, and the loading port modules are arranged in a plurality, and each of the loading port modules corresponds to a tooling station in the preparation tooling module one by one;

[0007] A hanging pick-up and delivery arm is erected above each of the loading port modules, wherein the loading port module is provided with a material transportation system, and the material transportation system is used to continuously transport the wafer boxes to the unloading area of ​​the loading port module, so that the hanging pick-up and delivery arm can pick up and deliver the wafers in the wafer boxes to the carrying mechanism one by one;

[0008] A front transfer module is arranged behind the preparation tooling module, wherein a vacuum manipulator assembly is arranged in the front transfer module, and the vacuum manipulator assembly clamps and transfers the wafers placed on one of the carrying mechanisms at a time;

[0009] The rear transport and transfer module adopts the same vacuum manipulator assembly as the front transport and transfer module, and the vacuum manipulator assembly in the rear transport and transfer module is horizontally erected along the transmission space in the ion implanter;

[0010] A temporary stage module, located between the front transfer module and the rear transfer module, for temporarily storing the wafers clamped in the vacuum manipulator assembly in the front transfer module;

[0011] The reaction module is distributed on both sides of the rear transport and transfer module in the ion implanter. The reaction module includes an ion source, an acceleration mechanism, and a process chamber, which are used to cooperate to accurately control the type, energy, dose, and implantation distribution of ions so as to form a precisely controllable doping layer on the wafer.

[0012] The carrying mechanism uses pulse airflow to detect the wafer clamping stability after the vacuum manipulator assembly completes the preliminary clamping of the wafer, so that the vacuum manipulator assembly at the front transfer and loading module can judge whether the clamped wafer can be turned over and moved based on the dynamic stability strength of the clamping. When the dynamic stability strength of the clamping meets the expected value, the vacuum manipulator assembly at the front transfer and loading module skips the temporary stage module and directly docks with the vacuum manipulator assembly in the rear transfer and loading module in mid-air to transfer the wafer.

[0013] The preparation tooling module is provided with a visual sensor;

[0014] The bearing mechanism comprises: a transmission frame, on which a mounting plate is slidably arranged, a transmission screw is rotatably arranged on one side of the transmission frame, and the mounting plate is slidably sleeved on the transmission screw through thread transmission;

[0015] An upper frame plate is slidably connected to the mounting plate, and the sliding direction of the upper frame plate is arranged along the vertical direction of the transmission frame. A threaded rod is rotatably arranged on the mounting plate, and the lower part of the upper frame plate is slidably connected to the threaded rod through a threaded sleeve. A motor is fixed to the mounting plate, and the output end of the motor is connected to the threaded rod for transmission through gear meshing.

[0016] A sealing seat is fixed on the upper frame plate, and a carrier plate is coaxially arranged in the center of the sealing seat;

[0017] The carrier plate is provided with a plurality of air flow holes, and an upper end surface of the carrier plate is provided with an extended plate groove for the transfer plate in the vacuum robot assembly to slide and extend under the wafer.

[0018] Further, as a preference, the diameter of the carrier is smaller than the diameter of the wafer, a negative pressure cavity is provided in the carrier, and the air flow holes are all connected to the negative pressure cavity;

[0019] A main shaft is arranged in the sealing seat, a plurality of telescopic guide rods are hingedly connected to the main shaft on the circumference, and the telescopic ends of the telescopic guide rods are universally hingedly connected to the bottom of the carrier plate.

[0020] Further, as a preference, the main shaft is rotatably connected in the sealing seat, a reduction transmission seat is provided on one side of the sealing seat, and the reduction transmission seat is connected to the main shaft for transmission through gear meshing;

[0021] The plurality of telescopic guide rods are synchronously extended and retracted to adjust the relative height between the carrier plate and the sealing seat, and the carrier plate is driven to perform spatial deflection in cooperation with the extension and retraction.

[0022] Further, as a preference, a plurality of pulse gas chambers are distributed in the carrier plate, a plurality of adjacent air flow holes are divided into a group, each group of air flow holes is connected to the corresponding pulse gas chamber, and each pulse gas chamber is connected to a pulse generator;

[0023] When the carrying mechanism performs pulsed airflow operation, each group of airflow holes on the opposite side is successively sprayed with pulsed airflow by the pulse generator, and the pulsed airflow impacts the surface and edge position of the non-clamping side of the wafer.

[0024] Further, as a preference, the vacuum manipulator assembly comprises: a slide rail on which a drive seat is slidably arranged, a lifting platform is installed on the drive seat, a mechanical arm is installed on one side of the lifting platform, one end of the mechanical arm is rotatably connected to a clamper, and a transfer plate is installed in the middle of the clamper.

[0025] Furthermore, preferably, the drive seat is driven by a three-speed speed control mechanism when sliding along the slide rail, and the robot arm in the vacuum manipulator assembly presents different clamping postures while working based on the gear speed of each drive seat, and the supporting mechanism freely adjusts the wafer loading and transmission space point according to the clamping posture of the robot arm.

[0026] Further, as a preference, the clamp comprises: a mounting portion, wherein the left and right sides of the inner end surface of the mounting portion are respectively provided with clamping fingers, and the connection between each clamping finger and the mounting portion is provided with a transmission tooth, and the two transmission teeth are meshed with each other, and the mounting portion is provided with a driving tooth, and the driving tooth is meshed with one of the transmission teeth;

[0027] The clamping fingers are all fixed with a connecting portion, the connecting portion is provided with a clamping plate, and the clamping plate is fixed with an anti-slip layer;

[0028] The clamping plate is slidably connected to the connecting part through two pins, a guide shaft is fixed on the clamping plate, two slides are slidably connected to the guide shaft, a support rod is rotatably connected to the slide, one end of the support rod is connected to the connecting part, and an inner spring is sleeved on one side of each slide on the guide shaft;

[0029] A stress sensor is arranged on the connecting portion, and the stress sensor is in contact with the inner spring.

[0030] Further, as a preference, a rotation cavity is provided inside the transmission tooth of one of the clamping fingers, a coupling is coaxially rotated in the rotation cavity, an end of the clamping finger is fixed to the coupling, and a fastening spring is connected between the coupling and the transmission tooth;

[0031] An arc-shaped guide cavity is provided in the rotating cavity, a guide plug is slidably provided in the arc-shaped guide cavity, one end of the guide plug is fixed to the coupling shaft through a connecting rod, an air pressure hole is provided on the arc-shaped guide cavity, a compression pump is provided on the mounting portion, and the compression pump is connected to the air pressure hole.

[0032] Further, as a preference, an angle sensor is provided on the mounting portion for detecting a rotation angle between two clamping fingers.

[0033] Furthermore, preferably, the compression pump controls the airflow in the arc-shaped guide cavity so that the clamping fingers can be adjusted step by step in wafer clamping.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] The vacuum manipulator components in the front transfer and loading module and the rear transfer and loading module used in the present invention can cooperate with the bearing mechanism in the preparation tooling module to clamp the wafer at multiple angles in the wafer space, and the vacuum manipulator components used have three-speed adjustment. The bearing mechanism changes the wafer clamping point based on different speed adjustment schemes, so that the vacuum manipulator components can adopt different postures to more efficiently pick up and deliver the wafers.

[0036] In the present invention, the pulse airflow action used by the carrying mechanism in particular can detect the wafer clamping stability, thereby identifying and judging whether the vacuum robot arm assembly can safely flip and move the wafer, so that the wafer can directly skip the temporary carrier module when it is transported from the front transfer module to the rear transfer module, thereby reducing unnecessary repeated actions and improving transmission efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 A schematic diagram of the structure of a transmission system for improving the transmission efficiency of wafers in an ion implanter;

[0038] Figure 2 It is a structural schematic diagram of a front transfer module in a transmission system for improving the transmission efficiency of wafers in an ion implanter;

[0039] Figure 3 A schematic diagram of the structure of a carrier mechanism in a transmission system for improving the transmission efficiency of wafers in an ion implanter;

[0040] Figure 4 A schematic diagram of the structure of a sealing seat in a transmission system for improving the transmission efficiency of wafers in an ion implanter;

[0041] Figure 5 A schematic diagram of the structure of a vacuum manipulator component in a transmission system for improving the transmission efficiency of wafers in an ion implanter;

[0042] Figure 6 A schematic diagram of the structure of a clamp in a transmission system for improving the transmission efficiency of wafers in an ion implanter;

[0043] Figure 7 A schematic diagram of the structure of a clamping plate in a transmission system for improving the transmission efficiency of wafers in an ion implanter;

[0044] Figure 8 A schematic diagram of the structure of a coupling in a transmission system for improving the transmission efficiency of wafers in an ion implanter;

[0045] In the figure: 1. Loading port module; 11. Preparation tooling module; 12. Front transfer module; 13. Rear transfer module; 14. Temporary stage module; 15. Reaction module; 2. Carrying mechanism; 21. Transmission rack; 22. Transmission screw; 23. Mounting plate; 24. Upper plate; 25. Threaded rod; 26. Motor; 3. Vacuum manipulator assembly; 31. Slide rail; 32. Drive seat; 33. Lifting platform; 34 , robotic arm; 35, transfer plate; 4, sealing seat; 41, carrier plate; 42, extension plate slot; 43, main shaft; 44, telescopic guide rod; 45, reduction transmission seat; 5, clamp; 51, mounting part; 52, clamping finger; 53, driving tooth; 54, connecting part; 55, clamping plate; 56, anti-slip layer; 57, support rod; 58, inner spring; 6, coupling; 61, tightening spring; 62, arc guide cavity; 63, air pressure hole. DETAILED DESCRIPTION

[0046] See also Figure 1-Figure 8 In an embodiment of the present invention, a transmission system for improving the transmission efficiency of wafers in an ion implanter comprises:

[0047] A Preparing Tooling Module 11, which is divided into a plurality of tooling stations, each of which is provided with a carrying mechanism 2;

[0048] A loading port module 1 is arranged in front of the preparation tooling module 11. The loading port modules 1 are arranged in a plurality and each loading port module 1 corresponds to a tooling station in the preparation tooling module 11 one by one.

[0049] A hanging pick-up and delivery arm (not shown in the figure) is erected above each of the loading port modules 1. The loading port modules 1 are provided with a material transportation system, and the material transportation system is used to continuously transport the wafer boxes to the unloading area of ​​the loading port modules 1, so that the hanging pick-up and delivery arm can pick up and deliver the wafers in the wafer boxes to the carrying mechanism 2 one by one;

[0050] A front-end transfer and loading module 12 is arranged at the rear of the preparation tooling module 11, and a vacuum manipulator assembly 3 is arranged in the front-end transfer and loading module 12, and the vacuum manipulator assembly 3 clamps and transfers the wafers placed on one of the carrying mechanisms 2 each time;

[0051] A back-end transfer and loading module 13 uses the same vacuum manipulator assembly 3 as the front-end transfer and loading module 12, and the vacuum manipulator assembly 3 in the back-end transfer and loading module 13 is horizontally erected along the transmission space in the ion implanter;

[0052] The temporary mounting module 14 is located between the front transfer module 12 and the rear transfer module 13, and is used to temporarily store the wafers clamped in the vacuum manipulator assembly 3 in the front transfer module 12; that is, a device that temporarily carries and fixes wafers, circuit boards or other thin materials at a certain stage in the processing process. This type of module can be used as an intermediate carrier in an automated production line to safely and accurately transfer wafers between different process equipment, ensuring the position accuracy and contamination-free nature of the wafers during the transfer process;

[0053] Reactor Module 15, which is distributed on both sides of the rear transport and transfer module 13 in the ion implanter. The reactor module 15 includes an ion source, an acceleration mechanism, and a process chamber, which are used to cooperate to accurately control the type, energy, dose, and implantation distribution of ions, so as to form a precisely controllable doping layer on the wafer;

[0054] The carrying mechanism 2 uses pulse airflow to detect the wafer clamping stability after the vacuum manipulator assembly 3 completes the preliminary clamping of the wafer, so that the vacuum manipulator assembly 3 at the front transfer and loading module 12 can judge whether the clamped wafer can be turned over and moved based on the dynamic stability strength of the clamping. When the dynamic stability strength of the clamping meets the expected value, the vacuum manipulator assembly 3 at the front transfer and loading module 12 skips the temporary stage module 14 and directly docks with the vacuum manipulator assembly 3 in the rear transfer and loading module 13 in mid-air to transfer the wafer;

[0055] The preparation tooling module 11 is provided with a visual sensor, which uses pulsed airflow technology to blow short and precise airflow to the wafer clamping mechanism. By monitoring the tiny vibration or displacement of the wafer after being impacted by the airflow, the tightness and stability of the wafer clamping can be judged; the visual sensor captures and analyzes the state of the wafer in real time, and can also detect whether the wafer has been correctly clamped, whether it is centered, whether there are cracks or foreign objects, etc.;

[0056] The bearing mechanism 2 comprises: a transmission frame 21, on which a mounting plate 23 is slidably arranged, a transmission screw 22 is rotatably arranged on one side of the transmission frame 21, and the mounting plate 23 is slidably sleeved on the transmission screw 22 through thread transmission;

[0057] The mounting plate 23 is slidably connected with an upper frame plate 24, the sliding direction of the upper frame plate 24 is arranged along the vertical direction of the transmission frame 21, a threaded rod 25 is rotatably arranged on the mounting plate 23, the lower part of the upper frame plate 24 is slidably connected with the threaded rod 25 through a threaded sleeve, a motor 26 is fixed on the mounting plate 23, and the output end of the motor 26 is connected with the threaded rod 25 for transmission through gear meshing;

[0058] A sealing seat 4 is fixed on the upper shelf plate 24, and a carrier plate 41 is coaxially arranged in the center of the sealing seat 4; the carrier plate 41 is usually made of conductive or anti-static material, has a smooth surface and is easy to clean, carries the wafer, and is driven by the transmission screw 22 and the threaded rod 25 to adjust the displacement along the spatial orientation X-axis and Y-axis, thereby changing the transfer point.

[0059] The carrier plate 41 is provided with a plurality of air flow holes, and an upper end surface of the carrier plate 41 is provided with an extension plate slot 42 for the transfer plate in the vacuum robot assembly 3 to slide and extend under the wafer.

[0060] In this embodiment, the diameter of the carrier 41 is smaller than the diameter of the wafer, a negative pressure cavity is provided in the carrier 41, and the air flow holes are all connected to the negative pressure cavity; it should be noted that when the wafer is delivered to the carrier 41 by the suspension pick-up and delivery arm, the wafer should be concentric with the carrier 41, and the preparation tooling module can be provided with a correction mechanism, when the wafer is placed on the carrier 41 not concentrically, the correction mechanism corrects it, and the vacuum manipulator assembly 3 can clamp the wafer on the carrying mechanism of the adjacent station to avoid the pause phenomenon;

[0061] A main shaft 43 is disposed in the sealing seat 4 , and a plurality of telescopic guide rods 44 are hingedly connected to the circumference of the main shaft 43 . The telescopic ends of the telescopic guide rods 44 are universally hinged to the bottom of the carrier 41 .

[0062] As a preferred embodiment, the main shaft 43 is rotatably connected in the sealing seat 4, and a reduction transmission seat 45 is provided on one side of the sealing seat 4. The reduction transmission seat 45 is connected to the main shaft 43 for transmission through gear meshing; it is used to rotate the carrier plate 41 so that the extended plate slot 42 on the carrier plate 41 faces the vacuum manipulator assembly 3;

[0063] The plurality of telescopic guide rods 44 are synchronously telescoped to adjust the relative height between the carrier plate 41 and the sealing seat 4 , and drive the carrier plate 41 to perform spatial deflection in coordination with the telescopic movement.

[0064] In this embodiment, a plurality of pulse gas chambers are distributed in the carrier plate 41, and a plurality of adjacent air flow holes are divided into a group, and each group of air flow holes is connected to the corresponding pulse gas chamber, and each pulse gas chamber is connected to a pulse generator (not shown in the figure);

[0065] When the carrier mechanism 2 performs pulsed airflow, each group of airflow holes on the opposite side is successively sprayed with pulsed airflow by the pulse generator, and the pulsed airflow impacts the surface and edge position of the non-clamped side of the wafer; when the pulsed airflow is successively sprayed to the surface and edge position of the non-clamped side of the wafer, the dynamic response of the wafer under the impact of the airflow is observed and analyzed by the visual sensor, and the tightness and stability of the wafer clamping can be judged. For example, if the wafer is firmly and stably clamped, there will be no significant shaking or displacement even if it is impacted by the pulsed airflow; on the contrary, if the wafer is not clamped stably, the impact of the airflow will cause the wafer to produce additional vibration or deviate from the original position, so as to judge whether the clamped wafer can be flipped and moved later.

[0066] In this embodiment, the vacuum manipulator assembly 3 includes: a slide rail 31, on which a drive seat 32 is slidably arranged, a lifting platform 33 is installed on the drive seat 32, a mechanical arm 34 is installed on one side of the lifting platform 33, one end of the mechanical arm 34 is rotatably connected to a clamper 5, and a transfer plate 35 is installed in the middle of the clamper 5.

[0067] In this embodiment, the mechanical arm 34 in the vacuum manipulator assembly 3 presents different gripping postures in the work based on the gear speed of each drive seat 32, and the bearing mechanism 2 freely adjusts the wafer loading and transmission space point according to the gripping posture of the mechanical arm 34; the drive seat can move smoothly and accurately on the slide rail 31 at low, medium and high speeds according to different work requirements. Such a speed regulation function helps to improve work efficiency while taking into account the precision and safety of operation; at the same time, no matter which speed gear the drive seat 32 is in, the clamp 5 can accurately find the appropriate spatial position at the corresponding speed to adapt to the changes in the wafer loading and transmission point, ensuring the accurate and stable transmission and positioning of the wafer at different process stages.

[0068] As a preferred embodiment, the clamp 5 comprises: a mounting portion 51, the left and right sides of the inner end surface of which are rotatably provided with clamping fingers 52, each of which is provided with a transmission tooth at the connection between the clamping finger 52 and the mounting portion 51, and the two transmission teeth are meshed with each other, and a driving tooth 53 is rotatably provided on the mounting portion 51, and the driving tooth 53 is meshed with one of the transmission teeth;

[0069] The clamping fingers 52 are all fixed with a connecting portion 54 , the connecting portion 54 is provided with a clamping plate 55 , and the clamping plate 55 is fixed with an anti-slip layer 56 ;

[0070] The clamping plate 55 is slidably connected to the connecting portion 54 via two pins. A guide shaft is fixed to the clamping plate 55. Two slides are slidably connected to the guide shaft. A support rod 57 is rotatably connected to the slide. One end of the support rod 57 is connected to the connecting portion 54. An inner spring 58 is sleeved on one side of each slide on the guide shaft.

[0071] A stress sensor is provided on the connecting portion 54 , and the stress sensor is in contact with the inner spring 58 , and is used for real-time monitoring of the stress distribution and changes generated when the wafer is clamped. When the clamp clamps the wafer, the distance between the clamping plate 55 and the connecting portion 54 is shortened, and the inner spring is gradually compressed.

[0072] In this embodiment, a rotation cavity is provided inside the transmission tooth of one of the clamping fingers 52, a coupling shaft 6 is coaxially provided in the rotation cavity, an end of the clamping finger 52 is fixed to the coupling shaft 6, and a fastening spring 61 is connected between the coupling shaft 6 and the transmission tooth;

[0073] An arc-shaped guide cavity 62 is provided in the rotating cavity, a guide plug is slidably provided in the arc-shaped guide cavity 62, one end of the guide plug is fixed to the coupling 6 through a connecting rod, an air pressure hole 63 is provided on the arc-shaped guide cavity 62, a compression pump is provided on the mounting portion 51, the compression pump is connected to the air pressure hole 63, and the compression pump controls the air pressure of the arc-shaped guide cavity 62 through the air pressure hole 63, so that relative rotation is generated between the coupling 6 and the rotating cavity, thereby realizing air-controlled fine-tuning of the clamping finger 52.

[0074] In this embodiment, an angle sensor is provided on the mounting portion 51 for detecting the relative rotation angle between the two clamping fingers 52, wherein the visual sensor preferentially detects the diameter of the wafer, and when the clamp is clamped, the angle sensor detects the opening and closing clamping angle of the clamp, thereby identifying the clamping point of the clamp on the wafer (the selection of the clamping point directly affects the subsequent transfer process of the wafer), thereby preferentially judging whether the vacuum manipulator assembly in the front transfer module and the rear transfer module can be docked in mid-air.

[0075] In this embodiment, the compression pump controls the airflow in the arc-shaped guide cavity 62 so that the clamping fingers 52 can be adjusted step by step in the wafer clamping. During the initial clamping of the wafer, the clamper in the vacuum manipulator assembly uses the minimum force to clamp the wafer ("minimum force" refers to the minimum necessary clamping force to ensure that the wafer is reliably fixed on the clamper during processing). At this time, the wafer needs to be transferred through a temporary stage module, and in the subsequent clamping (i.e., the next clamping process), the compression pump is used to gradually increase the clamping force of the clamper to prepare for the docking transfer operation, while preventing the strong clamping force from damaging the wafer.

[0076] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A transmission system for improving the transmission efficiency of wafers in an ion implanter, characterized in that: It includes: A tooling module (11) is prepared, wherein a plurality of tooling stations are divided therein, and each of the tooling stations is provided with a carrying mechanism (2); A loading port module (1) is arranged in front of the preparation tooling module (11), wherein the loading port modules (1) are arranged in a plurality and each loading port module (1) corresponds one-to-one to a tooling station in the preparation tooling module (11); A hanging pick-up and delivery arm is erected above each of the loading port modules (1), wherein the loading port module (1) is provided with a material transport system, wherein the material transport system is used to continuously transport the wafer boxes to the unloading area of ​​the loading port module (1), so that the hanging pick-up and delivery arm can pick up the wafers in the wafer boxes one by one and deliver them to the carrying mechanism (2); A front transfer module (12) is arranged behind the preparation tooling module (11), wherein a vacuum manipulator assembly (3) is arranged in the front transfer module (12), and the vacuum manipulator assembly (3) clamps and transfers a wafer placed on one of the carrier mechanisms (2) each time; The rear transport and transfer module (13) uses the same vacuum manipulator assembly (3) as the front transport and transfer module (12), and the vacuum manipulator assembly (3) in the rear transport and transfer module (13) is horizontally erected along the transmission space in the ion implanter; A temporary stage module (14) is located between the front transfer module (12) and the rear transfer module (13) and is used for temporarily storing the wafers clamped in the vacuum robot assembly (3) in the front transfer module (12); The reaction modules (15) are arranged on both sides of the rear transport and transfer module (13) in the ion implanter, and the reaction modules (15) include an ion source, an acceleration mechanism, and a process chamber, and are used to cooperate to accurately control the type, energy, dosage, and implantation distribution of ions, so as to form an accurately controllable doping layer on the wafer; The bearing mechanism (2) uses a pulsed airflow action to detect the wafer clamping stability after the vacuum manipulator assembly (3) completes the preliminary clamping of the wafer, so that the vacuum manipulator assembly (3) at the front transfer and loading module (12) can judge whether the clamped wafer can be turned over and moved based on the clamping dynamic stability strength. When the clamping dynamic stability strength meets the expected value, the vacuum manipulator assembly (3) at the front transfer and loading module (12) bypasses the temporary stage module (14) and directly docks with the vacuum manipulator assembly (3) in the rear transfer and loading module (13) in mid-air to transfer the wafer; The preparation tooling module (11) is provided with a visual sensor; The bearing mechanism (2) comprises: a transmission frame (21) on which a mounting plate (23) is slidably arranged, a transmission screw (22) is rotatably arranged on one side of the transmission frame (21), and the mounting plate (23) is slidably sleeved on the transmission screw (22) through thread transmission; An upper frame plate (24) is slidably connected to the mounting plate (23), the sliding direction of the upper frame plate (24) is arranged along the vertical direction of the transmission frame (21), a threaded rod (25) is rotatably arranged on the mounting plate (23), the lower part of the upper frame plate (24) is slidably connected to the threaded rod (25) through a threaded sleeve, a motor (26) is fixed to the mounting plate (23), and the output end of the motor (26) is connected to the threaded rod (25) for transmission through gear meshing; A sealing seat (4) is fixed on the upper frame plate (24), and a carrier plate (41) is coaxially arranged in the center of the sealing seat (4); a plurality of air flow holes are opened on the carrier plate (41), and an extended plate groove (42) is provided on the upper end surface of the carrier plate (41).

2. A transmission system for improving the transmission efficiency of ion implanter wafers according to claim 1, characterized in that: The diameter of the carrier (41) is smaller than the diameter of the wafer, a negative pressure cavity is provided inside the carrier (41), and the air flow holes are all connected to the negative pressure cavity; A main shaft (43) is arranged inside the sealing seat (4), a plurality of telescopic guide rods (44) are circumferentially hinged on the main shaft (43), and the telescopic ends of the telescopic guide rods (44) are universally hinged below the carrier plate (41).

3. A transmission system for improving the transmission efficiency of wafers in an ion implanter according to claim 2, characterized in that: The main shaft (43) is rotatably connected in the sealing seat (4), a reduction transmission seat (45) is provided on one side of the sealing seat (4), and the reduction transmission seat (45) is connected to the main shaft (43) for transmission through gear meshing; The plurality of telescopic guide rods (44) are synchronously telescoped to adjust the height between the carrier plate (41) and the sealing seat (4), and the carrier plate (41) is driven to perform spatial deflection in coordination with the telescopic movement.

4. A transmission system for improving the transmission efficiency of ion implanter wafers according to claim 2, characterized in that: A plurality of pulse gas chambers are distributed in the carrier plate (41), a plurality of adjacent air flow holes are divided into a group, each group of air flow holes is connected to a corresponding pulse gas chamber, and each pulse gas chamber is connected to a pulse generator. When the carrier mechanism (2) performs pulsed airflow operation, each group of airflow holes on the opposite side is successively sprayed with pulsed airflow by a pulse generator, and the pulsed airflow impacts the surface and edge position of the non-clamping side of the wafer.

5. The transmission system for improving the transmission efficiency of wafers in an ion implanter according to claim 1, characterized in that: The vacuum manipulator assembly (3) comprises: a slide rail (31) on which a driving seat (32) is slidably arranged, a lifting platform (33) is installed on the driving seat (32), a mechanical arm (34) is installed on one side of the lifting platform (33), one end of the mechanical arm (34) is rotatably connected to a clamper (5), and a transfer plate (35) is installed in the middle of the clamper (5).

6. A transmission system for improving the transmission efficiency of wafers in an ion implanter according to claim 5, characterized in that: The drive seat (32) is driven by a three-speed speed regulating mechanism when sliding along the slide rail (31); the mechanical arm (34) in the vacuum manipulator assembly (3) presents different clamping postures when working based on the speed of each gear of the drive seat (32); and the bearing mechanism (2) freely adjusts the point position of the wafer loading and transmission space according to the clamping posture of the mechanical arm (34).

7. A transmission system for improving the transmission efficiency of wafers in an ion implanter according to claim 5, characterized in that: The clamp (5) comprises: a mounting portion (51), the left and right sides of the inner end surface of which are rotatably provided with clamping fingers (52), each of the connection points between the clamping fingers (52) and the mounting portion (51) is provided with a transmission tooth, two of the transmission teeth are meshed with each other, and a driving tooth (53) is rotatably provided on the mounting portion (51), and the driving tooth (53) is meshed with one of the transmission teeth; The clamping fingers (52) are all fixed with connecting parts (54), the connecting parts (54) are provided with clamping plates (55), and the clamping plates (55) are fixed with anti-slip layers (56); The clamping plate (55) is slidably connected to the connecting portion (54) via two pins, a guide shaft is fixed to the clamping plate (55), two slides are slidably connected to the guide shaft, a support rod (57) is rotatably connected to the slide, one end of the support rod (57) is connected to the connecting portion (54), and an inner spring (58) is sleeved on one side of each slide on the guide shaft; A stress sensor is provided on the connecting portion (54), and the stress sensor is in contact with an inner spring (58).

8. A transmission system for improving the transmission efficiency of wafers in an ion implanter according to claim 7, characterized in that: A rotation cavity is provided inside the transmission tooth of one of the clamping fingers (52), a coupling shaft (6) is coaxially rotatably provided in the rotation cavity, an end of the clamping finger (52) is fixed to the coupling shaft (6), and a fastening spring (61) is connected between the coupling shaft (6) and the transmission tooth; An arc-shaped guide cavity (62) is provided in the rotating cavity, a guide plug is slidably provided in the arc-shaped guide cavity (62), one end of the guide plug is fixed to the coupling shaft (6) through a connecting rod, an air pressure hole (63) is provided on the arc-shaped guide cavity (62), a compression pump is provided on the mounting portion (51), and the compression pump is connected to the air pressure hole (63).

9. A transmission system for improving the transmission efficiency of wafers in an ion implanter according to claim 8, characterized in that: The mounting portion (51) is provided with an angle sensor for detecting the rotation angle between the two clamping fingers (52).

10. The transmission system for improving the transmission efficiency of wafers in an ion implanter according to claim 8, characterized in that: The compression pump controls the airflow of the arc-shaped guide cavity (62) so that the clamping fingers (52) can be adjusted step by step in wafer clamping.

Images