A cooling device for electronic components

Abstract

The present invention provides a cooling and heat dissipation device for electronic components, belonging to the field of electronic component heat dissipation technology. The invention includes a cold head, a fan and a CPU chip, and also includes: a circulating cooling component, an air guide component, and a circulating test component; a micro-water pump drives the coolant to circulate between the cooling box and the circulation box, realizing continuous renewal and cooling of the coolant, and during the circulation process, the heat on the heat exchange fins is quickly taken away by the wind generated by the fan, thereby reducing the temperature increase of the coolant in the circulation box. At the same time, the fan drives the fan-shaped swing arm and the baffle to rotate synchronously, realizing effective cooling of the outside of the circulation box, and also changing the flow rate and direction of the wind, thereby enhancing the heat exchange efficiency; the temperature sensor rotates with the fan-shaped swing arm, and dynamically detects the wind temperature in the air guide tube. This dynamic detection method combines the electrical connection to control the start and stop and speed of the micro-water pump, realizing intelligent adjustment cooling, and the layout is also more flexible.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic components, and in particular to a cooling and heat dissipation device for electronic components. Background Art

[0002] The CPU chip, or central processing unit chip, is the core component of the computer hardware system and is responsible for executing instructions in the computer program. It is a very large-scale integrated circuit (IC) composed of a large number of electronic components. These electronic components mainly include transistors, resistors, capacitors, etc. In the CPU, transistors and other electronic components realize complex logical operations and data processing functions through specific connections and layouts. When current passes through the transistors inside the CPU, Joule heat is generated. Especially when the CPU is running at high speed, such as performing complex tasks or running large software, the heat generated will increase significantly. If the heat generated by the CPU cannot be dissipated in time, its temperature will continue to rise. High temperature will cause the CPU performance to decline or even cause permanent physical damage. Therefore, cooling the CPU is a necessary measure to protect its normal operation.

[0003] Currently, CPU chips are mostly cooled by water or air alone. Under high load or overclocking conditions, air cooling may not be able to meet the CPU's cooling needs, resulting in excessive CPU temperature, affecting system stability and performance. Water-cooled radiators are usually large in size, occupy more chassis space, and have certain requirements for the installation environment, and have poor overall adaptability. In addition, the temperature is only monitored through the CPU's built-in temperature sensor. Due to the CPU's packaging form and heat dissipation design, there is often a temperature difference between the CPU surface temperature and the core temperature, which may reach 15°C to 30°C. Although the core temperature can be directly measured, it cannot fully reflect the temperature distribution outside the CPU package.

[0004] How to invent a cooling and heat dissipation device for electronic components to solve these problems has become an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0005] In order to make up for the above shortcomings, the present invention provides a cooling and heat dissipation device for electronic components, aiming to solve the problems mentioned in the above background.

[0006] The present invention is achieved in that:

[0007] The present invention provides a device for conducting cooling and heat dissipation of electronic components, comprising a cold head, a fan and a CPU chip, wherein the CPU chip is mounted on a mainboard by clamping, fan brackets are arranged on both sides of the fan, and the fan is fixed on the cold head through the fan bracket, and further comprising:

[0008] Circulating cooling component: The circulating cooling component is arranged around the cold head. The circulating cooling component uses a combination of water cooling and air cooling to dissipate the heat of the CPU chip and can also take away its own heat;

[0009] Wind guide assembly: The wind guide assembly is arranged outside the circulating cooling assembly, and is used to change the wind direction and wind force flowing out of the circulating cooling assembly;

[0010] Circulation test component: The circulation test component is arranged on the air guide component, and the circulation test component determines whether the circulation needs to be started according to the wind blown out by the circulation cooling component.

[0011] Preferably, a mounting groove and a mounting part are provided on the back of the cold head, and the mounting part is composed of a mounting frame and a mainboard bracket. The mounting frame is fixedly installed in the mounting groove, and the mainboard bracket is fixed on the mainboard on which the CPU chip is installed. The cold head is fixed on the CPU chip of the mainboard through the mounting frame and the mainboard bracket, and the CPU chip is fitted to the back of the cold head and thermal conductive silicone grease is coated between the two.

[0012] Preferably, the circulating cooling assembly includes a cooling box, a circulation box and a main line. A micro water pump is installed on the side wall of the circulation box. The micro water pump is connected to the cooling box through a pipe and to the circulation box through another pipe. There are two cooling boxes, and the upper and lower ends of the two cooling boxes are connected by two main lines. The side walls of the two cooling boxes are in contact with the side walls of the cold head. The cooling box and the circulation box are both hollow and pre-filled with coolant.

[0013] Preferably, the front end of the cold head is fin-shaped, and a plurality of branch pipes are connected between the two main pipes. The branch pipes are installed on the cold head and close to the CPU chip.

[0014] Preferably, the cross-section of the circulation box is U-shaped, and the cooling box and the side walls of the circulation box are correspondingly provided with liquid replenishing ports, the circulation box is sealingly fitted on the outside of the cooling box, and the liquid replenishing port and the micro water pump are on different sides of the circulation box.

[0015] Preferably, the fan is located between the cold head and the circulation box, a channel is provided through the circulation box corresponding to the fan, heat exchange fins are connected in the channel, and the heat exchange fins and the fins of the cold head are coated with a thermal conductive coating.

[0016] Preferably, the air guide assembly includes an air guide shell and an air guide tube, the air guide tube is fixedly arranged on the outside of the channel, the air guide tube is composed of an open area and a closed area, the air guide shell is fixedly arranged at the front end of the air guide tube, the middle part of the air guide shell is penetrated by a slot hole matching the channel, the side wall of the air guide tube is annularly arranged with several air outlet grooves, and the ends of the air outlet grooves pass through the side wall of the air guide tube.

[0017] Preferably, the air guide assembly also includes a connecting shaft, which is fixedly connected to the main shaft of the fan, and the heat exchange fins are provided with a channel matching the connecting shaft. The connecting shaft is fixedly connected with a fan-shaped swing arm and a baffle in sequence from the inside to the outside, and the fan-shaped swing arm is hollowed in the middle, and both sides of the air guide shell are folded toward the cold head.

[0018] Preferably, the baffle plate is fitted with the closed area, and the front side of the air guide shell is in a closed state when the baffle plate overlaps with the open area. The outer wall of the fan-shaped swing arm is fitted with the inner wall of the air guide tube, and the outer end surface of the fan-shaped swing arm can completely cover the air outlet groove.

[0019] Preferably, the circulation test assembly includes a support plate fixedly connected inside the fan-shaped swing arm, a temperature sensor is fixedly connected to the support plate, and the temperature sensor is electrically connected to the micro water pump.

[0020] The beneficial effects of the present invention are:

[0021] 1. The micro water pump drives the coolant to circulate between the cooling box and the circulation box, realizing the continuous renewal and cooling of the coolant. During the circulation process, the heat on the heat exchange fins is quickly taken away by the wind force generated by the fan, thereby reducing the temperature rise of the coolant in the circulation box, so that the coolant can maintain a lower temperature during the circulation process, thereby more effectively absorbing and taking away the heat of the CPU chip.

[0022] 2. At the same time, the air guide assembly rotates through the fan-driven connecting shaft, driving the fan-shaped swing arm and the baffle to rotate synchronously, thereby achieving effective cooling of the outside of the circulation box. The fan-shaped swing arm intermittently blocks different air outlet slots during rotation, changing the flow rate and direction of the wind, enhancing the heat exchange efficiency, and reducing airflow turbulence and energy loss.

[0023] 3. The temperature sensor rotates with the fan-shaped swing arm and dynamically detects the wind temperature in the air guide tube. When the air guide shell is closed, the sensor can more accurately capture the wind temperature after heat exchange treatment and reflect the temperature changes around the CPU chip in real time. This dynamic detection method combines the electrical connection to control the start and stop and speed of the micro water pump, realizes the intelligent adjustment of the cooling system, and improves the stability and efficiency of the system. A dynamic detection mechanism is added on the basis of the built-in sensor of the CPU. The dynamic detection method in this device can reflect the temperature changes around the CPU chip in a more real-time and accurate manner, reducing the influence of factors such as sensor position and contact method on the measurement results, and improving accuracy.

[0024] 4. By combining the dual cooling methods of water cooling and air cooling, the device achieves efficient heat dissipation of the CPU chip. Compared with the traditional single cooling method, through the setting of the circulation box and the cold conduction box, the device is smaller in size and more flexible in layout, which helps to save space inside the chassis and makes the layout of other hardware components more reasonable and efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 This is a schematic diagram of the overall structure of a cooling and heat dissipation device for electronic components provided by the present invention;

[0027] Figure 2 This is a structural schematic diagram of a cold head of a cooling and heat dissipation device for electronic components provided by the present invention when it is attached to a CPU chip;

[0028] Figure 3 This is a schematic diagram of the back structure of a cold head of a cooling and heat dissipation device for electronic components provided by the present invention;

[0029] Figure 4 This is a schematic diagram of the exploded structure of a cooling and heat dissipation device for electronic components provided by the present invention;

[0030] Figure 5 It is a schematic cross-sectional structure diagram of a cooling and heat dissipation device for electronic components provided by the present invention;

[0031] Figure 6 This is a schematic diagram of the structure of an air guide tube and a baffle of a cooling and heat dissipation device for electronic components provided by the present invention;

[0032] Figure 7This is a schematic diagram of the structure of a liquid filling port of a cooling and heat dissipation device for electronic components provided by the present invention;

[0033] Figure 8 This is a schematic diagram of the installation structure of a circulation box and an air guide tube of a cooling and heat dissipation device for electronic components provided by the present invention;

[0034] Fig. 9 It is a schematic diagram of the installation structure of a fan-shaped swing arm, a baffle and a connecting shaft of a cooling and heat dissipation device for electronic components provided by the present invention;

[0035] Fig.10 The present invention is a schematic structural diagram of an electronic component cooling and heat dissipation device in operation.

[0036] In the figure: 1. cold head; 2. fan; 3. cold guide box; 4. mounting frame; 5. circulation box; 6. micro water pump; 7. air guide shell; 8. support plate; 9. air guide tube; 10. CPU chip; 101. mounting slot; 201. fan bracket; 202. connecting shaft; 203. fan-shaped swing arm; 204. baffle; 301. main line; 302. branch pipe; 303. liquid filling port; 401. main board bracket; 501. heat exchange fins; 801. temperature sensor; 901. open area; 902. closed area; 903. air outlet slot. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] Embodiment 1, refer to Figure 1-Figure 5 A cooling device for electronic components includes a cold head 1, a fan 2 and a CPU chip 10. The CPU chip 10 is mounted on a mainboard by snapping. Fan brackets 201 are provided on both sides of the fan 2. The fan 2 is fixed on the cold head 1 through the fan brackets 201. The fan 2 is used to accelerate the air flow around the cold head 1 to enhance the heat dissipation effect. The device also includes:

[0039] Circulating cooling component: The circulating cooling component is arranged around the cold head 1. The circulating cooling component uses a combination of water cooling and air cooling to dissipate heat from the CPU chip 10, while taking away its own heat;

[0040] Air guide assembly: The air guide assembly is arranged outside the circulating cooling assembly, and is used to change the wind direction and wind force flowing out of the circulating cooling assembly;

[0041] Circulation test component: The circulation test component is set on the air guide component. The circulation test component determines whether the circulation needs to be started according to the air blown out by the circulation cooling component.

[0042] Furthermore, a mounting groove 101 and a mounting part are provided on the back of the cold head 1. The mounting part is composed of a mounting frame 4 and a mainboard bracket 401. The mounting frame 4 is fixedly installed in the mounting groove 101. The mainboard bracket 401 is fixed on the mainboard on which the CPU chip 10 is installed. The cold head 1 is fixed on the CPU chip 10 of the mainboard through the mounting frame 4 and the mainboard bracket 401. The CPU chip 10 fits with the back of the cold head 1 and thermal conductive silicone grease is applied between the two to ensure that heat can be effectively transferred from the CPU chip 10 to the cold head 1.

[0043] Furthermore, the circulating cooling assembly includes a cooling box 3, a circulation box 5 and a main line 301. A micro water pump 6 is installed on the side wall of the circulation box 5. The micro water pump 6 is connected to the cooling box 3 through a pipe and to the circulation box 5 through another pipe. There are two cooling boxes 3. The upper and lower ends of the two cooling boxes 3 are connected through two main lines 301. The side walls of the two cooling boxes 3 are both in contact with the side walls of the cold head 1. The cooling box 3 and the circulation box 5 are both hollow and pre-filled with coolant. The cooling box 3 transfers the heat absorbed by the cold head 1 to the coolant through heat exchange. The front end of the cold head 1 is fin-shaped, which increases the heat dissipation area and improves To improve the heat dissipation efficiency, a plurality of branch pipes 302 are arranged between the two main pipes 301, and the branch pipes 302 are installed on the cold head 1 and close to the CPU chip 10. The design of the main pipe 301 and the branch pipe 302 ensures that the coolant is evenly distributed in the cold conduction box 3 and the cold head 1, thereby improving the heat exchange efficiency. The micro water pump 6 drives the coolant to circulate between the cold conduction box 3 and the circulation box 5, and the heat generated by the CPU chip 10 is taken away by the coolant. Through the arrangement of the fan 2, the cold conduction box 3, the circulation box 5, the main pipe 301 and the branch pipe 302, the CPU chip 10 is dissipated in a clever way by combining water cooling and air cooling, thereby improving the heat dissipation efficiency and making the volume smaller.

[0044] It should be noted that the cross-section of the circulation box 5 is U-shaped, which can effectively wrap the cold conduction box 3. The cold conduction box 3 and the side wall of the circulation box 5 are correspondingly provided with a liquid replenishing port 303. The circulation box 5 is sealed and fitted on the outside of the cold conduction box 3. The liquid replenishing port 303 and the micro water pump 6 are on different sides of the circulation box 5. The fan 2 is located between the cold head 1 and the circulation box 5. A channel is provided on the circulation box 5 corresponding to the fan 2. The heat exchange fins 501 are connected in the channel. The heat exchange fins 501 and the fins of the cold head 1 are coated with a thermal conductive coating. The thermal conductive coating can select a nano heat pipe coating, etc., to further improve In order to improve the heat dissipation performance, the wind force generated by the fan 2 can be used to perform heat exchange treatment on the heat exchange fins 501, thereby reducing the temperature of the circulation box 5. When the micro water pump 6 is started, the coolant (with high temperature) is pumped into the circulation box 5 through the cold conduction box 3 on the side close to the water pump, and the coolant originally in the circulation box 5 (with low temperature) will be replenished into the cold conduction box 3 through the replenishing port 303, thereby realizing the cooling cycle. During the circulation of the coolant, the fan 2 can not only speed up the air circulation of the cold head 1, but also cool the heat exchange fins 501, thereby realizing the double cooling of the cold conduction box 3 and the circulation box 5.

[0045] In this embodiment, the heat generated by the CPU chip 10 during operation is quickly transferred to the cold head 1 through the thermal grease applied between the CPU chip 10 and the back of the cold head 1. The front end of the cold head 1 adopts a fin-shaped design to increase the heat dissipation area and improve the heat dissipation efficiency. The two cold conduction boxes 3 in the circulating cold conduction assembly are tightly attached to the side wall of the cold head 1, and the heat absorbed by the cold head 1 is transferred to the coolant inside it through heat exchange.

[0046] Concentrated absorption of heat: The branch pipes 302 are directly mounted on the cold head 1 and close to the CPU chip 10, which enables them to more effectively absorb and disperse the heat conducted from the CPU chip 10 to the cold head 1. Since the CPU chip 10 is the main source of heat generation, the close arrangement of the branch pipes 302 ensures that the coolant can quickly and directly exchange heat with these high temperature areas.

[0047] Uniform distribution of coolant: The branch pipes 302 serve as branches for the flow of coolant, and they guide the coolant from the main pipe 301 to various key heat dissipation areas of the cold head 1. This design ensures uniform distribution of the coolant on the surface of the cold head 1, thereby improving the overall heat exchange efficiency.

[0048] When the micro water pump 6 is started, it drives the coolant to circulate between the cold conduction box 3 and the circulation box 5. The coolant (high temperature) is pumped into the circulation box 5 through the cold conduction box 3 on the side close to the water pump, and the coolant originally in the circulation box 5 (low temperature) is replenished into the cold conduction box 3 through the liquid replenishment port 303 to realize the cooling cycle. Subsequently, the coolant (low temperature) is diverted to different areas of the cold head 1 through the main line 301 and the branch pipe 302, especially the area close to the CPU chip 10. Here, the coolant absorbs a lot of heat and becomes warm. As the coolant continues to flow, it eventually returns to the circulation box 5. In the circulation box 5, the coolant with a higher temperature is mixed with the coolant with a lower temperature, and is pumped to the cold conduction box 3 again through the micro water pump 6 for the next round of circulation. In the whole process, the branch pipe 302, as a key component connecting the main line 301 and the cold head 1, ensures that the coolant can be efficiently and evenly distributed on the cold head 1, thereby realizing efficient heat dissipation of the CPU chip 10.

[0049] The fan 2 is fixed on the cold head 1 and supported by the fan bracket 201, which accelerates the air flow around the cold head 1 and enhances the heat dissipation effect. The fan 2 not only directly blows air to the fins of the cold head 1 to dissipate heat, but also cools the heat exchange fins 501 provided on the circulation box 5 through the wind force it generates. The heat exchange fins 501 and the fins of the cold head 1 are coated with a thermal conductive coating (such as a nano heat pipe coating) to further improve the heat dissipation performance. The wind force of the fan 2 acts on the heat exchange fins 501 through the holes on the circulation box 5, reduces the temperature of the circulation box 5, and thereby indirectly reduces the temperature of the coolant in the circulation box 5, thereby realizing double cooling of the cold conduction box 3 and the circulation box 5.

[0050] Through the dual effects of water cooling (coolant circulation in the cooling box 3 and the circulation box 5) and air cooling (fan 2 accelerates air flow), efficient heat dissipation of the CPU chip 10 is achieved. This combination is more effective than a single heat dissipation method and can dissipate the heat generated by the CPU faster. Compared with the traditional single heat dissipation method (such as a water-cooled radiator or an air-cooled tower), this heat dissipation system combining water cooling and air cooling is smaller in size and more flexible in layout, which helps to save the internal space of the chassis and makes the layout of other hardware components more reasonable and efficient. The micro water pump 6 is responsible for driving the coolant to circulate between the cooling box 3 and the circulation box 5, realizing the continuous renewal and cooling of the coolant. This circulation mechanism ensures that the coolant can continuously absorb heat from the CPU chip 10 and take it away. In the circulation process, the heat on the heat exchange fins 501 is quickly taken away by the wind force generated by the fan 2, thereby reducing the temperature increase of the coolant in the circulation box 5. This design enhances the efficiency of the entire heat dissipation system, allowing the coolant to maintain a lower temperature during the circulation process, thereby more effectively absorbing and taking away the heat of the CPU chip 10.

[0051] Example 2, refer to Figure 4-Figure 10 The air guide assembly includes an air guide shell 7 and an air guide tube 9. The air guide tube 9 is fixedly arranged on the outside of the channel. The air guide tube 9 is composed of an open area 901 and a closed area 902. The air guide shell 7 is fixedly arranged at the front end of the air guide tube 9. A slot hole matching the channel is penetrated in the middle of the air guide shell 7. A plurality of air outlet grooves 903 are annularly arranged on the side wall of the air guide tube 9. The ends of the air outlet grooves 903 penetrate the side wall of the air guide tube 9.

[0052] Furthermore, the air guide assembly also includes a connecting shaft 202, which is fixedly connected to the main shaft of the fan 2. A channel matching the connecting shaft 202 is provided on the heat exchange fin 501. A fan-shaped swing arm 203 and a baffle 204 are fixedly connected to the connecting shaft 202 in sequence from the inside to the outside. When the fan 2 rotates, the connecting shaft 202 will drive the fan-shaped swing arm 203 and the baffle 204 to rotate synchronously. The fan-shaped swing arm 203 is hollowed out in the middle, which not only reduces the weight but also maintains ventilation. The two sides of the air guide shell 7 are folded toward the cold head 1 to ensure that the wind flow blown out by the fan 2 will be blocked by the air guide shell 7 and guided to the circulation box 5.

[0053] It should be noted that the baffle 204 is fitted with the closed area 902. When the baffle 204 overlaps with the open area 901, the front side of the air guide shell 7 is in a closed state, and the outer wall of the fan-shaped swing arm 203 is fitted with the inner wall of the air guide tube 9. The outer end surface of the fan-shaped swing arm 203 can completely cover the air outlet slot 903. When the air guide shell 7 is opened, outside air can enter. When the air guide shell 7 is blocked and closed by the baffle 204, the wind will flow to the outside of the circulation box 5 through the air outlet slot 903. When the connecting shaft 202 rotates, the air guide shell 7 will be continuously in a closed, open and closed state, and the outer wall of the fan-shaped swing arm 203 is fitted with the inner wall of the air guide tube 9, and the outer end surface can cover the air outlet slot 903. Different air outlet slots 903 are intermittently blocked by rotation, thereby changing the flow rate and direction of the wind flowing out of the air outlet slot 903.

[0054] In this embodiment, the air guide assembly drives the connecting shaft 202 to rotate through the rotation of the fan 2, thereby driving the fan-shaped swing arm 203 and the baffle 204 to rotate synchronously. The air guide shell 7 is fixedly arranged at the front end of the air guide tube 9, and the folding design on both sides ensures that the airflow blown out by the fan 2 is guided to the circulation box 5, thereby realizing external cooling of the circulation box 5 and improving the efficiency of the coolant circulation cooling.

[0055] When the fan 2 is working, the connecting shaft 202 drives the fan-shaped swing arm 203 and the baffle 204 to rotate, and the baffle 204 fits with the closed area 902, and when it overlaps with the open area 901, it closes the front side of the air guide housing 7 to prevent air from passing directly. At this time, since the air guide housing 7 is closed by the baffle 204, the wind is forced to flow out through the air outlet slot 903 of the air guide cylinder 9 and flow to the outside of the circulation box 5.

[0056] During the rotation of the fan-shaped swing arm 203, its outer side wall is in contact with the inner wall of the air guide tube 9, and the outer end surface can completely cover different air outlet slots 903. As the fan-shaped swing arm 203 rotates, it intermittently blocks different air outlet slots 903, and can change the flow rate and direction of the wind flowing out of these air outlet slots 903 without changing the rotation speed of the fan 2. This dynamic adjustment mechanism enhances the heat exchange efficiency, ensures that the wind flow can flow along the predetermined path, and reduces air flow turbulence and energy loss.

[0057] Example 3, refer to Figure 8-Figure 10 The circulation test assembly includes a support plate 8 fixedly connected inside the fan-shaped swing arm 203, and a temperature sensor 801 is fixedly connected to the support plate 8. The temperature sensor 801 is electrically connected to the micro water pump 6. The temperature sensor 801 controls the working state of the micro water pump 6 according to the detected wind temperature.

[0058] In this embodiment, when the fan-shaped swing arm 203 rotates, the temperature sensor 801 will also rotate accordingly. This design enables the temperature sensor 801 to dynamically detect the wind temperature blown out by the fan 2 in the air guide tube 9 as the fan-shaped swing arm 203 rotates. In particular, when the air guide shell 7 is in a closed state, the temperature sensor 801 is located in a relatively closed space, which can more accurately capture the wind temperature after the heat exchange treatment of the fins of the cold head 1 and the heat exchange fins 501. An electrical connection is established between the temperature sensor 801 and the micro-water pump 6, so it can control the start and stop and speed of the micro-water pump 6 in real time according to the detected wind temperature. This dynamic feedback mechanism combined with the built-in sensor of the CPU chip 10 ensures that the cooling system can automatically adjust according to the actual temperature condition of the CPU chip 10, thereby more effectively controlling the temperature and improving the stability and efficiency of the system.

[0059] A dynamic detection mechanism is added on the basis of the built-in sensor of the CPU chip 10. This method enables the device to reflect the temperature changes around the CPU chip in a more real-time and accurate manner. After the wind has passed through the heat exchange treatment of the cold head 1 and the heat exchange fins 501, its temperature can more directly reflect the heat dissipation effect of the CPU chip 10, reducing the influence of factors such as sensor position and contact method on the measurement results, improving accuracy, and thus improving the heat dissipation efficiency of the device.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A device for conducting cooling and heat dissipation of electronic components, comprising a cold head (1), a fan (2) and a CPU chip (10), wherein the CPU chip (10) is mounted on a mainboard by snap-fitting, and fan brackets (201) are arranged on both sides of the fan (2), and the fan (2) is fixed on the cold head (1) through the fan brackets (201), characterized in that: Also includes: The back of the cold head (1) is provided with a mounting groove (101) and a mounting portion, the mounting portion is composed of a mounting frame (4) and a motherboard bracket (401), the mounting frame (4) is fixedly mounted in the mounting groove (101), the motherboard bracket (401) is fixed on a motherboard on which a CPU chip (10) is mounted, the cold head (1) is fixed on the CPU chip (10) of the motherboard through the mounting frame (4) and the motherboard bracket (401), the CPU chip (10) is in contact with the back of the cold head (1), and thermal conductive silicone grease is applied between the two; Circulating cooling component: the circulating cooling component is arranged around the cold head (1); The circulating cooling assembly comprises a cooling box (3), a circulation box (5) and a main pipe (301); a micro water pump (6) is installed on the side wall of the circulation box (5); the micro water pump (6) is connected to the cooling box (3) via a pipe and is connected to the circulation box (5) via another pipe; there are two cooling boxes (3); the upper and lower ends of the two cooling boxes (3) are connected via two main pipes (301); the side walls of the two cooling boxes (3) are both in contact with the side walls of the cold head (1); the cooling boxes (3) and the circulation box (5) are both hollow and pre-filled with coolant; Air guide component: the air guide component is arranged on the outside of the circulating cooling component; Circulation test assembly: The circulation test assembly is arranged on the air guide assembly.

2. The electronic component cooling device according to claim 1, characterized in that: The cold head (1) has a fin-shaped front end, and a plurality of branch pipes (302) are arranged in communication between the two main pipes (301). The branch pipes (302) are installed on the cold head (1) and are close to the CPU chip (10).

3. The electronic component cooling device according to claim 1, characterized in that: The cross section of the circulation box (5) is U-shaped, and the side walls of the cold conduction box (3) and the circulation box (5) are provided with liquid replenishment ports (303) correspondingly thereto, the circulation box (5) is sealingly arranged on the outside of the cold conduction box (3), and the liquid replenishment port (303) and the micro water pump (6) are located on different sides of the circulation box (5).

4. The electronic component cooling device according to claim 1, characterized in that: The fan (2) is located between the cold head (1) and the circulation box (5), and a channel is provided through the circulation box (5) corresponding to the fan (2), and a heat exchange fin (501) is connected in the channel, and the heat exchange fin (501) and the fins of the cold head (1) are both coated with a thermal conductive coating.

5. The electronic component cooling device according to claim 4, characterized in that: The air guide assembly comprises an air guide shell (7) and an air guide tube (9); the air guide tube (9) is fixedly arranged on the outside of the hole; the air guide tube (9) is composed of an open area (901) and a closed area (902); the air guide shell (7) is fixedly arranged at the front end of the air guide tube (9); a slot hole matching the hole is provided through the middle of the air guide shell (7); a plurality of air outlet slots (903) are provided in an annular manner on the side wall of the air guide tube (9); the ends of the air outlet slots (903) pass through the side wall of the air guide tube (9).

6. The electronic component cooling device according to claim 5, characterized in that: The air guide assembly further comprises a connecting shaft (202), the connecting shaft (202) being fixedly connected to the main shaft of the fan (2), the heat exchange fin (501) being provided with a channel matching the connecting shaft (202), the connecting shaft (202) being fixedly connected with a fan-shaped swing arm (203) and a baffle (204) in sequence from the inside to the outside, the fan-shaped swing arm (203) being hollowed out in the middle, and the two sides of the air guide shell (7) being folded toward the cold head (1).

7. The electronic component cooling device according to claim 6, characterized in that: The baffle plate (204) is arranged to fit with the closed area (902); when the baffle plate (204) overlaps with the open area (901), the front side of the air guide shell (7) is in a closed state; the outer wall of the fan-shaped swing arm (203) fits with the inner wall of the air guide cylinder (9); and the outer end surface of the fan-shaped swing arm (203) can completely cover the air outlet groove (903).

8. The electronic component cooling device according to claim 7, characterized in that: The circulation test assembly comprises a support plate (8) fixedly connected inside the fan-shaped swing arm (203), a temperature sensor (801) fixedly connected to the support plate (8), and an electrical connection between the temperature sensor (801) and the micro water pump (6).

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