Cylinder rotating multi-path laser beam machining method

Abstract

The invention discloses a cylinder rotating multi-path laser beam machining method, and relates to the technical field of cylinder surface machining. The processing method comprises the following steps: S1, adjusting a light path of a laser; s2, light is emitted through a laser, dotting or routing is conducted on the surface of the polyurethane cylinder, and the laser is driven by a marking control system to shift; s3, a laser is moved to the focus position of the polyurethane cylinder, the laser emits light to conduct marking and grooving, the polyurethane cylinder rotates by a circle at the same time, and when the marking and grooving line width of the laser is the same as the rotation line width of the polyurethane cylinder, adjustment of the light path position of the laser is completed; and S4, parameters of the marking control system are adjusted, the laser device reaches the machining slotting position, the laser device emits light, and the polyurethane cylinder is machined. According to the cylinder rotating multi-path laser beam machining method, polyurethane cylinders are machined through laser, the limited production cost change is achieved, the production efficiency is remarkably improved, and the production cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of cylindrical surface processing, and in particular to a cylindrical rotating multi-path laser beam processing method. Background Art

[0002] Polyurethane (PU), full name polyurethane, is a polymer compound composed of polyisocyanate and polyhydroxy polymer. Polyurethane is an excellent material with high strength, wear resistance and compression resistance. The polyurethane cylinder is a workpiece to be processed by laser processing (grooving). The current grooving equipment is lathe processing, which requires consumables such as turning tools and cutting fluids during use, increasing corporate costs. At this stage, battery cells are getting thinner and thinner, and lathes are currently unable to meet the trend of thinning battery cells.

[0003] Therefore, there is an urgent need for a cylindrical rotating multi-path laser beam processing method that has low learning cost, simple operation, higher processing efficiency and faster grooving speed than lathe processing.

[0004] Compared with plane machining, cylindrical machining is mainly aimed at the processing and treatment of flat materials. Plane machining is relatively simple, and the position of the laser beam and the surface of the workpiece is relatively fixed, making it easy to control the accuracy and processing depth. Cylindrical machining mainly involves curved surface machining, which requires precise control of the laser focal length to avoid problems such as misfocusing. Compared with traditional lathe machining, cylindrical laser machining has higher precision and more stringent processing requirements, high processing efficiency, and no need to replace auxiliary tools such as cutting tools. Although the initial investment is large, considering its high precision and high efficiency characteristics as well as subsequent processing procedures and costs, it has high cost-effectiveness in the long run.

[0005] However, cylindrical laser processing technology still faces some challenges in practical applications, such as: 1. How to maintain the uniformity and stability of the groove shape during laser surface processing and rotation processing;

[0006] 2. Plane processing is mostly static processing, while curved surface processing requires mechanical coordination and rotation processing, which is more difficult to process; 3. For cylindrical slotting processing, the spacing between slots is micron-level, which requires a relatively stable site, level, equipment mechanical structure, etc.

[0007] 4. The control of laser focus becomes particularly important in the process of curved surface processing, because the change of focus directly affects the groove depth, angle, top width and bottom width due to the characteristics of curved surface processing;

[0008] 5. During the surface processing, the stability of the laser system must be ensured to avoid processing errors caused by vibration or unstable laser beam, which requires the processing equipment to have high precision and high stability;

[0009] 6. Laser has certain requirements for the surface of the processed cylinder. The surface of the cylinder needs to be kept flat to avoid unevenness. The surface should be smooth, free of slag and defects to meet the processing requirements. Summary of the invention

[0010] In order to solve the above technical problems, the present invention provides a cylindrical rotating multi-path laser beam processing method, which requires the laser to cooperate with the marking control system to change the Y and X axes of the laser to shift up and down and left and right, so that the two laser beams of L1 laser and L2 laser can be spliced ​​and beamed on the surface of the workpiece (polyurethane cylinder), find the most concentrated point (focal point) of the laser beam, and process and groove the polyurethane cylinder. The specific technical solutions include the following:

[0011] A cylindrical rotating multi-path laser beam processing method is provided, comprising the following steps:

[0012] S1. Adjust the optical path of the laser, wherein the laser includes an L1 laser and an L2 laser, and the optical paths of the L1 laser and the L2 laser are on the same parallel line;

[0013] S2. Use laser to make dots or lines on the surface of the polyurethane cylinder, use a magnifying glass to observe and take pictures, and measure the distance between the dots or lines made by the L1 laser and the L2 laser. If there is a deviation, drive the laser to move up and down, left and right along the Y and X axes of the laser through the marking control system;

[0014] S3. Move the laser along the Y axis of the laser to the focal point of the polyurethane cylinder, and the L1 and L2 lasers emit light to mark and groove. The laser starts to move along the X axis of the laser, and the polyurethane cylinder rotates one circle at the same time. The laser moves 3-5mm along the X axis, and then observes and measures the line width of the L1 and L2 lasers marked and grooved using a microscope. When the line width of the L1 and L2 lasers marked and grooved is the same as the line width of the polyurethane cylinder rotation, the adjustment of the L1 and L2 laser optical path positions is completed;

[0015] S4. Adjust the parameters of the marking control system, confirm that the L1 laser and the L2 laser reach the processing slot position, and the L1 laser and the L2 laser emit light and contact the surface of the polyurethane cylinder to process the polyurethane cylinder.

[0016] Preferably, in step S1, multiple beams of light are concentrated by means of hardware DOE, focusing mirror, beam expander, galvanometer, and beam splitter, thereby adjusting the optical path of the laser.

[0017] Preferably, in step S1, a frequency doubling plate is used for observation to ensure that the optical paths of the L1 and L2 lasers are on the same parallel line.

[0018] Preferably, the laser is arranged on a base, the base is arranged on a screw rod, and the base is slidably connected to the screw rod. The laser, base and screw rod constitute a laser module.

[0019] Preferably, the X-axis of the laser is horizontal, and the Y-axis of the laser is vertical.

[0020] Furthermore, in step S4, the marking control system has a marking speed of 100-10000 mm / s, a jump speed of 100-10000 mm / s, a frequency of 10-3000 khz, a marking, turning, and jumping delay of 0-100 μs, a light on and off delay of 100-1000 μs, and a marking number of 1-100 times.

[0021] Furthermore, in step S1, the laser is one of an ultraviolet laser, a green laser, an infrared laser, and a CO2 laser.

[0022] Furthermore, in step S1, the power of the laser is 10-100 kHz.

[0023] Furthermore, before step S1, a step of calibrating the marking coordinate system is also included, and the calibrating the marking coordinate system is to change the X-axis and Y-axis coordinate systems of the L1 laser and the L2 laser through a marking control system.

[0024] Preferably, the calibration marking coordinate system is to draw a "positive" on the marking control system, mark up and down, left and right, and emit light from the L1 laser to mark on the surface of the aluminum plate or photo paper. The marked pattern can be observed by the naked eye. For example, if the direction of the coordinate system is incorrect, the X and Y axis coordinate systems are changed through the marking control system, and light is emitted again for marking, and so on. The same applies to the L2 laser.

[0025] Furthermore, before step S1, a step of adjusting the marking width is also included, wherein the marking width is adjusted by adjusting the calibration accuracy of the L1 laser and the L2 laser to within ±1 um through the marking control system.

[0026] Preferably, the adjustment of the marking format is to draw a 20*20 standard square on the marking control system, use the L1 laser to mark the aluminum plate or photo paper, use a vernier caliper or a two-dimensional element to measure the diagonal dimensions of the four sides, compare them with the actual values, and input the measured dimensions into the corresponding position of the marking control system. If the marked figure is not the drawn 20*20 square, it is necessary to continue marking after the input is completed until the correction accuracy reaches within ±1um. The same applies to the L2 laser.

[0027] Furthermore, in step S2, mechanical ejectors are provided at both ends of the polyurethane cylinder.

[0028] Furthermore, in step S3, a motor is used to drive the polyurethane cylinder to rotate, and the motor rotation speed is 100-20000 mm / s.

[0029] Preferably, the focal point is the position where the energy density of the laser beam to the workpiece is the highest and the laser power is most concentrated.

[0030] Furthermore, in step S4, the L1 laser and the L2 laser emit light simultaneously and contact the surface of the polyurethane cylinder synchronously.

[0031] Among them, the L1 laser and the L2 laser emit light at the same time, which is a synchronous emitting light grooving mode; the L1 and L2 lasers emit light synchronously, and according to the process parameters preset by the marking control system, grooves are processed on the surface of the polyurethane cylinder. The marking control system accurately controls the start and stop of the L1 and L2 lasers to achieve precise processing of the two lasers.

[0032] Furthermore, in step S4, the L1 laser and the L2 laser emit light in a staggered manner, and the L1 laser is used to process the polyurethane cylinder through the host computer operating system. After the L1 laser is processed, the L2 laser is used to process the polyurethane cylinder through the host computer operating system. The above steps are repeated to complete the processing of the polyurethane cylinder.

[0033] Among them, the L1 laser and the L2 laser are staggered in the way of emitting light by alternating grooving and splicing; the two lasers work alternately, the L1 laser completes part of the groove processing, and the L2 laser then completes the processing of the remaining part, and so on to complete the processing of the entire cylinder. This method can reduce the load of continuous operation of the laser to a certain extent, while ensuring the processing efficiency and processing time.

[0034] Preferably, in step S4, before the L1 laser and the L2 laser emit light in a staggered manner, it is necessary to confirm that the optical path and focus are correct.

[0035] Compared with the prior art, the present invention has the following beneficial effects:

[0036] 1. Laser processing of polyurethane cylinders, limited production cost changes, significantly improved production efficiency and reduced production costs;

[0037] 2. This laser processing method is a new type of non-contact processing. Traditional lathe processing is a contact cutting process, which cannot avoid the problem of heat accumulation and the impact on the groove shape. In addition, traditional lathe processing requires cutting fluid to assist in cooling. Therefore, the laser processing method of the present invention can significantly reduce costs by reducing consumables such as tools and cutting fluids;

[0038] 3. The laser processing process is local processing, the heat-affected zone of the non-laser irradiated part is small, and the thermal deformation of the polyurethane main roller is smaller;

[0039] 4. The cylindrical processing shape, angle, depth, etc. can be quickly changed, while the turning tool changes of traditional lathe processing need to be customized in advance, which takes a long time and is expensive. The tool cannot be directly put into production after debugging in the early stage. After debugging, it is necessary to replace the tool with a new one to start production;

[0040] 5. Compared with the single laser processing slotting technology, the dual laser has significantly improved efficiency, the slotting effect is better, rounder and fuller, the burrs are significantly reduced, the edge transition is smooth and natural, and the morphology effect is obviously superior;

[0041] 5. Simultaneous processing by multiple lasers can significantly shorten the processing time. Through precise mechanical control, it can reduce errors and defects in processing, improve the accuracy and consistency of the groove shape, and can adapt to different sizes and different polyurethane coating ratios to meet different needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0043] Figure 1 It is a schematic diagram of the structure of the polyurethane cylinder in Example 1 and Example 2 of the present invention;

[0044] Figure 2 It is a schematic diagram of the structure of the laser and the polyurethane cylinder in Example 1 and Example 2 of the present invention;

[0045] Figure 3 Schematic top view of the laser and the polyurethane cylinder in Example 1 and Example 2 of the present invention;

[0046] Figure 4 This is a processing schematic diagram of a cylindrical rotating multi-path laser beam processing method according to Embodiment 1 of the present invention;

[0047] Figure 5 This is a processing schematic diagram of a cylindrical rotating multi-path laser beam processing method according to Embodiment 1 of the present invention;

[0048] Figure 6 This is a schematic diagram of the surface structure of a polyurethane cylinder after being processed by the cylindrical rotating multi-path laser beam processing method according to Example 1 of the present invention;

[0049] Figure 7 This is a processing schematic diagram of a cylindrical rotating multi-path laser beam processing method according to Embodiment 2 of the present invention;

[0050] Figure 8This is a schematic diagram of the surface structure of a polyurethane cylinder after being processed by the cylindrical rotating multi-path laser beam processing method according to Example 2 of the present invention.

[0051] Description of the symbols in the figure:

[0052] 1-polyurethane cylinder; 2-mechanical ejector pin; 3-laser; 4-L1 laser; 5-L2 laser. DETAILED DESCRIPTION

[0053] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0054] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0055] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0056] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0057] In order to more fully understand the technical content of the present invention, the technical solution of the present invention is further introduced and illustrated in conjunction with specific embodiments below.

[0058] Among them, the embodiment of the present invention concentrates multiple beams of light through hardware DOE, focusing mirror, beam expander, galvanometer, and beam splitter, thereby adjusting the optical path of the laser.

[0059] The laser described in the embodiment of the present invention is arranged on a base, the base is arranged on a screw rod, and the base is slidably connected to the screw rod. The laser, the base, and the screw rod constitute a laser module. The X-axis of the laser is horizontal, and the Y-axis of the laser is vertical.

[0060] The calibration marking coordinate system described in the embodiment of the present invention is to draw a "positive" on the marking control system, mark up and down, left and right, and emit light from the L1 laser to mark on the surface of the aluminum plate or photo paper, and observe the marking pattern. The marked pattern can be observed by naked eyes. For example, if the direction of the coordinate system is wrong, the X and Y axis coordinate systems are changed by the marking control system, and the light is emitted again for marking, and so on. The same is true for the L2 laser. The adjustment of the marking format described in the embodiment of the present invention is to draw a 20*20 standard square on the marking control system, and emit light from the L1 laser to mark the aluminum plate or photo paper, and use a vernier caliper or a two-dimensional element to measure the diagonal dimensions of the four sides, compare them with the actual values, and input the measured dimensions into the corresponding position of the marking control system. If the marked pattern is not the 20*20 square drawn, it is necessary to continue marking after the input is completed until the calibration accuracy reaches within ±1um, and the same is true for the L2 laser.

[0061] The focal point is the position where the energy density of the laser beam to the workpiece is the highest and the laser power is most concentrated.

[0062] Example

[0063] like Figure 1-Figure 3 As shown, Figure 1 It is a schematic diagram of the structure of the polyurethane cylinder in Example 1 and Example 2 of the present invention; Figure 2 It is a schematic diagram of the structure of the laser and the polyurethane cylinder in Example 1 and Example 2 of the present invention; Figure 3 Schematic top view of the laser and the polyurethane cylinder in Example 1 and Example 2 of the present invention.

[0064] Example 1

[0065] A cylindrical rotating multi-path laser beam processing method comprises the following steps:

[0066] S1. Adjust the optical path of the laser (infrared laser, power of 50kHz), the laser includes L1 laser and L2 laser, the optical path of L1 laser and L2 laser belong to the same parallel line (confirmed by observation using frequency doubling film);

[0067] S2. Use laser to make dots or lines on the surface of the polyurethane cylinder, use a magnifying glass to observe and take pictures, and measure the distance between the dots or lines made by the L1 laser and the L2 laser. If there is a deviation, drive the laser to move up and down and left and right along the Y and X axes of the laser through the marking control system; mechanical ejectors are provided at both ends of the polyurethane cylinder;

[0068] S3. Move the laser along the Y axis of the laser to the focal point of the polyurethane cylinder, and the L1 and L2 lasers emit light to mark and groove. The laser starts to move along the X axis of the laser, and the polyurethane cylinder rotates one circle at the same time. The motor is used to drive the polyurethane cylinder to rotate. The motor rotation speed is 10000mm / s. The laser moves 3mm along the X axis, and then a microscope is used to observe and measure the line width of the L1 and L2 lasers marking and grooving. When the line width of the L1 and L2 lasers marking and grooving is the same as the line width of the polyurethane cylinder rotation, the adjustment of the L1 and L2 laser optical path positions is completed;

[0069] S4. Adjust the parameters of the marking control system (the marking speed of the marking control system is 5000mm / s, the jump speed is 5000mm / s, the frequency is 1500khz, the marking, turning, and jumping delays are 50μs, the light on and off delays are 500μs, and the marking times are 50 times), confirm that the L1 laser and the L2 laser reach the processing grooving position, and the L1 laser and the L2 laser emit light at the same time and synchronously contact the surface of the polyurethane cylinder to process the polyurethane cylinder.

[0070] Before step S1, the steps of calibrating the marking coordinate system and adjusting the marking area are also included; calibrating the marking coordinate system is to change the X-axis and Y-axis coordinate systems of the L1 laser and the L2 laser through the marking control system; adjusting the marking area is to adjust the calibration accuracy of the L1 laser and the L2 laser to within ±1um through the marking control system.

[0071] Since Example 1 adopts the method of simultaneous light emission of L1 laser and L2 laser, the method of simultaneous light emission of L1 laser and L2 laser is synchronous light emission and grooving; L1 and L2 lasers work synchronously, and grooves are processed on the surface of the polyurethane cylinder according to the process parameters preset by the marking control system. The starting and stopping of L1 and L2 lasers are accurately controlled by the marking control system to achieve precise processing of the two lasers.

[0072] In this embodiment, step S1 also includes providing a device for cylindrical rotating multi-path laser beam processing, which includes a processing workpiece, specifically a polyurethane cylinder 1, and mechanical ejectors 2 arranged at both ends of the polyurethane cylinder 1; it also includes a laser 3, and the laser 3 includes an L1 laser 4 and an L2 laser 5, and the L1 laser 4 and the L2 laser 5 are electrically connected through a marking control system. Figure 4 This is a processing schematic diagram of a cylindrical rotating multi-path laser beam processing method according to Embodiment 1 of the present invention; Figure 5 This is a processing schematic diagram of a cylindrical rotating multi-path laser beam processing method according to Embodiment 1 of the present invention; Figure 6 This is a schematic diagram of the surface structure of a polyurethane cylinder after being processed by the cylindrical rotating multi-path laser beam processing method in Example 1 of the present invention. Figure 6It can be seen that the grooves formed by the cylindrical rotating multi-path laser beam processing method in Example 1 of the present invention are V-shaped grooves.

[0073] Example 2

[0074] A cylindrical rotating multi-path laser beam processing method comprises the following steps:

[0075] S1. Adjust the optical path of the laser (infrared laser, power of 50kHz), the laser includes L1 laser and L2 laser, the optical path of L1 laser and L2 laser belong to the same parallel line (confirmed by observation using frequency doubling film);

[0076] S2. Use laser to make dots or lines on the surface of the polyurethane cylinder, use a magnifying glass to observe and take pictures, and measure the distance between the dots or lines made by the L1 laser and the L2 laser. If there is a deviation, drive the laser to move up and down and left and right along the Y and X axes of the laser through the marking control system; mechanical ejectors are provided at both ends of the polyurethane cylinder;

[0077] S3. Move the laser along the Y axis of the laser to the focal point of the polyurethane cylinder, and the L1 and L2 lasers emit light to mark and groove. The laser starts to move along the X axis of the laser, and the polyurethane cylinder rotates one circle at the same time. The motor is used to drive the polyurethane cylinder to rotate. The motor rotation speed is 10000mm / s. The laser moves 3mm along the X axis, and then a microscope is used to observe and measure the line width of the L1 and L2 lasers marking and grooving. When the line width of the L1 and L2 lasers marking and grooving is the same as the line width of the polyurethane cylinder rotation, the adjustment of the L1 and L2 laser optical path positions is completed;

[0078] S4. Adjust the parameters of the marking control system (the marking control system has a marking speed of 5000mm / s, a jump speed of 5000mm / s, a frequency of 1500khz, a marking, turning, and jumping delay of 50μs, a light on and off delay of 500μs, and a marking number of 50 times), confirm that the L1 laser and the L2 laser have reached the processing slot position, and the L1 laser and the L2 laser emit light and contact the surface of the polyurethane cylinder to process the polyurethane cylinder. Among them, the L1 laser and the L2 laser emit light in a staggered manner. The upper computer operating system enables the L1 laser to process the polyurethane cylinder. After the L1 laser is processed, the upper computer operating system enables the L2 laser to process the polyurethane cylinder. Repeat the above steps to complete the processing of the polyurethane cylinder. Before the L1 laser and the L2 laser emit light in a staggered manner, it is necessary to confirm that the optical path and focus are correct.

[0079] Before step S1, the steps of calibrating the marking coordinate system and adjusting the marking area are also included; calibrating the marking coordinate system is to change the X-axis and Y-axis coordinate systems of the L1 laser and the L2 laser through the marking control system; adjusting the marking area is to adjust the calibration accuracy of the L1 laser and the L2 laser to within ±1um through the marking control system.

[0080] Since Example 2 adopts the staggered light emitting method of L1 laser and L2 laser, the staggered light emitting method of L1 laser and L2 laser is alternating grooving and splicing; the two lasers work alternately, L1 laser completes part of the groove processing, and L2 laser then completes the processing of the remaining part, and so on to complete the processing of the entire cylinder. This method can reduce the load of continuous operation of the laser to a certain extent, while ensuring the processing efficiency and processing time.

[0081] In this embodiment, step S1 also includes providing a device for cylindrical rotating multi-path laser beam processing, which includes a processing part, specifically a polyurethane cylinder 1, and mechanical ejectors 2 arranged at both ends of the polyurethane cylinder 1; it also includes a laser 3, and the laser 3 includes an L1 laser 4 and an L2 laser 5, and the L1 laser 4 and the L2 laser 5 are electrically connected to the host computer operating system through a marking control system. Figure 7 This is a processing schematic diagram of a cylindrical rotating multi-path laser beam processing method according to Embodiment 2 of the present invention; Figure 8 This is a schematic diagram of the surface structure of a polyurethane cylinder after being processed by the cylindrical rotating multi-path laser beam processing method according to Example 2 of the present invention. Figure 8 It can be seen that the groove formed by the cylindrical rotating multi-path laser beam processing method in Example 2 of the present invention is a U-shaped groove.

[0082] Comparative Example 1

[0083] Comparative Example 1 is a cylindrical rotating single-path laser beam processing method, comprising the following steps:

[0084] 1. Use mechanical ejector pins to fix on both sides of the polyurethane cylinder, open the upper computer operating system, move the laser along the X-axis of the laser to the processing slot position of the polyurethane cylinder (3mm on the left or right side), and move the laser along the Y-axis of the laser to the preset focus position;

[0085] 2. Set the laser power to 70% (specifically, use an infrared picosecond 100w laser), the polyurethane cylinder rotates through a shaft motor, the surface linear speed of the polyurethane cylinder is 5000mm / s, and cooperate with the host computer operating system to modify the parameters of the marking control system: marking speed is 5000mm / s, jump speed is 5000mm / s, frequency is 1500khz, marking, turning, jump delay is 50μs, light on and off delay is 500μs, marking times is 50 times;

[0086] 3. After the setting of the marking control system is completed, the upper computer operating system confirms that the laser has reached the processing slot position and the preset focus position in the X and Y axis directions, starts the coupling motor to rotate the cylinder, and the laser emits light for marking to process the polyurethane cylinder.

[0087] This solution is the simplest solution. It only uses the laser focus spot to make grooves without changing the laser light path. This groove making solution can process a variety of groove types. However, this solution has the following disadvantages: low processing efficiency.

[0088] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A cylindrical rotating multi-path laser beam processing method, characterized in that: The following steps are involved: S1. Adjust the optical path of the laser, wherein the laser includes an L1 laser and an L2 laser, and the optical paths of the L1 laser and the L2 laser are on the same parallel line; S2. Use laser to make dots or lines on the surface of the polyurethane cylinder, use a magnifying glass to observe and take pictures, and measure the distance between the dots or lines made by the L1 laser and the L2 laser. If there is a deviation, drive the laser to move up and down, left and right along the Y and X axes of the laser through the marking control system; S3. Move the laser along the Y axis of the laser to the focal point of the polyurethane cylinder, and the L1 and L2 lasers emit light to mark and groove. The laser starts to move along the X axis of the laser, and the polyurethane cylinder rotates one circle at the same time. The laser moves 3-5mm along the X axis, and then observes and measures the line width of the L1 and L2 lasers marked and grooved using a microscope. When the line width of the L1 and L2 lasers marked and grooved is the same as the line width of the polyurethane cylinder rotation, the adjustment of the L1 and L2 laser optical path positions is completed; S4. Adjust the parameters of the marking control system, confirm that the L1 laser and the L2 laser reach the processing slot position, and the L1 laser and the L2 laser emit light and contact the surface of the polyurethane cylinder to process the polyurethane cylinder.

2. The cylindrical rotating multi-path laser beam processing method according to claim 1, characterized in that: In step S4, the marking control system has a marking speed of 100-10000 mm / s, a jump speed of 100-10000 mm / s, a frequency of 10-3000 khz, a marking, turning, and jump delay of 0-100 μs, a light on and off delay of 100-1000 μs, and a marking number of 1-100 times.

3. The cylindrical rotating multi-path laser beam processing method according to claim 1, characterized in that: In step S1, the laser is one of an ultraviolet laser, a green laser, an infrared laser, and a CO2 laser.

4. The cylindrical rotating multi-path laser beam processing method according to claim 3, characterized in that: In step S1, the power of the laser is 10-100kHz.

5. The cylindrical rotating multi-path laser beam processing method according to claim 1, characterized in that: Before step S1, a step of calibrating the marking coordinate system is also included. The calibrating the marking coordinate system is to change the X-axis and Y-axis coordinate systems of the L1 laser and the L2 laser through a marking control system.

6. The cylindrical rotating multi-path laser beam processing method according to claim 1, characterized in that: Before step S1, the step of adjusting the marking width is also included, and the marking width is adjusted by adjusting the calibration accuracy of the L1 laser and the L2 laser to within ±1um through the marking control system.

7. The cylindrical rotating multi-path laser beam processing method according to claim 1, characterized in that: In step S2, mechanical ejectors are provided at both ends of the polyurethane cylinder.

8. The cylindrical rotating multi-path laser beam processing method according to claim 1, characterized in that: In step S3, a motor is used to drive the polyurethane cylinder to rotate, and the motor rotation speed is 100-20000 mm / s.

9. The cylindrical rotating multi-path laser beam processing method according to claim 1, characterized in that: In step S4, the L1 laser and the L2 laser emit light simultaneously and contact the surface of the polyurethane cylinder synchronously.

10. The cylindrical rotating multi-path laser beam processing method according to claim 1, characterized in that: In step S4, the L1 laser and the L2 laser emit light in a staggered manner, and the L1 laser is used to process the polyurethane cylinder through the host computer operating system. After the L1 laser is processed, the L2 laser is used to process the polyurethane cylinder through the host computer operating system. The above steps are repeated to complete the processing of the polyurethane cylinder.

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