Thermal management method, system and terminal for intelligent vehicle-mounted equipment test bench

Abstract

The invention relates to the technical field of vehicles, and discloses an intelligent vehicle-mounted equipment test bench thermal management method and system, electronic equipment, a storage medium and a terminal.The method comprises the steps that a to-be-tested device is responded, a to-be-cooled area of the to-be-tested device is identified, and temperature data of the to-be-cooled area is obtained in real time; the temperature data is responded and compared with a preset temperature threshold value, whether the cooling process needs to be started or not is determined, parameters of the cooling process are dynamically adjusted in response to the temperature change trend of the to-be-cooled area, and the parameters comprise the flow of cooling liquid, the temperature and the power of refrigeration equipment; in response to ambient temperature and humidity data, a dew point temperature is calculated, and the parameters during the cooling process are adjusted based on the dew point temperature. During development and testing, the heat dissipation performance of the vehicle-mounted equipment test bench can be improved, and the environment condition of a working area is improved.

Description

Technical Field

[0001] The present invention relates to the field of vehicle technology, and in particular to a thermal management method, system, electronic equipment, storage medium and terminal for a test bench for intelligent vehicle-mounted equipment. Background Art

[0002] At present, a lot of testing work is required in the process of intelligent automobile development. The test bench designed for testing in the development stage has improved the efficiency of vehicle and software development. Most software testing work is also completed on a dedicated test bench. The test platform concentrates multiple controllers and I / O devices on the workbench, which concentrates heat and easily forms heat accumulation, which will have an adverse effect on the performance of chips and other electronic components.

[0003] In addition, with the continuous improvement of chip performance and the increase of vehicle functions, the heat generation of controllers is also gradually increasing, and more and more controllers use liquid cooling to dissipate heat. Such controllers lack the support of liquid cooling systems on test benches and cannot effectively dissipate heat.

[0004] In the prior art, the test platform concentrates multiple controllers and I / O devices on the workbench, which concentrates heat and easily forms heat accumulation, which will have an adverse effect on the performance of chips and other electronic components. Poor heat dissipation in certain locations may cause the local power lines to age faster, which is prone to safety problems, burning equipment at the least and causing fire accidents at the worst. High-heat-generating equipment in the test bench will also have an adverse effect on low-heat-generating equipment, and for controllers with liquid cooling, there may be no related liquid cooling system support in the early development stage. The additional arrangement of the on-board liquid cooling system will not only increase the cost, but frequent disassembly will also cause certain troubles in daily testing work. In addition, to carry out development and testing of multiple models and multiple functions at the same time, dozens or even hundreds of test benches are required. These benches will generate a lot of heat during work, which will cause the environmental conditions in the working area to deteriorate.

[0005] Therefore, the present application provides a thermal management method for a smart vehicle-mounted equipment test bench to solve the above-mentioned technical problems. Summary of the invention

[0006] The purpose of the present invention is to provide a thermal management method, system, electronic device, storage medium and terminal for an intelligent vehicle-mounted equipment test bench, so as to solve the technical problem in the prior art that during development and testing, the heat dissipation performance of the vehicle-mounted equipment test bench is poor, resulting in a decrease in the environmental conditions of the working area.

[0007] In order to solve the above technical problems, the present invention provides a thermal management method for a test bench of an intelligent vehicle-mounted equipment, comprising:

[0008] The real-time data acquisition step includes, in response to the device under test, identifying the area to be cooled of the device under test, and acquiring temperature data of the area to be cooled in real time;

[0009] A cooling demand judgment step, comprising responding to the temperature data, comparing it with a preset temperature threshold, and determining whether a cooling process needs to be started, wherein the temperature data includes at least one temperature measurement point data, and when any of the temperature measurement point data exceeds the temperature threshold, the cooling process is started;

[0010] A dynamic cooling adjustment step, comprising dynamically adjusting the parameters of the cooling process in response to the temperature change trend of the area to be cooled, wherein the parameters include the flow rate and temperature of the coolant and the power of the refrigeration equipment;

[0011] The dew point control prevention step includes calculating the dew point temperature in response to the ambient temperature and humidity data, and adjusting the parameters in the cooling process based on the dew point temperature.

[0012] In some specific embodiments, the real-time data acquisition step includes, in response to the device under test, identifying a region to be cooled of the device under test, and acquiring temperature data of the region to be cooled in real time, further comprising:

[0013] Based on the device under test, identifying the structure and thermal distribution characteristics of the device under test, and obtaining the area to be cooled;

[0014] Based on the area to be cooled, arrange at least one of the temperature measurement points so that the temperature measurement point can reflect the temperature state of the device to be tested;

[0015] The temperature data is periodically acquired from each of the temperature measurement points.

[0016] In some specific embodiments, the cooling demand judgment step includes comparing the temperature data with a preset temperature threshold in response to determine whether a cooling process needs to be started, wherein the temperature data includes at least one temperature measurement point data, and when any of the temperature measurement point data exceeds the temperature threshold, the cooling process is started, further comprising:

[0017] Comparing the temperature data of each of the temperature measurement points with the temperature threshold one by one;

[0018] If the temperature data of any of the temperature measurement points is higher than the temperature threshold, a cooling start signal is triggered to start the cooling process;

[0019] When the temperature data of all the temperature measurement points are lower than the temperature threshold, the current state is maintained;

[0020] The temperature data of each temperature measurement point is continuously monitored to dynamically adjust the cooling demand.

[0021] In some specific embodiments, the dynamic cooling adjustment step includes dynamically adjusting the parameters of the cooling process in response to the temperature change trend of the area to be cooled, wherein the parameters include the flow rate, temperature and power of the cooling liquid and the refrigeration equipment, and further includes:

[0022] Monitoring the temperature data and identifying a change trend of the temperature data;

[0023] Dynamically adjusting the flow rate, temperature and refrigeration equipment power of the coolant according to the change parameters of the temperature data, including:

[0024] When the temperature data shows an upward trend, the flow rate of the coolant is increased, the temperature of the coolant is reduced, or the power of the refrigeration equipment is increased;

[0025] When the temperature data shows a downward trend, the flow rate of the coolant is reduced, the temperature of the coolant is increased, or the power of the refrigeration equipment is reduced;

[0026] When the temperature data gradually stabilizes, the adjustment amplitude is gradually reduced to maintain a constant temperature state.

[0027] In some specific embodiments, the dew point control prevention step includes calculating the dew point temperature in response to ambient temperature and humidity data, and adjusting the parameters in the cooling process based on the dew point temperature, further comprising:

[0028] Collecting the ambient temperature and humidity data in real time;

[0029] Calculating the dew point temperature based on the dew point temperature calculation formula includes:

[0030]

[0031] Among them, T d is the dew point temperature, T is the ambient temperature, Rh is the ambient humidity, constant a=17.27, constant b=237.7℃;

[0032] The initial value of the parameter in the cooling process is adjusted according to the calculated dew point temperature.

[0033] In some specific embodiments, the step of adapting the cooling body is also included, including:

[0034] The cooling body is provided with a flexible structure to adapt to the devices under test of different sizes;

[0035] The cooling body is clamped on the PCBA board of the device under test, and a heat conductive material is attached to the chip area to improve the heat conduction efficiency.

[0036] Based on the same concept, the present invention also provides a thermal management system for an intelligent vehicle-mounted equipment test bench, comprising:

[0037] A real-time data acquisition module is configured to respond to the device under test, identify the area to be cooled of the device under test, and acquire temperature data of the area to be cooled in real time;

[0038] a cooling demand judgment module, configured to respond to the temperature data, compare with a preset temperature threshold, and determine whether a cooling process needs to be started, wherein the temperature data includes at least one temperature measurement point data, and when any of the temperature measurement point data exceeds the temperature threshold, the cooling process is started;

[0039] A dynamic cooling adjustment module, configured to dynamically adjust the parameters of the cooling process in response to the temperature change trend of the area to be cooled, wherein the parameters include the flow rate and temperature of the coolant and the power of the refrigeration equipment;

[0040] The dew point control prevention module is configured to calculate a dew point temperature in response to ambient temperature and humidity data, and adjust the parameters in the cooling process based on the dew point temperature.

[0041] Based on the same concept, the present invention also provides an electronic device, including: a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other through the communication bus; a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the steps of the thermal management method of the intelligent vehicle equipment test bench.

[0042] Based on the same concept, the present invention also provides a computer-readable storage medium storing a computer program executable by an electronic device. When the computer program runs on the electronic device, the electronic device executes the steps of the thermal management method of the intelligent vehicle-mounted equipment test bench.

[0043] Based on the same concept, the present invention also provides a thermal management terminal for an intelligent vehicle-mounted equipment test bench, wherein the terminal is provided with the thermal management system for the intelligent vehicle-mounted equipment test bench as described above.

[0044] Compared with the prior art, the beneficial effects are:

[0045] The present invention discloses a thermal management method, system, electronic equipment, storage medium and terminal for an intelligent vehicle-mounted equipment test bench, which can improve the heat dissipation performance of the vehicle-mounted equipment test bench and improve the environmental conditions of the working area during development and testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It is a flowchart of a thermal management method for a test bench of an intelligent vehicle-mounted device of the present invention in some specific embodiments;

[0047] Figure 2 It is a schematic diagram of the architecture of a thermal management method for a test bench of intelligent vehicle-mounted equipment in some applications of the present invention;

[0048] Figure 3 It is a schematic diagram of the operating principle of a thermal management method for a test bench of intelligent vehicle equipment in some applications of the present invention;

[0049] Figure 4 It is a schematic diagram of a cooling body in some applications of a thermal management method for a test bench of intelligent vehicle equipment according to the present invention;

[0050] Figure 5 It is a schematic diagram of the structure of a thermal management system of an intelligent vehicle-mounted equipment test bench of the present invention in some specific embodiments;

[0051] Figure 6 is a schematic diagram of the structure of an electronic device of the present invention in some specific embodiments;

[0052] In the figure, 101, upper cooling body, 1011, upper cooling body upper shell, 1012, upper cooling body lower shell, 102, lower cooling body, 1021, lower cooling body upper shell, 1022, lower cooling body lower shell, 103, upper cooling body water channel, 104, lower cooling body water channel, 105, upper cooling body water inlet, 106, lower cooling body water inlet, 107, upper cooling body water outlet, 108, lower cooling body water outlet, 109, cooling body water inlet, 110, cooling body water outlet. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0054] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two.

[0055] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0056] It should be understood that although the terms first, second, third, etc. may be used to describe in the embodiments of the present application, these descriptions should not be limited to these terms. These terms are only used to distinguish the descriptions. For example, without departing from the scope of the embodiments of the present application, the first may also be referred to as the second, and similarly, the second may also be referred to as the first.

[0057] As used herein, the words "if" and "if" may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to determining" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)", depending on the context.

[0058] It should also be noted that the term "includes", "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, so that a commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the commodity or device including the elements.

[0059] It should be particularly noted that any symbols and / or numbers in the specification that are not marked in the accompanying drawings are not drawing marks.

[0060] Reference Figure 1 , a thermal management method for a smart vehicle-mounted equipment test bench, comprising:

[0061] S101, a real-time data acquisition step, comprising, in response to a device under test, identifying a region to be cooled of the device under test, and acquiring temperature data of the region to be cooled in real time;

[0062] It is understandable that the device to be tested connected to the test bench is identified through a preset interface or communication protocol. According to the structural characteristics of the device to be tested and the preset cooling strategy, the area that needs to be cooled (i.e., the area to be cooled) is identified. In the area to be cooled, the temperature measurement points are reasonably arranged according to the heat distribution characteristics and cooling requirements. For example, measurement points are set on the processor chip, on the surface of the radiator, and in the surrounding air. The temperature data of each measurement point is collected in real time and continuously. The frequency of data collection can be adjusted according to actual needs, such as collecting once or more per second.

[0063] In some of the applications, the real-time data acquisition step includes responding to the device under test, identifying the area to be cooled of the device under test, and acquiring the temperature data of the area to be cooled in real time; based on the device under test, identifying the structure and thermal distribution characteristics of the device under test, and acquiring the area to be cooled; based on the area to be cooled, arranging at least one temperature measurement point so that the temperature measurement point can reflect the temperature state of the device under test; and periodically acquiring temperature data from each temperature measurement point.

[0064] It is understandable that a detailed structural analysis of the device to be tested is performed to understand the layout and connection methods of its various components (such as processors, memory, power modules, cooling systems, etc.). Based on the results of the structural analysis, thermal simulation software or experimental means (such as infrared thermal imagers) are used to evaluate the thermal distribution characteristics of the device to be tested. Identify the area with the most concentrated heat generation and the highest temperature, that is, the area to be cooled. According to the shape, size and thermal distribution characteristics of the area to be cooled, select a suitable location to arrange the temperature measurement points. Determine the number and specific location of the temperature measurement points. Install the temperature sensor (such as a thermocouple, thermistor or infrared temperature probe) at the selected measurement point location and calibrate it to ensure the accuracy of the measurement results. Set the temperature data acquisition frequency according to the test requirements and equipment characteristics. For example, for key equipment that requires precise temperature control, a higher acquisition frequency (such as once per second) can be set; for equipment with slower temperature changes, a lower acquisition frequency (such as once per minute) can be set. According to the set frequency, temperature data is periodically obtained from each temperature measurement point.

[0065] S102, a cooling demand determination step, comprising responding to the temperature data, comparing it with a preset temperature threshold, and determining whether a cooling process needs to be started, wherein the temperature data includes at least one temperature measurement point data, and when any of the temperature measurement point data exceeds the temperature threshold, the cooling process is started;

[0066] It is understandable that the temperature data transmitted from each temperature measurement point is received in real time. According to the performance parameters, operating environment and test requirements of the equipment to be tested, reasonable temperature thresholds are set. Including the maximum temperature threshold (such as 85°C) and other reference thresholds (such as 70°C as the warning threshold). Compare the temperature data received in real time with the preset temperature threshold. If the temperature of all measurement points does not exceed the maximum temperature threshold and does not reach the warning threshold, it is judged that there is no need to start the cooling process at present, maintain the current state or perform other non-cooling related tasks. If the temperature of any measurement point exceeds the maximum temperature threshold, or reaches the warning threshold but the continuous upward trend is obvious, it is judged that the cooling process needs to be started immediately or prepared to start.

[0067] In some of the applications, the cooling demand judgment step includes responding to temperature data, comparing it with a preset temperature threshold, and determining whether a cooling process needs to be started. The temperature data includes data of at least one temperature measurement point. When the data of any temperature measurement point exceeds the temperature threshold, the cooling process is started, and the temperature data of each temperature measurement point is compared with the temperature threshold one by one; if the temperature data of any temperature measurement point is higher than the temperature threshold, a cooling start signal is triggered to start the cooling process; when the temperature data of all temperature measurement points are lower than the temperature threshold, the current state is maintained; and the temperature data of each temperature measurement point is continuously monitored to dynamically adjust the cooling demand.

[0068] It is understandable that the real-time temperature data of all temperature measurement points are obtained and compared with the preset temperature threshold one by one. In the process of one-by-one comparison, when it is found that the temperature data of any temperature measurement point is higher than the temperature threshold, the cooling start signal is triggered. The start signal is an immediate response to the high temperature state and is used to start or enhance the cooling process to prevent the equipment from overheating. If the temperature data of all temperature measurement points are lower than the temperature threshold, it is determined that no additional cooling measures are required at present and the current state is maintained. The temperature data of each temperature measurement point is continuously monitored. According to the changing trend of real-time data, the cooling demand is dynamically adjusted to adapt to the changes in the operating status of the equipment.

[0069] S103, a dynamic cooling adjustment step, comprising dynamically adjusting the parameters of the cooling process in response to the temperature change trend of the area to be cooled, wherein the parameters include the flow rate and temperature of the coolant and the power of the refrigeration equipment;

[0070] In some of the applications, the dynamic cooling adjustment step includes dynamically adjusting the parameters of the cooling process in response to the temperature change trend of the area to be cooled, the parameters including the flow rate, temperature and power of the coolant, monitoring the temperature data and identifying the change trend of the temperature data; dynamically adjusting the flow rate, temperature and power of the coolant according to the change parameters of the temperature data, when the temperature data shows an upward trend, increasing the flow rate of the coolant, lowering the temperature of the coolant or increasing the power of the refrigeration equipment; when the temperature data shows a downward trend, reducing the flow rate of the coolant, increasing the temperature of the coolant or reducing the power of the refrigeration equipment; when the temperature data gradually stabilizes, gradually reducing the adjustment amplitude to maintain a constant temperature state.

[0071] It is understandable that the temperature data collected at each temperature measurement point is continuously monitored to ensure the real-time and accuracy of the data. According to the changing trend of the temperature data, the corresponding parameter adjustment strategy is formulated. When the temperature data shows an upward trend, it indicates that the heat accumulation rate of the area to be cooled exceeds the heat dissipation rate, and the cooling intensity needs to be increased at this time. Increase the flow rate of the coolant to reduce the temperature rise of the coolant during the heat exchange process; reduce the temperature of the coolant to improve the heat exchange efficiency; or increase the power of the refrigeration equipment to enhance the refrigeration effect. When the temperature data shows a downward trend, it indicates that the heat dissipation rate exceeds the heat accumulation rate. At this time, the cooling intensity can be appropriately reduced to avoid overcooling. Reduce the flow rate of the coolant to save resources; increase the temperature of the coolant to reduce energy loss during the heat exchange process; or reduce the power of the refrigeration equipment to reduce energy consumption. When the temperature data gradually stabilizes, it indicates that the current cooling intensity and the heat accumulation rate are balanced. At this time, the adjustment range should be gradually reduced to maintain a constant temperature state.

[0072] According to the formulated adjustment strategy, the flow rate, temperature of the coolant and the power of the refrigeration equipment are automatically adjusted. At the same time, the adjusted temperature data is continuously monitored to evaluate the adjustment effect. If the adjustment does not achieve the expected goal, the adjustment strategy is re-formulated and executed based on the new temperature data; if the adjustment is successful, the current parameter settings are maintained until the next temperature fluctuation.

[0073] S104, a dew point control prevention step, comprising calculating the dew point temperature in response to the ambient temperature and humidity data, and adjusting the parameters in the cooling process based on the dew point temperature.

[0074] In some of the applications, the dew point control prevention step includes calculating the dew point temperature in response to the ambient temperature and humidity data, and adjusting the parameters in the cooling process based on the dew point temperature, collecting the ambient temperature and humidity data in real time; calculating the dew point temperature based on the dew point temperature calculation formula, including:

[0075]

[0076] Among them, T d is the dew point temperature, T is the ambient temperature, Rh is the ambient humidity, constant a=17.27, constant b=237.7°C; according to the calculated dew point temperature, adjust the initial values ​​of the parameters in the cooling process.

[0077] It is understandable that, in combination with the calculated dew point temperature, the initial temperature of the coolant is controlled above the dew point temperature to prevent condensation from causing damage to circuits and electronic devices.

[0078] In some of these applications, the step of adapting the cooling body is also included, including providing a cooling body with a flexible structure to adapt to devices under test of different sizes; clamping the cooling body on the PCBA board of the device under test, and attaching thermal conductive material to the chip area to improve the heat conduction efficiency.

[0079] It is understandable that a cooling body with a flexible structure is designed. The cooling body is made of soft and high temperature resistant materials, such as silicone, soft metal (such as aluminum hose wrapped with elastic material) or specially synthesized thermoplastic elastomers. The cooling body can flexibly adapt to the devices under test of different sizes, shapes and surface curvatures to ensure a close fit and reduce thermal resistance. The cooling body is equipped with necessary interfaces and connection devices, such as a water pipe interface (for a water cooling system), a temperature sensor interface, and a data interface for communicating with the test system, to ensure that the cooling body can be smoothly connected to the overall architecture of the test system. The designed flexible cooling body is clamped on the PCBA board (Printed Circuit Board Assembly) of the device under test, and a layer of efficient thermal conductive material, such as a thermal conductive silicone sheet, a thermal conductive gel or a phase change material, is attached between the chip area and the cooling body to improve the efficiency of heat conduction.

[0080] Combine the following Figures 2 to 4 The following describes some examples of the thermal management method for the intelligent vehicle-mounted equipment test bench of the present invention in some applications:

[0081] This embodiment is used for bench testing of intelligent vehicle-mounted equipment, and is composed of a temperature monitoring module, a liquid cooling module, a liquid cooling pipeline, a controller, a refrigeration module, an electronic valve, etc. The temperature is monitored in real time by a temperature sensor arranged near the controller, the control module drives the coolant to flow to cool and dissipate heat in the corresponding heating area, and the solenoid valve controls the opening and closing of the liquid pipeline.

[0082] There is no liquid pipeline connection between the cooling module and the cooled controller, etc. The controller and other cooled equipment can be disassembled and installed at any time according to work needs. It is convenient and fast, without the risk of liquid leakage and safety hazards, and also avoids the disassembly and assembly of liquid pipelines.

[0083] The temperature monitoring module monitors the temperature of the cooled area in real time and transmits the collected temperature data to the thermal management control module to achieve rapid response of temperature control.

[0084] Temperature and humidity sensors are set in the internal space of the test area box. The control module calculates the dew point temperature based on the temperature and humidity to avoid condensation on the cooling system, including the cooling block and the cooling pipeline surface. When the condensation temperature is low, the control module controls the water pump and the compressor to reduce the refrigeration efficiency and increase the flow rate of the heat dissipation pipeline.

[0085] The cooling module of each test bench is connected to the main line through a solenoid valve. The control module controls the opening and closing of the valve body. Each group of cooling modules is a branch, and the module is further divided into several sub-branches. The switch and flow are controlled by solenoid valves. A cooling body is set in each sub-branch, corresponding to a cooled test equipment. The water inlet and outlet of each cooling body are equipped with temperature sensors to monitor the inlet and outlet water temperatures.

[0086] The cooling body adopts a ring design, which can adapt to the size of the domain controller of each model, or adopts a flexible ring design, which can be adjusted in size. When using a single board test, the single PCAB can also be directly clamped on the cooling module, and the chip and the cooling module are filled with thermal conductive silicone grease.

[0087] Each independent test bench has a cooling branch, which is connected to the main line through a solenoid valve. The system obtains the temperature rise rate of the cooled area through the temperature sensor to determine the required cooling capacity, thereby determining the required flow rate and coolant temperature, and combining the dew point temperature to control the initial coolant temperature above the dew point temperature to prevent condensation on the cooling module from damaging the circuits and electronic devices.

[0088] like Figure 2 As shown, this embodiment is composed of a cooling body, a cooling pipeline, a solenoid valve, a temperature sensor, a humidity sensor, a refrigeration module, and a control module.

[0089] like Figure 3 As shown,

[0090] 1. First, the temperature sensor collects the surface temperature of the corresponding device under test, and all temperature values ​​are transmitted to the control module.

[0091] 2. When the temperature of any device under test is higher than the set temperature T0, the refrigeration module starts and the coolant begins to cool the device under test; when the temperature of all measuring points is lower than the set temperature, the cooling module is turned off.

[0092] 3. When the temperature value of the measured device increases, the power of the refrigeration module increases and the water inlet temperature decreases; when the measured temperature decreases, the power of the refrigeration module decreases and the water inlet temperature increases.

[0093] 4. When the coolant inlet temperature drops to close to the dew point temperature, the refrigeration temperature stops dropping, and the solenoid valve is controlled to increase the opening, thereby increasing the coolant flow rate. When the measured temperature drops, the solenoid valve first reduces the opening and reduces the flow rate. After the flow rate drops to the basic value, the refrigeration temperature begins to rise.

[0094] like Figure 4 As shown, the flexible cooling body has an upper and lower two-piece structure. The shell of each cooling fin is made of silicone material, the outer side is a relatively hard material, and the inner side is a relatively soft material. The internal water channel is arranged in an S shape, and the cooled device is placed between the upper and lower cooling fins. The water inlet and outlet of the cooling body are respectively located at the two ends of the cooling fin, and the upper and lower cooling fins share the water inlet and outlet. The inner side of the cooling fin has a certain deformation ability, that is, the soft silicone material on the inner side of the upper and lower pieces can be deformed under pressure, thereby increasing the fitting area between the cooling body and the cooled object. The inlet and outlet pipes of the upper and lower pieces are flexible pipes, which can be plastic hoses or metal hoses, so the distance between the upper and lower cooling fins can be adjusted, and can adapt to the sizes of most domain controllers. In addition, during the development and testing phase, usually only a single PCBA board is available, and the heat dissipation performance of the PCBA will be very poor. In this case, this embodiment can also meet the needs, that is, the PCBA board is placed between two cooling fins, and a thermal grease sheet is attached or filled in the chip area corresponding to the PCBA, so that the heat generated by the chip is directly transferred to the cooling fins through the thermal grease, and the heat is taken away by the coolant.

[0095] like Figure 2 As shown, the dew point monitoring module of this test bench is composed of a temperature sensor and a humidity sensor. The temperature sensor and humidity sensor are located inside the test bench box to monitor the temperature and humidity status inside the test bench. The temperature data and humidity data will be transmitted to the control module, and the control module will calculate the dew point temperature in the current test bench. The calculation formula is as follows:

[0096]

[0097] Among them, T d is the dew point temperature, T is the ambient temperature, Rh is the ambient humidity, constant a=17.27, constant b=237.7℃;

[0098] For example, the ambient temperature is 35°C and the ambient humidity is 80%, r = 17.27*35 / (237.7+35)+l n0.8 = 2.21-0.22 = 2;

[0099] T=237.7*2 / (17.27-2)=31.13℃;

[0100] Ambient temperature 35°C, ambient humidity 90%, r = 2.21-0.1 = 2.11;

[0101] T=237.7*2.11 / 17.27+2.11=25.88℃;

[0102] Ambient temperature 25°C, ambient humidity 90%, r = 1.64-0.1 = 1.54;

[0103] T=237.7*1.54 / 17.27+1.54=19.46℃;

[0104] This embodiment is described below in conjunction with application scenarios:

[0105] 1. For electronic equipment that conventionally uses natural cooling, air cooling or liquid cooling, use Figure 4 The cooling body shown;

[0106] The cooling body is installed in each test bench, and the refrigeration module is located in the peripheral space, in a different office area from the test bench, to avoid unnecessary impact of its heat on the equipment in the cockpit test bench.

[0107] The cooling body can be increased or decreased according to the number of devices under test in the test stand, and cooling and heat dissipation are performed one-to-one. A temperature sensor is arranged between each controller and the corresponding cooling module to monitor the surface temperature of the controller.

[0108] The dew point monitoring module (temperature sensor and humidity sensor) located in the test bench box detects the ambient temperature and relative humidity, and calculates the real-time dew point temperature T through the system control module. d The control module controls the refrigeration module to work, and the refrigeration temperature is kept above the dew point temperature. The refrigeration temperature is set not lower than (T d +3)℃. After the refrigeration module is started, the cooling capacity of the cooling body is improved by cooling until the refrigeration temperature reaches (T d +3)℃.

[0109] Before the smart cockpit is started, it is in standby mode in real time. After the smart cockpit is started, various controllers start to run, and their temperatures start to rise randomly. The corresponding temperature sensors monitor the temperature of the controller surface and transmit it to the control module. When a temperature sensor measures a temperature rise that exceeds the set optimal working temperature (the general controller's optimal working temperature is 30-60°C, and the optimal temperature upper and lower limits are set to 40-50°C), the control module controls the refrigeration module to start working for refrigeration, and at the same time opens the solenoid valve of the water inlet pipe of the cooling body to be cooled, and the coolant flows through the cooling body to cool the corresponding equipment under test. When the temperature in the area drops to 40, the refrigeration module stops working.

[0110] When multiple racks are working at the same time, if the temperature of one of the multiple devices exceeds 50 degrees, the refrigeration module will start to cool. When all temperature measurement points are lower than 40 degrees, the refrigeration module will stop cooling.

[0111] When a large number of racks are working at the same time, the cooling capacity demand is large, and the cooling temperature drops close to the dew point temperature, that is, close to (T d +3)℃, the control module controls its cooling power not to continue to increase, that is, the temperature of the refrigerant no longer decreases, to avoid condensation in the liquid cooling pipeline. At this time, the control module controls the solenoid valve of the over-temperature cooling body, increases the opening of the solenoid valve, increases the liquid flow, and accelerates the cooling at that location. When the test bench is shut down and stops testing, the temperature of the measuring point gradually decreases. When it is as low as 40 degrees, its solenoid valve reduces the opening, reduces the liquid flow, and after it is reduced to the minimum opening (set to 1 / 10 of the total opening), if all solenoid valves are reduced to the minimum opening, the cooling module begins to reduce the cooling power until it stops.

[0112] 2. Different from 1, in this example, after the refrigeration module is started, the cooling temperature of the coolant is first set to the current ambient temperature, and the cooling area is cooled and dissipated by increasing the opening of the solenoid valve. The upper and lower limits of the optimal temperature are set to 40-50°C. For each cooling body, when the temperature exceeds 50°, the corresponding solenoid valve gradually increases the opening to keep the temperature of the area below 50°. As the temperature continues to rise, when the opening of the solenoid valve increases to the maximum, in order to ensure the cooling effect, the refrigeration module begins to increase the cooling power and reduce the cooling temperature of the coolant until the cooling temperature reaches (T d +3)℃, the cooling power no longer increases. At this time, the cooling capacity of the refrigeration module can no longer meet the needs of all racks. It is necessary to confirm whether the total capacity can meet the needs of all racks in order to carry out transformation and upgrading.

[0113] 3. For electronic equipment with liquid cooling pipelines, Figure 4 The cooling body in the controller can connect the water inlet and outlet of the controller to the liquid cooling pipeline, and the working mode remains unchanged.

[0114] For the method steps disclosed in the above embodiments, the method steps are described as a series of action combinations for the purpose of simple description, but those skilled in the art should know that the embodiments of the present invention are not limited by the order of the actions described, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of the present invention.

[0115] like Figure 5 As shown, the present invention also provides a thermal management system for an intelligent vehicle-mounted equipment test bench, comprising:

[0116] The real-time data acquisition module 201 is configured to respond to the device under test, identify the area to be cooled of the device under test, and acquire the temperature data of the area to be cooled in real time;

[0117] A cooling demand judgment module 202 is configured to respond to the temperature data and compare it with a preset temperature threshold to determine whether a cooling process needs to be started, wherein the temperature data includes at least one temperature measurement point data, and when any of the temperature measurement point data exceeds the temperature threshold, the cooling process is started;

[0118] A dynamic cooling adjustment module 203 is configured to dynamically adjust the parameters of the cooling process in response to the temperature change trend of the area to be cooled, wherein the parameters include the flow rate and temperature of the coolant and the power of the refrigeration equipment;

[0119] The dew point control prevention module 204 is configured to calculate the dew point temperature in response to the ambient temperature and humidity data, and adjust the parameters in the cooling process based on the dew point temperature.

[0120] It is worth noting that although only some basic functional modules are disclosed in the embodiments of the present invention, it does not mean that the composition of the present system is limited to the above basic functional modules. On the contrary, what the present embodiment wants to express is that on the basis of the above basic functional modules, those skilled in the art can arbitrarily add one or more functional modules in combination with the prior art to form an infinite number of embodiments or technical solutions. In other words, the present system is open rather than closed. Just because the present embodiment only discloses individual basic functional modules, it cannot be considered that the protection scope of the claims of the present invention is limited to the disclosed basic functional modules. At the same time, for the convenience of description, the above devices are described in terms of functions and are described separately in various units and modules. Of course, when implementing the present invention, the functions of each unit and module can be implemented in the same or one or more software and / or hardware.

[0121] like Figure 6 As shown, the present invention also provides an electronic device, including: a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other through the communication bus; a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the steps of the thermal management method of the intelligent vehicle-mounted equipment test bench.

[0122] Figure 6 Schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. Figure 6 The electronic device provided in the embodiment of the present invention includes: one or more processors 710 and a storage device 720; the processor 710 in the electronic device may be one or more, Figure 6A processor 710 is taken as an example; the storage device 720 is used to store one or more programs; the one or more programs are executed by the one or more processors 710, so that the one or more processors 710 implement the thermal management method of the intelligent vehicle-mounted equipment test bench as described in any one of the embodiments of the present invention.

[0123] The electronic device may further include: an input device 730 and an output device 740 .

[0124] The processor 710, storage device 720, input device 730 and output device 740 in the electronic device can be connected via a bus or other means. Figure 6 The example of connecting through bus is taken in the following.

[0125] The storage device 720 in the electronic device is a computer-readable storage medium that can be used to store one or more programs, which can be software programs, computer executable programs, and modules, such as the program instructions / modules corresponding to the thermal management method for the intelligent vehicle-mounted equipment test bench provided in the embodiment of the present invention. The processor 710 executes various functional applications and data processing of the electronic device by running the software programs, instructions, and modules stored in the storage device 720, that is, the thermal management method for the intelligent vehicle-mounted equipment test bench in the above method embodiment is implemented.

[0126] The storage device 720 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the storage device 720 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some instances, the storage device 720 may further include a memory remotely arranged relative to the processor 710, and these remote memories may be connected to the device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0127] The input device 730 may be used to receive input digital or character information and generate key signal input related to user settings and function control of the electronic device. The output device 740 may include a display device such as a display screen.

[0128] The present invention also provides a computer-readable storage medium storing a computer program executable by an electronic device. When the computer program runs on the electronic device, the electronic device executes the steps of the thermal management method of the intelligent vehicle-mounted equipment test bench.

[0129] Specifically, the computer storage medium of the embodiment of the present invention can adopt any combination of one or more computer-readable media. The computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or device, or any combination of the above. More specific examples (non-exhaustive list) of computer-readable storage media include: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present embodiment, the computer-readable storage medium can be any tangible medium containing or storing a program, which can be used by an instruction execution system, device or device or used in combination with it.

[0130] The present invention also provides a thermal management terminal for an intelligent vehicle-mounted equipment test bench, wherein the terminal is provided with the thermal management system for the intelligent vehicle-mounted equipment test bench as described above.

[0131] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A thermal management method for a test bench for intelligent vehicle-mounted equipment, characterized in that: include: The real-time data acquisition step includes, in response to the device under test, identifying the area to be cooled of the device under test, and acquiring temperature data of the area to be cooled in real time; A cooling demand judgment step, comprising responding to the temperature data, comparing it with a preset temperature threshold, and determining whether a cooling process needs to be started, wherein the temperature data includes at least one temperature measurement point data, and when any of the temperature measurement point data exceeds the temperature threshold, the cooling process is started; A dynamic cooling adjustment step, comprising dynamically adjusting the parameters of the cooling process in response to the temperature change trend of the area to be cooled, wherein the parameters include the flow rate and temperature of the coolant and the power of the refrigeration equipment; The dew point control prevention step includes calculating the dew point temperature in response to the ambient temperature and humidity data, and adjusting the parameters in the cooling process based on the dew point temperature.

2. The thermal management method for the intelligent vehicle-mounted equipment test bench according to claim 1, characterized in that: The real-time data acquisition step includes, in response to the device under test, identifying the area to be cooled of the device under test, and acquiring temperature data of the area to be cooled in real time, further comprising: Based on the device under test, identifying the structure and thermal distribution characteristics of the device under test, and obtaining the area to be cooled; Based on the area to be cooled, arrange at least one of the temperature measurement points so that the temperature measurement point can reflect the temperature state of the device to be tested; The temperature data is periodically acquired from each of the temperature measurement points.

3. The thermal management method for the intelligent vehicle-mounted equipment test bench according to claim 1, characterized in that: The cooling demand judgment step includes comparing the temperature data with a preset temperature threshold in response to determine whether a cooling process needs to be started, wherein the temperature data includes at least one temperature measurement point data, and when any of the temperature measurement point data exceeds the temperature threshold, the cooling process is started, further comprising: Comparing the temperature data of each of the temperature measurement points with the temperature threshold one by one; If the temperature data of any of the temperature measurement points is higher than the temperature threshold, a cooling start signal is triggered to start the cooling process; When the temperature data of all the temperature measurement points are lower than the temperature threshold, the current state is maintained; The temperature data of each temperature measurement point is continuously monitored to dynamically adjust the cooling demand.

4. The thermal management method for the intelligent vehicle-mounted equipment test bench according to claim 1, characterized in that: The dynamic cooling adjustment step includes dynamically adjusting the parameters of the cooling process in response to the temperature change trend of the area to be cooled, wherein the parameters include the flow rate, temperature and power of the cooling liquid and the refrigeration equipment, and further includes: Monitoring the temperature data and identifying a change trend of the temperature data; Dynamically adjusting the flow rate, temperature and refrigeration equipment power of the coolant according to the change parameters of the temperature data, including: When the temperature data shows an upward trend, the flow rate of the coolant is increased, the temperature of the coolant is reduced, or the power of the refrigeration equipment is increased; When the temperature data shows a downward trend, the flow rate of the coolant is reduced, the temperature of the coolant is increased, or the power of the refrigeration equipment is reduced; When the temperature data gradually stabilizes, the adjustment amplitude is gradually reduced to maintain a constant temperature state.

5. The thermal management method for the intelligent vehicle-mounted equipment test bench according to claim 1, characterized in that: The dew point control prevention step includes calculating the dew point temperature in response to the ambient temperature and humidity data, and adjusting the parameters in the cooling process based on the dew point temperature, further comprising: Collecting the ambient temperature and humidity data in real time; Calculating the dew point temperature based on the dew point temperature calculation formula includes: Among them, T d is the dew point temperature, T is the ambient temperature, Rh is the ambient humidity, constant a=17.27, constant b=237.7℃; The initial value of the parameter in the cooling process is adjusted according to the calculated dew point temperature.

6. The thermal management method for the intelligent vehicle-mounted equipment test bench according to claim 1, characterized in that: The method also includes the step of adapting the cooling body, including: The cooling body is provided with a flexible structure to adapt to the devices under test of different sizes; The cooling body is clamped on the PCBA board of the device under test, and a heat conductive material is attached to the chip area to improve the heat conduction efficiency.

7. A thermal management system for an intelligent vehicle-mounted equipment test bench, characterized in that: include: A real-time data acquisition module is configured to respond to the device under test, identify the area to be cooled of the device under test, and acquire temperature data of the area to be cooled in real time; a cooling demand judgment module, configured to respond to the temperature data, compare with a preset temperature threshold, and determine whether a cooling process needs to be started, wherein the temperature data includes at least one temperature measurement point data, and when any of the temperature measurement point data exceeds the temperature threshold, the cooling process is started; A dynamic cooling adjustment module, configured to dynamically adjust the parameters of the cooling process in response to the temperature change trend of the area to be cooled, wherein the parameters include the flow rate and temperature of the coolant and the power of the refrigeration equipment; The dew point control prevention module is configured to calculate a dew point temperature in response to ambient temperature and humidity data, and adjust the parameters in the cooling process based on the dew point temperature.

8. An electronic device, characterized in that: include: A processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other via the communication bus; a computer program is stored in the memory, and when the computer program is executed by the processor, the processor executes the steps of the method described in any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that: It stores a computer program executable by an electronic device, and when the computer program runs on the electronic device, the electronic device executes the steps of the method described in any one of claims 1 to 6.

10. A thermal management terminal for an intelligent vehicle-mounted equipment test bench, characterized in that: The terminal is provided with the intelligent vehicle-mounted equipment test bench thermal management system as claimed in claim 7.

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