Transformer structure and radio frequency front-end module

Abstract

The invention discloses a transformer structure and a radio frequency front end module, the transformer structure comprises a secondary coil and M primary coils, the M primary coils are sequentially spaced, and each primary coil surrounds the periphery of a specified point; the first end of each primary coil is configured to be connected to a first signal end, and the second end of each primary coil is configured to be grounded or connected to a power supply port. The secondary coil and the M primary coils are located on the same metal layer, and at least part of the secondary coil is wound in a gap formed by the M primary coils; the first end of the secondary coil is configured to be connected to a second signal end, and the second end of the secondary coil is configured to be grounded. The M primary coils are connected in parallel, so that the equivalent inductance value of the primary coils is reduced, the inductance value ratio between the secondary coils and the primary coils is increased, and the large impedance conversion ratio is achieved.

Description

Technical Field

[0001] The present application relates to the field of radio frequency technology, and more specifically, to a transformer structure and a radio frequency front-end module. Background Art

[0002] In the field of radio frequency technology, a transformer is a device that uses electromagnetic mutual induction to achieve voltage, current and impedance conversion. For example, in a single-ended power amplifier circuit, a transformer is usually used for impedance conversion.

[0003] However, in the existing transformer structure, the number of turns between the secondary coil and the primary coil of the transformer is relatively small, which leads to a relatively small impedance conversion ratio that can be achieved by the existing transformer. Summary of the invention

[0004] The embodiments of the present application provide a transformer structure and a radio frequency front-end module.

[0005] According to the first aspect of the present application, an embodiment of the present application provides a transformer structure, which includes a first winding and a second winding coupled to each other, the first winding includes M primary coils, and the second winding includes a secondary coil. The M primary coils are spaced in sequence, and each primary coil surrounds the periphery of a specified point; the first end of each primary coil is configured to be connected to the first signal end, and the second end of each primary coil is configured to be grounded or connected to a power supply port, and M is a positive integer greater than 1. The secondary coil and the M primary coils are located in the same metal layer, and at least part of the secondary coil is wound in the gap formed by the M primary coils; the first end of the secondary coil is configured to be connected to the second signal end, and the second end of the secondary coil is configured to be grounded.

[0006] According to the second aspect of the present application, an embodiment of the present application further provides a radio frequency front-end module, which includes a substrate, a power amplifier chip and a transformer. Among them, the power amplifier chip is arranged on the substrate, and the power amplifier chip is provided with a signal output terminal. The transformer includes a secondary coil and M primary coils, each of which is surrounded by the periphery of a designated point of the substrate, and the M primary coils are spaced in sequence, and the first end of each primary coil is connected to the signal output terminal, and the second end of each primary coil is grounded or connected to the power supply port, and M is a positive integer greater than 1. The secondary coil and the M primary coils are arranged on the same metal layer of the substrate, and at least part of the secondary coil is located in the gap formed by the M primary coils; the first end of the secondary coil is connected to the output port, and the second end of the secondary coil is grounded.

[0007] The embodiments of the present application provide a transformer structure and a radio frequency front-end module. On the one hand, the first winding in the transformer structure includes M primary coils, the first ends of the M primary coils are all connected to the first signal end, and the second ends are all grounded or connected to the power supply port, that is, the M primary coils are connected in parallel with each other, thereby reducing the equivalent inductance of the primary coil. On the premise that the inductance of the secondary coil remains unchanged, the ratio of the inductance between the secondary coil and the primary coil is increased, thereby achieving a larger impedance conversion ratio.

[0008] On the other hand, the second winding in the transformer structure includes a secondary coil, and at least part of the secondary coil is located in the gap formed by the M primary coils, so that each primary coil has a secondary coil that can be coupled with it, thereby ensuring the coupling coefficient between the primary coil and the secondary coil. On the other hand, the secondary coil and the M primary coils are located in the same metal layer, which can make the transformer structure more compact, which is conducive to the miniaturization design of the RF front-end module using the transformer structure. Furthermore, the secondary coil and the primary coil located in the same metal layer do not need to be bridged by a jumper during the coupling winding process, thereby ensuring the coupling degree while reducing the power loss caused by the jumper bridging. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0010] Figure 1 It is a schematic diagram of the transformer structure provided in an embodiment of the present application.

[0011] Figure 2 yes Figure 1 Schematic diagram of the structure of the first winding.

[0012] Figure 3 yes Figure 1 A structural schematic diagram of the second winding.

[0013] Figure 4 yes Figure 1 Another structural schematic diagram of the second winding.

[0014] Figure 5 It is a structural schematic diagram of the RF front-end module provided in an embodiment of the present application.

[0015] Figure 6 yes Figure 5 Schematic cross-section of the substrate.

[0016] Figure 7 This is another structural schematic diagram of the RF front-end module provided in an embodiment of the present application.

[0017] Figure 8 This is another structural diagram of the RF front-end module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0019] See also Figure 1 The embodiment of the present application provides a transformer structure 100. The transformer is a device that uses electromagnetic mutual induction to achieve voltage, current and impedance transformation. For example, in a push-pull power amplifier circuit, a transformer is usually used to perform impedance conversion or signal synthesis. Specifically, the transformer can be a magnetic coupling transformer, a transmission line transformer, and the like.

[0020] The transformer structure 100 in this embodiment may include a first winding 10 and a second winding 20 coupled to each other, wherein the first winding 10 includes M primary coils 110, and the second winding 20 includes a secondary coil 210. The M primary coils 110 are spaced in sequence, and each primary coil 110 surrounds the periphery of a specified point (point O), and the first end 1101 of each primary coil 110 is configured to be connected to a first signal end (not shown in the figure), and the second end 1103 of each primary coil 110 is configured to be grounded or connected to a power supply port (not shown in the figure), wherein M is a positive integer greater than 1. Figure 1 In the illustrated embodiment, M is set to 2. In some other possible embodiments, M may be set to 3, 4, 5, etc. Therefore, the M primary coils 110 in this embodiment are connected in parallel to each other, thereby reducing the equivalent inductance of the primary coil 110, so that under the premise that the inductance of the secondary coil 210 remains unchanged, the ratio of the inductance between the secondary coil 210 and the primary coil 110 increases, thereby achieving a larger impedance conversion ratio.

[0021] The secondary coil 210 and the M primary coils 110 are located on the same metal layer. At least a portion of the secondary coil 210 is wound around the gap formed by the M primary coils 110. The first end 2101 of the secondary coil 210 is configured to be connected to the second signal end (not shown in the figure), and the second end 2103 of the secondary coil 210 is configured to be grounded.

[0022] Since at least part of the secondary coils 210 in this embodiment are wound around the gap formed by the M primary coils 110, each primary coil 110 has a secondary coil 210 that can be coupled thereto, thereby ensuring the coupling coefficient between the primary coil 110 and the secondary coil 210. In addition, the secondary coil 210 and the M primary coils 110 are located on the same metal layer, which can make the transformer structure 100 more compact, which is conducive to the miniaturization design of the RF front-end module using the transformer structure 100.

[0023] In practical applications, the transformer structure 100 in this embodiment often needs to be integrated on a substrate (e.g., a copper-clad laminate), which may include at least one metal layer, and the secondary coil 210 and the M primary coils 110 are arranged on the same metal layer on the substrate. Furthermore, the secondary coil 210 and the primary coil 110 located on the same metal layer do not need to be connected by a jumper during the process of coupling winding, thereby ensuring the coupling degree while reducing the power loss caused by the jumper connection.

[0024] It should be noted here that the above-mentioned "first signal terminal" can be the signal output terminal of a chip (for example, a power amplifier chip), or the signal output terminal of a component (for example, a transistor). The above-mentioned "second signal terminal" can be the signal input terminal of a chip (for example, a power amplifier chip, a switch chip), or the signal input terminal of a component (for example, a transistor). When the transformer structure 100 is integrated in the RF front-end module, the "second signal terminal" can also be the signal output terminal of the RF front-end module. Specifically, the "first signal terminal" and the "second signal terminal" need to be determined according to the hardware circuit of the specific application of the transformer structure 100, and this embodiment does not impose specific restrictions on this.

[0025] In addition, Figure 1 In the illustrated embodiment, the marked positions of the first end 1101 and the second end 1103 of the primary coil 110, and the first end 2101 and the second end 2103 of the secondary coil 210 are only schematic. The positions of the first end 1101 and the second end 1103 of the primary coil 110 can be interchanged, and the positions of the first end 2101 and the second end 2103 of the secondary coil 210 can be interchanged. Figure 1 Only one possible implementation of the transformer structure 100 is shown.

[0026] The transformer structure 100 in this embodiment is described in detail below.

[0027] The first winding 10 includes M primary coils 110, wherein the M primary coils 110 are spaced in sequence, and each primary coil 110 surrounds the periphery of a designated point (point O). It should be noted that the designated point in this embodiment is only a "virtual point" used to represent the winding position of the M primary coils 110.

[0028] See also Figure 2 , the primary coil 110 may include P first connecting segments 1100, the P first connecting segments 1100 are connected in series, and the extension direction of each first connecting segment 1100 is different from the extension direction of the first connecting segment 1100 adjacent to it. Wherein, P is an integer greater than 4. Figure 2 In the illustrated embodiment, P is set to 7, and the seven first connection segments 1100 are sequentially connected in series and surround the periphery of the point O. Therefore, the primary coil 110 in this embodiment is substantially in a polygonal ring structure, so that the overall structure of the primary coil 110 is smoother, and the coupling degree with the secondary coil 210 can be improved. In some other possible embodiments, P can be set to 5, 6, 8, 9, etc., which is not specifically limited in this embodiment.

[0029] In some possible embodiments, M is 2. The first winding 10 may include a first primary coil 112 and a second primary coil 114. The first primary coil 112 is disposed around the outer periphery of the second primary coil 114, and the first primary coil 112 and the second primary coil 114 are spaced apart from each other. Specifically, the first primary coil 112 and the second primary coil 114 may be in a polygonal ring structure to respectively improve the degree of coupling with the secondary coil 210.

[0030] In some possible embodiments, the first end 1121 of the first primary coil 112 may be located outside the surrounding area formed by the secondary coil 210, and the second end 1123 of the first primary coil 112 may be located within the surrounding area formed by the secondary coil 210. The first end 1141 and the second end 1143 of the second primary coil 114 may both be located within the surrounding area formed by the secondary coil 500. In this embodiment, the coupling degree between the first primary coil 112 and the second primary coil 114 and the secondary coil 210 may be improved through the above-mentioned layout, thereby improving the signal output quality of the transformer structure 100.

[0031] In some other possible embodiments, the first end 1121 of the first primary coil 112 may be located within the surrounding area formed by the secondary coil 210, and the second end 1123 of the first primary coil 112 may be located outside the surrounding area formed by the secondary coil 210. The first end 1141 and the second end 1143 of the second primary coil 114 are both located within the surrounding area formed by the secondary coil 210. In this embodiment, the above-mentioned layout can improve the coupling degree between the first primary coil 112 and the second primary coil 114 and the secondary coil 210, thereby improving the signal output quality of the transformer structure 100.

[0032] In this embodiment, a first straight line L1 defined by a first end 1121 of the first primary coil 112 and a second end 1123 of the first primary coil 112 intersects a second straight line L2 defined by a first end 1141 of the second primary coil 114 and a second end 1143 of the second primary coil 114. In some other possible embodiments, the first end 1121 of the first primary coil 112 and the second end 1123 of the first primary coil 112 may be substantially axisymmetric with respect to a third straight line (not shown in the figure), and the first end 1141 of the second primary coil 114 and the second end 1143 of the second primary coil 114 may be substantially axisymmetric with respect to a fourth straight line (not shown in the figure), wherein the third straight line and the fourth straight line are not collinear.

[0033] Since the transformer structure 100 in this embodiment is a single-input single-output structure, it does not have the function of converting a differential signal into a single-channel signal, or converting a single-channel signal into a differential signal. Therefore, the first end 1121 of the first primary coil 112 and the second end 1123 of the first primary coil 112 are not differential ends to each other, and the first end 1141 of the second primary coil 114 and the second end 1143 of the second primary coil 114 are not differential ends to each other, so that the first end 1121 of the first primary coil 112 and the second end 1123 of the first primary coil 112 and the first end 1141 of the second primary coil 114 and the second end 1143 of the second primary coil 114 do not need to be strictly symmetrically arranged on both sides of the same straight line, thereby improving the flexibility of the first primary coil 112 and the second primary coil 114 in position layout.

[0034] It should be noted here that, in the same embodiment, the connection positions of the first end 1121 of the first primary coil 112 and the first end 1141 of the second primary coil 114 are the same. That is, the first end 1121 of the first primary coil 112 and the first end 1141 of the second primary coil 114 are connected to the same first signal terminal. Similarly, the connection positions of the second end 1123 of the first primary coil 112 and the second end 1143 of the second primary coil 114 are the same. In the case where the second end 1123 of the first primary coil 112 is configured to be grounded, the second end 1143 of the second primary coil 114 is also configured to be grounded. In the case where the second end 1123 of the first primary coil 112 is configured to be connected to the power supply port, the second end 1143 of the second primary coil 114 is also configured to be connected to the power supply port.

[0035] The second winding 20 and the first winding 10 are coupled to each other, and the "coupling" here refers to the energy (for example, electrical energy) transfer phenomenon between the second winding 20 and the first winding 10. The second winding 20 in this embodiment includes a secondary coil 210, and the secondary coil 210 and the M primary coils 110 are located on the same metal layer. Exemplarily, the secondary coil 210 and the M primary coils 110 can be made of metal plates (for example, copper-clad laminates) through an etching process, thereby making the transformer structure 100 more compact, which is conducive to the miniaturization design of the RF front-end module using the transformer structure 100.

[0036] See also Figure 3 , the secondary coil 210 may include Q second connecting segments 2100, the Q second connecting segments 2100 are connected in series, and the extension direction of each second connecting segment 2100 is different from the extension direction of the second connecting segment 2100 adjacent to it. Wherein, Q is an integer greater than 4. Figure 3 In the embodiment shown, Q takes a value of 24, and 24 second connecting segments 2100 are connected in series in sequence and surround the periphery of point O. Therefore, the secondary coil 210 in this embodiment is roughly a polygonal spiral ring structure, which makes the overall structure of the secondary coil 210 smoother and can improve the coupling degree with the primary coil 110. In some other possible embodiments, Q can take a value of 6, 8, 14, 20, etc., which is not specifically limited in this embodiment. It should be noted here that the secondary coil 210 and the M primary coils 110 are roughly the same in shape. Figure 3 As shown, the secondary coil 210 and the M primary coils 110 are both roughly octagonal ring structures, so that when the secondary coil 210 is coupled with the primary coil 110, the coupling degree between the two can be improved.

[0037] See also Figure 4, the secondary coil 210 may include a first connection portion 2120, a body 2140, and a second connection portion 2160 connected in series. The body 2140 is wound around the gap formed by the M primary coils 110, so that each primary coil 110 has a secondary coil 210 that can be coupled thereto, thereby ensuring the coupling coefficient between the primary coil 110 and the secondary coil 210. In some possible embodiments, when the first winding 10 includes a first primary coil 112 and a second primary coil 114, the body 2140 is wound around the gap formed by the first primary coil 112 and the second primary coil 114, that is, the body 2140 is located between the first primary coil 112 and the second primary coil 114, so that the body 2140 can be coupled to the first primary coil 112 and the second primary coil 114, respectively.

[0038] The first connection portion 2120 is connected to one end of the body 2140 away from the designated point (point O), and is wound around the outer periphery of the primary coil 110 located in the outermost circle among the M primary coils 110. On the one hand, the first connection portion 2120 and the body 2140 are connected in series, which can increase the overall inductance of the secondary coil 210, so that the ratio of the inductance between the secondary coil 210 and the primary coil 110 is further increased, thereby achieving a larger impedance conversion ratio. On the other hand, the first connection portion 2120 is wound around the outer periphery of the primary coil 110 located in the outermost circle among the M primary coils 110, so that the secondary coil 210 is wound on both sides of the primary coil 110 in the outermost circle, further improving the coupling coefficient between the primary coil 110 and the secondary coil 210. In some possible embodiments, when the first winding 10 includes a first primary coil 112 and a second primary coil 114 , and the first primary coil 112 is disposed around the outer circumference of the second primary coil 114 , the first connecting portion 2120 is disposed around the outer circumference of the first primary coil 112 .

[0039] The second connection portion 2160 is connected to one end of the body 2140 close to the designated point (point O), and is wound around the inner circumference of the primary coil 110 located in the innermost circle among the M primary coils 110. On the one hand, the second connection portion 2160 and the body 2140 are connected in series, which can increase the overall inductance of the secondary coil 210, so that the ratio of the inductance between the secondary coil 210 and the primary coil 110 is further increased, thereby achieving a larger impedance conversion ratio. On the other hand, the second connection portion 2160 is wound around the inner circumference of the primary coil 110 located in the innermost circle among the M primary coils 110, so that the secondary coil 210 is wound on both sides of the primary coil 110 in the innermost circle, further improving the coupling coefficient between the primary coil 110 and the secondary coil 210. In some possible embodiments, when the first winding 10 includes a first primary coil 112 and a second primary coil 114 , and the first primary coil 112 is disposed around an outer circumference of the second primary coil 114 , the second connecting portion 2160 is disposed around an inner circumference of the second primary coil 114 .

[0040] In some possible embodiments, the secondary coil 210 may only include a first connection portion 2120 and a body 2140 connected in series. In other possible embodiments, the secondary coil 210 may only include a body 2140 and a second connection portion 2160 connected in series. This embodiment does not limit the specific implementation of the secondary coil 210.

[0041] In this embodiment, the positions of the first end 2101 and the second end 2103 of the secondary coil 210 can be interchanged. Figure 3 As shown, the first end 2101 of the secondary coil 210 may be located outside the surrounding area defined by the first primary coil 112, and the second end 2103 of the secondary coil 210 may be located within the surrounding area defined by the second primary coil 114. Figure 4 As shown, the first end 2101 of the secondary coil 210 can be located within the surrounding area defined by the second primary coil 114, and the second end 2103 of the secondary coil 210 can be located outside the surrounding area defined by the first primary coil 112, so that the secondary coil 210 can be more flexible in position layout.

[0042] The embodiment of the present application provides a transformer structure 100, which includes a first winding 10 and a second winding 20 coupled to each other, the first winding 10 includes M primary coils 110, and the second winding 20 includes a secondary coil 210. The M primary coils 110 are spaced in sequence, and each primary coil 110 surrounds the periphery of a specified point (point O), the first end 1101 of each primary coil 110 is configured to be connected to the first signal end, and the second end 1103 of each primary coil 110 is configured to be grounded or connected to a power supply port, wherein M is a positive integer greater than 1. Therefore, the M primary coils 110 in this embodiment are connected in parallel to each other, thereby reducing the equivalent inductance of the primary coil 110, so that under the premise that the inductance of the secondary coil 210 remains unchanged, the ratio of the inductance between the secondary coil 210 and the primary coil 110 increases, thereby achieving a larger impedance conversion ratio.

[0043] The secondary coil 210 and the M primary coils 110 are located in the same metal layer, at least part of the secondary coil 210 is wound in the gap formed by the M primary coils 110, the first end 2101 of the secondary coil 210 is configured to be connected to the second signal end (not shown in the figure), and the second end 2103 of the secondary coil 210 is configured to be grounded. Since at least part of the secondary coil 210 in this embodiment is wound in the gap formed by the M primary coils 110, each primary coil 110 has a secondary coil 210 that can be coupled thereto, thereby ensuring the coupling coefficient between the primary coil 110 and the secondary coil 210. In addition, the secondary coil 210 and the M primary coils 110 are located in the same metal layer, which can make the transformer structure 100 more compact, which is conducive to the miniaturization design of the RF front-end module using the transformer structure 100. Furthermore, the secondary coil 210 and the primary coil 110 located in the same metal layer do not need to be connected via a jumper wire during the coupling winding process, thereby ensuring the coupling degree while reducing the power loss caused by the jumper wire connection.

[0044] See also Figure 5 The embodiment of the present application provides a radio frequency front-end module 300, which is a component that integrates two or more discrete devices such as a radio frequency switch, a low noise amplifier, a filter, a duplexer, a power amplifier, and a transformer into an independent module, thereby improving the integration and hardware performance of the radio frequency front-end module 300 and miniaturizing its size. Specifically, the radio frequency front-end module 300 can be applied to 4G and 5G communication devices such as smart phones, tablet computers, and smart watches.

[0045] The RF front-end module 300 in this embodiment may include a substrate 30, a power amplifier chip 40 and a transformer 50. The power amplifier chip 40 is disposed on the substrate 30, and the power amplifier chip 40 is provided with a signal output terminal 400. The transformer 50 includes a secondary coil 500 and M primary coils 510, each of which surrounds the periphery of a designated point (point O) of the substrate 30, and the M primary coils 510 are spaced in sequence, and the first end 5101 of each primary coil 510 is connected to the signal output terminal 400, and the second end 5103 of each primary coil 510 is grounded or connected to a power supply port (not shown in the figure), and M is a positive integer greater than 1. Figure 5 In the illustrated embodiment, M takes a value of 2. In some other possible embodiments, M may take a value of 3, 4, 5, etc. Therefore, the M primary coils 510 in this embodiment are connected in parallel to each other, thereby reducing the equivalent inductance of the primary coil 510, so that under the premise that the inductance of the secondary coil 210 remains unchanged, the ratio of the inductance between the secondary coil 500 and the primary coil 510 increases, thereby achieving a larger impedance conversion ratio, and the secondary coil and the primary coil located on the same metal layer do not need to be bridged by a jumper during the coupling winding process, so that while ensuring the coupling degree, the power loss caused by the jumper bridge can be reduced, thereby achieving a large bandwidth and low loss performance of the RF front-end module 300.

[0046] The secondary coil 500 and the M primary coils 510 are arranged on the same metal layer of the substrate 30, and at least part of the secondary coil 500 is located in the gap formed by the M primary coils 510. The first end 5001 of the secondary coil 500 is connected to the output port 60, and the second end 5003 of the secondary coil 500 is grounded.

[0047] Since at least part of the secondary coils 500 in this embodiment are wound around the gap formed by the M primary coils 510, each primary coil 510 has a secondary coil 500 that can be coupled thereto, thereby ensuring the coupling coefficient between the primary coil 510 and the secondary coil 500. In addition, the secondary coil 500 and the M primary coils 510 are located on the same metal layer, which can make the overall structure of the transformer 50 more compact, which is conducive to the miniaturization design of the RF front-end module 300.

[0048] It should be noted here that the above-mentioned "output port 60" can be the signal output terminal of the RF front-end module 300, that is, the RF signal processed by the RF front-end module 300 is output from this port. In some possible embodiments, the "output port 60" can also be the signal input terminal of a chip (for example, a power amplifier chip, a switch chip), or the signal input terminal of a component (for example, a transistor, a capacitor), and this embodiment does not specifically limit this.

[0049] The following is an introduction to each module in the RF front-end module 300.

[0050] The substrate 30 is roughly rectangular and is used to fix and support the components (e.g., the power amplifier chip 40 and the transformer 50) in the RF front-end module 300. Specifically, the substrate 30 can be a copper-clad laminate, and a circuit can be printed on the surface of the substrate 30 by processing the copper-clad laminate with holes, chemical copper plating, electroplating copper, etching, etc.

[0051] In some possible embodiments, the substrate 30 may adopt a double metal layer structure. Figure 6 , the substrate 30 may include a first metal layer 3300, a dielectric layer 3320 and a second metal layer 3340, wherein the first metal layer 3300, the dielectric layer 3320 and the second metal layer 3340 are sequentially stacked in the thickness direction of the substrate 30, that is, the first metal layer 3300 and the second metal layer 3340 are spaced apart and arranged on opposite sides of the dielectric layer 3320. Specifically, the first metal layer 3300 can be used for layout routing (for example, equivalent routing of the transformer 50) and fixed support components in the RF front-end module 300 (for example, power amplifier chip 40, etc.). The second metal layer 3340 is used for grounding, and it can also be used for layout routing. Exemplarily, the second metal layer 3340 can be used to set signal ports (for example, signal input ports, output ports 60, etc.) and grounded metal plates. Specifically, the routing located on the first metal layer 3300 and the routing located on the second metal layer 3340 can be connected through a conductive via 3321 set in the dielectric layer 3320, thereby avoiding redundant jumpers and making the layout of components in the RF front-end module 300 more flexible.

[0052] In some possible embodiments, when the output power of the RF front-end module 300 is greater than or equal to the first specified power, the absolute value of the difference between the width of the primary coil 510 and the diameter of the conductive via 3321 is greater than or equal to 0μm and less than or equal to 5μm. The first specified power is determined by the actual application scenario of the RF front-end module 300. When the output power of the RF front-end module 300 is greater than or equal to the first specified power, it means that the RF front-end module 300 can output high-power RF signals. In this case, the width of the primary coil 510 and the diameter of the conductive via 3321 are designed to be roughly the same, which can improve the impedance conversion ratio of the transformer 50 and thus improve the output power of the RF signal. Specifically, the first specified power can be greater than or equal to 2W and less than or equal to 10W. For example, the first specified power is 2W, 4W, and so on. The absolute value of the difference between the width of the primary coil 510 and the diameter of the conductive via 3321 can be 0μm, 1μm, 3μm, 5μm, and so on, which is not specifically limited in this embodiment. Specifically, please refer to Figure 5 In this embodiment, the diameter of the conductive via 3321 may be approximately between 40 μm and 160 μm, the width of the primary coil 510 may be approximately between 40 μm and 160 μm, and the width of the secondary coil 500 may be approximately between 20 μm and 80 μm.

[0053] In some possible embodiments, when the output power of the RF front-end module 300 is less than or equal to the second specified power, the absolute value of the difference between the width of the primary coil 510 and the width of the secondary coil 500 is greater than or equal to 0μm and less than or equal to 5μm. The second specified power is determined by the actual application scenario of the RF front-end module 300. When the output power of the RF front-end module 300 is less than or equal to the second specified power, it means that the RF front-end module 300 can output low-power RF signals. In this case, the width of the primary coil 510 and the width of the secondary coil 500 are designed to be roughly the same, which can make the overall structure of the transformer 50 more compact and reduce the hardware cost of the RF front-end module 300. Specifically, the second specified power can be greater than or equal to 0.1W and less than or equal to 2W. For example, the second specified power is 0.5W, 1W, etc. The absolute value of the difference between the width of the primary coil 510 and the width of the secondary coil 500 can be 0μm, 1μm, 3μm, 5μm, etc., which is not specifically limited in this embodiment. Specifically, see Figure 7 In this embodiment, the width of the primary coil 510 may be approximately between 20 μm and 80 μm, and the width of the secondary coil 500 may be approximately between 20 μm and 80 μm.

[0054] The power amplifier chip 40 is used to amplify the power of the RF signal input to the RF front-end module 300. The power amplifier chip 40 in this embodiment is provided with a signal output terminal 400, a first ground terminal 410 and a second ground terminal 420. The signal output terminal 400 is used to output the RF signal after power amplification. Figure 7 The power amplifier chip 40 may be integrated with a transistor 430, and the transistor 430 is used to form a single-ended power amplifier circuit, and the signal output terminal 400 is the output terminal of the single-ended power amplifier circuit. The transistor 430 may be a bipolar junction transistor (Bipolar Junction Transistor, BJT) or a metal-oxide-semiconductor field-effect transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), and the specific implementation method of the transistor 430 is not limited in this embodiment.

[0055] In some possible embodiments, the power amplifier chip 40 may further be integrated with a first matching capacitor 440, and the first grounding terminal 410 is grounded through the first matching capacitor 440. Therefore, when one end (i.e., the second end 5003) of the secondary coil 500 in the transformer 50 for grounding is arranged outside the surrounding area defined by the primary coil 510 in the outermost circle among the M primary coils 510, and the end is arranged adjacent to the power amplifier chip 40, the secondary coil 500 may be directly connected to the first grounding terminal 410. At this time, the first matching capacitor 440 arranged in the power amplifier chip 40 may play an impedance matching role for the secondary coil 500, reduce the signal output loss, and improve the signal output quality (i.e., Q value) of the transformer 50. Furthermore, the first matching capacitor 440 is integrated in the power amplifier chip 40, which can save the layout space of the substrate 30, so that there is no need to set a surface mounted device (SMD) capacitor on the substrate 30, thereby making the overall structure of the RF front-end module 300 more compact, smaller in area, and lower in cost, which is conducive to the miniaturization design of the RF front-end module 300.

[0056] In some possible embodiments, a fourth matching capacitor 450 may be integrated in the power amplifier chip 40, and the output end of the transistor 430 is connected to the signal output end 400 through the fourth matching capacitor 450. Therefore, when the primary coil 510 in the transformer 50 is connected to the signal output end 400, the fourth matching capacitor 450 can play an impedance matching role for the primary coil 510, thereby improving the signal output quality of the transformer 50. Furthermore, the fourth matching capacitor 450 is integrated in the power amplifier chip 40, which can save the layout space of the substrate 30, making the overall structure of the RF front-end module 300 more compact and lower in cost, which is conducive to the miniaturization design of the RF front-end module 300.

[0057] The transformer 50 is connected to the signal output terminal 400 of the power amplifier chip 40 and is used to adjust the output voltage of the RF signal. The transformer 50 may include a secondary coil 500 and M primary coils 510, wherein the secondary coil 500 and the M primary coils 510 may be arranged in the first metal layer 3300, so that the overall structure of the transformer 50 becomes more compact, which is conducive to the miniaturization design of the RF front-end module 300.

[0058] The M primary coils 510 are spaced in sequence, wherein each primary coil 510 surrounds the periphery of a designated point (point O) of the substrate 30, a first end 5101 of each primary coil 510 is connected to the signal output terminal 400, and a second end 5103 of each primary coil 510 is grounded or connected to a power supply port. Specifically, the primary coil 510 can refer to and follow the relevant introduction of the primary coil 110 in the above transformer structure embodiment, which will not be repeated here. To save space, they will not be repeated here one by one.

[0059] See also Figure 8 , in some possible embodiments, the value of M is 2. The transformer 50 may include a first primary coil 5110 and a second primary coil 5120, and the first primary coil 5110 is arranged around the outer periphery of the second primary coil 5120. Specifically, the first primary coil 5110 and the second primary coil 5120 may refer to and follow the relevant introduction of the first primary coil 112 and the second primary coil 114 in the above transformer structure embodiment, which will not be repeated here. To save space, they will not be repeated here one by one.

[0060] Here, the connection manners of the first primary coil 5110 and the second primary coil 5120 with the power amplifier chip 40 are described respectively.

[0061] In some possible embodiments, Figure 8As shown, the first end 5111 of the first primary coil 5110 is located outside the surrounding area formed by the secondary coil 500 and is connected to the power amplifier chip 40. The second end 5113 of the first primary coil 5110 is located within the surrounding area formed by the secondary coil 500 and is grounded. For example, the second end 5113 of the first primary coil 5110 can be connected to the second metal layer 3340 through a first conductive via (not shown in the figure). The first end 5121 and the second end 5123 of the second primary coil 5120 are both located within the surrounding area formed by the secondary coil 500, the first end 5121 of the second primary coil 5120 is connected to the power amplifier chip 40, and the second end 5123 of the second primary coil 5120 is grounded. For example, the second end 5123 of the second primary coil 5120 can be connected to the second metal layer 3340 through a second conductive via (not shown in the figure).

[0062] Specifically, the RF front-end module 300 may further include a third jumper 31 and a fourth jumper 32. The first end 5111 of the first primary coil 5110 may be connected to the signal output terminal 400 of the power amplifier chip 40 through the third jumper 31. The first end 5121 of the second primary coil 5120 may be connected to the signal output terminal 400 of the power amplifier chip 40 through the fourth jumper 32. Since the first end 5111 of the first primary coil 5110 is located outside the surrounding area formed by the secondary coil 500, when the third jumper 31 connects the first end 5111 to the signal output terminal 400, the third jumper 31 will not cross the top of the secondary coil 500, thereby avoiding the third jumper 31 from affecting the signal output of the secondary coil 500.

[0063] In some other possible embodiments, Figure 7 As shown, the first end 5111 of the first primary coil 5110 is located within the surrounding area formed by the secondary coil 500 and is connected to the power amplifier chip 40. The second end 5113 of the first primary coil 5110 is located outside the surrounding area formed by the secondary coil 500 and is connected to the second ground terminal 420. The first end 5121 and the second end 5123 of the second primary coil 5120 are both located within the surrounding area formed by the secondary coil 500, the first end 5121 of the second primary coil 5120 is connected to the power amplifier chip 40, and the second end 5123 of the second primary coil 5120 is grounded. For example, the second end 5123 of the second primary coil 5120 can be connected to the second metal layer 3340 through a third conductive via (not shown in the figure).

[0064] Specifically, the RF front-end module 300 may further include a fifth jumper 33, a sixth jumper 34 and a seventh jumper 35. Among them, the first end 5111 of the first primary coil 5110 is connected to the signal output terminal 400 of the power amplifier chip 40 through the fifth jumper 33. The first end 5121 of the second primary coil 5120 is connected to the signal output terminal 400 of the power amplifier chip 40 through the sixth jumper 34. The second end 5113 of the first primary coil 5110 is connected to the second ground terminal 420 through the seventh jumper 35. Therefore, when the first primary coil 5110 and the second primary coil 5120 in this embodiment are set on the substrate 30, only three jumpers and one conductive via are required, and Figure 8 Compared with the technical solution shown, one less conductive via can be arranged, thereby reducing the discontinuous area on the substrate 30, thereby improving the coupling between the secondary coil 500 and the primary coil 510.

[0065] At least part of the secondary coil 500 is located in the gap formed by the M primary coils 510, the first end 5001 of the secondary coil 500 is connected to the output port 60, and the second end 5003 of the secondary coil 500 is grounded. Specifically, the secondary coil 500 can refer to and use the relevant introduction of the secondary coil 210 in the above transformer structure embodiment, which will not be repeated here. To save space, it will not be repeated here one by one.

[0066] Please refer again Figure 8 , the secondary coil 500 may include a body 5010, a first connection portion 5020 and a second connection portion 5030, wherein the body 5010 is located in a gap formed by the first primary coil 5110 and the second primary coil 5120. The first connection portion 5020 is connected to an end of the body 5010 away from a designated point (point O), and is wound around the outer periphery of the first primary coil 5110. The second connection portion 5030 is connected to an end of the body 5010 close to a designated point (point O), and is wound around the inner periphery of the second primary coil 5120. Specifically, the body 5010, the first connection portion 5020 and the second connection portion 5030 may refer to and follow the relevant introduction of the body 2140, the first connection portion 2120 and the second connection portion 2160 in the above transformer structure embodiment, and will not be repeated here. To save space, they will not be repeated here one by one.

[0067] Here, the connection between the secondary coil 500 and the power amplifier chip 40 is described.

[0068] In some possible embodiments, Figure 7As shown, the first end 5001 of the secondary coil 500 is located within the surrounding area defined by the primary coil 510 in the innermost circle among the M primary coils 510, and is connected to the output port 60. The second end 5003 of the secondary coil 500 is located outside the surrounding area defined by the primary coil 510 in the outermost circle among the M primary coils 510, and is connected to the first ground terminal 410.

[0069] Specifically, the RF front-end module 300 may further include a first jumper 36 and a second jumper 37. The first end 5001 of the secondary coil 500 is connected to the output port 60 through the first jumper 36. The second end 5003 of the secondary coil 500 is connected to the first ground terminal 410 through the second jumper 37. The second end 5003 of the secondary coil 500 in this embodiment is grounded by connecting to the first ground terminal 410, which can avoid the use of a punching grounding (that is, connecting to the second metal layer 3340 through a conductive via). Therefore, one less conductive via can be arranged on the substrate 30, reducing the discontinuous area on the substrate 30, thereby improving the coupling between the secondary coil 500 and the primary coil 510.

[0070] In this embodiment, the RF front-end module 300 may further include a second matching capacitor 460, which is arranged within the surrounding area defined by the innermost primary coil 510 among the M primary coils 510, thereby making the layout between the second matching capacitor 460 and the transformer 50 more compact and making reasonable use of the layout space of the substrate 30. The second matching capacitor 460 may be a chip capacitor, a plug-in capacitor, etc. Figure 7 In the illustrated embodiment, one end of the second matching capacitor 460 is connected to the first end 5001 of the secondary coil 500, and the other end is grounded. Therefore, the second matching capacitor 460 can be provided in this embodiment to achieve impedance matching of the secondary coil 500, thereby improving the signal output quality of the transformer 50. In other possible embodiments, the first end 5001 of the secondary coil 500 is connected to the output port 60 through the second matching capacitor 460, that is, the second matching capacitor 460 and the secondary coil 500 are connected in series. The specific connection method of the second matching capacitor 460 is not limited in this embodiment.

[0071] In some other possible embodiments, Figure 5As shown, the first end 5001 of the secondary coil 500 is located outside the surrounding area defined by the primary coil 510 in the outermost circle among the M primary coils 510, and the second end of the secondary coil 500 is located within the surrounding area defined by the primary coil 510 in the innermost circle among the M primary coils 510. In this case, the first end 5001 of the secondary coil 500 can be connected to the output port 60 through a jumper wire, and the second end of the secondary coil 500 can be connected to the second metal layer 3340 through a fourth conductive via (not shown in the figure).

[0072] In this embodiment, the RF front-end module 300 may further include a third matching capacitor 470, one end of the third matching capacitor 470 is connected to the first end 5001 of the secondary coil 500, and the other end is grounded. In some other possible embodiments, the first end 5001 of the secondary coil 500 may be connected to the output port 60 through the third matching capacitor 470. In this case, the third matching capacitor 470 is connected in series between the first end 5001 of the secondary coil 500 and the output port 60. Among them, the third matching capacitor 470 can be a chip capacitor, a plug-in capacitor, etc. In this embodiment, by setting the third matching capacitor 470, the impedance matching of the secondary coil 500 can be achieved, thereby improving the signal output quality of the transformer 50.

[0073] The embodiment of the present application provides a radio frequency front-end module 300, which may include a substrate 30, a power amplifier chip 40 and a transformer 50. The power amplifier chip 40 is disposed on the substrate 30, and the power amplifier chip 40 is provided with a signal output terminal 400. The transformer 50 includes a secondary coil 500 and M primary coils 510, each of which surrounds the periphery of a designated point (point O) of the substrate 30, and the M primary coils 510 are spaced in sequence, and the first end 5101 of each primary coil 510 is connected to the signal output terminal 400, and the second end 5103 of each primary coil 510 is grounded or connected to a power supply port (not shown in the figure), and M is a positive integer greater than 1. Therefore, the M primary coils 510 in this embodiment are connected in parallel with each other, thereby reducing the equivalent inductance of the primary coil 510, so that under the premise that the inductance of the secondary coil 210 remains unchanged, the ratio of the inductance between the secondary coil 500 and the primary coil 510 increases, thereby achieving a larger impedance conversion ratio.

[0074] The secondary coil 500 and the M primary coils 510 are arranged on the same metal layer of the substrate 30, and at least part of the secondary coil 500 is located in the gap formed by the M primary coils 510. The first end 5001 of the secondary coil 500 is connected to the output port 60, and the second end 5003 of the secondary coil 500 is grounded.

[0075] Since at least part of the secondary coils 500 in this embodiment are wound around the gap formed by the M primary coils 510, each primary coil 510 has a secondary coil 500 that can be coupled thereto, thereby ensuring the coupling coefficient between the primary coil 510 and the secondary coil 500. In addition, the secondary coil 500 and the M primary coils 510 are located on the same metal layer, which can make the overall structure of the transformer 50 more compact, which is conducive to the miniaturization design of the RF front-end module 300.

[0076] In the specification of this application, certain words are used to refer to specific components in the specification and claims. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in name as a way to distinguish components, but use the difference in function of the components as the criterion for distinction. For example, "including" mentioned throughout the specification and claims is an open term, so it should be interpreted as "including but not limited to"; "substantially" means that those skilled in the art can solve technical problems within a certain error range and basically achieve technical effects.

[0077] In the description of the present application, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", and "inside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are merely simplified descriptions for the convenience of describing the present application. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present application.

[0078] In this application, unless otherwise clearly specified or limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can be internal communication between two elements, or it can be only surface contact. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0079] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0080] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A transformer structure, It is characterized in that include: A first winding and a second winding coupled to each other, wherein the first winding includes M primary coils, and the second winding includes a secondary coil; The M primary coils are spaced in sequence, and each of the primary coils surrounds the periphery of a designated point; the first end of each of the primary coils is configured to be connected to the first signal end, and the second end of each of the primary coils is configured to be grounded or connected to a power supply port, and M is a positive integer greater than 1; The secondary coil and the M primary coils are located in the same metal layer, and at least part of the secondary coil is wound in the gap formed by the M primary coils; the first end of the secondary coil is configured to be connected to the second signal end, and the second end of the secondary coil is configured to be grounded.

2. The transformer structure according to claim 1, It is characterized in that The secondary coil comprises a body and a first connecting portion connected in series; The body is wound around the gap formed by the M primary coils; The first connecting portion is connected to an end of the body away from the designated point, and is wound around the outer circumference of the primary coil located at the outermost circle among the M primary coils.

3. The transformer structure according to claim 1, It is characterized in that The secondary coil comprises a main body and a second connecting portion connected in series; The body is wound around the gap formed by the M primary coils; The second connecting portion is connected to one end of the main body close to the designated point, and is wound around the inner circumference of the innermost primary coil among the M primary coils.

4. The transformer structure according to claim 1, It is characterized in that The secondary coil comprises a first connecting portion, a body and a second connecting portion connected in series; The body is wound around the gap formed by the M primary coils; The first connecting portion is connected to an end of the body away from the designated point and is wound around the outer circumference of the primary coil located at the outermost circle among the M primary coils; The second connecting portion is connected to one end of the main body close to the designated point, and is wound around the inner circumference of the innermost primary coil among the M primary coils.

5. The transformer structure according to claim 4, It is characterized in that The M is 2, the first winding includes a first primary coil and a second primary coil, and the first primary coil is arranged around the outer periphery of the second primary coil; The body is wound around a gap formed by the first primary coil and the second primary coil; the first connecting portion is wound around an outer circumference of the first primary coil; and the second connecting portion is wound around an inner circumference of the second primary coil.

6. The transformer structure according to claim 5, It is characterized in that A first straight line where the first end of the first primary coil and the second end of the first primary coil are located intersects a second straight line where the first end of the second primary coil and the second end of the second primary coil are located.

7. The transformer structure according to claim 5, It is characterized in that The first end of the first primary coil and the second end of the first primary coil are axially symmetric with respect to a third straight line, the first end of the second primary coil and the second end of the second primary coil are axially symmetric with respect to a fourth straight line, and the third straight line and the fourth straight line are not collinear.

8. The transformer structure according to claim 5, It is characterized in that The first end of the secondary coil is located outside the surrounding area defined by the first primary coil, and the second end of the secondary coil is located within the surrounding area defined by the second primary coil; or The first end of the secondary coil is located within the surrounding area defined by the second primary coil, and the second end of the secondary coil is located outside the surrounding area defined by the first primary coil.

9. The transformer structure according to claim 1, It is characterized in that The primary coil comprises P first connecting segments, the P first connecting segments are connected in series, and the extending direction of each first connecting segment is different from the extending direction of the first connecting segment adjacent to it; P is an integer greater than 4; or / and The secondary coil includes Q second connecting segments, which are connected in series, and the extension direction of each second connecting segment is different from the extension direction of the second connecting segment adjacent to it; Q is an integer greater than 4.

10. A radio frequency front-end module, It is characterized in that include: substrate; A power amplifier chip is disposed on the substrate, and the power amplifier chip is provided with a signal output terminal; and A transformer, comprising a secondary coil and M primary coils, each of the primary coils surrounds the outer circumference of a designated point of the substrate, the M primary coils are sequentially spaced, a first end of each of the primary coils is connected to the signal output end, a second end of each of the primary coils is grounded or connected to a power supply port, and M is a positive integer greater than 1; The secondary coil and the M primary coils are arranged on the same metal layer of the substrate, and at least part of the secondary coil is located in the gap formed by the M primary coils; the first end of the secondary coil is connected to the output port, and the second end of the secondary coil is grounded.

11. The radio frequency front-end module according to claim 10, It is characterized in that The RF front-end module and the power amplifier chip are also provided with a first ground terminal; The first end of the secondary coil is located within the surrounding area defined by the innermost primary coil among the M primary coils, and is connected to the output port; the second end of the secondary coil is located outside the surrounding area defined by the outermost primary coil among the M primary coils, and is connected to the first ground terminal.

12. The radio frequency front-end module according to claim 11, It is characterized in that The RF front-end module also includes a first jumper and a second jumper; The first end of the secondary coil is connected to the output port through the first jumper; the second end of the secondary coil is connected to the first grounding end through the second jumper.

13. The RF front-end module according to claim 11, It is characterized in that The RF front-end module also includes a first matching capacitor, which is integrated in the power amplifier chip, and the second end of the secondary coil is connected to the first ground end through the first matching capacitor.

14. The radio frequency front-end module according to claim 11, It is characterized in that The RF front-end module further includes a second matching capacitor, which is arranged within a surrounding area defined by the innermost primary coil among the M primary coils; the first end of the secondary coil is connected to the output port through the second matching capacitor; or One end of the second matching capacitor is connected to the first end of the secondary coil, and the other end is grounded.

15. The radio frequency front-end module according to claim 10, It is characterized in that The first end of the secondary coil is located outside the surrounding area defined by the primary coil in the outermost circle among the M primary coils, and is connected to the output port; the second end of the secondary coil is located within the surrounding area defined by the primary coil in the innermost circle among the M primary coils, and is grounded.

16. The radio frequency front-end module according to claim 15, It is characterized in that The RF front-end module further includes a third matching capacitor, one end of the third matching capacitor is connected to the first end of the secondary coil, and the other end is grounded; or The first end of the secondary coil is connected to the output port through the third matching capacitor.

17. The radio frequency front-end module according to claim 10, It is characterized in that The M is 2, the transformer comprises a first primary coil and a second primary coil, and the first primary coil is arranged around the outer periphery of the second primary coil; The secondary coil comprises a body, a first connecting portion and a second connecting portion, wherein the body is located in a gap formed by the first primary coil and the second primary coil; The first connecting portion is connected to an end of the body away from the designated point and is wound around the outer circumference of the first primary coil; The second connecting portion is connected to an end of the body close to the designated point and is wound around the inner circumference of the second primary coil.

18. The radio frequency front-end module according to claim 17, It is characterized in that The first end of the first primary coil is located outside the surrounding area formed by the secondary coil and is connected to the power amplifier chip; the second end of the first primary coil is located within the surrounding area formed by the secondary coil and is grounded; The first end and the second end of the second primary coil are both located within the surrounding area formed by the secondary coil, the first end of the second primary coil is connected to the power amplifier chip, and the second end of the second primary coil is grounded.

19. The radio frequency front-end module according to claim 18, It is characterized in that The RF front-end module further includes a third jumper and a fourth jumper, and the first end of the first primary coil is connected to the signal output end of the power amplifier chip through the third jumper; The first end of the second primary coil is connected to the signal output end of the power amplifier chip through the fourth jumper.

20. The radio frequency front-end module according to claim 17, It is characterized in that The power amplifier chip is also provided with a second ground terminal; the first end of the first primary coil is located within the surrounding area formed by the secondary coil and is connected to the power amplifier chip; the second end of the first primary coil is located outside the surrounding area formed by the secondary coil and is connected to the second ground terminal; The first end and the second end of the second primary coil are both located within the surrounding area formed by the secondary coil, the first end of the second primary coil is connected to the power amplifier chip, and the second end of the second primary coil is grounded.

21. The radio frequency front-end module according to claim 20, It is characterized in that The RF front-end module also includes a fifth jumper, a sixth jumper and a seventh jumper; The first end of the first primary coil is connected to the signal output end of the power amplifier chip through the fifth jumper; The first end of the second primary coil is connected to the signal output end of the power amplifier chip through the sixth jumper; The second end of the first primary coil is connected to the second ground end through the seventh jumper.

22. The RF front-end module according to any one of claims 10 to 21, It is characterized in that The power amplifier chip is provided with a transistor and a fourth matching capacitor, and the output end of the transistor is connected to the signal output end through the fourth matching capacitor.

23. The RF front-end module according to any one of claims 10 to 21, It is characterized in that The substrate comprises a first metal layer, a second metal layer for grounding, and a dielectric layer arranged between the first metal layer and the second metal layer, wherein the dielectric layer is provided with a conductive via; The secondary coil and the M primary coils are arranged on the first metal layer, and the second ends of at least some of the primary coils are connected to the second metal layer through the conductive vias.

24. The radio frequency front-end module according to claim 23, It is characterized in that When the output power of the RF front-end module is greater than or equal to the first specified power, the absolute value of the difference between the width of the primary coil and the diameter of the conductive via is greater than or equal to 0 μm and less than or equal to 5 μm.

25. The RF front-end module according to any one of claims 10 to 21, It is characterized in that When the output power of the RF front-end module is less than or equal to the second specified power, the absolute value of the difference between the width of the primary coil and the width of the secondary coil is greater than or equal to 0 μm and less than or equal to 5 μm.

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