Optical integrated chip and optical gyroscope
Through the design of optical integrated chips, some components in the optical gyroscope are integrated, and technologies such as silicon nitride optical waveguide layer and polarization beam splitter are used to solve the problems of low adaptability and high loss in the fiber fusion connection method, and improve the system The stability and measurement accuracy reduce costs.
Patent Information
- Application Number
- CN202411025200.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-25
- Publication Date
- 2024-12-13
AI Technical Summary
The fiber fusion connection method in existing optical gyroscopes has problems such as low adaptability, high loss, complex process and high cost, which affects the performance and economic benefits of the system.
By designing an optical integrated chip, some components in the optical gyroscope are integrated and chipped, reducing the connection points between modules, and using technologies such as silicon nitride optical waveguide layer and polarization beam splitter to improve integration and stability .
It achieves higher integration and operational stability, reduces connection loss, simplifies the manufacturing process, improves system performance and measurement accuracy, and reduces costs.
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Figure CN119124126A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of integrated optical sensing technology, and in particular, relates to an optical integrated chip and an optical gyroscope. Background Art
[0002] The optical gyroscope is a precision instrument that uses the principle of optical interference to measure angular velocity. It is widely used in aerospace, navigation, military and other high-tech fields. At present, the various functional components in the optical gyroscope often need to be connected by optical fiber fusion splicing. This traditional connection method has many disadvantages, resulting in low connection adaptability and high loss between the functional components of the optical gyroscope, which seriously affects the overall performance and economic benefits of the optical gyroscope.
[0003] Specifically, the fiber fusion splicing method faces the following main problems in actual operation:
[0004] First, the adaptability of fiber fusion connection is low. Since fiber fusion requires precise alignment of the connection point, a small error will reduce the efficiency of signal transmission and affect the measurement accuracy. In addition, the difference in refractive index and physical size between different optical fibers will increase the complexity of the connection, thus affecting the stability and reliability of the system.
[0005] Secondly, optical loss is inevitable during the fiber splicing process. The optical signal passes through multiple splicing points during transmission, and each splicing point will introduce a certain amount of insertion loss and reflection loss. These losses will accumulate, causing the optical signal strength to gradually weaken, affecting the signal detection and processing capabilities of the gyroscope, and reducing the overall sensitivity and accuracy of the system.
[0006] Thirdly, the fiber fusion splicing process is complex and costly. Fiber fusion splicing requires special equipment and technicians, and the splicing process is time-consuming and labor-intensive, increasing production costs and maintenance difficulties. At the same time, the stability and durability of the splicing point will also be affected by external factors such as ambient temperature and humidity, increasing the risk of system failure and maintenance costs.
[0007] Therefore, improving the integration of optical gyroscopes has become an urgent problem to be solved. Improving integration means integrating more optical functional devices into a smaller and more compact space through technological innovation and optimized design, reducing the number and length of optical fiber connections, reducing connection losses, and improving system performance and stability. Summary of the invention
[0008] The embodiments of the present application provide an optical integrated chip and an optical gyroscope, which integrate and chip some components in the optical gyroscope, reduce the connection points between modules, and improve the integration and operation stability.
[0009] The present application provides an optical integrated chip, including a substrate and an optical waveguide device layer. The optical waveguide device layer is arranged on the substrate, and the optical waveguide device layer includes a first coupler and a detection waveguide. The first coupler includes a light source waveguide and a first waveguide, a second waveguide and a third waveguide connected to the light source waveguide, and the light source waveguide is used to connect the light source. The first waveguide is used to connect the first interference module, the second waveguide is used to connect the second interference module, the third waveguide is used to connect the third interference module, and the detection waveguide is used to connect the detection element. The detection waveguide includes a fourth waveguide connected to the first waveguide, a fifth waveguide connected to the second waveguide, and a sixth waveguide connected to the third waveguide. Among them, the first waveguide, the second waveguide and the third waveguide are arranged at intervals along the first direction, the light source waveguide is arranged on one side of the first waveguide, the second waveguide and the third waveguide along the second direction, and the first direction intersects with the second direction.
[0010] In some embodiments, the optical waveguide device layer includes an optical waveguide layer and a first dielectric layer, the first dielectric layer is disposed on the substrate, the optical waveguide layer is disposed on a side of the first dielectric layer away from the substrate, and the refractive index of the optical waveguide layer is greater than the refractive index of the first dielectric layer.
[0011] In some embodiments, the material of the optical waveguide layer includes silicon nitride, and the material of the first dielectric layer includes silicon dioxide.
[0012] In some embodiments, the optical waveguide device layer further includes a second coupler, the second coupler including a first device connected to the first waveguide, a second device connected to the second waveguide, and a third device connected to the third waveguide, the first device, the second device, and the third device are spaced apart along the first direction.
[0013] In some embodiments, the optical waveguide device layer further includes a polarization beam splitter, which is connected to the first coupler and is used to convert the light into TE polarized light.
[0014] In some embodiments, the polarization beam splitter includes a first polarization beam splitter, a second polarization beam splitter, and a third polarization beam splitter. The first polarization beam splitter is connected to the first waveguide, the second polarization beam splitter is connected to the second waveguide, and the third polarization beam splitter is connected to the third waveguide.
[0015] In some embodiments, the optical waveguide device layer also includes a first light guide groove connected to the first polarization beam splitter, a second light guide groove connected to the second polarization beam splitter, and a third light guide groove connected to the third polarization beam splitter, and the first light guide groove, the second light guide groove and the third light guide groove are used to absorb the TM polarized light separated from the polarization beam splitter.
[0016] In some embodiments, the optical integrated chip further includes a light source chip, and the light source chip is connected to the light source waveguide.
[0017] The present application also provides an optical gyroscope, comprising the optical integrated chip, the detection element and the interference module in the above embodiment. The detection element is connected to the detection waveguide, and the interference module comprises a first interference module, a second interference module and a third interference module. The first interference module is connected to the first waveguide, the second interference module is connected to the second waveguide, and the third interference module is connected to the third waveguide.
[0018] In some embodiments, the first interference module includes a first phase modulator and a first interference ring. The first phase modulator is connected to the first waveguide, and the first interference ring is connected to the first phase modulator.
[0019] In some embodiments, the first phase modulator includes at least one of a piezoelectric phase modulator or a lithium niobate phase modulator.
[0020] In some embodiments, the fourth waveguide includes a first sub-waveguide extending along the second direction and a second sub-waveguide extending along the first direction, the fifth waveguide includes a third sub-waveguide extending along the first direction, a fourth sub-waveguide extending along the second direction and a fifth sub-waveguide extending along the first direction, and the sixth waveguide extends along the first direction. The detection element is disposed on one side of the optical integrated chip along the first direction, and the detection element includes a first detector connected to the second sub-waveguide, a second detector connected to the fifth sub-waveguide and a third detector connected to the sixth waveguide.
[0021] In some embodiments, the fourth waveguide includes a first sub-waveguide extending along the first direction and a second sub-waveguide extending along the second direction, the fifth waveguide includes a third sub-waveguide extending along the first direction and a fourth sub-waveguide extending along the second direction, and the sixth waveguide includes a fifth sub-waveguide extending along the first direction and a sixth sub-waveguide extending along the second direction. The detection element is arranged on one side of the optical integrated chip along the second direction, and the detection element includes a first detector connected to the second sub-waveguide, a second detector connected to the fourth sub-waveguide, and a third detector connected to the sixth sub-waveguide.
[0022] The optical integrated chip provided in the embodiment of the present application includes a substrate and an optical waveguide device layer, and the optical waveguide device layer includes a first coupler and a detection waveguide. The first coupler includes a light source waveguide, which is used to connect the light source to receive the incident light, so that the incident light can be transmitted from the light source waveguide to other devices. The first coupler also includes a first waveguide, a second waveguide and a third waveguide, which can divide the incident light into three parts of light. The first waveguide, the second waveguide and the third waveguide are respectively connected to the first interference module, the second interference module and the third interference module, and the three parts of light can be introduced into the interference module respectively to transmit light to the interference module or receive light transmitted back from the interference module. The detection waveguide is connected to the first coupler and is used to transmit the light transmitted back from the interference module to the detection element, thereby completing the detection work. In the above structure, the first waveguide, the second waveguide and the third waveguide are arranged at intervals along the first direction, and the light source waveguide is arranged on one side of the first waveguide, the second waveguide and the third waveguide along the second direction. The various components are arranged reasonably to make full use of the space of the substrate. The integration of the optical integrated chip is improved, the connection points between the modules are reduced, and the operation stability of the optical gyroscope is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments of the present application. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0024] Figure 1 is a schematic diagram of the structure of an optical integrated chip provided in one embodiment of the present application;
[0025] Figure 2 is a schematic structural diagram of an optical integrated chip provided in another embodiment of the present application;
[0026] Figure 3 is a schematic structural diagram of an optical integrated chip provided by another embodiment of the present application;
[0027] Figure 4 is a schematic structural diagram of an optical gyroscope provided in one embodiment of the present application;
[0028] Figure 5 is a schematic structural diagram of an optical gyroscope provided in another embodiment of the present application;
[0029] Figure 6 is a structural schematic diagram of an optical gyroscope provided in yet another embodiment of the present application;
[0030] Figure 7 It is a schematic diagram of the structure of an optical gyroscope provided in yet another embodiment of the present application.
[0031] In the drawings, the figures are not necessarily drawn to scale.
[0032] The reference numerals in the specific implementation manner are as follows:
[0033] 1. Optical gyroscope; X, first direction; Y, second direction; Z, third direction; 10. Optical integrated chip; 101. Substrate; 102. First coupler; 103. Detection waveguide; 104. Light source waveguide; 105. First waveguide; 106. Second waveguide; 107. Third waveguide; 108. Fourth waveguide; 109. Fifth waveguide; 110. Sixth waveguide; 111. Second coupler; 112. Seventh waveguide; 113. Eighth waveguide; 114. Ninth waveguide; 115. Tenth waveguide; 116. Eleventh waveguide; 117. Twelfth waveguide; 118. Polarization beam splitter; 119. First polarization beam splitter; 120. First polarization waveguide; 121. First beam splitting waveguide; 122. Second polarization beam splitter; 123. Second polarization waveguide; 124. Second beam splitting waveguide; 125. 5. The third polarization beam splitter; 126. The third polarization waveguide; 127. The third beam splitting waveguide; 128. The first sub-waveguide; 129. The second sub-waveguide; 130. The third sub-waveguide; 131. The fourth sub-waveguide; 132. The fifth sub-waveguide; 133. The first sub-waveguide; 134. The second sub-waveguide; 135. The third sub-waveguide; 136. The fourth sub-waveguide; 137. The fifth sub-waveguide; 138. The sixth sub-waveguide; 140. The optical waveguide device layer; 20. The detection element; 201. The first detector; 202. The second detector; 203. The third detector; 30. The light source chip; 40. The interference module; 401. The first interference module; 402. The second interference module; 403. The third interference module; 404. The first phase modulator; 405. The first interference ring; 406. The piezoelectric phase modulator. DETAILED DESCRIPTION
[0034] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.
[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.
[0036] It should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", etc. are based on the directions or positional relationships shown in the drawings and are only for the convenience of description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on this patent.
[0037] It should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0038] The optical gyroscope is an optical sensor that detects the angular velocity of a moving carrier. It is a core component of the strapdown inertial navigation system and is widely used in weapon guidance, aerospace, and automation control. In recent years, the research on gyroscopes has been moving towards chip-based development. The integrated optical gyroscope based on optoelectronic integration technology replaces optical fiber with waveguide and integrates some active and passive components on the chip. It has the characteristics of simple structure, small size, light weight, and more reliable operation. It is expected to meet the development needs of inertial systems in the new era of intelligence and miniaturization, and has broad application prospects.
[0039] The optical gyroscope is mainly composed of a light source, a coupler, a polarizer, a phase modulator, a sensitive unit fiber ring, a detector, and a signal processing circuit. The light emitted by the broadband light source passes through the coupler and the polarizing structure, and is divided into two beams of light transmitted in opposite directions and enter the fiber ring. At different times, they are subjected to phase modulation of different magnitudes by the phase modulator. As the system rotates, the two beams of light generate a Sagnac phase difference in the fiber ring, and after interference occurs, they are detected by the photodetector PD and converted into electrical signals. Subsequently, they pass through the signal processing circuit to obtain the rotation electrical signal of the gyroscope.
[0040] As an engineering system, the optimal working condition of the interferometric fiber gyroscope is to adopt a bias modulation scheme, and to achieve push-pull modulation of reciprocal light by placing reciprocal phase modulators at both ends of the beam splitter. Since the fiber coil has a transmission time, the fiber coil is like a delay line filter. Without weakening the reciprocity of the optical path, a high-sensitivity working point is obtained, and the best modulation-demodulation effect is obtained at the eigenfrequency. The key to ensuring this optimal working condition is the reciprocity of the two interfering light beams. Only by ensuring that the optical paths of the two reverse light waves are exactly the same can the true non-reciprocal effect, namely the Sagnac effect, produce a non-reciprocal phase difference. The optimal working conditions of the optical path system are jointly determined by its light source, integrated optical branch phase modulator, coupler, polarization-maintaining fiber ring ring and detector.
[0041] In order to match the technological development level of the intelligent era, the standards of various aspects of the gyroscope system have also been improved accordingly. For example, the size and weight of the gyroscope need to be smaller and lighter to achieve the angular velocity measurement of the carrier, making the research on optical gyroscopes gradually develop in the direction of lightweight and chip-based.
[0042] In addition, in order to measure the precise angular velocity of the carrier in three-dimensional space, the three-axis gyroscope system requires three sets of the same optical path structure for measurement, which has some problems and limitations in practical applications. For example, the system is large in size and weight, and the discrete system consists of multiple independent gyroscope modules, with a large overall size and weight. This is not conducive to application scenarios that require lightweight and miniaturization (such as portable devices and drones). In addition, the system has high total power consumption and high cost. At the same time, due to the large number of connection points between multiple modules in the discrete system, each connection point may become a potential failure point. In addition, differences in welding and wiring processes may also reduce the overall reliability of the system. There may be certain performance differences in the discrete gyroscope modules during the manufacturing process, which leads to poor measurement consistency between the axes in the system, affecting the overall measurement accuracy and stability. In addition, the design and integration process of the discrete system is relatively complex, and it is necessary to consider the layout, connection and calibration of multiple modules. This increases the design time and difficulty, and may also lead to a longer development cycle. Secondly, due to the large number of connection lines between the discrete modules, the system is more susceptible to external electromagnetic interference, which in turn affects the accuracy and stability of the measurement data.
[0043] Based on the above problems, the present application proposes an optical integrated chip, which integrates and chips some independent modules in the three-axis system. The optical integrated chip includes a substrate and an optical waveguide device layer, and the optical waveguide device layer is arranged on the substrate. The optical waveguide device layer includes a first coupler and a detection waveguide. The first coupler includes a light source waveguide, which is used to connect the light source to receive incident light, so that the incident light can be transmitted from the light source waveguide to other devices. The first coupler also includes a first waveguide, a second waveguide and a third waveguide, and the first coupler can divide the incident light into three parts of light. The first waveguide, the second waveguide and the third waveguide are respectively used to connect the first interference module, the second interference module and the third interference module. The three parts of light can be introduced into the interference module respectively to transmit light to the interference module or receive light transmitted back from the interference module. The detection waveguide is connected to the first coupler, and is used to transmit the light transmitted back from the interference module to the detection element, thereby completing the detection work.
[0044] In the above structure, the first waveguide, the second waveguide and the third waveguide are arranged on the substrate at intervals along the first direction, so as to realize the above structure chip. The light source waveguide is arranged on one side of the first waveguide, the second waveguide and the third waveguide along the second direction, and each component is arranged reasonably to make full use of the space of the substrate. The integration of the optical integrated chip is improved, the connection points between modules are reduced, the operation stability of the optical gyroscope and the accuracy of the measured data are improved, the cost is reduced, and the overall volume and weight are reduced.
[0045] The optical integrated chip and the optical gyroscope of the embodiment of the present application are described in detail below in conjunction with the accompanying drawings. Figures 1 to 3 , Figure 1 is a schematic diagram of the structure of an optical integrated chip provided in one embodiment of the present application, Figure 2 is a schematic diagram of the structure of an optical integrated chip provided by another embodiment of the present application, Figure 3 It is a schematic diagram of the structure of an optical integrated chip provided in yet another embodiment of the present application.
[0046] As shown in the figure, the optical integrated chip 10 of the embodiment of the present application includes: a substrate 101 and an optical waveguide device layer 140, and the optical waveguide device layer 140 is arranged on the substrate 101. The optical waveguide device layer 140 includes a first coupler 102 and a detection waveguide 103. The first coupler 102 is arranged on the substrate 101, and the first coupler 102 includes a light source waveguide 104 and a first waveguide 105, a second waveguide 106 and a third waveguide 107 connected to the light source waveguide 104. The light source waveguide 104 is used to connect the light source. The first waveguide 105 is used to connect the first interference module, the second waveguide 106 is used to connect the second interference module, and the third waveguide 107 is used to connect the third interference module. The detection waveguide 103 is used to connect the detection element, and the detection waveguide 103 includes a fourth waveguide 108 connected to the first waveguide 105, a fifth waveguide 109 connected to the second waveguide 106, and a sixth waveguide 110 connected to the third waveguide 107. The first waveguide 105 , the second waveguide 106 and the third waveguide 107 are arranged at intervals along the first direction X, and the light source waveguide 104 is arranged on one side of the first waveguide 105 , the second waveguide 106 and the third waveguide 107 along the second direction Y. The first direction X and the second direction Y intersect.
[0047] The material of the substrate 101 may include a silicon-based material, and illustratively, may include at least one of a silicon-on-insulator (SOI) platform, a silicon nitride-on-silicon platform, a lithium niobate platform, and a silicon dioxide platform.
[0048] The first coupler 102 may be a one-to-three coupler, which equally divides the light in the light source waveguide 104 into three parts, and the three parts of light are respectively emitted into the first waveguide 105 , the second waveguide 106 , and the third waveguide 107 .
[0049] The light source waveguide 104, the first waveguide 105, the second waveguide 106, the third waveguide 107, the fourth waveguide 108, the fifth waveguide 109 and the sixth waveguide 110 may be light path structures formed on the substrate 101. They have a high refractive index and guide light to propagate along the path along which they extend.
[0050] Exemplarily, the first direction X is perpendicular to the second direction Y. The first direction X may be a width direction of the substrate 101 , and the second direction Y may be a length direction of the substrate 101 .
[0051] The optical integrated chip 10 provided in the embodiment of the present application includes a substrate 101 and an optical waveguide device layer 140, and the optical waveguide device layer 140 is arranged on the substrate 101. The optical waveguide device layer 140 includes a first coupler 102 and a detection waveguide 103. The first coupler 102 includes a light source waveguide 104, which is used to connect the light source to receive the incident light, so that the incident light can be transmitted from the light source waveguide 104 to other devices. The first coupler 102 also includes a first waveguide 105, a second waveguide 106 and a third waveguide 107, which can divide the incident light into three parts of light. The first waveguide 105, the second waveguide 106 and the third waveguide 107 are respectively used to connect the first interference module, the second interference module and the third interference module, and can introduce the three parts of light into the interference module 40 respectively, so as to transmit light to the interference module 40 or receive light transmitted back from the interference module 40. The detection waveguide 103 is connected to the first coupler 102 and is used to transmit the light returned by the interference module 40 to the detection element 20, thereby completing the detection work.
[0052] In the above structure, the first waveguide 105, the second waveguide 106 and the third waveguide 107 are arranged at intervals along the first direction X, and the light source waveguide 104 is arranged on one side of the first waveguide 105, the second waveguide 106 and the third waveguide 107 along the second direction Y. The various components are arranged reasonably to make full use of the space of the substrate 101. The integration of the optical integrated chip 10 is improved, the connection points between modules are reduced, and the operation stability of the optical gyroscope 1 is improved.
[0053] In some embodiments of the present application, the first waveguide 105, the second waveguide 106, the third waveguide 107, the fourth waveguide 108, the fifth waveguide 109 and the sixth waveguide 110 are an integrally formed structure. The first waveguide 105, the second waveguide 106, the third waveguide 107, the fourth waveguide 108, the fifth waveguide 109 and the sixth waveguide 110 can be manufactured using the same material and process, thereby improving the integration of the first coupler 102 and the detection waveguide 103, reducing the number of welding times for assembly, and improving assembly efficiency and detection accuracy, and reducing power consumption of the chip.
[0054] In some embodiments of the present application, the optical waveguide device layer 140 includes an optical waveguide layer and a first dielectric layer. The first dielectric layer is disposed on the substrate 101 , and the optical waveguide layer is disposed on a side of the first dielectric layer away from the substrate. The refractive index of the optical waveguide layer is greater than the refractive index of the first dielectric layer.
[0055] Optionally, the optical waveguide device layer 140 further includes a second dielectric layer, and the refractive index of the optical waveguide layer is greater than the refractive index of the second dielectric layer. The second dielectric layer is disposed on the side of the first dielectric layer away from the substrate. The optical waveguide layer is disposed between the first dielectric layer and the second dielectric layer, and the first dielectric layer and the second dielectric layer surround the optical waveguide layer, limiting the light to propagate in the optical waveguide layer.
[0056] The optical waveguide layer is isolated from the substrate 101 by providing the first dielectric layer, thereby limiting the transmission path of the light beam and improving the measurement accuracy.
[0057] In some embodiments of the present application, the material of the optical waveguide device layer 140 includes silicon nitride, and the material of the first dielectric layer includes silicon dioxide. Optionally, the material of the second dielectric layer includes silicon dioxide.
[0058] In the above technical solution, the propagation loss of the silicon nitride (SiN) optical waveguide layer can be as low as 0.04dB / cm. This feature enables silicon nitride-based optical integrated chips to achieve high-performance optical components and links. Low loss means that the signal is less attenuated during transmission, which is conducive to long-distance and high-efficiency optical communications. The silicon nitride optical waveguide layer can be efficiently coupled with standard single-mode optical fiber, and the coupling loss is usually less than 1dB. This helps to reduce the connection loss between the optical fiber and the chip and improve the overall performance of the system. At the same time, silicon nitride material has high thermal and mechanical stability and can maintain stable performance in harsh working environments. Silicon nitride is corrosion-resistant and oxidation-resistant. It does not react with other inorganic acids except hydrofluoric acid. It can withstand strong radiation irradiation, which makes the chip reliable in complex environments for a long time.
[0059] Optionally, the optical waveguide device layer 140 can be manufactured using CMOS compatible technologies such as low pressure chemical vapor deposition (LPCVD) and plasma enhanced chemical vapor deposition (PECVD). These deposition methods can grow uniform and repeatable silicon nitride films with well-controlled thickness and refractive index. This enables silicon nitride-based waveguide chips to be integrated with existing semiconductor manufacturing processes, reducing production costs and improving production efficiency. Silicon nitride waveguides can be designed into various cross-sectional geometries (such as strip waveguides, box waveguides, slot waveguides, etc.) to achieve the desired optical properties.
[0060] like Figure 2 As shown, in some embodiments of the present application, the optical waveguide device layer 140 further includes a second coupler 111, the second coupler 111 includes a first device 111A connected to the first waveguide 105, a second device 111B connected to the second waveguide 106, and a third device 111C connected to the third waveguide 107, and the first device 111A, the second device 111B, and the third device C are arranged at intervals along the first direction X.
[0061] Specifically, the first device 111A includes a seventh waveguide 112 and an eighth waveguide 113 connected to the first waveguide 105 , the second device 111B includes a ninth waveguide 114 and a tenth waveguide 115 connected to the second waveguide 106 , and the third device 111C includes an eleventh waveguide 116 and a twelfth waveguide 117 connected to the third waveguide 107 .
[0062] Exemplarily, the second coupler 111 may be a one-to-two coupler, which refers to an optical device capable of equally splitting a light beam into two.
[0063] Exemplarily, the three light beams output by the first coupler 102 are further divided into six light beams by the second coupler 111, and every two light beams enter the same interference module. Inside each interference module, two light beams propagate in opposite directions around a closed loop (usually a ring waveguide) to form Sagnac interference. By setting the second coupler 111, the stability and accuracy of the measurement in the interference module are improved. In addition, the second coupler 111 is integrated into the optical integrated chip 10, which reduces the volume and weight, while improving the stability and reliability of the system.
[0064] In some embodiments of the present application, the seventh waveguide 112, the eighth waveguide 113 and the first waveguide 105 are integrally formed, the ninth waveguide 114, the tenth waveguide 115 and the second waveguide 106 are integrally formed, and the eleventh waveguide 116 and the twelfth waveguide 117 and the third waveguide 107 are integrally formed.
[0065] The one-piece structure means that these waveguides are manufactured as a whole during the manufacturing process, rather than being manufactured separately and then assembled. This design reduces the interfaces and connection points between components, thereby saving space and simplifying the manufacturing process. In the optical integrated chip 10, the substrate 101 space is a very valuable resource. Reducing unnecessary components and connections can improve the integration of the chip, so that more functions can be integrated into a smaller chip area. The one-piece structure also enhances the operational stability of the chip. Since the waveguides are directly connected and there are no additional interfaces or connection points, the risk of performance degradation or failure caused by problems such as loose interfaces, poor connections or aging is reduced. In addition, the one-piece structure usually has better thermal stability and mechanical stability, and can maintain stable performance in various harsh environments. In particular, the one-piece structure can improve the optical performance of the chip. The first coupler 102 and the second coupler 111 are directly connected and there are no additional loss sources (such as interface reflection, scattering, etc.), so the loss of the optical signal during transmission is greatly reduced. At the same time, since the relative positions and angles between the waveguides can be more precisely controlled, the desired optical mode matching and phase matching can be achieved more easily, thereby improving the stability and sensitivity of the interference effect.
[0066] like Figure 3 As shown, in some embodiments of the present application, the optical integrated chip 10 further includes a polarization beam splitter 118 , which is connected to the first coupler 102 , and is used to convert light into TE polarized light.
[0067] In the optical measurement process, stray light is a common interference factor, which will interfere with the measurement of the target signal and reduce the signal-to-noise ratio and measurement accuracy of the system. The polarization beam splitter 118 selectively transmits light in a specific polarization direction and suppresses light in other polarization directions, thereby effectively reducing unwanted stray light and improving the system's anti-interference ability and measurement accuracy.
[0068] The above structure integrates the polarization beam splitter 118 into the optical integrated chip 10, which not only improves the integration of the chip, but also enhances the stability of the system. Since all components are tightly integrated together, the impact of external interference and mechanical vibration on system performance is reduced. In addition, the integrated design also helps to simplify the installation and maintenance process of the system and reduce the cost of use.
[0069] In some embodiments of the present application, the polarization beam splitter 118 includes a first polarization beam splitter 119, a second polarization beam splitter 122, and a third polarization beam splitter 125. The first polarization beam splitter 119 is connected to the first waveguide 105, the second polarization beam splitter 122 is connected to the second waveguide 106, and the third polarization beam splitter 125 is connected to the third waveguide 107.
[0070] In some embodiments of the present application, the optical waveguide device layer 140 also includes a first light guide groove connected to the first polarization beam splitter 119, a second light guide groove connected to the second polarization beam splitter, and a third light guide groove connected to the third polarization beam splitter, and the first light guide groove, the second light guide groove and the third light guide groove are used to absorb the TM polarized light separated from the polarization beam splitter.
[0071] The first polarization beam splitter 119 , the second polarization beam splitter 122 , and the third polarization beam splitter 125 have the same structure. The structure of the polarization beam splitter 118 will be described below by taking the first polarization beam splitter 119 as an example.
[0072] Exemplarily, the first polarization beam splitter 119 includes a first polarization waveguide 120 and a first beam splitting waveguide 121. The first polarization waveguide 120 is connected to the first waveguide 105, and the first beam splitting waveguide 121 is connected to the first polarization waveguide 120. One end of the first beam splitting waveguide 121 away from the first polarization waveguide 120 is connected to a first light guiding groove, and a light absorbing material is disposed in the first light guiding groove.
[0073] The first polarization waveguide 120 is connected between the first waveguide 105 and the seventh waveguide 112, and its main function is to selectively transmit light of a specific polarization direction. That is, only light that meets the specific polarization conditions can pass through the first polarization waveguide 120, and light of other polarization directions will be suppressed or attenuated. The first beam splitting waveguide 121 is connected to the first polarization waveguide 120, and its main function is to split the polarization-selected light beam for subsequent optical processing or measurement. A first light guide groove is provided at one end of the first beam splitting waveguide 121 away from the first polarization waveguide 120, and a light absorbing material is provided in the first light guide groove, which can effectively absorb stray light that is not split or scattered, and prevent these lights from interfering with the system. The selection of the light absorbing material should have high absorbance, low reflectivity and good stability to ensure reliability in long-term use.
[0074] The above structure can reduce unnecessary light loss and noise interference by precisely controlling the polarization state of light and the beam splitting process. This helps to improve the signal-to-noise ratio and measurement accuracy of the system, allowing the system to maintain stable performance in more complex environments or for longer operating times. In addition, integrating polarization selection and beam splitting functions into a single module can simplify the overall structure of the system and reduce the number of components and interfaces. This not only reduces the manufacturing cost and maintenance difficulty of the system, but also improves the reliability and stability of the system.
[0075] In some optional embodiments, the polarization beam splitter 118 includes a second polarization beam splitter 122, and the second polarization beam splitter 122 includes a second polarization waveguide 123 and a second beam splitting waveguide 124. The second polarization waveguide 123 is connected to the second waveguide 106, and the second beam splitting waveguide 124 is connected to the second polarization waveguide 123. The second beam splitting waveguide 124 is provided with second light guiding grooves at two ends away from the second polarization waveguide 123, and light absorbing materials are provided in the second light guiding grooves.
[0076] In some optional embodiments, the polarization beam splitter 118 includes a third polarization beam splitter 125, and the third polarization beam splitter 125 includes a third polarization waveguide 126 and a third beam splitting waveguide 127. The third polarization waveguide 126 is connected to the third waveguide 107, and the third beam splitting waveguide 127 is connected to the third polarization waveguide 126. The third beam splitting waveguide 127 is provided with third light guiding grooves at two ends away from the third polarization waveguide 126, and light absorbing materials are provided in the third light guiding grooves.
[0077] In some embodiments of the present application, there are multiple first beam splitting waveguides 121, and the multiple first beam splitting waveguides 121 are respectively connected to the first polarization waveguide 120. Multiple first beam splitting waveguides 121 can process multiple light beams at the same time, and each first beam splitting waveguide 121 can independently transmit and process stray light, thereby improving the absorption efficiency of stray light. Since the optical signal is transmitted in multiple first beam splitting waveguides 121, even if a waveguide is disturbed or damaged, the optical signals on other waveguides can still remain intact and stable, thereby reducing the risk of system collapse due to single point failure. Arranging multiple first beam splitting waveguides 121 along the first direction X can reasonably utilize the space on the substrate 101 and improve space utilization.
[0078] In some optional embodiments, there are multiple second beam splitting waveguides 124, and the multiple second beam splitting waveguides 124 are respectively connected to the second polarization waveguide 123. In some optional embodiments, there are multiple third beam splitting waveguides 127, and the multiple third beam splitting waveguides 127 are respectively connected to the third polarization waveguide 126.
[0079] In some embodiments of the present application, the optical integrated chip 10 further includes a light source chip 30, and the light source chip 30 is connected to the light source waveguide 104. The light source chip 30 is connected to the light source waveguide 104 to provide a stable light source for the entire optical system.
[0080] like Figure 1 as well as Figure 4 As shown, the embodiment of the present application also provides an optical gyroscope 1, including an optical integrated chip 10, a detection element 20 and an interference module 40. The detection element 20 is connected to the detection waveguide 103. The interference module 40 includes a first interference module 401, a second interference module 402 and a third interference module 403. The first interference module 401 is connected to the first waveguide 105, the second interference module 402 is connected to the second waveguide 106, and the third interference module 403 is connected to the third waveguide 107.
[0081] In the optical integrated chip 10, the first coupler 102 and the detection waveguide 103 are integrated and chip-processed, which reduces the overall volume and weight of the optical gyroscope 1, improves the connection stability between the modules, and thus improves the accuracy of the measurement results of the gyroscope. The interference module 40 includes a first interference module 401, a second interference module 402 and a third interference module 403, which are respectively connected to different waveguides to measure the rotational angular velocity of the gyroscope through the interference effect. Therefore, it can measure the angular velocity in three directions and realize accurate angular velocity measurement in three-dimensional space. The detection element 20 is connected to the detection waveguide 103, for receiving and converting the interference signal into an electrical signal, and then performing data processing and analysis.
[0082] In the above structure, the first coupler 102 divides the incident light into three light beams, which enter the first waveguide 105, the second waveguide 106 and the third waveguide 107 respectively. The first of the three light beams enters the first interference module 401 through the first waveguide 105, the second light beam enters the second interference module 402 through the second waveguide 106, and the third light beam enters the third interference module 403 through the third waveguide 107. The three light beams interfere in the three interference modules 40 respectively and transmit the signals to the detection element 20 through the fourth waveguide 108, the fifth waveguide 109 and the sixth waveguide 110, thereby realizing the angular velocity measurement of the carrier. In summary, the structure of the optical gyroscope 1 has the characteristics of high integration, high-precision measurement, multi-module collaborative operation, scalability and flexibility, high stability and reliability.
[0083] In some embodiments of the present application, the first interference module 401 includes a first phase modulator 404 and a first interference ring 405. The first phase modulator 404 is connected to the first waveguide 105, and the first interference ring 405 is connected to the first phase modulator 404.
[0084] Specifically, the optical gyroscope 1 includes an optical integrated chip 10, a detection element 20 and an interference module 40. The detection element 20 is connected to the detection waveguide 103. The interference module 40 includes a first interference module 401, a second interference module 402 and a third interference module 403. The first interference module 401 is connected to the first waveguide 105, the second interference module 402 is connected to the second waveguide 106, and the third interference module 403 is connected to the third waveguide 107. The optical integrated chip 10 includes a first coupler 102 and a detection unit. The detection element 20 is arranged on one side of the optical integrated chip 10 along the second direction Y.
[0085] In the above structure, the first phase modulator 404 is used to change the phase of the light in the waveguide, and it changes the phase of the light wave passing through the waveguide by applying external stimuli such as voltage, current or temperature. The first phase modulator 404 is connected to the first waveguide 105, and the optical signal is transmitted through the first waveguide 105 into the phase modulator for phase modulation, in preparation for subsequent interference modulation to improve the test accuracy. The first interference ring 405 includes any one of an optical fiber ring or a waveguide ring. The two beams of light signals are circulated and transmitted in the first interference ring 405, and interfere with each other. The interference signal is transmitted to the detection element 20 to obtain the angular velocity of the carrier in a certain direction.
[0086] In some embodiments of the present application, the first phase modulator 404 includes at least one of a piezoelectric phase modulator 406 or a lithium niobate phase modulator. Figure 4 The first phase modulator 404 in is a lithium niobate phase modulator.
[0087] The piezoelectric phase modulator 406 refers to a piezoelectric material disposed on the side of the waveguide away from the substrate 101. The piezoelectric material is deformed by the electric field, thereby applying pressure to the waveguide. The waveguide structure is deformed to change the refractive index, thereby changing the phase of the light in the waveguide. The lithium niobate phase modulator refers to a lithium niobate material disposed on the side of the waveguide away from the substrate 101. The lithium niobate material changes the refractive index under the action of an external electric field, thereby changing the phase of the light. The first phase modulator 404 includes at least one of the piezoelectric phase modulator 406 or the lithium niobate phase modulator, which can improve the accuracy of the optical gyroscope 1, reduce energy consumption, and improve reliability and flexibility, thereby improving the measurement efficiency and accuracy of the optical gyroscope 1.
[0088] In some embodiments of the present application, the fourth waveguide 108 includes a first sub-waveguide 128 extending along the second direction Y and a second sub-waveguide 129 extending along the first direction X, the fifth waveguide 109 includes a third sub-waveguide 130 extending along the first direction X, a fourth sub-waveguide 131 extending along the second direction Y, and a fifth sub-waveguide 132 extending along the first direction X, and the sixth waveguide 110 extends along the second direction Y. The detection element 20 is disposed on one side of the optical integrated chip 10 along the first direction X, and the detection element 20 includes a first detector 201 connected to the second sub-waveguide 129, a second detector 202 connected to the fifth sub-waveguide 132, and a third detector 203 connected to the sixth waveguide 110.
[0089] Exemplarily, the first detector 201 , the second detector 202 and the third detector 203 are sequentially arranged at intervals along the second direction Y. The first detector 201 is arranged close to the light source chip 30 , and the third detector 203 is arranged close to the interference module 40 .
[0090] In the above structure, one end of the fourth waveguide 108 is connected to the first waveguide 105, and is arranged along the space between the first waveguide 105 and the first detector 201, so as to connect the first waveguide 105 with the first detector 201, and transmit the optical signal in the first interference ring 405 to the first detector 201. One end of the fifth waveguide 109 is connected to the second waveguide 106, and is arranged along the space between the second waveguide 106 and the second detector 202. By setting three sub-waveguides to bend and extend along the internal free space, the free space of the substrate 101 is fully utilized, and the optical signal in the second interference ring is transmitted to the second detector 202. One end of the sixth waveguide 110 is connected to the third waveguide 107, and is directly connected to the third detector 203 nearby, so as to transmit the optical signal in the third interference ring to the third detector 203. In the above structure, the detection unit is arranged on one side of the optical integrated chip 10 along the second direction Y, so as to fully utilize the space around the optical integrated chip 10, and facilitate the connection between the detection element 20 and the detection waveguide 103.
[0091] like Figure 5 As shown, in some optional embodiments, the optical gyroscope 1 includes an optical integrated chip 10, a detection element 20 and an interference module 40. The detection element 20 is connected to the detection waveguide 103. The interference module 40 includes a first interference module 401, a second interference module 402 and a third interference module 403. The first interference module 401 is connected to the first waveguide 105, the second interference module 402 is connected to the second waveguide 106, and the third interference module 403 is connected to the third waveguide 107.
[0092] The optical integrated chip 10 includes a substrate 101 and an optical waveguide device layer 140, and the optical waveguide device layer 140 is disposed on the substrate 101. The optical waveguide device layer 140 includes a first coupler 102, a polarization beam splitter 118, and a detection waveguide 103. The detection waveguide 103 includes a fourth waveguide 108 connected to the first waveguide 105, a fifth waveguide 109 connected to the second waveguide 106, and a sixth waveguide 110 connected to the third waveguide 107. The first waveguide 105, the second waveguide 106, and the third waveguide 107 are arranged at intervals along a first direction X, and the light source waveguide 104 is arranged on one side of the first waveguide 105, the second waveguide 106, and the third waveguide 107 along a second direction Y, and the first direction X intersects with the second direction Y.
[0093] The fourth waveguide 108 includes a first sub-waveguide 128 extending along the second direction Y and a second sub-waveguide 129 extending along the first direction X, the fifth waveguide 109 includes a third sub-waveguide 130 extending along the first direction X, a fourth sub-waveguide 131 extending along the second direction Y and a fifth sub-waveguide 132 extending along the first direction X, and the sixth waveguide 110 extends along the second direction Y. The detection element 20 is arranged on one side of the optical integrated chip 10 along the first direction X, and the detection element 20 includes a first detector 201 connected to the second sub-waveguide 129, a second detector 202 connected to the fifth sub-waveguide 132 and a third detector 203 connected to the sixth waveguide 110. The first detector 201, the second detector 202 and the third detector 203 are arranged in sequence along the second direction Y. The first detector 201 is arranged close to the light source chip 30, and the third detector 203 is arranged close to the interference module 40. The materials of the first waveguide 105, the second waveguide 106, the third waveguide 107, the fourth waveguide 108, the fifth waveguide 109, the sixth waveguide 110, the seventh waveguide 112 and the eighth waveguide 113 all include silicon nitride. The interference module 40 includes a first interference module, a second interference module and a third interference module. The first interference module is connected to the first waveguide 105, the second interference module is connected to the second waveguide 106, and the third interference module is connected to the third waveguide 107. Exemplarily, the first interference module 401 includes a lithium niobate phase modulator and an optical fiber ring.
[0094] like Figure 6As shown, in some embodiments of the present application, the fourth waveguide 108 includes a first sub-waveguide 133 extending along the first direction X and a second sub-waveguide 134 extending along the second direction Y, the fifth waveguide 109 includes a third sub-waveguide 135 extending along the first direction X and a fourth sub-waveguide 136 extending along the second direction Y, and the sixth waveguide 110 includes a fifth sub-waveguide 137 extending along the first direction X and a sixth sub-waveguide 138 extending along the second direction Y. The detection element 20 is disposed on one side of the optical integrated chip 10 along the second direction Y, and the detection element 20 includes a first detector 201 connected to the second sub-waveguide 134, a second detector 202 connected to the fourth sub-waveguide 136, and a third detector 203 connected to the sixth sub-waveguide 138.
[0095] In the above structure, the detection unit is arranged on one side of the optical integrated chip 10 along the second direction Y, and the detection element 20 and the interference module 40 are arranged on the same side, which reduces welding on other sides, improves the degree of integration and reduces the occupied space.
[0096] like Figure 3 as well as Figure 7 As shown, in some optional embodiments, the optical gyroscope 1 includes an optical integrated chip 10, a detection element 20 and an interference module 40. The detection element 20 is connected to the detection waveguide 103. The interference module 40 includes a first interference module 401, a second interference module 402 and a third interference module 403. The first interference module 401 is connected to the first waveguide 105, the second interference module 402 is connected to the second waveguide 106, and the third interference module 403 is connected to the third waveguide 107.
[0097] The optical integrated chip 10 includes a substrate 101 and an optical waveguide device layer 140, and the optical waveguide device layer 140 is disposed on the substrate 101. The optical waveguide device layer 140 includes a first coupler 102, a polarization beam splitter 118, and a detection waveguide 103. The detection waveguide 103 includes a fourth waveguide 108 connected to the first waveguide 105, a fifth waveguide 109 connected to the second waveguide 106, and a sixth waveguide 110 connected to the third waveguide 107. The first waveguide 105, the second waveguide 106, and the third waveguide 107 are arranged at intervals along a first direction X, and the light source waveguide 104 is arranged on one side of the first waveguide 105, the second waveguide 106, and the third waveguide 107 along a second direction Y, and the first direction X intersects with the second direction Y. The fourth waveguide 108 includes a first sub-waveguide 128 extending along the second direction Y and a second sub-waveguide 129 extending along the first direction X, the fifth waveguide 109 includes a third sub-waveguide 130 extending along the first direction X, a fourth sub-waveguide 131 extending along the second direction Y and a fifth sub-waveguide 132 extending along the first direction X, and the sixth waveguide 110 extends along the second direction Y. The detection element 20 is arranged on one side of the optical integrated chip 10 along the first direction X, and the detection element 20 includes a first detector 201 connected to the second sub-waveguide 129, a second detector 202 connected to the fifth sub-waveguide 132 and a third detector 203 connected to the sixth waveguide 110. The first detector 201, the second detector 202 and the third detector 203 are arranged in sequence along the second direction Y. The first detector 201 is arranged close to the light source chip 30, and the third detector 203 is arranged close to the interference module 40. The materials of the first waveguide 105, the second waveguide 106, the third waveguide 107, the fourth waveguide 108, the fifth waveguide 109, the sixth waveguide 110, the seventh waveguide 112 and the eighth waveguide 113 all include silicon nitride. The interference module 40 includes a first interference module 401, a second interference module 402 and a third interference module 403. The first interference module 401 is connected to the first waveguide 105, the second interference module 402 is connected to the second waveguide 106, and the third interference module 403 is connected to the third waveguide 107. Exemplarily, the first interference module 401 includes a piezoelectric phase modulator and an optical fiber ring.
[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.
Claims
1. An optical integrated chip, characterized in that: For an optical gyroscope, the optical integrated chip comprises: substrate; an optical waveguide device layer, arranged on the substrate, the optical waveguide device layer comprising a first coupler and a detection waveguide, the first coupler comprising a light source waveguide and a first waveguide, a second waveguide and a third waveguide connected to the light source waveguide, the light source waveguide being used to connect a light source, the first waveguide being used to connect a first interference module, the second waveguide being used to connect a second interference module, the third waveguide being used to connect a third interference module, the detection waveguide being used to connect a detection element, the detection waveguide comprising a fourth waveguide connected to the first waveguide, a fifth waveguide connected to the second waveguide and a sixth waveguide connected to the third waveguide, The first waveguide, the second waveguide and the third waveguide are arranged at intervals along a first direction, the light source waveguide is arranged on one side of the first waveguide, the second waveguide and the third waveguide along a second direction, and the first direction intersects with the second direction.
2. The optical integrated chip according to claim 1, characterized in that: The optical waveguide device layer includes an optical waveguide layer and a first dielectric layer. The first dielectric layer is disposed on the substrate. The optical waveguide layer is disposed on a side of the first dielectric layer away from the substrate. The refractive index of the optical waveguide layer is greater than that of the first dielectric layer.
3. The optical integrated chip according to claim 2, characterized in that: The material of the optical waveguide layer includes silicon nitride, and the material of the first dielectric layer includes silicon dioxide.
4. The optical integrated chip according to claim 1, characterized in that: The optical waveguide device layer further includes a second coupler, which includes a first device connected to the first waveguide, a second device connected to the second waveguide, and a third device connected to the third waveguide, wherein the first device, the second device, and the third device are spaced apart along the first direction.
5. The optical integrated chip according to any one of claims 1 to 4, characterized in that: The optical waveguide device layer further includes a polarization beam splitter, which is connected to the first coupler and is used to convert light into TE polarized light.
6. The optical integrated chip according to claim 5, characterized in that: The polarization beam splitter includes a first polarization beam splitter, a second polarization beam splitter and a third polarization beam splitter, The first polarization beam splitter is connected to the first waveguide, the second polarization beam splitter is connected to the second waveguide, and the third polarization beam splitter is connected to the third waveguide.
7. The optical integrated chip according to claim 6, characterized in that: The optical waveguide device layer also includes a first light guide groove connected to the first polarization beam splitter, a second light guide groove connected to the second polarization beam splitter, and a third light guide groove connected to the third polarization beam splitter, and the first light guide groove, the second light guide groove and the third light guide groove are used to absorb the TM polarized light separated from the polarization beam splitter.
8. The optical integrated chip according to claim 1, characterized in that: The optical integrated chip further comprises a light source chip, and the light source chip is connected to the light source waveguide.
9. An optical gyroscope, characterized in that: include: The optical integrated chip according to any one of claims 1 to 8; A detection element connected to the detection waveguide; The interference module includes a first interference module, a second interference module and a third interference module, wherein the first interference module is connected to the first waveguide, the second interference module is connected to the second waveguide, and the third interference module is connected to the third waveguide.
10. The optical gyroscope according to claim 9, characterized in that: The first interference module comprises: a first phase modulator connected to the first waveguide; The first interference ring is connected to the first phase modulator.
11. The optical gyroscope according to claim 10, characterized in that: The first phase modulator includes at least one of a piezoelectric phase modulator or a lithium niobate phase modulator.
12. The optical gyroscope according to any one of claims 9 to 11, characterized in that: The fourth waveguide includes a first sub-waveguide extending along the second direction and a second sub-waveguide extending along the first direction, the fifth waveguide includes a third sub-waveguide extending along the first direction, a fourth sub-waveguide extending along the second direction and a fifth sub-waveguide extending along the first direction, and the sixth waveguide extends along the first direction. The detection element is arranged at one side of the optical integrated chip along the first direction, and includes a first detector connected to the second sub-waveguide, a second detector connected to the fifth sub-waveguide, and a third detector connected to the sixth waveguide.
13. The optical gyroscope according to any one of claims 9 to 11, characterized in that: The fourth waveguide includes a first sub-waveguide extending along the first direction and a second sub-waveguide extending along the second direction, the fifth waveguide includes a third sub-waveguide extending along the first direction and a fourth sub-waveguide extending along the second direction, and the sixth waveguide includes a fifth sub-waveguide extending along the first direction and a sixth sub-waveguide extending along the second direction. The detection element is arranged at one side of the optical integrated chip along the second direction, and includes a fourth detector connected to the second branch waveguide, a fifth detector connected to the fourth branch waveguide, and a sixth detector connected to the sixth waveguide.
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Integrated optical chip, preparation method and optical gyroscope
CN119687885A
