Manufacturing method of FC-BGA substrate

Abstract

The invention belongs to the technical field of packaging substrates, and particularly relates to a manufacturing method of an FC-BGA substrate. The manufacturing method of the FC-BGA substrate comprises the following steps that a first ABF film is obtained, and first isolating films are attached to the surfaces of the two sides of the first ABF film; stripping the first isolating membrane on one side of the first ABF membrane; the first ABF film is attached to the core plate; a first ABF film is subjected to hot pressing, excessive glue appears on the first ABF film, and a first glue edge is formed on the core plate; a plurality of ablation holes are formed in the ablation area of the first rubber edge through laser machining, and the adjacent ablation holes are overlapped so that the ablation area of the first rubber edge can be removed. The plurality of overlapped ablation holes are processed by laser, so that the ablation area on the first adhesive edge is completely ablated, and the surface of the first ABF film is flat; the situation that in the prior art, when the first adhesive edge is higher than the surface of the first ABF film, the first adhesive edge is abraded and broken in the follow-up machining process of the base plate, the broken position enters liquid medicine when the base plate is electroplated, and consequently the base plate is exploded in the baking process is avoided, and the yield of the base plate is increased.

Description

Technical Field

[0001] The invention belongs to the technical field of packaging substrates, and in particular relates to a method for manufacturing an FC-BGA substrate. Background Art

[0002] FC-BGA substrate (Flip Chip Ball Grid Array) is a flip chip ball grid array substrate, which is used for chip protection and circuit board used to provide an interface between the chip and the external circuit.

[0003] FC-BGA substrates usually include core boards and multi-layer ABF films. ABF film (dry film) is an interlayer insulating material used for FC-BGA substrate packaging. Its surface is more susceptible to laser processing and direct copper plating to form circuits. Before making the substrate, PET film is attached to both sides of the ABF film. When making the substrate, the PET film on one side of the ABF film is peeled off and the ABF film is attached to the core board; then, the ABF film is flattened under high temperature and high pressure conditions; finally, laser drilling and copper plating are performed on the ABF film to process the vias and blind holes between the substrate layers.

[0004] However, due to the design of the ABF film, in the initial state, one side of the PET film protrudes from the ABF film, and the other side of the PET film is flush with the ABF film. When the ABF is flattened, under high temperature and high pressure conditions, the adhesive in the ABF film flows outward, resulting in adhesive overflow on the side where the ABF film is flush with the PET film in the initial state, forming an adhesive edge. The height of the adhesive edge is usually higher than the ABF film where it is located. The adhesive edge is prone to friction and cracking during subsequent processing of the substrate, and the cracked position will be filled with chemicals during the electroplating of the substrate, resulting in the substrate being prone to explosion after baking, reducing the substrate's yield rate. Summary of the invention

[0005] The technical problem to be solved by the present invention is that, for the existing FC-BGA substrate, when ABF is flattened, glue overflow occurs on the side where the ABF film is flush with the PET film in the initial state to form a glue edge, and the glue edge is easily broken by friction during subsequent processing of the substrate, thereby reducing the yield rate of the substrate. A method for manufacturing an FC-BGA substrate is provided.

[0006] In order to solve the above technical problems, an embodiment of the present invention provides a method for manufacturing an FC-BGA substrate, comprising the following steps:

[0007] Obtaining a first ABF film, wherein first isolation films are attached to both sides of the first ABF film;

[0008] peeling off the first isolation film on one side of the first ABF film;

[0009] attaching the first ABF film to the core plate;

[0010] Hot pressing the first ABF film, so that the first ABF film has glue overflow and forms a first glue edge on the core plate;

[0011] A plurality of ablation holes are laser processed in the ablation region of the first glue edge, and adjacent ablation holes overlap, so as to remove the ablation region of the first glue edge.

[0012] Optionally, the laser processing a plurality of ablation holes in the ablation area of ​​the first glue edge, wherein adjacent ablation holes overlap, so as to remove the ablation area of ​​the first glue edge, comprises:

[0013] A plurality of ablation holes distributed in rows are processed along the first glue edge, and adjacent ablation holes in the same row overlap.

[0014] Optionally, a plurality of rows of ablation holes are processed on the first glue edge, and two adjacent rows of ablation holes overlap.

[0015] Optionally, the hole center distance between adjacent ablation holes is A, the sum of the hole diameters of two adjacent ablation holes is B, and B / 3<A≤B / 2.

[0016] Optionally, the core plate is rectangular, and the first ABF film and the first isolation film are rectangular;

[0017] During hot pressing of the first ABF film, before the first ABF film overflows and forms a first glue edge on the core board, one side of the first isolation film in the width direction is flush with one side of the first ABF film in the width direction, and the other side of the first isolation film in the width direction exceeds the other side of the first ABF film in the width direction;

[0018] The laser processing of a plurality of ablation holes in the ablation area of ​​the first glue edge, wherein adjacent ablation holes overlap, so as to remove the ablation area of ​​the first glue edge, comprises:

[0019] Ablation holes are laser processed on a portion of the first glue edge extending along the length direction of the first ABF film, and adjacent ablation holes overlap, so as to remove the corresponding first glue edge.

[0020] Optionally, before attaching the first ABF film to the core board, the method further includes:

[0021] A positioning through hole is processed on the core plate, and the positioning through hole positions the core plate on the processing position of the laser drilling machine.

[0022] Optionally, after the first ABF film is hot-pressed and the first ABF film overflows and forms a first glue edge on the core board, the method further includes:

[0023] The laser drilling machine is used to laser drill a first connecting hole on the first ABF film.

[0024] Optionally, after laser processing a plurality of ablation holes in the ablation region of the first glue edge, wherein adjacent ablation holes overlap, to remove the ablation region of the first glue edge, the method further comprises:

[0025] peeling off the first isolation film on the side of the first ABF film facing away from the core plate;

[0026] Obtaining a second ABF film, wherein second isolation films are attached to both sides of the second ABF film;

[0027] peeling off the second isolation film on one side of the second ABF film;

[0028] Attaching the second ABF film to a surface of the first ABF film that is opposite to the core plate;

[0029] The second ABF film is hot pressed, and the second ABF film has glue overflow to form a second glue edge;

[0030] The ablation holes are laser processed in the ablation region of the second glue edge, and adjacent ablation holes overlap, so as to remove the ablation region of the second glue edge.

[0031] Optionally, the second ABF film and the second isolation film are rectangular;

[0032] During hot pressing of the second ABF film, before the second ABF film overflows with glue to form a second glue edge, one side of the second isolation film in the width direction is flush with one side of the second ABF film in the width direction, and the other side of the second isolation film in the width direction exceeds the other side of the second ABF film in the width direction;

[0033] The laser processing of the ablation holes in the ablation area of ​​the second glue edge, wherein adjacent ablation holes overlap, so as to remove the ablation area of ​​the second glue edge, comprises:

[0034] A laser ablation hole is processed on a portion of the second glue edge extending along the length direction of the second ABF film, and adjacent ablation holes overlap, so as to remove the corresponding second glue edge.

[0035] Optionally, after the second ABF film is hot-pressed and glue overflow occurs on the second ABF film to form a second glue edge, the method further includes:

[0036] A second connecting hole is laser drilled on a side of the second ABF film facing away from the first ABF film.

[0037] In the manufacturing method of the FC-BGA substrate of the present invention, a plurality of ablation holes are laser-drilled in the ablation area of ​​the first glue edge formed by the overflow of glue during the hot pressing of the first ABF film, and the plurality of ablation holes overlap each other to ablate the ablation area on the first glue edge cleanly, so that the surface of the first ABF film is flat, and the situation in the prior art that the first glue edge is higher than the surface of the first ABF film, the first glue edge is worn and broken in the subsequent processing of the substrate, and the broken position enters the liquid during the electroplating of the substrate, resulting in the explosion of the substrate during baking, is avoided, and the yield rate of the substrate is improved. Moreover, when the FC-BGA substrate is provided with multiple layers of ABF films, the first ABF film with a flat surface is conducive to the subsequent ABF film to be firmly attached to the first ABF film, reducing the possibility of the ABF film falling off and increasing the number of layers that can be pressed on the FC-BGA substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is a flow chart of a method for manufacturing an FC-BGA substrate provided by one embodiment of the present invention;

[0039] Figure 2 yes Figure 1 A cross-sectional view of the FC-BGA substrate in step S3;

[0040] Figure 3 yes Figure 2 Cross-sectional view of the FC-BGA substrate during laser drilling;

[0041] Figure 4 yes Figure 1 A schematic diagram of the FC-BGA substrate in the process of forming the first glue edge;

[0042] Figure 5 yes Figure 4 Schematic diagram of drilling ablation holes on the first glue edge;

[0043] Figure 6 yes Figure 4 A schematic diagram of the relative position of the first glue edge and the core board;

[0044] Figure 7 yes Figure 1 Schematic diagram of the FC-BGA substrate when the second glue edge is formed.

[0045] The reference numerals in the specification are as follows:

[0046] 1. Core board; 2. First ABF film; 21. First connecting hole; 22. First glue edge; 23. Ablation hole; 3. First isolation film; 4. Second ABF film; 41. Second glue edge; 5. Second isolation film. DETAILED DESCRIPTION

[0047] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0048] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a method for manufacturing an FC-BGA substrate, comprising the following steps:

[0049] S1: obtaining a first ABF film 2, with first isolation films 3 attached to both sides of the first ABF film 2;

[0050] S2: peeling off the first isolation film 3 on one side of the first ABF film 2;

[0051] S3: Figure 2 As shown, the first ABF film 2 is attached to the core board 1;

[0052] S4: Figure 3 As shown, the first ABF film 2 is hot pressed, and glue overflow occurs at the edge of the first ABF film 2 and forms a first glue edge 22 on the core board 1;

[0053] S5: Figure 4 As shown, a plurality of ablation holes 23 are laser processed in the ablation region of the first glue edge 22 , and adjacent ablation holes 23 overlap, so as to remove the ablation region of the first glue edge 22 .

[0054] ABF film is an interlayer insulating material used for FC-BGA substrate packaging. Its surface is more susceptible to laser processing and direct copper plating to form circuits. ABF film has bonding ability, so in the initial state, isolation films are attached to both sides of the ABF film. The isolation film is preferably a PET film.

[0055] In the initial state, the first isolation film 3 covers the first ABF film 2. Due to the design of the first ABF film 2, one side of the first isolation film 3 exceeds the first ABF film 2, and the other side of the first isolation film 3 is flush with the first ABF film 2. In step S4, since the first ABF film 2 needs to be hot-pressed after being attached to the core board 1, the adhesive in the first ABF film 2 flows outward under high temperature and high pressure conditions, and the side of the first isolation film 3 that exceeds the first ABF film 2 may still be able to cover the first ABF film 2. However, in the initial state, the side of the first ABF film 2 that is flush with the first isolation film 3 will overflow due to the flow of the adhesive, and a first adhesive edge 22 will be formed after solidification.

[0056] The height of the first glue edge 22 is usually higher than the first ABF film 2 where it is located. The first glue edge 22 is easily broken by the friction of the rollers on the subsequent production line during subsequent processing of the substrate. The broken position will be infiltrated by chemicals during electroplating of the substrate, causing the FC-BGA substrate to easily explode after baking, thereby reducing the yield rate of the substrate.

[0057] Therefore, in step S5, a plurality of ablation holes 23 are processed in the ablation area of ​​the first glue edge 22 by laser, and the plurality of ablation holes 23 overlap with each other, so that the ablation area on the first glue edge 22 is ablated cleanly, so that the surface of the first ABF film 2 is smooth, thereby avoiding the situation in the prior art that when the first glue edge 22 is higher than the surface of the first ABF film 2, the first glue edge 22 is worn and broken during subsequent processing of the substrate, and the broken position enters the solution during electroplating of the substrate, causing the substrate to explode during baking, thereby improving the yield rate of the substrate.

[0058] Moreover, when the FC-BGA substrate is provided with multiple layers of ABF films, the first ABF film 2 with a flat surface is conducive to the subsequent ABF films being firmly attached to the first ABF film 2, reducing the ABF film from falling off and increasing the number of layers that can be pressed on the FC-BGA substrate.

[0059] like Figure 4 As shown, the laser processing mode of the ablation hole 23 is a jump mode. The jump mode means that the laser beam of the laser drilling machine is concentrated on a point, and the energy of the laser beam will melt the point to drill the ablation hole 23 on the first glue edge 22. After that, the FC-BGA substrate and the laser beam are moved along the Figure 4 There is a relative movement in the direction indicated by the middle arrow, so that the laser beam jumps to another point on the first glue edge 22 for drilling.

[0060] In the manufacturing method of the FC-BGA substrate of the present invention, a plurality of ablation holes 23 are laser-drilled in the ablation area of ​​the first glue edge 22 formed by the overflow of glue during the hot pressing of the first ABF film 2, and the plurality of ablation holes 23 overlap each other to ablate the ablation area on the first glue edge 22 cleanly, so that the surface of the first ABF film 2 is flat, and the situation in the prior art that the first glue edge 22 is worn and broken in the subsequent processing of the substrate when the first glue edge 22 is higher than the surface of the first ABF film 2, and the broken position enters the liquid during the electroplating of the substrate, resulting in the substrate bursting during baking, is avoided, and the substrate yield is improved. Moreover, when the FC-BGA substrate is provided with multiple layers of ABF films, the first ABF film 2 with a flat surface is conducive to the subsequent ABF film firmly attached to the first ABF film 2, reducing the possibility of the ABF film falling off, and increasing the number of layers that can be pressed on the FC-BGA substrate.

[0061] In one embodiment, in step S5 , a plurality of ablation holes 23 distributed in rows are processed along the first glue edge 22 , and adjacent ablation holes 23 in the same row overlap.

[0062] The multiple ablation holes 23 are distributed in rows, and the position distribution of the ablation holes 23 is relatively regular, which is conducive to the laser drilling machine jumping to the position when processing each ablation hole 23, improving the position accuracy of each ablation hole 23, and thus better ablating the ablation area on the first glue edge 22.

[0063] In one embodiment, a plurality of rows of ablation holes 23 are processed on the first adhesive edge 22 , and the ablation holes 23 in two adjacent rows overlap.

[0064] For the first adhesive edge 22 of the same width, when multiple rows of ablation holes 23 are used, ablation holes 23 with a smaller aperture can be designed, so that a laser beam with a smaller energy can be used to process the ablation holes 23. The number of ablation holes 23 is larger and the distribution is more dense, which is conducive to accurately ablating the first adhesive edge 22. Moreover, for the ablation holes 23 with the same aperture, multiple rows of ablation holes 23 can process a first adhesive edge 22 with a larger width.

[0065] In one embodiment, the hole center distance between adjacent ablation holes 23 is A, the sum of the hole diameters of two adjacent ablation holes 23 is B, and B / 3<A≤B / 2.

[0066] In one embodiment, the ablation hole 23 has a hole diameter of 160 μm, and with a hole center spacing of 110 μm, the ablation hole 23 is designed to have a hole diameter of 50-200 μm.

[0067] In one embodiment, the energy of the laser for processing the ablation hole 23 is 2.8 mj, and the number of shots is 3.

[0068] In one embodiment, a CO2 laser is used to drill the holes.

[0069] In one embodiment, if Figure 6 As shown, the core plate 1 is rectangular, and the first ABF film 2 and the first isolation film 3 are rectangular.

[0070] Before step S4 , one side of the first isolation film 3 in the width direction is flush with one side of the first ABF film 2 in the width direction, and the other side of the first isolation film 3 in the width direction exceeds the other side of the first ABF film 2 in the width direction.

[0071] In step S5, laser processing ablation holes 23 are formed on the portion of the first glue edge 22 extending along the length direction of the first ABF film 2, and adjacent ablation holes 23 overlap, so that the glue edge formed on the long side edge of the first ABF film 2 is completely ablated, and as for the glue edge that may exist on the short side edge of the first ABF film 2, since the glue edge on the short side edge has little effect on the effective graphic area of ​​the product, only the glue edge at the long side position of the first ABF film 2 is ablated to improve the production capacity of the product. Ideally, all the glue edges existing around the first ABF film 2 should be ablated by laser processing ablation holes 23.

[0072] In one embodiment, a single ablation region along the length direction of the first ABF film 2 is 5.5 mm wide and 603 mm long, and multiple rows of ablation holes 23 are processed in the ablation region. Figure 6 Only one row of ablation holes 23 is shown.

[0073] In one embodiment, the ablation region is located in the middle of the core plate 1 in the length direction.

[0074] In one embodiment, before step S3, step S6 is also included: machining a positioning through hole on the core board 1, and positioning the core board 1 on the processing position of the laser drilling machine through the positioning through hole. Specifically, a corresponding positioning piece is provided on the processing position of the laser drilling machine, and when the core board 1 is placed on the processing position, the positioning piece is installed in the positioning through hole.

[0075] In one embodiment, after step S6, step S7 is also included: using a laser drilling machine to laser drill a connecting hole on the first ABF film 2. In the conventional FC-BGA substrate manufacturing process, it is necessary to process the first connecting hole 21 for connecting the layers on the first ABF film 2, and copper is plated inside the first connecting hole 21 so that the first connecting hole 21 has a conductive function. Copper can also be directly plated on the surface of the first ABF film 2 to form a circuit. The process of drilling the first connecting hole 21 on the first ABF film 2 and the process of drilling the ablation hole 23 on the first adhesive edge 22 are both processed by a laser drilling machine, so that they can be processed in the same process, improving the processing efficiency.

[0076] In one embodiment, after step S5, the method further includes:

[0077] S8: peeling off the first isolation film 3 on the side of the first ABF film 2 facing away from the core board 1;

[0078] S9: obtaining a second ABF film 4, with second isolation films 5 attached to both sides of the second ABF film 4;

[0079] S10: peeling off the second isolation film 5 on one side of the second ABF film 4;

[0080] S11: Figure 7 As shown, the second ABF film 4 is attached to the surface of the first ABF film 2 facing away from the core board 1;

[0081] S12: hot pressing the second ABF film 4, the second ABF film 4 has overflow glue to form a second glue edge 41;

[0082] S13 : laser processing ablation holes 23 in the ablation area of ​​the second glue edge 41 , with adjacent ablation holes 23 overlapping, so as to remove the ablation area of ​​the second glue edge 41 .

[0083] The multiple ablation holes 23 processed on the first adhesive edge 22 make the surface and edge of the first ABF film 2 smooth. After the second ABF film 4 is attached to the smooth surface of the first ABF film 2 , the second ABF film 4 has better adhesion.

[0084] When the second ABF film 4 is hot-pressed, the second ABF film 4, like the first ABF film 2, has overflowing glue to form a second glue edge 41. In order to prevent the existence of the second glue edge 41 from causing the surface of the second ABF film 4 to be uneven and affecting the subsequent mounting of the ABF film, similar to the processing method of the first glue edge 22, a plurality of ablation holes 23 are laser-processed in the ablation area of ​​the second glue edge 41 to ablate the ablation area on the second glue edge 41 cleanly, so that the surface and edge of the second glue edge 41 are clean and flat.

[0085] When multiple layers of ABF films are arranged in the FC-BGA substrate, laser processing ablation holes 23 can be used to clean the glue edges of all ABF films to increase the number of layers that can be pressed together in the FC-BGA substrate. At this time, the first ABF film 2 and the second ABF film 4 are defined according to the relative positions of any two adjacent ABF films. The first ABF film 2 refers to the one of any two adjacent ABF films that is closer to the core board 1, and the second ABF film 4 refers to the one that is farther away from the core board 1 relative to the first ABF film 2.

[0086] In one embodiment, the second ABF film 4 and the second isolation film 5 are rectangular.

[0087] Before step S12 , one side of the second isolation film 5 in the width direction is flush with one side of the second ABF film 4 , and the other side of the second isolation film 5 in the width direction exceeds the other side of the second ABF film 4 .

[0088] In step S13, laser processing ablation holes 23 are formed on the portion of the second glue edge 41 extending along the length direction of the second ABF film 4, and adjacent ablation holes 23 overlap, so that the glue edge formed on the long side edge of the second ABF film 4 is completely ablated, and as for the glue edge that may exist on the short side edge of the second ABF film 4, since the glue edge on the short side edge has little effect on the effective graphic area of ​​the product, only the glue edge at the long side position of the second ABF film 4 is ablated to improve the production capacity of the product. Ideally, all the glue edges existing around the second ABF film 4 should be ablated by laser processing ablation holes 23.

[0089] In one embodiment, after step S12 , step S14 is further included: laser drilling a second connecting hole on a side of the second ABF film 4 facing away from the first ABF film 2 .

[0090] In other embodiments, the plurality of ablation holes 23 on the first adhesive edge 22 may be irregularly distributed.

[0091] In other embodiments, the first adhesive edges 22 existing around the first ABF film 2 may all be laser processed to form ablation holes 23 so as to completely ablate the first adhesive edges 22 .

[0092] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing an FC-BGA substrate, characterized in that: The steps include: Obtaining a first ABF film (2), wherein first isolation films (3) are attached to both sides of the first ABF film (2); peeling off the first isolation film (3) on one side of the first ABF film (2); Attaching the first ABF film (2) to the core plate (1); Hot pressing the first ABF film (2), so that the first ABF film (2) has glue overflow and forms a first glue edge (22) on the core board (1); A plurality of ablation holes (23) are laser processed in the ablation region of the first adhesive edge (22), and adjacent ablation holes (23) overlap, so as to remove the ablation region of the first adhesive edge (22).

2. The method for manufacturing the FC-BGA substrate according to claim 1, characterized in that: The laser processing of a plurality of ablation holes (23) in the ablation area of ​​the first adhesive edge (22), wherein adjacent ablation holes (23) overlap, so as to remove the ablation area of ​​the first adhesive edge (22), comprises: A plurality of ablation holes (23) distributed in rows are processed along the first glue edge (22), and adjacent ablation holes (23) in the same row overlap.

3. The method for manufacturing the FC-BGA substrate according to claim 2, characterized in that: A plurality of rows of ablation holes (23) are processed on the first adhesive edge (22), and two adjacent rows of ablation holes (23) overlap.

4. The method for manufacturing the FC-BGA substrate according to claim 2, characterized in that: The hole center distance between adjacent ablation holes (23) is A, the sum of the hole diameters of two adjacent ablation holes (23) is B, and B / 3<A≤B / 2.

5. The method for manufacturing the FC-BGA substrate according to claim 2, characterized in that: The core plate (1) is rectangular, and the first ABF film (2) and the first isolation film (3) are rectangular; During hot pressing of the first ABF film (2), before the first ABF film (2) overflows with glue and forms a first glue edge (22) on the core plate (1), one side of the first isolation film (3) in the width direction is flush with one side of the first ABF film (2) in the width direction, and the other side of the first isolation film (3) in the width direction exceeds the other side of the first ABF film (2) in the width direction; The laser processing of a plurality of ablation holes (23) in the ablation area of ​​the first adhesive edge (22), wherein adjacent ablation holes (23) overlap, so as to remove the ablation area of ​​the first adhesive edge (22), comprises: A laser ablation hole (23) is processed on a portion of the first adhesive edge (22) extending along the length direction of the first ABF film (2), and adjacent ablation holes (23) overlap, so as to remove the corresponding first adhesive edge (22).

6. The method for manufacturing the FC-BGA substrate according to claim 1, characterized in that: Before attaching the first ABF film (2) to the core plate (1), the method further comprises: A positioning through hole is processed on the core plate (1), and the positioning through hole positions the core plate (1) on the processing position of the laser drilling machine.

7. The method for manufacturing the FC-BGA substrate according to claim 6, characterized in that: After the first ABF film (2) is hot-pressed and the first ABF film (2) has glue overflow and forms a first glue edge (22) on the core board (1), the method further comprises: The laser drilling machine is used to laser drill a first connecting hole (21) on the first ABF film (2).

8. The method for manufacturing the FC-BGA substrate according to any one of claims 1 to 7, characterized in that: After laser processing a plurality of ablation holes (23) in the ablation region of the first adhesive edge (22), wherein adjacent ablation holes (23) overlap, to remove the ablation region of the first adhesive edge (22), the method further comprises: peeling off the first isolation film (3) on the side of the first ABF film (2) facing away from the core plate (1); Obtaining a second ABF film (4), wherein second isolation films (5) are attached to both sides of the second ABF film (4); peeling off the second isolation film (5) on one side of the second ABF film (4); attaching the second ABF film (4) to a surface of the first ABF film (2) that is opposite to the core plate (1); The second ABF film (4) is hot-pressed, and the second ABF film (4) has glue overflow to form a second glue edge (41); The ablation holes (23) are laser processed in the ablation region of the second glue edge (41), and adjacent ablation holes (23) overlap, so as to remove the ablation region of the second glue edge (41).

9. The method for manufacturing the FC-BGA substrate according to claim 8, characterized in that: The second ABF film (4) and the second isolation film (5) are rectangular; When hot pressing the second ABF film (4), before the second ABF film (4) overflows with glue to form a second glue edge (41), one side of the second isolation film (5) in the width direction is flush with one side of the second ABF film (4) in the width direction, and the other side of the second isolation film (5) in the width direction exceeds the other side of the second ABF film (4) in the width direction; The laser processing of the ablation holes (23) in the ablation area of ​​the second glue edge (41), wherein adjacent ablation holes (23) overlap, so as to remove the ablation area of ​​the second glue edge (41), comprises: A laser ablation hole (23) is processed on a portion of the second glue edge (41) extending along the length direction of the second ABF film (4), and adjacent ablation holes (23) overlap, so as to remove the corresponding second glue edge (41).

10. The method for manufacturing the FC-BGA substrate according to claim 8, characterized in that: After the second ABF film (4) is hot-pressed and the second ABF film (4) has glue overflow to form a second glue edge (41), the method further comprises: A second connecting hole is laser drilled on a side of the second ABF film (4) facing away from the first ABF film (2).

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