High-temperature-resistant high-thermal-conductivity single-component epoxy pouring sealant and preparation method thereof

Abstract

The invention relates to a high-temperature-resistant high-thermal-conductivity single-component epoxy pouring sealant and a preparation method thereof, and the high-temperature-resistant high-thermal-conductivity single-component epoxy pouring sealant comprises the following components: 1-10 parts of modified high-temperature-resistant epoxy resin, 0.5-5 parts of modified core-shell epoxy resin, 90-98 parts of thermal conductive powder, 0.5-5 parts of a phenyl-containing diluent, 10-50 parts of a dicyandiamide curing agent, 0.1-1 part of a powder dispersant and 0.1-2 parts of an accelerant. The modified high-temperature-resistant epoxy resin is obtained by grafting phenolic resin to epoxy resin. And dispersing the organic silicon core-shell nanoparticles in epoxy resin to obtain the modified core-shell epoxy resin. When the epoxy pouring sealant is prepared, a small amount of modified resin is added, and the dicyandiamide curing agent, the phenyl-containing diluent and different types of heat-conducting powder are matched, so that the heat stability of the epoxy pouring sealant can be remarkably improved.

Description

Technical Field

[0001] The invention relates to the field of epoxy resin adhesives, in particular to a high-temperature resistant and high-thermal conductive single-component epoxy potting adhesive, and also relates to a preparation method of the high-temperature resistant and high-thermal conductive single-component epoxy potting adhesive. Background Art

[0002] With the continuous development of electronic technology, the trend of electronic products becoming thinner and lighter requires electronic components to have better performance. Among them, epoxy adhesive is chosen as the adhesive medium for packaging by more and more electronic products due to its excellent performance such as viscosity, durability, and thermal conductivity. It is widely used in the fields of electronic packaging, battery pack packaging, and precision component packaging, and epoxy potting adhesive has come into being. In order to achieve better bonding strength, faster curing effect, better thermal conductivity and longer service life, the structural performance of potting adhesive is also constantly improving. Potting adhesives are usually divided into two types: two-component and one-component. The advantage of two-component potting adhesive is that it can be cured at room temperature, but the disadvantages are long curing time, poor thermal conductivity, precise proportioning, and short service life after configuration. Single-component potting adhesive eliminates the proportioning step and has good applicability, but the high curing temperature, high viscosity and harsh storage conditions make it difficult for single-component potting adhesive to be used in the packaging and adhesion of small gaps in electronic devices. These are inevitable problems in the development of potting adhesives. At the same time, other properties such as heat resistance, corrosion resistance, and moisture resistance are also factors that should be considered in the process of potting compound improvement. As the applicable environment expands, the external environment faced by electronic devices will also change dramatically. As the packaging medium for electronic devices, potting compounds need to adapt to the changing environment and develop in the direction of low viscosity, stable performance, safety and convenience.

[0003] CN115926703A discloses a two-component epoxy potting glue that resists high and low temperature cracking and a preparation method thereof. The ability of the colloid to resist cracking is improved by cross-linking polyurethane and epoxy resin molecules, and the two-component potting glue can adapt to the environment of high and low temperature cycle changes. However, the use of the two-component potting glue is more complicated and does not meet the requirements of convenience. The currently disclosed single-component epoxy encapsulation glue relies heavily on the selection of additives such as curing agents and diluents in terms of performance improvement, which is not conducive to production development. Therefore, improving the preparation process technology of epoxy potting glue and exploring high temperature resistant epoxy glue systems are of great production significance to the application and promotion of epoxy potting glue. Summary of the invention

[0004] In view of the above problems, the present invention provides a high temperature resistant and highly thermally conductive one-component epoxy potting adhesive and a preparation method thereof. The thermal stability and insulation of the epoxy potting adhesive are increased by modifying the high temperature resistant epoxy resin and the modified core-shell epoxy resin. The compounding of the dicyandiamide curing agent, the phenyl-containing diluent and the thermal conductive powder significantly improves the heat resistance of the epoxy potting adhesive. The one-component epoxy potting adhesive prepared by the present invention not only meets the requirements of convenient use, but also effectively solves the problem of reduced performance of the product at high temperatures.

[0005] A high temperature resistant and highly thermally conductive single-component epoxy potting adhesive, the components of which include, by weight, 1-10 parts of a modified high temperature resistant epoxy resin, 0.5-5 parts of a modified core-shell epoxy resin, 90-98 parts of thermally conductive powder, 0.5-5 parts of a phenyl-containing diluent, 10-50 parts of a dicyandiamide curing agent, 0.1-1 parts of a powder dispersant, and 0.1-2 parts of an accelerator, wherein the components of the modified high temperature resistant epoxy resin include, by weight, 40-60 parts of an epoxy resin, 10-20 parts of a phenolic resin, and 10-20 parts of a solid phenolic resin, and the components of the modified core-shell epoxy resin include, by weight, 30-70 parts of an epoxy resin, 10-50 parts of organic silicon nano-core-shell particles, and 0.1-1 parts of a dispersant. The thermally conductive powder accounts for a large proportion, which provides room for compounding and adjustment of the epoxy potting adhesive, thereby improving thermal conductivity and heat dissipation performance. The ratio of epoxy resin to phenolic resin is close to 3:2, which is conducive to the full grafting of epoxy resin. A high proportion of organosilicon nano core-shell particles can significantly improve the toughening effect of the modified core-shell resin.

[0006] Preferably, the epoxy resin includes one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, novolac epoxy resin, and hydrogenated epoxy resin, and the viscosity of the epoxy resin ranges from 0 to 2000 mPa.s.

[0007] Preferably, the phenolic resin has a viscosity ranging from 0 to 5000 mPa.s.

[0008] Both epoxy resin and phenolic resin limit the viscosity range, ensuring the low viscosity characteristics of epoxy potting compound. Low viscosity can make the potting compound more fluid and better penetrate into the tiny gaps of electronic components, leaving no gaps during the packaging process, greatly improving production efficiency.

[0009] Preferably, the diameter of the organosilicon nano core-shell particles is in the range of 0-400 μm. The organosilicon nano core-shell particles of this particle size have high reactivity and good compatibility with epoxy resin. They can improve the toughness and strength of the product while maintaining the heat resistance of the product. The silicon element therein can also enhance the insulation of the product.

[0010] Preferably, the thermally conductive powder includes one or more of alumina powder, aluminum nitride powder, boron nitride powder, and silicon carbide powder. The particle size range of the thermally conductive powder is 1-50 μm. The small-particle thermally conductive powder can be evenly dispersed in the colloid, thereby improving the heat dissipation performance and insulation, so that the product can meet the electrical packaging requirements.

[0011] Preferably, the phenyl-containing diluent includes one or more of phenyl glycidyl ether and o-cresyl glycidyl ether, and the phenyl structure improves the heat resistance of the product.

[0012] Preferably, the dicyandiamide curing agent is a liquid latent curing agent with a viscosity range of 0-300mPa.s, including one or more of HS-601, HS-605 of Chuzhou Huisheng Electronic Materials and HBY-L620, HBY-L630, HBY-L690 of Shaoxing Hebangyuan New Materials Technology. The dicyandiamide structure can improve the thermal stability of the epoxy potting adhesive.

[0013] Preferably, the powder dispersant includes one or more of epoxy phosphate, hydroxycarboxylate, unsaturated polyamine amide, low molecular weight acidic polyester salt, and high molecular ionic polymer. The powder dispersant improves the compatibility of thermal conductive powder and colloid, while reducing product viscosity.

[0014] Preferably, the accelerator is an imidazole adduct or a modified amine compound, including one or more of Ancamine 2014AS and 2014FG from Evonik, FXR-1081 and FXR-1020 from Sanhe Synthetics, and HT110 and MC120D from Guangzhou Solid Research.

[0015] A method for preparing a high temperature resistant and high thermal conductivity single-component epoxy potting adhesive, characterized in that it comprises the following steps:

[0016] Mix the modified high temperature resistant epoxy resin, the modified core-shell epoxy resin, the phenyl-containing diluent, the dicyandiamide curing agent, and the powder dispersant according to the weight ratio, and stir under vacuum at 60-90° C. for 0.5-1 hour to obtain a first mixture;

[0017] Adding thermally conductive powder to the first mixture in proportion by weight, stirring under vacuum at 60-90° C. for 1-3 hours to obtain a second mixture;

[0018] Add an accelerator to the second mixture in proportion by weight, and stir under vacuum at 15-40° C. for 1-3 hours to obtain a high-temperature resistant and highly thermally conductive single-component epoxy potting adhesive.

[0019] The vacuum condition prevents the epoxy resin from being oxidized during the preparation process and thus reducing product performance. The weight proportion of the modified core-shell epoxy resin and the modified high-temperature resistant epoxy resin is relatively low, which improves the heat resistance without affecting the use of the epoxy adhesive itself.

[0020] Preferably, the preparation method of the modified high temperature resistant epoxy resin is: under nitrogen conditions, epoxy resin, phenolic resin, and solid phenolic resin are mixed in proportion by weight, and stirred at 100-150°C for 2-3 hours so that the phenolic group can be fully grafted to the epoxy resin and the temperature is lower than 30°C to obtain the modified high temperature resistant epoxy resin.

[0021] Preferably, the preparation method of the modified core-shell epoxy resin is to mix the epoxy resin and the dispersant in proportion by weight, stir, add the organosilicon nano core-shell particles, and disperse in vacuum at 60-90° C. for 2-3 hours. The organosilicon nano core-shell particles can be fully integrated with the epoxy resin under high temperature conditions without grinding, thereby obtaining a modified core-shell epoxy resin with a high core-shell number and good toughening effect.

[0022] Compared with the prior art, the beneficial effect of the present invention is that the aromatic ether bond of phenolic resin and solid phenolic resin has good high temperature resistance and insulation, and the phenolic resin is grafted to epoxy resin, which well compensates for the poor thermal stability of epoxy resin and the shortcomings of easy fracture and degradation at high temperature. At the same time, the compounding of different particle sizes or different types of thermal conductive powders can improve the thermal conductivity of the product, promote heat loss, and avoid overheating of the product. The diluent containing phenyl and dicyandiamide curing agent can increase the heat resistance, comprehensively improve the thermal stability of epoxy potting glue from multiple aspects, strongly inhibit the decomposition of epoxy glue in a high-temperature environment, and avoid the problems of dissolution, loose structure, and reduced hardness of epoxy potting glue in a high-temperature environment. A high proportion of organosilicon nano core-shell particles can improve the toughness and strength of the product without affecting the heat resistance of the product, and avoid the problems of excessive internal stress in epoxy glue causing cracking during use. In addition, the epoxy potting glue of the present invention also has the characteristics of low viscosity and single component, and is convenient to use while meeting the packaging requirements of electronic devices. The preparation process is simple, highly practical, and has the conditions for large-scale production, and has certain application value. DETAILED DESCRIPTION

[0023] The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention. Without departing from the spirit and essence of the present invention, modifications or substitutions made to the methods, steps or conditions of the present invention all belong to the scope of protection of the present invention. Unless otherwise specified, the experimental materials, reagents, instruments, etc. used in the examples of the present invention are all commercially available; unless otherwise specified, all technical means in the examples of the present invention are conventional means well known to those skilled in the art.

[0024] Example 1

[0025] Under nitrogen conditions, bisphenol F epoxy resin with a viscosity of 1500mPa.s, phenolic resin with a viscosity of 4000mPa.s, and solid phenolic resin are mixed in proportion by weight, stirred at 120°C for 2 hours to keep the temperature below 30°C, and a modified high-temperature resistant epoxy resin is obtained.

[0026] The weight proportions of the components are as follows: 60 parts of bisphenol F epoxy resin, 20 parts of phenolic resin, and 20 parts of solid phenolic resin.

[0027] Bisphenol A epoxy resin with a viscosity of 1500 mPa.s and hydroxycarboxylate were mixed according to weight proportion, stirred, organic silicon nano core-shell particles were added, and vacuum dispersed at 80° C. for 2 hours in a high-speed disperser to obtain a modified core-shell epoxy resin.

[0028] The weight proportions of the components are as follows: bisphenol A epoxy resin: 57 parts, hydroxycarboxylate: 1 part, and organosilicon nano core-shell particles: 42 parts.

[0029] Mix the modified high temperature resistant epoxy resin, the modified core-shell epoxy resin, phenyl glycidyl ether, the curing agent HS-601, and the hydroxycarboxylate according to the weight ratio, and stir under vacuum at 80° C. for 1 hour to obtain a first mixture;

[0030] The weight proportions of the components of the first mixture are: 2 parts of modified high temperature resistant epoxy resin, 0.6 parts of modified core-shell epoxy resin, 1 part of phenyl glycidyl ether, 1 part of dicyandiamide curing agent HS-601, and 0.2 parts of hydroxycarboxylate.

[0031] Add 25 parts of 2 μm aluminum nitride powder and 70 parts of 50 μm aluminum nitride powder to the first mixture in proportion by weight, stir under vacuum at 80° C. for 2 hours, and cool to 35° C. to obtain a second mixture;

[0032] According to the weight ratio, 0.2 parts of accelerator MC120D were added to the second mixture, and the mixture was stirred in vacuum at 30° C. for 2 hours to obtain a high-temperature resistant and high-thermal conductive single-component epoxy potting adhesive.

[0033] Example 2

[0034] Under nitrogen conditions, bisphenol F epoxy resin with a viscosity of 1500mPa.s, phenolic resin with a viscosity of 4000mPa.s, and solid phenolic resin are mixed in proportion by weight, stirred at 120°C for 2 hours to keep the temperature below 30°C, and a modified high-temperature resistant epoxy resin is obtained.

[0035] The weight proportions of the components are as follows: 60 parts of bisphenol F epoxy resin, 20 parts of phenolic resin, and 20 parts of solid phenolic resin.

[0036] According to the weight ratio, bisphenol A epoxy resin with a viscosity of 1500 mPa.s and a high molecular ionic polymer are mixed and stirred, and organic silicon nano core-shell particles are added, and the mixture is dispersed in a high-speed disperser at 80° C. in vacuum for 2 hours to obtain a modified core-shell epoxy resin.

[0037] The weight proportions of the components are as follows: 57 parts of bisphenol A epoxy resin, 1 part of unsaturated polyamine amide and low molecular weight acidic polyester salt, and 42 parts of organosilicon nano core-shell particles.

[0038] The modified high temperature resistant epoxy resin, the modified core-shell epoxy resin, the phenyl glycidyl ether, the curing agent HBY-L620, the unsaturated polyamine amide and the low molecular weight acidic polyester salt are mixed according to the weight proportion, and the mixture is stirred under vacuum at 80° C. for 1 hour to obtain a first mixture;

[0039] Among them, the weight proportions of the components of the first mixture are: modified high temperature resistant epoxy resin: 1.3 parts, modified core-shell epoxy resin: 1.3 parts, phenyl glycidyl ether: 0.8 parts, dicyandiamide curing agent HBY-L620: 1.2 parts, unsaturated polyamine amide and low molecular weight acidic polyester salt: 0.2 parts.

[0040] Add 10 parts of 5 μm aluminum nitride powder, 35 parts of 30 μm aluminum nitride powder, and 50 parts of 50 μm aluminum nitride powder to the first mixture in proportion by weight, stir under vacuum at 80° C. for 2 hours, and cool to 35° C. to obtain a second mixture;

[0041] According to the weight ratio, 0.2 parts of accelerator 2014FG were added to the second mixture, and the mixture was stirred in vacuum at 30° C. for 2 hours to obtain a high-temperature resistant and high-thermal conductive single-component epoxy potting adhesive.

[0042] Example 3

[0043] Under nitrogen conditions, bisphenol F epoxy resin with a viscosity of 1500mPa.s, phenolic resin with a viscosity of 4000mPa.s, and solid phenolic resin are mixed in proportion by weight, stirred at 120°C for 2 hours to keep the temperature below 30°C, and a modified high-temperature resistant epoxy resin is obtained.

[0044] The weight proportions of the components are as follows: 60 parts of bisphenol F epoxy resin, 20 parts of phenolic resin, and 20 parts of solid phenolic resin.

[0045] According to the weight ratio, bisphenol A epoxy resin with a viscosity of 1500 mPa.s and a high molecular ionic polymer are mixed and stirred, and organic silicon nano core-shell particles are added, and the mixture is dispersed in a high-speed disperser at 80° C. in vacuum for 2 hours to obtain a modified core-shell epoxy resin.

[0046] The weight proportions of the components are as follows: bisphenol A epoxy resin: 57 parts, high molecular ionic polymer: 1 part, and organic silicon nano core-shell particles: 42 parts.

[0047] The modified high temperature resistant epoxy resin, the modified core-shell epoxy resin, the phenyl glycidyl ether, the curing agent HS-605, and the high molecular ionic polymer are mixed according to the weight ratio, and the mixture is stirred at 80° C. in vacuum for 1 hour to obtain a first mixture;

[0048] The weight proportions of the components of the first mixture are: modified high temperature resistant epoxy resin: 1.6 parts, modified core-shell epoxy resin: 1 part, phenyl glycidyl ether: 1 part, dicyandiamide curing agent HS-605: 0.8 parts, and high molecular ionic polymer: 0.3 parts.

[0049] Add 10 parts of 2 μm aluminum nitride powder, 15 parts of 30 μm aluminum nitride powder, and 70 parts of 50 μm aluminum nitride powder to the first mixture in proportion by weight, stir under vacuum at 80° C. for 2 hours, and cool to 35° C. to obtain a second mixture;

[0050] According to the weight ratio, 10.3 parts of accelerator FXR-108 were added to the second mixture, and the mixture was stirred at 30° C. in vacuum for 2 hours to obtain a high-temperature resistant and high-thermal conductive single-component epoxy potting adhesive.

[0051] Comparative Example 1

[0052] Mix bisphenol A epoxy resin, bisphenol F epoxy resin, phenyl glycidyl ether, curing agent HS-601, and hydroxycarboxylate according to weight proportion, and stir under vacuum at 80° C. for 1 hour to obtain a first mixture;

[0053] The weight proportions of the components of the first mixture are: bisphenol A epoxy resin: 2 parts, bisphenol F epoxy resin: 0.6 parts, phenyl glycidyl ether: 1 part, dicyandiamide curing agent HS-601: 1 part, and hydroxycarboxylate: 0.2 parts.

[0054] Add 25 parts of 2 μm aluminum nitride powder and 70 parts of 50 μm aluminum nitride powder to the first mixture in proportion by weight, stir under vacuum at 80° C. for 2 hours, and cool to 35° C. to obtain a second mixture;

[0055] 0.2 parts of accelerator MC120D were added to the second mixture in proportion by weight, and the mixture was stirred at 30° C. in vacuum for 2 hours to obtain a one-component epoxy potting adhesive.

[0056] Comparative Example 2

[0057] Mix bisphenol A epoxy resin, bisphenol F epoxy resin, phenyl glycidyl ether, curing agent HS-605, and high molecular ionic polymer according to weight proportion, and stir under vacuum at 80° C. for 1 hour to obtain a first mixture;

[0058] The weight proportions of the components of the first mixture are: bisphenol A epoxy resin: 1 part, bisphenol F epoxy resin: 1 part, phenyl glycidyl ether: 1 part, dicyandiamide curing agent HS-605: 1.4 parts, and high molecular ionic polymer: 0.3 parts.

[0059] Add 10 parts of 5 μm aluminum nitride powder, 35 parts of 30 μm aluminum nitride powder, and 50 parts of 50 μm aluminum nitride powder to the first mixture in proportion by weight, stir under vacuum at 80° C. for 2 hours, and cool to 35° C. to obtain a second mixture;

[0060] According to the weight ratio, 10.3 parts of accelerator FXR-108 were added to the second mixture, and the mixture was stirred at 30° C. in vacuum for 2 hours to obtain a one-component epoxy potting adhesive.

[0061] Experimental example

[0062] The product performance of all embodiments and comparative examples was tested, and the performance indicators included glass transition temperature (Tg point), room temperature viscosity, thermal conductivity, 150°C shear strength, hardness, room temperature storage change, water absorption, volume resistivity, breakdown strength, dielectric constant and dielectric loss. The test standards refer to GB / T 19466.2-2004, GB / T 15357-2014, ISO 8894-1, GB / T 7124-2008, GB / T 531.1-2008, GB / T 1034-2008, GB / T 1410-2006, GB / T 1408.1-2006 and GB / T 1693-2007, and the test results are shown in Table 1.

[0063] Table 1 Product performance test results

[0064]

[0065]

[0066] By comparing the test results of Example 1 and Comparative Example 1, it can be seen that Example 1 adds modified high temperature resistant epoxy resin and modified core-shell epoxy resin, the product has low viscosity, good fluidity and permeability, and the shear strength is significantly higher than that of Comparative Example 1 at 150°C, that is, after the epoxy resin is grafted with phenolic resin, the thermal stability of the epoxy potting glue is significantly improved. There is no obvious change in room temperature storage, which will not affect normal use, and the water absorption rate is low, indicating that the epoxy potting glue has good moisture resistance and can adapt to high temperature and high humidity environments. The volume resistivity, breakdown strength, and dielectric constant are all higher than those of Comparative Example 1, that is, the product has high resistance, strong structural bearing capacity, good insulation performance, and meets the packaging conditions of electronic devices. The low dielectric loss indicates that the product has a longer service life. The product of Comparative Example 1 is a paste, which cannot fully penetrate into the tiny gaps of electronic devices and cannot be completely encapsulated. Secondly, the shear strength is low at high temperature, and the product is not heat-resistant. It is stored as a paste at room temperature, which affects use, has a high water absorption rate, and is not suitable for humid use environments. The insulation performance is poor, the dielectric loss is large, and the service life is short. There is no significant difference in thermal conductivity between Example 1 and Comparative Example 1, which fully demonstrates that compounding thermally conductive powders of different particle sizes can enhance the heat dissipation performance of the product and improve the heat resistance of the product.

[0067] By comparing the test results of Example 3 and Comparative Example 3, it can be seen that Example 3 adds modified high-temperature resistant epoxy resin and modified core-shell epoxy resin, the product has low viscosity, good fluidity and permeability, and the shear strength is significantly higher than that of Comparative Example 3 at 150°C, that is, after the epoxy resin is grafted with phenolic resin, the thermal stability of the epoxy potting glue is significantly improved. There is no obvious change in room temperature storage, which will not affect normal use. The water absorption rate is low, indicating that the epoxy potting glue has good moisture resistance and can adapt to high temperature and high humidity environments. The volume resistivity, breakdown strength, and dielectric constant are all higher than those of Comparative Example 3, that is, the product has high resistance, strong structural bearing capacity, good insulation performance, and meets the packaging conditions of electronic devices. The low dielectric loss indicates that the product has a longer service life. Although the product of Comparative Example 3 has a lower viscosity, the shear strength is low at high temperature and the product is not heat-resistant. Storage at room temperature will solidify, affecting use, and the water absorption rate is high, which is not suitable for humid use environments. The insulation performance is poor, the dielectric loss is large, and the service life is short. There is no significant difference in thermal conductivity between Example 3 and Comparative Example 3, which fully demonstrates that compounding thermally conductive powders of different particle sizes can enhance the heat dissipation performance of the product and improve the heat resistance of the product.

[0068] It can be understood that the above embodiments only express the preferred implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the present invention. It should be pointed out that, for ordinary technicians in this field, the above technical features can be freely combined without departing from the concept of the present invention, and several deformations and improvements can be made, which all belong to the protection scope of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should belong to the coverage of the claims of the present invention.

Claims

1. A high temperature resistant and highly thermally conductive one-component epoxy potting adhesive, characterized in that: The components of the one-component epoxy potting adhesive include, by weight, 1-10 parts of modified high-temperature resistant epoxy resin, 0.5-5 parts of modified core-shell epoxy resin, 90-98 parts of thermal conductive powder, 0.5-5 parts of phenyl-containing diluent, 10-50 parts of dicyandiamide curing agent, 0.1-1 parts of powder dispersant, and 0.1-2 parts of accelerator. Among them, the components of the modified high-temperature resistant epoxy resin include, by weight, 40-60 parts of epoxy resin, 10-20 parts of phenolic resin, and 10-20 parts of solid phenolic resin. The components of the modified core-shell epoxy resin include, by weight, 30-70 parts of epoxy resin, 10-50 parts of organosilicon nano core-shell particles, and 0.1-1 parts of dispersant.

2. The one-component epoxy potting adhesive according to claim 1, characterized in that: The epoxy resin includes one or more of bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, novolac epoxy resin, and hydrogenated epoxy resin, and the epoxy resin viscosity ranges from 0 to 2000 mPa.s.

3. The one-component epoxy potting adhesive according to claim 1, characterized in that: The viscosity of the phenolic resin ranges from 0 to 5000 mPa.s.

4. The one-component epoxy potting adhesive according to claim 1, characterized in that: The diameter of the organosilicon nano core-shell particles ranges from 0 to 400 μm.

5. The one-component epoxy potting adhesive according to claim 1, characterized in that: The thermally conductive powder includes one or more of aluminum oxide powder, aluminum nitride powder, boron nitride powder, and silicon carbide powder, and the particle size of the thermally conductive powder ranges from 1 to 50 μm.

6. The one-component epoxy potting adhesive according to claim 1, characterized in that: The dicyandiamide curing agent is a liquid latent curing agent with a viscosity range of 0-300 mPa.s.

7. The one-component epoxy potting adhesive according to claim 1, characterized in that: The powder dispersant includes one or more of epoxy phosphate, hydroxycarboxylic acid ester, unsaturated polyamine amide, low molecular weight acidic polyester salt and high molecular ionic polymer.

8. The one-component epoxy potting adhesive according to claim 1, characterized in that: The accelerator is an imidazole adduct or a modified amine compound.

9. A method for preparing the high temperature resistant and high thermal conductivity one-component epoxy potting adhesive according to claim 1, characterized in that: The following steps are involved: Mixing the modified high temperature resistant epoxy resin, the modified core-shell epoxy resin, the phenyl-containing diluent, the dicyandiamide curing agent, and the powder dispersant according to the weight ratio, and stirring under vacuum at 60-90° C. to obtain a first mixture; Adding thermally conductive powder to the first mixture in proportion by weight, stirring under vacuum at 60-90° C. to obtain a second mixture; Add an accelerator to the second mixture in proportion by weight, and stir under vacuum at 15-40° C. to obtain the high-temperature resistant and highly thermally conductive single-component epoxy potting adhesive as claimed in claim 1.

10. The preparation method according to claim 9, characterized in that: The preparation method of the modified high temperature resistant epoxy resin is: Under nitrogen conditions, epoxy resin, phenolic resin and solid phenolic resin are mixed according to weight proportion, stirred evenly at 100-150° C., and the temperature is lowered to below 30° C. to obtain a modified high-temperature resistant epoxy resin.

11. The preparation method according to claim 9, characterized in that: The preparation method of the modified core-shell epoxy resin is: The epoxy resin and the dispersant are mixed according to the weight ratio, stirred, and the organic silicon nano core-shell particles are added, and the particles are dispersed in a vacuum at 60-90° C. to obtain the modified core-shell epoxy resin.

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