Double-layer wafer visual inspection tilting table and control method thereof

Abstract

The invention relates to a double-layer wafer visual inspection inclined table and a control method thereof, and belongs to the technical field of wafer inspection equipment. The double-layer wafer visual inspection inclined table comprises an operation table, the visual inspection inclined table is arranged on the operation table, a good product packaging box is arranged on the upper portion of the visual inspection inclined table, and a to-be-inspected packaging box is arranged on the lower portion of the visual inspection inclined table; a magnetic attraction pen is arranged on one side of the visual inspection inclined table, and a pen holder cylinder connected with the magnetic attraction pen in a sliding and inserted mode is arranged between the magnetic attraction pen and the operation table. The visual inspection inclined table comprises a main plate, an inclined supporting plate is arranged at the rear end of the main plate, the inclined supporting plate and the main plate are of a herringbone structure, an upper inspection plate is arranged on the upper portion of the front end of the main plate, and a lower inspection plate is arranged on the lower portion of the front end of the main plate. The device has the advantages of compact structure, convenient operation and good operation stability. Particle abnormity is solved, wafer quality is improved, and manual inspection work efficiency and work convenience are improved at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer inspection equipment, and in particular to a double-layer wafer visual inspection tilting platform and a control method thereof. Background Art

[0002] Semiconductor silicon wafers are the main substrate material for modern ultra-large-scale integrated circuits. They are generally manufactured through processes such as crystal pulling, slicing, chamfering, grinding, etching, polishing, cleaning, inspection, and packaging to form integrated circuit-grade semiconductor silicon wafers.

[0003] When the processed wafers are visually inspected, the wafers are taken out from the packaging box to be inspected for visual inspection, and good wafers are placed in the good product packaging box. In the inspection method from left to right, the operator's hand will move over the wafer and the packaging box, causing particles to fall into the packaging box and cause abnormalities. Summary of the invention

[0004] The present invention mainly solves the problem in the prior art that particles will be contaminated inside the packaging box and on the surface of the silicon wafer during the inspection process due to left and right pick-up, and provides a double-layer wafer visual inspection tilting table and a control method thereof, which has the advantages of compact structure, convenient operation and good running stability. It solves the problem of particle anomalies and improves the quality of wafers, while also improving the efficiency of manual inspection and the convenience of work.

[0005] The above technical problems of the present invention are mainly solved by the following technical solutions: A double-layer wafer visual inspection tilting platform, including an operating table, a visual inspection tilting platform is provided on the operating table, a good product packaging box is provided on the upper part of the visual inspection tilting platform, a packaging box to be inspected is provided on the lower part of the visual inspection tilting platform, a magnetic pen is provided on one side of the visual inspection tilting platform, and a pen holder tube slidably plugged with the magnetic pen is provided between the magnetic pen and the operating table. The visual inspection tilting platform includes a main board, a diagonal support plate in a "human" shape with the main board is provided at the rear end of the main board, an upper inspection plate is provided at the upper front end of the main board, and a lower inspection plate is provided at the lower front end of the main board. A 50-degree angle is formed between the main board and the diagonal support plate, and a 65-degree angle is formed between the main board and the operating table, and between the diagonal support plate and the operating table.

[0006] Preferably, the sides of the lower inspection plate and the diagonal support plate are provided with side guard bars.

[0007] Preferably, a visual inspection bracket is provided on the other side of the visual inspection tilting platform, a rotating shaft is provided between the visual inspection bracket and the visual inspection tilting platform, and a rotating rod is provided between the rotating shaft and the visual inspection bracket.

[0008] Preferably, the visual inspection bracket includes a fixed sleeve, a top cap is provided at the upper end of the fixed sleeve, a spring is provided between the fixed sleeve and the top cap and is fixedly connected to the fixed sleeve, and a plurality of rubber support rods are provided at the upper end of the spring and are distributed in an annular shape and extend out of the fixed sleeve.

[0009] Preferably, a vacuum air pipe is provided at the upper end of the operating table, a plurality of quick-connect valve plugs threadedly connected and fixed to the vacuum air pipe are provided at the front end of the vacuum air pipe, and a bellows is provided between the quick-connect valve plug and the magnetic pen.

[0010] Preferably, anti-slip pads are provided between the packaging box to be inspected and the visual inspection tilting table, and between the packaging box of good products and the visual inspection tilting table.

[0011] A control method for a double-layer wafer visual inspection tilt stage comprises the following operating steps: Step 1: Place the packaging box filled with wafers to be inspected on the lower inspection board.

[0012] Step 2: Move the visual inspection bracket around the axis through the rotating rod to the front of the packaging box to be inspected.

[0013] Step 3: Use a magnetic pen to pick up the wafers in the packaging box to be inspected and place them on the visual inspection bracket for visual inspection.

[0014] Step 4: Wafers that pass the visual inspection are placed in good product packaging boxes on the upper inspection board.

[0015] Preferably, the magnetic pen realizes vacuum adsorption and air intake separation through a vacuum air pipe and a bellows at the same time as magnetic adsorption.

[0016] The present invention can achieve the following effects: The present invention provides a double-layer wafer visual inspection tilting table and a control method thereof, which, compared with the prior art, has the advantages of compact structure, convenient operation and good running stability. It can solve particle anomalies and improve the quality of wafers, while improving the efficiency of manual inspection and the convenience of work. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the present invention.

[0018] Figure 2 It is a schematic diagram of the three-dimensional structure of the visual inspection tilting platform of the present invention.

[0019] Figure 3 It is a side view structural schematic diagram of the visual inspection tilting platform of the present invention.

[0020] Figure 4 It is a structural schematic diagram of the visual inspection bracket of the present invention.

[0021] In the figure: operating table 1, vacuum air pipe 2, quick-connect valve plug 3, good product packaging box 4, visual inspection tilting table 5, bellows 6, packaging box to be inspected 7, magnetic pen 8, pen holder tube 9, anti-slip mat 10, shaft 11, rotating rod 12, visual inspection bracket 13, main board 14, upper inspection plate 15, side baffle 16, lower inspection plate 17, diagonal support plate 18, rubber support rod 19, top cap 20, spring 21, fixed sleeve 22. DETAILED DESCRIPTION

[0022] The technical solution of the invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0023] Example: Figure 1-4 As shown, a double-layer wafer visual inspection tilting platform includes an operating table 1, on which a visual inspection tilting platform 5 is provided. The visual inspection tilting platform 5 includes a main board 14, a rear end of the main board 14 is provided with an inclined support plate 18 in a "human" shape with the main board 14, an upper inspection plate 15 is provided at the upper front end of the main board 14, and a lower inspection plate 17 is provided at the lower front end of the main board 14. Side guard bars 16 are provided on the sides of the lower inspection plate 17 and the inclined support plate 18. A good product packaging box 4 is provided on the upper part of the visual inspection tilting platform 5, and a packaging box to be inspected 7 is provided at the lower part of the visual inspection tilting platform 5. Anti-slip pads 10 are provided between the packaging box to be inspected 7 and the visual inspection tilting platform 5, and between the good product packaging box 4 and the visual inspection tilting platform 5. A magnetic pen 8 is provided on one side of the visual inspection tilting platform 5, and a pen holder tube 9 slidably plugged with the magnetic pen 8 is provided between the magnetic pen 8 and the operating table 1. A vacuum air pipe 2 is provided at the upper end of the operating table 1, and 7 quick-connect valve plugs 3 threadedly sleeved and fixed with the vacuum air pipe 2 are provided at the front end of the vacuum air pipe 2, and a bellows 6 is provided between the quick-connect valve plug 3 and the magnetic pen 8. A visual inspection bracket 13 is provided on the other side of the visual inspection tilting platform 5, and a rotating shaft 11 is provided between the visual inspection bracket 13 and the visual inspection tilting platform 5, and a rotating rod 12 is provided between the rotating shaft 11 and the visual inspection bracket 13. The visual inspection bracket 13 includes a fixed sleeve 22, and a top cap 20 is provided at the upper end of the fixed sleeve 22. A spring 21 sleeved and fixed with the fixed sleeve 22 is provided between the fixed sleeve 22 and the top cap 20, and 3 rubber support rods 19 distributed in an annular shape and extending out of the fixed sleeve 22 are provided at the upper end of the spring 21.

[0024] A control method for a double-layer wafer visual inspection tilt stage comprises the following operating steps: Step 1: The packaging box 7 to be inspected, which is filled with wafers, is placed on the lower inspection plate 17 .

[0025] Step 2: Move the visual inspection bracket 13 around the rotating shaft 11 through the rotating rod 12 to the front of the packaging box 7 to be inspected.

[0026] Step 3: Use the magnetic pen 8 to pick up the wafers in the packaging box 7 to be inspected, and place them on the visual inspection bracket 13 for visual inspection.

[0027] The magnetic pen 8 realizes vacuum adsorption and air intake separation through the vacuum air pipe 2 and the bellows 6 at the same time of magnetic adsorption.

[0028] Step 4: Place the wafers that pass the visual inspection into the good product packaging box 4 on the upper inspection board 15.

[0029] In summary, the double-layer wafer visual inspection tilting table and its control method have the advantages of compact structure, convenient operation and good running stability. It can solve particle anomalies and improve the quality of wafers, while improving the efficiency of manual inspection and the convenience of work.

[0030] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A double-layer wafer visual inspection tilting table, characterized in that: The invention comprises an operating table (1), wherein a visual inspection tilting table (5) is provided on the operating table (1), a good product packaging box (4) is provided on the upper part of the visual inspection tilting table (5), a packaging box to be inspected (7) is provided on the lower part of the visual inspection tilting table (5), a magnetic pen (8) is provided on one side of the visual inspection tilting table (5), and a pen holder tube (9) is provided between the magnetic pen (8) and the operating table (1) and is slidably plugged into the magnetic pen (8); the visual inspection tilting table (5) comprises a main board (14), a diagonal support plate (18) in a "human" shape with the main board (14) is provided at the rear end of the main board (14), an upper inspection plate (15) is provided at the upper part of the front end of the main board (14), and a lower inspection plate (17) is provided at the lower part of the front end of the main board (14).

2. The double-layer wafer visual inspection tilting platform according to claim 1, characterized in that: The sides of the lower inspection plate (17) and the diagonal support plate (18) are both provided with side blocking strips (16).

3. The double-layer wafer visual inspection tilting platform according to claim 1, characterized in that: A visual inspection bracket (13) is provided on the other side of the visual inspection tilting platform (5), a rotating shaft (11) is provided between the visual inspection bracket (13) and the visual inspection tilting platform (5), and a rotating rod (12) is provided between the rotating shaft (11) and the visual inspection bracket (13).

4. The double-layer wafer visual inspection tilting platform according to claim 3, characterized in that: The visual inspection bracket (13) comprises a fixed sleeve (22), a top cap (20) being provided at the upper end of the fixed sleeve (22), a spring (21) being sleeved and fixed to the fixed sleeve (22) being provided between the fixed sleeve (22) and the top cap (20), and a plurality of rubber support rods (19) being distributed in an annular shape and extending out of the fixed sleeve (22) being provided at the upper end of the spring (21).

5. The double-layer wafer visual inspection tilting platform according to claim 1 or 4, characterized in that: A vacuum air pipe (2) is provided at the upper end of the operating table (1), a plurality of quick-connect valve plugs (3) threadedly sleeved and fixed to the vacuum air pipe (2) are provided at the front end of the vacuum air pipe (2), and a bellows (6) is provided between the quick-connect valve plug (3) and the magnetic pen (8).

6. The double-layer wafer visual inspection tilting platform according to claim 1, characterized in that: Anti-slip pads (10) are provided between the packaging box to be inspected (7) and the visual inspection tilting platform (5), and between the packaging box of good quality (4) and the visual inspection tilting platform (5).

7. A control method for a double-layer wafer visual inspection tilt stage according to claim 5, characterized in that The steps are as follows: Step 1: placing the packaging box (7) to be inspected filled with wafers on the lower inspection plate (17); Step 2: Move the visual inspection bracket (13) around the rotating shaft (11) via the rotating rod (12) to the front of the packaging box (7) to be inspected; Step 3: Use a magnetic pen (8) to pick up the wafer in the packaging box (7) to be inspected, and place it on the visual inspection bracket (13) for visual inspection; Step 4: Wafers that pass the visual inspection are placed in a good product packaging box (4) on the upper inspection board (15).

8. The control method of the double-layer wafer visual inspection tilt stage according to claim 7, characterized in that: The magnetic pen (8) realizes vacuum adsorption and air intake separation through the vacuum air pipe (2) and the bellows (6) at the same time as magnetic adsorption.

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