Wafer cleaning equipment

Abstract

The invention provides wafer cleaning equipment. The wafer cleaning equipment comprises a positioning device, a spraying device and an illumination device, wherein the positioning device is used for keeping a wafer in a horizontal posture and driving the wafer to rotate in the axial direction; the spraying device is used for spraying photocatalyst steam to the wafer; the illumination device is arranged on the positioning device and forms an illumination part exposed on the back surface of the wafer, the illumination part irradiates light containing ultraviolet rays on the back surface of the wafer so as to activate the photocatalyst, and the organic compounds on the back surface of the wafer are removed by the photocatalyst. Through the spraying device and the illumination device, residual organic compounds on the back surface of the wafer are thoroughly decomposed and removed.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer cleaning device. Background Art

[0002] Wafer cleaning is an important process step in the semiconductor manufacturing process, which aims to remove pollutants such as metal ions, organic matter, particulate matter, etc. generated by the contact of wafers with various organic substances, particles and metals during processing, forming and polishing. When cleaning wafers, not only the surface but also the back of the wafer should be cleaned. In the wafer cleaning process, commonly used cleaning fluids include inorganic acids, alkaline solutions, deionized water and various organic compound solutions. Organic compound cleaning fluids play an important role in semiconductor manufacturing due to their unique properties.

[0003] In the prior art, after the equipment for cleaning wafers uses organic compound cleaning liquid to clean the surface and / or back of the wafer, the organic compound cleaning liquid will remain on the back of the wafer, and during the drying process after cleaning, the organic compound will form a watermark on the back of the wafer, affecting the subsequent process.

[0004] In view of this, it is necessary to improve the equipment used for cleaning wafers in the prior art to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to disclose a wafer cleaning device for solving many defects of the devices for cleaning wafers in the prior art, especially for achieving complete decomposition and removal of residual organic compounds on the back side of the wafer.

[0006] To achieve the above-mentioned object, the present invention provides a wafer cleaning device, comprising: a positioning device for holding a wafer in a horizontal posture and driving the wafer to rotate axially, a spraying device for spraying photocatalyst vapor onto the wafer, and an irradiation device; The illumination device is arranged on the positioning device and forms an illumination part exposed to the back side of the wafer. The illumination part irradiates the back side of the wafer with light containing ultraviolet rays to activate the photocatalyst, and the photocatalyst removes the organic compound on the back side of the wafer.

[0007] As a further improvement of the present invention, the illumination device includes: a parallel backlight source, the side of the parallel backlight source facing the back side of the wafer forms the illumination portion, and the back side of the wafer is located within the illumination range of the illumination portion.

[0008] As a further improvement of the present invention, the positioning device is constructed to form a mounting cavity that accommodates the illumination device and exposes the illumination portion to the back side of the wafer.

[0009] As a further improvement of the present invention, the lighting device further includes: a cooling unit and a control unit which are sequentially arranged from top to bottom along the axial direction, and the cooling unit is clamped between the parallel backlight source and the control unit.

[0010] As a further improvement of the present invention, the lighting device further includes: a protection plate disposed on the top of the parallel backlight source and spaced a certain distance from the wafer.

[0011] As a further improvement of the present invention, the spray device includes: a shell arranged above the positioning device, a spray pipe penetrating the shell to spray photocatalyst vapor onto the wafer, and a heat preservation unit disposed inside the shell.

[0012] As a further improvement of the present invention, the shell is constructed to form a mixing chamber for accommodating the insulation unit, and the spraying device also includes: a multi-way valve pipe that penetrates the shell to inject photocatalyst steam into the mixing chamber and spray the photocatalyst steam onto the wafer, and sprays the photocatalyst steam injected into the mixing chamber onto the wafer.

[0013] As a further improvement of the present invention, the positioning device includes: a support plate with the installation cavity formed therein, at least three positioning posts arranged around the support plate and penetrating the support plate in the longitudinal direction and rotatably connected to the support plate, a transmission plate coaxially arranged at the outer side of the bottom of the support plate and axially rotating relative to the support plate to drive the positioning posts to rotate along their axes, a rotating base coaxially arranged at the bottom of the transmission plate and synchronously driving the support plate and the transmission plate to axially rotate, and a control component driving the transmission plate to axially rotate relative to the support plate and the rotating base to drive the positioning posts to switch between a wafer clamping state and a wafer unclamping state; A first gear is formed on the outer periphery of the bottom of the positioning column, and a second gear is constructed at the edge of the transmission plate to mesh with the first gear to drive the positioning column to rotate along its axis.

[0014] As a further improvement of the present invention, the rotating base protrudes toward the transmission disc to form a mounting column, and the transmission disc is constructed with a limiting portion spaced apart from the mounting column; The control component includes: an elastic member with two ends respectively connecting the mounting column and the limiting portion; the elastic member forms an elastic force on the limiting portion to drive the transmission disk to rotate along a first direction, so as to drive the positioning column to switch from a state of not clamping the wafer to a state of clamping the wafer.

[0015] As a further improvement of the present invention, the transmission plate is constructed with a convex block penetrating the rotating base and concavely arranged to form an arc surface, and the rotating base is provided with a clearance groove for the convex block to rotate along the axial direction; The control component also includes: a telescopic unit, a telescopic rod configured on the telescopic unit and moving closer to or away from a guide block on the arc surface as the telescopic rod telescopes, the telescopic unit drives the telescopic rod to extend to drive the guide block to approach the arc surface, the guide block abuts against the arc surface to push the transmission disk to rotate in a second direction opposite to the first direction, so as to drive the positioning column to switch from a state of clamping the wafer to a state of not clamping the wafer.

[0016] As a further improvement of the present invention, the rotating base includes: a hollow shaft drive motor, a connecting plate controlled by the drive motor to rotate axially and fixedly connected to the support plate, the connecting plate being constructed with a connecting portion connected to the output shaft of the hollow shaft drive motor; the transmission plate being constructed with a transmission portion that is sleeved on the outside of the connecting portion and rotatably connected to the connecting portion.

[0017] As a further improvement of the present invention, the wafer cleaning device further comprises: a composite chamber device circumferentially arranged outside the positioning device to recover waste gas and waste liquid.

[0018] Compared with the prior art, the beneficial effect of the present invention is that after the surface and / or back of the wafer are cleaned with an organic compound cleaning liquid, the organic compound cleaning liquid will remain on the back of the wafer, and the photocatalyst vapor is sprayed on the wafer through a spray device so that the photocatalyst covers the back of the wafer, and then the back of the wafer is irradiated with light containing ultraviolet light through the illumination part of the illumination device to activate the photocatalyst, so as to decompose the organic compounds on the back of the wafer and oxidize them into carbon dioxide and water, thereby completely removing the organic pollutants. Through the synergistic effect of the photocatalyst and the illumination device, the organic compound cleaning liquid residue on the back of the wafer is effectively removed, watermarks are avoided from forming during the drying process, which affects the subsequent process, and the cleanliness of the back of the wafer is ensured, thereby improving the yield and quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is an overall schematic diagram of the wafer cleaning device disclosed by the present invention; Figure 2 A schematic diagram of a spray device being arranged above a positioning device; Figure 3 A schematic diagram of the configuration of the illumination device on the positioning device; Figure 4 A schematic diagram of forming a mounting cavity for a support plate; Figure 5 is a schematic diagram of a lighting device, wherein the support plate is omitted; Figure 6 For along Figure 2 Schematic diagram of the shell and insulation unit cut along the AA axis; Figure 7is a schematic diagram of the second gear of the transmission plate meshing with the first gear of the positioning column; Figure 8 A schematic diagram of an elastic member with two ends respectively connected to a mounting column and a limiting portion; Fig. 9 Construct a schematic diagram of the connecting portion for the connecting plate. DETAILED DESCRIPTION

[0020] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these embodiments are all within the scope of protection of the present invention.

[0021] It is particularly important to note that in the following embodiments, the term "axial" refers to Figure 3 The direction indicated by the central axis P. The term "longitudinal direction" refers to a direction parallel to the axial direction.

[0022] Please refer to Figures 1 to 9 A specific implementation of a wafer cleaning apparatus 100 is disclosed.

[0023] Ginseng Figures 1 to 5 As shown, in this embodiment, the wafer cleaning equipment 100 includes: a positioning device 1 for holding the wafer 200 in a horizontal posture and driving the wafer 200 to rotate axially, a spraying device 2 for spraying photocatalyst vapor onto the wafer 200, and an illumination device 3; the illumination device 3 is configured on the positioning device 1 and forms an illumination portion (not marked) exposed to the back side of the wafer (not marked), the illumination portion irradiates light containing ultraviolet rays to the back side of the wafer to activate the photocatalyst, and the photocatalyst removes organic compounds on the back side of the wafer.

[0024] The positioning device 1 holds the wafer in a horizontal posture and drives the wafer to rotate axially, and an organic compound cleaning liquid (e.g., SC-1, Standard Clean 1) is sprayed on the surface and / or back of the wafer through an external cleaning component (not shown) to clean the wafer. After the surface and / or back of the wafer are cleaned with the organic compound cleaning liquid, the organic compound cleaning liquid will remain on the back of the wafer. The positioning device 1 stops driving the wafer to rotate, and then a photocatalyst (e.g., titanium dioxide, ) vapor so that the photocatalyst covers the back of the wafer, and then the light containing ultraviolet light (UV) is irradiated to the back of the wafer through the illumination unit of the illumination device 3 to activate the photocatalyst. Specifically, the ultraviolet light excites the photocatalyst to generate electron-hole pairs, which in turn generate free radicals (such as hydroxyl radicals, ·OH), which attack and decompose organic compounds on the back of the wafer through the generated free radicals, oxidizing them into carbon dioxide ( ) and water ( ), thereby completely removing organic pollutants. Through the synergistic effect of the photocatalyst and the illumination device 3, the residual organic compound cleaning solution on the back of the wafer is effectively removed, avoiding the formation of watermarks during the drying process, affecting the subsequent process, and ensuring the cleanliness of the back of the wafer, improving the yield and quality of the wafer. This solves the problem in the prior art that the organic compound cleaning solution will remain on the back of the wafer, and the organic compound will form a watermark on the back of the wafer during the drying process after cleaning. In addition, the wafer cleaning device 100 can reduce the emission of organic compounds and the cost of waste liquid treatment through efficient photocatalytic reaction, which meets environmental protection requirements.

[0025] It should be noted that during the cleaning process of spraying organic compound cleaning liquid on the surface and / or back of the wafer, the lighting device 3 can also be turned on to irradiate the back of the wafer with light containing ultraviolet rays through the lighting part to improve the reaction efficiency of the cleaning liquid, thereby improving the cleaning efficiency.

[0026] Ginseng Figure 5 As shown, the illumination device 3 includes: a parallel backlight source 32, and the parallel backlight source 32 forms an illumination portion on one side facing the back of the wafer, and the back of the wafer is located within the illumination range of the illumination portion. The parallel backlight source 32 forms an illumination portion on one side facing the back of the wafer to ensure that the ultraviolet light is irradiated to the back of the wafer in parallel and evenly, so that each part of the back of the wafer can receive consistent illumination, avoiding differences in cleaning effects caused by uneven illumination. And the uniform illumination distribution can improve the efficiency of the photocatalytic reaction, ensuring that the organic compounds on the back of the wafer are completely decomposed to avoid residue. The parallel backlight source 32 includes a light-carrying plate (not shown), and LED lamp beads (not shown) that are evenly arranged on the light-carrying plate and can emit ultraviolet light. The LED lamp beads are evenly arranged on the light-carrying plate, and each lamp bead can emit ultraviolet (UV) light to ensure that each area on the back of the wafer can receive uniform illumination.

[0027] Ginseng Figure 3 and Figure 4 As shown, the positioning device 1 is constructed with a mounting cavity 10 for accommodating the illumination device 3 and exposing the illumination portion to the back of the wafer. The mounting cavity 10 can provide a fixed installation space for the illumination device 3, ensuring that the illumination device 3 will not shift during the operation of the device. The mounting cavity 10 can also ensure that the illumination portion is accurately aligned with the back of the wafer, so that the light is evenly and effectively irradiated to the back of the wafer.

[0028] Ginseng Figure 5 As shown, the illumination device 3 also includes: a cooling unit 33 and a control unit 34 which are arranged in sequence from top to bottom along the axial direction, and the cooling unit 33 is clamped between the parallel backlight source 32 and the control unit 34. The intensity of the light emitted by the illumination part is adjusted by the control unit 34. According to the requirements of the cleaning process, the control unit 34 can dynamically adjust the light intensity to provide appropriate illumination intensity to adapt to different cleaning conditions. And the cooling unit 33 is controlled by the control unit 34 to maintain the temperature stability of the parallel backlight source 32 through heat dissipation or cooling technology, prevent the parallel backlight source 32 from overheating due to long-term operation, avoid the performance degradation or damage of the LED lamp beads due to excessive temperature, and extend the service life of the parallel backlight source 32. By stabilizing the temperature of the LED lamp beads, it is helpful to optimize the light output of the LED lamp beads, ensure the intensity and stability of the ultraviolet light, and improve the efficiency of the photocatalytic reaction. And the cooling unit 33 can reduce the thermal stress of the LED lamp beads, avoid the change of light output caused by temperature fluctuations, and ensure the uniformity and consistency of the illumination. The cooling unit 33 not only cools the parallel backlight source 32, but also protects the control unit 34 below to prevent high temperature from affecting the normal operation of the control unit 34.

[0029] Ginseng Figure 5 As shown, the illumination device 3 further includes: a protective plate 35 disposed on the top of the parallel backlight source 32 and spaced a certain distance from the wafer 200. The protective plate 35 can prevent pollutants (such as dust, cleaning droplets, etc.) generated during the cleaning process from directly contacting the parallel backlight source 32, so as to protect the light source from contamination and extend its service life. In order to ensure the effective transmission of ultraviolet light, the material of the protective plate 35 needs to have a good transmittance to ultraviolet light, and materials such as quartz glass or borosilicate glass can be selected.

[0030] Ginseng Figure 2 and Figure 6 As shown, the spray device 2 includes: a shell 21 arranged above the positioning device 1, a spray pipe 22 penetrating the shell 21 to spray photocatalyst steam to the wafer, and a heat preservation unit 23 arranged inside the shell 21. By arranging the shell 21 above the positioning device 1, since the quality of steam is higher than that of air, the spray pipe 22 is from top to bottom (such as Figure 6The photocatalyst vapor is sprayed on the wafer (in the direction indicated by the arrow J5 in the middle), and the photocatalyst vapor naturally descends and diffuses to the back of the wafer to cooperate with the illumination device 3 to remove the residual organic compounds on the back of the wafer. Exemplarily, the spray pipe 22 can be configured as a multi-point nozzle to ensure that the photocatalyst vapor is evenly distributed and avoid uneven local coverage on the back of the wafer. The photocatalyst vapor in the spray pipe 22 can be assisted by the insulation unit 23 to ensure that the temperature of the photocatalyst vapor is within the optimal range to avoid temperature fluctuations affecting the decomposition effect. In addition, the insulation unit 23 can also maintain the activity of the photocatalyst in the spray pipe 22, making it easier to react with organic pollutants and improving the cleaning effect. It can also ensure the evaporation rate of the photocatalyst vapor so that the photocatalyst can quickly cover the back of the wafer to improve the decomposition efficiency.

[0031] Ginseng Figure 6 As shown, the housing 21 is constructed with a mixing chamber 24 for accommodating the heat preservation unit 23, and the spraying device 2 further includes: a multi-way valve pipe 25 that penetrates the housing 21 to inject photocatalyst steam into the mixing chamber 24 and spray the photocatalyst steam onto the wafer, and sprays the photocatalyst steam injected into the mixing chamber 24 onto the wafer. The multi-way valve pipe 25 can be connected along Figure 6 The photocatalyst vapor is sprayed directly onto the wafer in the direction indicated by the middle arrow J1 to ensure that the photocatalyst vapor quickly diffuses to the back of the wafer; or the multi-way valve pipe 25 is sprayed along the Figure 6 The photocatalyst vapor is injected into the mixing chamber 24 in the direction indicated by the middle arrow J2, and the photocatalyst vapor injected into the mixing chamber 24 is moved along the Figure 6 The spraying method of spraying to the wafer in the direction indicated by the arrow J3 in the middle ensures the activity and uniform distribution of the photocatalyst vapor; it can even be sprayed along Figure 6 The photocatalyst vapor is sprayed directly onto the wafer in the direction indicated by the middle arrow J4, and at the same time, the photocatalyst vapor in the mixing chamber 24 is sprayed onto the wafer together, so as to ensure the sufficient diffusion and high activity of the photocatalyst vapor. The multi-way valve tube 25 can adopt any of the above-mentioned spraying methods or a combination of multiple spraying methods, which is not limited in this embodiment, as long as it can ensure that the photocatalyst vapor diffuses to the back of the wafer. The multi-way valve tube 25 and the photocatalyst vapor in the mixing chamber 24 can be auxiliaryly insulated by the insulation unit 23 to maintain the activity of the photocatalyst in the mixing chamber 24, so that the photocatalyst vapor is in a highly active state when sprayed through the multi-way valve tube 25 and diffused to the back of the wafer, and the rate at which the temperature of the photocatalyst in the mixing chamber 24 decreases is slowed down to improve the cleaning efficiency. In addition, the insulation unit 23 can also keep the temperature in the mixing chamber 24 within the optimal range to prevent the photocatalyst vapor from condensing in the mixing chamber 24 and to prevent the condensed droplets from contaminating the wafer surface.

[0032] Ginseng Figure 6As shown, in this embodiment, the heat preservation unit 23 includes: a heat conducting plate 231, and a heating tube 232 (for example, an electric heating tube) embedded in the heat conducting plate 231. The heating tube 232 is used to transfer heat to the heat conducting plate 231, and the spray pipe 22, the multi-way valve tube 25 and the photocatalyst vapor in the mixing chamber 24 are kept warm through the heat conducting plate 231. The spray device 2 also includes: a pressure regulating valve 26 and a suction pipe 27 that penetrate the shell 21 and connect to the mixing chamber 24. The pressure regulating valve 26 is used to balance the pressure inside and outside the mixing chamber 24 to prevent the pressure in the mixing chamber 24 from being too high or too low, and to ensure the stable spraying of the photocatalyst vapor. The suction pipe 27 is used to extract and recover the residual photocatalyst vapor in the mixing chamber 24 after the organic compound cleaning liquid on the back of the wafer is removed.

[0033] Ginseng Figures 2 to 5 and Figure 7 As shown, the positioning device 1 includes: a support plate 11 with an installation cavity 10, at least three positioning columns 12 arranged around the support plate 11 and passing through the support plate 11 in the longitudinal direction and rotatably connected to the support plate 11, a transmission plate 13 coaxially arranged on the outer side of the bottom of the support plate 11 and axially rotating relative to the support plate 11 to drive the positioning columns 12 to rotate along its axis, a rotating base 14 coaxially arranged at the bottom of the transmission plate 13 and synchronously driving the support plate 11 and the transmission plate 13 to axially rotate, and a control component 15 that drives the transmission plate 13 to axially rotate relative to the support plate 11 and the rotating base 14 to drive the positioning columns 12 to switch between a wafer clamping state and a wafer non-clamping state; a first gear 121 is formed on the outer periphery of the bottom of the positioning column 12, and a second gear 135 is constructed at the edge of the transmission plate 13 to mesh with the first gear 121 to drive the positioning column 12 to rotate along its axis. The control assembly 15 drives the transmission disk 13 to rotate axially relative to the support disk 11 and the rotating base 14, and the first gear 121 is meshed with the second gear 135 to drive the positioning column 12 to rotate along its axis, thereby driving the positioning column 12 to switch between a wafer clamping state and an unclamped wafer state. After the positioning column 12 clamps the wafer, the rotating base 14 synchronously drives the support disk 11 and the transmission disk 13 to rotate axially to maintain the stability of the wafer during the cleaning process.

[0034] Ginseng Figure 7 and Figure 8As shown, the rotating base 14 protrudes toward the transmission disk 13 to form a mounting column 141, and the transmission disk 13 is constructed with a limiting portion 131 spaced apart from the mounting column 141; the control component 15 includes: an elastic member 151 with two ends respectively connecting the mounting column 141 and the limiting portion 131; the elastic member 151 forms an elastic force on the limiting portion 131 to drive the transmission disk 13 to rotate along a first direction, so as to drive the positioning column 12 to switch from a state of not clamping the wafer to a state of clamping the wafer. The elastic member 151 (for example, a spring) forms an elastic force on the limiting portion 131 to drive the transmission disk 13 to rotate along a first direction (for example, a state of not clamping the wafer). Figure 8 The transmission plate 13 rotates in the direction indicated by the middle arrow Z2, and the second gear 135 engages with the first gear 121 while driving the positioning column 12 to rotate along its axis to switch from a state of not clamping the wafer to a state of clamping the wafer.

[0035] Ginseng Figures 7 to 9 As shown, the transmission disk 13 is constructed with a protrusion 132 that penetrates the rotating base 14 and is recessed to form an arc surface 133. The rotating base 14 is provided with a makeshift groove 142 for the protrusion 132 to rotate axially; the control component 15 also includes: a telescopic unit 152 (for example, a cylinder), a telescopic rod 1521 configured on the telescopic unit 152 and a guide block 154 that moves closer to or away from the arc surface 133 with the telescopic movement of the telescopic rod 1521. The telescopic unit 152 drives the telescopic rod 1521 to extend to drive the guide block 154 to approach the arc surface 133, and the guide block 154 abuts against the arc surface 133 to push the transmission disk 13 to rotate in a second direction opposite to the first direction, so as to drive the positioning column 12 to switch from a wafer clamping state to a wafer unclamping state. The telescopic unit 152 drives the telescopic rod 1521 to extend, so as to drive the guide block 154 to approach the arc surface 133. The guide block 154 abuts against the arc surface 133 to push the transmission plate 13 to move in a second direction (eg, Figure 8 The transmission disc 13 rotates in the direction indicated by the middle arrow Z1, and the transmission disc 13 rotates while the second gear 135 meshes with the first gear 121 to drive the positioning column 12 to rotate in the opposite direction along its axis, so as to switch from the state of clamping the wafer to the state of not clamping the wafer. At the same time, during the rotation of the transmission disc 13 along the second direction, the limiting part 131 is driven to move synchronously, so that the elastic member 151 is stressed and its length changes. When the telescopic unit 152 drives the telescopic rod 1521 to retract to drive the guide block 154 away from the arc surface 133, the telescopic unit 152 restores the length without stress, thereby pulling the limiting part 131 to drive the transmission disc 13 to rotate in the first direction. While the transmission disc 13 rotates, the second gear 135 meshes with the first gear 121 to drive the positioning column 12 to rotate along its axis to switch from the state of not clamping the wafer to the state of clamping the wafer.

[0036] Ginseng Figures 7 to 9As shown, the rotating base 14 includes: a hollow shaft driving motor 143, a connecting plate 145 which is controlled by the driving motor to rotate along the axial direction and fixedly connected to the supporting plate 11, and the connecting plate 145 is constructed with a connecting portion 1451 connected to the output shaft 1431 of the hollow shaft driving motor 143; the transmission plate 13 is constructed with a transmission portion 134 which is sleeved outside the connecting portion 1451 and is rotatably connected to the connecting portion 1451; there is a gap between the supporting plate 11 and the transmission plate 13 and between the connecting plate 145 and the transmission plate 13 for the axial rotation of the transmission plate 13. The connecting plate 145 is constructed with a connecting portion 1451 connected to the output shaft 1431 of the hollow shaft driving motor 143 to ensure that the power of the hollow shaft driving motor 143 is effectively transmitted to the connecting plate 145, so that the connecting plate 145 is controlled by the hollow shaft driving motor 143 to rotate along the axial direction, and the connecting plate 145 is fixedly connected to the supporting plate 11 to ensure that the supporting plate 11 and the connecting plate 145 rotate synchronously. The transmission disc 13 is constructed with a transmission part 134 which is sleeved on the outside of the connecting part 1451 and is rotatably connected to the connecting part 1451. The transmission part 134 and the connecting part 1451 can be rotatably connected via a bearing to ensure that the transmission disc 13 can rotate axially relative to the connecting part 1451. There is a gap between the support disc 11 and the transmission disc 13 for the axial rotation of the transmission disc 13, and there is a gap between the connecting disc 145 and the transmission disc 13 for the axial rotation of the transmission disc 13 to ensure that the transmission disc 13 can rotate freely in the axial direction. The transmission disc 13 is constructed with a limiting part 131 which is spaced apart from the mounting column 141 to ensure that the elastic member 151 has enough space to expand and contract.

[0037] Ginseng Figure 5 and Figure 7 As shown, the wafer cleaning device 100 further includes a mounting frame 5, and the hollow shaft driving motor 143 and the telescopic unit 152 are arranged on the mounting frame 5. When the protrusion 132 is arranged in multiple groups, the telescopic rod 1521 of the telescopic unit 152 is arranged on the annular bracket 155, and the guide block 154 is arranged on the annular bracket 155 and aligned with the protrusion 132 in the longitudinal direction, so that the telescopic rod 1521 is driven to extend by the telescopic unit 152 to drive the annular bracket 155 and the multiple groups of guide blocks 154 arranged on the annular bracket 155 to approach the arc surface 133 of the protrusion 132 at the same time, and the guide block 154 is abutted against the arc surface 133 to push the transmission disk 13 to rotate in the second direction opposite to the first direction. While the transmission disk 13 rotates, it meshes with the first gear 121 through the second gear 135 to drive the positioning column 12 to rotate in the opposite direction along its axis, so as to switch from the state of clamping the wafer to the state of not clamping the wafer.

[0038] Ginseng Figure 1As shown, the wafer cleaning device 100 further includes: a composite chamber device 4 circumferentially arranged outside the positioning device 1 to recover waste gas and waste liquid. The waste gas and waste liquid generated during the wafer cleaning process are recovered by the composite chamber device 4, and after the organic compound cleaning liquid on the back of the wafer is removed, the photocatalyst vapor diffused into the composite chamber device 4 is sucked and recovered by the waste gas recovery device (not shown) connected to the composite chamber device 4. The composite chamber device 4 in this embodiment is a prior art and will not be described in detail here.

[0039] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0040] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0041] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer cleaning device, characterized in that: include: A positioning device for holding the wafer in a horizontal posture and driving the wafer to rotate axially, a spraying device for spraying photocatalyst vapor onto the wafer, and an illumination device; The illumination device is arranged on the positioning device and forms an illumination part exposed to the back side of the wafer. The illumination part irradiates the back side of the wafer with light containing ultraviolet rays to activate the photocatalyst, and the photocatalyst removes the organic compound on the back side of the wafer.

2. The wafer cleaning device according to claim 1, characterized in that: The illumination device comprises: a parallel backlight source, wherein a side of the parallel backlight source facing the back side of the wafer forms the illumination portion, and the back side of the wafer is located within the illumination range of the illumination portion.

3. The wafer cleaning device according to claim 1, characterized in that: The positioning device is configured to form a mounting cavity for accommodating the illumination device and exposing the illumination portion to the back side of the wafer.

4. The wafer cleaning device according to claim 2, characterized in that: The illumination device further comprises: a cooling unit and a control unit which are sequentially arranged from top to bottom along the axial direction, and the cooling unit is clamped between the parallel backlight source and the control unit.

5. The wafer cleaning device according to claim 2, characterized in that: The lighting device further includes: a protection plate disposed on the top of the parallel backlight source and spaced a certain distance from the wafer.

6. The wafer cleaning device according to claim 1, characterized in that: The spray device comprises: a shell arranged above the positioning device, a spray pipe penetrating the shell to spray photocatalyst steam onto the wafer, and a heat preservation unit arranged inside the shell.

7. The wafer cleaning device according to claim 6, characterized in that: The shell is constructed to form a mixing chamber for accommodating the insulation unit, and the spraying device further comprises: a multi-way valve pipe penetrating the shell to inject photocatalyst steam into the mixing chamber and spray the photocatalyst steam onto the wafer, and spraying the photocatalyst steam injected into the mixing chamber onto the wafer.

8. The wafer cleaning device according to claim 3, characterized in that: The positioning device comprises: a support plate with the mounting cavity formed therein, at least three positioning posts arranged around the support plate and penetrating the support plate in the longitudinal direction and rotatably connected to the support plate, a transmission plate coaxially arranged at the outer side of the bottom of the support plate and axially rotating relative to the support plate to drive the positioning posts to rotate along their axes, a rotating base coaxially arranged at the bottom of the transmission plate and synchronously driving the support plate and the transmission plate to axially rotate, and a control component driving the transmission plate to axially rotate relative to the support plate and the rotating base to drive the positioning posts to switch between a wafer clamping state and a wafer non-clamping state; A first gear is formed on the outer periphery of the bottom of the positioning column, and a second gear is constructed at the edge of the transmission plate to mesh with the first gear to drive the positioning column to rotate along its axis.

9. The wafer cleaning device according to claim 8, characterized in that: The rotating base protrudes toward the transmission plate to form a mounting post, and the transmission plate is configured with a limiting portion spaced apart from the mounting post; The control component includes: an elastic member with two ends respectively connecting the mounting column and the limiting portion; the elastic member forms an elastic force on the limiting portion to drive the transmission disk to rotate along a first direction, so as to drive the positioning column to switch from a state of not clamping the wafer to a state of clamping the wafer.

10. The wafer cleaning device according to claim 9, characterized in that: The transmission plate is constructed with a convex block penetrating the rotating base and concavely arranged to form an arc surface, and the rotating base is provided with a clearance groove for the convex block to rotate along the axial direction; The control component also includes: a telescopic unit, a telescopic rod configured on the telescopic unit and moving closer to or away from a guide block on the arc surface as the telescopic rod telescopes, the telescopic unit drives the telescopic rod to extend to drive the guide block to approach the arc surface, the guide block abuts against the arc surface to push the transmission disk to rotate in a second direction opposite to the first direction, so as to drive the positioning column to switch from a state of clamping the wafer to a state of not clamping the wafer.

11. The wafer cleaning device according to claim 10, characterized in that: The rotating base includes: a hollow shaft driving motor, a connecting plate which is controlled by the driving motor to rotate axially and fixedly connected to the supporting plate, the connecting plate being constructed with a connecting portion connected to the output shaft of the hollow shaft driving motor; the transmission plate being constructed with a transmission portion which is sleeved on the outside of the connecting portion and is rotatably connected to the connecting portion.

12. The wafer cleaning device according to claim 1, characterized in that: The wafer cleaning device further comprises: a composite chamber device circumferentially arranged outside the positioning device to recover waste gas and waste liquid.

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