Infrared heating detinning device for waste circuit board

Abstract

The invention discloses an infrared heating detinning device for waste circuit boards, which belongs to the technical field of metal recovery and comprises a detinning drum, the detinning drum comprises a driving drum seat, an infrared heating drum and a dynamic conveying frame are arranged at one end of the driving drum seat, and a static conveying frame is arranged on the inner wall of the other end of the driving drum seat. A slag discharging mechanism is arranged at the bottom of the infrared heating cylinder; according to the invention, the sealed continuous production of the waste circuit board is realized, the waste heat preheating is utilized to improve the detinning efficiency, the detinning rotary drum and infrared heating are combined to dynamically rotate to promote tin melting and element falling, the vibrating screen and the guide plate screen tin, the vibration and high-temperature blowing cleaning of the element are realized, and the external air draft and temperature control filter pipe accurately controls the solidification and remelting of the tin; the air injection cushion and the sealing arc plate guarantee sealing and cleaning, the whole process is efficient in detinning, elements are separated, and energy and production efficiency are improved.

Description

Technical Field

[0001] The invention relates to the technical field of metal recovery, in particular to an infrared heating detinning device for waste circuit boards. Background Art

[0002] With the continuous increase of electronic waste, the demand for recycling of waste circuit boards is becoming increasingly urgent. Infrared heating detinning technology provides an efficient and environmentally friendly solution for the recycling of waste circuit boards. It has broad application prospects and can be applied to electronic waste recycling companies, metal smelting companies and other fields, contributing to resource recycling and environmental protection.

[0003] In conjunction with the above content, it should be noted that: the Chinese patent with the announcement number CN218396353U discloses an automatic detinning device for circuit boards, which uses automatic conveying, automatic heating and automatic solder stripping to realize automatic detinning of circuit boards in an integrated manner. However, during the opening and closing of the material replacement, the above patent is not only prone to cause a large amount of heat waste, but also easily causes some of the heated harmful gases to diffuse into the surrounding processing environment;

[0004] In view of the above technical defects, a solution is now proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a device for removing tin by infrared heating of waste circuit boards to solve the problems raised.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: an infrared heating detinning device for waste circuit boards, comprising a detinning rotary drum, the detinning rotary drum comprising a driving drum seat, one end of the driving drum seat is provided with an infrared heating drum and a dynamic conveying frame, and the inner wall of the other end of the driving drum seat is provided with a static conveying frame, and the bottom of the infrared heating drum is provided with a slag unloading mechanism;

[0007] The slag unloading mechanism comprises a sealing arc plate and a side frame, and a vibrating screen is arranged on the inner wall of the side frame, a tin separation box is arranged on the outer wall of the side frame close to the vibrating screen, and a temperature-controlled filter tube is arranged inside the tin separation box;

[0008] The outer periphery of the static conveying frame is provided with a heat-insulating cover, and partition plates are symmetrically provided at both ends of the heat-insulating cover, and a sealing plate inserted into the static conveying frame is provided on the inner wall of the partition plate.

[0009] Furthermore, the infrared heating tube is sleeved on the outer side of one end of the driving tube seat, and a rotating tube frame is arranged on the inner side of one end of the driving tube seat, an outer fine mesh cover is arranged on the inner wall of the infrared heating tube, and a movable arc plate is slidably arranged on the bottom tube wall of the infrared heating tube.

[0010] Furthermore, the inner wall of the rotating drum frame is connected to the outer wall of the dynamic conveying frame, and the end surface of the rotating drum frame is provided with an inner coarse mesh drum covering the outer periphery of the dynamic conveying frame, and the driving drum seat is provided with a rotating motor connected to the rotating drum frame.

[0011] Furthermore, a rotary cylinder connected to the outer wall of the infrared heating tube is arranged on the top of the sealing arc plate, a jet pad is arranged on the inner wall of the bottom of the sealing arc plate, and vibration motors connected to the vibrating screen are arranged on the outer walls at both ends of the side frame.

[0012] Furthermore, an air outlet is arranged on a side of the tin separation box away from the vibrating screen, and a guide plate is arranged on the bottom inner wall of a side of the tin separation box close to the vibrating screen.

[0013] Furthermore, a tin collecting groove is provided in a central depression at the bottom of the tin separation box, and a collecting frame connected to the tin collecting groove is provided at the bottom of the tin separation box.

[0014] Furthermore, an inner return pipe is arranged at the inner center of the temperature control filter tube, an outer heat transfer pipe is arranged on the outer periphery of the inner return pipe, a plurality of groups of heat transfer needles are arranged on the outer wall of the outer heat transfer pipe, the bottom of the temperature control filter tube is inclined toward the guide plate, and the plurality of groups of temperature control filter tubes are arranged in a staggered manner.

[0015] Furthermore, the heat preservation cover is rectangularly sleeved on the frame of the static conveying frame close to the detinning drum, and a ventilation port is provided on the inner wall of the heat preservation cover close to the middle of the static conveying frame, and the opening of the ventilation port is inclined toward the direction of the detinning drum.

[0016] Furthermore, linear cylinders are provided through the outer walls on both sides of the partition plate, the bottom of the linear cylinders is connected to the sealing plate, and notches are provided on both sides of the sealing plate to match the internal frame of the static conveying frame.

[0017] The beneficial effects of the present invention are:

[0018] 1. The present invention fixes the waste circuit boards on a static conveyor rack through a clamp, and uses a partition plate and a heat preservation cover in conjunction with the static conveyor rack structure to ensure that each group of circuit boards forms a sealed environment before entering the detinning area. At the same time, the static conveyor rack continuously provides circuit boards for subsequent processing to achieve continuous production, and guides the high-temperature waste heat generated during the detinning process for internal circulation to preheat the subsequent circuit boards in advance, thereby improving the overall detinning processing efficiency of the waste circuit boards and reducing the waste of high-temperature heat.

[0019] 2. The present invention uses a detinning drum and an infrared heating drum to perform surrounding heating on waste circuit boards, and rotates with a dynamic conveyor frame to promote the melting of tin and the shedding and interception of electronic components. Subsequently, the tin is collected, screened and drained through a vibrating screen and a guide plate. On the vibrating screen, the electronic components are further vibrated and blown with high-temperature air to remove residual tin and complete separation.

[0020] 3. The present invention controls the temperature of hot air through external exhaust equipment and temperature-controlled filter tubes to ensure that the tin is solidified and re-melted and collected at an appropriate temperature. The coordinated operation of the jet pad and the sealing arc plate not only ensures the sealing of the processing area, but also realizes the cleaning and discharge of electronic components. The whole process realizes the efficient detinning of waste circuit boards and the clean separation of electronic components. At the same time, the internal heat cycle and the external heat cycle are used to improve the energy utilization rate and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a three-dimensional diagram of the overall structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the unfolded structure of the dynamic conveyor frame and the static conveyor frame of the present invention;

[0024] Figure 3 It is a structural schematic diagram of the detinning drum of the present invention;

[0025] Figure 4 It is a cross-sectional structural schematic diagram of the detinning drum of the present invention;

[0026] Figure 5 It is a structural schematic diagram of the slag unloading mechanism of the present invention;

[0027] Figure 6 It is a schematic diagram of the internal structure of the slag unloading mechanism of the present invention;

[0028] Figure 7 It is a schematic diagram of the internal structure of the tin separation box of the present invention;

[0029] Figure 8 It is a structural schematic diagram of the temperature-controlled filter tube of the present invention;

[0030] Fig. 9 It is a schematic diagram of the internal structure of the heat-insulating cover and the partition plate of the present invention.

[0031] Figure numerals: 1. detinning drum; 101. driving drum seat; 102. infrared heating drum; 103. outer fine mesh cover; 104. inner coarse mesh drum; 105. jet arc plate; 106. rotating drum frame; 2. heat preservation cover; 201. ventilation port; 3. partition plate; 301. linear cylinder; 302. sealing plate; 4. slag unloading mechanism; 401. rotary cylinder; 402. sealing arc plate; 403. jet pad; 404. vibrating screen; 405. side frame; 406. vibration motor; 5. dynamic conveying frame; 6. tin separation box; 601. air outlet; 602. temperature control filter tube; 603. guide plate; 604. tin collecting trough; 605. collecting frame; 606. inner return pipe; 607. external heat transfer pipe; 608. heat transfer needle; 7. static conveying frame. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] Example 1: Please refer to Figure 1 - Fig. 9 As shown, this embodiment is an infrared heating detinning device for waste circuit boards, including a detinning rotary drum 1, the detinning rotary drum 1 includes a driving cylinder seat 101, an infrared heating cylinder 102 and a dynamic conveying frame 5 are arranged at one end of the driving cylinder seat 101, and a static conveying frame 7 is arranged on the inner wall of the other end of the driving cylinder seat 101, and a slag unloading mechanism 4 is arranged at the bottom of the infrared heating cylinder 102. The waste circuit boards waiting for detinning processing are fixed by an adapter clamp, and the clamp is placed between the static conveying frames 7, and the static conveying frames 7 move them close to the detinning rotary drum 1.

[0034] The infrared heating tube 102 is sleeved on the outer side of one end of the driving tube seat 101, and a rotating tube frame 106 is arranged on the inner side of one end of the driving tube seat 101, an outer fine mesh cover 103 is arranged on the inner wall of the infrared heating tube 102, and a movable arc plate 105 is slidably arranged on the bottom tube wall of the infrared heating tube 102, the inner wall of the rotating tube frame 106 is connected to the outer wall of the dynamic conveying frame 5, and an inner coarse mesh tube 104 covering the outer periphery of the dynamic conveying frame 5 is arranged on the end face of the rotating tube frame 106, and a rotating motor connected to the rotating tube frame 106 is arranged inside the driving tube seat 101.

[0035] After the first group of waste circuit boards are limited and fixed by the dynamic conveyor frame 5, the partition plates 3 at both ends of the detinning drum 1 are closed, forming a cylindrical cavity inside the detinning drum 1, and the infrared heating drum 102 is operated to perform targeted surrounding heating on the internal environment of the cylindrical cavity and the first group of waste circuit boards. At the same time, the rotating motor drives the dynamic conveyor frame 5 to rotate along the rotating drum frame 106 through the coupling, gears and other components, so that the first group of waste circuit boards keeps rotating synchronously;

[0036] The tin connected to the electronic components on the surface of the first group of waste circuit boards is melted by high temperature heating, causing the electronic components to detach from the first group of waste circuit boards under the action of rotational inertia force. The electronic components first contact with the inner coarse mesh cylinder 104 and pass through its mesh holes, and then are intercepted by the outer fine mesh cover 103, slide along the inner wall of the outer fine mesh cover 103 to accumulate in the movable arc plate 105 area, and the melted tin is dispersed on the inner walls of the inner coarse mesh cylinder 104, the outer fine mesh cover 103 and the infrared heating cylinder 102 with inertia, and are gathered in the movable arc plate 105 area under the interference of its own weight and the airflow caused by the rotation disturbance of the dynamic conveyor frame 5.

[0037] When the electronic components on the first group of waste circuit boards have completely fallen off after relaxation due to rotational inertia and high-temperature thermalization, the rotating motor gradually stops rotating, and a propulsion cylinder connected to the movable arc plate 105 is embedded in the inner wall of the bottom of the infrared heating cylinder 102. The propulsion cylinder drives the movable arc plates 105 away from each other, causing the bottom of the cylindrical cavity to be opened, and the electronic components fall onto the vibrating screen.

[0038] Embodiment 2: This embodiment is an infrared heating detinning device for waste circuit boards, including a slag unloading mechanism 4 including a sealing arc plate 402 and a side frame 405, and a vibrating screen 404 is arranged on the inner wall of the side frame 405, and a tin separation box 6 is arranged on the outer wall of the side frame 405 close to the vibrating screen 404, and a temperature-controlled filter tube 602 is arranged inside the tin separation box 6. The collected tin is always kept in liquid state due to the high temperature inside the cylindrical cavity, and drips onto the vibrating screen along the gap between the movable arc plates 105. Due to the inclined installation of the vibrating screen, the liquid tin passes through the vibrating screen and then drips onto the guide plate 603, and is guided by the guide plate 603 to be collected in the tin collecting tank 604.

[0039] A rotary cylinder 401 connected to the outer wall of the infrared heating cylinder 102 is arranged on the top of the sealing arc plate 402, a jet pad 403 is arranged on the inner wall of the bottom of the sealing arc plate 402, and a vibration motor 406 connected to the vibrating screen 404 is arranged on the outer walls of both ends of the side frame 405. The vibration motor 406 drives the vibration screen to operate, so that the accumulated electronic components inside the slag unloading mechanism 4 maintain high-frequency turbulence, and the external exhaust device heats part of the air and guides it along the jet pad 403 to blow toward the vibration screen through the pipe fitting, so that the residual tin on the surface of the electronic components is melted under the influence of the high-temperature air and the heat dissipated from the bottom of the cylindrical cavity, and the exhaust device is connected to the air outlet 601 through the pipe fitting, so that the high-temperature air injected into the vibration screen area is extracted through the tin separation box 6, forming a hot air circulation.

[0040] An air outlet 601 is arranged on the side of the tin separation box 6 away from the vibrating screen 404, a guide plate 603 is arranged on the bottom inner wall of the side of the tin separation box 6 close to the vibrating screen 404, a tin collecting trough 604 is arranged in the center depression at the bottom of the tin separation box 6, and a collecting frame 605 connected to the tin collecting trough 604 is arranged at the bottom of the tin separation box 6.

[0041] When the jet pad 403 stops inputting high-temperature airflow, the sealing arc plate 402 is pulled open briefly by the rotary cylinder 401, so that the accumulated electronic components are cleaned and discharged.

[0042] An inner return pipe 606 is arranged at the inner center of the temperature control filter tube 602, an outer heat transfer pipe 607 is arranged on the outer periphery of the inner return pipe 606, and multiple groups of heat transfer needles 608 are arranged on the outer wall of the external heat transfer pipe 607. The bottom of the temperature control filter tube 602 is inclined toward the guide plate 603, and the multiple groups of temperature control filter tubes 602 are arranged in a staggered manner.

[0043] The tin carried by the hot air through the vibrating screen comes into contact with the temperature-controlled filter tube 602. The external exhaust device inputs cold air into the external heat transfer pipe 607 through the pipe fittings, causing the surface temperature of the temperature-controlled filter tube 602 to drop. When the tin in the hot air contacts the heat-conducting needles 608 on its surface, it adheres and solidifies on its surface. After waiting for the surface detinning of the electronic components to be completed, the airflow input to the jet pad 403 is suspended, and the high-temperature hot air is guided by the external exhaust device into the external transfer pipe, causing its surface to heat up rapidly, causing the solidified tin on its surface to melt again and drip onto the guide plate 603, thereby realizing the collection of the tin.

[0044] Embodiment 3: This embodiment is an infrared heating detinning device for waste circuit boards, including a static conveyor frame 7 whose outer periphery is provided with a heat preservation cover 2, and partition plates 3 are symmetrically provided at both ends of the heat preservation cover 2, and a sealing plate 302 inserted into the static conveyor frame 7 is provided on the inner wall of the partition plate 3. When the first group of waste circuit boards approaches the heat preservation cover 2 area at one end of the detinning drum 1, the partition plate 3 at one end of the heat preservation cover 2 is first opened, and the upper sealing plate 302 is pulled up by the linear cylinder 301 to open the top conveying area of ​​the static conveyor frame 7, and the static conveyor frame 7 moves the first group of waste circuit boards into the heat preservation cover 2.

[0045] The heat preservation cover 2 is rectangular and is sleeved on the frame of the static conveying frame 7 near the detinning drum 1. A ventilation port 201 is arranged on the inner wall of the heat preservation cover 2 near the middle of the static conveying frame 7, and the opening of the ventilation port 201 is inclined toward the direction of the detinning drum 1. Linear cylinders 301 are penetrated on the outer walls of both sides of the partition plate 3. The bottom of the linear cylinder 301 is connected to the sealing plate 302. Notches that are adapted to the internal frame of the static conveying frame 7 are arranged on both sides of the sealing plate 302. After the first group of waste circuit boards entering the heat preservation cover 2 pauses for a short time, the partition plate 3 of the heat preservation cover 2 near one end of the detinning drum 1 is opened, and the static conveying frame 7 transfers the first group of waste circuit boards to the dynamic conveying frame 5. The dynamic conveying frame 5 connects and clamps the first group of waste circuit boards and transports them to the middle area of ​​the detinning drum 1, and the partition plate 3 of the heat preservation cover 2 is closed.

[0046] The static conveyor rack 7 continues to transport the next group of waste circuit boards close to the detinning drum 1, the partition plate 3 at one end of the insulation cover 2 is opened, and the group of waste circuit boards is placed inside the insulation cover 2, and the opened partition plate 3 is closed. The insulation cover 2 cooperates with the partition plate 3 to form a sealed environment in this area of ​​the static conveyor rack 7.

[0047] When the detinning drum 1 is waiting to complete the detinning treatment of the first group of waste circuit boards, the residual high temperature inside the detinning drum 1 is sucked out by the external exhaust device, and connected to the air exchange port 201 through the pipe fitting, and the high-temperature hot air is piped into the sealed environment, and the partition plate 3 of the heat preservation cover 2 near the end of the detinning device is slightly opened, so that the excess air inside the sealed environment is forced to flow back into the detinning device, so as to realize the internal heat circulation;

[0048] When the detinning treatment of the first group of waste circuit boards inside the detinning drum 1 is completed, the dynamic conveyor rack 5 moves the treated circuit boards to the static conveyor rack 7 near the other end of the detinning drum 1, which first opens the partition plate 3 near one end of the detinning drum 1, waits for the circuit boards to completely enter the group of thermal insulation cover 2, and then opens the partition plate 3 at the end away from the detinning drum 1, and the circuit boards are transported to the next step by the static conveyor rack 7.

[0049] In combination with Example 1, Example 2 and Example 3, it can be known that the present invention ensures that a sealed environment is formed for the waste circuit boards before they enter the detinning area through the linkage design of innovative clamp fixation and static conveying frame 7, partition plate 3 and thermal insulation cover 2, thereby achieving continuous production and utilizing the high-temperature waste heat generated during the detinning process for internal circulation preheating to improve the detinning efficiency and reduce heat waste; combined with the surround heating of the detinning drum 1 and the infrared heating drum 102 and the rotation of the dynamic conveying frame 5, the melting of tin and the shedding and interception of electronic components are effectively promoted, and then the vibrating screen and the guide plate 603 cooperate to complete the collection and screening of tin, while the vibration on the vibrating screen and the blowing of high-temperature air further clean the residual tin on the surface of the electronic components to achieve efficient separation.

[0050] In addition, the temperature control of the external exhaust equipment and the temperature-controlled filter tube 602 ensures the precise solidification and re-melting collection of the tin. The intelligent coordination of the jet pad 403 and the sealing arc plate 402 maintains the sealing of the processing area and promotes the smooth discharge of electronic components. This overall process not only realizes the efficient detinning of waste circuit boards and the clean separation of electronic components, but also significantly improves energy utilization and production efficiency through the clever combination of internal and external heat cycles.

[0051] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A device for removing tin from waste circuit boards by infrared heating, comprising a detinning drum (1), characterized in that: The detinning rotary drum (1) comprises a driving drum seat (101), one end of which is provided with an infrared heating drum (102) and a dynamic conveying frame (5), and the inner wall of the other end of the driving drum seat (101) is provided with a static conveying frame (7), and the bottom of the infrared heating drum (102) is provided with a slag unloading mechanism (4); The slag unloading mechanism (4) comprises a sealing arc plate (402) and a side frame (405), and a vibrating screen (404) is arranged on the inner wall of the side frame (405), a tin separation box (6) is arranged on the outer wall of the side frame (405) close to the vibrating screen (404), and a temperature-controlled filter tube (602) is arranged inside the tin separation box (6); The outer periphery of the frame of the static conveying frame (7) is provided with a heat-insulating cover (2), and partition plates (3) are symmetrically arranged at both ends of the heat-insulating cover (2), and a sealing plate (302) inserted into the interior of the static conveying frame (7) is arranged on the inner wall of the partition plate (3).

2. The infrared heating detinning device for waste circuit boards according to claim 1 is characterized in that: The infrared heating tube (102) is sleeved on the outer side of one end of the driving tube seat (101), and a rotating tube frame (106) is arranged on the inner side of one end of the driving tube seat (101), an outer fine mesh cover (103) is arranged on the inner wall of the infrared heating tube (102), and a movable arc plate (105) is slidably arranged on the bottom tube wall of the infrared heating tube (102).

3. The infrared heating detinning device for waste circuit boards according to claim 2 is characterized in that: The inner wall of the rotating drum frame (106) is connected to the outer wall of the dynamic conveying frame (5), and the end surface of the rotating drum frame (106) is provided with an inner coarse mesh drum (104) covering the outer periphery of the dynamic conveying frame (5), and a rotating motor connected to the rotating drum frame (106) is provided inside the driving drum seat (101).

4. The infrared heating detinning device for waste circuit boards according to claim 1 is characterized in that: A rotary cylinder (401) connected to the outer wall of the infrared heating cylinder (102) is arranged on the top of the sealing arc plate (402), an air jet pad (403) is arranged on the inner wall of the bottom of the sealing arc plate (402), and vibration motors (406) connected to the vibration screen (404) are arranged on the outer walls at both ends of the side frame (405).

5. The infrared heating detinning device for waste circuit boards according to claim 1 is characterized in that: An air outlet (601) is provided on a side of the tin separation box (6) away from the vibrating screen (404), and a guide plate (603) is provided on the inner wall of the bottom of a side of the tin separation box (6) close to the vibrating screen (404).

6. The infrared heating detinning device for waste circuit boards according to claim 5 is characterized in that: A tin collecting groove (604) is provided in a concave center at the bottom of the tin separation box (6), and a collecting frame (605) connected to the tin collecting groove (604) is provided at the bottom of the tin separation box (6).

7. The infrared heating detinning device for waste circuit boards according to claim 6 is characterized in that: An inner return pipe (606) is arranged at the center of the temperature control filter tube (602), an outer heat transfer pipe (607) is arranged on the outer periphery of the inner return pipe (606), and multiple groups of heat transfer needles (608) are arranged on the outer wall of the external heat transfer pipe (607). The bottom of the temperature control filter tube (602) is inclined toward the guide plate (603), and the multiple groups of temperature control filter tubes (602) are arranged in a staggered manner.

8. The infrared heating detinning device for waste circuit boards according to claim 1 is characterized in that: The heat-insulating cover (2) is in a rectangular shape and is sleeved on a frame of a static conveying frame (7) close to the detinning drum (1). A ventilation port (201) is provided on the inner wall of the heat-insulating cover (2) close to the middle of the static conveying frame (7), and the opening of the ventilation port (201) is inclined toward the direction of the detinning drum (1).

9. The infrared heating detinning device for waste circuit boards according to claim 1, characterized in that: A linear cylinder (301) is provided through the outer walls on both sides of the partition plate (3), the bottom of the linear cylinder (301) is connected to a sealing plate (302), and notches are provided on both sides of the sealing plate (302) to match the internal frame of the static conveying frame (7).

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