Semiconductor processing device and cavity opening method thereof

Abstract

The invention provides a semiconductor processing device and a cavity opening method thereof. The semiconductor processing device comprises a chamber top cover and a plurality of cavities, wherein the chamber top cover and the cavities form a reaction chamber; the plurality of stacked cavities comprise an upper cavity positioned below the chamber top cover and a lower cavity fixed with a frame of the semiconductor processing device; the semiconductor processing device further comprises a lifting shaft which is arranged on one side of the multiple cavities, and the cavity top cover and the upper cavity are rotatably connected to the lifting shaft. The driving device is used for driving the lifting shaft to drive the chamber top cover to lift or driving the lifting shaft to drive the chamber top cover and the upper cavity to lift together; and the chamber top cover and / or the upper cavity can rotate around the lifting shaft to realize cavity opening. Various cavity opening modes can be achieved through the single-shaft lifting mechanism, the structure is simple, occupied space is reduced, and cost is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductors, and in particular to a semiconductor processing device and a cavity opening method thereof. Background Art

[0002] The semiconductor processing device uses the processing space formed inside the reaction chamber to perform integrated circuit manufacturing related process processing on the semiconductor substrate placed therein. An example reaction chamber includes a chamber body and a chamber cover that can seal the opening of the chamber body; when the semiconductor processing device stops working, the chamber cover can be opened to maintain the parts in the chamber or at the chamber cover. The current mechanism for opening the reaction chamber is complex in structure, occupies a large space, and is costly. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor processing device and a cavity opening method thereof, to design the structure of opening a reaction chamber, to reduce space occupation, and to lower costs.

[0004] In order to achieve the above-mentioned purpose, the present invention provides a semiconductor processing device, including a chamber top cover and a plurality of chambers constituting a reaction chamber, wherein the plurality of chambers are stacked, and the plurality of chambers include an upper chamber located below the chamber top cover and a lower chamber fixed to a frame of the semiconductor processing device, and the semiconductor processing device also includes: a lifting shaft, which is vertically arranged on one side of the plurality of chambers, and the chamber top cover and the upper chamber are rotatably connected to the lifting shaft respectively; and a driving device, for driving the lifting shaft to drive the chamber top cover to rise and fall, or for driving the lifting shaft to drive the chamber top cover and the upper chamber to rise and fall together.

[0005] Optionally, the chamber top cover is rotatably connected to the lifting shaft via a first rotating connection portion configured on one side thereof, the first rotating connection portion is provided with a limiting countersunk hole, the upper portion of the lifting shaft is installed in the limiting countersunk hole and does not move axially relative to the limiting countersunk hole.

[0006] Optionally, the first rotating connection part further includes a bearing, the lifting shaft is provided with a first shoulder, the bearing is arranged between the limiting countersunk hole and the lifting shaft, and the bearing abuts against the first shoulder.

[0007] Optionally, the bearing is a double-row tapered roller bearing, and the upper portion of the lifting shaft is installed with a gap between the top wall of the limiting countersunk hole.

[0008] Optionally, the upper cavity body is detachably connected to the chamber top cover, and the upper cavity body connected to the chamber top cover can be lifted together with the chamber top cover or relatively rotated.

[0009] Optionally, the upper cavity includes a plurality of sub-cavities, the plurality of sub-cavities are stacked and two adjacent sub-cavities are detachably connected.

[0010] Optionally, the chamber top cover and each cavity are provided with a flange to achieve detachable connection.

[0011] Optionally, a shaft sleeve is provided on one side of the upper cavity, the lifting shaft can be slidably inserted into the shaft sleeve, and the shaft sleeve can rotate relative to the lifting shaft.

[0012] Optionally, an oil-free bushing is provided between the shaft sleeve and the lifting shaft.

[0013] Optionally, the upper cavity is rotatably connected to the lifting shaft via a second rotating connection portion configured on one side thereof, and the second rotating connection portion is provided with a through hole, and the lifting shaft is passed through the through hole and can slide relative to the through hole; wherein, the lifting shaft is provided with a second shaft shoulder below the through hole, for further lifting the upper cavity after the lifting shaft lifts the chamber top cover.

[0014] Optionally, the upper cavity includes a plurality of sub-cavities, and the plurality of sub-cavities are arranged in a stacked manner. The second shoulder includes a plurality of second sub-shoulders corresponding to the plurality of sub-cavities, and each of the second sub-shoulders is used to further lift the sub-cavity after the lifting shaft lifts the adjacent chamber top cover or sub-cavity above the sub-cavity.

[0015] Optionally, the lifting shaft is a stepped shaft, and the second shaft shoulder is a step portion of the stepped shaft.

[0016] Optionally, the spline sleeve connected to the lower cavity has a ball groove inside; the lifting shaft is a spline shaft, and a groove is formed on the side thereof;

[0017] A plurality of balls roll in a channel formed by the cooperation of the ball groove and the groove; the lifting shaft is slidably arranged in the spline sleeve.

[0018] The present invention further provides a cavity opening method for a semiconductor processing device, which is applied to any one of the semiconductor processing devices described above, and the cavity opening method comprises:

[0019] The lifting shaft is driven by a driving device to drive the chamber top cover to rise and fall;

[0020] Rotating the chamber top cover around the lifting axis;

[0021] The lifting shaft is driven by a driving device to drive the chamber top cover and the upper chamber body to rise and fall;

[0022] The chamber top cover and / or the upper chamber body are rotated around the lifting axis.

[0023] Optionally, in the semiconductor processing device, the upper cavity body is detachably connected to the chamber top cover; when the cavity is opened by opening the chamber top cover alone, before the lifting shaft lifts the chamber top cover, the connection between the chamber top cover and the upper cavity body is released;

[0024] When the chamber is opened by jointly opening the chamber top cover and the upper chamber body, before the lifting shaft lifts the chamber top cover, the connection between the chamber top cover and the upper chamber body is maintained and the connection between the upper chamber body and the lower chamber is released.

[0025] Optionally, in the semiconductor processing device, the upper cavity is rotatably connected to the lifting shaft via a second rotating connection portion disposed on one side thereof, the second rotating connection portion is provided with a through hole, the lifting shaft is passed through the through hole and can slide relative to the through hole, and the lifting shaft is provided with a second shaft shoulder below the through hole;

[0026] The cavity opening method further comprises:

[0027] After the lifting shaft lifts the chamber top cover, the lifting shaft continues to lift so that the second shaft shoulder abuts against the through hole and lifts the upper cavity.

[0028] Optionally, the chamber top cover is rotated around the lifting axis before or after the upper chamber body is lifted.

[0029] Compared with the prior art, the technical solution of the present invention has at least the following advantages:

[0030] In one example of the present invention, a single-axis lifting mechanism provided in a semiconductor processing device can lift and rotate the chamber top cover individually to open the chamber through a lifting shaft; or, one, two or more sub-cavities of the upper cavity are connected to the chamber top cover and rotatably connected to the same lifting shaft. Driven by the lifting shaft, the sub-cavity can be lifted and rotated along with the chamber top cover to open the cavity.

[0031] In another example of the present invention, the single-axis lifting mechanism provided in the semiconductor processing device can not only lift and rotate the chamber top cover independently, but also enable one, two or more sub-cavities of the upper cavity to be rotated and opened independently; wherein, each sub-cavity is rotatably connected to the same lifting shaft through a configured rotating connection part; the lifting shaft is provided with a corresponding sub-shaft shoulder for each rotating connection part; when the lifting shaft reaches different heights, the sub-shaft shoulder successively abuts against the corresponding rotating connection part to drive the corresponding sub-cavity to lift together, so that the sub-cavity can be rotated and opened independently to meet the corresponding cavity opening requirements.

[0032] The present invention provides a lifting shaft, which is vertically arranged on one side of multiple cavities. The shaft and / or the chamber are designed to realize multiple ways of opening the cavity, thereby reducing the space occupied by the lifting mechanism, effectively simplifying the overall structure and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic structural diagram of a semiconductor processing device including two chambers in Embodiment 1 of the present invention;

[0034] Figure 2 yes Figure 1 A schematic diagram of a semiconductor processing device in which a chamber top cover is lifted separately;

[0035] Figure 3 yes Figure 2 A schematic diagram of a semiconductor processing device with a chamber top cover opened separately;

[0036] Figure 4 yes Figure 1 A schematic diagram of a semiconductor processing device that jointly lifts a chamber top cover and an upper chamber body;

[0037] Figure 5 yes Figure 4 A schematic diagram of a semiconductor processing device in which a chamber top cover and an upper chamber body are opened together;

[0038] Figure 6 is a schematic structural diagram of a semiconductor processing device according to a first embodiment of the present invention including three chambers;

[0039] Figure 7 yes Figure 1 Schematic diagram of the structure of a single-axis lifting mechanism of a semiconductor processing device;

[0040] Figure 8 yes Figure 7 A schematic diagram of the cross-sectional structure of the middle shaft sleeve;

[0041] Fig. 9 is a schematic structural diagram of a semiconductor processing device including two chambers in a second embodiment of the present invention;

[0042] Fig.10 yes Fig. 9 A schematic diagram of a semiconductor processing device with a chamber top cover opened separately;

[0043] Fig.11 yes Fig. 9 Schematic diagram of a semiconductor processing device with the chamber top cover and upper chamber body opened respectively;

[0044] Fig.12 yes Fig. 9 A schematic diagram of a semiconductor processing device in which a chamber top cover and an upper chamber body are opened together;

[0045] Fig.13 yes Fig. 9 A schematic diagram of the side section structure of the middle lifting shaft;

[0046] Fig.14 yes Fig. 9 A schematic diagram of the side cross-section structure of the middle single-axis lifting mechanism when the second shaft shoulder is not in contact with the second bearing;

[0047] Fig.15 yes Fig.14 A schematic diagram of the side section structure of the middle single-axis lifting mechanism when the second shaft shoulder contacts the second bearing;

[0048] Fig.16 is a schematic side cross-sectional structure diagram of a single-axis lifting mechanism when the semiconductor processing device includes three chambers in the second embodiment of the present invention, wherein the second sub-shaft shoulder is not in contact with the second bearing;

[0049] Fig.17 is a schematic structural diagram of a semiconductor processing device including three chambers in a second embodiment of the present invention;

[0050] Fig.18 It is a schematic flow chart of a method for opening a chamber by opening a chamber top cover of a semiconductor processing device in the present invention;

[0051] Fig.19 It is a schematic flow chart of a method for opening a chamber by jointly opening a chamber top cover and an upper chamber body of a semiconductor processing device in the present invention;

[0052] Fig. 20 It is a schematic diagram of the process of respectively lifting the chamber top cover and the upper chamber body in the chamber opening method of the semiconductor processing device in the present invention. DETAILED DESCRIPTION

[0053] The semiconductor processing device has a reaction chamber forming a processing space inside, and performs integrated circuit manufacturing related process processing, such as etching, deposition, epitaxy, etc., on the semiconductor substrate placed in the processing space, but is not limited thereto. The reaction chamber is provided with an air inlet to introduce the gas required for the process into the processing space, and is also provided with an exhaust to exhaust the waste gas. A base is provided in the reaction chamber to support the semiconductor substrate.

[0054] The reaction chamber includes a chamber body and a chamber cover. During operation, the semiconductor processing device closes the opening at the top of the chamber body through the chamber cover. When the device stops working, the chamber cover can be opened to perform various maintenance operations such as cleaning, repairing, adjusting, and replacing the parts located at the chamber body or the chamber cover; or, in some examples, the substrate can be adjusted or replaced through the opening.

[0055] like Figure 1As shown, the semiconductor processing device has a plurality of chambers arranged in a stacked manner, and the plurality of chambers and the chamber top cover 200 cooperate to form a reaction chamber. The plurality of chambers include an upper chamber 300 and a lower chamber 400; the upper chamber 300 is located below the chamber top cover 200 and is detachably connected to the chamber top cover 200; the upper chamber 300 and the lower chamber 400 are also detachably connected; the lower chamber 400 is also fixed to the frame of the semiconductor processing device. During operation of the device, the chamber top cover 200 and the upper chamber 300, and the upper chamber 300 and the lower chamber 400 are respectively connected and kept airtight to form a processing space of the reaction chamber; the base for carrying the substrate is located in the area surrounded by the lower chamber 400.

[0056] In some embodiments, mutually matching flanges are provided at the bottom of the chamber cover 200 and the top of the upper cavity 300, and mutually matching flanges are also provided at the bottom of the upper cavity 300 and the top of the lower cavity 400. The mutually matching flanges can be connected by connecting pieces, thereby forming detachable connections between the chamber cover 200 and the upper cavity 300, and between the upper cavity 300 and the lower cavity 400. Specifically, the connecting piece is a bolt and a matching nut, and a plurality of mounting holes are distributed on the flange, and the bolts are locked by nuts after passing through the corresponding mounting holes on each pair of flanges.

[0057] Taking a semiconductor processing device for SiC epitaxial processing as an example, a SiC (silicon carbide) epitaxial film layer is grown on a wafer at a high temperature of about 1600°C using a chemical vapor deposition process using gases such as monosilane and propane. A tray is provided at the base to carry the wafer, and a rotating mechanism is provided to drive the tray and the wafer to rotate at high speed during the process; a heater is provided at the base to control the temperature of the wafer. A gas shower head is provided at the chamber top cover 200 opposite to the base, which is connected to an external gas source to deliver the gas required for growing the epitaxial film layer to the top of the wafer. An exhaust port is provided at the bottom of the reaction chamber, which is connected to an exhaust device to discharge the waste gas after the process is completed out of the reaction chamber.

[0058] Among them, the upper cavity 300 and the lower cavity 400 are cylindrical structures stacked up and down, each of which is provided with a heater, for example, by heat radiation, to heat the gas transported from the gas shower head to the wafer; in addition, a bushing is correspondingly arranged on the inner side of the heater to prevent the gas from damaging the heater and the inner wall of the cavity; and a wafer removal port is provided at the lower cavity 400. Different control temperatures can be set for the heaters of the upper cavity 300 and the lower cavity 400, and the temperature at the lower cavity 400 is set higher, so that the temperature of the gas can be gradually increased during the transportation process until the temperature reaches the temperature required for epitaxial growth when it reaches the surface of the wafer. A mechanism for suppressing the rise in gas temperature can be set at the chamber top cover 200, such as a component for cooling the gas shower head and / or a reflective component for isolating the heat of the lower heater, to prevent the output gas from reacting near the gas shower head, and to avoid the generation of particles adhering to the gas shower head or each cavity, or falling on the surface of the wafer.

[0059] Embodiment 1

[0060] like Figure 1 to Figure 5 As shown, the semiconductor processing device is provided with a mechanism that can lift and rotate the chamber top cover 200. A lifting shaft 100 is vertically arranged beside the chamber body, and the chamber top cover 200 and the upper chamber body 300 are rotatably connected to the lifting shaft 100. When the chamber top cover 200 is opened, the chamber top cover 200 can rotate around the lifting shaft 100 to expose all or part of the opening of the lower chamber ( Figure 3 ). Driven by the connected driving device, the lifting shaft 100 can rise or fall in the axial direction and drive the chamber top cover 200 to rise or fall; or, the driving device can drive the lifting shaft 100 to rise or fall in the axial direction to drive the chamber top cover 200 and the upper chamber body 300 to rise and fall together.

[0061] In some embodiments, the lifting shaft 100 is located at one side of the plurality of chambers, and the chamber top cover 200 is provided with a first rotating connection portion 210 on the side where the lifting shaft 100 is located, and the first rotating connection portion 210 is rotatably connected to the lifting shaft 100. Figure 7 As shown, the first rotating connection part 210 is provided with a limiting countersunk hole, and the upper part of the lifting shaft 100 is installed in the limiting countersunk hole and does not move axially relative to the limiting countersunk hole. The upper part of the lifting shaft 100 can directly contact the body of the first rotating connection part 210 (such as the top in the limiting countersunk hole), and the chamber top cover 200 is driven to be lifted by lifting the first rotating connection part 210.

[0062] In some embodiments, Figure 7As shown, the first rotating connection part 210 may further include a first bearing 220; the lifting shaft 100 is a stepped shaft, and a first shaft shoulder 110 is provided at the upper part; the first bearing 220 is provided between the limiting counterbore and the lifting shaft 100, and the first bearing 220 abuts against the first shaft shoulder 110. Optionally, the first bearing 220 is a double-row tapered roller bearing; preferably, the upper part of the lifting shaft 100 is installed with a clearance between the top wall of the limiting counterbore.

[0063] In some embodiments, the upper cavity 300 includes a sub-cavity, which is located between the chamber top cover 200 and the lower cavity 400 and is detachably connected to both. When opening the cavity, the connection between the upper cavity 300 and the lower cavity 400 can be released, and the connection between the upper cavity 300 and the chamber top cover 200 can be maintained to achieve common lifting and / or rotation, thereby achieving the cavity opening.

[0064] When the chamber is opened by opening the chamber top cover 200 alone, Figure 2 , Figure 3 As shown, when the lifting shaft 100 rises, it drives the first rotating connecting part 210 (see Figure 7 ) rises, and the first rotating connection part 210 is connected to the top cover 200, so it can drive the chamber top cover 200 to rise separately, forming a certain distance d1 between the chamber top cover 200 and the upper cavity 300 to avoid collision during rotation; after a certain distance d1 is formed between the chamber top cover 200 and the upper cavity 300, the chamber top cover 200 is rotated around the lifting shaft 100, so that the opening of the upper cavity 200 is at least partially exposed to achieve the opening of the cavity; when closing the cavity, the chamber top cover 200 rotates back to the top of the opening of the upper cavity 200, and the chamber top cover 200 descends with the lifting shaft 100 until it is supported by the upper cavity 200, and the openings of each cavity are connected and closed by the chamber top cover 200. Before executing the process, the adjacent components are all sealed and connected to form the processing space of the reaction chamber.

[0065] When the chamber is opened by opening the chamber top cover 200 and the upper chamber body 300 together, the upper chamber body 300 and the chamber top cover 200 are connected to form a first assembly 501 that can be lifted and / or rotated together; Figure 4 , Figure 5 As shown, the lifting shaft 100 rises and drives the first assembly 501 to rise, forming a certain distance d2 between the upper cavity 300 and the lower cavity 400; after a certain distance d2 is formed between the upper cavity 300 and the lower cavity 400, the first assembly 501 rotates around the lifting shaft 100, and the opening of the lower cavity 400 is at least partially exposed to realize the cavity opening.

[0066] In some embodiments, Figure 6As shown, the upper cavity 300 includes two sub-cavities, namely the first sub-cavity 301 and the second sub-cavity 302, both of which are cylindrical structures stacked up and down. The first sub-cavity 301 is located below the chamber top cover 200 and is detachably connected to the chamber top cover 200; the second sub-cavity 302 is located between the first sub-cavity 301 and the lower cavity 400, and is detachably connected to the latter two respectively; the adjacent components are fastened and connected, for example, by bolts passing through corresponding flanges and their matching nuts. Optionally, the first sub-cavity 301 and the second sub-cavity 302 are each provided with a heater for heating the gas, and a bushing for protecting the cavity wall and the heater. The temperature set at the second sub-cavity 302 is higher than the temperature set at the first sub-cavity 301 (but lower than the temperature set at the lower cavity 400), so that the temperature of the gas can be gradually increased during the transportation process.

[0067] The first sub-cavity 301 and the second sub-cavity 302 are disconnected, and the chamber top cover 200 and the first sub-cavity 301 are connected to form a second combination 502 in which the two can be lifted and / or rotated together. Alternatively, the lower cavity 400 and the second sub-cavity 302 are disconnected, and the chamber top cover 200 and the first sub-cavity 301 and the first sub-cavity 301 and the second sub-cavity 302 are connected to form a third combination 503 in which the chamber top cover 200 and the two sub-cavities can be lifted and / or rotated together.

[0068] When the chamber is opened by opening the chamber top cover 200 alone, the lifting shaft 100 rises and drives the chamber top cover 200 to rise alone, forming a certain distance between the chamber top cover 200 and the first sub-chamber 301; after the chamber top cover 200 rotates around the lifting shaft 100, the opening of the first sub-chamber 301 is at least partially exposed. When the chamber is opened by opening the chamber top cover 200 and the first sub-chamber 301 together, the lifting shaft 100 rises and drives the second assembly 502 to rise, forming a certain distance between the first sub-chamber 301 and the second sub-chamber 302; when the second assembly 502 rotates around the lifting shaft 100, the opening of the second sub-chamber 302 is at least partially exposed. When the chamber is opened by jointly opening the two sub-cavities of the chamber top cover 200 and the upper cavity 300, the lifting shaft 100 rises and drives the third assembly 503 to rise, forming a certain distance between the second sub-cavity 302 and the lower cavity 400. When the third assembly 503 rotates around the lifting shaft 100, the opening of the lower cavity 400 is at least partially exposed ( Figure 6 The components shown have not yet been lifted and the spacing between adjacent components is not shown).

[0069] like Figure 7 As shown, when the upper cavity 300 has one or more sub-cavities, each sub-cavity is provided with a corresponding sleeve 310 on the side close to the lifting shaft 100 to strengthen the structure and guide the sub-cavity ( Figure 6 The shaft sleeve 310a corresponding to the first sub-cavity 301 and the shaft sleeve 310b corresponding to the second sub-cavity 302 are shown. Figure 7 The structure of the sleeve 310 is basically the same as that of the lifting shaft 100); the lifting shaft 100 can be slidably inserted into the sleeve 310, and the sleeve 310 can rotate relative to the lifting shaft 100. The sleeve 310 and the corresponding sub-cavity have the same action state: if the sub-cavity is not connected to any combination and does not move with the chamber top cover 200, the sleeve 310 is in a fixed state together with the corresponding sub-cavity, and the lifting shaft 100 moves linearly in the axial direction relative to the sleeve 310; if the sub-cavity belongs to a certain combination and is lifted or lowered with the combination or rotates around the lifting shaft 100, the sleeve 310 is also lifted or lowered with the corresponding sub-cavity or rotates around the lifting shaft 100.

[0070] like Figure 8 As shown, optionally, the sleeve 310 includes a bushing shell 320 fixedly connected to the upper cavity 300, and an oil-free bushing 330 nested in the bushing shell 320, and the lifting shaft 100 can pass through the oil-free bushing 330 so that the oil-free bushing 330 is located between the bushing shell 320 and the lifting shaft 100.

[0071] like Figure 1 , Figure 6 or Figure 7 As shown, the lower cavity 400 is provided with a spline sleeve 410 on one side thereof close to the lifting shaft 100, and the lifting shaft 100 is slidably inserted into the spline sleeve 410, and the lifting shaft 100 can make linear motion in the axial direction relative to the spline sleeve 410. Optionally, a ball groove is provided inside the spline sleeve 410, and the lifting shaft 100 is a spline shaft with a groove provided on the side, and the axial length of the groove can be designed according to the range of the distance that the lifting shaft 100 moves relative to the spline sleeve 410; a plurality of balls roll in the channel formed by the ball groove and the groove to reduce friction.

[0072] For example Figure 2 , Figure 3 , Fig.18 The present invention provides a method for opening a chamber by opening a chamber top cover 200 alone, and the method comprises the following steps:

[0073] Step S1-1, releasing the connection between the chamber top cover 200 and the upper chamber body 300;

[0074] Step S1-2, lifting the chamber top cover 200 by lifting the shaft 100;

[0075] Step S1-3, rotating the chamber top cover 200 around the lifting shaft 100 to reach a preset rotation angle.

[0076] Steps S1-1 to S1-3 are applicable to the case where the upper chamber 300 includes one or more sub-chambers. When there are multiple sub-chambers, before lifting the chamber top cover 200, the connection between the chamber top cover 200 and the first sub-chamber 301 adjacent thereto is released.

[0077] For example Figure 4 , Figure 5 , Fig.19 The semiconductor processing device shown in the figure, the present invention provides a cavity opening method, which realizes the cavity opening by opening the chamber top cover 200 and the upper cavity body 300, including the following steps:

[0078] Step S2-1, maintaining the connection between the chamber top cover 200 and the upper chamber body 300, and releasing the connection between the upper chamber body 300 and the lower chamber body 400;

[0079] Step S2-2, lifting the chamber top cover 200 and the upper chamber body 300 by the lifting shaft 100;

[0080] Step S2-3, rotating the chamber top cover 200 and the upper chamber body 300 around the lifting shaft 100 to reach a preset rotation angle.

[0081] In some embodiments, in step S2-1, the chamber top cover 200 and the upper chamber body 300 are connected to form a first assembly 501 that can be lifted and / or rotated together.

[0082] In some examples of step S2-1, there is no axial spacing between the connected chamber top cover 200 and the upper cavity body 300, and the relative interfaces of the two are in direct contact. In other examples, before step S2-1, a spacing is first formed between the chamber top cover 200 and the upper cavity body 300 in the axial direction, and then the separated chamber top cover 200 and the upper cavity body 300 are fastened and connected by a connecting piece (for example, before step S2-1, the chamber top cover 200 has been lifted a distance by operations similar to steps S1-1 to S1-2, and the chamber top cover 200 can be connected to the upper cavity body 300 at the current position). Taking the use of bolts and nuts as connecting pieces as an example, compared with the two situations of separating the upper cavity body 300 and the chamber top cover 200 from each other and not separating them, when the two are separated, the bolts required for connection are longer, or the bolt length remains unchanged (sufficient to pass through the two separated parts), and the locking position of the nut is adjusted accordingly.

[0083] The cavity opening method corresponding to steps S2 - 1 to S2 - 3 can also be applied to the case where the upper cavity 300 includes a plurality of sub-cavities, and these sub-cavities are connected to each other and to the chamber top cover 200 to form a combination.

[0084] In some embodiments, Figure 6As shown, the upper cavity includes two sub-cavities, and the cavity opening method is realized by jointly opening the chamber top cover 200 and the two sub-cavities of the upper cavity, including:

[0085] Step S3-1, maintaining the connection between the chamber top cover 200 and the first sub-cavity 301 and the connection between the first sub-cavity 301 and the second sub-cavity 302, and releasing the connection between the second sub-cavity 302 and the lower cavity 400; at this time, the chamber top cover 200 and the two sub-cavities form a third combination 503 that can be lifted and / or rotated together;

[0086] Step S3-2, lifting the chamber top cover 200 and the two sub-cavities of the upper cavity by the lifting shaft 100;

[0087] Step S3-3, rotating the chamber top cover 200 and the two sub-cavities of the upper cavity around the lifting shaft 100 to reach a preset rotation angle.

[0088] In step S3-1, there may be no axial spacing between the connected chamber top cover 200 and the first sub-chamber 301, and the relative interfaces of the two are in direct contact; or, the two may be connected to each other after being separated (such as after the lifting shaft 100 drives the chamber top cover 200 to rise a certain distance) (adaptive adjustment is made to the connecting piece if necessary). Similarly, there may be no axial spacing between the two sub-chambers in step S3-1, and they are connected to each other with the relative interfaces in direct contact; or, the two sub-chambers may be connected to each other after being separated (such as after the first sub-chamber 301 rises a certain distance with the chamber top cover 200) (adaptive adjustment is made to the connecting piece if necessary).

[0089] like Figure 6 As shown, when the upper cavity includes two sub-cavities, the semiconductor processing device can also provide another cavity opening method, which is realized by jointly opening the chamber top cover 200 and the first sub-cavity 301 of the upper cavity, including:

[0090] Step S4-1, maintaining the connection between the chamber top cover 200 and the first sub-cavity 301 of the upper cavity, and releasing the connection between the first sub-cavity 301 and the second sub-cavity 302;

[0091] At this time, the chamber top cover 200 and the first sub-chamber 301 form a second assembly 502 that can be lifted and / or rotated together;

[0092] Step S4-2, lifting the chamber top cover 200 and the first sub-chamber 301 by the lifting shaft 100;

[0093] Step S4-3: Rotate the chamber top cover 200 and the first sub-chamber 301 around the lifting shaft 100 to reach a preset rotation angle.

[0094] For the chamber top cover 200 and the first sub-chamber 301 in step S4-1, there may be no axial spacing between the two, and the two may be connected to each other with direct contact at the relative interfaces; or, the two may be connected to each other after being separated (such as after the lifting shaft 100 drives the chamber top cover 200 to rise a certain distance) (adaptive adjustments to the connecting parts may be made if necessary).

[0095] The rotation angle in step S1-3 or S2-3 or S3-3 or S4-3 can be determined according to actual needs. For example, the chamber top cover 200, or any component in the first combination 501, or any component in the second combination 502, or any component in the third combination 503 can be rotated by manual operation directly; however, this is not a limitation on the rotation mode of the chamber top cover 200 or each combination. In other examples, the chamber top cover 200 or the sub-cavity of the upper cavity 300 can be configured with a rotation control component that can automatically rotate around the lifting shaft 100 under user control.

[0096] According to this embodiment, the semiconductor processing device can open the chamber top cover 200 alone or open one or two sub-cavities of the upper chamber 300 together with the chamber top cover 200 through a single-axis lifting mechanism, thereby realizing multiple ways of opening the chamber with a simple structure and operation. When the upper chamber 300 includes a larger number of sub-cavities, each sub-cavity can be optionally connected to the same lifting shaft 100 and connected to the combination where the chamber top cover 200 is located through its corresponding shaft sleeve 310, which can also meet the corresponding chamber opening requirements.

[0097] Embodiment 2

[0098] The semiconductor processing device in this embodiment is different from the first embodiment in that the lifting shaft causes the upper chamber to rise in a different manner. Figure 1 or Figure 6 In the embodiment shown, the upper cavity 300 includes one or more sub-cavities, which are connected to the cavity top cover 200 and are opened together with the cavity top cover 200; Fig. 9 or Fig.17 As shown, in this embodiment, the upper cavity 300 includes one or more sub-cavities, which are lifted and lowered by cooperating with the shoulder of the lifting shaft 600 through the second rotating connection part 340, 340a, 340b. Optionally, in some cases, a connecting piece can be set between the chamber top cover 200 and the upper cavity 300 to achieve the same opening method as in Example 1.

[0099] In this embodiment, a lifting shaft 600 is vertically arranged on one side of the upper cavity 300 and the lower cavity 400; the chamber top cover 200 and the upper cavity 300 are rotatably connected to the lifting shaft 600. The driving device can drive the lifting shaft 600 connected thereto to rise and fall, and drive the chamber top cover 200 to rise and fall through the lifting shaft 600; or, the driving device can drive the lifting shaft 600 to rise and fall, so as to drive the chamber top cover 200 and the upper cavity 300 to rise and fall together.

[0100] See also Figure 13 to Figure 15 As shown, the lifting shaft 600 is a stepped shaft, and a first shaft shoulder 610 is provided at the upper part, and the shaft shoulder 610 can abut against the first rotating connection part 210 (or the first bearing 220 therein), and drive the chamber top cover 200 equipped with the first rotating connection part 210 to lift, and the chamber top cover 200 can rotate around the lifting shaft 600. For other configurations of the chamber top cover 200 and the lower chamber body 400, such as the limiting countersunk hole of the first rotating connection part 210 of the chamber top cover 200, the spline shaft groove of the lifting shaft 600, and the ball groove of the spline sleeve 410 at the lower chamber body 400, etc., please refer to the description in the first embodiment.

[0101] The lifting shaft 600 of this embodiment is further provided with a second shoulder 620 in the middle; the upper cavity 300 is provided with a second rotating connection portion 340 on one side close to the lifting shaft 600; the lifting shaft 600 passes through the through hole opened in the axial direction of the second rotating connection portion 340, and the lifting shaft 600 can slide relative to the second rotating connection portion 340; initially, the second shoulder 620 of the lifting shaft 600 is located below the through hole of the second rotating connection portion 340 ( Fig.14 ), after the chamber top cover 200 is lifted, as the lifting shaft 600 continues to lift, the second shaft shoulder 620 will lift the upper chamber 300 ( Fig.15 ).

[0102] The second rotating connection part 340 further includes a second bearing 350, which is located between the body of the second rotating connection part 340 and the lifting shaft 600; optionally, the second bearing 350 is a double-row tapered roller bearing. When the second shaft shoulder 620 is not in contact with the second bearing 350, the lifting shaft 600 alone lifts the chamber top cover 200 ( Fig.14 ); When the second shoulder 620 abuts against the second bearing 350, the lifting shaft 600 further rises to drive the upper cavity 300 to lift ( Fig.15 ).

[0103] In some embodiments, the upper chamber 300 includes a sub-chamber, which is located between the chamber top cover 200 and the lower chamber 400 and is detachably connected to both. Fig.10As shown, the lifting shaft 600 rises, first driving the chamber top cover 200 to rise separately, so that a certain distance d3 is formed between the chamber top cover 200 and the upper chamber body 300; the chamber top cover 200 rotates around the lifting shaft 600, so that the opening of the upper chamber body 300 is at least partially exposed for opening. Fig.11 As shown, as the lifting shaft 600 continues to rise, when the second shaft shoulder 620 abuts against the second rotating connection part 340 of the upper cavity 300, the lifting shaft 600 can drive the upper cavity 300 to rise and form a certain distance d4 between it and the lower cavity 400; the upper cavity 300 rotates around the lifting shaft 600, so that the opening of the lower cavity 400 is at least partially exposed to realize the cavity opening; at this time, the chamber top cover 200 can also be unscrewed separately. Fig.12 In another example shown, the upper cavity 300 and the chamber top cover 200 can be lifted and rotated together after being connected, so that the opening of the lower cavity 400 is at least partially exposed to realize the cavity opening.

[0104] In some embodiments, when the upper cavity 300 includes a plurality of sub-cavities, each sub-cavity is provided with a corresponding second rotating connection part 340, and the motion state of the second rotating connection part 340 is consistent with the corresponding sub-cavity, and the corresponding sub-cavity is lifted, rotated or kept still. The second shoulder 620 of the lifting shaft 600 includes a plurality of second sub-shoulders corresponding to the plurality of sub-cavities; the lifting shaft 600 is passed through the through holes of each second rotating connection part 340 and can slide relative to each through hole, and each second sub-shoulder is initially located below the through hole of a corresponding second rotating connection part 340; when the adjacent component above a certain sub-cavity (such as the chamber top cover 200 or another sub-cavity) is lifted, as the lifting shaft 600 continues to rise, the sub-cavity can be further lifted by the corresponding second sub-shoulder (for example, when the second sub-shoulder rises to abut against the second bearing 350 of the corresponding second rotating connection part 340, the sub-cavity configured with the second rotating connection part 340 is driven to lift).

[0105] like Fig.17 As shown, the upper cavity 300 includes two sub-cavities, wherein the first sub-cavity 301 is located below the cavity top cover 200 and is detachably connected to the cavity top cover 200; the second sub-cavity 302 is located between the first sub-cavity 301 and the lower cavity 400 and is detachably connected to the latter two; see Fig.16 , the second shoulder 620 of the lifting shaft 600 includes a second sub-shoulder 620a corresponding to the second rotating connection portion 340a of the first sub-cavity 301, and a second sub-shoulder 620b corresponding to the second rotating connection portion 340b of the second sub-cavity 302; Fig.16 The figure shows a state where the second sub-shoulder 620a, 620b is not in contact with the second bearing 350a, 350b.

[0106] In one example, when the lifting shaft 600 rises, it first drives the chamber top cover 200 to rise alone. When a certain distance is formed between the chamber top cover 200 and the first sub-cavity 301, the chamber top cover 200 can be rotated alone to open the cavity; as the lifting shaft 600 continues to rise, when the second sub-shaft shoulder 620a abuts against the second rotating connection part 340a of the first sub-cavity 301, the lifting shaft 600 can drive the first sub-cavity 301 to rise (when a certain interval is formed between the two sub-cavities, the first sub-cavity 301 can be rotated alone to open the cavity); when the second sub-shaft shoulder 620b abuts against the second rotating connection part 340b of the second sub-cavity 302, the lifting shaft 600 can drive the second sub-cavity 302 to rise (when a certain interval is formed with the lower cavity 400 below, the second sub-cavity 302 can also be rotated alone to open the cavity).

[0107] In some embodiments, flanges and connectors are provided between the chamber top cover 200 and the first sub-cavity 301, and between the first sub-cavity 301 and the second sub-cavity 302. After the chamber top cover 200 and the first sub-cavity 301 are connected, they can be lifted and rotated together, so that the opening of the second sub-cavity 302 is at least partially exposed to achieve the cavity opening. Alternatively, after the chamber top cover 200 and the two sub-cavities of the upper cavity 300 are connected, they can be lifted and rotated together, so that the opening of the lower cavity 400 is at least partially exposed to achieve the cavity opening.

[0108] The lifting shaft 600 of this embodiment can meet various different cavity opening requirements when it rises to different heights. One cavity opening method provided by the semiconductor processing device can open the chamber top cover 200 and one or more sub-cavities of the upper cavity 300 respectively.

[0109] In some embodiments, Fig. 20 As shown, the cavity opening method comprises the following steps:

[0110] Step A1, the lifting shaft 600 rises, driving the chamber top cover 200 to lift up separately; at this time, the second shaft shoulder 620 is not in contact with the second rotating connection part 340 of the upper chamber 300;

[0111] Step A2: The lifting shaft 600 continues to rise, so that the second shaft shoulder 620 abuts against the second rotating connection part 340 of the upper cavity 300, so as to drive the upper cavity 300 to rise.

[0112] Among them, after step A1, the chamber top cover 200 can rotate around the lifting shaft 600, and the chamber top cover 200 can be opened alone to implement cavity opening; after step A2, the chamber top cover 200 and the upper cavity body 300 can rotate around the lifting shaft 600 respectively, and both can be opened separately to implement cavity opening.

[0113] like Figures 9 to 12As shown, when the upper cavity 200 includes a sub-cavity, the cavity opening method includes the following steps:

[0114] Step S5-0, initial stage, the lifting shaft 600 is at an initial height ( Fig. 9 ); The second rotating connection portion 340 of the upper cavity 300 is located above the second shoulder 620 ( Fig.14 ).

[0115] Step S5-1, the lifting shaft 600 rises, driving the chamber top cover 200 to be lifted separately; the second shaft shoulder 620 does not lift the second rotating connecting part 340, and the upper chamber 300 remains stationary.

[0116] Step S5-2: When the lifting shaft 600 continues to rise to form a certain spacing distance d3 between the chamber top cover 200 and the upper chamber body 300 (the lifting shaft 600 is at a first height higher than the initial height), the chamber top cover 200 is at a position where it can be opened independently ( Fig.10 ).

[0117] Step S5-3, the lifting shaft 600 continues to rise until the second shaft shoulder 620 contacts the second rotating connection portion 340 of the upper cavity 300 (the lifting shaft 600 is at a second height higher than the first height), and the lifting shaft 600 drives the upper cavity 300 to rise.

[0118] Step S5-4, the lifting shaft 600 drives the upper cavity 300 to continue to lift until a certain spacing distance d4 is formed between the upper cavity 300 and the lower cavity 400. The lifting shaft 600 is at a third height higher than the second height (at the first height, the upper cavity 300 and the chamber top cover 200 are already separated), and the upper cavity 300 is currently in a position where it can be opened independently.

[0119] Among them, from step S5-2, the chamber top cover 200 in the independent open position can be operated to rotate around the lifting shaft 600 to open the chamber. From step S5-4, at any time, the upper cavity body 300 in the independent open position can be operated to rotate around the lifting shaft 600 to open the chamber. The rotation of the chamber top cover 200 and the upper cavity body 300 is independent of each other, and the rotation angles can be the same or different. Of course, according to the needs of the actual application, even if they have risen to their respective independent open positions, the chamber top cover 200 and the upper cavity body 300 may not rotate.

[0120] In the embodiment where a flange and a connector are provided between the chamber top cover 200 and the upper chamber body 300, before step S5-1, ensure that the connection between the chamber top cover 200 and the upper chamber body 300 is released. In these embodiments, the upper chamber body 300 and the chamber top cover 200 can be connected to form a first assembly 510 that can rotate and / or lift together. In one example, before step S5-3 in which the second rotating connection part 340 of the upper chamber body 300 is lifted by the second shoulder 620, the first assembly 510 is formed and lifted and rotated in accordance with the method of steps S2-1 to S2-3 (with or without a gap between the upper chamber body 300 and the chamber top cover 200); during the process of the chamber top cover 200 being lifted, the upper chamber body 300 is lifted by the connector), and as the first assembly 510 rotates and continues to lift, the second rotating connection part 340 of the upper chamber body 300 will not contact the second shoulder 620. In another example, after step S5-3, the upper cavity body 300 and the chamber top cover 200 may be connected to form a first assembly 510 (and the distance d3″ formed since step S5-2 is maintained, d3″≥d3, see Fig.12 , which can be adjusted adaptively according to the length of the connecting piece or the locking position), the upper cavity 300 is not only lifted up by the driving force of the connecting piece, but the second rotating connecting part 340 of the upper cavity 300 is also lifted up by the corresponding second shoulder 620; when the first combination 510 rotates, the second rotating connecting part 340 is also supported by the corresponding second shoulder 620.

[0121] Figure 16-17 In the embodiment, the upper cavity 300 includes two sub-cavities; the cavity opening method includes the following steps:

[0122] Step S6-0, initial stage, the lifting shaft 600 is at an initial height; the second rotating connecting portion 340a of the first sub-cavity 301 of the upper cavity 300 is located above a corresponding second sub-shoulder 620a and does not contact the second sub-shoulder 620a.

[0123] Step S6-1, the lifting shaft 600 rises, driving the chamber top cover 200 to rise independently; at this time, the lifting shaft 600 slides relative to the second rotating connection part 340a of the first sub-chamber 301, and the second sub-shaft shoulder 620a does not lift the second rotating connection part 340a, and the first sub-chamber 301 remains stationary.

[0124] Step S6-2: When the lifting shaft 600 continues to rise until a certain distance is formed between the chamber top cover 200 and the first sub-chamber 301 (the lifting shaft 600 is at a first height higher than the initial height), the chamber top cover 200 is in a position that can be opened independently.

[0125] Step S6-3, the lifting shaft 600 continues to rise until the corresponding second sub-shaft shoulder 620a contacts the second rotating connection portion 340a of the first sub-cavity 301 (the lifting shaft 600 is at a second height higher than the first height), and the lifting shaft 600 drives the first sub-cavity 301 to rise.

[0126] Step S6-4, the lifting shaft 600 drives the first sub-cavity 301 to continue to lift until a certain spacing distance is formed between the first sub-cavity 301 and the second sub-cavity 302, the lifting shaft 600 is at a third height higher than the second height (at the first height, the first sub-cavity 301 and the chamber top cover 200 are already separated), and the first sub-cavity 301 is currently in a position where it can be opened independently.

[0127] Step S6-5, the lifting shaft 600 continues to rise until the corresponding second sub-shaft shoulder 620b contacts the second rotating connection portion 340b of the second sub-cavity 302 (the lifting shaft 600 is at a fourth height higher than the third height), and the lifting shaft 600 drives the second sub-cavity 302 to rise.

[0128] Step S6-6, the lifting shaft 600 drives the second sub-cavity 302 to continue to lift until a certain spacing distance is formed between the second sub-cavity 302 and the lower cavity 400, the lifting shaft 600 is at a fifth height higher than the fourth height (at the third height, the first sub-cavity 301 and the second sub-cavity 302 are already separated), and the second sub-cavity 302 is currently in a position where it can be opened independently.

[0129] For the above-mentioned cavity opening method, during the lifting process from step S6-1 to S6-6, the upper part of the lifting shaft 600 always drives the chamber top cover 200 to lift, and the lower cavity 400 is always fixed. From step S6-2, at any time, the chamber top cover 200 in the independent opening position can be operated to rotate around the lifting shaft 600 to open the cavity. From step S6-4, at any time, the first sub-cavity 301 in the independent opening position can be operated to rotate around the lifting shaft 600 to open the cavity. From step S6-6, at any time, the second sub-cavity 302 in the independent opening position can be operated to rotate around the lifting shaft 600 to open the cavity. The rotations of the chamber top cover 200, the first sub-cavity 301, and the second sub-cavity 302 are independent of each other; the rotation angles of adjacent components can be the same or different. Of course, according to the needs of actual application, even if they have risen to their respective independent open positions, the chamber top cover 200, the first sub-cavity 301, and the second sub-cavity 302 may not rotate.

[0130] In the embodiment where flanges and connectors are provided between the chamber top cover 200 and the first sub-cavity 301, and between the first sub-cavity 301 and the second sub-cavity 302, at least the connection between the chamber top cover 200 and the first sub-cavity 301 is released before step S6-1. Before step S6-3, ensure that the connection between the first sub-cavity 301 and the second sub-cavity 302 is released; before step S6-5, ensure that the connection between the second sub-cavity 302 and the lower cavity 400 is also released. In these embodiments, it is also possible to form a combination by connecting multiple components to each other, and rotate the combination around the lifting shaft 600 to open the cavity (the components in the combination rotate at the same angle). It can be understood that by lifting to a suitable height, a sufficient spacing distance is formed between a certain combination and the cavity below it, so that collision with the cavity below during rotation can be avoided.

[0131] For example, the first sub-cavity 301 and the chamber top cover 200 can be connected to form a second assembly 520 that can rotate and / or lift together. In one example, the second assembly 520 is formed before step S6-3 in which the second rotating connection portion 340a is lifted by the second sub-shoulder 620a, and the second assembly 520 is lifted and rotated in accordance with the method of steps S4-1 to S4-3 (with or without a gap between the first sub-cavity 301 and the chamber top cover 200; the first sub-cavity 301 is lifted by the connecting member between the two); then, when the second assembly 520 rotates and continues to lift, the second rotating connection portion 340a of the first sub-cavity 301 will not contact the corresponding second sub-shoulder 620a. In another example, the first sub-cavity 301 and the chamber top cover 200 are connected to form a second combination 520 after step S6-3 (maintaining the spacing formed since step S6-2, and being able to adapt to the length of the connecting piece or the locking position); then, when the second combination 520 rotates and continues to lift, the second rotating connection portion 340a of the first sub-cavity 301 is supported by the corresponding second sub-shoulder 620a.

[0132] The first sub-cavity 301 and the second sub-cavity 302 can be connected to form a fourth combination that can rotate and / or lift together. In one example, the fourth combination can be formed between steps S6-3 and S6-5 (with or without a gap between the sub-cavities), the second sub-shoulder 620a can lift the second rotating connection part 340a of the first sub-cavity 301, and the connecting piece between the two sub-cavities drives the second sub-cavity 302 to lift, then, when rotating and continuing to lift with the fourth combination, the second rotating connection part 340a of the first sub-cavity 301 is supported by the second sub-shoulder 620a, and the second rotating connection part 340b does not contact the second sub-shoulder 620b. In another example, after step S6-5 in which the second rotating connection portion 340b is lifted by the second sub-shoulder 620b, the first sub-cavity 301 and the second sub-cavity 302 are connected to form a fourth combination (maintaining the distance between the two since step S6-4); then, when rotating and continuing to be lifted with the fourth combination, the second rotating connection portions 340a and 340b of the two sub-cavities can be supported by the corresponding second sub-shoulders 620a and 620b, respectively.

[0133] The chamber top cover 200 and the two sub-cavities 301 and 302 can also be connected to form a third combination 530 that can be rotated and / or lifted together (with or without gaps between adjacent components) with reference to steps S3-1 to S3-3. During the lifting of the chamber top cover 200, the third combination 530 is lifted together at least by the connecting parts between the adjacent components. If, when the third combination 530 is formed, a certain second rotating connection part 340a / 340b has been lifted by the corresponding second sub-shoulder 620a / 620b, it can be supported by the corresponding second sub-shoulder 620a / 620b when the third combination 530 rotates and continues to be lifted. On the contrary, if, when the third combination 530 is formed, a certain second rotating connection part 340a / 340b has not been lifted by the corresponding second sub-shoulder 620a / 620b, it cannot be supported by the corresponding second sub-shoulder 620a / 620b when the third combination 530 rotates or continues to be lifted.

[0134] According to this embodiment, the semiconductor processing device can open the chamber top cover 200 alone through a single-axis lifting mechanism, or open one or two sub-cavities of the upper cavity 300 together with the chamber top cover 200, or further open one or two sub-cavities of the upper cavity 300 alone, thereby realizing multiple ways of opening the cavity with a simple structure and operation.

[0135] When the upper cavity 300 includes a larger number of sub-cavities, optionally, each sub-cavity can be rotatably connected to the same lifting shaft 600 through its corresponding second rotating connection part 340, and a corresponding second sub-shaft shoulder is provided for it on the lifting shaft 600. The lifting shaft 600 is provided with two height positions for each sub-cavity (including a position where the second rotating connection part 340 can contact the corresponding second sub-shaft shoulder, and a position where the sub-cavity to be opened separately is separated from the cavity below it), so as to meet the corresponding cavity opening requirements.

[0136] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A semiconductor processing device, characterized in that: include: A chamber top cover and a plurality of chambers constituting a reaction chamber, wherein the plurality of chambers are stacked and include an upper chamber located below the chamber top cover and a lower chamber fixed to a frame of the semiconductor processing device; A lifting shaft is arranged on one side of the multiple cavities, and the chamber top cover and the upper cavity are rotatably connected to the lifting shaft respectively; a driving device is used to drive the lifting shaft to drive the chamber top cover to rise and fall, or to drive the lifting shaft to drive the chamber top cover and the upper cavity to rise and fall together.

2. The semiconductor processing device according to claim 1, wherein: The chamber top cover is rotatably connected to the lifting shaft via a first rotatable connection portion disposed on one side thereof. The first rotatable connection portion is provided with a limiting countersunk hole. The upper portion of the lifting shaft is installed in the limiting countersunk hole and does not move axially relative to the limiting countersunk hole.

3. The semiconductor processing device according to claim 2, wherein: The first rotating connection part also includes a bearing, the lifting shaft is provided with a first shaft shoulder, the bearing is arranged between the limiting counterbore and the lifting shaft, and the bearing abuts against the first shaft shoulder.

4. The semiconductor processing device according to claim 3, wherein: The bearing is a double-row tapered roller bearing, and the upper portion of the lifting shaft is installed with a gap between the top wall of the limiting countersunk hole.

5. The semiconductor processing device according to claim 1, wherein: The upper cavity body is detachably connected to the chamber top cover, and the upper cavity body connected to the chamber top cover can be lifted together with the chamber top cover or relatively rotated.

6. The semiconductor processing device according to claim 5, wherein: The upper cavity includes a plurality of sub-cavities, which are stacked and two adjacent sub-cavities are detachably connected.

7. The semiconductor processing device according to claim 5 or 6, characterized in that: The chamber top cover and the chamber body are both provided with flanges to achieve detachable connection.

8. The semiconductor processing device according to claim 1 or 5, characterized in that: A shaft sleeve is arranged at one side of the upper cavity, the lifting shaft can be slidably penetrated through the shaft sleeve, and the shaft sleeve can rotate relative to the lifting shaft.

9. The semiconductor processing device according to claim 8, wherein: An oil-free bushing is provided between the shaft sleeve and the lifting shaft.

10. The semiconductor processing device according to any one of claims 1 to 4, characterized in that: The upper cavity is rotatably connected to the lifting shaft via a second rotating connection portion configured on one side thereof, the second rotating connection portion being provided with a through hole, the lifting shaft being passed through the through hole and being able to slide relative to the through hole; wherein the lifting shaft is provided with a second shaft shoulder below the through hole for further lifting the upper cavity after the lifting shaft lifts the chamber top cover.

11. The semiconductor processing device according to claim 10, wherein: The upper cavity includes a plurality of sub-cavities, and the plurality of sub-cavities are arranged in a stacked manner. The second shoulder includes a plurality of second sub-shoulders corresponding to the plurality of sub-cavities, and each of the second sub-shoulders is used to further lift the sub-cavity after the lifting shaft lifts the adjacent chamber top cover or sub-cavity above the sub-cavity.

12. The semiconductor processing device according to claim 10 or 11, characterized in that: The lifting shaft is a stepped shaft, and the second shaft shoulder is a step portion of the stepped shaft.

13. The semiconductor processing apparatus according to claim 1, wherein: Also includes: The spline sleeve connected to the lower cavity has a ball groove inside; the lifting shaft is a spline shaft, and a groove is formed on the side thereof; A plurality of balls roll in a channel formed by the cooperation of the ball groove and the groove; the lifting shaft is slidably arranged in the spline sleeve.

14. A cavity opening method for a semiconductor processing device, applied to the semiconductor processing device according to claim 1, characterized in that: The cavity opening method comprises: The lifting shaft is driven by a driving device to drive the chamber top cover to rise and fall; Rotating the chamber top cover around the lifting axis; The lifting shaft is driven by a driving device to drive the chamber top cover and the upper chamber body to rise and fall; The chamber top cover and / or the upper chamber body are rotated around the lifting axis.

15. The cavity opening method according to claim 14, characterized in that: In the semiconductor processing device, the upper cavity body is detachably connected to the chamber top cover; when the chamber is opened by opening the chamber top cover alone, the connection between the chamber top cover and the upper cavity body is released before the lifting shaft lifts the chamber top cover; When the chamber is opened by jointly opening the chamber top cover and the upper chamber body, before the lifting shaft lifts the chamber top cover, the connection between the chamber top cover and the upper chamber body is maintained and the connection between the upper chamber body and the lower chamber is released.

16. The cavity opening method according to claim 14, characterized in that: In the semiconductor processing device, the upper chamber is rotatably connected to the lifting shaft via a second rotating connection portion disposed on one side thereof, the second rotating connection portion is provided with a through hole, the lifting shaft is passed through the through hole and can slide relative to the through hole, and the lifting shaft is provided with a second shaft shoulder below the through hole; The cavity opening method further comprises: After the lifting shaft lifts the chamber top cover, the lifting shaft continues to lift so that the second shaft shoulder abuts against the through hole and lifts the upper cavity.

17. The cavity opening method according to claim 16, characterized in that: The chamber top cover is rotated around the lifting axis before or after lifting the upper chamber body.

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