High-power IGBT (Insulated Gate Bipolar Translator) cold plate two-phase direct-cooling heat exchanger

Abstract

The invention relates to the technical field of cooling fans, in particular to a high-power IGBT cold plate two-phase direct cooling heat exchanger which comprises a cold plate, a micro-channel flow channel is arranged in the cold plate, a cover plate is fixedly arranged on the front face of the cold plate, a lower connecting pipe is fixedly arranged on the top of the cold plate, a plurality of heat exchange fins are fixedly arranged on the lower connecting pipe, and an upper sealing pipe is fixedly arranged on the tops of the heat exchange fins. Sealing covers are fixedly arranged at the two ends of the lower connecting pipe and the two ends of the upper sealing pipe correspondingly, heat dissipation fins are fixedly arranged on the back of the cold plate and located in an air guide shell, the air guide shell is fixedly arranged on the back of the cold plate, a mounting plate is fixedly arranged at the bottom of the air guide shell, and a plurality of heat dissipation fans distributed at equal intervals are fixedly arranged on the mounting plate. The high-power IGBT cold plate two-phase direct-cooling heat exchanger can respond to instantaneous heat change, has a good heat dissipation effect under the requirement of transient cooling, has two heat dissipation modes of convection heat dissipation and phase change heat dissipation, and greatly improves the heat dissipation efficiency of an existing two-phase direct-cooling heat exchanger.

Description

Technical Field

[0001] The invention relates to the technical field of heat dissipation fans, in particular to a high-power IGBT cold plate two-phase direct cooling heat exchanger. Background Art

[0002] A cold plate is a structure used to transfer heat from an IGBT or other power component to a cooling medium. It is usually made of metal (such as aluminum or copper) and is in contact with a cooling liquid. A two-phase direct cooling heat exchanger uses a fluid in a phase change process (such as liquid turning into gas) to exchange heat. The fluid usually absorbs heat and evaporates in the cooling channel to reduce the operating temperature of the IGBT. Existing two-phase direct cooling heat exchangers generally dissipate heat directly through the phase change process of the refrigerant. When the IGBT starts to run at high power, its heat generation will suddenly increase. The phase change process takes time and it is difficult to respond to instantaneous thermal changes, resulting in poor heat dissipation under transient cooling requirements. Summary of the invention

[0003] In view of the deficiencies in the prior art, the present invention provides a high-power IGBT cold plate two-phase direct cooling heat exchanger, which solves the technical problem that the existing two-phase direct cooling heat exchanger is difficult to dissipate heat in time when the IGBT just starts to run at high power.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: a high-power IGBT cold plate two-phase direct cooling heat exchanger, comprising a cold plate, a microchannel flow channel is arranged in the cold plate, a cover plate is fixedly arranged on the front of the cold plate, a lower connecting pipe is fixedly arranged on the top of the cold plate, a plurality of heat exchange fins are fixedly arranged on the lower connecting pipe, an upper sealing pipe is fixedly arranged on the top of the heat exchange fin, and sealing covers are fixedly arranged at both ends of the lower connecting pipe and the upper sealing pipe, a heat dissipation fin is fixedly arranged on the back of the cold plate, the heat dissipation fin is located in an air guide shell, the air guide shell is fixedly arranged on the back of the cold plate, a mounting plate is fixedly arranged on the bottom of the air guide shell, and a plurality of heat dissipation fans distributed at equal distances are fixedly arranged on the mounting plate;

[0005] The microchannel flow channel includes a plurality of heat exchange chambers 1 and 2 distributed inside the cold plate, a connecting port is provided between the heat exchange chambers 1 and 2, both the heat exchange chambers 1 and 2 are connected with two aggregate flow channels through the flow channel outlets, and the two aggregate flow channels are provided with through holes and connected with the interior of the lower connecting pipe.

[0006] Preferably, a plurality of protrusions are provided in the heat exchange chamber 1 and the heat exchange chamber 2, and the heat exchange chamber 2 is a serpentine structure.

[0007] Preferably, the cover plate is provided with a plurality of heat-conducting parts corresponding to the positions of the heat exchange chamber 1 and the heat exchange chamber 2, and the heat-conducting parts protrude from the surface of the cover plate.

[0008] Preferably, a plurality of channels are provided inside the heat exchange fin.

[0009] Preferably, the side wall of the air guide shell is provided with a mounting hole for accommodating the heat dissipation fins.

[0010] Preferably, the top of the air guide shell is arc-shaped and closed, and air guide holes are provided on the side wall of the top of the air guide shell facing the heat exchange fins.

[0011] Preferably, a ring-shaped magnetic strip is fixedly provided at the bottom of the mounting plate, and a metal mesh is magnetically connected to the magnetic strip.

[0012] Preferably, the cold plate is embedded with a plurality of temperature sensors corresponding to the positions of the heat exchange chamber 1 and the heat exchange chamber 2, and the plurality of temperature sensors are electrically connected to a speed regulator installed at the bottom of the cold plate through wires, and the speed regulator is also electrically connected to the cooling fan.

[0013] By means of the above technical solution, the present invention provides a high-power IGBT cold plate two-phase direct cooling heat exchanger, which has at least the following beneficial effects:

[0014] 1. The high-power IGBT cold plate two-phase direct cooling heat exchanger is provided with heat exchange fins, heat dissipation fins, air guide shells and heat dissipation fans. When the IGBT starts to run at high power, its heat generation increases greatly, which will cause the refrigerant inside the microchannel flow channel to become hot. However, since it takes a certain amount of time for it to reach the evaporation temperature, the heat is transferred to the heat dissipation fins at this time, and the heat is dissipated by direct blowing of the heat dissipation fan. When the refrigerant reaches the evaporation temperature, the refrigerant evaporates and gasifies, and can be dissipated through the heat exchange fins. It can respond to instantaneous thermal changes and has a good heat dissipation effect under transient cooling requirements. It has two heat dissipation methods: convection heat dissipation and phase change heat dissipation, which greatly improves the heat dissipation efficiency of the existing two-phase direct cooling heat exchanger.

[0015] 2. The high-power IGBT cold plate two-phase direct cooling heat exchanger can enhance the local heat dissipation effect by setting up microchannel flow channels, and can cool and dissipate heat for multiple IGBTs at the same time. It is more efficient than traditional water cooling and does not require additional water pumps and pipeline connections. The overall design is simpler and the cost is lower.

[0016] 3. This high-power IGBT cold plate two-phase direct cooling heat exchanger is equipped with a temperature sensor and a speed regulator. Under the action of the temperature sensor, the local temperature change in the microchannel flow channel is used to monitor the operation of the IGBT, and then the operating power of the cooling fan can be adjusted according to the number of IGBT operations, which has the advantage of reducing energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application:

[0018] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0019] Figure 2 It is a schematic diagram of the structure after the present invention is split;

[0020] Figure 3 It is a schematic diagram of the structure of each component on the cold plate of the present invention;

[0021] Figure 4 It is a schematic diagram of the structure of the connection between the lower connecting pipe, the heat exchange fins and the upper sealing pipe of the present invention;

[0022] Figure 5 It is a schematic diagram of the structure of the heat exchange fin of the present invention from a top view;

[0023] Figure 6 It is a schematic structural diagram of the internal cross-section of the cold plate of the present invention;

[0024] Figure 7 It is a structural schematic diagram of the air guide shell of the present invention;

[0025] Reference numerals:

[0026] 1. Cold plate; 101. Microchannel flow channel; 1011. Heat exchange chamber 1; 1012. Heat exchange chamber 2; 1013. Connecting port; 1014. Flow channel outlet; 1015. Aggregate flow channel; 1016. Through hole; 1017. Protrusion; 2. Cover plate; 3. Heat transfer part; 4. Lower connecting pipe; 5. Heat exchange fin; 501. Channel; 6. Upper sealing pipe; 7. Cover; 8. Heat dissipation fin; 9. Air guide shell; 901. Mounting hole; 902. Air guide hole; 10. Mounting plate; 11. Heat dissipation fan; 12. Magnetic strip; 13. Metal mesh; 14. Temperature sensor; 15. Wire; 16. Speed ​​regulator. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] IGBT, also known as insulated gate bipolar transistor, is a highly efficient switching device widely used in power electronic devices such as inverters and motor drives. It can handle high currents and high voltages while having low switching losses. IGBT generates a lot of heat when working. The design of the cold plate 1 makes it in close contact with the IGBT, so that the heat is effectively transferred to the coolant. The coolant is usually in liquid form (such as water or some coolant). When it flows through the cold plate 1, it absorbs heat and begins to evaporate, thereby taking the heat away. This process involves a phase change from liquid to gas, which has a high heat transfer efficiency. The gas phase coolant is then directed to the cooling system, further cooled and circulated back to the cold plate 1, thereby continuously exchanging heat.

[0029] Embodiment 1:

[0030] Based on the technical defects of the existing technology that it is difficult to dissipate heat in time when the IGBT starts to operate at high power, please refer to Figure 1-Figure 7 The present invention provides a high-power IGBT cold plate two-phase direct cooling heat exchanger, which can respond to instantaneous thermal changes, has a good heat dissipation effect under transient cooling requirements, and has two heat dissipation modes of convection heat dissipation and phase change heat dissipation, which greatly improves the heat dissipation efficiency of the existing two-phase direct cooling heat exchanger. The heat exchanger includes a cold plate 1, a microchannel flow channel 101 is arranged in the cold plate 1, a cover plate 2 is fixedly arranged on the front of the cold plate 1, a lower connecting pipe 4 is fixedly arranged on the top of the cold plate 1, a plurality of heat exchange fins 5 are fixedly arranged on the lower connecting pipe 4, an upper sealing pipe 6 is fixedly arranged on the top of the heat exchange fin 5, and sealing covers 7 are fixedly arranged at both ends of the lower connecting pipe 4 and the upper sealing pipe 6, and a heat dissipation fin 8 is fixedly arranged on the back of the cold plate 1, and the heat dissipation fin 8 is located in an air guide shell 9. Inside, an air guide shell 9 is fixedly arranged on the back of the cold plate 1, a mounting plate 10 is fixedly arranged at the bottom of the air guide shell 9, and a plurality of equidistantly distributed heat dissipation fans 11 are fixedly arranged on the mounting plate 10; when the IGBT starts to operate at high power, its heat generation increases greatly, which will cause the refrigerant inside the microchannel flow channel 101 to become hot, but since it takes a certain amount of time for it to reach the evaporation temperature, the heat is then conducted to the heat dissipation fins 8, and the heat is dissipated by direct blowing of the heat dissipation fan 11. When the refrigerant reaches the evaporation temperature, the refrigerant evaporates and gasifies and can enter the heat exchange fins 5. Then, under the action of the air guide shell 9, the wind blown by the heat dissipation fan 11 can take away the heat on the heat exchange fins 5, thereby liquefying the refrigerant and flowing back into the cold plate 1.

[0031] To achieve rapid heating of the refrigerant, please refer to Figure 3The microchannel flow channel 101 includes a plurality of heat exchange chambers 1011 and heat exchange chambers 1012 distributed inside the cold plate 1, and a connecting port 1013 is provided between the heat exchange chambers 1011 and the heat exchange chambers 1012. The heat exchange chambers 1011 and the heat exchange chambers 1012 are both connected to two aggregate flow channels 1015 through flow channel outlets 1014. The two aggregate flow channels 1015 are provided with through holes 1016 and are connected to the interior of the lower connecting tube 4. The refrigerant can flow with each other under the action of the heat exchange chambers 1011 and the heat exchange chambers 1012, so that the heat distribution is more uniform. When the refrigerant is evaporated by heat, the gaseous refrigerant can enter the lower connecting tube 4 through the aggregate flow channel 1015, and rise from the lower connecting tube 4 to the heat exchange fins 5 for heat dissipation.

[0032] In order to increase the contact area between the refrigerant and the cold plate 1, a plurality of protrusions 1017 are provided in the heat exchange chamber 1 1011 and the heat exchange chamber 2 1012, and the heat exchange chamber 2 1012 is a serpentine structure; the setting of the protrusions 1017 can increase the contact area between the refrigerant and the cold plate 1, thereby allowing the refrigerant to heat up and vaporize faster, and the setting of the serpentine structure can lengthen the refrigerant flow path, so that the refrigerant's residence time in the heating part will be prolonged.

[0033] In order to facilitate the cold plate 1 to be in contact with the IGBT, a plurality of heat conducting parts 3 corresponding to the positions of the heat exchange chamber 1 1011 and the heat exchange chamber 2 1012 are provided on the cover plate 2, and the heat conducting parts 3 protrude from the surface of the cover plate 2; since the heat conducting parts 3 protrude from the surface of the cover plate 2, the heat conducting parts 3 can just be in contact with the IGBT, thereby conducting the heat generated when the IGBT is in operation.

[0034] In order to improve the liquefaction efficiency of the gaseous refrigerant, a plurality of channels 501 are provided inside the heat exchange fin 5 ; the provision of the channels 501 can increase the inner surface area of ​​the heat exchange fin 5 , thereby making the heat dissipation effect of the heat exchange fin 5 better.

[0035] In order to facilitate the installation of the heat dissipation fins 8 into the air guide shell 9 , a mounting hole 901 for accommodating the heat dissipation fins 8 is provided on the side wall of the air guide shell 9 .

[0036] In order to optimize the air duct, the top of the air guide shell 9 is arc-shaped and closed, and an air guide hole 902 is provided on the side wall of the top of the air guide shell 9 facing the heat exchange fins 5; when the cooling fan 11 is running, the air can act on the cooling fins 8 and the heat exchange fins 5 at the same time, thereby achieving a good heat dissipation effect.

[0037] In order to prevent dust or other debris from affecting the operation of the cooling fan 11, a ring-shaped magnetic strip 12 is fixedly provided at the bottom of the mounting plate 10, and a metal mesh 13 is magnetically connected to the magnetic strip 12; the metal mesh 13 can be magnetically installed on the outside of the cooling fan 11, which is convenient for disassembly and assembly, and also has a good dustproof protection effect.

[0038] Embodiment 2:

[0039] Since the first embodiment is for heat dissipation of multiple IGBTs, but multiple IGBTs do not necessarily run at the same time, when only one or several of them are working, the heat dissipation fan 11 does not need to run at a high speed. Therefore, based on the first embodiment, a plurality of temperature sensors 14 corresponding to the positions of the heat exchange chamber 1 1011 and the heat exchange chamber 2 1012 are embedded in the cold plate 1, and the plurality of temperature sensors 14 are electrically connected to the speed regulator 16 installed at the bottom of the cold plate 1 through the wire 15, and the speed regulator 16 is also electrically connected to the heat dissipation fan 11; under the action of the temperature sensor 14, the local temperature change in the microchannel flow channel 101 is used to monitor the operation of the IGBT. For example, when only one IGBT is working, the local temperature of the heat exchange chamber 1 1011 or the heat exchange chamber 2 1012 near the position will be higher than the local temperature at other positions, so that it is judged that the IGBT at the position is in a working state. By knowing that several IGBTs are in a running state, the operating power of the heat dissipation fan 11 can be adjusted under the action of the speed regulator 16.

[0040] It can be seen from the above embodiments that: when the IGBT starts to run at high power, its heat generation increases greatly, which will cause the refrigerant inside the microchannel flow channel 101 to become hot, but since it takes a certain amount of time to reach the evaporation temperature, the heat is conducted to the heat dissipation fins 8 at this time, and the heat is dissipated by direct blowing of the heat dissipation fan 11. When the refrigerant reaches the evaporation temperature, the refrigerant evaporates and gasifies and can enter the heat exchange fins 5. Then, under the action of the air guide shell 9, the wind blown by the heat dissipation fan 11 can take away the heat on the heat exchange fins 5, thereby liquefying the refrigerant and flowing back into the cold plate 1.

[0041] It should be noted that the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-power IGBT cold plate two-phase direct cooling heat exchanger, comprising a cold plate (1), characterized in that: The cold plate (1) is provided with a microchannel flow passage (101), a cover plate (2) is fixedly provided on the front of the cold plate (1), a lower connecting tube (4) is fixedly provided on the top of the cold plate (1), a plurality of heat exchange fins (5) are fixedly provided on the lower connecting tube (4), an upper sealing tube (6) is fixedly provided on the top of the heat exchange fins (5), both ends of the lower connecting tube (4) and the upper sealing tube (6) are fixedly provided with sealing covers (7), a heat dissipation fin (8) is fixedly provided on the back of the cold plate (1), the heat dissipation fin (8) is located in an air guide shell (9), the air guide shell (9) is fixedly provided on the back of the cold plate (1), a mounting plate (10) is fixedly provided on the bottom of the air guide shell (9), a plurality of heat dissipation fans (11) distributed at equal distances are fixedly provided on the mounting plate (10); The microchannel flow channel (101) comprises a plurality of heat exchange chambers (1011) and heat exchange chambers (1012) distributed inside the cold plate (1); a connecting port (1013) is provided between the heat exchange chambers (1011) and the heat exchange chambers (1012); the heat exchange chambers (1011) and the heat exchange chambers (1012) are both connected to two aggregate flow channels (1015) via flow channel outlets (1014); the two aggregate flow channels (1015) are provided with through holes (1016) and are connected to the interior of the lower connecting pipe (4).

2. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1 is characterized in that: A plurality of protrusions (1017) are provided in the heat exchange chamber 1 (1011) and the heat exchange chamber 2 (1012), and the heat exchange chamber 2 (1012) is a serpentine structure.

3. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: The cover plate (2) is provided with a plurality of heat-conducting parts (3) corresponding to the positions of the heat-exchange chamber 1 (1011) and the heat-exchange chamber 2 (1012), and the heat-conducting parts (3) protrude from the surface of the cover plate (2).

4. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: A plurality of channels (501) are provided inside the heat exchange fin (5).

5. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: The side wall of the air guide shell (9) is provided with a mounting hole (901) for accommodating the heat dissipation fins (8).

6. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: The top of the air guide shell (9) is arc-shaped and closed, and an air guide hole (902) is provided on the side wall of the top of the air guide shell (9) facing the heat exchange fins (5).

7. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: A ring-shaped magnetic strip (12) is fixedly provided at the bottom of the mounting plate (10), and a metal mesh (13) is magnetically connected to the magnetic strip (12).

8. The high-power IGBT cold plate two-phase direct cooling heat exchanger according to claim 1, characterized in that: The cold plate (1) is embedded with a plurality of temperature sensors (14) corresponding to the positions of the heat exchange chamber 1 (1011) and the heat exchange chamber 2 (1012); the plurality of temperature sensors (14) are electrically connected to a speed regulator (16) installed at the bottom of the cold plate (1) via wires (15); and the speed regulator (16) is also electrically connected to the heat dissipation fan (11).

Images