Upper electrode device and semiconductor process equipment

Abstract

The invention discloses an upper electrode device and semiconductor process equipment, and the device comprises a gas inlet structure which penetrates through a cavity cover plate, is movably connected with the cavity cover plate in a sealing manner, and is used for introducing process gas into a process cavity; the first adjusting mechanism comprises at least one first displacement guiding assembly, and the first displacement guiding assembly is connected with the end, located outside the cavity body, of the air inlet structure and used for guiding the air inlet structure when the air inlet structure moves in the first horizontal direction; the second adjusting mechanism comprises at least one second displacement guiding assembly, the second displacement guiding assembly is connected with the end, located outside the cavity body, of the air inlet structure and used for guiding the air inlet structure when the air inlet structure moves in the second horizontal direction, and the first horizontal direction intersects with the second horizontal direction. According to the invention, the controllability and convenience of coaxiality adjustment between the upper electrode air inlet structure and the wafer can be improved.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor equipment, and more specifically, relates to an upper electrode device and semiconductor process equipment. Background Art

[0002] In the manufacturing process of IC (integrated circuit), edge etcher is an indispensable equipment, because during the deposition and etching process of the wafer, polymers of different components and thicknesses will be produced at its edge. If these polymers cannot be removed in time, it will easily cause defects in the integrated circuit in the subsequent process, especially at the edge of the wafer. This is one of the main reasons for reducing the yield of equipment products. With the continuous development of high-end processes, it is particularly important to use edge etcher to improve product yield. Among them, the upper electrode structure of the machine is particularly critical, because only the edge of the wafer needs to be etched, and the center position of the wafer and the upper gas outlet plate needs to be controllable. In this way, the purpose of selecting different etching areas can be achieved by adjusting the center position, and finally the uniformity of edge etching is achieved to prevent the wafer from being over-etched. In this way, the coaxiality of the gas outlet plate and the wafer needs to be particularly good to achieve the adjustable function.

[0003] However, the current method for adjusting the coaxiality between the wafer and the gas outlet plate has problems of poor controllability and complex operation. Summary of the invention

[0004] The purpose of the present invention is to provide an upper electrode device and semiconductor process equipment to improve the controllability and convenience of coaxiality adjustment between the upper electrode air intake structure and the wafer.

[0005] To achieve the above-mentioned object, in a first aspect, the present invention provides an upper electrode device, which is applied to a process chamber of a semiconductor process equipment, wherein the process chamber comprises a chamber body and a chamber cover plate covered on the chamber body, and the upper electrode device comprises:

[0006] An air inlet structure, which is arranged through the chamber cover plate and is movably and hermetically connected to the chamber cover plate, and is used to introduce process gas into the process chamber;

[0007] A first adjustment mechanism includes at least one first displacement guide assembly, wherein the first displacement guide assembly is connected to one end of the air intake structure located outside the chamber body and is used to guide the air intake structure when the air intake structure moves along a first horizontal direction;

[0008] The second adjustment mechanism includes at least one second displacement guide component, which is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along a second horizontal direction, wherein the first horizontal direction intersects with the second horizontal direction.

[0009] Optionally, it further comprises a movable bracket, wherein the movable bracket is arranged above the chamber cover plate, and the air intake structure is arranged on the movable bracket;

[0010] The first displacement guide assembly and the second displacement guide assembly are arranged on the movable bracket and are respectively located on two adjacent sides of the air intake structure.

[0011] Optionally, the first displacement guide assembly and the second displacement guide assembly are guide assemblies with the same structure;

[0012] The guide assembly includes a fixing member and a connecting member, the air intake structure includes a guide structure, the fixing member is arranged on the movable bracket, one end of the connecting member is slidably connected to the fixing member, and the other end is guided and matched with the guide structure.

[0013] Optionally, the fixing member includes a sliding bearing seat, and the connecting member includes a sliding shaft and a guide seat;

[0014] The sliding bearing seat is fixed to the movable bracket, and the sliding shaft is inserted into the sliding bearing seat and is slidably connected to the sliding bearing seat;

[0015] One end of the guide seat is fixedly connected to the sliding shaft, and the other end of the guide seat is in guiding cooperation with the guide structure;

[0016] When the air intake structure moves along the first horizontal direction, the sliding shaft in the second displacement guide assembly slides along the first horizontal direction;

[0017] When the air intake structure moves along the second horizontal direction, the sliding shaft in the first displacement guide assembly slides along the second horizontal direction.

[0018] Optionally, the guide assembly further includes an adjusting top screw, and a first threaded hole is provided at the top end of the sliding bearing seat, and the adjusting top screw can cooperate with the first threaded hole to lock the sliding shaft.

[0019] Optionally, the one end of the guide seat is provided with a first connection portion and a second connection portion, the first connection portion and the second connection portion are respectively arranged on both sides of the sliding bearing seat, the first connection portion is connected to one end of the sliding shaft, and the second connection portion is connected to the other end of the sliding shaft;

[0020] The distance between the first connecting portion and the second connecting portion is greater than the width of the sliding bearing seat.

[0021] Optionally, the air intake structure includes a pad, which is disposed on the movable bracket and is detachably connected to the movable bracket;

[0022] The guide structure includes a blind hole opened on the side of the pad and a guide sleeve arranged in the blind hole. One end of the blind hole is provided with an annular groove, and a retaining spring is provided in the annular groove. The guide sleeve is fixed in the blind hole by the retaining spring, and the other end of the guide seat is inserted in the guide sleeve.

[0023] Optionally, the first adjustment mechanism further includes a first displacement adjustment component, the second adjustment mechanism further includes a second displacement adjustment component, and the first displacement adjustment component and the second displacement adjustment component are arranged on the movable bracket;

[0024] The first displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the first horizontal direction;

[0025] The second displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the second horizontal direction.

[0026] Optionally, the first displacement adjustment component and the second displacement adjustment component are the same displacement adjustment member;

[0027] The displacement adjustment member includes a limit support and an adjustment rod;

[0028] The limit support is fixedly connected to the movable bracket, and one end of the adjustment rod passes through the limit support and is threadedly connected to the air intake structure;

[0029] The axial direction of the adjusting rod in the first displacement adjusting assembly is parallel to the first horizontal direction, and the limiting support is provided with a sliding groove extending along the second horizontal direction. The axial direction of the adjusting rod in the second displacement adjusting assembly is parallel to the second horizontal direction, and the limiting support is provided with a sliding groove extending along the first horizontal direction.

[0030] Optionally, one first displacement guide assembly is provided on both sides of the first displacement adjustment assembly, and one second displacement guide assembly is provided on both sides of the second displacement adjustment assembly.

[0031] Optionally, it further includes a first horizontal displacement measuring member and a second horizontal displacement measuring member;

[0032] The first horizontal displacement measuring member is disposed opposite to the first displacement guiding assembly, and the second horizontal displacement measuring member is disposed opposite to the second displacement guiding assembly;

[0033] The first horizontal displacement measuring member is used to monitor the displacement of the air intake structure in the first horizontal direction in real time;

[0034] The second horizontal displacement measuring device is used to monitor the displacement of the air intake structure in the second horizontal direction in real time.

[0035] Optionally, both the first horizontal displacement measuring element and the second horizontal displacement measuring element are laser displacement sensors.

[0036] In a second aspect, the present invention proposes a semiconductor process equipment, comprising: a process chamber and an upper electrode device as described in any one of the first aspects, wherein a base for supporting a wafer is provided inside the process chamber, and a lifting drive mechanism is provided above the process chamber, and the lifting drive mechanism is used to drive the air intake structure to rise and fall.

[0037] The beneficial effects of the present invention are:

[0038] The upper electrode device of the present invention realizes guidance of the air intake node during horizontal displacement adjustment through the first adjustment mechanism and the second adjustment mechanism, wherein the first adjustment mechanism includes at least one first displacement guide component, and the second adjustment mechanism includes at least one second displacement guide component, the first displacement guide component is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along the first horizontal direction, and the second displacement guide component is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along the second horizontal direction. The first adjustment mechanism and the second adjustment mechanism can guide the air intake structure when the air intake structure moves horizontally, thereby ensuring that the air intake structure can accurately move in the first horizontal direction or the second horizontal direction, avoiding the rotation of the air intake structure along its axial direction resulting in uncontrollable displacement adjustment, and then accurately adjusting the coaxiality between the air intake structure and the wafer.

[0039] The system of the present invention has other characteristics and advantages, which will be apparent from the drawings incorporated herein and the following detailed description, or will be described in detail in the drawings incorporated herein and the following detailed description, which together serve to explain the specific principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, in which like reference numerals generally represent like components.

[0041] Figure 1 A top view of an upper electrode of a conventional edge etching chamber is shown.

[0042] Figure 2 A top view of a semiconductor process chamber according to embodiment 1 of the present invention is shown.

[0043] Figure 3 Shown along Figure 2 Longitudinal section view of BB.

[0044] Figure 4 Shows Figure 2 A partial enlarged view of the guide part at II in the middle.

[0045] Figure 5 Shown along Figure 4 Longitudinal section view along the AA direction.

[0046] Figure 6 An enlarged view of a horizontal displacement adjusting member in a semiconductor process chamber according to embodiment 1 of the present invention is shown. DETAILED DESCRIPTION

[0047] The upper electrode structure of the edge etcher is as follows Figure 1 As shown, it includes a height gauge 4, an air intake structure, a movable bracket 7, and a connecting assembly 14. Among them, the air intake structure includes a pad, a horizontal adjustment plate 6, an air path connecting tube, and an air outlet plate. The pad is located below the horizontal adjustment plate 6 and is fixed to the horizontal adjustment plate 6 through the connecting assembly 14. The pad is fixed to the movable bracket 7 through the fastening screws 5. The movable bracket 7 drives the air intake structure to rise and fall through the pad. Due to errors in processing accuracy and installation, the wafer (base or lower electrode) in the process chamber and the air outlet plate cannot be coaxial in the initial state. Therefore, it is necessary to adjust the horizontal adjustment plate 6 through the first coaxial adjustment mechanism 17 and the second coaxial adjustment mechanism 18, thereby driving the air intake and outlet plates to move in the horizontal direction.

[0048] The first coaxial adjustment mechanism 17 and the second coaxial adjustment mechanism 18 both include an adjustment knob and a limit support. The adjustment knob is connected to the pad via a thread. The limit support can limit the forward and backward movement of the adjustment knob in the corresponding direction, but can move in the left and right directions. Since the forward and backward movement of the adjustment knob is limited, rotating the adjustment knob can drive the pad to move forward and backward through the thread. The adjustment amount in the corresponding direction can be obtained by changing the indication of the altimeter 4 fixed on the movable bracket 7 in the corresponding direction (the altimeter 4 has a retractable reading head, and the movement of the pad will press the reading head to retract. The altimeter is fixed on the movable bracket 7, and the reading head is in contact with the pad). Since the horizontal adjustment plate 6 and the pad are fastened together via the connecting assembly 14, the air outlet disk also undergoes the same displacement.

[0049] The current coaxial adjustment mechanism has the following problems:

[0050] 1. The pad is an annular part, which is naturally placed on the movable bracket 7. Due to the lack of installation positioning guide reference of the pad and the gap between the threaded transmission, the adjustment knobs in the X and Y directions are not perpendicular to each other. When adjusting the displacement, the pad may rotate around the Z direction (i.e., the axial direction of the air outlet disk), resulting in uncontrollable changes.

[0051] 2. When adjusting the displacement in the X direction, the displacement in the Y direction will also change due to the gap between the thread transmissions. In this case, the change in the Y direction needs to be restored. Unnecessary repeated actions prolong the maintenance time.

[0052] 3. During the normal operation of the machine, the actual position of the gas outlet plate is constantly changing due to vibration and other reasons, but the existing structure cannot monitor the status of the gas outlet plate in real time. When the change accumulates to a certain extent, the uniformity of etching will not meet the requirements, but it cannot be discovered and handled in time.

[0053] The present invention provides a semiconductor process chamber and semiconductor process equipment, which adds guiding functions in two horizontal directions to the coaxial adjustment mechanism, improves the controllability of the displacement direction, and prevents the gas outlet disk from rotating along its axial direction (Z direction). At the same time, a real-time monitoring function of the center position of the gas outlet disk is added to record the position change between the gas outlet disk and the wafer in real time.

[0054] The present invention will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0055] Example 1

[0056] like Figure 2 and Figure 3 As shown, an upper electrode device is applied to a process chamber of a semiconductor process equipment, wherein the process chamber includes a chamber body and a chamber cover 101 covered on the chamber body, and the upper electrode device includes:

[0057] An air inlet structure is provided through the chamber cover plate 101 and is movably and sealingly connected to the chamber cover plate 101, and is used to introduce process gas into the process chamber;

[0058] The first adjustment mechanism includes at least one first displacement guide component 201, which is connected to one end of the air intake structure located outside the chamber body and is used to guide the air intake structure when the air intake structure moves along the first horizontal direction;

[0059] The second adjustment mechanism includes at least one second displacement guide component 202, which is connected to one end of the air intake structure located outside the chamber body and is used to guide the air intake structure when the air intake structure moves along a second horizontal direction, wherein the first horizontal direction intersects with the second horizontal direction.

[0060] refer to Figure 3 In this embodiment, the upper electrode device further comprises a movable support 102, which is disposed above the chamber cover 101, and an air intake structure is disposed on the movable support 102; a first displacement guide assembly 201 and a second displacement guide assembly 202 are disposed on the movable support 102 and are respectively located on two adjacent sides of the air intake structure. The air intake structure comprises a pad 103, which is disposed on the movable support 102 and is detachably connected to the movable support 102.

[0061] Specifically, the movable bracket 102 is disposed above the process chamber 101 and is used to drive the air intake structure to rise and fall. The top of the movable bracket 102 has a support plane; the pad 103 is annular and is disposed on the support plane; the first displacement guide assembly 201 and the second displacement guide assembly 202 are both disposed on the support plane and are respectively located on two adjacent sides of the air intake structure. Preferably, the first horizontal direction is perpendicular to the second horizontal direction.

[0062] In this embodiment, the air intake structure further includes a horizontal adjustment plate 105, an air path connecting tube 106, an air outlet plate 107 and a bellows 108;

[0063] The top edge of the horizontal adjustment plate 105 is provided with an annular connecting portion, the bottom surface of the annular connecting portion is overlapped and fixed with the top surface of the pad 103, and the horizontal adjustment plate 105 and the pad 103 are coaxially arranged; the horizontal adjustment plate 105 and the pad 103 are fixedly connected by a connecting component 113.

[0064] The bottom of the gas outlet plate 107 extends into the chamber body, the top of the gas path connecting tube 106 is fixedly connected to the bottom of the horizontal adjustment plate 105, and the bottom of the gas path connecting tube 106 passes through the top wall of the process chamber 101 and is fixedly connected to the top of the gas outlet plate 107;

[0065] The backing plate 103, the horizontal adjustment plate 105, the gas path connecting tube 106 and the gas outlet plate 107 are coaxially arranged; an air inlet 111 is arranged in the center of the horizontal adjustment plate 105, a gas passage is arranged in the gas path connecting tube 106, and an air duct is arranged in the gas outlet plate 107, and the air inlet 111, the gas passage and the air duct are connected in sequence;

[0066] The air passage includes an air inlet located at the center of the top of the air outlet disk 107 and an air outlet located at the bottom edge of the air outlet disk 107;

[0067] The bellows 108 is disposed outside the gas path connecting tube 106 , the top end of the bellows 108 is sealedly connected to the bottom end of the horizontal adjustment plate 105 , and the bottom end of the bellows 108 is sealedly connected to the top wall of the process chamber 101 .

[0068] A base 110 for supporting the wafer is disposed inside the chamber body. The base 110 is located directly below the gas outlet plate 107 , and a gas outlet 112 is disposed at the bottom of the chamber body.

[0069] In this embodiment, the first displacement guide assembly 201 and the second displacement guide assembly 202 are guide assemblies with the same structure; the guide assembly includes a fixing member and a connecting member, the air intake structure includes a guide structure, the fixing member is arranged on the movable bracket 102, one end of the connecting member is slidably connected to the fixing member, and the other end is guided and cooperated with the guide structure.

[0070] Specifically, if Figure 4 and Figure 5 As shown, the guide assembly includes a fixing part and a connecting part, wherein the fixing part includes a sliding bearing seat 401, and the connecting part includes a sliding shaft 403 and a guide seat 402; the sliding bearing seat 401 is fixed to the supporting surface at the top of the movable bracket 102, and the sliding shaft 403 is penetrated through the sliding bearing seat 401 and is slidably connected to the sliding bearing seat 401; one end of the guide seat 402 is fixedly connected to the sliding shaft 403, and the other end of the guide seat 402 is guided and matched with the guide structure on the side of the pad 103; when the air intake structure moves along the first horizontal direction, the sliding shaft 403 in the second displacement guide assembly slides along the first horizontal direction; when the air intake structure moves along the second horizontal direction, the sliding shaft 403 in the first displacement guide assembly slides along the second horizontal direction.

[0071] Preferably, a first connection portion and a second connection portion are provided at one end of the guide seat 402, the first connection portion and the second connection portion are respectively provided at both sides of the sliding bearing seat 401, the first connection portion is connected to one end of the sliding shaft 403, the second connection portion is connected to the other end of the sliding shaft 403, and the distance between the first connection portion and the second connection portion is greater than the width of the sliding bearing seat 401. Compared with the single-end connection mode, the connection mode of the first connection portion and the second connection portion can avoid the shaking of the guide seat and improve the stability of the guiding process.

[0072] A blind hole is opened on the side of the backing plate 103 on the air intake structure and a guide sleeve 404 is arranged in the blind hole. An annular groove is arranged at one end of the blind hole. A retaining spring 405 is arranged in the annular groove. The guide sleeve 404 is fixed in the blind hole by the retaining spring 405.

[0073] A guide column is provided at the other end of the guide seat 402, and the axial direction of the guide column is perpendicular to the sliding shaft 403; a blind hole corresponding to the guide column is provided on the side of the pad 103, and the guide sleeve 404 is fixed in the circular hole by a retaining ring 405, and the guide column is inserted in the guide sleeve 404.

[0074] The axial direction of the guide column in the first displacement guide assembly 201 is parallel to the first direction, and the sliding shaft 403 in the first displacement guide assembly 201 can slide in the sliding bearing seat 401 along the second horizontal direction; the axial direction of the guide column in the second displacement guide assembly 202 is parallel to the second direction, and the sliding shaft 403 in the second displacement guide assembly 202 can slide in the sliding bearing seat 401 along the first horizontal direction.

[0075] The horizontal displacement guide member adopts a guide sleeve 404 to cooperate with the guide column on the guide seat 402, and there can be a very small fitting gap between the two; at the same time, a sliding shaft 403 and a sliding bearing seat 401 are slidably matched, and there can also be a very small fitting gap between the two, thereby improving the installation accuracy of the moving parts and reducing the friction loss inside the coaxial adjustment structure.

[0076] Preferably, the first adjustment mechanism in this embodiment includes two first displacement guide components 201 arranged on the same side of the mobile bracket, and the second adjustment mechanism includes two second displacement guide components 202 arranged on the other side of the mobile bracket adjacent to the first adjustment mechanism. Using two horizontal displacement guides on each side can improve the support stability of the pad 103 during translational sliding.

[0077] like Figure 5 As shown, in this embodiment, the guide assembly further includes an adjusting screw 406 , and a first threaded hole is provided at the top of the sliding bearing seat 401 . The adjusting screw 406 can cooperate with the first threaded hole to lock the sliding shaft 403 .

[0078] For example, when adjusting the displacement of the air outlet plate 107 in the first horizontal direction, the adjusting top screws 406 of the two first displacement guide components 201 can be tightened first to lock the sliding shaft 403 of the first displacement guide component 201, thereby preventing the guide seat 402 from sliding relative to the sliding bearing seat 401 in the second horizontal direction, and then loosen the adjusting top screws 406 of the two second displacement guide components 202, and then rotate the knob of the first horizontal displacement adjustment member 301 located on the first side, so that the guide seats 402 in the two first displacement guide components 201 can be guided along the first direction, and the guide seats 402 and the sliding shafts 403 of the two second displacement guide components 202 slide on the sliding bearing seat 401, and the maximum sliding distance is Figure 4 2a shown in FIG.

[0079] In this embodiment, the first adjustment mechanism also includes a first displacement adjustment component 301, and the second adjustment mechanism also includes a second displacement adjustment component 302. The first displacement adjustment component 301 and the second displacement adjustment component 302 are arranged on the movable bracket 102; the first displacement adjustment component 301 is connected to the air intake structure, and is used to drive the air intake structure to move along the first horizontal direction; the second displacement adjustment component 302 is connected to the air intake structure, and is used to drive the air intake structure to move along the second horizontal direction.

[0080] like Figure 6 As shown, in this embodiment, the first displacement adjustment component 301 and the second displacement adjustment component 302 are the same displacement adjustment member; the displacement adjustment member includes a limit support 501 and an adjustment rod 502; the limit support 501 is fixedly connected to the mobile bracket 102, and one end of the adjustment rod 502 passes through the limit support 501 and is threadedly connected to the air intake structure;

[0081] The axial direction of the adjustment rod 502 in the first displacement adjustment component 301 is parallel to the first horizontal direction, and the limiting support 501 is provided with a slide groove extending along the second horizontal direction. The axial direction of the adjustment rod 502 in the second displacement adjustment component 302 is parallel to the second horizontal direction, and the limiting support 501 is provided with a slide groove extending along the first horizontal direction.

[0082] Specifically, the limit support 501 is fixed on the support surface of the mobile bracket 102, a slide groove is provided in the limit support 501, an annular protrusion is provided in the center of the adjustment rod 502, the annular protrusion is arranged in the slide groove, a handle is provided at one end of the adjustment rod 502, a thread is provided at the other end of the adjustment rod 502, a corresponding threaded hole is provided on the side of the pad 103, the adjustment rod 502 is threadedly connected with the pad 103, and the pad 103 is adjusted in the horizontal displacement direction by rotating the adjustment rod 502. The axial direction of the adjustment rod 502 in the first displacement adjustment member 301 is parallel to the first horizontal direction, the slide groove in the limit support 501 extends along the second horizontal direction, the axial direction of the adjustment rod 502 in the second displacement adjustment member 302 is parallel to the second horizontal direction, and the slide groove in the limit support 501 extends along the first horizontal direction. When the adjusting rod 502 in the first displacement adjusting member 301 is rotated, the air intake structure moves along the first horizontal direction, and at this time the adjusting rod 502 in the second displacement adjusting member 302 can slide along the first horizontal direction in the limiting support 501; when the adjusting rod 502 in the second displacement adjusting member 302 is rotated, the air intake structure moves along the second horizontal direction, and at this time the adjusting rod 502 in the first displacement adjusting member 301 can slide along the first horizontal direction in the limiting support 501.

[0083] In other embodiments, the displacement adjustment member can also be implemented in other ways, for example, a slide groove is set on the support surface, the limit support 501 is set in the slide groove, and a bearing is set in the limit support 501, and the adjustment rod 502 is passed through the bearing, that is, the adjustment rod 502 can rotate in the limit support 501, and the limit support 501 can slide on the support surface along the axial direction perpendicular to the adjustment rod 501.

[0084] Preferably, in this embodiment, a first displacement guide assembly 201 is provided on both sides of the first displacement adjustment assembly 301 , and a second displacement guide assembly 202 is provided on both sides of the second displacement adjustment assembly 302 .

[0085] In this embodiment, the upper electrode device further includes a first horizontal displacement measuring member 303 and a second horizontal displacement measuring member 304; the first horizontal displacement measuring member 303 is arranged relative to the first displacement guide assembly 201, and the second horizontal displacement measuring member 304 is arranged relative to the second displacement guide assembly 202; the first horizontal displacement measuring member 303 is used to monitor the displacement of the air intake structure in the first horizontal direction in real time; the second horizontal displacement measuring member 304 is used to monitor the displacement of the air intake structure in the second horizontal direction in real time. Preferably, the first horizontal displacement measuring member 303 and the second horizontal displacement measuring member 304 are both laser displacement sensors.

[0086] Specifically, the laser displacement sensor can be connected to the host computer. By using two laser sensors to collect the movement of the horizontal adjustment plate 105 in the first horizontal direction and the second horizontal direction in real time and uploading it to the host computer, the center position of the air outlet disk 107 can be dynamically understood by calculating and reading the displacement change during the adjustment process, or recording the calculated change during monitoring.

[0087] Compared with the existing displacement measurement method, the altimeter is replaced by a laser displacement sensor, which is also fixed on the mobile bracket 102. It can collect the displacement data in the first horizontal direction and the second horizontal direction in real time, and can also calculate and read the displacement change during the adjustment process, or record the calculated change during monitoring, so as to dynamically understand the center position of the gas outlet disk 107. It should be noted that the embodiment of the present application does not limit the specific position of the laser displacement sensor, as long as it can detect the displacement change.

[0088] Taking the etcher as an example, during the process debugging stage, the machine will initially etch a wafer, and obtain the offset of the gas outlet plate 107 by calculating the morphological data of the edge etching. After changing the position of the gas outlet plate 107, the latest process results are used to determine whether the relative positions of the gas outlet plate 107 and the wafer on the base 110 are coaxial. The real-time monitoring function of the center position of the gas outlet plate 107 is added, and the relative position change of the two can be recorded in real time.

[0089] In summary, the upper electrode device of this embodiment has the following advantages:

[0090] 1. Adding a guide mechanism to the coaxial adjustment mechanism makes the single-direction adjustment more stable and avoids the occurrence of other rotational movements except the linear displacement in the first horizontal direction and the second horizontal direction;

[0091] 2. Improve the installation accuracy of the coaxial adjustment mechanism and reduce internal friction loss;

[0092] 3. The real-time monitoring function of the center position of the gas outlet plate 107 has been added to timely understand the coaxiality of the gas outlet plate 107 and the wafer to avoid over-engraving of products.

[0093] 4. One-way adjustment is more stable and effectively reduces the maintenance time of coaxial adjustment.

[0094] Example 2

[0095] refer to Figure 3 This embodiment provides a semiconductor process equipment, including: a process chamber and the upper electrode device described in Example 1, a base for supporting the wafer is provided inside the process chamber, and a lifting drive mechanism is provided above the process chamber, and the lifting drive mechanism is used to drive the air intake structure to rise and fall.

[0096] Specifically, the lifting drive mechanism drives the air intake structure to lift and lower through the mobile bracket 102. The power input of the lifting drive can be transmitted by the screw structure. The specific lifting drive can include a support fixed on the top surface of the chamber cover 101, and a screw is fixed at the lower end of the support so that the screw can only make rotational motion. The screw nut is fixed on the mobile bracket 102, thereby finally realizing the lifting and lowering of the air intake structure.

[0097] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. An upper electrode device, applied to a process chamber of a semiconductor process equipment, wherein: The process chamber comprises a chamber body and a chamber cover plate disposed on the chamber body, wherein the upper electrode device comprises: An air inlet structure, which is arranged through the chamber cover plate and is movably and hermetically connected to the chamber cover plate, and is used to introduce process gas into the process chamber; A first adjustment mechanism includes at least one first displacement guide assembly, wherein the first displacement guide assembly is connected to one end of the air intake structure located outside the chamber body and is used to guide the air intake structure when the air intake structure moves along a first horizontal direction; The second adjustment mechanism includes at least one second displacement guide component, which is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along a second horizontal direction, wherein the first horizontal direction intersects with the second horizontal direction.

2. The upper electrode device according to claim 1, characterized in that: It also includes a movable bracket, which is arranged above the chamber cover plate, and the air intake structure is arranged on the movable bracket; The first displacement guide assembly and the second displacement guide assembly are arranged on the movable bracket and are respectively located on two adjacent sides of the air intake structure.

3. The upper electrode device according to claim 2, characterized in that: The first displacement guide assembly and the second displacement guide assembly are guide assemblies with the same structure; The guide assembly includes a fixing member and a connecting member, the air intake structure includes a guide structure, the fixing member is arranged on the movable bracket, one end of the connecting member is slidably connected to the fixing member, and the other end is guided and matched with the guide structure.

4. The upper electrode device according to claim 3, characterized in that: The fixing member includes a sliding bearing seat, and the connecting member includes a sliding shaft and a guide seat; The sliding bearing seat is fixed to the movable bracket, and the sliding shaft is inserted into the sliding bearing seat and is slidably connected to the sliding bearing seat; One end of the guide seat is fixedly connected to the sliding shaft, and the other end of the guide seat is in guiding cooperation with the guide structure; When the air intake structure moves along the first horizontal direction, the sliding shaft in the second displacement guide assembly slides along the first horizontal direction; When the air intake structure moves along the second horizontal direction, the sliding shaft in the first displacement guide assembly slides along the second horizontal direction.

5. The upper electrode device according to claim 4, characterized in that: The guide assembly also includes an adjusting top screw. The top end of the sliding bearing seat is provided with a first threaded hole. The adjusting top screw can cooperate with the first threaded hole to lock the sliding shaft.

6. The upper electrode device according to claim 5, characterized in that: The one end of the guide seat is provided with a first connection part and a second connection part, the first connection part and the second connection part are respectively arranged on both sides of the sliding bearing seat, the first connection part is connected to one end of the sliding shaft, and the second connection part is connected to the other end of the sliding shaft; The distance between the first connecting portion and the second connecting portion is greater than the width of the sliding bearing seat.

7. The upper electrode device according to claim 4, characterized in that: The air intake structure comprises a backing plate, which is arranged on the movable bracket and is detachably connected to the movable bracket; The guide structure includes a blind hole opened on the side of the pad and a guide sleeve arranged in the blind hole. One end of the blind hole is provided with an annular groove, and a retaining spring is provided in the annular groove. The guide sleeve is fixed in the blind hole by the retaining spring, and the other end of the guide seat is inserted in the guide sleeve.

8. The upper electrode device according to claim 2, characterized in that: The first adjustment mechanism further includes a first displacement adjustment component, and the second adjustment mechanism further includes a second displacement adjustment component, and the first displacement adjustment component and the second displacement adjustment component are arranged on the movable bracket; The first displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the first horizontal direction; The second displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the second horizontal direction.

9. The upper electrode device according to claim 8, characterized in that: The first displacement adjustment component and the second displacement adjustment component are the same displacement adjustment member; The displacement adjustment member includes a limit support and an adjustment rod; The limit support is fixedly connected to the movable bracket, and one end of the adjustment rod passes through the limit support and is threadedly connected to the air intake structure; The axial direction of the adjusting rod in the first displacement adjusting assembly is parallel to the first horizontal direction, and the limiting support is provided with a sliding groove extending along the second horizontal direction. The axial direction of the adjusting rod in the second displacement adjusting assembly is parallel to the second horizontal direction, and the limiting support is provided with a sliding groove extending along the first horizontal direction.

10. The upper electrode device according to claim 8, characterized in that: A first displacement guide assembly is respectively provided on both sides of the first displacement adjustment assembly, and a second displacement guide assembly is respectively provided on both sides of the second displacement adjustment assembly.

11. The upper electrode device according to claim 1, characterized in that: Also included is a first horizontal displacement measuring member and a second horizontal displacement measuring member; The first horizontal displacement measuring member is disposed opposite to the first displacement guiding assembly, and the second horizontal displacement measuring member is disposed opposite to the second displacement guiding assembly; The first horizontal displacement measuring member is used to monitor the displacement of the air intake structure in the first horizontal direction in real time; The second horizontal displacement measuring device is used to monitor the displacement of the air intake structure in the second horizontal direction in real time.

12. The upper electrode device according to claim 11, characterized in that: The first horizontal displacement measuring element and the second horizontal displacement measuring element are both laser displacement sensors.

13. A semiconductor process equipment, characterized in that: include: A process chamber and an upper electrode device as described in any one of claims 1-12, wherein a base for supporting a wafer is provided inside the process chamber, and a lifting drive mechanism is provided above the process chamber, and the lifting drive mechanism is used to drive the air intake structure to rise and fall.

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