Photoinduction ranging module, preparation method, laser radar and electronic equipment

Abstract

The invention discloses a light induction distance measurement module, a preparation method, a laser radar and electronic equipment. The light-sensing distance measurement module comprises a substrate, and a first light source, a second light source and a light-sensing chip which are arranged on the substrate, the first light source is configured to emit a first light beam to the view field range, and the second light source is configured to emit a second light beam to be transmitted to the light-sensing chip. The light sensing chip is configured to perform distance sensing according to the sensed second light beam and the light beam from the view field range. By adopting the scheme, the light blocking structure does not need to be pressed on the light sensing chip, so that the production yield can be improved; moreover, only one light receiving area needs to be arranged on the light sensing chip, so that the area of the light sensing chip is reduced, and the cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of distance measurement, and in particular to a light-sensing distance measurement module, a preparation method, a laser radar and an electronic device. Background Art

[0002] Existing light-sensing ranging modules based on the time-of-flight principle usually adopt a structure of a light source and a light-sensing chip, on which two light-receiving areas are formed. A part of the light beam emitted by the light source is reflected inside the light-sensing ranging module to one of the light-receiving areas to obtain a first signal peak for starting timing; another part of the light beam emitted by the light source is emitted to the external field of view, reflected by the target object and returned to be received by the other light-receiving area to obtain a second signal peak for ending timing; the distance to the target object is sensed by calculating the time difference between the second signal peak and the first signal peak.

[0003] In order to avoid optical crosstalk between the two light receiving areas, a light-isolating baffle needs to be set between the two areas. However, since the two light receiving areas are set on the same light sensing chip, the baffle usually needs to be pressed on the light sensing chip between the two light receiving areas, which can easily damage the light sensing chip during the manufacturing and assembly process, resulting in a low production yield. Moreover, the light sensing chip that needs to have two light receiving areas has a large area, and the production and design costs are relatively high. Summary of the invention

[0004] The main purpose of this application is to provide a light-sensing ranging module, a preparation method, a laser radar and an electronic device, which can solve the problem of the enlarged area of ​​the light-sensing chip.

[0005] In order to solve the above technical problems, the first technical solution adopted in the present application is: providing a light-sensing ranging module, which is configured to perform distance sensing on a preset field of view, and the light-sensing ranging module includes a substrate and a first light source, a second light source and a light-sensing chip arranged on the substrate, the first light source is configured to emit a first light beam to the field of view, the second light source is configured to emit a second light beam to the light-sensing chip, and the light-sensing chip is configured to perform distance sensing based on the sensed second light beam and the light beam from the field of view.

[0006] In order to solve the above technical problems, the second technical solution adopted in the present application is to provide a method for preparing a light-sensing ranging module, including: arranging a first light source, a second light source and a light-sensing chip on a substrate; forming a first light-transmitting package body that at least covers the light-emitting area of ​​the first light source; forming a second light-transmitting package body that at least covers the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip; and forming an opaque package body on the substrate to fill the gaps on the substrate except for the first light-transmitting package body and the second light-transmitting package body.

[0007] In order to solve the above technical problems, the third technical solution adopted in this application is: to provide a laser radar, including the above-mentioned light sensing ranging module.

[0008] To solve the above technical problems, the fourth technical solution adopted in this application is: to provide an electronic device, which includes an application device and the above-mentioned laser radar, the application device is connected to the laser radar, and the application device is configured to perform corresponding preset operations based on the ranging results obtained by the laser radar.

[0009] Beneficial effects of the present application: Different from the prior art, the light sensing distance measurement module of the present application includes a substrate and a first light source, a second light source and a light sensing chip arranged on the substrate, the first light source is configured to emit a first light beam to the field of view, the second light source is configured to emit a second light beam to the light sensing chip, and the light sensing chip is configured to perform distance sensing based on the sensed second light beam and the light beam from the field of view. With the above scheme, the light blocking structure does not need to be pressed on the light sensing chip, which can improve the production yield. Moreover, only one light receiving area needs to be set on the light sensing chip, which reduces the area of ​​the light sensing chip and reduces the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0011] Figure 1 It is a functional module diagram of an embodiment of a light sensing ranging module provided in the present application.

[0012] Figure 2 It is a structural schematic diagram of an embodiment of a light sensing ranging module provided in the present application.

[0013] Figure 3 yes Figure 1 Schematic diagram of the statistical histogram of the distance measurement performed by the medium light sensing distance measurement module.

[0014] Figure 4 yes Figure 2 Schematic diagram of a top view of the light sensing ranging module.

[0015] Figure 5 It is a structural schematic diagram of another embodiment of the light sensing ranging module provided by the present application.

[0016] Figure 6 yes Figure 5 Schematic diagram of a top view of the light sensing ranging module.

[0017] Figure 7 It is a structural schematic diagram of another embodiment of the light sensing ranging module provided by the present application.

[0018] Figure 8 yes Figure 7 Schematic diagram of a top view of the light sensing ranging module.

[0019] Fig. 9 It is a flow chart of an embodiment of a method for preparing a light sensing ranging module provided in the present application.

[0020] Fig.10 It is a schematic diagram of the framework of an embodiment of a laser radar provided in this application.

[0021] Fig.11 It is a schematic diagram of the framework of an embodiment of an electronic device provided by the present application. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0023] The terms "first", "second", etc. in this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0024] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0025] An embodiment of the present application provides a light-sensing ranging module, which is configured to perform distance sensing on a preset field of view. The light-sensing ranging module includes a substrate and a first light source, a second light source and a light-sensing chip arranged on the substrate. The first light source is configured to emit a first light beam to the field of view, the second light source is configured to emit a second light beam to the light-sensing chip, and the light-sensing chip is configured to perform distance sensing based on the sensed second light beam and the light beam from the field of view.

[0026] Optionally, the optical power of the first light beam emitted by the first light source is greater than the optical power of the second light beam emitted by the second light source.

[0027] Optionally, there is a preset time interval between the moment when the first light source emits the first light beam and the moment when the second light source emits the second light beam; Alternatively, when the first light source emits the first light beam, the second light source simultaneously emits the second light beam.

[0028] Optionally, the light sensing ranging module includes a baffle wall disposed on the substrate, and the baffle wall is configured to separate the first light source from the second light source and the light sensing chip to block the first light beam from being emitted to the light sensing chip.

[0029] Optionally, the second light source is located between the first light source and the light sensing chip, and the blocking wall is arranged between the first light source and the second light source.

[0030] Optionally, the light-sensing ranging module includes a shell, which is arranged on the base, and the shell and the base cooperate to form a cavity. The baffle wall is arranged in the cavity, and the baffle wall is configured to separate the cavity into a first cavity and a second cavity. The first light source is located in the first cavity, and the second light source and the light-sensing chip are located in the second cavity; a first opening corresponding to the first light source is provided on the shell, and the first light beam is emitted to the field of view through the first opening; a second opening corresponding to the light-sensing chip is provided on the shell, and the light beam from the field of view is transmitted to the light-sensing chip through the second opening.

[0031] Optionally, the shell includes a top and side walls, the side walls extend from the edges of the top to enclose the cavity together with the top, and the retaining wall extends from the inner surface of the top located in the cavity and is connected to the side walls.

[0032] Optionally, the light-sensing ranging module includes a first light-transmitting package body, a second light-transmitting package body and an opaque package body, the first light-transmitting package body is at least arranged on the light-emitting area of ​​the first light source, so that the first light beam is emitted to the field of view through the first light-transmitting package body; the second light-transmitting package body is at least arranged on the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip, so that the second light beam and the light beam from the field of view are transmitted to the light-sensing chip through the second light-transmitting package body; the opaque package body is configured to fill the gap on the substrate except the first light-transmitting package body and the second light-transmitting package body, and the part of the opaque package body located between the first light-transmitting package body and the second light-transmitting package body forms the retaining wall.

[0033] Optionally, the first light-transmitting encapsulation body, the second light-transmitting encapsulation body and the opaque encapsulation body are formed by a molding process.

[0034] Optionally, the first light-transmitting packaging body and the second light-transmitting packaging body are formed by a dispensing and curing process, and the opaque packaging body is formed by a molding process.

[0035] The embodiment of the present application also provides a method for preparing a light sensing ranging module, comprising: Disposing a first light source, a second light source and a light sensing chip on a substrate; forming a first light-transmitting encapsulation body at least covering the light-emitting area of ​​the first light source; forming a second light-transmitting encapsulation body at least covering the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip; A light-impermeable encapsulation body is formed on the substrate to fill the gap on the substrate except the first light-transmitting encapsulation body and the second light-transmitting encapsulation body.

[0036] Optionally, the step of forming a first light-transmitting encapsulation body at least covering the light-emitting area of ​​the first light source comprises: Covering at least the light emitting area of ​​the first light source with a light-transmitting material by a molding process to form the first light-transmitting encapsulation body; The step of forming a second light-transmitting package body at least covering the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip comprises: The light-transmitting material is covered at least on the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip by the molding process to form the second light-transmitting package; The step of forming a light-proof encapsulation body on the substrate comprises: The light-proof material is filled into the gaps on the substrate except the first light-proof encapsulation body and the second light-proof encapsulation body through the molding process to form the light-proof encapsulation body.

[0037] Optionally, the step of forming a first light-transmitting encapsulation body at least covering the light-emitting area of ​​the first light source comprises: Covering the light-transmitting material at least above the light-emitting area of ​​the first light source by a dispensing and curing process to form the first light-transmitting encapsulation body; The step of forming a second light-transmitting package body at least covering the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip comprises: Covering the light-transmitting material at least on the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip through the glue-dispensing and curing process to form the second light-transmitting package; The step of forming a light-proof encapsulation body on the substrate comprises: The light-proof material is filled into the gaps on the substrate except the first light-proof encapsulation body and the second light-proof encapsulation body through a molding process to form the light-proof encapsulation body.

[0038] An embodiment of the present application also provides a laser radar, including the above-mentioned light sensing ranging module.

[0039] The embodiment of the present application further provides an electronic device, the electronic device comprising an application device and the above-mentioned laser radar, the application device being connected to the laser radar, and the application device being configured to perform a corresponding preset operation based on the ranging result obtained by the laser radar. The electronic device is, for example, a mobile phone, a car, a robot, an access control / monitoring system, a smart door lock, an unmanned vehicle, a drone, etc., which is not limited in the present application.

[0040] The following is a description of the contents of the embodiments of the present application in conjunction with the accompanying drawings: See also Figures 1 to 3 As shown, Figure 1 is a functional module diagram of an embodiment of a light sensing ranging module provided by the present application, Figure 2 is a structural schematic diagram of an embodiment of a light sensing distance measurement module provided by the present application, Figure 3 yes Figure 1The optical sensing distance measuring module 100 provided in the embodiment of the present application comprises a substrate 10, a first light source 20, a second light source 30 and an optical sensing chip 40, wherein the first light source 20, the second light source 30 and the optical sensing chip 40 are arranged on the substrate 10.

[0041] The first light source 20, the second light source 30 and the light sensing chip 40 are arranged on the substrate 10 at intervals; the first light source 20 is electrically connected to the outside through the substrate 10, the second light source 30 is electrically connected to the outside through the substrate 10, and the light sensing chip 40 is electrically connected to the outside through the substrate 10. In some embodiments, the substrate 10 is, for example, a printed circuit board (PCB), which has circuit traces necessary for realizing the electrical connection function, and can be a single-layer structure or a multi-layer structure.

[0042] The light sensing distance measuring module 100 is configured to sense the distance of a preset field of view. The first light source 20 is configured to emit a first light beam to the field of view, and the second light source 30 is configured to emit a second light beam to the light sensing chip 40. The light sensing chip 40 is configured to sense the distance based on the sensed second light beam and the light beam from the field of view.

[0043] In some embodiments, Figure 2 , Figure 5 and Figure 7, the first light source 20 can be electrically connected to the circuit trace on the substrate 10 through the first metal wire, and the second light source 30 can be electrically connected to the circuit trace on the substrate 10 through the second metal wire. Wherein, the first light source 20 includes at least one first light emitting unit, and the second light source 30 includes at least one second light emitting unit, and the first light emitting unit and the second light emitting unit can be but are not limited to vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), edge emitting laser (Edge Emitting Laser, EEL), light emitting diode (Light Emitting Diode, LED) or laser diode (Laser Diode, LD), etc. The light sensing chip 40 can be electrically connected to the circuit traces on the substrate 10 through a third metal wire. The light sensing chip 40 includes at least one photosensitive pixel, which can be but is not limited to a single photon avalanche diode (SPAD), an avalanche photodiode (APD), a silicon photomultiplier (SiPM) formed by a plurality of SPADs connected in parallel, and / or other suitable photoelectric conversion elements. In some other embodiments, any one or more of the first light source 20, the second light source 30, and the light sensing chip 40 can also be electrically connected to the substrate 10 through the pins or pads at the bottom without the need for metal wires, depending on the packaging type of the first light source, the second light source, and the light sensing chip. Figure 2 , Figure 5 and Figure 7 This is for example only and is not intended to be limiting.

[0044] In some embodiments, the first light source 20 includes a plurality of first light-emitting units, and the second light source 30 includes a plurality of second light-emitting units. The plurality of first light-emitting units and the plurality of second light-emitting units may be arranged regularly, for example, in an array; or, the plurality of first light-emitting units and the plurality of second light-emitting units may be arranged randomly. The light beams emitted by the plurality of first light-emitting units in the first light source 20 serve as the first light beams of the first light source 20, and the region where the plurality of first light-emitting units are located serves as the light-emitting region of the first light source 20; the light beams emitted by the plurality of second light-emitting units in the second light source 30 serve as the second light beams of the second light source 30, and the region where the plurality of second light-emitting units are located serves as the light-emitting region of the second light source 30.

[0045] In some embodiments, the light sensing chip 40 includes a plurality of photosensitive pixels, which can be arranged regularly or randomly. An area where at least one photosensitive pixel on the light sensing chip 40 is located serves as a light receiving area of ​​the light sensing chip 40 and is configured to sense the second light beam and a light beam from the field of view.

[0046] In some embodiments, the first light source 20 and the second light source 30 may be light-emitting bare chips, the bottom surface of which is fixed to the substrate 10 by conductive adhesive and electrically connected; the top surface of the first light source 20 is electrically connected to the substrate 10 by a first metal wire, and the top surface of the second light source 30 is electrically connected to the substrate 10 by a second metal wire. The light sensing chip 40 may be a photosensitive bare chip, which is fixed to the substrate 10 by wafer curing adhesive, and the light sensing chip 40 is electrically connected to the substrate 10 by a third metal wire.

[0047] like Figure 1 As shown, the light sensing ranging module 100 also includes a control module 11 and a processing module 12. The control module 11 is configured to control the second light source 30 to emit a second light beam according to a preset time sequence and to control the first light source 20 to emit a first light beam according to a preset time sequence. For example, the first light beam is a plurality of first light pulses, and the second light beam is a plurality of second light pulses corresponding to the first light beam.

[0048] In some embodiments, the first light source 20 emits light synchronously with the second light source 30. Specifically, the control module 11 is further configured to control the first light source 20 to emit the first light beam while controlling the second light source 30 to emit the second light beam. In this case, the time interval between the moment when the first light source 20 emits the first light beam and the moment when the second light source 30 emits the second light beam is zero. For example, the first light beam is a plurality of first light pulses, the second light beam is a plurality of second light pulses, the first light pulses correspond to the second light pulses one by one, and the emission time of each pair of first light pulses corresponding to each other is the same as the emission time of the second light pulses.

[0049] In some embodiments, the first light source 20 and the second light source 30 emit light asynchronously. Specifically, the control module 11 is further configured to control the first light source 20 to emit the first light beam after controlling the second light source 30 to emit the second light beam, at a preset time interval greater than zero. The preset time interval is, for example, 5ns, 10ns, 15ns, 20ns, etc. For example, the first light beam is a plurality of first light pulses, the second light beam is a plurality of second light pulses, the first light pulses correspond to the second light pulses one by one, and each pair of first light pulses and second light pulses corresponding to each other are not emitted simultaneously, and the corresponding first light pulse is emitted only after a time interval greater than zero after a second light pulse is emitted. In this case, if the photosensitive pixels in the light receiving area of ​​the light sensing chip 40 are SPADs, setting the emission time interval between the first light beam and the second light beam to be greater than the avalanche recovery time of the SPAD can make the SPAD that was previously triggered by the corresponding second light beam to avalanche recover when the first light beam echoes back from the object, thereby ensuring that there are a sufficient number of SPADs to receive the first light beam echoes emitted back, which can improve the system's sensing accuracy of the first light beam echoes.

[0050] The processing module 12 is configured to determine a first receiving time t1 when the light sensing chip 40 senses the second light beam, and to determine a second receiving time t2 when the light sensing chip 40 senses the first light beam echo from the field of view. Figure 3As shown, in the embodiment where the photosensitive pixel of the photosensitive chip 40 is a SPAD, the processing module 12 is configured to process the photosensitive signal output by the photosensitive chip 40 in response to the photon according to the time-correlated single photon counting (TSCPC) technology to obtain a statistical histogram of the count distribution of the photosensitive signal over time, and determine the first receiving time t1 and the second receiving time t2 according to the time bins corresponding to the signal peaks in the histogram. Since the propagation distance of the second light beam inside the photosensitive ranging module is very short and the speed of light is fast, the first receiving time t1 of the second light beam is similar to the emission time of the second light beam, which can be used as the starting reference time of the time-of-flight ranging. On this basis, for the embodiment where the first light beam and the second light beam are emitted synchronously, the first receiving time t1 of the second light beam is equivalent to the emission time of the first light beam, and the processing module uses the time difference between the second receiving time t2 of the first light beam and the first receiving time t1 of the second light beam as the flight time of the first light beam echo reflected from the object, and then obtains the distance of the object according to the principle of time of flight. For the embodiment in which the first light beam and the second light beam are emitted asynchronously, the first receiving time t1 of the second light beam needs to be added with a preset time interval to be equivalent to the emission time of the first light beam, and thus the processing module takes the time difference between the second receiving time t2 of the first light beam and the first receiving time t1 of the second light beam minus the preset time interval of the delayed emission of the first light beam compared to the second light beam as the flight time of the echo of the first light beam reflected from the object, and then obtains the distance of the object according to the principle of flight time. Since the echoes of the second light beam and the first light beam in the present application are both sensed by the same light receiving area on the same light sensing chip, the sensed first receiving time t1 and the second receiving time t2 have the same temperature drift characteristics, and therefore the temperature drift effect of the light sensing chip on the sensing result due to temperature changes can be offset by processing the time difference between the second receiving time t2 and the first receiving time t1, thereby improving the accuracy of ranging.

[0051] In some embodiments, all or part of the functional units in the control module and / or the processing module may include firmware solidified in a storage medium or computer software code stored in a storage medium, and executed by one or more corresponding processors to control related components to implement corresponding functions. The processor is, for example, but not limited to, an application processor, a central processing unit, a microcontroller, etc. The storage medium includes, but is not limited to, a flash memory, an electrically erasable programmable read-only storage medium, a programmable read-only storage medium, a hard disk, etc.

[0052] In some embodiments, all or part of the functional units in the control module and / or the processing module may also be implemented by hardware means, for example, by any one of the following technologies or a combination thereof: a discrete logic circuit having a logic gate circuit for implementing logical functions on data signals, a dedicated integrated circuit having a suitable combinational logic gate circuit, a programmable gate array (PGA), a field programmable gate array (FPGA), a driving circuit for a specific object, etc.

[0053] In some embodiments, all or part of the functional units in the control module and / or the processing module may be integrated in any one of the light sensing chip, the first light source, the second light source, other processors disposed in the light sensing ranging module, and processors disposed outside the light sensing ranging module. All or part of the functional units in the control module and / or the processing module may also be independent chips or microprocessors, etc. For example: the control module includes: a first emission driving circuit, a second emission driving circuit, a sensing driving circuit and a main controller, the first emission driving circuit is configured to drive the first light source to emit a first light beam, the second emission driving circuit is configured to drive the second light source to emit a second light beam, the sensing driving circuit is configured to drive the light sensing chip to start working, and the main controller is configured to coordinate the working sequence of the first light source, the second light source and the light sensing chip; wherein the first emission driving circuit, the second emission circuit, the sensing driving circuit and the main controller can be respectively arranged on different chips; or, the first emission driving circuit and the first light source are integrated on the same chip; or, the second emission driving circuit and the second light source are integrated on the same chip; or, the sensing driving circuit and the light sensing chip are integrated on the same chip; or, the first emission driving circuit, the second emission circuit, the sensing driving circuit and the main controller are integrated on the same chip; or, the first emission driving circuit and the main controller are integrated on the same chip; or, the second emission driving circuit and the main controller are integrated on the same chip; or, the sensing driving circuit and the main controller are integrated on the same chip; or, the first emission driving circuit, the second emission circuit, the sensing driving circuit, the main controller and the light sensing chip are integrated on the same chip.

[0054] In such Figure 2 , Figure 5 and Figure 7 In the illustrated embodiment, the second light source 30 is disposed between the first light source 20 and the light sensing chip 40 , that is, the first light source 20 is located on a side of the second light source 30 away from the light sensing chip 40 .

[0055] In other embodiments, the light sensing chip may be disposed between the first light source and the second light source; or, the first light source is disposed on the perpendicular midline of the line connecting the light sensing chip and the second light source. The distance between the light sensing chip and the second light source may be greater than, equal to, or less than the distance between the light sensing chip and the first light source, and this application does not make specific restrictions on this, as long as the light sensing chip and the second light source can be divided into the same side of the retaining wall, and the first light source is divided into the other side of the retaining wall.

[0056] In some embodiments, the optical power of the first light beam emitted by the first light source 20 is greater than the optical power of the second light beam emitted by the second light source 30. Since the first light beam emitted by the first light source 20 needs to be emitted to the field of view for ranging, in order to enable the emitted first light beam to reach the farthest distance of the field of view and then return to be received by the light sensing chip, the first light source 20 needs to emit the first light beam with a larger optical power. Since the second light source 30 and the light sensing chip 40 are both located inside the light sensing ranging module 100, the distance that the second light beam emitted by the second light source 30 propagates to the light sensing chip 40 is much shorter than the distance that the first light beam needs to propagate within the field of view, so the optical power of the second light beam emitted by the second light source 30 can be less than the optical power of the first light beam, thereby reducing the overall power consumption of the light sensing ranging module and the cost of the second light source 30.

[0057] In some embodiments, Figure 2 As shown, the optical sensing distance measuring module 100 further includes a retaining wall 50, which is configured to optically isolate the first light source 20 from the second light source 30 and the optical sensing chip 40, so as to prevent the first light beam emitted by the first light source 20 from being directly transmitted to the optical sensing chip 40 and causing interference. That is, the retaining wall 50, as a light-blocking structure in the optical sensing distance measuring module 100, divides the first light source 20 into one side, and divides the second light source 30 and the optical sensing chip 40 into the other side, so as to prevent the first light beam emitted by the first light source 20 from being directly transmitted to the optical sensing chip 40 inside the optical sensing distance measuring module 100. For example, the second light source 30 is located between the first light source 20 and the optical sensing chip 40, and the retaining wall 50 is disposed between the first light source 20 and the second light source 30. In some other embodiments, the optical sensing chip 40 is located between the first light source 20 and the second light source 30, and the retaining wall 50 is disposed between the first light source 20 and the optical sensing chip 40.

[0058] Compared with the prior art, the embodiment of the present application sets a second light source for emitting a second light beam as a starting reference for time-of-flight ranging, so that only one light receiving area for sensing the light beam is required on the light sensing chip, thereby reducing the area of ​​the light sensing chip and the production cost of the light sensing chip. On the other hand, the retaining wall used for optical isolation in the light sensing ranging module does not need to be pressed on the light sensing chip, so as to avoid the retaining wall from crushing the light sensing chip, thereby improving the production yield.

[0059] In some embodiments, see Figure 2 and Figure 4 As shown, Figure 4 yes Figure 1 The optical sensing distance measuring module 100 provided in the embodiment of the present application comprises a hollow shell 60, which is disposed on a substrate 10, and the shell 60 cooperates with the substrate 10 to form a cavity, in which the first light source 20, the second light source 30 and the optical sensing chip 40 are accommodated.

[0060] The housing 60 is disposed on the substrate 10 and covers the first light source 20, the second light source 30 and the light sensing chip 40 to protect the first light source 20, the second light source 30 and the light sensing chip 40 disposed on the substrate 10. The housing 60 can be made of an opaque material to reduce the interference of ambient light on the light sensing chip 40.

[0061] Optionally, the housing 60 can be set on the base 10 by bonding. Specifically, the housing 60 and the base 10 can be bonded by an adhesive layer. The adhesive layer can be made of an opaque adhesive material, such as black glue. The retaining wall 50 can also be set on the base 10 by bonding, specifically, the retaining wall 50 and the base 10 can be bonded by an adhesive layer.

[0062] The retaining wall 50 extends from the inner surface of the shell 60 to separate the internal cavity of the shell 60 into a first cavity 67 and a second cavity 68. The first light source 20 is located in the first cavity 67, and the second light source 30 and the light sensing chip 40 are located in the second cavity 68 to separate the first light source 20 from the second light source 30 and the light sensing chip 40 to block the first light beam emitted by the first light source 20 from being directly transmitted to the light sensing chip 40 inside the light sensing ranging module 100.

[0063] In some embodiments, the housing 60 includes a top 61 and a side wall 62, wherein the side wall 62 extends from the edges of the top 61 to form a cavity with the top 61. The retaining wall 50 extends from the inner surface of the top 61 in the cavity, and the retaining wall 50 is connected to the side wall 62. The cross-sectional shape of the side wall 62 includes but is not limited to a circle, an ellipse or a polygon.

[0064] In some embodiments, Figure 2 and Figure 4 As shown, the housing 60 is in the shape of a cuboid, and includes four side walls 62 that are vertically connected in sequence, and the four side walls 62 extend vertically downward from the edges of the top 61, and the four side walls 62 and the top 61 form a cavity. In other embodiments, the housing 60 includes other numbers of side walls 62, such as six side walls 62, but the embodiments of the present application are not limited thereto.

[0065] In some embodiments, the retaining wall 50 may be made of an opaque material to block the first light beam emitted by the first light source 20 from being directly transmitted to the light sensing chip 40 inside the light sensing ranging module 100. For example, the housing 60 and the retaining wall 50 may be pre-made by injection molding and then assembled on the substrate 10. The materials of the retaining wall 50 and the housing 60 may be thermosetting polymers, silicone rubber gel or epoxy resin, etc. However, the embodiments of the present application are not limited thereto, and the retaining wall 50 and the housing 60 may also be pre-formed by other manufacturing methods.

[0066] Optionally, in some embodiments, the housing 60 is provided with a first opening 63 corresponding to the light-emitting area of ​​the first light source 20, and the first light beam is emitted to the field of view through the first opening 63. The housing 60 is provided with a second opening 64 corresponding to the light-receiving area of ​​the light-sensing chip 40, and the light beam from the field of view is transmitted to the light-sensing chip 40 through the second opening 64. The first opening 63 and the second opening 64 can be, for example, through holes penetrating the top of the housing 60. The second light beam emitted by the second light source 30 is reflected to the light-sensing chip 40 through the inner surface of the housing.

[0067] In some embodiments, Figure 2 As shown, the light sensing ranging module 100 also includes a first optical element 65 corresponding to the light emitting area of ​​the first light source 20 and a second optical element 66 corresponding to the light receiving area of ​​the light sensing chip 40. The first optical element 65 can be arranged at the first opening 63, and the second optical element 66 can be arranged at the second opening 64.

[0068] The second optical element 66 may include one or more of a filter and / or an anti-reflection film (AR, also known as an anti-reflection film). The filter is configured to transmit light within a preset wavelength range and filter out light outside the preset wavelength range to reduce the impact of ambient light on the light sensing chip 40. In other embodiments, the second optical element 66 may be disposed on the receiving path of the light beam returned from the field of view.

[0069] The light sensing distance measurement module proposed in the embodiment of the present application encapsulates the first light source, the second light source and the light sensing chip through a cavity formed by assembling a hollow shell and a substrate. Since the shell can be pre-made in batches and then assembled on the substrate, it is not necessary to perform molding on the first light source, the second light source and the light sensing chip during the packaging process, which greatly reduces the probability of damage to the chip during the molding process and also reduces the difficulty of the manufacturing process.

[0070] In some embodiments, see Figures 5 to 8 As shown, Figure 5 It is a structural schematic diagram of another embodiment of the light sensing ranging module provided by the present application; Figure 6 Figure 5 A top view schematic diagram of the light sensing ranging module; Figure 7 It is a structural schematic diagram of another embodiment of the light sensing ranging module provided by the present application; Figure 8 Figure 7 The light sensing ranging module 100 provided in the embodiment of the present application includes a first light-transmitting package 70, a second light-transmitting package 80 and an opaque package 90. The first light-transmitting package 70 is at least arranged on the light-emitting area of ​​the first light source 20, and the second light-transmitting package 80 is at least arranged on the light-emitting area of ​​the second light source 30 and the light-receiving area of ​​the light-sensing chip 40.

[0071] The first light beam emitted by the first light source 20 is emitted to the field of view through the first light-transmitting package 70, and the second light beam emitted by the second light source 30 and the light beam from the field of view are transmitted to the light sensing chip 40 through the second light-transmitting package 80. The second light beam emitted by the second light source 20 can be transmitted to the light receiving area of ​​the light sensing chip 40 in the second light-transmitting package 80 by total reflection, scattering or / and other suitable methods.

[0072] In some embodiments, the material of the first light-transmitting encapsulation body 70 and the second light-transmitting encapsulation body 80 may be a light-transmitting colloid, and the light-transmitting colloid may be DAF glue (Die Attach Film) or FOW glue (Film On Wire) according to actual needs, and this application does not make any specific limitation on this.

[0073] In some embodiments, the light-impermeable encapsulation body 90 is configured to fill the gap on the substrate 10 except the first light-transmitting encapsulation body 70 and the second light-transmitting encapsulation body 80 , and the portion of the light-impermeable encapsulation body 90 between the first light-transmitting encapsulation body 70 and the second light-transmitting encapsulation body 80 forms a retaining wall 50 .

[0074] Among them, the first light-transmitting package body 70 is formed on the substrate and covers at least the light-emitting area of ​​the first light source 20, the second light-transmitting package body 80 is formed on the substrate and covers at least the light-emitting area of ​​the second light source 30 and the light receiving area of ​​the light-sensing chip 40, and the opaque package body 90 is arranged around the first light-transmitting package body 70 and the second light-transmitting package body 80 to fill the gap on the substrate 10 except the first light-transmitting package body 70 and the second light-transmitting package body 80.

[0075] Optionally, the first light-transmitting package body 70 has an exposed first surface 71, and the second light-transmitting package body 80 has an exposed second surface 81. The first light beam emitted by the first light source 20 is emitted to the field of view through the first surface 71 of the first light-transmitting package body 70, and the light beam from the field of view is transmitted to the light sensing chip 40 through the second surface 81 of the second light-transmitting package body 80.

[0076] In some embodiments, the material of the light-proof packaging body 90 may be a light-proof colloid, such as DAF glue, which is not specifically limited in the present application.

[0077] The light-sensing ranging module 100 proposed in the embodiment of the present application encapsulates the first light source 20, the second light source 30 and the light-sensing chip 40 respectively through the first light-transmitting packaging body 70, the second light-transmitting packaging body 80 and the opaque packaging body 90. Since the first light-transmitting packaging body 70, the second light-transmitting packaging body 80 and the opaque packaging body 90 are all solid structures, the overall strength of the light-sensing ranging module 100 can be enhanced and the adverse effects of environmental water vapor on the first light source 20, the second light source 30 and the light-sensing chip 40 can be reduced, and the module has high durability.

[0078] like Figure 5 and Figure 6 As shown, in some embodiments, the first light-transmitting encapsulation body 70 , the second light-transmitting encapsulation body 80 and the opaque encapsulation body 90 are formed by a molding process.

[0079] The molding process is to form a cavity on the space to be packaged by a mold, and then inject the packaging material into the cavity for solidification to form a corresponding packaging body. The first light-transmitting packaging body 70 and the second light-transmitting packaging body 80 formed by the molding process have regular shapes, including but not limited to circular, elliptical or polygonal shapes, such as Figure 5 and Figure 6 The first light-transmitting package body 70 and the second light-transmitting package body 80 are in the shape of a cuboid.

[0080] Among them, the first light-transmitting package body 70 covers the light-emitting area of ​​the first light source 20 and the first metal wire, and the second light-transmitting package body 80 covers the light-emitting area of ​​the second light source 30, the light-receiving area of ​​the light-sensing chip 40, the second metal wire and the third metal wire. The opaque package body 90 is arranged on the substrate 10 and surrounds the first light-transmitting package body 70 and the second light-transmitting package body 80 to fill the gap on the substrate 10 except the first light-transmitting package body 70 and the second light-transmitting package body 80, and exposes the top surface of the first light-transmitting package body 70 and the second light-transmitting package body 80, forming a larger rectangular parallelepiped with two smaller rectangular parallelepiped cavities inside. In other embodiments, the opaque package body 90 may also cover a portion of the top surface of the first light-transmitting package body 70 and / or the second light-transmitting package body 80, and only expose a portion of the top surface corresponding to the light-emitting area of ​​the first light source 20 and the light-receiving area of ​​the light-sensing chip 40.

[0081] The first light-transmitting packaging body 70, the second light-transmitting packaging body 80 and the opaque packaging body 90 proposed in the embodiment of the present application are formed by a molding process, so that the first light source 20, the second light source 30 and the light sensing chip 40 are wrapped by the packaging material, the first light source 20, the second light source 30 and the light sensing chip 40 are less affected by environmental water vapor, and the mass production cost is low.

[0082] In some embodiments, the first light-transmitting encapsulation body 70 and the second light-transmitting encapsulation body 80 are formed by a dispensing and curing process, and the light-opaque encapsulation body 90 is formed by a molding process.

[0083] The glue-dispensing curing process refers to the glue-dispensing curing of the packaging material on the space to be packaged by the glue-dispensing curing equipment. For example, a glue-dispensing curing equipment and a mold are provided; the light-transmitting material is dripped on the first light source 20 by the glue-dispensing curing equipment, and the shape of the light-transmitting material is adjusted by controlling the flow rate and moving the glue-dispensing equipment according to the fluidity and tension of the light-transmitting material, and the light-transmitting material is gradually cured during the adjustment process to form a first light-transmitting package 70 of a specific shape; similarly, the light-transmitting material is dripped on the light-emitting area 31 of the second light source 30 and the light-receiving area 41 of the light-sensing chip 40 by the glue-dispensing curing equipment, and the shape of the light-transmitting material is adjusted by controlling the flow rate and moving the glue-dispensing equipment according to the fluidity and tension of the light-transmitting material, and the light-transmitting material is gradually cured during the adjustment process to form a second light-transmitting package 80 of a specific shape; a cavity containing the first light-transmitting package 70 and the second light-transmitting package 80 is formed by the mold, and then the opaque material is injected to form an opaque package 90 that fills the gap on the substrate 10 except the first light-transmitting package 70 and the second light-transmitting package 80.

[0084] Specifically, in Figure 7 and Figure 8In the illustrated embodiment, the first light-transmitting package body 70 is formed on the first light source 20 to cover the light-emitting area of ​​the first light source 20. The first light-transmitting package body 70 is in a tapered shape that is wide at the bottom and narrow at the top, and the area of ​​the cross section gradually decreases in the direction away from the first light source 20. The second light-transmitting package body 80 is formed on the second light source 30 and the light-sensing chip 40 and covers the light-emitting area of ​​the second light source 30 and the light-receiving area of ​​the light-sensing chip 40. The second light-transmitting package body 80 is a special-shaped structure with an asymmetric protrusion, including a bottom with a gently changing thickness and a tapered protrusion that protrudes upwards and is formed at the bottom corresponding to the position of the light-receiving area of ​​the light-sensing chip 40. The opaque package body 90 is disposed on the substrate 10 and surrounds the first light-transmitting package body 70 and the second light-transmitting package body 80 to fill the gap on the substrate 10 except for the first light-transmitting package body 70 and the second light-transmitting package body 80. The top of the conical first light-transmitting package body 70 is exposed from the light-opaque package body 90, so that the first light beam emitted by the first light source 20 can be emitted through the exposed top of the first light-transmitting package body 70. The top of the conical protrusion on the second light-transmitting package body 80 is exposed from the light-opaque package body 90 to receive the light beam returned from the field of view. The bottom of the second light-transmitting package body 80 that wraps the second light source 30 is covered by the light-opaque package body 90. Since the second light-transmitting package body 80 only exposes the conical protrusion corresponding to the light receiving area of ​​the light-sensing chip 40, the interference caused by stray light outside the preset field of view can be reduced. In addition, the shape of the package body can be adjusted during the formation process through the glue dispensing and curing method, and the shapes of the first light-transmitting package body 70 and the second light-transmitting package body 80 formed have a high degree of adjustment flexibility.

[0085] The first light-transmitting packaging body 70 and the second light-transmitting packaging body 80 proposed in the embodiment of the present application are formed by a glue dispensing and curing process, and the opaque packaging body 90 is formed by a molding and plastic sealing process, so that the first light source 20, the second light source 30 and the light sensing chip 40 are wrapped by glue dispensing. The first light source 20, the second light source 30 and the light sensing chip 40 are less affected by environmental moisture, and the mass production cost is low; the opaque packaging body 90 is then formed by a mold, which can reduce the pressure on the first light source 20, the second light source 30 and the light sensing chip 40 and improve the protection during the production process.

[0086] In some embodiments, the shape of the first light-transmitting package body 70 and the shape of the second light-transmitting package body 80 are irregular shapes, the first light-transmitting package body 70 covers the light-emitting area 21 of the first light source 20, and the second light-transmitting package body 80 covers the light-emitting area 31 of the second light source 30 and the light receiving area 41 of the light-sensing chip 40. The opaque package body 90 is arranged around the first light-transmitting package body 70 and the second light-transmitting package body 80, and the opaque package body 90 covers the first metal wire, the second metal wire, and the third metal wire.

[0087] See also Fig. 9 As shown, Fig. 9 1 is a flow chart of an embodiment of a method for preparing a light sensing ranging module provided in the present application. The method for preparing a light sensing ranging module 100 provided in the embodiment of the present application is used to manufacture the light sensing ranging module 100 of the above embodiment, and the preparation method comprises the following steps: Step S101 : disposing the first light source 20 , the second light source 30 and the light sensing chip 40 on the substrate 10 .

[0088] In some embodiments, a substrate 10 is provided, and the substrate 10 may be a printed circuit board, and the substrate 10 has the necessary circuit traces to realize the electrical connection function, and the substrate 10 may be a single-layer structure or a multi-layer structure. The first light source 20, the second light source 30, and the light sensing chip 40 are disposed on the substrate 10.

[0089] Step S102 : forming a first light-transmitting encapsulation body 70 at least covering the light-emitting area of ​​the first light source 20 .

[0090] The first light beam emitted by the first light source 20 is emitted to the field of view through the first light-transmitting package 70 .

[0091] Step S103 : forming a second light-transmitting package body 80 that at least covers the light-emitting area of ​​the second light source 30 and the light-receiving area of ​​the light-sensing chip 40 .

[0092] The second light beam emitted by the second light source 20 can be transmitted to the light receiving area of ​​the light sensor chip 40 in the second light-transmitting package 80 by total reflection, scattering or / and other suitable methods.

[0093] Step S104 : forming a light-impermeable encapsulation body 90 on the substrate 10 to fill the gaps on the substrate 10 except for the first light-transmitting encapsulation body 70 and the second light-transmitting encapsulation body 80 .

[0094] The portion of the opaque encapsulation body 90 between the first light-transmitting encapsulation body 70 and the second light-transmitting encapsulation body 80 forms a retaining wall 50 .

[0095] In some embodiments, Figure 5 and Figure 6 As shown, step S102 includes the following steps: using a molding process to cover at least the light emitting area of ​​the first light source 20 with a light-transmitting material to form a first light-transmitting encapsulation body 70 .

[0096] Optionally, a first mold is provided, a cavity is formed by the first mold, and then a light-transmitting material is injected to form a first light-transmitting encapsulation body 70 encapsulating the first light source 20 .

[0097] Step S103 includes the following steps: using a molding process to cover at least the light emitting area of ​​the second light source 30 and the light receiving area of ​​the light sensor chip 40 with a light-transmitting material to form a second light-transmitting package 80 .

[0098] Optionally, a second mold is provided, a cavity is formed by the second mold, and then a light-transmitting material is injected to form a second light-transmitting package body 80 that encapsulates the second light source 30 and the light-sensing chip 40 .

[0099] Step S104 includes the following steps: filling the gaps on the substrate 10 except the first light-transmitting encapsulation body 70 and the second light-transmitting encapsulation body 80 with a light-impermeable material through a molding process to form a light-impermeable encapsulation body 90 .

[0100] Optionally, a third mold is provided to form a cavity accommodating the first light-transmitting package body 70 and the second light-transmitting package body 80, and then an opaque material is injected to form an opaque package body 90 that fills the gaps on the substrate 10 except the first light-transmitting package body 70 and the second light-transmitting package body 80.

[0101] In some embodiments, Figure 7 As shown, step S102 includes the following steps: using a dispensing and curing process to cover at least the light emitting area 21 of the first light source 20 with a light-transmitting material to form a first light-transmitting encapsulation body 70 .

[0102] Optionally, a glue dispensing and curing device is provided, by which the light-transmitting material is dispensed onto the light-emitting area 21 of the first light source 20 , and the light-transmitting material is cured to form a first light-transmitting package 70 on the light-emitting area 21 of the first light source 20 .

[0103] Step S103 includes the following steps: using a dispensing and curing process to cover at least the light emitting area 31 of the second light source 30 and the light receiving area 41 of the light sensing chip 40 with a light-transmitting material to form a second light-transmitting package 80 .

[0104] Specifically, for example, the light-transmitting material can be dispensed onto the light-emitting area 31 of the second light source 30 by means of a dispensing and curing device; the dispensing head is translated to apply the light-transmitting material from the light-emitting area 31 of the second light source 30 to the light-receiving area 41 of the light-sensing chip 40 to form a bottom of the second light-transmitting package 80 covering the light-emitting area 31 of the second light source 30 and the light-receiving area 41 of the light-sensing chip 40; the dispensing head is translated to the light-receiving area 41 of the light-sensing chip 40 and lifted in a direction away from the substrate 10 to form a conical protrusion of the second light-transmitting package 80.

[0105] Step S104 includes the following steps: filling the gaps on the substrate 10 except the first light-transmitting encapsulation body 70 and the second light-transmitting encapsulation body 80 with a light-impermeable material through a molding process to form a light-impermeable encapsulation body 90 .

[0106] Specifically, for example, a fourth mold can be provided, through which a cavity accommodating the first light-transmitting package body 70 and the second light-transmitting package body 80 is formed, and then opaque material is injected to fill the gaps on the substrate 10 except for the first light-transmitting package body 70 and the second light-transmitting package body 80 to form the opaque package body 90.

[0107] This application embodiment proposes a laser radar, see Fig.10 As shown, Fig.10 The laser radar 200 includes the light sensing ranging module 100 of the above embodiment, which will not be described in detail here.

[0108] In some embodiments, the laser radar 200 further includes a scanning unit 201 , which can be configured to adjust the sensing direction of the light sensing ranging module 100 to expand the sensing range of the light sensing ranging module 100 .

[0109] The scanning unit 201 can optically adjust the sensing direction of the light sensing distance measuring module 100. For example, the scanning unit 201 is a micro-electro-mechanical system (MEMS) galvanometer, which can be configured to reflect the first light beam emitted by the light sensing distance measuring module 100 to different angles by deflecting a micro-reflector.

[0110] The present application embodiment provides an electronic device, see Fig.11 As shown, Fig.11 It is a schematic diagram of the framework of an embodiment of an electronic device provided by the present application. The electronic device 300 includes an application device 301 and a laser radar 200. The application device 301 is configured to perform corresponding preset operations or implement corresponding functions based on the ranging results of the laser radar 200, such as but not limited to: judging whether an object appears within a preset detection range in front of the electronic device according to the ranging results; or controlling the movement of the electronic device to avoid obstacles according to the ranging results; or implementing 3D modeling, face recognition, machine vision, etc. according to the ranging results. The laser radar 200 can specifically be the laser radar 200 described in the above embodiment, which will not be repeated here.

[0111] The application device 301 may specifically include a processor and a memory.

[0112] It should be understood that the laser radar 200 of the above embodiment may also include a processor and a memory.

[0113] The processor and the memory are connected to the bus respectively. The memory stores program instructions. The processor is used to execute the program instructions to realize the functions of the laser radar in the above embodiment.

[0114] In this embodiment, the processor may also be referred to as a CPU (Central Processing Unit). The processor may be an integrated circuit chip with signal processing capabilities. The processor may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0115] Optionally, in some embodiments, the electronic device 300 is, for example, a car, and the laser radar 200 can be installed at multiple different positions on the car to detect distance information of objects within the surrounding area of ​​the car and implement driving control accordingly.

[0116] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0117] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A light sensing distance measurement module, characterized in that: Configured to perform distance sensing for a preset field of view, the light sensing ranging module includes a substrate and a first light source, a second light source and a light sensing chip arranged on the substrate, the first light source is configured to emit a first light beam to the field of view, the second light source is configured to emit a second light beam to the light sensing chip, and the light sensing chip is configured to perform distance sensing based on the sensed second light beam and the light beam from the field of view.

2. The optical sensing distance measurement module according to claim 1, characterized in that: The optical power of the first light beam emitted by the first light source is greater than the optical power of the second light beam emitted by the second light source.

3. The light sensing distance measuring module according to claim 1, characterized in that: There is a time interval greater than zero between the moment when the first light source emits the first light beam and the moment when the second light source emits the second light beam; Alternatively, when the first light source emits the first light beam, the second light source simultaneously emits the second light beam.

4. The light sensing distance measuring module according to claim 1, characterized in that: The light sensing ranging module includes a baffle wall, which is configured to separate the first light source from the second light source and the light sensing chip to block the first light beam from being emitted to the light sensing chip.

5. The light sensing distance measuring module as claimed in claim 4, characterized in that: The second light source is located between the first light source and the light sensing chip, and the blocking wall is arranged between the first light source and the second light source.

6. The light sensing distance measuring module as claimed in claim 4, characterized in that: The light-sensing ranging module includes a shell, which is arranged on the base, and the shell and the base cooperate to form a cavity. The baffle wall is arranged in the cavity, and the baffle wall is configured to separate the cavity into a first cavity and a second cavity. The first light source is located in the first cavity, and the second light source and the light-sensing chip are located in the second cavity; a first opening corresponding to the first light source is provided on the shell, and the first light beam is emitted to the field of view through the first opening; a second opening corresponding to the light-sensing chip is provided on the shell, and the light beam from the field of view is transmitted to the light-sensing chip through the second opening, and the second light beam is reflected to the light-sensing chip through the inner surface of the shell.

7. The light sensing distance measuring module as claimed in claim 6, characterized in that: The shell comprises a top and side walls, wherein the side walls extend from the edges of the top to enclose the cavity together with the top, and the retaining wall extends from the inner surface of the top in the cavity and is connected to the side walls.

8. The light sensing distance measuring module as claimed in claim 4, characterized in that: The light sensing distance measuring module comprises a first light-transmitting package body, a second light-transmitting package body and an opaque package body, wherein the first light-transmitting package body is at least arranged on the light-emitting area of ​​the first light source, so that the first light beam is emitted to the field of view through the first light-transmitting package body; The second light-transmitting package is at least arranged on the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip, so that the second light beam and the light beam from the field of view are transmitted to the light-sensing chip through the second light-transmitting package; The light-impermeable encapsulation body is configured to fill the gap on the substrate except the first light-transmitting encapsulation body and the second light-transmitting encapsulation body, and a portion of the light-impermeable encapsulation body located between the first light-transmitting encapsulation body and the second light-transmitting encapsulation body forms the retaining wall.

9. The light sensing distance measuring module as claimed in claim 8, characterized in that: The first light-transmitting encapsulation body, the second light-transmitting encapsulation body and the opaque encapsulation body are formed by a molding process.

10. The light sensing distance measuring module according to claim 8, characterized in that: The first light-transmitting packaging body and the second light-transmitting packaging body are formed by a dispensing and curing process, and the opaque packaging body is formed by a molding and plastic packaging process.

11. A method for preparing a light sensing distance measurement module, characterized in that: include: Disposing a first light source, a second light source and a light sensing chip on a substrate; forming a first light-transmitting encapsulation body at least covering the light-emitting area of ​​the first light source; forming a second light-transmitting encapsulation body at least covering the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip; A light-impermeable encapsulation body is formed on the substrate to fill the gap on the substrate except the first light-transmitting encapsulation body and the second light-transmitting encapsulation body.

12. The preparation method according to claim 11, characterized in that: The step of forming a first light-transmitting encapsulation body at least covering the light-emitting area of ​​the first light source comprises: Covering at least the light emitting area of ​​the first light source with a light-transmitting material by a molding process to form the first light-transmitting encapsulation body; The step of forming a second light-transmitting package body at least covering the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip comprises: The light-transmitting material is covered at least on the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip by the molding process to form the second light-transmitting package; The step of forming a light-proof encapsulation body on the substrate comprises: The light-proof material is filled into the gaps on the substrate except the first light-proof encapsulation body and the second light-proof encapsulation body through the molding process to form the light-proof encapsulation body.

13. The preparation method according to claim 11, characterized in that: The step of forming a first light-transmitting encapsulation body at least covering the light-emitting area of ​​the first light source comprises: Covering the light-transmitting material at least above the light-emitting area of ​​the first light source by a dispensing and curing process to form the first light-transmitting encapsulation body; The step of forming a second light-transmitting package body at least covering the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip comprises: Covering the light-transmitting material at least on the light-emitting area of ​​the second light source and the light-receiving area of ​​the light-sensing chip through the glue-dispensing and curing process to form the second light-transmitting package; The step of forming a light-proof encapsulation body on the substrate comprises: The light-proof material is filled into the gaps on the substrate except the first light-proof encapsulation body and the second light-proof encapsulation body through a molding process to form the light-proof encapsulation body.

14. A laser radar, characterized in that: It comprises a light sensing ranging module as described in any one of claims 1-10.

15. An electronic device, characterized in that: The electronic device includes an application device and the laser radar as claimed in claim 14, the application device is connected to the laser radar, and the application device is configured to perform corresponding preset operations based on the ranging results obtained by the laser radar.

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