Chip micro-jet liquid cooling and immersed liquid cooling module combination device

Abstract

The invention discloses a chip micro-jet liquid cooling and immersed liquid cooling module combination device which comprises a liquid cooling rack, a heat exchanger, a pump and a main liquid cooling connector are fixed on the liquid cooling rack, a micro-jet liquid cooling plate and an immersed liquid cooling plate are further inserted into the liquid cooling rack, a fan is fixed on the heat exchanger, and a fan is fixed on the immersed liquid cooling plate. The micro-jet liquid cooling plate and the immersed liquid cooling plate are both arranged on one side of the heat exchanger, the fan is arranged on the other side of the heat exchanger, an internal pipeline is arranged in the liquid cooling rack, the two ends of the internal pipeline are communicated with the two main liquid cooling connectors respectively, and the two ends of the internal pipeline are communicated with the heat exchanger. And joints for enabling the internal pipelines to be communicated with the interiors of the micro-jet liquid cooling plate and the immersed liquid cooling plate are respectively arranged at the mounting positions of the micro-jet liquid cooling plate and the immersed liquid cooling plate on the liquid cooling rack. The device has the characteristics of efficient heat dissipation, simple structure, high reliability, energy conservation, environmental protection, high adaptability and wide application prospect.

Description

Technical Field

[0001] The invention relates to a chip micro-spray liquid cooling and immersion liquid cooling module combination device, belonging to the technical field of electronic device heat dissipation. Background Art

[0002] With the rapid development of electronic information technology, the integration and performance of chips as one of the core components of electronic equipment are constantly improving, and the heat generation power is also increasing sharply. Excessive temperature will affect the stability and life of the chip. How to effectively dissipate heat has become one of the key issues restricting the further improvement of chip performance. The traditional air cooling method has limited heat dissipation efficiency and it is difficult to meet the heat dissipation requirements of high-power chips. Liquid cooling technology has gradually become a research hotspot due to its efficient heat dissipation.

[0003] Liquid cooling technology is to remove the heat generated by the chip by flowing the coolant on the surface of the chip or inside the structural parts. At present, the common liquid cooling methods are mainly immersion liquid cooling, cold plate liquid cooling, etc. However, while these liquid cooling methods solve the chip heat dissipation problem to a certain extent, there are still some shortcomings. For example, cold plate liquid cooling may affect the efficiency of heat dissipation due to the contact thermal resistance between the chip and the cold plate and the limitations of the internal flow channel design of the cold plate; immersion liquid cooling has high requirements on the insulation of the coolant, and at the same time has high requirements on the compatibility of electronic components and coolant, and there may be drawbacks such as coolant leakage and excessive coolant leading to increased weight. In addition, the cost of a simple immersion liquid cooling system is high and maintenance is also more difficult. Summary of the invention

[0004] The technical problem to be solved by the present invention is: how to avoid the cold plate liquid cooling which may affect the heat dissipation efficiency due to the contact thermal resistance between the chip and the cold plate and the limitations of the internal flow channel design of the cold plate; the immersion liquid cooling has very high requirements on the insulation of the coolant, and at the same time has relatively high requirements on the compatibility of electronic components and the coolant, and there may be problems such as coolant leakage and excessive coolant leading to increased weight.

[0005] In order to solve the above technical problems, the technical solution of the present invention is to provide a chip micro-spray liquid cooling and immersion liquid cooling module combination device, which is characterized in that it includes a liquid cooling rack, a heat exchanger, a pump, and a total liquid cooling joint are fixed on the liquid cooling rack, and a micro-spray liquid cooling plate and an immersion liquid cooling plate are also plugged into the liquid cooling rack, a fan is fixed on the heat exchanger, the micro-spray liquid cooling plate and the immersion liquid cooling plate are both arranged on one side of the heat exchanger, and the fan is arranged on the other side of the heat exchanger. There are at least two total liquid cooling joints, and an internal pipeline is arranged in the liquid cooling rack, and the two ends of the internal pipeline are respectively connected to the two total liquid The cold joint is connected, and the installation positions of the micro-spray liquid cooling plate and the immersion liquid cooling plate on the liquid cooling rack are respectively provided with joints that connect the internal pipelines to the micro-spray liquid cooling plate and the immersion liquid cooling plate; the micro-spray liquid cooling plate includes a spray chamber, the upper part of the spray chamber is connected to the condenser inlet through a pipeline, the condenser outlet is connected to the pump inlet through a pipeline, the lower end of the spray chamber is connected to the pump inlet through a pipeline, the pump outlet is connected to the heat exchanger inlet through a pipeline, the heat exchanger outlet is connected to the nozzle located at the upper part of the spray chamber through a pipeline, and a micro-spray main chip is provided directly below the nozzle in the spray chamber.

[0006] Preferably, a fluid control valve is provided on the pipeline between the outlet end of the heat exchanger and the spray chamber.

[0007] Preferably, the micro-spray liquid cooling plate includes a jet evaporative condensation device and a micro-spray liquid cooling device arranged on the jet evaporative condensation device, the micro-spray liquid cooling device includes an inlet pipe, the outlet end of the inlet pipe is connected to one end of the cold liquid chamber, the other end of the cold liquid chamber is connected to the nozzle plate, a plurality of holes are provided on the nozzle plate, and are connected to one end of a plurality of nozzles, the other ends of the plurality of nozzles are arranged in the steam chamber, a plurality of steam branch pipes are also provided in the steam chamber, the top end of the steam chamber is connected to one end of the steam main pipe, the other end of the steam main pipe is connected to the outlet pipe, the other ends of the plurality of nozzles and one ends of the plurality of steam branch pipes are all arranged directly above the micro-spray main chip and close to the position of the micro-spray main chip, and one side of the bottom of the steam chamber is connected to the outlet pipe; the steam chamber and the cold liquid chamber are not directly connected, and the two are separated by the nozzle plate and the nozzle; the inlet pipe, the cold liquid chamber, and the steam chamber together constitute a spray chamber.

[0008] Preferably, a plurality of screw holes are evenly distributed on the outside of the spray chamber, and the micro-spray liquid cooling device is fastened to a fixed bracket on the back of the printed circuit board by installing screws through the screw holes and the holes of the printed circuit board, and a micro-spray main chip is provided between the spray chamber and the printed circuit board.

[0009] Preferably, a thermal pad is provided between the surface of the micro-spray main chip and the micro-spray liquid cooling device.

[0010] Preferably, the jet evaporative condensation device includes a printed circuit board, on which a micro-spray main chip and a micro-spray sub-chip are fixed, and a micro-spray internal pipeline is provided in the jet evaporative condensation device, and the two ends of the micro-spray internal pipeline are respectively connected to two micro-spray joints, and the two micro-spray joints are arranged on the side of the jet evaporative condensation device; when the micro-spray liquid cooling plate is installed on the liquid cooling rack, the two micro-spray joints are respectively connected to the joints of the internal pipeline located at the position of the micro-spray liquid cooling plate on the liquid cooling rack; the micro-spray internal pipeline is located at the position of the micro-spray main chip on the jet evaporative condensation device. Joints that are respectively connected to the inlet pipe and the outlet pipe are provided.

[0011] Preferably, the immersion liquid cooling plate includes a sealed cold plate, an immersion cavity is provided in the sealed cold plate, two immersion joints connected to the immersion cavity are provided on the outside of the sealed cold plate, the immersion cavity is connected to the immersion main chip and the immersion low-power chip respectively, the immersion main chip and the immersion low-power chip are both immersed in the immersion cavity, and a heat sink is provided on the outside of the immersion main chip; when the immersion liquid cooling plate is installed on a liquid cooling rack, the two immersion joints are respectively connected to the joints of the internal pipeline on the liquid cooling rack located at the position of the immersion liquid cooling plate.

[0012] Preferably, the two total liquid cooling joints are connected to an external cooling liquid circulation system; or when the internal pipeline is filled with cooling liquid, the two total liquid cooling joints are directly blocked.

[0013] Preferably, the micro-spray liquid cooling plate comprises a jet evaporative condensing device and a micro-spray liquid cooling device arranged on the jet evaporative condensing device, the micro-spray liquid cooling device comprises a shell, the top of the shell is an inlet pipe and a steam chamber, the outlet end of the inlet pipe is connected to one end of the cold liquid chamber, the other end of the cold liquid chamber is connected to a nozzle plate, a plurality of holes are arranged on the nozzle plate, a flow stabilizing plate facing the outlet end of the inlet pipe is arranged in the cold liquid chamber, the flow stabilizing plate is directly or indirectly connected to the inner wall of the shell, and a channel connected to the nozzle plate is arranged between the flow stabilizing plate and the inner wall of the shell or on the flow stabilizing plate, the bottom of the shell is sealed and fixed on the printed circuit board, a micro-spray main chip is arranged in the shell, the micro-spray main chip is fixed on the printed circuit board and is located directly below the nozzle plate; the bottom of the nozzle plate is connected to the steam chamber, the top of the steam chamber is connected to one end of the steam main pipe, the other end of the steam main pipe is connected to the outlet pipe, and the bottom of one side of the shell is connected to the outlet pipe; the steam chamber and the cold liquid chamber are not directly connected, and the two are separated by the nozzle plate.

[0014] The present invention can be applied to the field of electronic equipment cooling, and can realize the free combination and application of a single module or several modules. The present invention can be flexibly used in combination with existing liquid cooling modules. The focus of the micro-spray liquid cooling technology is a liquid-gas two-phase exchange heat transfer technology. Fine droplets are formed by micro-nozzles and sprayed onto the contact surface with the chip. The cooling of the chip depends on the boiling phase change of the droplets, and the release of heat depends on the condensation phase change. There are gas-liquid phase changes and two-phase mixing, which greatly improves the heat exchange efficiency. At the same time, the structure of the micro-spray liquid cooling device is miniaturized to meet the needs of modular structure. This type of module with a micro-spray structure can meet the design of chips with 1 to 2 high-power CPUs, GPUs, etc. within a limited size. The immersion cooling module used in combination can meet the scenario where multiple high-power chips are distributed more evenly.

[0015] Compared with the prior art, the present invention has at least one of the following beneficial effects:

[0016] 1. Efficient heat dissipation

[0017] The micro-spraying technology can spray the coolant in the form of mist droplets onto the contact surface with the chip to form a uniform liquid film. When the chip heats up, the mist droplets evaporate, absorb the heat generated by the chip, and change phase to form gas, thereby improving the heat dissipation efficiency. Compared with the traditional liquid cooling method, the chip micro-spraying device of the present invention has higher heat dissipation efficiency.

[0018] The immersion cooling module can immerse the entire circuit board in the FC coolant, greatly reducing thermal resistance, improving the heat dissipation capacity of the entire module, and reducing the temperature difference of the module.

[0019] 2. Simple structure and high reliability

[0020] The chip micro-spray liquid cooling and immersion liquid cooling module combination device of the present invention has a compact and simple structure, is easy to process and manufacture, and the chip can be installed independently. Compared with the traditional liquid cooling method, the chip micro-spray liquid cooling or immersion liquid cooling module device of the present invention can provide users with a more stable working environment.

[0021] 3. Energy saving and environmental protection

[0022] The chip micro-spray liquid cooling device of the present invention adopts a circulating cooling method. The micro-spray principle is phase change cooling. The main process includes coolant injection, atomization, evaporation, condensation and circulation, etc., which can save the amount of coolant used. The design method of the immersion liquid cooling module can improve the energy efficiency ratio of electronic equipment. Compared with the traditional liquid cooling method, the chip micro-spray liquid cooling device of the present invention is more energy-saving and environmentally friendly.

[0023] 4. Strong adaptability and broad application prospects

[0024] The chip micro-spray liquid cooling device of the present invention is chip-level, and a cooling device can be designed for each chip individually. At the same time, the device can also be combined with other heat dissipation forms to form a hybrid heat dissipation system to further improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of a chip micro-spray liquid cooling and immersion liquid cooling module combination device;

[0026] Figure 2 This is the working principle diagram of the micro-spray liquid cooling plate;

[0027] Figure 3 This is a schematic diagram of the installation of a micro-spray liquid cooling device;

[0028] Figure 4 It is a structural schematic diagram of a micro-spray liquid cooling device;

[0029] Figure 5 This is a schematic diagram of the liquid flow in the micro-spray liquid cooling device;

[0030] Figure 6 It is a schematic diagram of the jet evaporation condensation device;

[0031] Figure 7 It is the overall schematic diagram of the immersion liquid cooling plate;

[0032] Figure 8 Schematic diagram of the internal structure of the micro-spray liquid cooling device. DETAILED DESCRIPTION

[0033] In order to make the present invention more clearly understood, preferred embodiments are described in detail below with reference to the accompanying drawings.

[0034] Example 1

[0035] The present invention provides a chip micro-spray liquid cooling and immersion liquid cooling module combination device, such as Figure 1-Figure 8As shown, it includes a liquid cooling rack 1, a heat exchanger 2, a fan 3, a pump 6 (a gear pump is optional), a total liquid cooling joint 5, a micro-spray liquid cooling plate 4, an immersion liquid cooling plate 7, and FC (fluorinated liquid) coolant (having the characteristics of electrical insulation, good compatibility with electronic devices and PCB (printed circuit board)), etc. The fan 3 is fixed on the heat exchanger 2, and the heat exchanger 2, the pump 6, the total liquid cooling joint 5, the micro-spray liquid cooling plate 4, and the immersion liquid cooling plate 7 are all fixed on the liquid cooling rack 1. There are two total liquid cooling joints 5. An internal pipeline is provided in the liquid cooling rack 1. The two ends of the internal pipeline are connected to the two total liquid cooling joints 5 respectively. The installation positions of the micro-spray liquid cooling plate 4 and the immersion liquid cooling plate 7 on the liquid cooling rack 1 are respectively provided with joints that connect the internal pipelines to the micro-spray liquid cooling plate 4 and the immersion liquid cooling plate 7 (at the same time, there are sealing plugs matching each joint). The micro-spray liquid cooling plate 4 and the immersion liquid cooling plate 7 are both arranged on one side of the heat exchanger 2 , and the fan 3 is arranged on the other side of the heat exchanger 2 .

[0036] The two total liquid cooling joints 5 can be connected to an external cooling liquid circulation system, or the two total liquid cooling joints 5 can be directly blocked to form a circulation pipeline through the cooling liquid in the internal pipeline of the liquid cooling rack 1.

[0037] The above key components can be integrated into a system to form a standardized electronic product (ATR chassis). In this embodiment, the liquid cooling rack 1 is a through-type liquid cooling rack. The pump 6 is a liquid pump.

[0038] The selection and function of each component are as follows:

[0039] (1) The liquid cooling rack 1 provides module installation and cooling liquid circulation, and is provided with internal pipes;

[0040] (2) The heat exchanger 2 provides a heat exchange environment between the coolant and the external air, and then transfers a large amount of heat to the surrounding environment through the fan 3;

[0041] (3) The selection of pump 6 can be based on different environmental conditions. When the fluid power is provided by an external device, pump 6 may not be arranged here; when the coolant circulation power is provided by itself, a gear pump can be preferably selected as the power to meet the requirements of miniaturization and strong power.

[0042] (4) Liquid cooling joints are divided into two types: rack-level joints (i.e., total liquid cooling joints 5) and module-level joints (i.e., micro-spray joints 403, immersion joints 71). Both are self-sealing sealing joints to ensure that there is no leakage during the plug-in and unplugging process and the fluid circulation process. The rack-level liquid cooling joints are installed at the inlet and outlet positions of the liquid cooling rack 1, and the number can be adjusted according to actual needs. The socket of the module-level liquid cooling joint is installed near the backplane of the liquid cooling rack 1, and forms a corresponding relationship with the plug of the module-level liquid cooling joint. After the module is inserted, the module position is fixed by the locking strip and the puller to avoid the module falling off during vibration or leakage at the module-level liquid cooling joint;

[0043] (5) The overall schematic diagram of the chip micro-spray liquid cooling system is as follows Figure 2 As shown, it is mainly composed of a spray chamber 41, a condenser 42, a pump 6, a heat exchanger 2 and a fluid control valve 45. The upper part of the spray chamber 41 is connected to the inlet end of the condenser 42 through a pipeline, the outlet end of the condenser 42 is connected to the inlet end of the pump 6 through a pipeline, the lower end of the spray chamber 41 is connected to the inlet end of the pump 6 through a pipeline, the outlet end of the pump 6 is connected to the inlet end of the heat exchanger 2 through a pipeline, and the outlet end of the heat exchanger 2 is connected to the nozzle located at the upper part of the spray chamber 41 through a pipeline. A micro-spray main chip 401 is provided just below the nozzle in the spray chamber 41. A fluid control valve 45 is provided on the pipeline between the outlet end of the heat exchanger 2 and the spray chamber 41.

[0044] The principle of micro-spraying is phase change cooling, and the main processes include coolant injection, atomization, evaporation, condensation, external heat exchange and circulation. Specifically:

[0045] When the micro-spray main chip 401 is working, the pump 6 transports the coolant in the condenser 42 to the nozzle of the spray chamber 41 through the heat exchanger 2, and sprays tiny mist coolant through the nozzle to form a uniform coolant film on the contact surface with the micro-spray main chip 401. On the one hand, the coolant film will evaporate when it encounters the hot micro-spray main chip 401, thereby taking away the heat generated by the micro-spray main chip 401 and then flowing back to the condenser 42; on the other hand, the coolant film can also take away part of the heat generated by the micro-spray main chip 401 after absorbing the heat generated by the micro-spray main chip 401. The coolant that has absorbed the heat flows back to the pump 6 from the surface of the micro-spray main chip 401 and is cooled through the heat exchanger 2 to form a cycle. Figure 3 , Figure 4 and Figure 5 shown.

[0046] The micro-spray liquid cooling plate 4 includes a jet evaporation condensation device 43 and a micro-spray liquid cooling device 44. The micro-spray liquid cooling device 44 includes an inlet pipe 440. The outlet end of the inlet pipe 440 is connected to one end of a cold liquid chamber 441. The other end of the cold liquid chamber 441 is connected to a nozzle plate 442. The nozzle plate 442 is provided with a plurality of holes and is connected to one end of a plurality of nozzles 443. The other ends of the plurality of nozzles 443 are arranged in a steam chamber 446. A plurality of steam branch pipes 445 are also arranged in the steam chamber 446. The top of the steam chamber 446 is connected to one end of a steam main pipe 447. The other end of the steam main pipe 447 is connected to an outlet pipe 448. The other ends of the plurality of nozzles 443 and one end of the plurality of steam branch pipes 445 are both arranged directly above and close to the micro-spray main chip 401. One side of the bottom of the steam chamber 446 is connected to the outlet pipe 448. The steam chamber 446 and the cold liquid chamber 441 are not directly connected, but are separated by the nozzle plate 442 and the nozzle 443 .

[0047] Among them, the inlet pipe 440, the cold liquid chamber 441, and the steam chamber 446 together constitute the spray chamber 41. A plurality of screw holes 444 are evenly distributed on the outside of the spray chamber 41 (in this embodiment, four screw holes 444 are located at the four corners of the spray chamber 41). The micro-spray liquid cooling device 44 passes through the screw holes 444 and the holes of the printed circuit board 47 through the mounting screws 46, and is then fastened to the fixing bracket 49 on the back of the printed circuit board 47 (the fixing bracket 49 is provided with corresponding threaded holes). A micro-spray main chip 401 is provided between the spray chamber 41 and the printed circuit board 47.

[0048] A high thermal conductivity heat dissipation material is added between the surface of the micro-spray main chip 401 and the micro-spray liquid cooling device 44 to improve the chip heat dissipation efficiency. In this embodiment, a thermal pad 48 is added between the spray chamber 41 and the micro-spray main chip 401.

[0049] The nozzle structure can be optimized to expand the coolant spray range and improve the coolant atomization ability. The solution adopts a uniformly distributed multi-nozzle system.

[0050] Within the limited size, the nozzle density is increased as much as possible and evenly distributed to expand the actual contact area between the coolant and the chip (i.e., the micro-spray main chip 401); it also helps to reduce the height of the micro-spray liquid cooling device 44 to adapt to the modular structure.

[0051] The evaporation and condensation temperature ranges can be determined according to the actual working temperature, and the cooling liquid with the corresponding temperature characteristics can be selected; at the same time, in order to improve the external heat exchange efficiency, a cooling liquid with high thermal conductivity can be selected after comprehensive consideration. In this embodiment, the FC cooling liquid model can be FC-40.

[0052] The jet evaporative condensation device 43 includes a printed circuit board 47, on which a micro-spray main chip 401 and a micro-spray sub-chip 402 are fixed, and a micro-spray internal pipeline is arranged in the jet evaporative condensation device 43, and two ends of the micro-spray internal pipeline are respectively connected to two micro-spray joints 403, and the two micro-spray joints 403 are arranged on the side of the jet evaporative condensation device 43. When the micro-spray liquid cooling plate 4 is installed on the liquid cooling rack 1, the two micro-spray joints 403 are respectively connected to the joints of the internal pipeline located at the position of the micro-spray liquid cooling plate 4 on the liquid cooling rack 1. The micro-spray internal pipeline is provided with joints connected to the inlet pipe 440 and the outlet pipe 448 respectively at the position of the micro-spray main chip 401 on the jet evaporative condensation device 43. The circuit board and the pressure plate integrated jet evaporative condensation module of the micro-spray structure and the high-power consumption chip are as follows. Figure 6 shown.

[0053] like Figure 7As shown, the immersion liquid cooling plate 7 includes a sealed cold plate, an immersion cavity 72 is provided in the sealed cold plate, two immersion joints 71 connected to the immersion cavity 72 are provided on the outside of the sealed cold plate, the immersion cavity 72 is connected to the immersion main chip 73 and the immersion low power chip 74 respectively, the immersion main chip 73 and the immersion low power chip 74 are both immersed in the immersion cavity 72, and a heat sink is provided on the outside of the immersion main chip 73. When the immersion liquid cooling plate 7 is installed on the liquid cooling rack 1, the two immersion joints 71 are respectively connected to the joints of the internal pipeline located at the position of the immersion liquid cooling plate 7 on the liquid cooling rack 1.

[0054] The immersion principle of the immersion liquid cooling plate 7 is solid-liquid heat exchange and phase change cooling. The main process includes coolant injection, heat exchange between the heat sink (or chip packaging surface) and the coolant, phase change, and coolant outflow to the external heat exchange device. Specifically:

[0055] When the immersed main chip 73 and the immersed low-power chip 74 are working, the pump 6 transports the coolant in the condenser 42 to the sealed cold plate, and the coolant exchanges heat directly with the chip heat sink or the chip packaging surface. On the one hand, the coolant will exchange solid-liquid heat when it encounters the hot chip or heat sink, or partially evaporate to take away the heat generated by the chip, and then flow back to the condenser.

[0056] The immersion liquid cooling module is a beneficial supplement to the above-mentioned jet evaporation condensation module. It can realize the situation where there are multiple main chips with lower power consumption relative to the jet evaporation condensation module or there are multiple small-sized high heat flux density chips, and the allowable temperature of multiple chips is lower.

[0057] The immersion liquid cooling module uses FC coolant, and the module components are compatible with FC coolant. Which components inside the immersion liquid cooling module need to add a radiator to improve the heat dissipation efficiency can be adjusted according to actual needs. The immersion liquid cooling module needs to be sealed to ensure that the FC coolant does not leak inside, and the module connector is outside the sealed area to ensure the normal plug-in and unplugging of the module.

[0058] The micro-spray liquid cooling device 44 is a chip-level cooling device that can be customized according to the shape, size and power distribution of the chip. The immersion liquid cooling plate 7 is a module-level cooling device that can perform partial or full immersion cooling according to the heat dissipation requirements of different module chips. Among them, the immersed main chip 73 adopts full immersion cooling; the immersed low-power chip 74 adopts partial immersion cooling, and the immersed main chip 73 is provided with multiple heat sinks to facilitate better cooling in the coolant. The installation form of the micro-spray liquid cooling device 44 is similar to that of a traditional radiator, which is easy to disassemble and install. The micro-spray liquid cooling device 44 does not directly contact the chip, has a low risk of leakage, and has high reliability. Through the micro-spray liquid cooling plate 4, the chip can be at any desired position, and only a micro-spray liquid cooling device is added at the chip position, and the chip is sealed in the spray chamber 41 to achieve it; while the chip using the immersion liquid cooling plate 7 needs to be immersed in the immersion cavity 72, and its position cannot be set independently.

[0059] In the case where there are fewer high-power chips on the board and the heat flux density is large, the micro-spray liquid cooling plate 4 is preferred. This structure has high heat dissipation efficiency and is suitable for the case where a single chip is close to 500W or more; while the heat dissipation advantage of the immersion liquid cooling plate 7 is that all chips on the board are immersed in one space, which is suitable for the heat dissipation of chips less than 300W. Therefore, according to different needs, the board or board chip can be set in the micro-spray liquid cooling plate 4 or the immersion liquid cooling plate 7.

[0060] Figure 2 The condenser 42 shown can be placed outside the system separately, or the metal cold plate structure part that changes the atomized coolant from gas to liquid in the whole circuit can be regarded as the condenser.

[0061] Example 2

[0062] In this embodiment, Figure 8As shown, the micro-spray liquid cooling plate 4 includes a jet evaporation condensation device 43 and a micro-spray liquid cooling device 44 arranged on the jet evaporation condensation device 43, and the micro-spray liquid cooling device 44 includes a shell 40, and the top of the shell 40 is an inlet pipe 440 and a steam chamber 446, the outlet end of the inlet pipe 440 is connected to one end of the cold liquid chamber 441, and the other end of the cold liquid chamber 441 is connected to a nozzle plate 442, and a plurality of holes are provided on the nozzle plate 442, and the plurality of holes are evenly arranged according to the jet array; a flow stabilizing plate 449 is provided in the cold liquid chamber 441, which is directly or indirectly connected to the outlet end of the inlet pipe 440. The inner wall of the shell 40 is connected, and a channel connected to the nozzle plate 442 is provided between the flow stabilizing plate 449 and the inner wall of the shell 40 or on the flow stabilizing plate 449. After the high-speed liquid enters the nozzle plate 442, the flow stabilizing plate 449 ensures that the jet state of the array nozzle is basically consistent; the bottom of the shell 40 is sealed and fixed on the printed circuit board 47, and a micro-spray main chip 401 is provided in the shell 40. The micro-spray main chip 401 is fixed on the printed circuit board 47 and is located directly below the nozzle plate 442; the shell 40 and the printed circuit board 47 together construct a water-sealed structure to minimize the direct thermal resistance between the device and the cold plate. The bottom of the nozzle plate 442 is connected to the steam chamber 446, the top of the steam chamber 446 is connected to one end of the steam main pipe 447, the other end of the steam main pipe 447 is connected to the outlet pipe 448, and the bottom of one side of the shell 40 is connected to the outlet pipe 448; the steam chamber 446 and the cold liquid chamber 441 are not directly connected, and the two are separated by the nozzle plate 442.

[0063] The rest is the same as Example 1.

Claims

1. A chip micro-spray liquid cooling and immersion liquid cooling module combination device, characterized in that: The invention comprises a liquid cooling rack (1), on which a heat exchanger (2), a pump (6), and a total liquid cooling joint (5) are fixed, and a micro-spray liquid cooling plate (4) and an immersion liquid cooling plate (7) are also plugged into the liquid cooling rack (1), a fan (3) is fixed on the heat exchanger (2), the micro-spray liquid cooling plate (4) and the immersion liquid cooling plate (7) are both arranged on one side of the heat exchanger (2), the fan (3) is arranged on the other side of the heat exchanger (2), at least two total liquid cooling joints (5) are provided, an internal pipeline is provided in the liquid cooling rack (1), and the two ends of the internal pipeline are respectively connected to the two total liquid cooling joints (5), and the micro-spray liquid cooling plate (4) and the immersion liquid cooling plate (7) on the liquid cooling rack (1) are provided with a fan (3) on the heat exchanger (2). The installation position of the plate (7) is respectively provided with joints for connecting the internal pipelines to the micro-spray liquid cooling plate (4) and the immersion liquid cooling plate (7); the micro-spray liquid cooling plate (4) comprises a spray chamber (41); the upper part of the spray chamber (41) is connected to the inlet end of the condenser (42) through a pipeline; the outlet end of the condenser (42) is connected to the inlet end of the pump (6) through a pipeline; the lower end of the spray chamber (41) is connected to the inlet end of the pump (6) through a pipeline; the outlet end of the pump (6) is connected to the inlet end of the heat exchanger (2) through a pipeline; the outlet end of the heat exchanger (2) is connected to the nozzle located at the upper part of the spray chamber (41) through a pipeline; and a micro-spray main chip (401) is provided directly below the nozzle in the spray chamber (41).

2. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 1, characterized in that: A fluid control valve (45) is provided on the pipeline between the outlet end of the heat exchanger (2) and the spray chamber (41).

3. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 1, characterized in that: The micro-spray liquid cooling plate (4) comprises a jet evaporation condensation device (43) and a micro-spray liquid cooling device (44) arranged on the jet evaporation condensation device (43), wherein the micro-spray liquid cooling device (44) comprises an inlet pipe (440), wherein the outlet end of the inlet pipe (440) is connected to one end of a cold liquid chamber (441), and the other end of the cold liquid chamber (441) is connected to a nozzle plate (442), wherein a plurality of holes are arranged on the nozzle plate (442) and connected to one end of a plurality of nozzles (443), wherein the other ends of the plurality of nozzles (443) are arranged in a steam chamber (446), wherein a plurality of steam branch pipes (445) are also arranged in the steam chamber (446), and the top of the steam chamber (446) is provided with a plurality of holes. The steam chamber (446) is connected to one end of a steam main pipe (447), the other end of the steam main pipe (447) is connected to an outlet pipe (448), the other ends of the plurality of nozzles (443) and one end of the plurality of steam branch pipes (445) are arranged directly above and close to the micro-spray main chip (401), and one side of the bottom of the steam chamber (446) is connected to the outlet pipe (448); the steam chamber (446) and the cold liquid chamber (441) are not directly connected, and the two are separated by a nozzle plate (442) and a nozzle (443); the inlet pipe (440), the cold liquid chamber (441), and the steam chamber (446) together form a spray chamber (41).

4. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 3, characterized in that: The outer side of the spray chamber (41) is evenly distributed with a plurality of screw holes (444); the micro-spray liquid cooling device (44) is installed by passing the screw holes (444) and the holes of the printed circuit board (47) through the mounting screws (46); and then is fastened to the fixing bracket (49) on the back side of the printed circuit board (47); and a micro-spray main chip (401) is provided between the spray chamber (41) and the printed circuit board (47).

5. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 3 or 4, characterized in that: A heat conducting pad (48) is provided between the surface of the micro-spraying main chip (401) and the micro-spraying liquid cooling device (44).

6. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 4, characterized in that: The jet evaporative condensation device (43) comprises a printed circuit board (47), on which a micro-spray main chip (401) and a micro-spray sub-chip (402) are fixed, and a micro-spray internal pipeline is arranged in the jet evaporative condensation device (43), and two ends of the micro-spray internal pipeline are respectively connected to two micro-spray joints (403), and the two micro-spray joints (403) are arranged on the side of the jet evaporative condensation device (43); when the micro-spray liquid cooling plate (4) is installed on the liquid cooling rack (1), the two micro-spray joints (403) are respectively connected to the joints of the internal pipeline located at the position of the micro-spray liquid cooling plate (4) on the liquid cooling rack (1); and joints respectively connected to an inlet pipe (440) and an outlet pipe (448) are arranged on the micro-spray internal pipeline located at the position of the micro-spray main chip (401) on the jet evaporative condensation device (43).

7. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 1, characterized in that: The immersion liquid cooling plate (7) comprises a sealed cold plate, an immersion cavity (72) is arranged in the sealed cold plate, two immersion joints (71) connected to the immersion cavity (72) are arranged on the outer side of the sealed cold plate, the immersion cavity (72) is connected to the immersion main chip (73) and the immersion low power consumption chip (74) respectively, the immersion main chip (73) and the immersion low power consumption chip (74) are both immersed in the immersion cavity (72), and a heat sink is arranged on the outer side of the immersion main chip (73); when the immersion liquid cooling plate (7) is installed on the liquid cooling rack (1), the two immersion joints (71) are respectively connected to the joints of the internal pipeline located at the position of the immersion liquid cooling plate (7) on the liquid cooling rack (1).

8. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 1, characterized in that: The two total liquid cooling joints (5) are connected to an external cooling liquid circulation system; or when the internal pipeline is filled with cooling liquid, the two total liquid cooling joints (5) are directly blocked.

9. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 1, characterized in that: The micro-spray liquid cooling plate (4) comprises a jet evaporative condensation device (43) and a micro-spray liquid cooling device (44) arranged on the jet evaporative condensation device (43), the micro-spray liquid cooling device (44) comprising a shell (40), the top of the shell (40) being an inlet pipe (440) and a steam chamber (446), the outlet end of the inlet pipe (440) being connected to one end of a cold liquid chamber (441), the other end of the cold liquid chamber (441) being connected to a nozzle plate (442), a plurality of holes being arranged on the nozzle plate (442), a flow stabilizing plate (449) being arranged in the cold liquid chamber (441) facing the outlet end of the inlet pipe (440), the flow stabilizing plate (449) being directly or indirectly connected to the inner wall of the shell (40), and the flow stabilizing plate (449) and the inner wall of the shell (40) being connected to each other. A channel connected to the nozzle plate (442) is occasionally provided on the flow stabilizing plate (449), the bottom of the capsule (40) is sealed and fixed on the printed board (47), a micro-spraying main chip (401) is provided in the capsule (40), the micro-spraying main chip (401) is fixed on the printed board (47) and is located directly below the nozzle plate (442); the bottom of the nozzle plate (442) is connected to the steam chamber (446), the top of the steam chamber (446) is connected to one end of the steam main pipe (447), the other end of the steam main pipe (447) is connected to the outlet pipe (448), and the bottom of one side of the capsule (40) is connected to the outlet pipe (448); the steam chamber (446) and the cold liquid chamber (441) are not directly connected, and the two are separated by the nozzle plate (442).

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