Pressure measuring device and test sorting equipment

Abstract

The invention relates to a pressure measuring device and test sorting equipment. The pressure measuring device comprises a supporting column; the base is arranged on the supporting column; the semiconductor chilling plate is arranged on the base and is provided with a cold surface and a hot surface; the pressure head is mounted at the end part of the supporting column in the lengthwise extension direction, and is spaced from the base; the first heat pipe comprises a first condensation end and a first evaporation end which are connected with each other, the first condensation end is arranged on the base and attached to the cold face, and the first evaporation end is attached to the pressing head; the end face, far away from the base, of the pressing head in the extending direction forms a crimping face used for being pressed on a product. Due to the fact that the first heat pipe conducts heat between the cold face of the semiconductor chilling plate and the pressing head, it is avoided that the semiconductor chilling plate is directly arranged on the pressing head, and more or larger semiconductor chilling plates can be arranged to meet the requirement for large refrigeration power.

Description

Technical Field

[0001] The present invention relates to the technical field of testing and sorting equipment, and in particular to a pressure measuring device and testing and sorting equipment. Background Art

[0002] Before the chip leaves the factory, it needs to be tested for performance, and the chip performance test is generally completed on the test sorting equipment. The test sorting equipment includes a pressure measuring device. Under the drive of the driving device, the pressure head of the pressure measuring device moves toward the chip to press the chip down to perform a pressure test on the chip. When the chip is pressure tested, the temperature of the pressure head needs to be controlled by the refrigeration component, thereby controlling the temperature of the chip.

[0003] In traditional technology, high-power refrigerant direct cooling refrigeration components are often used as cooling sources. They use internal compressors to compress high-temperature refrigerants. After the temperature of the refrigerant increases significantly with the pressure, the refrigerant is first dissipated through the condenser, and then the refrigerant pressure is reduced through the throttling mechanism to quickly reduce the refrigerant temperature. Finally, the low-temperature refrigerant is transported to the load evaporator through pipelines to exchange heat with the pressure head, thereby achieving the cooling of the pressure head. However, this type of refrigeration component is large in size, high in cost, complex in pipelines, and has a high failure rate, resulting in a large volume, high cost, and complex structure of the pressure measuring device. In some fields (such as medical and life sciences), TEC refrigeration sheets are also used for cooling, but the cooling power of TEC refrigeration sheets is low. When the cooling area is small, the size of the TEC refrigeration sheet is small and cannot meet the needs. Summary of the invention

[0004] Based on this, it is necessary to provide a pressure measuring device and a test sorting device that can improve the above problems.

[0005] A pressure measuring device, comprising:

[0006] Support columns;

[0007] A base, arranged on the support column;

[0008] The semiconductor cooling sheet arranged on the base has a cold surface and a hot surface;

[0009] A pressure head is installed at the end of the support column in the longitudinal extension direction and is spaced apart from the base;

[0010] A first heat pipe comprises a first condensation end and a first evaporation end connected to each other, wherein the first condensation end is arranged on the base and in contact with the cold surface, and the first evaporation end is in contact with the pressure head;

[0011] The end surface of the pressing head away from the base in the extending direction forms a pressing surface for pressing on the product.

[0012] In one of the embodiments, in a circumferential direction surrounding the extending direction, the pressure measuring device includes at least one group of refrigeration fin groups and at least one group of first heat pipe groups, and the first heat pipe groups correspond to the refrigeration fin groups one by one;

[0013] Each group of the refrigeration fins includes at least one semiconductor refrigeration fin arranged in the extension direction, and each group of the first heat pipes includes at least one first heat pipe arranged in the surrounding direction. Each first heat pipe is in contact with the cold surfaces of all the semiconductor refrigeration fins of the corresponding refrigeration fin group.

[0014] In one embodiment, the base is sleeved outside the support column, and there is a heat-insulating gap between the base and the outer surface of the support column; and / or

[0015] The pressure head comprises a freezing head and a heater, the freezing head is mounted on the supporting column, the heater is arranged inside the freezing head, and the pressing surface is formed on the freezing head.

[0016] In one embodiment, the pressure measuring device further includes a heat sink, and the heat sink is in contact with the hot surface of the semiconductor cooling plate.

[0017] In one of the embodiments, the pressure measuring device further includes a second heat pipe, the second heat pipe includes a second condensation end and a second evaporation end connected to each other, the second evaporation end is in contact with the hot surface, and the radiator is in contact with the second heat pipe.

[0018] In one of the embodiments, in the circumferential direction surrounding the extending direction, the pressure measuring device includes at least one group of refrigeration fins, at least one group of second heat pipes and at least one radiator, and the second heat pipes, the refrigeration fins and the radiator correspond to each other one by one;

[0019] Each group of the refrigeration fins includes at least one semiconductor refrigeration fin arranged in the extension direction, each group of the second heat pipes includes at least one second heat pipe arranged in the surrounding direction, each of the second heat pipes is in contact with the hot surfaces of all the semiconductor refrigeration fins of the corresponding refrigeration fin group, and each of the radiators is in contact with all the second heat pipes included in the corresponding second heat pipe group.

[0020] In one of the embodiments, the cross-sectional shapes of the base and the pressure head are both square, the four faces of the base and the pressure head correspond one to one, and each face is provided with a group of the refrigeration fin groups.

[0021] In one of the embodiments, in the extension direction, the heat sink extends from the second condensation end to the second evaporation end of the second heat pipe, and the heat sink is connected to various locations of the second heat pipe in the extension direction.

[0022] In one embodiment, in a circumferential direction surrounding the extending direction, all of the heat sinks are arranged in a ring shape outside the support column and form a receiving space with the support column;

[0023] Part of the pressure head, the base, the semiconductor cooling sheet and the first heat pipe are all arranged in the accommodation space, and the remaining part of the pressure head extends out of the accommodation space along the extension direction;

[0024] The pressure measuring device further comprises two end covers, which are respectively arranged at two ends of the radiator in the extending direction to close the accommodation space; and / or

[0025] The radiator is a liquid-cooled radiator, a flow channel is arranged inside the radiator, and a heat dissipation fin is arranged in the flow channel at a position close to the hot surface.

[0026] A testing and sorting device comprises the pressure measuring device as described above.

[0027] The above-mentioned pressure measuring device and test sorting equipment, semiconductor refrigeration plate and pressure head are integrated on the support column, and the structure is compact. On the one hand, it is equivalent to the high-power refrigerant direct cooling type refrigeration source in the prior art, and does not need to set up components such as compressors, condensers, throttling mechanisms, evaporators, and complex pipeline structures connecting various components. The refrigeration components are small in size, low in cost, and low in failure rate, which makes the pressure measuring device small in size, low in cost, and simplifies the structure of the pressure measuring device; on the other hand, when the pressure measuring device needs to test the product, the pressure can be directly transmitted to the pressure head through the support column, so that the pressure head can fit closely with the product to ensure the refrigeration effect of the refrigeration product. In addition, since the first heat pipe conducts heat between the cold surface of the semiconductor refrigeration plate and the pressure head, it avoids directly setting the semiconductor refrigeration plate on the pressure head, and more or larger semiconductor refrigeration plates can be set to meet the demand for larger refrigeration power. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 An axonometric diagram of a pressure measuring device provided in one embodiment of the present application;

[0029] Figure 2 for Figure 1 An axonometric view of another perspective of the load cell shown in FIG.

[0030] Figure 3 for Figure 1 An axonometric view of the load cell shown in FIG.

[0031] Figure 4 for Figure 1 An exploded view of the pressure measuring device shown in;

[0032] Figure 5 for Figure 1 A structural diagram of a partial structure of a pressure measuring device shown in ;

[0033] Figure 6 for Figure 5 An exploded view of the structure shown in;

[0034] Figure 7 for Figure 5 Another exploded view of the structure shown in;

[0035] Figure 8 for Figure 1 A cross-sectional view of the pressure measuring device shown in ;

[0036] Fig. 9 for Figure 1 An exploded view of the heat sink of the pressure measuring device shown in FIG.

[0037] Fig.10 for Fig. 9 The structural diagram of the radiator shown in;

[0038] Fig.11 for Figure 8 An enlarged view of point A of the pressure measuring device shown in FIG.

[0039] Description of reference numerals:

[0040] 100. pressure measuring device; 10. support column; 20. base; 30. semiconductor cooling plate; 31. hot surface; 32. cold surface; 40. pressure head; 41. freezing head; 42. heater; 50. first heat pipe; 51. first condensation end; 52. first evaporation end; A. cooling plate group; B. first heat pipe group; C. second heat pipe group; 60. first assembly groove; 70. radiator; 71. second assembly groove; 72. cooling fin; 73. flow channel; 80. second heat pipe; 81. second condensation end; 82. second evaporation end; 90. joint; 110. end cover; 120. thermal insulation gap; 200. chip. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0042] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0044] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0047] See also Figure 1-Figure 3 In one embodiment of the present application, a pressure measuring device 100 is provided, which is used to be crimped onto a product to perform a pressure test on the product. In some specific implementations, the product tested by the pressure measuring device 100 is a chip 200 (IC). It is understandable that in some other implementations, the type of product tested by the pressure measuring device 100 is not limited, such as the product can also be other types of electronic components.

[0048] At the same time, the pressure measuring device 100 can not only perform pressure testing on the product, but also control the temperature of the product during the pressure testing. For example, in some specific embodiments, the pressure measuring device 100 cooperates with the heating device to control the temperature of the chip at -60°C-175°C.

[0049] See also Figure 4-Figure 6 The pressure measuring device 100 includes a support column 10, a base 20 and a semiconductor cooling plate 30. The support column 10 extends longitudinally ( Figure 6 The X direction is the extension direction of the support column 10), the base 20 is arranged on the support column 10, and the semiconductor cooling sheet 30 is arranged on the base 20, and has a hot surface 31 and a cold surface 32. Among them, the semiconductor cooling sheet 30 is also called a thermoelectric semiconductor cooling component, Peltier, etc., which refers to a patch with two sides, one side absorbing heat and the other side dissipating heat, which plays a role in heat conduction. Among them, the cold surface 32 is the heat absorbing surface, and the hot surface 31 is the heat dissipating surface.

[0050] See also Figure 5-Figure 7The pressure measuring device 100 also includes a pressure head 40 and a first heat pipe 50. The pressure head 40 is installed at the end of the support column 10 in the extension direction and is spaced apart from the base 20, so that the heat of the semiconductor cooling sheet 30 will not be transferred to the pressure head 40 through the base 20. The first heat pipe 50 includes a first condensation end 51 and a first evaporation end 52 connected to each other. The first condensation end 51 is arranged on the base 20 and is attached to the cold surface 32 of the semiconductor cooling sheet 30, and the first evaporation end 52 is attached to the pressure head 40. Among them, the heat pipe is a heat transfer element that relies on the phase change of its internal working liquid to achieve heat transfer. One end of the heat pipe is the evaporation end, and the other end is the condensation end. When one end of the heat pipe is heated, the liquid in the capillary tube is rapidly vaporized, and the steam flows to the other end under the power of heat diffusion, and condenses at the condensation end to release heat. The liquid then flows back to the evaporation end along the porous material by capillary action, and the cycle continues until the temperatures at both ends of the heat pipe are equal (the heat diffusion of the steam stops at this time). The pressure head 40 is made of a material with high thermal conductivity, so as to facilitate rapid conduction of heat to the first heat pipe 50 .

[0051] Furthermore, the end face of the pressure head 40 away from the base 20 in the extension direction of the support column 10 forms a crimping surface, and the pressure measuring device 100 is crimped on the product through the crimping surface to test the product. At the same time, heat is transferred between the pressure head 40 and the product, thereby cooling the product.

[0052] In the above arrangement, since the first condensation end 51 of the first heat pipe 50 is in contact with the cold surface 32 of the semiconductor cooling sheet 30, and the first evaporation end 52 is in contact with the pressure head 40, the first heat pipe 50 can connect the cold surface 32 of the semiconductor cooling sheet 30 with the pressure head 40 and conduct heat, thereby achieving the effect of heat dissipation and cooling of the pressure head 40. When the pressure head 40 is pressed onto the product through the pressing surface, the heat of the product is transferred to the pressure head 40, and the heat of the pressure head 40 is transferred to the first evaporation end 52 of the first heat pipe 50. When the first evaporation end 52 of the first heat pipe 50 is heated, the liquid in the capillary of the first heat pipe 50 is rapidly vaporized, and the vapor flows to the first condensation end 51 under the power of heat diffusion, and condenses at the first condensation end 51 to release heat to the cold surface 32 of the semiconductor cooling sheet 30, and the heat is dissipated through the hot surface 31 of the semiconductor cooling sheet 30. At the same time, the liquid in the first heat pipe 50 flows back to the first evaporation end 52 along the porous material by capillary action, and the cycle continues until the temperatures at both ends of the first heat pipe 50 are equal, thereby completing the refrigeration operation of the product.

[0053] The pressure measuring device 100 provided in the embodiment of the present application, the semiconductor cooling sheet 30 and the pressure head 40 are all integrated on the support column 10, and the structure is compact. On the one hand, it is equivalent to the high-power refrigerant direct cooling type refrigeration source in the prior art, and does not need to set up components such as compressors, condensers, throttling mechanisms, evaporators, and complex pipeline structures connecting the components. The refrigeration components are small in size, low in cost, and low in failure rate, so that the pressure measuring device 100 is small in size, low in cost, and the structure of the pressure measuring device 100 is simplified; on the other hand, when the pressure measuring device 100 needs to refrigerate the product, the pressure can be directly transmitted to the pressure head 40 through the support column 10, so that the pressure head 40 can fit closely with the product to ensure the refrigeration effect of the refrigeration product. In addition, since the first heat pipe 50 conducts heat between the cold surface 32 of the semiconductor cooling sheet 30 and the pressure head 40, it is avoided to directly set the semiconductor cooling sheet 30 on the pressure head 40, and more or larger semiconductor cooling sheets 30 can be set to meet the demand for larger refrigeration power.

[0054] In some embodiments, the cross-sectional shape of the support column 10 is circular, and the extension direction is the axial direction of the support column 10. The base 20 is sleeved outside the support column 10, and the pressure head 40 is threadedly connected to one end of the longitudinal extension of the support column 10. Such a configuration, on the one hand, is convenient for the assembly of the base 20 and the pressure head 40 with the support column 10; on the other hand, it is convenient to replace the pressure head 40 when the pressure head 40 is damaged. It can be imagined that in some other embodiments, the cross-sectional shape of the support column 10 is not limited, such as it can also be square or triangular. At the same time, the assembly method of the base 20 and the pressure head 40 with the support column 10 is also not limited, such as the base 20 is not set outside the support column 10 in a sleeve connection manner, but is directly installed on the outer surface of the support column 10, and the pressure head 40 is not fixed to the support column 10 by a threaded connection, such as the pressure head 40 is fixed to the support column 10 by a buckle.

[0055] Optionally, continue to Figure 6 The pressing head 40 includes a freezing head 41 and a heater 42. The freezing head 41 is mounted on the support column 10, the heater 42 is disposed inside the freezing head 41, and the crimping surface is formed on the freezing head 41. The heater 42 can generate heat, and by adjusting the output power of the heater 42, a thermal balance is formed with the heat dissipation of the freezing head 41, thereby achieving temperature control of the pressing head 40.

[0056] In some embodiments, in the circumferential direction ( Figure 6In the middle R direction), the pressure measuring device 100 includes at least one group of refrigeration plate groups A and at least one group of first heat pipe groups B, and the first heat pipe groups B correspond to the refrigeration plate groups A one by one. Each group of refrigeration plate groups A includes at least one semiconductor refrigeration plate 30 arranged in the extension direction of the support column 10, and each group of first heat pipe groups B includes at least one first heat pipe 50 arranged in the circumferential direction, and the first heat pipe 50 extends along the extension direction of the support column 10. Each first heat pipe 50 is in contact with the cold surface 32 of all the semiconductor refrigeration plates 30 of the corresponding refrigeration plate group A. Specifically, when the cross-sectional shape of the support column 10 is circular, the circumferential direction is the circumferential direction of the support column 10. Since the first heat pipe groups B correspond to the refrigeration plate groups A one by one, and each first heat pipe 50 is in contact with the cold surface 32 of all the semiconductor refrigeration plates 30 of the corresponding refrigeration plate group A, the first heat pipe 50 and the semiconductor refrigeration plate 30 are arranged regularly, which facilitates the heat transfer between the semiconductor refrigeration plate 30 and the pressure head 40.

[0057] Preferably, continue to refer to Figure 6 and Figure 7 The pressure measuring device 100 includes a plurality of cooling fin groups A and a plurality of first heat pipe groups B. Each cooling fin group A includes a plurality of semiconductor cooling fins 30 arranged in the extending direction of the support column 10, and each first heat pipe group B includes a plurality of first heat pipes 50 arranged in the surrounding direction. In this way, the first heat pipes 50 of the plurality of first heat pipe groups B can guide the cooling energy of the corresponding plurality of semiconductor cooling fins 30 to the pressure head 40, ensuring that the pressure head 40 has sufficient cooling energy for cooling the product.

[0058] In some specific implementations, the pressure measuring device 100 includes 4 groups of cooling plate groups A and 4 groups of first heat pipe groups B, each group of cooling plate groups A includes 3 semiconductor cooling plates 30, and each group of first heat pipe groups B includes two first heat pipes 50. In this way, the entire pressure measuring device 100 includes 12 semiconductor cooling plates 30 and 8 first heat pipes 50, and the 8 first heat pipes 50 guide the cooling energy of the 12 semiconductor cooling plates 30 to the pressure head 40, ensuring that the cooling energy of the pressure head 40 is sufficient.

[0059] Preferably, the cross-sectional shapes of the base 20 and the pressure head 40 are both square, and the four surfaces of the base 20 and the pressure head 40 correspond to each other, and each surface is provided with a set of cooling fin groups A. In this way, the four cooling fin groups A and the four first heat pipe groups B are respectively provided on the four surfaces of the base 20, and the four first heat pipe groups B are respectively attached to the four surfaces of the pressure head 40, which facilitates the installation and fixation of the first heat pipe 50 and the semiconductor cooling fin 30, and ensures the compactness of the structure of the pressure measuring device 100.

[0060] It is worth noting that in some other specific embodiments, the pressure measuring device 100 may also include other numbers of cooling plate groups A and other numbers of first heat pipe groups B, such as the pressure measuring device 100 includes 3 cooling plate groups A and 3 first heat pipe groups 50, or includes 5 cooling plate groups A and 5 first heat pipe groups B. Moreover, each cooling plate group A may include other numbers of semiconductor cooling plates 30, and each first heat pipe group B may also include other numbers of first heat pipes 50, such as each cooling plate group A includes 4 or 5 semiconductor cooling plates 30, and each first heat pipe group B includes 3 or 4 first heat pipes 50.

[0061] It should be noted here that the shapes of the base 20 and the pressure head 40 can be changed accordingly according to the number of refrigeration fin groups A and the first heat pipe group B. For example, when the number of refrigeration fin groups A and the first heat pipe group B are both 3 groups, the cross-sectional shapes of the base 20 and the pressure head 40 are both triangular; when the number of refrigeration fin groups A and the first heat pipe group B are both 5 groups, the cross-sectional shapes of the base 20 and the pressure head 40 are both pentagonal.

[0062] Continue reading Figure 6 In order to further facilitate the installation and fixation of the first heat pipe 50 and the semiconductor cooling sheet 30, the surfaces of the base 20 and the pressure head 40 are both recessed with a first assembly groove 60, and the two ends of the first heat pipe 50 are respectively arranged in the first assembly grooves 60 of the base 20 and the pressure head 40, and the semiconductor cooling sheet 30 is attached to the portion of the base 20 where the first assembly groove 60 is not provided. In addition, when the semiconductor cooling sheet 30 is attached to the surface of the base 20, it is also attached to the first condensation end 51 of the first heat pipe 50.

[0063] Continue reading Figure 3 and Figure 4 The pressure measuring device 100 further includes a heat sink 70, which is attached to the hot surface 31 of the semiconductor cooling plate 30. During cooling, the heat sink 70 can cool the hot surface 31 of the semiconductor cooling plate 30 to reduce the temperature difference between the hot surface 31 and the cold surface 32, thereby preventing the temperature difference between the hot and cold surfaces 31 from being too large, causing heat to flow back from the hot surface 31 to the cold surface 32, thereby significantly reducing the cooling efficiency.

[0064] Optionally, see Figure 8 and Fig. 9The radiator 70 is a liquid cooling type radiator 70, and a flow channel 73 is provided in the radiator 70. A heat dissipation fin 72 is provided in the flow channel 73 near the hot surface 31. The cooling medium can flow through the heat dissipation fin 72 when circulating in the flow channel 73. The provision of the heat dissipation fin 72 can increase the contact area between the cooling medium and the radiator 70, and ensure the heat dissipation effect of the radiator 70 on the hot surface 31 of the semiconductor cooling plate 30. The pressure measuring device 100 includes a joint 90, which is connected to the radiator 70, and the internal channel in the joint 90 is connected to the flow channel 73. The external cooling medium can flow into the flow channel 73 through the internal channel of the joint 90, and flow to the outside through the internal channel of the joint 90, so that the cooling medium circulates in the flow channel 73 to dissipate heat from the hot surface 31 of the semiconductor cooling plate 30.

[0065] Continue reading Figure 4 , Figure 5 and Figure 7 The pressure measuring device 100 further includes a second heat pipe 80, which includes a second condensation end 81 and a second evaporation end 82 connected to each other, the second evaporation end 82 is in contact with the hot surface 31, and the radiator 70 is in contact with the second heat pipe 80. That is, at least part of the radiator 70 is in contact with the hot surface 31 of the semiconductor cooling plate 30 through the second heat pipe 80. The second heat pipe 80 is provided to facilitate the heat transfer from the hot surface 31 of the semiconductor cooling plate 30 to the radiator 70, so as to be dissipated through the radiator 70, thereby improving the heat dissipation efficiency.

[0066] In some specific implementations, the semiconductor cooling sheet 30 is sandwiched between the first heat pipe 50 and the second heat pipe 80. Fig.10 The heat sink 70 is provided with a second assembly groove 71, and the second heat pipe 80 is provided in the second assembly groove 71. The portion of the heat sink 70 provided with the second assembly groove 71 is in contact with the hot surface 31 of the semiconductor cooling plate 30 through the second heat pipe 80, and the portion without the second assembly groove 71 is directly in contact with the hot surface 31 of the semiconductor cooling plate 30, so that the heat of the hot surface 31 of the semiconductor cooling plate 30 is fully dissipated through the heat sink 70. In other specific implementations, the portion of the heat sink 70 provided with the second assembly groove 71 can also be in contact with the hot surface 31 of the semiconductor cooling plate 30 through the second heat pipe 80, and the portion without the second assembly groove 71 is spaced from the hot surface 31 of the semiconductor cooling plate 30, which is not limited here.

[0067] Furthermore, in the extension direction of the support column 10, the radiator 70 extends from the second condensation end 81 of the second heat pipe 80 to the second evaporation end 82, and the radiator 70 is connected to various places of the second heat pipe 80 in the extension direction. In this way, the second heat pipe 80 can conduct the heat of the hot surface 31 to the area of ​​the radiator 70 that is not directly opposite to the hot surface 31 of the semiconductor cooling plate 30, thereby avoiding heat accumulation in the area where the radiator 70 is opposite to the hot surface 31, reducing the heat flux density of the hot surface 31, and improving the heat dissipation efficiency of the radiator 70.

[0068] In the circumferential direction, the pressure measuring device 100 includes at least one group of second heat pipe groups C, and the second heat pipe groups C, the first heat pipe groups B and the cooling fin groups A correspond one to one. That is, the number of groups of the second heat pipe groups C is equal to the number of groups of the first heat pipe groups B and the number of groups of the cooling fin groups A and corresponds one to one. And the number of radiators 70 is equal to the number of second heat pipe groups C and corresponds one to one. Each group of second heat pipe groups C includes at least one second heat pipe 80 arranged along the circumferential direction, and the second heat pipe 80 extends along the extension direction of the support column 10. Each second heat pipe 80 is in contact with the heat surface 31 of all semiconductor cooling fins 30 of the corresponding cooling fin group A, and each radiator 70 is in contact with all second heat pipes 80 included in the corresponding second heat pipe group C. In this way, each group of second heat pipe groups C guides the heat of the heat surface 31 of the corresponding cooling fin group A to the corresponding radiator 70, ensuring the heat dissipation effect.

[0069] It is conceivable that in some other embodiments, the refrigeration fin group A, the first heat pipe group B, the second heat pipe group C and the radiator 70 are not arranged in a one-to-one correspondence. For example, the refrigeration fin group A, the first heat pipe group B and the second heat pipe group C can be arranged in a one-to-one correspondence, while there is only one radiator 70, which is surrounded by the support column 10 in a ring shape.

[0070] In some specific embodiments, there are 4 groups of cooling fin groups A, first heat pipe groups B and second heat pipe groups C, and there are 4 heat sinks 70. The cross-sectional shape of the base 20 and the pressure head 40 is square, specifically a square, and the 4 groups of cooling fin groups A, 4 groups of first heat pipe groups B, 4 groups of second heat pipe groups C and 4 heat sinks 70 are respectively arranged corresponding to the 4 faces of the square. Each group of cooling fin groups A includes 3 semiconductor cooling fins 30, each group of first heat pipe groups B includes 2 first heat pipes 50, and each group of second heat pipe groups C includes 2 second heat pipes 80. In this way, while ensuring that sufficient cold is conducted to the pressure head 40, the compactness of the structure of the pressure measuring device 100 is increased.

[0071] Of course, according to the above, there is no limitation on the number of the refrigeration fin group A, the number of the first heat pipe group B, the number of the semiconductor refrigeration fins 30 included in the refrigeration fin group A, and the number of the first heat pipes 50 included in the first heat pipe group B. Therefore, there is no limitation on the number of the second heat pipe group C and the number of the radiators 70. At the same time, there is no limitation on the number of the second heat pipes 80 included in the second heat pipe group C.

[0072] For more details, see Figure 3 In the circumferential direction, all the heat sinks 70 are arranged in a ring shape outside the support column 10, and form a receiving space with the support column 10. Part of the pressure head 40, the base 20, the semiconductor cooling plate 30, the first heat pipe 50 and the second heat pipe 80 are all arranged in the receiving space, and the remaining part of the pressure head 40 extends out of the receiving space along the extension direction, and the holding surface is formed on the part of the pressure head 40 extending out of the receiving space. Figure 2 and Figure 3 The pressure measuring device 100 further includes two end caps 110, which are respectively arranged at both ends of the radiator 70 in the extension direction to close the accommodation space. In this way, the semiconductor cooling plate 30, the first heat pipe 50, the second heat pipe 80 and the areas participating in heat exchange in the accommodation space are isolated from the external environment, avoiding the influence of external air flow disturbance on the interior, and improving the heat dissipation efficiency. Optionally, the internal heat pipes and the areas participating in heat exchange are silver-plated to reduce the heat radiation of the internal high-temperature area to the low-temperature area, thereby improving the cooling efficiency.

[0073] In some embodiments, continue to refer to Figure 6 , Figure 7 , Figure 8 and Fig.11 The base 20 is sleeved outside the support column 10, and there is a heat insulation gap 120 between the base 20 and the outer surface of the support column 10 to reduce the heat conduction between the base 20 and the support column 10, so that more cold energy is transferred to the pressure head 40 through the first heat pipe 50. Optionally, the base 20 is made of a high thermal conductivity metal material, so that the base 20 can receive the cold energy conducted by the cold surface 32 of the semiconductor refrigeration plate 30, and transfer it to the first condensation end 51 of the first heat pipe 50, ensuring the proportion of the cold energy of the cold surface 32 transferred to the pressure head 40.

[0074] It should be noted that, since there is a heat-insulating gap 120 between the base 20 and the outer surface of the support column 10, the base 20 is fixedly connected to the radiator 70, and the end cover 110 is connected to the radiator 70, and is sleeved and fixed on the support column 10. That is, the base 20 is indirectly connected to the support column 10 through the radiator 70 and the end cover 110. It should also be noted that the end of the support column 10 away from the pressure head 40 forms an operating end that passes through the end cover 110, so that the pressure measuring device 100 can be operated through the operating end to press the pressure head 40 onto the product, so that the pressure can be transmitted to the pressure head 40 through the support column 10, thereby avoiding damage to the heat pipe and the radiator 70.

[0075] Another embodiment of the present application also provides a test and sorting device, including a feeding device, a receiving device, a conveying device and the above-mentioned pressure measuring device 100. The conveying device is used to convey the product provided by the feeding device to the pressure measuring position. The pressure measuring device 100 performs a pressure test on the product by pressing down the product at the pressure measuring position with a pressure head. The conveying device can also convey the product tested by the pressure measuring device 100 to the receiving device for receiving. Optionally, the test and sorting device is a three-temperature test and sorting device, which can control the product at low temperature, normal temperature and high temperature. Since the above-mentioned pressure measuring device 100 has beneficial effects, correspondingly, the test and sorting device including the above-mentioned pressure measuring device 100 has the same beneficial effects, which will not be described in detail here.

[0076] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A pressure measuring device, characterized in that: include: Support column (10); A base (20) is arranged on the support column (10); A semiconductor cooling sheet (30) disposed on the base (20) has a cold surface (32) and a hot surface (31); A pressure head (40) is installed at the end of the support column (10) in the longitudinal extension direction and is spaced apart from the base (20); A first heat pipe (50), comprising a first condensation end (51) and a first evaporation end (52) connected to each other, wherein the first condensation end (51) is arranged on the base (20) and in contact with the cold surface (32), and the first evaporation end (52) is in contact with the pressure head (40); The end surface of the pressing head (40) away from the base (20) in the extending direction forms a pressing surface for pressing on the product.

2. The pressure measuring device according to claim 1, characterized in that: In a circumferential direction surrounding the extending direction, the pressure measuring device comprises at least one group of refrigeration fin groups (A) and at least one group of first heat pipe groups (B), and the first heat pipe groups (B) correspond one to one with the refrigeration fin groups (A); Each group of the refrigeration fins (A) includes at least one semiconductor refrigeration fin (30) arranged in the extension direction, and each group of the first heat pipes (B) includes at least one first heat pipe (50) arranged in the circumferential direction, and each first heat pipe (50) is in contact with the cold surfaces (32) of all the semiconductor refrigeration fins (30) of the corresponding refrigeration fin group (A).

3. The pressure measuring device according to claim 1, characterized in that: The base (20) is sleeved outside the support column (10), and a heat-insulating gap is provided between the base (20) and the outer surface of the support column (10); and / or The pressure head (40) comprises a freezing head (41) and a heater (42); the freezing head (41) is mounted on the support column (10); the heater (42) is arranged inside the freezing head (41); and the pressing surface is formed on the freezing head (41).

4. The pressure measuring device according to any one of claims 1 to 3, characterized in that: The pressure measuring device also includes a heat sink (70), and the heat sink (70) is in contact with the hot surface (31) of the semiconductor cooling plate (30).

5. The pressure measuring device according to claim 4, characterized in that: The pressure measuring device also includes a second heat pipe (80), the second heat pipe (80) including a second condensation end (81) and a second evaporation end (82) connected to each other, the second evaporation end (82) being in contact with the hot surface (31), and the radiator (70) being in contact with the second heat pipe (80).

6. The pressure measuring device according to claim 5, characterized in that: In a circumferential direction surrounding the extending direction, the pressure measuring device comprises at least one group of refrigeration fin groups (A), at least one group of second heat pipe groups (C) and at least one radiator (70), and the second heat pipe groups (C), the refrigeration fin groups (A) and the radiator (70) correspond to each other one by one; Each group of the refrigeration fins (A) includes at least one semiconductor refrigeration fin (30) arranged in the extension direction, each group of the second heat pipe groups (C) includes at least one second heat pipe (80) arranged in the circumferential direction, each second heat pipe (80) is in contact with the heat surfaces (31) of all the semiconductor refrigeration fins (30) of the corresponding refrigeration fin group (A), and each radiator (70) is in contact with all the second heat pipes (80) included in the corresponding second heat pipe group (C).

7. The pressure measuring device according to claim 6, characterized in that: The cross-sectional shapes of the base (20) and the pressure head (40) are both square, the four faces of the base (20) and the pressure head (40) correspond one to one, and each face is provided with a group of the refrigeration fin group (A).

8. The pressure measuring device according to claim 5, characterized in that: In the extension direction, the radiator (70) extends from the second condensation end (81) of the second heat pipe (80) to the second evaporation end (82), and the radiator (70) is connected to various locations of the second heat pipe (80) in the extension direction.

9. The pressure measuring device according to claim 4, characterized in that: In a circumferential direction surrounding the extending direction, all of the heat sinks (70) are arranged in a ring shape outside the support column (10) and form a receiving space with the support column (10); Part of the pressure head (40), the base (20), the semiconductor cooling sheet (30) and the first heat pipe (50) are all arranged in the accommodation space, and the remaining part of the pressure head (40) extends out of the accommodation space along the extension direction; The pressure measuring device further comprises two end covers (110), which are respectively arranged at two ends of the heat sink (70) in the extension direction to close the accommodation space; and / or The radiator (70) is a liquid-cooled radiator (70), a flow channel (73) is provided in the radiator (70), and a heat dissipation fin (72) is provided in the flow channel (73) at a position close to the hot surface (31).

10. A test sorting device, characterized in that: It includes a loading device, a receiving device, a conveying device and the pressure measuring device as described in any one of claims 1 to 9, the conveying device is used to convey the product provided by the loading device to the pressure measuring position, the pressure measuring device presses down the product located at the pressure measuring position through the pressure head, and the conveying device can also convey the product tested by the pressure measuring device to the receiving device for collection.

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