Surface polishing method for aluminum heating plate

Abstract

The invention provides a surface polishing method for an aluminum heating plate, which comprises the following steps: sequentially carrying out first polishing treatment and second polishing treatment on the surface of the aluminum heating plate by adopting a pneumatic polishing device, and then carrying out post-treatment to obtain the polished aluminum heating plate, the polishing pressure of the first polishing treatment is 80-90 kg / cm < 2 >; the polishing pressure of the second polishing treatment is 100-110 kg / cm < 2 >. The pneumatic polishing device is adopted for sequentially carrying out first polishing treatment and second polishing treatment on the aluminum heating disc, and the pressure in the polishing process of the pneumatic polishing device is controlled in a combined mode, so that the surface roughness of the polished aluminum heating disc meets the requirement, the surface is free of scratches and lines, and the wafer use requirement is met.

Description

Technical Field

[0001] The invention belongs to the technical field of surface treatment and relates to a surface polishing method for an aluminum heating plate. Background Art

[0002] In the process of plasma enhanced chemical vapor deposition (PECVD), in order to ensure the stability of the wafer coating process and the coating quality, the wafer needs to be heated. The heating plate is the main component of the chemical vapor deposition equipment, which is mainly used to carry the wafer and adjust the temperature of the wafer. There is a heating element inside the heating plate. When the heating element is powered on, it generates heat, thereby heating the heating plate.

[0003] CN118204719A discloses an aluminum alloy heating plate and a preparation method and application thereof. The preparation method of the aluminum alloy heating plate comprises the following steps: (1) subjecting a 1050 aluminum alloy billet to a first preheating, a first forging and a first heat treatment in sequence to obtain a pretreated aluminum alloy; (2) subjecting the pretreated aluminum alloy obtained in step (1) to a second preheating, a second forging and a hot rolling, a second heat treatment in sequence, and then machining to obtain the aluminum alloy heating plate.

[0004] CN215280270U discloses an integrated brazing heating plate, comprising a brazing chassis, a connecting sleeve is provided in the middle of the brazing chassis, a connecting head is provided at the lower end of the connecting sleeve, a plurality of locking screw holes are provided on the connecting head, the brazing chassis is supported by an aluminum alloy material, a cooling pipe and a heating pipe are passed through the connecting sleeve, the cooling pipe and the heating pipe are both laid on the upper surface of the brazing chassis in a spiral disk shape, and the cooling plate and the heating pipe are arranged at intervals, both ends of the cooling pipe extend out of the connecting sleeve, the water inlet end of the cooling pipe is provided with a first joint, the water outlet end of the cooling pipe is provided with a second structure, and the upper surface of the brazing chassis is provided with a composite bottom plate.

[0005] The existing technologies mostly improve the structure or preparation method of aluminum heating plates, but do not improve their surface roughness and surface appearance. The market and demand for aluminum heating plates as wafer heating plates are increasing day by day. Aluminum heating plates are expensive and have long been dependent on imports, which seriously affects the development of the semiconductor industry. The surface roughness of aluminum heating plates will affect the adhesion of wafers, and the appearance of grains will affect the uniformity of coating, and the wear will increase during use. Therefore, while ensuring the roughness of the aluminum heating plate, it is also necessary to ensure that its appearance is free of scratches and grains to meet market demand.

[0006] In summary, a surface polishing method for an aluminum heating plate that takes both roughness and appearance into consideration is needed to ensure the quality of wafer coating. Summary of the invention

[0007] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a surface polishing method for an aluminum heating plate, which uses a pneumatic polishing device to perform a first polishing treatment and a second polishing treatment on the surface of the aluminum heating plate in sequence, so that the surface roughness and appearance of the aluminum heating plate after polishing meet the requirements.

[0008] In order to achieve the purpose of the invention, the present invention adopts the following technical solutions:

[0009] The present invention provides a surface polishing method for an aluminum heating plate, the surface polishing method comprising: using a pneumatic polishing device to sequentially perform a first polishing treatment and a second polishing treatment on the surface of the aluminum heating plate, and then performing a post-treatment to obtain a polished aluminum heating plate;

[0010] The grinding pressure of the first grinding process is 80-90 kg / cm 2 , for example, it can be 81kg / cm 2 、82kg / cm 2 、83kg / cm 2 、84kg / cm 2 、85kg / cm 2 、86kg / cm 2 、87kg / cm 2 、88kg / cm 2 or 89kg / cm 2 etc., but not limited to the listed values, other values ​​within the numerical range are also applicable;

[0011] The grinding pressure of the second grinding process is 100-110kg / cm 2 , for example, it can be 101kg / cm 2 、102kg / cm 2 、103kg / cm 2 、104kg / cm 2 、105kg / cm 2 、106kg / cm 2 、107kg / cm 2 、108kg / cm 2 or 109kg / cm 2 The above values ​​are not limited to the above values, and other values ​​within the above range are also applicable.

[0012] In the present invention, the aluminum heating plate is fixed before the first grinding process.

[0013] The surface polishing method provided by the present invention uses a pneumatic polishing device to perform a first polishing treatment and a second polishing treatment on the surface of an aluminum heating plate in sequence, and combined with controlling the pressure of the pneumatic polishing device during the polishing process, has the advantage of a gradient transition, which not only makes the surface roughness of the aluminum heating plate meet the requirements after polishing, but also ensures that the surface of the aluminum heating plate is not easily scratched and has no lines, thereby meeting the requirements for wafer use.

[0014] As a preferred technical solution of the present invention, in the first polishing process and the second polishing process, the pneumatic polishing device performs uniform speed polishing, and the polishing direction is diffuse polishing from the center to the periphery of the aluminum heating plate.

[0015] In the present invention, the grinding direction is controlled to be a diffuse grinding from the center of the aluminum heating plate to the periphery, rather than a horizontal or vertical reciprocating grinding, which is more conducive to avoiding the problem of random lines on the surface of the aluminum heating plate.

[0016] Preferably, the grinding radius of the first grinding process and the second grinding process are both 1 / 5-1 / 3 of the radius of the aluminum heating plate, for example, 1 / 5, 1 / 4 or 1 / 3.

[0017] In the present invention, by controlling the grinding radius of the pneumatic polishing device, it is ensured that the grinding action is smoother, the trajectory is more precise, and the contact with the surface of the aluminum heating plate is more uniform; it can also reduce the generation of stress, thereby reducing the impact on the surface roughness of the aluminum heating plate.

[0018] It is worth noting that by controlling the grinding pressure and the grinding radius, the impact on the surface roughness of the aluminum heating plate can be further reduced, and it is helpful to obtain a grain-free surface.

[0019] As a preferred technical solution of the present invention, the first polishing agent of the first polishing treatment includes alcohol solvent or kerosene.

[0020] Preferably, the alcohol solvent comprises ethanol and / or isopropanol.

[0021] Preferably, in the first polishing process, the first polishing head on the pneumatic polishing device includes 800#-1200# scouring pads, for example, 850# scouring pads, 900# scouring pads, 950# scouring pads, 1000# scouring pads, 1050# scouring pads, 1100# scouring pads or 1150# scouring pads, but are not limited to the listed values, and other values ​​within the numerical range are also applicable.

[0022] As a preferred technical solution of the present invention, the rotation speed of the first grinding process is 200-400rpm, for example, it can be 220rpm, 250rpm, 260rpm, 280rpm, 300rpm, 320rpm, 350rpm, 360rpm or 380rpm, but is not limited to the listed values, and other values ​​within the numerical range are also applicable.

[0023] Preferably, the time for the first grinding treatment is 60-180s, for example, it can be 70s, 80s, 90s, 100s, 110s, 120s, 130s, 140s, 150s, 160s or 170s, but is not limited to the listed values, and other values ​​within the numerical range are also applicable.

[0024] As a preferred technical solution of the present invention, the second polishing agent of the second polishing treatment includes water.

[0025] Preferably, in the second polishing process, the second polishing head on the pneumatic polishing device includes 1500#-2000# scouring pads, for example, 1550# scouring pads, 1600# scouring pads, 1650# scouring pads, 1700# scouring pads, 1750# scouring pads, 1800# scouring pads, 1850# scouring pads, 1900# scouring pads or 1950# scouring pads, but are not limited to the listed values, and other values ​​within the numerical range are equally applicable.

[0026] In the present invention, by controlling the size of the polishing head for the first grinding process and the second grinding process, the advantage of gradient transition is achieved, thereby ensuring that the surface of the aluminum heating plate is not easily scratched and has no grain.

[0027] As a preferred technical solution of the present invention, the rotation speed of the second grinding process is 150-250rpm, for example, it can be 160rpm, 170rpm, 180rpm, 190rpm, 200rpm, 210rpm, 220rpm, 230rpm or 240rpm, but is not limited to the listed values, and other values ​​within the numerical range are also applicable.

[0028] In the present invention, by controlling the rotation speed range of the second grinding process, it is ensured that the surface of the polished aluminum heating plate is free of grains and the surface roughness is as low as less than 1 μm, meeting the wafer use requirements.

[0029] Preferably, the time of the second grinding treatment is 200-360s, for example, it can be 220s, 240s, 250s, 260s, 280s, 300s, 320s, 340s or 350s, but is not limited to the listed values, and other values ​​within the numerical range are also applicable.

[0030] As a preferred technical solution of the present invention, the post-treatment includes water washing, a first wiping and a second wiping performed in sequence.

[0031] As a preferred technical solution of the present invention, the water washing method includes flushing.

[0032] Preferably, the first wiping is performed by wiping the surface of the aluminum heating plate with a dust-free cloth.

[0033] Preferably, the second wiping is performed by wiping the threaded hole with a cotton swab wrapped with a dust-free cloth.

[0034] As a preferred technical solution of the present invention, the surface roughness of the polished aluminum heating plate is ≤1μm, for example, it can be 0.9μm, 0.8μm, 0.7μm, 0.6μm, 0.5μm or 0.3μm, etc., but is not limited to the listed values, and other values ​​within the numerical range are also applicable.

[0035] Preferably, the surface of the polished aluminum heating plate has no scratches or lines.

[0036] As a preferred technical solution of the present invention, the surface polishing method comprises:

[0037] The pneumatic polishing device is used to polish the surface of the aluminum heating plate at a pressure of 80-90kg / cm 2 , the first grinding process is carried out at a rotation speed of 200-400 rpm for 60-180 s and at a grinding pressure of 100-110 kg / cm 2 , a second grinding process is performed at a rotation speed of 150-250 rpm for 200-360 seconds, and then post-processing is performed to obtain an aluminum heating plate with a surface roughness of ≤1 μm and no scratches or lines on the surface;

[0038] In the first polishing process and the second polishing process, the pneumatic polishing device performs polishing at a uniform speed, and the polishing direction is to diffusely polish from the center of the aluminum heating plate to the periphery; the polishing radius in the first polishing process and the second polishing process is 1 / 5-1 / 3 of the radius of the aluminum heating plate;

[0039] The first polishing agent of the first polishing treatment includes an alcohol solvent or kerosene; in the first polishing treatment, the first polishing head on the pneumatic polishing device includes a 800#-1200# scouring pad;

[0040] The second polishing agent of the second polishing treatment includes water; in the second polishing treatment, the second polishing head on the pneumatic polishing device includes a 1500#-2000# scouring pad;

[0041] The post-treatment includes water washing, first wiping and second wiping performed in sequence; the water washing method includes flushing; the first wiping uses a dust-free cloth to wipe the surface of the aluminum heating plate; the second wiping uses a cotton swab wrapped with a dust-free cloth to wipe the threaded hole.

[0042] Compared with the prior art, the present invention has the following beneficial effects:

[0043] The surface polishing method provided by the present invention adopts a pneumatic polishing device to perform a first polishing treatment and a second polishing treatment on the surface of an aluminum heating plate in sequence. The process operation is simple, and combined with the parameter control during the polishing process of the pneumatic polishing device, not only the surface roughness of the aluminum heating plate after polishing is made ≤1μm, but also the surface of the aluminum heating plate is ensured to be not prone to scratches and lines, thereby meeting the requirements for wafer use and having a prospect for large-scale industrial promotion and application. DETAILED DESCRIPTION

[0044] The technical solution of the present invention is further described below by specific implementation methods. It should be understood by those skilled in the art that the embodiments are only to help understand the present invention and should not be regarded as specific limitations of the present invention.

[0045] In the following embodiments and comparative examples, the aluminum heating plate was fixed before the first grinding process.

[0046] Example 1

[0047] This embodiment provides a surface polishing method for an aluminum heating plate, the surface polishing method comprising:

[0048] The surface of the aluminum heating plate is polished with a pneumatic polishing device at a pressure of 85 kg / cm 2 The first grinding process was performed at a rotation speed of 300 rpm for 120 s and a grinding pressure of 100 kg / cm 2 , a second grinding treatment at a rotation speed of 200 rpm for 240 seconds, and then the aluminum heating plate is rinsed with water and wiped with a dust-free cloth in turn, and then the threaded hole is wiped with a cotton swab wrapped with a dust-free cloth to obtain a polished aluminum heating plate;

[0049] In the first polishing process and the second polishing process, the pneumatic polishing device performs polishing at a uniform speed, and the polishing direction is to diffusely polish from the center of the aluminum heating plate to the periphery; the polishing radius of the first polishing process and the second polishing process is 1 / 4 of the radius of the aluminum heating plate;

[0050] The first polishing agent of the first polishing treatment is ethanol; in the first polishing treatment, the first polishing head on the pneumatic polishing device is a 1000# scouring pad;

[0051] The second polishing agent of the second polishing treatment is water; in the second polishing treatment, the second polishing head on the pneumatic polishing device is a 1800# scouring pad.

[0052] Example 2

[0053] This embodiment provides a surface polishing method for an aluminum heating plate, the surface polishing method comprising:

[0054] The surface of the aluminum heating plate is polished with a pneumatic polishing device at a pressure of 80 kg / cm 2 The first grinding process was performed at a rotation speed of 400 rpm for 70 s and a grinding pressure of 100 kg / cm 2 , a second grinding treatment at a rotation speed of 250 rpm for 200 s, and then the aluminum heating plate is rinsed with water and wiped with a dust-free cloth in turn, and then the threaded hole is wiped with a cotton swab wrapped with a dust-free cloth to obtain a polished aluminum heating plate;

[0055] In the first polishing process and the second polishing process, the pneumatic polishing device performs polishing at a uniform speed, and the polishing direction is to diffusely polish from the center of the aluminum heating plate to the periphery; the polishing radius of the first polishing process and the second polishing process is 1 / 3 of the radius of the aluminum heating plate;

[0056] The first polishing agent of the first polishing treatment is ethanol; in the first polishing treatment, the first polishing head on the pneumatic polishing device is a 1200# scouring pad;

[0057] The second polishing agent of the second polishing treatment is water; in the second polishing treatment, the second polishing head on the pneumatic polishing device is a 2000# scouring pad.

[0058] Example 3

[0059] This embodiment provides a surface polishing method for an aluminum heating plate, the surface polishing method comprising:

[0060] The surface of the aluminum heating plate is polished with a pneumatic polishing device at a pressure of 90 kg / cm 2 The first grinding process was performed at a rotation speed of 200 rpm for 180 s and a grinding pressure of 110 kg / cm 2 , a second grinding treatment for 360 seconds at a rotation speed of 150 rpm, and then the aluminum heating plate is rinsed with water and wiped with a dust-free cloth in turn, and then the threaded hole is wiped with a cotton swab wrapped with a dust-free cloth to obtain a polished aluminum heating plate;

[0061] In the first polishing process and the second polishing process, the pneumatic polishing device performs polishing at a uniform speed, and the polishing direction is to diffusely polish from the center of the aluminum heating plate to the periphery; the polishing radius of the first polishing process and the second polishing process is 1 / 5 of the radius of the aluminum heating plate;

[0062] The first polishing agent of the first polishing treatment is isopropyl alcohol; in the first polishing treatment, the first polishing head on the pneumatic polishing device is an 800# scouring pad;

[0063] The second polishing agent of the second polishing treatment is water; in the second polishing treatment, the second polishing head on the pneumatic polishing device is a 1500# scouring pad.

[0064] Example 4

[0065] This embodiment provides a surface polishing method for an aluminum heating plate. Except that the grinding radius in the first grinding process and the second grinding process is 1 / 2 of the radius of the aluminum heating plate, other conditions are the same as those in Embodiment 1.

[0066] Example 5

[0067] This embodiment provides a surface polishing method for an aluminum heating plate. Except that no polishing agent is used during the first polishing treatment and the second polishing treatment, other conditions are the same as those in Embodiment 1.

[0068] Example 6

[0069] This embodiment provides a surface polishing method for an aluminum heating plate. Except that in the first polishing process, the first polishing head on the pneumatic polishing device is 320# sandpaper, other conditions are the same as those in Example 1.

[0070] Example 7

[0071] This embodiment provides a surface polishing method for an aluminum heating plate. Except that in the first polishing process, the first polishing head on the pneumatic polishing device is a 500# scouring pad, other conditions are the same as those in Example 1.

[0072] Example 8

[0073] This embodiment provides a surface polishing method for an aluminum heating plate. Except that in the first polishing process, the first polishing head on the pneumatic polishing device is a 1800# scouring pad, other conditions are the same as those in Example 1.

[0074] Example 9

[0075] This embodiment provides a surface polishing method for an aluminum heating plate. Except that the rotation speed of the first polishing process is 100 rpm, other conditions are the same as those in Embodiment 1.

[0076] Example 10

[0077] This embodiment provides a surface polishing method for an aluminum heating plate. Except that the rotation speed of the first polishing process is 500 rpm, other conditions are the same as those in Embodiment 1.

[0078] Embodiment 11

[0079] This embodiment provides a surface polishing method for an aluminum heating plate. Except that in the second polishing process, the second polishing head on the pneumatic polishing device is a 1200# scouring pad, other conditions are the same as those in Example 1.

[0080] Example 12

[0081] This embodiment provides a surface polishing method for an aluminum heating plate. Except that the rotation speed of the second polishing process is 350 rpm, other conditions are the same as those in Embodiment 1.

[0082] Comparative Example 1

[0083] This embodiment provides a surface polishing method for an aluminum heating plate, except that the polishing pressure of the first polishing treatment is 60 kg / cm 2 Except for this, other conditions are the same as those in Example 1.

[0084] Comparative Example 2

[0085] This embodiment provides a surface polishing method for an aluminum heating plate, except that the polishing pressure of the first polishing treatment is 100 kg / cm 2 Except for this, other conditions are the same as those in Example 1.

[0086] Comparative Example 3

[0087] This embodiment provides a surface polishing method for an aluminum heating plate, except that the polishing pressure of the second polishing treatment is 120 kg / cm 2 Except for this, other conditions are the same as those in Example 1.

[0088] Comparative Example 4

[0089] This embodiment provides a surface polishing method for an aluminum heating plate. Except that the first grinding treatment is not performed, other conditions are the same as those in Embodiment 1.

[0090] Comparative Example 5

[0091] This embodiment provides a surface polishing method for an aluminum heating plate. Except that the second grinding treatment is not performed, other conditions are the same as those in Embodiment 1.

[0092] The surface roughness results and appearance of the polished aluminum heating plates obtained in the above examples and comparative examples are shown in Table 1; wherein the surface roughness is measured using a roughness meter.

[0093] Table 1

[0094]

[0095]

[0096] From Table 1, we can see that:

[0097] (1) It can be seen from Examples 1-3 that the surface polishing method provided by the present invention is easy to operate, and the surface roughness of the polished aluminum heating plate is ≤1 μm, and there are no scratches or lines, which meets the use requirements of the wafer;

[0098] (2) A comparison between Example 1 and Example 4 shows that when the grinding radius is too large, although the material removal speed can be accelerated, the surface roughness increases; a comparison between Example 1 and Example 5 shows that when the first grinding process and the second grinding process are dry grinding, the surface roughness of the aluminum heating plate is too large and there are lines;

[0099] (3) By comparing Example 1 with Examples 6-8 and 11, it can be seen that when the size of the sandpaper or scouring pad used in the first grinding process is too large, the surface roughness of the aluminum heating plate will be too large and there will be lines; when the size of the first polishing head is too small, the processing efficiency will be low and it will take longer time to complete the first grinding process;

[0100] (4) By comparing Example 1 with Examples 9-10 and 12, it can be seen that when the rotation speed of the first grinding process is not within the appropriate range and the rotation speed of the second grinding process is too high, the surface roughness of the aluminum heating plate will be too large and there will be lines;

[0101] (5) It can be seen from the comparison between Example 1 and Comparative Examples 1-3 that when the polishing pressure of the first polishing treatment is too small, not only the polishing efficiency is reduced, but also the pneumatic polishing device cannot act evenly on the surface of the aluminum heating plate due to insufficient pressure, thereby producing uneven surface roughness; when the polishing pressure of the first polishing treatment is too large, the surface of the aluminum heating plate will be damaged at a high speed, and the surface roughness will increase; when the polishing pressure of the second polishing treatment is too large, new wear marks will appear due to excessive pressure, resulting in increased surface roughness and the presence of lines;

[0102] (6) It can be seen from the comparison between Example 1 and Comparative Examples 4-5 that when the first grinding process or the second grinding process is omitted, the surface roughness of the aluminum heating plate is too large and there are lines.

[0103] The applicant declares that the above is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention shall fall within the protection scope and disclosure scope of the present invention.

Claims

1. A surface polishing method for an aluminum heating plate, characterized in that: The surface polishing method comprises: using a pneumatic polishing device to sequentially perform a first polishing treatment and a second polishing treatment on the surface of the aluminum heating plate, and then performing a post-treatment to obtain a polished aluminum heating plate; The grinding pressure of the first grinding process is 80-90 kg / cm 2 ; The grinding pressure of the second grinding process is 100-110kg / cm 2 .

2. The surface polishing method according to claim 1, characterized in that: In the first polishing process and the second polishing process, the pneumatic polishing device performs uniform speed polishing, and the polishing direction is diffuse polishing from the center to the periphery of the aluminum heating plate; Preferably, the grinding radius of the first grinding process and the second grinding process are both 1 / 5-1 / 3 of the radius of the aluminum heating plate.

3. The surface polishing method according to claim 1 or 2, characterized in that: The first polishing agent of the first polishing treatment includes an alcohol solvent or kerosene; Preferably, the alcohol solvent comprises ethanol and / or isopropanol; Preferably, in the first polishing process, the first polishing head on the pneumatic polishing device includes a 800#-1200# scouring pad.

4. The surface polishing method according to any one of claims 1 to 3, characterized in that: The rotation speed of the first grinding process is 200-400 rpm; Preferably, the first grinding process lasts for 60-180 seconds.

5. The surface polishing method according to any one of claims 1 to 4, characterized in that: The second polishing agent of the second polishing treatment includes water; Preferably, in the second polishing process, the second polishing head on the pneumatic polishing device includes a 1500#-2000# scouring pad.

6. The surface polishing method according to any one of claims 1 to 5, characterized in that: The rotation speed of the second grinding process is 150-250 rpm; Preferably, the second grinding process lasts for 200-360 seconds.

7. The surface polishing method according to any one of claims 1 to 6, characterized in that: The post-treatment includes water washing, a first wiping and a second wiping performed in sequence.

8. The surface polishing method according to claim 7, characterized in that: The water washing method includes flushing; Preferably, the first wiping is performed by wiping the surface of the aluminum heating plate with a dust-free cloth; Preferably, the second wiping is performed by wiping the threaded hole with a cotton swab wrapped with a dust-free cloth.

9. The surface polishing method according to any one of claims 1 to 8, characterized in that: The surface roughness of the polished aluminum heating plate is ≤1 μm; Preferably, the surface of the polished aluminum heating plate has no scratches or lines.

10. The surface polishing method according to any one of claims 1 to 9, characterized in that: The surface polishing method comprises: The pneumatic polishing device is used to polish the surface of the aluminum heating plate at a pressure of 80-90kg / cm 2 , the first grinding process is carried out at a rotation speed of 200-400 rpm for 60-180 s and at a grinding pressure of 100-110 kg / cm 2 , a second grinding process is performed at a rotation speed of 150-250 rpm for 200-360 seconds, and then post-processing is performed to obtain an aluminum heating plate with a surface roughness of ≤1 μm and no scratches or lines on the surface; In the first polishing process and the second polishing process, the pneumatic polishing device performs polishing at a uniform speed, and the polishing direction is to diffusely polish from the center of the aluminum heating plate to the periphery; the polishing radius in the first polishing process and the second polishing process is 1 / 5-1 / 3 of the radius of the aluminum heating plate; The first polishing agent of the first polishing treatment includes an alcohol solvent or kerosene; in the first polishing treatment, the first polishing head on the pneumatic polishing device includes a 800#-1200# scouring pad; The second polishing agent of the second polishing treatment includes water; in the second polishing treatment, the second polishing head on the pneumatic polishing device includes a 1500#-2000# scouring pad; The post-treatment includes water washing, first wiping and second wiping performed in sequence; the water washing method includes flushing; the first wiping uses a dust-free cloth to wipe the surface of the aluminum heating plate; the second wiping uses a cotton swab wrapped with a dust-free cloth to wipe the threaded hole.

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