Heat dissipation system of dual-spectrum long-distance field domain temperature measurement equipment

Abstract

The invention discloses a heat dissipation system of dual-spectrum long-distance field domain temperature measurement equipment, which comprises a closed equipment shell, and is characterized in that the equipment shell comprises a main control board, a red light camera, a red light camera control board, a switch circuit board, a router module, a first white light camera module and a second white light camera module; the router module is fixed on the upper side of the switch circuit board, an internal circulation unit with a downward air outlet end is arranged above the router module, and the internal circulation unit is fixedly installed on the top wall of the equipment shell; the bottom of the main control board is matched with the bottom of the inner wall of the equipment shell in a heat transfer mode through a heat conduction structure, a cooling fin comprising a plurality of cooling fins is fixedly installed at the bottom of the equipment shell, and a first external fan and a second external fan are evenly arranged on the face, provided with the cooling fins, of the cooling fin. The temperature of the internal space of the field-domain temperature measurement equipment is reduced, so that electronic devices of the field-domain temperature measurement equipment are in a normal working temperature range, and the heat dissipation efficiency of the equipment is improved.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation system of a dual-spectrum long-distance field temperature measurement device. Background Art

[0002] The dual-spectrum long-distance field temperature measurement equipment is equipped with red and white light cameras, main control boards and other major components. It can conduct comprehensive remote temperature monitoring of many key power equipment throughout the substation, better ensure the safe and stable operation of the power grid, and has important significance and value for improving the upgrading and transformation of the national power industry and safeguarding the safety of people's lives and property. Since the equipment is mainly used for temperature detection in power plants, the field temperature measurement equipment must meet the working requirements of dust and rain protection, so the equipment shell is designed as a closed structure, which increases the density of components inside the equipment. When the equipment is running for a long time, the heat generated by the power devices inside the equipment will cause the heat of the components in the cavity of the equipment to accumulate continuously. If the temperature reaches or exceeds the specified temperature threshold of the electronic equipment, the failure rate of the equipment will increase; for high-tech products, high density, high integration, high frequency and miniaturization of components are inevitable trends, and the resulting increase in heat is also an inevitable physical fact.

[0003] For closed field temperature measurement equipment, the heat dissipation problem is particularly prominent. During normal operation, it is necessary to ensure that the electronic components inside are kept within the temperature range of -5 to 65°C. If the temperature exceeds this range, the performance of the components will be significantly reduced and stable operation will not be maintained, which will inevitably affect the reliability of the system operation. More than half of the damage to the equipment and its components is caused by excessive temperature. Temperature is an important factor affecting the performance stability of electronic components. Once it exceeds its tolerance range, the stability of these components will drop sharply. If the temperature rises by 1°C, the reliability of the components will decrease by 5%. Therefore, in order to ensure the safe and reliable operation of electronic equipment, it is particularly important to do a good job in the thermal design and heat dissipation design of the power devices inside the electronic equipment. Summary of the invention

[0004] Purpose of the invention: In order to overcome the deficiencies in the prior art, the present invention provides a heat dissipation system for a dual-spectrum long-distance field temperature measurement device, which is provided with an internal circulation unit, a heat-conducting structure, a heat sink and two external fans to reduce the temperature of the internal space of the field temperature measurement device, so that the electronic components of the field temperature measurement device are within the temperature range of normal working operation, thereby improving the heat dissipation efficiency of the device.

[0005] Technical solution: To achieve the above-mentioned purpose, a heat dissipation system of a dual-spectrum long-distance field temperature measurement device of the present invention comprises a sealed device housing, wherein the device housing comprises a main control board, a red light camera, a red light camera control board, a switch circuit board, a router module, a first white light camera module and a second white light camera module; the red light camera is installed on the red light camera control board, and the first white light camera module and the second white light camera module are respectively arranged on both sides of the red light camera; the main control board is horizontally fixed to the bottom of the inner wall of the device housing, and the main control board is located on the side of the red light camera away from the lens end; the switch circuit board is parallel to the top of the main control board, and a heat dissipation cavity is formed between the switch circuit board and the main control board; the router module is fixed on the upper side of the switch circuit board, and an internal circulation unit with an air outlet facing downward is arranged above the router module, and the four sides of the internal circulation unit are air inlet ends, and the internal circulation unit is fixedly mounted on the top wall of the device housing.

[0006] Furthermore, the red light camera is surrounded by a metal enclosure wall, isolating the first white light camera module and the second white light camera module outside the metal enclosure wall; the upper end of the red light camera housing transfers heat to the top wall of the device housing through a heat conductive block.

[0007] Furthermore, a connecting passage is formed between the switch circuit board and the metal enclosure wall, and a first side passage and a second side passage are formed between the two sides of the switch circuit board and the inner wall of the device shell respectively; the upper space of the switch circuit board is connected to the heat dissipation cavity through the connecting passage, the first side passage and the second side passage respectively.

[0008] Furthermore, an annular channel is formed between the heat-conducting block and the metal enclosure wall, and the space enclosed by the metal enclosure wall is connected to the inner cavity of the device shell through the annular channel.

[0009] Furthermore, the bottom of the main control board transfers heat to the bottom of the inner wall of the equipment shell through a heat-conducting structure, and the heat-conducting structure includes a temperature-averaging plate and a heat pipe; the heat input end of the sealed shell in the temperature-averaging plate transfers heat to the bottom of the main control board, the heat output end of the sealed shell in the temperature-averaging plate transfers heat to the evaporation section of the tube shell in the heat pipe, and the condensation section of the tube shell in the heat pipe transfers heat to the bottom of the inner wall of the equipment shell.

[0010] Furthermore, a heat sink is fixedly installed at the bottom of the device housing, and the heat sink includes a substrate and a plurality of heat dissipation ribs; one side of the substrate is fixed to the bottom of the outer wall of the device housing through a heat-conducting material, and the other side of the substrate is fixedly provided with a plurality of heat dissipation ribs.

[0011] Furthermore, the plurality of heat dissipation fins are parallel to each other, and the intervals between the plurality of heat dissipation fins are equal.

[0012] Furthermore, a first external fan and a second external fan are evenly arranged on one side of the heat sink having heat dissipation ribs.

[0013] Beneficial effects: A heat dissipation system of a dual-spectrum long-distance field temperature measurement device of the present invention is provided with an internal circulation unit on the top wall of the device shell, so that the airflow in the device shell can circulate, reduce the temperature of each electronic device, and transmit the high-temperature area to the low-temperature area, and bring the high-temperature to the device shell, and transmit it from the device shell to the outside of the device shell, thereby improving the heat dissipation efficiency of the device; a temperature-averaging plate and heat pipe composite heat-conducting structure is provided between the main control board and the device shell, so as to transfer the temperature of the main control board to the device shell and reduce the temperature of the main control board; a heat sink and two external fans are provided at the bottom of the device shell, so as to reduce the weight of the equipment and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A three-dimensional image of the field temperature measurement device with the top shell removed;

[0015] Figure 2 A top view of the field temperature measurement device with the top shell removed;

[0016] Figure 3 It is a side view of the field temperature measurement equipment;

[0017] Figure 4 This is a bottom view of the bottom shell of the field temperature measurement equipment;

[0018] Figure 5 is the structural diagram of the heat sink;

[0019] Figure 6 is the equivalent thermal resistance model of the heat sink;

[0020] Figure 7 This is the temperature cloud map of the red light camera and the main control board. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] like Figure 1As shown, a heat dissipation system of a dual-spectrum long-distance field temperature measurement device comprises a sealed device housing 1, wherein the device housing 1 comprises a main control board 2, a red light camera 3, a red light camera control board 10, a switch circuit board 4, a router module 5, a first white light camera module 8 and a second white light camera module 9; the red light camera 3 is mounted on the red light camera control board 10, and the first white light camera module 8 and the second white light camera module 9 are respectively arranged on both sides of the red light camera 3; the main control board 2 is horizontally fixed to the bottom of the inner wall of the device housing 1, and the main control board 2 is located on the side of the red light camera 3 away from the lens end; the switch circuit board 4 is parallel to the top of the main control board 2, and a heat dissipation cavity 22 is formed between the switch circuit board 4 and the main control board 2; the router module 5 is fixed on the upper side of the switch circuit board 4, and an internal circulation unit 11 with an air outlet facing downward is arranged above the router module 5, and the surrounding of the internal circulation unit 11 is an air inlet end, and the internal circulation unit 11 is fixedly mounted on the top wall of the device housing 1. The main control board is fixed 20mm from the lower shell, and other small-sized and low-power consumption components are evenly distributed on the entire main board. The switch module is fixed 30cm above the main control board.

[0023] The size of the device housing 1 is 340mm×212mm×194mm; the switch circuit board 4 adopts the switch LX-IS5011, with a single power consumption of 0.8W, a total power consumption of 0.8W, and an operating temperature of -40℃~85℃; the router module 5 adopts the router LW-IP301-ELSKY, with a single power consumption of 3.4W, a total power consumption of 3.4W; the main control machine 2 adopts NUC600 (7500U), with a single power consumption of 30W, a total power consumption of 30W, and an operating temperature of -20℃~60℃. The working temperature of the red light camera in the device housing 1 is 65.89℃, the electronic components in the device housing 1 work normally, the inner cavity temperature in the device housing 1 is 67.782℃, and the working temperature of the main control board 2 in the device housing 1 is 76.38℃.

[0024] To solve the heat dissipation problem of field temperature measurement equipment, it is necessary to research and develop a more efficient heat dissipation structure. This includes optimization of the selection of heat dissipation materials, the design of heat dissipation paths, the innovation of heat dissipation methods, and the integration of the overall heat dissipation system. By using materials with high thermal conductivity, heat can be transferred from the heat source to the radiator more quickly; by carefully designing the heat dissipation path, it can be ensured that heat can be efficiently transferred and thermal resistance can be reduced; by innovating the heat dissipation method, the heat dissipation efficiency can be greatly improved; finally, through the integrated design of the entire heat dissipation system, the optimal coordination of each heat dissipation component can be achieved, thereby achieving the best heat dissipation effect. By increasing the amount of heat transferred in the heat transfer process, increasing the heat transfer area, the heat transfer temperature difference, and the heat transfer coefficient can all increase the transfer of heat; the heat transfer process of the field temperature measurement equipment refers to the process in which the heat generated by the power components inside the equipment flows to the external environment through the inner cavity and the equipment housing 1.

[0025] The device housing 1 is made of aluminum alloy with a thermal conductivity of λ=120W / (m·K), and the size of the device shell is determined, so the heat transfer is mainly enhanced by reducing the thermal resistance between the inner cavity and the inner side of the device shell, and between the inner side of the device shell and the external environment. Since the components inside the device are concentrated and compactly distributed, and the inner cavity space is limited, the heat dissipation from the inner cavity of the device to the inner side of the external shell is mainly enhanced by increasing the heat transfer coefficient.

[0026] like Figure 1-3 As shown, the red light camera 3 is surrounded by a metal enclosure wall 21, isolating the first white light camera module 8 and the second white light camera module 9 on the outside of the metal enclosure wall 21; the upper end of the red light camera 3 shell is heat-conducted to the top wall of the device shell 1 through the heat-conducting block 33. The first white light camera module 8 includes a first white light camera 81 and a first white light camera control board 82; the second white light camera module 9 includes a second white light camera 91 and a second white light camera control board 92. The heat-conducting block 33 is thermally connected to the device shell 1 through thermal grease, and the heat-conducting block 33 can be an aluminum block; by adding an aluminum block between the red light camera 3 and the device shell 1 for heat conduction, the heat generated by the red light camera 3 is transferred to the device shell 1 through the aluminum block, and then heat is exchanged with the external environment through natural convection. The metal enclosure wall 21 isolates the first white light camera module 8 and the second white light camera module 9 outside the metal enclosure wall 21. Since the red light camera 3, the first white light camera module 8 and the second white light camera module 9 will generate heat when working, the metal enclosure wall 21 is provided to isolate the heat generated by the first white light camera module 8 and the second white light camera module 9 from affecting the temperature of the red light camera 3, thereby preventing the temperature of the red light camera 3 from rising and ensuring the normal operation of the red light camera 3; at the same time, it can also isolate the heat generated by the red light camera 3 from affecting the temperature of the first white light camera module 8 and the second white light camera module 9.

[0027] like Figure 2-3 As shown, the lenses of the first white light camera 81, the second white light camera 91 and the red light camera 3 are oriented in the same direction; a camera panel 7 is provided on the inner wall of the device housing 1 on the side facing the lens of the red light camera, and holes covered with transparent material are provided at positions on the camera panel 7 corresponding to the lenses of the first white light camera, the second white light camera and the red light camera, so that the airtightness of the device housing 1 is ensured while ensuring that the red light camera and the two white light cameras can capture images; a plug panel 6 is provided on one side of the device housing 1 opposite to the camera panel 7, and the plug port of the switch circuit board 4 is provided on the plug panel 6, and the end connected to the external device line is electrically connected to the plug port of the switch circuit board 4.

[0028] Due to the closed structure of the device housing, the heat in the device cavity cannot be dissipated to the external environment in time, and the heat accumulation in the cavity aggravates the temperature rise of components; when the temperature in the device cavity exceeds the working temperature of the red light camera, a high temperature crash will occur, and the temperature of the main control board is too high, which may cause the system to run slowly and damage internal components; the heat dissipation inside the device mainly considers enhancing the heat transfer of the main control board and the red light camera and enhancing the air flow in the device cavity. Therefore, an internal circulation unit 11 is set in the device housing 1, and the internal circulation unit 11 can be a fan. The fan installed inside the device rotates to increase the air flow inside the device housing 1 to enhance the heat dissipation of the device; when the fan rotates, it will accelerate the air flow in the device cavity, so that the air conducts heat faster, which helps to alleviate the uneven temperature distribution in the device cavity, and diffuse the heat in the device cavity to the vicinity of the device housing. The heat in the device cavity is brought to the external environment through the housing to achieve effective heat dissipation.

[0029] like Figure 1-3 As shown, a connecting passage 23 is formed between the switch circuit board 4 and the metal enclosure wall 21, and a first side passage 41 and a second side passage 42 are formed between the two sides of the switch circuit board 4 and the inner wall of the device housing 1; the upper space of the switch circuit board 4 is connected to the heat dissipation cavity 22 through the connecting passage 23, the first side passage 41 and the second side passage 42. A ring-shaped passage 24 is formed between the heat conducting block 33 and the metal enclosure wall 21, and the space enclosed by the metal enclosure wall 21 is connected to the inner cavity of the device housing 1 through the ring-shaped passage 24.

[0030] When the internal circulation fan in the device housing 1 is started, the fan rotates, and the airflow blown by the fan first blows to the space above the switch circuit board 4, and then the airflow spreads from the upper surface of the switch circuit board 4 to the surroundings, blowing away the heat generated by the switch circuit board 4 and the router module 5, and reducing the temperature near the switch circuit board 4 and the router module 5. At this time, the airflow is divided into two paths, most of the airflow blows to the inner side of the metal enclosure wall 21 through one side of the annular channel 24, and the airflow blows to the gap space between the red light camera 3 and the metal enclosure wall 21. The airflow comes out from the other side of the annular channel 24, taking away the heat generated by the red light camera 3, and reducing the temperature of the red light camera 3; another small part of the airflow blows to the heat dissipation cavity 22 through the connecting channel 23, the first side channel 41 and the second side channel 42. The airflow blows into the heat dissipation cavity 22, and after the airflow touches the panel of the main control board or the inner wall of the device housing, it comes out again through the connecting channel 23, the first side channel 41 and the second side channel 42, taking away the heat generated by the main control board 2, and reducing the temperature of the main control board.

[0031] At the same time, due to the setting of the internal circulation unit 11, the airflow in the space inside the device housing 1 circulates, the heat generated by the red light camera is diffused to other areas inside the device housing 1 through the annular channel 24, and the heat generated by the main control board 2 is diffused to other areas inside the device housing 1 through the connecting channel 23, the first side channel 41 and the second side channel 42; the temperature distribution inside the device housing 1 becomes uniform, the heat is diffused to the vicinity of the inner wall of the device housing 1, and the heat is brought to the external environment through the device housing 1; thereby reducing the temperature of the entire space inside the device housing. The airflow blown out by the internal circulation unit 11 transfers the high heat generated by the power electronic devices in the device to the surroundings of the device cavity, and diffuses outward along the cavity to reach the inner wall of the device housing; the heat gradually moves to the outside of the outer shell along the thickness direction of the device housing 1; as the heat gradually transfers from the inside to the outside of the shell, the two external fans push the heat gathered around the shell out, forming a complete heat dissipation cycle.

[0032] like Figure 3 As shown, the main control board 2 transfers heat through the heat-conducting structure 14 to cooperate with the bottom of the inner wall of the equipment shell 1, and the heat-conducting structure 14 includes a temperature-averaging plate and a heat pipe; the heat input end of the sealed shell in the temperature-averaging plate transfers heat to cooperate with the bottom of the main control board 2, the heat output end of the sealed shell in the temperature-averaging plate transfers heat to cooperate with the evaporation section of the tube shell in the heat pipe, and the condensation section of the tube shell in the heat pipe transfers heat to cooperate with the bottom of the inner wall of the equipment shell 1.

[0033] The temperature spreader is a heat pipe technology distributed on a two-dimensional plane for heat dissipation. It achieves efficient heat conduction through a phase change heat dissipation mechanism and is widely used in the field of heat dissipation of electronic products. The temperature spreader consists of a closed shell, a capillary structure layer on the surface of the shell, and a working medium. In the heating zone, which is the heat input end or evaporation end, the working medium evaporates from liquid to gas, and the gas is quickly distributed in the cavity. Then in the cooling zone, which is the heat output end or condensation end, it condenses into liquid and returns to the heating zone through capillary action. This cycle effectively transfers heat. Although the heat spreader itself cannot store heat energy, its main advantage is that its heat transfer performance on a plane far exceeds that of general metal materials; it has an equivalent thermal conductivity of more than 20000W / (m*K), and the thickness can be as small as 3mm, which is almost equivalent to the thickness of the metal cavity wall, so it does not take up too much extra space. The temperature-regulating plate is embedded between the heat source and the heat pipe. This layout allows the heat generated by the heat source to be first directed to the temperature-regulating plate. Due to its two-dimensional structure, this thermally conductive material transfers heat with extremely high efficiency. This heat transfer method not only ensures that the heat can be efficiently and evenly distributed, but also ensures that the phase change material can fully absorb and utilize this energy, further enhancing the effectiveness of the phase change material at the heat source, thereby improving the efficiency of the entire heat dissipation system. The temperature-regulating plate can be 100*100*3mm in size, with a thermal conductivity of 10000W / (m*K).

[0034] The heat pipe transfers a large amount of heat over a long distance through a very small cross-sectional area without relying on external power; the heat pipe consists of three main parts: the tube shell, the wick and the end cap; the tube shell is the main structure of the heat pipe; the wick is a special capillary porous material that can absorb heat and transfer it to the surrounding environment or other heat transfer media; the end cap is responsible for sealing and protecting the working liquid in the tube to ensure that the heat can be effectively transferred. The working principle of the heat pipe is to use the negative pressure formed inside to drive the working liquid to flow in the tube. In this way, it can quickly transfer heat from one area, the evaporation section, to another area, the cooling section, to achieve heat redistribution. When one section of the heat pipe contacts the heat source, i.e., the heat output end of the temperature equalizer, the capillary wick inside it starts to work, and the liquid gradually evaporates in the process until it is completely vaporized; then, the heat carried by the steam migrates to the other end of the heat pipe at a very high speed, and the released heat is converted into liquid, and this liquid substance, driven by the capillary force, flows along the porous material to the evaporation part, thereby continuously and rapidly transmitting the temperature of the heat output end of the temperature equalizer to the bottom of the inner wall of the device housing 1. The thermal conductivity of the heat pipe is 20000W / (m*K).

[0035] like Figure 4-5As shown, a heat sink 31 is fixedly installed at the bottom of the device housing 1, and the heat sink 31 includes a substrate and a plurality of heat sink fins; one side of the substrate is fixed to the bottom of the outer wall of the device housing 1 by a heat conductive material 32, and a plurality of heat sink fins are fixedly provided on the other side of the substrate. The plurality of heat sink fins are parallel to each other, and the spacing between the plurality of heat sink fins is equal; the length direction of the heat sink fins is consistent with the length direction of the device housing 1. The heat sink 31 can expand the area of ​​heat dissipation to promote the cooling of the device or component, and the plurality of heat sink fins are usually made of metal materials with high thermal conductivity; the heat sink 31 mainly considers multiple factors such as material selection, thickness, shape, and matching degree with the device housing to achieve the best heat dissipation effect. The heat dissipation efficiency of the heat sink 31 is mainly reflected by the thermal resistance of the heat sink. When calculating the thermal resistance of the heat sink, the model of the heat sink is first simplified, and an equivalent thermal resistance model is created, such as Figure 6 As shown. The conduction thermal resistance of the substrate of the heat sink 31 is closely related to the material properties, structural design and surface characteristics of the substrate, and directly affects the efficiency of heat transfer from the heat source to the heat sink; the heat sink fins are usually composed of a plurality of small fins that are perpendicular to the substrate, each of which has its own thermal conductivity and can transfer heat from one area to another by convection. The heat sink fins mainly have conduction thermal resistance and convection thermal resistance; since the end surface area of ​​the heat sink fins is usually small, the effect of convection heat dissipation on the overall thermal resistance is relatively weak; therefore, in the heat sink problem involved in this study, the effect of convection thermal resistance on thermal resistance is chosen to be ignored.

[0036] like Figure 5 As shown, the thermal resistance of the heat sink 31 mainly includes the conduction thermal resistance of the substrate, the conduction thermal resistance of the heat sink fins, and the convection thermal resistance of the fins; the total thermal resistance calculation process of the heat sink 31 is as follows:

[0037]

[0038] In the formula, R th,b is the thermal conduction resistance of the substrate, R th,fin is the conduction thermal resistance of the heat sink fin, R th,A is the convection thermal resistance of the heat sink fin;

[0039] The calculation process of the convection thermal resistance of the heat sink fin is as follows:

[0040]

[0041] Where Hb is the height of the heat sink, m; L is the length of the heat sink, m; h is the convection heat transfer coefficient between the heat sink and the air, W / m 2 K; n is the number of heat sink fins; the conduction calculation process of the substrate is as follows:

[0042]

[0043] Where b is the thickness of the substrate, m; W is the width of the heat sink, m; K is the thermal conductivity of the heat sink material, W / m℃; the calculation process of the conduction thermal resistance of the heat sink fin is as follows:

[0044]

[0045] The total thermal resistance of the heat sink is expressed as:

[0046]

[0047] The total thermal resistance of the heat sink is mainly affected by the dimensional parameters of the heat sink. By optimizing the dimensional parameters of the heat sink, the total thermal resistance of the heat sink can be reduced, thereby improving the heat dissipation efficiency. Based on the calculation formula of the total thermal resistance of the heat sink, the material and size that minimize the total thermal resistance of the heat sink are selected. The heat sink is made of aluminum alloy, the height of the heat sink is selected as 30mm, the width of the heat sink is selected as 212mm, and the length of the heat sink is selected as 340mm. The height of the heat sink fin is 20mm, the thickness of the heat sink fin is 1.2mm, the number of heat sink fins is 32, and the thickness of the substrate is 10mm. Analysis of the influence of the thickness of the heat sink fins: As the thickness of the heat sink fins increases, there are two sides to the heat transfer. On the one hand, increasing the thickness can enhance the ability of the heat source to transfer heat to the heat sink, which helps to dissipate heat. On the other hand, as the thickness of the heat sink fins increases, the flow area through which the cooling air flows will decrease, resulting in an increase in flow resistance and a decrease in wind speed, which is not conducive to heat dissipation. At the same time, increasing the thickness may lead to a decrease in the number of heat sink fins, which means a decrease in heat exchange area, which is not conducive to heat dissipation. Therefore, there is a balance point. Before this point, increasing the thickness of the heat sink is beneficial to improving the heat dissipation performance, but after this point, too thick a heat sink will reduce the heat dissipation efficiency. Therefore, the thickness of the heat sink is selected to be 1.2 mm; the number of heat sinks is n=26.

[0048] like Figure 5 As shown, the first external fan 12 and the second external fan 13 are evenly arranged on one side of the heat dissipation ribs in the heat sink 31. The two fans outside the device housing 1 speed up the air flow speed of the environment around the device, so that the heat conducted to the device housing 1 is transferred to the external environment as quickly as possible; the air inlet ends of the first external fan 12 and the second external fan 13 can be arranged around the fan, and the temperature emitted by the heat dissipation ribs enters through the air inlet end of the fan and is blown out from the outlet end; the air inlet ends of the first external fan 12 and the second external fan 13 can be arranged at one end of the fan away from the heat dissipation ribs, and the fan blows the airflow with a lower temperature to the heat dissipation ribs, and diffuses the heat of the heat dissipation ribs to the surroundings through the gaps between the heat dissipation ribs, thereby reducing the temperature at the bottom of the device housing.

[0049] The main control board 2 is electrically connected to the red light camera control board, the first white light camera control board and the second white light camera control board; the red light camera control board is electrically connected to the red light camera, the first white light camera control board is electrically connected to the first white light camera, and the second white light camera control board is electrically connected to the second white light camera; the main control board 2 is also electrically connected to the switch circuit board 4, the internal circulation unit 11, the first external fan 12 and the second external fan 13, the switch circuit board 4 is electrically connected to the router module 5; the wiring port of the switch circuit board 4 is electrically connected to an external device or a computer terminal.

[0050] When monitoring power equipment, the computer terminal and other devices transmit to the switch circuit board 4 through the line, and then the switch circuit board 4 transmits to the main control board 2. The main control board 2 controls the red light camera control board, the first white light camera control board and the second white light camera control board to respectively control the red light camera, the first white light camera and the second white light camera to work normally. The red light camera control board controls the red light camera to collect images or monitor the real-time temperature of the power equipment. Similarly, the two white light cameras also collect images. The images collected by the white light camera can be a supplement to the images collected by the red light camera; and the collected images are transmitted to the main control machine, and the final collected images are clearer and clearer, and are transmitted to the computer terminal through the switch circuit board 4. The main control board 2 also controls the rotation of the internal circulation unit 11, the first external fan and the second external fan. When the temperature in the device housing 1 is higher than the highest temperature of the normal operation of the electronic components in the device housing, the internal circulation unit 11, the first external fan and the second external fan are driven to rotate to dissipate the temperature in the device housing to ensure that the temperature in the device housing is within the normal operating temperature range of the electronic components in the device housing.

[0051] Example

[0052] When the ambient temperature is 26.5℃ and the equipment has no heat dissipation measures, the maximum temperatures of the inner cavity, red light camera and main control board of the field temperature measurement equipment are 67.782℃, 65.890℃ and 76.383℃ respectively when the steady state is reached. Since the normal operating temperature of the electronic components of the field temperature measurement equipment is generally lower than 60℃, it is necessary to set a heat dissipation structure to reduce the temperature of each electronic component in the field temperature measurement equipment. The internal circulation unit 11, the first external fan 12, the second external fan 13, the heat conduction structure 14 and other device structural materials are set up, and the red light camera 3 and the main control board 2 in the field temperature measurement equipment are thermally simulated and analyzed by ANSYS / Icepak software, and the temperature cloud diagram of the two main electronic components of the red light camera 3 and the main control board 2 in the inner cavity of the equipment is obtained, as shown in FIG. Figure 7As shown, it can be seen that the temperature of the red light camera has dropped below 50°C, and the temperature of the main control board and the highest local temperature of the main control board are both below 60°C, which is in line with the normal operating temperature range of the electronic components in the field temperature measurement equipment. At the same time, heat dissipation grooves are set on the top and both sides of the outer wall of the device housing 1 to increase the heat dissipation efficiency of the device housing 1.

[0053] The above is only a description of the preferred embodiments of the present invention. Ordinary technicians in this technical field can make several modifications and optimizations based on the above disclosure without departing from the above basic principles. These improvements and optimizations should be regarded as the understood protection scope of the present invention.

Claims

1. A heat dissipation system for a dual-spectrum long-distance field temperature measurement device, characterized in that: The device comprises a sealed device housing (1), wherein the device housing (1) comprises a main control board (2), a red light camera (3), a red light camera control board (10), a switch circuit board (4), a router module (5), a first white light camera module (8) and a second white light camera module (9); the red light camera (3) is mounted on the red light camera control board (10), and the first white light camera module (8) and the second white light camera module (9) are respectively arranged on both sides of the red light camera (3); the main control board (2) is horizontally fixed to the bottom of the inner wall of the device housing (1). The main control board (2) is located on a side of the red light camera (3) away from the lens end; the switch circuit board (4) is parallel to the upper side of the main control board (2), and a heat dissipation cavity (22) is formed between the switch circuit board (4) and the main control board (2); the router module (5) is fixed on the upper side of the switch circuit board (4), and an internal circulation unit (11) with an air outlet facing downward is arranged above the router module (5), the four sides of the internal circulation unit (11) are air inlet ends, and the internal circulation unit (11) is fixedly mounted on the top wall of the device housing (1).

2. The heat dissipation system of the dual-spectrum long-distance field temperature measurement device according to claim 1 is characterized in that: The red light camera (3) is surrounded by a metal enclosure wall (21), isolating the first white light camera module (8) and the second white light camera module (9) outside the metal enclosure wall (21); the upper end of the housing of the red light camera (3) transfers heat to the top wall of the housing of the matching device (1) through a heat conducting block (33).

3. The heat dissipation system of the dual-spectrum long-distance field temperature measurement device according to claim 2 is characterized in that: A connecting passage (23) is formed between the switch circuit board (4) and the metal enclosure wall (21); a first side passage (41) and a second side passage (42) are formed between the two sides of the switch circuit board (4) and the inner wall of the device housing (1); and the upper space of the switch circuit board (4) is connected to the heat dissipation cavity (22) through the connecting passage (23), the first side passage (41) and the second side passage (42).

4. The heat dissipation system of the dual-spectrum long-distance field temperature measurement device according to claim 3 is characterized by: A ring-shaped channel (24) is formed between the heat-conducting block (33) and the metal enclosure wall (21), and the space enclosed by the metal enclosure wall (21) is connected to the inner cavity of the device housing (1) through the ring-shaped channel (24).

5. The heat dissipation system of the dual-spectrum long-distance field temperature measurement device according to claim 1 is characterized in that: The bottom of the main control board (2) transfers heat to the bottom of the inner wall of the matching equipment housing (1) through a heat-conducting structure (14), and the heat-conducting structure (14) includes a temperature-isolating plate and a heat pipe.

6. The heat dissipation system of the dual-spectrum long-distance field temperature measurement device according to claim 1, characterized in that: A heat sink (31) is fixedly mounted on the bottom of the device housing (1), and the heat sink (31) comprises a base plate and a plurality of heat sink fins; one side of the base plate is fixed to the bottom of the outer wall of the device housing (1) via a heat conductive material (32), and the other side of the base plate is fixedly provided with a plurality of heat sink fins.

7. The heat dissipation system of the dual-spectrum long-distance field temperature measurement device according to claim 6, characterized in that: The first external fan (12) and the second external fan (13) are evenly arranged on one side of the heat sink (31) having heat dissipation ribs.

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