Insulating pouring sealant and preparation method thereof

Abstract

The invention relates to the technical field of insulating pouring sealants, and provides an insulating pouring sealant and a preparation method thereof. The insulating pouring sealant comprises 100 parts by weight of dicyclopentadiene dioxide, 60-120 parts by weight of modified muscovite powder and 45-60 parts by weight of a curing agent, and a preparation method of the modified muscovite powder comprises the following steps: diluting a coupling agent with a solvent, then adding the muscovite powder, stirring, mixing, filtering and drying to obtain the modified muscovite powder. The insulating pouring sealant provided by the invention has low heat conductivity coefficient and excellent electrical insulation property and compression strength, and is suitable for high-end electronic and electrical fields with higher requirements on heat conductivity and electrical insulation property.

Description

Technical Field

[0001] The invention relates to the technical field of insulating potting adhesive, and more specifically to an insulating potting adhesive and a preparation method thereof. Background Art

[0002] Insulation potting glue is a liquid or viscous polymerizable resin mixture made of resin, filler, curing agent, etc. It has good fluidity and less volatiles at the pouring temperature, fast curing, small shrinkage after curing, and excellent electrical, mechanical and chemical properties. It is a special electrical insulation material that integrates multiple functions such as insulation, moisture-proof, mildew-proof, anti-corrosion, fixation and isolation, and plays a very important role in the electrical industry. At present, insulation potting glue has been widely used in motors, electrical appliances, electronic combinations, and 500,000-volt high-voltage transmission transformers, especially in current transformers below 20kV, voltage transformers below 10kV, dry-type transformers, indoor and outdoor insulators, sulfur hexafluoride switch arc chamber insulators, and cable junction boxes.

[0003] In recent years, with the progress of society, the industry has higher requirements for the heat resistance, mechanical strength, thermal conductivity and other properties of insulation potting glue. In order to further improve the quality of insulation potting glue, the industry has carried out research work on potting glue resin and its additives (such as curing agent, curing accelerator, toughening agent), inorganic filler and preparation process, in order to develop insulation potting glue with good comprehensive performance.

[0004] In the field of new energy batteries, since the promotion of electric vehicles, there has been no interruption in the news of lithium battery combustion and explosion, and the safety issues of lithium batteries need to be solved urgently. How to improve the safety performance of lithium batteries has become an important development trend and research hotspot in new energy batteries. In the development of power battery safety technology, car companies and mainstream battery companies have begun to focus on the goal of "ternary lithium battery system without fire". How to prevent ternary lithium batteries from catching fire, one of the easy ways to achieve is isolation, the purpose of which is to block the spread, which includes isolation inside and outside the battery pack. One of the key links of isolation is to block the heat transfer between battery cells, and low thermal conductivity insulating potting glue is the key material in this link. Existing insulating potting glue generally cannot meet the requirements of low thermal conductivity. Summary of the invention

[0005] The object of the present invention is to provide an insulating potting glue and a preparation method thereof, so as to solve the technical problem that the insulating potting glue products in the prior art are difficult to meet the requirements of low thermal conductivity.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] In a first aspect, the present invention provides an insulating potting adhesive comprising the following components in parts by weight:

[0008] 100 parts of dicyclopentadiene dioxide;

[0009] 60-120 parts of modified muscovite powder;

[0010] 45-60 parts of curing agent;

[0011] The preparation method of the modified muscovite powder comprises:

[0012] The coupling agent is diluted with a solvent, then added into the muscovite powder, stirred and mixed, filtered, and dried to obtain the modified muscovite powder.

[0013] It should be noted that the "muscovite powder" described in the present invention refers to the powder of muscovite minerals. Muscovite minerals refer to a type of mineral in the mica family and the muscovite subfamily, which are 2:1 type layered silicate minerals with a layer of silicon oxygen octahedron sandwiched between two layers of silicon oxygen tetrahedron, mainly including muscovite, sericite, illite and hydromica. Muscovite minerals contain cationic K + It is generally distributed in the center of the upper and lower hexagonal rings, surrounded by 12 oxygen ions, which can prevent the flow of electrons and has a very stable structure.

[0014] The particle size of the modified muscovite powder used in the present invention can refer to the particle size of inorganic fillers commonly used in insulating potting glue, such as 600 mesh, 800 mesh, etc.

[0015] The insulating potting glue provided by the present invention adopts the modified muscovite powder modified by a coupling agent as a filler, so that the insulating potting glue can have low thermal conductivity and excellent insulating performance and mechanical properties.

[0016] Dicyclopentadiene dioxide (DCPDDO) is a special alicyclic epoxy resin monomer. The insulating potting adhesive provided by the present invention uses dicyclopentadiene dioxide instead of epoxy resin (such as bisphenol A epoxy resin), which can obtain better electrical insulation performance and has excellent strength and heat resistance.

[0017] According to some embodiments of the present invention, the curing agent includes at least one of maleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and dodecenylsuccinic anhydride.

[0018] According to some embodiments of the present invention, the weight ratio of the coupling agent to the muscovite powder is 1:25-400.

[0019] According to some embodiments of the present invention, the coupling agent includes at least one of the silane coupling agents KH570, KH560, and KH550.

[0020] According to some embodiments of the present invention, the weight ratio of the coupling agent to the solvent is 1:4-6.

[0021] According to some embodiments of the present invention, the solvent includes water and / or an alcohol solvent.

[0022] According to some embodiments of the present invention, the alcohol solvent includes at least one of methanol, ethanol and isopropanol.

[0023] According to some embodiments of the present invention, the solvent includes water and an alcohol solvent, and the weight ratio of the water to the alcohol solvent is 1:9-12.

[0024] According to some embodiments of the present invention, the insulating potting compound further includes 5 to 10 parts of an accelerator.

[0025] According to some embodiments of the present invention, the promoter includes at least one of glycerol, ethylene glycol, trimethylolpropane, butylene glycol, and propylene glycol.

[0026] In a second aspect, the present invention provides a method for preparing the insulating potting adhesive described in the first aspect, comprising: mixing the components at room temperature for 1.5 to 2.5 hours to obtain the insulating potting adhesive.

[0027] In a third aspect, the present invention provides a method for using the insulating potting glue described in the first aspect, comprising: heating and melting the insulating potting glue at 80-90° C., stirring, and then heating to 110-130° C. for curing.

[0028] According to some embodiments of the present invention, the curing time is 2 to 6 hours.

[0029] The beneficial effects of the present invention are at least:

[0030] The insulating potting adhesive provided by the present invention has low thermal conductivity and excellent electrical insulation performance and compression strength, and is suitable for use in high-end electronic and electrical fields with high requirements on thermal conductivity and electrical insulation. DETAILED DESCRIPTION

[0031] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments. It should be understood that the specific embodiments described herein are only used to explain this patent in detail and do not limit the scope of protection of the present invention in any way.

[0032] Unless otherwise defined, the technical terms used in the following examples have the same meanings as those generally understood by those skilled in the art to which the present invention belongs. The reagents used in the following examples, unless otherwise specified, are all conventional biochemical reagents; the raw materials, instruments and equipment used in the following examples, etc., can all be purchased on the market or can be obtained by existing methods; the reagent amounts, unless otherwise specified, are the reagent amounts used in conventional experimental operations; the experimental methods, unless otherwise specified, are all conventional methods.

[0033] In each embodiment and comparative example of the present invention, each performance data is tested according to the following test method:

[0034] (1) Volume resistivity: measured in accordance with GB / T1410-2006.

[0035] (2) Compression strength: measured in accordance with GB / T528-2009.

[0036] (3) Thermal conductivity: measured in accordance with GB / T11205-2009.

[0037] In each embodiment and comparative example of the present invention, the preparation method of the modified muscovite powder used is as follows:

[0038] (1) Modified muscovite powder A

[0039] In a 1000 mL beaker, silane coupling agent KH570 was mixed with deionized water and ethanol in a weight ratio of 20:8:72 to obtain a coupling agent diluent, and then 800 mesh muscovite powder was added, the weight ratio of silane coupling agent KH570 to muscovite powder was 1:200, and after fully stirring and mixing, the mixture was filtered and dried to obtain modified muscovite powder A.

[0040] (2) Modified muscovite powder B

[0041] In a 1000 mL beaker, silane coupling agent KH550 was mixed with deionized water and ethanol in a weight ratio of 20:8:72 to obtain a coupling agent diluent, and then 800 mesh muscovite powder was added, the weight ratio of silane coupling agent KH550 to muscovite powder was 1:200, and after fully stirring and mixing, the mixture was filtered and dried to obtain modified muscovite powder B.

[0042] Example 1

[0043] In a 500 mL beaker, 100 g of dicyclopentadiene dioxide, 5 g of glycerol, 60 g of modified muscovite powder A, and 50 g of maleic anhydride were added, and the mixture was stirred and mixed at room temperature for 2 h to obtain an insulating potting adhesive.

[0044] Example 2

[0045] In a 500 mL beaker, 100 g of dicyclopentadiene dioxide, 7.5 g of glycerol, 85 g of modified muscovite powder A, and 60 g of maleic anhydride were added, and the mixture was stirred and mixed at room temperature for 2 h to obtain an insulating potting adhesive.

[0046] Example 3

[0047] In a 500 mL beaker, 100 g of dicyclopentadiene dioxide, 10 g of glycerol, 120 g of modified muscovite powder A, and 55 g of maleic anhydride were added, and the mixture was stirred and mixed at room temperature for 2 h to obtain an insulating potting adhesive.

[0048] Example 4

[0049] In a 500 mL beaker, 100 g of dicyclopentadiene dioxide, 5 g of glycerol, 60 g of modified muscovite powder A, and 45 g of maleic anhydride were added, and the mixture was stirred and mixed at room temperature for 2 h to obtain an insulating potting adhesive.

[0050] Example 5

[0051] The preparation method of the insulating potting compound is similar to that of Example 1, except that the modified muscovite powder A is replaced by modified muscovite powder B.

[0052] Comparative Example 1

[0053] The preparation method of the insulating potting compound is similar to that of Example 1, except that the modified muscovite powder A is replaced by an equal weight of modified phlogopite powder.

[0054] The preparation method of the modified phlogopite powder is the same as that of the modified muscovite powder A, except that the muscovite powder is replaced by 800 mesh phlogopite powder.

[0055] Comparative Example 2

[0056] The preparation method of the insulating potting compound is similar to that of Example 1, except that the modified muscovite powder A is replaced by an equal weight of modified silica powder.

[0057] The preparation method of the modified silica powder is the same as that of the modified muscovite powder A, except that the muscovite powder is replaced with 800 mesh silica powder.

[0058] Comparative Example 3

[0059] The preparation method of the insulating potting compound is similar to that of Example 1, except that the amount of the modified muscovite powder A is changed from 60 g to 30 g.

[0060] Performance evaluation of insulation potting glue

[0061] The insulating potting glue prepared in Examples 1 to 5 and Comparative Examples 1 to 3 was heated and stirred at 80° C. to dissolve, and then heated to 120° C. to cure for 2 hours.

[0062] The performance of the cured insulating potting glue was tested, and the results are shown in the following table:

[0063]

[0064] It should be noted that the embodiments described above are only used to explain the present invention and do not constitute any limitation to the present invention. The present invention has been described with reference to typical embodiments, but it should be understood that the words used therein are descriptive and explanatory words, rather than restrictive words. The present invention may be modified as specified within the scope of the claims of the present invention, and the present invention may be revised without departing from the scope and spirit of the present invention. Although the present invention described therein relates to specific methods, materials and embodiments, it does not mean that the present invention is limited to the specific examples disclosed therein, on the contrary, the present invention can be extended to all other methods and applications with the same functions.

Claims

1. An insulating potting glue, characterized in that: The composition comprises the following components in parts by weight: 100 parts of dicyclopentadiene dioxide; 60-120 parts of modified muscovite powder; 45-60 parts of curing agent; The preparation method of the modified muscovite powder comprises: The coupling agent is diluted with a solvent, then added into the muscovite powder, stirred and mixed, filtered, and dried to obtain the modified muscovite powder.

2. The insulating potting adhesive according to claim 1, characterized in that: The curing agent includes at least one of maleic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and dodecenylsuccinic anhydride.

3. The insulating potting glue according to claim 1 or 2, characterized in that: The weight ratio of the coupling agent to the muscovite powder is 1:25-400; And / or, the coupling agent includes at least one of the silane coupling agents KH570, KH560, and KH550.

4. The insulating potting compound according to any one of claims 1 to 3, characterized in that: The weight ratio of the coupling agent to the solvent is 1:4-6.

5. The insulating potting compound according to any one of claims 1 to 4, characterized in that: The solvent includes water and / or alcohol solvent.

6. The insulating potting adhesive according to claim 5, characterized in that: The alcohol solvent includes at least one of methanol, ethanol and isopropanol; And / or, the solvent includes water and an alcohol solvent, and the weight ratio of the water to the alcohol solvent is 1:9-12.

7. The insulating potting adhesive according to any one of claims 1 to 6, characterized in that: The insulating potting glue also includes 5 to 10 parts of an accelerator.

8. The insulating potting adhesive according to claim 7, characterized in that: The accelerator includes at least one of glycerol, ethylene glycol, trimethylolpropane, butylene glycol and propylene glycol.

9. The method for preparing the insulating potting adhesive according to any one of claims 1 to 8, characterized in that: include: The insulating potting adhesive can be prepared by mixing the components at room temperature for 1.5 to 2.5 hours.

10. The method for using the insulating potting adhesive according to any one of claims 1 to 8, characterized in that: include: The insulating potting glue is heated to melt at 80-90° C., stirred, and then heated to 110-130° C. for curing; Preferably, the curing time is 2 to 6 hours.

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