Superhard brittle nonmetal material diamond wire cutting liquid and preparation method thereof

Abstract

The invention relates to the technical field of cutting fluids, in particular to a superhard brittle nonmetal material diamond wire cutting fluid and a preparation method thereof.The superhard brittle nonmetal material diamond wire cutting fluid at least comprises, by mass, 10-20% of organic amine, 2-5% of organic acid, 20-30% of polyethylene glycol, 0.1-0.5% of quaternary ammonium salt, 0.1-0.5% of benzotriazole, 0.1-0.5% of nonionic surfactant and the balance water. By optimizing a formula system of the cutting fluid, after the provided cutting fluid is used for cutting superhard and brittle materials such as silicon nitride, aluminum oxide and special glass, the surface quality of products is high, the degree of finish is high, and no trace is generated.

Description

Technical Field

[0001] The invention relates to the technical field of cutting fluids, in particular to a super-hard and brittle non-metallic material diamond wire cutting fluid and a preparation method thereof. Background Art

[0002] At present, the diamond wire cutting fluid is mainly composed of polyethylene glycol and pure water, and is combined with the introduction of emulsified silicone oil, ethers and polydimethylsilane to inhibit foaming and ensure sufficient permeability to the processing gap. For example, a Chinese patent (publication number CN105008505A) discloses an aqueous processing fluid, which specifically selects a specific non-ionic surfactant (epoxy adduct of acetylene glycol) and a glycol compound to cooperate, thereby improving its wettability to the processing gap, improving the cutting accuracy and inhibiting the foaming of the liquid. However, for super-hard and brittle materials, especially for silicon nitride, aluminum oxide and special glass, the Mohs hardness is usually between 8.5-9.5, and the diamond wire saw tension setting value is 20-25N. Due to the polycrystalline structure, it is difficult for the wire saw to enter the crystal for wire cutting under low tension, and the surface quality after processing is accompanied by the generation of line marks and deterioration of smoothness due to the increase of chips. Summary of the invention

[0003] In order to solve the above problems, the present invention provides a diamond wire cutting fluid for super-hard and brittle non-metallic materials. By optimizing the cutting fluid formula system, the provided cutting fluid is used for cutting super-hard and brittle materials such as silicon nitride, aluminum oxide and special glass, and the surface quality of the product is high, the finish is high, and no wire marks are generated.

[0004] On one hand, the present invention provides a superhard and brittle non-metallic material diamond wire cutting fluid, which comprises, by mass percentage, at least 10-20% of organic amine, 2-5% of organic acid, 20-30% of polyethylene glycol, 0.1-0.5% of quaternary ammonium salt, 0.1-0.5% of benzotriazole, 0.1-0.5% of nonionic surfactant, and the balance is made up of water.

[0005] As a preferred technical solution, the super-hard and brittle non-metallic material diamond wire cutting fluid comprises, by mass percentage, at least 12.5-15.5% of organic amine, 3-4.5% of organic acid, 23-24% of polyethylene glycol, 0.2-0.3% of quaternary ammonium salt, 0.2-0.3% of benzotriazole, 0.3-0.5% of non-ionic surfactant, and the balance is made up of water.

[0006] As a preferred technical solution, the nonionic surfactant is selected from at least one of alkylphenol polyoxyethylene ether, castor oil polyoxyethylene ether, fatty alcohol polyoxyethylene ether, fatty acid polyoxyethylene ether, and fatty amine polyoxyethylene ether, preferably fatty alcohol polyoxyethylene ether.

[0007] Preferably, the fatty alcohol polyoxyethylene ether is selected from oleyl alcohol polyoxyethylene ether, isomeric decanol polyoxyethylene ether, isomeric tridecanol polyoxyethylene ether, C 16-18 Fatty alcohol polyoxyethylene ether, C 12-14 At least one of the fatty alcohol polyoxyethylene ethers is preferably isomeric decanol polyoxyethylene ether.

[0008] Preferably, the hydroxyl value of the isomeric decanol polyoxyethylene ether is 135-215 mgKOH / g, preferably 175-215 mgKOH / g (E-1003, Haian Petrochemical).

[0009] As a preferred technical solution, the organic amine at least includes polyethylene polyamine.

[0010] Preferably, the organic amine further comprises at least one of triethanolamine and diethanolamine.

[0011] Preferably, the mass ratio of polyethylene polyamine, triethanolamine and diethanolamine is (2-5):(8-10):(2-3), preferably (2-5):(8.5-9.5):(2-3).

[0012] As a preferred technical solution, the mass ratio of the isomeric decanol polyoxyethylene ether to polyethylene polyamine is (0.3-0.5): (2-3).

[0013] As a preferred technical solution, the organic acid is selected from at least one of sebacic acid, citric acid and benzoic acid. Preferably, the organic acid is a combination of sebacic acid, citric acid and benzoic acid, and the mass ratio of the organic acid to sebacic acid, citric acid and benzoic acid is (1-3): (1-2): (0.1-0.5), preferably (1.5-2.5): (1.3-1.7): (0.2-0.3).

[0014] As a preferred technical solution, the polyethylene glycol is selected from at least one of polyethylene glycol 200, polyethylene glycol 400, polyethylene glycol 600, polyethylene glycol 800, polyethylene glycol 1000, polyethylene glycol 1200, polyethylene glycol 1500, polyethylene glycol 1800, and polyethylene glycol 2000, preferably polyethylene glycol 200 and / or polyethylene glycol 400.

[0015] The main reason why the common polyethylene glycol-water cutting fluid system cannot try the cutting of superhard and brittle materials is that the polyethylene glycol-water system has no cleaning and penetration ability for the chips (usually 0.5-1 μm) after cutting, and the chips will be filled between the diamond particles on the surface of the diamond wire, hindering the diamond cutting force, especially for polycrystalline superhard and brittle materials, it is difficult to cut when the cutting tension is reduced, and it is impossible to cut. Therefore, the present invention introduces nonionic surfactants and organic amines in the optimization system, especially introduces isomeric decanol polyoxyethylene ethers to cooperate with the organic amine system containing polyethylene polyamines, and the chips after cutting are settled as much as possible, avoiding the chips from participating in the cutting for the second time with the steel wire movement, resulting in obvious dense line marks on the surface of the workpiece, effectively suppressing the bending of the wafer, and ensuring that the subsequent process continues to process. The use of other nonionic surfactants cannot achieve the effective sedimentation of chips, and thus the quality of the products after cutting cannot be guaranteed. The present invention unexpectedly discovered that by controlling the mass ratio of isomeric decanol polyoxyethylene ether and polyethylene polyamine to (0.3-0.5): (2-3), and combining polyethylene glycol and other raw materials in the system, the provided cutting fluid has excellent lubricity, cooling property and chip sedimentation property, thereby improving the cutting accuracy, improving the surface brightness of the processed workpiece, and at the same time, the processed workpiece can be cleaned with only clean water, thereby saving the amount of cleaning agent used.

[0016] On the other hand, the present invention provides a method for preparing a diamond wire cutting fluid for super-hard and brittle non-metallic materials, which comprises at least the following steps: adding an organic acid into water, sequentially adding an organic amine, benzotriazole, a quaternary ammonium salt, and a non-ionic surfactant, and stirring until no precipitate is formed, then adding polyethylene glycol and continuing to stir until completely transparent, and then packaging the fluid.

[0017] In addition, the cutting fluid provided by the present invention does not contain additive ingredients harmful to the environment, such as sulfur and chlorine, thereby reducing harm to the environment and workers. The preparation method is simple, the conditions are mild, the processing cost is low, the production efficiency is high, and it is easy to realize large-scale industrial production and application.

[0018] Beneficial Effects

[0019] 1. The present invention provides a diamond wire cutting fluid for super-hard and brittle non-metallic materials. By optimizing the cutting fluid formula system, the provided cutting fluid is used for cutting super-hard and brittle materials such as silicon nitride, aluminum oxide and special glass. The surface quality of the product is high, the finish is high, and no wire marks are generated.

[0020] 2. The present invention introduces a nonionic surfactant and an organic amine into the optimized system, especially introduces isomeric decanol polyoxyethylene ether in combination with an organic amine system containing polyethylene polyamine, so that the chips after cutting are settled as much as possible, avoiding the chips from participating in cutting again with the movement of the steel wire, resulting in dense and obvious line marks on the surface of the workpiece, effectively inhibiting the bending of the wafer, and ensuring the continued processing of the subsequent process.

[0021] 3. The present invention controls the mass ratio of isomeric decanol polyoxyethylene ether and polyethylene polyamine to (0.3-0.5): (2-3), and coordinates the polyethylene glycol and other raw materials in the system, so that the provided cutting fluid has good lubricity, cooling property and chip sedimentation property, thereby improving the cutting accuracy, improving the surface brightness of the workpiece, and at the same time, the workpiece can be cleaned with only clean water, saving the use of cleaning agent.

[0022] 4. The cutting fluid provided by the present invention does not contain additives such as sulfur and chlorine that are harmful to the environment, thereby reducing harm to the environment and workers. The preparation method is simple, the conditions are mild, the processing cost is low, the production efficiency is high, and it is easy to realize large-scale industrial production and application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a comparison chart of the surface quality results of the workpieces cut with the cutting fluid provided by Example 1 and Comparative Example 1, with Example 1 on the left and Comparative Example 1 on the right.

[0024] Figure 2 The SEM characterization pictures of the surface of diamond wire after being cut by the cutting fluid provided by Example 1 and Comparative Example 1, the left side of the picture is Example 1, and the right side is Comparative Example 1. DETAILED DESCRIPTION

[0025] Example 1, Comparative Example 1

[0026] Example 1 and Comparative Example 1 of the present invention provide, on the one hand, a superhard and brittle non-metallic material diamond wire cutting fluid, and the formula is shown in Table 1 in terms of mass percentage.

[0027] Table 1

[0028]

[0029] On the other hand, Example 1 and Comparative Example 1 of the present invention provide a method for preparing a super-hard and brittle non-metallic material diamond wire cutting fluid, comprising the following steps: after adding sebacic acid to water, triethanolamine, diethanolamine, polyethylene polyamine, citric acid, benzotriazole, benzoic acid, quaternary ammonium salt, and non-ionic surfactant are added in sequence and stirred until there is no precipitate, then polyethylene glycol is added and stirring is continued until it is completely transparent and then packaged.

[0030] Performance Testing Methods

[0031] 1. The appearance, pH, density and surface tension of the cutting fluids provided in Example 1 and Comparative Example 1 of the present invention were tested. The test results are shown in Table 2.

[0032] Table 2

[0033]

[0034]

[0035] 2. The cutting fluids provided in Example 1 and Comparative Example 1 were used to cut silicon nitride wafers with a diameter of 150 mm and a thickness of 350 μm. The surface quality results of the cut parts were shown in Figure 1 , SEM characterization results of diamond wire surface after cutting can be found in Figure 2 . Figure 1 The results show that: the surface quality of the wafer cut by the cutting fluid provided in Example 1 is good without any line marks; the surface of the wafer cut by the cutting fluid provided in Comparative Example 1 has line marks, and the product quality is unqualified. Figure 2 The results show that: there is no chip on the surface of the diamond wire after cutting with the cutting fluid provided in Example 1; there is chip on the surface of the diamond wire after cutting with the cutting fluid provided in Comparative Example 1. The quality evaluation results of the processed parts are shown in Table 3.

[0036] Table 3

[0037]

Claims

1. A diamond wire cutting fluid for super-hard and brittle non-metallic materials, characterized in that: Calculated by mass percentage, the composition comprises at least 10-20% of organic amine, 2-5% of organic acid, 20-30% of polyethylene glycol, 0.1-0.5% of quaternary ammonium salt, 0.1-0.5% of benzotriazole, 0.1-0.5% of nonionic surfactant, and the balance is made up of water.

2. The superhard and brittle non-metallic material diamond wire cutting fluid according to claim 1, characterized in that: The super-hard and brittle non-metallic material diamond wire cutting fluid comprises, by mass percentage, at least 12.5-15.5% of organic amine, 3-4.5% of organic acid, 23-24% of polyethylene glycol, 0.2-0.3% of quaternary ammonium salt, 0.2-0.3% of benzotriazole, 0.3-0.5% of non-ionic surfactant, and the balance is made up of water.

3. The superhard and brittle non-metallic material diamond wire cutting fluid according to claim 2, characterized in that: The nonionic surfactant is selected from at least one of alkylphenol polyoxyethylene ether, castor oil polyoxyethylene ether, fatty alcohol polyoxyethylene ether, fatty acid polyoxyethylene ether and fatty amine polyoxyethylene ether.

4. The superhard and brittle non-metallic material diamond wire cutting fluid according to claim 3, characterized in that: The fatty alcohol polyoxyethylene ether is selected from oleyl alcohol polyoxyethylene ether, isomeric decanol polyoxyethylene ether, isomeric tridecanol polyoxyethylene ether, C 16-18 Fatty alcohol polyoxyethylene ether, C 12-14 At least one of fatty alcohol polyoxyethylene ethers.

5. The superhard and brittle non-metallic material diamond wire cutting fluid according to claim 4, characterized in that: The organic amine at least includes polyethylene polyamine.

6. The superhard and brittle non-metallic material diamond wire cutting fluid according to claim 5, characterized in that: The organic amine further comprises at least one of triethanolamine and diethanolamine.

7. The superhard and brittle non-metallic material diamond wire cutting fluid according to claim 6, characterized in that: The mass ratio of the polyethylene polyamine, triethanolamine and diethanolamine is (2-5): (8-10): (2-3).

8. The superhard and brittle non-metallic material diamond wire cutting fluid according to claim 7, characterized in that: The organic acid is selected from at least one of sebacic acid, citric acid and benzoic acid.

9. The superhard and brittle non-metallic material diamond wire cutting fluid according to claim 8, characterized in that: The polyethylene glycol is selected from at least one of polyethylene glycol 200, polyethylene glycol 400, polyethylene glycol 600, polyethylene glycol 800, polyethylene glycol 1000, polyethylene glycol 1200, polyethylene glycol 1500, polyethylene glycol 1800, and polyethylene glycol 2000.

10. A method for preparing a superhard and brittle non-metallic material diamond wire cutting fluid according to any one of claims 1 to 9, characterized in that: The method comprises at least the following steps: adding organic acid into water, sequentially adding organic amine, benzotriazole, quaternary ammonium salt and nonionic surfactant, stirring until no precipitate is formed, then adding polyethylene glycol, stirring continuously until completely transparent, and then packaging.

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