Stack type testing device

Abstract

The invention relates to a stack type testing device which comprises a machine table, a testing machine frame, a testing mechanism, a chip placing assembly, a transferring assembly, a flying shuttle moving assembly and a material moving arm assembly, the testing machine frame is arranged on the machine table, and multiple layers of testing grooves are formed in the testing machine frame; a testing mechanism is arranged in each testing groove, each testing mechanism comprises a testing carrier plate, a moving assembly and a testing unit, and the testing carrier plates are arranged in the testing grooves in a sliding mode through the moving assemblies; the test unit is arranged on the test carrier plate; the chip placing assembly is arranged on the machine table on one side of the test rack; the flying shuttle moving assembly is arranged on the machine table on one side of the chip placing assembly; the transferring assembly is arranged on the machine table and used for transferring the chip between the chip placing assembly and the flying shuttle moving assembly; the material moving arm assembly is arranged on the machine table and used for transferring the chip between the flying shuttle moving assembly and the testing unit. The method has the effect of improving the test efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of chip testing, and in particular to a stacked testing device. Background Art

[0002] Generally speaking, memory must pass various electrical tests before leaving the factory. The current way of conducting the test operation is to place multiple packaged memory chips on a tray, collect multiple trays and send them to a test machine. The test machine has multiple test operation areas distributed in a planar array. Each test operation area is equipped with a related circuit board and multiple test units. Each test unit is for a single memory chip to be placed and can perform various tests on the memory chip through the circuit board. The test machine is equipped with a pick-and-place mechanism that is responsible for removing multiple chips from the tray at one time and sending them to the multiple test units in the corresponding test operation area. The time difference required for the test is used to transfer the memory chips to meet the test of a large number of memory chips at the same time. However, if the number of test chips is to be increased, more test work areas must be distributed on the test machine, which will cause the machine to be too large and increase the floor space of the machine. However, the area of ​​the factory is limited. If the machine occupies a larger area, it will affect the installation of other equipment. Therefore, when the number of large test chips is large, the overall test time will be longer and the efficiency will be lower. Summary of the invention

[0003] In order to improve testing efficiency, the present application provides a stacked testing device.

[0004] The present application provides a stacked test device, which adopts the following technical solution: A stacking test device comprises a machine platform, a test rack, a test mechanism, a chip placement assembly, a transfer assembly, a shuttle assembly and a material transfer arm assembly, wherein the test rack is arranged on the machine platform, and the test rack is provided with multiple layers of test slots; each of the test slots is provided with the test mechanism, and the test mechanism comprises a test carrier, a moving component and a test unit, and the test carrier is slidably arranged in the test slot by the moving component; the test unit is arranged on the test carrier; the chip placement assembly is arranged on the machine platform on one side of the test rack; the shuttle assembly is arranged on the machine platform on one side of the chip placement assembly; the transfer assembly is arranged on the machine platform, and the transfer assembly is used to realize the transfer of chips between the chip placement assembly and the shuttle assembly; the material transfer arm assembly is arranged on the machine platform, and the material transfer arm assembly is used to realize the transfer of chips between the shuttle assembly and the test unit.

[0005] By adopting the above technical solution, when the test unit has finished testing the chip or is about to place the chip to be tested on the test unit, the moving component is started, the moving component drives the test carrier to move, and the test carrier drives the test unit to move, so that the test unit extends out of the test slot; when the chip to be tested is placed on the test unit, the moving component is started again to move the test carrier and the test unit back into the test slot, and finally the test unit tests the chip again; the test unit that can be extended and recovered into the test slot is convenient for the transfer arm assembly to transfer the chip; because when the chip is placed on the test unit or the chip is separated from the test unit, the test unit is located outside the test slot, so the height of the test slot does not need to be particularly high, so that the number of test slots can be increased within a limited space; the transfer assembly places the chip inside the test slot The chip to be tested is transferred to the shuttle moving assembly, and then the material transfer arm assembly transfers the chip to be tested on the shuttle moving assembly to the test unit for testing; after the chip is tested, the material transfer arm assembly transfers the tested chip from the test unit to the shuttle moving assembly, and then the transfer assembly transfers the tested chip on the shuttle moving assembly and then transfers it to the chip placement assembly; therefore, the test rack is provided with multiple layers of test slots, which cooperate with the transfer assembly, the shuttle moving assembly and the material transfer arm assembly to timely transfer the chip located at the chip placement assembly to the test slot of the corresponding height and position for testing, and the chip to be tested and the tested chip can be moved synchronously during the transfer process, thereby avoiding the idle running phenomenon of some mechanism assemblies, greatly improving the transfer efficiency, and thus the number of test chips can be greatly increased in a limited machine space, thereby improving the test efficiency.

[0006] Optionally, the chip placement assembly includes a placement frame, a tray and an adjustment mechanism, wherein a plurality of placement frames are provided and the plurality of placement frames are all provided on the machine platform, a placement slot is formed in the placement frame; the tray is located in the placement slot of the placement frame, and a receiving slot for placing the chip is provided on the tray; the adjustment mechanism is used to adjust the position of the tray in the placement frame or to transfer the tray in the placement frame to other placement frames.

[0007] By adopting the above technical solution, since the receiving slot will be idle when the transfer assembly transfers the chip out, the adjustment mechanism can be used to transfer the tray without chips to the receiving slot of other placement frames for collecting the tested chips.

[0008] Optionally, a plurality of trays are provided, and the plurality of trays are stacked in the placement slot; the adjustment mechanism includes a lifting platform, a first support block, an adjustment plate, an adjustment suction cup and a first lifting assembly, the lifting platform is provided on the placement frame and is located in the placement slot, and one of the trays contacts the lifting platform; the first support block is connected to the transfer assembly; the adjustment plate is provided on the first support block via the first lifting assembly; and the adjustment suction cup is provided on the adjustment plate.

[0009] By adopting the above technical solution, the first lifting component is started, the first lifting component drives the adjustment plate to move, and the adjustment plate drives the adjustment suction cup to move, so that the adjustment suction cup adsorbs the pallet located on the placement frame and away from the lifting platform; then the first lifting component is started again, and the first lifting component drives the movement to the top of the placement frame; then the transfer assembly is started, so that the pallet adsorbed by the adjustment suction cup moves to the top of another placement frame where the pallet is placed, and then the first lifting component is started again, so that the adjustment suction cup transfers the pallet from one placement frame to another placement frame.

[0010] Optionally, multiple groups of supporting components are provided on the side walls of the placement slot, and the supporting components include two supporting blocks, both of which are arranged on the placement frame, and the two supporting blocks are located in the same horizontal plane; the two supporting blocks in the same group of supporting components abut against the same pallet; the placement frame is provided with an inlet and outlet hole connected to the placement slot; the adjustment mechanism includes a blocking plate, a first column, a second lifting component, a first adjustment block, a second adjustment block, a two-way cylinder, a clamping block, an adjustment component and a transverse movement component, the blocking plate is rotatably arranged on the placement frame through the adjustment component, and the blocking plate can block the inlet and outlet hole; the first column is arranged on the machine platform, and the first adjustment block is slidably arranged on the first column through the second lifting component; the second adjustment block is arranged on the first adjustment block through the transverse movement component; the two-way cylinder is arranged on the second adjustment block, and the two piston rods of the two-way cylinder are provided with the clamping blocks, and the two clamping blocks can both be pressed against the pallet.

[0011] By adopting the above technical solution, when there is no chip in the tray away from the side of the machine, the adjustment component is started first, and the adjustment component drives the blocking plate to rotate so that the blocking plate no longer blocks the inlet and outlet holes; then the second lifting component is started, and the second lifting component drives the first adjustment block to move, so that the second adjustment block moves to the vicinity of the tray without chips; then the transverse movement component is started, and the transverse movement component drives the second adjustment block to move in the direction close to the supporting block, so that the tray without chips is located between the two clamping blocks of the two-way cylinder; then the two-way cylinder is started to make the two clamping blocks move towards each other, so that the two clamping blocks are clamped tightly against the tray; then the transverse movement component is started to make the second adjustment block move in the direction close to the first column, and the tray clamped tightly by the two clamping blocks will move out of the placement slot; then the second lifting component is started again to make the tray that has moved out of the placement slot move to the vicinity of the supporting block that does not support the tray; then the transverse movement component is started to place the tray without chips back into the placement slot.

[0012] Optionally, the transfer assembly includes a supporting frame, a moving frame, a moving block, a material picking block, a material picking suction nozzle, a transverse moving mechanism, a material picking reciprocating mechanism, a spacing adjustment mechanism and a lifting mechanism, the supporting frame is arranged on the machine platform; the moving frame is slidably arranged on the supporting frame through the transverse moving mechanism; the moving block is slidably arranged on the moving frame through the material picking reciprocating mechanism; there are multiple material picking blocks, and the multiple material picking blocks are slidably arranged on the moving block through the spacing adjustment mechanism; the material picking suction nozzle is slidably arranged on the material picking block through the lifting mechanism.

[0013] By adopting the above technical solution, when it is necessary to transfer the chip to be tested, first start the material picking reciprocating mechanism to make the moving block slide on the moving frame, and the position of the material picking block on the moving block will change, so that the material picking nozzle is aligned with the chip to be tested; then start the lifting mechanism, the lifting mechanism drives the material picking nozzle to move, and makes the material picking nozzle adsorb the chip; then start the lifting mechanism again, so that the material picking nozzle drives the chip to move in the direction away from the tray, so that the chip leaves the receiving slot; then start the horizontal moving mechanism, so that the moving frame is close to the top of the shuttle moving assembly; finally, start the lifting mechanism, so that the material picking nozzle drives the chip to move in the direction close to the shuttle moving assembly, and places the chip on the shuttle moving assembly; the set spacing adjustment mechanism can adjust the position of the material picking nozzle, so that the material picking nozzle can better adsorb the chip and better place the chip in the receiving slot of the shuttle moving assembly or the tray.

[0014] Optionally, the shuttle moving assembly includes a shuttle carrier, a carrying jig, a placement seat and a reciprocating mechanism, and the shuttle carrier is slidably set on the machine platform through the reciprocating mechanism; there are multiple carrying jigs, and the multiple carrying jigs are all set on the shuttle carrier; each of the carrying jigs is provided with two placement seats.

[0015] By adopting the above technical scheme, when the chip adsorbed by the transfer assembly or the chip adsorbed by the material transfer arm assembly is located above the fixed plate, the reciprocating mechanism is started to move, and the reciprocating mechanism drives the shuttle carrier to move, so that the carrier jig is located directly below the chip and the chip is aligned with the placement seat; then the chip is placed on the placement seat, one of the two placement seats is used to place the chip to be tested, and the other placement seat is used to place the tested chip; in this way, the transfer assembly can adsorb the tested chip on the other placement seat after placing the chip on one placement seat, and the material transfer arm assembly can adsorb the chip to be tested on the other placement seat after placing the tested chip on the placement seat.

[0016] Optionally, the material transfer arm assembly includes a second column, a second support block, a third support block, a horizontal moving mechanism, a vertical moving mechanism, a material transfer mechanism and a material transfer suction nozzle, the second column is slidably set on the machine platform through the horizontal moving mechanism; the second support block is slidably set on the second column through the vertical moving mechanism; the third support block is slidably set on the second support block through the material transfer mechanism; the material transfer suction nozzle is set on both sides of the third support block.

[0017] By adopting the above technical solution, the horizontal moving mechanism and the vertical moving mechanism are started to move the flying material transfer nozzle toward the direction close to the flying shuttle moving assembly, and the material transfer nozzle on the side of the third support block is aligned with the chip on the flying shuttle moving assembly; then the vertical moving mechanism is started to move the second support block toward the direction close to the chip, so that the material transfer nozzle on the side of the third support block adsorbs the chip; after the material transfer nozzle adsorbs the chip, the horizontal moving mechanism and the vertical moving mechanism are started to move the chip adsorbed by the material transfer nozzle to the side of the corresponding test carrier, and the chip on the material transfer nozzle is placed on the test unit.

[0018] Optionally, a scanning mechanism is provided on the second support block, and the scanning mechanism includes a fourth support block, a connecting block, a scanning component and an adjustment component, the fourth support block is provided on the second support block; the connecting block is slidably provided on the fourth support block through the adjustment component; the scanning component is provided on the connecting block.

[0019] By adopting the above technical solution, when the chip to be tested is placed on the test unit, if the test unit sends a signal of clamping failure, the adjustment component drives the connecting block to move, and the connecting block drives the scanning part to move. The scanning part scans the chip on the test unit to confirm the position of the chip that is poorly clamped, and finally the material transfer nozzle performs the action of re-placing.

[0020] Optionally, the test rack is provided with a pull-out hole connected to the test slot, and the test rack is provided with a replacement component, the replacement component includes an additional circuit board and a fixing part, the additional circuit board enters the test slot through the pull-out hole, and the additional circuit board is connected to the test rack through the fixing part; the test carrier is slidably set on the additional circuit board through the moving component.

[0021] By adopting the above technical solution, firstly, a suitable test unit and an additional circuit board are selected according to the type of chip to be tested, and then the additional circuit board is inserted into the test slot through the pull-out hole; then the fixing piece fixes the additional circuit board on the test rack; therefore, the replacement component provided can match the chip to be tested with a suitable test unit, which can improve the applicability; and it is also convenient to replace or repair the test unit when it is damaged, thereby improving the efficiency.

[0022] In summary, the present application includes at least one of the following beneficial technical effects: 1. The test rack is equipped with multiple test slots, which cooperate with the transfer assembly, shuttle assembly and material transfer arm assembly to timely transfer the chips located in the chip placement assembly to the test slots of corresponding height and position for testing. During the transfer process, the chips to be tested and the tested chips can be moved synchronously to avoid the idle running phenomenon of some mechanism assemblies, greatly improving the transfer efficiency. In this way, the number of test chips can be greatly increased in a limited machine space, thereby improving the test efficiency; 2. The replacement components provided can match the chip to be tested with the appropriate test unit, which can improve applicability; and it is also convenient to replace or repair the test unit when it is damaged, thereby improving efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the structure of the stacked test device in Example 1 of the present application; Figure 2 This is a schematic diagram of the structure of the test mechanism in Example 1 of the present application; Figure 3 This is a schematic diagram of the structure of the first slide rail in Example 1 of the present application; Figure 4 This is a schematic diagram of the structure of the chip placement assembly in Example 1 of the present application; Figure 5 This is a schematic diagram of the structure of the transfer assembly in Example 1 of the present application; Figure 6 This is a schematic diagram of the structure of the lifting mechanism in Example 1 of the present application; Figure 7 This is a schematic diagram of the structure of the shuttle moving assembly in Example 1 of the present application; Figure 8This is a schematic structural diagram of the material transfer arm assembly in Example 1 of the present application; Fig. 9 This is a schematic diagram of the structure of the third support in Example 1 of the present application; Fig.10 This is a schematic diagram of the structure of the adjustment mechanism in Example 2 of the present application; Fig.11 This is a schematic diagram of the structure of the clamping block in Example 2 of the present application; Fig.12 This is a schematic diagram of the structure of the limiting mechanism in Example 3 of the present application; Fig.13 This is a schematic diagram of the structure of the ratchet in Example 3 of the present application; Fig.14 This is a schematic diagram of the structure of the rotating block in Example 3 of the present application.

[0024] Figure numerals: 11, machine; 12, test rack; 2, test mechanism; 21, test carrier; 22, moving component; 23, test unit; 24, replacement component; 241, additional circuit board; 242, handle; 25, first slide rail; 26, first slider; 3, chip placement assembly; 31, placement frame; 311, placement slot; 32, tray; 33, adjustment mechanism; 331, lifting platform; 332, first support block; 333, adjustment plate; 334, first lifting assembly; 335, blocking plate; 336, First column; 337, second lifting assembly; 338, first adjustment block; 339, second adjustment block; 3310, two-way cylinder; 3311, clamping block; 3312, adjustment assembly; 3313, lateral movement assembly; 34, supporting block; 4, transfer assembly; 41, support frame; 42, moving frame; 43, moving block; 44, material taking block; 45, material taking nozzle; 46, lateral movement mechanism; 47, material taking reciprocating mechanism; 48, lifting mechanism; 481, lifting motor; 482, driving wheel; 483, belt; 484 , lifting block; 5, shuttle moving assembly; 51, shuttle carrier; 52, carrying jig; 53, placement seat; 54, reciprocating moving mechanism; 541, screw rod; 542, driving motor; 543, transmission wheel; 544, conveyor belt; 55, fixed plate; 56, second guide rail; 6, material transfer arm assembly; 61, second column; 62, second support block; 63, third support block; 64, horizontal moving mechanism; 65, vertical moving mechanism; 66, material transfer moving mechanism; 67, material transfer nozzle; 7, scanning mechanism; 71, fourth support Block; 72, connecting block; 73, scanning piece; 74, adjusting assembly; 8, limiting mechanism; 81, limiting block; 82, first adjusting block; 83, second adjusting block; 84, first spring; 85, first rotating shaft; 86, first gear; 87, first rack; 88, second gear; 89, second rack; 810, ratchet; 811, second rotating shaft; 812, pawl; 813, rotating block; 814, third gear; 815, third adjusting block; 816, third rack; 817, second spring; 818, limiting rod. DETAILED DESCRIPTION

[0025] The following is combined with Figure 1-14 This application is described in further detail.

[0026] Example 1 The embodiment of the present application discloses a stacked testing device.

[0027] refer to Figure 1A stacking test device includes a platform 11, a test rack 12 is arranged on one side of the platform 11, the test rack 12 is a straight stacking structure and is provided with multiple layers of test slots, each layer of test slots has multiple test slots; a test mechanism 2 is arranged in each test slot; a chip placement assembly 3 is arranged on the platform 11 on one side of the test rack 12, and a shuttle moving assembly 5 is arranged on the platform 11 on one side of the chip placement assembly 3; a transfer assembly 4 and a material transfer arm assembly 6 are arranged on the platform 11.

[0028] Place the chip in the chip placement assembly 3, the transfer assembly 4 transfers the chip to be tested in the chip placement assembly 3 to the shuttle moving assembly 5, and then the material transfer arm assembly 6 transfers the chip to be tested on the shuttle moving assembly 5 to the testing mechanism 2 for testing; after the chip is tested, the material transfer arm assembly 6 transfers the tested chip from the testing mechanism 2 to the shuttle moving assembly 5, and then the transfer assembly 4 transfers the tested chip on the shuttle moving assembly 5 to the chip placement assembly 3.

[0029] refer to Figure 1 and Figure 2 A pull-out hole connected to the test slot is provided on the test rack 12, and the test mechanism 2 includes a replacement component 24, and the replacement component 24 has an additional circuit board 241, and the additional circuit board 241 can enter the test slot through the pull-out hole; a fixing part is provided on the additional circuit board 241, and the fixing part is a fixing bolt, which passes through the additional circuit board 241 and is threadedly connected to the test rack 12; a handle 242 is fixedly connected to the additional circuit board 241.

[0030] refer to Figure 2 and Figure 3 The additional circuit board 241 is slidably connected to a test carrier 21, on which a plurality of parallel test units 23 are fixed. In this embodiment, there are eight test units 23. Each test unit 23 is a standard test fixture, equipped with a probe, a test interface board and related fixing mechanisms to fix, release and perform test operations on the chip placed thereon in a timely manner. The test carrier 21 is provided with relevant circuits and electrical connectors to transmit the test signals of the test unit 23 to the terminal host.

[0031] A moving component 22 is provided on the additional circuit board 241. The moving component 22 is a first cylinder. The cylinder body of the first cylinder is fixed on the additional circuit board 241, and the piston rod of the first cylinder is connected to the test carrier 21; a first slider 26 is fixedly connected to the test carrier 21, and a first slide rail 25 that is slidably arranged with the first slider 26 is fixedly connected to the additional circuit board 241.

[0032] First, select a suitable test unit 23 and additional circuit board 241 according to the chip type to be tested, then insert the additional circuit board 241 into the test slot through the pull-out hole; then pass the fixing bolts through the additional circuit board 241 and threadedly connect it to the test rack 12.

[0033] When the test unit 23 has finished testing the chip or is about to place the chip to be tested on the test unit 23, the first cylinder is started, and the piston rod of the first cylinder drives the test carrier 21 to move, and the test carrier 21 drives the test unit 23 to move, so that the test unit 23 extends out of the test slot; when the chip to be tested is placed on the test unit 23, the first cylinder is started again to move the test carrier 21 and the test unit 23 back into the test slot, and finally the test unit 23 tests the chip again.

[0034] refer to Figure 4 and Figure 5 The chip placement assembly 3 includes a placement frame 31 fixedly connected to the machine platform 11, the placement frame 31 is located on one side of the test rack 12, and a placement slot 311 is opened on the placement frame 31; a side of the placement slot 311 away from the test rack 12 is opened with a pick-up and release opening, and a blocking door for blocking the pick-up and release opening is hinged on the placement frame 31.

[0035] A plurality of trays 32 are placed in the placement frame 31 , and the trays 32 are provided with receiving slots for receiving chips.

[0036] The placement frame 31 is provided with an adjustment mechanism 33, which includes a lifting platform 331 provided on the placement frame 31. The tray 32 close to the machine table 11 among the plurality of trays 32 abuts against the lifting platform 331, and the plurality of trays 32 are stacked and placed in the placement slot 311. The plurality of placement frames 31 can be divided into trays 32 for accommodating chips to be tested, trays 32 for tested good chips, or trays 32 for defective chips as required; and no tray 32 is placed in the placement slot 311 of at least one of the placement frames 31.

[0037] refer to Figure 4 and Figure 5 The transfer assembly 4 includes a support frame 41 fixedly connected to the machine platform 11, the support frame 41 is located between the placement frame 31 and the test frame 12, and a lateral moving mechanism 46 is arranged on the support frame 41. The lateral moving mechanism 46 is a first linear motor module in this embodiment, and a moving frame 42 is fixed on the slide of the first linear motor module.

[0038] A first support block 332 is fixedly connected to the movable frame 42, and a first lifting assembly 334 is arranged on the first support block 332. The first lifting assembly 334 is a second cylinder in this embodiment, and the cylinder body of the second cylinder is connected to the first support block 332. An adjustment plate 333 is connected to the piston rod of the second cylinder, and an adjustment suction cup is fixed on the adjustment plate 333.

[0039] Start the second cylinder, the piston rod of the second cylinder drives the adjustment plate 333 to move, and the adjustment plate 333 drives the adjustment suction cup to move, so that the adjustment suction cup adsorbs the pallet 32 ​​located on the placement frame 31 and away from the lifting platform 331; then start the second cylinder again, the piston rod of the second cylinder drives the adjustment plate 333 to move, and the adjustment suction cup on the adjustment plate 333 drives the pallet 32 ​​to move, so that the pallet 32 ​​moves to the top of the placement frame 31; then start the first linear motor module to move the moving frame 42, and the moving frame 42 drives the first support block 332 to move, so that the pallet 32 ​​adsorbed by the adjustment suction cup moves to the top of another placement frame 31 where the pallet 32 ​​is placed, and then start the second cylinder again, so that the adjustment suction cup transfers the pallet 32 ​​from one placement frame 31 to another placement frame 31.

[0040] refer to Figure 5 and Figure 6 A material picking reciprocating mechanism 47 is provided on the movable frame 42. In this embodiment, the material picking reciprocating mechanism 47 is a second linear motor module. A movable block 43 is connected to the slide table of the second linear motor module. The movable block 43 is slidably arranged on the movable frame 42; a material picking block 44 is slidably connected to the movable block 43, and the number of the material picking blocks 44 is plural; in this embodiment, the number of the material picking blocks 44 is 8, and they are divided into two rows, front and back, with 4 material picking blocks 44 in each row.

[0041] The moving block 43 is provided with a spacing adjustment mechanism, which is a third cylinder in this embodiment. The cylinder body of the third cylinder is fixed on the moving block 43 , and the piston rod of the third cylinder is connected to the material taking block 44 .

[0042] The material taking block 44 is provided with a lifting mechanism 48, which includes a lifting motor 481 fixedly connected to the material taking block 44, two driving wheels 482 are rotatably connected to the material taking block 44, and the output shaft of the lifting motor 481 is connected to one of the driving wheels 482; a belt 483 is sleeved on the two driving wheels 482; a lifting block 484 is slidably provided on the material taking block 44, and the lifting block 484 is connected to the belt 483. The lifting block 484 is connected to the material taking suction nozzle 45 at one end close to the machine platform 11.

[0043] When the chip to be tested is to be transferred, the second linear motor module is first started to make the moving block 43 slide on the moving frame 42, and the position of the material picking block 44 on the moving block 43 will change, so that the material picking nozzle 45 is aligned with the chip to be tested; then the lifting motor 481 is started, and the output shaft of the lifting motor 481 drives the driving wheel 482 to rotate, and the driving wheel 482 drives the belt 483 to rotate, and the belt 483 drives the lifting block 484 to move in the direction close to the tray 32, and the material picking nozzle 45 on the lifting block 484 will absorb the chip; then the lifting motor 481 is started again, so that the material picking nozzle 45 on the lifting block 484 drives the chip to move in the direction away from the tray 32, so that the chip leaves the receiving slot. Then the first linear motor module is started again, so that the moving frame 42 moves toward the top of the shuttle moving assembly 5; finally, the lifting motor 481 is started, so that the material picking nozzle 45 on the lifting block 484 drives the chip to move in the direction close to the shuttle moving assembly 5, and the chip is placed on the shuttle moving assembly 5.

[0044] refer to Figure 4 and Figure 7 The shuttle moving assembly 5 includes a fixed plate 55 fixedly connected to the machine table 11, and a second guide rail 56 is fixed on the fixed plate 55, and the second guide rail 56 is perpendicular to the support frame 41; a shuttle carrier 51 slides on the fixed plate 55, and a second slider that slides with the second guide rail 56 is fixed on the shuttle carrier 51; a plurality of supporting jigs 52 are arranged on the shuttle carrier 51, and the number of supporting jigs 52 in this embodiment is 8; each supporting jig 52 is fixed with two placement seats 53, and the two placement seats 53 are respectively located at the first placement seat 53 for placing the chip to be tested and the second placement seat 53 for placing the tested chip. A rotating motor is connected to the shuttle carrier 51, and the output shaft of the rotating motor is connected to the supporting jig 52.

[0045] A reciprocating mechanism 54 is provided on the fixed plate 55, and the reciprocating mechanism 54 includes a screw rod 541, which passes through the shuttle carrier plate 51 and is threadedly connected to the shuttle carrier plate 51; an active motor 542 is fixed to one end of the fixed plate 55, and a transmission wheel 543 is fixed to the output shaft of the active motor 542 and the screw rod 541, and a conveyor belt 544 is sleeved on the two transmission wheels 543.

[0046] When the chip sucked by the material picking nozzle 45 is located above the fixed plate 55, the active motor 542 is started, and the output shaft of the active motor 542 drives the transmission wheel 543 to rotate, the transmission wheel 543 drives the conveyor belt 544 to rotate, the conveyor belt 544 drives the transmission wheel 543 on the screw rod 541 to rotate, the transmission wheel 543 drives the screw rod 541 to rotate, and the screw rod 541 drives the shuttle carrier plate 51 to move, so that the carrier jig 52 is located directly below the chip and the chip is aligned with the first placement seat 53; then the lifting motor 481 is started, so that the material picking nozzle 45 on the lifting block 484 drives the chip to move in the direction close to the first placement seat 53, and the chip is placed on the first placement seat 53.

[0047] The rotating motor is started, and the output shaft of the rotating motor drives the carrier jig 52 to rotate, and the carrier jig 52 drives the placement seat 53 to rotate, so that the chip can be better positioned on the placement seat 53, so that the chip can be better transferred by the subsequent material transfer arm assembly 6.

[0048] refer to Figure 1 and Figure 8 The material transfer arm assembly 6 includes a horizontal moving mechanism 64, which is a third linear motor module in this embodiment. The movement direction of the third linear motor module is the same as that of the first linear motor module, and the third linear motor module is located between the support frame 41 and the test frame 12; a second column 61 is connected to the slide of the third linear motor module, and a vertical moving mechanism 65 is connected to the second column 61. The vertical moving mechanism 65 is a fourth linear motor module in this embodiment, and a second support block 62 is connected to the slide of the fourth linear motor module.

[0049] refer to Figure 8 and Fig. 9 , a material moving mechanism 66 is provided on the second support block 62. The material moving mechanism 66 in this embodiment is the fifth linear motor module. The slide of the fifth linear motor module is connected to the third support block 63. The third support block 63 is always located above the shuttle carrier 51; both sides of the third support block 63 are connected to a plurality of material moving nozzles 67. In this embodiment, both sides of the third support block 63 are connected to 8 material moving nozzles 67, wherein the material moving nozzle 67 on one side of the third support block 63 absorbs the chip to be tested on the first placement seat 53, and the material moving nozzle 67 on the other side of the third support block 63 absorbs the tested chip and places the tested chip on the second placement seat 53.

[0050] When the chip to be tested is located on the first placement seat 53, the active motor 542 is started to move the shuttle carrier 51 toward the direction close to the third support block 63 and is located directly below the third support block 63, and the material transfer nozzle 67 on the side of the third support block 63 is aligned with the chip on the first placement seat 53; then the fourth linear motor module is started, and the second support block 62 moves toward the direction close to the first placement seat 53, so that the material transfer nozzle 67 on the side of the third support block 63 absorbs the chip located on the first placement seat 53. After the material transfer nozzle 67 absorbs the chip, the third linear motor module and the fourth linear motor module are started to move the chip to be tested that is absorbed by the material transfer nozzle 67 to the side of the corresponding test carrier 21, and the chip on the material transfer nozzle 67 is placed on the test unit 23.

[0051] refer to Figure 8 A scanning mechanism 7 is arranged on the second support block 62, and the scanning mechanism 7 includes a fourth support block 71 fixedly connected to the second support block 62, and an adjusting component 74 is arranged on the fourth support block 71. The adjusting component 74 is the sixth linear motor module in this embodiment, and a connecting block 72 is connected to the slide of the sixth linear motor module, and a scanning component 73 is connected to the connecting block 72, and the scanning component 73 is a laser scanner.

[0052] When the chip to be tested is placed on the test unit 23, if the test unit 23 sends a signal of clamping failure, the slide of the sixth linear motor module drives the connecting block 72 to move, and the connecting block 72 drives the laser scanner to move. The laser scanner scans the chip on the test unit 23 to confirm the position of the chip that is poorly clamped, and finally the material transfer nozzle 67 performs the action of re-placing.

[0053] The implementation principle of the embodiment 1 of the present application is as follows: because the device is always working within a certain period of time, when the pick-up nozzle 45 moves the chip toward the first placement seat 53 and places the chip on the first placement seat 53, a tested chip has already been placed on the second placement seat 53. Then, the pick-up nozzle 45 sucks the tested chip and transfers the tested chip to the tray 32 for collecting the tested good chips or the tray 32 for collecting the defective chips.

[0054] When the material transfer nozzle 67 on one side of the third support block 63 moves the chip to be tested to the vicinity of the corresponding test carrier 21, the first cylinder is started, and the piston rod of the first cylinder drives the test carrier 21 to move, and the test carrier 21 drives the test unit 23 to move, so that the test unit 23 and the chip that has been tested move out of the test slot. Then the material transfer nozzle 67 on the other side of the third support block 63 adsorbs the tested chip, and then the chip to be tested adsorbed by the material transfer nozzle 67 on one side of the third support block 63 is transferred to the test unit 23. Then the first cylinder is started again, so that the chip to be tested and the test unit 23 move back into the test slot, and finally the test unit 23 tests the chip again.

[0055] Before the material transfer nozzle 67 on one side of the third support block 63 adsorbs the chip to be tested, the material transfer nozzle 67 on the other side of the third support block 63 that adsorbs the tested chip will first place the completed chip on the second placement seat 53; and then the material transfer nozzle 67 on one side of the third support block 63 is used to adsorb the chip to be tested.

[0056] Therefore, under the action of the transfer assembly 4, the shuttle assembly 5 and the material transfer arm assembly 6, the chip to be tested and the tested chip can be moved synchronously, avoiding the idle running phenomenon of some mechanism assemblies, and greatly improving the transfer efficiency.

[0057] Example 2 refer to Fig.10 , which is different from Example 1, is that a plurality of groups of supporting components are arranged on the placement frame 31, and each group of supporting components includes two supporting blocks 34, and the two supporting blocks 34 are connected to the placement frame 31 and are both located in the placement groove 311, and the two supporting blocks 34 are located in the same horizontal plane; the two supporting blocks 34 correspond to one tray 32 and contact the tray 32 to support the tray 32, and one of the supporting components does not support the tray 32, and the other supporting components all support the tray 32.

[0058] refer to Fig.10 and Fig.11An entry and exit hole is provided on one side of the placement frame 31 away from the pick-up and release port. The adjustment mechanism 33 includes an adjustment component 3312. The adjustment component 3312 includes an adjustment motor connected to the placement frame 31. An adjustment shaft is connected to the output shaft of the adjustment motor. A blocking plate 335 is fixed on the adjustment shaft. The blocking plate 335 can block the entry and exit hole. A seventh linear motor module is provided on the machine platform 11, and the seventh linear motor module is located between the placement frame 31 and the test frame 12; a first column 336 is connected to the slide of the seventh linear motor module, and a second lifting assembly 337 is provided on the first column 336, and the second lifting assembly 337 is the eighth linear motor module in this embodiment; a first adjustment block 338 is connected to the slide of the eighth linear motor module, and a transverse movement assembly 3313 is provided on the first adjustment block 338, and the transverse movement assembly 3313 is the fourth cylinder in this embodiment, and a second adjustment block 339 is connected to the piston rod of the fourth cylinder; two bidirectional cylinders 3310 are provided on the second adjustment block 339, and a clamping block 3311 is connected to the two piston rods of the bidirectional cylinder 3310, and the two clamping blocks 3311 of the bidirectional cylinder 3310 can both press against the tray 32.

[0059] The implementation principle of Example 2 of the present application is: when there is no chip in the tray 32 on the side away from the machine 11, the adjustment motor is started first, the output shaft of the adjustment motor drives the adjustment shaft to rotate, and the adjustment shaft drives the blocking plate 335 to rotate, so that the blocking plate 335 no longer blocks the inlet and outlet holes. Then start the seventh linear motor module, and the slide of the seventh linear motor module drives the first column 336 to move, so that the second adjustment block 339 moves to the corresponding unblocked inlet and outlet hole; then start the eighth linear motor module, and the slide of the eighth linear motor module drives the first adjustment block 338 to move, and the fourth cylinder on the first adjustment block 338 drives the second adjustment block 339 to move the second adjustment block 339 to the vicinity of the tray 32 without the chip; then start the fourth cylinder, and the piston rod of the fourth cylinder drives the second adjustment block 339 to move toward the supporting block 34, so that the tray 32 without the chip is located between the two clamping blocks 3311 of the same two-way cylinder 3310; then start the two-way cylinder 3310 to make the two clamping blocks 3311 move towards each other, so that the two clamping blocks 3311 are clamped tightly against the tray 32.

[0060] Then start the fourth cylinder to move the second adjustment block 339 toward the first column 336, and the tray 32 clamped by the two clamping blocks 3311 will move out of the placement slot 311; then start the eighth linear motor module to move the tray 32 that has moved out of the placement slot 311 to the vicinity of the supporting block 34 that did not initially support the tray 32; then start the fourth cylinder to place the tray 32 without the chip back into the placement slot 311.

[0061] If the tray 32 of the chip to be tested is placed in the placement slot 311 of the placement frame 31, the two supporting blocks 34 away from the machine table 11 can be adjusted by the adjustment mechanism 33 to always contact the tray 32 of the chip to be tested. When there is no chip on the tray 32 of the chip to be tested, the tray 32 without the chip is transferred to the supporting block 34 without the supporting tray 32 in the placement slot 311 through the adjustment mechanism 33; at the same time, a tray 32 with a chip to be tested in the placement slot 311 is transferred to the placement frame 31 to a position convenient for the material taking suction nozzle 45 to transfer the chip under the adjustment of the adjustment mechanism 33.

[0062] Example 3 refer to Fig.12 , which is different from the embodiment 4, is that a limiting mechanism 8 is provided on the tray 32, and each limiting mechanism 8 corresponds to a containing slot.

[0063] refer to Fig.12 and Fig.13 The tray 32 is provided with a first groove connected to the receiving groove, and the limiting mechanism 8 includes a limiting block 81 slidably connected to the first groove; the limiting block 81 located in the first groove is fixedly connected to the second rack 89. A second groove is provided on the tray 32 on one side of the receiving groove, and a second adjustment block 83 is slidably connected to the second groove, and a first spring 84 connected to the tray 32 is connected to the second adjustment block 83; the first rack 87 is fixedly connected to the second adjustment block 83 located in the second groove. A cavity is provided on the tray 32, and the cavity connects the first groove and the second groove, and a first rotating shaft 85 is rotatably connected in the cavity, and one end of the first rotating shaft 85 is keyed to a first gear 86 meshing with the first rack 87, and one end of the first rotating shaft 85 away from the first gear 86 is keyed to a second gear 88 meshing with the second rack 89; a ratchet 810 is keyed to the first rotating shaft 85 between the first gear 86 and the second gear 88.

[0064] refer to Fig.12 , Fig.13 and Fig.14 A second rotating shaft 811 is fixedly connected in the cavity, and a ratchet 812 cooperating with the ratchet 810 is rotatably connected to the second rotating shaft 811. A rotating block 813 is rotatably connected to the second rotating shaft 811, and a third gear 814 is key-connected to the rotating block 813; a third groove communicating with the cavity is provided on the tray 32, and a third adjusting block 815 is slidably connected in the third groove, and a second spring 817 connected to the tray 32 is connected to the third adjusting block 815, and a third rack 816 meshing with the third gear 814 is fixedly connected to the side wall of the third adjusting block 815 close to the rotating block 813. Two limiting rods 818 are fixedly connected to the rotating block 813, and the ratchet 812 is located between the two limiting rods 818.

[0065] A fifth cylinder is provided on the material taking block 44 in the transfer assembly 4 , and a first adjusting block 82 is connected to the piston rod of the fifth cylinder. When the material taking nozzle 45 corresponds to the chip on the tray 32 , the first adjusting block 82 corresponds to the second adjusting block 83 .

[0066] Initially, the first spring 84 and the second spring 817 are in a normal state, and the side wall of the second adjustment block 83 away from the first spring 84, the side wall of the third adjustment block 815 away from the second spring 817 and the side wall of the tray 32 are on the same horizontal plane.

[0067] The implementation principle of the third embodiment of the present application is as follows: when the material taking suction nozzle 45 sucks the chip on the tray 32, the first adjustment block 82 will not conflict with the second adjustment block 83. When the material taking suction nozzle 45 places the chip in the receiving slot of the tray 32, and the chip is a defective chip, the fifth cylinder is started, and the piston rod of the fifth cylinder drives the first adjustment block 82 to move, the first adjustment block 82 conflicts with the second adjustment block 83 and pushes the second adjustment block 83 to move, the first rack 87 on the second adjustment block 83 drives the first gear 86 to rotate, the first gear 86 drives the first rotating shaft 85 to rotate, the second gear 88 on the first rotating shaft 85 drives the second rack 89 to move, and the second rack 89 drives the limiting block 81 to move, so that one end of the limiting block 81 moves to the receiving slot to limit the defective chip in the receiving slot, and the first spring 84 is in a compressed state at this time; because of the existence of the ratchet 810 and the pawl 812, when the first adjustment block 82 moves in the direction away from the second adjustment block 83, the limiting block 81 still limits the chip in the receiving slot.

[0068] When the chips to be tested are transferred out, the receiving slots of the tray 32 are in an idle state; then the chips that have been tested are transferred to the idle receiving slots, and the defective chips are restricted in the receiving slots by the restriction blocks 81 . When the subsequent operator takes the chips on the tray 32, it is easy to take because the good chips are not restricted by the limiting block 81; when the operator takes the defective chips, he must first press the third adjustment block 815, and the third rack 816 on the third adjustment block 815 drives the third gear 814 to rotate, and the third gear 814 drives the rotating block 813 to rotate, and the two limiting rods 818 on the rotating block 813 will drive the pawl 812 to rotate, so that the pawl 812 no longer cooperates with the ratchet 810, and the first spring 84 will restore the elastic deformation. The force of the first spring 84 restoring the elastic deformation will drive the second adjustment block 83 to move, so that the second adjustment block 83 returns to its original position. When the second adjustment block 83 moves, it will drive the limiting block 81 to move, so that the limiting block 81 extends back into the first groove and no longer limits the chip; finally, the operator takes the defective chip located in the accommodating groove.

[0069] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A stacked test device, characterized in that: It includes a machine platform (11), a test frame (12), a test mechanism (2), a chip placement assembly (3), a transfer assembly (4), a shuttle movement assembly (5) and a material transfer arm assembly (6). The test rack (12) is arranged on the machine platform (11), and the test rack (12) is provided with multiple layers of test slots; The test mechanism (2) is arranged in each of the test slots, and the test mechanism (2) comprises a test carrier (21), a moving component (22) and a test unit (23). The test carrier (21) is slidably disposed in the test slot via the moving component (22); The test unit (23) is arranged on the test carrier (21); The chip placement assembly (3) is arranged on the machine platform (11) at one side of the test rack (12); The shuttle moving assembly (5) is arranged on the machine platform (11) on one side of the chip placement assembly (3); The transfer assembly (4) is arranged on the machine platform (11), and the transfer assembly (4) is used to realize the transfer of chips between the chip placement assembly (3) and the shuttle movement assembly (5); The material transfer arm assembly (6) is arranged on the machine platform (11), and the material transfer arm assembly (6) is used to realize the transfer of chips between the shuttle moving assembly (5) and the testing unit (23).

2. A stacked test device according to claim 1, characterized in that: The chip placement assembly (3) comprises a placement frame (31), a tray (32) and an adjustment mechanism (33). A plurality of the placement frames (31) are provided, and the plurality of the placement frames (31) are all provided on the machine platform (11), and a placement groove (311) is formed in the placement frame (31); The tray (32) is located in the placement groove (311) of the placement frame (31), and a receiving groove for placing a chip is provided on the tray (32); The adjustment mechanism (33) is used to adjust the position of the tray (32) in the placement frame (31) or to transfer the tray (32) in the placement frame (31) to another placement frame (31).

3. A stacked test device according to claim 2, characterized in that: A plurality of trays (32) are provided, and the plurality of trays (32) are stacked and located in the placement slot (311); The adjustment mechanism (33) comprises a lifting platform (331), a first support block (332), an adjustment plate (333), an adjustment suction cup and a first lifting assembly (334). The lifting platform (331) is arranged on the placement frame (31) and is located in the placement slot (311), wherein one of the trays (32) contacts the lifting platform (331); The first support block (332) is connected to the transfer assembly (4); The adjustment plate (333) is arranged on the first support block (332) via the first lifting assembly (334); The adjustment suction cup is arranged on the adjustment plate (333).

4. A stacked test device according to claim 2, characterized in that: A plurality of groups of supporting components are arranged on the side wall of the placement groove (311), and the supporting components include two supporting blocks (34). The two supporting blocks (34) are both arranged on the placement frame (31), and the two supporting blocks (34) are located in the same horizontal plane; the two supporting blocks (34) in the same group of supporting components abut against the same tray (32); The placement frame (31) is provided with an inlet and outlet hole which is in communication with the placement groove (311); The adjustment mechanism (33) comprises a blocking plate (335), a first column (336), a second lifting assembly (337), a first adjustment block (338), a second adjustment block (339), a bidirectional cylinder (3310), a clamping block (3311), an adjustment assembly (3312) and a transverse movement assembly (3313). The blocking plate (335) is rotatably arranged on the placement frame (31) through the adjustment component (3312), and the blocking plate (335) is capable of blocking the inlet and outlet holes; The first column (336) is arranged on the machine platform (11), and the first adjustment block (338) is slidably arranged on the first column (336) via the second lifting assembly (337); The second adjustment block (339) is arranged on the first adjustment block (338) via the transverse movement assembly (3313); The bidirectional cylinder (3310) is arranged on the second adjustment block (339), and the clamping blocks (3311) are arranged on the two piston rods of the bidirectional cylinder (3310), and the two clamping blocks (3311) can both be pressed against the tray (32).

5. The stacked test device according to claim 1, characterized in that: The transfer assembly (4) comprises a support frame (41), a moving frame (42), a moving block (43), a material taking block (44), a material taking suction nozzle (45), a lateral moving mechanism (46), a material taking reciprocating mechanism (47), a spacing adjustment mechanism and a lifting mechanism (48). The support frame (41) is arranged on the machine platform (11); The movable frame (42) is slidably arranged on the supporting frame (41) via the transverse moving mechanism (46); The moving block (43) is slidably arranged on the moving frame (42) via the material taking reciprocating mechanism (47); A plurality of the material taking blocks (44) are provided, and the plurality of the material taking blocks (44) are all slidably arranged on the moving block (43) via the spacing adjustment mechanism; The material taking suction nozzle (45) is slidably arranged on the material taking block (44) via the lifting mechanism (48).

6. The stacked test device according to claim 1, characterized in that: The shuttle moving assembly (5) comprises a shuttle carrier plate (51), a carrying jig (52), a placement seat (53) and a reciprocating moving mechanism (54). The shuttle carrier plate (51) is slidably arranged on the machine platform (11) via the reciprocating mechanism (54); A plurality of the carrier jigs (52) are provided, and the plurality of carrier jigs (52) are all provided on the shuttle carrier plate (51); Two placement seats (53) are provided on each of the supporting jigs (52).

7. The stacked test device according to claim 1, characterized in that: The material transfer arm assembly (6) comprises a second column (61), a second support block (62), a third support block (63), a horizontal moving mechanism (64), a vertical moving mechanism (65), a material transfer moving mechanism (66) and a material transfer suction nozzle (67). The second column (61) is slidably arranged on the machine platform (11) via the horizontal moving mechanism (64); The second support block (62) is slidably disposed on the second column (61) via the vertical moving mechanism (65); The third support block (63) is slidably arranged on the second support block (62) via the material shifting mechanism (66); The material transfer suction nozzles (67) are provided on both sides of the third support block (63).

8. A stacked test device according to claim 7, characterized in that: A scanning mechanism (7) is provided on the second supporting block (62), wherein the scanning mechanism (7) comprises a fourth supporting block (71), a connecting block (72), a scanning element (73) and an adjusting component (74). The fourth support block (71) is arranged on the second support block (62); The connecting block (72) is slidably arranged on the fourth supporting block (71) via the adjusting assembly (74); The scanning piece (73) is arranged on the connecting block (72).

9. The stacked test device according to claim 1, characterized in that: The test rack (12) is provided with a pull-out hole connected to the test slot. The test rack (12) is provided with a replacement component (24), the replacement component (24) comprising an additional circuit board (241) and a fixing part. The additional circuit board (241) enters the test slot through the draw-out hole, and the additional circuit board (241) is connected to the test rack (12) through the fixing member; The test carrier board (21) is slidably arranged on the additional circuit board (241) via the moving component (22).

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