Millimeter wave multi-beam phased array antenna

Abstract

The multi-beam phased-array antenna has the characteristics of high integration, high reliability, flexibility, agility and the like, and becomes an important component of a satellite internet communication system. According to the low-cost and high-integration millimeter wave multi-beam phased-array antenna provided by the invention, a silicon-based microsystem integration technology and an integrated comprehensive mother board integration technology are combined, so that the high-density integration design of multiple functions of the multi-beam phased-array antenna is realized; the problems of miniaturization, heat dissipation, interconnection, expandability and the like of a high-frequency-band antenna array are solved, and the multi-beam phased-array antenna can be suitable for a future satellite internet communication system.

Description

Technical Field

[0001] The present invention belongs to the technical field of microwave antennas, and in particular relates to a millimeter wave multi-beam phased array antenna. Background Art

[0002] In recent years, more and more countries and institutions have invested in the field of satellite communications due to the wide signal coverage, large-capacity high-speed communication, strong flexibility and high reliability of low-orbit satellite Internet communications. Due to the high cost of satellite launch and limited satellite resources (weight and power consumption), satellite communication antennas need to consider low cost, high integration, light weight and two-dimensional wide-angle scanning. Millimeter-wave multi-beam phased array antennas have become an important part of satellite Internet communication systems due to their high frequency band and wide bandwidth; multi-beam phased array antennas have high integration, high reliability and flexibility.

[0003] Due to the high frequency and two-dimensional wide-angle scanning, the millimeter wave band has small spacing between antenna array radiation units, many phased array antenna components, and high integration density, involving the interconnection and transmission of four major link systems: RF, control, power supply, and heat. The difficulty lies in the multiple signal forms, complex electromagnetic environment, high heat density, and large number of equipment. Its integrated design needs to comprehensively consider telecommunications, structure, cooling, and other aspects in order to optimize the entire system.

[0004] Therefore, adopting a reasonable array layout and appropriate interconnection, transmission, and integration forms is the key to improving array performance and integration and reducing system costs. Summary of the invention

[0005] To this end, the present invention proposes a low-cost, highly integrated millimeter-wave multi-beam phased array antenna. By combining silicon-based microsystem integration technology with integrated integrated motherboard integration technology, a high-density integrated design of multiple functions of the multi-beam phased array antenna is achieved, and the problems of miniaturization, heat dissipation, interconnection, and scalability of high-frequency band antenna arrays are solved. The multi-beam phased array antenna can be suitable for future satellite Internet communication systems.

[0006] The multi-beam phased array antenna of the present invention adopts a transmission and reception separation system and is divided into a transmission multi-beam phased array antenna (1) and a reception multi-beam phased array antenna (2). The transmission multi-beam phased array antenna (1) and the reception multi-beam phased array antenna (2) have basically the same integrated architecture and functional division.

[0007] The transmitting multi-beam phased array antenna (1) comprises a transmitting wafer sub-array (11), a transmitting integrated synthesis layer (12), a transmitting antenna structural plate (13), a transmitting primary power supply (14), a transmitting antenna thermal control film (15), etc.

[0008] The receiving multi-beam phased array antenna (2) comprises a receiving wafer sub-array (21), a receiving integrated synthesis layer (22), a receiving antenna structural plate (23), a receiving primary power supply (24), a receiving antenna thermal control film (25), etc.

[0009] The transmitting wafer sub-array (11) comprises a transmitting circularly polarized patch antenna (111), a silicon-based transmitting component (112), a transmitting composite interconnection layer (113), a transmitting sub-array metal carrier plate (114), a transmitting wafer sub-array interconnection interface (115), etc.

[0010] The receiving wafer sub-array comprises a receiving circularly polarized patch antenna (211), a silicon-based receiving component (212), a receiving composite interconnection layer (213), a receiving sub-array metal carrier plate (214), a receiving wafer sub-array interconnection interface (215), etc.

[0011] The architecture of the transmitting and receiving wafer sub-arrays is the same, using a micro-system chip architecture. BGA ball welding is used between the circularly polarized patch antenna, silicon-based components and composite interconnection layer to achieve fixation, high and low frequency signal transmission, and heat dissipation functions at the same time; the composite interconnection layer is welded to the aluminum silicon carbide (Al / SiC) metal carrier; and the thermal matching and thermal conductivity performance are fully achieved between the materials.

[0012] The transmission integrated comprehensive layer (12) includes a transmission frequency source SIP module (121), a transmission frequency conversion SIP module (122), a power supply module (123), a wave control module (124), an integrated network (125), etc.

[0013] The receiving integrated comprehensive layer (22) includes a receiving frequency source SIP module (221), a receiving frequency conversion SIP module (222), a power supply module (223), a wave control module (224), an integrated network (225), etc.

[0014] The integrated comprehensive layer realizes the multifunctional interconnection of control, power supply and radio frequency signal, and integrates the traditional single-machine frequency source (121) with the frequency conversion module (122), power module (123) and wave control module (124) into a common board. The integrated comprehensive layer (12) is a key component for the interconnection of antenna arrays. The radio frequency links interconnected with the wafer sub-array (11) are all interconnected by SSMP double-female connectors (1251), and the low-frequency links are welded spring pin connectors (1252). Contacts are set on the wafer sub-array, and the two are crimped and interconnected. The integrated network board and the external main port and wafer sub-array are all cable-free interconnected, with high integration.

[0015] The transmitting antenna structure plate (13) comprises a front cover plate (131), a mounting plate (132) and a bottom plate (133).

[0016] The receiving antenna structure plate (23) comprises a front cover plate (231), a mounting plate (232) and a bottom plate (233).

[0017] The mounting plate provides mounting interfaces and heat conduction channels for the wafer sub-array, integrated integrated layer, primary power supply, and connector. The cover plate is made of carbon fiber material and is a thin shell structure. It is connected to the mounting plate by screws to provide an implementation surface for the thermal control film. The bottom plate is connected to the mounting plate by screws, and the boss provides a heat dissipation channel for the heating device on the back of the integrated network board, which is fitted with the satellite cabin board for heat dissipation.

[0018] The transmitting primary power source (14) and the receiving primary power source (24) are designed in the same way and are completely the same in each unit.

[0019] The transmitting antenna thermal control film (15) and the receiving antenna thermal control film (25) are attached to the circular polarization patch antenna and the surface of the cover plate. The material is a nano film with high emissivity and absorptivity, which enhances the external radiation heat dissipation capability.

[0020] The beneficial effects of the present invention are

[0021] 1. The silicon-based microsystem integration technology is combined with the integrated integrated motherboard integration technology. The RF front-end array adopts the silicon-based microsystem integration technology to achieve high-density integration, miniaturization, and efficient heat dissipation. The frequency conversion, beam forming, beam control, frequency source, and secondary power supply adopt the integrated motherboard integration technology. The low-cost packaged chip is surface-mounted on the multi-layer PCB board to achieve multi-functional integration and high and low frequency co-board integration. It has a low profile, simple interconnection, and low manufacturing cost, which is suitable for mass production.

[0022] 2. As the core module, the wafer sub-array integrates glass antenna units, silicon-based multi-beam components and composite interconnection layers (including carrier boards), realizing three-dimensional heterogeneous integration within the wafer sub-array and successfully solving the problems of heat dissipation, interconnection and reliability existing in millimeter-wave high-integration arrays.

[0023] 3. Innovative use of multiple high-density hybrid interconnection methods, leadless design of antenna array, BGA interconnection between radiation unit and component, BGA interconnection between component and composite interconnection layer, surface mount welding and through-hole welding, etc., to achieve high integration and integrated design of millimeter wave array.

[0024] 4. The wafer sub-array adopts an integrated welding molding architecture of glass antenna + silicon-based components + aluminum nitride HTCC composite interconnection layer substrate + aluminum silicon carbide carrier to reduce the internal conduction temperature rise. The mounting plate adopts surface-mounted high thermal conductivity graphene film to improve the surface thermal expansion capability. The conduction interface adopts low thermal resistance interface materials and bosses to reduce the contact temperature rise, realizing bidirectional and efficient conduction heat dissipation of the millimeter wave array.

[0025] 5. Use SiP technology to mount the frequency conversion module and frequency source module on the integrated network board, and modularize the beam control and secondary power supply on the same board to achieve multi-functional integration and high and low frequency integrated design. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is an exploded diagram of a highly integrated multi-beam millimeter-wave phased array antenna.

[0027] Figure 2 Exploded view of the highly integrated multi-beam millimeter-wave transmitting phased array antenna.

[0028] Figure 3 Exploded diagram of a highly integrated multi-beam millimeter-wave receiving phased array antenna.

[0029] Figure 4 This is the exploded diagram of the transmit array wafer sub-array.

[0030] Figure 5 This is an exploded diagram of the receiving array wafer sub-array.

[0031] Figure 6 This is a schematic diagram of the launch integrated comprehensive layer.

[0032] Figure 7 This is a schematic diagram of the integrated receiving layer.

[0033] Figure 8 This is a schematic diagram of the interconnection of the integrated layer of the transmitting array.

[0034] Fig. 9 This is a schematic diagram of the interconnection of the integrated comprehensive layer of the receiving array.

[0035] Fig.10 Schematic diagram of the installation plate of the transmitting array structure.

[0036] Fig.11 Schematic diagram of the receiving array structure installation plate. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] The highly integrated millimeter wave multi-beam phased array antenna of the present invention adopts a transmitting and receiving split system, and is divided into a transmitting multi-beam phased array antenna 1 and a receiving multi-beam phased array antenna 2. The integrated architecture and functional division of the transmitting multi-beam phased array antenna 1 and the receiving multi-beam phased array antenna 2 are basically the same. Figure 1 shown.

[0039] like Figure 2 As shown, the transmitting multi-beam phased array antenna 1 includes a transmitting wafer sub-array 11, a transmitting integrated integrated layer 12, a transmitting antenna structural plate 13, a transmitting primary power supply 14, a transmitting antenna thermal control film, etc.

[0040] like Figure 3 As shown, the receiving multi-beam phased array antenna 2 includes a receiving wafer sub-array 21, a receiving integrated integrated layer 22, a receiving antenna structure plate 23, a receiving primary power supply 24, a receiving antenna thermal control film, etc.

[0041] like Figure 4 As shown, the transmitting wafer sub-array 11 includes a transmitting circularly polarized patch antenna 111, a silicon-based transmitting component 112, a transmitting composite interconnect layer 113, a transmitting sub-array metal carrier 114, a transmitting wafer sub-array interconnect interface 115, and the like.

[0042] like Figure 5 As shown, the receiving wafer sub-array includes a receiving circularly polarized patch antenna 211, a silicon-based receiving component 212, a receiving composite interconnection layer 213, a receiving sub-array metal carrier 214, a receiving wafer sub-array interconnection interface 215, etc.

[0043] The architecture of the transmitting and receiving wafer sub-arrays is the same, using a micro-system chip architecture. BGA ball welding is used between the circularly polarized patch antenna, silicon-based components and the composite interconnection layer to achieve fixed, high- and low-frequency signal transmission, and heat dissipation functions at the same time; the metal carrier processed by aluminum silicon carbon (Al / SiC) is behind the composite interconnection layer, which is combined with the interconnection layer by welding, and is interconnected with the integrated integrated layer 12 through the RF SSMP dual-female connector 1251 and the low-frequency spring pin connector 1252 to achieve the transmission of array surface signals. The thermal matching and thermal conductivity performance are fully realized between the materials of each part of the wafer sub-array.

[0044] like Figure 6 As shown, the transmission integrated comprehensive layer 12 includes a transmission frequency source SIP module 121, a transmission frequency conversion SIP module 122, a power supply module 123, a wave control module 124, an integrated network 125 and the like.

[0045] like Figure 7 As shown, the receiving integrated comprehensive layer 22 includes a receiving frequency source SIP module 221, a receiving frequency conversion SIP module 222, a power supply module 223, a wave control module 224, an integrated network 225, etc.

[0046] The integrated comprehensive layer realizes the multifunctional interconnection of control, power supply and RF signals. It uses a mixed pressure multilayer board as a carrier. The mixed pressure multilayer board realizes the transmission and distribution of 4 independent power division networks, power supply networks and control networks. On the front and back sides, the traditional stand-alone wave control module, power supply module, frequency source and frequency conversion SIP module are integrated into a common board. The integrated comprehensive layer is a key component for the interconnection of antenna arrays. The RF interface interconnected with the wafer sub-array is SSMP double-female connector interconnection, and the low-frequency link is a welded spring pin connector. Contacts are set on the wafer sub-array, and the two are crimped and interconnected; the primary power supply is blindly connected through the J181 connector. The integrated network board is connected to the external main port and the wafer sub-array without cables, and the integration is high.

[0047] like Fig.10 and 11 As shown, the transmitting antenna structure plate includes a front cover plate 131 , a mounting plate 132 and a bottom plate 133 ; the receiving antenna structure plate includes a front cover plate 231 , a mounting plate 232 and a bottom plate 233 .

[0048] The mounting plate provides mounting interfaces and heat conduction channels for the wafer sub-array, integrated integrated layer, primary power supply, and connector. The cover plate is made of carbon fiber material and is a thin shell structure. It is connected to the mounting plate by screws to provide an implementation surface for the thermal control film. The bottom plate is connected to the mounting plate by screws, and the boss provides a heat dissipation channel for the heating device on the back of the integrated network board, which is fitted with the satellite cabin board for heat dissipation.

[0049] The transmitting primary power source 14 and the receiving primary power source 24 are of the same design and are completely identical in their individual units.

[0050] The transmitting antenna thermal control film and the receiving antenna thermal control film are attached to the surface of the circularly polarized patch antenna and the cover plate. The material is a nano-film with high emissivity and absorption rate, which enhances the external radiation heat dissipation capability.

[0051] The millimeter wave phased array antenna adopts a wafer sub-array architecture, which greatly simplifies the interconnection between the circularly polarized patch radiation unit and the silicon-based components and the composite interconnection layer, and replaces a large number of high and low frequency connectors through micro-assembly. The multifunctional integrated integrated layer design adopts a common board integration design, which integrates high and low frequency signal interconnection, reduces single-machine interconnection, and saves space. The connectors are all integrated into the integrated network layer, and there is no cable design. The millimeter wave highly integrated and thin antenna architecture design is realized.

[0052] The above is a specific description of the preferred embodiments of the present invention, but the invention is not limited to the embodiments, and those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention. It is worth noting that the various variables mentioned in the present invention can be adjusted according to actual conditions. In addition, the number of wafer sub-arrays, patch antenna types and structural plate types, assembly forms, number of beams, module integration forms and arrangement methods within the integrated integrated layer mentioned in this embodiment can be modified according to actual conditions. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A millimeter-wave multi-beam phased array antenna with a separate transmitter and receiver, characterized in that: The transmitting multi-beam phased array antenna (1) and the receiving multi-beam phased array antenna (2) have basically the same integrated architecture and functional division.

2. The millimeter wave multi-beam phased array antenna with a separate transmitter and receiver according to claim 1, characterized in that: The transmitting multi-beam phased array antenna (1) comprises a transmitting wafer sub-array (11), a transmitting integrated comprehensive layer (12), a transmitting antenna structural plate (13), a transmitting primary power supply (14), and a transmitting antenna thermal control film; the receiving multi-beam phased array antenna (2) comprises a receiving wafer sub-array (21), a receiving integrated comprehensive layer (22), a receiving antenna structural plate (23), a receiving primary power supply (24), and a receiving antenna thermal control film.

3. The millimeter wave multi-beam phased array antenna with a separate transmitter and receiver according to claim 2, characterized in that: The transmitting wafer sub-array (11) comprises a transmitting circularly polarized patch antenna (111), a silicon-based transmitting component (112), a transmitting composite interconnection layer (113), a transmitting sub-array metal carrier (114), and a transmitting wafer sub-array interconnection interface (115); the receiving wafer sub-array comprises a receiving circularly polarized patch antenna (211), a silicon-based receiving component (212), a receiving composite interconnection layer (213), a receiving sub-array metal carrier (214), and a receiving wafer sub-array interconnection interface (215); The architecture of the transmitting and receiving wafer sub-arrays is the same, using a microsystem chip architecture; BGA ball welding is used between the circularly polarized patch antenna, silicon-based components and the composite interconnect layer; behind the composite interconnect layer is a metal carrier plate processed from aluminum, silicon and carbon, which is combined with the composite interconnect layer by welding.

4. The millimeter wave multi-beam phased array antenna with a separate transmitter and receiver according to claim 2, characterized in that: The transmitting integrated comprehensive layer (12) comprises a transmitting frequency source SIP module (121), a transmitting frequency conversion SIP module (122), a power module (123), a wave control module (124), and an integrated network (125); the receiving integrated comprehensive layer (22) comprises a receiving frequency source SIP module (121), a receiving frequency conversion SIP module (121), an integrated network (121), a power module (121), and a wave control module (121); the common board modules adopt a variety of interconnection methods such as BGA solder ball interconnection, surface mount soldering, and through-hole soldering.

5. The millimeter wave multi-beam phased array antenna with a separate transmitter and receiver according to claim 4, characterized in that: The radio frequency interfaces for interconnecting the integrated integrated layer (12) and the wafer sub-array (11) are all interconnected by SSMP double-female connectors (1251), and the low-frequency links are welded spring pin connectors (1252). Contacts are set on the wafer sub-array, and the two are crimped and interconnected; the primary power supply is blindly connected through the J181 connector; the integrated network board and the external main port and wafer sub-array are all cable-free.

6. The millimeter wave multi-beam phased array antenna with a separate transmitter and receiver according to claim 1, characterized in that: The transmitting antenna structure plate comprises a transmitting antenna front cover plate (131), a transmitting antenna mounting plate (132) and a transmitting antenna bottom plate (133); the receiving antenna structure plate comprises a receiving antenna front cover plate (231), a receiving antenna mounting plate (232) and a receiving antenna bottom plate (233); the transmitting antenna structure plate and the receiving antenna structure plate have the same architecture, the mounting plate provides a mounting interface and a heat conduction channel for the wafer sub-array, the integrated integrated layer and the connector, the front cover plate is made of carbon fiber material and is a thin shell structure, which is connected to the mounting plate by screws and provides an implementation surface for the thermal control film, the bottom plate is connected to the mounting plate by screws, and a heat dissipation channel is provided for the back heating device by a boss, and heat is dissipated by fitting with the satellite cabin plate.

7. The millimeter wave multi-beam phased array antenna with a separate transmitter and receiver according to claim 2, characterized in that: The transmitting antenna thermal control film (15) and the receiving antenna thermal control film (25) are both attached to the corresponding circular polarization patch antenna and the surface of the cover plate.

Images