Gradient component antenna TR heat dissipation structure, component device and preparation method

Abstract

The invention provides a gradient component antenna TR heat dissipation structure, an assembly device and a preparation method. According to the gradient component antenna TR assembly heat dissipation structure, the structure carries a large amount of heat for heat transfer through a phase change medium arranged in a cavity and by using the principle of phase change heat absorption / release, and the purpose of efficient heat dissipation is achieved. The device adopts a closed structure, and the cold end and the hot end are arranged at two different positions of one cavity, so that the requirement of conductor refrigeration is met. Extra compressor equipment and other power equipment are not needed, and gas flowing, liquid backflow and other operations are achieved through gas rising flowing and other phenomena. The device has the advantages of self-circulation and low energy consumption. In addition, by means of the structure, the assumption that refrigeration is conducted through liquid phase change in the semiconductor field is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of antenna TR components, and in particular to a gradient component antenna TR heat dissipation structure, component device, and preparation method. Background Art

[0002] High-power electronic devices generate a lot of heat, especially TR components. For this type of microelectronic packaging, the packaging material must have high thermal conductivity to avoid failure of the chip and device due to temperature rise. At the same time, the packaging material must have a matching thermal expansion coefficient with the chip, LTCC substrate and other packaged device materials to avoid component failure due to thermal mismatch. It must also have sufficient strength and rigidity to protect and support the chip and device.

[0003] Traditional heat dissipation devices usually use heat transfer, that is, heat is transferred from a high temperature area to a low temperature area. The medium that transfers heat itself only plays a role in heat conduction. Common methods include air cooling, such as fan cooling devices; liquid cooling, such as refrigerant liquid cooling devices; and solid thermal conduction cooling, such as heat sinks. However, these cooling devices have limited ability to transfer heat and are difficult to use in the cooling of TR components. In order to increase the amount of heat transfer, R&D personnel have proposed to take away a large amount of heat through the change of liquid phase and release a large amount of heat through the change of liquid phase at the other end. However, this idea can only be applied to large heat dissipation transpositions, such as air conditioning equipment. So far, there is no equipment in the semiconductor field that uses liquid phase changes for cooling.

[0004] Therefore, there is an urgent need for a gradient component antenna TR heat dissipation structure, component device, and preparation method. Summary of the invention

[0005] The present invention aims to provide a gradient component antenna TR heat dissipation structure, component device, and preparation method, and proposes a device for refrigeration through liquid phase change in the field of semiconductor refrigeration technology. The specific technical solution of the present invention is as follows:

[0006] In a first aspect, the present invention provides a heat dissipation structure of a gradient component antenna TR component, the heat dissipation structure comprising: a phase-changing medium and a cavity; the image state of the phase-changing medium changes at different parts of the same cavity, thereby realizing heat transfer at different parts of the same cavity;

[0007] The cavity is filled with the phase-changing medium, which evaporates at a first preset temperature and condenses at a second preset temperature; the cavity seals the phase-changing medium inside, one end of the cavity outside is in contact with a heat source, and the other end is in contact with a heat sink; the phase-changing medium evaporates at an end close to the heat source and flows into an end close to the heat sink, and the phase-changing medium condenses at an end close to the heat sink and flows back to an end close to the heat source.

[0008] Preferably, a confluence structure is provided in the cavity, and the confluence structure is used to converge the liquid water droplets condensed at one end close to the heat dissipation device into a liquid water flow, so that the condensed phase-changing medium flows back to the end close to the heat source in the phase of liquid water flow.

[0009] Preferably, the confluence structure is provided with multiple flow channels, so that the liquid flows formed at various locations gradually converge, thereby accelerating the reflux of the liquid flows.

[0010] Preferably, the confluence structure is a protrusion arranged in an array, and corresponding intervals are preset between the protrusions so that condensed liquid water droplets converge into a liquid water flow; the multi-stage flow channel is a channel arranged around a plurality of the protrusions.

[0011] In a second aspect, the present invention further provides a gradient component antenna TR assembly device, the device comprising: a substrate, an antenna TR assembly;

[0012] A plurality of slots are provided on the substrate, and the slots are used to install the antenna TR assembly. The antenna TR assembly is provided at one end of the corresponding slot. The material at one end of the slot close to the antenna TR assembly is a preset expansion coefficient material, and the preset expansion coefficient material matches the expansion coefficient of the contact material of the antenna TR assembly. The contact material is the material in the antenna TR assembly that contacts the substrate. The material at one end of the slot away from the antenna TR assembly is a heat dissipation material. In the slot, a transition material is provided between the preset expansion coefficient material and the heat dissipation material. The transition material is used to connect the preset expansion coefficient material and the heat dissipation material and eliminate the stress between the materials.

[0013] In another embodiment of the present solution, the device further comprises: a heat sink; the heat sink is installed in the slot, and the heat sink is used to transfer the heat of the antenna TR component to one end of the heat dissipation material;

[0014] The heat sink comprises a heat dissipation layer, a condensation layer, and a heat dissipation microchannel layer; the heat dissipation microchannel layer is arranged between the heat dissipation layer and the condensation layer; a pipeline is arranged in the heat dissipation microchannel layer, and a heat conductive material is arranged in the pipeline.

[0015] In another embodiment of the present solution, the pipeline is a pipeline in the form of multi-stage leaf veins.

[0016] In another embodiment of the present solution, the pipeline is a multi-circulation pipeline.

[0017] In another embodiment of the present solution, the heat sink is a multi-layer split structure, and the condensation layer.

[0018] In a third aspect, the present invention further provides a method for preparing a gradient component antenna TR assembly device, the method comprising:

[0019] The low expansion high silicon aluminum alloy area is formed to a specified height by a selective laser melting process, and the height position of the forming chamber is kept unchanged;

[0020] After cleaning the high-silicon aluminum alloy powder material in the equipment, place the transition aluminum alloy powder material in the forming cabin and the powder supply cabin respectively; continue to form the transition aluminum alloy area to the specified height;

[0021] After cleaning the transition aluminum alloy powder material in the equipment, place the high thermal conductivity aluminum alloy powder material in the forming chamber and the powder supply chamber respectively; continue to form the high thermal conductivity aluminum alloy area until the forming is completed.

[0022] The beneficial effects of the present invention are as follows:

[0023] The present invention provides a heat dissipation structure of a gradient component antenna TR component. The structure uses a phase-changing medium disposed in a cavity and utilizes the principle of phase change absorption / release of heat to carry a large amount of heat for heat transfer, thereby achieving the purpose of efficient heat dissipation. The device adopts a closed structure, and the cold end and the hot end are disposed at two different positions in a cavity, thereby achieving the need for single-conductor refrigeration. No additional compressor equipment or other power equipment is required, and the flow of gas, liquid reflux and other operations are achieved by utilizing phenomena such as gas rising flow. It has the advantages of self-circulation and low energy consumption. In addition, the structure realizes the idea of ​​refrigeration through liquid phase change in the semiconductor field. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Three-dimensional diagram of the gradient component antenna TR component structure;

[0025] Figure 2 Three-dimensional wireframe diagram of the gradient component antenna TR component structure;

[0026] Figure 3 AA cross-sectional view of the gradient component antenna TR component structure;

[0027] Figure 4 Evaporation end flow channel design drawing;

[0028] Figure 5 Evaporation end structure design drawing;

[0029] Figure 6 Condensation end flow channel design drawing;

[0030] Figure 7 Condensation end structure design drawing;

[0031] Among them, 1. Low expansion and high silicon aluminum alloy area; 2. Transition aluminum alloy area; 3. High thermal conductivity aluminum alloy area; 4. Three-dimensional model of evaporation end structure; 5. Three-dimensional model of condensation end structure. DETAILED DESCRIPTION

[0032] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description and claims. It should be noted that the drawings are all in very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0033] It should be noted that, in order to clearly explain the content of the present invention, the present invention specifically cites multiple embodiments to further illustrate different implementations of the present invention, wherein the multiple embodiments are enumerated rather than exhaustive. In addition, for the sake of brevity of explanation, the contents mentioned in the previous embodiments are often omitted in the subsequent embodiments. Therefore, the contents not mentioned in the subsequent embodiments can refer to the previous embodiments accordingly.

[0034] Although the invention can be extended in various forms of modification and substitution, some specific implementation examples are listed in the specification and described in detail. It should be understood that the starting point of the inventor is not to limit the invention to the specific embodiments described. On the contrary, the starting point of the inventor is to protect all improvements, equivalent substitutions and modifications made within the spirit or scope defined by this claim. The same component number may be used in all drawings to represent the same or similar parts. Specific embodiment 1:

[0036] like Figure 1-7 As shown, the present invention provides a heat dissipation structure of a gradient component antenna TR component, the heat dissipation structure comprising: a phase-changing medium and a cavity; the image state of the phase-changing medium changes at different parts of the same cavity, so as to realize the transfer of heat at different parts of the same cavity;

[0037] The cavity is filled with the phase-changing medium, which evaporates at a first preset temperature and condenses at a second preset temperature; the cavity seals the phase-changing medium inside, one end of the cavity outside is in contact with a heat source, and the other end is in contact with a heat sink; the phase-changing medium evaporates at an end close to the heat source and flows into an end close to the heat sink, and the phase-changing medium condenses at an end close to the heat sink and flows back to an end close to the heat source.

[0038] Figure 1 The chip and ceramic substrate are installed at the location where the heat source is placed. Figure 1The medium and high thermal conductivity aluminum alloy area 3 is where the heat sink is installed, i.e. the cold end. The phase-changing medium is liquid in the initial state. It evaporates into gas after absorbing heat at the heat source position, and absorbs a large amount of heat during vaporization. After the phase-changing medium becomes gas, it diffuses to the cold end. Since the temperature at the cold end is relatively low, the high-temperature gas releases a large amount of heat here and liquefies into liquid. The liquid condenses into a stream here and flows back to the hot end, forming a heat dissipation cycle. In such a cycle, due to the change in the phase state of the phase-changing medium, a large amount of heat will be carried, thereby improving the efficiency of heat transportation.

[0039] The cavity is provided with a confluence structure, which is used to converge the condensed liquid water droplets at one end close to the heat dissipation device into a liquid water flow, so that the condensed phase-changing medium flows back to the end close to the heat source in the phase of liquid water flow. The confluence structure is provided with multiple flow channels, so that the liquid water flows formed at various places gradually converge, accelerating the reflux of the liquid water flow. The confluence structure is a protrusion arranged in an array, and corresponding intervals are preset between the protrusions, so that the condensed liquid water droplets converge into a liquid water flow; the multi-stage flow channel is a channel arranged around a plurality of the protrusions.

[0040] like Figure 4-7 As shown, a confluence structure is provided, which can accelerate the condensed water droplets to gather into small streams. Small streams of water gradually converge to the hot end through the flow channel. The confluence structure is composed of multiple cylinders, and the cylinders are arranged according to a preset spacing. Due to the tension of the liquid, the condensed water droplets will adhere to the cylinders. Since the spacing between the cylinders is relatively small, two adjacent water droplets will converge into a larger water droplet. The larger water droplet will flow into the multi-stage flow channel. Specific embodiment 2:

[0042] In this embodiment, a gradient component antenna TR assembly device is provided. The device is composed of multiple structures described in the specific embodiment 1. The device includes: a substrate, an antenna TR assembly;

[0043] A plurality of slots are provided on the substrate, and the slots are used to install the antenna TR assembly. The antenna TR assembly is provided at one end of the corresponding slot. The material at one end of the slot close to the antenna TR assembly is a preset expansion coefficient material, and the preset expansion coefficient material matches the expansion coefficient of the contact material of the antenna TR assembly. The contact material is the material in the antenna TR assembly that contacts the substrate. The material at one end of the slot away from the antenna TR assembly is a heat dissipation material. In the slot, a transition material is provided between the preset expansion coefficient material and the heat dissipation material. The transition material is used to connect the preset expansion coefficient material and the heat dissipation material and eliminate the stress between the materials.

[0044] The antenna TR components are usually arranged in an array, so their heat dissipation devices are also arranged in an array. The substrate is an integrated structure and is provided with multiple grooves. Figure 1 As shown, in order to place the chip, the groove can be set in a stepped shape. A gradient component antenna TR heat dissipation structure as described in specific embodiment 1 is arranged inside the substrate. A plurality of relatively independent grooves are arranged on the substrate, and a chip is arranged in each groove. Mutually independent cavities are arranged inside the substrate, and the gradient component antenna TR heat dissipation structure is arranged in each cavity. The cavity of the gradient component antenna TR heat dissipation structure is the cavity in the substrate. A heat dissipation layer, a condensation layer, and a heat dissipation microchannel layer are arranged inside the cavity. Combined with Figure 3 As shown, the heat dissipation layer is arranged at one end of the cavity close to the chip, and the condensation layer is arranged at the end away from the chip. The temperature of the heat dissipation layer is higher, and the liquid will evaporate into gas. The temperature of the condensation layer is lower, and the gas condenses into liquid. In this way, a heat transfer cycle is formed. The heat dissipation microfluidic layer is formed by avoiding the cylinder in specific embodiment 1, and can be arranged in the condensation layer and the heat dissipation layer respectively. In this embodiment, the heat flow cycle is analyzed from a cross-sectional perspective, which does not conflict with the embodiment of specific embodiment 1.

[0045] The device further includes: a heat sink; the heat sink is installed in the slot, and the heat sink is used to transfer the heat of the antenna TR component to one end of the heat dissipation material; the heat sink includes a heat dissipation layer, a condensation layer, and a heat dissipation microchannel layer; the heat dissipation microchannel layer is arranged between the heat dissipation layer and the condensation layer; a pipeline is arranged in the heat dissipation microchannel layer, and a heat conductive material is arranged in the pipeline. The pipeline is a pipeline in the form of multi-stage leaf veins. The pipeline is a multi-circulation pipeline. The heat sink is a multi-layer split structure, and the condensation layer. Specific embodiment 3:

[0047] In the specific embodiment 1 and the specific embodiment 2, the substrate can be processed by CNC integrated processing. However, as a more preferred embodiment, the present embodiment processes the substrate by 3D printing.

[0048] Another object of the present invention is to provide a method for preparing a gradient component antenna TR component structure, comprising the following steps:

[0049] The first step is to form a low expansion high silicon aluminum alloy area

[0050] The low expansion high silicon aluminum alloy area is formed to a specified height by a selective laser melting process, and the height position of the forming chamber is kept unchanged;

[0051] The second step forming material is changed to transition aluminum alloy

[0052] After cleaning the high silicon aluminum alloy powder material in the equipment, place the transition aluminum alloy powder material in the forming cabin and the powder supply cabin respectively;

[0053] The third step is to form the transition aluminum alloy zone

[0054] Continue forming the transition aluminum alloy zone to a specified height;

[0055] The fourth step is to change the forming material to high thermal conductivity aluminum alloy

[0056] After cleaning the transition aluminum alloy powder material in the equipment, place high thermal conductivity aluminum alloy powder material in the forming cabin and powder supply cabin respectively;

[0057] Step 5: Forming the high thermal conductivity aluminum alloy area

[0058] Continue forming the high thermal conductivity aluminum alloy area until the forming is completed;

[0059] Step 6: Remove the parts

[0060] Clean the high thermal conductivity aluminum alloy powder material in the equipment and take out the integral parts;

[0061] Step 7 Post-processing

[0062] The integral parts are post-processed, including powder cleaning, heat treatment, wire cutting, finishing, filling with working fluid, etc. The working fluid is acetone or liquid ammonia.

[0063] In one embodiment, the heat treatment is annealing heat treatment, which is used to refine grains, enhance thermal conductivity of materials, and reduce residual stress. The heat treatment system is: temperature 300° C., heat preservation for 2 hours, and air cooling.

[0064] The low expansion high silicon aluminum alloy area 1, the high thermal conductivity aluminum alloy area 3, and the transition aluminum alloy area 2 are integrated into a gradient composition overall structure through a selective laser melting process; the low expansion high silicon aluminum alloy area 1 is made of AlSi20, which is used to install the silicon-based chip and ceramic substrate of the antenna TR component to achieve the thermal expansion coefficient matching between the structure of this area and the ceramic substrate; the high thermal conductivity aluminum alloy area 3 is made of AlSi5Mg, and a chip heat dissipation microchannel is arranged inside the structure, and its channel structure is in the form of 3-level leaf veins, and the solid area is filled with a cylinder with a diameter of 0.5mm, a height of 0.4mm, and a center spacing of 0.7mm; (it can also be: a cylinder with a diameter of 0.6mm, a height of 0.6mm, and a center spacing of 0.8mm;) The microchannel is divided into an evaporation end 4 and a condensation end 5 , the interior is filled with gas-liquid phase change working fluid material, the heat generated by the evaporation end chip is transferred to the liquid working fluid through the evaporation end 4, the liquid working fluid absorbs the heat and evaporates into high-temperature gas and fills the entire cavity, the high-temperature gas will condense into low-temperature liquid droplets after contacting the condensation end 5 with a lower temperature and adhere to the surface of the condensation end, and return to the evaporation end 4 under the action of the capillary force of the flow channel structure of the evaporation end 4 and the condensation end 5, thus forming a cycle, continuously transferring the heat from the heat source to the heat sink, and realizing efficient heat dissipation of high-power chips; the transition aluminum alloy zone 2 is made of AlSi12, located at the junction of the low expansion high silicon aluminum alloy zone 1 and the high thermal conductivity aluminum alloy zone 3, with a height of 2mm (can also be: height 3mm), to achieve stress uniformity at the connection between the low expansion high silicon aluminum alloy zone and the high thermal conductivity aluminum alloy zone.

[0065] A gradient component antenna TR component device includes: a low expansion high silicon aluminum alloy area, a high thermal conductivity aluminum alloy area, and a transition aluminum alloy area. The low expansion high silicon aluminum alloy area is used to install the silicon-based chip and ceramic substrate of the antenna TR component to achieve the matching of the thermal expansion coefficient of the structure of the area with that of the ceramic substrate; the high thermal conductivity aluminum alloy area has a chip heat dissipation microchannel arranged inside its structure, and forms an efficient thermal conductive structure through the arrangement of cylinders in the form of a bionic structure, and is filled with gas-liquid phase change working fluid materials inside to achieve efficient heat dissipation of high-power chips; the transition aluminum alloy area is located at the connection between the low expansion high silicon aluminum alloy area and the high thermal conductivity aluminum alloy area to achieve stress uniformity in the connection between the low expansion high silicon aluminum alloy area and the high thermal conductivity aluminum alloy area. The preparation method is efficient, reliable, and low-cost. The overall structure of the gradient component is formed by the selective laser melting process; it solves the deformation and cracking caused by the mismatch of the thermal expansion coefficients of the structural material and the chip substrate, the problem of efficient heat dissipation of high-power chips, and the problem of numerous procedures, high difficulty, and long cycle of the traditional preparation process.

[0066] The area where the structure contacts the ceramic substrate uses a low-expansion high-silicon aluminum alloy to match the thermal expansion coefficient of the structure and the ceramic substrate. However, the thermal conductivity of high-silicon aluminum alloy is low, so a high-thermal conductivity aluminum alloy with higher thermal conductivity is used in other areas, and a bionic microfluidic high thermal conductivity structure is designed to further improve the thermal conductivity of the TR component structure, thereby meeting the mechanical and thermal coupling requirements of electronic equipment. The traditional microfluidic thermal conductive structure and heterogeneous material structure preparation process has many steps, high difficulty, and long cycle. The selective laser melting process can be used to form an efficient thermal conductive structure of the antenna TR component with a gradient component and a bionic microfluidic channel. The preparation process is simple, the cycle is short, and the reliability is high. It is an ideal means to prepare a gradient component high thermal conductivity TR component structure.

[0067] In this embodiment, in addition to solving the technical problems in the background technology, the technical problem of cracking caused by different substrate materials, which leads to mismatched expansion coefficients, is also solved. In particular, this technical problem is not only present in 3D printing, but also occurs if CNC processing is used. The technical solution is similar to this solution, and the following operations can be performed:

[0068] Prepare materials A, B and C, melt material A and cool it to form, then melt material B on material A, and similarly melt material C on the formed material B. A blank containing three materials A, B and C is obtained, and a finished product can be obtained by processing the blank. Specific embodiment 4:

[0070] This embodiment is a gradient component antenna TR component device manufactured by the processing method described in Specific Embodiment 3. Figures 1 to 7 A gradient component antenna TR component device of the present invention comprises: a low expansion high silicon aluminum alloy zone, a high thermal conductivity aluminum alloy zone, and a transition aluminum alloy zone, which are integrated into a gradient component overall structure through a selective laser melting process; the low expansion high silicon aluminum alloy zone is used to install the silicon-based chip and the ceramic substrate of the antenna TR component to achieve thermal expansion coefficient matching between the structure of the region and the ceramic substrate; the high thermal conductivity aluminum alloy zone has a chip heat dissipation microchannel arranged inside its structure, and an efficient heat conduction structure is formed by arranging cylinders in a bionic structure, and a gas-liquid phase change working fluid material is filled inside to achieve efficient heat dissipation of high-power chips; the transition aluminum alloy zone is located at the connection between the low expansion high silicon aluminum alloy zone and the high thermal conductivity aluminum alloy zone to achieve stress homogenization at the connection between the low expansion high silicon aluminum alloy zone and the high thermal conductivity aluminum alloy zone.

[0071] The preferred data in this embodiment are as follows:

[0072] Preferably, the length of a single area of ​​the chip heat dissipation microfluidic channel is 28mm, the width is 7mm, and the height is 2mm. Preferably, the chip heat dissipation microfluidic channel is an independent area, one chip corresponds to one microfluidic channel, and each microfluidic channel is separately filled with working fluid. Preferably, the microfluidic channel is in the form of a three-level leaf vein, and the solid area is filled with cylinders with a diameter of 0.5mm, a height of 0.4mm, and a center spacing of 0.7mm. Preferably, the thermal expansion coefficient of the transition aluminum alloy zone is between the thermal expansion coefficients of high silicon aluminum alloy materials and high thermal conductivity aluminum alloy materials. Preferably, the height of the transition aluminum alloy zone is 2mm.

[0073] Another preferred data in this embodiment is as follows:

[0074] The length of a single area of ​​the chip heat dissipation microfluidic channel is 30mm, the width is 8mm, and the height is 2.5mm. The chip heat dissipation microfluidic channel is an independent area, one chip corresponds to one microfluidic channel, and each microfluidic channel is filled with working fluid separately. The microfluidic channel is in the form of a three-level leaf vein, and the solid area is filled with a cylinder with a diameter of 0.6mm, a height of 0.6mm, and a center spacing of 0.8mm. The thermal expansion coefficient of the transition aluminum alloy area is between the thermal expansion coefficients of high silicon aluminum alloy materials and high thermal conductivity aluminum alloy materials. In one embodiment, the height of the transition aluminum alloy area is 3mm.

[0075] The structure is simple, including: a low expansion high silicon aluminum alloy area, a high thermal conductivity aluminum alloy area, and a transition aluminum alloy area; the low expansion high silicon aluminum alloy area is used to install the antenna TR component silicon-based chip and ceramic substrate to achieve the thermal expansion coefficient matching between the structure of this area and the ceramic substrate; the high thermal conductivity aluminum alloy area has a chip heat dissipation microchannel arranged inside its structure, and forms an efficient thermal conductive structure through the cylinders arranged in the form of a bionic structure, and is filled with gas-liquid phase change working fluid materials inside to achieve efficient heat dissipation of high-power chips; the transition aluminum alloy area is located at the connection between the low expansion high silicon aluminum alloy area and the high thermal conductivity aluminum alloy area to achieve stress homogenization of the connection between the low expansion high silicon aluminum alloy area and the high thermal conductivity aluminum alloy area. The preparation method is efficient, reliable, and low-cost. The overall structure of the gradient component is formed by the selective laser melting process; it solves the deformation and cracking caused by the mismatch between the thermal expansion coefficients of the structural material and the chip substrate, the problem of efficient heat dissipation of high-power chips, and the problem of numerous procedures, high difficulty, and long cycle of the traditional preparation process. Specific embodiment 5:

[0077] In a third aspect, the present invention further provides a method for preparing a gradient component antenna TR assembly device, the method comprising:

[0078] The low expansion high silicon aluminum alloy area is formed to a specified height by a selective laser melting process, and the height position of the forming chamber is kept unchanged;

[0079] After cleaning the high-silicon aluminum alloy powder material in the equipment, place the transition aluminum alloy powder material in the forming cabin and the powder supply cabin respectively; continue to form the transition aluminum alloy area to the specified height;

[0080] After cleaning the transition aluminum alloy powder material in the equipment, place the high thermal conductivity aluminum alloy powder material in the forming chamber and the powder supply chamber respectively; continue to form the high thermal conductivity aluminum alloy area until the forming is completed.

[0081] According to the technical solution and concept of the present invention, there may be any other suitable changes. For those skilled in the art, all these replacements, adjustments and improvements should fall within the protection scope of the appended claims of the present invention.

Claims

1. A gradient component antenna TR component heat dissipation structure, characterized in that: The heat dissipation structure comprises: a phase-changing medium and a cavity; the image state of the phase-changing medium changes at different parts of the same cavity, thereby realizing the transfer of heat at different parts of the same cavity; The cavity is filled with the phase-changing medium, which evaporates at a first preset temperature and condenses at a second preset temperature; the cavity seals the phase-changing medium inside, one end of the cavity outside is in contact with a heat source, and the other end is in contact with a heat sink; the phase-changing medium evaporates at an end close to the heat source and flows into an end close to the heat sink, and the phase-changing medium condenses at an end close to the heat sink and flows back to an end close to the heat source.

2. A gradient component antenna TR component heat dissipation structure as claimed in claim 1, characterized in that: The cavity is provided with a confluence structure for converging the liquid water droplets condensed at one end close to the heat dissipation device into a liquid water flow, so that the condensed phase-changing medium flows back to the end close to the heat source in the phase of liquid water flow.

3. A gradient component antenna TR assembly heat dissipation structure as claimed in claim 2, characterized in that: The confluence structure is provided with multiple flow channels, so that the liquid water flows formed at various places gradually converge, thereby accelerating the reflux of the liquid water flows.

4. A gradient component antenna TR assembly heat dissipation structure as claimed in claim 3, characterized in that: The confluence structure is a protrusion arranged in an array, and corresponding intervals are preset between the protrusions so that condensed liquid water droplets converge into a liquid water flow; the multi-stage flow channel is a channel arranged around a plurality of the protrusions.

5. A gradient component antenna TR assembly device, characterized in that: The device comprises: a substrate, an antenna TR component; A plurality of slots are provided on the substrate, and the slots are used to install the antenna TR assembly. The antenna TR assembly is provided at one end of the corresponding slot. The material at one end of the slot close to the antenna TR assembly is a preset expansion coefficient material, and the preset expansion coefficient material matches the expansion coefficient of the contact material of the antenna TR assembly. The contact material is the material in the antenna TR assembly that contacts the substrate. The material at one end of the slot away from the antenna TR assembly is a heat dissipation material. In the slot, a transition material is provided between the preset expansion coefficient material and the heat dissipation material. The transition material is used to connect the preset expansion coefficient material and the heat dissipation material and eliminate the stress between the materials.

6. A gradient component antenna TR assembly device as claimed in claim 1, characterized in that: The device further comprises: a heat sink; the heat sink is installed in the slot, and the heat sink is used to transfer the heat of the antenna TR component to one end of the heat dissipation material; The heat sink comprises a heat dissipation layer, a condensation layer, and a heat dissipation microchannel layer; the heat dissipation microchannel layer is arranged between the heat dissipation layer and the condensation layer; a pipeline is arranged in the heat dissipation microchannel layer, and a heat conductive material is arranged in the pipeline.

7. A gradient component antenna TR assembly device as claimed in claim 2, characterized in that: The pipeline is a pipeline in the form of multiple leaf veins.

8. A gradient component antenna TR assembly device as claimed in claim 2, characterized in that: The pipeline is a multi-path circulation pipeline.

9. A gradient component antenna TR assembly device as claimed in claim 2, characterized in that: The heat sink is a multi-layer split structure, and the condensation layer.

10. A method for preparing a gradient component antenna TR assembly device, characterized in that: The method is used to prepare the device according to any one of claims 5 to 9, and the method comprises: The low expansion high silicon aluminum alloy area is formed to a specified height by a selective laser melting process, and the height position of the forming chamber is kept unchanged; After cleaning the high silicon aluminum alloy powder material in the equipment, place the transition aluminum alloy powder material in the forming cabin and the powder supply cabin respectively; continue to form the transition aluminum alloy area to the specified height; After cleaning the transition aluminum alloy powder material in the equipment, place the high thermal conductivity aluminum alloy powder material in the forming chamber and the powder supply chamber respectively; continue to form the high thermal conductivity aluminum alloy area until the forming is completed.

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