Time-frequency shaping femtosecond laser conformal antenna patterning online processing and monitoring device

Abstract

The invention discloses a conformal antenna component manufacturing system and method based on cross-scale space-time frequency shaping femtosecond laser, and belongs to the technical field of micro-nano machining. The system comprises an ultrafast laser excitation module, a laser pulse time / frequency shaping module, a pulse detection module, an online monitoring module and a focusing high-speed scanning galvanometer module. By means of the system, high-selectivity, large-breadth and three-dimensional precision machining of conformal antenna circuit patterns is achieved, and it is ensured that a substrate is not damaged. The femtosecond laser time-frequency shaping technology is combined in the machining process, layered scanning and accurate removal of the heterogeneous multilayer structure are achieved through an adjustable pulse sequence and a high-speed galvanometer system, and the problems that in the prior art, materials are damaged, and the size precision is low are solved. The device further integrates an on-line depth monitoring function, the machining efficiency and the forming quality are remarkably improved, and the device is suitable for high-precision patterning machining of complex curved surface heterogeneous thin film materials.

Description

Technical Field

[0001] The invention relates to a conformal antenna component manufacturing system and method based on cross-scale space-time frequency shaping femtosecond laser, belonging to the field of micro-nano processing technology. Background Art

[0002] As the requirements for ultra-high-speed flight, long-distance reconnaissance / interference, and the integration requirements for communications and other equipment continue to increase in aircraft, missiles, satellites and other aircraft in the aerospace field, the protruding structure of traditional rigid non-conformal antennas will affect the aerodynamic performance of fighter aircraft, and the excessive antenna scattering cross-section is not conducive to the stealth of aircraft, and cannot meet the increasing requirements for advanced aircraft applications. "Conformal" antennas that can perfectly blend with the appearance of aircraft and other weapon platforms have emerged and continue to be widely used. High-performance conformal antennas have the characteristics of low profile, flexible installation position, and large antenna aperture. They have great advantages in advanced aircraft applications and are key functional components of aerospace equipment. Their stability and reliability directly determine the performance and service life of the equipment.

[0003] The curved composite film material required for conformal antennas is a composite material composed of substrate materials and multilayer film structures. It is a typical anisotropic, heterogeneous, laminated material. Ceramic / polymer substrates and metal films have very different mechanical, thermal, electrical, optical and other physical properties, and are a typical difficult-to-process material. In order to avoid the degradation of material performance and structural deformation caused by hygroscopic deliquescence of substrate materials, dry and low-damage processing is a basic requirement. The current additive processing methods (metal sputtering process, screen printing, flexible film transplantation technology) have obvious common problems such as significant material damage layer, rough processing wall, low dimensional accuracy, and difficulty in preparing fine structures and surface micro-nano structures as manufacturing needs continue to increase. A new non-contact, high material removal resolution (up to sub-micron level) and low heat-affected zone processing method are urgently needed to achieve high-quality conformal antenna processing. Summary of the invention

[0004] Conformal antennas are usually composed of a large number of receiving / transmitting units on the surface, and high-precision circuit patterning processing needs to be performed on each receiving / transmitting unit. In order to solve the problems of unit distortion and complex process in the existing conformal antenna manufacturing, and to achieve the goal of high selectivity, large format, high precision, substrate-free, and three-dimensional patterning manufacturing of curved surface heterogeneous thin film circuits, the main purpose of the present invention is to provide a conformal antenna component manufacturing system and method based on cross-scale spatiotemporal frequency shaping femtosecond laser, which simplifies the process, uses ultrafast laser with a five-axis high-speed galvanometer system, and realizes one-time large-format three-dimensional patterning of common antennas by designing a processing position control algorithm for the curved surface.

[0005] At the same time, the manufacturing system proposed by the present invention integrates the function of online monitoring of the removal depth, which greatly simplifies the complex process flow of existing conformal antenna processing, realizes one-time forming and detection of conformal antenna manufacturing, avoids positioning errors caused by multiple clamping caused by out-of-situ detection, and improves manufacturing yield and efficiency.

[0006] The purpose of the present invention is achieved through the following technical solutions.

[0007] The device for online processing and monitoring of conformal antenna patterning using time-frequency shaping femtosecond laser disclosed in the present invention comprises:

[0008] First, a heterogeneous material precision processing system based on cross-scale space-time shaping femtosecond laser composite processing, including an ultrafast laser excitation module, a laser pulse time / frequency shaping module, a pulse detection module, a depth online monitoring module, and a focused high-speed scanning galvanometer module arranged in sequence along the laser optical path.

[0009] The ultrafast laser excitation module comprises a femtosecond laser (1) and is used to generate the required femtosecond pulse laser beam.

[0010] The laser pulse time / frequency shaping module includes a programmable dispersion control filter, a birefringent crystal, and a bbo crystal, and is used to generate a THz-GHz-MHz shaped ultrafast laser pulse sequence across time domain scales. The shaping includes the laser center wavelength, the pulse sequence cross-scale time domain interval, the laser pulse width, the sub-pulse laser energy, and the repetition frequency of the macro pulse and the sub-pulse.

[0011] The pulse detection module includes an autocorrelator and a spectrometer, which are used to detect the spectrum information and pulse shape of the regulated shaped pulse sequence in real time and establish a parameter library required for processing.

[0012] The depth online monitoring module includes a 4f optical handling system and a micro-fiber spectrometer, which is used to collect the signal of the plasma emission spectrum of the material in the laser action area during the processing and obtain the depth information of the processing process in real time.

[0013] The focused high-speed scanning galvanometer module includes a high-speed processing galvanometer, a focusing field lens and a three-axis high-precision translation stage, which is used to focus the shaping laser pulse sequence and accurately control the focus spot position to achieve fixed-point removal.

[0014] The ultrafast laser beam emitted by the laser excitation module forms a processing optical path after passing through the laser time / frequency shaping module, the laser spatial shaping module and the focusing high-speed scanning galvanometer module;

[0015] Secondly, the present invention provides a circuit patterning processing method of a three-dimensional conformal antenna based on a cross-scale time-frequency shaping femtosecond laser, comprising the following steps:

[0016] Step 1: Surface pretreatment of the three-dimensional curved conformal antenna substrate: Use 280#~2000# sandpaper to mechanically polish the substrate material on one side one by one until there are no obvious scratches under an optical microscope, use a magnetron sputtering coating device to coat the surface with copper, nickel, and gold composite films in sequence, and ultrasonically clean the component to be processed with anhydrous ethanol and blow dry;

[0017] Step 2: clamp the processed sample with a fixed fixture and fix it on a three-degree-of-freedom displacement platform;

[0018] Step 3: Write the surface patterned circuit path of the component to be processed into G code and input it into the control program of the translation stage, and move the translation stage to determine that the focus position is located at the starting point of the processing path.

[0019] Step 4: Adjust the processing optical path to implement heterogeneous material circuit patterning processing, and control the repetition frequency of the macro pulse / sub-pulse of the processing pulse sequence, the sub-pulse laser energy, the laser pulse width, and the laser center wavelength by adjusting the femtosecond laser, the time domain shaping module, and the frequency domain shaping module; and adjust the scanning speed, scanning trajectory, and scanning position by adjusting the high-speed scanning galvanometer and the three-degree-of-freedom displacement stage.

[0020] The step 4 specifically includes:

[0021] 1) The pulse laser generated by the femtosecond laser can achieve arbitrary adjustment of the energy and polarization of a single pulse through a half-wave plate and a Glan prism.

[0022] 2) Through a programmable dispersion control filter, a programmed RF signal is loaded on the acousto-optic crystal to adjust the dispersion of the pulsed laser to achieve any pulse width between 50-2000 femtoseconds.

[0023] 3) By changing the RF signal, a transducer is used to generate a periodic density Bragg grating structure inside the acousto-optic crystal, so that the pulse laser periodically generates first-order Bragg diffraction light entering the slow axis during the fast axis propagation of the acousto-optic crystal, thereby forming a high repetition frequency pulse sequence at the THz level. By adjusting the periodic time interval of the RF signal, the pulse interval can be controlled to obtain an arbitrarily adjustable repetition frequency pulse sequence in the range of GHz to MHz.

[0024] 4) By changing the power of the radio frequency signal, the intensity of the loaded periodic sound wave can be adjusted, and a free high-repetition-rate pulse sequence with arbitrarily adjustable pulse interval and pulse energy can be generated.

[0025] 5) The BBO crystal and the corresponding bandpass filter are inserted into the optical path through an electric switch to achieve frequency domain control of the reference wavelength, double frequency, and triple frequency.

[0026] Step 5. Adjust the electric translation stage to control the shaped pulse laser to focus on the processing interface of the membrane material, adjust the top imaging subsystem to make the laser focus coincide with the imaging focus position, adjust the computer control software to start the scanning trajectory, monitor the processing depth information through the online monitoring module, and observe the processing morphology in situ through the CCD camera.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] 1. The femtosecond laser processing method for patterning and shaping the surface circuit of a conformal antenna disclosed in the present invention can achieve high selectivity and large-scale precise processing of curved heterogeneous thin film circuits, overcome the problems of significant material damage layer and low dimensional accuracy in existing processing techniques, and provide a dry, low-damage femtosecond laser processing method for surface patterning circuits.

[0029] 2. The manufacturing system proposed in the present invention integrates an online depth removal monitoring function, which can obtain the material information and depth information of the processed material in real time during the processing, and realize the precise removal of heterogeneous film materials. This effectively overcomes the material damage caused by under-processing or over-processing during processing, and realizes the one-time forming and detection of conformal antennas. At the same time, by avoiding multiple clamping and positioning errors caused by out-of-situ detection, the system can greatly improve the yield and efficiency of manufacturing.

[0030] 3. The time-frequency shaping device of the present invention has a powerful shaping function. Combined with the acousto-optic dispersion programmable filter and nonlinear crystal, it can generate a pulse sequence with adjustable parameters. Compared with the existing cascaded Michelson interferometer and cascaded birefringent crystal pulse sequence generation method, this method overcomes the problems of the existing technology such as the difficulty of neutron pulse beam combining, complex optical path debugging, fixed sub-pulse interval of pulse sequence, and limited energy regulation. This method can flexibly adjust the sub-pulse interval of the pulse sequence, keep the sub-pulse spectral phase unchanged, and freely control the sub-pulse energy to achieve more flexible energy deposition regulation, thereby optimizing dimensional accuracy and reducing residual stress during the processing process. This method is also suitable for other processing requirements, such as deep hole structure processing and micro-area welding processing, to improve processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0032] Figure 1 It is a schematic diagram of the optical path of a time-frequency shaping femtosecond laser composite processing system for realizing layer-by-layer removal of heterogeneous materials provided by an embodiment of the present invention;

[0033] Among them, 1-ultrafast laser, 2-half-wave plate, 3-Glan prism, 4-acoustic-optic dispersion programmable filter, 5-beamsplitter, 6-BBO, 7-filter, 8-shutter, 9-reflector, 10-aperture, 11-aperture, 12-reflector, 13-dichroic mirror, 14-semi-transparent and semi-reflective mirror, 15-lens, 16-illumination light source, 17-industrial imaging camera, 18-reflector, 19-dichroic mirror, 20-galvanometer, 21-field mirror, 22-reflector, 23-bandpass filter, 24-convex lens, 25-fiber spectrometer, 26-translation stage, 27-sample, 28-nonlinear crystal, 29-photodetector, 04-autocorrelation pulse detection module. DETAILED DESCRIPTION

[0034] The following is a further clear and complete description of the scheme of the present invention in conjunction with the accompanying drawings and embodiments. The described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Example 1

[0036] Figure 1 A schematic diagram of the optical path used by the conformal antenna component manufacturing system based on cross-scale space-time frequency shaping femtosecond laser of this embodiment is shown, including an ultrafast laser excitation module 01, a laser pulse time domain shaping module 02, a laser pulse frequency domain shaping module 03, a pulse detection module 04, an online monitoring module 05 and a focused high-speed scanning galvanometer module 06, which are arranged in sequence along the laser optical path.

[0037] Specifically, it comprises a femtosecond laser (1) for generating a required femtosecond pulse laser beam; a half-wave plate (2) and a Glan prism (3) for changing the polarization direction of the emitted initial laser and adjusting the energy of a single pulse laser; an acousto-optic programmable dispersion filter (4) for performing time domain shaping of the original pulse at the GHZ-MHZ level (picosecond-nanosecond pulse interval) to generate a cross-time domain pulse sequence with adjustable interval; an anti-reflection film is coated on the front surface of a beam splitter (5), and a beam splitting film is coated on the rear surface of the beam splitter. After the pulse sequence passes through the beam splitter (5), it is divided into two beams with an energy ratio of 90:10. The transmitted beam 1 is incident on a pulse detection module 04, and the number of sub-pulses of the shaped pulse sequence is measured based on the pulse intensity autocorrelation signal. The reflected light beam 2 is incident on a frequency domain shaping module (6) placed at a distance L on the side of the beam splitter. The frequency domain shaping module is composed of a nonlinear crystal (6) and a bandpass filter (7) with a switch. The frequency doubler, frequency combiner, and frequency mixer components of different wavelengths generated in the nonlinear crystal are selectively passed through to achieve a selectable central wavelength of the incident laser pulse to meet the requirements of different material processing processes.

[0038] The BBO crystal (6) and the bandpass filters (7) with different central wavelengths mounted on the rotating switching frame are installed together on a single-axis precision manual displacement stage, and can be translated in a direction perpendicular to the main optical path to achieve selective use of the frequency domain shaping module; the mechanical optical switch (8) is used to control the passage or cutoff of the laser in the processing optical path; the outgoing pulse sequence is continuously reflected by the reflectors (9, 12, 18) in sequence and enters the high-speed scanning galvanometer system; the aperture (10, 11) is used to collimate the optical path to ensure the normal incidence of the processing laser that finally enters the focusing field lens of the galvanometer system.

[0039] The online monitoring module 05 includes an optical monitoring module and a depth monitoring module. The optical monitoring module is composed of a dichroic mirror (13), a semi-transparent and semi-reflective mirror (14), a convex lens (15), an illumination light source (16) and an imaging CCD (17). The semi-transparent and semi-reflective mirror is used to guide the illumination light into the processing light path and the illumination light reflected by the sample surface. The convex lens (15) is used to converge the light to form an image. The CCD (17) is placed at the focal length of the convex lens for sample surface imaging collection. The depth monitoring module is composed of a dichroic mirror (19), a bandpass filter (23), a convex lens (24) and a fiber spectrometer (25). The dichroic mirror (19) is used to selectively pass the returned plasma emission spectrum and illumination light. The bandpass filter (23) is used to further filter the processing light and illumination light reflected back from the sample surface, and pass through the light band where the plasma emission spectrum is located. The convex lens (24) is used to converge the plasma luminescence signal into the fiber spectrometer to collect spectral information.

[0040] The specific processing process includes the following steps:

[0041] Step 1: Surface pretreatment of the three-dimensional curved conformal antenna substrate: Use 280#~2000# sandpaper to mechanically polish the substrate material on one side one by one until there are no obvious scratches under an optical microscope, use a magnetron sputtering coating device to coat the surface with copper, nickel, and gold composite films in sequence, and ultrasonically clean the component to be processed with anhydrous ethanol and blow dry;

[0042] Step 2: clamp the processed sample with a fixed fixture and fix it on a three-degree-of-freedom displacement platform;

[0043] Step 3: Write the surface patterned circuit path of the component to be processed into G code and input it into the control program of the translation stage, and move the translation stage to determine that the focus position is located at the starting point of the processing path.

[0044] Step 4: Adjust the processing optical path to implement patterning processing of heterogeneous material circuits, and control the repetition frequency of the macro pulse / sub-pulse of the processing pulse sequence, the sub-pulse laser energy, the laser pulse width, and the laser center wavelength by adjusting the femtosecond laser, the time domain shaping module, and the frequency domain shaping module; adjust the scanning speed, scanning trajectory, and scanning position by adjusting the high-speed scanning galvanometer and the three-degree-of-freedom displacement stage, control the shaping pulse laser to focus on the processing interface of the film material, and observe the processing morphology in situ through a CCD camera.

[0045] Step 4 specifically includes:

[0046] 1) Adjust the alignment of the optical path of the femtosecond laser processing subsystem, and guide the laser output laser to pass through each device in sequence. The output laser first enters the time / frequency shaping module, and adjusts the position of the acousto-optic programmable dispersion filter to ensure that the incident light is perpendicular to the surface of the acousto-optic crystal. Set the radio frequency signal to make the transducer generate a periodic dispersion-free acoustic field. When the original pulse laser is transmitted to the inside of the acousto-optic crystal, a single pulse can be converted into a pulse sequence with a pulse time interval of 50-2000 femtoseconds. By changing the power of the radio frequency signal, a free high-repetition-rate pulse sequence with arbitrarily adjustable pulse interval and pulse energy is generated. By adjusting the electric switch to control the BBO crystal and the corresponding bandpass filter to insert into the optical path, the laser wavelength of the base frequency pulse sequence is changed to achieve the 515nm wavelength and 5-pulse sequence processing laser with a pulse interval of 1ps required in this embodiment. The output pulse sequence is continuously reflected by the reflectors (9, 12, 18) in turn and enters the high-speed scanning galvanometer system; the aperture (10, 11) is used to collimate the optical path to ensure the normal incidence of the processing laser that finally enters the focusing field mirror of the galvanometer system.

[0047] 2) Adjust the online monitoring module, in the optical monitoring module, the illumination light emitted by the illumination light source (16) located at the top passes through the semi-transparent and semi-reflective mirror (14) and the dichroic mirror (13) to enter the processing light path to illuminate the sample to be processed and reflect, and the reflected illumination light passes through the galvanometer system (20, 21) and the dichroic mirror (13) to return, and is transmitted at the semi-transparent and semi-reflective mirror (14) to reach the industrial imaging camera (17). By adjusting the distance between the industrial imaging camera (17) and the convex lens, the real-time picture taken by the CCD is observed to be a clear image at the laser focusing plane. The laser-induced plasma emission light generated on the sample processing surface passes through the galvanometer system (20, 21) and the dichroic mirror (19) to enter the depth monitoring module, and the bandpass filter (23) selectively passes through the wavelength band of the characteristic plasma emission light of the gold / nickel / copper film, and is converged through the convex lens (24) to enter the optical fiber spectrometer (25), and the characteristic spectrum is read in the computer software, and is calibrated together with the film thickness of the processed sample and the removal depth of a single scan to realize the online monitoring function of the removal depth.

[0048] 3) Samples to be processed such as Figure 1As shown, it is placed on an electric three-axis translation stage, and the Z-axis height of the electric translation stage is adjusted by a computer to make the laser focus plane coincide with the surface of the sample to be processed. In this embodiment, the conformal antenna substrate used in the processing process is a curved composite film layer structure with a total of 4 layers. The base is a 4mm thick peek material, and the upper layer sequence is 8μm copper film, 1μm nickel film and 0.5μm gold film.

[0049] 4) Operate the computer control software to set the required motion trajectory, so that the femtosecond laser can cut / selectively remove the sample to be processed as required to form a conformal antenna surface circuit structure. The specific motion trajectory planning is to focus the shaped pulse laser on the processing interface of the film material, and use the contour trajectory for scanning processing to reduce the overscanning / underscanning caused by the acceleration and deceleration of the galvanometer during the trajectory segmentation process. After the scanning processing of one layer of trajectory is completed, the focus is moved to the starting point of the trajectory, and then the removal depth distance after the z-axis upward scanning of the displacement stage is adjusted as the feed interval in the thickness direction, and the contour trajectory is scanned again. Repeat the above steps until the insulating base layer is processed to complete the patterning of the conformal antenna surface in the entire film layer depth to form the required circuit structure. The central wavelength of the femtosecond laser used in this embodiment is 1030nm, the pulse width is 138fs, and the repetition frequency is 100kHz. The focusing mirror used in this embodiment is a flat field lens with a focal length of 160mm. The laser power in the femtosecond laser direct writing process in this embodiment is 2.1W, and the scanning speed is 1000mm / s. In this embodiment, the contour track processing line spacing during the femtosecond laser layer-by-layer scanning direct writing process is 15 μm, the distance between each layer of tracks (ie, the feed interval in the z-axis direction) is 1 μm, and the number of feed layers is 10.

[0050] Step 5. After the circuit patterning process is completed, the workpiece is ultrasonically cleaned and the physical properties of the processed area are characterized. The processed part exposes the peek substrate, and the surface roughness is Ra = 1.2μm. There is no obvious optical change under the optical microscope, no carbonization, and the Raman spectrum is slightly broadened, indicating that the crystallinity has changed. There is no carbonization / graphitization characteristic peak. XPS analysis shows that the ratio of CC bonds to C=O has no obvious change, indicating that the surface metal film layer is selectively removed, ensuring that the physical properties of the substrate peek material remain unchanged, and achieving the purpose of high-quality femtosecond laser processing of conformal antenna circuits.

[0051] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A circuit patterning method for a three-dimensional conformal antenna based on a cross-scale time-frequency shaping femtosecond laser, characterized in that: The curved conformal antenna substrate consists of two parts: a dielectric layer and a conductive composite film. The dielectric layer is polymer peek, and the energy absorption mechanism has a clear change rule with the change of the laser center wavelength. The conductive composite film is 10μm copper film, 1μm nickel film and 0.5μm gold film, and its ablation threshold has a clear change rule with the change of time domain shaping pulse delay and pulse number. The femtosecond laser is shaped in the time domain and frequency domain, and is divided into a pulse sequence with an interval of 0.1-2ps in time. The central wavelength of the laser is changed in the frequency domain to achieve dual wavelengths of 1030nm and 515nm. The selective removal of the surface circuit of the conformal antenna layer by layer and the high-quality processing of the substrate are achieved by regulating the pulse wavelength, pulse delay and pulse number.

2. The circuit patterning method of the three-dimensional conformal antenna of the time-frequency shaping femtosecond laser as claimed in claim 1, characterized in that: The specific method for achieving layer-by-layer selective removal of the surface circuit of the conformal antenna and high-quality processing of the substrate by regulating the pulse wavelength, pulse delay and pulse number is as follows: based on the change law of the ablation threshold of the metal composite film and the polymer substrate with the change of the time domain shaping pulse delay and the pulse number, the threshold differences of each component under the same conditions are distinguished, and the appropriate time domain shaping femtosecond laser processing parameters are selected for processing according to the change of processing depth; when removing the surface metal composite film, the time domain shaping pulse delay and scanning speed with small threshold differences of different metal films under the same conditions are used for processing to achieve consistency in the removal of heterogeneous materials, and at the same time, the online monitoring module is used to collect the plasma emission spectrum information and optical images of the processing area in real time to obtain the depth information of the metal composite film during the processing; When processing the substrate / metal film contact interface, frequency domain shaping with a small threshold difference under the same conditions is used to change the pulse center wavelength for processing, and the substrate energy absorption mechanism is regulated to achieve carbonization-free processing of the polymer substrate.

3. The device for implementing the method according to any one of claims 1 to 2 is an online processing monitoring device for conformal antenna patterning using a time-frequency shaping femtosecond laser, characterized in that: It includes an ultrafast laser excitation module, a laser pulse time / frequency shaping module, a pulse detection module, a depth online monitoring module, and a focusing high-speed scanning galvanometer module which are sequentially arranged along the laser optical path. The laser pulse time / frequency shaping module includes a programmable dispersion control filter, a birefringent crystal, and a BBO crystal. Based on the crystal acousto-optic effect and optical nonlinear effect, a cross-time domain scale shaped ultrafast laser pulse sequence is generated. The shaping includes the laser center wavelength, the cross-scale time domain interval of the pulse sequence, the laser pulse width, the sub-pulse laser energy, and the repetition frequency of the macro pulse and the sub-pulse. The pulse detection module includes an autocorrelator and a spectrometer. After the time-frequency shaping module, the laser beam is separated proportionally by a beam splitter and then introduced into the detection module for real-time detection of the spectrum information and pulse shape of the regulated shaping pulse sequence and establishment of a parameter library required for processing. The depth online monitoring module includes a 4f optical handling system and a micro-fiber spectrometer, which are used to collect signals of plasma emission spectra of materials in the laser action area during the processing process and obtain depth information of the processing process in real time. The focusing high-speed scanning galvanometer module comprises a high-speed processing galvanometer, a focusing field lens and a three-axis high-precision translation stage, and is used to focus the shaping laser pulse sequence and accurately control the position of the focusing spot to achieve fixed-point removal. The ultrafast laser beam emitted by the laser excitation module forms a processing optical path after passing through a laser time / frequency shaping module, a laser spatial shaping module and a focusing high-speed scanning galvanometer module.

4. A method for high-quality processing of conformal antenna surface circuits using the device as claimed in claim 3, characterized in that: Step 1: Surface pretreatment of the three-dimensional curved conformal antenna substrate: Use 280#~2000# sandpaper to mechanically polish the substrate material on one side one by one until there are no obvious scratches under an optical microscope, use a magnetron sputtering coating device to coat the surface with copper, nickel, and gold composite films in sequence, and ultrasonically clean the component to be processed with anhydrous ethanol and blow dry; Step 2: clamp the processed sample with a fixed fixture and fix it on a three-degree-of-freedom displacement platform; Step 3: Write the surface patterned circuit path of the component to be processed into G code and input it into the control program of the translation stage, and move the translation stage to determine that the focus position is located at the starting point of the processing path. Step 4: Adjust the processing optical path to implement patterning processing of heterogeneous material circuits, and control the repetition frequency of the macro pulse / sub-pulse of the processing pulse sequence, the sub-pulse laser energy, the laser pulse width, and the laser center wavelength by adjusting the femtosecond laser, the time domain shaping module, and the frequency domain shaping module; adjust the scanning speed, scanning trajectory, and scanning position by adjusting the high-speed scanning galvanometer and the three-degree-of-freedom displacement stage, control the shaping pulse laser to focus on the processing interface of the film material, and observe the processing morphology in situ through the CCD camera. Step 5. Adjust the electric translation stage to control the shaped pulse laser to focus on the processing interface of the membrane material, adjust the top imaging subsystem to make the laser focus coincide with the imaging focus position, adjust the computer control software to start the scanning trajectory, monitor the processing depth information through the online monitoring module, and observe the processing morphology in situ through the CCD camera.

5. The processing method according to claim 4, characterized in that: The focusing system is a flat-field lens with a focal length of 160mm. The laser power range is 0.5W-2.5W during femtosecond laser direct writing processing, and the scanning speed range is 1mm / s-1500mm / s. The centerline spacing of the contour trajectory scanning during laser direct writing processing is 5-30μm, and the z-axis feed step is 1μm. The parameters of the femtosecond laser pulse sequence during the processing of the metal composite film are 1030nm central wavelength, 100khz 5-pulse sequence, and sub-pulse interval of 1ps; the femtosecond laser parameters at the contact interface between the polymer substrate and the metal film are 515nm central wavelength, 50khz double pulse sequence, and pulse interval of 2ps.

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