Wire cutting machine

Abstract

The invention relates to the technical field of cutting equipment, in particular to a wire cutting machine. The problem that an existing wire cutting machine is low in machining efficiency is solved. To this end, the wire cutting machine of the present application comprises: a cutting frame; the main roller assembly is used for winding a cutting line to form a line net; the feeding device can be provided with a crystal bar assembly, the crystal bar assembly comprises at least two crystal bars which are bonded together in the feeding direction, and the feeding device is used for driving the crystal bar assembly to be fed towards the wire net; the degumming device is mounted on the cutting frame and can be used for degumming the cut crystal bar; and the discharging device can receive the degummed silicon wafers. According to the wire cutting machine, through the arrangement, multi-bar continuous cutting can be achieved, cutting continues during degumming, silicon wafers obtained after degumming are collected through the discharging device, the silicon wafers are conveyed to the outside of the cutting cavity, a plurality of crystal bars are continuously cut within one period, and therefore the machining efficiency is greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of cutting equipment, and in particular to a wire cutting machine. Background Art

[0002] Wire cutting is a processing method in which the cutting wire is moved back and forth at high speed and moves relative to the workpiece to be cut (such as photovoltaic silicon rods, semiconductors, silicon carbide, sapphire or magnetic materials) to achieve cutting of the workpiece by the cutting wire.

[0003] Taking diamond wire cutting as an example, during the cutting process, the workpiece to be cut is bonded to the crystal tray, which is installed on the feeding device. The feeding device drives the workpiece to be cut to feed in the direction close to the cutting line. After the cutting line completely cuts through the workpiece to be cut, the feeding device drives the workpiece to be cut to retreat to the initial position, and then removes the crystal tray and transports it to the degumming device for degumming operation to separate the slice from the crystal tray. After degumming, the above loading and unloading operations are performed again for the next cutting. The current cutting method requires loading and unloading and degumming operations for each cut, which seriously affects the processing efficiency.

[0004] Accordingly, the art needs a new technical solution to solve the above problems. Summary of the invention

[0005] In order to solve at least one of the above problems in the prior art, that is, to solve the problem of low processing efficiency of the existing wire cutting machine.

[0006] In a first aspect, the present application provides a wire cutting machine, comprising: a cutting frame, in which a cutting chamber is formed; a main roller assembly, which is mounted on the cutting frame, and the main roller assembly is used to wind the cutting wire to form a wire mesh; a feeding device, which is mounted on the cutting frame, and the feeding device can be mounted with a crystal rod assembly, the crystal rod assembly comprising at least two crystal rods bonded together along a feeding direction, and the feeding device is used to drive the crystal rod assembly to feed toward the wire mesh; a degumming device, which is mounted on the cutting frame, and the degumming device can degumming the cut crystal rod; and a unloading device, which can receive the degummed silicon wafer.

[0007] Through the above-mentioned settings, the wire cutting machine of the present application can realize continuous cutting of double-layer silicon rods and multi-layer silicon rods, debond the silicon rods that have been cut first, and continue cutting the silicon rods that have not been cut, and continue cutting while debonding, thereby realizing the new function of cutting and debonding at the same time. The debonded silicon wafers are collected by the unloading device and transported to the outside of the cutting chamber. Multiple crystal rods are continuously cut in one cycle, and the silicon wafers are debonded and unloaded while cutting, thereby greatly improving the processing efficiency of the wire cutting machine.

[0008] In the preferred technical solution of the above-mentioned wire cutting machine, the debonding device is a spray debonding device, and the spray debonding device can spray the debonding liquid toward the glue layer on the crystal rod.

[0009] By adopting the spray degumming device, the degumming efficiency is higher.

[0010] In the preferred technical solution of the above-mentioned wire cutting machine, the spray degumming device comprises:

[0011] A spray pipe connected to a degumming liquid source, the spray pipe extending along the axial direction of the main roller assembly; and a nozzle, one end of the nozzle connected to the spray pipe.

[0012] The combination of the spray pipe and the nozzle is advantageous for obtaining a larger degumming range and improving the degumming effect and degumming efficiency.

[0013] In the preferred technical solution of the above-mentioned wire cutting machine, the spray degumming device also includes a protective component, which is located between the nozzle and the main roller assembly, and the protective component can prevent the degumming liquid sprayed from the nozzle from spraying onto the main roller assembly.

[0014] By arranging a protective component between the nozzle and the main roller assembly, the cutting fluid can be blocked to prevent the cutting fluid from being sprayed onto the main roller assembly, thereby effectively protecting the main roller assembly.

[0015] In the preferred technical solution of the above-mentioned wire cutting machine, the degumming device is arranged in the area enclosed by the wire mesh, and the nozzle is arranged toward the cutting section of the wire mesh.

[0016] By arranging the nozzle toward the cutting section of the wire mesh, the debonding liquid sprayed from the nozzle can be brought into contact with the glue layer on the crystal rod as early as possible, which is beneficial to further improve the processing efficiency.

[0017] In the preferred technical solution of the above-mentioned wire cutting machine, the unloading device includes a collecting member located in the wire net, the collecting member is used to collect the silicon wafers that have completed degumming, and the cutting frame is provided with a discharge port connected to the cutting chamber at a position corresponding to the collecting member, and the collecting member can pass through the discharge port to transport the collected silicon wafers to the outside of the cutting chamber.

[0018] By receiving the debonded silicon wafers through the collecting component, the silicon wafers can be effectively protected during the transportation of the silicon wafers, thereby preventing the silicon wafers from colliding with the cutting frame.

[0019] In the preferred technical solution of the above-mentioned wire cutting machine, the unloading device also includes a first driving component, and the first driving component can drive the collecting component to move back and forth along the feeding direction.

[0020] By setting the first driving component to drive the collecting member to move back and forth in the feeding direction, during the degumming operation, the first driving component drives the collecting member to move so that the distance between the collecting member and the silicon wafer is within a safe distance range. When the silicon wafer falls into the collecting member, the silicon wafer can be prevented from being damaged. After receiving the silicon wafer, the collecting member is driven to move to the position of the discharge port.

[0021] In the preferred technical solution of the above-mentioned wire cutting machine, the unloading device also includes a track, a part of which passes through the discharge port and extends into the cutting chamber, the collecting member is located on the track and can move along the track, and the first driving assembly can drive the track to reciprocate along the feeding direction.

[0022] By setting a track and moving the collecting component along the track, the collecting component can be moved along a fixed line, thereby preventing the collecting component from colliding with the cutting frame during the movement.

[0023] In the preferred technical solution of the above-mentioned wire cutting machine, the unloading device also includes a lifting seat and a guide mechanism, the track is installed on the lifting seat, the first driving assembly is connected to the lifting seat and can drive the lifting seat to reciprocate along the feeding direction, and the guide mechanism is used to guide the lifting seat.

[0024] By providing a guide mechanism to guide the lifting seat, the accuracy of movement of the track and the collecting component on the lifting seat can be ensured, thereby avoiding the situation where the collecting component touches the crystal rod and the wire mesh, which is safer and more reliable.

[0025] In the preferred technical solution of the above-mentioned wire cutting machine, the unloading device also includes a second driving component installed on the track, and the second driving component can drive the collecting member to move along the track from the discharge port to the outside of the cutting chamber.

[0026] The collecting member is moved to the outside of the cutting chamber by the second driving assembly, so as to realize automatic material unloading, thereby further improving the processing efficiency.

[0027] In the preferred technical solution of the above-mentioned wire cutting machine, the unloading device also includes a moving cart, the collecting component is placed on the moving cart, the moving cart is located on the track, and the second driving assembly is connected to the moving cart and can drive the moving cart to move along the track.

[0028] By setting up a mobile cart and installing the collecting component on the mobile cart, there is no need to connect the collecting component to the second driving assembly. When unloading, the collecting component and the silicon wafer can be removed from the mobile cart together, which is beneficial to further improve the processing efficiency and avoid damage to the silicon wafer.

[0029] In the preferred technical solution of the above-mentioned wire cutting machine, the second driving assembly includes a second driving mechanism, a sprocket and a chain meshing with the sprocket, the chain is connected to the moving trolley, and the second driving mechanism is connected to the sprocket and can drive the sprocket to rotate.

[0030] Through such an arrangement, a combination of chains and sprockets is adopted, so that the collecting component can move more stably, with high transmission reliability, simple structure, easy maintenance and small space occupation.

[0031] In the preferred technical solution of the above-mentioned wire cutting machine, the unloading device also includes a clamping mechanism, and the clamping mechanism is used to clamp the silicon wafer located on the collecting member.

[0032] By setting up a clamping mechanism to clamp the silicon wafer in the collecting component, the debonded silicon wafer can be stably clamped, so that the silicon wafer can fall smoothly into the collecting component to prevent the silicon wafer from tilting. The silicon wafer can also be prevented from tipping over during the movement of the collecting component, which is conducive to the stable transfer of the silicon wafer.

[0033] In the preferred technical solution of the above-mentioned wire cutting machine, the clamping mechanism includes two clamping assemblies arranged opposite to each other, and the two clamping assemblies can move relative to each other in a direction approaching / moving away from each other to clamp / loosen the silicon wafer.

[0034] Through the above arrangement, the two clamping assemblies can move simultaneously, which is more efficient.

[0035] In the preferred technical solution of the above-mentioned wire cutting machine, the clamping assembly includes an airbag and a clamping plate, and one side of the clamping plate is connected to the airbag.

[0036] By adopting the airbag, the clamping assembly has appropriate elasticity, which can avoid damage to the silicon wafer caused by excessive clamping force.

[0037] In the preferred technical solution of the above-mentioned wire cutting machine, an elastic buffer structure is provided on the other side of the clamping plate.

[0038] By providing an elastic buffer structure on the clamping plate, damage to the silicon wafer caused by excessive clamping force can be further avoided, better protection can be provided for the silicon wafer, and it is more conducive to ensuring the quality of the silicon wafer.

[0039] In the preferred technical solution of the above-mentioned wire cutting machine, the clamping assembly also includes an air pump, and the air pump is connected to the airbag.

[0040] By arranging the air pump to be connected with the airbag, the air pump can quickly inflate the airbag and also quickly exhaust air, thereby further improving the processing efficiency.

[0041] In the preferred technical solution of the above-mentioned wire cutting machine, the wire cutting machine also includes a water retaining device, which is installed at the discharge port and arranged around the track to prevent the cutting fluid in the cutting chamber from overflowing from the gap between the discharge port and the track.

[0042] By installing a water retaining device at the discharge port, the cutting fluid can be blocked to prevent the cutting fluid from overflowing and polluting the working environment of the wire cutting machine, and also to avoid waste.

[0043] In the preferred technical solution of the above-mentioned wire cutting machine, the water retaining device includes a first water retaining member, which is located above the track, the bottom of the first water retaining member abuts against the top surface of the track, and the first water retaining member can reciprocate along the feeding direction with the track.

[0044] By arranging the first water retaining member above the track, the cutting fluid in the cutting chamber can be prevented from overflowing from the gap between the top surface of the track and the discharge port. The first water retaining member can also reciprocate along the feed direction together with the track. During the movement of the track, the first water retaining member can also play a role in blocking water. In addition, the bottom of the first water retaining member abuts against the top surface of the track. When the discharge port needs to be opened, it is only necessary to lift the first water retaining member without any other operation, which is conducive to further improving work efficiency.

[0045] In the preferred technical solution of the above-mentioned wire cutting machine, the water retaining device also includes a second water retaining member, which is located below the track, the top of the second water retaining member is connected to the bottom surface of the track, and the second water retaining member can be extended and retracted with the reciprocating movement of the track.

[0046] By arranging a second water retaining member under the track, the cutting fluid in the cutting chamber can be prevented from overflowing from the gap between the bottom surface of the track and the discharge port. The second water retaining member can also extend and retract with the rise and fall of the track. During the movement of the track, the second water retaining member can also play a role in water retaining, preventing the cutting fluid in the cutting chamber from overflowing from the gap between the bottom surface of the track and the discharge port.

[0047] In the preferred technical solution of the above-mentioned wire cutting machine, the water retaining device also includes a third water retaining component, which is located on the side of the track and connected to the side of the track. The third water retaining component can reciprocate along the feeding direction with the track.

[0048] By arranging a third water retaining member on the side of the track, the cutting fluid in the cutting chamber can be prevented from overflowing from the gap between the side of the track and the discharge port. The third water retaining member can also reciprocate along the feed direction together with the track. During the movement of the track, the third water retaining member can also play a water retaining role, which can prevent the cutting fluid in the cutting chamber from overflowing from the gap between the side of the track and the discharge port.

[0049] In a preferred technical solution of the above-mentioned wire cutting machine, the water retaining device further includes a guide member, and the guide member is used for guiding during the movement of the first water retaining member, the second water retaining member and the third water retaining member.

[0050] The first water retaining member, the second water retaining member and the third water retaining member are guided by the guide member so that the first water retaining member, the second water retaining member and the third water retaining member will not deviate during the movement, thereby achieving a more reliable water retaining effect.

[0051] In the preferred technical solution of the above-mentioned wire cutting machine, the water retaining device also includes a fixed frame fixedly connected to the cutting frame, the guide member and the second water retaining member are installed on the fixed frame, a water receiving groove is provided at the bottom of the fixed frame, and the bottom of the guide member and the bottom of the second water retaining member are both connected to the water receiving groove.

[0052] By arranging a water receiving groove at the bottom of the fixing frame and connecting the bottom of the guide member and the second water retaining member to the water receiving groove, the water receiving groove can collect the cutting fluid blocked by the second water retaining member and the cutting fluid that may flow onto the guide member, thereby preventing the cutting fluid from overflowing to the outside and achieving a better waterproof effect.

[0053] In the preferred technical solution of the above-mentioned wire cutting machine, the wire cutting machine also includes a flow guide component, and the flow guide component is used to receive part of the cutting fluid during the cutting process and / or the feeding process.

[0054] By providing a guide component to receive dripping cutting fluid, the cutting fluid can be prevented from falling onto the first drive component located below the track, thereby effectively protecting the first drive component and preventing the cutting fluid from contaminating the working environment of the wire cutting machine.

[0055] In the preferred technical solution of the above-mentioned wire cutting machine, the guide component is connected to the cutting chamber so as to guide the received cutting fluid back to the cutting chamber.

[0056] By connecting the flow guide component with the cutting chamber, the received cutting fluid can be guided back into the cutting chamber to avoid wasting the cutting fluid.

[0057] In the preferred technical solution of the above-mentioned wire cutting machine, the guide assembly includes a first guide plate installed on the moving vehicle, and a first collecting port is provided on the top of the first guide plate, and the cutting fluid can enter the first guide plate through the first collecting port.

[0058] By arranging a first guide plate on the moving trolley, during the process of removing the collecting component from the moving trolley, the first guide plate can receive the cutting fluid dripping from the collecting component to prevent the cutting fluid from dripping to other places. In addition, when the collecting component is located inside the cutting chamber, the first guide plate can also rise with the collecting component to receive the cutting fluid dripping from above, thereby playing a role of buffering the cutting fluid and preventing the cutting fluid from splashing everywhere.

[0059] In the preferred technical solution of the above-mentioned wire cutting machine, a first guide opening is provided on the first guide plate, and the cutting fluid in the first guide plate can flow out from the first guide opening and drip onto the track or the bottom of the cutting chamber.

[0060] By setting the first guide opening on the first guide plate, when the first guide plate moves to the outside of the cutting chamber with the moving vehicle, the cutting fluid in the first guide plate can flow directly onto the track and flow back into the cutting chamber along the track. There is no need to set a drain pipe to connect the first guide plate with the cutting chamber. The structure is simpler and it is beneficial to reduce costs.

[0061] In the preferred technical solution of the above-mentioned wire cutting machine, the guide assembly also includes a guide box installed on the track, a second guide opening is provided on the track, the guide box is located below the track and is connected to the second guide opening, and the guide box is connected to the cutting chamber through a drain pipe.

[0062] By arranging a guide box at the bottom of the track beam and arranging a second guide opening connected to the guide box, it is helpful to collect the cutting fluid on the track beam and avoid the cutting fluid from accumulating on the track beam.

[0063] In the preferred technical solution of the above-mentioned wire cutting machine, the guide assembly also includes a second guide plate installed on the side of the track, and a second collecting port is provided on the top of the second guide plate. The cutting fluid dripping from the collecting component during the unloading process can pass through the second collecting port into the second guide plate.

[0064] By arranging a second guide plate on the side of the track beam, the receiving area of ​​the guide assembly can be expanded to receive more cutting fluid.

[0065] In the preferred technical solution of the above-mentioned wire cutting machine, the main roller assembly includes a first main roller and a second main roller, the first main roller and the second main roller are spaced apart along the feed direction, the number of the first main rollers is two and they are spaced apart along a direction perpendicular to the feed direction, and the degumming device is located between the first main roller and the second main roller.

[0066] In the preferred technical solution of the above-mentioned wire cutting machine, the wire cutting machine also includes a guide cover located between the two first main rollers, the guide cover extends along the axial direction of the first main roller, and the guide cover is penetrated along the feeding direction so that the crystal rod can pass through the guide cover.

[0067] By arranging a flow guide hood that penetrates vertically between the two first main rollers, the flow guide hood can collect the cutting fluid and guide the cutting fluid toward the bottom of the cutting chamber to prevent the cutting fluid from falling onto the first main rollers.

[0068] In the preferred technical solution of the above-mentioned wire cutting machine, the number of the second main rollers is two and they are distributed at intervals along a direction perpendicular to the feeding direction.

[0069] In a preferred technical solution of the above-mentioned wire cutting machine, the horizontal spacing between the two second main rollers is greater than the horizontal spacing between the two first main rollers.

[0070] By increasing the horizontal spacing between the two second main rollers, the space for arranging the unloading device can be further increased, which is beneficial for collecting the debonded silicon wafers and moving the silicon wafers to the outside of the cutting chamber.

[0071] In the preferred technical solution of the above-mentioned wire cutting machine, the wire cutting machine also includes a debris box located between the two second main rollers, the debris box extends along the length direction of the second main roller, the bottom of the debris box is closed, and the top of the debris box has an opening allowing the crystal rod to pass through.

[0072] By arranging a debris box with a closed bottom between the two second main rollers, the cutting liquid dripping from above can be collected to prevent the cutting liquid from dripping onto the wire mesh at the bottom of the second main rollers, thereby reducing the occurrence of wire skipping.

[0073] In the preferred technical solution of the above-mentioned wire cutting machine, the debris box is provided with a water baffle, and the debris box is provided with water baffles extending toward the outside of the debris box on both sides along the width direction thereof, and the water baffles are located above the second main roller.

[0074] By arranging a water baffle plate extending toward the outside of the debris box on the debris box, the water baffle plate is located above the second main roller, which is more conducive to preventing the cutting liquid from dripping onto the second main roller and improving the protection effect of the main roller assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] The wire cutting machine of the present application is described below with reference to the accompanying drawings. In the accompanying drawings:

[0076] Figure 1 This is a schematic diagram of the structure of the wire cutting machine of this application;

[0077] Figure 2 The structure diagram of the cutting assembly of this application is shown in FIG. Figure 1 ;

[0078] Figure 3 The structure diagram of the cutting assembly of this application is shown in FIG. Figure 2 ;

[0079] Figure 4 It is a schematic diagram of the structure of the debris box device of the present application;

[0080] Figure 5 This is a schematic diagram of the structure of the spray degumming device of the present application;

[0081] Figure 6 The structure diagram of the cutting assembly of this application is shown in FIG. Figure 3 ;

[0082] Figure 7 The structure diagram of the cutting assembly of this application is shown in FIG. Figure 4 ;

[0083] Figure 8 The structure diagram of the cutting assembly of this application is shown in FIG. Figure 5 ;

[0084] Fig. 9 The structure diagram of the cutting assembly of this application is shown in FIG. Figure 6 ;

[0085] Fig.10 This is a schematic diagram of the structure of the track, mobile trolley and chain of the cutting assembly of the present application;

[0086] Fig.11 This is a schematic diagram of the structure of the chain of the second drive assembly of the present application;

[0087] Fig.12 The structure diagram of the water retaining device of this application is shown in FIG. Figure 1 ;

[0088] Fig.13 The structure diagram of the water retaining device of this application is shown in FIG. Figure 2 ;

[0089] Fig.14 A cross-sectional view of the water retaining device of the present application;

[0090] Fig.15 A top view of a guide plate of the water retaining device of the present application;

[0091] Fig.16 This is a top view of the water retaining block of the water retaining device of the present application.

[0092] Reference numerals list

[0093] 10. cutting frame; 11. discharging port; 13. first main roller; 14. second main roller; 15. wire net; 16. collecting member; 17. crystal rod; 161. receiving surface;

[0094] 20. Feeding device;

[0095] 21. air deflector; 22. debris box; 211. long board; 212. short board; 213. hanging ear; 2111. flange structure; 221. water retaining plate; 222. box bottom plate; 223. box side plate; 2211. first water retaining flange; 2212. second water retaining flange; 2221. connecting flange; 2222. connecting column;

[0096] 3. Spray degumming device; 31. Spray pipe; 32. Nozzle; 33. Protective component; 331. First protective plate; 332. Second protective plate;

[0097] 41. track; 42. mobile trolley; 43. sprocket; 44. chain; 45. second motor; 46. driving pulley; 47. driven pulley; 48. synchronous belt; 49. storage box; 411. horizontal guide rail; 412. strip groove; 4121. straight line segment; 4122. arc segment; 441. body; 442. rotating shaft; 443. roller;

[0098] 51. lifting seat; 52. first motor; 53. lifting machine; 54. guide column; 55. linear bearing; 56. fixed seat;

[0099] 6. Clamping assembly; 61. Airbag; 62. Clamping plate; 621. Elastic buffer pad;

[0100] 7. Water retaining device; 71. First water retaining member; 72. Second water retaining member; 73. Third water retaining member; 74. Guide plate; 75. Fixing frame; 711. First water retaining plate; 712. Second water retaining plate; 713. Connecting plate; 714. Third water retaining plate; 741. First guide groove; 742. Second guide groove; 743. Guide rib; 731. Third guide groove; 751. Water receiving trough;

[0101] 81. First guide plate; 82. Second guide plate; 83. Guide box; 811. First bottom plate; 812. First side plate; 813. First end plate; 814. First guide opening; 821. Second bottom plate; 822. Second side plate; 823. Second end plate. DETAILED DESCRIPTION

[0102] The preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the protection scope of the present application.

[0103] It should be noted that in the description of this application, the terms "left", "right", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for the convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of this application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0104] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installation", "setting", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0105] Specifically, the present application provides a wire cutting machine, such as Figure 1 As shown, the wire cutting machine of the present application includes a cutting assembly, a feeding device 20 and a winding assembly (not shown in the figure).

[0106] The cutting assembly includes a plurality of main rollers and a main roller motor for driving the main rollers to rotate. The plurality of main rollers are generally arranged in parallel and located in the cutting chamber of the wire cutting machine. The plurality of main roller motors are respectively connected to the corresponding main roller drive, and the main roller motors can drive the respective main rollers to rotate. Cutting wires are arranged on the main rollers, and the cutting wires are spirally arranged on the plurality of main rollers at a certain distance to form a wire net 15. The multi-wire cutting work is realized by grinding between the wire net 15 and the crystal rod 17.

[0107] It should be noted that the number of main rollers can be three or four, etc. Correspondingly, the number of main roller motors used to drive the main rollers to rotate can also be three or four, etc. Such adjustments and changes to the specific number of main rollers do not deviate from the principle and scope of the present application and should be limited within the protection scope of the present application.

[0108] The winding assembly includes a wire-reeling and wire-unwinding mechanism and a tension mechanism. The wire-reeling and wire-unwinding mechanism is used for releasing and rewinding the cutting wire. There are two wire-reeling and wire-unwinding mechanisms, which are located on both sides of the cutting assembly. During operation, one is used for releasing the cutting wire and the other is used for rewinding the cutting wire. The tension mechanism is used for controlling the tension of the cutting wire to ensure that the entire cutting wire is stretched and tightened during operation.

[0109] Among them, the wire-reeling and wire-winding mechanism includes a wire roller and a wire roller motor for driving the wire roller to rotate. The cutting wire is wound on the wire roller. When the wire roller motor drives the wire roller to rotate forward, the wire roller is in a wire-reeling state. When the wire roller motor drives the wire roller to rotate reversely, the wire roller is in a wire-reeling state.

[0110] Among them, the tension mechanism includes a tension swing rod, a tension guide wheel and a swing rod motor for driving the tension swing rod to swing. The bottom end of the tension swing rod is fixedly connected to the output shaft of the swing rod motor, and the tension guide wheel is rotatably installed on the top end of the tension swing rod.

[0111] It should be noted that the winding assembly includes, in addition to the above-mentioned wire-reeling and wire-releasing mechanism and tension mechanism, a wire-arranging mechanism and a steering wheel mechanism, wherein the wire-arranging mechanism is installed between the wire roller and the tension mechanism, and is used to arrange the cutting wire on the wire roller at a certain pitch, and the steering wheel mechanism is installed between the tension mechanism and the main roller, and is used to change the direction of the cutting wire so that the cutting wire can be smoothly wound on the main roller. The wire-cutting machine of the present application can adopt any structural form of the wire-arranging mechanism and the steering wheel mechanism used in the prior art.

[0112] In order to solve the problem of low cutting efficiency of existing wire cutting machines, the present application provides a new cutting assembly, such as Figure 1 , Figure 2 , Figure 3 and Figure 7 As shown, the cutting assembly of the present application includes a cutting frame 10 , a feeding device, and a main roller assembly and a degumming device installed on the cutting frame 10 .

[0113] Among them, a cutting chamber is formed in the cutting frame 10, and a discharge port 11 connected to the cutting chamber is provided on the cutting frame 10. The main roller assembly is located in the cutting chamber. Each main roller in the main roller assembly is rotatably arranged between two side walls of the cutting frame 10 arranged opposite to each other. The cutting wire is wound around the main roller assembly to form a wire net 15. A feed opening connected to the cutting chamber is formed at the top of the cutting frame 10. The feeding device 20 of the wire cutting machine is installed at the feed opening at the top and can make feeding movements in the vertical direction.

[0114] It should be noted that the feeding direction is not limited to the vertical direction, for example, the feeding direction may also be horizontal or oblique. The technical solution of the present application will be further described below by taking the feeding direction in the vertical direction as an example.

[0115] The feeding device 20 can be equipped with a crystal rod assembly, such as Figure 3As shown, the crystal rod assembly includes multiple crystal rods 17 bonded together in the vertical direction, the feeding device 20 is used to feed the crystal rod assembly toward the wire mesh 15, the wire mesh 15 can cut the crystal rod into multiple silicon wafers, the degumming device can degumming the cut silicon wafers, and the unloading device can receive the degummed silicon wafers and transport the silicon wafers to the outside of the cutting chamber.

[0116] It should be noted that, in actual applications, those skilled in the art may also install only one crystal rod on the feeding device 20 .

[0117] Preferably, if Figure 3 and Figure 7 As shown, the unloading device includes a collecting member 16, which is located in the cutting chamber and corresponds to the discharge port 11. More specifically, the collecting member 16 is located in the space surrounded by the wire mesh 15. The collecting member 16 is used to collect the silicon wafers that have completed degumming, and the collecting member 16 can pass through the discharge port 11 to transport the collected silicon wafers to the outside of the cutting chamber.

[0118] It should be noted that multiple crystal rods 17 (for example, two, three or four, etc.) are bonded together along the feeding direction to form a crystal rod assembly. Adjacent crystal rods 17 are bonded by glue to form a glue layer. The axes of all crystal rods 17 are arranged in the vertical direction. The feeding device 20 drives the crystal rod assembly to feed the wire mesh 15. During the feeding process, multiple crystal rods 17 are cut into multiple silicon wafers in turn by the wire mesh 15, thereby improving the cutting efficiency.

[0119] Preferably, if Figure 2 and Figure 3 As shown, the main roller assembly of the present application includes a first main roller 13 and a second main roller 14. The first main roller 13 and the second main roller 14 are spaced apart along the feed direction. The number of the first main rollers 13 is two and they are spaced apart along a direction perpendicular to the feed direction. The number of the second main rollers 14 is two and they are spaced apart along a direction perpendicular to the feed direction.

[0120] The plane where the axes of the two first main rollers 13 are located is perpendicular to the feeding direction, and the plane where the axes of the two second main rollers 14 are located is also perpendicular to the feeding direction. For example, if the feeding direction is a vertical direction, the two first main rollers 13 are spaced apart in the horizontal direction and are located at the same level, and the two second main rollers 14 are also spaced apart in the horizontal direction and are located at the same level.

[0121] That is to say, the main roller assembly of the present application includes four main rollers arranged in parallel, wherein two first main rollers are located at the top, and two second main rollers are located at the bottom, an upper wire mesh is formed between the two first main rollers 13, and a lower wire mesh is formed between the two second main rollers 14. The upper wire mesh is used to cut the crystal rod 17, and can also be called a cutting section. The collecting component 16 is located between the upper wire mesh and the lower wire mesh, and is used to collect silicon wafers.

[0122] It should be noted that the number of the second main rollers 14 is not limited to the two mentioned above. For example, only one second main roller may be provided.

[0123] In addition, it should be noted that the present application does not limit the specific structural form of the collecting component 16. For example, those skilled in the art may set the collecting component 16 as a shell structure ( Figure 7 The collecting member 16 shown in the figure is a shell structure), or the collecting member 16 can also be set as a frame structure ( Figure 8 The collecting component 16 shown in the figure is a frame structure), or alternatively, the collecting component 16 can also be set as a flat plate structure, etc. Such adjustments and changes to the specific structural form of the collecting component 16 do not deviate from the principle and scope of the present application and should be limited within the protection scope of the present application.

[0124] Preferably, if Figure 3 As shown, the wire web wrap angle of the first main roller 13 and / or the wire web wrap angle of the second main roller 14 is not less than 80°.

[0125] By limiting the wire mesh wrap angle of the main rollers (the first main roller 13 and the second main roller 14) to not less than 80°, it is possible to ensure that there is sufficient friction between the main rollers and the wire mesh 15, avoiding wire jumping and slipping, and ensuring the normal operation of the main roller assembly.

[0126] Among them, Figure 3 As shown, taking the first main roller 13 as an example, there are two tangent points between the cutting line and the first main roller 13, and the angle α between the line between the two tangent points and the axis of the first main roller 13 is the wire mesh wrap angle of the first main roller 13, or it can also be understood as the angle corresponding to the contact arc length of the cutting line and the first main roller 13, and the same is true for the second main roller 14.

[0127] Preferably, if Figure 7 As shown, the collecting member 16 of the present application is a shell with a closed bottom and surroundings, and the top of the shell has an opening allowing the crystal rod 17 to pass through.

[0128] That is to say, the bottom and sides of the shell are closed. By setting the collecting member 16 as a closed shell, some cutting fluid can be injected into the shell. When the silicon wafer falls into the shell, the cutting fluid can play a buffering role to prevent the silicon wafer from being damaged.

[0129] Exemplarily, the collecting member 16 is a rectangular shell with a receiving cavity formed inside the shell to receive the silicon wafers after cutting. The top of the receiving cavity is open, and the cut silicon wafers can directly fall into the receiving cavity of the shell after debonding.

[0130] Preferably, if Figure 3As shown, the horizontal distance between the two second main rollers 14 is greater than the horizontal distance between the two first main rollers 13 .

[0131] By increasing the horizontal distance between the two second main rollers 14 , the collecting member 16 has a larger installation space, which is convenient for arrangement, collection of silicon wafers and transportation of the silicon wafers to the outside of the cutting chamber.

[0132] Preferably, if Figures 2 to 4 As shown, the cutting assembly of the present application further comprises a chip box device, which is installed in the cutting chamber.

[0133] The debris box device is fixedly connected to the cutting frame 10 , the main body of the debris box device is also located in the space surrounded by the wire mesh 15 , and the collecting member 16 is located in the debris box device.

[0134] Preferably, if Figure 3 and Figure 4 As shown, the debris box device of the present application includes a flow guide cover 21 and a debris box 22 located below the flow guide cover 21 .

[0135] The top and bottom of the air deflector 21 are both open, the air deflector 21 is located between the two first main rollers 13 , the debris box 22 is located between the two second main rollers 14 , and the collecting component 16 is located in the debris box 22 .

[0136] That is to say, the guide cover 21 is through-through from top to bottom. Such an arrangement allows the crystal rod 17 to pass through the guide cover 21. The guide cover 21 and the debris box 22 both extend along the axial direction of the first main roller 13. The guide cover 21 is located below the upper wire mesh and is mainly used to guide the cutting liquid. The cutting liquid can drip into the debris box 22 along the inner wall of the guide cover 21 to prevent the cutting liquid from flowing onto the first main roller 13. The two ends of the debris box 22 in the length direction are preferably set to be open, so that the cutting liquid in the debris box 22 can flow back to the bottom of the cutting chamber and allow the collecting member 16 to pass through. The bottom of the debris box 22 is closed, which can prevent the cutting liquid from dripping onto the wire mesh located at the bottom of the second main roller 14.

[0137] Preferably, if Figure 3 and Figure 4 As shown, the debris box 22 of the present application is provided with water baffles 221 extending toward the outside of the debris box 22 on both sides along the width direction thereof, and the water baffles 221 are located above the second main roller 14 .

[0138] By providing the water baffle plate 221 on the chip box 22 and positioning the water baffle plate 221 above the second main roller 14 , it is possible to prevent the cutting liquid from dripping onto the second main roller 14 .

[0139] Preferably, if Figure 3 and Figure 4As shown, the top opening of the air deflector 21 is larger than the bottom opening of the air deflector 21 .

[0140] By increasing the size of the top opening of the flow guide cover 21 , more cutting fluid can enter the flow guide cover 21 , and at the same time, it is more conducive to the crystal rod 17 to pass through the flow guide cover 21 smoothly.

[0141] For example, Figure 4 As shown, the air guide 21 includes two relatively arranged long plates 211 and two relatively arranged short plates 212, and the short plates 212 are provided with hanging ears 213, and the hanging ears 213 are fixedly connected to the inner wall of the cutting chamber. The two long plates 211 and the two short plates 212 together form a box structure, and the cross-section of the box structure is rectangular. The top ends of the two long plates 211 are respectively provided with a flange structure 2111 extending obliquely outward, thereby increasing the size of the top opening of the air guide 21.

[0142] Preferably, if Figure 3 and Figure 4 As shown, the water baffle 221 of the present application is arranged to be inclined upward in a direction away from the debris box 22 .

[0143] By arranging the water baffle plate 221 at an angle, the cutting fluid can flow smoothly into the debris box 22. In addition, the lateral space occupied by the debris box 22 can be reduced, making it easier to arrange.

[0144] For example, Figure 3 As shown, two water baffles 221 are provided on the top of the debris box 22. The water baffle 221 on the left is inclined toward the upper left, and the water baffle 221 on the right is inclined toward the upper right. The two water baffles 221 are arranged in an inverted "eight" shape to converge the cutting fluid dripping from the top into the debris box 22.

[0145] Preferably, if Figure 3 and Figure 4 As shown, the edge of the water retaining plate 221 of the present application is provided with a water retaining structure extending upward.

[0146] By arranging a water retaining structure at the edge of the water retaining plate 221 and extending the water retaining structure upward, it is possible to ensure that the cutting fluid on the water retaining plate 221 flows smoothly to the debris box 22 .

[0147] It should be noted that the water retaining structure can be a flange formed by bending the edge of the water retaining plate upward, or it can be set as a raised water retaining rib, etc. Such adjustments and changes to the specific structural form of the water retaining structure do not deviate from the principle and scope of the present application, and should be limited within the scope of protection of the present application.

[0148] Preferably, if Figure 3 and Figure 4As shown, the water retaining structure of the present application includes two first water retaining flanges 2211 that are spaced apart from each other. The first water retaining flanges 2211 extend from one end of the water retaining plate 221 away from the debris box 22 to the top of the debris box 22 .

[0149] That is to say, each of the two edges distributed along the length direction of the water retaining plate 221 is provided with a first water retaining flange 2211 , and the first water retaining flange 2211 extends along the width direction of the water retaining plate 221 , extending from the top of the water retaining plate 221 to the top of the debris box 22 .

[0150] Preferably, if Figure 3 and Figure 4 As shown, the first water retaining flange 2211 of the present application is arranged vertically to the water retaining plate 221 .

[0151] By vertically arranging the first water retaining flange 2211 and the water retaining plate 221 , a better water retaining effect can be achieved.

[0152] Preferably, if Figure 3 and Figure 4 As shown, the water retaining structure of the present application further includes a second water retaining flange 2212 located between the two first water retaining flanges 2211 , and the extension direction of the second water retaining flange 2212 is perpendicular to the extension direction of the first water retaining flange 2211 .

[0153] That is to say, the second water retaining flange 2212 extends along the length direction of the water retaining plate 221 , and the two ends of the second water retaining flange 2212 are preferably respectively connected to the two first water retaining flanges 2211 , so that the water retaining plate 221 can be surrounded, and the water retaining effect is better.

[0154] Preferably, if Figure 3 and Figure 4 As shown, the second water retaining flange 2212 of the present application is inclined toward the outside of the debris box 22 .

[0155] By arranging the second water retaining flange 2212 to be inclined outward, the water retaining plate 221 can receive more cutting fluid.

[0156] The inclination angle (the angle with the vertical direction) of the second water retaining flange 2212 is smaller than the inclination angle of the water retaining plate 221 . For example, the inclination angle of the water retaining plate 221 is 45 degrees, and the inclination angle of the second water retaining flange 2212 is 10 degrees.

[0157] Preferably, if Figure 4 As shown, the debris box 22 of the present application includes a box bottom plate 222 and two oppositely arranged box side plates 223, the bottom of the box side plates 223 is fixedly connected to or integrally arranged with the box bottom plate 222, and the water retaining plate 221 extends from the top of the box side plates 223 toward the outside of the debris box 22.

[0158] For example, Figure 4 As shown, the box bottom plate 222 is a rectangular plate and is horizontally arranged, the two box side plates 223 are also rectangular plates and are spaced apart along the width direction of the box bottom plate 222, the two box side plates 223 are vertically arranged and respectively connected to the two sides of the width direction of the box bottom plate 222, the collecting member 16 is located between the two box side plates 223, and the top of each box side plate 223 is provided with a water retaining plate 221 extending outwardly and obliquely, the debris box 22 is open at both ends along the length direction, and a downwardly bent connecting flange 2221 is respectively provided at both ends of the box bottom plate 222, and a horizontally extending connecting column 2222 is provided on the connecting flange 2221, and the connecting column 2222 is fixedly connected to the cutting frame 10, and the two ends of the second water retaining flange 2212 are also fixedly connected to the cutting frame 10, for example, by screws.

[0159] Preferably, if Figure 1 and Figure 3 As shown, the degumming device of the present application is arranged between the first main roller and the second main roller, and is also located between the guide cover 21 and the debris box 22. When the crystal rod 17 is cut or is close to being cut, the degumming device is started to degumming the crystal rod 17, so that the crystal rod 17 falls into the collecting component 16 below.

[0160] In the technical solution of the present application, by arranging a debonding device and a collecting component 16 on the cutting frame 10, the debonding and collection of the cut crystal rod 17 can be achieved without stopping the machine during the cutting process, which is beneficial to greatly improve the cutting efficiency of the wire cutting machine and reduce the process flow.

[0161] It should be noted that the present application does not limit the specific type of the degumming device. For example, those skilled in the art may use a laser degumming device or a spray degumming device.

[0162] In a first preferred embodiment, Figure 5 and Figure 6 As shown, the degumming device of the present application is configured as a spray degumming device 3. The spray degumming device 3 is connected to the cutting frame 10, and is used to spray the degumming liquid on the crystal rod 17, so that the cut crystal rod 17 is degummed. In the present application, the degumming liquid can be selected according to the specific type of the adhesive layer, and those skilled in the art can flexibly select. For example, when the adhesive layer uses a water-soluble adhesive, the degumming liquid can be selected from pure water, tap water or cutting fluid, etc.

[0163] Furthermore, if Figure 3 , Figure 5 and Figure 6 As shown, the spray degumming device 3 of the present application includes a spray assembly connected to the cutting frame 10 , the spray assembly is connected to the degumming liquid source, and the spray assembly is used to spray the degumming liquid onto the crystal rod 17 .

[0164] The spray assembly is located between the first main roller 13 and the second main roller 14 . When the crystal rod 17 is cut or nearly cut, the spray debonding device 3 is started to spray the cutting liquid toward the adhesive layer of the crystal rod 17 .

[0165] It should be noted that the present application does not limit the structural form of the spray assembly. For example, a person skilled in the art may configure the spray assembly as a spray pipe + nozzle structure, or a spray pipe with spray holes, or a spray shower structure, and so on.

[0166] Furthermore, if Figure 3 and Figure 5 As shown, the spray assembly of the present application includes a spray pipe 31 and a nozzle 32 connected to the cutting frame 10 , the spray pipe 31 is connected to the degumming liquid source, and one end of the nozzle 32 is connected to the spray pipe 31 .

[0167] For example, Figure 3 and Figure 5 As shown, the spray pipe 31 is located between the first main roller 13 and the second main roller 14, and is arranged closer to the first main roller 13. The spray pipe 31 extends along the axial direction of the first main roller 13. After the spray degumming device 3 is started, the degumming liquid from the degumming liquid source enters the spray pipe 31, and then is sprayed out by the nozzle 32 to the adhesive layer of the crystal rod 17.

[0168] The water flow sprayed from the nozzle 32 is a conical jet surface, and the taper of the conical jet surface is preferably 60°, which has a larger coverage range and is conducive to improving processing efficiency.

[0169] Furthermore, if Figure 3 and Figure 5 As shown, the nozzle 32 is arranged towards the cutting section of the wire web 15 .

[0170] The cutting section of the wire web 15 refers to the wire web between the two first main rollers 13, and this section of the wire web is used for cutting. Figure 3 Seen from above, the cutting section of the wire web 15 is located above the nozzle 32, so the nozzle 32 is arranged to be inclined upward.

[0171] By arranging the nozzle 32 toward the cutting section of the wire mesh 15 , the debonding liquid sprayed from the nozzle 32 can be brought into contact with the glue layer on the crystal rod 17 as early as possible, which is beneficial to improving the processing efficiency.

[0172] It should be noted that the present application does not limit the angle between the nozzle 32 and the horizontal direction (i.e., the inclination angle of the nozzle 32). For example, those skilled in the art may set the angle between the nozzle 32 and the horizontal direction to 20°, 50°, or 70°, etc.

[0173] Furthermore, if Figure 3 As shown, the angle between the nozzle 32 and the horizontal direction is 30° to 60°.

[0174] By limiting the included angle between the nozzle 32 and the horizontal direction to 30° to 60°, the nozzle 32 can cover a larger degumming range, thereby further improving the processing efficiency.

[0175] The angle between the nozzle 32 and the horizontal direction is the angle between the axis direction of the nozzle 32 and the horizontal direction.

[0176] It should be noted that the present application does not limit the specific number of nozzles 32. For example, a technician in this field may set multiple nozzles 32 in actual applications, or may only set one nozzle 32. When setting one nozzle 32, it is preferred to set a sliding mechanism to move the nozzle 32 back and forth along the length direction of the collecting component 16.

[0177] Furthermore, if Figure 5 As shown, there are multiple nozzles 32 , and the multiple nozzles 32 are distributed at intervals along the length direction of the spray pipe 31 .

[0178] The spray pipe 31 extends along the length direction of the collecting member 16 , and a plurality of nozzles 32 are spaced apart along the length direction of the spray pipe 31 . The distance between two adjacent nozzles 32 can be determined according to the coverage range of the nozzles 32 .

[0179] Furthermore, if Figure 3 As shown, there are two spray pipes 31 and they are spaced apart in the horizontal direction.

[0180] Among them, the two spray pipes 31 are respectively located on both sides of the width direction of the collecting component 16, and the nozzles 32 on the two spray pipes 31 are arranged opposite to each other, and both spray toward the side close to the collecting component 16. In this way, degumming can be achieved from two directions at the same time, thereby greatly improving the degumming efficiency.

[0181] It should be noted that, in the present application, the length direction of the collecting member 16 is parallel to the axial direction of the first main roller 13 , and the width direction of the collecting member 16 is perpendicular to the axial direction of the first main roller 13 and along the horizontal direction.

[0182] Furthermore, if Figure 3 and Figure 5 As shown, the spray degumming device 3 of the present application further includes a protective component 33, which is located between the spray assembly and the main roller assembly. The protective component 33 can prevent the degumming liquid sprayed from the spray assembly from being sprayed onto the main roller assembly.

[0183] By providing a protective component 33 between the spray assembly and the main roller assembly, the cutting liquid can be blocked to prevent the cutting liquid from being sprayed onto the main roller assembly, thereby effectively protecting the main roller assembly.

[0184] Specifically, Figure 3 As shown, the protective component 33 is located between the nozzle 32 and the first main roller 13, and can effectively protect the first main roller 13. When two spray pipes 31 are provided, the number of the protective components 33 is also two, and the two protective components 33 are respectively located between the corresponding nozzle 32 and the first main roller 13 to protect both first main rollers 13.

[0185] Furthermore, the protection component 33 is connected to the spray pipe 31 .

[0186] For example, Figure 5 and Figure 6 As shown, both ends of the spray pipe 31 are fixedly mounted on the cutting frame 10 through connectors, and the protective component 33 is fixedly mounted on the spray pipe 31 .

[0187] It should be noted that, in actual applications, technical personnel in this field can connect the protective component 33 to the cutting frame 10 through a connecting piece, and fix the spray pipe 31 on the protective component 33. Alternatively, the protective component 33 and the spray pipe 31 can be set as a split type, and the protective component 33 can be directly connected to the cutting frame 10 through a connecting piece, and so on.

[0188] Of course, the present application preferably connects the protective component 33 and the spray pipe 31 together, and then installs them together on the cutting frame 10. This is beneficial for ensuring a stable positional relationship between the protective component 33 and the nozzle 32, thus providing better protection, and improving assembly efficiency.

[0189] Furthermore, if Figure 3 As shown, the top of the protection member 33 extends to the air deflector 21 .

[0190] By extending the top of the protective component 33 to the air deflector 21 , there is no gap between the two in the vertical direction, which can achieve a better protective effect.

[0191] It should be noted that, in practical applications, the top of the protective component 33 can be connected to the bottom of the air deflector 21, or the top of the protective component 33 can be connected to the side of the air deflector 21, that is, the two partially overlap in the vertical direction.

[0192] Furthermore, if Figure 3 and Figure 5As shown, the protective component 33 of the present application includes a first protective plate 331, which is located above the spray pipe 31, and the extension direction of the cross-section of the first protective plate 331 is inclined toward the wire mesh between the two first main rollers 13, and the first protective plate 331 is located between the nozzle 32 and the first main roller 13.

[0193] Compared with setting the first guard plate 331 horizontally or vertically, by setting the first guard plate 331 upwardly, the influence on the spray range of the nozzle 32 can be reduced, and the vertical space occupied by the first guard plate 331 can be reduced, which is convenient for arrangement. It is preferred that the top of the first guard plate 331 extends to the guide cover 21. In addition, the first guard plate 331 extends along the length direction of the spray pipe 31, and the length of the first guard plate 331 is preferably greater than or equal to the length of the spray pipe 31.

[0194] Furthermore, the angle between the first guard plate 331 and the horizontal direction is greater than the angle between the nozzle 32 and the horizontal direction.

[0195] That is to say, the inclination direction of the first guard plate 331 is not parallel to the inclination direction of the nozzle 32, and the inclination angle of the first guard plate 331 is greater than the inclination angle of the nozzle 32. In this way, the influence on the spraying range of the nozzle 32 can be further reduced or even eliminated, ensuring that the nozzle 32 has the largest spraying range.

[0196] The specific value of the angle between the extension direction of the cross section of the first guard plate 331 and the extension direction of the nozzle 32 can be determined through experiments.

[0197] Furthermore, if Figure 3 and Figure 5 As shown, the protective component 33 of the present application also includes a second protective plate 332, which is located on the side of the spray pipe 31 away from the nozzle 32, and the top of the second protective plate 332 is fixedly connected to or integrally arranged with the bottom of the first protective plate 331, and the extension direction of the cross-section of the second protective plate 332 intersects with the extension direction of the cross-section of the first protective plate 331.

[0198] That is to say, the second guard plate 332 extends downward from the bottom of the first guard plate 331, so that the cutting liquid reflected from the crystal rod 17 can be prevented from splashing onto the wire mesh 15 between the first main roller 13 and the second main roller 14. In addition, the degumming liquid blocked by the first guard plate 331 can also be guided to the bottom of the cutting chamber.

[0199] Furthermore, if Figure 3 and Figure 5 As shown, the second guard plate 332 is arranged in the vertical direction.

[0200] By arranging the second guard plate 332 in the vertical direction, the second guard plate 332 can have a maximum protection range.

[0201] It should be noted that, in actual applications, those skilled in the art may also set the second guard plate 332 to be tilted downward toward the side close to the nozzle 32, so as to Figure 3 Looking from above, the second guard plate 332 on the left side is tilted toward the lower right, and the second guard plate 332 on the right side is tilted toward the lower left. This is more conducive to guiding the cutting liquid to the bottom of the cutting chamber and preventing the cutting liquid from dripping onto the second main roller 14.

[0202] In addition, it should be noted that the protective component 33 includes a first protective plate 331 and a second protective plate 332. Only the first protective plate 331 or the second protective plate 332 can be connected to the spray pipe 31, or the first protective plate 331 and the second protective plate 332 can be connected to the spray pipe 31 at the same time.

[0203] In the second preferred embodiment, the degumming device of the present application is a laser generator, and there are two laser generators, which are respectively located on both sides of the width direction of the collecting component 16. A sliding mechanism is arranged between the two side walls opposite to the length direction of the cutting frame 10 and the collecting component 16. The sliding mechanism uses an electric cylinder, and the two laser generators are respectively fixed on the corresponding sliding mechanisms.

[0204] During the debonding process, two electric cylinders drive two laser generators to move along the length direction of the collecting component 16. The two laser generators respectively emit lasers from both sides of the crystal rod assembly to the same glue layer, and use the cavitation effect of the laser to destroy the chemical bonds of the glue, causing cavitation inside the glue layer to produce tiny holes. The liquid can quickly enter the glue layer, causing the glue layer to fall off from the silicon wafer, ultimately achieving debonding of the silicon wafer.

[0205] Of course, the specific setting mode of the above-mentioned laser generator is not static, and those skilled in the art can adjust it so that the present application is applicable to more specific application scenarios. For example, the laser generator can also be fixedly set or rotated around the rotating shaft, etc., instead of being movable. When it is fixed, it is necessary to set multiple laser generators, or control the laser range generated by the laser generator to be sufficient to make the entire glue layer fall off. For another example, the number of laser generators can be set at least one, and of course more can be set. In addition to being distributed on both sides of the collecting member 16, the setting position of the laser generator can also be located on the same side, or on the outside of the two ends of the length direction of the collecting member 16. Of course, being located on the same side or on the outside of the two ends of the length direction of the collecting member 16 will not be conducive to achieving rapid degumming. For another example, in addition to using an electric cylinder, the sliding mechanism can also use a cylinder or a hydraulic cylinder.

[0206] Preferably, if Figure 7 and Figure 8As shown, the unloading device of the present application further includes a first driving assembly, which can drive the collecting member 16 to move up and down in a vertical direction.

[0207] By setting the first driving assembly to drive the collecting member 16 to move up and down, it is convenient to adjust the vertical distance between the collecting member 16 and the crystal rod 17 according to specific circumstances, which is conducive to safely collecting silicon wafers and preventing the silicon wafers from being damaged due to the excessive distance between the collecting member 16 and the crystal rod 17.

[0208] It should be noted that the present application does not limit the specific structural form of the first drive component. For example, a person skilled in the art may set the first drive component to be a motor drive component, a hydraulic drive component, or a pneumatic drive component, etc. Such adjustments and changes to the specific structural form of the first drive component do not deviate from the principle and scope of the present application and should be limited within the protection scope of the present application.

[0209] Preferably, if Figure 2 , Figures 7 to 11 As shown, the unloading device of the present application further includes a second driving assembly, which can drive the collecting member 16 to move from the discharge port 11 to the outside of the cutting chamber.

[0210] When all the debonded silicon wafers fall into the collecting member 16, the second driving assembly drives the collecting member 16 through the discharge port 11 and moves to the outside of the cutting chamber.

[0211] It should be noted that the present application does not limit the specific structural form of the second drive component. For example, a person skilled in the art may set the second drive component to be a motor drive component, a hydraulic drive component or a pneumatic drive component, etc. Such adjustment and change to the specific structural form of the second drive component does not deviate from the principle and scope of the present application and should be limited within the protection scope of the present application.

[0212] Preferably, if Figures 7 to 10 As shown, the unloading device of the present application also includes a track 41 and a moving cart 42, wherein the collecting member 16 is placed on the moving cart 42, the moving cart 42 is located on the track 41, a portion of the track 41 passes through the discharge port 11 and extends into the cutting chamber, and the second driving assembly is connected to the moving cart 42 and can drive the moving cart 42 to move along the track 41.

[0213] For example, Figure 3 , Figures 7 to 10As shown, the second driving assembly is installed on the track 41, and a horizontal guide rail 411 is provided on the track 41. The second driving assembly can drive the moving trolley 42 to move along the horizontal guide rail 411. A fragment box 22 is installed between the two second main rollers 14. The discharge port 11 on the cutting frame 10 is arranged opposite to the fragment box 22. The track 41 is arranged horizontally, and a part of the track 41 passes through the discharge port 11 and extends into the fragment box 22. The first driving assembly is located outside the cutting chamber and is supported under another part of the track 41. Driven by the first driving assembly, the track 41, the moving trolley 42, the second driving assembly and the collecting member 16 move up and down together. The discharge port 11 is rectangular and extends in the vertical direction, allowing the track 41 to move up and down. Wheels are installed on both sides of the bottom of the moving trolley 42, so that the moving trolley 42 can move smoothly on the horizontal guide rail 411.

[0214] When the silicon wafer falls into the collecting component 16, the first driving component drives the track 41 and the second driving component on the track 41, the moving cart 42 and the collecting component 16 to move downward. After moving to the set initial position, the first driving component stops running, and the second driving component is started to pull the moving cart 42 and the collecting component 16 on the moving cart 42 to move along the track 41 and pass through the discharge port 11 to the outside of the cutting chamber, and then the collecting component 16 and the silicon wafer on the collecting component 16 are removed from the moving cart 42, and then an empty collecting component 16 is placed on the moving cart 42, and the collecting component 16 removed from the moving cart 42 is transferred to a special wafer taking station, and then the silicon wafer is taken out of the collecting component 16.

[0215] It should be noted that, in actual applications, those skilled in the art may cancel the provision of the moving trolley 42 . In this case, the second driving assembly may be directly connected to the collecting member 16 .

[0216] Preferably, if Figure 7 and Figure 8 As shown, the unloading device of the present application also includes a lifting seat 51 and a guiding mechanism. The track 41 is installed on the lifting seat 51. The first driving assembly is connected to the lifting seat 51 and can drive the lifting seat 51 to move up and down in the vertical direction. The guiding mechanism is used to guide the lifting seat 51.

[0217] For example, Figure 7 and Figure 8As shown, the unloading device of the present application also includes a fixed seat 56, which is fixedly connected to the cutting frame 10, and the lifting seat 51 is fixedly installed at the bottom of the track 41. The guide mechanism includes a plurality of vertically arranged guide columns 54 and a linear bearing 55 sleeved on each guide column 54. The top of the guide column 54 is fixedly connected to the lifting seat 51, and the linear bearing 55 and the first driving assembly are fixedly installed on the fixed seat 56. In the process of the first driving assembly driving the lifting seat 51 to move up and down, the guide column 54 slides up and down in the linear bearing 55 to guide the lifting seat 51.

[0218] It should be noted that the guide mechanism is not limited to the combination of the guide column 54 and the linear bearing 55 introduced above. For example, the linear bearing 55 can be replaced by a guide cylinder, or the guide mechanism can be set to a structural form in which a guide groove formed on the cutting frame 10 cooperates with a guide block provided on the lifting seat 51, etc. Such adjustments and changes to the specific structural form of the guide mechanism do not deviate from the principle and scope of the present application, and should be limited within the protection scope of the present application.

[0219] In addition, it should be noted that the fixing seat may be omitted. In this case, the first driving assembly and the guide mechanism may be installed on the base of the wire cutting machine.

[0220] In addition, it should be noted that the present application does not limit the structural form of the first drive component. For example, a person skilled in the art may set the first drive component to be a motor drive component, a hydraulic drive component or a pneumatic drive component, etc. Such adjustments and changes to the specific structural form of the first drive component do not deviate from the principle and scope of the present application and should be limited within the protection scope of the present application.

[0221] Preferably, if Figure 7 and Figure 8 As shown, the first driving assembly of the present application includes a first motor 52 and a lift 53 connected to a lifting seat 51 , and the first motor 52 is drivingly connected to the lift 53 .

[0222] Exemplarily, the lift 53 is a ball screw lift, and the first motor 52 drives the lift seat 51 to move up and down through the ball screw lift.

[0223] It should be noted that the lift 53 is not limited to the above-mentioned ball screw lift, for example, a worm gear screw lift may also be used.

[0224] Preferably, if Figures 7 to 11 As shown, the second drive assembly of the present application includes a second drive mechanism, a sprocket 43 and a chain 44 meshing with the sprocket 43, the chain 44 is connected to the moving trolley 42, and the second drive mechanism is connected to the sprocket 43 and can drive the sprocket 43 to rotate.

[0225] When the collecting member 16 needs to be moved outside the cutting chamber, the second driving mechanism drives the sprocket 43 to rotate, and the sprocket 43 moves with the chain 44, and the chain 44 pulls the moving trolley 42 and the collecting member 16 on the moving trolley 42 to move together.

[0226] For example, Figure 7 and Figure 8 As shown, the sprocket 43 is pivotally mounted on the track 41 and is located at the outer end of the track 41 (from Figure 7 The second drive mechanism is also mounted on the track 41, and the right end of the chain 44 is connected to the outer end of the moving trolley 42 (from the left end). Figure 7 The left end (as viewed from above) is fixedly connected.

[0227] It should be noted that the present application does not limit the structural form of the second drive mechanism. For example, a person skilled in the art may set the second drive mechanism to be in the structural form of a motor + gear transmission group, or to be in the structural form of a motor + synchronous belt transmission group, etc. Such adjustments and changes to the specific structural form of the second drive mechanism do not deviate from the principle and scope of the present application, and should be limited within the protection scope of the present application.

[0228] Preferably, if Figure 7 and Figure 8 As shown, the second driving mechanism of the present application includes a second motor 45, a driving pulley 46, a driven pulley 47 and a synchronous belt 48 for connecting the driving pulley 46 and the driven pulley 47. The driving shaft of the second motor 45 is connected to the driving pulley 46, and the driven pulley 47 is installed on the sprocket 43.

[0229] For example, Figure 7 and Figure 8 As shown, the second motor 45 is fixedly mounted at the bottom of the track 41, the driving shaft of the second motor 45 is horizontally arranged, specifically extending along the width direction of the track 41, the driving pulley 46 is fixedly mounted on the driving shaft, the driven pulley 47 is fixedly mounted on the side of the sprocket 43, and the driving pulley 46 and the driven pulley 47 are connected by a synchronous belt 48. The second motor 45 drives the driving pulley 46 to rotate, and the driving pulley 46 drives the driven pulley 47 and the sprocket 43 to rotate synchronously through the synchronous belt 48.

[0230] Preferably, if Figures 9 to 11As shown, the chain 44 of the present application includes a plurality of pivotally connected chain monomers, the chain monomers including a body 441, a rotating shaft 442 horizontally installed in the body 441 and rollers 443 installed at both ends of the rotating shaft 442. A chain guide is also provided on the track 41, and the chain guide includes two strip grooves 412 spaced apart along the width direction of the track 41, and the side where the two strip grooves 412 are close to each other is open, and the roller 443 is located in the strip groove 412, and the size of the strip groove 412 along the vertical direction matches the size of the roller 443 along the vertical direction to confine the roller 443 in the strip groove 412.

[0231] For example, Figures 9 to 11 As shown, the chain monomer extends along the length direction of the track 41, and two adjacent chain monomers are pivotally connected. A mounting hole is provided in the middle position of each chain monomer, and the mounting hole extends along the width direction of the track 41. The rotating shaft 442 is installed in the mounting hole and can rotate. Two strip grooves 412 are provided on the track 41, and the two strip grooves 412 are spaced apart along the width direction of the track 41. The chain 44 is located between the two strip grooves 412, and the sides of the two strip grooves 412 that are close to each other are open, that is, the strip grooves 412 are spaced apart from each other. 2 is approximately C-shaped, so that the roller 443 can extend into the corresponding strip groove 412, and the size of the strip groove 412 along the vertical direction, that is, the distance between the top wall and the bottom wall of the strip groove 412 matches the height of the roller 443. In this way, the chain 44 also has the function of pushing the moving cart 42. After the silicon wafer on the collecting member 16 is taken out, the moving cart 42 and the collecting member 16 on the moving cart 42 can be pushed back into the cutting chamber by the chain 44 under the drive of the second driving mechanism.

[0232] Preferably, if Figure 7 As shown, the strip groove 412 on the track 41 includes a straight segment 4121 and an arc segment 4122 , one end of the straight segment 4121 is connected to the top of the arc segment 4122 , and the arc segment 4122 is arranged corresponding to the sprocket 43 .

[0233] For example, Figure 7 As shown, the arc segment 4122 is located at the outer end of the track 41 , the sprocket 43 is located between the two arc segments 4122 , and the other end of the chain 44 extends out from the bottom end of the arc segment 4122 .

[0234] Preferably, if Figure 7 and Figure 8 As shown, the second driving assembly of the present application further includes a storage box 49 for storing the chain 44. The storage box 49 is located below the sprocket 43, and the top of the storage box 49 has an opening for allowing the chain 44 to pass through.

[0235] By providing a storage box 49 below the sprocket 43 , the chain 44 extending from the bottom end of the arc segment 4122 enters the storage box 49 , thereby preventing the chain 44 from swinging at will.

[0236] Preferably, if Fig. 9 As shown, the unloading device of the present application further includes a clamping mechanism installed on the collecting member 16 , and the clamping mechanism is used to clamp the crystal rod 17 located on the collecting member 16 .

[0237] Clamping the silicon wafer by a clamping mechanism can prevent the silicon wafer from tipping over, thereby avoiding damage to the silicon wafer.

[0238] It should be noted that the present application does not limit the structural form of the clamping mechanism. For example, a person skilled in the art may set the clamping mechanism to be a motor clamping mechanism, a hydraulic clamping mechanism or a pneumatic clamping mechanism, etc. Such adjustments and changes to the specific structural form of the clamping mechanism do not deviate from the principle and scope of the present application and should be limited within the protection scope of the present application.

[0239] Preferably, if Fig. 9 As shown, the clamping mechanism of the present application includes two clamping components 6 arranged opposite to each other, and the two clamping components 6 can generate relative movement in the direction of approaching / moving away from each other to clamp / loosen the silicon wafer.

[0240] Exemplarily, the two clamping assemblies 6 are arranged opposite to each other along the width direction of the collecting member 16. When the silicon wafer falls into the collecting member 16, the two clamping assemblies 6 move relative to each other in a direction approaching each other, thereby clamping the silicon wafer in the collecting member 16. When the second driving assembly moves the collecting member 16 to the outside of the cutting chamber and transfers the collecting member 16 and the silicon wafer to a special wafer taking station, the two clamping assemblies 6 move in a direction away from each other, thereby loosening the silicon wafer, and then taking out the silicon wafer in the collecting member 16.

[0241] It should be noted that the two clamping assemblies 6 may also be arranged relative to each other along the length direction of the collecting member 16. Of course, it is preferred that the two clamping assemblies 6 are arranged relative to each other along the width direction of the collecting member 16. This arrangement is less likely to cause damage to the silicon wafer.

[0242] Preferably, if Fig. 9 As shown, the clamping assembly 6 of the present application includes an airbag 61 , an air pump (not shown in the figure) connected to the airbag 61 , and a clamping plate 62 , one side of the clamping plate 62 is connected to the airbag 61 .

[0243] Exemplarily, the airbag 61 is fixedly mounted on the inner side wall of the collecting member 16 distributed along the width direction, the airbag 61 is connected to the air pump through an air pipe, the clamping plate 62 is fixedly connected to the inner side of the airbag 61, the clamping plate 62 is located between the silicon wafer and the airbag 61, and can provide rigid support for the silicon wafer, for example, it is set to a rectangular steel plate, etc., the clamping plate 62 extends along the length direction of the collecting member 16, and the length of the clamping plate 62 is slightly larger than the length of the crystal rod 17. When the silicon wafer in the collecting member 16 needs to be clamped, the air pumps of the two clamping assemblies 6 inflate their respective airbags 61 respectively, so that the two clamping plates 62 move toward the silicon wafer at the same time to clamp the silicon wafer. When the silicon wafer needs to be taken out, the exhaust valve on the airbag 61 can be opened to discharge the gas in the airbag 61, thereby loosening the silicon wafer.

[0244] It should be noted that the airbag 61 can realize the clamping and loosening functions by switching between positive pressure and negative pressure modes, or a spring can be installed inside the airbag 61 or between the airbag 61 and the collecting member 16, and the airbag 61 can be expanded by positive pressure to clamp the silicon wafer, and the airbag 61 can be compressed by the spring to loosen the silicon wafer after the air supply is stopped, etc. Such flexible adjustments and changes do not deviate from the principles and scope of the present application and should be limited within the scope of protection of the present application.

[0245] Preferably, if Fig. 9 As shown, the other side (ie, the inner side) of the clamping plate 62 of the present application is provided with an elastic buffer structure.

[0246] By providing an elastic buffer structure on the inner side surface (the side surface close to the silicon wafer) of the clamping plate 62, the silicon wafer can be better protected and prevented from being damaged.

[0247] It should be noted that the present application does not limit the specific structural form of the elastic buffer structure. For example, the elastic buffer structure can be set as a plurality of elastic point-shaped protrusions, or as an elastic buffer pad, etc.

[0248] Preferably, if Fig. 9 As shown, the elastic buffer structure of the present application is an elastic buffer pad 621 .

[0249] Exemplarily, the elastic buffer pad 621 is made of polyurethane material.

[0250] Preferably, if Figure 2 and Figure 7 As shown, the cutting assembly of the present application further includes a water retaining device 7 , which is installed at the discharge port 11 to prevent the cutting fluid in the cutting chamber from overflowing from the discharge port 11 .

[0251] The water retaining device 7 is arranged around the track 41 of the feeding device to prevent the cutting fluid in the cutting chamber from overflowing from the gap between the discharge port 11 and the track 41 . The water retaining device 7 can move up and down in the vertical direction along with the track 41 .

[0252] It should be noted that, in actual applications, those skilled in the art may configure the water retaining device 7 as an integral annular structure, which is arranged around the track 41, or may configure the water retaining device 7 to include a plurality of split water retaining structures, which are respectively arranged on the top, bottom and sides of the track 41, etc. Such flexible adjustments and changes do not deviate from the principles and scope of the present application, and should be limited within the scope of protection of the present application.

[0253] Preferably, if Figure 7 , Figure 12 to Figure 14 As shown, the water retaining device 7 of the present application includes a first water retaining member 71, which is located above the track 41, and the bottom of the first water retaining member 71 abuts against the top surface of the track 41. The first water retaining member 71 can move up and down in the vertical direction together with the track 41.

[0254] Through such an arrangement, when the discharge port 11 needs to be opened, it is only necessary to lift up the first water retaining member 71 without any other operations, thereby improving work efficiency.

[0255] The first water retaining member 71 rests against the top surface of the track 41 under the action of its own weight. When the track 41 rises, the track 41 lifts the first water retaining member 71 up together. When the track 41 descends, the first water retaining member 71 descends together with the track 41 under the action of its own weight.

[0256] Preferably, if Figure 7 , Figure 12 to Figure 14 As shown, the water retaining device 7 of the present application further includes a second water retaining member 72 , which is located below the track 41 , and the top of the second water retaining member 72 is connected to the bottom surface of the track 41 , and the second water retaining member 72 can be extended and retracted as the track 41 rises and falls.

[0257] Among them, the bottom of the second water retaining member 72 is fixed. When the track 41 rises, the second water retaining member 72 stretches and lengthens with the rise of the track 41, closing the part of the discharge port 11 located below the track 41. When the track 41 descends, the second water retaining member 72 is compressed and shortened.

[0258] Preferably, if Figure 7 , Figure 12 to Figure 14As shown, the water retaining device 7 of the present application further includes a third water retaining member 73 , which is located on the side of the track 41 , connected to the side of the track 41 , and can move up and down in the vertical direction together with the track 41 .

[0259] Among them, the first water retaining component 71, the second water retaining component 72 and the third water retaining component 73 are three independent components, which are respectively used to retain water on the top, bottom and sides of the track 41. When the first driving component drives the track 41 to move up and down, the first water retaining component 71, the second water retaining component 72 and the third water retaining component 73 can all move up and down with the track 41. In this way, during the cutting process, the discharge port 11 is always in a closed state, and the water retaining effect is better.

[0260] Preferably, if Figure 12 to Figure 14 As shown, the water retaining device 7 of the present application further includes a guide member, which is used to guide the first water retaining member 71 , the second water retaining member 72 and the third water retaining member 73 during their up and down movement.

[0261] The first water retaining member 71, the second water retaining member 72 and the third water retaining member 73 are guided by the guide member so that the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73 will not deviate during the up and down movement, thereby achieving a more stable water retaining effect.

[0262] It should be noted that the present application does not limit the specific structural forms of the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73. For example, they can be set as water retaining plates, water retaining blocks or water retaining covers, etc., as long as they can achieve the water retaining effect.

[0263] In addition, it should be noted that, in actual applications, those skilled in the art may install the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73 inside the cutting chamber, or may install the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73 between the track 41 and the inner wall of the discharge port 11, or may install the first water retaining member 71, the second water retaining member 72 and the third water retaining member 73 outside the cutting chamber, etc. Such flexible adjustments and changes do not deviate from the principle and scope of the present application, and should be limited within the scope of protection of the present application.

[0264] Preferably, if Figures 12 to 15 As shown, the guide member of the present application is provided with a first guide groove 741 on the side facing the track 41 . The first guide groove 741 extends in the vertical direction, and the edge of the first water retaining member 71 is located in the first guide groove 741 .

[0265] For example, Figures 12 to 15 As shown, the guide member and the first water retaining member 71 are both located outside the cutting chamber, the guide member includes two vertically arranged guide plates 74, the two guide plates 74 are respectively located on both sides of the track 41, and the guide plate 74 is provided with a vertically extending first guide groove 741 on the side facing the track 41, the left edge and the right edge of the first water retaining member 71 are respectively located in the corresponding first guide groove 741, the width of the first guide groove 741 matches the thickness of the edge of the first water retaining member 71, and the first water retaining member 71 is guided by the first guide groove 741, which is beneficial to prevent the cutting fluid on the inner side of the first water retaining member 71 from flowing along the edge of the first water retaining member 71 to the outer side of the first water retaining member 71, and the waterproof effect is better.

[0266] Preferably, if Figures 12 to 15 As shown, the guide member of the present application is provided with a second guide groove 742 on the side facing the track 41 . The second guide groove 742 extends in the vertical direction, and the edge of the second water retaining member 72 is located in the second guide groove 742 .

[0267] For example, Figures 12 to 15 As shown, the second water retaining member 72 is also located outside the cutting chamber, and the guide plate 74 is further provided with a second guide groove 742 extending vertically on the side facing the track 41, and the left edge and the right edge of the second water retaining member 72 are respectively located in the corresponding second guide groove 742. The first guide groove 741 and the second guide groove 742 can be located on the same vertical plane, and the bottom end of the first guide groove 741 is connected to the top end of the second guide groove 742, or, as shown in FIG. Fig.15 As shown, the first guide groove 741 and the second guide groove 742 can be staggered in the horizontal direction.

[0268] Preferably, if Figures 12 to 16 As shown, the guide component of the present application is provided with a guide rib 743 on the side facing the track 41, and the guide rib 743 extends in the vertical direction. The third water retaining component 73 is provided with a third guide groove 731 at a position corresponding to the guide rib 743, and the guide rib 743 is adapted to the third guide groove 731.

[0269] For example, Figures 12 to 16As shown, the first guide groove 741 and the second guide groove 742 on the guide plate 74 are spaced apart in the horizontal direction, and the portion between the first guide groove 741 and the second guide groove 742 forms a guide rib 743. A portion of the third water retaining member 73 is located between the side of the track 41 and the side wall of the discharge port 11, and is in contact with the side wall of the discharge port 11. Another portion of the third water retaining member 73 is located outside the cutting chamber and between the track 41 and the guide plate 74. A vertically extending third guide groove 731 is provided at this portion. The guide rib 743 is located in the third guide groove 731, and while playing a guiding role, it can also play a waterproof role.

[0270] Preferably, the first water blocking member 71 of the present application is located outside the cutting chamber.

[0271] By arranging the first water retaining member 71 outside the cutting chamber, when the collecting member 16 needs to be moved outside the cutting chamber, it is convenient to lift the first water retaining member 71 to open the discharge port 11, that is, the first water retaining member 71 is equivalent to a door, closing the portion of the discharge port 11 above the track 41. When the discharge port 11 needs to be opened, the first water retaining member 71 can be lifted manually, automatically or semi-automatically.

[0272] Preferably, if Figure 12 to Figure 14 As shown, the first water retaining member 71 of the present application includes a vertically arranged first water retaining plate 711, a vertically arranged second water retaining plate 712, and a connecting plate 713 for connecting the first water retaining plate 711 and the second water retaining plate 712. The first water retaining plate 711 and the second water retaining plate 712 are spaced apart along the length direction of the track 41, and the first water retaining plate 711 is located between the second water retaining plate 712 and the cutting frame 10.

[0273] By arranging the first water retaining plate 711 and the second water retaining plate 712 spaced apart along the length direction of the track 41 , double protection can be formed, and the water retaining effect is better.

[0274] For example, Figure 12 to Figure 14 As shown, the top of the first water baffle plate 711 and the second water baffle plate 712 are connected by a horizontally arranged connecting plate 713, and the two sides of the first water baffle plate 711 and the second water baffle plate 712 are respectively connected by a vertically arranged connecting plate 713, the width of the second water baffle plate 712 is greater than the width of the first water baffle plate 711, and the edge of the second water baffle plate 712 is located in the first guide groove 741.

[0275] Preferably, if Fig.10 and Fig.12As shown, the horizontal guide rail 411 on the track 41 is a track groove formed on the top surface of the track 41, and the first water retaining member 71 also includes a third water retaining plate 714, which is installed on the second water retaining plate 712. The third water retaining plate 714 can move up and down relative to the second water retaining plate 712 so that the bottom of the third water retaining plate 714 can abut against the bottom wall of the track groove.

[0276] Under normal working conditions, there is relatively little cutting fluid on the track 41, and the bottom of the third water baffle 714 is flush with or slightly higher than the bottom of the second water baffle 712. When there is relatively much cutting fluid on the track 41, the third water baffle 714 can be moved downward so that the bottom of the third water baffle 714 passes over the bottom of the second water baffle 712 and abuts against the bottom wall of the track groove on the track 41 to block the cutting fluid and prevent it from flowing outward, thereby achieving a better water-blocking effect.

[0277] For example, Fig.10 As shown, two track grooves are formed on the top surface of the track 41, and the two track grooves are spaced apart along the width direction of the track 41, as shown in FIG. Fig.12 As shown, the third water baffle 714 is arranged in an inverted U shape, which can be inserted into the two track grooves.

[0278] Preferably, if Figure 12 to Figure 14 As shown, the second water retaining member 72 of the present application is an accordion shield, and the top of the accordion shield is fixedly connected to the bottom surface of the track 41.

[0279] Among them, the accordion shield can be stretched / compressed in the vertical direction, and the bottom end of the accordion shield is fixed. When the track 41 rises, the accordion shield stretches and becomes longer as the track 41 rises, closing the part of the discharge port 11 located below the track 41. When the track 41 descends, the accordion shield is compressed and shortened.

[0280] It should be noted that, in actual applications, those skilled in the art may install the accordion guard inside the cutting chamber, or may install the accordion guard between the track 41 and the bottom wall of the discharge port 11, or may install the accordion guard outside the cutting chamber. Such adjustments and changes to the specific installation position of the accordion guard do not deviate from the principle and scope of the present application, and should be limited within the protection scope of the present application.

[0281] Preferably, the accordion shield of the present application is located outside the cutting chamber.

[0282] Preferably, if Figure 12 to Figure 14As shown, the water retaining device 7 of the present application also includes a fixing frame 75 fixedly connected to the cutting frame 10, the guide member and the second water retaining member 72 are installed on the fixing frame 75, and a water receiving groove 751 is provided at the bottom of the fixing frame 75, and the bottom of the guide member and the bottom of the second water retaining member 72 are both connected to the water receiving groove 751.

[0283] For example, Figure 12 to Figure 14 As shown, the fixing frame 75 is located outside the cutting chamber, and a flange is provided on one side of the fixing frame 75 close to the cutting frame 10, and the flange is fixedly connected to the cutting frame 10 by bolts, and the bottom end of the accordion shield is fixedly connected to the inner bottom wall of the water receiving tank 751, and the cutting fluid blocked by the accordion shield can flow along the accordion shield into the water receiving tank 751, effectively preventing the cutting fluid from flowing out. Further, two guide plates 74 are fixedly mounted on the fixing frame 75, and the first guide groove 741 and the second guide groove 742 provided on the guide plate 74 are both connected to the water receiving tank 751 on the fixing frame 75, and if there is cutting fluid entering the first guide groove 741 and the second guide groove 742, it will also flow into the water receiving tank 751, effectively preventing the cutting fluid from flowing out.

[0284] Preferably, if Figures 12 to 16 As shown, the third water retaining member 73 of the present application includes two water retaining blocks, and the two water retaining blocks are respectively located on both sides of the track 41 .

[0285] That is to say, a water retaining block is installed on the left and right sides of the track 41, for example, the water retaining block can be fixed to the side of the track 41 by screws, wherein a part of the water retaining block is located between the track 41 and the side wall of the discharge port 11, and the other part of the water retaining block is located outside the cutting chamber, and the side of the part facing away from the track 41 is provided with a third guide groove 731 adapted to the guide rib 743 on the guide plate 74.

[0286] Preferably, if Figure 8 and Fig. 9 As shown, the cutting assembly of the present application also includes a flow guide component, which is used to receive part of the cutting fluid during the cutting process and / or the feeding process.

[0287] The cutting process refers to the process of cutting the crystal rod, and the unloading process refers to the process of removing the collecting component 16 and the silicon wafers in the collecting component 16 from the moving cart 42. When the collecting component 16 and the silicon wafers in the collecting component 16 are removed from the moving cart 42, the cutting liquid on the outer surface of the collecting component 16 will drip, and the dripping cutting liquid can be received by the guide component.

[0288] The flow guide component may be installed on the track 41 and / or the moving trolley 42 of the unloading device. Furthermore, the flow guide component may be connected to the cutting chamber so as to guide the received cutting fluid back to the cutting chamber.

[0289] By setting up the guide component, during the cutting process, the cutting liquid dripping from the top can be received, which plays a role of buffering the cutting liquid and avoids the cutting liquid from splashing everywhere. In the process of removing the collecting component 16 from the moving cart 42, the cutting liquid dripping from the collecting component 16 can be collected and guided back into the cutting chamber to avoid waste due to the outflow of the cutting liquid. In addition, when a first drive component is provided, the cutting liquid can also be prevented from falling onto the first drive component located under the track 41, thereby effectively protecting the first drive component and avoiding pollution of the working environment.

[0290] Preferably, if Figure 8 and Fig. 9 As shown, the guide assembly of the present application includes a first guide plate 81 installed on the unloading device, and a first collecting port is provided on the top of the first guide plate 81, and the cutting fluid can enter the first guide plate 81 through the first collecting port.

[0291] Exemplarily, the first guide plate 81 is installed on the moving trolley 42 of the unloading device. During the process of removing the collecting member 16 from the moving trolley 42, the cutting fluid dripping from the collecting member 16 can be collected to prevent the cutting fluid from dripping to other places. In addition, when the first driving assembly is provided, when the collecting member 16 is located inside the cutting chamber, the first guide plate 81 can also rise with the track 41 to receive the cutting fluid dripping from above, thereby playing the role of cutting fluid buffering.

[0292] For example, Fig. 9 and Fig.10 As shown, the moving vehicle 42 is a flatbed vehicle, and the first guide plate 81 is installed on the top surface of the moving vehicle 42 .

[0293] Preferably, if Figure 8 and Fig. 9 As shown, the lower portion of the collecting member 16 is located in the first guide plate 81 , and the width of the first guide plate 81 is greater than the width of the collecting member 16 .

[0294] In this way, a space for storing the cutting fluid can be formed between the first guide plate 81 and the side wall of the collecting member 16 .

[0295] Preferably, if Figure 8 and Fig. 9 As shown, the first guide plate 81 is provided with a first guide opening 814 , and the cutting fluid in the first guide plate 81 can flow out from the first guide opening 814 and drip onto the track 41 or the bottom of the cutting chamber.

[0296] When the first guide plate 81 is located inside the cutting chamber, the cutting fluid flowing out from the first guide opening 814 can directly drip to the bottom of the cutting chamber; when the first guide plate 81 is located outside the cutting chamber, the cutting fluid flowing out from the first guide opening 814 can directly drip onto the track 41.

[0297] Exemplarily, the first guide opening 814 is provided at the inner end of the first guide plate 81 (from Figure 8 The right end when viewed from above) and the inner end of track 41 (from Figure 8 The track 41 (the right end when viewed from above) is set to be open. After the cutting fluid flows onto the track 41, it flows out from the opening at the inner end of the track 41 and falls to the bottom of the cutting chamber. Alternatively, an opening can be set in the middle position of the track 41, and the opening is connected to the cutting chamber through a drain pipe.

[0298] Preferably, if Figure 8 and Fig. 9 As shown, the first guide plate 81 includes a first bottom plate 811, two oppositely arranged first side plates 812 and two oppositely arranged first end plates 813. The first bottom plate 811, the two first side plates 812 and the two first end plates 813 together form a water-containing space. The first bottom plate 811 is fixedly connected to the moving cart 42, and the first side plate 812 extends along the length direction of the moving cart 42. The bottom end of the first side plate 812 is fixedly connected to or integrally arranged with the first bottom plate 811. The first end plate 813 extends along the width direction of the moving cart 42. The bottom end of the first end plate 813 is fixedly connected to or integrally arranged with the first bottom plate 811. The first guide opening 814 is formed on the inner side of the first end plate 813.

[0299] It should be noted that, in actual applications, those skilled in the art may also cancel the first end plate 813 located on the inner side, that is, the inner end of the first guide plate 81 is open, and the opening between the two first side plates 812 forms the first guide opening 814 .

[0300] Preferably, if Figure 8 and Fig. 9 As shown, the guide assembly of the present application also includes a guide box 83 installed on the track 41, and a second guide opening (not shown in the figure) is provided on the track 41. The guide box 83 is located below the track 41 and is connected to the second guide opening. The guide box 83 is connected to the cutting chamber through a drain pipe.

[0301] Exemplarily, the second diversion opening is preferably arranged in the middle position in the length direction of the track 41, the diversion box 83 is fixedly installed at the bottom of the track 41, the top of the diversion box 83 is open, so as to be connected with the second diversion opening on the track 41, and the bottom of the diversion box 83 has a drain port connected with the drain pipe, and the cutting fluid on the track 41 enters the diversion box 83 through the second diversion opening, and then flows back into the cutting chamber along the drain pipe.

[0302] Preferably, if Figure 8 and Fig. 9 As shown, the guide assembly of the present application also includes a second guide plate 82 installed on the track 41. A second collecting port is provided on the top of the second guide plate 82. During the unloading process, the cutting fluid dripping from the collecting member 16 can pass through the second collecting port into the second guide plate 82. The second guide plate 82 is located on the side of the track 41.

[0303] For example, Figure 8 and Fig. 9 As shown, a second guide plate 82 is installed on the left and right sides of the track 41, the length of the second guide plate 82 is less than the length of the track 41, and it is located outside the cutting chamber. In the process of removing the silicon wafer from the collecting member 16, the cutting liquid dripping from the silicon wafer will fall on the second guide plate 82. Of course, in actual applications, those skilled in the art can also only set the second guide plate 82 on one side of the track 41.

[0304] It should be noted that, in actual applications, those skilled in the art may extend the second guide plate 82 into the inside of the cutting chamber and set the inner end of the second guide plate 82 to be open so that the cutting fluid in the second guide plate 82 can flow directly back into the cutting chamber, or the second guide plate 82 may be connected to the cutting chamber through a drain pipe.

[0305] Preferably, if Figure 8 and Fig. 9 As shown, the second guide plate 82 of the present application is connected to the cutting chamber through a drainage pipe.

[0306] For example, Figure 8 and Fig. 9 As shown, a drain port is provided at the middle position of the bottom of the second guide plate 82, and the drain port is connected to the drain pipe. The cutting fluid in the second guide plate 82 enters the drain pipe through the drain port and flows back to the cutting chamber along the drain pipe.

[0307] Preferably, if Figure 8 and Fig. 9As shown, the second guide plate 82 of the present application includes a second bottom plate 821, a second side plate 822 and two oppositely arranged second end plates 823, one side of the second bottom plate 821 is fixedly connected to the side wall of the track 41, the second side plate 822 extends along the length direction of the track 41, the bottom end of the second side plate 822 is fixedly connected to or integrally arranged with the other side of the second bottom plate 821, the bottom end of the second end plate 823 is fixedly connected to or integrally arranged with the second bottom plate 821, and the left and right ends of the second end plate 823 are respectively connected to the side wall of the track 41 and the second side plate 822.

[0308] That is to say, the front and rear ends of the second guide plate 82 are both blocked, and all the cutting fluid in the second guide plate 82 flows back into the cutting chamber through the drain pipe. For example, a drain port connected to the drain pipe is provided in the middle position of the second bottom plate 821.

[0309] Preferably, if Figure 8 and Fig. 9 As shown, the second side plate 822 of the present application is tilted in a direction away from the track 41 .

[0310] By tilting the second side plate 822 of the second guide plate 82 , the receiving area of ​​the second guide plate 82 is increased, so that more cutting fluid can be received.

[0311] Finally, the working process of the wire cutting machine of the present application is introduced. Before cutting begins, the crystal rod assembly needs to be installed at the bottom of the feeding device 20. After cutting starts, the main roller motor of the main roller assembly is started to drive the first main roller 13 and the second main roller 14 to rotate at high speed, and the feeding device 20 drives the crystal rod assembly to feed downward, that is, move toward the wire network on the main roller assembly, start the first drive assembly, drive the lifting seat 51, the track 41 on the lifting seat 51, the second drive assembly on the track 41, the mobile trolley 42 and the collecting member 16 on the mobile trolley 42 to move upward. When the distance between the collecting member 16 and the crystal rod 17 at the bottom reaches the set safety distance, the collecting member 16 stops rising, and the first drive assembly moves downward with the feeding of the feeding device 20, so that the distance between the collecting member 16 and the crystal rod 17 at the bottom is always maintained at a safe distance.

[0312] When the bottom crystal rod is cut, the spray degumming device 3 is started to spray degumming liquid toward the glue layer on the crystal rod to separate the silicon wafer formed by cutting from the upper crystal rod. After the silicon wafer is degummed, it falls into the collecting component 16 below. The clamping mechanism is started to clamp the silicon wafer in the collecting component 16, and the first drive component drives the lifting seat 51, the track 41 on the lifting seat 51, the second drive component on the track 41, the moving trolley 42 and the collecting component 16 on the moving trolley 42 to move downward quickly. After moving to the set initial position, the first drive component is closed and the second drive component is started to pull the moving trolley 42, the collecting component 16 on the moving trolley 42 and the silicon wafer in the collecting component 16 through the discharge port 11 to the outside of the cutting chamber.

[0313] Then, the collecting member 16 and the silicon wafer are removed from the moving cart 42 together, and then an empty collecting member 16 is placed on the moving cart. The second driving component is started to push the moving cart 42 and the collecting member 16 on the moving cart 42 back into the cutting chamber. The second driving component is closed and the first driving component is started to drive the lifting seat 51, the track 41 on the lifting seat 51, the second driving component on the track 41, the moving cart 42 and the collecting member 16 on the moving cart 42 to move upward, and then the above steps are repeated. During the discharging process, the feeding device 20 does not stop and continues to feed.

[0314] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims of the present application, any one of the claimed embodiments may be used in any combination.

[0315] So far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present application.

Claims

1. A wire cutting machine, characterized in that: include: a cutting frame having a cutting chamber formed therein; A main roller assembly is mounted on the cutting frame, and the main roller assembly is used to wind the cutting wire to form a wire web; A feeding device, which is mounted on the cutting frame, on which a crystal rod assembly can be mounted, wherein the crystal rod assembly includes at least two crystal rods bonded together along a feeding direction, and the feeding device is used to drive the crystal rod assembly to feed toward the wire mesh; a debonding device, which is installed on the cutting frame and can debond the cut crystal rod; and The unloading device is capable of receiving the silicon wafers after debonding.

2. The wire cutting machine according to claim 1, characterized in that: The degumming device is a spray degumming device, and the spray degumming device can spray a degumming liquid toward the glue layer on the crystal rod.

3. The wire cutting machine according to claim 2, characterized in that: The spray degumming device comprises: A spray pipe connected to a degumming liquid source, the spray pipe extending along the axis direction of the main roller assembly; and A nozzle, one end of which is connected to the spray pipe.

4. The wire cutting machine according to claim 3, characterized in that: The spray degumming device further comprises a protective component, which is located between the nozzle and the main roller assembly, and can prevent the degumming liquid sprayed from the nozzle from being sprayed onto the main roller assembly.

5. The wire cutting machine according to claim 3, characterized in that: The degumming device is arranged in the area enclosed by the wire mesh, and the nozzle is arranged toward the cutting section of the wire mesh.

6. The wire cutting machine according to claim 1, characterized in that: The unloading device includes a collecting component located in the wire mesh, the collecting component is used to collect the silicon wafers that have completed degumming, the cutting frame is provided with a discharge port connected to the cutting chamber at a position corresponding to the collecting component, and the collecting component can pass through the discharge port to transport the collected silicon wafers to the outside of the cutting chamber.

7. The wire cutting machine according to claim 6, characterized in that: The unloading device also includes a first driving assembly, which can drive the collecting member to reciprocate along the feeding direction.

8. The wire cutting machine according to claim 7, characterized in that: The unloading device also includes a track, a portion of which passes through the discharge port and extends into the cutting chamber, the collecting member is located on the track and can move along the track, and the first driving component can drive the track to reciprocate along the feeding direction.

9. The wire cutting machine according to claim 8, characterized in that: The unloading device also includes a lifting seat and a guide mechanism, the track is installed on the lifting seat, the first driving assembly is connected to the lifting seat and can drive the lifting seat to reciprocate along the feeding direction, and the guide mechanism is used to guide the lifting seat.

10. The wire cutting machine according to claim 8, characterized in that: The unloading device further comprises a second driving assembly mounted on the track, and the second driving assembly can drive the collecting member to move along the track from the discharge port to the outside of the cutting chamber.

11. The wire cutting machine according to claim 10, characterized in that: The unloading device also includes a moving cart, the collecting member is placed on the moving cart, the moving cart is located on the track, and the second driving component is connected to the moving cart and can drive the moving cart to move along the track.

12. The wire cutting machine according to claim 11, characterized in that: The second driving assembly includes a second driving mechanism, a sprocket and a chain meshed with the sprocket, the chain is connected to the moving trolley, and the second driving mechanism is connected to the sprocket and can drive the sprocket to rotate.

13. The wire cutting machine according to claim 6, characterized in that: The unloading device further comprises a clamping mechanism, and the clamping mechanism is used to clamp the silicon wafer located on the collecting member.

14. The wire cutting machine according to claim 13, characterized in that: The clamping mechanism includes two clamping components arranged opposite to each other, and the two clamping components can move relative to each other in a direction of approaching or moving away from each other to clamp or release the silicon wafer.

15. The wire cutting machine according to claim 14, characterized in that: The clamping assembly comprises an airbag and a clamping plate, and one side of the clamping plate is connected to the airbag.

16. The wire cutting machine according to claim 15, characterized in that: An elastic buffer structure is arranged on the other side of the clamping plate.

17. The wire cutting machine according to claim 15, characterized in that: The clamping assembly also includes an air pump, which is in communication with the airbag.

18. The wire cutting machine according to claim 9, characterized in that: The wire cutting machine further comprises a water retaining device, which is installed at the discharge port and arranged around the track to prevent the cutting fluid in the cutting chamber from overflowing from the gap between the discharge port and the track.

19. The wire cutting machine according to claim 18, characterized in that: The water retaining device includes a first water retaining member, which is located above the track. The bottom of the first water retaining member abuts against the top surface of the track. The first water retaining member can reciprocate along the feeding direction together with the track.

20. The wire cutting machine according to claim 19, characterized in that: The water retaining device further comprises a second water retaining member, which is located below the track, the top of which is connected to the bottom surface of the track, and the second water retaining member can be extended and retracted along with the reciprocating movement of the track.

21. The wire cutting machine according to claim 20, characterized in that: The water retaining device further comprises a third water retaining member, which is located on the side of the track and connected to the side of the track. The third water retaining member can reciprocate along the feeding direction together with the track.

22. The wire cutting machine according to claim 21, characterized in that: The water blocking device further includes a guide member for guiding the first water blocking member, the second water blocking member, and the third water blocking member during their movement.

23. The wire cutting machine according to claim 22, characterized in that: The water retaining device also includes a fixing frame fixedly connected to the cutting frame, the guide member and the second water retaining member are installed on the fixing frame, a water receiving groove is provided at the bottom of the fixing frame, and the bottom of the guide member and the bottom of the second water retaining member are both connected to the water receiving groove.

24. The wire cutting machine according to claim 11, characterized in that: The wire cutting machine further comprises a flow guide assembly, which is used to receive part of the cutting fluid during the cutting process and / or the feeding process.

25. The wire cutting machine according to claim 24, characterized in that: The guide component is in communication with the cutting chamber so as to guide the received cutting fluid back to the cutting chamber.

26. The wire cutting machine according to claim 24, characterized in that: The guide assembly includes a first guide plate installed on the moving vehicle, and a first collecting port is provided on the top of the first guide plate. The cutting fluid can enter the first guide plate through the first collecting port.

27. The wire cutting machine according to claim 26, characterized in that: The first guide plate is provided with a first guide opening, and the cutting fluid in the first guide plate can flow out from the first guide opening and drip onto the track or the bottom of the cutting chamber.

28. The wire cutting machine according to claim 27, characterized in that: The guide assembly also includes a guide box installed on the track, a second guide opening is provided on the track, the guide box is located below the track and is connected to the second guide opening, and the guide box is connected to the cutting chamber through a drain pipe.

29. The wire cutting machine according to claim 27, characterized in that: The guide assembly also includes a second guide plate installed on the side of the track, and a second collecting port is provided on the top of the second guide plate. The cutting fluid dripping from the collecting component during the unloading process can pass through the second collecting port and enter the second guide plate.

30. The wire cutting machine according to any one of claims 1 to 29, characterized in that: The main roller assembly includes a first main roller and a second main roller, the first main roller and the second main roller are spaced apart along the feed direction, there are two first main rollers and they are spaced apart along a direction perpendicular to the feed direction, and the degumming device is located between the first main roller and the second main roller.

31. The wire cutting machine according to claim 30, characterized in that: The wire saw further includes a flow guide cover located between the two first main rollers, the flow guide cover extending along the axial direction of the first main roller, and the flow guide cover penetrating along the feeding direction so that the crystal rod can pass through the flow guide cover.

32. The wire cutting machine according to claim 30, characterized in that: The number of the second main rollers is two and they are spaced apart and distributed in a direction perpendicular to the feeding direction.

33. The wire cutting machine according to claim 32, characterized in that: The horizontal distance between the two second main rollers is greater than the horizontal distance between the two first main rollers.

34. The wire cutting machine according to claim 32, characterized in that: The wire saw also includes a debris box located between the two second main rollers, the debris box extending along the length direction of the second main roller, the bottom of the debris box is closed, and the top of the debris box has an opening allowing the crystal rod to pass through.

35. The wire cutting machine according to claim 34, characterized in that: The debris box is provided with a water baffle, and the debris box is provided with water baffles extending toward the outside of the debris box on both sides along the width direction thereof, and the water baffles are located above the second main roller.

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