Cabin, apparatus, system and manufacturing method for substrate manufacturing

Abstract

The invention discloses a cabin body, equipment, system and manufacturing method for substrate manufacturing, and the cabin body, the equipment, the system and the manufacturing method comprise a housing with a sealing structure, and the housing forms an internal accommodation space; the exposure processing unit is arranged in the internal accommodating space and is used for carrying out exposure treatment on the substrate; wherein the internal accommodating space is used for providing a process environment required by exposure treatment for the exposure process unit. By using the technical scheme disclosed by the invention, dust-free, constant-temperature, constant-humidity and other process environment control on the whole workshop provided with the exposure equipment can be avoided, so that the construction cost and the maintenance cost of the workshop are saved, and the production cost of a substrate exposure process is reduced.

Description

Technical Field

[0001] The present disclosure belongs to the technical field of mechanical equipment, and in particular relates to a chamber, equipment, system and manufacturing method for substrate manufacturing. Background Art

[0002] The exposure process can transfer the designed circuit pattern to the substrate to realize the production of specific interconnection lines of the substrate. In actual operation, the exposure process has very strict requirements on the environment, and it is necessary to be in an environment with yellow light, dust-free, constant temperature, constant humidity and other requirements to ensure the accuracy and quality of the product. In the prior art, the exposure process equipment and other process equipment are placed together in an extra-large yellow light dust-free workshop, and the entire yellow light dust-free workshop is also subjected to dust-free, constant temperature, constant humidity and other environmental controls. The maintenance cost of the yellow light dust-free workshop is high, resulting in a high cost waste. How to balance the quality and cost of the exposure process is a technical problem that needs to be solved urgently in this field. Summary of the invention

[0003] The purpose of the present disclosure is to provide a chamber, equipment, system and manufacturing method for substrate manufacturing, which ensures that the substrate can be exposed in the specific environment required by the exposure process, while effectively reducing the construction cost and maintenance cost of the yellow light dust-free workshop, thereby reducing the process cost of substrate manufacturing.

[0004] To achieve the above-mentioned object, the present disclosure provides a cabin body manufactured by a substrate in a first aspect, comprising:

[0005] A housing having a sealed structure, wherein the housing forms an internal accommodation space;

[0006] An exposure process unit disposed in the internal accommodation space is used to perform exposure processing on the substrate;

[0007] The internal accommodation space provides the exposure process unit with a process environment required for the exposure process.

[0008] Optionally, the housing includes a heat insulation structure.

[0009] Optionally, the exposure process unit includes an exposure unit, and the number of the exposure units is greater than or equal to one.

[0010] Optionally, the exposure process unit includes a flip unit, and the flip unit is used to flip the substrate input into the exposure unit.

[0011] Optionally, the cabin includes a dust collecting unit, and the substrate is subjected to dust collecting treatment by the dust collecting unit before the exposure treatment.

[0012] Optionally, the cabin includes a laminating machine group, and the substrate is first subjected to lamination treatment by the laminating machine group before being subjected to exposure treatment.

[0013] Optionally, the internal accommodation space does not include auxiliary equipment that does not directly process the substrate.

[0014] Optionally, the cabin body includes process components and non-process components, and the process components and the non-process components are arranged in sequence within the cabin body, and the sequential arrangement includes a straight-line arrangement or a ring arrangement.

[0015] In a second aspect, the present disclosure provides a substrate manufacturing device, which is applied to a chamber for manufacturing the substrate, comprising: a chamber, an environment adjustment device;

[0016] The environment adjustment device is connected to the cabin body and is used to control and adjust the environment of the internal accommodation space.

[0017] Optionally, the environment of the internal containing space includes dust-free, temperature, humidity, and air pressure, and the environment regulating device is used to control and regulate the environment of the internal containing space, including controlling and regulating at least one of dust-free, temperature, humidity, and air pressure.

[0018] Optionally, the environment adjustment device is used to control and adjust the environment of the internal accommodation space, including controlling and adjusting at least one of dust-free, temperature, humidity, and air pressure, and specifically includes:

[0019] The environment regulating device controls the cabin environment to be a dust-free environment;

[0020] and / or,

[0021] The environment regulating device controls the cabin environment to be a constant temperature and humidity environment;

[0022] and / or,

[0023] The environment regulating device controls the cabin environment to be a constant pressure environment.

[0024] Optionally, the environment adjustment device is used to control and adjust the environment of the internal accommodation space, specifically including:

[0025] By delivering dust-free clean gas into the cabin and controlling the pressure difference between the inside and outside of the cabin, a dust-free environment is formed inside the cabin.

[0026] Optionally, the substrate manufacturing equipment further includes a lighting system, and the lighting system is used to provide ambient light for the cabin.

[0027] In a third aspect, the present disclosure provides a substrate manufacturing system, which is applied to the above-mentioned substrate manufacturing equipment, including: a substrate manufacturing equipment, a conveying component connected to the substrate manufacturing equipment, the conveying component is used to convey the substrate to the substrate manufacturing equipment, and convey the substrate that has completed the exposure process to other locations.

[0028] In a fourth aspect, the present disclosure provides a substrate manufacturing method, which is applied to the above-mentioned substrate manufacturing system. The specific steps of the substrate manufacturing method include:

[0029] The conveying assembly conveys the substrate to be processed into the cabin;

[0030] Starting the environment adjustment device to control the internal environment of the chamber to be a process environment required for process treatment of the substrate;

[0031] The cabin completes the exposure process of the substrate and sends it to the conveying assembly;

[0032] The conveying component conveys the substrate that has completed the exposure process to other locations.

[0033] Compared with the prior art, one beneficial effect of the present invention is that the equipment involved in the exposure process of substrate manufacturing is placed in an integrated cabin, and the internal accommodation space formed by the outer shell of the sealed structure of the integrated cabin provides a process environment for the exposure processing performed inside the cabin, which can avoid the need for dust-free, constant temperature, constant humidity and other process controls for the entire workshop where the exposure equipment is set up, thereby saving the construction cost and maintenance cost of the workshop and reducing the production cost of the substrate.

[0034] Other features and advantages of the present disclosure will become apparent from the following detailed description of exemplary embodiments of the present disclosure with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0036] Figure 1 This is a schematic diagram of the structure of the exposure equipment and other process section machines placed together in the super large yellow light dust-free workshop in the background technology

[0037] Figure 2 It is a structural diagram of an embodiment of the present disclosure

[0038] Figure 3 It is a structural diagram of another embodiment of the present disclosure

[0039] Figure 4 It is a structural diagram of another embodiment of the present disclosure

[0040] Figure 5 It is a structural diagram of another embodiment of the present disclosure

[0041] Figure 6 It is a structural diagram of another embodiment of the present disclosure

[0042] Figure 7 is a flow chart of a substrate manufacturing method

[0043] Figure 8 This is a schematic diagram of PCB board manufacturing using a substrate manufacturing system.

[0044] Fig. 9 This is a structural diagram of the substrate manufacturing system.

[0045] Figures 1 to 9 The one-to-one correspondence between the component names and the figure marks is as follows: 1, substrate manufacturing system; 10, substrate manufacturing equipment; 100, cabin; 110, shell; 1101, first opening; 1102, second opening; 120, exposure process unit; 1201, first exposure unit; 1202, first exposure unit; 130, flip unit; 140, transfer unit; 1401, first transfer unit; 1401, second transfer unit; 150, dust collection unit; 160, film pressing unit; 170, temporary storage mechanism; 200, environmental adjustment device; 1000, yellow light workshop; 2000, equipment assembly line; 2100; exposure process equipment; 2200, other process section equipment; 3100, air purification system; 3200, constant temperature and humidity system. DETAILED DESCRIPTION

[0046] The following will be combined with the embodiments and drawings to clearly and completely describe the technical solution of the present disclosure. The described embodiments are only part of the embodiments that may be implemented by the present disclosure, not all of them. Those skilled in the art can completely combine the embodiments of the present disclosure to obtain other embodiments without creative work, and these embodiments are also within the scope of protection of the present disclosure.

[0047] In the present disclosure, when a device or component is referred to as being "equipped with," "installed," "connected" or "connected" to another device or component, it may be directly "equipped with," "installed," "connected" or "connected" to the other device or component, or an intervening device or component may also be present.

[0048] The exposure process is an important process link in substrate manufacturing. It mainly refers to the micro-nano manufacturing technology that uses optical-chemical reaction principles and chemical and physical etching methods to transfer the designed micro-graphic structure to the surface of substrates such as wafers, glass substrates, copper-clad boards, etc. covered with photosensitive materials. The exposure process needs to be completed by exposure process equipment. The inventors of the present disclosure have found that the exposure process equipment has very strict requirements on the processing environment when performing exposure processing on the substrate. It is necessary to be in an environment of yellow light, dust-free, constant temperature, constant pressure, constant humidity, etc. to ensure the accuracy and quality of the processed products. In the prior art, by equipping the exposure process equipment with a super-large yellow light dust-free workshop, the entire workshop needs to be continuously maintained in an environment of yellow light, dust-free, constant temperature, constant pressure, constant humidity, etc.

[0049] as follows Figure 1 As shown, the yellow light workshop 1000 is equipped with multiple equipment lines 2000 that need to work in a yellow light environment. The equipment lines 2000 are composed of exposure process equipment 2100 and other process equipment 2200, and work channels and maintenance spaces are reserved. Each equipment line needs to be arranged at a certain distance, and the length, width and height of different equipment are not consistent. The yellow light workshop needs to consider the height of the highest equipment, which often reaches a floor height of more than 3.5m. Therefore, the actual volume of the equipment only accounts for less than 30% of the volume of the yellow light workshop 1000, resulting in low space utilization of the yellow light workshop 1000; at the same time, due to the strict working environment requirements of the exposure process, it is necessary to use equipment such as an air purification system 3100 and a constant temperature and humidity system 3200 to control the process environment of the entire yellow light workshop 1000 such as dust-free, constant temperature, constant pressure, and constant humidity, which further causes a high cost waste. The resulting problem is that the maintenance cost of the yellow light workshop 1000 is high, and the production cost of using the yellow light workshop for substrate manufacturing is high.

[0050] The present disclosure provides a cabin for substrate manufacturing, which can be applied to the scenario of providing an exposure process for substrate manufacturing. The cabin includes: an outer shell and an exposure process unit. The outer shell has a sealing structure, and the sealing structure of the outer shell enables the cabin to form an internal accommodating space. The exposure process unit is arranged in the internal accommodating space of the cabin. The internal accommodating space of the cabin can provide the exposure process unit with the process environment required during the exposure process, so that the exposure process unit provides exposure processing for the substrate. Specifically, the sealing structure means that the process environment provided in the internal accommodating space of the cabin is not directly affected by the environment outside the cabin. In this way, it is achieved that only the process environment required for exposure processing is provided in the internal accommodating space of the cabin, and the exposure process unit can be used to perform exposure processing on the substrate, without the need to control and maintain the process environment of the entire workshop where the exposure process unit is installed.

[0051] The exposure process unit is used to transfer the designed micro-pattern structure onto a substrate covered with a photosensitive material. Exposure process equipment with different working principles such as contact proximity exposure, projection exposure, and direct writing exposure can be used according to different processing requirements. The present disclosure does not limit the specific types of exposure process units.

[0052] It should be noted that the substrate subjected to exposure processing by the exposure process unit refers to all substrates to be processed that need to undergo an exposure processing process during the manufacturing process, for example, it can be a circuit board for chip packaging, including a PCB (Print Circuit Board), an IC carrier, a glass substrate, and also includes semiconductor chips, LED chips, etc. The present disclosure does not limit the specific type and material of the substrate.

[0053] The present invention provides a cabin body including a shell and an exposure process unit, wherein the internal accommodation space with a sealed structure formed by the shell of the cabin body can provide the exposure process unit with a process environment required for exposure processing. When the user implements the exposure process in substrate manufacturing, it is not necessary to adjust and maintain the harsh process environment required for exposure processing in the entire workshop where the exposure process unit is installed, which can effectively simplify the structure of the exposure process workshop, reduce the maintenance cost of the exposure process, and further reduce the production cost of the substrate exposure process.

[0054] The following is combined with Figure 2-9 Specific embodiments of the present disclosure are described.

[0055] refer to Figure 2 The cabin 100 for substrate manufacturing provided by the present disclosure includes: an outer shell 110 and an exposure process unit 120. Among them, the outer shell has a sealing structure. In some embodiments of the present disclosure, the outer shell of the cabin 100 includes a heat-insulating structure, which can be composed of a rigid material and a heat-insulating material. The rigid material includes a stainless steel plate, a ceramic and a composite rigid material, etc. The heat-insulating material includes glass fiber, a rock wool board, an aerogel felt, a vacuum board, etc. The use of a shell with a heat-insulating structure can avoid the temperature, humidity, pressure and other environments outside the cabin 100 from directly affecting the process environment in the internal accommodation space of the cabin 100, which is beneficial to the regulation and maintenance of the internal process environment of the cabin 100.

[0056] In some embodiments of the present disclosure, Figure 2As shown, the cabin 100 includes a flipping unit 130, which is arranged in the internal accommodation space of the cabin 100. The flipping unit 130 can flip the substrate input into the exposure process unit 120, so that different processing surfaces of the substrate can be exposed by the exposure process unit 120. The exposure process unit 120 is composed of exposure units, and the number of exposure units is designed according to different application requirements of the cabin 100, which is greater than or equal to 1. The number of flipping units 130 is designed according to different application requirements of the cabin 100, which is greater than or equal to 0.

[0057] When the chamber 100 is only used to provide a single exposure process for a single processing surface of a substrate, the flipping unit 130 is not required to flip the substrate, and the number of flipping units can be 0.

[0058] When the chamber 100 is used to provide exposure processing for different processing surfaces of the substrate or to perform multiple exposure processing on a single processing surface of the substrate, the flipping unit 130 flips the different processing surfaces of the substrate to be processed into the exposure unit for exposure processing. It should be noted that the flipping unit 130 can also be used as a shelf for the substrate before and after the exposure processing is completed, so that the substrate can be placed on the flipping unit 130 or the position adjustment and alignment can be performed.

[0059] It should be noted that a single exposure unit can be used to provide one or more exposure processes to at least one processing surface of the substrate, or two or more exposure units can be used to provide one or more exposure processes to at least one processing surface of the substrate. When the exposure process unit 120 is configured to include at least one exposure unit and equipped with a flip unit 130 as needed, the requirements for exposure processing of different processing surfaces of the substrate can be met, and a smaller number of exposure units can be used to achieve multiple exposure processing requirements for the substrate, so that the cabin 100 provides more abundant application requirements for exposure processing of the substrate.

[0060] In a specific embodiment, the first exposure unit 1201 can be used to expose the first processing surface of the substrate. After the exposure processing by the first exposure unit 1201, the substrate is moved to the flip unit 130 for flipping, so that the second processing surface of the substrate is transported to the second exposure unit 1202 for exposure processing, so that different processing surfaces of the substrate are all exposed.

[0061] In another specific embodiment, the first exposure unit 1201 can be used to expose the first processing surface of the substrate. The substrate after the exposure processing by the first exposure unit 1201 is moved to the flip unit 130 for flipping, and the second processing surface of the substrate is transported to the first exposure unit 1201 again for exposure processing, thereby using a single exposure unit 1201 in cooperation with the flip unit 130 to expose different processing surfaces of the substrate.

[0062] In some embodiments, the cabin 100 includes a transfer unit 140, which is disposed in the internal accommodation space of the cabin 100 and is used to transport and transfer the substrate in the cabin 100. Specifically, the transfer unit 140 can transport the substrate into the exposure process unit 120, and can also transfer the substrate that has completed the process in the exposure process unit 120 to other locations. Alternatively, when the exposure process unit 120 includes multiple exposure units, the transfer unit can transport and transfer the substrate between different exposure units according to the process sequence. The transfer unit 140 can automatically transfer the substrate between different positions in the cabin 100, avoiding the influence of dust particles and the like that may be introduced during the manual substrate transfer operation on the process environment, and can also avoid the influence of possible manual operation errors on the process yield, thereby improving the substrate processing yield and efficiency.

[0063] In some embodiments, the internal accommodation space of the cabin 100 does not include auxiliary equipment (not shown). Auxiliary equipment refers to components that do not directly contact or process the substrate, but provide necessary working conditions for the cabin 100 to manufacture the substrate, for example, including vacuum pumps, voltage stabilizers, water coolers, etc. These auxiliary equipment are arranged outside the cabin 100, which can further reduce the volume required for the internal accommodation space and reduce the volume of the cabin 100. In addition, some auxiliary equipment will generate a lot of heat during operation. Arranging them outside the integrated cabin 100 can further reduce energy consumption and reduce the maintenance cost of the process environment in the cabin 100. Arranging the auxiliary equipment outside the cabin 100 is also conducive to debugging or replacing the auxiliary equipment.

[0064] In some embodiments, reference Figure 3 The cabin 100 includes a dust collecting unit 150. The dust collecting unit 150 is disposed in the internal accommodation space of the cabin 100. The dust collecting unit 150 can first perform dust removal on the substrate sent to the exposure process unit 120 for exposure processing, so as to prevent dust, particles and other pollutants generated or carried by the substrate in the processing steps before the exposure processing from being brought into the exposure process unit 120, thereby affecting the processing yield of the exposure processing. In addition, by performing dust removal on the substrate through the dust collecting unit 150, the cabin 100 can also more efficiently maintain the process environment in the internal accommodation space, improve the substrate processing efficiency, and reduce the maintenance cost of the exposure process environment.

[0065] In some embodiments, the chamber 100 further includes a unit for providing other process technologies for the substrate, such as providing a lamination process or a photoresist coating process for the substrate. Figure 3 , for example, the cabin also includes a laminating unit 160 that provides a laminating process for the substrate, the laminating unit 160 is arranged in the internal accommodation space of the cabin 100, and performs laminating treatment on the substrate before entering the exposure process unit 120, so that a dry film is formed on the surface of the substrate. Specifically, the substrate is input into the cabin 100, and is first transported to the laminating unit 160, and the laminating unit 160 performs laminating on the substrate, so that a dry film is formed on the substrate, and the substrate that has completed lamination is transported to the dust collection unit 150 for dust removal, and the substrate that has completed dust removal is transferred to the exposure process unit 120 for exposure treatment of the substrate. In some embodiments, a temporary storage mechanism 170 is provided next to the laminating unit 160, and the substrate that has completed lamination is transported to the temporary storage mechanism 170, and after the temperature drops to a suitable temperature, subsequent dust removal, exposure and other treatments are performed.

[0066] In the above-mentioned embodiments, the cabin 100 includes process components and non-process components. Process components refer to components that provide processing processes for substrates, such as the exposure process unit 120 that provides exposure processes and the lamination unit 160 that provides lamination processing; non-process units refer to components that directly process substrates but do not provide processing processes for substrates, such as the temporary storage mechanism 170, the flip unit 130, the transfer unit 140, the dust collection unit 150, etc. The types and numbers of process components and non-process components are set according to the manufacturing needs of the substrates provided by the cabin 100, and the present disclosure does not limit the types and numbers of process components and non-process components.

[0067] In the above-mentioned embodiments, each process component and non-process component is arranged in sequence in the internal accommodation space. The arrangement in sequence means that each component is placed according to the processing sequence and conveying route of the substrate in the manufacturing process. Specifically, all process components and non-process components are arranged in sequence in the same horizontal plane inside the cabin 100, or all or part of the components are arranged in sequence in a stacked manner in the height direction as needed. The arrangement in sequence includes a straight line arrangement or a ring arrangement. Arranging each process component and non-process component in the cabin 100 in sequence according to the processing sequence and conveying route of the substrate in the manufacturing process is conducive to optimizing the spatial layout between each component in the cabin 100 and the substrate transfer path, improving the internal space utilization of the cabin 100, further improving the processing efficiency and reducing the process environment maintenance cost, and is also conducive to realizing the automatic control of each process component and non-process component in the substrate manufacturing process.

[0068] In the above embodiments, the components inside the cabin 100, including process components and non-process components, such as the exposure process unit 120, the flip unit 130, the transfer unit 140, the dust collection unit 150, the film pressing unit 160 and the temporary storage mechanism 170, can be installed in the internal accommodation space of the cabin 100 in a non-fixed manner with the cabin shell 110. When the substrate is subjected to process processing or maintenance and replacement are required, the position of each component in the cabin 100 can be changed or the component can be moved in and out of the cabin 100 as needed. Alternatively, each component and the cabin shell 110 are installed in the internal accommodation space of the cabin 100 in a detachable manner, and can be conveniently moved in and out of the cabin 100 or disassembled and replaced when maintenance or replacement operations are required. Alternatively, each component is fixedly connected to the capsule 100 through welding or integral molding. Fixedly connecting each component to the capsule 100 can reduce vibration during the process, which is beneficial to improving the processing quality. Alternatively, each component and the capsule shell 110 can be installed in a combination of at least two of a non-fixed manner, a detachable manner, and a fixed manner. For example, the transfer unit 140 can be set to a non-fixed manner to facilitate its movement between other components to transfer the substrate. The exposure process unit 120, the dust collection unit 150, the laminating unit 160, etc. are fixedly installed in the capsule 100 to reduce the vibration of these components when processing the substrate. The present disclosure does not limit the installation and fixing methods between each component and the capsule shell 110.

[0069] The above is an embodiment of a chamber 100 for manufacturing a substrate provided by the present disclosure. Next, an embodiment of a substrate manufacturing device provided by the present disclosure is introduced.

[0070] For easier understanding, please refer to Figure 4A substrate manufacturing device 10 includes: a chamber 100 for substrate manufacturing, and an environmental conditioning device 200. The environmental conditioning device 200 is arranged outside the chamber 100 and connected to the chamber 100, and can control and adjust the process environment in the internal storage space of the chamber 100. Specifically, an opening is provided on the shell 110 of the chamber, and the environmental conditioning device 200 is connected to the chamber 100 through a first opening 1101 and controls and adjusts the process environment in the chamber 100 through the first opening 1101. It can be understood that although there is a first opening 1101 on the chamber 100, after the first opening 1101 is connected to the environmental conditioning device 200, the internal storage space of the chamber 100 is interconnected with the environmental conditioning device 200, and the environment in the internal storage space of the chamber 100 is not directly affected by the space other than the environmental conditioning device 200. In some embodiments, the first opening 1101 includes an air inlet and an air outlet. The air inlet is used to allow the environment conditioning device 200 to input gas into the chamber 100 and perform other controls, and the air outlet is used to discharge gas in the chamber 100 that does not meet the process environment or perform other controls.

[0071] The internal accommodation space of the cabin 100 provides a process environment for the exposure process unit 120 to perform exposure processing, including dust-free, temperature, humidity, air pressure, etc. The environment adjustment device 200 controls and adjusts the environment of the internal accommodation space, including controlling and adjusting at least one of dust-free, temperature, humidity, and air pressure in the internal accommodation space of the cabin 100. In some embodiments, the environment adjustment device 200 is used to control and adjust the environment of the internal accommodation space, including controlling and adjusting at least one of dust-free, temperature, humidity, and air pressure, including the environment adjustment device 200 controlling the internal environment of the cabin 100 to be a dust-free environment; and / or, the environment adjustment device 200 controls the internal environment of the cabin 100 to be a constant temperature and humidity environment; and / or, the environment adjustment device 200 controls the internal environment of the cabin 100 to be a constant pressure environment. The present disclosure does not limit the content and parameter indicators of the environment control of the cabin 100 by the environment adjustment device 200, and those skilled in the art can set and adjust according to the process environment required for exposure processing and other processing of different substrates. By splitting the substrate manufacturing equipment into a cabin 100 and an environmental conditioning device 200, the cabin 100 and the environmental conditioning device 200 can be designed separately and assembled or replaced according to different application requirements, which is beneficial to reducing the design difficulty and production cost of the substrate manufacturing equipment, enriching application requirements and reducing equipment maintenance costs.

[0072] Specifically, the environment adjustment device 200 can deliver dust-free clean gas into the cabin 100, and control the pressure difference between the inside and outside of the cabin 100, so that the pressure inside the cabin 100 is higher than the pressure outside the cabin 100, and the gas outside the cabin 100 that has not been processed by the environment adjustment device 200 cannot easily enter the cabin 100 without the help of external force, thereby forming and maintaining a dust-free environment or process environment in the cabin 100. It can be understood that the dust-free clean gas delivered to the cabin 100 by the environment adjustment device 200 can simultaneously meet at least one of the conditions of temperature, humidity and air pressure required for the process environment; or the environment adjustment device 200 only delivers dust-free gas to the cabin 100, and the conditions of temperature, humidity and air pressure required for the process environment are achieved through the subsequent further regulation of the dust-free gas input into the cabin 100 by the environment adjustment device 200.

[0073] It is understandable that the substrate manufacturing equipment 10 can be composed of one cabin 100 connected to the environmental adjustment device 200, or can be composed of multiple cabins 100 connected to the environmental adjustment device 200. When the substrate manufacturing equipment 10 is composed of multiple cabins 100 connected to the environmental adjustment device 200, each cabin 100 is connected to the environmental adjustment device 200, and the environmental adjustment device 200 can adjust and control the process environment inside all cabins 100. Specifically, when the substrate manufacturing equipment 10 is used to process the substrate, the environmental adjustment device 200 can adjust and control the process environment of all cabins 100 at the same time, or can only start the adjustment and control of the process environment of the cabin 100 that needs to be processed. The process processing of the substrate by each cabin 100 does not interfere with each other, and the process processing in each cabin 100 can be started at the same time, or only the process processing in some cabins 100 can be started. Configuring the substrate manufacturing equipment 10 to be a structure consisting of multiple cabins 100 and environmental conditioning devices 200 is beneficial to improving the utilization rate of the environmental conditioning devices 200 and the substrate processing efficiency. When some cabins 100 need maintenance, other cabins 100 of the substrate manufacturing equipment 10 can still be used to continue substrate manufacturing processing, thereby greatly improving the flexibility of use of the substrate manufacturing equipment 10 and further reducing the substrate manufacturing cost.

[0074] It is understandable that in other embodiments, when the substrate manufacturing equipment 10 is composed of a plurality of cabins 100 and an environmental conditioning device 200, the cabins 100 may be independent of each other and may not interfere with each other; however, at least some of the cabins may be connected as needed. For example, when a substrate needs to be processed successively in a plurality of cabins, connecting channels may be provided between different cabins to enable automatic transmission of the substrates in different cabins.

[0075] It is understandable that the environment conditioning device 200 may include a plurality of components with different functions, for example, an air purification component and a constant temperature and humidity component, the air purification component is used to maintain and control the dust-free environment and pressure inside the cabin 100, and the constant temperature and humidity component is used to maintain and control the temperature and humidity inside the cabin 100. This embodiment does not limit the components of the environment conditioning device 200 and the environmental control content and parameter indicators that can be achieved.

[0076] In a specific embodiment, Figure 5 As shown, the substrate manufacturing equipment 10 is composed of three cabins 100 and an environment adjustment device 200. The environment adjustment device 200 is located outside the cabin 100 and is separately connected to the three cabins 100 through openings on the cabin shell 110. The environment adjustment device 200 is composed of an air purification component 201 and a constant temperature and humidity component 202. The air purification component 201 maintains and controls the dust-free environment and pressure in the three cabins 100 respectively, and the constant temperature and humidity component 202 maintains and controls the temperature and humidity inside the three cabins 100 respectively.

[0077] In some embodiments, the substrate manufacturing equipment further includes a lighting system (not shown), which is used to provide ambient light when the chamber 100 is manufacturing the substrate. The ambient light is light that will not cause unnecessary exposure of the photosensitive material on the substrate. Specifically, when the process light used for the exposure treatment of the substrate is ultraviolet light, the ambient light can be yellow light. The wavelength of yellow light is far away from the wavelength range of ultraviolet light. The exposure treatment is carried out in a soft yellow light atmosphere, which can protect the photosensitive material on the substrate from unnecessary exposure and improve the accuracy and yield of the exposure process. It should be noted that the ambient light is not limited to yellow light. As long as it can effectively prevent the photosensitive material on the substrate from being accidentally exposed by light other than the process light, it can be set as ambient light as needed.

[0078] The present disclosure provides a substrate manufacturing system 1, such as Figure 6 As shown, the substrate manufacturing system 1 includes: a substrate manufacturing device 10, and a conveying component (not shown), the conveying component is used to convey the substrate to the substrate manufacturing device 10, and output the substrate that has completed the manufacturing process from the substrate manufacturing device 10 and transfer it to other locations as needed.

[0079] In some embodiments, a second opening 1102 is provided on the housing of the chamber 100 of the substrate manufacturing equipment, and the second opening 1102 is used as a passage for conveying substrates between the conveying assembly and the substrate manufacturing equipment 10. Specifically, when the conveying assembly transfers the substrate to the substrate manufacturing equipment 10 or outputs the substrate from the substrate manufacturing equipment 10, the second opening 1102 is opened; when the conveying assembly conveys the substrate to the inside of the substrate manufacturing equipment 10 for processing, the second opening 1102 is closed, so that the internal accommodation space of the chamber 100 maintains a sealed structure.

[0080] It can be understood that the second opening 1102 is located on the side wall of the chamber 100, and the number of the second openings can be one or more. When the number of the second openings 1102 is one, one second opening 1102 is used as a channel for inputting and outputting substrates between the conveying assembly and the substrate manufacturing device 10. At this time, the opening and closing time of the second opening 1102 can be set to match the substrate input or substrate output time, so as to realize the input and output of the substrate through one second opening 1102. When the number of the second openings 1102 is two, one second opening 1102 is used for the conveying assembly to input the substrate into the substrate manufacturing device 10, and the other second opening 1102 is used for the substrate manufacturing device 10 to output the substrate that has been processed or needs to be output to the conveying assembly. At this time, the positions of the two second openings 1102 can be designed according to the processing path of the substrate, and can be located on the same side wall of the chamber 100 or distributed on different side walls of the chamber 100. When the number of the second openings 1102 is ≥ 3, some of the second openings can be used as spare openings, or multiple second openings 1102 can be used simultaneously to input or output substrates. This design can increase the flexibility of the cabin or improve production efficiency.

[0081] In some embodiments, the conveying assembly is always located outside the chamber 100, and only exchanges and transfers substrates with the substrate manufacturing equipment 10 through the second opening 1102. At this time, the second opening 1102 has a small opening size and only accommodates the passage of the substrate. The small second opening 1102 is conducive to the control and maintenance of the pressure inside the chamber 100 and the stability of the process environment.

[0082] In some embodiments, the function of the conveying component can be functionally integrated with the non-process components inside the cabin 100 that do not provide a processing process for the substrate. In this case, the conveying component can carry the substrate through the second opening 1102 to enter or leave the cabin 100. For example, the function of the conveying component can be combined with the function of at least one of the temporary storage mechanism 170, the dust collection unit 150, the transfer component 140, the flip unit 130, etc. The non-process components with integrated functions can be omitted, and the functions of the omitted non-process components are simultaneously realized by the conveying component. In a specific embodiment, the conveying component is functionally integrated with all non-process components inside the cabin 100 that do not provide a processing process for the substrate. In this case, the conveying component can act as a transfer component for the substrate in the entire process from the substrate entering the substrate manufacturing device 10 to the substrate exiting the substrate manufacturing device 10, and at the same time, according to the needs of the substrate manufacturing process, it provides the substrate with functions such as carrying, dust removal, transfer, and flipping. Functionally integrating the conveying assembly with the non-process components inside the chamber 100 that do not provide processing for the substrate can further simplify the components inside the chamber 100, reduce the volume of the chamber 100 and the floor space it occupies in the workshop, and also facilitate the realization of automated control of the substrate processing process inside the chamber 100.

[0083] In some embodiments, the function of the conveying assembly is functionally integrated with the non-process components inside the chamber 100 that do not provide processing for the substrate, and the conveying assembly is an automated conveying device, and the movement trajectory of the conveying assembly and the processing of the substrate can be set in advance or controlled in real time according to the transfer path of the substrate during processing and manufacturing in the chamber 100. It can be understood that when the conveying assembly is an automated conveying setting that integrates the substrate conveying function with the non-process components inside the chamber 100 that do not provide processing for the substrate, the conveying assembly can provide fully automatic supporting services for the processing of the substrate inside the chamber 100, for example, supporting services including substrate carrying, conveying, transfer, flipping, etc. can be carried out in an orderly manner through a preset process, and can also be adjusted and controlled in real time through remote control.

[0084] See also Figure 7 , Figure 7 It is a schematic flow chart of a substrate manufacturing method in the present disclosure. The various steps of the substrate manufacturing method provided in the present disclosure are described in detail below in conjunction with the accompanying drawings.

[0085] Specifically, Figure 7 As shown, the substrate manufacturing method can be applied to a substrate manufacturing system as in any of the above embodiments, and the substrate manufacturing method comprises the following steps:

[0086] S10: The conveying component delivers the substrate to be processed into the cabin;

[0087] S20: starting the environment adjustment device to control the internal environment of the chamber to be the process environment required for the process treatment of the substrate;

[0088] S30: The cabin completes the exposure process of the substrate to be processed and sends it to the conveying assembly;

[0089] S40: The conveying component transfers the substrate that has completed the exposure process out of the chamber and sends it to other locations.

[0090] Furthermore, in step S20, the method of controlling the chamber environment to be the process environment required for the process treatment of the substrate includes:

[0091] The environmental conditioning device can deliver dust-free clean air into the cabin, and control the pressure difference between the inside and outside of the cabin, so that the pressure inside the cabin is higher than the pressure outside the cabin, and the gas outside the cabin that has not been processed by the environmental conditioning device cannot easily enter the cabin without the help of external force, thereby forming and maintaining a dust-free environment or process environment in the cabin. It can be understood that the dust-free clean air delivered to the cabin by the environmental conditioning device can simultaneously meet at least one of the conditions required for the process environment, such as temperature, humidity, and air pressure; or the environmental conditioning device only delivers dust-free gas to the cabin, and the temperature, humidity, and air pressure required for the process environment are achieved through the subsequent further regulation of the dust-free gas input into the cabin by the environmental conditioning device.

[0092] Furthermore, in step S30, the exposure process of the chamber to the substrate includes:

[0093] The exposure process unit in the cabin performs single or multiple exposure processing on a single processing surface of the substrate to be processed, or the exposure process unit in the cabin performs single or multiple exposure processing on different processing surfaces of the substrate to be processed respectively.

[0094] The cabin body performs dust removal on the substrate to be processed before the substrate to be processed is exposed.

[0095] When the substrate to be processed needs to be processed by other processes before exposure, the chamber body also performs other processes on the substrate to be processed before exposure. In a specific embodiment, the substrate to be processed needs to form a dry film on the substrate surface before exposure, and the chamber body also performs a film pressing process on the substrate to be processed before exposure.

[0096] Next, the specific application of the substrate manufacturing system disclosed in the present invention using the laser direct imaging (LDI) technology to manufacture PCB boards is described.

[0097] Reference Figure 3-4 and attached Figure 8-9The substrate manufacturing system 1 includes: a cabin 100, a gas regulating device 200, an illumination system (not shown) and a conveying assembly (not shown). The cabin 100 includes an outer shell 110 forming an internal accommodation space of a sealed structure and an exposure process unit 120 and a laminating unit 160 disposed in the internal accommodation space. The illumination system is connected to the cabin 100 and provides ambient light for the internal accommodation space of the cabin. The gas regulating device is connected to the internal accommodation space of the cabin through a first opening 1101 opened on the cabin outer shell 110. The conveying assembly conveys the substrate to be processed to the cabin 100 and receives the substrate output from the cabin 100 through a second opening 1102 opened on the cabin outer shell. The substrate to be processed is a PCB board. The exposure process unit 120 uses laser direct writing lithography technology to expose the PCB board to form a circuit pattern on the PCB board.

[0098] Specifically, the gas regulating device delivers dust-free clean air into the cabin 100 through the first opening 1101, and controls the pressure difference between the inside and outside of the cabin, so that the pressure in the internal storage space of the cabin 100 is higher than the pressure outside the cabin 100, and the gas outside the cabin 100 that has not been processed by the environmental regulating device cannot easily enter the internal storage space of the cabin 100 without the help of external force, so that the internal storage space of the cabin 100 forms and maintains the process environment required for substrate processing and manufacturing. The lighting system provides yellow light for the internal storage space of the cabin 100 as the ambient light when the laminating unit 160 and the exposure process unit 120 process the substrate, and the laminating unit 160 and the exposure process unit 120 perform laminating and exposure process processing on the PCB board in the yellow light environment.

[0099] In this embodiment, the substrate manufacturing system 1 provided with an exposure process unit 120 using laser direct writing lithography technology includes process components, and the process components in this embodiment are a laminating unit 160 and an exposure process unit 120. It can be understood that, according to the needs of the substrate manufacturing system 1 for PCB board processing, non-process components that do not provide processing processes for the substrate can be provided inside the cabin, such as a temporary storage mechanism 170, a dust collection unit 150, a transfer unit 140, and a flip unit 130, etc., which are used to carry, remove dust, transfer, and flip the substrate in the internal accommodation space of the cabin 100. It is further understood that the function of the conveying component can be functionally integrated with the non-process components inside the cabin that do not provide processing for the substrate. For example, the function of the conveying component can be combined with the function of at least one of the temporary storage mechanism 170, the dust collection unit 150, the transfer component 140, the flip unit 130, etc., and the non-process components with integrated functions can be omitted. At this time, the conveying component can enter and leave the cabin 100 through the second opening 1102 together with the substrate, and act as a transfer component for the substrate in the entire process from the substrate entering the internal storage space of the cabin 100 to the substrate exiting the internal storage space of the cabin 100, providing the substrate with at least one of the functions of carrying, dust removal, transfer, flipping, etc.

[0100] In order to facilitate the understanding of the application of the substrate manufacturing system 1, in the embodiment described below, the function of the conveying component is not functionally integrated with the non-process components. The conveying component only inputs the substrate into the cabin 100 or receives the substrate output from the cabin 100 through the second opening 1102, and the conveying component itself is always located outside the cabin 100. Specifically, the environment adjustment device adjusts and maintains the process environment in the internal accommodation space of the cabin 100 through the first opening, and turns on the lighting system to provide the ambient light required for PCB board processing for the laminating unit 160 and the exposure process unit 120 in the internal accommodation space of the cabin. The conveying component inputs the PCB board into the internal accommodation space of the cabin 100 through the second opening 1102, first transfers the PCB board to the automatic laminating unit 160, and laminates the PCB board through the laminating unit 160, so that the PCB board has a dry film. The laminated PCB is transferred to the temporary storage mechanism 170 to wait for the temperature of the PCB to drop to a suitable temperature; then, the laminated PCB is sent to the dust collecting unit 150 for dust removal; and the dust-removed PCB is moved to the exposure process unit 120 for exposure. Specifically, in this embodiment, the exposure process unit 120 includes a first exposure unit 1201 and a second exposure unit 1202, the first exposure unit 1201 and the second exposure unit 1202 are respectively equipped with a first transfer unit 1401 and a second transfer unit 1402, and a flip unit 130 is arranged between the first exposure unit 1201 and the second exposure unit 1202. The PCB board that has been subjected to dust removal treatment is transferred to the machine platform of the first exposure unit 1201 by the first transfer unit 1401 to expose the first side of the PCB board. After the first side of the PCB board is exposed, the first transfer unit 1401 transfers the PCB board to the automatic flip unit 130 to flip the PCB board, and the second transfer unit 1402 transfers the PCB board that has been flipped to the machine platform of the second exposure unit 1202 to expose the second side of the PCB board. The PCB board that has completed exposure on both sides leaves the integrated cabin 100 through the second opening 1102.

[0101] In the above embodiments, non-process components and process units are provided in the substrate manufacturing system 1, for example, the conveying component, temporary storage mechanism 170, dust collection unit 150, transfer component 140, plate turning unit 130, etc. are all non-process units that do not provide processing for the substrate, and the exposure process unit 120 and laminating unit 160, etc. are all process units. The provision of non-process components is conducive to the full automation of the substrate manufacturing process in the cabin manufacturing system, and the substrate can be automatically conveyed, transferred, turned over, etc. between the exposure process unit 120, laminating unit 160, etc. process unit components through these non-process components. It can be understood that when the non-process unit is an automated functional unit that is pre-set or controlled in real time according to the transfer path of the substrate during processing and manufacturing in the cabin 100, the process unit can also be an automated functional unit that is pre-set or controlled in real time according to the process sequence and transfer path of the substrate during processing and manufacturing in the cabin 100, so as to achieve fully automated production control of the substrate in the internal accommodation space of the integrated cabin 100.

[0102] In some other embodiments, the substrate manufacturing system may include only process components, at least one of the non-process components may be omitted, and the function of the omitted non-process component may be replaced by manual operation.

[0103] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments. In the various embodiments provided in the present disclosure, it should be understood that the disclosed devices, equipment, systems and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the connection between each other shown or discussed can be an indirect connection through some interfaces, devices or units, and can be an electrical, mechanical or other form of connection.

[0104] It should be understood that in the various embodiments of the present application, the size of the serial number of each process or component does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0105] It should be noted that, for the aforementioned method embodiments or embodiments involving operation methods, for the sake of simplicity of description, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, some steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0106] It should be understood that each method or automated processing method in the above embodiments can be implemented by an integrated logic circuit of hardware in a processor or by instructions in the form of software. The method steps disclosed in the embodiments of the present application can be directly embodied as being executed by a hardware processor, or by a combination of hardware and software modules in a processor.

[0107] The above are only some embodiments of the present disclosure, and do not limit the present disclosure in any form. Any simple modification, equivalent changes and modifications made to the above embodiments still fall within the scope of protection of the technical solution of the present disclosure.

Claims

1. A chamber for substrate manufacturing, characterized in that: The cabin comprises: A housing having a sealed structure, wherein the housing forms an internal accommodation space; An exposure process unit disposed in the internal accommodation space is used to perform exposure processing on the substrate; The internal accommodation space provides the exposure process unit with a process environment required for the exposure process.

2. The cabin according to claim 1, characterized in that: The housing includes a thermal insulation structure.

3. The cabin according to claim 1, characterized in that: The exposure process unit includes an exposure unit, and the number of the exposure units is greater than or equal to one.

4. The cabin according to claim 3, characterized in that: The exposure process unit includes a flipping unit, and the flipping unit is used to flip the substrate input into the exposure unit.

5. The cabin according to claim 3, characterized in that: The cabin body comprises a dust collecting unit, and the substrate is subjected to dust collecting treatment by the dust collecting unit before the exposure treatment.

6. The cabin according to claim 1, characterized in that: The cabin body includes a laminator unit, and the substrate is first subjected to lamination by the laminator unit before being subjected to exposure treatment.

7. The cabin according to claim 1, characterized in that: The internal accommodation space does not include auxiliary equipment that does not directly process the substrate.

8. The cabin according to claim 1, characterized in that: The cabin body includes process components and non-process components, and the process components and the non-process components are arranged in sequence in the cabin body, and the sequential arrangement includes a straight-line arrangement or a ring arrangement.

9. A substrate manufacturing device, characterized in that: include: The cabin as described in any one of claims 1 to 8; An environment regulating device is connected to the cabin and is used to control and regulate the environment of the internal accommodation space.

10. The substrate manufacturing equipment according to claim 9, wherein the environment of the internal containing space includes dust-free, temperature, humidity, and air pressure, and the environmental regulating device is used to control and regulate the environment of the internal containing space, including controlling and regulating at least one of dust-free, temperature, humidity, and air pressure.

11. The substrate manufacturing equipment according to claim 10, wherein the environment regulating device is used to control and regulate the environment of the internal accommodation space, including controlling and regulating at least one of dust-free, temperature, humidity, and air pressure, and specifically comprises: The environment regulating device controls the cabin environment to be a dust-free environment; and / or, The environment regulating device controls the cabin environment to be a constant temperature and humidity environment; and / or, The environment regulating device controls the cabin environment to be a constant pressure environment.

12. The substrate manufacturing equipment according to claim 9, wherein the environment adjustment device is used to control and adjust the environment of the internal accommodation space, specifically comprising: By delivering dust-free clean gas into the cabin and controlling the pressure difference between the inside and outside of the cabin, a dust-free environment is formed inside the cabin.

13. The substrate manufacturing equipment according to any one of claims 9 to 12, characterized in that: The substrate manufacturing equipment further includes a lighting system, and the lighting system is used to provide ambient light for the cabin.

14. A substrate manufacturing system, characterized in that: The substrate manufacturing system comprises: The substrate manufacturing apparatus according to claim 13; A conveying assembly connected to the substrate manufacturing equipment is used to convey the substrate to the substrate manufacturing equipment and to convey the substrate that has completed the exposure process to other locations.

15. A method for manufacturing a substrate, characterized in that: The substrate manufacturing method is applied to the substrate manufacturing system according to claim 14, and the method comprises: The conveying assembly conveys the substrate to be processed into the cabin; Starting the environment adjustment device to control the internal environment of the chamber to be a process environment required for process treatment of the substrate; The cabin completes the exposure process of the substrate and sends it to the conveying assembly; The conveying component conveys the substrate that has completed the exposure process to other locations.

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