Insulating heat-conducting thermal interface material as well as preparation method and application thereof
By mixing materials such as aminobenzoic acid-modified aluminum oxide spherical powder and MgO powder with silicone oil and silane coupling agent, a thermal interface material with high insulation and high thermal conductivity is prepared, which solves the problem of existing materials in high voltage environments. The problem of insufficient medium insulation performance and limited thermal conductivity has been achieved, and the dual performance improvement of the material has been achieved, which is suitable for efficient chip protection and heat dissipation.
Patent Information
- Application Number
- CN202411268519.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-11
- Publication Date
- 2025-01-17
AI Technical Summary
The existing thermal interface materials lack sufficient insulation performance in high voltage environments, making it difficult to effectively protect the chip from breakdown from high DC voltages. At the same time, their thermal conductivity is also limited, making it difficult to meet the needs of efficient heat dissipation.
By mixing materials such as aminobenzoic acid-modified aluminum oxide spherical powder and MgO powder with silicone oil and silane coupling agent, a thermal interface material with high insulation and high thermal conductivity is prepared, which can withstand 10kV at 1mm. DC voltage and has a high thermal conductivity of 2.3W/(m·K).
It achieves the dual improvement of the insulation performance and thermal conductivity of the thermal interface material, can effectively protect the chip from high voltage breakdown, and has the ability to efficiently dissipate heat, making it suitable for mass production and manufacturing.
Smart Images
Figure CN119320556A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of materials, and mainly relates to a high-insulation and high-thermal-conductivity thermal interface material and a preparation method and application thereof. Background Art
[0002] As electronic chips improve in performance and become smaller in size, they are showing higher and higher heat flux densities. According to relevant theoretical simulations, when the average heat flux density of a chip reaches 500W / cm 2 When the local hot spot heat flux density exceeds 1000W / cm 2 If the chip runs under high temperature conditions for a long time, it will cause irreversible damage to the chip, so the temperature control of the chip is very important. Studies have shown that within 70℃~80℃, the performance of a single electronic component decreases by 50% for every 10℃ increase in temperature, and more than 55% of electronic equipment failures are caused by excessive temperature. Therefore, in order to ensure the reliability and stability of chip operation, efficient heat dissipation technology has become an urgent need.
[0003] At the same time, since the chip still needs to face high voltage environments such as static electricity, good insulation performance is what silicone grease is pursuing. In order to better exert the insulation performance of thermal interface materials, developing a nanoparticle material with high insulation performance and adding it to thermal interface materials has become an effective way to make high insulation thermal interface materials. This method can protect the chip from high DC voltage breakdown and better protect the corresponding equipment. Therefore, developing a thermal interface material with high insulation and high thermal conductivity has certain advanced significance for the equipment using it. Summary of the invention
[0004] Technical problem to be solved: The present invention provides an insulating thermally conductive thermal interface material and a preparation method and application thereof, which can withstand a DC voltage of 10kV at 1mm, has a high thermal conductivity of 2.3W / (m·K), has industrial production capacity, and is conducive to large-scale production and manufacturing.
[0005] Technical solution: A method for preparing an insulating heat-conductive thermal interface material, the preparation steps comprising: in the following proportions, a. take 1 part by mass of silicone oil with a viscosity of 50cs and 0.2 parts by mass of silane coupling agent (KH-792), mix and stir evenly; b. add 6 to 8 parts by mass of aminobenzoic acid-modified aluminum oxide spherical powder in step a and stir evenly; c. add 1 to 4 parts by mass of MgO powder in step b and stir evenly again to form a paste thermal interface material; d. in step c, add 0.01 to 0.5 parts by mass of 50cs silicone oil, vacuum dry, stir evenly, and finally form a thermal interface material.
[0006] The preparation method of the above-mentioned aminobenzoic acid modified aluminum oxide spherical powder is as follows: 3 parts by mass of aminobenzoic acid (m-ABA) and 2 parts by mass of aminosilane coupling agent (KH-550) are added to 35 parts by mass of toluene solution according to the following proportions, and then 55 parts by mass of aluminum oxide particles and 5 parts by mass of ethanol are added to obtain a colloid, which is then filtered and dried to obtain the aminobenzoic acid modified aluminum oxide spherical powder.
[0007] Preferably, the added amount of the aminobenzoic acid modified aluminum oxide spherical powder is 7 parts by mass.
[0008] Preferably, the added amount of the MgO is 2 parts by mass.
[0009] Preferably, the stirring speed in the above steps is 500 r / min.
[0010] The insulating heat-conductive thermal interface material is prepared by the above method.
[0011] Application of the above insulating thermal conductive thermal interface material in chip protection.
[0012] Beneficial effects: Traditional thermal interface materials only have thermal conductivity, and their insulation properties mainly rely on the properties of the filler itself, and their insulation capacity is not high. The thermal conductive filler particles modified by us can not only improve the thermal conductivity of the interface material, but also increase the insulation performance of the particles, thereby achieving a two-way improvement in thermal conductivity and insulation performance. In addition, since this process does not involve the preparation of the thermal interface material itself, its preparation method does not change much, does not generate wastewater and waste, is environmentally friendly and pollution-free, has industrial potential, and has great application prospects. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 : The morphology of the thermally conductive silicone grease after preparation in Example 2.
[0014] Figure 2 : Changes in thermal conductivity and breakdown voltage of thermal grease due to changes in aluminum oxide content after preparation.
[0015] Figure 3 : Changes in thermal conductivity and breakdown voltage of thermal grease caused by changes in magnesium oxide after preparation. DETAILED DESCRIPTION
[0016] The present invention will be further described below in conjunction with specific embodiments.It should be noted that each of the following embodiments is exemplary, and is not intended to limit the scope of the present invention.After reading content of the present invention, those skilled in the art may make various changes or modifications to the present invention, and these equivalent forms fall within the scope limited by the claims of the present application equally.
[0017] Example 1
[0018] Take 1 part by mass of silicone oil with a viscosity of 50cs and add 0.2 parts by mass of silane coupling agent (KH-792), mix and stir evenly, then add 5 parts by mass of aminobenzoic acid modified aluminum oxide spherical powder, and stir evenly at 500r / min. Then add 2 parts by mass of MgO powder to the above mixture, stir evenly at high speed again to form a paste thermal interface material; add 0.02 parts by mass of 50cs silicone oil to the above mixture. Then put it in a vacuum drying oven, vacuum dry it for 3h, and finally put it in a three-roll mill and stir evenly to form a thermal interface material.
[0019] Example 2
[0020] Take 1 part by mass of silicone oil with a viscosity of 50cs and add 0.2 parts by mass of silane coupling agent (KH-792) and mix them evenly. Add 7 parts by mass of aminobenzoic acid-modified aluminum oxide spherical powder to the above solution, stir evenly at 500r / min, then add 2 parts by mass of MgO powder to the above mixture, stir evenly at high speed again to form a paste thermal interface material; add 0.02 parts by mass of 50cs silicone oil to the above mixture. Then put it in a vacuum drying oven, vacuum dry it for 3h, and finally put it in a three-roll mill and stir evenly to form a thermal interface material.
[0021] Example 3
[0022] Take 1 part by mass of silicone oil with a viscosity of 50cs and add 0.2 parts by mass of silane coupling agent (KH-792) and mix them evenly. Add 9 parts by mass of aminobenzoic acid-modified aluminum oxide spherical powder to the above solution and stir evenly at 500r / min. Then add 2 parts by mass of MgO powder to the above mixture and stir evenly at high speed again to form a paste thermal interface material. Add 0.02 parts by mass of 50cs silicone oil to the above mixture. Then put it in a vacuum drying oven, vacuum dry it for 3h, and finally put it in a three-roll mill and stir evenly to form a thermal interface material.
[0023] In Examples 1 to 3, we used the mass of aminobenzoic acid modified aluminum oxide spherical powder as a variable to prepare a high insulation and high thermal conductivity thermal interface material to obtain the optimal mass of aminobenzoic acid modified aluminum oxide spherical powder for preparing high thermal interface material.
[0024] The experimental results are summarized as follows:
[0025]
[0026] Example 4
[0027] Take 1 part by mass of silicone oil with a viscosity of 50cs and add 0.2 parts by mass of silane coupling agent (KH-792) and mix them evenly. Add 7 parts by mass of aminobenzoic acid-modified aluminum oxide spherical powder to the above solution and stir evenly at 500r / min. Then add 0.5 parts by mass of MgO powder to the above mixture and stir evenly at high speed again to form a paste thermal interface material. Add 0.02 parts by mass of 50cs silicone oil to the above mixture. Then put it in a vacuum drying oven, vacuum dry it for 3h, and finally put it in a three-roll mill and stir evenly to form a thermal interface material.
[0028] Example 5
[0029] Take 1 part by mass of silicone oil with a viscosity of 50cs and add 0.2 parts by mass of silane coupling agent (KH-792) and mix them evenly. Add 7 parts by mass of aminobenzoic acid-modified aluminum oxide spherical powder to the above solution and stir evenly at 500r / min. Then add 5 parts by mass of MgO powder to the above mixture and stir evenly at high speed again to form a paste thermal interface material. Add 0.02 parts by mass of 50cs silicone oil to the above mixture. Then put it in a vacuum drying oven, vacuum dry it for 3h, and finally put it in a three-roll mill and stir evenly to form a thermal interface material.
[0030] In Examples 2, 4, and 5, we prepared a high-insulation and high-thermal-conductivity granular material by using the amount of aminosilane coupling agent as a variable to obtain the optimal amount of KH-550 for preparing the granular material.
[0031] The experimental results are summarized as follows:
[0032]
Claims
1. A method for preparing an insulating thermally conductive thermal interface material, characterized in that: The preparation steps include: a. taking 1 part by mass of silicone oil with a viscosity of 50cs and 0.2 parts by mass of silane coupling agent (KH-792) and mixing them evenly according to the following proportions; b. adding 6 to 8 parts by mass of aminobenzoic acid-modified aluminum oxide spherical powder in step a and stirring them evenly; c. adding 1 to 4 parts by mass of MgO powder in step b and stirring them evenly again to form a paste thermal interface material; d. in step c, adding 0.01 to 0.5 parts by mass of 50cs silicone oil, vacuum drying, stirring evenly, and finally forming a thermal interface material.
2. The method for preparing the insulating thermally conductive thermal interface material according to claim 1, characterized in that: The preparation method of the aminobenzoic acid modified aluminum oxide spherical powder is as follows: according to the following proportions, 3 parts by mass of aminobenzoic acid (m-ABA) and 2 parts by mass of aminosilane coupling agent (KH-550) are added to 35 parts by mass of toluene solution, and then 55 parts by mass of aluminum oxide particles and 5 parts by mass of ethanol are added to obtain a colloid, which is then filtered and dried to obtain the aminobenzoic acid modified aluminum oxide spherical powder.
3. The method for preparing the insulating thermally conductive thermal interface material according to claim 1, characterized in that: The added amount of the aminobenzoic acid modified aluminum oxide spherical powder is 7 parts by mass.
4. The method for preparing the insulating thermally conductive thermal interface material according to claim 1, characterized in that: The added amount of MgO is 2 parts by mass.
5. The method for preparing the insulating thermally conductive thermal interface material according to claim 1, characterized in that: The stirring speed in each step is 500r / min.
6. The insulating thermally conductive thermal interface material obtained by the method according to any one of claims 1 to 5.
7. Application of the insulating thermal conductive thermal interface material according to claim 6 in chip protection.