Wafer transmission method, wafer processing method and wafer processing device

Abstract

The present application belongs to the field of wafer processing technology, and provides a wafer transmission method, a wafer processing method and a wafer processing device. The wafer transmission method includes controlling the wafer to move along a preset path, obtaining four encoder values ​​when the edge of the wafer passes through a first position sensor and a second position sensor to determine the actual center position of the wafer; then comparing the actual center position with the preset center position, and if the offset between the actual center position and the preset center position is greater than the first preset offset, the position of the wafer is corrected. The present application detects the four encoder values ​​of the wafer through two position sensors to determine the actual center position of the wafer, which reduces the number of position sensors and the cost of detecting the wafer position. In addition, the present application detects the wafer position while the wafer is moving along the preset path, and there is no need for the wafer to stop for detection, which can improve detection efficiency.

Description

Technical Field

[0001] The present application belongs to the field of wafer processing technology, and in particular relates to a wafer transmission method, a wafer processing method and a wafer processing device. Background Art

[0002] In the plasma dry stripping process equipment, a robot is required to move the wafer from the wafer stage to the process chamber. After the wafer completes the plasma dry stripping in the process chamber, the wafer in the process chamber is moved back to the wafer stage to be placed in the wafer boat on the wafer stage. During wafer processing or wafer movement, the wafer will shift. In the case that the wafer shifts, when the wafer is placed back on the wafer boat on the wafer stage, the wafer will collide with the edge of the wafer boat, which will damage the wafer, and when the wafer position shifts too much, the wafer cannot be correctly placed back on the wafer boat.

[0003] However, the wafer transfer method in the prior art for detecting the position of the wafer and correcting the position of the wafer during the wafer movement process is inefficient and has a high cost. Summary of the invention

[0004] The technical problem to be solved by the present application is to provide a wafer transmission method, aiming to improve the efficiency of the wafer transmission method for detecting and correcting the wafer position and to reduce the cost.

[0005] To solve the above technical problems, in a first aspect, the present application provides a wafer transmission method, which is applied to a wafer processing device, wherein the wafer processing device comprises a process chamber, a wafer stage, a manipulator, and a sensor group, wherein the manipulator is used to move the wafer in the process chamber to the wafer stage, or to move the wafer on the wafer stage to the process chamber, wherein the sensor group comprises a first position sensor and a second position sensor, wherein the first position sensor and the second position sensor are asymmetrically arranged on both sides of a preset path of movement of the wafer, and wherein the wafer transmission method comprises:

[0006] Controlling the wafer to move along the preset path;

[0007] Acquire four encoder values ​​when the edge of the wafer passes through the first position sensor and the second position sensor;

[0008] Determine the actual center position of the wafer according to the four encoder values;

[0009] comparing the actual center position with the preset center position;

[0010] If the offset between the actual center position and the preset center position is greater than a first preset offset, the position of the wafer is corrected.

[0011] Further, determining the actual center position of the wafer according to the four encoder values ​​includes:

[0012] Obtaining coordinate positions of four edges of the wafer according to the four encoder values;

[0013] The actual center position of the wafer is determined according to the coordinate positions of the four wafer edges.

[0014] Furthermore, the wafer processing device includes a wafer correction mechanism, which includes three lifting components, and the three lifting components are arranged in a triangle. When correcting the position of the wafer, the wafer is located above the wafer correction mechanism, and at least one of the lifting components is controlled to rise. The raised lifting component contacts the wafer to move the wafer.

[0015] Furthermore, the wafer correction mechanism is located on the preset path, and corrects the position of the wafer in the preset path of movement of the wafer.

[0016] Furthermore, the wafer deflection correction mechanism is located in the process chamber and between the sensor group and the wafer stage.

[0017] Further, after the step of comparing the actual center position with the preset center position, the wafer transmission method includes:

[0018] If the offset between the actual center position and the preset center position is greater than or equal to a second preset offset, an alarm is issued;

[0019] The second preset offset is greater than the first preset offset.

[0020] Furthermore, the wafer transmission method comprises:

[0021] If it is detected for multiple consecutive times that the offset between the actual center position and the preset center position is greater than the first preset offset, an alarm is issued.

[0022] In a second aspect, the present application provides a wafer processing method, which is applied to a wafer processing device, wherein the wafer processing device includes a process chamber, a wafer stage, a manipulator, and a sensor group, and the wafer processing method includes:

[0023] Controlling the robot to move the wafer on the wafer stage to the process chamber;

[0024] Controlling the process chamber to perform process processing on the wafer;

[0025] After the wafer process is completed, controlling the robot to move the wafer in the process chamber to the wafer stage;

[0026] Among them, the robot is controlled to move the wafer in the process chamber to the path of the wafer carrier, or the robot is controlled to move the wafer on the wafer carrier to the path of the process chamber, and the wafer processing method is applied by any of the wafer transmission methods described above for transmission.

[0027] In a third aspect, the present application provides a wafer processing device, which includes a process chamber, a wafer stage, a robot, and a sensor group, wherein the robot is used to move the wafer in the process chamber to the wafer stage, or to move the wafer on the wafer stage to the process chamber, and the sensor group includes a first position sensor and a second position sensor, wherein the first position sensor and the second position sensor are asymmetrically arranged on both sides of a preset path of movement of the wafer;

[0028] The wafer processing device uses any one of the wafer transmission methods described above for transmission, or uses any one of the wafer processing methods described above for processing.

[0029] Further, the wafer processing device includes a wafer deflection correction mechanism, the wafer deflection correction mechanism includes three lifting components, the three lifting components are arranged in a triangle, when the wafer position is corrected, the wafer is located above the wafer deflection correction mechanism, at least one of the lifting components is controlled to rise, and the raised lifting component contacts the wafer to move the wafer;

[0030] The wafer deviation correction mechanism is located on the preset path, and corrects the position of the wafer in the preset path where the wafer moves;

[0031] The wafer deflection correction mechanism is located in the process chamber and between the sensor group and the wafer stage.

[0032] The present application discloses a wafer transmission method, which is applied to a wafer processing device. The wafer processing device includes a process chamber, a wafer stage, a manipulator, and a sensor group. The manipulator is used to move the wafer in the process chamber to the wafer stage, or to move the wafer on the wafer stage to the process chamber. The sensor group includes a first position sensor and a second position sensor. The first position sensor and the second position sensor are asymmetrically arranged on both sides of the preset path of the wafer movement. The wafer transmission method first controls the wafer to move along the preset path; then, obtains four encoder values ​​when the edge of the wafer passes through the first position sensor and the second position sensor; then, determines the actual center position of the wafer according to the four encoder values; then, compares the actual center position with the preset center position, and if the offset between the actual center position and the preset center position is greater than the first preset offset, the position of the wafer is corrected. The present application detects the four encoder values ​​of the wafer through two position sensors, thereby determining the actual center position of the wafer, reducing the number of position sensors and reducing the cost of detecting the wafer position. In addition, the wafer position detection of the present application is performed while the wafer is moving along the preset path, and there is no need for the wafer to stop for detection, which can improve the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a schematic structural diagram of a wafer processing device in an embodiment of the present application;

[0034] Figure 2 It is a schematic flow chart of a wafer transmission method in an embodiment of the present application;

[0035] Figure 3 is a flow chart of the decomposition steps of step S3 in the embodiment of the present application;

[0036] Figure 4 It is a schematic diagram of a path in which a wafer moves along a preset path and passes through a sensor group in an embodiment of the present application;

[0037] Figure 5 is a top view of the wafer deflection correction mechanism in an embodiment of the present application;

[0038] Figure 6 It is a flow chart of the wafer processing method in the embodiment of the present application.

[0039] In the accompanying drawings, each reference numeral represents: 1. process chamber; 2. sensor group; 21. first position sensor; 22. second position sensor; 3. robot; 4. wafer processing device; 5. wafer stage; 6. wafer deflection correction mechanism; 61. lifting component. DETAILED DESCRIPTION

[0040] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0041] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0043] In the plasma dry stripping process equipment, the wafer is processed, and the robot 3 is required to move the wafer from the wafer carrier 5 to the process chamber 1. After the wafer completes the plasma dry stripping in the process chamber 1, the wafer in the process chamber 1 is moved back to the wafer carrier 5 to be placed in the wafer boat of the wafer carrier 5. During the wafer processing or wafer movement process, the wafer will shift. In the case that the wafer shifts, when the wafer is placed back on the wafer boat on the wafer carrier 5, the wafer will collide with the edge of the wafer boat, which will damage the wafer, and when the wafer position shifts too much, the wafer cannot be correctly placed back on the wafer boat.

[0044] The conventional wafer transfer method for detecting and correcting the wafer position during wafer movement is inefficient and has high cost.

[0045] In view of the above-mentioned technical problems, the present application provides a wafer transmission method, aiming to improve the efficiency of the wafer transmission method for detecting and correcting the wafer position and reduce the cost.

[0046] In the embodiment of the present application, the wafer transmission method is applied to the wafer processing device 4. Figure 1 As shown, the wafer processing device 4 includes a process chamber 1, a wafer stage 5, a robot 3, and a sensor group 2. The robot 3 is used to move the wafer in the process chamber 1 to the wafer stage 5, or to move the wafer on the wafer stage 5 to the process chamber 1. The sensor group 2 includes a first position sensor 21 and a second position sensor 22. The first position sensor 21 and the second position sensor 22 are asymmetrically arranged on both sides of the preset path of the wafer movement. The first position sensor 21 and the second position sensor 22 are used to record the coded values ​​when the wafer passes through the first position sensor 21 and the second position sensor 22 when the wafer moves along the preset path, and when the edge of the wafer passes through the first position sensor 21 and the second position sensor 22, so that the wafer position or the actual center position of the wafer can be determined through four coded values. The center position of the wafer can be the center position of the wafer.

[0047] It can be seen from the above embodiments that the wafer processing device 4 of the present application is provided with a first position sensor 21 and a second position sensor 22, which can detect four coding values, and has a lower cost than the wafer processing device 4 in the prior art that detects the position of the wafer by three position sensors.

[0048] In some embodiments, the wafer processing device 4 includes a controller, which is connected to the first position sensor 21 and the second position sensor 22 by signal, receives the coded values ​​detected by the first position sensor 21 and the second position sensor 22, and determines the actual center position of the wafer according to the coded values. The first position sensor 21 and / or the second position sensor 22 include a transmitter and a receiver, the transmitter is used to transmit light, and the receiver is used to receive the light emitted by the transmitter. When the wafer passes through the first position sensor 21 or the second position sensor 22, the transmitter and the receiver are respectively located above and below the wafer, so that when the wafer passes through the first position sensor 21 or the second position sensor 22, the wafer blocks the light emitted by the transmitter, thereby causing the receiver to not receive the light emitted by the transmitter. When the edge of the wafer passes through the first position sensor 21 or the second position sensor 22, the receiver changes from not receiving the light emitted by the transmitter to being able to receive the light emitted by the transmitter, or the receiver changes from being able to receive the light emitted by the transmitter to not receiving the light emitted by the transmitter. The first position sensor 21 or the second position sensor 22 records the encoding value when the wafer edge passes through the first position sensor 21 or the second position sensor 22 according to these changes.

[0049] It can be understood that the manipulator 3 moves along a preset route, so that the wafer moves along a roughly preset path. The manipulator 3 carries / grabs the wafer to move. If the wafer position does not shift, the relative position of the manipulator 3 and the wafer is the preset relative position. At this time, the manipulator 3 carries / grabs the wafer to move, and the wafer moves along the preset path. The wafer will pass through the first position sensor 21 and the second position sensor 22. The manipulator 3 carries / grabs the wafer to move. If the wafer position shifts, the relative position of the manipulator 3 and the wafer is not the preset relative position. At this time, the manipulator 3 carries / grabs the wafer to move, and the movement path of the wafer is offset from the preset path, but the wafer still moves along the roughly preset path, and the amount of offset is less than or equal to 4mm. The amount of offset between the movement path of the wafer and the preset path is less than or equal to 4mm, which belongs to the range of the wafer moving along the preset path.

[0050] A wafer boat is provided on the wafer stage 5. The wafer boat is a wafer container for accommodating and holding wafers. However, the wafer boat has a size, and the size is adapted to the size of the wafer, so that the wafer is conveniently placed in the wafer boat. The wafer is limited in position in the wafer boat and will not be displaced significantly. Therefore, the position of the wafer when it is placed in the wafer boat is very important, which determines whether the wafer can be correctly placed in the wafer boat without colliding with the wafer boat. The present application detects the position of the wafer during the wafer movement process to determine whether the position of the wafer is offset, so as to correct the position of the wafer in a timely manner if the position of the wafer is offset.

[0051] As attached Figure 2 FIG. 2 is a flow chart of a wafer transmission method in an embodiment of the present application. As can be seen from the accompanying drawings, the wafer transmission method includes step S1, step S2, step S3, step S4, and step S5.

[0052] S1: Control the wafer to move along a preset path.

[0053] When the wafer is processed in the wafer processing device 4, it is necessary to move the wafer in the wafer boat on the wafer carrier 5 to the process chamber 1. After the processing in the process chamber 1 is completed, the wafer in the process chamber 1 is moved to the wafer boat on the wafer carrier 5. The movement of the wafer between the process chamber 1 and the wafer carrier 5 is a basic step in the processing of the wafer in the wafer processing device 4. During the wafer movement process, the wafer is controlled to move along a preset path to ensure that the wafer can maintain the position when it leaves the wafer boat when it returns to the wafer boat, so that it is convenient to take and place the wafer on the wafer boat.

[0054] It can be understood that the preset route is a line, and the movement of the wafer along the preset path means that the center of the wafer moves along the preset path.

[0055] S2: Acquire four encoder values ​​when the edge of the wafer passes through the first position sensor 21 and the second position sensor 22 .

[0056] In this embodiment, in the process of the wafer moving along the preset path, the edge points of the wafer are detected by the first position sensor 21 and the second position sensor 22. Since the wafer is moving, there are four edge points of the wafer passing through the first position sensor 21 and the second position sensor 22. The first position sensor 21 and the second position sensor 22 can generate four encoder values. In the process of the wafer moving along the preset path, the edge points of the wafer are detected by the first position sensor 21 and the second position sensor 22, and four encoding values ​​can be generated. The coordinate positions of the four edge points of the wafer are determined by the encoding values, thereby determining the wafer position or the actual center position of the wafer. Compared with the prior art that detects the three position edge points of the wafer by three position sensors, the present application can save one position sensor on the one hand and reduce the cost of detecting the wafer position. On the other hand, detection is performed in the process of the wafer moving along the preset path, and the wafer does not need to stop for detection, which can improve the efficiency of detection.

[0057] S3: Determine the actual center position of the wafer based on the four encoder values.

[0058] S4: Compare the actual center position with the preset center position.

[0059] The preset center position is preset in advance. When the actual center position of the wafer is at the preset center position, the wafer can be correctly placed back into the wafer boat to avoid the wafer colliding with the wafer boat or failing to be correctly placed in the wafer boat.

[0060] S5: If the offset between the actual center position and the preset center position is greater than the first preset offset, the position of the wafer is corrected.

[0061] The first preset offset is used to compare with the offset of the wafer. Within the first preset offset, the wafer can still be correctly placed in the wafer boat without colliding with the wafer boat. Correcting the position of the wafer can be correcting the relative position of the wafer and the manipulator, or the relative position of the wafer and the preset path, so that the distance difference between the center position of the wafer and the preset path is less than the first preset offset. The first preset offset and the preset center position are set according to actual conditions, and this application does not impose specific restrictions on the first preset offset and the preset center position.

[0062] Exemplarily, the wafer boat is a standard container. When the robot 3 moves the wafer back to the wafer boat, the deviation between the actual center position of the wafer and the preset center position cannot exceed the first preset offset, and the first preset offset is 1mm. When the wafer is taken out of the process chamber 1, the wafer position deviation is detected. The reasons for this deviation are generally: the wafer is offset in the process chamber 1. Generally, the process chamber 1 will have a wafer limit device to limit the wafer movement range to less than 2mm. Of course, the ideal state is that the wafer does not move in the process chamber 1. Compared with the first preset offset, if the offset between the actual center position and the preset center position is greater than the first preset offset, the position of the wafer is corrected. Compared with the first preset offset, if the offset between the actual center position and the preset center position is less than or equal to the first preset offset, the wafer is directly moved back to the wafer boat.

[0063] It can be seen from the above embodiments that the present application detects the four encoder values ​​of the wafer through two position sensors, thereby determining the actual center position of the wafer, reducing the number of position sensors and lowering the cost of detecting the wafer position. In addition, the present application detects the wafer position while the wafer is moving along a preset path, and there is no need for the wafer to stop for detection, thereby improving detection efficiency.

[0064] As attached Figure 3 As shown, in some embodiments, step S3, determining the actual center position of the wafer according to four encoder values, includes step S31 and step S32.

[0065] S31: Obtain the coordinate positions of four wafer edges according to the four encoder values.

[0066] S32: Determine the actual center position of the wafer according to the coordinate positions of the four wafer edges.

[0067] The coded value can be converted into a coordinate position. The first position sensor 21 detects two coded values. The first wafer edge point detected by the first position sensor 21 can be used as the starting position. The incremental change from the detection of the first wafer edge point to the second wafer edge point includes speed and detection time, thereby giving the coordinate positions of the first wafer edge point and the second wafer edge point in the preset coordinates. Similarly, the coordinate positions of the two wafer edge points detected by the second position sensor 22 can be calculated, and the relative positions of the first position sensor 21 and the second position sensor 22 are fixed, so the coordinate positions of the four wafer edge points in the same coordinate system can be determined. Then, the position of the wafer or the actual center position of the wafer is determined by the four coordinate positions.

[0068] As attached Figure 4As shown, it can be understood that the first position sensor 21 and the second position sensor 22 are asymmetrically arranged on both sides of the preset path of wafer movement, and the ordinate and abscissa of the coordinate positions of the two wafer edge points obtained by the first position sensor 21 are different from the ordinate and abscissa of the coordinate positions of the two wafer edge points obtained by the second position sensor 22, so that the coordinate positions of the four wafer edge points are all valid, so that the accurate wafer position or the actual center position of the wafer can be obtained through the coordinate positions of the four wafer edge points. The coordinate positions of the four wafer edge points are point A, point B, point C and point D respectively. Point A and point B are the coordinate positions of the two wafer edge points obtained by the first position sensor 21, and point C and point D are the coordinate positions of the two wafer edge points obtained by the second position sensor 22. The ordinates of point A and point C / point D are different, and the abscissas are also different. Similarly, the ordinates of point B and point C / point D are different, and the abscissas are also different. In this way, point A, point B, point C and point D are four valid coordinate positions. A circle can be determined based on the coordinates of the three points. Then, the position of the wafer or the actual center position O of the wafer can be determined based on any three points among point A, point B, point C and point D.

[0069] For example, see again the attached Figure 4 , the distance L1 between the first position sensor 21 and the preset route S, and the distance L2 between the second position sensor 22 and the preset route. The radius of the wafer is R, the sum of the distance L1 and the distance L2 is 1.2R-1.4R, and the difference between the distance L2 and the distance L1 is 0.1R-0.3R. With this arrangement, when the wafer deviates and moves along the preset route, the wafer can still pass through the first position sensor 21 and the second position sensor 22.

[0070] As attached Figure 1 and attached Figure 5 As shown, in some embodiments, the wafer processing device 4 includes a wafer correction mechanism 6, and the wafer correction mechanism 6 includes three lifting components 61, and the three lifting components 61 are arranged in a triangle. When correcting the position of the wafer, the wafer is located above the wafer correction mechanism 6, and at least one lifting component 61 is controlled to rise, and the raised lifting component 61 contacts the wafer to move the wafer. The arrangement of the three lifting components 61 can correct the position of the wafer by controlling at least one lifting component 61 to rise when the wafer is placed above the wafer correction mechanism 6. Exemplarily, the three lifting components 61 are arranged in an equilateral triangle, so that no matter in which direction the wafer is offset, it can be corrected by the wafer correction mechanism 6.

[0071] In some embodiments, the lifting component 61 includes a lifting portion (not shown in the figure), which is conical. When the lifting component 61 is raised, the tip of the conical lifting portion contacts the wafer and gently lifts the wafer, so that the wafer moves toward the lifting component 61 that is not raised, thereby achieving the purpose of correcting the wafer position.

[0072] See again the attached Figure 1 In some embodiments, the wafer correction mechanism 6 is located in a preset path, and corrects the position of the wafer in the preset path of the wafer movement. There is no need to move the wafer to other places for correction, and the position of the wafer can be corrected without leaving the preset path, which can improve the efficiency of wafer correction.

[0073] See again the attached Figure 1 In other embodiments, the wafer correction mechanism 6 is not located in the preset path. When correcting the wafer position, the wafer can be moved to the wafer correction mechanism 6 for correction and then returned to the preset path.

[0074] In some embodiments, the wafer deflection correction mechanism 6 is located in the process chamber 1 and between the sensor group 2 and the wafer stage 5. The wafer generally deflects when it is being processed in the process chamber 1. In this case, it is most appropriate to correct the position of the wafer when the wafer is moved back to the wafer boat on the wafer stage 5. The wafer deflection correction mechanism 6 is located in the process chamber 1, and can correct the position of the wafer after the wafer is processed in the process chamber 1 and the sensor group 2 detects the actual center position of the wafer.

[0075] In some embodiments, after comparing the actual center position with the preset center position in step S4, the wafer transfer method includes step S5.

[0076] S5: If the offset between the actual center position and the preset center position is greater than or equal to the second preset offset, an alarm is issued.

[0077] Among them, the second preset offset is greater than the first preset offset. It can be understood that when the offset between the actual center position and the preset center position is greater than or equal to the second preset offset, it is abnormal. During the normal processing of the wafer on the wafer processing device 4, it usually does not happen that the wafer offset is greater than or equal to the second preset offset. If the wafer offset is greater than or equal to the second preset offset, it may be that the robot 3 is loose and offset, which leads to the situation that the wafer offset is greater than or equal to the second preset offset. At this time, the alarm notifies the staff and asks the staff to repair the robot 3 to avoid the situation where the wafer is offset and needs to be corrected in the future.

[0078] From the above embodiment, it can be seen that the process chamber 1 has a wafer limiting device (not marked in the figure) to limit the wafer movement range to less than 2mm. When the offset between the actual center position of the wafer and the preset center position is greater than or equal to 2mm, the cause of the wafer position offset is no longer the wafer offset in the process chamber 1, but may be caused by the offset of the physical structure of the manipulator 3, such as the loosening of the screws of the manipulator 3. At this time, setting the second preset offset to 2mm can effectively detect the cause of the offset of the actual center position of the wafer.

[0079] In some embodiments, the wafer transfer method includes step S6.

[0080] S6: If it is detected for multiple consecutive times that the offset between the actual center position and the preset center position is greater than the first preset offset, an alarm is issued.

[0081] It is understandable that the actual center position of the wafer is shifted for multiple consecutive times, which is an abnormal situation. Usually, the robot 3 may be loose or the position of the robot 3 may be shifted, which will cause the actual center position of the wafer to shift for multiple consecutive times. At this time, the alarm notifies the staff to repair the robot 3 to avoid the situation where the wafer is shifted and needs to be corrected. The number of consecutive times can be preset, which can be 5 consecutive times, 6 consecutive times, etc. The specific number of consecutive times can be set according to the actual situation.

[0082] As attached Figure 6 As shown, an embodiment of the present application provides a wafer processing method, which is applied to a wafer processing device 4, the wafer processing device 4 includes a process chamber 1, a wafer carrier 5, a robot 3, and a sensor group 2, and the wafer processing method includes step S101, step S102, and step S103.

[0083] S101 : controlling the robot 3 to move the wafer on the wafer stage 5 to the process chamber 1 .

[0084] S102: Control process chamber 1 to perform process processing on the wafer.

[0085] S103 : After the wafer process is completed, the robot arm 3 is controlled to move the wafer in the process chamber 1 to the wafer stage 5 .

[0086] Among them, the robot 3 is controlled to move the wafer in the process chamber 1 to the path of the wafer stage 5, or the robot 3 is controlled to move the wafer on the wafer stage 5 to the path of the process chamber 1. The wafer processing method is applied to the wafer transmission method implemented in any one of the above. The steps of the wafer processing method and its beneficial effects have been described in detail in the above embodiments. Since the wafer processing method includes the wafer transmission method, it also includes the steps and beneficial effects in the above embodiments, which will not be repeated here.

[0087] For example, the process may be a plasma dry stripping process, plasma etching, etc. In a typical plasma etching process, different process gas combinations (such as CxFy, NF3, O2, Ar, etc.) are excited by radio frequency in a radio frequency environment to form plasma. The formed plasma physically bombards and chemically reacts with the surface of the wafer (WAFER) under the action of the electric field of the upper and lower electrodes of the etching chamber, completing the processing of the wafer surface design pattern and key processes.

[0088] The embodiment of the present application provides a wafer processing device 4, which includes a process chamber 1, a wafer stage 5, a robot 3, and a sensor group 2. The robot 3 is used to move the wafer in the process chamber 1 to the wafer stage 5, or to move the wafer on the wafer stage 5 to the process chamber 1. The sensor group 2 includes a first position sensor 21 and a second position sensor 22. The first position sensor 21 and the second position sensor 22 are asymmetrically arranged on both sides of the preset path of the wafer movement. The structure and beneficial effects of the wafer processing device 4 have been described in the embodiment of the above-mentioned wafer transmission method, and will not be repeated here.

[0089] The wafer processing device 4 applies the wafer transmission method of any of the above-mentioned embodiments to transfer, or applies the wafer processing method of the above-mentioned embodiments to process. The steps of the wafer processing method and its beneficial effects have been described in detail in the above-mentioned embodiments. Since the wafer processing device 4 applies the wafer transmission method, the wafer processing device 4 includes the steps and its beneficial effects in the above-mentioned embodiments during use, which will not be repeated here.

[0090] The arrangement of the three lifting components 61 can correct the position of the wafer by controlling at least one lifting component 61 to rise when the wafer is placed above the wafer deflection correction mechanism 6. Exemplarily, the three lifting components 61 are arranged in an equilateral triangle, so that no matter which direction the wafer deflects, it can be corrected by the wafer deflection correction mechanism 6.

[0091] In some embodiments, the lifting component 61 includes a lifting portion, and the lifting portion is conical. When the lifting component 61 is raised, the tip of the conical lifting portion contacts the wafer and gently lifts the wafer, so that the wafer moves toward the lifting component 61 that is not raised, thereby achieving the purpose of correcting the wafer position. Exemplarily, the tip of the cone can be blunt.

[0092] In some embodiments, the wafer correction mechanism 6 is located in a preset path, and corrects the position of the wafer in the preset path of the wafer movement. There is no need to move the wafer to other places for correction, and the position of the wafer can be corrected without leaving the preset path, which can improve the efficiency of wafer correction.

[0093] In some embodiments, the wafer deflection correction mechanism 6 is located in the process chamber 1 and between the sensor group 2 and the wafer stage 5. The wafer generally deflects when it is being processed in the process chamber 1. Then, when the wafer is moved back to the wafer boat on the wafer stage 5, the position of the wafer is corrected to the most appropriate time. The wafer deflection correction mechanism 6 is located in the process chamber 1, and the position of the wafer can be corrected after the wafer is processed in the process chamber 1 and the actual center position of the wafer is detected by the sensor group 2.

[0094] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A wafer transmission method, characterized in that: The wafer transmission method is applied to a wafer processing device, the wafer processing device includes a process chamber, a wafer stage, a manipulator, and a sensor group, the manipulator is used to move the wafer in the process chamber to the wafer stage, or move the wafer on the wafer stage to the process chamber, the sensor group includes a first position sensor and a second position sensor, the first position sensor and the second position sensor are asymmetrically arranged on both sides of a preset path for the wafer to move, wherein the distance L1 between the first position sensor and the preset route, the distance L2 between the second position sensor and the preset route, and the radius R of the wafer satisfy the following relationship: the sum of the distance L1 and the distance L2 is 1.2R to 1.4R, and the difference between the distance L2 and the distance L1 is 0.1R to 0.3R; the wafer transmission method includes: Controlling the wafer to move along the preset path; Acquire four encoder values ​​when the edge of the wafer passes through the first position sensor and the second position sensor; Obtaining coordinate positions of four wafer edges according to the four encoder values; Determining the actual center position of the wafer according to the coordinate positions of the four wafer edges; comparing the actual center position with the preset center position; If the offset between the actual center position and the preset center position is greater than a first preset offset and less than a second preset offset, the position of the wafer is corrected, the first preset offset is 1 mm, and the second preset offset is 2 mm.

2. The wafer transmission method according to claim 1, characterized in that: The wafer processing device includes a wafer correction mechanism, which includes three lifting components. The three lifting components are arranged in a triangle. When correcting the position of the wafer, the wafer is located above the wafer correction mechanism, and at least one of the lifting components is controlled to rise. The raised lifting component contacts the wafer to move the wafer.

3. The wafer transmission method according to claim 2, characterized in that: The wafer deviation correction mechanism is located on the preset path and corrects the position of the wafer in the preset path where the wafer moves.

4. The wafer transmission method according to claim 3, characterized in that: The wafer deflection correction mechanism is located in the process chamber and between the sensor group and the wafer stage.

5. The wafer transmission method according to claim 1, characterized in that: After the step of comparing the actual center position with the preset center position, the wafer transfer method includes: If the offset between the actual center position and the preset center position is greater than or equal to a second preset offset, an alarm is issued.

6. The wafer transmission method according to claim 1, characterized in that: The wafer transmission method comprises: If it is detected for multiple consecutive times that the offset between the actual center position and the preset center position is greater than the first preset offset, an alarm is issued.

7. A wafer processing method, characterized in that: The wafer processing method is applied to a wafer processing device, the wafer processing device includes a process chamber, a wafer stage, a manipulator, and a sensor group, and the wafer processing method includes: Controlling the robot to move the wafer on the wafer stage to the process chamber; Controlling the process chamber to perform process processing on the wafer; After the wafer process is completed, controlling the robot to move the wafer in the process chamber to the wafer stage; Among them, the robot is controlled to move the wafer in the process chamber to the path of the wafer carrier, or the robot is controlled to move the wafer on the wafer carrier to the path of the process chamber, and the wafer processing method is applied to the wafer transmission method described in any one of claims 1-6 for transmission.

8. A wafer processing device, characterized in that: The wafer processing device includes a process chamber, a wafer stage, a robot, and a sensor group, wherein the robot is used to move the wafer in the process chamber to the wafer stage, or to move the wafer on the wafer stage to the process chamber, and the sensor group includes a first position sensor and a second position sensor, wherein the first position sensor and the second position sensor are asymmetrically arranged on both sides of a preset path of movement of the wafer; Wherein, the wafer processing device is transmitted using the wafer transmission method described in any one of claims 1 to 6, or is processed using the wafer processing method described in claim 7.

9. The wafer processing device according to claim 8, characterized in that: The wafer processing device includes a wafer deflection correction mechanism, which includes three lifting components, which are arranged in a triangle. When correcting the position of the wafer, the wafer is located above the wafer deflection correction mechanism, and at least one of the lifting components is controlled to rise, and the raised lifting component contacts the wafer to move the wafer; The wafer deviation correction mechanism is located on the preset path, and corrects the position of the wafer in the preset path where the wafer moves; The wafer deflection correction mechanism is located in the process chamber and between the sensor group and the wafer stage.

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