Circuit board and manufacturing method thereof

Abstract

A circuit board comprises a core layer and two circuit structures. The core layer has a first surface and a second surface opposite to each other. The two circuit structures are respectively arranged on the first surface and the second surface. Each circuit structure comprises a substrate, an insulating layer, a metal pattern layer and a metal layer. The substrate comprises two through holes which are arranged at intervals and expose the first surface. The insulating layer is disposed in one of the two through holes and contacts the first surface. The metal pattern layer comprises a first heat conduction part and a circuit part. The first heat conduction part is arranged on the insulating layer. The circuit part is arranged in the other one of the two through holes and forms a cavity with the first surface. The metal layer comprises a second heat conduction part and a conduction part. The second heat conduction part is arranged on the first heat conduction part. The conduction part is arranged on the base material. The circuit board can improve the product yield.

Description

Technical Field

[0001] The present invention relates to a circuit board and a manufacturing method thereof, and in particular to a circuit board with multiple functional element channels and a manufacturing method thereof. Background Art

[0002] As electronic products are moving towards lightweight and miniaturization, more and more products are designing multiple channels for different signals or energies on the same circuit board, where the aforementioned channels are, for example, heat conduction channels for heat dissipation, high current channels, and high-speed or high-frequency signal transmission channels with cavities. However, component channels with different functions have different sizes (such as length or width) and structures, and making these channels with different functions on the same circuit board usually requires a very complex and difficult process, which makes it difficult to improve the yield, or even reduces it. Summary of the invention

[0003] The object of the present invention is to provide a circuit board with multiple functional element channels, which can improve product yield.

[0004] Another object of the present invention is to provide a method for manufacturing a circuit board to help improve the product yield of the circuit board.

[0005] A circuit board proposed in at least one embodiment of the present invention comprises a core layer, a first circuit structure and a second circuit structure. The core layer has a first surface and a second surface opposite to the first surface. The first circuit structure is disposed on the first surface and comprises a first substrate, a first insulating layer, a first metal pattern layer and a first metal layer. The first substrate comprises a first through hole and a second through hole spaced apart from the first through hole, and the first through hole and the second through hole expose the first surface. The first insulating layer is disposed in the first through hole and contacts the first surface. The first metal pattern layer comprises a first heat conducting portion and a first circuit portion, the first heat conducting portion is disposed on the first insulating layer, the first circuit portion is disposed in the second through hole and forms a first cavity with the first surface. The first metal layer comprises a second heat conducting portion and a first conducting portion, the second heat conducting portion is disposed on the first heat conducting portion, and the first conducting portion is disposed on the first substrate. The second circuit structure is disposed on the second surface and comprises a second substrate, a second insulating layer, a second metal pattern layer and a second metal layer. The second substrate comprises a third through hole and a fourth through hole spaced apart from the third through hole, and the third through hole and the fourth through hole expose the second surface. The second insulating layer is disposed in the third through hole and contacts the second surface. The second metal pattern layer includes a third heat conducting portion and a second circuit portion, the third heat conducting portion is disposed on the second insulating layer, the second circuit portion is disposed in the fourth through hole and forms a second cavity with the second surface. The second metal layer includes a fourth heat conducting portion and a second conducting portion, the fourth heat conducting portion is disposed on the third heat conducting portion, and the second conducting portion is disposed on the second substrate.

[0006] In at least one embodiment of the present invention, the circuit board includes a heat conduction channel, a circuit channel and a current channel, the heat conduction channel includes a first insulating layer, a first heat conduction part, a second heat conduction part, a second insulating layer, a third heat conduction part and a fourth heat conduction part, the circuit channel includes a first circuit part, a first cavity, a second circuit part and a second cavity, and the current channel includes a first conductive part and a second conductive part.

[0007] In at least one embodiment of the present invention, the first circuit structure further includes a third metal pattern layer, the third metal pattern layer includes a fifth heat conducting portion and a third conductive portion, the fifth heat conducting portion is arranged on the second heat conducting portion, and the third conductive portion is arranged on the first conductive portion, and the second circuit structure further includes a fourth metal pattern layer, the fourth metal pattern layer includes a sixth heat conducting portion and a fourth conductive portion, the sixth heat conducting portion is arranged on the fourth heat conducting portion, and the fourth conductive portion is arranged on the second conductive portion.

[0008] In at least one embodiment of the present invention, the heat conduction channel further includes a fifth heat conduction portion and a sixth heat conduction portion, and the current channel further includes a third conduction portion and a fourth conduction portion.

[0009] A method for manufacturing a circuit board proposed in at least one embodiment of the present invention includes providing a first initial substrate and a second initial substrate. Forming a first initial metal layer on the first initial substrate, and forming a second initial metal layer on the second initial substrate. Patterning the first initial substrate to form a first substrate having a first through-hole and a second through-hole arranged at intervals, and patterning the second initial substrate to form a second substrate having a third through-hole and a fourth through-hole arranged at intervals. Forming a first metal pattern layer in the first through-hole and the second through-hole, and forming a second metal pattern layer in the third through-hole and the fourth through-hole. Forming a first insulating layer on the first metal pattern layer in the first through-hole, and forming a second insulating layer on the second metal pattern layer in the third through-hole. Providing a core layer. Afterwards, laminating the first substrate and the core layer to form a first cavity located in the second through-hole, and laminating the second substrate and the core layer to form a second cavity located in the fourth through-hole. Patterning the first initial metal layer to form a first metal layer, and patterning the second initial metal layer to form a second metal layer.

[0010] In at least one embodiment of the present invention, the step of forming the first metal pattern layer includes forming the first heat conducting portion in the first through hole and forming the first circuit portion in the second through hole. The step of patterning the first initial metal layer includes forming the second heat conducting portion on the first heat conducting portion and forming the first conductive portion on the second substrate. The step of forming the second metal pattern layer includes forming the third heat conducting portion in the third through hole and forming the second circuit portion in the fourth through hole. The step of patterning the second initial metal layer includes forming the fourth heat conducting portion on the third heat conducting portion and forming the second conductive portion on the second substrate.

[0011] In at least one embodiment of the present invention, the first insulating layer, the first heat conducting portion, the second heat conducting portion, the second insulating layer, the third heat conducting portion and the fourth heat conducting portion form a heat conducting channel, the first circuit portion, the first cavity, the second circuit portion and the second cavity form a circuit channel, and the first conductive portion and the second conductive portion form a current channel.

[0012] In at least one embodiment of the present invention, before patterning the first initial metal layer and the second initial metal layer, the method further includes forming a third metal pattern layer on the first initial metal layer and forming a fourth metal pattern layer on the second initial metal layer.

[0013] In at least one embodiment of the present invention, the step of forming the third metal pattern layer includes forming a fifth heat conducting portion, the second heat conducting portion is located between the first heat conducting portion and the fifth heat conducting portion, and forming a third conductive portion, the first conductive portion is located between the first substrate and the third conductive portion, and the step of forming the fourth metal pattern layer includes forming a sixth heat conducting portion, the fourth heat conducting portion is located between the third heat conducting portion and the sixth heat conducting portion, and forming a fourth conductive portion, the second conductive portion is located between the second substrate and the fourth conductive portion.

[0014] In at least one embodiment of the present invention, the heat conduction channel further includes a fifth heat conduction portion and a sixth heat conduction portion, and the current channel further includes a third conduction portion and a fourth conduction portion.

[0015] In at least one embodiment of the present invention, the depth of the first through hole and the depth of the second through hole are respectively greater than the thickness of the first metal pattern layer, and the depth of the third through hole and the depth of the fourth through hole are respectively greater than the thickness of the second metal pattern layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a partial cross-sectional schematic diagram of a circuit board according to at least one embodiment of the present invention; and

[0017] Figure 2A to Figure 2L It is a partial cross-sectional view of a circuit board in different process stages according to at least one embodiment of the present invention. DETAILED DESCRIPTION

[0018] In the following text, in order to clearly present the technical features of the present invention, the dimensions (such as length, width, thickness and depth) of the elements (such as layers, films, substrates and regions, etc.) in the drawings will be enlarged in a non-proportional manner, and the number of some elements will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings and the dimensions and shapes presented by the elements, but should cover the dimensions, shapes and deviations of the two caused by actual processes and / or tolerances. For example, the flat surface shown in the drawings may have rough and / or nonlinear features, and the acute angles shown in the drawings may be rounded. Therefore, the elements presented in the drawings of the present invention are mainly for illustration, and are not intended to accurately depict the actual shape of the elements, nor are they intended to limit the claims of the present invention.

[0019] Secondly, the words "about", "approximately" or "substantially" used in the present invention not only cover the numerical values ​​and numerical ranges clearly recorded, but also cover the permissible deviation ranges that can be understood by those skilled in the art, wherein the deviation range can be determined by the error generated during measurement, and the error is caused by the limitations of the measurement system or process conditions, for example. For example, two objects (such as the planes or traces of a substrate) are "substantially parallel" or "substantially perpendicular", wherein "substantially parallel" and "substantially perpendicular" respectively represent that the parallelism and perpendicularity between the two objects may include non-parallelism and non-perpendicularity caused by the permissible deviation range.

[0020] The spatially relative terms used in the present invention, such as "below", "under", "above", "on", etc., are for the purpose of facilitating the description of the relative relationship between one element or feature and another element or feature, as shown in the figure. The true meaning of these spatially relative terms includes other orientations. For example, when the figure is flipped up and down 180 degrees, the relationship between one element and another element may change from "below" or "under" to "above" or "on". In addition, the spatially relative descriptions used in the present invention should also be interpreted in the same way.

[0021] It should be understood that, although the present invention may use the terms "first", "second", "third" and the like to describe various elements or features, these elements or features should not be limited by these terms. These terms are mainly used to distinguish one element from another element, or one feature from another feature. In addition, the term "or" used in the present invention may include any one or more combinations of the associated listed items depending on the actual situation.

[0022] Although a series of operations or steps are utilized in the present invention to illustrate the manufacturing method, the order shown in these operations or steps should not be interpreted as a limitation of the present invention. For example, some operations or steps can be performed in different orders and / or simultaneously with other steps. In addition, each operation or step described herein can include several sub-steps or actions.

[0023] In addition, the present invention may be implemented or applied through other different specific embodiments, and the details of the present invention may also be combined, modified and changed in various embodiments based on different viewpoints and applications without departing from the concept of the present invention.

[0024] Figure 1 FIG. 1 is a partial cross-sectional view of a circuit board according to at least one embodiment of the present invention. Figure 1 The circuit board 1 includes a core layer 30, a first circuit structure 10 and a second circuit structure 20. The core layer 30 has a first surface S1 and a second surface S2, and the first surface S1 is opposite to the second surface S2. The first circuit structure 10 is disposed on the first surface S1 of the core layer 30, and the second circuit structure 20 is disposed on the second surface S2.

[0025] The first circuit structure 10 includes a first substrate 110, a first insulating layer 112, a first metal pattern layer 114 and a first metal layer 116. The first substrate 110 includes a first through hole T1 and a second through hole T2, which are arranged at intervals and expose the first surface S1 of the core layer 30.

[0026] The first insulating layer 112 is disposed in the first through hole T1 and contacts the first surface S1 of the core layer 30. The first metal pattern layer 114 includes a first heat conducting portion 114h and a first circuit portion 114t. The first heat conducting portion 114h is disposed in the first through hole T1 and disposed on the first insulating layer 112. The first circuit portion 114t is disposed in the second through hole T2 and forms a first cavity C1 with the first surface S1, that is, the first circuit portion 114t does not contact the first surface S1. The first metal layer 116 includes a second heat conducting portion 116h and a first conducting portion 116c. The second heat conducting portion 116h is disposed on the first heat conducting portion 114h. The first conducting portion 116c is disposed on the first substrate 110.

[0027] The second circuit structure 20 includes a second substrate 210, a second insulating layer 212, a second metal pattern layer 214 and a second metal layer 216. The second substrate 210 includes a third through hole T3 and a fourth through hole T4, which are arranged at intervals and expose the second surface S2 of the core layer 30.

[0028] The second insulating layer 212 is disposed in the third through hole T3 and contacts the second surface S2 of the core layer 30. The second metal pattern layer 214 includes a third heat conducting portion 214h and a second circuit portion 214t. The third heat conducting portion 214h is disposed in the third through hole T3 and disposed on the second insulating layer 212. The second circuit portion 214t is disposed in the fourth through hole T4 and forms a second cavity C2 with the second surface S2, that is, the second circuit portion 214t does not contact the second surface S2. The second metal layer 216 includes a fourth heat conducting portion 216h and a second conductive portion 216c. The fourth heat conducting portion 216h is disposed on the third heat conducting portion 214h. The second conductive portion 216c is disposed on the second substrate 210.

[0029] Through the above structural design, the insulating layer and the heat conducting part, the circuit part and the cavity, and the conducting part can be used as component channels with different functions respectively, thereby forming a circuit board with component channels with multiple functions.

[0030] like Figure 1 As shown, the circuit board 1 includes a heat conduction channel HC, a circuit channel TC and a current channel CC. The heat conduction channel HC includes the first insulating layer 112, the first heat conduction portion 114h of the first metal pattern layer 114, the second heat conduction portion 116h of the first metal layer 116, the second insulating layer 212, the third heat conduction portion 214h of the second metal pattern layer 214 and the fourth heat conduction portion 216h of the second metal layer 216. The circuit channel TC includes the first circuit portion 114t of the first metal pattern layer 114, the first cavity C1, the second circuit portion 214t of the second metal pattern layer 214 and the second cavity C2. The current channel CC includes the first conductive portion 116c of the first metal layer 116 and the second conductive portion 216c of the second metal layer 216.

[0031] In some embodiments, the first circuit portion 114t of the first metal pattern layer 114 is matched with the first cavity C1 and the second circuit portion 214t of the second metal pattern layer 214 is matched with the second cavity C2, so that the circuit channel TC is used as a high-speed or high-frequency signal transmission circuit channel, for example, for 4G or 5G communication components.

[0032] In some embodiments, a heat conduction channel HC having a heat dissipation effect is formed by providing the second heat conduction portion 116h of the first metal layer 116 and the fourth heat conduction portion 216h of the second metal layer 216. In addition, a current channel CC suitable for transmitting high current is formed by providing the first conductive portion 116c of the first metal layer 116 and the second conductive portion 216c of the second metal layer 216.

[0033] In some embodiments, the number of the first through hole T1, the second through hole T2, the third through hole T3 and the fourth through hole T4 may be more than one. Figure 1As shown, the number of the first through hole T1 and the third through hole T3 is one, and the number of the second through hole T2 and the fourth through hole T4 is two, but the present invention is not limited thereto, and the number of the through holes can be adjusted according to different design requirements.

[0034] In some embodiments, the first heat conducting portion 114 h of the first metal pattern layer 114 contacts the first insulating layer 112 , the second heat conducting portion 116 h of the first metal layer 116 contacts the first heat conducting portion 114 h , and the first conducting portion 116 c of the first metal layer 116 contacts the first substrate 110 .

[0035] In some embodiments, the third heat conducting portion 214 h of the second metal pattern layer 214 contacts the second insulating layer 212 , the fourth heat conducting portion 216 h of the second metal layer 216 contacts the third heat conducting portion 214 h , and the second conducting portion 216 c of the second metal layer 216 contacts the second substrate 210 .

[0036] Please continue reading Figure 1 The first circuit structure 10 further includes a third metal pattern layer 118, the third metal pattern layer 118 includes a fifth heat conducting portion 118h and a third conductive portion 118c, the fifth heat conducting portion 118h is disposed on the second heat conducting portion 116h, and the third conductive portion 118c is disposed on the first conductive portion 116c. The second circuit structure 20 further includes a fourth metal pattern layer 218, the fourth metal pattern layer 218 includes a sixth heat conducting portion 218h and a fourth conductive portion 218c, the sixth heat conducting portion 218h is disposed on the fourth heat conducting portion 216h, and the fourth conductive portion 218c is disposed on the second conductive portion 216c.

[0037] like Figure 1 As shown, the heat conduction channel HC further includes the fifth heat conduction portion 118h of the third metal pattern layer 118 and the sixth heat conduction portion 218h of the fourth metal pattern layer 218 , and the current channel CC further includes the third conductive portion 118c of the third metal pattern layer 118 and the fourth conductive portion 218c of the fourth metal pattern layer 218 .

[0038] In some embodiments, the thickness of the third metal pattern layer 118 is greater than the thickness of the first metal pattern layer 114, and the thickness of the fourth metal pattern layer 218 is greater than the thickness of the second metal pattern layer 214. The heat dissipation effect of the heat conduction channel HC can be further improved by the fifth heat conduction portion 118h of the third metal pattern layer 118 and the sixth heat conduction portion 218h of the fourth metal pattern layer 218 with greater thickness. In addition, the high current resistance effect of the current channel CC can be further improved by the third conductive portion 118c of the third metal pattern layer 118 and the fourth conductive portion 218c of the fourth metal pattern layer 218 with greater thickness.

[0039] In some embodiments, the fifth heat conducting portion 118h of the third metal pattern layer 118 contacts the second heat conducting portion 116h, and the third conductive portion 118c of the third metal pattern layer 118 contacts the first conductive portion 116c. In some embodiments, the sixth heat conducting portion 218h of the fourth metal pattern layer 218 contacts the fourth heat conducting portion 216h, and the fourth conductive portion 218c of the fourth metal pattern layer 218 contacts the second conductive portion 216c.

[0040] Figure 2A to Figure 2L is a partial cross-sectional view of a circuit board in different process stages according to at least one embodiment of the present invention. Figure 2A , providing a first initial substrate 110' and a second initial substrate 210', and forming a first initial metal layer 116' on the first initial substrate 110' and forming a second initial metal layer 216' on the second initial substrate 210'. In some embodiments, the material of the first initial substrate 110' and the second initial substrate 210' may include resin, and the material of the first initial metal layer 116' and the second initial metal layer 216' may include metal, such as copper.

[0041] See also Figure 2B , patterning the first initial substrate 110' to form the first substrate 110 having the first through-holes T1 and the second through-holes T2 arranged at intervals, and patterning the second initial substrate 210' to form the second substrate 210 having the third through-holes T3 and the fourth through-holes T4 arranged at intervals. In some embodiments, the first through-holes T1, the second through-holes T2, the third through-holes T3 and the fourth through-holes T4 may be formed by an etching process, such as dry etching.

[0042] See also Figure 2C , forming a first metal pattern layer 114 in the first through hole T1 and the second through hole T2, and forming a second metal pattern layer 214 in the third through hole T3 and the fourth through hole T4. In some embodiments, the material of the first metal pattern layer 114 and the second metal pattern layer 214 may include a metal, such as copper. In some embodiments, the first metal pattern layer 114 and the second metal pattern layer 214 may be formed by an electroplating process. In some embodiments, the depth of the first through hole T1 and the depth of the second through hole T2 are respectively greater than the thickness of the first metal pattern layer 114, and the depth of the third through hole T3 and the depth of the fourth through hole T4 are respectively greater than the thickness of the second metal pattern layer 214.

[0043] like Figure 2CAs shown, the step of forming the first metal pattern layer 114 includes forming the first heat conducting portion 114h in the first through hole T1 and the first circuit portion 114t in the second through hole T2. The step of forming the second metal pattern layer 214 includes forming the third heat conducting portion 214h in the third through hole T3 and the second circuit portion 214t in the fourth through hole T4. In some embodiments, the depth of the first through hole T1 is greater than the thickness of the first heat conducting portion 114h, the depth of the second through hole T2 is greater than the thickness of the first circuit portion 114t, the depth of the third through hole T3 is greater than the thickness of the third heat conducting portion 214h, and the depth of the fourth through hole T4 is greater than the thickness of the second circuit portion 214t.

[0044] See also Figure 2D , forming a first insulating layer 112 on the first metal pattern layer 114 in the first through hole T1, and forming a second insulating layer 212 on the second metal pattern layer 214 in the third through hole T3, so as to obtain a first initial circuit structure 10'. In some embodiments, the materials of the first insulating layer 112 and the second insulating layer 212 may include resin. In some embodiments, the depth of the first through hole T1 is approximately equal to the sum of the thicknesses of the first heat conducting portion 114h and the first insulating layer 112, and the depth of the third through hole T3 is approximately equal to the sum of the thicknesses of the third heat conducting portion 214h and the second insulating layer 212.

[0045] See also Figure 2E and Figure 2F , providing a core layer 30, laminating the first initial circuit structure 10', the second initial circuit structure 20' and the core layer 30, that is, laminating the first substrate 110 and the core layer 30 to form a first cavity C1 located in the second through hole T2, and laminating the second substrate 210 and the core layer 30 to form a second cavity C2 located in the fourth through hole T4. However, the manufacturing method of the second initial circuit structure 20' is the same as that of the first initial circuit structure 10', such as Figures 2A to 2D Therefore, the same contents will not be repeated here.

[0046] like Figure 2E and Figure 2F As shown, the core layer 30 has a first surface S1 and a second surface S2 opposite to the first surface S1. The core layer 30 is disposed between the first substrate 110 and the second substrate 210, and the first substrate 110, the second substrate 210 and the core layer 30 are pressed together, so that the first substrate 110 is attached to the first surface S1 of the core layer 30, and the second substrate 210 is attached to the second surface S2 of the core layer 30.

[0047] In detail, the first substrate 110, the second substrate 210 and the core layer 30 are pressed together to form a first cavity C1 between the first circuit portion 114t formed in the second through hole T2 and the first surface S1 of the core layer 30, and a second cavity C2 is formed between the second circuit portion 214t formed in the fourth through hole T4 and the second surface S2 of the core layer 30. In addition, the first insulating layer 112 formed in the first through hole T1 contacts the first surface S1 of the core layer 30, and the second insulating layer 212 formed in the third through hole T3 contacts the second surface S2 of the core layer 30. In some embodiments, the material of the core layer 30 may include a resin, such as a low flow prepreg or a no flow prepreg.

[0048] See also Figure 2G to Figure 2L , patterning the first initial metal layer 116' to form the first metal layer 116, and patterning the second initial metal layer 216' to form the second metal layer 216. First, as Figure 2G As shown, a first photoresist film F1 is formed on the first initial metal layer 116', and a second photoresist film F2 is formed on the second initial metal layer 216'. In some embodiments, the first photoresist film F1 and the second photoresist film F2 can be formed on the first initial metal layer 116' and the second initial metal layer 216' respectively by a lamination process.

[0049] like Figure 2H As shown, the first photoresist film F1 is patterned to form a first opening O1 and a second opening O2 exposing the first initial metal layer 116', and the second photoresist film F2 is patterned to form a third opening O3 and a fourth opening O4 exposing the second initial metal layer 216'. In some embodiments, the first opening O1 is formed corresponding to the position of the first heat conducting portion 114h, that is, corresponding to the first through hole T1, and the third opening O3 is formed corresponding to the position of the third heat conducting portion 214h, that is, corresponding to the third through hole T3. In some embodiments, the first opening O1, the second opening O2, the third opening O3, and the fourth opening O4 can be formed by a photolithography process.

[0050] like Fig.2IAs shown, the third metal pattern layer 118 is formed on the first initial metal layer 116', and the fourth metal pattern layer 218 is formed on the second initial metal layer 216'. In detail, forming the third metal pattern layer 118 includes forming the fifth heat conducting portion 118h on the first initial metal layer 116' in the first opening O1, and forming the third conductive portion 118c on the first initial metal layer 116' in the second opening O2, and forming the fourth metal pattern layer 218 includes forming the sixth heat conducting portion 218h on the second initial metal layer 216' in the third opening O3, and forming the fourth conductive portion 218c on the second initial metal layer 216' in the fourth opening O4. In some embodiments, the material of the third metal pattern layer 118 and the fourth metal pattern layer 218 may include metal, such as copper. In some embodiments, the third metal pattern layer 118 and the fourth metal pattern layer 218 may be formed by an electroplating process.

[0051] like Figure 2J As shown, the first protective layer E1, the second protective layer E2, the third protective layer E3 and the fourth protective layer E4 are respectively formed on the fifth heat conducting portion 118h, the third conductive portion 118c, the sixth heat conducting portion 218h and the fourth conductive portion 218c. In some embodiments, the materials of the first protective layer E1, the second protective layer E2, the third protective layer E3 and the fourth protective layer E4 may include metal, such as tin. In some embodiments, the first protective layer E1, the second protective layer E2, the third protective layer E3 and the fourth protective layer E4 may be formed by an electroplating process. In some embodiments, the first protective layer E1, the second protective layer E2, the third protective layer E3 and the fourth protective layer E4 are respectively directly in contact with the fifth heat conducting portion 118h, the third conductive portion 118c, the sixth heat conducting portion 218h and the fourth conductive portion 218c.

[0052] like Figure 2K As shown in FIG. 1 , the first photoresist film F1 and the second photoresist film F2 are removed. Figure 2L As shown, the first protective layer E1 and the second protective layer E2 are used as masks to pattern the first initial metal layer 116' below the third metal pattern layer 118 to form the first metal layer 116, and the third protective layer E3 and the fourth protective layer E4 are used as masks to pattern the second initial metal layer 216' below the fourth metal pattern layer 218 to form the second metal layer 216. In some embodiments, the first initial metal layer 116' and the second initial metal layer 216' can be patterned by an etching process.

[0053] In detail, the step of patterning the first initial metal layer 116' includes forming the second heat conducting portion 116h on the first heat conducting portion 114h and forming the first conductive portion 116c on the first substrate 110, and the step of patterning the second initial metal layer 216' includes forming the fourth heat conducting portion 216h on the third heat conducting portion 214h and forming the second conductive portion 216c on the second substrate 210. In other words, the second heat conducting portion 116h is formed between the first heat conducting portion 114h and the fifth heat conducting portion 118h, the first conductive portion 116c is formed between the first substrate 110 and the third conductive portion 118c, the fourth heat conducting portion 216h is formed between the third heat conducting portion 214h and the sixth heat conducting portion 218h, and the second conductive portion 216c is formed between the second substrate 210 and the fourth conductive portion 218c.

[0054] See also Figure 1 and Figure 2L After patterning the first initial metal layer 116' and the second initial metal layer 216', the first protective layer E1, the second protective layer E2, the third protective layer E3 and the fourth protective layer E4 are removed to form the first circuit structure 10 and the second circuit structure 20, and the following can be obtained: Figure 1 The circuit board 1 shown includes a heat conduction channel HC, a circuit channel TC and a current channel CC.

[0055] In summary, in at least one embodiment of the circuit board and its manufacturing method of the present invention, the insulating layer and the heat conducting part, the circuit part and the cavity, and the conducting part can be used as component channels with different functions respectively, thereby forming a circuit board with multiple functional component channels and improving product yield and reliability.

[0056] Although the present invention has been disclosed as above by way of embodiments, it is not intended to limit the present invention. Those skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the attached claims.

[0057]

Explanation of symbols

[0058] 1: Circuit board

[0059] 10: First line structure

[0060] 10': First initial line structure

[0061] 110: first substrate

[0062] 110': first initial substrate

[0063] 112: first insulating layer

[0064] 114: first metal pattern layer

[0065] 114h: first heat transfer part

[0066] 114t: First line section

[0067] 116: First metal layer

[0068] 116': first initial metal layer

[0069] 116c: first conductive portion

[0070] 116h: Second heat transfer part

[0071] 118: third metal pattern layer

[0072] 118c: third conductive portion

[0073] 118h: Fifth heat transfer part

[0074] 20: Second line structure

[0075] 20': Second initial line structure

[0076] 210: Second substrate

[0077] 210': Second initial substrate

[0078] 212: Second insulation layer

[0079] 214: second metal pattern layer

[0080] 214h: The third heat transfer part

[0081] 214t: Second line section

[0082] 216: Second metal layer

[0083] 216': Second initial metal layer

[0084] 216c: second conductive portion

[0085] 216h: fourth heat transfer part

[0086] 218: fourth metal pattern layer

[0087] 218c: fourth conductive portion

[0088] 218h: Sixth heat transfer part

[0089] 30: Core layer

[0090] C1: First cavity

[0091] C2: Second cavity

[0092] CC: Current Channel

[0093] E1: First protective layer

[0094] E2: Second protective layer

[0095] E3: The third protection layer

[0096] E4: The fourth protective layer

[0097] F1: First photoresist film

[0098] F2: Second photoresist film

[0099] HC: Heat conduction channel

[0100] O1: First opening

[0101] O2: Second opening

[0102] O3: The third opening

[0103] O4: The fourth opening

[0104] S1: First surface

[0105] S2: Second surface

[0106] T1: First piercing

[0107] T2: Second piercing

[0108] T3: The third piercing

[0109] T4: Fourth piercing

[0110] TC: Line channel.

Claims

1. A circuit board, characterized in that: include: A core layer having a first surface and a second surface opposite to the first surface; A first circuit structure is disposed on the first surface, and the first circuit structure includes: A first substrate, comprising a first through-hole and a second through-hole spaced apart from the first through-hole, wherein the first through-hole and the second through-hole expose the first surface; A first insulating layer is disposed in the first through hole and contacts the first surface; A first metal pattern layer, comprising a first heat conducting portion and a first circuit portion, wherein the first heat conducting portion is disposed on the first insulating layer, and the first circuit portion is disposed in the second through hole and forms a first cavity on the first surface; and A first metal layer includes a second heat conducting portion and a first conducting portion, wherein the second heat conducting portion is disposed on the first heat conducting portion, and the first conducting portion is disposed on the first substrate; and A second circuit structure is disposed on the second surface, and the second circuit structure includes: A second substrate comprises a third through hole and a fourth through hole spaced apart from the third through hole, wherein the third through hole and the fourth through hole expose the second surface; A second insulating layer is disposed in the third through hole and contacts the second surface; A second metal pattern layer includes a third heat conducting portion and a second circuit portion, wherein the third heat conducting portion is disposed on the second insulating layer, and the second circuit portion is disposed in the fourth through hole and forms a second cavity with the second surface; and The second metal layer includes a fourth heat conducting portion and a second conducting portion, wherein the fourth heat conducting portion is disposed on the third heat conducting portion, and the second conducting portion is disposed on the second substrate.

2. The circuit board according to claim 1, characterized in that: It includes a heat conduction channel, a line channel and a current channel, wherein the heat conduction channel includes the first insulating layer, the first heat conduction part, the second heat conduction part, the second insulating layer, the third heat conduction part and the fourth heat conduction part, the line channel includes the first line part, the first cavity, the second line part and the second cavity, and the current channel includes the first conductive part and the second conductive part.

3. The circuit board according to claim 2, characterized in that: The first circuit structure also includes a third metal pattern layer, the third metal pattern layer includes a fifth heat conducting portion and a third conductive portion, the fifth heat conducting portion is arranged on the second heat conducting portion, and the third conductive portion is arranged on the first conductive portion, wherein the second circuit structure also includes a fourth metal pattern layer, the fourth metal pattern layer includes a sixth heat conducting portion and a fourth conductive portion, wherein the sixth heat conducting portion is arranged on the fourth heat conducting portion, and the fourth conductive portion is arranged on the second conductive portion.

4. The circuit board according to claim 3, characterized in that: The heat conduction channel further includes the fifth heat conduction portion and the sixth heat conduction portion, and the current channel further includes the third conduction portion and the fourth conduction portion.

5. A method for manufacturing a circuit board, characterized in that: include: Providing a first initial substrate and a second initial substrate; forming a first initial metal layer on the first initial substrate; forming a second initial metal layer on the second initial substrate; Patterning the first initial substrate to form a first substrate having first through-holes and second through-holes disposed at intervals; Patterning the second initial substrate to form a second substrate having third through-holes and fourth through-holes disposed at intervals; forming a first metal pattern layer in the first through hole and the second through hole; forming a second metal pattern layer in the third through hole and the fourth through hole; forming a first insulating layer on the first metal pattern layer in the first through hole; forming a second insulating layer on the second metal pattern layer in the third through hole; Provides the core layer; Laminating the first substrate and the core layer to form a first cavity located in the second through hole; Laminating the second substrate and the core layer to form a second cavity located in the fourth through hole; patterning the first initial metal layer to form a first metal layer; as well as The second initial metal layer is patterned to form a second metal layer.

6. The method for manufacturing a circuit board according to claim 5, characterized in that: The step of forming the first metal pattern layer includes forming a first heat conducting portion in the first through-hole and forming a first circuit portion in the second through-hole, the step of patterning the first initial metal layer includes forming a second heat conducting portion on the first heat conducting portion and forming a first conductive portion on the first substrate, wherein the step of forming the second metal pattern layer includes forming a third heat conducting portion in the third through-hole and forming a second circuit portion in the fourth through-hole, and the step of patterning the second initial metal layer includes forming a fourth heat conducting portion on the third heat conducting portion and forming a second conductive portion on the second substrate.

7. The method for manufacturing a circuit board according to claim 6, characterized in that: The first insulating layer, the first heat conducting part, the second heat conducting part, the second insulating layer, the third heat conducting part and the fourth heat conducting part form a heat conducting channel, the first circuit part, the first cavity, the second circuit part and the second cavity form a circuit channel, and the first conducting part and the second conducting part form a current channel.

8. The method for manufacturing a circuit board according to claim 7, characterized in that: Before patterning the first initial metal layer and the second initial metal layer, the method further includes: forming a third metal pattern layer on the first initial metal layer; and A fourth metal pattern layer is formed on the second initial metal layer.

9. The method for manufacturing a circuit board according to claim 8, characterized in that: The step of forming the third metal pattern layer includes forming a fifth heat conducting portion, the second heat conducting portion is located between the first heat conducting portion and the fifth heat conducting portion, and forming a third conductive portion, wherein the first conductive portion is located between the first substrate and the third conductive portion, wherein the step of forming the fourth metal pattern layer includes forming a sixth heat conducting portion, the fourth heat conducting portion is located between the third heat conducting portion and the sixth heat conducting portion, and forming a fourth conductive portion, wherein the second conductive portion is located between the second substrate and the fourth conductive portion.

10. The method for manufacturing a circuit board according to claim 9, characterized in that: The heat conduction channel further includes the fifth heat conduction portion and the sixth heat conduction portion, and the current channel further includes the third conduction portion and the fourth conduction portion.

11. The method for manufacturing a circuit board according to claim 5, characterized in that: The depth of the first through hole and the depth of the second through hole are respectively greater than the thickness of the first metal pattern layer, wherein the depth of the third through hole and the depth of the fourth through hole are respectively greater than the thickness of the second metal pattern layer.

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