OCA optical adhesive film die cutting control method and equipment

Abstract

The invention is suitable for the technical field of optical adhesive film die cutting, and particularly relates to an OCA optical adhesive film die cutting control method and device, and the method comprises the steps: obtaining parameter information of a to-be-processed OCA optical adhesive film; matching the parameter information with a preset die cutting database to obtain set information; and based on the set information and the preset size information, the OCA optical adhesive film die cutting equipment carries out die cutting treatment on the to-be-treated OCA optical adhesive film. According to the OCA optical adhesive film die cutting control method, the problem that in the traditional OCA optical adhesive film die cutting process, manual operation is prone to being influenced, artificial errors are caused, and then the OCA optical adhesive film die cutting efficiency is low can be solved.

Description

Technical Field

[0001] The present application belongs to the field of optical film die-cutting technology, and in particular, relates to an OCA optical film die-cutting control method and device. Background Art

[0002] OCA optical adhesive film is a transparent adhesive material used in optical applications, usually made of polymer materials. OCA optical adhesive film is widely used in electronic products, displays, optical lenses and other fields due to its excellent optical transparency and bonding ability. OCA optical adhesive film die cutting refers to the process of cutting OCA optical adhesive film for use in various optical applications.

[0003] Traditional OCA optical film die-cutting is easily affected by manual operation (for example, the operator's experience or the operator's die-cutting skill level), which leads to human errors and thus causes low efficiency in die-cutting of OCA optical film. Summary of the invention

[0004] The embodiments of the present application provide an OCA optical adhesive film die-cutting control method and device, which can solve the problem that the traditional OCA optical adhesive film die-cutting process is easily affected by manual operation, resulting in human errors and thus causing low OCA optical adhesive film die-cutting efficiency.

[0005] In a first aspect, an embodiment of the present application provides an OCA optical adhesive film die-cutting control method, which is applied to an OCA optical adhesive film die-cutting device, and the method includes:

[0006] Acquire parameter information of the OCA optical adhesive film to be processed; wherein the parameter information is used to reflect the thickness of the OCA optical adhesive film to be processed;

[0007] Matching the parameter information with a preset die-cutting database to obtain setting information; wherein the setting information is used to reflect the setting of the die-cutting parameters;

[0008] Based on the setting information and the preset size information, the OCA optical adhesive film die-cutting device performs die-cutting processing on the OCA optical adhesive film to be processed.

[0009] The above technical solutions in the embodiments of the present application have at least the following technical effects:

[0010] The OCA optical adhesive film die-cutting control method provided in the present application can provide data support for the subsequent rapid adjustment of the die-cutting parameters by obtaining parameter information that reflects the thickness of the OCA optical adhesive film to be processed, thereby reducing the time of manual operation (for example, manual repeated trial cutting to determine the final die-cutting parameters), thereby helping to improve the die-cutting efficiency. Secondly, the parameter information is matched with the preset die-cutting database to obtain the setting information, which can reduce the error rate of manual operation (for example, parameter setting errors caused by human factors), thereby helping to improve the die-cutting efficiency. Then, based on the setting information and the preset size information, the OCA optical adhesive film die-cutting equipment performs die-cutting processing on the OCA optical adhesive film to be processed, and can automatically perform die-cutting processing according to the desired parameters, reducing the dependence on manual operation, thereby helping to improve the die-cutting efficiency.

[0011] In a possible implementation of the first aspect, the OCA optical adhesive film die-cutting device includes an OCA optical adhesive film die-cutting device, the OCA optical adhesive film die-cutting device includes a first die-cutting device and a second die-cutting device, the first die-cutting device is compatible with a first parameter switching function, and before the OCA optical adhesive film die-cutting device performs die-cutting processing on the OCA optical adhesive film to be processed based on the setting information and the preset size information, the method further includes:

[0012] The first die-cutting device responds to the switching signal of the second die-cutting device, and the first die-cutting device obtains a first die-cutting parameter list of the second die-cutting device; wherein the first die-cutting parameter list is used to indicate a first parameter switching path compatible with the second die-cutting device;

[0013] In the case that the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, traversing the first parameter switching path compatible with the first die-cutting device one by one to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained; wherein the die-cutting request instruction is used to request the configuration of the first die-cutting device associated with the first parameter switching path compatible with the first die-cutting device;

[0014] When the die-cutting request instruction is obtained on the first path of the first parameter switching path compatible with the first die-cutting device, a first parameter switching path association is established with the second die-cutting device on the first path; wherein the first path is one of the first parameter switching paths compatible with the first die-cutting device;

[0015] The first die-cutting device obtains the die-cutting parameter switching information of the second die-cutting device through the first path.

[0016] In a possible implementation manner of the first aspect, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, traversing the first parameter switching paths compatible with the first die-cutting device one by one to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained includes:

[0017] When the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, sending first information to the second die-cutting device; wherein the first information is used to obtain whether the second die-cutting device is compatible with the first parameter switching function;

[0018] When feedback information corresponding to the first information sent by the second die-cutting device is obtained, the first parameter switching path compatible with the first die-cutting device is traversed one by one to see whether the die-cutting request instruction sent by the second die-cutting device is obtained; wherein the feedback information is used to indicate that the second die-cutting device is compatible with the first parameter switching function.

[0019] In a possible implementation manner of the first aspect, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, traversing the first parameter switching paths compatible with the first die-cutting device one by one to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained includes:

[0020] When the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, waiting for a first time period on the first parameter switching path compatible with the first die-cutting device one by one;

[0021] During the first time period, monitoring is performed to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained.

[0022] In a possible implementation of the first aspect, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, after traversing the first parameter switching paths compatible with the first die-cutting device one by one to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained, the method further includes:

[0023] When the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device, a second parameter switching path association is established with the second die-cutting device on the second path; wherein the second path is one of the second parameter switching paths compatible with both the first die-cutting device and the second die-cutting device.

[0024] In a possible implementation of the first aspect, when the die-cutting request instruction is not obtained on a first parameter switching path compatible with the first die-cutting device, establishing a second parameter switching path association with the second die-cutting device on a second path includes:

[0025] If the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device within the second time period, a second parameter switching path association is established with the second die-cutting device on the second path; or,

[0026] When the die-cutting request instruction is not obtained on all compatible first parameter switching paths of the first die-cutting device, a second parameter switching path association is established with the second die-cutting device on the second path.

[0027] In a possible implementation manner of the first aspect, the OCA optical adhesive film die-cutting device further includes a control device, and the control device is communicatively connected to the OCA optical adhesive film die-cutting device. The method further includes:

[0028] In the case where there is die-cutting control information and the current moment is a preset moment, determining that the die-cutting control opportunity of the OCA optical adhesive film die-cutting device has arrived; wherein the die-cutting control efficiency corresponding to the die-cutting control information is greater than the die-cutting control efficiency of the die-cutting control information currently corresponding to the OCA optical adhesive film die-cutting device, and the preset moment is the moment when a preset number of OCA optical adhesive films are die-cut without using a key device;

[0029] When it is determined that the die-cutting control opportunity has arrived, a device list of the OCA optical adhesive film die-cutting device that transmits information with the control device is obtained; wherein the device list includes key devices or non-key devices;

[0030] In the case where the device list obtained includes at least one key device, the workload value of each key device is obtained, and if the workload value of each key device is less than the preset workload value, the die-cutting control information configuration service of the OCA optical adhesive film die-cutting device is implemented;

[0031] In the case that the devices in the device list are all non-critical devices, the control device implements the die-cutting control information configuration service of the OCA optical adhesive film die-cutting device.

[0032] In a possible implementation manner of the first aspect, the method further includes:

[0033] In the case where the device list obtained includes at least one key device, determining an average workload value of each key device within a preset time period;

[0034] When the average workload value of each key device is less than the preset workload value, the die-cutting control information configuration service of the OCA optical film die-cutting equipment is implemented.

[0035] In a possible implementation manner of the first aspect, when obtaining that the device list includes at least one key device, determining an average workload value of each key device within a preset time period includes:

[0036] In the case where the device list obtained includes at least one key device, obtaining a workload value of each key device at a first time interval within the preset time length;

[0037] After the preset time period ends, an average workload value of the acquired workload values ​​of each key device is determined.

[0038] In a possible implementation manner of the first aspect, the method further includes:

[0039] When the workload value of each key device exceeds the preset workload value, waiting for the next die-cutting control opportunity of the OCA optical film die-cutting device;

[0040] When it is determined that the next die-cutting control opportunity has arrived, a list of devices connected to the control device is obtained.

[0041] In a second aspect, an embodiment of the present application provides an OCA optical adhesive film die-cutting control system, which is used to implement the OCA optical adhesive film die-cutting control method described in any one of the first aspects above, and the OCA optical adhesive film die-cutting control system is applied to an OCA optical adhesive film die-cutting device, and the OCA optical adhesive film die-cutting control system includes:

[0042] An acquisition unit, used for acquiring parameter information of the OCA optical adhesive film to be processed; wherein the parameter information is used for reflecting the thickness of the OCA optical adhesive film to be processed;

[0043] A matching unit, used to match the parameter information with a preset die-cutting database to obtain setting information; wherein the setting information is used to reflect the setting of the die-cutting parameters;

[0044] The processing unit is used for the OCA optical adhesive film die-cutting device to perform die-cutting processing on the OCA optical adhesive film to be processed based on the setting information and the preset size information.

[0045] In a third aspect, an embodiment of the present application provides an OCA optical adhesive film die-cutting device, comprising an OCA optical adhesive film die-cutting device and a control device electrically connected to the OCA optical adhesive film die-cutting device, wherein the control device comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the OCA optical adhesive film die-cutting control method described in any one of the first aspects above when executing the computer program.

[0046] It can be understood that the beneficial effects of the second to third aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0048] Figure 1 It is a flow chart of an OCA optical film die-cutting control method provided in one embodiment of the present application;

[0049] Figure 2 It is a schematic diagram of a process for obtaining die-cutting parameter switching information in an OCA optical adhesive film die-cutting control method provided in an embodiment of the present application;

[0050] Figure 3 It is a flow chart of implementing die-cutting control information configuration service in the OCA optical adhesive film die-cutting control method provided in one embodiment of the present application;

[0051] Figure 4 It is a structural schematic diagram of an OCA optical film die-cutting control system provided in an embodiment of the present application;

[0052] Figure 5 It is a structural schematic diagram of a control device of an OCA optical adhesive film die-cutting device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0053] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0054] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, wholes, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or combinations thereof.

[0055] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0056] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting" depending on the context. Similarly, the phrase "if it is determined" or "if the described condition or event is detected" can be interpreted as meaning "uponce determined" or "in response to determining" or "uponce the described condition or event is detected" or "in response to detecting the described condition or event" depending on the context.

[0057] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0058] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0059] In the related art, OCA optical adhesive film is a transparent adhesive material used in optical applications, usually made of polymer materials. OCA optical adhesive film is widely used in electronic products, displays, optical lenses and other fields due to its excellent optical transparency and bonding ability. OCA optical adhesive film die cutting refers to the process of cutting OCA optical adhesive film for use in various optical applications.

[0060] Traditional OCA optical film die-cutting is easily affected by manual operation (for example, the operator's experience or the operator's die-cutting skill level), which leads to human errors and thus causes low efficiency of OCA optical film die-cutting.

[0061] In order to solve the above problems, the embodiments of the present application provide an OCA optical adhesive film die-cutting control method and device.

[0062] In this method, by obtaining parameter information that reflects the thickness of the OCA optical adhesive film to be processed, data support can be provided to help quickly adjust the die-cutting parameters in the subsequent process, reduce the time of manual operation (for example, manual repeated trial cutting to determine the final die-cutting parameters), and thus help improve the die-cutting efficiency. Secondly, the parameter information is matched with the preset die-cutting database to obtain the setting information, which can reduce the error rate of manual operation (for example, parameter setting errors caused by human factors), and thus help improve the die-cutting efficiency. Then, based on the setting information and the preset size information, the OCA optical adhesive film die-cutting equipment performs die-cutting processing on the OCA optical adhesive film to be processed, and can automatically perform die-cutting processing according to the desired parameters, reducing dependence on manual operation, and thus helping to improve the die-cutting efficiency.

[0063] The OCA optical adhesive film die-cutting control method provided in the embodiment of the present application can be applied to the OCA optical adhesive film die-cutting equipment. At this time, the OCA optical adhesive film die-cutting equipment is the executor of the OCA optical adhesive film die-cutting control method provided in the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of the OCA optical adhesive film die-cutting equipment.

[0064] For example, the OCA optical film die-cutting equipment may include an OCA optical film die-cutting device and a control device that is communicatively connected to the OCA optical film die-cutting device. The OCA optical film die-cutting device may include a conveying device (such as a conveyor belt), a tool die-cutting device (such as a CNC die-cutting machine, a rotary knife die-cutting machine, etc.), a collecting device (such as a roll rack), etc. The control device controls the conveying device to automatically transfer the OCA optical film to the die-cutting area of ​​the tool die-cutting device. The control device controls the tool die-cutting device to die-cut the OCA optical film according to the setting information and the preset size information to obtain a die-cut product. The control device controls the collecting device to collect the die-cut products that have completed die-cutting to obtain the final OCA optical film product.

[0065] For example, the control device can be a mobile phone, tablet computer, notebook computer, ultra-mobile personal computer (UMPC), netbook, desktop computer, computing device or computer connected to a wireless modem, laptop computer, handheld communication device, handheld computing device, etc.

[0066] In order to better understand the OCA optical adhesive film die-cutting control method provided in the embodiment of the present application, the specific implementation process of the OCA optical adhesive film die-cutting control method provided in the embodiment of the present application is exemplarily introduced below.

[0067] Figure 1 A schematic flow chart of an OCA optical adhesive film die-cutting control method provided in an embodiment of the present application is shown. The OCA optical adhesive film die-cutting control method includes:

[0068] S100, obtaining parameter information of the OCA optical adhesive film to be processed, wherein the parameter information is used to reflect the thickness of the OCA optical adhesive film to be processed.

[0069] For example, a micrometer-level sensor may be used to directly contact the surface of the OCA optical adhesive film to measure the thickness, so as to obtain parameter information of the OCA optical adhesive film to be processed.

[0070] For example, optical detection technology can also be used to detect the thickness of the OCA optical adhesive film to obtain parameter information of the OCA optical adhesive film to be processed, for example, the optical interference principle can be used to accurately measure the thickness of the OCA optical adhesive film. For another example, the thickness of the OCA optical adhesive film can be obtained by measuring the reflectivity of the OCA optical adhesive film to light of different wavelengths.

[0071] Such a setting, by obtaining parameter information of the OCA optical film to be processed, can provide data support for subsequent rapid adjustment of die-cutting parameters, reduce the time of manual operation (for example, manual repeated trial cutting to determine the final die-cutting parameters), and thus help improve die-cutting efficiency.

[0072] S200, matching the parameter information with a preset die-cutting database to obtain setting information, wherein the setting information is used to reflect the setting of the die-cutting parameters.

[0073] It can be understood that the setting information may be tool type parameters, die-cutting speed parameters, die-cutting pressure parameters, etc. of the OCA optical film die-cutting equipment.

[0074] For example, the preset die-cutting parameters are entered into the die-cutting database, which includes the thickness of multiple OCA optical adhesive films and multiple die-cutting parameters. There is a mapping relationship between the thickness of the OCA optical adhesive film and the die-cutting parameters, and a unique identifier is established for each OCA optical adhesive film and die-cutting parameter. The parameter information is matched with the preset die-cutting database through a matching algorithm (such as complete matching, fuzzy matching) to obtain setting information corresponding to the parameter information. Optionally, the die-cutting database can be established by manual input, uploading files, etc.

[0075] For example, the matching process can also be guided by manually setting matching rules. For example, if the thickness is within a certain range, a certain tool or cutting speed is preferred. For example, if the film thickness is less than 0.3 mm, a laser knife is preferred; if the thickness is between 0.3 mm and 0.6 mm, a mechanical knife is selected.

[0076] By setting up in this way, the parameter information is matched with the preset die-cutting database to obtain the setting information, which can reduce the error rate of manual operation (for example, parameter setting errors caused by human factors), thereby helping to improve the die-cutting efficiency.

[0077] S300, based on the setting information and the preset size information, the OCA optical adhesive film die-cutting device performs die-cutting on the OCA optical adhesive film to be processed.

[0078] It can be understood that the preset size information can be the size information of the OCA optical adhesive film required by the user, for example, the length is x cm and the width is y cm, wherein x is any positive number and y is any positive number, such as x is 1, 2, 3 and y is 1, 2, 3.

[0079] For example, the setting information is parsed to obtain parameters such as cutting speed, pressure, and tool type. The OCA optical film die-cutting device is configured according to the parsed setting information so that the parameters of the OCA optical film die-cutting device are set to recommended values. The specific size information of the OCA optical film to be processed is input through the operation interface of the OCA optical film die-cutting device. For example, it can be manually input or a file can be automatically uploaded to the OCA optical film die-cutting device through an interface. The OCA optical film die-cutting device is started so that the OCA optical film die-cutting device performs die-cutting processing on the OCA optical film to be processed according to the setting information and the preset size information.

[0080] For example, the setting information is parsed to obtain parameters such as cutting speed, pressure, and tool type. The OCA optical film die-cutting device is configured according to the parsed setting information so that the parameters of the OCA optical film die-cutting device are set to recommended values. The preset size information is parsed, the contour information in the preset size information is identified, and the area to be cut is extracted to obtain a cutting path. The OCA optical film die-cutting device performs die-cutting on the OCA optical film to be processed according to the parsed setting information and the cutting path.

[0081] In this way, based on the set information and preset size information, the OCA optical adhesive film die-cutting equipment can automatically perform die-cutting on the OCA optical adhesive film to be processed according to the desired parameters, reducing dependence on manual operation, thereby helping to improve die-cutting efficiency.

[0082] In one possible implementation, see Figure 2The OCA optical film die-cutting device includes an OCA optical film die-cutting device, the OCA optical film die-cutting device includes a first die-cutting device and a second die-cutting device, the first die-cutting device is compatible with a first parameter switching function, in step S300, based on the setting information and the preset size information, before the OCA optical film die-cutting device performs die-cutting processing on the OCA optical film to be processed, the OCA optical film die-cutting control method further includes:

[0083] S310, the first die-cutting device responds to the switching signal of the second die-cutting device, and the first die-cutting device obtains a first die-cutting parameter list of the second die-cutting device, wherein the first die-cutting parameter list is used to indicate a first parameter switching path compatible with the second die-cutting device.

[0084] It is understood that the switching signal may be a signal for instructing the die-cutting device to adjust parameters, such as an electrical signal, a digital signal, etc. The first parameter switching path may be a path for die-cutting operations in coordination with other die-cutting devices, such as a PLC control path, a remote control path, etc.

[0085] For example, when the second die-cutting device needs to switch die-cutting parameters, it sends a switching signal to the first die-cutting device. In response to the switching signal, the first die-cutting device actively requests or obtains a "first die-cutting parameter list", which can be a list containing the first parameter switching paths compatible with the second die-cutting device.

[0086] For example, a trigger program can be set up. When the second die-cutting device needs to switch die-cutting parameters, the second die-cutting device will generate a switching signal to inform the first die-cutting device that it needs to cooperate in switching the die-cutting parameters. The first die-cutting device can respond to the switching signal of the second die-cutting device and obtain the first die-cutting parameter list of the second die-cutting device.

[0087] In this arrangement, the first die-cutting device responds to the switching signal of the second die-cutting device, and the first die-cutting device obtains the first die-cutting parameter list of the second die-cutting device, which helps to achieve coordinated switching of parameters between the two die-cutting devices, so that the first die-cutting device understands the first parameter switching path compatible with the second die-cutting device, thereby helping the first die-cutting device understand how to cooperate with the second die-cutting device for subsequent effective die-cutting operations.

[0088] S320, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, traverse the first parameter switching path compatible with the first die-cutting device one by one to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained. The die-cutting request instruction is used to request the configuration of the first parameter switching path compatible with the first die-cutting device associated with the first die-cutting device.

[0089] It can be understood that the first parameter switching paths compatible with the first die-cutting device are PLC control path 1, PLC control path 2 and PLC control path 3, and the first parameter switching paths compatible with the second die-cutting device are PLC control path 4 and PLC control path 5. At this time, the first die-cutting parameter list and the first parameter switching paths compatible with the first die-cutting device do not overlap. Alternatively, the first parameter switching paths compatible with the first die-cutting device are PLC control path 1, PLC control path 2 and PLC control path 3, and the first parameter switching path compatible with the second die-cutting device is 0, that is, there is no PLC control path. At this time, the first die-cutting parameter list and the first parameter switching paths compatible with the first die-cutting device do not overlap.

[0090] Optionally, after the first die-cutting device obtains the first die-cutting parameter list, if it is determined that the first die-cutting parameter list is 0, it is not necessary to perform the operation of detecting whether the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device overlap, but it can be directly determined that the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap.

[0091] For example, the first parameter switching paths compatible with the first die-cutting device are PLC control path 1, PLC control path 2 and PLC control path 3, and the first parameter switching paths compatible with the second die-cutting device are PLC control path 2 and PLC control path 5. Then the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device overlap (i.e., control path 2), that is, the first die-cutting device can perform mutually coordinated die-cutting operations with the second die-cutting device on control path 2 (e.g., which of the parameters currently set in the first die-cutting device should be adjusted and which should not be adjusted, to cooperate with the adjustment process of the second die-cutting device), for example, the coordinated operation of parameters such as tool type, cutting speed, and pressure, so as to realize the first die-cutting device and the second die-cutting device to coordinate and perform mutually coordinated die-cutting operations.

[0092] For example, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, it means that the first die-cutting device and the second die-cutting device cannot perform a cooperative die-cutting operation in the current scenario. Therefore, an algorithm or traversal rule can be used to traverse the first parameter switching path compatible with the first die-cutting device one by one to see if the die-cutting request instruction sent by the second die-cutting device is obtained. For example, the first parameter switching paths compatible with the first die-cutting device are PLC control path 1, PLC control path 2, and PLC control path 3, then it can be queried on PLC control path 1 whether the die-cutting request instruction sent by the second die-cutting device is obtained. If not, it can be queried on PLC control path 2 whether the die-cutting request instruction sent by the second die-cutting device is obtained, and so on, until the die-cutting request instruction is obtained, or all PLC control paths are traversed.

[0093] For example, each path in the first parameter switching path compatible with the first die-cutting device corresponds to a set of specific configurations, and the die-cutting request instruction can make the second die-cutting device associated with the configuration of the first parameter switching path compatible with the first die-cutting device, so that the second die-cutting device can cooperate with the first die-cutting device on the associated path (e.g., which of the parameters currently set in the first die-cutting device should be adjusted and which should not be adjusted to cooperate with the adjustment process of the second die-cutting device). For example, the response level of the parameter control corresponding to the tool type of PLC control path 1 is the highest; the response level of the parameter control corresponding to the cutting speed of PLC control path 2 is the highest; and the response level of the parameter control corresponding to the pressure of PLC control path 2 is the highest. The second die-cutting device only requests the parameter switch of the tool type in the first die-cutting device, so the second die-cutting device can be associated with the PLC control path 1 of the first die-cutting device, such as setting the parameters of the PID controller (proportional, integral, differential), or defining the type (digital quantity, analog quantity) and address of each input and output point of the PLC, so that the second die-cutting device can cooperate with the first die-cutting device on the associated path.

[0094] With such arrangement, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, the first parameter switching path compatible with the first die-cutting device is traversed one by one to see whether the die-cutting request instruction sent by the second die-cutting device is obtained. This can flexibly cope with various work scenarios. For example, even if no overlapping path is found initially, a suitable configuration can still be found through the traversal process, thereby achieving effective collaborative die-cutting operations, which helps the first die-cutting device and the second die-cutting device to perform effective collaborative die-cutting operations, ensure the accuracy and consistency of the die-cutting operations, improve product quality, and thus help improve die-cutting efficiency.

[0095] In a possible implementation, S320, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, traversing the first parameter switching path compatible with the first die-cutting device one by one to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained, includes:

[0096] S321, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, send first information to the second die-cutting device, wherein the first information is used to obtain whether the second die-cutting device is compatible with the first parameter switching function.

[0097] It can be understood that the second die-cutting device is compatible with the first parameter switching function, which means that the second die-cutting device can perform die-cutting operations in coordination with other devices on the first parameter switching path. However, the second die-cutting device is not compatible with the first parameter switching function, which means that the second die-cutting device cannot perform die-cutting operations in coordination with other devices on the first parameter switching path. For example, the second die-cutting device is subsequently associated with the first parameter switching path of the first die-cutting device, and the first die-cutting device cannot obtain the die-cutting parameter switching information of the second die-cutting device through the first path.

[0098] For example, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, it means that the first die-cutting device and the second die-cutting device cannot perform a cooperative die-cutting operation in the current scenario. In order to avoid subsequent associated operations when the second die-cutting device is not compatible with the first parameter switching function, the first information is sent to the second die-cutting device to determine whether the second die-cutting device is compatible with the first parameter switching function.

[0099] With such a configuration, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, sending the first information to the second die-cutting device can help understand the compatibility between different die-cutting devices, help to reasonably arrange the die-cutting parameter switching business, and avoid unnecessary waste of resources.

[0100] S322, when feedback information corresponding to the first information sent by the second die-cutting device is obtained, traverse the first parameter switching path compatible with the first die-cutting device one by one to see whether a die-cutting request instruction sent by the second die-cutting device is obtained. The feedback information is used to indicate that the second die-cutting device is compatible with the first parameter switching function.

[0101] It can be understood that when the feedback information corresponding to the first information sent by the second die-cutting device is obtained, it means that the second die-cutting device can perform die-cutting operations in coordination with other devices on the first parameter switching path. Therefore, it is possible to traverse the first parameter switching path compatible with the first die-cutting device one by one to see whether the die-cutting request instruction sent by the second die-cutting device is obtained.

[0102] With such a configuration, when feedback information corresponding to the first information sent by the second die-cutting device is obtained, the first parameter switching path compatible with the first die-cutting device is traversed one by one to see whether the die-cutting request instruction sent by the second die-cutting device is obtained. This can reduce erroneous operations caused by the mismatch between the die-cutting request instruction and the path, facilitate subsequent effective interaction, ensure that they can communicate smoothly, and thus improve die-cutting efficiency.

[0103] In a possible implementation, S320, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, traversing the first parameter switching path compatible with the first die-cutting device one by one to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained, includes:

[0104] S323, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, wait for a first time period one by one on the first parameter switching path compatible with the first die-cutting device.

[0105] It is understandable that the first duration can be 10 seconds, 20 seconds, 30 seconds, etc.

[0106] For example, if the first parameter switching paths compatible with the first die-cutting device are PLC control path 1, PLC control path 2, and PLC control path 3, then the first time length may be waited on PLC control path 1 to determine whether a die-cutting request instruction is obtained within the first time length. If not, the first time length may be waited on PLC control path 2 to determine whether a die-cutting request instruction is obtained within the first time length, and so on, until a die-cutting request instruction is obtained, or all PLC control paths are traversed completely, or until the first time length is reached.

[0107] With such arrangement, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, waiting for the first time on the first parameter switching path compatible with the first die-cutting device one by one can avoid long-term invalid waiting and improve subsequent operation efficiency.

[0108] S324: monitoring whether a die-cutting request instruction sent by the second die-cutting device is obtained within the first time period.

[0109] It can be understood that a monitoring mechanism can be set to determine whether the die-cutting request instruction sent by the second die-cutting device is obtained. For example, the first instruction sent by the second die-cutting device is monitored within the first time period, and it is queried whether the associated configuration carried by the first instruction is the configuration of the first parameter switching path of the second die-cutting device. If so, the die-cutting request instruction sent by the second die-cutting device is obtained; if not, the die-cutting request instruction sent by the second die-cutting device is not obtained, then after the first time period is reached, it can switch to the next path (such as PLC control path 2) to continue monitoring, and repeat the above monitoring process until the die-cutting request instruction is obtained, or all PLC control paths are completely traversed, or until the first time period is reached.

[0110] With this arrangement, whether the die-cutting request instruction sent by the second die-cutting device is obtained within the first time period can be monitored. Each path can be monitored one by one, which can greatly increase the probability of capturing a valid die-cutting request instruction, so that the first die-cutting device can obtain the correct instruction in many situations.

[0111] In a possible implementation, in step S320, when the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, after traversing the first parameter switching path compatible with the first die-cutting device one by one to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained, the OCA optical adhesive film die-cutting control method further includes:

[0112] S325, when the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device, a second parameter switching path association is established with the second die-cutting device on the second path, wherein the second path is one of the second parameter switching paths compatible with the first die-cutting device and the second die-cutting device.

[0113] It can be understood that the second path can be a path that is compatible with the first die-cutting device and the second die-cutting device, which means that they have the ability to cooperate with each other in the die-cutting operation on the second path.

[0114] For example, when the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device, it may mean that the first parameter switching path compatible with the first die-cutting device fails and cannot receive or process the request instruction. It is also possible that the parameter setting of the first parameter switching path may be incompatible with the current die-cutting request instruction, resulting in the inability to recognize and process the instruction. Therefore, the same control logic or control command set can be set so that different die-cutting devices can operate in coordination through a common PLC control path, that is, establish a second parameter switching path association with the second die-cutting device on the second path.

[0115] With such a setting, when the die-cutting request instruction is not obtained in the first parameter switching path compatible with the first die-cutting device, a second parameter switching path association is established with the second die-cutting device on the second path. This can enhance the reliability of the entire die-cutting process, reduce the risk of interruption caused by a single path failure, and help improve die-cutting efficiency.

[0116] In a possible implementation, S325, when the die-cutting request instruction is not obtained in the first parameter switching path compatible with the first die-cutting device, establishing a second parameter switching path association with the second die-cutting device on the second path includes:

[0117] S326: If the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device within the second time period, a second parameter switching path association is established with the second die-cutting device on the second path.

[0118] It is understandable that the second duration can be 10 seconds, 20 seconds, 30 seconds, etc.

[0119] For example, when the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device, it may indicate that there is a delay in the current instruction. Therefore, a second time period is set. After the second time period, if the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device, it means that there is no delay in the instruction, but that there is a failure in the first parameter switching path compatible with the first die-cutting device, and the request instruction cannot be received or processed. Therefore, a second parameter switching path association can be established with the second die-cutting device on the second path.

[0120] With such a configuration, if the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device within the second time period, a second parameter switching path association is established with the second die-cutting device on the second path, thereby avoiding misjudgment caused by delays, thereby enhancing the reliability of the entire die-cutting process and helping to improve die-cutting efficiency.

[0121] Alternatively, S327, when the die-cutting request instruction is not obtained on all compatible first parameter switching paths of the first die-cutting device, a second parameter switching path association is established with the second die-cutting device on the second path.

[0122] It can be understood that when the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device, it may mean that only a certain path in the first parameter switching path has not obtained the die-cutting request instruction, but it does not mean that other paths in the first parameter switching path cannot obtain the die-cutting request instruction. Therefore, it is possible to traverse all the first parameter switching paths compatible with the first die-cutting device to see whether the die-cutting request instruction is obtained. When the die-cutting request instruction is not obtained on all the first parameter switching paths compatible with the first die-cutting device, it means that other paths cannot obtain the die-cutting request instruction either, but all the paths of the first parameter switching path compatible with the first die-cutting device are faulty and cannot receive or process the request instruction. Therefore, a second parameter switching path association can be established with the second die-cutting device on the second path.

[0123] With such a configuration, when no die-cutting request instruction is obtained on all compatible first parameter switching paths of the first die-cutting device, a second parameter switching path association is established with the second die-cutting device on the second path. This can avoid misjudgment caused by delays, thereby enhancing the reliability of the entire die-cutting process and helping to improve die-cutting efficiency.

[0124] S330, when a die-cutting request instruction is obtained on a first path of a first parameter switching path compatible with the first die-cutting device, a first parameter switching path association is established with the second die-cutting device on the first path, wherein the first path is one of the first parameter switching paths compatible with the first die-cutting device.

[0125] It can be understood that when a die-cutting request instruction is obtained on the first path of the first parameter switching path compatible with the first die-cutting device, it means that the second die-cutting device hopes to perform some form of cooperative die-cutting operation with the first die-cutting device in order to coordinate the working parameters of the two. Therefore, the first path of the first die-cutting device can be associated with the die-cutting request instruction of the second die-cutting device, such as configuring the network parameters of each device (such as IP address, port number, etc.) to ensure that they can recognize each other and define which input signals come from the second die-cutting device (such as die-cutting request instructions) and which output signals will be sent to the first die-cutting device (such as parameter adjustment commands), so that the two devices can effectively collaborate on the same path. For example, the first die-cutting device can respond to the needs of the second die-cutting device, such as modifying the tool type, cutting speed or pressure.

[0126] With such a configuration, when a die-cutting request instruction is obtained on the first path of the first parameter switching path compatible with the first die-cutting device, a first parameter switching path association is established with the second die-cutting device on the first path, and real-time coordination can be achieved to ensure that each link of the subsequent die-cutting process can be carried out synchronously to avoid ineffective waiting or downtime, thereby helping to improve the quality of the final product and, in turn, to improve die-cutting efficiency.

[0127] S340: The first die-cutting device obtains die-cutting parameter switching information of the second die-cutting device through the first path.

[0128] It can be understood that the die-cutting parameter switching information may be information on cutting speed switching, information on tool type switching, information on pressure switching, and the like.

[0129] For example, the first die-cutting device can send a request to the second die-cutting device through the first path to obtain the die-cutting switching parameters of the second die-cutting device. Optionally, the request can be periodic or based on a specific event (such as a die-cutting switching parameter event). Once the second die-cutting device receives the request, it transmits the current die-cutting parameter switching information of the second die-cutting device back to the first die-cutting device to enable the first die-cutting device and the second die-cutting device to perform effective collaborative die-cutting operations.

[0130] With such a configuration, the first die-cutting device obtains the die-cutting parameter switching information of the second die-cutting device through the first path, which can significantly enhance the coordination between the first die-cutting device and the second die-cutting device, ensure the efficient cooperation of the two devices in the same die-cutting process, and help improve the die-cutting efficiency.

[0131] In one possible implementation, see Figure 3 The OCA optical film die-cutting device further includes a control device, which is communicatively connected with the OCA optical film die-cutting device. The OCA optical film die-cutting control method further includes:

[0132] S400, when there is die-cutting control information and the current moment is a preset moment, determining that a die-cutting control opportunity has arrived for the OCA optical adhesive film die-cutting device. The die-cutting control efficiency corresponding to the die-cutting control information is greater than the die-cutting control efficiency of the die-cutting control information currently corresponding to the OCA optical adhesive film die-cutting device, and the preset moment is a moment when more than a preset number of OCA optical adhesive films are operated without using a key device.

[0133] It can be understood that the die-cutting control information can be information on optimization of control parameters, information on improvement of control functions, etc. A key device can be a device that an operator uses a control device to control die-cutting, such as a CNC die-cutting machine, a rotary knife die-cutting machine, etc. A non-key device can be a device that an operator does not use a control device to control die-cutting, and a device that automatically runs through a control program preset by the control device, such as a conveyor belt, a coil rack, etc. The preset time can be a time when a preset number (such as 2, 3, etc.) of OCA optical adhesive films are not die-cut using a key device, such as 02:00, 03:00, etc. The die-cutting control efficiency can be the efficiency of the control device controlling the OCA optical adhesive film die-cutting equipment to die-cut the OCA optical adhesive film, for example, the number or area of ​​OCA optical adhesive films that can be processed per unit time.

[0134] For example, when there is die-cutting control information and the current moment is the preset moment, it means that the control parameters can be optimized or the control function can be improved, that is, it is determined that the die-cutting control opportunity of the OCA optical film die-cutting device has arrived. For example, the die-cutting control efficiency corresponding to the die-cutting control information set in the current control device is 85%. When there is die-cutting control information (the corresponding die-cutting control efficiency is 89%), if the current moment is 02:00, it is determined that the die-cutting control opportunity of the OCA optical film die-cutting device has arrived. For another example, the die-cutting control efficiency corresponding to the die-cutting control information set in the current control device is 85%. When there is die-cutting control information (the corresponding die-cutting control efficiency is 82%), if the current moment is 02:00, it is determined that there is no die-cutting control opportunity of the OCA optical film die-cutting device. For another example, the die-cutting control efficiency corresponding to the die-cutting control information set in the current control device is 85%. When there is die-cutting control information (the corresponding die-cutting control efficiency is 89%), if the current time is 10:00, it is determined that there is no die-cutting control opportunity for the OCA optical film die-cutting equipment.

[0135] For example, the operator uses the control device to perform die-cutting control on the key device, but if die-cutting control information is obtained, in order to improve the die-cutting efficiency, the original configured die-cutting control information will be deleted, and the obtained die-cutting control information will be configured. At this time, higher computing resources (such as CPU, memory, etc.) may be required during the configuration process, resulting in a shortage of computing resources for the die-cutting control process, which in turn affects the normal operation of the operator using the control device to perform die-cutting control on the key device (for example, causing the key device to temporarily lose response), or, during the configuration process, the priority of the service for configuring the obtained die-cutting control information is higher than the priority of the current die-cutting control service, which will also affect the normal operation of the operator using the control device to perform die-cutting control on the key device (for example, causing the control device to temporarily stop controlling the key device). Therefore, by judging whether the die-cutting control opportunity of the OCA optical film die-cutting device has arrived, the problem of erroneous operation of the die-cutting control process caused by configuring the obtained die-cutting control information at the wrong opportunity can be avoided.

[0136] With this setting, when there is die-cutting control information and the current moment is the preset moment, the die-cutting control opportunity of the OCA optical film die-cutting equipment is determined, which can reduce the missed die-cutting control opportunities due to operator misjudgment, thereby improving the reliability of the overall die-cutting process.

[0137] S500, when it is determined that the die-cutting control opportunity has arrived, a device list of the OCA optical film die-cutting device that transmits information with the control device is obtained, wherein the device list includes key devices or non-key devices.

[0138] It is understood that the device list may be a list including device identifications or a list including device models. For example, if the model of device 1 is Rotary, then device 1 is a rotary die cutter; if the model of device 2 is Belt, then device 2 is a conveyor belt.

[0139] For example, when it is determined that the die-cutting control opportunity has arrived, the device list of the OCA optical film die-cutting device that transmits information with the control device can be queried through the interface. The device list of the OCA optical film die-cutting device that transmits information with the control device can also be obtained through API query.

[0140] With this arrangement, when it is determined that the die-cutting control opportunity has arrived, the device list of the OCA optical film die-cutting device that transmits information with the control device is obtained, reducing errors in manual recording, so as to obtain the latest device information in real time and provide data support for subsequent decision-making.

[0141] S600, when the device list obtained includes at least one key device, obtain the workload value of each key device. If the workload value of each key device is less than the preset workload value, implement the die-cutting control information configuration service of the OCA optical film die-cutting equipment.

[0142] It can be understood that the preset workload value can be a value used to determine whether the key device is performing die-cutting control services, such as 0%, 5%, 70%, etc. The die-cutting control information configuration service can be a service for controlling the device to configure the acquired die-cutting control information.

[0143] For example, when the device list obtained includes at least one key device, it means that a key device is transmitting information with the control device. Therefore, in order to avoid the configuration of the acquired die-cutting control information affecting the normal operation of the operator using the control device to control the die-cutting of the key device, the workload value of each key device can be obtained through sensors (such as pressure sensors, power sensors, etc.). If the workload value of each key device is less than the preset workload value, it means that no key device is currently performing die-cutting control services, that is, the operator has not used the control device to perform die-cutting control operations on the key device. At this time, if the acquired die-cutting control information is configured, there will be no temporary loss of response of the key device. Therefore, the die-cutting control information configuration service of the OCA optical film die-cutting equipment can be implemented.

[0144] For example, if the workload value of each key device is 2% and the preset workload value is 3%, it means that the key device may be performing a calibration operation, that is, the key device has not yet started the die-cutting control service, that is, the operator has not started to use the control device to perform die-cutting control operations on the key device. At this time, if the die-cutting control information obtained by the configuration is obtained, there will be no temporary loss of response of the key device (such as the calibration operation occupies less computing resources and will not compete with the configuration process for computing resources). Therefore, the die-cutting control information configuration service of the OCA optical film die-cutting equipment can also be implemented.

[0145] With such a configuration, when the device list obtained includes at least one key device, the workload value of each key device is obtained. If the workload value of each key device is less than the preset workload value, the die-cutting control information configuration service of the OCA optical film die-cutting equipment is implemented. This can avoid the problem of untimely device response or service conflict, and can effectively reduce the probability of unexpected equipment shutdown or loss of response, thereby helping to improve die-cutting efficiency.

[0146] S700: When the devices in the acquired device list are all non-critical devices, the control device implements the die-cutting control information configuration service of the OCA optical adhesive film die-cutting device.

[0147] It can be understood that when all the devices in the device list obtained are non-critical devices, it means that no critical device is currently performing die-cutting control services. Even if non-critical devices (such as conveyor belts) are running, the die-cutting control information obtained by configuration will not affect the operation process of the non-critical devices. Therefore, the die-cutting control information configuration service of OCA optical film die-cutting equipment can be implemented.

[0148] With such a setting, when all the devices in the device list obtained are non-critical devices, the control device implements the die-cutting control information configuration service of the OCA optical film die-cutting device, which can avoid the problem of untimely device response or business conflict, and can effectively reduce the probability of unexpected equipment shutdown or loss of response, thereby helping to improve die-cutting efficiency.

[0149] In a possible implementation, the OCA optical film die-cutting control method further includes:

[0150] S800: When the acquired device list includes at least one key device, determine an average workload value of each key device within a preset time period.

[0151] It is understandable that the preset duration can be 1 minute, 2 minutes, 3 minutes, etc.

[0152] For example, when the device list obtained includes at least one key device, the average workload value of each key device within a preset time period is calculated. The calculation formula may be: For example, within 1 minute, the workload value is collected every 3 seconds, so the number of data points is 20, and the calculation formula can be For another example, if the workload value is collected every 2 seconds within 1 minute, the number of data points is 30, and the calculation formula can be

[0153] With such a setting, when the device list obtained includes at least one key device, the average workload value of each key device within a preset time period is determined, which can avoid data deviation caused by a single collection and provide data support for subsequent decision-making.

[0154] In a possible implementation, S800, when the acquired device list includes at least one key device, determining an average workload value of each key device within a preset time period includes:

[0155] S810: When the acquired device list includes at least one key device, obtain a workload value of each key device at a first time interval within a preset time period.

[0156] It can be understood that the first time interval may be every 1 second, every 2 seconds, etc.

[0157] For example, when the device list obtained includes at least one key device, the sampling time point within the preset time length is set according to the preset time length and the first time interval, and the workload value of each key device is obtained through the sensor when each first time interval arrives.

[0158] With such configuration, when the device list obtained includes at least one key device, the workload value of each key device is obtained at a first time interval within a preset time period, which helps to ensure the timeliness of the data and provide a basis for subsequent analysis.

[0159] S820: After the preset time period has elapsed, determine the average workload value of the acquired workload values ​​of each key device.

[0160] It can be understood that for each key device, the workload values ​​collected by the key device within a preset time period are summed up and then divided by the number of data points of the sampled workload values ​​to obtain an average workload value.

[0161] With such a setting, after the preset time period, the average workload value of the workload values ​​of each key device obtained is determined, which can avoid data deviation caused by a single collection and provide data support for subsequent decision-making.

[0162] S900: When the average workload value of each key device is less than the preset workload value, the die-cutting control information configuration service of the OCA optical film die-cutting device is implemented.

[0163] It can be understood that when the average workload value of each key device is less than the preset workload value, it means that no key device is currently performing die-cutting control operations, that is, the operator has not used the control device to perform die-cutting control operations on the key device. At this time, if the die-cutting control information obtained is configured, there will be no temporary loss of response of the key device. Therefore, the die-cutting control information configuration service of the OCA optical film die-cutting equipment can be implemented.

[0164] With this arrangement, when the average workload value of each key device is less than the preset workload value, the die-cutting control information configuration service of the OCA optical film die-cutting equipment can be implemented, which can reduce the risk of operator misjudgment and help improve die-cutting efficiency.

[0165] In a possible implementation, the OCA optical film die-cutting control method further includes:

[0166] S901, when the workload value of each key device exceeds the preset workload value, wait for the next die-cutting control opportunity of the OCA optical film die-cutting equipment.

[0167] It can be understood that when the workload value of each key device exceeds the preset workload value, it means that a key device is currently performing die-cutting control operations, that is, the operator is using the control device to perform die-cutting control operations on the key device. At this time, if the die-cutting control information obtained by the configuration is obtained, the key device may temporarily lose response. Therefore, the die-cutting control information configuration business of the OCA optical film die-cutting equipment may not be implemented temporarily, but wait for the next die-cutting control opportunity of the OCA optical film die-cutting equipment.

[0168] With this setting, when the workload value of each key device exceeds the preset workload value, waiting for the next die-cutting control opportunity of the OCA optical film die-cutting equipment can avoid problems such as untimely device response or business conflicts, and can effectively reduce the probability of unexpected equipment shutdown or loss of response, thereby helping to improve die-cutting efficiency.

[0169] S902, when it is determined that the next die-cutting control opportunity has arrived, a list of devices connected to the control device is obtained.

[0170] It is understandable that when it is determined that the next die-cutting control opportunity has arrived, the device list of the OCA optical film die-cutting device that transmits information with the control device can be queried again through the interface end. The device list of the OCA optical film die-cutting device that transmits information with the control device can also be obtained through the API query again.

[0171] With this arrangement, when it is determined that the next die-cutting control opportunity has arrived, a list of devices connected to the control device is obtained, reducing errors in manual recording, so that the latest device information can be obtained in real time to provide data support for subsequent decision-making.

[0172] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0173] Corresponding to the OCA optical adhesive film die-cutting control method described in the above embodiment, the embodiment of the present application also provides an OCA optical adhesive film die-cutting control system, and each unit of the system can implement each step of the OCA optical adhesive film die-cutting control method. Figure 4 A structural block diagram of an OCA optical adhesive film die-cutting control system provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0174] Reference Figure 4 , OCA optical film die-cutting control system includes:

[0175] The acquisition unit is used to acquire parameter information of the OCA optical adhesive film to be processed, wherein the parameter information is used to reflect the thickness of the OCA optical adhesive film to be processed.

[0176] The matching unit is used to match the parameter information with the preset die-cutting database to obtain setting information, wherein the setting information is used to reflect the setting of the die-cutting parameters.

[0177] The processing unit is used for the OCA optical adhesive film die-cutting device to perform die-cutting processing on the OCA optical adhesive film to be processed based on the setting information and the preset size information.

[0178] It should be noted that the information interaction, execution process, etc. between the above-mentioned systems / units are based on the same concept as the method embodiment of the present application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0179] Those skilled in the art can clearly understand that, for the convenience and simplicity of description, only the division of the above-mentioned functional units is used as an example for illustration. In practical applications, the above-mentioned functions can be assigned to different functional units as needed, that is, the internal structure of the system can be divided into different functional units to complete all or part of the functions described above. The functional units in the embodiment can be integrated into a processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0180] The present application also provides an OCA optical film die-cutting device, Figure 5 This is a schematic diagram of the structure of a control device for an OCA optical film die-cutting device provided in one embodiment of the present application. Figure 5 As shown, the control device 6 of this embodiment includes: at least one processor 60 ( Figure 5 Only one is shown), at least one memory 61 ( Figure 5Only one is shown) and a computer program 62 stored in the at least one memory 61 and executable on the at least one processor 60. When the processor 60 executes the computer program 62, the control device 6 implements the steps in any of the above-mentioned OCA optical adhesive film die-cutting control method embodiments, or implements the functions of the various units in the above-mentioned system embodiments.

[0181] Exemplarily, the computer program 62 may be divided into one or more units, which are stored in the memory 61 and executed by the processor 60 to complete the present application. The one or more units may be a series of computer program instruction segments capable of completing specific functions, which are used to describe the execution process of the computer program 62 in the control device 6.

[0182] For example, the OCA optical film die-cutting equipment may include an OCA optical film die-cutting device and a control device 6 that is communicatively connected to the OCA optical film die-cutting device. The OCA optical film die-cutting device may include a conveying device (such as a conveyor belt), a tool die-cutting device (such as a CNC die-cutting machine, a rotary knife die-cutting machine, etc.), a collecting device (such as a roll rack), etc. The control device 6 controls the conveying device to automatically transfer the OCA optical film to the die-cutting area of ​​the tool die-cutting device. Based on the setting information and preset size information, the control device 6 controls the tool die-cutting device to die-cut the OCA optical film as required to obtain a die-cut product. The control device 6 controls the collecting device to collect the die-cut products that have completed die-cutting to obtain the final OCA optical film product. The control device 6 may include, but is not limited to, a processor 60 and a memory 61. Those skilled in the art will understand that, Figure 5 It is only an example of the control device 6 and does not constitute a limitation on the control device 6. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, buses, etc.

[0183] The processor 60 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0184] In some embodiments, the memory 61 may be an internal storage unit of the control device 6, such as a hard disk or memory of the control device 6. In other embodiments, the memory 61 may also be an external storage device of the control device 6, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash card, etc. equipped on the control device 6. Further, the memory 61 may also include both an internal storage unit and an external storage device of the control device 6. The memory 61 is used to store an operating system, an application program, a boot loader (BootLoader), data, and other programs, such as the program code of the computer program. The memory 61 may also be used to temporarily store data that has been output or is to be output.

[0185] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0186] An embodiment of the present application provides a computer program product. When the computer program product is run on an OCA optical adhesive film die-cutting device, the OCA optical adhesive film die-cutting device implements the steps in any of the above-mentioned method embodiments.

[0187] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, which can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may at least include: any entity or device capable of carrying the computer program code to the OCA optical film die-cutting equipment, recording medium, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electrical carrier signal, telecommunication signal and software distribution medium. For example, a USB flash drive, a mobile hard disk, a disk or an optical disk.

[0188] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0189] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0190] In the embodiments provided in the present application, it should be understood that the disclosed OCA optical adhesive film die-cutting equipment, OCA optical adhesive film die-cutting control system and OCA optical adhesive film die-cutting control method can be implemented in other ways. For example, the above-described OCA optical adhesive film die-cutting equipment and OCA optical adhesive film die-cutting control system embodiments are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0191] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0192] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. An OCA optical film die-cutting control method, characterized in that: Applied to OCA optical film die-cutting equipment, the method comprises: Acquire parameter information of the OCA optical adhesive film to be processed; wherein the parameter information is used to reflect the thickness of the OCA optical adhesive film to be processed; Matching the parameter information with a preset die-cutting database to obtain setting information; wherein the setting information is used to reflect the setting of the die-cutting parameters; Based on the setting information and the preset size information, the OCA optical adhesive film die-cutting device performs die-cutting processing on the OCA optical adhesive film to be processed.

2. The OCA optical film die-cutting control method according to claim 1, characterized in that: The OCA optical adhesive film die-cutting device includes an OCA optical adhesive film die-cutting device, the OCA optical adhesive film die-cutting device includes a first die-cutting device and a second die-cutting device, the first die-cutting device is compatible with a first parameter switching function, and before the OCA optical adhesive film die-cutting device performs die-cutting processing on the OCA optical adhesive film to be processed based on the setting information and the preset size information, the method further includes: The first die-cutting device responds to the switching signal of the second die-cutting device, and the first die-cutting device obtains a first die-cutting parameter list of the second die-cutting device; wherein the first die-cutting parameter list is used to indicate a first parameter switching path compatible with the second die-cutting device; In the case that the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, traversing the first parameter switching path compatible with the first die-cutting device one by one to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained; wherein the die-cutting request instruction is used to request the configuration of the first die-cutting device associated with the first parameter switching path compatible with the first die-cutting device; When the die-cutting request instruction is obtained on the first path of the first parameter switching path compatible with the first die-cutting device, a first parameter switching path association is established with the second die-cutting device on the first path; wherein the first path is one of the first parameter switching paths compatible with the first die-cutting device; The first die-cutting device obtains the die-cutting parameter switching information of the second die-cutting device through the first path.

3. The OCA optical film die-cutting control method according to claim 2, characterized in that: When the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, traversing the first parameter switching paths compatible with the first die-cutting device one by one to see whether a die-cutting request instruction sent by the second die-cutting device is obtained, includes: When the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, sending first information to the second die-cutting device; wherein the first information is used to obtain whether the second die-cutting device is compatible with the first parameter switching function; When feedback information corresponding to the first information sent by the second die-cutting device is obtained, the first parameter switching path compatible with the first die-cutting device is traversed one by one to see whether the die-cutting request instruction sent by the second die-cutting device is obtained; wherein the feedback information is used to indicate that the second die-cutting device is compatible with the first parameter switching function.

4. The OCA optical film die-cutting control method according to claim 2, characterized in that: When the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, traversing the first parameter switching paths compatible with the first die-cutting device one by one to see whether a die-cutting request instruction sent by the second die-cutting device is obtained, includes: When the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, waiting for a first time period on the first parameter switching path compatible with the first die-cutting device one by one; During the first time period, monitoring is performed to determine whether a die-cutting request instruction sent by the second die-cutting device is obtained.

5. The OCA optical film die-cutting control method according to claim 2, characterized in that: In the case that the first die-cutting parameter list and the first parameter switching path compatible with the first die-cutting device do not overlap, after traversing the first parameter switching paths compatible with the first die-cutting device one by one to see whether a die-cutting request instruction sent by the second die-cutting device is obtained, the method further includes: When the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device, a second parameter switching path association is established with the second die-cutting device on the second path; wherein the second path is one of the second parameter switching paths compatible with both the first die-cutting device and the second die-cutting device.

6. The OCA optical film die-cutting control method according to claim 5, characterized in that: When the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device, a second parameter switching path association is established with the second die-cutting device on the second path, including: If the die-cutting request instruction is not obtained on the first parameter switching path compatible with the first die-cutting device within the second time period, a second parameter switching path association is established with the second die-cutting device on the second path; or, When the die-cutting request instruction is not obtained on all compatible first parameter switching paths of the first die-cutting device, a second parameter switching path association is established with the second die-cutting device on the second path.

7. The OCA optical adhesive film die-cutting control method according to claim 1, characterized in that: The OCA optical adhesive film die-cutting device further includes a control device, and the control device is communicatively connected with the OCA optical adhesive film die-cutting device. The method further includes: In the case where there is die-cutting control information and the current moment is a preset moment, determining that the die-cutting control opportunity of the OCA optical adhesive film die-cutting device has arrived; wherein the die-cutting control efficiency corresponding to the die-cutting control information is greater than the die-cutting control efficiency of the die-cutting control information currently corresponding to the OCA optical adhesive film die-cutting device, and the preset moment is the moment when a preset number of OCA optical adhesive films are die-cut without using a key device; When it is determined that the die-cutting control opportunity has arrived, a device list of the OCA optical adhesive film die-cutting device that transmits information with the control device is obtained; wherein the device list includes key devices or non-key devices; In the case where the device list obtained includes at least one key device, the workload value of each key device is obtained, and if the workload value of each key device is less than the preset workload value, the die-cutting control information configuration service of the OCA optical adhesive film die-cutting device is implemented; In the case that the devices in the device list are all non-critical devices, the control device implements the die-cutting control information configuration service of the OCA optical adhesive film die-cutting device.

8. The OCA optical adhesive film die-cutting control method according to claim 7, characterized in that: The method further comprises: In the case where the device list obtained includes at least one key device, determining an average workload value of each key device within a preset time period; When the average workload value of each key device is less than the preset workload value, the die-cutting control information configuration service of the OCA optical film die-cutting equipment is implemented.

9. The OCA optical film die-cutting control method according to claim 7, characterized in that: In the case where the device list obtained includes at least one key device, determining the average workload value of each key device within a preset time period includes: In the case where the device list obtained includes at least one key device, obtaining a workload value of each key device at a first time interval within the preset time length; After the preset time period ends, an average workload value of the acquired workload values ​​of each key device is determined.

10. An OCA optical film die-cutting device, characterized in that: The OCA optical adhesive film die-cutting equipment includes an OCA optical adhesive film die-cutting device and a control device communicatively connected to the OCA optical adhesive film die-cutting device. The control device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the method described in any one of claims 1 to 9 is implemented.

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