Liquid cooling shell heat dissipation assembly

Abstract

The invention relates to a liquid cooling shell heat dissipation assembly, which comprises a ceramic substrate, a liquid cooling shell and a heat conduction column, and is characterized in that the ceramic substrate is attached to one side of the liquid cooling shell, and the heat conduction column is attached to the other side of the liquid cooling shell; the radio frequency device is mounted on the ceramic substrate, and a mounting hole for accommodating the radio frequency device is formed in the liquid cooling shell; the liquid cooling shell comprises butt joint shell plates which are oppositely spliced, and avoiding openings corresponding to the mounting holes are formed in the butt joint shell plates; runner partition plates are dispersedly arranged on the inner side walls of the butt-joint shell plates, grooves in the butt-joint shell plates are formed between the runner partition plates and the avoiding openings, and after the butt-joint shell plates are spliced and assembled, the grooves form a refrigerant runner in the liquid cooling shell; the refrigerant flow channel comprises a central flow channel and an edge flow channel, and the mounting hole is formed between the central flow channel and the edge flow channel; and the central flow channel, the mounting holes and the edge flow channels are in mirror symmetry relative to the axis of the liquid cooling shell. The heat dissipation effect can be guaranteed from the angles of high heat dissipation and light weight, and the leakage risk of refrigerant fluid is effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to a liquid cooling housing heat dissipation assembly. Background Art

[0002] The development trend of high integration, miniaturization and multi-function of electronic packaging causes the chip to generate higher heat during normal service. The difference in thermal expansion coefficients between the packaging components in the T / R assembly produces serious thermal mismatch at high temperatures, causing packaging aging phenomena such as cracking between the components. The thermal management role of the T / R assembly is becoming more and more obvious and important.

[0003] The invention patent with publication number CN117715378A discloses a magnesium alloy liquid-cooled casing and its preparation and assembly process, which mainly include the following aspects: the overall structural angle of the cavity, cover plate and sealing ring molding; the reinforcement angle of the local protective treatment of the cavity and cover plate; the flow channel sealing angle of flow channel pre-installation, clamping and leak detection; the processing angle of liquid cooling flow channel welding molding, casing post-weld finishing and outer surface protective treatment.

[0004] The above technical solution is essentially a cold plate structure, which adopts an indirect liquid cooling method. The cold plate and the object to be cooled are in contact to achieve heat dissipation, and there will be a certain loss in the efficiency of liquid cooling.

[0005] At the same time, the liquid cooling channel provided in the disclosed technical solution adopts an assembled form, and sealing gaskets, cover plates, etc. need to be assembled to form a magnesium alloy shell with a flow channel. The increase in components will increase the risk of fluid leakage. Summary of the invention

[0006] The purpose of the present application is to provide a liquid-cooled shell heat dissipation component, which can ensure the heat dissipation effect from the perspective of high heat dissipation and lightweight, and effectively reduce the risk of leakage of refrigerant fluid.

[0007] In order to achieve the above-mentioned object, the present invention provides a liquid-cooled housing heat dissipation assembly for dissipating heat from a radio frequency device, comprising: a ceramic substrate, a liquid-cooled housing, and a heat-conducting column, wherein the ceramic substrate is bonded to one side of the liquid-cooled housing, and the heat-conducting column is bonded to the other side of the liquid-cooled housing; The radio frequency device is mounted on the ceramic substrate, and the liquid cooling housing is provided with a mounting hole for accommodating the radio frequency device; The liquid cooling housing comprises butted shell plates facing each other, and the butted shell plates are provided with avoidance openings corresponding to the mounting holes; The inner side walls of the docking shell plates are provided with flow channel partitions in a dispersed manner, and the flow channel partitions and the avoidance openings form grooves on the docking shell plates. After the docking shell plates are assembled, the grooves form refrigerant flow channels in the liquid-cooling shell; The refrigerant flow channel includes a central flow channel and an edge flow channel, and the mounting hole is arranged between the central flow channel and the edge flow channel; The central flow channel, the mounting hole, and the edge flow channel are mirror-symmetrical relative to the axis of the liquid cooling housing.

[0008] In an optional embodiment, the docking shell plate includes a shell plate edge located at the periphery, the shell plate edge and the flow channel partition are perpendicular to the plate surface of the docking shell plate, and the shell plate edge has the same height as the flow channel partition.

[0009] In an optional embodiment, the butted shell plates are connected by brazing to form an integral structure of the liquid-cooled shell, and the avoidance opening is provided with a rim bonding plate protruding radially inward, and the rim bonding plate is arranged at the joint position of the avoidance opening.

[0010] In an optional embodiment, the avoidance includes a contour partition, and the contour partition is arranged on the inner side wall of the docking shell plate, and the height of the contour partition is the same as the height of the flow channel partition.

[0011] In an optional embodiment, the contour partition is integrally formed with the wheel rim bonding plate.

[0012] In an optional embodiment, the gap between adjacent avoidance openings is 0.15-0.25 mm, and the thickness of the butt shell plates is 0.6-0.9 mm.

[0013] In an optional embodiment, both the inner surface and the outer surface of the butted shell plates are provided with a diamond-like coating, and the diamond-like coating is deposited on the surface of the butted shell plates by magnetron sputtering.

[0014] In an optional embodiment, a liquid inlet and a liquid outlet are provided on the liquid cooling shell, and the liquid inlet and the liquid outlet include square openings arranged opposite to each other on both sides of the liquid cooling shell, and open notches are correspondingly provided on the edges of the shell plate, and the open notches are assembled to form a square opening structure of the liquid inlet and the liquid outlet.

[0015] In an optional embodiment, the material of the liquid cooling housing includes molybdenum-modified Invar alloy, the material of the ceramic substrate includes aluminum nitride, and the material of the heat-conducting column includes aluminum alloy; A refrigerant medium circulates in the refrigerant flow channel in the liquid-cooled shell, and the refrigerant medium includes ethylene glycol coolant with a concentration of 60%, and the liquid inlet volume is 0.3-0.8L / min.

[0016] In an optional embodiment, a main connecting hole and a secondary connecting hole are provided on the liquid-cooling shell, and a main connecting hole column and a secondary connecting hole column that can be spliced ​​and connected are correspondingly provided on the inner side wall of the docking shell plate, the diameter of the main connecting hole column is larger than the diameter of the secondary connecting hole column, and the side wall of the main connecting hole column is connected to the flow channel partition.

[0017] Through the above technical solution, the RF components can be cooled in the form of direct heat exchange, which effectively improves the heat dissipation effect of the packaged electronic components.

[0018] The liquid cooling housing in the present invention has higher heat dissipation performance and low expansion characteristics. Compared with the existing conventional indirect heat dissipation form, it can improve the heat dissipation conditions and ensure the sealing performance of the liquid cooling housing.

[0019] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of the overall structure of the liquid cooling shell heat dissipation assembly in this application; Figure 2 for Figure 1 A side view structural schematic diagram of; Figure 3 It is a structural schematic diagram of butt-jointed shell plates; Figure 4 is the steady-state temperature distribution diagram on the chip side; Figure 5 It is the steady-state temperature cloud diagram of the liquid-cooled shell; Figure 6 This is the temperature cloud diagram for the steady-state simulation of the refrigerant medium.

[0022] icon: 1- Ceramic substrate; 2-liquid cooling shell; 21-mounting hole; 22-refrigerant flow channel; 22a-central flow channel; 22b-edge flow channel; 23-liquid inlet; 24-liquid outlet; 25-main connection hole; 26-secondary connection hole; 3-heat conducting column; 4- docking shell plate; 41- avoidance; 42- flow channel partition; 43- shell plate edge; 44- wheel rim fitting plate; 45- contour partition; 46- open gap; 47- main connection hole column; 48- secondary connection hole column. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0024] In the description of this application, it should be noted that the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0025] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0026] The liquid-cooled shell heat dissipation assembly in the present application is mainly used for heat dissipation of packaged electronic components, especially for cooling packaged radio frequency components. By directly using the electronic packaging shell itself as the main heat dissipation structure, direct heat dissipation of packaged electronic components is achieved, greatly enhancing the heat dissipation effect, while ensuring the sealing of the heat dissipation shell to avoid the risk of leakage of the refrigerant medium.

[0027] See also Figure 1 , and combined with Figure 2-Figure 3 The liquid-cooled shell heat dissipation component of the present invention is used to dissipate heat for radio frequency devices. The main body includes: a ceramic substrate 1, a liquid-cooled shell 2 and a thermally conductive column 3. The ceramic substrate 1 is mainly used to install the radio frequency component, and the hydraulic shell serves as a packaging shell of the radio frequency component. While realizing the packaging structure, the packaged radio frequency component is directly dissipated through the internal flow channel and the flowing refrigerant.

[0028] From the perspective of RF device installation, the ceramic substrate 1 is fitted on one side of the liquid-cooled shell 2, and the liquid-cooled shell 2 can be used to dissipate the heat of the ceramic substrate 1. The heat generated by the ceramic substrate 1 is transferred to the liquid-cooled shell 2 in the form of heat conduction and dissipated to the outside through the flowing refrigerant of the liquid-cooled shell 2 itself.

[0029] The heat-conducting column 3 is attached to the other side of the liquid-cooled shell 2. Through the setting of the heat-conducting column 3, the heat-conducting column 3 can be connected to the heat dissipation cold plate or other structure providing cold capacity, so that the heat of the liquid-cooled shell 2 is transferred to the heat dissipation cold plate or other structure providing cold capacity through the heat-conducting column 3 in the form of heat conduction, ensuring that a relatively smooth heat transfer route is formed.

[0030] Based on the installation of the RF device in the present application and the characteristics of the liquid-cooled housing 2 that takes both the packaging structure and the heat dissipation structure into consideration, the RF device is installed on the ceramic substrate 1 to achieve normal installation.

[0031] The liquid-cooled housing 2 is provided with a mounting hole 21 for accommodating the RF device. Through the setting of the mounting hole 21, the RF device can be accommodated in the mounting hole 21 of the liquid-cooled housing 2, thereby achieving the enclosure of the RF device installation space, so that the heat generated by the RF device in the mounting hole 21 can be directly removed through the liquid-cooled housing 2.

[0032] The liquid cooling housing 2 includes butted shell plates 4 which are butted and welded to form the structure of the liquid cooling housing 2. The butted shell plates 4 in the present invention specifically include two pieces, which, after being butted and connected, form the overall structure of the liquid cooling housing.

[0033] From the standpoint of the docking shell plate 4, the docking shell plate 4 is provided with a avoidance opening 41 corresponding to the mounting hole 21. The avoidance opening 41 is specifically in the form of a hole on the docking shell plate 4. By butt-jointing the docking shell plates 4 and performing sealed butt welding, the avoidance openings 41 on both sides can form a through hole type in the thickness direction of the liquid cooling shell 2 after butt-jointing, so that the through hole type is formed into a housing and mounting structure for the RF component, that is, the RF component can be installed in the through hole type mounting hole 21.

[0034] Based on the basic function of the liquid-cooled shell 2, flow channel partitions 42 are dispersedly arranged on the inner side walls of the docking shell plate 4. After the docking shell plates 4 are connected toward each other, the flow channel partitions 42 can be spliced ​​and connected toward each other, so that the groove on the docking shell plate 4 formed between the flow channel partition 42 and the avoidance port 41 is buckled and closed. After the docking shell plates 4 are spliced ​​and assembled, the groove between the flow channel partition 42 and the avoidance port 41 forms a refrigerant flow channel 22 in the liquid-cooled shell 2. Furthermore, the refrigerant flow channel 22 can wrap around the mounting hole 21 so that the heat in the mounting hole 21 can be removed by the flowing refrigerant medium.

[0035] The arrangement of the refrigerant flow channel 22 fills the internal space of the liquid-cooled shell 2 and is spread over the unperforated portion of the docking shell plate 4, thereby ensuring the coverage area of ​​the refrigerant medium to the maximum extent. Combined with direct heat dissipation, the heat exchange effect of the RF component is improved as a whole.

[0036] Relative to the overall liquid-cooled shell 2, the refrigerant channel 22 includes a central channel 22a and an edge channel 22b, and the mounting hole 21 is arranged between the central channel 22a and the edge channel 22b, so that the mounting hole 21 can be wrapped in the area between the central channel 22a and the edge channel 22b to ensure the heat dissipation effect.

[0037] The central flow channel 22a, the mounting hole 21 and the edge flow channel 22b are mirror-symmetrical with respect to the axis of the liquid-cooled shell 2. Furthermore, the central flow channel 22a and the edge flow channel 22b are both in an interconnected configuration, which enables the periphery of the mounting hole 21 to be completely surrounded by the refrigerant medium. Combined with the dynamic flow of the refrigerant medium in the liquid-cooled shell 2, the heat dissipation effect of the RF components can be guaranteed to a great extent on the basis of direct heat exchange.

[0038] In one specific embodiment, the docking shell plate 4 includes a shell plate edge 43 located at the periphery, the shell plate edge 43 and the flow channel partition 42 are perpendicular to the plate surface of the docking shell plate 4, and the shell plate edge 43 and the flow channel partition 42 have the same height.

[0039] After the shell plates 4 are butted together and connected, the shell plate edges 43 can form a sealed side wall around the liquid-cooled shell 2, and the flow channel partition 42 can form a refrigerant channel. Combined with the same height of the shell plate edge 43 and the flow channel partition 42, the refrigerant flow channel 22 can be reliably formed, and sealing failure due to docking misalignment can be avoided, thereby reducing the risk of leakage.

[0040] The docking shell plates 4 are connected by brazing to form an integral structure of the liquid-cooling shell 2. In order to ensure the sealing performance, the avoidance opening 41 is provided with a rim fitting plate 44 protruding radially inward, and the rim fitting plate 44 is arranged at the joint position of the avoidance opening 41. Preferably, the avoidance opening 41 on the docking shell plates 4 is a avoidance square opening with a certain thickness that is essentially the same as the thickness of the docking shell plates 4, and the avoidance square opening is a hollow opening structure. After the docking shell plates 4 are joined together facing each other, the avoidance square openings on both sides constitute a straight-through mounting hole 21 structure.

[0041] The wheel rim fitting plate 44 is specifically a wheel rim annular plate arranged on the inner side of the docking shell plate 4 and extending outward at the avoidance square opening. The plate surface of the wheel rim annular plate is flush with the edge of the shell and the top of the flow channel partition 42, so that the wheel rim fitting plates 44 on both sides can face each other, thereby forming a good seal at the avoidance opening 41.

[0042] Based on the dense installation of RF components and from the perspective of a larger opening rate, the provision of the rim bonding plate 44 can greatly improve the sealing of the mounting hole 21, thereby minimizing the risk of leakage.

[0043] From the perspective of the formation of the avoidance opening 41, the avoidance opening 41 includes a contour partition 45, which has the same function as the shell plate edge 43 and the flow channel partition 42, all of which are to form a relatively closed space environment inside the liquid-cooled shell 2 after the shell plates 4 are butt-jointed.

[0044] Based on this, the contour partition 45 is arranged on the inner wall of the docking shell plate 4. The height of the contour partition 45 is the same as the height of the flow channel partition 42, which can form sufficient heat dissipation space at the installation hole 21 to meet the installation and heat dissipation needs of the RF component.

[0045] The liquid cooling shell 2 in the present invention is specifically a square shell structure, and the main functional area includes a central flow channel 22a located in the middle, edge flow channels 22b located on the edges, and a heat dissipation installation area located between the central flow channel 22a and the edge flow channels 22b. The heat dissipation installation area is divided into four areas by the central flow channel 22a and the connecting area, and each heat dissipation installation area is densely arranged with multiple installation holes 21.

[0046] Based on the dense distribution of the mounting holes 21 in each heat dissipation mounting area, the contour partition 45 on each heat dissipation mounting area is integrally formed with the wheel rim bonding plate 44. This method not only ensures the sealing of the mounting holes 21 after bonding, but also enhances the bonding strength and ensures the structural stability. More importantly, through the connected structure, the degree of thermal expansion of the mounting holes 21 in the heat dissipation mounting area can be reduced, and the expansion probability can be reduced to a minimum while maintaining high heat dissipation performance.

[0047] Furthermore, the rim bonding plate 44 close to the central flow channel 22a is connected to the flow channel partition plate 42 of the central flow channel 22a. In order to enable the flow channels of different heat dissipation installation areas to communicate with each other and facilitate the refrigerant medium to pass through different avoidance ports 41, there is at least a certain gap between the rim bonding plate 44 and the wall surface of the docking shell plate 4, so that the flow channels between different avoidance ports 41 are connected, the flow of the refrigerant medium between different avoidance ports 41 is maintained, and it is ensured that the cold can be transferred to each different avoidance port 41, so that different installation holes 21 can all get good heat dissipation.

[0048] In order to form the flow of refrigerant medium between different avoidance ports 41, the gap between adjacent avoidance ports 41 is 0.15-0.25mm, preferably 0.2mm. At the same time, based on the dense arrangement of the avoidance ports 41 in the heat dissipation installation area, in order to reduce the deformation during the processing process, the thickness of the docking shell plate 4 is 0.6-0.9mm, preferably 0.8mm, which can reduce the difficulty of brazing and ensure that there is no leakage during brazing.

[0049] In order to prevent the surface of the liquid-cooling housing 2 from being oxidized and to improve the corrosion resistance of the housing itself, the inner and outer surfaces of the docking shell plate 4 are both provided with a diamond-like coating.

[0050] The diamond-like coating is plated on the inner and outer surfaces of the docking shell plate 4 by a magnetron sputtering process, which not only has the function of wear resistance and corrosion resistance, but also can further increase the heat dissipation performance of the shell.

[0051] In another specific embodiment, a liquid inlet 23 and a liquid outlet 24 are provided on the liquid cooling shell 2. The liquid inlet 23 and the liquid outlet 24 include square openings arranged on both sides of the liquid cooling shell 2, which can maintain the inflow and outflow of the cold medium on the liquid cooling shell 2 and create conditions for the circulation of the cold medium in the liquid cooling shell 2.

[0052] In this embodiment, after the refrigerant medium enters the liquid cooling shell 2 through the liquid inlet 23, a part of it is diverted to the edge flow channel 22b through the flow channel partition 42, and the other part is diverted to the central flow channel 22a through the flow channel partition 42 of the central flow channel 22a, thereby forming a dynamic flow state between different heat dissipation installation areas, and finally gathered at the liquid outlet 24, and discharged from the inside of the liquid cooling shell 2 through the liquid outlet 24.

[0053] The shell plate edge 43 is provided with an open notch 46, which is joined to form a square opening structure of the liquid inlet 23 and the liquid outlet 24. Furthermore, the liquid inlet 23 and the liquid outlet 24 of the square opening structure can facilitate the connection of the external refrigerant medium pipeline, and the size of the square opening is adjustable. The liquid inlet 23 and the liquid outlet 24 in this embodiment are square openings of 5mm*2.2mm in size, which can be controlled and adjusted according to the size and type of the joint in actual use.

[0054] In the present invention, the material of the liquid cooling housing 2 includes molybdenum-modified Invar alloy, the material of the ceramic substrate 1 includes aluminum nitride, and the material of the heat conducting column 3 includes aluminum alloy.

[0055] Molybdenum modified Invar alloy can significantly improve the high temperature strength and corrosion resistance of the molybdenum modified Invar alloy by adding molybdenum element to Invar alloy. At the same time, the molybdenum modified Invar alloy can further optimize the thermal expansion performance of Invar alloy through the synergistic effect of molybdenum element and other elements of Invar alloy, making it more stable and reliable. And the addition of molybdenum can also improve the wear resistance of Invar alloy, making it have a longer service life in friction and wear environment.

[0056] Aluminum nitride, as a ceramic insulator, has a high heat transfer capacity and can take into account both RF component installation and heat transfer performance. The material of the thermal conductive column 3 is specifically 6061 aluminum alloy, which can fully transfer the self heat of the liquid cooling shell 2 to the heat dissipation cold plate or other structures that provide cooling in the form of heat conduction.

[0057] A refrigerant medium circulates in the refrigerant channel 22 in the liquid-cooled shell 2. The refrigerant medium includes ethylene glycol coolant with a concentration of 60%. The liquid inflow rate is 0.3-0.8 L / min. Preferably, the liquid inflow rate of the ethylene glycol coolant is 0.5 L / min.

[0058] In order to facilitate the connection between the liquid-cooled shell heat dissipation component and other functional components, a main connecting hole 25 and a secondary connecting hole 26 are provided on the liquid-cooled shell 2, and a main connecting hole column 47 and a secondary connecting hole column 48 that can be spliced ​​and connected are correspondingly provided on the inner side wall of the docking shell plate 4. The diameter of the main connecting hole column 47 is larger than the diameter of the secondary connecting hole column 48. The side wall of the main connecting hole column 47 is connected to the flow channel partition 42 of the central flow channel 22a, and the structural strength of the opening part can be enhanced by mutual connection, so that the flow channel partition 42 can also play the role of a reinforcing rib.

[0059] The liquid-cooled shell heat dissipation component in the present invention designs the flow channel for the electronic packaging shell itself. In order to achieve a weight similar to that of the widely used Al / SiC material shell, the traditional packaging shell is machined to form an internal flow channel of the packaging shell. The wall thickness of the shell itself reaches 0.8mm, achieving a combination of low expansion and high heat dissipation. The coolant can directly contact the RF component, and the direct liquid cooling and heat dissipation effect is better.

[0060] From the perspective of the overall structure, the liquid-cooling shell 2 is evenly divided into two upper and lower docking shell plates 4. The structures of the upper and lower docking shell plates 4 are different, and there are certain differences in the flow channel distribution, but the flow channels of the docking shell plates 4 correspond to each other as a whole. After machining, they can be well connected and airtight by brazing, and there is no risk of liquid leakage.

[0061] The liquid inlet 23 and the liquid outlet 24 of the liquid cooling housing 2 are both designed as square openings of 5mm*2.2mm in size, which can be controlled and adjusted according to the size and type of the connector in actual use. The refrigerant directly enters the liquid cooling housing 2 to circulate, and can conduct convection heat exchange with the cavity of the mounting hole 21 where the chip is mounted at the closest distance, and the liquid cooling heat dissipation effect is more obvious.

[0062] Although the removal amount of the avoidance opening 41 on the liquid-cooled shell 2 is relatively large, the flatness of the flat plate portion of the upper and lower docking shell plates 4 can be stabilized at 0.02 through machining and matching heat treatment processes, which has excellent processing feasibility.

[0063] The refrigerant medium selected in this application is a military 60% concentration ethylene glycol coolant, and the liquid inlet volume is designed to be 0.5L / min. It has an outstanding heat exchange effect and can stably and reliably remove heat from the liquid-cooled shell 2 and the cavity of the mounting hole 21.

[0064] Under the action of liquid cooling, in the absence of additional heat conduction of a cold plate, the temperature rise of the liquid cooling housing 2 and the refrigerant medium can be controlled to be far below the maximum allowable temperature of the military chip (125°C); The overall specific density of the liquid cooling shell 2 is only 2.9 g·cm -3 , achieving the characteristics of high heat dissipation and light weight; When 5 kg of water pressure is injected into the liquid cooling shell 2, the shell does not bulge or crack, and has reliable structural strength and stable sealing effect.

[0065] In one of the specific implementation processes, a specific simulation was conducted, and the simulation conditions were as follows: Shell material performance parameters

[0066] Refrigerant medium performance parameters

[0067] Liquid cooling simulation parameters

[0068] See also Figure 4-Figure 6 From the steady-state temperature distribution diagram of the chip side, the steady-state temperature cloud diagram of the liquid-cooled shell 2 and the steady-state simulated temperature cloud diagram of the refrigerant medium, it can be directly seen that the temperatures of the liquid-cooled shell 2 and the refrigerant medium are both controlled below 24°C, and the lowest temperature is controlled in the central part of the liquid-cooled shell 2, which can meet the cooling requirements of the RF components.

[0069] It should be noted that, in the absence of conflict, the features in the embodiments of this application may be combined with each other.

[0070] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A liquid-cooled housing heat dissipation assembly for dissipating heat from a radio frequency device, characterized in that: include: A ceramic substrate, a liquid cooling shell and a heat conducting column, wherein the ceramic substrate is attached to one side of the liquid cooling shell and the heat conducting column is attached to the other side of the liquid cooling shell; The radio frequency device is mounted on the ceramic substrate, and the liquid cooling housing is provided with a mounting hole for accommodating the radio frequency device; The liquid cooling housing comprises butted shell plates facing each other, and the butted shell plates are provided with avoidance openings corresponding to the mounting holes; The inner side walls of the docking shell plates are provided with flow channel partitions in a dispersed manner, and the flow channel partitions and the avoidance openings form grooves on the docking shell plates. After the docking shell plates are assembled, the grooves form refrigerant flow channels in the liquid-cooling shell; The refrigerant flow channel includes a central flow channel and an edge flow channel, and the mounting hole is arranged between the central flow channel and the edge flow channel; The central flow channel, the mounting hole, and the edge flow channel are mirror-symmetrical relative to the axis of the liquid cooling housing.

2. The liquid cooling housing heat dissipation assembly according to claim 1, characterized in that: The butt joint shell plate comprises a shell plate edge located at the periphery, the shell plate edge and the flow channel partition plate are both perpendicular to the plate surface of the butt joint shell plate, and the shell plate edge has the same height as the flow channel partition plate.

3. The liquid cooling housing heat dissipation assembly according to claim 2, characterized in that: The butted shell plates are connected by brazing to form an integral structure of the liquid-cooled shell, and the avoidance opening is provided with a wheel rim bonding plate protruding radially inward, and the wheel rim bonding plate is arranged at the joint position of the avoidance opening.

4. The liquid cooling housing heat dissipation assembly according to claim 3, characterized in that: The avoidance opening comprises a contour partition plate, which is arranged on the inner side wall of the butt shell plate, and the height of the contour partition plate is the same as that of the flow channel partition plate.

5. The liquid cooling housing heat dissipation assembly according to claim 4, characterized in that: The contour partition plate and the wheel rim bonding plate are integrally formed, and there is at least a gap between the wheel rim bonding plate and the wall surface of the butt shell plate.

6. The liquid cooling housing heat dissipation assembly according to claim 4, characterized in that: The gap between adjacent avoidance openings is 0.15-0.25 mm, and the thickness of the butt shell plates is 0.6-0.9 mm.

7. The liquid cooling housing heat dissipation assembly according to claim 4, characterized in that: The inner surface and the outer surface of the butt joint shell plates are both provided with diamond-like coatings, and the diamond-like coatings are deposited on the surfaces of the butt joint shell plates by magnetron sputtering.

8. The liquid cooling housing heat dissipation assembly according to claim 4, characterized in that: The liquid cooling shell is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet include square openings arranged opposite to each other on both sides of the liquid cooling shell, and the edges of the shell plate are correspondingly provided with open notches, and the open notches are assembled to form the square opening structure of the liquid inlet and the liquid outlet.

9. The liquid cooling housing heat dissipation assembly according to claim 4, characterized in that: The material of the liquid cooling housing includes molybdenum-modified Invar alloy, the material of the ceramic substrate includes aluminum nitride, and the material of the heat-conducting column includes aluminum alloy; A refrigerant medium circulates in the refrigerant flow channel in the liquid-cooled shell, and the refrigerant medium includes ethylene glycol coolant with a concentration of 60%, and the liquid inlet volume is 0.3-0.8L / min.

10. The liquid cooling housing heat dissipation assembly according to claim 4, characterized in that: The liquid cooling shell is provided with a main connection hole and a secondary connection hole, and the inner side wall of the docking shell plate is correspondingly provided with a main connection hole column and a secondary connection hole column that can be spliced ​​and connected. The diameter of the main connection hole column is larger than the diameter of the secondary connection hole column, and the side wall of the main connection hole column is connected to the flow channel partition.

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