Indicator lamp type TOP RGB LED lamp bead structure and preparation method thereof

Abstract

The invention discloses an indicator lamp type TOP RGB LED lamp bead structure and a preparation method thereof, and relates to the technical field of surface mounting LED devices. The lamp bead structure comprises an insulating base, a metal support, an RGB LED chip, a bonding wire table, a common electrode pin and packaging colloid, the metal support comprises a metal packaging cup body, and the bottom of the metal packaging cup body protrudes out of the bottom face of the insulating base to form a negative electrode pin; the RGB LED chip is installed in the die bonding area of the metal packaging cup body. The RGB LED chip is electrically connected with the bonding wire area of the bonding wire table through a bonding wire; the common-pole pin is arranged outside the insulating seat, and the bonding wire table is electrically connected with the common-pole pin; the lamp bead structure is improved, RGB lamp beads are combined into one lamp bead, the display effect of the indicator lamp can be improved, integration is facilitated, through structural improvement, the lamp bead structure further has the advantages of being high in heat dissipation, high in brightness and high in air tightness, and the defects that an existing LED lamp bead is poor in heat dissipation performance and not easy to integrate are overcome.

Description

Technical Field

[0001] The present invention relates to the technical field of surface mounted LED devices, and in particular to a TOP RGB LED lamp bead structure based on an indicator light type and a preparation method thereof. Background Art

[0002] The LEDs used in modern traffic lights have intelligent control and adaptive functions, which can adjust the signal duration in real time according to traffic flow, thereby improving traffic efficiency. This intelligent development trend helps to optimize urban traffic flow management, reduce traffic congestion, and improve road safety. High-brightness LEDs can ensure good visibility and driving safety in adverse weather conditions. This feature is crucial to improving road safety, especially at night or in adverse weather conditions, which can significantly improve the visibility and reaction time of drivers. Compared with traditional signal lights, LED signal lights have greater advantages in energy consumption and environmental friendliness. This trend is in line with the requirements of sustainable development, helps to reduce energy consumption and reduce the impact on the environment, and is also in line with the modern society's pursuit of green and low-carbon life. In addition, experts in the industry have conducted in-depth discussions on the development trend of the road LED traffic light industry, indicating that the application of LED technology in the field of traffic signals will be more extensive in the future, providing more intelligent, efficient and environmentally friendly solutions for urban traffic management and safety.

[0003] At present, the main type of traffic light lamp beads is direct-plug LED lamp beads. Direct-plug LED lamp beads are a common type of LED lamp beads and are widely used in traffic lights. This type of lamp bead has a variety of colors and specifications, such as 5mm bullet-shaped square lamps, 2mm long nipple-shaped lamp beads, 4mm round-headed light-emitting diodes, etc., which are suitable for different indicator light requirements. The characteristics of direct-plug LED lamp beads include low power consumption, high brightness, small size, light weight and long life, which make it an ideal choice for making road traffic lights. Compared with traditional incandescent lamps and low-voltage halogen tungsten lamps, LED lamp beads have significant advantages in brightness, life and energy efficiency, and therefore gradually replace the application of traditional light sources in traffic lights.

[0004] Although direct-plug LED lamp beads have certain advantages in terms of brightness, lifespan and energy efficiency, they usually have large sizes and thick packages, which to a certain extent limit the effective transfer of heat and make the heat dissipation performance of direct-plug LED lamp beads poor. This means that under high-intensity use, the operating temperature of direct-plug LED lamp beads will be higher, which may affect their service life and stability. In addition, this design of direct-plug LED lamp beads also leads to their large size and difficulty in integration. In modern electronic devices and lamps, space utilization efficiency is very important, and the large size of direct-plug LED lamp beads may limit their use in certain application scenarios. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to propose a TOP RGBLED lamp bead structure based on an indicator light type. By improving the lamp bead structure, RGB (red, green, and blue) lamp beads are merged into one lamp bead, which can enhance the indicator light display effect and facilitate integration. Moreover, through structural improvement, the lamp bead structure of the present invention has the advantages of high heat dissipation, high brightness and high air tightness, which solves the shortcomings of poor heat dissipation performance and difficult integration of existing LED lamp beads.

[0006] Another object of the present invention is to provide a method for preparing a TOP RGB LED lamp bead structure based on an indicator light type, which is used to prepare the above-mentioned TOP RGB LED lamp bead structure based on an indicator light type.

[0007] In order to solve the above technical problems, the present invention provides a TOP RGB LED lamp bead structure based on an indicator light type, including an insulating seat, a metal bracket, an RGB LED chip, a wire bonding station, a common electrode pin and a packaging colloid, wherein the metal bracket and the wire bonding station are respectively embedded in the inside of the insulating seat;

[0008] The metal bracket comprises a metal packaging cup body which is concave downwards, the inner bottom surface of the metal packaging cup body is a crystal fixing area, and the bottom of the metal packaging cup body protrudes from the bottom surface of the insulating seat to form a negative electrode pin;

[0009] The RGB LED chip is mounted on the crystal-bonding area of ​​the metal packaging cup, and the bottom end of the RGB LED chip is electrically connected to the crystal-bonding area of ​​the metal packaging cup;

[0010] The wire bonding station is correspondingly arranged on one side of the metal packaging cup body, and the RGB LED chip is electrically connected to the wire bonding area of ​​the wire bonding station through bonding wires;

[0011] The common-pole pin is arranged outside the insulating seat, and the wire bonding station is electrically connected to the common-pole pin;

[0012] The packaging colloid is filled in the metal packaging cup, the top of the packaging colloid protrudes from the top surface of the insulating seat, or the top surface of the packaging colloid is flush with the top surface of the insulating seat.

[0013] As an improvement of the above solution, three metal brackets (2) are provided, and each of the metal brackets (2) is provided with a metal packaging cup body (21) that is recessed downwards;

[0014] The RGB LED chip includes a red LED chip, a green LED chip and a blue LED chip, and the red LED chip, the green LED chip and the blue LED chip are respectively bonded to the solid crystal areas of the three metal packaging cup bodies, and the bottom end of the red LED chip, the bottom end of the green LED chip and the bottom end of the blue LED chip are respectively electrically connected to the solid crystal areas of the three metal packaging cup bodies;

[0015] The wire bonding station is correspondingly arranged on one side of each of the metal packaging cup bodies, and the red LED chip, the green LED chip and the blue LED chip are electrically connected to the corresponding wire bonding areas of the wire bonding station through different bonding wires.

[0016] As an improvement of the above solution, the indicator light type TOP RGB LED lamp bead structure includes two common-pole pins, and the two common-pole pins are respectively arranged on both sides of the insulating seat;

[0017] Two sides of each of the wire bonding stations are respectively connected to the two common electrode pins.

[0018] As an improvement of the above solution, the top of the packaging colloid protrudes from the top surface of the insulating seat, and the top of the packaging colloid is spherical.

[0019] As an improvement of the above solution, the surfaces of the wire bonding station, the common electrode pin and the metal bracket are respectively provided with a nickel layer and a silver layer from the inside to the outside.

[0020] As an improvement of the above solution, the wire bonding area of ​​the wire bonding stage is surrounded by a packaging colloid.

[0021] As an improvement of the above solution, the metal packaging cup body is in the shape of an inverted truncated cone.

[0022] As an improvement of the above solution, the length of the indicator light-based TOP RGB LED lamp bead structure is 2.0 to 4.0 mm, the width is 2.0 to 4.0 mm, and the height is 1.0 to 1.6 mm.

[0023] As an improvement of the above solution, the RGB LED chip is a vertical single-electrode RGB chip.

[0024] As an improvement of the above solution, the material of the insulating seat is PPA.

[0025] As an improvement of the above solution, the metal bracket, the wire bonding platform and the common electrode pin are made of copper.

[0026] Correspondingly, the present invention also provides a method for preparing a TOP RGB LED lamp bead structure based on an indicator light type, which is used to prepare the above-mentioned TOP RGB LED lamp bead structure based on an indicator light type, comprising the following steps:

[0027] (1) stamping and stretching the metal substrate, and stamping out unnecessary parts to obtain a mother metal bracket including a wire bonding platform and a metal packaging cup body, wherein protrusions are respectively provided on both sides of the mother metal bracket, and a gap is provided between the wire bonding platform and the metal packaging cup body; then electroplating is performed to form a nickel layer and a silver layer on the surface of the metal substrate in sequence;

[0028] (2) performing injection molding on the top and bottom surfaces of the parent metal bracket to form an insulating seat, and the bottom of the metal packaging cup body protrudes from the bottom surface of the insulating seat, so that the bottom of the metal packaging cup body serves as a negative electrode pin;

[0029] (3) Punching out the connecting portion between the parent metal bracket and the protrusion, so that the parent metal bracket is divided into three metal brackets, and each metal bracket is provided with a corresponding metal packaging cup body, and the two protrusions are bent to form common-pole pins on both sides of the insulating seat;

[0030] (4) fixing the RGB LED chip to the inner bottom surface of the metal packaging cup body, and connecting the RGB LED chip and the wire bonding area of ​​the wire bonding station through bonding wires;

[0031] (5) Encapsulation glue is used for encapsulation, so that the interior of the metal encapsulation cup is filled with encapsulation glue, and after curing, an encapsulation colloid is formed to obtain a TOP RGB LED lamp bead structure based on an indicator light type.

[0032] The implementation of the present invention has the following beneficial effects: the technical solution improves the overall structure of the lamp bead structure, innovatively integrates the originally dispersed RGB (red, green and blue) lamp beads into a single package, achieves a better integration effect, makes the overall volume of the lamp bead structure smaller, and is more conducive to integration. Compared with the original structure of the traditional dispersed layout, the lamp bead structure of the technical solution is conducive to improving the display effect and layout of the indicator light, improving the display clarity, and at the same time helping to simplify the circuit design and assembly process of the indicator light. In addition, the lamp bead structure of the technical solution has the advantages of high heat dissipation, high brightness and high air tightness, ensuring that it can still maintain a low operating temperature under high-intensity working conditions, effectively extending the service life of the lamp bead structure, and improving the stability and reliability of the system; at the same time, its high brightness characteristics ensure that the indication information is clearly visible even under darker or long-distance viewing conditions, further broadening the application scenarios; in addition, the high airtightness design effectively resists the erosion of harmful factors such as moisture and dust in the external environment, ensuring the long-term stable operation of internal electronic components, and is particularly suitable for use under harsh or special environmental conditions. At the application level, this technical solution based on the indicator light type TOP RGBLED lamp bead structure is not only suitable for indicator applications, but can also be used as a display screen, such as LED display screens, smart wearable devices, car display screens and other fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a structural diagram of a TOP RGB LED lamp bead structure based on an indicator light type in one embodiment of the present invention;

[0034] Figure 2 yes Figure 1 The cross-sectional view at AA of the TOP RGB LED lamp bead structure based on the indicator light type in the embodiment shown;

[0035] Figure 3 yes Figure 2 Cross-section at the middle BB;

[0036] Figure 4 for Figure 1 A rear view of the indicator light type TOP RGB LED lamp bead structure in the illustrated embodiment;

[0037] Figure 5 This is a schematic diagram of a structure of a TOP RGB LED lamp bead based on an indicator light type in another embodiment of the present invention;

[0038] Figure 6 for Figure 1 A flow chart of the preparation of a TOP RGB LED lamp bead structure based on an indicator light type in the embodiment shown;

[0039] Figure 7 for Figure 1A schematic diagram of the structure of the metal substrate after the connecting portion between the parent metal support and the protrusion is punched out in step (3) of the preparation process of the lamp bead structure shown;

[0040] In the figure, an insulating seat 1, a metal bracket 2, an RGB LED chip 3, a wire bonding station 4, a common electrode pin 5, a packaging colloid 6, a bonding wire 7, a metal packaging cup 21, a red LED chip 31, a green LED chip 32, a blue LED chip 33, and a cathode pin 211. DETAILED DESCRIPTION

[0041] To make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0042] In the description of the present invention, it is necessary to understand that the orientations or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “top” and “bottom” are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0043] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] like Figures 1 to 4 As shown, this embodiment is based on the indicator light type TOP RGB LED lamp bead structure, including an insulating seat 1, a metal bracket 2, an RGB LED chip 3, a wire bonding station 4, a common electrode pin 5 and a packaging colloid 6, and the metal bracket 2 and the wire bonding station 4 are respectively embedded in the insulating seat 1;

[0045] The metal bracket 2 includes a metal packaging cup body 21 that is concave downwards, the inner bottom surface of the metal packaging cup body 21 is a crystal-fixing area, and the bottom of the metal packaging cup body 21 protrudes from the bottom surface of the insulating seat 1 to form a negative electrode pin 211;

[0046] The RGB LED chip 3 is installed in the solid crystal area of ​​the metal packaging cup body 21, and the bottom end of the RGB LED chip 3 is electrically connected to the solid crystal area of ​​the metal packaging cup body 21;

[0047] The wire bonding station 4 is correspondingly arranged on one side of the metal packaging cup body 21, and the RGB LED chip 3 is electrically connected to the wire bonding area of ​​the wire bonding station 4 through the bonding wire 7;

[0048] The common-pole pin 5 is arranged outside the insulating seat 1, and the wire bonding station 4 is electrically connected to the common-pole pin 5;

[0049] The packaging colloid 6 is filled in the metal packaging cup 21 , and the top of the packaging colloid 6 protrudes from the top surface of the insulating seat 1 , or the top surface of the packaging colloid 6 is flush with the top surface of the insulating seat 1 .

[0050] It is worth noting that, compared with the traditional direct-plug LED lamp beads and conventional SMD LED lamp beads, this technical solution improves the overall structure of the lamp bead structure, innovatively integrates the originally dispersed RGB (red, green and blue) lamp beads into a single package, achieves a better integration effect, and makes the lamp bead structure more conducive to integration. Compared with the original structure of the traditional dispersed layout, the lamp bead structure of this technical solution is conducive to improving the display effect and layout of the indicator light, improving the display clarity, and at the same time helping to simplify the circuit design and assembly process of the indicator light. In addition, the lamp bead structure of this technical solution has the advantages of high heat dissipation, high brightness and high air tightness, ensuring that it can still maintain a low operating temperature under high-intensity working conditions, effectively extending the service life of the lamp bead structure, and improving the stability and reliability of the system; at the same time, its high brightness characteristics ensure that the indication information is clearly visible even under darker or long-distance viewing conditions, further broadening the application scenarios; in addition, the high airtightness design effectively resists the erosion of harmful factors such as moisture and dust in the external environment, ensuring the long-term stable operation of internal electronic components, and is particularly suitable for use in harsh or special environmental conditions. At the application level, this technical solution based on the indicator light type TOP RGB LED lamp bead structure is not only suitable for indicator applications, but can also be used as a display screen, such as LED display screens, smart wearable devices, car display screens and other fields.

[0051] Specifically, in the lamp bead structure, the chip is the main source of heat. The lamp bead structure of the present technical solution directly adheres the RGB LED chip 3 to the metal package cup 21. Based on the fact that the bottom of the metal package cup 21 is protruding from the bottom surface of the insulating seat 1, the bottom of the metal package cup 21 of the present technical solution is used for pins, and the negative electrode pin 211 is located outside the insulating seat 1, so that the lamp bead structure of the present technical solution can directly dissipate heat through the negative electrode pin 211 of the metal material located outside the insulating seat 1, which is convenient for the direct heat dissipation of the lamp bead. The metal material has good thermal conductivity and can quickly transfer heat, thereby effectively improving the heat dissipation of the lamp bead structure. In addition, the common electrode pin 5 of the present technical solution is also located outside the insulating seat 1, which can further improve the heat dissipation of the lamp bead structure, so that the lamp bead structure of the present technical solution has excellent heat dissipation effect, ensuring that a low working temperature can be maintained under high-intensity working conditions, effectively extending the service life of the lamp bead structure, and improving the stability and reliability of the system.

[0052] Further explanation, the cup and bowl bracket of the traditional RGB LED lamp bead usually only has the bottom solid crystal area made of metal material, and the side wall of the cup and bowl bracket is an insulator made of plastic material. The side wall of the lamp bead of this structure basically has no reflective effect, which makes the brightness of the lamp bead of this structure relatively poor. However, the entire metal packaging cup body 21 of the present technical solution is made of metal material, which has a better reflective effect, and can effectively improve the brightness of the lamp bead structure, so that even under darker or long-distance viewing conditions, it can ensure that the indication information is clearly visible. At the same time, based on the present technical solution, the entire metal packaging cup body 21 is made of metal material, the RGB LED chip 3 is directly in contact with the metal packaging cup body 21 of the metal material, and the RGB LED chip 3 is surrounded by the metal part and the packaging colloid 6, so that the RGB LED chip 3 is basically seamless around, and then the lamp bead structure of the present technical solution has high airtightness, which can effectively resist the erosion of harmful factors such as moisture and dust in the external environment, and ensure the long-term stable operation of the internal electronic components, which is particularly suitable for use in harsh or special environmental conditions.

[0053] Further explanation, the metal bracket 2 is provided with three, each of which is provided with the metal packaging cup body 21 which is concave downward; the RGB LED chip 3 includes a red LED chip 31, a green LED chip 32 and a blue LED chip 33, the red LED chip 31, the green LED chip 32 and the blue LED chip 33 are respectively bonded to the solid crystal areas of the three metal packaging cup bodies 21, and the bottom end of the red LED chip 31, the bottom end of the green LED chip 32 and the bottom end of the blue LED chip 33 are respectively electrically connected to the solid crystal areas of the three metal packaging cup bodies 21;

[0054] A wire bonding station 4 is correspondingly arranged on one side of each metal packaging cup body 21 , and the electrodes of the red LED chip 31 , the green LED chip 32 and the blue LED chip 33 are electrically connected to the corresponding wire bonding areas of the wire bonding station 4 through different bonding wires 7 .

[0055] Specifically, the technical solution uses silver glue to fix the red LED chip 31, the green LED chip 32 and the blue LED chip 33 respectively in the solid crystal areas of the three metal packaging cup bodies 21, and then connects the chips and the welding wire areas through bonding wires to form an electrical connection, thereby merging the RGB lamp beads into one lamp bead, which is beneficial to the indicator light display effect and layout, and improves the display cleanliness.

[0056] It is worth noting that the bottoms of the three metal packaging cups 21 of the present technical solution are all used as pins, namely the red light cathode pin, the green light cathode pin and the blue light cathode pin, which facilitates direct heat dissipation of the lamp beads and increases the service life of the lamp beads.

[0057] Preferably, the bonding wire may be gold wire, silver wire, copper wire or aluminum wire.

[0058] Further explanation, the indicator light type TOP RGB LED lamp bead structure includes two common-pole pins 5, and the two common-pole pins 5 are respectively arranged on both sides of the insulating seat 1;

[0059] Two sides of each of the wire bonding stations 4 are respectively connected to the two common electrode pins 5 , that is, each of the wire bonding stations 4 is connected to two common electrode pins 5 .

[0060] It is worth noting that the TOP RGB LED lamp bead structure based on the indicator light type of this technical solution is a dual common-pole design, including two common-pole pins 5, and the common-pole pins 5 are common anodes. Thanks to this structural design, in the subsequent work of the TOP RGB LED lamp bead structure, if one of the common-pole circuits has a circuit breaker or other faults, it can be quickly switched to another common-pole circuit, and the backup common-pole circuit can be started in time to ensure the continuous normal operation of the TOP RGB LED lamp bead structure. In addition, since the lamp bead structure of this technical solution is provided with two common-pole pins 5, and the common-pole pins 5 are made of metal, the heat dissipation performance of the lamp bead structure can be further improved.

[0061] To further illustrate, the lamp bead structure based on the technical solution is provided with two common-pole pins 5, and at the same time, the lamp bead structure also includes a red light cathode pin, a green light cathode pin and a blue light cathode pin, that is, the lamp bead structure of the technical solution is designed with five pins. In one embodiment of the technical solution, the five pins of the technical solution are arranged symmetrically (such as Figure 4The symmetrical structure facilitates the consistent stability of the lamp bead patch, and it is a dual common-pole design. If one common-pole circuit is broken later, the backup common-pole circuit can be started in time.

[0062] Preferably, the common-pole pin 5 is bent according to the outside of the insulating seat 1, so that the common-pole pin 5 fits on the insulating seat 1, making the overall structure of the lamp bead structure of the technical solution more compact and more conducive to integration. In one embodiment of the present invention, the common-pole pin 5 is in an "L" shape, so that the common-pole pin 5 can fit on the outside of the insulating seat 1.

[0063] For further explanation, the top of the packaging colloid 6 protrudes from the top surface of the insulating seat 1 , and the top of the packaging colloid 6 is spherical.

[0064] The top of the encapsulation colloid 6 of the present technical solution is spherical, forming a spherical encapsulation body. This encapsulation method not only protects the chip from the influence of the external environment, but also scatters the light more evenly through its spherical surface, further improving the brightness of the TOP RGB LED lamp bead structure.

[0065] For further explanation, the surfaces of the wire bonding station 4 , the common electrode pin 5 and the metal bracket 2 are respectively provided with a nickel layer and a silver layer from the inside to the outside.

[0066] The technical solution sequentially arranges a nickel layer and a silver layer on the surface of the wire bonding station 4, the common electrode pin 5 and the metal bracket 2 (including the metal packaging cup 21), so that the surface of these metal structures is silvery white. The silver layer has excellent conductivity and reflectivity, which can further improve the brightness of the TOP RGB LED lamp bead structure, and facilitate the lamp bead packaging wire bonding, which helps to form a good electrical connection during wire bonding. The nickel layer can enhance the corrosion resistance and improve the adhesion of the silver layer.

[0067] To further illustrate, the wire bonding area of ​​the wire bonding stage 4 is surrounded by the packaging colloid 6 .

[0068] It is worth noting that the encapsulated colloid 6 of the present technical solution can tightly surround the wire bonding area of ​​the wire bonding station 4 to prevent the wire bonding from being corroded by the external environment, such as moisture, dust and chemical substances, thereby improving the stability and reliability of the wire bonding. Figure 3 FIG. 4 is a diagram showing the structure of a wire bonding station 4 in one embodiment of the present invention. Figure 5 This is the structural arrangement of the wire bonding station 4 in another embodiment of the present invention. Figure 3 and Figure 5 The wire bonding areas of the wire bonding platform 4 are tightly surrounded by the encapsulation colloid 6 .

[0069] Specifically, the wire bonding area of ​​the wire bonding stage 4 in the present technical solution is the top surface of the wire bonding stage 4 .

[0070] Further explanation, the metal packaging cup body 21 described in the present technical solution is in the shape of an inverted truncated cone. Since the negative electrode pin 211 is the bottom of the metal packaging cup body 21, the negative electrode pin 211 is also in the shape of an inverted truncated cone, which can not only further enhance the heat dissipation effect of the lamp bead structure, but also improve the stability of the electrical connection.

[0071] Further explanation, the length of the indicator light type TOP RGB LED lamp bead structure is 2.0-4.0 mm, the width is 2.0-4.0 mm, and the height is 1.0-1.6 mm.

[0072] It is worth mentioning that the diameter of a single traditional plug-in LED lamp bead is 2mm to 5mm, and three plug-in LED lamp beads are needed to achieve the three luminous colors of red, green and blue, which makes it difficult to integrate and layout when used in indicator lights. To meet the required brightness of the indicator light, more plug-in LED lamp beads are needed, which will result in a larger overall structure of the indicator light. This solution combines the RGB (red, green and blue) lamp beads into one lamp bead, which is more conducive to integration and layout, making the overall structure of the indicator light smaller when achieving the same brightness.

[0073] As a further explanation, the RGB LED chip is a vertical single-electrode RGB chip.

[0074] Preferably, the RGB LED chip of the present technical solution uses a vertical single-electrode RGB chip. The vertical single-electrode RGB chip has the advantages of less light interference, less brightness loss and high definition, and is suitable for use in indicator lamp bead structures.

[0075] As a further explanation, the insulating seat 1 is made of PPA.

[0076] Specifically, PPA, known as polyphthalamide, is a high-performance engineering plastic with high thermal stability and can maintain its performance in high temperature environments. It also has good chemical stability and is resistant to a variety of chemical substances, such as acids, alkalis, solvents, etc., and exhibits excellent corrosion resistance. PPA materials also have high strength, stiffness and wear resistance, as well as good fatigue resistance, and can maintain stable mechanical properties for a long time. At high temperatures, PPA can still maintain excellent mechanical strengths such as bending, tensile and impact resistance, and can resist long-term tensile creep. PPA also has excellent insulation and dielectric properties, and can maintain good insulation properties in harsh environments such as high temperature and high humidity.

[0077] As a further explanation, the metal support 2 , the wire bonding platform 4 and the common electrode pin 5 are made of copper.

[0078] It is worth noting that the metal bracket 2 (including the metal packaging cup body 21), the wire bonding platform 4 and the common electrode pin 5 of the present technical solution are made of copper. The copper material has good conductivity, which ensures the stable luminescence of the lamp bead structure. In addition, the copper material has good flexibility, so that the metal bracket 2 can be stamped and stretched to form the metal packaging cup body 2.

[0079] Preferably, the packaging colloid 6 is made of a highly transparent and high-viscosity packaging glue, which can ensure the packaging effect and is conducive to improving the luminous efficiency and light color uniformity of the lamp bead structure. For example, epoxy resin, silica gel, glass glue and other materials can be selected.

[0080] like Figure 6 As shown, the technical solution is based on the preparation method of the indicator light type TOP RGB LED lamp bead structure, including the following steps:

[0081] (1) The metal substrate is punched and stretched, and unnecessary parts are punched out to obtain a mother metal bracket including a wire bonding platform and a metal packaging cup body, and protrusions are respectively provided on both sides of the mother metal bracket, and a gap is provided between the wire bonding platform and the metal packaging cup body; then, electroplating is performed to form a nickel layer and a silver layer on the surface of the metal substrate in sequence, such as Figure 6 As shown in a and b;

[0082] (2) Injection molding is performed on the top and bottom surfaces of the parent metal bracket to form an insulating seat, and the bottom of the metal packaging cup body protrudes from the bottom surface of the insulating seat, so that the bottom of the metal packaging cup body serves as a negative electrode pin, such as Figure 6 As shown in c;

[0083] (3) Punch out the connecting part between the parent metal bracket and the protrusion so that the parent metal bracket is divided into three metal brackets (such as Figure 7 As shown), each metal bracket is provided with a metal packaging cup body. At this time, each metal packaging cup body is relatively independent, and each metal packaging cup body and its corresponding welding wire stage are separated, and the protrusion is connected to the three welding wire stages; the two protrusions are bent to form common electrode pins on both sides of the insulating seat, such as Figure 6 As shown in d1, d2 and d3, d1 is a front view after bending, d2 is a cross-sectional view after bending, and d3 is a back view after bending;

[0084] (4) fixing the RGB LED chip to the inner bottom surface of the metal packaging cup, and connecting the electrodes of the RGB LED chip and the wire bonding area of ​​the wire bonding station through bonding wires;

[0085] (5) Encapsulation glue is used for encapsulation, so that the interior of the metal encapsulation cup is filled with encapsulation glue, and after curing, an encapsulation colloid is formed to obtain a TOP RGB LED lamp bead structure based on an indicator light type.

[0086] Specifically, in the lead frame process, the technical solution is to stamp on a metal substrate (such as a copper strip), and the metal substrate is stamped and stretched according to the unit to form a metal packaging cup body with an inward concave truncated cone shape, and the unnecessary part is stamped out at the same time, and then the nickel-silver plating process is performed to make the metal substrate change from yellow to silver-white, which is convenient for the subsequent lamp bead packaging and welding wires while improving the brightness of the lamp bead, and finally the lead frame required by the lamp bead is formed by injection molding and bending. In the lamp bead packaging link, the RGB LED chip of this solution preferably uses a vertical single-electrode RGB chip, which is fixed to the inner bottom surface of the metal packaging cup body (i.e., the solid crystal area) with silver glue, and then the RGB LED chip and the welding wire area of ​​the welding wire station are connected by bonding wires to form an electrical connection; finally, glue is dispensed, and a high-transparency, high-viscosity package is used for packaging. Preferably, the packaging surface is spherical to improve the brightness of the lamp bead. In the lamp bead structure of the technical solution, the bottom of the metal packaging cup body protrudes from the bottom surface of the insulating seat, so that the bottom of the metal packaging cup body is used as a negative electrode pin, which is convenient for the direct heat dissipation of the lamp bead structure and improves the service life of the lamp bead structure. At the same time, the lamp bead structure of the present technical solution is designed with five pins, preferably a symmetrical structure, which is convenient for the consistent stability of the lamp bead patch, and is a dual common pole design. If one common pole circuit is broken later, the backup common pole circuit can be started in time.

[0087] It is worth mentioning that this technical solution merges the RGB lamp beads into one lamp bead, which is beneficial to the indicator light display effect and layout, and improves the display clarity. At the same time, the indicator light type TOP RGB LED lamp bead structure prepared by this technical solution is a lamp bead with the characteristics of high heat dissipation, high brightness and high air tightness, so that it can be used not only in indicator lights, but also in display screens and other fields, with a wider range of application scenarios.

[0088] Specifically, the stamping process, stretching process, electroplating process, injection molding process, bending process, crystal bonding process and packaging process in the preparation method of the present technical solution are all existing technologies, so the above processes will not be further elaborated.

[0089] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A TOP RGB LED lamp bead structure based on indicator light, characterized in that: It comprises an insulating seat (1), a metal bracket (2), an RGB LED chip (3), a wire bonding platform (4), a common electrode pin (5) and a packaging colloid (6), wherein the metal bracket (2) and the wire bonding platform (4) are respectively embedded in the interior of the insulating seat (1); The metal support (2) comprises a metal packaging cup body (21) that is concave downwards, the inner bottom surface of the metal packaging cup body (21) is a crystal fixing area, and the bottom of the metal packaging cup body (21) protrudes from the bottom surface of the insulating seat (1) to form a negative electrode pin (211); The RGB LED chip (3) is mounted on the crystal-bonding area of ​​the metal packaging cup body (21), and the bottom end of the RGB LED chip (3) is electrically connected to the crystal-bonding area of ​​the metal packaging cup body (21); The wire bonding platform (4) is correspondingly arranged on one side of the metal packaging cup body (21), and the RGB LED chip (3) is electrically connected to the wire bonding area of ​​the wire bonding platform (4) via a bonding wire (7); The common-pole pin (5) is arranged outside the insulating seat (1), and the wire bonding station (4) and the common-pole pin (5) are electrically connected; The encapsulating colloid (6) is filled inside the metal encapsulating cup (21), and the top of the encapsulating colloid (6) protrudes from the top surface of the insulating seat (1), or the top surface of the encapsulating colloid (6) is flush with the top surface of the insulating seat (1).

2. According to the indicator light type TOP RGB LED lamp bead structure according to claim 1, it is characterized in that: The metal brackets (2) are provided in three numbers, and each of the metal brackets (2) is provided with a metal packaging cup body (21) that is recessed downwards; The RGB LED chip (3) comprises a red LED chip (31), a green LED chip (32) and a blue LED chip (33); the red LED chip (31), the green LED chip (32) and the blue LED chip (33) are respectively bonded to the solid crystal areas of the three metal packaging cup bodies (21); and the bottom end of the red LED chip (31), the bottom end of the green LED chip (32) and the bottom end of the blue LED chip (33) are respectively electrically connected to the solid crystal areas of the three metal packaging cup bodies (21); The wire bonding platform (4) is correspondingly arranged on one side of each of the metal packaging cup bodies (21); the red LED chip (31), the green LED chip (32) and the blue LED chip (33) are electrically connected to the corresponding wire bonding areas of the wire bonding platform (4) via different bonding wires (7).

3. The TOP RGB LED lamp bead structure based on indicator light type according to claim 2 is characterized in that: The indicator light type TOP RGB LED lamp bead structure comprises two common-pole pins (5), and the two common-pole pins (5) are respectively arranged on two sides of the insulating seat (1); Both sides of each of the wire bonding platforms (4) are respectively connected to the two common-pole pins (5).

4. The TOP RGB LED lamp bead structure based on indicator light type according to claim 1 is characterized in that: The top of the packaging colloid (6) protrudes from the top surface of the insulating seat (1), and the top of the packaging colloid (6) is spherical.

5. The TOP RGB LED lamp bead structure based on indicator light type according to claim 1 is characterized in that: The surfaces of the wire bonding platform (4), the common electrode pin (5) and the metal bracket (2) are respectively provided with a nickel layer and a silver layer from the inside to the outside.

6. The TOP RGB LED lamp bead structure based on indicator light type according to claim 1 is characterized in that: The wire bonding area of ​​the wire bonding platform (4) is surrounded by a packaging colloid (6).

7. The TOP RGB LED lamp bead structure based on indicator light type according to claim 1 is characterized in that: The metal packaging cup body (21) is in the shape of an inverted truncated cone.

8. The TOP RGB LED lamp bead structure based on indicator light type according to claim 1 is characterized in that: The length of the indicator light type TOP RGB LED lamp bead structure is 2.0-4.0 mm, the width is 2.0-4.0 mm, and the height is 1.0-1.6 mm.

9. The TOP RGB LED lamp bead structure based on indicator light type according to claim 1 is characterized in that: The RGBLED chip is a vertical single-electrode RGB chip; The material of the insulating seat (1) is PPA; The metal support (2), the wire bonding platform (4) and the common-pole pin (5) are made of copper.

10. A method for preparing a TOP RGB LED lamp bead structure based on an indicator light, characterized in that: The method for preparing the indicator light type TOP RGB LED lamp bead structure according to any one of claims 1 to 9 comprises the following steps: (1) stamping and stretching the metal substrate, and stamping out unnecessary parts to obtain a mother metal bracket including a wire bonding platform and a metal packaging cup body, wherein protrusions are respectively provided on both sides of the mother metal bracket, and a gap is provided between the wire bonding platform and the metal packaging cup body; then electroplating is performed to form a nickel layer and a silver layer on the surface of the metal substrate in sequence; (2) performing injection molding on the top and bottom surfaces of the parent metal bracket to form an insulating seat, and the bottom of the metal packaging cup body protrudes from the bottom surface of the insulating seat, so that the bottom of the metal packaging cup body serves as a negative electrode pin; (3) Punching out the connecting portion between the parent metal bracket and the protrusion, so that the parent metal bracket is divided into three metal brackets, and each metal bracket is provided with a corresponding metal packaging cup body, and the two protrusions are bent to form common-pole pins on both sides of the insulating seat; (4) fixing the RGB LED chip to the inner bottom surface of the metal packaging cup body, and connecting the RGB LED chip and the wire bonding area of ​​the wire bonding station through bonding wires; (5) Encapsulation glue is used for encapsulation, so that the interior of the metal encapsulation cup is filled with encapsulation glue, and after curing, an encapsulation colloid is formed to obtain a TOP RGB LED lamp bead structure based on an indicator light type.

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