Integrated image intensifier power supply encapsulation device and method

Through the integrated integrated image enhancer power potting device, vacuum potting and positioning quantitative dispensing methods are adopted to solve the problems of bubble residue and low degree of automation in the existing technology, and an efficient and automated potting process is realized. Improves insulation stability and yield.

CN119426098APending Publication Date: 2025-02-14NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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Patent Information

Application Number
CN202411867247.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-18
Publication Date
2025-02-14

AI Technical Summary

Technical Problem

The existing image enhancer power potting process has bubble residue, low degree of automation, low efficiency, poor adaptability and difficulty in meeting the potting requirements of different rubber types, resulting in poor insulation stability, high production costs and difficulty in maintaining large batch production. Higher yield rate.

Method used

Adopt an integrated integrated image enhancer power potting device, including a potting box, a four-axis dispensing gun, a glue height sensor and a programming controller. Through vacuum potting and positioning, the bubble removal and difference can be achieved. Adaptation of rubber seeds.

Benefits of technology

It effectively ensures that the potted image enhancer power supply has no bubbles, holes and other defects, improves insulation and environmental reliability, realizes automation and efficient production of the potting process, reduces costs and improves yield.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses an integrated image intensifier power supply filling and sealing device and method. The device comprises a sealed filling and sealing box body capable of heating, feeding glue and vacuumizing, a four-axis glue dispensing gun attached with a glue height sensor is arranged in the sealed filling and sealing box body, and a programming controller used for overall control is arranged outside the sealed filling and sealing box body. Glue height data are collected through the glue height sensor and fed back to the programming controller, and the programming controller is used for controlling the glue inlet pipeline, the air inlet and outlet pipeline and the four-axis glue dispensing gun to cooperatively work to achieve image intensifier power supply potting. According to different types of glue and power supply semi-finished products under complex working conditions, the filling and sealing vacuum pumping process is segmented, and the power supply semi-finished products are subjected to positioning and quantitative glue dispensing. Through the device and the method, the problem of residual bubbles in the existing power supply insulation encapsulation technology can be solved, and an automatic encapsulation process is basically realized, so that the cost is reduced, and the production efficiency is improved. And finally, high-efficiency preparation and excellent finished product yield of the image intensifier power supply are realized.
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Description

Technical Field

[0001] The invention belongs to the technical field of image intensifier insulation potting, and in particular relates to an integrated image intensifier power potting device and method. Background Art

[0002] The image intensifier is the most important imaging device in low-light-level night vision goggles, and consists of three parts: a tube core, a high-voltage power supply, and a shell. The input voltage of the image intensifier power supply is boosted by the high-voltage power supply to provide high voltage to the tube core. Among them, the packaging process plays a decisive role in the imaging quality of the entire night vision system. Effective insulation and potting of the image intensifier power supply can improve its environmental reliability and ensure stable operation.

[0003] However, during the packaging process of the image intensifier, the traditional packaging method will cause some air to remain in the image intensifier, which may further lead to insufficient insulation capacity or even a short circuit of the image intensifier.

[0004] Patent CN11182278A proposes an image intensifier power supply potting device and potting method, and designs an image intensifier power supply potting device including a base assembly, a gasket, an outer cylinder, a pressure plate and a nut. It can be applied to power supplies of three sizes and has a certain degree of versatility. At the same time, it provides a simple potting method, which can be used to achieve effective operation of the potting process. However, this process is relatively complicated and has a long waiting time, low labor efficiency, and is not suitable for mass production.

[0005] At present, there is no integrated potting device dedicated to image intensifier power supply. The following problems still exist in the implementation of potting process:

[0006] (1) The existing encapsulation process mainly consists of an empirical dispensing process, which does not consider the generation of internal bubbles from the principle of vacuum encapsulation, so the packaging quality is not high.

[0007] (2) With the continuous optimization of the image intensifier power supply design, more requirements are put forward for the performance indicators of the potting glue materials. In addition to the basic insulation performance, the potting of the voltage doubler circuit board inside the power supply requires a glue with better adhesion and less internal stress. Epoxy glue can be used for potting; and the overall packaging of the power supply requires potting silicone rubber to provide elasticity and shock absorption effect. Therefore, the potting system should preferably be compatible with different types of glue. The current rigid curing process design and operation are difficult to meet the product design requirements.

[0008] (3) At present, most of the methods for potting the power supply of image intensifiers have a low degree of automation. Manual operation and manual handling are required for the steps of mixing glue, positioning the fixture, potting, and curing. It is difficult to achieve integrated insulation potting.

[0009] In summary, the existing power supply potting process relies on the operator's process experience, has a low degree of automation, low efficiency, poor adaptability, cumbersome transportation, and is difficult to achieve the potting requirements of different potting glue types. This leads to poor insulation stability of the image intensifier power supply, high production costs, and difficulty in maintaining large-batch production and a high yield rate. Summary of the invention

[0010] The purpose of the present invention is to propose an integrated image intensifier power supply potting device and method through a mechanism analysis of the causes of internal bubbles in vacuum potting, so as to solve the problem of residual bubbles in the existing power supply insulation potting technology. It can not only simplify the power supply potting process and basically realize the automated potting process, thereby reducing costs and improving production efficiency, but also realize the switching of different types of glue, adapt to the potting needs of complex circuit boards, meet the design requirements in various application scenarios, and finally achieve efficient preparation of image intensifier power supplies and excellent finished product yield.

[0011] In order to solve the above technical problems, the technical solution adopted by the present invention is: an integrated image intensifier power supply potting device, including a potting box, a four-axis glue dispensing gun, a glue height sensor and a programming controller;

[0012] The potting box is equipped with a heater to realize temperature control function, and has two pipes, namely a glue inlet pipe and an air inlet and outlet pipes; the glue inlet pipe is connected to the four-axis dispensing gun through a hose inside the potting box, and is connected to the pre-used glue cylinder outside, and the air inlet and outlet pipes are connected to the vacuum pump and nitrogen bottle outside; the glue height sensor is located at the top of the inner cavity of the box, and is used to detect the glue liquid level of the semi-finished power supply and the potting container during the potting process.

[0013] A potting method based on the above-mentioned integrated image intensifier power supply potting device comprises the following steps:

[0014] The first step is to install the sample to be potted at the bottom of the potting box;

[0015] In the second step, the four-axis dispensing gun is moved to dispense glue to the potting sample. When the glue height sensor detects that the inner and outer glue interfaces of the semi-finished power supply are higher than its bottom surface, the programming controller controls the glue feeding pipeline to close and stops the first glue injection;

[0016] The third step is to control the opening of the air inlet and outlet pipes and start vacuuming to make the glue inside and outside the semi-finished power supply flow through and remove bubbles;

[0017] Step 4: The programming controller controls the inlet and outlet pipes to slowly fill with nitrogen to restore the normal pressure, completing the first vacuum degassing;

[0018] The fifth step is to control the opening of the glue feeding pipeline, and use the upward air exhaust method to first dispense glue at the complex components to prevent bubbles from forming in the gaps, so that the glue can finally fill the potting container;

[0019] Step 6: When the height of the glue interface inside and outside the semi-finished power supply product is below the top of the semi-finished power supply product, the glue height sensor transmits the height data back to the programming controller, and the programming controller controls the glue inlet pipe to close, completing the potting operation;

[0020] Step 7: Open the air inlet and outlet pipes and start vacuuming for 10 minutes. At this time, the height of the glue interface is basically flush with the top of the semi-finished power supply, and vacuum degassing is completed;

[0021] Step 8: When the bubbles stop escaping, the programmed controller controls the air inlet and outlet pipes to adjust the air pressure in the box according to the different molecular weights of the glue, and performs the pressure-maintaining operation;

[0022] In the ninth step, the programming controller controls the heater to heat up and perform high temperature drying and curing;

[0023] The tenth step is to take out the sample to be potted, remove the solidified glue around and on the bottom of the semi-finished power supply without a cover, and cover the semi-finished power supply with a cover that is spin-coated with glue; then put it into a box for drying to obtain the final image intensifier power supply, and complete the post-processing process.

[0024] Compared with the prior art, the integrated image intensifier power supply potting device and method have the following advantages:

[0025] Beneficial effects:

[0026] 1) Segmented vacuuming and positioning quantitative dispensing solve the shortcomings of existing potting devices and methods, effectively ensure that there are no defects such as bubbles and voids in the image intensifier power supply after potting, meet the insulation requirements and environmental reliability requirements, and effectively improve the yield rate of potted power supply;

[0027] 2) The programming controller can accurately control the execution steps and automatically repeat the programmed program later, basically realizing the integration and automation of image intensifier power supply potting, without the need for cumbersome transportation process, greatly saving working hours and labor costs;

[0028] 3) The potting device provided can use semi-finished power supplies of different sizes and different types of glue to improve the adaptability of the device and save production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the integrated image intensifier power supply potting device of the present invention.

[0030] Figure 2It is a schematic diagram of positioning a semi-finished power supply without a cover plate in a fixing fixture in the present invention.

[0031] Figure 3 It is a schematic diagram of the interior of the cavity during vacuum encapsulation according to an embodiment of the present invention.

[0032] In the figure: 1-sample to be potted; 2-potting box; 3-four-axis dispensing gun; 4-glue height sensor; 5-programming controller; 11-fixing fixture; 12-semi-finished power supply without cover; 13-potting container; 121-power supply shell; 122-circuit board. DETAILED DESCRIPTION

[0033] An integrated image intensifier power supply potting device applicable to different types of glue and different potting scenarios comprises a sample to be potted 1, a potting box 2, a four-axis dispensing gun 3, a glue height sensor 4, and a programming controller 5.

[0034] The potting box 2 is provided with a heater 23 to realize the temperature control function. It is provided with two pipes, namely a glue inlet pipe 21 and an air inlet and outlet pipe 22. The glue inlet pipe 21 is connected to the four-axis glue gun 3 through a rubber hose inside the potting box 2, and is connected to a pre-used glue cylinder outside. The air inlet and outlet pipe 22 is connected to a vacuum pump and a nitrogen bottle outside.

[0035] The sample to be potted 1 comprises a potting container 13, a fixing fixture 11 for fixing a semi-finished power supply without a cover plate, and a semi-finished power supply without a cover plate 12;

[0036] The programming controller 5 can control the glue height sensor 4, the valve of the glue inlet pipe 21, the valve of the air inlet and outlet pipes 22, and the heater 23, and control the mobile glue dispensing operation of the four-axis glue dispensing gun 3 at the same time.

[0037] The glue height sensor 4 is located at the top of the inner cavity of the box body, and can detect the glue liquid level of the filling container 13 and the semi-finished power supply 12 during the filling process. The glue height sensor 4 can be implemented by a sensing device such as a photoelectric sensor, and can exchange data with the programming controller 5. The glue height sensor 4 is assembled with the four-axis glue gun 3, and can be freely moved in three dimensions by issuing instructions from the programming controller 5. The programming controller 5 can control the opening and closing of the valve of the glue inlet pipeline 21 and the valve of the inlet and outlet pipelines 22.

[0038] The present invention also provides an integrated image intensifier power supply potting method, comprising the following steps:

[0039] The first step is to install the sample to be potted at the bottom of the potting box, and prepare the nitrogen bottle, glue cylinder filled with glue to be potted, vacuum pump and other peripheral equipment;

[0040] In the second step, the four-axis dispensing gun is moved to dispense glue to the potting sample. When the glue height sensor detects that the inner and outer glue interfaces of the semi-finished power supply are slightly higher than its bottom surface, the programming controller controls the glue feeding pipeline to close and stops the first glue injection;

[0041] The third step is to control the opening of the air inlet and outlet pipes and start vacuuming to make the glue inside and outside the semi-finished power supply flow through and remove bubbles. The vacuuming time is determined by the amount of glue, glue viscosity, glue viscosity change curve, etc., and is generally not less than 10 minutes;

[0042] Step 4: The programming controller controls the inlet and outlet pipes to slowly fill with nitrogen to restore the normal pressure, completing the first vacuum degassing;

[0043] The fifth step is to control the opening of the glue feeding pipeline, and use the upward air exhaust method to first dispense glue at the complex components to prevent bubbles from forming in the gaps, so that the glue fills the container.

[0044] Step 6: When the height of the glue interface inside and outside the semi-finished power supply product is slightly below the top of the semi-finished power supply product, the glue height sensor transmits the height data back to the programming controller, and the programming controller controls the glue inlet pipe to close, completing the potting operation;

[0045] Step 7: Open the air inlet and outlet pipes and start vacuuming for 10 minutes. At this time, the height of the glue interface is basically flush with the top of the semi-finished power supply, and vacuum degassing is completed;

[0046] Step 8: When the bubbles stop escaping, the programmed controller controls the air inlet and outlet pipes to adjust the air pressure in the box according to the different molecular weights of the glue, and performs the pressure-maintaining operation;

[0047] In the ninth step, the programming controller controls the heater to heat up and perform high temperature drying and curing;

[0048] Step 10: Take out the sample to be potted, remove the cured glue around and on the bottom of the semi-finished power supply without the cover plate, and cover the semi-finished power supply with a cover plate with a small amount of glue. Then put it into the box for drying to obtain the final image intensifier power supply. After the post-processing process is completed.

[0049] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0050] Example 1

[0051] In this embodiment, the potting glue is a two-component addition type silicone rubber, and the specific potting method includes:

[0052] The first step is to put the circuit board 122 into the housing 121, adjust the position appropriately, and lead the lead wires on the circuit board 122 out from the bottom lead hole to form a semi-finished power supply 12 without a cover plate, and then install the semi-finished power supply on the fixing fixture 11 and put it into the potting container 13 to form a sample to be potted 1, and fix the sample to be potted 1 at the bottom of the potting box 2;

[0053] The second step is to move the four-axis glue gun 3, with the glue head positioned above the sample 1 to be potted. The glue gun is controlled to start dispensing glue inside 1, and when the glue height sensor 4 detects that the inner and outer glue interfaces of the semi-finished power supply product are slightly higher than the bottom surface, i.e., H+2mm, the programming controller 5 controls the glue feeding pipeline 21 to be closed;

[0054] The third step is to control the air inlet and outlet pipes 22 to open and start vacuuming. The vacuum pressure indicator reaches -0.9 and remains for 10 minutes;

[0055] In the fourth step, the program controller 5 controls the inlet and outlet gas pipes 22 to slowly fill with nitrogen to restore normal pressure, and at the same time controls the glue inlet pipe 21 to open;

[0056] Step 5: Move the glue gun 3 to preferentially dispense glue at the complex components by exhausting air upwards, preventing bubbles from forming in the gaps, and finally filling the container with glue;

[0057] Step 6: When the glue interface height of the semi-finished power supply is slightly above the top of the semi-finished power supply, that is, H

[0058] +L+2mm, the glue height sensor 4 transmits the height data back to the programming controller 5, and the programming controller 5 controls the glue feeding pipeline 21 to be closed; wherein H is the height of the bottom surface of the power supply semi-finished product 12 from the bottom of the potting container 13, and L is the height of the power supply semi-finished product 12 itself;

[0059] Step 7: Control the air inlet and outlet pipes 22 to open and start vacuuming for 10 minutes. The pressure reading must reach below -0.9. At this time, the height of the glue interface is basically flush with the top of the semi-finished power supply, that is, H+L;

[0060] Preferably, the two-component addition silicone rubber potting adhesive is Dow Corning Sylgard-170.

[0061] Preferably, according to the viscosity curve of sylgard-170 after mixing, the glue viscosity needs to be controlled below 10000 mPas during the operation process, that is, the glue pouring and vacuuming must be completed within 30 minutes.

[0062] Step 8: When the bubbles stop escaping, the programming controller 5 controls the air inlet and outlet pipes 22 to maintain the vacuum pressure indication number below -0.9 for pressure maintenance;

[0063] In the ninth step, the programming controller 5 controls the heater 23 to perform high temperature drying and curing.

[0064] Preferably, the drying temperature is set at 60°C and the time is not less than 12 hours;

[0065] Step 10: Take out the sample 1 to be potted, remove the solidified glue around the semi-finished power supply 12 without the cover plate, and cover the semi-finished power supply with a cover plate with a small amount of glue applied by spin coating. Then put it into the box 2 for drying, and the final image intensifier power supply is obtained.

[0066] Example 2

[0067] The potting glue of this embodiment uses a two-component addition epoxy glue, and the specific potting method includes:

[0068] The pressure display number during vacuuming in the third and seventh steps of Example 1 is set to -0.5, and the eighth step is changed to maintaining the pressure at 1 atmosphere, which becomes Example 2 of the present invention.

[0069] Preferably, the two-component addition epoxy potting adhesive is EPOXY 301-2.

[0070] Preferably, the drying temperature is set to 80° C. and the time is not less than 3 hours.

[0071] The above is only a preferred embodiment of the present invention. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, which should also be regarded as the protection scope of the present invention.

Claims

1. An integrated image intensifier power supply potting device, characterized in that: It comprises a potting box (2), a four-axis glue dispensing gun (3), a glue height sensor (4) and a programming controller (5); The potting box (2) is provided with a heater (23) for realizing a temperature control function, and has two pipes, namely a glue inlet pipe (21) and an air inlet and outlet pipe (22); the glue inlet pipe (21) is connected to a four-axis glue gun (3) through a rubber hose inside the potting box (2), and is connected to a pre-used glue cylinder outside, and the air inlet and outlet pipe (22) is connected to a vacuum pump and a nitrogen bottle outside; the glue height sensor (4) is located at the top of the inner cavity of the box, and is used to detect the glue liquid level of the semi-finished power supply product (12) and the potting container (13) during the potting process.

2. The integrated image intensifier power supply potting device according to claim 1, characterized in that: The sample to be potted (1) comprises a fixing fixture (11) for fixing a semi-finished power supply without a cover plate, a semi-finished power supply without a cover plate (12), and a potting container (13).

3. The integrated image intensifier power supply potting device according to claim 2, characterized in that: The sample to be potted (1) is installed at the bottom of the potting box (2).

4. The integrated image intensifier power supply potting device according to claim 1, characterized in that: The glue height sensor (4) and the programming controller (5) realize data exchange. The glue height sensor (4) and the four-axis glue dispensing gun (3) are assembled together. The programming controller (5) issues instructions to realize three-dimensional free movement. The programming controller (5) controls the opening and closing of the valve of the glue inlet pipeline (21) and the valve of the air inlet and outlet pipelines (22).

5. The integrated image intensifier power supply potting device according to claim 4, characterized in that: The glue height sensor (4) is implemented by a photoelectric sensor.

6. A potting method for the integrated image intensifier power potting device according to any one of claims 1 to 5, characterized in that: The steps include: The first step is to install the sample to be potted (1) at the bottom of the potting box; In the second step, the four-axis glue dispensing gun (3) is moved to dispense glue on the sample to be potted (1). When the glue height sensor (4) detects that the inner and outer glue interfaces of the semi-finished power supply product (12) are higher than its bottom surface, the programming controller (5) controls the glue feeding pipeline (21) to close, and the first glue injection is stopped; The third step is to control the opening of the air inlet and outlet pipes (22) and start vacuuming so that the glue inside and outside the semi-finished power supply product (12) can penetrate and remove bubbles; In the fourth step, the programming controller (5) controls the inlet and outlet gas pipes (22) to slowly fill with nitrogen to restore the normal pressure, thus completing the first vacuum degassing. Step 5: Control the glue inlet pipe (21) to open, move the four-axis glue gun (3) to use the upward air exhaust method to preferentially glue the complex components to prevent bubbles from being generated in the gap, and finally make the glue fill the potting container (13); Step 6: When the glue interface height inside and outside the semi-finished power supply product (12) is below the top of the semi-finished power supply product (12), the glue height sensor (4) transmits the height data back to the programming controller (5), and the programming controller (5) controls the glue inlet pipe (21) to close, thus completing the potting operation; Step 7: Control the air inlet and outlet pipes (22) to open and start vacuuming for 10 minutes. At this time, the height of the glue interface is basically flush with the top of the semi-finished power supply product (12), and vacuum degassing is completed; Step 8: When the bubbles stop escaping, the programming controller (5) controls the air inlet and outlet pipes (22) to adjust the air pressure in the box according to the different molecular weights of the glue, and performs a pressure-maintaining operation; In the ninth step, the programming controller (5) controls the heater (23) to increase the temperature to perform high temperature drying and curing; The tenth step is to take out the sample to be potted (1), remove the cured glue around and on the bottom of the semi-finished power supply (12) without a cover plate, and cover the semi-finished power supply (12) with a cover plate coated with glue; then put it into a box for drying to obtain the final image intensifier power supply, and complete the post-processing process.

7. The method according to claim 6, characterized in that The first step is to assemble the sample to be potted (1) into a fixing fixture (11) for fixing the semi-finished power supply without a cover, the semi-finished power supply without a cover (12), and the potting container (13) before the sample to be potted (1) is installed at the bottom of the potting box; and connect the peripheral equipment containing the glue to be potted to the potting box (2).

8. The method according to claim 6, characterized in that In the third step, the pumping time is no less than 10 minutes.

9. The method according to claim 6, characterized in that In the ninth step, the drying temperature is set to 60°C and the time is not less than 12 hours.

10. The method according to claim 6, characterized in that The programming controller (5) generates a program by programming the second to ninth steps and executes it repeatedly, thereby realizing the automatic potting of the image intensifier power supply.