COS laser chip test fixture assembly and test system

Abstract

The invention relates to a COS laser chip test fixture assembly and a test system. The COS laser chip test fixture assembly comprises a bearing base, an insulating pressing plate, a conductive assembly and a heat conduction assembly. The laser chip is detachably connected between the insulating pressing plate and the bearing base. At least part of the insulating pressing plate, the conductive assembly and the bearing base are sequentially overlapped in the thickness direction of the bearing base. The laser chip is electrically connected with an external power supply assembly through the conductive assembly. The laser chip and the bearing base are arranged at an interval through the heat conduction assembly. The heat conducting assembly can be controlled to form a hot end and a cold end. The cold end is used for being matched with a heat sink assembly of the laser chip to conduct heat exchange so as to conduct pre-cooling treatment on the laser chip. The hot end is used for abutting against the bearing base in a matched mode to conduct heat exchange so that heat can be dissipated through the bearing base. According to the COS laser chip test fixture assembly, the heat dissipation effect of the chip in the test process can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of laser chip test fixtures, and in particular to a COS laser chip test fixture assembly and a test system. Background Art

[0002] In the field of display products, the function of laser display is often achieved through the setting of laser chips. As the industry's requirements for high-quality laser manufacturing become higher and higher, laser chips are driven to develop towards higher power density and lower energy consumption.

[0003] In order to ensure the performance of the laser chip, performance tests will be performed on the laser chip. The performance test of the laser chip is generally divided into optoelectronic performance test and aging test, so as to evaluate the optoelectronic performance, long-term stability and service life of the chip. These performance tests all require the laser chip body to be placed on the test fixture through the COS package base (heat sink component) and powered on. However, due to the increase in power in the semiconductor laser, the thermal effect generated after the power-on test is more obvious, resulting in excessive heating of the laser chip during the test, causing heat loss of the laser chip and affecting the performance of the laser chip.

[0004] In the related technology, many manufacturers have improved the laser chip. Specifically, the laser chip after the modification will be composed of two parts, one is the laser chip body, and the other is the COS package base. And by combining the COS package base with the heat dissipation base of the test fixture for heat dissipation, the heat dissipation of the laser chip during the test can be achieved.

[0005] However, in actual test scenarios, the method of simply relying on the COS package base and the heat sink base for heat dissipation has serious problems such as slow heat dissipation and insufficient heat dissipation of the laser chip body, which can still easily cause thermal damage to the laser chip body. Summary of the invention

[0006] Based on this, it is necessary to provide a COS laser chip test fixture assembly and a test system to improve the heat dissipation effect of the laser chip during the test process.

[0007] A COS laser chip test fixture assembly comprises a bearing base, an insulating pressing plate, a conductive component and a thermal conductive component.

[0008] An insulating pressing plate connected to the carrying base; a laser chip is detachably connected between the insulating pressing plate and the carrying base;

[0009] A conductive component, wherein at least a portion of the insulating pressing plate covers the conductive component, and at least a portion of the insulating pressing plate, the conductive component and the supporting base are sequentially overlapped along the thickness direction of the supporting base; the laser chip is electrically connected to an external power supply component through the conductive component;

[0010] A heat-conducting component is connected to the supporting base; the laser chip is spaced apart from the supporting base through the heat-conducting component; the heat-conducting component is electrically connected to the power supply component, and the heat-conducting component can be controlled to form a hot end and a cold end; the cold end is used to cooperate with the heat sink component of the laser chip to perform heat exchange so as to pre-cool the laser chip; the hot end is used to abut and cooperate with the supporting base to perform heat exchange so as to dissipate heat through the supporting base.

[0011] In one embodiment, the heat-conducting component includes a semiconductor refrigeration sheet and a conductive part; the semiconductor refrigeration sheet includes a first end and a second end disposed opposite to each other along the thickness direction; one of the first end and the second end is the cold end, and the other is the hot end; the conductive part is electrically connected to the semiconductor refrigeration sheet, and the conductive part is used to connect to the power supply component so that the semiconductor refrigeration sheet is fed with electricity;

[0012] And / or, the bearing base is provided with a bearing recess for bearing the heat-conducting component; the bearing recess cooperates with the heat-conducting component in a limiting bearing manner.

[0013] In one embodiment, the COS laser chip test fixture assembly also includes a current conversion element; the conductive part is electrically connected to the current conversion element; the current conversion element is used to adjust the current between the conductive part and the semiconductor refrigeration sheet to control the cooling capacity of the cold end.

[0014] In one embodiment, the conductive portion includes a first conductive portion connected to the positive electrode of the power supply assembly and a second conductive portion connected to the negative electrode of the power supply assembly;

[0015] The conductive part includes at least two of the first conductive parts, and / or at least two of the second conductive parts; the current conversion element includes a first resistor and a second resistor; at least one of the first conductive parts is electrically connected to the first resistor and at least one of the second conductive parts to form a first loop; at least one of the first conductive parts is electrically connected to the second resistor and at least one of the second conductive parts to form a second loop; wherein the resistance value of the first resistor is different from the resistance value of the second resistor, so that the current of the first loop is different from the current of the second loop.

[0016] In one embodiment, the COS laser chip test fixture assembly further includes a fastening component; the fastening component is inserted into the insulating pressure plate and the bearing base, and the fastening component is screwed with the bearing base, so that the insulating pressure plate is connected to the bearing base through the fastening component;

[0017] And / or, the COS laser chip test fixture assembly also includes an insulating connector, which is provided with a non-insulating part and an insulating part wrapped around the non-insulating part; at least one of the laser chip and the conductive part is arranged in the non-insulating part, so that the laser chip and at least one of the conductive part are avoided and matched with the insulating part; at least part of the insulating part is clamped between the conductive component and the cold end along the thickness direction, so that at least part of the insulating part is insulated and matched with the conductive component and the cold end.

[0018] In one embodiment, the fastening assembly includes a first fastener; the bearing base is provided with a first internal threaded hole, the insulating pressure plate is provided with a second internal threaded hole, and the first fastener is threadedly engaged with the first internal threaded hole and the second internal threaded hole.

[0019] In one embodiment, the fastening assembly includes a second fastener, a first limiter and a second limiter, the first limiter and the second limiter are spaced and protruded from the second fastener; the laser chip is detachably connected to the insulating connector; the second fastener is inserted into the insulating connector, the insulating pressure plate and the supporting base, the insulating connector, the conductive component and the insulating pressure plate are abutted and restricted between the first limiter and the second limiter, so that the insulating connector, the conductive component and the insulating pressure plate are locked to the second fastener; wherein the supporting base is threadedly engaged with the second fastener, so that the second fastener can move in a direction approaching or away from the supporting base, so that the first limiter and the second limiter drive the insulating pressure plate and the insulating connector to move in a direction approaching or away from the supporting base, and the distance between the cold end and the laser chip is adjustable.

[0020] In one embodiment, the conductive component includes a circuit board, and a first feeding pin and a second feeding pin arranged on the circuit board, the first feeding pin is used to cooperate with the positive feeding of the laser chip, and the second feeding pin is used to cooperate with the negative feeding of the laser chip; the insulating pressure plate is arranged to avoid the first feeding pin, the second feeding pin, the positive pole of the laser chip and the negative pole of the laser chip.

[0021] A testing system comprises a power supply component, a detection component and the COS laser chip test fixture assembly in the above embodiment, wherein the COS laser chip test fixture assembly is used to install a laser chip, the power supply component is used to feed and connect with a conductive component, a thermal conductive component and the detection component so that the laser chip and the conductive component are electrically connected and matched, and the detection component can be used to detect the performance parameters of the laser chip.

[0022] In one embodiment, the test system further includes a current regulating component, the power supply component is electrically connected to the heat conductive component to form a conductive loop, and the current regulating component is disposed in the conductive loop; the current regulating component is used to adjust the current of the conductive loop so that the cooling capacity of the cold end can be adjusted.

[0023] The above-mentioned COS laser chip test fixture assembly and test system use the cold end of the heat-conducting component to pre-cool the laser chip, so that the temperature difference between the cold end and the laser chip is larger, which improves the cooling efficiency of the chip, helps to dissipate heat quickly, and avoids damage to the chip due to overheating for too long. Furthermore, when the cold end is controlled, the cooling process of the chip can be relatively continuous and stable. The cooling capacity of the cold end does not follow the drop in chip temperature under non-external conditions and cause the cold end temperature to rise. It can continue to provide sufficient cooling capacity for the chip to ensure sufficient heat dissipation. In addition, the hot end of the heat-conducting component can cooperate with the supporting base for heat dissipation, and will not transfer heat to the laser chip. The setting of the cold end can fully block the heat from the supporting base from being transferred to the laser chip, avoiding reverse heat conduction in the heat dissipation process and ensuring the quality of heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the software structure of a test system in one embodiment.

[0025] Figure 2 Schematic diagram of the structure of a COS laser chip test fixture assembly in one embodiment.

[0026] Figure 3 for Figure 2 Front view of the COS laser chip test fixture assembly shown in FIG.

[0027] Figure 4 for Figure 2 Schematic diagram of the disassembled structure of the COS laser chip test fixture assembly shown in.

[0028] Figure 5 Schematic diagram of the coordination structure of the current regulating component in a test system in one embodiment.

[0029] Figure 6 Schematic diagram of the structure of a heat conduction component in one embodiment.

[0030] Figure 7 It is a schematic diagram of the installation of the fastening assembly to the insulating pressing plate and the supporting base in a use state in an embodiment.

[0031] Figure 8 It is a schematic diagram of the installation of the fastening assembly to the insulating pressing plate and the supporting base in another use state in one embodiment.

[0032] Description of reference numerals:

[0033] 10. Test system; 100. COS laser chip test fixture assembly; 110. Carrying base; 111. Carrying recess; 120. Insulating plate; 130. Conductive component; 131. Circuit board; 132. First feeding pin; 133. Second feeding pin; 134. First electric shock spring; 135. Second electric shock spring; 140. Thermal conductive component; 140a. Cold end; 140b. Hot end; 141. Semiconductor cooling sheet; 142. Conductive part; 142a. First A conductive part; 142b, a second conductive part; 150, a fastening assembly; 151, a first fastener; 152, a second fastener; 153, a first limiter; 154, a second limiter; 155, a third fastener; 160, an insulating connector; 161, a non-insulating part; 161a, a first non-insulating part; 161b, a second non-insulating part; 162, an insulating part; 200, a power supply assembly; 300, a detection assembly; 400, a current regulating assembly; 20, a laser chip. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0035] See also Figure 1 , Figure 1The structural schematic diagram of the COS laser chip test fixture assembly 100 in one embodiment of the present application is shown. A test system 10 provided in one embodiment of the present application includes a COS laser chip test fixture assembly 100, a power supply component 200 and a detection component 300. The power supply component 200 is used to distribute power to the COS laser chip test fixture assembly 100 and the detection component 300, and the detection component 300 is used to detect the performance parameters of the laser chip 20 (such as a semiconductor laser chip TEC). Among them, the performance parameters can be, but are not limited to, any one or any combination of multiple parameters such as the threshold current, operating voltage, output light power, output wavelength, photoelectric conversion efficiency, polarization degree, divergence angle, chip output light power and output wavelength of the laser chip.

[0036] Specifically, Figures 2 to 3 As shown, the COS laser chip test fixture assembly 100 includes a supporting base 110 , an insulating pressing plate 120 , a conductive component 130 and a thermal conductive component 140 .

[0037] The insulating plate 120 is connected to the supporting base 110. There is at least one mounting portion between the insulating plate 120 and the supporting base 110. The laser chip 20 is detachably connected between the insulating plate 120 and the supporting base 110.

[0038] The conductive component 130 is connected to the supporting base 110. At least part of the insulating platen 120 covers the conductive component 130, so that at least part of the insulating platen 120 is insulated from the conductive component 130, reducing the risk of leakage and improving the stability of the test of the laser chip 20. At least part of the insulating platen 120, the conductive component 130 and the supporting base 110 are overlapped in sequence along the thickness direction of the supporting base 110. The conductive component 130 is used to feed the power supply component 200, so that the power supply component 200 is electrically connected to the laser chip 20 through the conductive component 130. It should be noted that the cooperation between the conductive component 130 and the laser chip 20 can be installed on the same plane, or different planes can be overlapped. In addition, the electrical connection method between the conductive component 130 and the laser chip 20 can be but is not limited to contact electrical connection, wired connection, etc.

[0039] The heat conducting component 140 is connected to the supporting base 110. At least part of the laser chip 20 is connected and matched with the heat conducting component 140, and the laser chip 20 is spaced apart from the supporting base 110 through the heat conducting component 140. The heat conducting component 140 is electrically connected to the power supply component 200 so that it can be controlled to form a cold end 140a and a hot end 140b. The cold end 140a is used to perform heat exchange with the laser chip 20 to perform pre-cooling treatment on the heat sink component (equivalent to the COS package base) of the laser chip 20, wherein the cooperation between the cold end 140a and the laser chip 20 can be direct contact cooperation or indirect contact cooperation. The hot end 140b is used to abut and cooperate with the supporting base 110 for heat exchange so that heat is dissipated through the supporting base 110.

[0040] It should be noted that the definition of the cold end 140a and the hot end 140b means that the side of the heat conducting component 140 with a relatively lower temperature is defined as the cold end 140a, and the side with a relatively higher temperature can be defined as the hot end 140b.

[0041] It can be understood that, unlike the heat dissipation by abutting the laser chip 20 against the supporting base 110, since the outer wall temperature of the supporting base 110 is similar to the ambient temperature difference, the temperature difference between the laser chip 20 and the supporting base 110 in this heat dissipation method is smaller, and the cold end 140a of the heat conducting component 140 is used to pre-cool the laser chip 20, so that the temperature difference between the cold end 140a and the laser chip 20 is larger, thereby improving the cooling efficiency of the chip, helping to quickly dissipate heat, and avoiding damage to the chip due to overheating for too long.

[0042] Furthermore, the cooling process of the chip by the cold end 140a is relatively continuous and stable. The cooling capacity of the cold end 140a does not follow the decrease of the chip temperature under non-external conditions and causes the temperature of the cold end 140a to rise, and can continuously provide sufficient cooling capacity for the chip to ensure sufficient heat dissipation. In addition, the hot end 140b of the heat conducting component 140 can cooperate with the supporting base 110 for heat dissipation, and will not transfer heat to the laser chip 20. The setting of the cold end 140a can fully block the heat from the supporting base 110 from being transferred to the laser chip 20, avoiding the reverse conduction of heat in the heat dissipation process and ensuring the quality of heat dissipation.

[0043] It should be noted that the heat-conducting component 140 can be a semiconductor cooling sheet 141, or a refrigerant heat exchange component, etc., which can be selected according to different heat dissipation requirements.

[0044] In one embodiment, the heat conducting component 140 may be a refrigerant heat exchange component, which has a condensation side and a heating side. The condensation side is used to communicate with an external condenser to pass through the refrigerant, and the heating side is used to communicate with an external compressor to recover the refrigerant. In this way, by using the refrigerant as a heat exchange medium, since the temperature of the refrigerant is extremely low and the temperature difference with the laser chip 20 is extremely large, a large amount of heat can be absorbed during the process of the refrigerant changing from gas to liquid, so that the temperature of the laser chip 20 can be reduced very quickly, thereby improving the heat dissipation efficiency.

[0045] In the related art, related manufacturers will use a medium channel such as a water flow channel to open a medium channel on the bearing base 110 to dissipate heat from the laser chip 20 through the heat of the medium such as the water flow channel. However, this method requires deep processing of the bearing base 110, which is difficult to process and requires a lot of processing time and cost. In addition, due to the opening of the channel, the waterproof and dustproof performance of the bearing base 110 is reduced, further increasing the occurrence of accidents such as leakage.

[0046] In another embodiment, the heat conducting component 140 may be a semiconductor refrigeration component. Specifically, the heat conducting component 140 includes a semiconductor refrigeration sheet 141 and a conductive portion 142. The semiconductor refrigeration sheet 141 includes a first end and a second end that are arranged opposite to each other. One of the first end and the second end is a cold end 140a, and the other is a hot end 140b. The conductive portion 142 is connected to the semiconductor refrigeration sheet 141, and the conductive portion 142 is used to connect to the power supply component 200 so that the semiconductor refrigeration sheet 141 is fed with electricity.

[0047] The semiconductor cooling sheet 141 may include one or more of an N-type semiconductor cooling sheet 141 and a P-type semiconductor cooling sheet 141. Thus, the heat supply of the cold end 140a is realized by setting the semiconductor cooling sheet 141. Different from setting a water flow channel and the like, the semiconductor cooling sheet 141 has a simple structure and is easy to be integrated. There is no need to process the supporting base 110 too much, thereby improving the processing efficiency and reducing the processing cost.

[0048] The cooling capacity of the semiconductor refrigeration plate 141 is determined by the voltage provided by the power supply assembly 200 and the current passing through the semiconductor refrigeration plate 141. The specific cooling capacity may be adjustable or non-adjustable.

[0049] Further, in one embodiment, if Figure 4As shown, the conductive part 142 includes a first conductive part 142a connected to the positive electrode of the power supply assembly 200 and a second conductive part 142b connected to the negative electrode of the power supply assembly 200. The positive electrode of the power supply assembly 200, the first conductive part 142a, the semiconductor cooling sheet 141, the second conductive part 142b and the negative electrode of the power supply assembly 200 are connected to form a conductive loop. It should be noted that the conductive loop can be, but is not limited to, a series circuit or a parallel circuit.

[0050] In addition, the cooling capacity of the semiconductor cooling sheet 141 may be adjustable. In some embodiments, the cooling capacity of the semiconductor cooling sheet 141 may be adjusted by the magnitude of the current. Generally, within a certain ideal temperature difference range between the cold end 140a and the hot end 140b, the more heat the laser chip 20 needs to release, the more cooling capacity is required, and the greater the current that needs to pass through the semiconductor cooling sheet 141.

[0051] Based on this, in one embodiment, if Figure 5 As shown, the test system 10 further includes a current regulating component 400. The current regulating component 400 is disposed in the conductive loop. The current regulating component 400 includes a current regulating component 400. The current regulating component 400 is used to regulate the current of the conductive loop to regulate the cooling capacity of the cold end 140a.

[0052] Specifically, when the temperature measurement component detects that the temperature value is within the preset range, it means that the heat dissipation performance of the laser chip 20 is good at this time, and the distribution current to the heat-conducting component 140 can continue to be maintained (such as maintaining it at the first current). When the temperature measurement component detects that the temperature value is greater than the preset range, it means that the test laser chip 20 is in an overheated state, and its heat dissipation performance is poor. The current of the electric circuit can be increased by the current adjustment component 400 (such as increasing the first current to the second current) to increase the cooling capacity of the semiconductor cooling plate 141. When the temperature measurement component detects that the temperature value is less than the preset range, it means that the laser chip 20 is in an overcooled state, and the temperature of the laser chip 20 is low. At this time, the current of the electric circuit can be reduced by the current adjustment component 400 (such as reducing the second current to the first current) to reduce the cooling capacity of the semiconductor cooling plate 141, so as to avoid the laser chip 20 from being overcooled and frosted, which affects the test of the laser chip 20. Among them, the current adjustment component 400 can be but not limited to a rheostat, a transformer, etc., and no excessive restrictions are made here.

[0053] In addition to adjusting the current through the external current regulating component 400, the current can also be adjusted by an integrated setting in the COS laser chip test fixture assembly 100. In another embodiment, the COS laser chip test fixture assembly 100 also includes a current conversion element. The current conversion element is used to adjust the current between the conductive component 130 and the semiconductor refrigeration plate 141 to regulate the cooling capacity of the cold end 140a. It can be understood that the magnitude of the current can be adjusted by the current conversion element to form different cooling capacities, and then targeted heat dissipation can be performed for different heat dissipation scenarios, which is conducive to saving power loss. Among them, the current conversion element can be at least one of the conductive part 142 and the semiconductor refrigeration plate 141. In addition, the current conversion element can be but not limited to a sliding rheostat, a resistance loop formed by different resistors, etc., and no excessive restrictions are made here.

[0054] Specifically, the current conversion element may be disposed on the conductive portion 142. Figure 6 As shown, the conductive part 142 includes at least two first conductive parts 142a connected to the positive pole of the power supply assembly 200, and / or at least two second conductive parts 142b connected to the negative pole of the power supply assembly 200. The converter element includes a first resistor and a second resistor. At least one first conductive part 142a is electrically connected to the first resistor and at least one second conductive part 142b to form a first loop. At least one first conductive part 142a is electrically connected to the second resistor and at least one second conductive part 142b to form a second loop.

[0055] In one example, the conductive part 142 further includes at least two first conductive parts 142a, such as two first conductive parts 142a, namely a first conductive part 142aa and a first conductive part 142ab. The first circuit formed when the first conductive part 142aa and the second conductive part 142b are fed together will pass through the first resistor to achieve a first current passing through the semiconductor cooling sheet 141, so that the cold end 140a outputs a first cold amount for cooling the laser chip 20. The second circuit formed when the first conductive part 142ab and the second conductive part 142b are fed together will pass through the second resistor to achieve a second current passing through the semiconductor cooling sheet 141, so that the cold end 140a outputs a second cold amount for cooling the laser chip 20.

[0056] In this way, by switching between the first conductive portion 142a and the second conductive portion 142b, different currents are switched through resistors with different resistance values, which has a simple structure and is easy to operate.

[0057] It should be noted that, in addition, the connection between the supporting base 110 and the insulating pressing plate 120 may be, but is not limited to, a snap connection, a screw connection, or a cover connection.

[0058] In some embodiments, Figure 2, the COS laser chip test fixture assembly 100 also includes a fastening component 150. The fastening component 150 is inserted into the insulating platen 120 and the bearing base 110, and the fastening component 150 is screwed with the bearing base 110, so that the insulating platen 120 is connected to the bearing base 110 through the fastening component 150. Specifically, the bearing base 110 is provided with a first internal threaded hole, and the fastening component 150 is provided with an external threaded structure. The fastening component 150 and the bearing base 110 are fixed by screwing the external threaded structure with the first internal threaded hole, so that the positions of the insulating platen 120 and the bearing base 110 are fixed. The insulating platen 120 may be provided with an internal threaded hole or may not be provided with an internal threaded hole, and the pressing of the insulating platen 120 to the bearing base 110 may be achieved by gravity.

[0059] The fastening assembly 150 may be a screw, a bolt, a pin, etc. In addition, the number of the fastening assembly 150 may be one or more, and no excessive limitation is made here.

[0060] In the specific implementation mode, Figure 2 , there may be multiple groups of fastening components 150. One group of fastening components 150 may include two fastening components 150 arranged opposite to each other along the width direction of the bearing base 110. In this way, the fastening components 150 arranged symmetrically can ensure the balance of the fixing of the bearing base 110 and the insulating pressure plate 120, thereby improving the fixing stability of the COS laser chip test fixture assembly 100 on the laser chip 20.

[0061] In one embodiment, Figure 2 The fastening assembly 150 includes a first fastener 151. The insulating platen 120 is provided with a second internal threaded hole, and the first fastener 151 is threadedly engaged with the first internal threaded hole and the second internal threaded hole. In this way, the first fastener 151 is fastened with the bearing base 110 and the insulating platen 120, so that the connection strength between the bearing base 110 and the insulating platen 120 can be strengthened, thereby improving the fixing support strength of the COS laser chip test fixture assembly 100 on the laser chip 20, which is beneficial to protecting the laser chip 20.

[0062] Further, in some embodiments, Figure 4 The COS laser chip test fixture assembly 100 further includes an insulating connector 160, which is provided with a non-insulating portion 161 and an insulating portion 162 disposed around the non-insulating portion 161. At least one of the laser chip 20 and the conductive portion 142 is disposed on the non-insulating portion 161, so that at least one of the laser chip 20 and the conductive portion 142 is avoided and matched with the insulating portion 162. At least part of the insulating portion 162 is sandwiched between the conductive component 130 and the cold end 140a along the thickness direction, so that at least part of the insulating portion 162 is insulated and matched with the conductive component 130 and the cold end 140a.

[0063] In this way, the setting of the insulating connector 160 can serve as a transition connector for connecting the conductive component 130 with the laser chip 20, improve the stability of the connection between the two, increase the stability of the feed connection between the conductive component 130 and the laser chip 20, and ensure the stability of the test circuit. In addition, the insulating portion 162 can improve the connection stability between the conductive component 130 and the cold end 140a, and avoid leakage accidents, while the setting of the non-insulating portion 161 can fully ensure the feed stability of the laser chip 20 and the semiconductor cooling sheet 141, and improve the power safety performance of the laser chip 20 during the test process.

[0064] In addition to the above embodiments, the cooling capacity can be controlled by adjusting the current. In some embodiments, the cooling capacity can also be controlled by changing the medium. Figures 7 and 8 As shown, the fastening assembly 150 includes a second fastener 152, a first stopper 153 and a second stopper 154. The fastening assembly 150 includes a second fastener 152, a first stopper 153 and a second stopper 154. The first stopper 153 and the second stopper 154 are spaced and protruded from the second fastener 152. The second fastener 152 is provided with an external thread structure. The supporting base 110 is provided with a third internal thread hole threadedly matched with the external thread structure (it can be understood that the third internal thread hole can be connected to the first internal thread hole in the above embodiment or set together). The laser chip 20 is detachably connected to the insulating connector 160.

[0065] The second fastener 152 is inserted into the insulating connector 160 and the insulating pressure plate 120, and one of the first limiting member 153 and the second limiting member 154 is used to abut and limit the side of the insulating pressure plate 120 that is set away from the conductive component 130 (such as the first limiting member 153 abuts and cooperates with the upper surface of the insulating pressure plate 120), and the other is used to abut and limit the side of the insulating connector 160 that is set close to the semiconductor refrigeration component (such as the second limiting member 154 abuts and cooperates with the lower surface of the insulating connector 160), so that the insulating connector 160 and the insulating pressure plate 120 are abutted and limited between the first limiting member 153 and the second limiting member 154, so that the insulating connector 160 and the insulating pressure plate 120 are locked to the second fastener 152.

[0066] Based on this, since the laser chip 20 can be connected to the insulating connector 160, and the laser chip 20 is connected to the conductive component 130, the second fastener 152 can drive the insulating connector 160, the laser chip 20, the wire component and the insulating pressure plate 120 to move synchronously in a direction close to or away from the supporting base 110.

[0067] Therefore, by screwing the third internal thread hole and the external thread structure, the distance between the cold end 140 a and the insulating connector 160 is adjustable, so that the distance between the cold end 140 a and the laser chip 20 is adjustable.

[0068] For ease of understanding, the use of the fastening assembly 150 is described in detail below in conjunction with a usage scenario.

[0069] like Figure 7 As shown, when the laser chip 20 is in an overheated state, it is necessary to provide strong heat dissipation to the laser chip 20. At this time, the second fastener 152 can be inserted into the bearing base 110 and the insulating pressure plate 120, and the screwing amount of the second fastener 152 can be adjusted to make the laser chip 20 fully contact with the cold end 140a, so as to achieve the maximum degree of surface-to-surface heat dissipation and improve the heat dissipation efficiency.

[0070] like Figure 8 As shown, when the laser chip 20 is in a warm state or an overcooled state, it is not necessary to provide the laser chip 20 with a strong heat dissipation performance to avoid overcooling and frosting of the laser chip 20. At this time, the second fastener 152 can be screwed out appropriately, and the screwing amount of the second fastener 152 can be adjusted. The second fastener 152 drives the second stopper 154 to move relative to the bearing base 110 in a direction away from the bearing base 110, and then the second stopper 154 drives the insulating connector 160 and the laser chip 20 to move in a direction away from the bearing base 110, thereby increasing the distance between the cold end 140a and the laser chip 20. At this time, the heat dissipation between the laser chip 20 and the cold end 140a is at least partially through gas as a heat transfer medium. Compared with the heat transfer between the surfaces through fixed as a heat transfer medium, the heat dissipation rate of gas as a heat transfer medium is slowed down, thereby reducing the heat dissipation rate of the laser chip 20 and avoiding overcooling of the laser chip 20.

[0071] Furthermore, in some embodiments, at least one of the first limit member 153 and the second limit member 154 is threadedly engaged with the external thread structure, so that at least one of the first limit member 153 and the second limit member 154 is detachably connected to the second fastener 152, so that the distance between the first limit member 153 and the second limit member 154 is adjustable, and the second fastener 152 is detachably engaged with the insulating pressure plate 120 and the insulating connector 160.

[0072] It is understandable that the distance between the first limit member 153 and the second limit member 154 can be adjusted by disassembling the first limit member 153 or the second limit member 154, so that insulating pressure plates 120, insulating connectors 160 and conductive components 130 (such as circuit boards 131) of different sizes can be accommodated, which is conducive to replacing parts of different sizes and improves the disassembly and assembly performance of the test fixture. By replacing wire components or insulating connectors 160 of different sizes, the conductive properties of different laser chips 20 can be met, thereby broadening the clamping application range of the test fixture.

[0073] It should be noted that the first limiting member 153 and the second limiting member 154 may be, but are not limited to, structures such as nuts and washers, and no further restrictions are imposed herein.

[0074] In another embodiment, Figure 2 The fastening assembly further includes a third fastener 155, and the third fastener 153 is screwed and fixed to the insulating connector 160 and the bearing base 150. In this way, the third fastener 152 can limit the movement of the heat-conducting assembly 140, so that the installation and fixation of the heat-conducting assembly 140 is more stable, and the heat-conducting assembly 140 is kept in close contact with the bearing base 110, which is conducive to improving the heat dissipation rate.

[0075] Combined with any embodiment of the insulating connector 160 in the above embodiments. Figure 4 The insulating connector 160 includes at least two non-insulating parts 161. The at least two non-insulating parts 161 include a first non-insulating part 161a and a second non-insulating part 161b.

[0076] In a specific embodiment, the laser chip 20 is detachably connected to the first non-insulating portion 161a, so that the laser chip 20 can avoid the insulating connector 160 and conduct with the conductive component 130. In this way, the laser chip 20 is detachably connected to the first non-insulating portion 161a, so that the laser chip 20 can be easily disassembled and assembled, and the laser chip 20 and the conductive component 130 can conduct; and the insulating portion 162 and the conductive component 130 can improve the conductive stability of the conductive component 130 to the laser chip 20, avoid the conductive component 130 and the semiconductor cooling sheet 141 from excessive contact and leakage, and improve the stability of the test system.

[0077] In another specific embodiment, the second non-insulating portion 161b is spaced apart from the first non-insulating portion 161a by the insulating portion 162. The first conductive portion 142a in the above embodiment is corresponding to at least one second non-insulating portion 161b, and the second conductive portion 142b in the above embodiment is corresponding to at least one second non-insulating portion 161b. That is, the first conductive portion 142a and the second conductive portion 142b are arranged to avoid the insulating portion 162 through the second non-insulating portion 161b, and can be electrically connected and matched with the power supply assembly 200. In this way, the second conductive portion 142b and the first conductive portion 142a not only avoid the insulating pressure plate 120, but also avoid the insulating portion 162, so that the electrical connection effect between the power supply assembly 200 and the thermal conductive assembly 140 can be guaranteed, and leakage can be avoided to the greatest extent, thereby improving the operational stability of the test system.

[0078] It should be noted that the non-insulating portion 161 may be formed by a notch structure, a hollow portion, etc. In addition, the insulating connector 160 may be an insulating portion 162 such as a glass member, a plastic plate, an insulating cloth, etc., and no excessive restrictions are imposed herein.

[0079] In combination with any of the above-mentioned embodiments of the conductive component 130, Figure 4 The conductive component 130 includes a circuit board 131, and a first feeding pin 132 and a second feeding pin 133 disposed on the circuit board 131. The first feeding pin 132 is used to cooperate with the positive electrode of the laser chip 20 for feeding, and the second feeding pin 133 is used to cooperate with the negative electrode of the laser chip 20 for feeding. The first feeding pin 132, the positive electrode of the laser chip 20, the negative electrode of the laser chip 20, and the second feeding pin 133 are electrically connected to form a test circuit.

[0080] In this way, the conductive component 130 is a circuit board 131, which can improve the integrated performance of the test device, reduce the setting of conductive wires, etc., and reduce the internal volume of the COS laser chip test fixture assembly 100, which is beneficial to improving the pressing and fixing effect of the COS laser chip test fixture assembly 100 on the laser chip 20. It is necessary to increase the flatness of the circuit board 131, and the flattening effect is good. Further, generally, the circuit board 131 is in the shape of a relatively flat plate, and the setting of the circuit board 131 is beneficial to reduce the spacing between the insulating pressure plate 120 and the supporting base 110, so that there will not be too much gap between the conductive component 130 and the thermal conductive component 140, thereby improving the abutment and matching effect between the laser chip 20 and the semiconductor cooling plate 141, thereby optimizing the heat dissipation performance of the laser chip 20.

[0081] In one embodiment, in combination Figure 2 as well as Figure 4As shown, the insulating platen 120 is arranged to avoid the first feeding pin 132, the second feeding pin 133, the positive electrode of the laser chip 20, and the negative electrode of the laser chip 20. In this way, the insulating platen 120 will not affect the connection of the power supply component 200, and there is no need to vacate the insulating platen 120 to perform the feeding connection between the power supply component 200 and the laser chip 20 and the circuit board 131, which is conducive to improving the pressing contact effect of the insulating platen 120 on the laser chip 20, thereby improving the electric contact effect of the conductive component 130 and the laser chip 20 to ensure the stability of the test process; and improving the abutment effect between the laser chip 20 and the cold end 140a, thereby optimizing the heat dissipation effect of the laser chip 20.

[0082] It should be noted that the connection between the conductive component 130 and the laser chip 20 may be a contact electrical connection or a wired connection, etc., which is not limited here.

[0083] In a specific embodiment, Figure 4 , the conductive component 130 also includes a first electric shock spring 134 connected to the positive electrode of the laser chip 20 and a second electric shock spring 135 connected to the negative electrode of the laser chip 20. In this way, the way of feeding through the spring, which is different from the wired connection, is conducive to further reducing the matching distance between the conductive component 130 and the laser chip 20, thereby improving the pressing and fixing effect of the insulating pressure plate 120 and the supporting base 110 on the laser chip 20, and improving the installation stability of the laser chip 20. Furthermore, the setting of the spring makes it possible for the spring to have a certain elastic limit when it cooperates with the laser chip 20, so that the spring can be matched with laser chips 20 of various thicknesses, and then the COS laser chip test fixture assembly 100 can clamp various laser chips 20, which broadens the application scenarios of the COS laser chip test fixture assembly 100.

[0084] In combination with any of the above embodiments of the supporting base 110, Figure 4 The bearing base 110 is provided with a bearing recess 111 for bearing the heat-conducting component 140. The bearing recess 111 cooperates with the heat-conducting component 140 in a limited bearing manner. In this way, by setting the bearing recess 111, the height of the heat-conducting component 140 protruding from the bearing base 110 can be reduced, and even the upper surface of the heat-conducting component 140 can be made flush with the upper surface of the bearing base 110, so as to reduce the gap between the insulating pressure plate 120 and the bearing base 110, effectively avoid light leakage and other foreign matter from entering to affect the test of the laser chip with COS, and improve the test stability of the laser chip.

[0085] In order to improve the integrated performance of the COS laser chip test fixture assembly 100, some implementations, see Figure 4The bearing base 110 is also provided with at least two matching recesses, at least one matching recess is arranged in a one-to-one correspondence with the first conductive part 142a. At least one matching recess is arranged in a one-to-one correspondence with the second conductive part 142b. That is, the matching recess is arranged in a one-to-one correspondence with the conductive part 142. And when the matching recess is used to be installed and matched with the conductive part 142, the upper surface of the conductive part 142 is flush with the upper surface of the bearing base 110, or the upper surface of the conductive part 142 is slightly lower than the upper surface of the bearing base 110. In this way, the gap between the bearing base 110 and the conductive part 142 can be reduced, and the integrated performance of the COS laser chip test fixture assembly 100 can be improved, thereby improving the pressing and fixing effect of the COS laser chip test fixture assembly 100 on the laser chip 20.

[0086] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0087] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0088] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0089] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0090] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0091] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0092] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A COS laser chip test fixture assembly, characterized in that: include: Load-bearing base; An insulating pressing plate connected to the carrying base; a laser chip is detachably connected between the insulating pressing plate and the carrying base; A conductive component, wherein at least a portion of the insulating pressing plate covers the conductive component, and at least a portion of the insulating pressing plate, the conductive component and the supporting base are sequentially overlapped along the thickness direction of the supporting base; the laser chip is electrically connected to an external power supply component through the conductive component; A heat-conducting component is connected to the supporting base; the laser chip is spaced apart from the supporting base through the heat-conducting component; the heat-conducting component is electrically connected to the power supply component, and the heat-conducting component can be controlled to form a hot end and a cold end; the cold end is used to cooperate with the heat sink component of the laser chip to perform heat exchange so as to pre-cool the laser chip; the hot end is used to abut and cooperate with the supporting base to perform heat exchange so as to dissipate heat through the supporting base.

2. The COS laser chip test fixture assembly according to claim 1, characterized in that: The heat-conducting component comprises a semiconductor refrigeration sheet and a conductive part; the semiconductor refrigeration sheet comprises a first end and a second end disposed opposite to each other along the thickness direction; one of the first end and the second end is the cold end, and the other is the hot end; the conductive part is electrically connected to the semiconductor refrigeration sheet, and the conductive part is used to connect to the power supply component so that the semiconductor refrigeration sheet is fed with electricity; And / or, the bearing base is provided with a bearing recess for bearing the heat-conducting component; the bearing recess cooperates with the heat-conducting component in a limiting bearing manner.

3. The COS laser chip test fixture assembly according to claim 2, characterized in that: The COS laser chip test fixture assembly also includes a current conversion element; the conductive part is electrically connected to the current conversion element; the current conversion element is used to adjust the current between the conductive part and the semiconductor refrigeration sheet to control the cooling capacity of the cold end.

4. The COS laser chip test fixture assembly according to claim 3, characterized in that: The conductive part includes a first conductive part connected to the positive electrode of the power supply assembly and a second conductive part connected to the negative electrode of the power supply assembly; The conductive part includes at least two of the first conductive parts, and / or at least two of the second conductive parts; the current conversion element includes a first resistor and a second resistor; at least one of the first conductive parts is electrically connected to the first resistor and at least one of the second conductive parts to form a first loop; at least one of the first conductive parts is electrically connected to the second resistor and at least one of the second conductive parts to form a second loop; wherein the resistance value of the first resistor is different from the resistance value of the second resistor, so that the current of the first loop is different from the current of the second loop.

5. The COS laser chip test fixture assembly according to claim 2, characterized in that: The COS laser chip test fixture assembly further includes a fastening component; the fastening component is inserted into the insulating pressure plate and the bearing base, and the fastening component is threadedly engaged with the bearing base, so that the insulating pressure plate is connected to the bearing base through the fastening component; And / or, the COS laser chip test fixture assembly also includes an insulating connector, which is provided with a non-insulating part and an insulating part wrapped around the non-insulating part; at least one of the laser chip and the conductive part is arranged in the non-insulating part, so that the laser chip and at least one of the conductive part are avoided and matched with the insulating part; at least part of the insulating part is clamped between the conductive component and the cold end along the thickness direction, so that at least part of the insulating part is insulated and matched with the conductive component and the cold end.

6. The COS laser chip test fixture assembly according to claim 5, characterized in that: The fastening assembly includes a first fastener; the bearing base is provided with a first internal threaded hole, the insulating pressing plate is provided with a second internal threaded hole, and the first fastener is threadedly engaged with the first internal threaded hole and the second internal threaded hole.

7. The COS laser chip test fixture assembly according to claim 5, characterized in that: The fastening assembly comprises a second fastener, a first limiting member and a second limiting member, wherein the first limiting member and the second limiting member are spaced and protruded from the second fastener; the laser chip is detachably connected to the insulating connector; the second fastener is inserted into the insulating connector, the insulating pressure plate and the supporting base, and the insulating connector, the conductive component and the insulating pressure plate are abutted and restricted between the first limiting member and the second limiting member, so that the insulating connector, the conductive component and the insulating pressure plate are locked to the second fastener; Among them, the supporting base is threadedly cooperated with the second fastener, so that the second fastener can move in a direction close to or away from the supporting base, so that the first limit member and the second limit member drive the insulating pressure plate and the insulating connecting member to move in a direction close to or away from the supporting base, and the distance between the cold end and the laser chip is adjustable.

8. The COS laser chip test fixture assembly according to claim 2, characterized in that: The conductive component includes a circuit board, and a first feeding pin and a second feeding pin arranged on the circuit board, the first feeding pin is used to cooperate with the positive feeding of the laser chip, and the second feeding pin is used to cooperate with the negative feeding of the laser chip; the insulating pressure plate is arranged to avoid the first feeding pin, the second feeding pin, the positive pole of the laser chip and the negative pole of the laser chip.

9. A testing system, characterized in that: The invention comprises a power supply component, a detection component and a COS laser chip test fixture assembly as described in any one of claims 1 to 8, wherein the COS laser chip test fixture assembly is used to install a laser chip, the power supply component is used to feed and connect with a conductive component, a thermal conductive component and the detection component so that the laser chip is electrically connected to the conductive component, and the detection component can be used to detect the performance parameters of the laser chip.

10. The test system according to claim 9, characterized in that: The test system also includes a current regulating component, the power supply component is electrically connected to the heat conduction component to form a conductive loop, and the current regulating component is arranged in the conductive loop; the current regulating component is used to adjust the current of the conductive loop so that the cooling capacity of the cold end can be adjusted.

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