Aging device

Abstract

Provided is an aging device capable of increasing the number of DUTs measured per unit occupied area of the device and suppressing transmission loss of signals. The aging device (1) is provided with an aging plate (20), an aging chamber (11), a heat-insulating chamber (30) which is separated from the aging chamber (11) by a wall (115a) and is separated from outside air by a wall (60), and a functional plate (50), the wall (115a) comprises a top plate (40) and is embedded with a connector (42) through a connector (23), the aging plate (20) is electrically connected with the top plate (40), and the functional plate (50) enters the inside of the heat-insulating chamber (30) through an opening (61) formed in the wall (60). The functional plate (50) and the top plate (40) are electrically connected by fitting the connector (52) and the connector (43).

Description

Technical Field

[0001] The present invention relates to a aging device. Background Art

[0002] There is known a burn-in device that tests a DUT (Device Under Test) in a high-temperature or low-temperature environment for the purpose of removing electronic components having initial defects (see, for example, Patent Document 1). Prior Art Literature Patent Literature

[0003] Patent Document 1: Japanese Patent Application Publication No. 2022-138609 Summary of the invention Problems to be solved by the invention

[0004] In the above-mentioned aging device, in order to achieve heat insulation of the heating layer that accommodates the aging board and heats the DUT mounted on the aging board, the aging board is connected to the driving board through a relay board. In such an aging device, there is a problem that the device size becomes larger due to the presence of the relay board, and the number of DUTs that can be measured per unit area of ​​the device is limited. In addition, since the signal passes through the relay board, there is a problem of signal transmission loss between the aging board and the driving board.

[0005] The problem to be solved by the present invention is to provide a burn-in device that can increase the number of DUTs that can be measured per unit area occupied by the device and suppress signal transmission loss. Technical solutions to solve problems

[0006] [1] Mode 1 of the present invention is an aging device, comprising: an aging board, which has a socket equipped with a DUT, a first substrate on which the socket is mounted, and a first connector mounted on the first substrate; a chamber, which accommodates the aging board; a heat-insulating chamber, which is separated from the chamber by a first wall and separated from external air by a second wall; and a functional board, which has a second substrate and a second connector mounted on the second substrate, the first wall including a top plate, the top plate having a third substrate, a third connector mounted on one main surface of the third substrate, and a fourth connector mounted on another main surface of the third substrate, the aging board is electrically connected to the top plate by the first connector being engaged with the third connector, the functional board enters the interior of the heat-insulating chamber through an opening formed in the second wall, and is electrically connected to the top plate by the second connector being engaged with the fourth connector.

[0007] [2] A second aspect of the present invention may be the following aging device: In the aging device of the first aspect, the aging device may include a dry air supply device that supplies dry air to the heat insulation chamber.

[0008] [3] A third aspect of the present invention may be the following aging device: in the aging device of the second aspect, the aging device may include a heating device for heating the dry air.

[0009] [4] Mode 4 of the present invention may also be the following aging device: In the aging device of Mode 3, the aging device comprises: a temperature sensor that measures the temperature in the chamber; and a control device that controls the heating device based on the measurement result of the temperature sensor.

[0010] [5] Mode 5 of the present invention may also be the following aging device: in the aging device of Mode 4, the control device controls the heating device to heat the dry air when the temperature in the chamber is lower than a given temperature, and does not heat the dry air when the temperature in the chamber is higher than the given temperature.

[0011] [6] A sixth aspect of the present invention may be the following aging device: In the aging device described in the fifth aspect, the given temperature is a temperature value below 0°C.

[0012] [7] A seventh aspect of the present invention may be a aging device according to any one of aspects 1 to 6, wherein the aging device includes a sealing member that seals between the opening of the second wall and the functional board.

[0013] [8] Mode 8 of the present invention may also be the following aging device: In the aging device of any one of modes 1 to 7, the functional panel includes: a first part, which enters into the interior of the insulation chamber through the opening; and a second part, which is located outside the insulation chamber.

[0014] [9] A ninth aspect of the present invention may be the following aging device: In the aging device of the eighth aspect, the aging device includes a fan that sends air to the second portion to cool the functional panel.

[0015]

[10] Mode 10 of the present invention may also be the following aging device: In the aging device of any one of modes 1 to 9, the function board has a control circuit, the control circuit is mounted on the second substrate, and inputs and outputs signals to the DUT. Effects of the Invention

[0016] In the present invention, the aging board and the top plate are electrically connected via the first connector and the third connector, and the function board and the top plate are electrically connected via the second connector and the fourth connector. Therefore, there is no need to use other components for connecting the aging board and the function board, which can reduce the size of the aging device and increase the number of DUTs measured per unit area of ​​the device. In addition, the aging board and the function board are connected via the top plate and the first to fourth connectors, and the communication path between the aging board and the function board is short, so the transmission loss of the signal between the aging board and the function board can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a front view showing the aging device in the embodiment of the present invention. Figure 2 It is a side cross-sectional view of the aging device in the embodiment of the present invention. Figure 3 is with Figure 2 The corresponding figure of part III-III. Figure 4 is with Figure 2 The enlarged view corresponding to part IV. DETAILED DESCRIPTION

[0018] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0019] Reference Figure 1 as well as Figure 2 The overall structure of the burn-in device 1 in this embodiment will be described. Figure 1 is a front view of the aging device in this embodiment, Figure 2 is a side cross-sectional view of the aging device in this embodiment, Figure 3 is with Figure 2 The corresponding figure of part III-III is, Figure 4 is with Figure 2 The enlarged view corresponding to part IV.

[0020] The burn-in device 1 in the present embodiment is a device for performing a burn-in test as a kind of screening test for the purpose of picking out initial defects of electronic components under test (DUT: Device Under Test) such as semiconductor integrated circuit elements and removing initial defective products.

[0021] like Figure 1 to Figure 3As shown, the aging device 1 includes an aging chamber 11, an aging board 20, a functional board 50, and an insulating chamber 30. The aging board 20 is a wiring board having a plurality of sockets 22, which are arranged in a matrix on a substrate 21, and the aging board 20 can be equipped with a DUT 100 in a detachable manner. The aging chamber 11 can accommodate a plurality of aging boards 20. The functional board 50 is a wiring board for inputting voltage and signals to the DUT 100 mounted on the aging board 20. The insulating chamber 30 insulates the aging chamber 11 from the external air.

[0022] The aging device 1 applies a low-temperature thermal stress (e.g., about -55°C to -10°C) to the DUT 100 mounted on the aging board 20 accommodated in the aging chamber 11, while applying a power supply voltage and a signal to the DUT 100, thereby performing screening of the DUT 100. It should be noted that the thermal stress applied to the DUT 100 may be a thermal stress at room temperature or a high temperature (e.g., about +25°C to +180°C).

[0023] like Figure 1 As shown, the aging chamber 11 is divided by an insulating wall, etc., and has a constant temperature chamber 111 that can accommodate the aging board 20, and a door 112 that can open and close the constant temperature chamber 111. In the constant temperature chamber 111, a plurality of slots 113 for holding the aging board 20 are provided. Each slot 113 has a pair of guide rails 114 supporting the left and right ends of the aging board 20. While the aging board 20 slides on the guide rails 114, it is moved into the constant temperature chamber 111 through the door 112. Two rows of 24-level slots 113 are provided in the constant temperature chamber 111, which can accommodate a total of 48 aging boards 20.

[0024] It should be noted that in this figure, one door (the door on the right side of the figure) is not shown, and the constant temperature chamber 111 is shown in an open state. In contrast, the other door 112 (the door on the left side of the figure) is shown in a closed state, and accordingly, the 24-level slots 113 on the left side of the figure are not shown. It should be noted that the number and configuration of the slots 113 (i.e., the number of aging boards 20 that can be accommodated in the constant temperature chamber 111 and the positional relationship) are not limited to Figure 1 The examples shown can be arbitrarily set in consideration of test efficiency and the like.

[0025] Furthermore, the aging chamber 11 is provided with a temperature adjustment unit composed of an evaporator 116, a heater 117, and a fan 118, and the temperature in the constant temperature chamber 111 can be adjusted by the temperature adjustment unit. Specifically, the air in the constant temperature chamber 111 is blown to the outside by the fan 118. Figure 1 While air is sent and circulated in the direction of the arrows shown, it is cooled by the evaporator 116 or heated by the heater 117 , thereby adjusting the temperature in the constant temperature chamber 111 .

[0026] like Figure 2As shown, a temperature sensor 119 for measuring the temperature inside the constant temperature chamber 111 is provided inside the constant temperature chamber 111. In addition, the aging device 1 includes a control device 80 that controls the entire aging device 1. The temperature sensor 119 is electrically connected to the control device 80, and a detection signal of the temperature sensor 119 is output to the control device 80. Based on the temperature inside the constant temperature chamber 111 detected by the temperature sensor 119, the control device 80 controls the operation of the evaporator 116, the heater 117, and the fan 118.

[0027] The wall 115a on the back side of the wall 115 of the aging chamber 11 that divides the constant temperature room 111 includes a top plate 40 that separates the heat insulation chamber 30 from the aging chamber 11. When viewed from the front of the aging chamber 11, the top plate 40 is arranged on the inner side of each slot 113. The top plate 40 is a wiring board, and includes a substrate 41 and a connector 42 provided on one main surface of the substrate 41, and the connector 42 can be engaged with the connector 23 of the aging board 20 inserted into the slot 113. The aging board 20 is electrically connected to the top plate 40 by the connector 23 and the connector 42 being engaged.

[0028] In addition, the top plate 40 is provided with a connector 43 on the surface opposite to the surface provided with the connector 42. The connector 43 can be fitted with a connector 52 of a function board 50 described later. When the connector 43 and the connector 52 are fitted, the top plate 40 and the function board 50 are electrically connected.

[0029] like Figure 2 as well as Figure 3 As shown, the heat-insulating chamber 30 is a substantially rectangular parallelepiped space divided by the wall 115a and the wall 60 of the aging chamber 11. The heat-insulating chamber 30 is separated from the constant temperature chamber 111 of the aging chamber 11 by the top plate 40, and is separated from the outside air by the wall 60. In this embodiment, a portion of the wall 115a is formed with a space facing the inside of the constant temperature chamber 111 ( Figure 2 The bottom surface of the recess 115b is formed by the top plate 40. The wall 60 is a plate-shaped member made of a metal material such as SUS, and is provided in a manner to be located inside the recess 115b opposite to the top plate 40. In the present embodiment, the space divided by the recess 115b of the wall 115a and the wall 60 is used as the heat insulating chamber 30. Dry air is supplied to the heat insulating chamber 30 from the dry air supply device 70 described later.

[0030] It should be noted that in this embodiment, the wall 60 is located inside the recess 115b of the wall 115a, but the present invention is not particularly limited thereto. For example, the main surface of the wall 60 may be larger than the opening of the recess 115b, and the wall 60 may be installed on the outside of the wall 115a of the aging chamber 11 in a manner covering the recess 115b. In addition, the material constituting the wall 60 is not particularly limited to the above-mentioned materials, and for example, the wall 60 may be made of a resin material.

[0031] like Figure 4 As shown, an opening 61 is formed in the wall 60, and the functional board 50 enters the inner side of the heat insulation chamber 30 through the opening 61. The opening 61 is not particularly limited, but the same number as the number of the aging board 20 and the functional board 50 is provided.

[0032] The function board (test board) 50 is a wiring board, and includes a substrate 51 , a connector 52 , and a control circuit 53 . The function board 50 inputs a voltage and a signal to the DUT 100 mounted on the burn-in board 20 .

[0033] like Figure 4 As shown, a portion of the functional board 50 (the first portion P 1 ) enters the interior of the heat insulation chamber 30 through the opening 61 of the wall 60, and the connector 52 of the function board 50 is engaged with the connector 43 of the top plate 40. By engaging the connector 52 with the connector 43, the function board 50 is electrically connected to the top plate 40. Figure 2 As shown, the control circuit 53 is mounted on the substrate 51 and controls the input of voltage and signals to the burn-in board 20. The control circuit 53 is electrically connected to the control device 80 and is controlled by the control device 80.

[0034] like Figure 4 As shown, a sealing member 62 is provided on the wall 60 to seal the gap between the opening 61 and the functional plate 50. The material constituting the sealing member 62 is not particularly limited, and a resin material such as silicone rubber can be exemplified. By providing the sealing member 62, the constant temperature room 111 can be further insulated from the outside air.

[0035] The aging device 1 includes a fan 90 for cooling the functional board 50. Although not particularly limited, the fan 90 is provided in a box 91 (see FIG. 1 ) which is provided adjacent to the aging chamber 11 and supports a plurality of functional boards 50. Figure 2 The fan 90 is always running during the aging test to supply air to the second portion P of the functional panel 50. 2 The fan 90 is provided to cool the functional board 50 by blowing air to the substrate 51 at the functional board 50. The position of the fan 90 is not particularly limited thereto. For example, the fan 90 may also be provided on the substrate 51 of the functional board 50.

[0036] return Figure 2The aging device 1 further includes a dry air supply device 70. The dry air supply device 70 is connected to the heat insulation chamber 30 via a supply path 71, and supplies dry air to the heat insulation chamber 30 during the aging test.

[0037] The temperature of the dry air supplied by the dry air supply device 70 is not particularly limited, and is room temperature (25°C). Although not particularly limited, during the aging test, dry air is always supplied to the insulation chamber 30 at a fixed amount. By supplying dry air to the insulation chamber 30, the dew point in the insulation chamber 30 can be lowered, and condensation in the insulation chamber 30 and the functional board 50 can be suppressed. The dew point temperature of the dry air under atmospheric pressure is not particularly limited, and is below -50°C, preferably below -70°C.

[0038] The dry air supply device 70 is connected to a heating device 72 via a supply path 71. That is, the heating device 72 is provided in the supply path 71 connecting the dry air supply device 70 and the heat insulating chamber 30. By heating the dry air with the heating device 72, the temperature of the dry air supplied to the heat insulating chamber 30 can be adjusted within a range from room temperature to 150°C. By supplying heated dry air to the heat insulating chamber 30, the dew point in the heat insulating chamber 30 can be lowered, and the functional panel 50 (particularly the first portion P entering the heat insulating chamber 30) can be heated. 1 ). Thus, even when the temperature of the constant temperature room 111 is low, it is possible to suppress condensation from occurring in the heat insulating room 30 and the functional panel 50.

[0039] The dry air supply device 70 and the heating device 72 are electrically connected to the control device 80 and controlled by the control device 80. Figure 2 In the figure, the dry air supply device 70 and the heating device 72 are shown separately, but the present invention is not particularly limited to this. The dry air supply device 70 and the heating device 72 may be an integrated device.

[0040] The control device 80 is constituted by, for example, a computer. Although not particularly illustrated, the computer is an electronic computer having a CPU (processor), a main storage device (RAM, etc.), an auxiliary storage device (hard disk, SSD, etc.), and an interface. The control described below is functionally realized, for example, by the control device 80 executing a program. It should be noted that the control device 80 may be constituted by a circuit substrate instead of a computer.

[0041] In addition to controlling the applied voltage and applied signal to DUT100 and controlling the temperature adjustment in the constant temperature chamber 111, the control device 80 also judges the DUT100 that has an abnormal reaction in the aging test as a defective product, stores the serial number of the DUT100 (for example, the serial number corresponding to the number of the slot 113 and the position on the aging board 20), and feeds back the test results.

[0042] Furthermore, the control device 80 controls the dry air supply device 70 and the heating device 72 as follows according to the temperature of the constant temperature room 111 .

[0043] That is, when the temperature Tc in the constant temperature room 111 measured by the temperature sensor 119 is higher than the given temperature T1 (Tc ≥ T1), the control device 80 determines that the temperature in the constant temperature room 111 is high temperature, and controls the dry air supply device 70 and the heating device 72 so as to supply dry air at room temperature to the heat insulating room 30. That is, in this case, the control device 80 controls the dry air supply device 70 and the heating device 72 so as to supply dry air from the dry air supply device 70 to the heat insulating room 30, but does not heat the dry air.

[0044] On the other hand, when the temperature Tc in the constant temperature room 111 measured by the temperature sensor 119 is lower than the given temperature T1 (Tc<T1), the control device 80 determines that the temperature in the constant temperature room 111 is low, and controls the dry air supply device 70 and the heating device 72 so as to supply heated dry air to the heat insulating room 30. That is, in this case, the control device 80 controls the dry air supply device 70 and the heating device 72 so as to supply dry air from the dry air supply device 70 to the heat insulating room 30 while heating the dry air.

[0045] The given temperature T1 is not particularly limited, and is a temperature below 0°C (T1≤0°C), preferably below -5°C, and more preferably below -10°C. As an example of the temperature T2 of the heated dry air, for example, it is above 40°C (T2≥40°C). It should be noted that the temperature T2 of the heated dry air is not particularly limited to the above temperature as long as it is higher than normal temperature, and can be appropriately adjusted according to the temperature in the constant temperature chamber 111. In this way, by supplying dry air whose temperature is appropriately adjusted according to the temperature Tc in the constant temperature chamber 111 to the insulation chamber 30, the dew point in the insulation chamber 30 can be controlled, and the functional panel 50 can be heated, which can further suppress condensation in the insulation chamber 30 and the functional panel 50.

[0046] In addition, when a high-temperature thermal stress is applied to the DUT 100, the cooled dry air may be supplied to the heat-insulating chamber 30. That is, when the temperature Tc in the constant-temperature chamber 111 is 100°C or higher (Tc ≥ 100°C), the cooled dry air may be supplied to the heat-insulating chamber 30. An example of the temperature T3 of the cooled dry air is -10°C or lower (T3 ≤ -10°C).

[0047] As described above, the aging device 1 in this embodiment does not use a relay board, a relay cable, etc. for connecting the aging board 20 and the function board 50, but the aging board 20 and the function board 50 are connected via the top plate 40 and the connectors 23, 42, 43, 52. Therefore, it is not necessary to provide a space for accommodating a relay board and a relay cable in the device, and the number of DUTs 100 that can be measured per unit area occupied by the aging device 1 can be increased.

[0048] In addition, in this embodiment, the aging board 20 and the functional board 50 are not electrically connected via a relay board or a relay cable, and the communication path between the aging board 20 and the functional board 50 is shorter than that of previous aging devices equipped with a relay board, etc., thereby reducing the transmission loss of the signal from the functional board 50 to the aging board 20.

[0049] In addition, in the present embodiment, by supplying heated dry air to the heat insulation chamber 30, the function board 50 can be heated, and condensation on the function board 50 can be further suppressed. Therefore, in the present embodiment, even if a part of the function board 50 (P 1 ) enters the heat-insulating chamber 30, and condensation can also be suppressed on the functional board 50. Thus, in this embodiment, other components that relay the aging board 20 and the functional board 50 can be omitted to reduce the device size of the aging device 1, and condensation can be suppressed on the functional board 50.

[0050] It should be noted that the above-described embodiments are recorded to make the present invention easy to understand, and are not recorded to limit the present invention. Therefore, the gist of the various elements disclosed in the above-described embodiments is that all design changes and equivalents belonging to the technical scope of the present invention are also included. Explanation of symbols

[0051] 1: Aging device 11: Aging chamber 111: Constant Temperature Room 112: Door 113: Slot 114: Guide rail 115: wall 116: Evaporator 117: Heater 118: Fan 119: Temperature sensor 20: Aging board 21: Substrate 22: Socket 23: Connector 30: Insulated room 40: Top plate 41: Substrate 42, 43: Connectors 50: Function board 51: Substrate 52: Connector 53: Control circuit 60: wall 61: Opening 62: Sealing components 70: Dry air supply device 71: Supply Road 72: Heating device 80: Control device 90: Fan 91: Cabinet 100: DUT.

Claims

1. An aging device, comprising: A burn-in board having a socket equipped with a DUT, a first substrate on which the socket is mounted, and a first connector mounted on the first substrate; a chamber that receives the aging board; an insulating chamber separated from the chamber by a first wall and separated from external air by a second wall; and A functional board comprising a second substrate and a second connector mounted on the second substrate, The first wall includes a top plate, the top plate having a third substrate, a third connector mounted on one main surface of the third substrate, and a fourth connector mounted on the other main surface of the third substrate. The aging board is electrically connected to the top board by engaging the first connector with the third connector. The functional board enters the interior of the heat insulation chamber through the opening formed in the second wall. The function board is electrically connected to the top plate by the engagement of the second connector with the fourth connector.

2. The aging device according to claim 1, wherein: The aging device includes a dry air supply device that supplies dry air to the heat insulation chamber.

3. The aging device according to claim 2, wherein: The aging device includes a heating device for heating the dry air.

4. The aging device according to claim 3, wherein: The aging device comprises: a temperature sensor that measures the temperature within the chamber; and A control device controls the heating device based on the measurement result of the temperature sensor.

5. The aging device according to claim 4, wherein: The control device controls the heating device to heat the dry air when the temperature in the chamber is lower than a given temperature, and not to heat the dry air when the temperature in the chamber is higher than the given temperature.

6. The aging device according to claim 5, wherein: The given temperature is a temperature value below 0°C.

7. The aging device according to claim 1 or 2, wherein: The burn-in device includes a sealing member that seals between the opening of the second wall and the functional board.

8. The aging device according to claim 1 or 2, wherein: The function board includes: A first portion that enters into the interior of the heat-insulating chamber through the opening; and The second part is located outside the insulation chamber.

9. The aging device according to claim 8, wherein: The aging device includes a fan that sends air to the second portion to cool the functional panel.

10. The aging device according to claim 1 or 2, wherein: The function board includes a control circuit, which is mounted on the second substrate and inputs and outputs signals to and from the DUT.

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