Packaging equipment and method for animal and plant illumination light source

Abstract

The invention relates to a packaging device and method for an animal and plant illumination light source, and the device comprises a microscope which amplifies an image of an LED material; the conveying belt is used for conveying a to-be-detected material and staying at the same detection position; the central processing unit is in data connection with the microscope and the conveyor belt, can receive the image, divides the image amplified by the microscope into a plurality of areas, compares the areas with a standard drawing, and judges whether the areas where the pixel points of the image of the to-be-detected material are located correspond to the areas where the pixel points of the standard image are located or not; checking whether stains and uneven points exist on the surface of the material, whether the size and the electrode size are consistent and whether the electrode pattern is complete, scoring pixel points corresponding to a standard picture, finally calculating a difference value with a standard score, and deleting the number exceeding a threshold value from a pipeline system. Aiming at the problem that the detection efficiency is low in the light source packaging process, unqualified products can be effectively screened out through multiple times of image comparison and screening out, and the detection efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of aquaculture lighting, and in particular to a packaging device and method for an animal and plant lighting source. Background Art

[0002] Over the years, domestic and foreign scholars have made unremitting explorations on the application of LED light sources in the field of plant lighting and have made important progress. First, the effects of red and blue light and their combined light sources on plant growth and development were studied, which fully proved the feasibility of using red and blue light as a light source to cultivate plants. Tanaka et al. used LED for plant cultivation, and the results showed that when the duty cycle reached 25% to 50%, plant growth could be accelerated. Composite light quality is more suitable for plant growth than single light quality, and plants can be cultivated normally. In my country, some research and reports have been conducted on the application effects of LED in seedling cultivation, vegetable cultivation and greenhouse lighting, and its energy-saving effect is significant. LED has been successfully used in plant cultivation, and has made important progress in plant lighting, tissue culture, plant factories and aerospace fields.

[0003] Packaging is a key link in the preparation of white light LEDs, but the luminescence mechanism of semiconductor materials determines that a single LED chip cannot emit continuous spectrum white light. Therefore, the process must mix two or more complementary colors of light to form white light. Currently, there are three main methods to achieve white light LEDs: blue light LED + YAG yellow phosphor, RGB three-color LED, ultraviolet LED + three-color phosphor, and the realization of self-illuminating LEDs is in the packaging link. Good process precision control and good materials and equipment are the guarantee of the consistency of white light LED devices.

[0004] LED glue potting is a key process after the die bonding and wire bonding process in the LED packaging process. It protects the PCB circuit board with the die bonded and wire bonded. It involves processes such as glue preparation, glue injection and degassing. The quality of the glue potting result directly affects the yield rate. The technical difficulty lies in solving the bubble problem in the sealing glue.

[0005] The purpose of LED testing is to check whether the LED can emit light normally and to distinguish bad lights.

[0006] In the prior art, CN106896308A discloses a method and device for detecting an LED packaging module. The method includes the following steps: providing an LED packaging module, which includes a plurality of LED chips connected in series; applying a detection current to the LED packaging module; detecting the total voltage and / or total brightness of the LED packaging module; judging whether the total voltage and / or the total brightness are within a preset range. If so, none of the plurality of LED chips leak electricity; if not, at least one LED chip leaks electricity. The device detects whether an LED packaging module having a plurality of LED chips connected in series leaks electricity by applying a detection current to detect the total voltage and / or total brightness. The detection process is very simple, but the inspection efficiency is low, and the inspection of the finished product causes a waste of energy and materials in the packaging process steps, and recycling is time-consuming and labor-intensive.

[0007] In addition, on the one hand, there are differences in understanding among those skilled in the art; on the other hand, the inventor studied a large number of documents and patents when making the present invention, but due to space limitations, not all details and contents are listed in detail. However, this does not mean that the present invention does not have the characteristics of these prior arts. On the contrary, the present invention already has all the characteristics of the prior art, and the applicant reserves the right to add relevant prior art to the background technology. Summary of the invention

[0008] In the process of sealing glue, the existing technology is to adjust the speed of the roller of the sealing machine according to the size of the bracket bowl. The deeper the bowl, the slower the speed of the roller. At the same time, the gluing time is adjusted to be longer. Too long time will affect the packaging speed. Too short time will cause the colloid to not stick to the bowl and produce bubbles. It is best to make the colloid just stick to the bracket bowl. If the bracket bowl is shallow, it is the opposite. At the same time, the distance between the bracket and the roller should be adjusted. The edge of the bracket bowl should just touch the roller. When the spacing between the bracket and the roller is too close, the roller will wear off the coating of the bracket when rotating and produce debris. When the spacing between the bracket and the roller is too loose, the individual brackets will be slightly deformed and cannot stick to the glue, resulting in bubbles in the cup. Therefore, all parameters and mechanical parts must be adjusted to the right level. These need to be adjusted by operators or maintenance personnel every time the machine model is changed, but some factories have to change many models every day, so the error rate increases. Alternatively, a heating rod can be set in the bracket part. When the bracket is heated, the colloid will become thinner and the flow rate will be accelerated, so that it will flow down quickly along the edge of the bracket bowl and cup, so the bubbles in the cup can be squeezed out. However, there are cylinders and many air pipes around the bracket part, so the heating rod is needed to heat only the bracket part, but not other parts. This requires adding an insulator around the bracket part to prevent damage to other parts. This makes modification difficult and increases costs. Some companies are unwilling to adopt it because of the high cost. In addition, in the detection stage, the current existing technology is to power on all finished products to screen out dead lights - bad products. The detection efficiency is low and a lot of manpower is consumed. Therefore, the bubble handling during the sealing process and how to improve the detection efficiency are difficult. Since bubbles will grow larger over time and affect the life of the lamp beads, bubbles in LED lamp beads are a very serious problem. First, the light emitted is refracted by the bubbles, and the lighting effect changes. At the same time, the heat emitted by the LED lamp beads makes the air in the bubbles heat up and expand. There will be oxygen in the bubbles, and the chip is prone to oxidation at high temperatures, which can easily cause dead lights, shortened service life and other problems. The bubbles can even expand and contract due to heat, causing the colloid to change color, which in turn causes color difference in the light of the translucent LED lamp beads.

[0009] In order to improve the effect of LED lamp bead packaging process, the prior art has already appeared a technical solution to improve the intervention optimization effect of bubbles in the LED lamp bead packaging process by performing image detection on the bubble distribution information. For example, CN115472520A discloses a method and system for detecting the packaging process of direct-insertion LED lamp bead, wherein the method includes: performing image acquisition on the packaging process of the target object to obtain the first packaging image information, and then performing image extraction on the bonding process of the target object to obtain the first bonding image information; performing temperature acquisition on the outer wall of the bonding container to obtain dynamic bonding temperature information; inputting the first bonding image information and the dynamic bonding temperature information into the material bonding evaluation model for training to generate the material bonding evaluation distribution result corresponding to any time point; performing image screening on the bubbles accompanying the target object in the bonding process to obtain the corresponding bubble distribution information at any time point, based on which data optimization is performed on the material bonding evaluation distribution result to obtain the target bonding image corresponding to the target temperature, so as to facilitate the comparison and detection of the subsequent packaging process of the target object. This technical solution can intervene and optimize the evaluation results based on the bubbles in the potting process displayed by the image, and can compare and detect the subsequent packaging process of the lamp beads based on the obtained preheating temperature under the desired state and its corresponding packaging image, so as to achieve accurate temperature preheating of the lamp beads during the potting process, so that the bubbles that appear can be removed in time. However, this technical solution only uses the bubble image information under the macroscopic state as the basis for image screening, and the bubble image information is only used as the basis for adjusting the potting preheating temperature. At this time, the bubble distribution information is only used as an optimization parameter for the material adhesion evaluation distribution result, and it cannot be directly used as a judgment factor for the quality of LED materials. In addition, the bubble distribution information in this technical solution does not involve specific position parameter information, and it is even more impossible to determine the cause of the bubbles in the LED lamp through the bubble position distribution information.

[0010] In view of the shortcomings of the prior art, the present application proposes a packaging device for animal and plant lighting sources, including a microscope, a conveyor belt and a central processing unit. The microscope is used to receive shooting instructions to magnify the image of the LED material and transmit it to the central processing unit. The conveyor belt is arranged under the microscope to convey the material to be tested to ensure that the material tested each time stops at the same detection position of the microscope. The central processing unit is data-connected to the microscope and the conveyor belt to receive the image of the LED material. The central processing unit is also configured to: 1. divide the image magnified by the microscope into multiple areas for comparison with the standard image 2. determine whether the area where the pixel points of the image of the LED material to be tested are located corresponds to the area where the pixel points of the standard image are located, so as to check the state of the surface of the LED material to be tested 2. score the pixel points in the image of the LED material to be tested that correspond to the standard image, so as to calculate the difference between the score of the image of the LED material to be tested and the standard score; associate the corresponding number of the image of the LED material to be tested whose difference exceeds the threshold with an associated mark. Unlike the prior art, the present invention can evaluate the quality of the surface of LED materials based on the image information obtained under the microscopic state, that is, by dividing the image magnified by the microscope into multiple areas for comparison with the standard drawing, and then judging whether the area where the pixel points of the image of the material to be tested are located corresponds to the area where the pixel points of the standard image are located. Based on the above-mentioned distinguishing technical features, the problems to be solved by the present invention may include: how to detect the surface quality of LED materials on the assembly line to improve the efficiency of LED material quality inspection. Specifically, since the size of the LED chip itself is relatively small, if the conventional image processing method is used to compare the images of all LED material surfaces, the amount of image data processing will be significantly increased, which is contrary to the LED material quality inspection requirements that need to be processed quickly on the assembly line. To this end, the present invention converts a large amount of macroscopic image data processing process into an enlarged image obtained by a microscope for analysis, and combines statistical principles to reduce a large number of image processing processes, thereby significantly improving the efficiency of LED material quality inspection on the assembly line. Since there are differences in the workmanship of the materials to be tested, a threshold of error can be set, and those within the threshold range can be considered qualified. The threshold can be determined according to the actual situation or according to statistical principles. For example, if it is set to 5% of the standard score, the normal rate of the detected materials can reach 99%, which can achieve the actual desired qualified rate. Then the set threshold is reasonable. Preferably, the microscope can be an interference microscope, which can use the interference principle of light waves and the non-contact detection characteristics of the microscope to measure extremely small height differences on the surface of the sample, measure the surface lines of parts, the depth of coatings, etc., and can also measure the surface of particle processing lines with special accessories. Therefore, the microscope can measure the location of the bubble and transmit the position data to the central processing unit. Preferably, the central processing unit is also configured to detect the light package based on the final design light emission mode of the light.The results of testing the light package based on the final designed light emission mode of the light include "defective" LEDs and qualified LEDs.

[0011] According to a preferred embodiment, the surface status of the LED material to be tested includes whether there are stains and uneven spots on the material surface, whether the size and electrode size are consistent, and whether the electrode pattern is complete.

[0012] According to a preferred embodiment, the central processor sends a shooting instruction to the microscope at least when the conveyor belt stops transporting the LED material to be tested, so that the microscope can at least capture the image of the LED material to be tested when the conveyor belt stops.

[0013] According to a preferred embodiment, a chip expander is included. Since the LED chips are still closely arranged with a small spacing (about 0.1mm) after dicing, it is not conducive to the operation of subsequent processes. Therefore, a chip expander is used to expand the film bonding the chips and stretch the spacing of the LED chips to about 0.6mm. The chip expander can expand the film bonding the chips to expand the arrangement spacing of the LED chips after dicing.

[0014] According to a preferred embodiment, a vacuum degassing machine is included to remove bubbles in the colloid by centrifugation in a vacuum environment.

[0015] According to a preferred embodiment, a high-speed crystal bonding machine is included, which is used to fix the light-emitting chip in the bowl of the lead frame with a universal adhesive, wherein the universal adhesive is a conductive silver glue or a heat-dissipating insulating glue. Preferably, the conductive silver glue is used for single-welding electrode chips, such as red, yellow, orange, and yellow-green light, while the heat-dissipating insulating glue is used for double-welding electrode chips, such as blue and pure green light. When the bowl of the bracket is too deep, since the colloid has a certain viscosity, the colloid does not have time to flow from the edge of the bracket bowl to the bottom of the bracket cup, and the bracket bowl is already full, blocking part of the air in the cup to form bubbles in the cup. Preferably, the central processing unit can control the glue wheel of the high-speed crystal bonding machine to glue on the bracket for 0.3s and then leave for 3.5s, and then glue for 2.5s to fill the bracket bowl. The first gluing for 0.3s is to allow a small amount of colloid to slowly flow down from the edge of the bracket bowl, squeeze out the air at the bottom of the bracket cup, make the bracket bowl shallower, and eliminate the factor that the bottom of the cup is too deep to prevent air from being discharged. The second gluing for 2.5s is to fill the bracket bowl, thus solving the problem of bubbles in the bowl.

[0016] According to a preferred embodiment, after the LED material to be tested is processed by a wafer expander, a vacuum degassing machine and a high-speed die bonding machine in sequence via a conveyor belt, the conveyor belt stops to stop the LED material to be tested at a position for microscope control.

[0017] According to a preferred embodiment, the microscope is at least capable of capturing an image of the LED material to be tested after solidification when the conveyor belt is stagnant, so that the central processing unit can compare the image of the LED material to be tested after solidification with a standard image for scoring, thereby screening out the LED material to be tested with bubbles and the corresponding numbers, and sending the screened LED material to be tested with bubbles back to the vacuum degassing machine via the conveyor belt for further removal.

[0018] Here, the materials after die bonding are re-tested and screened to avoid further manipulation of the materials in the subsequent processing stages. Therefore, there is no need to eliminate unqualified materials during the processing. In the final stage, only the processed materials are selected for testing, which can screen out most of the unqualified products and improve the detection efficiency and accuracy.

[0019] According to a preferred embodiment, the device further includes a high-speed powder sprayer and a glue dispenser. The high-speed powder sprayer is used to spray phosphor into the lead frame cup with soldered wires to cover the LED material to be tested. The glue dispenser dispenses silver glue or insulating glue at the corresponding position of the LED material to be tested. The microscope is also configured to detect the irradiation parameters of the lamp bead of the LED material to be tested that is equipped with a light-emitting chip and phosphor and powered on, wherein the LED material to be tested has been glue dispensed at least once.

[0020] Since there are many reasons for the generation of bubbles in LED lights, the central processing unit issues a first warning based on the position data measured by the microscope when the bubbles are distributed on the surface of the colloid or wafer. Preferably, when the central processing unit issues the first warning, it checks whether there are bubbles remaining in the cavity of the front dispensing head of the glue dispenser. If there are bubbles, the bubbles can be effectively removed by endotracheal expulsion. During the expulsion process, the air pressure is less than 0.5Mpa to prevent the syringe from rupturing; preferably, when the central processing unit issues the first warning, and there are no residual bubbles in the cavity of the front dispensing head of the glue dispenser after inspection, it may be because the components of the glue dispenser are not completely sealed or leaking. At this time, tighten the sealing ring and knob components of the single connection; preferably, when the central processing unit issues the first warning, and the cavity of the front dispensing head of the glue dispenser after inspection If there are no residual bubbles in the body, it may be due to incomplete degassing of the adhesive itself. The vacuum degassing machine can receive the first warning, and remove the bubbles in the colloid by vacuuming after centrifugation. The degassing time of the adhesive is determined based on the number of bubbles. The degassing time may be 15 seconds for every 3 bubbles. Preferably, when the central processing unit issues the first warning, and there are no residual bubbles in the cavity of the front dispensing head of the dispensing machine after inspection, and there are still bubbles after the vacuum degassing machine performs the degassing operation, it may be due to moisture absorption during storage or use of the adhesive. At this time, the adhesive used should be dried or a spare adhesive should be used.

[0021] According to a preferred embodiment, when bubbles are distributed in the insulating tape at the bottom of the bracket, the central processing unit issues a second warning. Preferably, when the central processing unit issues the second warning, the air tightness of the bracket is checked. If the air tightness of the bracket itself is poor, the bracket is replaced. Preferably, when the central processing unit issues the second warning and the air tightness of the bracket is good, check whether there is a gap or fault between the silver layer of the bracket and the insulating tape. If there is a gap or fault between the silver layer of the bracket and the insulating tape, the gap or fault needs to be repaired.

[0022] According to a preferred embodiment, when the bubbles are distributed at the bottom of the bowl and on the side of the wafer under the gold line, the central processing unit issues a third warning. Preferably, when the central processing unit issues the third warning, the dispensing speed of the dispensing machine is appropriately lowered. Different from the prior art, the central processing unit of the present invention is able to detect the position distribution information of the bubbles based on the position data measured by the microscope, so as to adjust the corresponding equipment control or operating parameters according to the different position information of the bubble distribution. Based on the above-mentioned distinguishing technical features, the problems to be solved by the present invention may include: how to determine the cause of the bubble generation of the LED lamp according to the bubble position, and adjust the relevant equipment operating parameters on the assembly line according to the cause of the bubble generation obtained by analysis, so as to timely avoid the re-generation of bubbles in the subsequent continuous production process. Preferably, when the central processing unit issues the third warning and there are still bubbles after the dispensing speed of the glue dispenser is lowered, the position of the adhesive is checked at this time. If the pre-set initial position of the needle is unreasonable, the height of the needle is unreasonable, and the mechanical or fixture deviation or the bracket fluctuates during the bonding process, or the operator fails to place the bracket uniformly as required and deviates from the reasonable position of the needle, the central processing unit finds a suitable adhesive position based on the structure of the bracket itself and the fact that the adhesive generally flows along the cup wall, wherein the height of the needle increases with the increase of the amount of glue dispensed; preferably, when the central processing unit issues the third warning and there are still bubbles after the dispensing speed of the glue dispenser is lowered and the adhesive position is correct, it may be due to the moisture absorption of the bracket or poor surface fluidity. At this time, the bracket is dehumidified and kept warm in a 60-degree oven after dehumidification, wherein the insulation temperature is generally set at 40-60 degrees.

[0023] According to a preferred embodiment, the equipment includes a wire bonding machine. Preferably, a high-speed wire bonding machine can be used to connect the chip electrodes and the lead frame through gold wires, and the gold wires used are made of 99.99% pure gold.

[0024] According to a preferred embodiment, a high-speed powder sprayer is included, which can spray fluorescent powder into the lead frame bowl with soldered wires to cover the light-emitting chip. Preferably, since the LED bulb is a point light source, the diffusion cover of the LED bulb must have the characteristics of high light transmittance, uniform illumination, large light output angle, and no irritation to the eyes. Therefore, powder electrostatic spraying technology can be used. Under a high-voltage electrostatic field, the powder spray gun is connected to the negative pole, and the LED bulb is grounded (positive pole) to form a loop. The powder is sprayed from the spray gun with the help of compressed air, that is, it carries a negative charge, and is sprayed onto the bulb shell and solidified according to the principle of opposites attracting each other.

[0025] According to a preferred embodiment, the central processing unit is configured to determine the light-emitting mode of the LED material to be tested in the following manner: based on the calibration value of the illumination parameter, determine whether the packaging of the prepared LED material is qualified; if it is determined to be qualified, control the conveyor belt to perform the next step of processing according to the normal packaging process; if it is determined to be unqualified, match the lamp beads in several LED materials based on the range of illumination parameters pre-stored in the preset light-emitting mode to select several LED materials to form a lighting device that can meet the packaging standards.

[0026] According to a preferred embodiment, the central processing unit is also configured to: when at least one matching range of illumination parameters is matched, calibrate the lamp beads corresponding to the illumination parameters in a program or circuit so that the lamp beads can be controlled in the circuit logic to be applied in a lighting mode that is suitable for the matched range of illumination parameters.

[0027] A packaging method for an animal and plant lighting source comprises the following steps: receiving a shooting instruction to magnify and transmit an image of an LED material; transmitting a material to be tested to ensure that the material to be tested stops at the same testing position each time; receiving an image, and dividing the magnified image into a plurality of regions for comparison with a standard drawing, judging whether the region where the pixel points of the image of the material to be tested are located corresponds to the region where the pixel points of the standard image are located, so as to check whether there are stains and uneven points on the surface of the material, whether the size and electrode size are consistent, and whether the electrode pattern is complete, and scoring the pixel points corresponding to the standard image, and finally calculating the difference with the standard score, and making an associated mark for the number exceeding the threshold.

[0028] According to a preferred embodiment, the image of the material after solidification is compared with the standard drawing, and the score is given. The numbers corresponding to the materials with bubbles are screened out and deleted or associated with the system. If the number of deleted numbers or associated with the numbers of the same batch exceeds the threshold, a prompt is issued. When the number of deleted numbers or associated with the numbers of the same batch exceeds the threshold, it indicates that the unqualified rate in the solidification stage has increased, and there may be unqualified colloids used for solidification, so the colloids need to be reprocessed, thereby improving the qualified rate of finished products.

[0029] According to a preferred embodiment, a TPX material molding mold bar is included, and after liquid epoxy is poured in, a semi-finished product with welded wires or dotted with phosphors is inserted into the mold bar and cured by high-temperature baking.

[0030] According to a preferred embodiment, a pin cutting mold is included, and the pin cutting mold can separate the pins of the cured edge body LED.

[0031] According to a preferred embodiment, a testing machine is included to test the LEDs that have been cut once, and select those with electrical abnormalities. Preferably, materials with leakage current or forward voltage drop that do not meet the requirements and materials with poor appearance can be selected, and poor appearance can be bubbles, debris or black spots.

[0032] According to a preferred embodiment, a glue dispenser is included to dispense silver glue or insulating glue at the corresponding position of the LED bracket. Preferably, for red, yellow, and yellow-green chips with GaAs and SiC conductive substrates and back electrodes, silver glue is used. For blue and green LED chips with sapphire insulating substrates, insulating glue is used to fix the chips.

[0033] According to a preferred embodiment, a glue preparation machine is included, and the glue preparation machine can be used to first apply silver glue on the back electrode of the LED, and then the LED with silver glue on the back is installed on the LED bracket.

[0034] According to a preferred embodiment, the lamp housing is formed by stamping a metal plate; the lamp housing includes a bracket panel folded into multiple pieces, the bracket panel is provided with a mounting interface, and the mounting interface is provided with an LED bulb; the lamp housing is fixed to the lamp pole through a lamp pole fixing member. It also includes a wiring harness connector, which is arranged on the lamp housing and is used to connect multiple LED bulbs to a power supply and a control circuit.

[0035] According to a preferred embodiment, the edge of the lamp housing is provided with a folded edge to increase the structural strength. The installation interface includes a surface on the lamp housing that contacts the LED bulb and a connecting hole. The upper portion of the lamp pole fixing piece is a lamp pole fixing hole for connecting the lamp pole.

[0036] According to a preferred embodiment, it includes a metal extruded heat sink and a wiring harness connector formed by an extrusion process, the extruded heat sink is fixed on a lamp pole; the extruded heat sink includes a lamp pole fixing sleeve, heat sinks are provided on both sides of the lamp pole fixing sleeve, and the heat sink is provided with an installation interface for installing LED bulbs; the LED bulb is installed on the installation interface; the wiring harness connector is arranged on the lamp pole fixing sleeve, and the wiring harness connector is used to connect multiple LED bulbs to a power supply and a control circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1It is a hardware structure diagram of a preferred embodiment of a packaging device for an animal and plant lighting source of the present invention;

[0038] Figure 2 It is a flow chart of a preferred embodiment of a packaging method for an animal and plant lighting source of the present invention;

[0039] Figure 3 It is a hardware structure diagram of the production line layout of a preferred embodiment of a packaging device for animal and plant lighting source of the present invention.

[0040] Reference numerals list

[0041] 100: microscope; 200: conveyor belt; 300: central processing unit; 401: wafer expander; 402: vacuum degassing machine; 403: high-speed die bonding machine; 404: wire bonding machine; 405: high-speed powder spraying machine; 406: TPX material forming mold; 407: foot cutting mold; 408: testing machine; 409: glue dispensing machine; 410: glue preparation machine. DETAILED DESCRIPTION

[0042] The present invention is described in detail below with reference to the accompanying drawings.

[0043] In the present application, the associated mark number can be to store the test data and correspond the test data to the number to facilitate secondary review, or it can be deleted in the system and the test data corresponding to the number is stored in the memory. In order to reduce the redundancy of the system's real-time data processing, the present application proposes to delete the number in the assembly line system. However, this operation does not mean that the assembly line system or other related systems cannot obtain the test data of the lamp beads by number when reviewing them. Deleting the number in the assembly line system only means that during the inspection process of the current batch, the lamp beads with the deleted number cannot participate in subsequent inspection, shipment, storage and other operations.

[0044] Preferably, the memory in the present application may be a flash memory, a hard disk, a multimedia card micro memory, a card-type memory (e.g., an SD or XD memory), a random access memory, a read-only memory, a magnetic memory, a magnetic disk or an optical disk. The central processor 300 may be a terminal with data processing capabilities. For example, the central processor 300 may be a notebook computer, a server, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA).

[0045] Example 1

[0046] The present application proposes a packaging device for animal and plant lighting sources, including: a microscope 100, used to receive shooting instructions to magnify the image of LED materials and transmit it to a central processor 300; a conveyor belt 200, which is arranged below the microscope 100 and is used to convey the material to be tested to ensure that the material tested each time stops at the same detection position of the microscope 100; the central processor 300 is data-connected to the microscope 100 and the conveyor belt 200, and can receive images, and divide the image magnified by the microscope 100 into multiple areas and then compare them with the standard drawing, determine whether the area where the pixel points of the image of the material to be tested are located corresponds to the area where the pixel points of the standard image are located, so as to check whether there are stains and uneven points on the surface of the material, whether the size and electrode size are consistent, and whether the electrode pattern is complete, and score the pixel points corresponding to the standard picture, and finally calculate the difference with the standard score, and delete the numbers exceeding the threshold from the pipeline system or make an associated mark. Preferably, the standard drawing can be scored by pixel points, with one pixel being scored as one point. During the test, if the pixel points of the image of the material to be tested correspond to the pixel points of the standard drawing, one point is scored, and if they do not correspond, one point is deducted. Finally, the difference between the score of the image of the material to be tested and the standard score is calculated. Since there are differences in the workmanship of the materials to be tested, an error threshold can be set, and those within the threshold range can be considered qualified. The threshold can be determined according to the actual situation or according to statistical principles. For example, setting it to 5% of the standard score can make the normal rate of the detected materials reach 99%, which can achieve the actual desired qualified rate, so the set threshold is reasonable.

[0047] Preferably, the deletion numbering method is adopted to avoid the manipulation of materials in the subsequent processing stage, so there is no need to remove unqualified materials during the processing process, which can avoid the waste of materials and the consumption of energy and time in the subsequent processing process. In the final stage, only the processed materials are selected for testing, which can screen out most of the unqualified products and improve the detection efficiency and accuracy. Although the method of using associated marking numbers has the problem of large data storage volume, it can provide screening data for the subsequent secondary use of defective products.

[0048] According to a preferred embodiment, the central processing unit 300 can issue a shooting instruction when the conveyor belt 200 stops, and the microscope 100 can at least capture the material image when the conveyor belt 200 stops.

[0049] According to a preferred embodiment, Figure 1 and Figure 3As shown, it includes a wafer expander 401. Slicing refers to a key step in the LED chip manufacturing process. Specifically, in the LED chip manufacturing process, after a series of process steps, such as making two electrodes of the LED-PN junction on the epitaxial wafer, thinning the LED rough wafer, etc., the slicing operation will be performed. The main purpose of slicing is to divide the processed LED rough wafer into individual LED chips. This step usually uses a slicing saw (cutting knife) or scribing stripping technology, using a precise workbench and a scriber or a scriber to cut on the surface of the wafer according to specific pattern rules, so that the wafer is disconnected at the scratch, thereby realizing the separation of individual chips. Since the LED chips are still closely arranged and the spacing is very small (about 0.1mm) after slicing, it is not conducive to the operation of subsequent processes. Therefore, the wafer expander 401 is used to expand the film of the bonded chip and stretch the spacing of the LED chips to about 0.6mm. The wafer expander 401 can expand the film of the bonded chip to expand the arrangement spacing of the LED chips after slicing.

[0050] According to a preferred embodiment, a vacuum degassing machine 402 is included to remove bubbles in the colloid by centrifugation in a vacuum environment.

[0051] According to a preferred embodiment, a high-speed die-bonding machine 403 is included, which is used to fix the light-emitting chip in the bowl of the lead frame with a universal adhesive, wherein the universal adhesive is a conductive silver adhesive or a heat-dissipating insulating adhesive. Preferably, the conductive silver adhesive is used for single-welding electrode chips, such as red, yellow, orange, and yellow-green light, while the heat-dissipating insulating adhesive is used for double-welding electrode chips, such as blue and pure green light.

[0052] According to a preferred embodiment, the microscope 100 can at least collect images of the material after solidification when the conveyor belt 200 is stagnant, and the central processing unit 300 can compare the images of the material after solidification with the standard drawings, score them, screen out the numbers corresponding to the materials with bubbles and delete them from the system, and issue a prompt if the number of deleted numbers of the same batch exceeds the threshold. Preferably, the threshold of the number of deleted numbers of the same batch can be set to 5, that is, when the difference between the actual score of the same batch of materials after solidification is too large and the standard score exceeds 5, the central processing unit 300 issues a prompt, indicating that there is a problem with the solidification step or the colloid used for solidification. At this time, the vacuum degassing machine 402 can receive the prompt and remove the bubbles in the colloid by extracting the gas in the colloid after centrifugation. Preferably, the colloid after the removal operation is used again in the crystal bonding operation, and then tested again. For example, the threshold value of the number of deletion numbers for the same batch can be set to 5. That is, when the difference between the actual score of more than 5 and the standard score of the same batch of materials after crystal bonding is too large, the central processing unit will issue a prompt again. This indicates that the machine operation in the crystal bonding stage is incorrect, and the program should be reset until the production requirements are met.

[0053] According to a preferred embodiment, a wire bonding machine 404 is included. Preferably, a high-speed wire bonding machine can be used to connect the chip electrodes and the lead frame through gold wires, and the gold wires used are made of 99.99% pure gold.

[0054] According to a preferred embodiment, a high-speed powder sprayer 405 is included, which can spray fluorescent powder into the lead frame bowl with soldered wires to cover the light-emitting chip (the LED material to be tested, which is called the light-emitting chip after this step). Preferably, powder electrostatic spraying technology can be used, and an electrostatic generator is used to release high-voltage static electricity (negative electrode) through the electrode needle at the muzzle of the spray gun to the space in the direction of the glass bulb. When the powder particles are sprayed out from the nozzle of the spray needle and pass through the discharge area, they capture a large number of electrons and become negatively charged particles. Under the action of electrostatic attraction, they are adsorbed to the positively charged bulb. When the powder adheres to a certain thickness, the effect of "like repels like" will occur, and the powder can no longer be adsorbed, so that it forms a uniform coating on the surface of the bulb. The residual temperature on the surface of the bulb is used to further solidify the powder layer, and after cooling, it becomes a uniform and firm coating. This can achieve very good results in terms of color temperature consistency and light output effect.

[0055] According to a preferred embodiment, a TPX material molding mold bar 406 is included, and after liquid epoxy is poured in, a semi-finished product with welded wires or dotted with phosphors is inserted into the mold bar and cured by high-temperature baking.

[0056] According to a preferred embodiment, it includes one-time pin cutting: the solidified edge body LED is separated from the pins through a pin cutting mold 407.

[0057] According to a preferred embodiment, a testing machine 408 is included to test the LEDs that have been cut once, and select materials with electrical abnormalities. Preferably, materials with leakage current or forward voltage drop that do not meet the requirements and materials with poor appearance can be selected, and poor appearance can be bubbles, debris or black spots.

[0058] According to a preferred embodiment, a glue dispenser 409 is included to dispense silver glue or insulating glue at the corresponding position of the LED bracket. Preferably, silver glue is used for red, yellow, and yellow-green chips with back electrodes on GaAs and SiC conductive substrates. Insulating glue is used to fix the blue and green LED chips on sapphire insulating substrates.

[0059] According to a preferred embodiment, a glue preparation machine 410 is included, and the glue preparation machine can be used to first apply silver glue on the back electrode of the LED, and then the LED with silver glue on the back is installed on the LED bracket.

[0060] It should be noted that this application Figure 3The LED chip production line shown is only a schematic hardware connection structure diagram in the above production process of this application, and does not mean that each device therein must be arranged according to the shape or connection sequence in the figure. Figure 3 It is also only a schematic diagram of the layout of the LED chip production line of this application.

[0061] The present invention also relates to a packaging method for animal and plant lighting sources, which is used in the detection step of the packaging process, such as Figure 1 As shown, the following steps are included:

[0062] S1: receiving a shooting instruction to enlarge the image of the LED material and transmit it;

[0063] S2: convey the material to be tested to ensure that the material to be tested each time stops at the same testing position; receive the image, and divide the amplified image into multiple areas for comparison with the standard drawing;

[0064] S3: Determine whether the pixel area of ​​the image of the material to be tested corresponds to the pixel area of ​​the standard image, so as to check whether there are stains and uneven points on the surface of the material, whether the size and electrode size are consistent, and whether the electrode pattern is complete, and score the pixel points corresponding to the standard image;

[0065] S4: Calculate the difference from the standard score;

[0066] S5: Delete the numbers exceeding the threshold from the pipeline system;

[0067] S6: Compare the images of the materials that do not exceed the threshold value after die bonding with the standard drawings, score them, and select the numbers corresponding to the materials with bubbles and delete them from the system;

[0068] S7: If the number of deletion numbers in a batch exceeds a threshold, the central processing unit issues a prompt;

[0069] S8: using the colloid after the removal operation for the crystal bonding operation again;

[0070] S9: After another test, if the number of deleted numbers in the same batch exceeds the threshold, the central processing unit will issue a prompt again.

[0071] Preferably, in the lighting equipment for plants and animals targeted by the present invention, since most plants and animals, especially plants, usually require light that is not full-spectrum light, but rather monochromatic light such as red, blue, yellow or purple, for example, some plants mainly require red and blue light bands for photosynthesis, and the remaining light bands are relatively unnecessary, the lighting equipment used for plant and animal growth lighting is usually configured to be able to emit monochromatic light or a combination of several monochromatic lights. From the perspective of the large field of lighting equipment manufacturing, the manufacturing and packaging equipment or processes used for living lighting equipment usually focus on the light consistency of a single main light-emitting lamp bead or each sub-light-emitting lamp bead, that is, it requires focusing on the packaging qualification of each lamp bead, so that each light-emitting lamp bead in each lighting product shipped out of the factory can emit light with uniform light parameters.

[0072] Example 2

[0073] The present application proposes a system for screening lighting equipment based on functional requirements.

[0074] In the field of lighting equipment for animals and plants targeted by the present invention, there is a special point, that is, this type of lighting equipment is usually a combination of multiple lamp beads that emit different light parameters. If the equipment or scheme for light packaging in the prior art is used, more unnecessary waste will be generated. Specifically, when some lamp beads have the problem of "may be unqualified under the existing packaging standards", it does not mean that these lamp beads cannot be used in the combination of lighting equipment for animals and plants. For example, based on the packaging standards of the prior art, a certain light parameter of a certain lamp bead is significantly different from that of other similar lamp beads, indicating that it needs to be corrected. However, in lighting equipment for animals and plants, it may be used in other lighting modes besides the main lighting mode of the chromaticity light to which it belongs, such as the chromaticity of a certain red lamp bead is offset to produce standard chromaticity, but the red lamp bead can be used to combine with other lights to form a combined light to be applied to other lighting needs, such as red light plus blue light to form a purple light band.

[0075] Based on the above problems, the detection unit, that is, the microscope 100 mentioned above, is configured to detect the illumination parameters of the lamp bead. The lamp bead is configured with a light-emitting chip and a fluorescent powder. The lamp bead is also configured in a power-on mode. The light-emitting chip has also been dispensed at least once. The control unit (the control unit can be the central processor 300 mentioned above) is configured to make a judgment in the following manner: first, a judgment is performed based on the calibration value of the illumination parameter. If the judgment is qualified, the next step of the packaging process is controlled to be executed according to the normal process; if the judgment is unqualified, the matching is further performed based on the illumination parameter range pre-stored in the preset light-emitting mode. When at least one illumination parameter range that meets the requirements is matched, the lamp bead corresponding to the illumination parameter is calibrated in the program or circuit, so that the lamp bead can be controlled in the circuit logic to be applied to the light-emitting mode that is adapted to the matched illumination parameter range; if the matching is not achieved, the control unit controls the next step of the packaging process to be executed according to the correction process and / or sends an early warning message to the outside.

[0076] In some optional embodiments, the illumination parameters may include, but are not limited to, parameters such as chromaticity range or chromaticity value, brightness, color temperature or frequency. Especially for animal and plant lighting, the chromaticity or light band of the lamp bead is more important and can be used as the preferred illumination parameter. The illumination parameter calibration value refers to the unified illumination parameter index of a certain lamp bead under a certain manufacturing target. When a certain lamp bead meets the standard, it means that it can emit uniform light like other normal lamp beads of the same type.

[0077] The next step of the packaging process refers to the sequential steps after the detection of whether the irradiation parameters are qualified is performed in the currently selected packaging mode. For example, under an optional packaging process, the dispensing device is configured to first inject part of the colloid into the light-emitting chip, and then power on the light-emitting chip for luminescence testing. After the test, the dispensing device injects the remaining colloid into the same light-emitting chip. Accordingly, the next step of the packaging process is executed according to the normal process, which means: it is executed according to the established process requirements, for example, the dispensing device injects the remaining colloid into the same light-emitting chip 2 according to the predetermined index, and the next step is executed according to the correction process, which means: it is converted to the correction process, for example, the dispensing device injects less than or more than the predetermined index into the same light-emitting chip according to the instruction of the control unit, or performs some other operations through other devices. Further, the scheme of the correction process can be given by a preset method, and the control unit selects the scheme of the correction process accordingly based on the irradiation parameters detected by the detection unit. Preferably, when there is a mathematical relationship between the irradiation parameters and the correction scheme, the scheme can also be given by the calculation of the control unit. For example, when there is a mathematical relationship between the brightness and the amount of dispensing, the required remaining amount of dispensing can be calculated using the relationship formula between the two. The preset light-emitting mode is a preset light-emitting mode of various lamp beads of the finished light, either individually or in combination, which is set especially based on the characteristics of the plants and animals that the light is intended for. Some plants require different light spectra at different stages of growth or at different times. For example, some plants require blue light, red light, or a combination of blue and red light for photosynthesis. In this case, it is necessary to control the blue and red lamp beads on the finished light to emit light individually or in combination. When some plants are respiring, for the sake of the plants themselves or for insect repellent considerations, yellow light or white light may be required to assist in trapping or repelling specific pests. In this case, it is necessary to control the yellow light beads on the finished light or the lamp beads that can compound to form yellow light or white light to emit light. When compounding yellow light, red lamp beads participate, so some red lamp beads are preset to be regulated to participate in emitting light in the light-emitting mode that requires yellow light. Preferably, certain stages of plant growth may also require irradiation with purple light, which can be composited by the simultaneous emission of red light and blue light. At this time, red and blue lamp beads emit light in a certain ratio to synthesize purple light. The ratio can be 1:3 for red to blue, which is the ratio of the number of lamp beads. The light emission modes of the above-mentioned different types of lamp beads at different stages, either individually or in combination, can be designed as preset light emission modes. The light emission modes also include irradiation parameters that guide the light to regulate the light emission of related lamp beads. For example, in the case of composite purple light, a certain number ratio of red and blue lamp beads are selected for emission, and the parameters such as brightness, chromaticity or frequency of red and blue lamp beads are designed into the corresponding light emission mode.“The lamp bead corresponding to the illumination parameter is calibrated in program or circuit so that the lamp bead can be controlled in the circuit logic to be applied to the lighting mode adapted to the matched illumination parameter range” means that when the control unit retrieves a lamp bead that does not meet the preset illumination parameter calibration value but meets the preset illumination parameter range in a preset illumination mode, it controls the components in the light packaging equipment that can perform related work to mark the lamp bead in program or circuit. For example, when circuit marking is adopted, a welding robot can be used to weld the control interface of the lamp bead to the corresponding interface of the light control chip, which is the control interface corresponding to the lighting mode matched with the lamp bead, so that the light control chip can make the lamp bead emit light within the preset illumination parameter range in the preset lighting mode. For another example, when program marking is adopted, the control unit records the number of the lamp bead and the corresponding lighting mode (which can also be recorded as a mode number), and uploads the recorded number and corresponding lighting mode to the light control chip in a certain step, so that the light control chip can know which number of lamp beads corresponds to which lighting mode control flow.

[0078] The above scheme realizes that during the process of lamp package manufacturing, the final designed light-emitting mode of the lamp is used as a reference to detect whether the lamp package meets the standards, rather than simply using whether the simple lamp bead illumination parameters meet the residual test or consistency test to determine whether the lamp bead is qualified. This scheme fully takes into account the situation that even if the lamp beads are unqualified under some testing standards, they still have the effect or even the advantage in actual lamp use (for example, due to packaging errors, the frequency of a certain lamp bead is significantly higher than that of similar lamp beads, but in the actual use of the lamp, there is a need for high-frequency light emission to repel pests), so that the lamp package of this scheme can significantly reduce the processes that need to be corrected, reworked and adjusted, and significantly save packaging, raw materials and efficiency costs.

[0079] The test data of LED encapsulants can help determine whether LEDs are suitable for plant cultivation, especially those LEDs that are considered "defective" under traditional standards. Through detailed testing of each batch of lamp beads, those lamp beads with deviations in parameters but still have use value can be classified for application scenarios with specific requirements.

[0080] In this application, "defective" LEDs can be lamp beads (or LEDs) that are not considered to have safety hazards, but do not meet the standards under the test standard of "testing the light package based on the final design light emission mode of the light" involved in this application. Examples of non-compliant lamp beads include those with inconsistent color display, glue scattering, or other safe lamp beads.

[0081] The system includes a microscope capable of detecting the irradiation parameters of the lamp beads of the LED material to be tested. The LED material to be tested has been subjected to dispensing at least once. The system also includes a central processing unit. The system also includes an information input module and an information output module. Preferably, the system is connected to the pipeline system information.

[0082] The information input module of this application includes options for evaluating the application scenarios of LEDs based on spectral adaptability, light intensity uniformity, color temperature applicability, and light efficiency. The above four dimensions reflect the key performance of LEDs in different aspects of plant growth. According to the specific spectrum, light intensity, color temperature, and light efficiency requirements, the characteristics of LEDs can be more accurately matched with the specific plant cultivation environment and conditions, thereby optimizing product selection and improving plant growth efficiency and quality.

[0083] Spectral adaptability refers to the degree of matching between the spectral output of the LED light source and the spectrum required for plant photosynthesis. Preferably, the central processor is configured to: 适用性 ) Screening out "defective" LEDs. Preferably, the spectral adaptability is determined based on formula (1).

[0084]

[0085] Among them, L i is the light intensity at the detection wavelength i; L 标准 is the light intensity at standard wavelength i; w i is the weight at wavelength i.

[0086] Light intensity uniformity refers to the uniformity of the light intensity distribution of the LED light source within the irradiation area. Uniform light intensity distribution can ensure that the plants receive consistent light throughout the growth area. The central processor is configured to screen "defective" LEDs based on light intensity uniformity (U). Preferably, light intensity uniformity is determined based on formula (2).

[0087]

[0088] Among them, L min is the minimum light intensity in the spot; L max is the maximum light intensity in the spot.

[0089] Color temperature suitability refers to the degree of match between the color temperature of the LED light source and the color temperature required by the plant. Color temperature affects the color of the light, and different color temperatures have a significant impact on the growth morphology and physiological processes of plants. The CPU is configured as follows: Based on color temperature suitability (T 适用性 ) Screening out "defective" LEDs. Preferably, the color temperature suitability is confirmed based on formula (3).

[0090]

[0091] Among them, T 目标 is the target color temperature; T 实际 is the actual color temperature detected.

[0092] Light efficiency refers to the ratio of the light output power of an LED light source to its input power, i.e., the efficiency of converting each watt of electrical energy into usable light energy. High light efficiency means lower energy consumption and operating costs. The central processor is configured to filter out "defective" LEDs based on light efficiency (E). Preferably, the light efficiency is determined based on formula (4).

[0093]

[0094] Among them, L 输出 is the optical output power; P 输入 is the input power.

[0095] The information input module of this application includes options for comprehensive evaluation of lamp application scenarios based on spectral adaptability, light intensity uniformity, color temperature applicability, and light efficiency. The application scenario is, for example, a plant factory.

[0096] The central processor is configured as follows: Based on spectral adaptability (S 适用性 ), light intensity uniformity (U), color temperature applicability (T 适用性 ), light efficiency (E) to comprehensively screen out "defective" LEDs. Preferably, the screening result is confirmed based on the comprehensive score. The comprehensive score (QA) is confirmed by formula (5).

[0097]

[0098] Among them, W S , W U , W T and W E They are spectral adaptability (S 适用性 ), light intensity uniformity (U), color temperature applicability (T 适用性 ), the weight of the light effect (E).

[0099] The weight of each condition can be set according to plant cultivation needs, types or plant factory costs.

[0100] The comprehensive score is based on the weighted sum of spectral adaptability, light intensity uniformity, color temperature applicability and light efficiency, reflecting the overall applicability of LED light sources in plant cultivation. Through comprehensive evaluation of four dimensions, the "defective" LEDs suitable for plant cultivation are screened for the purpose of improving the growth rate, yield and quality of plants and adapting to different cultivation conditions. On the one hand, the characteristics of "defective" LEDs can effectively improve the conditions for plant cultivation and accelerate plant growth; on the other hand, the use of "defective" LEDs can reduce material waste, reduce production costs, and promote the sustainable use of resources. At the same time, the comprehensive score proposed in this application increases the flexibility of the screening conditions for "defective" LEDs. By adjusting the weight coefficient and combining "defective" LEDs with different characteristics, it is possible to flexibly adapt to various plant cultivation conditions and needs.

[0101] For example: Figure 3 As shown in the display screen, the cultivation conditions are used as classification and the screening conditions are set to three types. The screening conditions include lamp beads suitable for soil cultivation, hydroponics and fog cultivation environments.

[0102] In hydroponics, plant roots are in direct contact with the nutrient solution. Plant cultivation has high requirements for light intensity and spectrum. S , W U , W T and W E They are 0.5, 0.2, 0.2 and 0.1 respectively.

[0103] In soil cultivation, plant roots grow in a solid medium. Plant cultivation has high requirements for spectrum and color temperature. S , W U , W T and W E They are 0.4, 0.2, 0.3 and 0.1 respectively.

[0104] In aeroponics, plant roots are suspended in the air and nutrient solution is sprayed in the form of mist. Plant cultivation has high requirements for light intensity and light efficiency. S , W U , W T and W E They are 0.3, 0.3, 0.2 and 0.2 respectively.

[0105] It should be noted that the above specific embodiments are exemplary, and those skilled in the art can come up with various solutions inspired by the disclosure of the present invention, and these solutions also belong to the disclosure scope of the present invention and fall within the protection scope of the present invention. Those skilled in the art should understand that the present invention description and its drawings are illustrative and do not constitute a limitation of the claims. The protection scope of the present invention is defined by the claims and their equivalents.

Claims

1. A packaging device for animal and plant lighting sources, characterized in that: include: A microscope (100) is used to receive a shooting instruction to magnify and collect an image of the LED material to be tested and transmit it to a central processor (300); A conveyor belt (200) is arranged below the microscope (100) and is used to convey the material to be tested so as to ensure that the material to be tested each time stops at the same testing position of the microscope (100); The central processor (300) is data-connected to the microscope and the conveyor belt (200) to receive the image of the LED material, wherein the central processor (300) is further configured to: Dividing the image magnified by the microscope (100) into a plurality of regions and comparing them with a standard image; Determine whether the area where the pixel points of the image of the LED material to be tested are located corresponds to the area where the pixel points of the standard image are located, so as to check the state of the surface of the LED material to be tested; Scoring the pixel points in the image of the LED material to be tested that correspond to the standard image, so as to calculate the difference between the score of the image of the LED material to be tested and the standard score; The images of the LED material to be tested whose difference exceeds the threshold are marked with corresponding numbers.

2. The packaging device for an animal and plant lighting source according to claim 1, characterized in that: The surface conditions of the LED material to be tested include material stains, flatness, size, electrodes, and electrode patterns.

3. The packaging device for an animal and plant lighting source according to claim 1 or 2, characterized in that: The central processor (300) sends the shooting instruction to the microscope (100) at least when the process of the conveyor belt (200) transporting the LED material to be tested is stagnant, so that the microscope (100) can at least capture the image of the LED material to be tested when the conveyor belt (200) is stagnant.

4. The packaging device for lighting sources for animals and plants according to any one of claims 1 to 3, characterized in that: Also includes: A chip expander (401), used to expand the arrangement spacing of the LED material to be tested after dicing, and the chip expander (401) can expand the film bonding the chip; A vacuum degassing machine (402) is used to remove bubbles in the colloid of the LED material to be tested by centrifugation in a vacuum environment; A high-speed die-bonding machine (403) is used to fix the LED material to be tested in the bowl of the lead frame using a universal adhesive, wherein: After the LED material to be tested passes through the conveyor belt (200) and is processed in sequence by the wafer expander (401), the vacuum degassing machine (402) and the high-speed crystal bonding machine (403), the conveyor belt (200) stops to stop the LED material to be tested at a position for comparison by the microscope (100).

5. The packaging device for lighting sources for plants and animals according to any one of claims 1 to 4, characterized in that: The microscope (100) is at least capable of capturing an image of the LED material to be tested after solidification when the conveyor belt (200) is stagnant, so that the central processor (300) can compare the image of the LED material to be tested after solidification with a standard image for scoring, thereby screening out the LED material to be tested with bubbles and the corresponding numbers, and sending the screened LED material to be tested with bubbles back to the vacuum degassing machine (402) via the conveyor belt (200) for removal.

6. The packaging device for an animal and plant lighting source according to any one of claims 1 to 5, characterized in that: Also includes: A high-speed powder sprayer (405) is used to spray fluorescent powder into the lead frame bowl cup with soldered wires to cover the LED material to be tested; The glue dispenser (409) dispenses silver glue or insulating glue on the corresponding position of the LED material to be tested, wherein the microscope (100) is further configured as follows: The irradiation parameters of the lamp bead of the LED material to be tested which is equipped with a light-emitting chip and phosphor and powered on can be detected, wherein the LED material to be tested has been subjected to glue dispensing at least once.

7. The packaging device for animal and plant lighting source according to any one of claims 1 to 6, characterized in that: The central processor (300) is configured to determine the light emission mode of the LED material to be tested in the following manner: Based on the calibrated value of the irradiation parameter, judging whether the packaging of the manufactured LED material is qualified; If it is judged to be qualified, controlling the conveyor belt (200) to perform the next step of processing according to the normal packaging process; In the case of being judged as unqualified, matching with lamp beads in several LED materials is performed based on the range of the illumination parameters pre-stored in the preset light-emitting mode to select several lighting devices composed of the LED materials that can meet the packaging standards.

8. The packaging device for animal and plant lighting source according to any one of claims 1 to 7, characterized in that: The central processor (300) is also configured to: When at least one range of the illumination parameters is matched, the lamp beads corresponding to the illumination parameters are calibrated in program or circuit so that the lamp beads can be controlled in the circuit logic to be applied in a lighting mode that is suitable for the matched range of the illumination parameters.

9. A packaging method for an animal and plant lighting source, characterized in that: The method comprises the following steps: Convey the LED material to be tested to ensure that the material to be tested each time stops at the same testing position; receiving a shooting instruction to magnify and capture an image of the LED material to be tested; The enlarged image is divided into multiple regions for comparison with the standard image; Determine whether the area where the pixel points of the image of the LED material to be tested are located corresponds to the area where the pixel points of the standard image are located, so as to check the state of the surface of the LED material to be tested; Scoring the pixel points in the image of the LED material to be tested that correspond to the standard image, so as to calculate the difference between the score of the image of the LED material to be tested and the standard score; The images of the LED material to be tested whose difference exceeds the threshold are marked with corresponding numbers.

10. The packaging method of a light source for lighting animals and plants according to claim 9, characterized in that: The surface status of the LED material to be tested includes whether there are stains and uneven spots on the material surface, whether the size and electrode size are consistent, and whether the electrode pattern is complete.

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