Tape processing apparatus for semiconductor workpiece and tape changing method for

Abstract

The invention provides a tape processing device for a semiconductor workpiece and a tape replacing method for the semiconductor workpiece, which can further improve the tape processing efficiency for the semiconductor workpiece. The present invention is provided with: a tape supply unit (3) which is provided with a plurality of rolls (11) of adhesive tapes (T) and which supplies the adhesive tapes from the rolls located at a pasting position (G1); a tape attaching unit (4) that uses an adhesive tape to perform predetermined processing on the wafer (W); and a tape recovery unit (5) which is provided with a plurality of take-up cores (15) for taking up the unwanted tape (Tn) and takes up the unwanted tape (Tn) to the take-up cores located at the recovery position (K1), in which the tape supply unit (3) is configured so as to be able to carry the unused roll (11) into a preparation position (G2) that is a position different from the pay-off position (G1), and the tape recovery unit (5) is configured so as to be able to carry out the take-up cores (15) from the standby position (K2).

Description

Technical Field

[0001] The present invention relates to a tape processing device for semiconductor workpieces and a tape replacement method for semiconductor workpieces, which are used to perform various tape processing on semiconductor workpieces such as semiconductor wafers (hereinafter appropriately referred to as "wafers") or substrates, such as adhesive tape sticking processing or adhesive tape peeling processing. Background Art

[0002] In the process of manufacturing various products from a semiconductor workpiece such as a wafer or a substrate, the workpiece is sometimes subjected to various treatments using adhesive tape. Examples of the tape treatment process for the semiconductor workpiece include a process of attaching an adhesive tape (protective tape) for circuit protection to the workpiece, a process of attaching an adhesive tape (dicing tape) for workpiece support to load the workpiece on a ring rack, a process of sealing the semiconductor workpiece using an adhesive film for equipment sealing, or a process of attaching an adhesive tape (peeling tape) for peeling off the protective tape attached to the semiconductor workpiece to peel off the protective tape together with the peeling tape, etc.

[0003] The conventional structure of a tape processing device for performing tape processing on a semiconductor workpiece will be described by taking as an example a tape applying device for applying a protective adhesive tape to a semiconductor workpiece. Fig.37 As shown, the conventional tape applying device 201 includes a tape supply unit 203, a separator peeling unit 205, a holding table 207, a tape applying unit 209, a tape cutting mechanism 211, a tape collecting unit 213, a separator collecting unit 215, and the like.

[0004] The tape supply unit 203 allows a supply tube loaded with a roll of adhesive tape TS with a separator (release liner) for circuit protection to release and guide the adhesive tape TS with separators. The separator stripping unit 205 is used to strip the separator S from the released adhesive tape TS with separators. The holding table 207 adsorbs and holds the wafer W in a state where the circuit forming surface faces upward. As an example, the tape sticking unit 209 is a sticking roller. Fig.37 Through this horizontal movement, the tape sticking unit 209 sticks the adhesive tape T from which the separator S has been peeled off to the wafer W on the holding table 207 .

[0005] The tape cutting mechanism 211 includes a cutter 211a, and the tape cutting mechanism 211 is rotated about a vertical axis indicated by reference numeral P to cut the adhesive tape T along the outer shape of the wafer W. The unnecessary portion of the adhesive tape T after cutting, that is, the unnecessary tape Tn, is rolled up on a winding shaft constituting the tape recovery unit 213 and recovered. In addition, the separator S peeled from the adhesive tape T is rolled up on a winding shaft constituting the separator recovery unit 215 and recovered.

[0006] In such a tape applying device, when the amount of adhesive tape T in the tape supply unit 203 is less than a certain amount, or when the amount of unnecessary tape Tn collected in the tape collection unit 113 exceeds a certain amount, the roll needs to be replaced. In the conventional tape applying device 101, when replacing the roll, the operator needs to perform a complicated operation manually.

[0007] That is, in the tape supply unit 203, a series of operations such as the following operations need to be performed: the adhesive tape T and the separator S unwound from the reel are cut to separate from the reel; the reel is replaced with a new reel; the cut preceding adhesive tape T is joined with the subsequent adhesive tape T involved in the new reel; and the unwound of the adhesive tape T is restarted. Moreover, in the tape recovery unit 213 and the like, a series of operations such as the following operations need to be performed: the unnecessary tape Tn is cut to separate from the reel of the winding shaft; the unnecessary tape Tn recovered in a roll is removed from the winding shaft; the unnecessary tape Tn is joined to the winding shaft; and the winding of the unnecessary tape Tn is restarted.

[0008] In recent years, attempts have been made to automatically join the ends of the cut adhesive tape T. As one example, the following tape joining method has been proposed (for example, see Patent Documents 1 and 2). That is, an adhesive tape for joining, i.e., a joining tape, is attached to the rear end of the preceding adhesive tape with a spacer.

[0009] After the joining tape is attached, the rear end of the adhesive tape with the spacer attached to the joining tape is pressed against the front end of the subsequent adhesive tape with the spacer for joining. In this way, the end of the preceding adhesive tape can be joined to the end of the subsequent adhesive tape via the joining tape.

[0010] Prior art literature

[0011] Patent Literature

[0012] Patent Document 1: Japanese Patent Application Publication No. 2014-133616

[0013] Patent Document 2: Japanese Patent Application Publication No. 2019-172393 Summary of the invention

[0014] Problem that the invention aims to solve

[0015] However, the above-mentioned conventional devices have the following problems. That is, in the conventional tape processing device, the automation in the replacement process is insufficient. In the process of replacing the roll in the conventional device, the operator needs to perform operations frequently, and each operation takes a long time. As a result, there is a concern that it is difficult to reduce the burden on the operator. In addition, the device stops working for a long time in the process of replacing the roll, so there is also a concern that it is difficult to improve the processing efficiency of the tape processing device.

[0016] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a tape processing device for semiconductor workpieces and a tape replacement method for semiconductor workpieces, which can further improve the tape processing efficiency for semiconductor workpieces.

[0017] Solutions for solving problems

[0018] The present invention adopts the following structure to achieve this object.

[0019] That is, the tape processing device for semiconductor workpieces according to the present invention is characterized by comprising:

[0020] a tape supply unit including a plurality of roll holding units for holding rolls of adhesive tape, and the tape supply unit causes the roll held by the roll holding unit moved to a releasing position among the roll holding units to release the adhesive tape;

[0021] a tape processing section that performs a predetermined process on a semiconductor workpiece using the adhesive tape discharged from the tape supply section; and

[0022] The tape recovery section includes a plurality of winding core holding sections for holding a winding core capable of winding up unnecessary tape, and the tape recovery section winds up the unnecessary tape in a roll onto the winding core held by the winding core holding section moved to a recovery position in the winding core holding section for recovery, wherein the unnecessary tape is an unnecessary portion of the adhesive tape after the prescribed treatment has been performed.

[0023] The tape supply unit is configured to feed a new roll into the roll holding unit moved to the standby position while feeding the adhesive tape from the roll moved to the feeding position.

[0024] The tape collecting section is configured to be able to carry out the winding core from the winding core holding section moved to the standby position while winding the unnecessary tape onto the winding core moved to the collecting position for collection.

[0025] (Function / Effect) According to this structure, a plurality of roll holding parts for holding rolls of adhesive tape are provided in the tape supply part. In addition, the adhesive tape is discharged and supplied from the roll held by the roll holding part moved to the discharge position among the roll holding parts provided in the tape supply part to the tape processing part. Therefore, the mechanism for supplying the adhesive tape from the tape supply part to the tape processing part does not need to be provided for each roll holding part but only needs to be provided for the roll holding part moved to the discharge position. Therefore, the number of components required for supplying the adhesive tape from the tape supply part to the tape processing part can be reduced, and thus the structure of the tape processing device for semiconductor workpieces can be further simplified.

[0026] Furthermore, the tape supply unit is configured to be able to unwind the adhesive tape from the reel moved to the unwinding position while moving a new reel into the reel holding unit moved to the preparation position. Therefore, the operation of supplying the adhesive tape from the reel moved to the unwinding position to the tape processing unit to perform a predetermined process on the semiconductor workpiece can be continued while a new reel is replenished to the preparation position of the tape supply unit. That is, there is no need to stop the processing operation for the semiconductor workpiece when the reel is replenished to the tape supply unit, so the processing efficiency for the workpiece can be improved.

[0027] In addition, the unnecessary tape sent out from the tape processing section is wound onto a winding core held by a winding core holding section moved to a recovery position in a winding core holding section provided in the tape recovery section for recovery. Therefore, the mechanism for sending the adhesive tape from the tape processing section to the tape recovery section does not need to be provided for each winding core holding section but only needs to be provided for the winding core holding section moved to the recovery position. Therefore, the number of components required for sending the unnecessary tape from the tape processing section to the tape recovery section can be reduced, and thus the structure of the tape processing device for semiconductor workpieces can be further simplified.

[0028] Furthermore, the tape recovery section is configured to be able to recycle the unnecessary tape onto the recycle core that has been moved to the recovery position while carrying out the recycle core from the recycle core holder that has been moved to the standby position. Therefore, the action of recycle the unnecessary tape after the prescribed processing for the semiconductor workpiece onto the recycle core that has been moved to the recovery position can be continued while the used recycle core can be recovered from the preparation position of the tape recovery section. That is, it is not necessary to stop the processing operation for the semiconductor workpiece when the used recycle core is recovered from the tape recovery section, so the processing efficiency for the workpiece can be improved. In addition, after the recycle core has been moved out from the recycle core holder that has been moved to the standby position, a new recycle core is loaded into the recycle core holder, thereby making it possible to replenish the tape recovery section with a new recycle core without stopping the processing operation for the semiconductor workpiece.

[0029] In addition, in the above-mentioned invention, it is preferred that the tape supply section comprises: a preparation processing mechanism, which performs preparation processing on the reel moved to the preparation position, the preparation processing is a processing for making the reel release a portion of the adhesive tape and prepare for joining the adhesive tape; a cutting mechanism, which cuts the adhesive tape released from the reel moved to the release position to separate it from the reel; a configuration change mechanism, which moves the reel holding section holding the reel that has undergone the preparation processing from the preparation position to the release position; and a tape joining mechanism, which joins the adhesive tape cut from the reel by the cutting mechanism with the reel that has undergone the preparation processing and moved to the release position.

[0030] (Function and Effect) According to this structure, the tape supply unit includes a preparation processing mechanism, a cutting mechanism, and a tape joining mechanism. The preparation processing mechanism performs preparation processing on the unused reel moved to the preparation position, and the preparation processing is a process for making the reel release a part of the adhesive tape and prepare for the joining of the adhesive tape. The cutting mechanism cuts the adhesive tape released from the reel located at the release position and separates it from the reel. The tape joining mechanism joins the separated adhesive tape to the unused reel that has been subjected to the preparation processing.

[0031] By subjecting the unused reel to the preparation treatment in advance at the time when it is moved to the preparation position, when the reel moved to the release position is used up and is to be replaced with an unused reel, the adhesive tape cut from the used reel located at the release position can be quickly rejoined with the unused reel that has completed the preparation treatment. Therefore, the operation of releasing the unused reel and supplying the adhesive tape to perform the prescribed treatment on the semiconductor workpiece can be quickly started again, thereby improving the processing efficiency of the semiconductor workpiece. In addition, by providing a preparation treatment mechanism, the preparation treatment for the reel can be automatically performed. Therefore, when replacing the reel, there is no need for the operator to manually perform the preparation treatment for the reel, thereby reducing the burden on the operator.

[0032] In addition, in the above invention, it is preferable that the invention further comprises: a let-out tape amount detection unit that detects the amount of the adhesive tape wound around the reel moved to the let-out position; a configuration change mechanism control unit that controls the operation of the configuration change mechanism based on the amount of the adhesive tape detected by the let-out tape amount detection unit; and a preparation processing mechanism control unit that controls the operation of the preparation processing mechanism based on the amount of the adhesive tape detected by the let-out tape amount detection unit, wherein, when the let-out tape amount detection unit detects that the amount of the adhesive tape wound around the reel moved to the let-out position is less than a predetermined amount, the configuration change mechanism control unit controls the configuration change mechanism to move the reel holding unit located at the preparation position toward the let-out position, and when the let-out tape amount detection unit detects that the amount of the adhesive tape wound around the reel moved to the let-out position is less than the predetermined amount, the preparation processing mechanism control unit controls the operation of the preparation processing mechanism to perform the preparation processing on the reel moved to the preparation position.

[0033] (Function / Effect)

[0034] According to this structure, a delivery tape amount detection unit is provided for detecting the amount of adhesive tape wound around the reel moved to the delivery position, and the configuration change mechanism and the reel conveying mechanism are controlled according to the amount of adhesive tape wound around the reel moved to the delivery position. That is, when the amount of adhesive tape wound around the reel moved to the delivery position becomes less than a predetermined amount, the reel holding unit located at the preparation position is moved toward the delivery position. In this structure, the timing of the preparatory action required for replacing the reel is appropriately determined according to the amount of adhesive tape wound around the reel. Therefore, it is possible to avoid a situation in which the adhesive tape of the reel is deteriorated due to an overly fast preparatory action, or a situation in which the time required for replacing the reel is prolonged due to an overly slow preparatory action.

[0035] In addition, in the above-mentioned invention, it is preferred that, when the let-out tape amount detection unit detects that the amount of the adhesive tape wound around the reel moved to the let-out position is less than a predetermined first specified amount, the preparation processing mechanism control unit controls the action of the preparation processing mechanism to perform the preparation processing on the reel moved to the preparation position, and the configuration change mechanism control unit is constructed as follows: when the let-out tape amount detection unit detects that the amount of the adhesive tape wound around the reel moved to the let-out position is less than a predetermined second specified amount, the configuration change mechanism is controlled to move the reel holding unit located at the preparation position toward the let-out position, and the first specified amount is defined as a threshold value at which the tape amount is greater than the second specified amount.

[0036] (Action / Effect) According to this structure, the reel conveying mechanism, the configuration change mechanism control unit, and the preparation processing mechanism are controlled according to the amount of adhesive tape wound around the reel moved to the release position. That is, when the amount of adhesive tape wound around the reel moved to the release position and supplying the adhesive tape to the tape processing unit becomes less than the first specified amount, the reel moved to the preparation position in the tape supply unit is prepared. Moreover, when the amount of adhesive tape wound around the reel supplying the adhesive tape becomes less than the second specified amount, the reel holding unit located at the preparation position is moved to the release position. Moreover, the first specified amount is specified as a threshold value at which the amount of tape is more than the amount of tape of the second specified amount. Therefore, before the reel is moved to the release position to replace the reel, the action of moving the reel to the preparation position to perform preparation processing is performed. That is, the time required for the reel replacement operation such as cutting off the adhesive tape from the used reel and joining the adhesive tape with the unused reel can be further shortened. Therefore, the processing efficiency for semiconductor workpieces can be further improved.

[0037] In addition, in the above-mentioned invention, it is preferred that the belt recovery section comprises: an unnecessary belt cutting mechanism, which cuts the unnecessary belt released to the first winding core moved to the recovery position to separate it from the winding core; a recovery section configuration change mechanism, which moves the winding core holding section located in the standby position and holding the second winding core from the standby position to the recovery position to newly configure the second winding core to the recovery position; and an unnecessary belt joining mechanism, which joins the unnecessary belt cut off from the first winding core by the unnecessary belt cutting mechanism with the second winding core.

[0038] (Function / Effect) According to this structure, the tape recovery section is provided with an unnecessary tape cutting mechanism, a recovery section configuration change mechanism, and an unnecessary tape cutting mechanism. By providing these structures, the following actions can be performed quickly and automatically: the unnecessary tape conveyed from the tape processing section is cut off from the first roll core located at the recovery position, and the unnecessary tape is joined to the second roll core that is configured from the standby position to the recovery position. Therefore, the process of replacing the first roll core that has accumulated unnecessary tape and has been used with a new second roll core can be made more highly automated, thereby greatly reducing the burden on the operator.

[0039] In addition, in the above-mentioned invention, it is preferred that it is further provided with: an unnecessary tape detection unit, which detects the amount of the unnecessary tape that has been wound onto the winding core that has been moved to the recovery position; and a recovery unit configuration change control unit, which controls the operation of the recovery unit configuration change mechanism based on the amount of the unnecessary tape detected by the unnecessary tape detection unit, wherein, when the unnecessary tape detection unit detects that the amount of the unnecessary tape that has been wound onto the winding core that has been moved to the recovery position is greater than a third specified amount, the recovery unit configuration change control unit controls the recovery unit configuration change mechanism to move the winding core holding unit that is located at the standby position and holds the second winding core toward the recovery position.

[0040] (Function / Effect) According to this structure, there is an unnecessary tape detection unit for detecting the amount of unnecessary tape that has been wound onto the winding core that has been moved to the recovery position, and the recovery unit configuration change mechanism is controlled according to the amount of unnecessary tape that has been wound onto the winding core that has been moved to the recovery position. That is, when the amount of unnecessary tape that has been wound onto the winding core that has been moved to the recovery position becomes greater than a third specified amount, the winding core retaining unit located at the standby position is moved toward the recovery position. In this structure, the timing of replacing the winding core is appropriately determined according to the amount of unnecessary tape that has been wound onto the winding core that has been wound onto the recovery position. Therefore, it is possible to avoid a situation in which the processing efficiency of the adhesive tape processing device is reduced due to the late timing of replacing the winding core.

[0041] The stripping device further comprises a stripping means for detecting the amount of the adhesive tape wound on the roll moved to the pay-out position and an unnecessary tape detector for detecting the amount of the unnecessary tape wound on the take-up core moved to the collection position, wherein the stripping device comprises a stripping means for detecting the amount of the adhesive tape wound on the roll moved to the pay-out position and an unnecessary tape detector for detecting the amount of the unnecessary tape wound on the take-up core moved to the collection position, wherein the stripping device comprises a stripping means for detecting the amount of the adhesive tape wound on the roll moved to the pay-out position and an unnecessary tape detector for detecting the amount of the unnecessary tape wound on the take-up core moved to the collection position, wherein the stripping device comprises a stripping means for detecting the amount of the adhesive tape wound on the roll moved to the pay-out position and an unnecessary tape detector for detecting the amount of the unnecessary tape wound on the take-up core moved to the collection position, wherein the stripping means comprises a stripping means for detecting the amount of the adhesive tape wound on the roll moved to the pay-out position and wherein the unnecessary tape The retrieval section is provided with a winding core replacement system, and the winding core replacement system comprises: an unnecessary tape cutting mechanism, which cuts the unnecessary tape released to the first winding core moved to the recovery position to separate it from the winding core; a recovery section configuration change mechanism, which moves the winding core holding section located in the standby position and holding the second winding core from the standby position to the recovery position to newly configure the second winding core to the recovery position; and an unnecessary tape joining mechanism, which joins the unnecessary tape cut off from the first winding core by the unnecessary tape cutting mechanism with the second winding core moved to the recovery position by the recovery section configuration change mechanism, and the roll replacement system and the winding core replacement system are controlled to start the operation when the unwinding tape amount detection section detects that the amount of the adhesive tape wound around the roll moved to the unwinding position is less than a first threshold value, or when the unnecessary tape detection section detects that the amount of the unnecessary tape wound onto the winding core moved to the recovery position is greater than a second threshold value.

[0042] (Function / Effect) According to this structure, at least one of the unwinding tape amount detection unit detects the amount of adhesive tape wound around the reel moved to the unwinding position and the unnecessary tape detection unit detects the amount of unnecessary tape wound onto the take-up core moved to the collection position. Furthermore, the reel replacement system of the tape supply unit and the take-up core replacement system of the tape collection unit are controlled to start operation based on the amount of adhesive tape detected by the unwinding tape amount detection unit or the amount of unnecessary tape detected by the unnecessary tape detection unit.

[0043] That is, when the amount of adhesive tape wound around the roll moved to the release position becomes below the first threshold, or when the amount of unnecessary tape detected by the unnecessary tape detection unit becomes above the second threshold, the roll replacement process of the roll is started in the tape supply unit, and the winding core replacement process of the winding core is started in the tape recovery unit.

[0044] In this structure, the timing of replacing the reel and the timing of replacing the winding core can be appropriately determined according to the amount of adhesive tape wound on the reel at the unwinding position or the amount of unnecessary tape wound on the winding core at the recovery position. Therefore, it is possible to avoid the situation where the timing of replacement is too early and the frequency of replacement of the reel and the winding core increases. In addition, it is possible to avoid the situation where the adhesive tape of the reel is exhausted due to the timing of replacement too late, thereby hindering the tape processing process, or the situation where the winding core cannot completely recover the unnecessary tape, thereby hindering the tape processing process.

[0045] Furthermore, in this structure, by satisfying the prescribed conditions, the process of replacing the roll in the tape supply section and the process of replacing the winding core in the tape recovery section are performed synchronously. Therefore, the control in the adhesive tape processing device can be simplified. In addition, since the two replacement processes are performed synchronously, the frequency of performing the replacement process can be reduced. As a result, the frequency of stopping the tape processing process when performing the replacement process is reduced, so the processing efficiency of the adhesive tape processing device can be further improved.

[0046] In addition, in the above invention, it is preferred that there is also an input unit for inputting an operator's instructions, the tape supply unit is equipped with a reel replacement system, and the reel replacement system has: a preparation processing mechanism, which performs preparation processing on the reel moved to the preparation position, the preparation processing is a processing for causing the reel to release a portion of the adhesive tape and prepare for joining the adhesive tape; a cutting mechanism, which cuts the adhesive tape released from the reel moved to the release position to separate it from the reel; a configuration change mechanism, which moves the reel holding unit that holds the reel that has undergone the preparation processing from the preparation position to the release position; and a tape joining mechanism, which joins the adhesive tape cut from the reel by the cutting mechanism with the reel that has undergone the preparation processing and moved to the release position, and the tape recovery unit is equipped with a winding core replacement system The winding core replacement system comprises: an unnecessary belt cutting mechanism, which cuts off the unnecessary belt released to the first winding core moved to the collection position to separate it from the winding core; a recovery section configuration change mechanism, which moves the winding core holding section located in the standby position and holding the second winding core from the standby position to the collection position to newly configure the second winding core to the collection position; and an unnecessary belt joining mechanism, which joins the unnecessary belt cut off from the first winding core by the unnecessary belt cutting mechanism with the second winding core moved to the collection position by the collection section configuration change mechanism, and the bobbin replacement system is controlled to start operation according to an instruction for starting the replacement of the bobbin is input into the input section, and the winding core replacement system is controlled to start operation according to an instruction for starting the replacement of the winding core is input into the input section.

[0047] (Function / Effect) According to this structure, an input unit for inputting an instruction of an operator is provided. Furthermore, the bobbin replacement system of the tape supply unit is controlled to start operation in response to an instruction for starting replacement of a bobbin being input into the input unit. In addition, the winding core replacement system of the tape recovery unit is controlled to start operation in response to an instruction for starting replacement of a winding core being input into the input unit.

[0048] In this structure, the timing of replacing the roll and the timing of replacing the winding core can be appropriately determined by manually operating the input unit. Therefore, it is possible to avoid the situation where the timing of replacement is too early and the frequency of replacement of the roll and the winding core increases. In addition, it is possible to avoid the situation where the adhesive tape of the roll is exhausted due to the timing of replacement too late, thereby hindering the tape processing process, or the winding core cannot completely recover the unnecessary tape, thereby hindering the tape processing process.

[0049] In order to achieve this object, the present invention may also adopt the following structure.

[0050] That is, a tape replacement method for semiconductor workpieces is used to replace a roll of adhesive tape in a tape processing device for semiconductor workpieces, the tape processing device for semiconductor workpieces comprising: a tape supply unit, which has a plurality of roll holding units for holding the roll of adhesive tape, and the tape supply unit causes the roll held by the roll holding unit moved to a release position among the roll holding units to release the adhesive tape; and a tape processing unit, which uses the adhesive tape released from the tape supply unit to perform a prescribed process on the semiconductor workpiece, the tape replacement method for semiconductor workpieces is characterized in that it includes the following process:

[0051] a preparation process for performing a preparation process on the reel located at a preparation position provided in the tape supply section, wherein the preparation process is a process for causing the reel to unwind a portion of the adhesive tape and prepare for joining of the adhesive tape;

[0052] A cutting process is to cut the adhesive tape released from the roll located at the release position and separate it from the roll located at the release position;

[0053] a configuration changing process of moving the roll holding portion holding the roll that has undergone the preparation process from the preparation position to the release position;

[0054] a tape joining process of joining the adhesive tape cut from the roll by the cutting mechanism to the roll that has undergone the preparation process and moved to the unwinding position;

[0055] In a used roll unloading process, the roll cut from the adhesive tape by the cutting mechanism is unloaded while the adhesive tape is supplied to the tape processing section by the roll joined by the tape joining process at the unloading position; and

[0056] The roll carrying-in process is to carry a new roll into the roll holding portion located at the preparation position after the used roll carrying-out process.

[0057] (Function / Effect) According to this structure, in a structure in which an adhesive tape is fed from a roll located at a feeding position of a tape supply unit to a tape processing unit and a predetermined process is performed on a semiconductor workpiece in the tape processing unit, a process of replacing a used roll of adhesive tape with a new unused roll can be appropriately performed. That is, the roll replacement process includes a preparation process, a cutting process, a configuration change process, a tape joining process, a used roll carrying-out process, and a roll carrying-in process.

[0058] In the preparation process, the reel located at the preparation position is subjected to preparation processing, which is processing for making the reel unwind a portion of the adhesive tape and prepare for joining the adhesive tape. By subjecting the unused reel to the preparation processing in advance at the time when it is moved to the preparation position, when the reel moved to the release position is used up and is to be replaced with an unused reel, the joining process of the adhesive tape cut from the used reel located at the release position and the unused reel that has completed the preparation processing can be quickly completed. Therefore, the operation of unwinding and supplying the adhesive tape from the unused reel to perform the prescribed processing on the semiconductor workpiece can be quickly started again, thereby improving the processing efficiency of the semiconductor workpiece.

[0059] In the used roll unloading process, the reel cut from the adhesive tape in the cutting process is unloaded. The used roll unloading process is performed in a state where the reel at the unloading position that has been joined in the tape joining process is supplied with the adhesive tape to the tape processing unit. That is, it is not necessary to stop the processing operation for the semiconductor workpiece when the used reel is unloaded from the tape recovery unit, thereby improving the processing efficiency for the workpiece.

[0060] In the roll-in process, a new roll is brought into the roll holding part located at the preparation position of the tape supply part. The roll-in process is performed in a state where the roll at the unwinding position that has been joined in the tape joining process supplies the adhesive tape to the tape processing part. That is, it is not necessary to stop the processing operation for the semiconductor workpiece when the unused roll is replenished to the tape supply part, so the processing efficiency for the workpiece can be improved.

[0061] In order to achieve this object, the present invention may also adopt the following structure.

[0062] That is, a method for replacing a tape for a semiconductor workpiece, for replacing a winding core capable of winding up an unnecessary tape in a tape processing device for a semiconductor workpiece, the tape processing device for a semiconductor workpiece comprising: a tape processing unit, which uses an adhesive tape to perform a prescribed treatment on the semiconductor workpiece; and a tape recovery unit, which comprises a plurality of winding core holding units for holding the winding core capable of winding up the unnecessary tape, and the tape recovery unit winds up the unnecessary tape in a roll shape onto the winding core held by the winding core holding unit moved to a recovery position in the winding core holding unit for recovery, wherein the unnecessary tape is an unnecessary portion of the adhesive tape after the prescribed treatment is performed, and the method for replacing a tape for a semiconductor workpiece is characterized in that it comprises the following process:

[0063] an unnecessary tape cutting process of cutting the unnecessary tape released toward the first winding core located at the recovery position and separating the unnecessary tape from the first winding core;

[0064] The recovery section configuration change process moves the winding core holding section located at a standby position provided in the belt recovery section and holding the second winding core from the standby position to the recovery position, thereby newly configuring the second winding core to the recovery position;

[0065] an unnecessary tape joining process for joining the unnecessary tape cut off from the first winding core by the unnecessary tape cutting process to the second winding core;

[0066] In the process of carrying out the winding core after use, the first winding core separated from the unnecessary tape by the unnecessary tape cutting process is carried out while the winding core at the recovery position that has been connected to the unnecessary tape by the tape connecting process is being wound and recovered; and

[0067] The winding core carrying-in process is to carry a new winding core into the roll holding section located at the standby position after the used winding core carrying-out process.

[0068] (Function / Effect) According to this structure, in a structure in which a predetermined process is performed on a semiconductor workpiece in a tape processing section, and the unnecessary part of the adhesive tape after the predetermined process is wound up on a winding core for recovery, a process of replacing the winding core that has been fully wound up with the unnecessary tape with a new winding core can be appropriately performed. That is, the winding core replacement process includes an unnecessary tape cutting process, a recovery section configuration change process, an unnecessary tape joining process, a used winding core carrying out process, and a winding core carrying in process.

[0069] In the unnecessary tape cutting process, the unnecessary tape released to the first winding core located at the recovery position is cut off and separated from the first winding core. In the recovery section configuration change process, the new winding core, i.e., the second winding core, is moved from the standby position to the recovery position. Then, in the unnecessary tape joining process, the unnecessary tape cut from the first winding core is joined to the second winding core. These processes are performed automatically, so there is no need for the operator to manually perform the complicated action of cutting the unnecessary tape from the used winding core and joining it to the new winding core. Therefore, the operating efficiency of the adhesive tape processing device can be improved and the burden on the operator can be further reduced.

[0070] In the process of carrying out the used winding core, the first winding core that has been cut off from the unnecessary tape by the unnecessary tape cutting process is carried out. In the process of carrying in the winding core, a new winding core is carried to the winding core holding part located at the standby position of the tape recovery part. The process of carrying out the used winding core and the process of carrying in the winding core are carried out while the winding core at the recovery position that has been connected to the unnecessary tape by the tape connection process is being wound and recovered. That is, there is no need to stop the processing operation for the semiconductor workpiece when carrying out and carrying in the winding core, so the processing efficiency for the workpiece can be improved.

[0071] Effects of the Invention

[0072] According to the tape processing device for semiconductor workpieces and the tape replacement method for semiconductor workpieces involved in the present invention, a plurality of roll holding parts for holding rolls of adhesive tape are provided in the tape supply part. In addition, the adhesive tape is discharged and supplied to the tape processing part from the roll held by the roll holding part moved to the discharge position among the roll holding parts provided in the tape supply part. Therefore, the mechanism for supplying the adhesive tape from the tape supply part to the tape processing part does not need to be provided for each roll holding part but only needs to be provided for the roll holding part moved to the discharge position. Therefore, the number of components required for supplying the adhesive tape from the tape supply part to the tape processing part can be reduced, so the structure of the tape processing device for semiconductor workpieces can be further simplified.

[0073] Furthermore, the tape supply unit is configured to be able to unwind the adhesive tape from the reel moved to the unwinding position while moving a new reel into the reel holding unit moved to the preparation position. Therefore, the operation of supplying the adhesive tape from the reel moved to the unwinding position to the tape processing unit to perform a predetermined process on the semiconductor workpiece can be continued while a new reel is replenished to the preparation position of the tape supply unit. That is, there is no need to stop the processing operation for the semiconductor workpiece when the reel is replenished to the tape supply unit, so the processing efficiency for the workpiece can be improved.

[0074] In addition, the unnecessary tape sent out from the tape processing section is wound onto a winding core held by a winding core holding section moved to a recovery position in a winding core holding section provided in the tape recovery section for recovery. Therefore, the mechanism for sending the adhesive tape from the tape processing section to the tape recovery section does not need to be provided for each winding core holding section but only needs to be provided for the winding core holding section moved to the recovery position. Therefore, the number of components required for sending the unnecessary tape from the tape processing section to the tape recovery section can be reduced, and thus the structure of the tape processing device for semiconductor workpieces can be further simplified.

[0075] Moreover, the tape recovery section is configured to be able to recycle the unnecessary tape onto the recycle core moved to the recovery position while carrying out the recycle core from the recycle core holding section moved to the standby position. Therefore, the action of recycle the unnecessary tape after the prescribed processing for the semiconductor workpiece onto the recycle core moved to the recovery position can be continued while the used recycle core is recovered from the preparation position of the tape recovery section. That is, it is not necessary to stop the processing operation for the semiconductor workpiece when the used recycle core is recovered from the tape recovery section, so the processing efficiency for the workpiece can be improved. In addition, after the recycle core is carried out from the recycle core holding section moved to the standby position, a new recycle core is loaded into the recycle core holding section, thereby making it possible to replenish the tape recovery section with a new recycle core without stopping the processing operation for the semiconductor workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] Figure 1 It is a front view showing the basic structure of the semiconductor wafer tape processing apparatus according to the embodiment.

[0077] Figure 2 It is a perspective view showing the structure of the tape supply unit involved in the embodiment.

[0078] Figure 3 It is a perspective view showing the structure of the tape collecting section according to the embodiment.

[0079] Figure 4 The figures show the structure of the roll in the standby state according to the embodiment. (a) is a perspective view of the roll in the standby state, and (b) is a front view of the roll in the standby state.

[0080] Figure 5 The figures show the structure of the roll in the ready state according to the embodiment. (a) is a perspective view of the roll in the ready state, and (b) is a front view of the roll in the ready state.

[0081] Figure 6 It is a front view showing the overall structure of the tape supply unit involved in the embodiment.

[0082] Figure 7 It is a front view showing the structure of the tape holding unit and the tape cutting mechanism according to the embodiment.

[0083] Figure 8 It is a front view for explaining the operation of the belt joining mechanism according to the embodiment.

[0084] Fig. 9 It is a front view explaining the structure of the tape sticking part which concerns on Example.

[0085] Fig.10 It is a front view for explaining the overall structure of the tape recovery unit involved in the embodiment.

[0086] Fig.11 It is a front view for explaining the main part of the tape collecting section involved in the embodiment.

[0087] Fig.12 The flowcharts are as follows: (a) is a flowchart showing steps S1 to S5 as the basic process of the adhesive tape applying device; (b) is a flowchart showing the process of appropriately performing steps S6 to S8 according to the loading amount of the roll or winding core.

[0088] Fig.13 1 and 2 are flowcharts showing the operation of the adhesive tape sticking device according to the embodiment. (a) is a flowchart showing the operation related to step S6, (b) is a flowchart showing the operation related to step S7, and (c) is a flowchart showing the operation related to step S8.

[0089] Fig.14 It is a diagram for explaining step S2 according to the embodiment.

[0090] Fig.15 It is a diagram for explaining step S3 according to the embodiment.

[0091] Fig.16 It is a diagram for explaining step S4 according to the embodiment.

[0092] Fig.17 It is a front view for explaining step S6-1 involved in the embodiment.

[0093] Fig.18 It is a front view for explaining step S6-2 involved in the embodiment.

[0094] Fig.19 It is a front view for explaining step S6-3 involved in the embodiment.

[0095] Fig. 20 It is a front view for explaining step S6-4 involved in the embodiment.

[0096] Fig.21 It is a front view for explaining step S6-5 involved in the embodiment.

[0097] Fig. 22 1 and 2 are front views for explaining step S7-2 according to the embodiment. (a) is a view showing a state before the adhesive tape is cut, and (b) is a view showing a state after the adhesive tape is cut.

[0098] Fig.23 It is a front view for explaining step S7-3 involved in the embodiment.

[0099] Fig.24It is a front view explaining the structure of the tape supply unit at the time when step S7 - 3 according to the embodiment is completed.

[0100] Fig.25 It is a front view explaining the structure of the tape supply unit at the time when step S7 - 4 according to the embodiment is completed.

[0101] Fig.26 1 and 2 are front views for explaining step S7-5 according to the embodiment. (a) is a view showing a state before the adhesive tape is joined, and (b) is a view showing a state after the adhesive tape is joined.

[0102] Fig. 27 It is a perspective view for explaining step S7-7 involved in the embodiment.

[0103] Fig.28 It is a perspective view for explaining step S7 - 8 involved in the embodiment.

[0104] Fig.29 1 and 2 are front views for explaining step S8 according to the embodiment. (a) is a view showing a configuration in which the winding core arranged at the collection position is in an unused state, and (b) is a view showing a state in which the winding core arranged at the collection position has been used.

[0105] Fig.30 1 and 2 are front views for explaining step S8-2 according to the embodiment. (a) is a view showing a state where the rotating plate is rotated by 90 degrees, and (b) is a view showing a state where the rotating plate is rotated by 180 degrees.

[0106] Fig.31 1 and 2 are front views for explaining step S8-3 according to the embodiment. (a) is a view showing a state before the unnecessary tape is cut, and (b) is a view showing a state after the unnecessary tape is cut.

[0107] Fig.32 It is a front view for explaining step S8-4 involved in the embodiment.

[0108] Fig.33 This is a front view of the tape recovery unit illustrating a state in which step S8-4 according to the embodiment is completed.

[0109] Fig.34 is a perspective view for explaining step S8-6 according to the embodiment

[0110] Fig.35 It is a perspective view for explaining step S8-7 involved in the embodiment.

[0111] Fig.36 It is a perspective view for explaining a state in which step S8 according to the embodiment is completed.

[0112] Fig.37It is a figure explaining the structure of the adhesive tape sticking apparatus which concerns on a conventional example.

[0113] Fig.38 The drawings are for explaining the structure according to the embodiment. (a) is a perspective view for explaining the structure of a peeling bar, and (b) is a view showing a state where a release liner is peeled off from a pressure-sensitive adhesive tape using the peeling bar. DETAILED DESCRIPTION

[0114] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. As a tape processing device for a semiconductor workpiece involved in the embodiment, an adhesive tape sticking device 1 for sticking an adhesive tape T for circuit protection to a wafer W is described as an example. The wafer W corresponds to the semiconductor workpiece in the present invention. In addition, in the figure showing the adhesive tape sticking device 1, the illustration of the support unit supporting various structures and the driving unit driving various structures is appropriately omitted.

[0115] <Overview of overall structure>

[0116] Figure 1 1 is a front view of the adhesive tape applying device 1. In the following description, the long side direction of the adhesive tape applying device 1 in a rectangular shape when viewed from above is referred to as the left-right direction (x direction), and the horizontal direction orthogonal thereto is referred to as the front-back direction (y direction). In addition, the vertical direction is referred to as the z direction. Figure 1 As shown, the adhesive tape applying device 1 includes a tape supply unit 3, a tape applying unit 4, and a tape collecting unit 5. In this embodiment, the tape supply unit 3, the tape applying unit 4, and the tape collecting unit 5 are arranged in this order from the right to the left along the x direction.

[0117] like Figure 1 and Figure 2 As shown, the tape supply unit 3 unwinds the adhesive tape T from the reel 11 and supplies the adhesive tape T to the tape sticking unit 4. The reel 11 is wound with the strip-shaped adhesive tape T to which a release liner S (separator S) is added. In addition, the reel 11 is used together with a liner bobbin 13. The liner bobbin 13 reels and recovers the strip-shaped release liner S after being peeled off from the adhesive tape T. In addition, the adhesive tape T in the state of being added with the release liner S is referred to as the tape TS. That is, the reel 11 is a structure in which the tape TS is wound in a roll shape on the supply bobbin. In addition, two guide shafts 23 are attached to the reel 11.

[0118] In the present embodiment, the unused reel 11 refers to the reel 11 before the supply operation of the adhesive tape T to the tape applying section 4. In other words, it refers to the reel 11 in a state where the wound adhesive tape T has not been unwound to the tape applying section 4. As an example, the reel 11 in a state where the loaded tape TS has not been unwound corresponds to the unused reel 11. In addition, the unused reel 11 is not limited to the reel 11 in a new state, and is set to include the reel 11 in a state where a certain amount of adhesive tape T has been used in an adhesive tape processing device other than the adhesive tape applying device 1.

[0119] In the present embodiment, the used reel 11 refers to the reel 11 used after the supply operation of the adhesive tape T to the tape sticking section 4. As an example of the used reel 11, a reel 11 in which the amount of the adhesive tape T loaded is less than a predetermined allowable value and it is difficult to use the reel 11 for supplying the adhesive tape T is cited.

[0120] In the present embodiment, the unused liner tube 13 refers to the liner tube 13 used before the supply operation of the adhesive tape T to the tape applying section 4. As an example, the liner tube 13 in a state where the release liner S is not wound corresponds to the unused liner tube 13. In the present embodiment, the used liner tube 13 refers to the liner tube 13 in a state where the release liner S is wound, which was used in the supply operation of the adhesive tape T to the tape applying section 4.

[0121] The tape applying section 4 applies the adhesive tape T to the circuit surface of the wafer W and then cuts the adhesive tape T along the shape of the wafer W. The tape applying section 4 corresponds to the tape processing section in the present invention.

[0122] like Figure 1 and Figure 3 As shown, the tape recovery unit 5 rewinds and recovers the unnecessary tape Tn conveyed from the tape applying unit 4 onto the winding core 15. In the present embodiment, the unnecessary tape Tn refers to the unnecessary portion of the adhesive tape T after the adhesive tape T is applied.

[0123] In addition, in this embodiment, "upstream" and "downstream" are defined along the feeding direction of the tape TS. That is, "upstream" refers to the side close to the tape supply unit 3 described later in the feeding direction of the tape TS. In addition, the adhesive tape T has a structure in which a non-adhesive base material and an adhesive layer having adhesive properties are laminated. As a material constituting the release liner S, a material that can be bonded by thermal bonding is more preferred.

[0124] like Figure 1As shown, the adhesive tape applying device 1 further includes a control unit 9 and an input unit 10. The control unit 9 includes a CPU (central processing unit) and the like, and performs unified control of various actions and the like for each structure provided in the adhesive tape applying device 1. Examples of the input unit 10 include a console panel, a keyboard, and the like, and the operator uses the input unit 10 to input various instructions. The instruction content input to the input unit 10 is sent to the control unit 9, and the control unit 9 can perform various controls according to the instruction.

[0125] <Structure of tape supply unit>

[0126] like Figure 6 As shown in the figures, the tape supply section 3 includes a plurality of tape holding units 25, a tape cutting mechanism 27, a guide roller 29, a joint tape making mechanism 31, a tape amount detection sensor 32, and a liner cutting mechanism 54. The tape holding unit 25 has a structure for holding the reel 11 and the liner bobbin 13 and for peeling off the release liner S from the tape TS wound on the reel 11.

[0127] Each tape holding unit 25 holds the drum roll 11. In the present embodiment, the tape supply unit 3 as a whole is provided with two tape holding units 25, namely, a first tape holding unit 25A and a second tape holding unit 25B. In addition, with respect to each structure provided in the tape holding unit 25, the structure provided in the tape holding unit 25A is marked with a reference numeral A, and the structure provided in the tape holding unit 25B is marked with a reference numeral B to distinguish between the two. As an example, Figure 6 As shown, of the two tape joint mechanisms 37 provided in the tape supply unit 3, the one provided in the first tape holding unit 25A is identified by being expressed as a tape joint mechanism 37A. Furthermore, the other one provided in the second tape holding unit 25B is expressed as a tape joint mechanism 37B. The tape holding unit 25 is equivalent to the reel holding unit in the present invention.

[0128] The tape supply unit 3 is provided with a release position G1 and a preparation position G2, and each tape holding unit 25 is configured to be movable between the release position G1 and the preparation position G2. The tape supply unit 3 is configured to be able to supply the adhesive tape T to the tape processing unit 4 from the roll 11 held by the tape holding unit 25 that has moved to the release position G1 among the plurality of tape holding units 25. Figure 6 , the tape supply unit 25A is moved to the unwinding position G1 and the tape supply unit 25B is moved to the standby position G2. In this state, the adhesive tape T can be unwound and supplied from the roll 11 held by the tape holding unit 25A to the tape processing section 4.

[0129] When the tape supply unit 25B moves to the unwinding position G1, the tape supply unit 25A moves to the preparation position G2 synchronously. In this case, the adhesive tape T can be unwound and supplied from the reel 11 held by the tape holding unit 25B to the tape applying section 4. Hereinafter, the reel 11 held by the tape supply unit 25 moved to the unwinding position G1 and in a state where the adhesive tape T can be supplied to the tape processing section 4 is referred to as the "working reel 11".

[0130] Figure 7 The structure of the tape supply unit 25 and the tape cutting unit 27 is shown. The tape supply unit 25 includes a movable wall 33, a roll support shaft 34, a tube support shaft 35, a liner guide roller 36, a tape joint mechanism 37, and a liner peeling roller 40. The movable wall 33 is a vertical wall extending in the xz plane, and is configured to be movable in the y direction and the z direction in the embodiment.

[0131] By appropriately moving the movable wall 33, the tape supply unit 25 is moved as a whole. For example, the movable wall 33A of the tape supply unit 25A retreats from the discharge position G1 in the y direction, whereby the movable wall 33B of the tape supply unit 25B rises in the z direction and moves from the preparation position G2 to the discharge position G1. On the other hand, the movable wall 33A that has moved backward descends in the z direction and advances in the y direction, whereby the tape supply unit 25A can move from the discharge position G1 to the preparation position G2.

[0132] As an example, the reel support shaft 34 is a cylindrical shaft, and supports the reel 11. The reel support shaft 34 is erected so as to protrude forward from the front surface of the movable wall 33. By fitting the hole 14 of the reel 11 with the reel support shaft 34, the tape supply unit 25 stably holds the reel 11.

[0133] The bobbin support shaft 35 is used to support the cushion bobbin 13, and is arranged below the roll support shaft 34. The bobbin support shaft 35 is erected so as to protrude forward from the front surface of the movable wall 33. By fitting the hole 16 of the cushion bobbin 13 with the bobbin support shaft 35, the tape supply unit 25 stably holds the cushion bobbin 13.

[0134] also, Figure 7 FIG. 2 shows a state where the tape supply unit 25 does not hold the reel 11 and the liner tube 13. Figure 7 In the tape supply unit 25 shown in FIG. 1 , the state of the reel support shaft 34 and the tube support shaft 35 can be visually confirmed from the front of the reel support shaft 34 and the tube support shaft 35. Figure 1 and Figure 2 , the state where the bobbin roll 11 and the liner bobbin 13 are held in the tape supply unit 25 is shown. Figure 2In the perspective view shown, for the sake of convenience of explanation, the description of the tape joining mechanism 37, the liner cutting mechanism 54, etc. is appropriately omitted.

[0135] The outer diameter of the roll support shaft 34 is configured to be slightly smaller than the inner diameter of the hole 14 formed in the center of the supply tube provided in the roll 11. Figure 5 The hole portion 14 formed along the central axis of the roll 11 shown in the figure is fitted into the roll support shaft 34 , whereby the roll 11 is stably supported by the roll support shaft 34 .

[0136] The liner guide roller 36 is disposed on the movable wall 33 at the lower left of the roll support shaft 34. The liner guide roller 36 winds the release liner S peeled off from the tape TS of the roll 11 supported by the roll support shaft 34 and guides it to the liner tube 13 supported by the tube support shaft 35. Figure 7 As shown in the figure, it is configured to be reciprocatingly movable in the up-down direction (z direction) along the lifting rail 38 extending in the z direction.

[0137] The liner guide roller 36 can move to the guide position H1 by ascending along the elevating rail 38, and can move to the retreat position H2 by descending along the elevating rail 38. The liner guide roller 36 can guide the release liner S to the liner tube 13 by moving to the guide position H1. The retreat position H2 is defined as a position that can avoid interference between the liner guide roller 36 and the tape joint mechanism 37 described later. That is, by moving the liner guide roller 36 to the retreat position H2, the tape joint mechanism 37 can join the release liner S to the liner tube 13 as described later.

[0138] The tape joint mechanism 37 includes a vertical lift table 39, an adhesive tape holding member 41, and a joint tape holding member 43. The vertical lift table 39 is configured to be movable in the z direction along a lift rail 44 extending in the z direction. As an example, the adhesive tape holding member 41 is a plate-shaped member connected to the vertical lift table 39 via a telescopic arm 45. That is, the adhesive tape holding member 41 is configured to be movable in the z direction by the vertical lift table 39.

[0139] The telescopic arm 45 is configured to be telescopic in the x direction, and the adhesive tape holding member 41 is reciprocated in the x direction by this telescopic movement. Figure 8 As shown, by extending the telescopic arm 45, the adhesive tape holding member 41 moves from the initial position B1 shown by the dotted line to the holding position B2 shown by the solid line along the x direction. The adhesive tape holding member 41 holds the adhesive tape T or the release liner S unrolled from the reel 11 by moving to the holding position B2. As an example of a preferred structure, the adhesive tape holding member 41 uses a suction device (not shown) to absorb and hold the adhesive tape T or the release liner S.

[0140] As with the adhesive tape holding member 41, as an example, the bonding tape holding member 43 is a plate-shaped member connected to the upper and lower lifting platforms 39 via a telescopic arm 47. That is, the bonding tape holding member 43 can be moved in the z direction by the lifting and lowering movement of the upper and lower lifting platforms 39. The bonding tape holding member 43 holds the bonding tape Ns produced by the bonding tape production mechanism 31. The bonding tape Ns is a strip used to join the rear end of the preceding adhesive tape T with the front end of the subsequent adhesive tape T. In the present embodiment, the bonding tape Ns is used to join the rear end of the adhesive tape cut from the used reel 11 with the front end of the adhesive tape T released from the unused reel 11 newly moved to the release position G1. Through this joining, the adhesive tape T loaded on the unused reel 11 can be supplied to the tape sticking section 4.

[0141] like Figure 6 As shown, the bonding tape manufacturing mechanism 31 has a cutter unit, which includes a cutter blade holder 48 and a cutter blade 49. The cutter blade holder 48 is configured to be reciprocating in the width direction (y direction) of the adhesive tape T by a driving mechanism not shown. In addition, the cutter blade holder 48 is configured to be reciprocating in the x direction between a cutting position where the adhesive tape T can be cut and an initial position away from the adhesive tape T.

[0142] The cutter blade 49 is disposed at the front end of the cutter blade holder 48. The cutter blade 49 cuts the adhesive tape T released from the reel 11 moved to the preparation position G2. In the present embodiment, the front end of the adhesive tape T released from the reel 11 is cut along the width direction by the joint tape production mechanism 31 to produce the joint tape Ns. The details of the process of producing the joint tape Ns by the joint tape production mechanism 31 will be described later.

[0143] The liner peeling roller 40 peels the release liner S from the adhesive tape T unwound from the reel 11. The liner peeling roller 40 is disposed downstream of the guide shaft 23 attached to the reel 11 when the reel 11 is mounted on the reel support shaft 34. By rotating the liner tube 13 with the release liner S wound thereon, the release liner S portion of the tape TS unwound from the reel 11 is folded back by the liner peeling roller 40. The release liner S is stretched while being folded back by the liner peeling roller 40, thereby Figure 5 As shown in (a) and the like, the release liner S is peeled off from the pressure-sensitive adhesive tape T at the downstream of the guide shaft 23 .

[0144] The angle θ1 at which the release liner S is folded back by the liner peeling roller 40 is preferably 90 degrees or more and 180 degrees or less. Figure 5The angle formed by the conveying direction of the adhesive tape T indicated by the reference numeral L1 in (b) and the folding direction of the release liner S indicated by the reference numeral L2. In other words, the conveying direction L1 corresponds to the direction in which the adhesive tape T unwound from the roll 11 is conveyed after passing over the liner peeling roller 40, and the folding direction L2 of the release liner S corresponds to the direction in which the release liner S is folded back by the liner peeling roller 40. By making the angle θ1 at which the release liner is folded back large, it is possible to more reliably avoid the phenomenon (adhesive residue) in which the release liner S is peeled off from the adhesive tape T in a state in which the layer of the adhesive material contained in the adhesive tape T is broken and a part of the adhesive material is peeled off from the adhesive tape T and attached to the release liner S.

[0145] The tape cutting mechanism 27 includes a cutter unit 50 and a preceding tape holding member 51. The cutter unit 50 includes a cutter blade holder 52 and a cutter blade 53. The cutter blade holder 52 is configured to be movable in the x direction and the y direction by a driving mechanism (not shown). That is, the cutter blade holder 52 moves in the x direction so as to approach or leave the adhesive tape T fed and released from the tape supply unit 3, and moves in the width direction of the adhesive tape T, that is, the y direction.

[0146] The cutter blade 53 is disposed at the front end of the cutter blade holder 52, and moves in the x direction or the y direction together with the cutter blade holder 52 to cut the adhesive tape T in the width direction. The tape cutting mechanism 27 cuts the adhesive tape T of the roll 11 disposed at the feeding position G1 and from which the adhesive tape T is fed, thereby separating the adhesive tape T supplied to the tape applying section 4 from the roll 11.

[0147] The leading tape holding member 51 is arranged on the downstream side of the cutter unit 50. The leading tape holding member 51 is configured to be movable in the x direction by a movable table not shown in the figure, and to reciprocate between a holding position where it can abut against the adhesive tape T to hold the adhesive tape T and an initial position away from the adhesive tape T. The leading tape holding member 51 holds the adhesive tape T released from the reel 11 to the tape applying portion 4 by moving to the holding position. As an example of a preferred structure, the adhesive tape holding member 41 uses a suction device not shown in the figure to absorb and hold the adhesive tape T or the release liner S. In a state where the leading tape holding member 51 holds the adhesive tape T, the cutter unit 50 cuts the adhesive tape T on the upstream side of the leading tape holding member 51, whereby the rear end portion of the adhesive tape T (leading tape Tm) cut off from the reel 11 is stably held by the leading tape holding member 51.

[0148] The guide roller 29 is provided on the downstream side of the tape cutting mechanism 27 , and winds up the adhesive tape T unwound from the roll 11 disposed at the unwound position G1 , and guides the adhesive tape T to the tape applying section 4 .

[0149] In the process of the preparation process according to step S6 described later, the tape joining mechanism 37 changes the bobbin 11 from the standby state to the preparation state. Figure 4 (a) is a perspective view showing the roll 11 in a standby state. Figure 4 (b) is a front view of the roll 11 in a standby state. Figure 5 (a) is a perspective view showing the roll 11 in a standby state. Figure 5 (b) is a front view of the roll 11 in a standby state.

[0150] In the present embodiment, the standby state refers to the state of the roll 11 protected by the release liner S over the entire length of the adhesive tape T. The roll 11 is in the standby state at a point in time before the roll 11 is carried into the tape supply unit 3 of the adhesive tape applying device 1. That is, when the roll 11 is stored in a storage room (not shown), the roll 11 is in the standby state, and the roll 11 in the standby state is loaded onto the roll support shaft 34 of the tape holding unit 25.

[0151] For the roll 11 in the standby state, as Figure 4 As shown in the figures of FIG. 1 , a predetermined amount of tape TS is pulled out from the roll 11, and the pulled-out tape TS is guided by the guide shaft 23 and maintained in a downwardly extending posture. Moreover, within the range of a predetermined length L of the front end portion of the tape TS, the adhesive tape T is previously removed in the entire width direction to expose the release liner S. The area of ​​the front end portion where the release liner S is exposed is joined to the unused liner bobbin 13 in the process involved in step S6 described later.

[0152] exist Figure 4 In the states shown in the figures, the adhesive tape T loaded on the unused roll 11 is provided with a release liner S over the entire length of the adhesive surface. Therefore, even when the roll 11 is placed in the preparation position G2 for a long time, the adhesive surface of the adhesive tape T is protected by the release liner S, so that the adhesiveness of the adhesive tape T can be prevented from being deteriorated. In addition, the area where the release liner S is exposed at the front end of the roll 11 in the standby state is defined as the liner front end Sa.

[0153] In this embodiment, the preparation process refers to the pre-processing required for the operation of joining the adhesive tape T cut from the used roll 11 to the new unused roll 11. Moreover, the preparation state refers to the state of the roll 11 that has undergone the preparation process. Figure 5As shown in the figures of FIG. 1 , the front end of the release liner S is peeled off from the adhesive tape T and joined to the liner tube 13. At this time, at the front end of the tape TS, a part of the adhesive tape T is peeled off from the release liner S, and a part of the adhesive surface of the adhesive tape T is exposed. The exposed front end V1 of the adhesive tape T is an area joined to the rear end V2 of the preceding tape Tm described later. As described later, by putting the reel 11 in a ready state before starting the reel replacement process involved in step S7, the time required for the process of replacing the reel 11 in step S7 can be shortened.

[0154] The tape amount detection sensor 32 is disposed at the unwinding position G1 in the tape supply unit 3. The tape amount detection sensor 32 detects at any time the amount of the adhesive tape T wound around the reel 11 (the reel 11 in operation) that has moved to the unwinding position G1 and can supply the adhesive tape T to the tape applying unit 4. Information on the amount of the adhesive tape T detected by the tape amount detection sensor 32 is sequentially transmitted to the control unit 9.

[0155] In the adhesive tape applying device 1, when the tape amount detection sensor 32 detects that the amount of adhesive tape T wound around the working reel 11 has decreased to below the specified value T1, the tape replacement process described later is started, and the reel 11 loaded in the tape supply unit 3 is automatically replaced. As the tape amount detection sensor 32, various sensors such as optical sensors are used. The tape amount detection sensor 32 is equivalent to the unwinding tape amount detection unit in the present invention.

[0156] The liner cutting mechanism 54 is as follows Figure 6 As shown in the figure, the release liner S is arranged at the unwinding position G1, and the portion of the release liner S that is unwinded from the roll 11 arranged at the unwinding position G1 and peeled from the adhesive tape T is cut. The liner cutting mechanism 54 includes a movable table and a cutter blade, and is movable in a direction approaching or leaving the release liner S and in a width direction of the release liner S. Then, the release liner S is cut in the width direction by the cutter blade connected to the movable table to be separated from the roll 11.

[0157] <Structure of adhesive tape>

[0158] like Fig. 9 As shown, the tape sticking section 4 includes a holding table 55, a tape sticking unit 57, a tape cutting unit 59, and a tape peeling unit 60. The holding table 55 carries and holds the wafer W with the circuit forming surface facing upward. In the present embodiment, a chuck table for adsorbing and holding the wafer W is used as the holding table 55, but the structure of the holding table 55 is not limited to this. In addition, a cutter travel groove 55a is formed on the upper surface of the holding table 55 so that a cutter blade 59c provided in the tape cutting unit 59 described later can be rotated along the outer shape of the wafer W to cut the adhesive tape T. The holding table 55 can also be a structure that can be appropriately lifted and lowered by a lifting table 55b or the like.

[0159] The tape sticking unit 57 sticks the adhesive tape T on the circuit surface of the wafer W placed on the holding table 55 and held by suction. The tape sticking unit 57 includes a movable table 57a that reciprocates horizontally left and right along a track (not shown) and a sticking roller 57b that is pivotally supported by a bracket connected to the movable table 57a. In addition, the movable table 57 is configured to be able to move up and down in the z direction along a lifting table (not shown).

[0160] The tape cutting unit 59 is provided with a support arm 59b at the bottom of a movable table 59a that can be driven to rise and fall so as to be driven to rotate around a longitudinal axis P located at the center of the holding table 55. In addition, a cutter 59c with a blade tip facing downward is mounted on the free end side of the support arm 59b. That is, the structure is such that the cutter 59c moves along the outer periphery of the wafer W and cuts the adhesive tape T by rotating the support arm 59b around the longitudinal axis P as the rotation center.

[0161] The tape stripping unit 60 separates the adhesive tape Tw cut by the cutter 59c and attached to the surface of the wafer W from the unnecessary tape Tn, which is the adhesive tape T that becomes unnecessary after the adhesive tape Tw is cut. The tape stripping unit 60 includes a guide roller 61 and a clamping roller 62, and the guide roller 61 maintains the tension of the unnecessary tape Tn. The clamping roller 62 is composed of a clamping roller 63 that can be moved up and down and a feed roller 64 driven by a motor. The tape stripping unit 60 is configured to be able to reciprocate horizontally left and right along a track not shown. The unnecessary tape Tn separated from the adhesive tape Tw by the tape stripping unit 60 is wound by the guide roller 61 and guided to the tape recovery unit 5.

[0162] <Structure of belt recovery unit>

[0163] Next, the structure of the belt recovery unit 5 will be described in detail. Fig.10 As shown, the tape recovery unit 5 is configured such that a plurality of winding core support shafts 67 are erected on a rotating plate 65, and the winding core 15 can be loaded on each winding core support shaft 67. In this embodiment, two winding core support shafts 67A and 67B are erected on the rotating plate 65. In addition, the tape recovery unit 5 is further provided with a guide roller 66, a guide roller 69, a joining unit 70, and a tape amount detection sensor 71.

[0164] As an example, the winding core support shaft 67 is a cylindrical shaft, and supports the winding core 15 that winds up and recovers the unnecessary tape Tn. As an example, by fitting the hole of the winding core 15 with the winding core support shaft 67, the tape recovery unit 5 stably holds the winding core 15. The winding core support shafts 67A and 67B are arranged at positions facing each other across the central axis 68 of the rotating plate 65.

[0165] The rotating plate 65 is configured to rotate around the central axis 68 by a driving mechanism (not shown). The winding core support shaft 67A and the winding core support shaft 67B can rotate in the rotating plate 65. Fig.10 The recovery position K1 and the standby position K2 shown are shifted relative to each other.

[0166] The tape recovery section 5 is configured to wind up the unnecessary tape Tn from the tape sticking section 4 onto the winding core 15 held by the winding core support shaft 67 moved to the recovery position K1 among the plurality of winding core support shafts 67. Moreover, the winding core support shaft 67 moved to the standby position K2 among the plurality of winding core support shafts 67 is loaded with unused winding cores 15 in advance, so as to be prepared for the case where the winding core 15 moved to the recovery position K1 winds up the unnecessary tape Tn in a predetermined amount or more. Hereinafter, the winding core 15 held by the winding core support shaft 67 moved to the recovery position K1 and in a state where the unnecessary tape Tn can be wound up and recovered is referred to as the "working winding core 15".

[0167] That is, when the amount of unnecessary tape Tn wound and recovered by the winding core 15 moved to the recovery position K1 reaches a predetermined allowable amount, the unused winding core 15 arranged at the standby position K2 can be quickly arranged at the recovery position K1 by rotating the rotating plate 65. Figure 3 and Fig.10 , the state in which the winding core support shaft 67A has moved to the recovery position G1 and the winding core support shaft 67B has moved to the standby position K2 is shown. In this state, the unnecessary tape Tn conveyed from the tape applying section 4 can be wound onto the winding core 15 held by the winding core support shaft 67A for recovery. The winding core support shaft 67 is equivalent to the winding core holding section in the present invention.

[0168] In the present embodiment, the unused winding core 15 refers to the winding core 15 used before the recovery process of the unnecessary tape Tn in the tape recovery section 5. As an example, the winding core 15 in a state where the unnecessary tape Tn is not wound corresponds to the unused winding core 15. Moreover, the used winding core 15 refers to the winding core 15 after the recovery process of the unnecessary tape Tn in the tape recovery section 5. As an example of the used winding core 15, a winding core 15 in a state where the amount of the wound unnecessary tape Tn reaches a predetermined allowable amount as a result of winding up a sufficient amount of the unnecessary tape Tn is cited.

[0169] also, Fig.10 FIG. 6 shows a state where the winding core 15 is not loaded on the winding core support shaft 67. Fig.10 In the tape recovery section 5 shown in FIG. 1 , the state of the winding core support shaft 67 can be visually confirmed from the front of the winding core support shaft 67. Figure 1 and Figure 3 , a state in which the winding cores 15 are loaded on the winding core support shafts 67A and 67B, respectively, is shown.

[0170] The guide roller 66 is arranged at a position between the winding core support shaft 67A and the winding core support shaft 67B near the outer periphery of the rotating plate 65. When the rotating plate 65 rotates, the unnecessary tape Tn is wound by the guide roller 66 and guided so as to form a track along the outer periphery of the rotating plate 65. The guide roller 69 winds up the unnecessary tape Tn fed out from the tape applying section 4 to guide the unnecessary tape Tn to the working winding core 15 located at the collection position K1.

[0171] The joining unit 70 is arranged near the recovery position K1 in the tape recovery section 5, and joins the unnecessary tape Tn with the unused winding core 15 newly moved to the recovery position K1. Fig.11 As shown, the joining unit 70 includes a rotation shaft 73 , a pivot arm 74 , an affixing roller 75 , and a cutter blade 77 .

[0172] The rotation shaft 73 is disposed at the base end of the pivot arm 74 and is configured to be rotatable around the axis in the y direction. The pivot arm 74 is configured to pivot around the rotation shaft 73 and supports the bonding roller 75 and the cutter blade 77. By rotating the rotation shaft 73, the pivot arm 74 is pivoted, so that the bonding unit 70 is moved in a certain direction. Fig.11 The device reciprocates between an engaging position P1 and a retreating position P2 indicated by a solid line.

[0173] The joining position P1 is a position where the joining unit 70 approaches the winding core 15 moved to the recovery position K1. By moving to the joining position P1, the joining unit 70 can join the unnecessary tape Tn to the winding core 15 moved to the recovery position K1. The retreat position P2 is a position where the joining unit 70 is away from the winding core 15 moved to the recovery position K1. When the rotating plate 65 is rotated to move the winding core 15 located at the recovery position K1 to the standby position K2, by moving the joining unit 70 to the retreat position P2 in advance, interference between the winding core 15 or the unnecessary tape Tn and the joining unit 70 can be avoided.

[0174] The pasting roller 75 is connected to the front end of the pivot arm 74 via the movable table 76. The pasting roller 75 is configured to be rotatable around the axis in the y direction, and the unnecessary tape Tn is pasted on the winding core 15 by rotating along the outer circumference of the winding core 15 moved to the recovery position K1. Through this pasting action, the unnecessary tape Tn can be joined to the unused winding core 15. The movable table 76 is configured to be movable in a direction approaching or away from the winding core 15 moved to the recovery position K1. By moving the movable table 76 close to the winding core 15, the pasting roller 75 can abut against the winding core 15.

[0175] The cutter blade 77 is disposed on the downstream side of the sticking roller 75, and is connected to the front end of the pivot arm 74 via a movable table 78. The movable table 78 is configured to be movable in a direction approaching or away from the unnecessary tape Tn wound around the winding core 15, and is configured to be movable in the width direction (y direction) of the unnecessary tape Tn. By moving the movable table 78, the cutter blade 77 cuts off the unnecessary tape Tn and separates it from the working winding core 15. The process in which the joining unit 70 joins the unnecessary tape Tn to the unused winding core 15 and the process in which the joining unit 70 cuts off the unnecessary tape Tn and separates it from the working winding core 15 will be described later.

[0176] The tape quantity detection sensor 71 is arranged at the recovery position K1 in the tape recovery section 3. The tape quantity detection sensor 71 successively detects the amount of unnecessary tape Tn wound up by the working winding core 15 arranged at the recovery position K1. When the tape quantity detection sensor 71 detects that the amount of unnecessary tape Tn wound up and recovered on the working winding core 15 is greater than the specified value M1, the winding core replacement process involved in the later-described step S8 is started, and the action of automatically replacing the winding core 15 loaded on the tape recovery section 5 is executed. As the tape quantity detection sensor 71, various sensors such as an optical sensor having a laser emitting section and a laser receiving section are used. The tape quantity detection sensor 71 is equivalent to the unnecessary tape detection section in the present invention.

[0177] <Outline of basic actions>

[0178] Here, a series of basic operations for attaching the circuit surface protective adhesive tape T to the wafer W using the adhesive tape attaching apparatus 1 according to the embodiment will be described. Fig.12 (a) is a flow chart for explaining a series of steps of attaching the adhesive tape T to the surface of the wafer W using the adhesive tape attaching apparatus 1 .

[0179] In addition, it is assumed that the tape supply section 3 is pre-loaded with the bobbin roll 11, and the tape recovery section 5 is pre-loaded with the winding core 15. Specifically, Figure 2 As shown in FIG. 1 , it is assumed that: in the tape supply section 3, the tape holding unit 25A moves to the unwinding position G1, and the tape holding unit 25B moves to the preparation position G2. In order to distinguish the plurality of reels 11 installed in the adhesive tape sticking device 1, the reel 11 held by the reel support shaft 34A of the tape holding unit 25A is set as the reel 11A. The unused reel 11 held by the reel support shaft 34B of the tape holding unit 25B is set as the reel 11B. That is, at the start time of step S1, the reel 11A is equivalent to the reel 11 in operation.

[0180] Similarly, in order to distinguish between a plurality of spacer tubes 13, the spacer tube 13 held by the tube support shaft 35A provided in the belt holding unit 25A at the start time of step S1 is set as the spacer tube 13A. Furthermore, the spacer tube 13 held by the tube support shaft 35B provided in the belt holding unit 25B at the start time of step S1 is set as the spacer tube 13B. The spacer tube 13B is set as an unused spacer tube 13.

[0181] In addition, if Figure 3 As shown in the figure, it is assumed that: in the tape recovery section 5, the winding core support shaft 67A moves to the recovery position K1, and the winding core support shaft 67B moves to the standby position K2. In order to distinguish the multiple bobbin rolls 11 installed in the adhesive tape sticking device 1, the winding core 15 held by the winding core support shaft 67A is set as the winding core 15A. The unused winding core 15 held by the winding core support shaft 67B is set as the winding core 15B. That is, at the start time point of step S1, the winding core 15A is equivalent to the working winding core 15. It is assumed that the winding core 15B is the unused winding core 15.

[0182] Step S1 (Wafer placement)

[0183] When a sticking instruction is issued via the control unit 9, the wafer W is placed on the holding table 55 in the tape sticking unit 4. That is, the wafer W stored in a predetermined storage unit is aligned on the alignment table and then placed on the holding table 55 by a wafer transfer mechanism (not shown). The wafer W placed on the holding table 55 is held by suction in a state where the wafer W is aligned so that the center of the wafer W is located on the center of the holding table 55 by rotating the wafer W.

[0184] At this time, the tape sticking unit 57, the tape cutting unit 59 and the tape peeling unit 60 are moved to Fig. 9 That is, the tape applying unit 59 has moved to the right side of the holding table 55, and the tape peeling unit 60 has moved to the left side of the holding table 55. In addition, the tape cutting unit 59 is on standby above the holding table 55.

[0185] Step S2 (Attachment of Adhesive Tape)

[0186] After the wafer W is placed on the holding table 55, the process of attaching the adhesive tape T to the surface of the wafer W begins. Figure 6As shown in the figure, the tape TS is fed downstream from the reel 11A loaded on the reel holding shaft 34A moved to the feeding position G1. The tape TS fed from the reel 11A is peeled off into the adhesive tape T and the release liner S by the liner peeling roller 40 downstream of the guide shaft 23. Then, the adhesive tape T is wound by the guide roller 29 and guided to the tape applying section 4. The release liner S peeled off from the adhesive tape T is guided by the liner guide roller 36A and wound onto the liner bobbin 13A.

[0187] On the other hand, in the tape pasting portion 4, as Fig.14 As shown, the tape sticking roller 57b of the tape sticking unit 57 presses the adhesive tape T downward while rotating to the left side of the figure on the wafer W, and moves from the initial position shown by the dotted line to the end position shown by the solid line along the x direction.

[0188] Step S3 (cutting of adhesive tape)

[0189] After the adhesive tape T is attached to the wafer W, the adhesive tape T is cut according to the shape of the wafer W. Fig.15 As shown, the tape cutting unit 59 waiting at the top is lowered and moves from the initial position shown by the dotted line to the cutting position shown by the solid line. And, by lowering the tape cutting unit 59 to the cutting position, the cutter 59c pierces the adhesive tape T in the cutter travel groove 55a of the holding table 55.

[0190] When the cutter 59c pierces the adhesive tape T, the support arm 59b rotates around the longitudinal axis P. Accordingly, the cutter 59c rotates while slidingly contacting the outer peripheral edge of the wafer W, thereby cutting the adhesive tape T along the outer shape of the wafer.

[0191] Step S4 (peeling off adhesive tape)

[0192] When the cutting of the adhesive tape T is completed, the operation of peeling off the unnecessary part of the adhesive tape T begins. Fig.16 As shown in FIG. 1 , the tape cutting unit 59 rises to the original standby position. Furthermore, the tape sticking unit 57 returns to the initial position from the end position. The tape sticking unit 57 returns to the initial position, and the tape stripping unit 60 moves to the right side of the figure along the x direction. That is, the tape stripping unit 60 moves from the end position to the initial position. Fig.17 The initial position indicated by the middle dotted line moves horizontally in the right direction toward the end position indicated by the solid line.

[0193] The tape stripping unit 60 moves to the end position while rolling up and stripping the unnecessary tape Tn remaining after the tape-shaped adhesive tape T is circularly cut and cut on the wafer W. In addition, the portion of the adhesive tape T attached to the surface of the wafer W is marked with a reference symbol Tw to distinguish it from the unnecessary tape Tn.

[0194] When the tape stripping unit 11 reaches the end position and the stripping operation is completed, the tape stripping unit 60 returns from the end position to the initial position. At this time, the unnecessary tape Tn is released downstream and transported from the tape sticking section 4 to the tape recovery section 5. The unnecessary tape Tn transported to the tape recovery section 5 is guided by the guide roller 69 to the recovery position K1 of the tape recovery section 5. And, the unnecessary tape Tn is rolled up by the winding core 15A arranged at the recovery position K1 for recovery. In synchronization with the action of recovering the unnecessary tape Tn in the tape recovery section 5, a certain amount of tape TS is released from the reel 11A arranged at the release position G1 in the tape supply section 3.

[0195] Step S5 (wafer recovery)

[0196] When each process up to step S4 is completed, the adsorption of the wafer W in the holding table 55 is released. After the adsorption is released, the wafer W with the adhesive tape Tw attached is transported by the wafer transport mechanism and recovered to the wafer recovery unit (not shown). At this point, the basic operation of one adhesive tape attachment process is completed. By appropriately repeating a series of basic operations from step S1 to step S5, the adhesive tape T is attached to a predetermined number of wafers W.

[0197] <Branch of process>

[0198] In the adhesive tape pasting device 1 involved in the present embodiment, the structure is as follows: during the adhesive tape pasting process of steps S1 to S5, according to the amount of adhesive tape T loaded on the working reel 11 arranged at the release position G1, a prescribed preparation process is performed on the reel 11 arranged at the preparation position G2 and an action of automatically replacing the reel 11 arranged at the release position G1 is performed.

[0199] Fig.12 (b) is a flowchart showing the branching of the process according to the loading amount of the adhesive tape T. When the amount of the adhesive tape T loaded on the roll 11A arranged at the release position G1 decreases to a predetermined value T1 or less (branch Q1), and the predetermined preparation process is not performed on the roll 11 arranged at the preparation position G2 (branch Q2), the preparation process is performed on the roll 11B arranged at the preparation position G2 (step S6). The process of step S6 is performed in the state where the adhesive tape sticking process involved in steps S1 to S5 is continuously performed.

[0200] When the preparation process is completed for the roll 11 disposed at the preparation position G2, the adhesive tape sticking process involved in steps S1 to S5 is further continued. Then, when the amount of adhesive tape T loaded on the roll 11A further decreases from the specified value T1 and becomes less than the predetermined specified value T2 due to the continued adhesive tape sticking process (branch Q3), the process of automatically replacing the roll 11A disposed at the release position G1 with the unused roll 11B is started (step S7).

[0201] In addition, the prescribed value T1 and the prescribed value T2 can be appropriately set according to the time required for the adhesive tape pasting process or the characteristics of the adhesive material constituting the adhesive tape T. As an example of the prescribed value T1, 10% to 20% of the amount of the adhesive tape T loaded in the unused reel 11 is cited. The prescribed value T1 is set to a threshold value at which the tape amount is greater than the tape amount of the prescribed value T2. As an example of the prescribed value T2, 0% to 5% of the amount of the adhesive tape T loaded in the unused reel 11 is cited. The prescribed value T1 is equivalent to the first prescribed amount in the present invention. The prescribed value T2 is equivalent to the second prescribed amount in the present invention. That is, when the adhesive tape T is continuously unwound and supplied from the reel 11, the timing when the amount of the adhesive tape T loaded in the reel 11 decreases to less than the prescribed value T1 is always earlier than the timing when the amount of the adhesive tape T loaded in the reel 11 decreases to less than the prescribed value T2.

[0202] In addition, in the adhesive tape applying device 1 of the present embodiment, during the adhesive tape applying process of steps S1 to S5, the winding core 15 arranged at the recovery position K1 is automatically replaced according to the amount of unnecessary tape Tn wound on the winding core 15 arranged at the recovery position K1. Fig.13 As shown in (b), when the amount of unnecessary tape Tn that has been wound and recovered on the winding core 15A arranged at the recovery position G1 is greater than a predetermined specified value M1 (branch Q4), a process of automatically replacing the winding core 15A arranged at the recovery position K1 with an unused winding core 15B is started (step S8). The specified value M1 corresponds to the third specified amount in the present invention.

[0203] Next, each process of the bobbin preparation process according to step S6, the automatic bobbin replacement according to step S7, and the automatic replacement of the winding core according to step S8 will be described in detail.

[0204] <Preparation process of the roll>

[0205] First, the bobbin preparation process step according to step S6 , that is, a series of processes for bringing the bobbin 11 in a standby state into a preparation state, will be described. Fig.13(a) is a flowchart illustrating a series of steps of performing preparation processing on the roll 11.

[0206] Step S6-1 (Maintaining the Front End of the Pad)

[0207] When the amount of adhesive tape T on the roll 11A to which the adhesive tape T is fed and supplied at the feeding position G1 becomes less than the predetermined value T1, it is predicted that the adhesive tape T wound on the roll 11A will be exhausted in the near future and the adhesive tape T can no longer be supplied from the roll 11A to the tape applying section 4. In other words, it is predicted that the operation of step S7 of replacing the working roll 11A with the unused roll 11B will be required in the near future. Therefore, before the roll replacement process involved in step S7 is actually required, the roll preparation process involved in step S6 is performed in advance.

[0208] When the tape amount detection sensor 32 detects that the amount of adhesive tape T loaded on the roll 11A in operation becomes less than T1, Fig.17 As shown, the information that the loading amount has become less than T1 is sent from the tape amount detection sensor 32 to the control unit 9. Then, the control unit 9 controls the tape holding unit 25B moved to the preparation position G2 by receiving the information, and starts the preparation process for the roll 11 (here, the roll 11B) arranged at the preparation position G2. In addition, before starting the preparation process, the pad guide roller 36B is lowered in advance to move from the guide position H1 to the retreat position H2.

[0209] When a command to start the preparation process of the roll 11 is issued via the control unit 9, the leading end of the liner in the roll 11 in the standby state is first held. Fig.17 As shown, the upper and lower lifting platforms 39B are appropriately raised and lowered and the telescopic arms 47B are extended to displace the joint tape holding member 43B in the x direction and the z direction. By this displacement, the joint tape holding member 43B abuts against the pad front end Sa of the roll 11B in the standby state. The pad front end Sa refers to Figure 4 The adhesive tape T is removed from the roll 11 in the standby state shown in (a) and the front end portion of the release liner S is exposed. When the bonding tape holding member 43B abuts against the liner front end Sa, the suction mechanism (not shown) is activated, so that the bonding tape holding member 43B adsorbs and holds the liner front end Sa.

[0210] Step S6-2 (Joining of the front end of the gasket)

[0211] When the gasket front end Sa is held by the engagement band holding member 43B, the process of engaging the gasket front end Sa with the gasket tube 13 is started. In this embodiment, the gasket tube 13 disposed at the preparation position G2 is the gasket tube 13B, so the engagement band holding member 43B engages the gasket front end Sa with the gasket tube 13B. Fig.18 As shown, the joint tape holding member 43B is lowered to the height at which the liner bobbin 13B is arranged while adsorbing and holding the liner front end portion Sa.

[0212] Then, by further extending the telescopic arm 47, the joint band holding member 43B gradually approaches the pad tube 13B, and the pad front end Sa is pressed against the outer periphery of the pad tube 13B. After the pad front end Sa is brought into contact with the pad tube 13B, the pad front end Sa is joined to the pad tube 13B. In addition, at this time, the pad peeling roller 40 is appropriately retracted to a position (not shown) where it can avoid interference with the joint band holding member 43B and the like.

[0213] In this embodiment, after the liner tip Sa is brought into contact with the liner tube 13B, the control unit 9 operates the heater built into the bonding tape holding member 43 to heat the liner tip Sa. The release liner S is made of a material that is thermally bonded, so the liner tip Sa is heated so that the liner tip Sa is bonded to the outer periphery of the liner tube 13B. By engaging the liner tip Sa with the liner tube 13B, the release liner S can be sequentially peeled off from the tape TS of the reel 11B and wound up for recovery by rotating the liner tube 13.

[0214] Step S6-3 (Maintaining the Adhesive Tape)

[0215] When the process of joining the release liner S to the liner tube 13B is completed, the process of holding the front end of the adhesive tape T in the roll 11B begins. When the adhesive tape holding process begins, the tape holding member 43B releases the suction holding of the liner front end Sa. Then, the telescopic arm 47 is shortened to separate the tape holding member 43B from the liner front end Sa. Fig.19 As shown, the tape holding member 43B is raised to the height of the front end of the adhesive tape T, and the telescopic arm 47 is extended again to make the tape holding member 43B contact the front end of the adhesive tape T. Then, the suction device is operated, so that the tape holding member 43B sucks and holds the front end of the adhesive tape T.

[0216] Step S6-4 (Exposure of Adhesive Tape)

[0217] When the adhesive tape T is held by the joint tape holding member 43B, the process of exposing the front end of the adhesive tape T is started. Fig. 20As shown in FIG. 1 , the liner guide roller 36B is moved from the retreat position H2 to the guide position H1. The liner guide roller 36B is returned to the guide position H1, and the liner peeling roller 40B is also returned to the guide position H1. Figure 1 or Fig. 22 The release liner S is wound around the liner guide roller 36B by moving the liner guide roller 36B to the guide position H1, thereby generating appropriate tension. The liner front end Sa is joined to the liner tube 13B to generate tension on the release liner S, so that the liner tube 13B can rewind the release liner S for recovery.

[0218] After the liner guide roller 36B is moved to the guide position H1, the liner tube 13B is rotated about the axis in the y direction to wind up the release liner S, while the bonding tape holding member 43B holding the adhesive tape T is lowered. The release liner S is wound up and recovered from the liner front end Sa by the liner tube 13B, so that the release liner S is gradually peeled off from the front end of the adhesive tape T released from the reel 11B, and the adhesive surface is exposed at the front end of the adhesive tape T. The front end of the adhesive tape T with the exposed adhesive surface is gradually pulled downward while being held by the bonding tape holding member 43B. The control unit 9 controls the vertical lifting platform 39 to lower the bonding tape holding member 43B to a position lower than the bonding tape making mechanism 31.

[0219] After the front end of the adhesive tape T is exposed, the adhesive tape holding member 41B further holds the adhesive tape T. That is, the telescopic arm 45B is extended in the tape joint mechanism 37B to make the adhesive tape holding member 41B contact the non-adhesive surface of the adhesive tape T. Then, the suction mechanism is operated to make the adhesive tape holding member 41B suck and hold the upstream area from the front end of the adhesive tape T. In addition, as Fig. 20 As shown, the control unit 9 controls the tape joining mechanism 37B to move the adhesive tape holding member 43B to a position lower than the cutter blade 49 provided in the joining tape manufacturing mechanism 31 , and on the other hand, to move the adhesive tape holding member 41B to a position higher than the cutter blade 49 .

[0220] Step S6-5 (Preparation of Joint Belt)

[0221] After the release liner S is peeled off from the front end of the adhesive tape T and the adhesive tape holding member 43B and the adhesive tape holding member 41B hold the adhesive tape T, the process of making the joint tape Ns using the joint tape making mechanism 31 is started. In the present embodiment, a part of the front end of the adhesive tape T on the roll 11B to be processed is cut by the joint tape making mechanism 31, and the front end portion that is cut into pieces is used as the joint tape Ns.

[0222] When the process of making the joint tape Ns is started, the control unit 9 drives the cutter blade 48 of the joint tape making mechanism 31 so that the cutter blade 49 moves from Fig. 20 The initial position shown is Fig.21 That is, the cutter blade 49 is moved in the direction approaching the adhesive tape T and in the width direction of the adhesive tape T. As a result, Fig.21 As shown, the leading end portion of the adhesive tape T unwound from the roll 11B is cut in the entire width direction at a predetermined position between the adhesive tape holding member 41B and the joint tape holding member 43B.

[0223] The front end of the adhesive tape T is cut off from the reel 11B by the adhesive tape making mechanism 31. Then, the front end cut off from the reel 11B is held by the adhesive tape holding member 43B as the adhesive tape Ns. The front end V1 of the adhesive tape T newly formed by the cutting is held by the adhesive tape holding member 41B.

[0224] After the cutting is completed, the joint tape making mechanism 31 returns to the initial position from the cutting position. In addition, the joint tape holding member 43 holding the joint tape Ns retreats to the left side in the x direction. By making the joint tape Ns by the joint tape making mechanism 31, the preparation process of the reel involved in step S6 is completed.

[0225] When the series of processes involved in step S6 are completed, the roll 11B is Figure 4 (a) and Figure 4 The standby state shown in (b) becomes Figure 5 (a) and Figure 5 In the ready state shown in (b) of the reel 11B. In the ready state, the leading end portion V1 of the adhesive tape T in the tape TS loaded in the reel 11B is held by the adhesive tape holding member 41B. In addition, the leading end portion Sa of the release liner S in the tape TS is peeled off from the adhesive tape T and wound onto the liner bobbin 13B.

[0226] In this embodiment, the roll preparation process of step S6 is performed in the state of executing the adhesive tape pasting process involved in steps S1 to S5, when the adhesive tape filling amount of the roll 11A arranged at the unwinding position G1 becomes less than T1 as a trigger. When the roll 11B arranged at the preparation position G2 becomes the preparation state, the adhesive tape pasting process involved in steps S1 to S5 is continued until the process of step S7 is required. That is, the adhesive tape T is continuously unwound and supplied from the roll 11A until the adhesive tape filling amount of the roll 11A further decreases and becomes less than the predetermined amount T2.

[0227] <Automatic reel replacement process>

[0228] Next, the automatic reel replacement process according to step S7 , that is, automatically replacing the used reel 11 arranged at the feeding position G1 with the unused reel 11 arranged at the preparation position G2 , will be described. Fig.13 (b) is a flowchart illustrating a series of steps for replacing the used roll 11A arranged at the feeding position G1 with the unused roll 11B.

[0229] Step S7-1 (stopping belt conveyance)

[0230] When the adhesive tape T is further continuously unwound from the state where the loading amount of the adhesive tape T on the roll 11A is the specified value T1, the loading amount of the adhesive tape T on the roll 11A becomes a specified value T2 which is lower than the specified value T1. When the loading amount of the adhesive tape T on the roll 11A in operation arranged at the unwinding position G1 becomes less than the specified value T2, the adhesive tape T on the roll 11A is exhausted, and it is determined that it is difficult to supply the adhesive tape T from the roll 11A to the tape applying section 4.

[0231] Therefore, when the tape amount detection sensor 32 detects that the amount of adhesive tape T on the working reel 11A has become less than T2, the information that the amount of adhesive tape T has become less than T2 is sent from the tape amount detection sensor 32 to the control unit 9. Then, the control unit 9 controls the tape supply unit 3 by receiving the information, and starts the process of replacing the reel arranged at the feeding position G1 from the reel 11A whose amount of adhesive tape T has become less to the reel 11B which is in an unused state and whose amount of adhesive tape T is sufficiently large.

[0232] When the control unit 9 issues a command to start the automatic replacement process of the reel 11, first, the action of conveying the adhesive tape T is temporarily stopped. That is, the control unit 9 performs control to stop each structure of the adhesive tape applying device 1, for example, a mechanism that rotates the reel 11 arranged at the unwinding position G1 and the winding core 15 arranged at the recovery position K1. By this control, the rotation of the working reel 11 and the rotation of the working winding core 15 are stopped, so the action of unwinding and supplying the adhesive tape T from the working reel 11 and the action of winding and recovering the unnecessary tape Tn by the working winding core 15 are interrupted. Therefore, the adhesive tape applying process involved in steps S1 to S5 is temporarily interrupted.

[0233] Step S7-2 (cutting of adhesive tape)

[0234] After the conveyance of the adhesive tape T is interrupted, the adhesive tape T conveyed to the tape applying section 4 is cut off from the working roll 11A. First, the control section 9 controls the tape cutting mechanism 27 to make the preceding tape holding member 51 hold the adhesive tape T. The preceding tape holding member 51 is as shown in FIG. Fig. 22As shown in (a), the preceding tape holding member 51 moves from the initial position shown by the dotted line to the holding position shown by the solid line. By moving to the holding position, the preceding tape holding member 51 abuts against the non-adhesive surface of the adhesive tape T. Then, the suction mechanism (not shown) is operated, so that the preceding tape holding member 51 holds the adhesive tape T by suction.

[0235] Next, the control unit 9 controls the cutter unit 50 to cut the adhesive tape T on the upstream side of the preceding tape holding member 51. That is, the control unit 9 drives the cutter blade holder 52 of the cutter unit 50 so that the cutter blade 53 moves from Fig. 22 The initial position shown in (a) is moved to Fig. 22 That is, the cutter blade 53 is moved in the direction approaching the adhesive tape T and in the width direction of the adhesive tape T. As a result, Fig. 22 As shown in (b), the adhesive tape T released from the roll 11A is cut in the entire width direction on the upstream side of the portion held by the leading tape holding member 51. The conveyance of the adhesive tape T is stopped before starting the process of step S7-2, so the cutter unit 50 can accurately cut the adhesive tape T.

[0236] The adhesive tape T is cut in the entire width direction, so that the adhesive tape T being conveyed toward the tape pasting section 4 is cut off from the reel 11A. In addition, the portion of the adhesive tape T cut off from the reel 11A is set as "preceding tape Tm" to distinguish it from the portion of the adhesive tape T connected to the reel 11A. The adhesive tape T is cut by the cutter unit 50, so that the rear end portion V2 of the preceding tape Tm is held by the preceding tape holding member 51. When the adhesive tape T is cut, the cutter unit 50 returns to the initial position. In addition, in order to avoid interference in the process of exchanging the positions of the tape holding units 25A and 25B described later, the preceding tape holding member 51 holding the preceding tape Tm and the guide roller 29 guiding the preceding tape Tm can also be configured to further retreat.

[0237] Step S7-3 (cutting of release liner)

[0238] After the adhesive tape T is cut to separate the preceding tape Tm from the used roll 11A, the operation of cutting the release liner S to separate it from the roll 11A is started. Fig.23 As shown in FIG. 1 , the liner cutting mechanism 54 disposed at the unwinding position G1 is operated to cut the release liner S unwinding from the reel 11A and peeling off the adhesive tape T. The release liner S cut off from the reel 11A is wound onto the liner bobbin 13A. In addition, the process of step S7-3 is completed, and the tape supply unit 3 in a state where the adhesive tape T and the release liner S are cut off from the reel 11A is as shown in FIG. Fig.24 shown.

[0239] Step S7-4 (Interchange of holding units)

[0240] After the adhesive tape T is cut, the position of the tape holding unit 25 is interchanged. When the process of step S7-2 is started, the control unit 9 interchanges the positions of the tape holding units 25A and 25B by appropriately controlling the driving units of the movable wall 33A of the tape holding unit 25A and the movable wall 33B of the tape holding unit 25B.

[0241] In this embodiment, specifically, the movable wall 33A located at the release position G1 is retreated in the y direction, and the movable wall 33B located at the preparation position G2 is raised. By raising the movable wall 33B, the belt holding unit 25B originally located at the preparation position G2 is moved to the release position G1. Furthermore, the movable wall 33A retreated from the release position G1 is lowered in the z direction and further advanced in the y direction, so that the movable wall 33A is moved to the preparation position G2. As a result, the belt holding unit 25A originally located at the release position G1 is moved to the preparation position G2.

[0242] By this drive control, the tape holding unit 25A holding the used reel 11A is moved to the preparation position G2, while the tape holding unit 25B holding the unused reel 11B in the preparation state is moved to the feeding position G1. The tape supply unit 3 in the state where the positions of the tape holding units 25A and 25B are interchanged and the process of step S7-4 is completed is shown in FIG. Fig.25 That is, the structure provided to the tape holding unit 25, such as the tape engaging mechanism 37, moves together with the tape holding unit 25 in step S7-4. On the other hand, the structure not connected to the tape holding unit 25, such as the tape amount detection sensor 32, does not move in step S7-4.

[0243] The roll 11B disposed in the tape holding unit 25B has completed the preparation process involved in step S6. Therefore, by moving the tape holding unit 25B to the release position G1, the tape holding unit 25B is released. Fig.25 As shown, the adhesive tape holding member 41B holding the front end V1 of the adhesive tape T loaded on the reel 11B moves to a position corresponding to the upstream of the leading tape holding member 51 holding the rear end V2 of the leading tape Tm. Furthermore, the joining tape holding member 43B holding the joining tape Ns moves to a position downstream of the adhesive tape holding member 41B and upstream of the leading tape holding member 51.

[0244] Step S7-5 (joining of adhesive tape)

[0245] After the position of the tape holding unit 25 is interchanged to move the unused reel 11B to the unloading position G1, the process of joining the adhesive tape is started. That is, in step S7-5, the preceding tape Tm cut from the used reel 11A is joined to the adhesive tape T of the unused reel 11B newly arranged at the unloading position G1. Fig.26 (a) shows the state of the belt holding unit 25B immediately before the process of step S7-5 is started.

[0246] When the process of step S7-5 is started, the control unit 9 controls the telescopic arm 47B to move the bonding tape holding member 43B. By this control, the bonding tape holding member 43B that has retreated to the left side in the x direction moves to the right side in the x direction to gradually approach the adhesive tape T. As a result, Fig.26 As shown in (b), the joint tape Ns held by the joint tape holding member 43B is bonded to the rear end V2 of the preceding tape Tm and the front end V1 of the adhesive tape T loaded on the reel 11B. The preceding tape Tm is bonded to the adhesive tape T of the reel 11B by bonding the joint tape Ns to the rear end V2 of the preceding tape Tm and the front end V1 of the adhesive tape T. Fig.26 In (b), the joining tape Ns is attached to the non-adhesive surface of the rear end portion V2 and the non-adhesive surface of the front end portion V1, but the joining tape Ns may be attached to the adhesive surface of the rear end portion V2 and the adhesive surface of the front end portion V1.

[0247] Step S7-6 (Restart of belt conveyance)

[0248] By joining the reel 11B newly arranged at the feeding position G1 with the preceding tape Tm, a large amount of adhesive tape T loaded with the unused reel 11B can be fed and supplied to the tape applying section 4. Therefore, when the process of joining the adhesive tape involved in step S7-5 is completed, the action of conveying the adhesive tape T is restarted. That is, the control section 9 controls the actions of the various components of the adhesive tape applying device 1 to restart, for example, the mechanism for rotating the reel 11 arranged at the feeding position G1 and the winding core 15 arranged at the collection position K1.

[0249] By this control, the rotation of the working reel 11B and the rotation of the working winding core 15A are restarted, so the action of unwinding and supplying the adhesive tape T from the reel 11B and the action of winding and recovering the unnecessary tape Tn by the winding core 15A are restarted. Therefore, the adhesive tape applying process involved in steps S1 to S5 is restarted. That is, the processes of step S7-7 and step S7-8 in step S7 can be performed in the state of executing the adhesive tape applying process.

[0250] Step S7-7 (carrying out the roll)

[0251] When the series of actions of attaching the adhesive tape T to the wafer W is started again through the process of step S7-6, the action of unloading the used roll 11 from the tape supply unit 3 is started. That is, in the state where the adhesive tape attaching process involved in steps S1 to S5 is being performed, Fig. 27 The roll 11A is pulled out from the roll support shaft 34A as shown. The used roll 11A pulled out from the roll support shaft 34A is carried out from the adhesive tape applying device 1 and stored in a storage room not shown in the figure. The operation of pulling the roll 11A out from the roll support shaft 34A can be performed manually by an operator or automatically by an operating robot.

[0252] After the roll 11A is unloaded from the tape supply unit 3, the tape 11A is also Fig. 27 As shown, the used liner bobbin 13A is also carried out from the tape supply unit 3. At this point, the process of step S7-7 is completed.

[0253] Step S7-8 (carrying in rolls)

[0254] By unloading the used reel 11A and the cushion bobbin 13A from the tape supply unit 3 , the reel 11 and the cushion bobbin 13 are not arranged at the preparation position G2 of the tape supply unit 3 .

[0255] Therefore, after the used reel 11A and the cushion tube 13A are carried out from the preparation position G2 of the tape supply unit 3, the operation of carrying the unused reel 11 and the cushion tube 13 into the preparation position G2 of the tape supply unit 3 is started. In the present embodiment, the unused reel 11C and the unused cushion tube 13C are newly carried into the tape supply unit 3.

[0256] When the process of step S7-8 is started, the roll 11C stored in a storage room (not shown) is brought into the tape supply unit 3. Fig.28 As shown, the reel 11C is attached to the reel support shaft 34 (here, the reel support shaft 34A included in the tape holding unit 25A) included in the tape holding unit 25 moved to the preparation position G2.

[0257] After the unused bobbin roll 11C is carried into the tape supply unit 3, the unused cushion bobbin tube 13C is carried into the tape supply unit 3. Fig.28 As shown, the spacer bobbin 13C is attached to the bobbin support shaft 35 (here, the bobbin support shaft 35A) provided in the tape holding unit 25 moved to the preparation position G2. At this point, the process of step S7-8 is completed.

[0258] By executing the processes of step S7-1 to step S7-8, the reel replacement process involved in step S7 is completed. Thereafter, while the adhesive tape applying process involved in steps S1 to S5 is executed in the adhesive tape applying device 1, the processes of step S6 and step S7 are executed according to the loading amount of the adhesive tape T in the reel 11 arranged at the feeding position G1.

[0259] That is, when the adhesive tape T is unwound from the reel 11B disposed at the unwinding position G1 and the adhesive tape sticking process is performed, the amount of adhesive tape T loaded on the reel 11B gradually decreases. Then, when the amount of adhesive tape T loaded becomes less than the predetermined value T1, the preparation process involved in step S6 is automatically performed on the reel 11C in the standby state disposed at the preparation position G2 to change the reel 11C from the standby state to the preparation state.

[0260] After that, when the amount of adhesive tape T loaded on the roll 11B decreases to less than the specified value T2 and the roll 11B becomes a used-up state, the process of step S7 is started. That is, the adhesive tape sticking process is temporarily interrupted, and the roll 11C in the prepared state is moved from the preparation position G2 to the release position G1. The roll 11C moved to the release position G1 is joined with the preceding tape Tm, and the adhesive tape sticking process is started again. On the other hand, the roll 11B in the used-up state is moved from the release position G1 to the preparation position G2, and then is unloaded from the preparation position G2.

[0261] The process of carrying out the used reel 11 and the backing tube 13 and the process of carrying out the unused reel 11 and the backing tube 13 to the tape supply unit 3 can be performed while the adhesive tape sticking process involved in steps S1 to S5 is continued. Therefore, the process of carrying out and carrying in the reel 11 and the like can be performed without reducing the efficiency of the process of sticking the adhesive tape on the wafer W.

[0262] In addition, in the present embodiment, at the time of starting the roll replacement process involved in step S7, the roll preparation process involved in step S6 has been completed. Therefore, the roll 11 newly arranged at the release position G1 in step S7 is already in a ready state, and the pre-processing required for joining with the adhesive tape T cut from the roll 11 in step S7 has been completed.

[0263] That is, the release liner S is bonded to the liner bobbin 13, and the release liner S can be peeled off from the adhesive tape T and wound up. In addition, the bonding tape Ns is held by the bonding tape holding member 43, and the bonding tape Ns can be quickly attached to the adhesive tape T. Therefore, the time required for the process of step S7-5 can be shortened, so the operation of attaching the adhesive tape T to the wafer W can be quickly restarted. Therefore, the processing efficiency of the adhesive tape attaching device 1 can be improved.

[0264] In addition, the reel 11 that has been moved into the preparation position G2 becomes a standby state at the time point after being moved in, and the adhesive surface of the adhesive tape T is protected by the release liner S. As an example, it takes several hours to more than ten hours to release all the adhesive tape T loaded on the reel 11, so it takes a long time from the beginning of supplying the adhesive tape T from the reel 11 in the unused state until the loading amount of the adhesive tape T on the reel is reduced to less than the specified amount T1. Therefore, by keeping the reel 11 arranged in the preparation position G2 in the standby state until the loading amount of the adhesive tape T on the reel 11 arranged in the pasting position G1 becomes less than the specified amount T1, the time when the adhesive surface of the adhesive tape T on the reel 11 arranged in the preparation position G2 is exposed can be shortened. Therefore, it is possible to prevent the adhesive force of the adhesive tape T on the unused reel 11 arranged in the preparation position G2 from deteriorating.

[0265] <Automatic replacement process of winding core>

[0266] Next, the automatic replacement process of the winding core according to step S8 , that is, the process of automatically replacing the used winding core 15 arranged at the collection position K1 with the unused winding core 15 arranged at the standby position K2 , will be described. Fig.13 (c) is a flowchart explaining a series of steps of replacing the winding core arranged at the collection position K1 from the used winding core 15A to the unused winding core 15B.

[0267] Step S8-1 (stopping belt conveyance)

[0268] The winding core 15A disposed at the recovery position K1 is initially in the state as follows: Fig.29 However, when the adhesive tape pasting process involved in steps S1 to S5 is performed, as shown in (a) of FIG. Fig.29 As shown in (b), the amount of the unnecessary tape Tn wound on the winding core 15A arranged at the recovery position K1 gradually increases. The amount of the unnecessary tape Tn that can be wound and recovered by the winding core 15 has an upper limit. Therefore, when the amount of the unnecessary tape Tn wound and recovered by the winding core 15A becomes greater than the specified value M1, it is determined that it is difficult to recover the unnecessary tape Tn conveyed from the tape sticking section 4 by the winding core 15A.

[0269] Therefore, when the tape amount detection sensor 71 detects that the amount of the unnecessary tape Tn that has been wound and recovered by the working winding core 15A is greater than the specified value M1, the tape amount detection sensor 71 sends information that the amount of the unnecessary tape Tn recovered is greater than M1 to the control unit 9. Then, the control unit 9 controls the tape recovery unit 5 by receiving the information, and starts the process of replacing the winding core 15 disposed at the recovery position G1 from the winding core 15A, in which the amount of the unnecessary tape Tn recovered has reached the allowable amount and it is difficult to recover the unnecessary tape Tn, to the winding core 15B that is in an unused state and has not wound the unnecessary tape Tn.

[0270] When the control unit 9 issues a command to start the automatic replacement process of the winding core 15, first, the action of conveying the adhesive tape T is temporarily stopped. That is, the control unit 9 performs control to stop the various structures of the adhesive tape applying device 1, such as the mechanism for rotating the reel 11 arranged at the unwinding position G1 and the winding core 15 arranged at the recovery position K1. By this control, the rotation of the working reel 11 and the rotation of the working winding core 15 are stopped, so the action of unwinding and supplying the adhesive tape T from the reel 11 and the action of winding and recovering the unnecessary tape Tn by the winding core 15 are interrupted. Therefore, the adhesive tape applying process involved in steps S1 to S5 is temporarily interrupted.

[0271] Step S8-2 (Replacement of winding core)

[0272] After the conveyance of the adhesive tape T is interrupted, the position of the winding core support shaft 67 holding the winding core 15 is interchanged. In this embodiment, specifically, the position of the winding core support shaft 67 is interchanged between the recovery position K1 and the standby position K2 by rotating the rotating plate 65 by 180 degrees. By rotating the rotating plate 65, the guide roller 66 connected to the rotating plate 65, the winding core support shaft 67, and the winding core 15 loaded on the winding core support shaft 67 are also rotated.

[0273] Fig.30 (a) shows a state where the rotating plate 65 is rotated 90° counterclockwise. The unnecessary tape Tn wound on the winding core 15A is wound on the guide roller 66 newly moved to the collection position K1. Therefore, the track for conveying the unnecessary tape Tn is a track along the outer periphery of the rotating plate 65. Fig.30(b) shows a state in which the rotating plate 65 is rotated 180° counterclockwise. The recovery position K1 and the standby position K2 are positions facing each other across the rotating shaft 68. Therefore, by rotating the rotating plate 65 180°, the used winding core 15A originally configured at the recovery position K1 is moved to the standby position K2. On the other hand, the unused winding core 15B originally configured at the standby position K2 is moved to the recovery position K1. By interchanging the positions of the two winding cores 15 between the recovery position K1 and the standby position K2, the process of step S8-2 is completed.

[0274] Step S8-3 (cutting of the tape is not necessary)

[0275] At the time point when the process of step S8-2 is completed, the unnecessary tape Tn is guided by the guide roller 69, the winding core 15B, and the guide roller 66 and connected to the winding core 15A. That is, the unnecessary tape Tn is connected to the winding core 15A that has been used, while the unnecessary tape Tn is not connected to the unused winding core 15B that has been newly configured at the recovery position K1. In order to wind up and recover the unnecessary tape Tn with the winding core 15B, it is necessary to join the end of the unnecessary tape Tn to the winding core 15B. Therefore, as a preparatory stage for joining the unnecessary tape Tn to the unused winding core 15B, an action of cutting the unnecessary tape Tn at the recovery position K1 to newly form the end of the unnecessary tape Tn is performed.

[0276] When the process of step S8-3 is started, the control unit 9 operates the joining unit 70 to cut off the unnecessary tape Tn at the collection position G1. Fig.31 As shown in (a), the rotation shaft 73 is rotated to move the joining unit 70 from the retreat position P2 to the joining position P1. By moving the joining unit 70 to the joining position P1, the unnecessary tape Tn is sandwiched and fixed by the attaching roller 75 and the winding core 15B.

[0277] After the unnecessary tape Tn is fixed, the unnecessary tape Tn is cut using the cutter blade 77. That is, the movable table 78 holding the cutter blade 77 is moved in a direction close to the unnecessary tape Tn, and the movable table 78 is moved in the width direction of the unnecessary tape Tn. By the movement of the movable table 78, as shown in FIG. Fig.31 As shown in (b), the cutter blade 77 cuts the unnecessary tape Tn in the width direction at the downstream side of the position sandwiched by the adhesive roller 75 and the winding core 15B. At the time of starting the process of step S8-3, the conveyance of the adhesive tape T is stopped, so the cutter blade 77 can accurately cut the unnecessary tape Tn.

[0278] By cutting the unnecessary tape Tn, the unnecessary tape Tn being conveyed from the tape applying section 4 to the tape collecting section 5 is separated from the used winding shaft 15A moved to the standby position K2. By separating the unnecessary tape Tn from the used winding shaft 15A, a new front end portion V3 is formed in the unnecessary tape Tn on the upstream side of the separated portion. The unnecessary tape Tn on the downstream side of the separated portion is wound onto the winding core 15A by the rotation of the winding core 15A.

[0279] Step S8-4 (joining of belts not required)

[0280] After the unnecessary tape Tn is cut off from the used winding core 15A, the unnecessary tape Tn is joined to the unused winding core 15 newly arranged at the collection position K1. In this embodiment, the unnecessary tape Tn is joined to the winding core 15B. Fig.32 As shown, by causing the movable table 76 to rock around the connection portion with the pivot arm 74, the sticking roller 75 rotates on the outer periphery of the winding core 15B, pressing the front end V3 of the unnecessary tape Tn onto the winding core 15B.

[0281] The front end portion V3 of the unnecessary tape Tn is pressed so that the adhesive surface at the front end portion V3 of the unnecessary tape Tn is brought into close contact with the outer peripheral surface of the winding core 15B, thereby joining the unnecessary tape Tn to the winding core 15B. Fig.33 1 shows the tape recovery section 5 in a state where the unnecessary tape Tn is separated from the winding core 15A and the front end portion V3 of the unnecessary tape Tn is joined to the winding core 15B. After that, the joining unit 70 is retracted from the joining position P1 to the retracted position P2. The unnecessary tape Tn is joined to the unused winding core 15B newly moved to the recovery position K1, thereby completing the process of step S8-4.

[0282] Step S8-5 (Restart of belt conveyance)

[0283] By joining the take-up core 15B newly arranged at the collection position K1 with the unnecessary tape Tn, the unnecessary tape Tn conveyed from the tape applying section 4 can be taken up and recovered by the unused take-up core 15B. Therefore, when the process of joining the unnecessary tape involved in step S8-4 is completed, the action of conveying the adhesive tape T is restarted. That is, the control unit 9 controls the actions of the various components of the adhesive tape applying device 1 to restart, for example, the mechanism for rotating the roll 11 arranged at the feeding position G1 and the take-up core 15 arranged at the collection position K1.

[0284] By this control, the rotation of the reel 11B arranged at the unwinding position G1 is started, and the rotation of the winding core 15B arranged at the recovery position K1 is started, so that the operation of unwinding and supplying the adhesive tape T from the reel 11B and the operation of winding and recovering the unnecessary tape Tn by the winding core 15B are started. Therefore, the adhesive tape applying process involved in steps S1 to S5 is restarted. That is, the processes of step S8-6 and step S8-7 in step S8 can be performed in the state of executing the adhesive tape applying process.

[0285] Step S8-6 (carrying out the winding core)

[0286] When the series of actions of sticking the adhesive tape T on the wafer W is started again, the action of unloading the used winding core 15 from the tape recovery unit 5 is started. That is, in the state where the adhesive tape sticking process involved in steps S1 to S5 is being performed, Fig.34 As shown in the figure, the winding core 15A in the used state is pulled out from the winding core support shaft 67A. The used winding core 15A pulled out from the winding core support shaft 67A is moved out from the belt recovery unit 5 and stored in a storage room, etc., not shown. The operation of pulling the winding core 15A out of the winding core support shaft 67A can be performed manually by an operator or automatically by an operation robot.

[0287] Step S8-7 (carrying in the winding core)

[0288] By carrying out the used winding core 15A from the standby position K2 of the tape collecting section 5 , a state is achieved where no winding core 15 is arranged at the standby position K2 of the tape collecting section 5 .

[0289] Therefore, after the used winding core 15A is carried out from the standby position K2 of the tape collecting section 5, the unused winding core 15 is carried into the standby position K2 of the tape collecting section 5. In this embodiment, the unused winding core 15C is newly carried into the tape collecting section 5.

[0290] When the process of step S8-7 is started, the winding core 15C stored in a storage room (not shown) is moved to the tape recovery section 5. Fig.35 As shown, the winding core 15C is mounted on the winding core support shaft 67 (here, the winding core support shaft 67A) moved to the standby position K2. At this point, the process of step S8-7 is completed.

[0291] By executing the processes from step S8 - 1 to step S8 - 7 , the automatic replacement process of the winding core according to step S8 is completed. Fig.36The state in which the process of step S8 is completed is shown. Thereafter, while the adhesive tape applying process of steps S1 to S5 is executed in the adhesive tape applying device 1, the process of step S8 is executed according to the amount of unnecessary tape T collected on the winding core 15 disposed at the collection position K1.

[0292] That is, when the adhesive tape pasting process is further performed in the state where the winding core 15B is moved to the recovery position K1, the unnecessary tape Tn is wound onto the working winding core 15B for recovery, and the amount of the unnecessary tape Tn wound onto the winding core 15B gradually increases. Then, when the amount of the unnecessary tape Tn wound onto the winding core 15B increases to or above the specified value M1 and the winding core 15B becomes a used-up state, the adhesive tape pasting process is temporarily interrupted, and the unused winding core 15C pre-configured to the standby position K2 is moved from the standby position K2 to the recovery position K1. The winding core 15C moved to the recovery position K1 is engaged with the unnecessary tape Tn, thereby restarting the adhesive tape pasting process. On the other hand, the winding core 15B that has become a used-up state is moved from the recovery position K1 to the standby position K2, and then is carried out from the standby position K2.

[0293] The process of carrying out the used winding core 15 and the process of carrying out the unused winding core 15 to the tape recovery unit 5 can be performed while the adhesive tape sticking process involved in steps S1 to S5 is continued. Therefore, the process of carrying out and carrying in the winding core 15 can be performed without reducing the efficiency of the process of sticking the adhesive tape on the wafer W.

[0294] <Effects of the Structure of the Embodiment>

[0295] In the adhesive tape sticking device 1 according to the above-mentioned embodiment, the tape supply section 3 is provided with a plurality of tape holding units 25 for holding the reel 11. In addition, there are a discharge position G1 and a preparation position G2 in the tape supply section 3. Furthermore, the adhesive tape T is discharged and supplied from the reel 11 held by the tape holding unit 25 moved to the discharge position G1 in the reel holding section provided in the tape supply section to the tape processing section 3. On the other hand, the reel 11 that does not supply the adhesive tape T to the tape processing section 3 at the current time point is arranged at the preparation position G2.

[0296] Therefore, in the structure of the embodiment, the mechanism for supplying the adhesive tape from the tape supply section 3 to the tape applying section 4, such as the guide roller 29, does not need to be provided for each tape holding unit 25, but only for the tape holding unit 25 moved to the discharge position G1, so that the adhesive tape applying process can be properly performed. Therefore, even if a structure has a plurality of tape holding units 25, it is sufficient to have only one mechanism for supplying the adhesive tape to the tape applying section 4, such as the guide roller 29, so that the structure of the adhesive tape applying device 1 can be further simplified.

[0297] Furthermore, the configuration is such that the reel 11 can be carried into the tape holding unit 25 moved to the preparation position G2 among the plurality of tape holding units 25 provided in the tape supply unit 3. Therefore, while the operation of supplying the adhesive tape T from the reel 11 moved to the discharge position G1 to the tape applying unit 4 to apply the adhesive tape T to the wafer W continues, the unused reel 11 can be replenished to the preparation position G2 of the tape supply unit 3. That is, there is no need to stop the operation of applying the adhesive tape T to the wafer W when the unused reel 11 is replenished to the tape supply unit 3, so the efficiency of the adhesive tape applying process can be improved.

[0298] In addition, in the adhesive tape applying device 1 according to the embodiment, before executing the process (step S7) of replacing the reel 11 arranged at the applying position G1 and supplying the adhesive tape T, the preparation process (step S6) of changing the reel 11 arranged at the preparation position G2 from the standby state to the ready state is executed in advance. In other words, the reel 11 arranged at the preparation position G2 is initially in the standby state.

[0299] When the amount of adhesive tape T in the working reel 11 arranged at the pasting position G1 becomes less than the specified value T1, the supply of the adhesive tape T on the reel 11 at the pasting position G1 is continued, and the preparation process is performed on the unused reel 11 arranged at the preparation position G2. Furthermore, when the amount of adhesive tape T on the reel 11 arranged at the pasting position G1 is further reduced and becomes less than the specified value T2, the supply of the adhesive tape T on the reel 11 at the pasting position G1 is stopped, and the process of replacing the reel 11 is performed.

[0300] In the preparation process involved in step S6, the release liner is peeled off from the front end of the adhesive tape T wound on the roll 11 to expose a portion of the adhesive surface of the adhesive tape T. Then, the release liner S peeled off from the adhesive tape T is joined to the liner bobbin 13, so that the release liner S can be wound up and recovered by the liner bobbin 13.

[0301] This preparation process is a pre-processing required for starting the operation of unwinding and supplying the adhesive tape T from the unused roll 11 after the adhesive tape T cut from the used roll 11 is joined to the new unused roll 11. When starting step S7, it is necessary to temporarily stop the adhesive tape sticking process involved in steps S1 to S5. On the other hand, the preparation process involved in step S6 can be performed without temporarily stopping the adhesive tape sticking process.

[0302] Therefore, by performing the preparation process involved in step S6 during the adhesive tape pasting process to prepare the reel 11 arranged at the preparation position G2, the time and process required to release and supply the adhesive tape T after the reel 11 is moved to the pasting position G1 can be reduced. As a result, compared with the conventional structure in which the reel replacement operation including the preparation process is performed only after the adhesive tape loaded on the reel is exhausted, in the structure involved in the embodiment, the time for stopping the adhesive tape pasting process when the used reel 11 is replaced with a new unused reel 11 can be shortened, so the efficiency of the adhesive tape pasting process can be improved.

[0303] In step S6 of the embodiment, the preparation process of the roll 11 is automatically performed by the control of the control unit 9. That is, as an example, it is not necessary for the operator to manually perform the following operations: pull out the tape TS from the unused roll 11 and peel off the release liner S from the adhesive tape T to join the release liner S to the liner tube 13. Therefore, compared with the conventional replacement process in which the release liner S is manually joined to the liner tube 13 and the roll 11 is manually loaded onto the roll support shaft 34 at the attachment position G1, the burden on the operator can be reduced in the roll replacement process of the embodiment.

[0304] In addition, the tape recovery section 5 has a recovery position K1 and a standby position K2, and has a structure capable of arranging a plurality of winding cores 15. That is, the winding core 15 that is the object of the operation for recovering the unnecessary tape Tn conveyed from the tape sticking section 4 is arranged at the recovery position K1, and the unnecessary tape Tn is recovered by the winding core 15. On the other hand, the winding core 15 that is not performing the operation of recovering the unnecessary tape Tn at the current time point is arranged at the standby position K2. By having such a structure, it is possible to arrange the winding core 15 in a working state at the recovery position K1 to perform the operation of recovering the unnecessary tape Tn, while performing an operation different from the recovery operation at the standby position K2 in parallel with the recovery operation at the recovery position K1.

[0305] For example, when the used winding core 15 is carried out from the tape recovery unit 5, the used winding core 15 is arranged from the recovery position K1 to the standby position K2, so that the operation of carrying out the used winding core 15 from the standby position K2 can be performed while the operation of carrying out the unnecessary tape Tn using the other winding core 15 located at the recovery position K1 is performed. That is, when carrying out the used winding core 15, it is not necessary to stop the operation of collecting the unnecessary tape Tn, so it is possible to avoid a decrease in the efficiency of the process of attaching the adhesive tape T to the wafer W due to the operation of carrying out the used winding core 15 from the standby position K2.

[0306] Furthermore, the process of moving the winding core 15 between the recovery position K1 and the standby position K2 can be performed by automatic operation using the rotating plate 65, etc. That is, the conveying process can be more highly automated, thereby further reducing the burden on the operator and further improving the efficiency of the adhesive tape processing process for the wafer W.

[0307] In the embodiment, a part of the adhesive tape T is cut off and the cut piece is used as the joint tape Ns. Therefore, when the unused roll 11 newly arranged at the release position G1 is joined with the preceding tape Tm, it is not necessary to prepare in advance other tapes other than the adhesive tapes T to be joined as the joint tape Ns. In addition, it is not necessary to provide a structure for supplying the other tapes or a structure for attaching the other tapes to the adhesive tape T to be joined. Therefore, it is possible to avoid the situation where the preparation for joining the adhesive tapes is complicated, and the adhesive tape sticking device 1 is enlarged and the cost increases.

[0308] Furthermore, since a part of the adhesive tape T is used as the joining tape Ns, the properties of the joining tape Ns are the same as those of the adhesive tape T to be joined. Therefore, a situation where the adhesive force between the joining tape Ns and the adhesive tape T to be joined is low can be reliably avoided. Therefore, it is possible to more reliably prevent the occurrence of joining errors due to re-peeling at the joining portion.

[0309] <Structure of Modification Example>

[0310] In addition, the embodiments disclosed this time are illustrative and non-restrictive in all aspects. The scope of the present invention is not shown by the description of the above-mentioned embodiments, but by the claims, and also includes all changes (modifications) within the meaning and scope equivalent to the claims. As an example, the present invention can be modified and implemented as follows.

[0311] (1) In each embodiment, the two reels 11A and 11B disposed in the tape supply section 3 are respectively held by the tape holding unit 25A and the tape holding unit 25B as separate members, but the invention is not limited thereto. That is, it is also possible to make a rotating member hold the two reels 11A and the reel 11B, such as the rotating plate 65 that holds the two winding cores 15A and 15B. In this case, similar to the structure of the tape recovery section 5 in which the winding core 15 is moved between the recovery position K1 and the standby position K2 by rotating the rotating plate 65, it is possible to set a structure in which the reel 11 is moved between the release position G1 and the preparation position G2 by rotating the rotating member.

[0312] In addition, the tape recovery unit 5 is not limited to the structure in which the two winding cores 15A and 15B are held by the rotating plate 65 as one component, and the winding core 15A may be held by one of two holding units independent of each other, and the winding core 15B may be held by the other holding unit. In this case, the holding unit holding the winding core 15B is moved from the standby position K2 to the recovery position K1 in synchronization with the movement of the holding unit holding the winding core 15A from the recovery position K1 to the standby position K2, thereby moving the winding core 15A to the standby position K2 while moving the winding core 15B to the recovery position K1.

[0313] (2) In the embodiment, a part of the adhesive tape T supplied from the roll 11 is cut off and the cut piece is used as the joint tape Ns, but the present invention is not limited to this. That is, it is also possible to configure such that: a tape piece supply device pre-loaded with a large number of fragmented joint tapes Ns is provided in the tape supply unit 3, and the tape piece supply device supplies the fragments of the adhesive tape Ns to the joint tape holding member 43. In this case, the structure of the cutter blade 49 and the like in the joint tape manufacturing mechanism 31 can be omitted.

[0314] (3) In the embodiment, as an adhesive tape processing step for semiconductor workpieces, a process of sticking an adhesive tape T for circuit protection on the surface of wafer W is exemplified, but the adhesive tape processing step for semiconductor workpieces is not limited to this. As another example of the adhesive tape processing step, a process of making a loading rack in which a dicing tape is stuck over wafer W and a ring rack and an integrated loading rack is mentioned. In addition, as another example of the adhesive tape processing step, a process of sticking a strip-shaped adhesive tape (peeling tape) for peeling off the protective tape stuck on the surface of wafer W and a process of peeling off the protective tape and the peeling tape from wafer W are mentioned.

[0315] (4) In the embodiment, a wafer W is exemplified as a semiconductor workpiece, but the present invention is not limited thereto. As other examples of semiconductor workpieces, semiconductor substrates and the like are cited. In addition, the shape of the semiconductor workpiece is not limited to a circle, and may be any shape such as a rectangular shape, a polygonal shape, or an elliptical shape. In addition, when the semiconductor workpiece is a rectangular shape or a polygonal shape, it may be a shape with sharp corners or a shape with rounded corners.

[0316] (5) In the embodiment, in the process of replacing the winding core 15 involved in step S8, the process of stopping the conveyance of the adhesive tape T involved in step S8-1 is performed, but step S8-1 may be omitted. As an example, a guide roller 69 or the like is added to extend the conveyance path of the unnecessary tape Tn (adhesive tape T), thereby enabling the winding core 15 to be replaced without stopping the conveyance of the adhesive tape T. In such a structure, the process of replacing the winding core 15 can be performed while the operation of sticking the adhesive tape T on the wafer W is continued, thereby improving the yield of the device.

[0317] (6) In the embodiment, the structure in which the tape TS having the release liner S added to the adhesive tape T is loaded in the roll 11 is illustrated, but the structure without the release liner S may be used. That is, the roll 11 may be a structure in which the strip-shaped adhesive tape T without the release liner S is wound. In the case of such a modified example, the liner bobbin 13 for winding and recovering the release liner S and the liner peeling roller 40 as an auxiliary member for peeling the release liner S from the adhesive tape T can be omitted, so that the structure of the adhesive tape applying device 1 can be further simplified.

[0318] (7) In the embodiment, the process of replacing the reel 11 in the tape supply section 3 (step S7) is performed when the amount of adhesive tape T on the reel 11 in operation that has moved to the release position G1 becomes less than the specified value T2. On the other hand, the process of replacing the winding core 15 in the tape recovery section 5 (step S8) is performed when the amount of unnecessary tape Tn on the winding core 15 in operation that has moved to the recovery position K1 becomes greater than the specified value M1. That is, in the embodiment, a structure is formed in which the process of replacing the reel 11 and the process of replacing the winding core 15 are separately performed when different conditions are satisfied. Here, it is not limited to a structure in which the process of replacing the reel 11 and the process of replacing the winding core 15 are performed when different conditions are satisfied, and a structure in which they are synchronously performed when a single condition is satisfied may be used.

[0319] As a modified example of synchronously executing the process of replacing the reel 11 and the process of replacing the winding core 15, a structure is provided in which, when the amount of the adhesive tape T in the working reel 11 moved to the release position G1 becomes less than the specified value T2, the process of replacing the reel 11 and the process of replacing the winding core 15 are synchronously executed. In this case, when the tape amount detection sensor 32 detects that the amount of the adhesive tape T on the working reel 11 is less than the specified value T2, the control unit 9 controls the various structures such as the tape supply unit 3 and the tape recovery unit 5 to execute both the process of step S7 and the process of step S8.

[0320] As another example of a modification of synchronously executing the process of replacing the bobbin roll 11 and the process of replacing the winding core 15, the following structure can be cited: when the amount of unnecessary tape Tn in the working winding core 15 moved to the recovery position K1 becomes greater than the specified value M1, the process of replacing the bobbin roll 11 and the process of replacing the winding core 15 are synchronously executed. In this case, when the tape amount detection sensor 71 detects that the amount of unnecessary tape Tn in the working winding core 15 is greater than the specified value M1, the control unit 9 controls each structure such as the tape supply unit 3 and the tape recovery unit 5 to execute both the process of step S7 and the process of step S8.

[0321] In addition, the following structure may be adopted: in the structure in which the tape supply section 3 is provided with the tape amount detection sensor 32 and the tape recovery section 5 is provided with the tape amount detection sensor 71, both the process of step S7 and the process of step S8 are executed when any of the sensors detects a prescribed condition. That is, the following structure may be adopted: when any of the conditions that the tape amount detection sensor 32 detects that the amount of adhesive tape T on the working roll 11 is less than the prescribed value T2 and the tape amount detection sensor 71 detects that the amount of unnecessary tape Tn on the working take-up core 15 is greater than the prescribed value M1 is satisfied, both the process of step S7 and the process of step S8 are executed.

[0322] In the configuration of the modified example in which step S7 and step S8 are executed synchronously, the frequency of stopping the tape sticking process of steps S1 to S5 to execute the replacement process involved in step S7 or step S8 can be reduced compared to the configuration in which step S7 and step S8 are executed at different times. Therefore, the processing efficiency in the adhesive tape sticking device 1 can be further improved. In addition, since step S7 and step S8 are controlled synchronously, the control program in the control unit 9 can be further simplified.

[0323] (8) In step S8-4 of the embodiment, the process of joining the unnecessary tape Tn to the unused winding core 15 is described as an example in which the process is performed in a state where the unused winding core 15 is moved from the standby position K2 to the recovery position K1, but the present invention is not limited thereto. That is, the unnecessary tape Tn may be joined to the unused winding core 15 in a state where the unused winding core 15 is arranged at the standby position K2. In this case, the process of exchanging the position of the winding core 15 in step S8-2 is performed after the process of joining the unnecessary tape Tn to the unused winding core 15 in step S8-4.

[0324] (9) In each embodiment, the structure in which the release liner S is peeled off from the adhesive tape T using the liner peeling roller 40 for the tape TS unwound from the working roll 11 is exemplified, but the structure for assisting the peeling of the release liner S is not limited to the liner peeling roller 40 which is a roller-shaped member. As other examples of the structure for assisting the peeling of the release liner S, the following are mentioned: Fig.38 (a) and Fig.38 (b) shows a peeling rod 98. As an example of the peeling rod 98, Fig.38 As shown in (a), it is a columnar member extending in the width direction (y direction) of the pressure-sensitive adhesive tape T and includes a front end portion 98a for folding back the release liner S. The angle θ2 of the front end portion 98a is preferably an acute angle.

[0325] Fig.38 (b) shows a modified example structure in which a peeling bar 98 is used as an auxiliary material to peel the release liner S from the adhesive tape T. The peeling bar 98 is arranged so that the front end portion 98a faces the conveying direction L1 (downstream side) of the adhesive tape T. In this case, by rotating the liner bobbin 13 in a state where the release liner S is wound, the portion of the release liner S in the tape TS unwound from the reel 11 is folded back by the front end portion 98a of the peeling bar 98. Moreover, the release liner S is stretched while being folded back by the peeling bar 98, and the release liner S is peeled from the adhesive tape T at the downstream of the guide shaft 23.

[0326] When the angle θ2 of the front end 98a is an acute angle, the angle θ1 at which the release liner S is folded back is greater than 90 degrees and less than 180 degrees. In this case, since the folded back angle θ1 is sufficiently large, adhesive residue when the release liner S is peeled off from the adhesive tape T can be more reliably avoided.

[0327] (10) In each embodiment, the system for automatically replacing the bobbin roll 11 in the tape supply unit 3 and the system for automatically replacing the winding core 15 in the tape collection unit 5 are described as examples in which the operation is automatically started based on the information detected by the tape amount detection sensor 32 or the tape amount detection sensor 71, but the present invention is not limited thereto. That is, the system for automatically replacing the bobbin roll 11 in the tape supply unit 3 and the system for automatically replacing the winding core 15 in the tape collection unit 5 may be configured to start the operation by an operator inputting an instruction to the input unit 10. In other words, the process of step S6, step S7, and step S8 may be started by the operator manually operating the input unit 10.

[0328] Description of Reference Numerals

[0329] 1: Adhesive tape pasting device (tape processing device); 3: Tape supply unit; 4: Tape pasting unit (tape processing unit); 5: Tape recovery unit; 11: Coil; 13: Liner tube; 14: Hole; 15: Winding core; 16: Hole; 23: Guide shaft; 25: Tape holding unit; 27: Tape cutting mechanism; 29: Guide roller; 31: Joint tape making mechanism; 32: Tape amount detection sensor; 33: Movable wall; 34: Coil support shaft; 35: Tube support shaft; 36: Liner guide roller; 37: Tape joint mechanism; 38: Lifting rail; 39: Up and down lifting platform; 40: Liner peeling roller; 41: Adhesive tape holding member; 43: Joint tape holding member; 45: Telescopic arm; 46: Coil support shaft; 47: Coil support shaft; 48: Coil guide roller; 49: Coil support shaft; 50: Coil stripping roller; 51: Adhesive tape holding member; 52: Coil stripping member; 53: Coil stripping member; 54: Coil stripping member; 55: Coil stripping member; 56: Coil stripping member; 57: Coil stripping member; 58: Coil stripping member; 59: Coil stripping member; 60: Coil stripping member; 61: Coil stripping member; 62: Coil stripping member; 63: Coil stripping member; 64: Coil stripping member; 65: Coil stripping member; 66: Coil stripping member; 67: Coil stripping member; 68: Coil stripping member; 69: Coil stripping member; 70: Coil stripping member; 71: Coil stripping member; 72: Coil stripping member; 73: Coil stripping 7: telescopic arm; 48: cutter blade holder; 49: cutter tool; 50: cutter unit; 51: advance tape holding member; 52: cutter blade holder; 53: cutter tool; 54: pad cutting mechanism; 55: holding table; 57: tape pasting unit; 59: tape cutting unit; 60: tape peeling unit; 65: rotating plate; 67: winding core support shaft; 69: guide roller; 70: bonding unit; 71: tape amount detection sensor; W: wafer (semiconductor workpiece); TS: tape; T: adhesive tape; S: peeling pad (isolation member); Tn: unnecessary tape; Ns: bonding tape; G1: release position; G2: preparation position; K1: recovery position; K2: standby position.

Claims

1. A tape processing device for semiconductor workpieces, characterized in that: have: a tape supply unit including a plurality of roll holding units for holding rolls of adhesive tape, and the tape supply unit causes the roll held by the roll holding unit moved to a releasing position among the roll holding units to release the adhesive tape; a tape processing section for performing a predetermined process on a semiconductor workpiece using the adhesive tape discharged from the tape supply section; as well as The tape recovery section includes a plurality of winding core holding sections for holding a winding core capable of winding up unnecessary tape, and the tape recovery section winds up the unnecessary tape in a roll onto the winding core held by the winding core holding section moved to a recovery position in the winding core holding section for recovery, wherein the unnecessary tape is an unnecessary portion of the adhesive tape after the prescribed treatment has been performed. The tape supply unit is configured to feed a new roll into the roll holding unit moved to the standby position while feeding the adhesive tape from the roll moved to the feeding position. The tape collecting section is configured to be able to carry out the winding core from the winding core holding section moved to the standby position while winding the unnecessary tape onto the winding core moved to the collecting position for collection.

2. The tape processing device for semiconductor workpieces according to claim 1, characterized in that: The tape supply unit comprises: a preparation processing mechanism for performing a preparation processing on the roll moved to the preparation position, wherein the preparation processing is a processing for causing the roll to unwind a portion of the adhesive tape and prepare for joining of the adhesive tape; a cutting mechanism for cutting the adhesive tape released from the roll moved to the release position to separate the adhesive tape from the roll; a configuration changing mechanism for moving the roll holding portion holding the roll that has undergone the preparation process from the preparation position to the release position; as well as The tape joining mechanism joins the adhesive tape cut from the roll by the cutting mechanism to the roll that has been subjected to the preparation process and moved to the unwinding position.

3. The tape processing device for semiconductor workpieces according to claim 2, characterized in that: Also available: a tape-release amount detecting section for detecting the amount of the adhesive tape wound around the roll moved to the release position; a configuration changing mechanism control unit that controls the operation of the configuration changing mechanism according to the amount of the adhesive tape detected by the unwinding tape amount detection unit; as well as a preparation processing mechanism control unit that controls the operation of the preparation processing mechanism according to the amount of the adhesive tape detected by the unwinding tape amount detection unit, When the unwinding tape amount detection unit detects that the amount of the adhesive tape wound around the reel moved to the unwinding position is less than a predetermined amount, the configuration change mechanism control unit controls the configuration change mechanism to move the reel holding unit located at the preparation position toward the unwinding position. When the unwinding tape amount detector detects that the amount of the adhesive tape wound around the roll moved to the unwinding position is less than the specified amount, the preparation processing mechanism control unit controls the operation of the preparation processing mechanism to perform the preparation processing on the roll moved to the preparation position.

4. The tape processing device for semiconductor workpieces according to claim 3, characterized in that: When the unwinding tape amount detection unit detects that the amount of the adhesive tape wound around the reel moved to the unwinding position is less than a predetermined first specified amount, the preparation processing mechanism control unit controls the operation of the preparation processing mechanism to perform the preparation processing on the reel moved to the preparation position. The configuration change mechanism control unit is configured to control the configuration change mechanism to move the roll holding unit located at the preparation position toward the release position when the release tape amount detection unit detects that the amount of the adhesive tape wound around the roll moved to the release position is less than a predetermined second specified amount. The first prescribed amount is prescribed as a threshold value at which the tape amount is larger than the second prescribed amount.

5. The tape processing device for semiconductor workpieces according to claim 1, characterized in that: The belt recovery unit comprises: an unnecessary tape cutting mechanism for cutting the unnecessary tape unwound to the first winding core moved to the collection position and separating the unnecessary tape from the winding core; a recovery section configuration changing mechanism that moves the winding core holding section that is located at the standby position and holds the second winding core from the standby position to the recovery position to newly configure the second winding core to the recovery position; as well as The unnecessary tape joining mechanism joins the unnecessary tape cut off from the first winding core by the unnecessary tape cutting mechanism to the second winding core.

6. The tape processing device for semiconductor workpieces according to claim 5, characterized in that: Also available: an unnecessary tape detecting section that detects the amount of the unnecessary tape wound onto the take-up core moved to the collection position; and a collecting section configuration change control section that controls the operation of the collecting section configuration change mechanism according to the amount of the unnecessary tape detected by the unnecessary tape detection section, Among them, when the unnecessary tape detection unit detects that the amount of the unnecessary tape that has been wound onto the winding core that has moved to the recovery position is greater than a third specified amount, the recovery unit configuration change control unit controls the recovery unit configuration change mechanism to move the winding core holding unit that is located at the standby position and holds the second winding core toward the recovery position.

7. The tape processing device for semiconductor workpieces according to claim 1, characterized in that: The device further comprises at least one of a released tape amount detector for detecting the amount of the adhesive tape wound around the roll moved to the release position and an unnecessary tape detector for detecting the amount of the unnecessary tape wound onto the take-up core moved to the collection position. The tape supply unit is provided with a roll replacement system, and the roll replacement system comprises: a preparation processing mechanism for performing a preparation processing on the roll moved to the preparation position, wherein the preparation processing is a processing for causing the roll to unwind a portion of the adhesive tape and prepare for joining of the adhesive tape; a cutting mechanism for cutting the adhesive tape released from the roll moved to the release position to separate the adhesive tape from the roll; a configuration changing mechanism for moving the roll holding portion holding the roll that has undergone the preparation process from the preparation position to the release position; as well as a tape joining mechanism for joining the adhesive tape cut from the roll by the cutting mechanism to the roll that has undergone the preparation process and moved to the unwinding position, The tape recovery section is provided with a winding core replacement system, and the winding core replacement system comprises: an unnecessary tape cutting mechanism for cutting the unnecessary tape unwound to the first winding core moved to the collection position and separating the unnecessary tape from the winding core; a recovery section configuration changing mechanism that moves the winding core holding section that is located at the standby position and holds the second winding core from the standby position to the recovery position to newly configure the second winding core to the recovery position; as well as an unnecessary tape joining mechanism for joining the unnecessary tape cut off from the first winding core by the unnecessary tape cutting mechanism to the second winding core moved to the recovery position by the recovery portion configuration changing mechanism, The roll replacement system and the winding core replacement system are controlled to start operation when the unwinding tape amount detection unit detects that the amount of the adhesive tape wound around the roll moved to the unwinding position is below a first threshold value, or when the unnecessary tape detection unit detects that the amount of the unnecessary tape wound onto the winding core moved to the recovery position is above a second threshold value.

8. The tape processing device for semiconductor workpieces according to claim 1, characterized in that: It also includes an input unit for inputting instructions from an operator, The tape supply unit is provided with a roll replacement system, and the roll replacement system comprises: a preparation processing mechanism for performing a preparation processing on the roll moved to the preparation position, wherein the preparation processing is a processing for causing the roll to unwind a portion of the adhesive tape and prepare for joining of the adhesive tape; a cutting mechanism for cutting the adhesive tape released from the roll moved to the release position to separate the adhesive tape from the roll; a configuration changing mechanism for moving the roll holding portion holding the roll that has undergone the preparation process from the preparation position to the release position; as well as a tape joining mechanism for joining the adhesive tape cut from the roll by the cutting mechanism to the roll that has undergone the preparation process and moved to the unwinding position, The tape recovery section is provided with a winding core replacement system, and the winding core replacement system comprises: an unnecessary tape cutting mechanism for cutting the unnecessary tape unwound to the first winding core moved to the collection position and separating the unnecessary tape from the winding core; a recovery section configuration changing mechanism that moves the winding core holding section that is located at the standby position and holds the second winding core from the standby position to the recovery position to newly configure the second winding core to the recovery position; as well as an unnecessary tape joining mechanism for joining the unnecessary tape cut off from the first winding core by the unnecessary tape cutting mechanism to the second winding core moved to the recovery position by the recovery portion configuration changing mechanism, The reel replacement system is controlled to start operation in response to an instruction for starting replacement of the reel being input to the input unit. The winding core replacement system is controlled so as to start operation in response to an instruction for starting replacement of the winding core being input to the input unit.

9. A method for replacing a tape for a semiconductor workpiece, for replacing a roll of an adhesive tape in a tape processing device for a semiconductor workpiece, the tape processing device for a semiconductor workpiece comprising: a tape supply unit having a plurality of roll holding units for holding the roll of the adhesive tape, and the tape supply unit causes the roll held by the roll holding unit moved to a releasing position among the roll holding units to release the adhesive tape; and a tape processing unit that uses the adhesive tape discharged from the tape supply unit to perform a predetermined process on a semiconductor workpiece, wherein the tape replacement method for a semiconductor workpiece is characterized in that: The process includes: a preparation process for performing a preparation process on the reel located at a preparation position provided in the tape supply section, wherein the preparation process is a process for causing the reel to unwind a portion of the adhesive tape and prepare for joining of the adhesive tape; A cutting process is to cut the adhesive tape released from the roll located at the release position and separate it from the roll located at the release position; a configuration changing process of moving the roll holding portion holding the roll that has undergone the preparation process from the preparation position to the release position; a tape joining process of joining the adhesive tape cut from the roll in the cutting process to the roll that has undergone the preparation process and moved to the unwinding position; In the finished roll unloading process, the roll cut from the adhesive tape by the cutting process is unloaded while the adhesive tape is supplied to the tape processing section by the roll joined by the tape joining process at the unloading position; as well as The roll carrying-in process is to carry a new roll into the roll holding portion located at the preparation position after the used roll carrying-out process.

10. A method for replacing a tape for a semiconductor workpiece, for replacing a winding core capable of winding up an unnecessary tape in a tape processing device for a semiconductor workpiece, the tape processing device for a semiconductor workpiece comprising: a tape processing unit, which uses an adhesive tape to perform a prescribed process on the semiconductor workpiece; and a tape recovery unit, which comprises a plurality of winding core holding units for holding the winding core capable of winding up the unnecessary tape, and the tape recovery unit winds up the unnecessary tape in a roll onto the winding core held by the winding core holding unit moved to a recovery position in the winding core holding unit for recovery, wherein The unnecessary tape is a portion of the adhesive tape that is unnecessary after the prescribed treatment is performed, and the tape replacement method for a semiconductor workpiece is characterized by comprising the following steps: an unnecessary tape cutting process of cutting the unnecessary tape released toward the first winding core located at the recovery position and separating the unnecessary tape from the first winding core; The recovery section configuration change process moves the winding core holding section located at a standby position provided in the belt recovery section and holding the second winding core from the standby position to the recovery position, thereby newly configuring the second winding core to the recovery position; an unnecessary tape joining process for joining the unnecessary tape cut off from the first winding core by the unnecessary tape cutting process to the second winding core; In the process of carrying out the winding core after use, the first winding core separated from the unnecessary tape by the unnecessary tape cutting process is carried out while the winding core at the recovery position that has been connected to the unnecessary tape by the tape connecting process is being wound and recovered; and The winding core carrying-in process is to carry a new winding core into the winding core holding portion located at the standby position after the used winding core carrying-out process.

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