Multi-surface paint stripping device for chip inductor

Abstract

The invention relates to the technical field of laser paint stripping, and particularly discloses a chip inductor multi-face paint stripping device which comprises a base plate, a rotating disc, a top face paint stripping module and a side face paint stripping module. The rotating disc is rotationally connected to the top face of the base plate, and a plurality of jigs arranged around the circumference of the rotating disc are installed on the top face of the rotating disc. The top surface paint stripping module comprises a first laser and a first galvanometer, the first laser is mounted on the top surface of the substrate, the first galvanometer is mounted at the output end of the first laser, and the first galvanometer is used for reflecting laser of the first laser to the top surface of the chip inductor; the number of the side face paint stripping modules is two, and the two side face paint stripping modules are located on the two sides of the side face paint stripping station correspondingly. The side face paint stripping module comprises a second laser and second galvanometers, the second laser is installed on the top face of the base plate, the second galvanometers are installed at the output ends of the second laser, and the two second galvanometers are located on the two sides of the jig respectively. The device has the effect of improving the production efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of laser paint stripping, in particular to a chip inductor multi-surface paint stripping device. Background Art

[0002] Chip inductor products are widely used in the entire industrial system. They are used in the fields of Internet of Things, smart phones, new energy vehicles, home appliances, 3C electronics, etc. Small-sized chip inductors have a high market share and are also a trend for future development. In the manufacturing process of chip inductors, one of the steps is to peel off the resin coated on the chip inductor to facilitate the electroplating of the next process.

[0003] The current stripping methods include chemical stripping, thermal stripping, mechanical stripping and laser stripping. Chemical stripping is highly polluting and has certain hazards, although it can be achieved in batches. Although thermal and mechanical stripping have little hazards, they are inefficient and can easily damage chip inductors. Laser stripping can be precisely controlled to avoid damage to the inside of the inductor, and can be achieved in batches and is widely used.

[0004] At present, a Chinese invention patent with publication number CN117600661A discloses a vision-guided three-sided laser paint stripping machine and a paint stripping method thereof. The above technical solution is to transfer the chip inductor directly to a loading disc carrier, and the loading disc carrier then adsorbs and fixes the chip inductor, and then strips the paint through a laser; however, in the process of transferring the loading disc of the chip inductor box, when the chip inductor is unloaded to the top surface of the loading disc carrier, it is easy for some chip inductors to have a slight offset in position. Since the scanning position of the laser is fixed, when the position of the chip inductor is offset, the laser cannot completely strip the resin, and manual intervention is required to re-load and strip it again, which makes the stripping efficiency low and reduces production efficiency. Summary of the invention

[0005] In order to improve production efficiency, the present application provides a chip inductor multi-sided paint stripping device.

[0006] The present application provides a chip inductor multi-sided paint stripping device that adopts the following technical solution: A chip inductor multi-surface paint stripping device, comprising a substrate, a rotating disk, a top surface paint stripping module and a side surface paint stripping module; the rotating disk is rotatably connected to the top surface of the substrate, and a plurality of jigs arranged around the circumference of the rotating disk are installed on the top surface of the rotating disk, and the jigs are arranged along the radial direction of the rotating disk, and the jigs are used to place a whole row of chip inductors; the top surface paint stripping module comprises a first laser and a first galvanometer, the first laser is installed on the top surface of the substrate, the first galvanometer is installed at the output end of the first laser, the first galvanometer is located above the jig of the top surface paint stripping station, and the first galvanometer is used to reflect the laser of the first laser to the top surface of the chip inductor; two side surface paint stripping modules are provided, and the two side surface paint stripping modules are respectively located on both sides of the side surface paint stripping station; the side surface paint stripping module comprises a second laser and a second galvanometer, the second laser is installed on the top surface of the substrate, the second galvanometer is installed at the output end of the second laser, and the two second galvanometers are respectively located on both sides of the jig, and the second galvanometer is used to reflect the laser of the second laser to the side of the chip inductor.

[0007] Optionally, it also includes a loading module, a material handling module, a precise positioning module, a visual recognition positioning module and a unloading module; the material handling module is installed on the top surface of the substrate, and the material handling module is used to transport a whole row of chip inductors to the top surface of the jig at the loading station; the loading module is installed on the top surface of the substrate, and the loading module is used to transport chip inductors into the material handling module and form a whole row of chip inductors; the precise positioning module is installed on the top surface of the substrate, and the precise positioning module is used to correct the whole row of chip inductors on the jig at the loading station; the visual recognition positioning module is installed on the top surface of the substrate, and the visual recognition positioning module is used to identify the whole row of chip inductors above the jig at the top surface paint stripping station; the unloading module is installed on the top surface of the substrate, and the unloading module is used to unload the whole row of chip inductors that have been stripped of paint at the unloading station.

[0008] Optionally, the feeding module includes a vibration disk feeding mechanism, a material rail, a support table, an optical fiber, a feed plate, a push plate and a first driving mechanism; the vibration disk feeding mechanism is installed on the top surface of the substrate, and the vibration disk feeding mechanism is used for shaping and feeding the patch inductor so that the electrode of the patch inductor faces upward; the material rail is installed on the top surface of the substrate, and the feed port of the material rail is connected to the discharge port of the vibration disk feeding mechanism; the support table is installed on the top surface of the substrate, and the feed plate is installed on the top surface of the support table. The top surface of the feed plate is provided with a discharge trough, and the side of the feed plate close to the material rail is provided with a feed trough, the feed trough is connected with the discharge trough, and the notch of the feed trough is connected with the discharge port of the material rail; the push plate slides on the inner wall of the discharge trough, and the first driving mechanism is installed on the support table, and the first driving mechanism is used to drive the push plate to slide in the discharge trough; the optical fiber is arranged above the connection between the feed trough and the discharge trough, and the optical fiber is used to identify the patch inductor.

[0009] Optionally, the material handling module includes an installation box, a rotating shaft, a first synchronous wheel, a first synchronous belt, an upper movable plate, an upper adsorption plate, a handling mechanism and a second driving mechanism; the installation box is installed on the top surface of the substrate, and four rotating shafts are provided, and the four rotating shafts are rotatably connected to the inner wall of the installation box, two of which are located at one end of the installation box, and the other two are located at the other end of the installation box; four first synchronous wheels are provided, and the four first synchronous wheels are coaxially connected to the end of the rotating shaft, and the first synchronous belt is wound around the four first synchronous wheels; the upper movable plate is slidably connected to the installation At the top of the packing box, the upper movable plate is located above the first synchronous belt, the upper adsorption plate is installed on the top surface of the upper movable plate, the upper movable plate is connected to the upper half of the first synchronous belt, the top surface of the upper adsorption plate is provided with a mounting groove for a whole row of chip inductors to enter, the bottom surface of the mounting groove is provided with adsorption holes for adsorbing chip inductors, and the mounting groove is aligned with the discharge trough; the second driving mechanism is installed on the side of the mounting box, and the second driving mechanism is used to drive one of the rotating shafts to rotate; the conveying mechanism is installed on the top surface of the substrate, and the conveying mechanism is used to convey a whole row of chip inductors to the top of the fixture.

[0010] Optionally, the material handling module also includes a lower movable plate, a support plate, a lower adsorption plate and a lifting plate; the lower movable plate is arranged below the first synchronous belt, and the lower movable plate is slidably connected to the inner wall of the installation box; the lower movable plate is connected to the lower half of the first synchronous belt; a guide rod is arranged in the lower movable plate, and both ends of the guide rod pass through the lower movable plate; the support plate is connected to the top of the guide rod, the lower adsorption plate is installed on the top surface of the support plate, and the top surface of the lower adsorption plate is also provided with an installation groove for a whole row of chip inductors to enter, and the bottom surface of the installation groove is provided with adsorption holes for adsorbing chip inductors, and the installation groove is aligned with the discharge slot; the lifting plate is connected to the bottom end of the guide rod, and a roller is rotatably connected to one side of the lifting plate, and a track groove for rolling of the roller is provided on the side of the installation box, and the middle part of the track groove is sunken.

[0011] Optionally, the transport mechanism includes a linear module, a first cylinder, a connecting piece and a first adsorption strip; the linear module is installed on the top surface of the substrate, and the first cylinder is installed on the sliding seat surface of the linear module; the connecting piece is connected to the bottom end of the piston rod of the first cylinder, and the first adsorption strip is connected to the bottom of the connecting piece, and the bottom surface of the first adsorption strip is provided with two rows of adsorption holes, and the two rows of adsorption holes are respectively used to adsorb the two electrodes on the top of the chip inductor.

[0012] Optionally, a first micro-motion slide is installed on the top of one end of the installation box, and a lower pressure plate is connected to the bottom of the side of the first micro-motion slide. The lower pressure plate is located above the upper adsorption plate / the lower adsorption plate, and the first micro-motion slide is used to drive the lower pressure plate to move along the X-axis and the Y-axis in a vertical plane; a baffle is integrally formed on the bottom surface of one end of the lower pressure plate away from the discharge plate, and the baffle is used to block the chip inductor from entering the installation groove.

[0013] Optionally, the precise positioning module includes a second cylinder, a lifting frame, a fixed block, a movable block and a third cylinder; the second cylinder is installed on the top surface of the substrate through a fourth support frame, the lifting frame is connected to the bottom end of the piston rod of the second cylinder, the lifting frame is slidably connected to the side of the fourth support frame, and the lifting frame is located directly above the loading station of a whole row of chip inductors; the fixed block is installed on the bottom surface of the lifting frame, the movable block is slidably connected to the bottom surface of the lifting frame, the third cylinder is installed on the bottom surface of the lifting frame, the third cylinder is located on the side of the movable block away from the fixed block, and the piston rod of the third cylinder is connected to the side of the movable block away from the fixed block; the bottom of the side of the fixed block close to the movable block is connected to a positioning plate, the bottom of the side of the movable block close to the fixed block is connected to a movable plate, and the positioning plate and the movable plate are respectively attached to the two side surfaces of the whole row of chip inductors.

[0014] Optionally, the visual recognition positioning module includes a camera, a center lens and a reflector, the center lens is installed on the top surface of the substrate, and the camera is installed on the mounting end of the center lens; the reflector is installed on the top surface of the substrate, the reflector forms an angle of 45° with the horizontal plane, the output end of the center lens faces the reflective surface of the reflector, and the reflector is located directly above the top surface paint stripping station; the first galvanometer is located directly above the reflector, and the laser reflected by the first galvanometer passes through the reflector and is emitted toward the chip inductor.

[0015] Optionally, the unloading module includes a fourth cylinder, a fifth cylinder, a second micro-motion slide, a second adsorption strip and a silo, the fourth cylinder is installed on the top surface of the substrate, the fifth cylinder is installed on the top of the piston rod of the fourth cylinder, and the second micro-motion slide is connected to the end of the piston rod of the fifth cylinder; the second adsorption strip is installed on the top of the second micro-motion slide, and the second micro-motion slide drives the second adsorption strip to move along the X-axis and Y-axis directions in a vertical plane; two rows of adsorption holes are provided on the bottom surface of the second adsorption strip, and the two rows of adsorption holes correspond one by one to the two electrodes of the chip inductor; the silo is installed on the top surface of the substrate.

[0016] In summary, the present application includes at least one of the following beneficial technical effects: 1. The precise positioning module first calibrates the entire row of chip inductors on the fixture at the loading station, and then the reducer drives the rotating disk to rotate, and the rotating disk drives the fixture to rotate 90°. The fixture with the chip inductor first moves to the bottom of the first galvanometer, that is, the top surface paint stripping station. The first laser emits a laser, which is reflected by the first galvanometer and directed to the top surface of the chip inductor. The first galvanometer changes the irradiation route of the laser, so that the landing point of the laser moves on the top surface of the chip inductor, so that the resin on the top surface of the two electrodes of the chip inductor is removed; Then drive the rotating disk to rotate 90 degrees, the rotating disk drives the jig to rotate, and the jig moves to the side paint stripping station. The two second lasers emit lasers, and the second galvanometer reflects the lasers to the side of the SMD inductor. The second galvanometer changes the irradiation route of the laser, so that the landing point of the laser moves to the side of the SMD inductor, so that the resin on both sides of the SMD inductor is removed, and the resin removal of the SMD inductor is completed, so as to avoid that part of the SMD inductor cannot be completely stripped due to position offset, thereby reducing production costs and improving the paint stripping efficiency of the SMD inductor; 2. When it is necessary to load the upper adsorption plate / lower adsorption plate, align the mounting slot of the upper adsorption plate / lower adsorption plate with the feed slot, and the chip inductors in the feed slot enter the mounting slot one by one, so that the chip inductors on the upper adsorption plate / lower adsorption plate are aligned with the adsorption holes one by one, and the adsorption holes adsorb the chip inductors one by one; the second motor drives the second synchronous wheel to rotate, the second synchronous wheel drives the third synchronous wheel to rotate through the second synchronous belt, the third synchronous wheel drives the rotating shaft to rotate, the rotating shaft drives the first synchronous wheel to rotate, the first synchronous wheel drives the remaining first synchronous wheels to rotate through the first synchronous belt, and the first synchronous wheel drives the upper movable plate and the lower movable plate to move in opposite directions; the lower movable plate is supported by the guide rod and the lifting plate. At the same time, the lifting plate moves in the track groove through the roller. The roller first moves from the horizontal section to the inclined section, and the inclined section moves to the sinking section. At this time, the lifting plate drives the support plate to descend through the guide rod, and the support plate drives the lower adsorption plate to descend, so that the height positions of the lower adsorption plate and the upper adsorption plate are staggered. The lower adsorption plate is located below the upper moving plate, and the lower adsorption plate gradually passes over the upper moving plate. The roller of the lifting plate gradually rises through the inclined section at the other end, and the roller rolls to the horizontal section, so that the upper adsorption plate and the lower adsorption plate are exchanged, and the mounting groove of the lower adsorption plate is aligned with the discharge groove, and then the chip inductors are pushed into the mounting groove of the lower adsorption plate one by one, and then the position is exchanged again, so as to improve the efficiency of the material handling module in transporting materials to the fixture; 3. The first cylinder drives the connecting part to descend, and the connecting part drives the first adsorption bar to descend. The first adsorption bar adsorbs the entire row of chip inductors on the top surface of the lower adsorption plate / upper adsorption plate. The first cylinder then drives the connecting part to rise, and the connecting part drives the first adsorption bar to rise; the linear module drives the first cylinder to move, and the first cylinder drives the entire row of chip inductors to move through the connecting part and the first adsorption bar, so that the chip inductors are moved to above the fixture of the loading station, the first cylinder drives the connecting part and the first adsorption bar to descend, and the entire row of chip inductors is placed above the fixture, the first adsorption bar is desorbed, and the first cylinder drives the connecting part and the first adsorption bar to rise again; the linear module drives the first cylinder to return to the initial position. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the chip inductor according to the embodiment of the present application; Figure 2 It is a structural schematic diagram of a paint stripping device according to an embodiment of the present application; Figure 3 is a schematic diagram of the structure of the rotating disk of an embodiment of the present application; Figure 4 It is a schematic diagram of the structure of the fixture of the embodiment of the present application; Figure 5 It is a schematic structural diagram of a top paint stripping module and a side paint stripping module of an embodiment of the present application; Figure 6It is a structural schematic diagram of the top paint stripping module and the side paint stripping module from another perspective of the embodiment of the present application; Figure 7 It is a structural schematic diagram of a feeding module according to an embodiment of the present application; Figure 8 It is a partial structural schematic diagram of the feeding module of the embodiment of the present application; Fig. 9 It is a schematic diagram of the structure of the pusher plate of the embodiment of the present application; Fig.10 yes Fig. 9 A schematic diagram of the enlarged structure of part A; Fig.11 It is a structural schematic diagram of a material handling module according to an embodiment of the present application; Fig.12 This is a structural schematic diagram of the material handling module from another perspective of an embodiment of the present application; Fig.13 It is a schematic diagram of the internal structure of the material handling module of the embodiment of the present application; Fig.14 It is a schematic diagram of the cross-sectional structure of the discharge plate of the embodiment of the present application; Fig.15 yes Fig.12 A schematic diagram of the enlarged structure of part B; Fig.16 It is a schematic diagram of the structure of the transport mechanism and the upper adsorption plate of the embodiment of the present application; Fig.17 It is a structural schematic diagram of the transport mechanism and the fixture of the embodiment of the present application; Fig.18 It is a structural schematic diagram of the precise positioning module of the embodiment of the present application; Fig.19 yes Fig.18 A schematic diagram of the enlarged structure of the middle C part; Fig. 20 It is a structural schematic diagram of the blanking module of the embodiment of the present application.

[0018] Description of reference numerals: 01, SMD inductor; 011, mounting surface; 012, electrode; 1, substrate; 11, rotating disk; 111, loading station; 112, top surface paint stripping station; 113, side surface paint stripping station; 114, unloading station; 12, reducer; 13, fixture; 131, bottom plate; 132, adsorption table; 1321, stopper; 2, loading module; 21, vibration plate loading mechanism; 22, material rail; 23, support table; 24, optical fiber; 25, unloading plate; 251, discharge trough; 252, feed trough; 26, push plate; 261, groove; 262, clearance groove; 27 , first driving mechanism; 271, first motor; 272, swing eccentric shaft; 273, connecting rod; 274, sliding plate; 3, material handling module; 31, installation box; 311, rotating shaft; 312, first synchronous wheel; 313, first synchronous belt; 314, track groove; 3141, horizontal section; 3142, inclined section; 3143, sinking section; 315, first micro-slide; 3151, lower pressure plate; 3152, baffle; 32, upper moving plate; 33, installation groove; 34, upper adsorption plate; 35, handling mechanism; 351, linear module; 352, The first cylinder; 353, connecting piece; 354, first adsorption strip; 355, third support frame; 36, second driving mechanism; 361, second motor; 362, second synchronous wheel; 363, third synchronous wheel; 364, second synchronous belt; 37, lower movable plate; 371, guide rod; 38, support plate; 39, lower adsorption plate; 310, lifting plate; 3101, roller; 4, precise positioning module; 41, second cylinder; 42, lifting frame; 43, fixed block; 431, positioning plate; 44, movable block; 441, movable plate; 45, third cylinder; 46, the first Four support frames; 5. Visual recognition and positioning module; 51. Camera; 52. Center lens; 53. Reflector; 54. Fifth support frame; 55. Sixth support frame; 6. Top surface paint stripping module; 61. First laser; 62. First galvanometer; 63. First support frame; 7. Side surface paint stripping module; 71. Second laser; 72. Second galvanometer; 73. Second support frame; 8. Unloading module; 81. Fourth cylinder; 82. Fifth cylinder; 83. Second micro-slide; 84. Second adsorption strip; 85. Material bin; 86. Seventh support frame; 9. Eighth support frame; 91. Air knife. DETAILED DESCRIPTION

[0019] The following is combined with Figure 1-20 This application is described in further detail.

[0020] The present application embodiment discloses a chip inductor multi-side paint stripping device. Figure 1-20The chip inductor 01 is a rectangular parallelepiped structure, one of the surfaces of the chip inductor 01 is a mounting surface 011, and the mounting surface 011 faces the surface of the PCB board when in use; a raised electrode 012 is provided at each end of the mounting surface 011, and the top surfaces of the two electrodes 012 are coated with resin, and the top of the side surface of the chip inductor 01 adjacent to the two electrodes 012 is also coated with resin; the paint stripping mentioned here is to remove the resin coated on the surface of the chip inductor 01.

[0021] The multi-sided paint stripping device of the chip inductor 01 includes a substrate 1, a rotating disk 11, a loading module 2, a material handling module 3, a precise positioning module 4, a visual identification positioning module 5, a top surface paint stripping module 6, a side surface paint stripping module 7 and a blanking module 8; the rotating disk 11 is rotatably connected to the top surface of the substrate 1, and the rotating disk 11 is driven by a reducer 12; four jigs 13 arranged around the circumference of the rotating disk 11 are installed on the top surface of the rotating disk 11, and the jigs 13 are arranged along the radial direction of the rotating disk 11. The jigs 13 are used to place a whole row of chip inductors 01, and the four jigs 13 are respectively arranged at a loading station 111, a top surface paint stripping station 112, a side surface paint stripping station 113 and a blanking station 114; the top surface paint stripping module 6 includes a first laser 61 and a first galvanometer 62, and the first laser 61 passes through a first The support frame 63 is installed on the top surface of the substrate 1, the first galvanometer 62 is installed on the output end of the first laser 61, the first galvanometer 62 is located above the fixture 13 of the top surface paint stripping station 112, and the first galvanometer 62 is used to reflect the laser of the first laser 61 to the top surface of the chip inductor 01; two side paint stripping modules 7 are provided, and the two side paint stripping modules 7 are respectively located on both sides of the side paint stripping station 113; the side paint stripping module 7 includes a second laser 71 and a second galvanometer 72, the second laser 71 is installed on the top surface of the substrate 1 through the second support frame 73, the second galvanometer 72 is installed at the output end of the second laser 71, the two second galvanometers 72 are respectively located on both sides of the fixture 13, and the second galvanometer 72 is used to reflect the laser of the second laser 71 to the side of the chip inductor 01.

[0022] The precise positioning module 4 first calibrates the entire row of chip inductors 01 on the fixture 13 at the loading station 111, and then the reducer 12 drives the rotating disk 11 to rotate, and the rotating disk 11 drives the fixture 13 to rotate 90°. The fixture 13 with the chip inductor 01 first moves to the bottom of the first galvanometer 62, that is, the top surface paint stripping station 112, and the first laser 61 emits a laser, which is reflected by the first galvanometer 62 and emitted to the top surface of the chip inductor 01. The first galvanometer 62 changes the irradiation route of the laser, so that the landing point of the laser moves on the top surface of the chip inductor 01, so that the tree on the top surface of the two electrodes 012 of the chip inductor 01 The grease is removed; then the rotating disk 11 is driven to rotate 90°, and the rotating disk 11 drives the fixture 13 to rotate, so that the fixture 13 moves to the side paint stripping station 113, and the two second lasers 71 emit lasers, and the second galvanometer 72 reflects the laser to the side of the chip inductor 01. The second galvanometer 72 changes the irradiation route of the laser, so that the landing point of the laser moves to the side of the chip inductor 01, so that the resin on both sides of the chip inductor 01 is removed, and the resin removal of the chip inductor 01 is completed, so as to avoid that part of the chip inductor cannot be completely stripped due to position offset, thereby reducing production costs and improving the paint stripping efficiency of the chip inductor 01.

[0023] The material handling module 3 is installed on the top surface of the substrate 1, and the material handling module 3 is used to transport the whole row of chip inductors 01 to the top surface of the fixture 13 of the loading station 111; the loading module 2 is installed on the top surface of the substrate 1, and the loading module 2 is used to transport the chip inductors 01 into the material handling module 3 and form a whole row of chip inductors 01; the precise positioning module 4 is installed on the top surface of the substrate 1, and the precise positioning module 4 is used to calibrate the whole row of chip inductors 01 on the fixture 13 at the loading station 111; the visual recognition and positioning module 5 is installed on the top surface of the substrate 1, and the visual recognition and positioning module 5 is used to identify the whole row of chip inductors 01 above the fixture 13 at the top surface paint stripping station 112; the unloading module 8 is installed on the top surface of the substrate 1, and the unloading module 8 is used to unload the whole row of chip inductors 01 that have been stripped of paint at the unloading station 114.

[0024] The feeding module 2 includes a vibration plate feeding mechanism 21, a material rail 22, a support table 23, an optical fiber 24, a discharge plate 25, a push plate 26 and a first driving mechanism 27; the vibration plate feeding mechanism 21 is installed on the top surface of the substrate 1, and the vibration plate feeding mechanism 21 is used for shaping the patch inductor 01 so that the electrode 012 of the patch inductor 01 faces upward; the material rail 22 is installed on the top surface of the substrate 1, and the feed port of the material rail 22 is connected to the discharge port of the vibration plate feeding mechanism 21; the support table 23 is installed on the top surface of the substrate 1, and the discharge plate 25 is installed on the top surface of the support table 23, and the discharge plate 25 is perpendicular to the material rail 22, and the discharge plate 25 A discharge trough 251 is provided on the top surface, and both ends of the discharge trough 251 are connected to the end surface of the discharge plate 25. A feed trough 252 is provided on the side of the discharge plate 25 close to the material rail 22. The feed trough 252 is connected to the discharge trough 251, and the notch of the feed trough 252 is connected to the discharge port of the material rail 22; the push plate 26 slides on the inner wall of the discharge trough 251, and the first driving mechanism 27 is installed on the support platform 23, and the first driving mechanism 27 is used to drive the push plate 26 to slide in the discharge trough 251; the optical fiber 24 is arranged above the connection between the feed trough 252 and the discharge trough 251, and the optical fiber 24 is used to identify the chip inductor 01.

[0025] The end of the push plate 26 close to the chip inductor 01 is provided with a groove 261 for the chip inductor 01 to enter, and the side of the push plate 26 close to the feed slot 252 is provided with a clearance slot 262 for the chip inductor 01 in the feed slot 252 to slide through.

[0026] The first driving mechanism 27 includes a first motor 271, a swing eccentric shaft 272, a connecting rod 273 and a sliding plate 274. The first motor 271 is installed on the top surface of the support platform 23, the swing eccentric shaft 272 is installed on the output shaft of the first motor 271, one end of the connecting rod 273 is connected to the swing end of the swing eccentric shaft 272, and the sliding plate 274 is slidably connected to the top surface of the support platform 23 through a linear guide rail; the push plate 26 is connected to the bottom surface of the sliding plate 274.

[0027] When it is necessary to push the chip inductor 01 to slide out of the material, the vibration plate feeding mechanism 21 adjusts the position of the chip inductor 01 so that the electrode 012 of the chip inductor 01 faces upward and enters the material rail 22. The chip inductor 01 in the material rail 22 pushes the chip inductor 01 in the front, and the chip inductor 01 gradually enters the feed slot 252. The chip inductor 01 in the feed slot 252 is pushed into the discharge slot 251 by the chip inductor 01 behind. The optical fiber 24 detects that the chip inductor 01 enters the discharge slot 251, and the chip inductor 01 part adjacent to the chip inductor 01 in the feed slot 252 enters the discharge slot 251. ; The first motor 271 drives the swing eccentric shaft 272 to rotate one circle, the swing eccentric shaft 272 drives the connecting rod 273 to reciprocate, the connecting rod 273 pushes the sliding plate 274 to reciprocate, the sliding plate 274 drives the pushing plate 26 to reciprocate, and the pushing plate 26 pushes the chip inductor 01 in the discharge trough 251 to move; the chip inductor 01 in the discharge trough 251 enters the groove 261 of the pushing plate 26, and the chip inductor 01 adjacent to the chip inductor 01 in the feed trough 252 enters the make way groove 262, so that the chip inductor 01 located in the discharge trough 251 can be pushed out of the discharge trough 251.

[0028] The material handling module 3 includes an installation box 31, a rotating shaft 311, a first synchronous wheel 312, a first synchronous belt 313, an upper movable plate 32, an upper adsorption plate 34, a handling mechanism 35 and a second driving mechanism 36; the installation box 31 is installed on the top surface of the substrate 1, and four rotating shafts 311 are provided, and the four rotating shafts 311 are all rotatably connected to the inner wall of the installation box 31, wherein two rotating shafts 311 are located at one end of the installation box 31, and the other two rotating shafts 311 are located at the other end of the installation box 31; four first synchronous wheels 312 are provided, and the four first synchronous wheels 312 are coaxially connected to the end of the rotating shaft 311, and the first synchronous belt 313 is wound around the four first synchronous wheels 312; the upper movable plate 32 is slidably connected to the top of the installation box 31 through a linear guide rail The upper movable plate 32 is located above the first synchronous belt 313, the upper adsorption plate 34 is installed on the top surface of the upper movable plate 32, and the upper movable plate 32 is fixedly connected to the upper half of the first synchronous belt 313 through a clamping plate. The top surface of the upper adsorption plate 34 is provided with a mounting groove 33 for a whole row of chip inductors 01 to enter, and the bottom surface of the mounting groove 33 is provided with adsorption holes for adsorbing the chip inductors 01. The number of adsorption holes is equal to the number of the whole row of chip inductors 01, and the mounting groove 33 is aligned with the discharge groove 251; the second driving mechanism 36 is installed on the side of the installation box 31, and the second driving mechanism 36 is used to drive one of the rotating shafts 311 to rotate; the conveying mechanism 35 is installed on the top surface of the substrate 1, and the conveying mechanism 35 is used to convey the whole row of chip inductors 01 to the top of the fixture 13.

[0029] The material handling module 3 also includes a lower movable plate 37, a support plate 38, a lower adsorption plate 39 and a lifting plate 310; the lower movable plate 37 is arranged below the first synchronous belt 313, and the lower movable plate 37 is slidably connected to the inner wall of the installation box 31 through another linear guide rail; the lower movable plate 37 is fixedly connected to the lower half of the first synchronous belt 313 through a clamping plate; four guide rods 371 are arranged in the lower movable plate 37, and both ends of the guide rods 371 pass through the lower movable plate 37; the support plate 38 is connected to the top of the four guide rods 371, and the lower adsorption plate 39 is installed on the top surface of the support plate 38. The top surface of the lower adsorption plate 39 is also provided with an installation groove 33 for a whole row of chip inductors 01 to enter, and the bottom surface of the installation groove 33 is provided with adsorption holes for adsorbing the chip inductors 01, and the number of adsorption holes is the same as that of the lower adsorption plate 39. The number of chip inductors 01 in a whole row is equal, and the installation slot 33 is aligned with the discharge slot 251; the lifting plate 310 is connected to the bottom end of the four guide rods 371, and a roller 3101 is rotatably connected to one side of the lifting plate 310, and a track slot 314 for the roller 3101 to roll is arranged on the side of the installation box 31, and the middle part of the track slot 314 is sunken; the track slot 314 includes a horizontal section 3141, an inclined section 3142 and a sinking section 3143; there are two horizontal sections 3141, and the two horizontal sections 3141 are respectively located at the two ends of the installation box 31; there are two inclined sections 3142, and the two inclined sections 3142 are respectively connected to the ends of the two horizontal sections 3141 that are close to each other, and the inclined sections 3142 are inclined downward; the two ends of the sinking section 3143 are connected to the bottom ends of the two inclined sections 3142.

[0030] The second driving mechanism 36 includes a second motor 361, a second synchronous wheel 362, a third synchronous wheel 363 and a second synchronous belt 364; the second motor 361 is installed on the outside of the installation box 31, the second synchronous wheel 362 is coaxially connected to the output shaft of the second motor 361, the third synchronous wheel 363 is coaxially connected to one of the rotating shafts 311, and the second synchronous belt 364 is wound around the second synchronous wheel 362 and the third synchronous wheel 363.

[0031] The transport mechanism 35 includes a linear module 351, a first cylinder 352, a connecting piece 353 and a first adsorption strip 354; the linear module 351 is installed on the top surface of the substrate 1 through a third support frame 355, and the first cylinder 352 is installed on the sliding seat surface of the linear module 351; the connecting piece 353 is connected to the bottom end of the piston rod of the first cylinder 352, and the first adsorption strip 354 is connected to the bottom of the connecting piece 353. Two rows of adsorption holes are provided on the bottom surface of the first adsorption strip 354, and the two rows of adsorption holes are respectively used to adsorb the two electrodes 012 on the top of the chip inductor 01.

[0032] A first micro-slide 315 is installed on the top of one end of the installation box 31, and a lower pressure plate 3151 is connected to the bottom of the side of the first micro-slide 315. The lower pressure plate 3151 is located above the upper adsorption plate 34 / lower adsorption plate 39, and the first micro-slide 315 is used to drive the lower pressure plate 3151 to move along the X-axis and Y-axis in the vertical plane; a baffle 3152 is integrally formed on the bottom surface of one end of the lower pressure plate 3151 away from the discharge plate 25, and the baffle 3152 is used to block the chip inductor 01 from entering the installation groove 33.

[0033] When it is necessary to feed the upper adsorption plate 34 / lower adsorption plate 39, the mounting groove 33 of the upper adsorption plate 34 / lower adsorption plate 39 is aligned with the feed groove 252, and the chip inductors 01 in the feed groove 252 enter the mounting groove 33 one by one, so that the chip inductors 01 on the upper adsorption plate 34 / lower adsorption plate 39 are aligned with the adsorption holes one by one, and the adsorption holes adsorb the chip inductors 01 one by one; the second motor 361 drives the second synchronous wheel 362 to rotate, and the second synchronous wheel 362 passes The third synchronous wheel 363 is driven to rotate by the second synchronous belt 364, the third synchronous wheel 363 drives the rotating shaft 311 to rotate, the rotating shaft 311 drives the first synchronous wheel 312 to rotate, the first synchronous wheel 312 drives the other first synchronous wheels 312 to rotate through the first synchronous belt 313, and the first synchronous wheel 312 drives the upper moving plate 32 and the lower moving plate 37 to move in opposite directions; the lower moving plate 37 supports the plate 38 and the lifting plate 310 to move together through the guide rod 371, and the lifting plate The roller 3101 moves in the track groove 314, and the roller 3101 first moves from the horizontal section 3141 to the inclined section 3142, and the inclined section 3142 moves to the sinking section 3143. At this time, the lifting plate 310 drives the support plate 38 to descend through the guide rod 371, and the support plate 38 drives the lower adsorption plate 39 to descend, so that the lower adsorption plate 39 and the upper adsorption plate 34 are staggered in height, and the lower adsorption plate 39 is located below the upper moving plate 32. The lower adsorption plate 39 is gradually lowered. Gradually passing over the upper movable plate 32, the roller 3101 of the lifting plate 310 gradually rises through the inclined section 3142 at the other end, and the roller 3101 rolls to the horizontal section 3141, so that the upper adsorption plate 34 and the lower adsorption plate 39 are exchanged, and the mounting groove 33 of the lower adsorption plate 39 is aligned with the discharge groove 251, and then the chip inductor 01 is pushed into the mounting groove 33 of the lower adsorption plate 39 one by one, and then the position is exchanged again, so as to improve the efficiency of the material handling module 3 in transporting materials to the fixture 13.

[0034] The first cylinder 352 drives the connecting piece 353 to descend, and the connecting piece 353 drives the first adsorption bar 354 to descend. The first adsorption bar 354 adsorbs the entire row of chip inductors 01 on the top surface of the lower adsorption plate 39 / upper adsorption plate 34. The first cylinder 352 then drives the connecting piece 353 to rise, and the connecting piece 353 drives the first adsorption bar 354 to rise; the linear module 351 drives the first cylinder 352 to move, and the first cylinder 352 moves through the connecting piece 353 and the first adsorption bar 354. The attached strip 354 drives the entire row of chip inductors 01 to move, so that the chip inductors 01 are moved to above the fixture 13 of the loading station 111, and the first cylinder 352 drives the connecting piece 353 and the first adsorption strip 354 to descend, and the entire row of chip inductors 01 is placed above the fixture 13, and the first adsorption strip 354 is desorbed, and the first cylinder 352 drives the connecting piece 353 and the first adsorption strip 354 to rise; the linear module 351 then drives the first cylinder 352 to return to the initial position.

[0035] The fixture 13 includes a base plate 131 and an adsorption platform 132. The base plate 131 is installed on the top surface of the rotating disk 11. The adsorption platform 132 is integrally formed on the top surface of the base plate 131. A plurality of adsorption holes are provided on the top surface of the adsorption platform 132. The number of adsorption holes depends on the number of the whole row of chip inductors 01. Each adsorption hole adsorbs one chip inductor 01. A stopper 1321 is integrally formed on the top surface of one end of the adsorption platform 132 close to the center of the rotating disk 11. The stopper 1321 is used to block the whole row of chip inductors 01.

[0036] The precise positioning module 4 includes a second cylinder 41, a lifting frame 42, a fixed block 43, a movable block 44 and a third cylinder 45; the second cylinder 41 is installed on the top surface of the substrate 1 through a fourth support frame 46, the lifting frame 42 is connected to the bottom end of the piston rod of the second cylinder 41, and the lifting frame 42 is slidably connected to the side of the fourth support frame 46 through a linear guide rail. The lifting frame 42 is located directly above the loading station 111 of the entire row of SMD inductors 01; the fixed block 43 is installed on the bottom surface of the lifting frame 42, and the movable block 44 is slidably connected to the bottom surface of the lifting frame 42. The third cylinder 45 is connected to the bottom surface of the lifting frame 42, and is installed on the bottom surface of the lifting frame 42. The third cylinder 45 is located on the side of the movable block 44 away from the fixed block 43, and the piston rod of the third cylinder 45 is connected to the side of the movable block 44 away from the fixed block 43; the bottom of the side of the fixed block 43 close to the movable block 44 is connected with a positioning plate 431, and the bottom of the side of the movable block 44 close to the fixed block 43 is connected with a movable plate 441, and the positioning plate 431 and the movable plate 441 are respectively attached to the two side surfaces of the entire row of chip inductors 01.

[0037] The second cylinder 41 drives the lifting frame 42 to descend, and the lifting frame 42 drives the fixed block 43, the movable block 44 and the third cylinder 45 to descend, and the positioning plate 431 descends to one side of the whole row of chip inductors 01, and the movable plate 441 descends to the other side of the whole row of chip inductors 01. With the side of the positioning plate 431 as the reference plane, the third cylinder 45 drives the movable plate 441 to move toward the positioning plate 431, and the movable plate 441 pushes the whole row of chip inductors 01. The movable plate 441 cooperates with the positioning plate 431 to clamp the whole row of chip inductors 01, so that the whole row of chip inductors 01 is in an aligned state; then the third cylinder 45 drives the movable plate 441 away from the positioning plate 431, and the second cylinder 41 drives the lifting frame 42 to ascend.

[0038] The visual recognition positioning module 5 includes a camera 51, a center lens 52 and a reflector 53. The center lens 52 is installed on the top surface of the substrate 1 through the fifth support frame 54, and the camera 51 is installed on the mounting end of the center lens 52; the reflector 53 is installed on the top surface of the substrate 1 through the sixth support frame 55, and the reflector 53 is at an angle of 45° to the horizontal plane. The output end of the center lens 52 faces the reflective surface of the reflector 53, and the reflector 53 is located directly above the top surface paint stripping station 112; the first galvanometer 62 is located directly above the reflector 53, and the laser reflected by the first galvanometer 62 passes through the reflector 53 and is emitted toward the chip inductor 01.

[0039] The rotating disk 11 is driven to rotate 90°, so that the jig 13 with a whole row of chip inductors 01 is rotated to the top surface paint stripping station 112. The camera 51 captures the whole row of chip inductors 01 above the jig 13 through the center lens 52 and the reflector 53, identifies the top surface contour of the chip inductor 01, and confirms the center point of the chip inductor 01. The acquired signal is transmitted to the terminal, and the terminal transmits the signal to the top surface paint stripping module 6. The first galvanometer 62 reflects the laser to the electrode 012 of the chip inductor 01, and removes the resin on the top surface of the electrode 012.

[0040] The unloading module 8 includes a fourth cylinder 81, a fifth cylinder 82, a second micro-motion slide 83, a second adsorption strip 84 and a silo 85. The fourth cylinder 81 is installed on the top surface of the substrate 1 through the seventh support frame 86, the fifth cylinder 82 is installed on the top of the piston rod of the fourth cylinder 81 through a plate, and the second micro-motion slide 83 is connected to the end of the piston rod of the fifth cylinder 82 through a plate; the second adsorption strip 84 is installed on the top of the second micro-motion slide 83, and the second micro-motion slide 83 drives the second adsorption strip 84 to move along the X-axis and Y-axis directions in the vertical plane; two rows of adsorption holes are provided on the bottom surface of the second adsorption strip 84, and the two rows of adsorption holes correspond one by one to the two electrodes 012 of the chip inductor 01; the silo 85 is installed on the top surface of the substrate 1.

[0041] When it is necessary to unload the entire row of chip inductors 01 that have been stripped of paint, the fifth cylinder 82 drives the second micro-slide 83 and the second adsorption strip 84 to move to above the jig 13 at the unloading station 114; the fourth cylinder 81 drives the fifth cylinder 82 to descend, and the fifth cylinder 82 drives the second micro-slide 83 and the second adsorption strip 84 to descend, so that the second adsorption strip 84 is attached to the top surface of the electrode 012 of the entire row of chip inductors 01, and the adsorption of the chip inductors 01 by the adsorption platform 132 is released, and the second adsorption strip 84 is released. The strip 84 adsorbs the whole row of chip inductors 01, the fourth cylinder 81 drives the fifth cylinder 82 to rise, the fifth cylinder 82 drives the second micro-motion slide 83 and the second adsorption strip 84 to rise, the second adsorption strip 84 drives the whole row of chip inductors 01 to rise, the fifth cylinder 82 drives the second micro-motion slide 83 and the second adsorption strip 84 to retract, so that the whole row of chip inductors 01 moves to above the silo 85, the second adsorption strip 84 releases the adsorption of the chip inductors 01, and the chip inductors 01 fall into the silo 85.

[0042] An eighth support frame 9 is installed on the top surface of the substrate 1, and an air knife 91 is installed on the top of the eighth support frame 9. The air knife 91 is located between the unloading station 114 and the loading station 111. The air port of the air knife 91 faces the rotating disk 11, and the air knife 91 is located above the rotation trajectory of the fixture 13; when the fixture 13 rotates to the position of the air knife 91, the wind blade of the air knife 91 blows soot on the adsorption holes on the top surface of the adsorption platform 132.

[0043] The implementation principle of a chip inductor multi-side paint stripping device according to an embodiment of the present application is as follows: the precise positioning module 4 first calibrates the entire row of chip inductors 01 on the fixture 13 at the loading station 111, and then the reducer 12 drives the rotating disk 11 to rotate, and the rotating disk 11 drives the fixture 13 to rotate 90°, and the fixture 13 with the chip inductor 01 is first moved to the bottom of the first galvanometer 62, that is, the top surface paint stripping station 112, and the first laser 61 emits a laser, which is reflected by the first galvanometer 62 to the top surface of the chip inductor 01, and the first galvanometer 62 changes the irradiation route of the laser, so that the landing point of the laser moves on the top surface of the chip inductor 01, so that the chip inductor 01 is moved to the bottom of the first galvanometer 62, and the chip inductor 01 is moved to the top surface of the chip inductor 01. The resin on the top surface of the two electrodes 012 of 1 is removed; then the rotating disk 11 is driven to rotate 90°, and the rotating disk 11 drives the fixture 13 to rotate, so that the fixture 13 moves to the side paint stripping station 113, and the two second lasers 71 emit lasers, and the second galvanometer 72 reflects the laser to the side of the chip inductor 01. The second galvanometer 72 changes the irradiation route of the laser, so that the landing point of the laser moves on the side of the chip inductor 01, so that the resin on both sides of the chip inductor 01 is removed, and the resin removal of the chip inductor 01 is completed, so as to avoid that part of the chip inductor cannot be completely stripped due to position offset, thereby reducing production costs and improving the paint stripping efficiency of the chip inductor 01.

[0044] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A chip inductor multi-side paint stripping device, characterized by: The invention comprises a substrate (1), a rotating disk (11), a precise positioning module (4), a top surface paint stripping module (6) and a side surface paint stripping module (7); the rotating disk (11) is rotatably connected to the top surface of the substrate (1); a plurality of jigs (13) arranged around the circumference of the rotating disk (11) are installed on the top surface of the rotating disk (11); the jigs (13) are arranged along the radial direction of the rotating disk (11); the jigs (13) are used to place a whole row of chip inductors (01); the precise positioning module (4) is installed on the top surface of the substrate (1); the precise positioning module (4) is used to calibrate the whole row of chip inductors (01) on the jig (13) at the loading station (111); the top surface paint stripping module (6) comprises a first laser (61) and a first galvanometer (62); the first laser (61) is installed on the top surface of the substrate (1); the first galvanometer (62) is installed The first galvanometer (62) is installed at the output end of the first laser (61), the first galvanometer (62) is located above the fixture (13) of the top surface paint stripping station (112), and the first galvanometer (62) is used to reflect the laser of the first laser (61) to the top surface of the chip inductor (01); the side paint stripping module (7) is provided with two, and the two side paint stripping modules (7) are respectively located on both sides of the side paint stripping station (113); the side paint stripping module (7) includes a second laser (71) and a second galvanometer (72), the second laser (71) is installed on the top surface of the substrate (1), the second galvanometer (72) is installed at the output end of the second laser (71), the two second galvanometers (72) are respectively located on both sides of the fixture (13), and the second galvanometer (72) is used to reflect the laser of the second laser (71) to the side of the chip inductor (01).

2. A chip inductor multi-side paint stripping device according to claim 1, characterized in that: It also includes a loading module (2), a material handling module (3), a visual identification and positioning module (5) and a unloading module (8); the material handling module (3) is installed on the top surface of the substrate (1), and the material handling module (3) is used to transport a whole row of chip inductors (01) to the top surface of a fixture (13) of a loading station (111); the loading module (2) is installed on the top surface of the substrate (1), and the loading module (2) is used to transport the chip inductors (01) into the material handling module (3). The inductors (01) are formed into a whole row of chip inductors (01); the visual recognition and positioning module (5) is installed on the top surface of the substrate (1), and the visual recognition and positioning module (5) is used to identify the whole row of chip inductors (01) above the jig (13) at the top surface paint stripping station (112); the unloading module (8) is installed on the top surface of the substrate (1), and the unloading module (8) is used to unload the whole row of chip inductors (01) that have been stripped of paint at the unloading station (114).

3. A chip inductor multi-side paint stripping device according to claim 2, characterized in that: The feeding module (2) comprises a vibration disk feeding mechanism (21), a material rail (22), a support platform (23), an optical fiber (24), a discharge plate (25), a push plate (26) and a first driving mechanism (27); the vibration disk feeding mechanism (21) is mounted on the top surface of the substrate (1), and the vibration disk feeding mechanism (21) is used for shaping and feeding the chip inductor (01), so that the electrode (012) of the chip inductor (01) faces upward; the material rail (22) is mounted on the top surface of the substrate (1), and the feed port of the material rail (22) is connected to the discharge port of the vibration disk feeding mechanism (21); the support platform (23) is mounted on the top surface of the substrate (1), and the discharge plate (25) is mounted on the top surface of the support platform (23), and the discharge plate (25) is connected to the discharge port of the vibration disk feeding mechanism (21). ) is provided with a discharge trough (251) on the top surface, and a feed trough (252) is provided on the side of the discharge plate (25) close to the material rail (22), the feed trough (252) is connected with the discharge trough (251), and the notch of the feed trough (252) is connected with the discharge port of the material rail (22); the push plate (26) slides on the inner wall of the discharge trough (251), the first driving mechanism (27) is installed on the support platform (23), and the first driving mechanism (27) is used to drive the push plate (26) to slide in the discharge trough (251); the optical fiber (24) is arranged above the connection point between the feed trough (252) and the discharge trough (251), and the optical fiber (24) is used to identify the chip inductor (01).

4. The chip inductor multi-side paint stripping device according to claim 3, characterized in that: The material handling module (3) comprises an installation box (31), a rotating shaft (311), a first synchronous wheel (312), a first synchronous belt (313), an upper movable plate (32), an upper adsorption plate (34), a handling mechanism (35) and a second driving mechanism (36); the installation box (31) is installed on the top surface of the base plate (1); four rotating shafts (311) are provided, and the four rotating shafts (311) are all rotatably connected to the inner wall of the installation box (31), wherein two rotating shafts (311) are located at one end of the installation box (31), and the other two rotating shafts (311) are located at the other end of the installation box (31); four first synchronous wheels (312) are provided, and the four first synchronous wheels (312) are coaxially connected to the end of the rotating shaft (311); the first synchronous belt (313) is wound around the four first synchronous wheels (312); the upper movable plate (32) is slidably connected to the upper surface of the base plate (1); At the top of the installation box (31), the upper movable plate (32) is located above the first synchronous belt (313), the upper adsorption plate (34) is installed on the top surface of the upper movable plate (32), the upper movable plate (32) is connected to the upper half of the first synchronous belt (313), the top surface of the upper adsorption plate (34) is provided with an installation groove (33) for a whole row of chip inductors (01) to enter, the bottom surface of the installation groove (33) is provided with adsorption holes for adsorbing the chip inductors (01), and the installation groove (33) is aligned with the discharge slot (251); the second driving mechanism (36) is installed on the side of the installation box (31), and the second driving mechanism (36) is used to drive one of the rotating shafts (311) to rotate; the conveying mechanism (35) is installed on the top surface of the substrate (1), and the conveying mechanism (35) is used to convey the whole row of chip inductors (01) to the top of the fixture (13).

5. The chip inductor multi-side paint stripping device according to claim 4, characterized in that: The material handling module (3) further comprises a lower movable plate (37), a support plate (38), a lower adsorption plate (39) and a lifting plate (310); the lower movable plate (37) is arranged below the first synchronous belt (313), and the lower movable plate (37) is slidably connected to the inner wall of the installation box (31); the lower movable plate (37) is connected to the lower half of the first synchronous belt (313); a guide rod (371) is arranged inside the lower movable plate (37), and both ends of the guide rod (371) pass through the lower movable plate (37); the support plate (38) is connected to the top of the guide rod (371), and the lower adsorption plate (39) is ... the lower movable plate (37) is connected to the lower half of the first synchronous belt (313); the lower movable plate (37) is connected to the lower half of the first synchronous belt (313); the lower movable plate (37) is connected to the lower half of the first synchronous belt (313); the lower movable plate (37) is connected to the lower half of the first synchronous belt (313); the lower movable plate (37) is connected to the lower half of the first synchronous belt (313); the lower movable plate (37) is connected to the lower half of the first synchronous belt (313); the lower movable plate (37) is connected to the lower half of the first synchronous belt (313); the lower movable plate (37) is The plate (39) is installed on the top surface of the support plate (38), and the top surface of the lower adsorption plate (39) is also provided with an installation groove (33) for a whole row of chip inductors (01) to enter, and the bottom surface of the installation groove (33) is provided with an adsorption hole for adsorbing the chip inductor (01), and the installation groove (33) is aligned with the discharge groove (251); the lifting plate (310) is connected to the bottom end of the guide rod (371), and a roller (3101) is rotatably connected to one side of the lifting plate (310), and a track groove (314) for the roller (3101) to roll is provided on the side of the installation box (31), and the middle part of the track groove (314) is sunken.

6. The chip inductor multi-side paint stripping device according to claim 4, characterized in that: The transport mechanism (35) comprises a linear module (351), a first air cylinder (352), a connecting piece (353) and a first adsorption strip (354); the linear module (351) is mounted on the top surface of the substrate (1), and the first air cylinder (352) is mounted on the sliding seat surface of the linear module (351); the connecting piece (353) is connected to the bottom end of the piston rod of the first air cylinder (352), and the first adsorption strip (354) is connected to the bottom of the connecting piece (353); the bottom surface of the first adsorption strip (354) is provided with two rows of adsorption holes, and the two rows of adsorption holes are respectively used to adsorb the two electrodes (012) at the top of the chip inductor (01).

7. The chip inductor multi-side paint stripping device according to claim 5, characterized in that: A first micro-motion slide (315) is installed on the top of one end of the installation box (31), and a lower pressure plate (3151) is connected to the bottom of the side of the first micro-motion slide (315), and the lower pressure plate (3151) is located above the upper adsorption plate (34) / the lower adsorption plate (39), and the first micro-motion slide (315) is used to drive the lower pressure plate (3151) to move along the X-axis and the Y-axis in a vertical plane; a baffle (3152) is integrally formed on the bottom surface of one end of the lower pressure plate (3151) away from the discharge plate (25), and the baffle (3152) is used to block the chip inductor (01) from entering the installation groove (33).

8. The chip inductor multi-side paint stripping device according to claim 3, characterized in that: The precise positioning module (4) comprises a second cylinder (41), a lifting frame (42), a fixed block (43), a movable block (44) and a third cylinder (45); the second cylinder (41) is mounted on the top surface of the substrate (1) via a fourth support frame (46); the lifting frame (42) is connected to the bottom end of the piston rod of the second cylinder (41); the lifting frame (42) is slidably connected to the side of the fourth support frame (46); the lifting frame (42) is located directly above the loading station (111) of a whole row of chip inductors (01); the fixed block (43) is mounted on the bottom surface of the lifting frame (42); the movable block (44) is slidably connected to the lifting frame (42); The bottom surface of the lifting frame (42), the third cylinder (45) is installed on the bottom surface of the lifting frame (42), the third cylinder (45) is located on the side of the movable block (44) away from the fixed block (43), and the piston rod of the third cylinder (45) is connected to the side of the movable block (44) away from the fixed block (43); the bottom of the side of the fixed block (43) close to the movable block (44) is connected with a positioning plate (431), and the bottom of the side of the movable block (44) close to the fixed block (43) is connected with a movable plate (441), and the positioning plate (431) and the movable plate (441) are respectively attached to the two side surfaces of the entire row of chip inductors (01).

9. The chip inductor multi-side paint stripping device according to claim 3, characterized in that: The visual recognition positioning module (5) comprises a camera (51), a center lens (52) and a reflector (53); the center lens (52) is mounted on the top surface of the substrate (1); the camera (51) is mounted on the mounting end of the center lens (52); the reflector (53) is mounted on the top surface of the substrate (1); the reflector (53) forms an angle of 45° with the horizontal plane; the output end of the center lens (52) faces the reflective surface of the reflector (53); the reflector (53) is located directly above the top surface paint stripping station (112); the first galvanometer (62) is located directly above the reflector (53); the laser reflected by the first galvanometer (62) passes through the reflector (53) and is emitted toward the chip inductor (01).

10. The chip inductor multi-side paint stripping device according to claim 3, characterized in that: The unloading module (8) comprises a fourth cylinder (81), a fifth cylinder (82), a second micro-motion slide (83), a second adsorption strip (84) and a silo (85), wherein the fourth cylinder (81) is mounted on the top surface of the substrate (1), the fifth cylinder (82) is mounted on the top of the piston rod of the fourth cylinder (81), and the second micro-motion slide (83) is connected to the end of the piston rod of the fifth cylinder (82); the second adsorption strip (84) is mounted on the top of the second micro-motion slide (83), and the second micro-motion slide (83) drives the second adsorption strip (84) to move in the vertical plane along the X-axis and Y-axis directions; the bottom surface of the second adsorption strip (84) is provided with two rows of adsorption holes, and the two rows of adsorption holes correspond one by one to the two electrodes (012) of the chip inductor (01); the silo (85) is mounted on the top surface of the substrate (1).

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