Loading mechanism for full-automatic silicon wafer scribing machine

Abstract

The invention relates to the technical field of silicon wafer scribing machines, in particular to a loading mechanism for a full-automatic silicon wafer scribing machine. Comprising a loading placement table, a supporting table, a silicon wafer loading auxiliary mechanism and an auxiliary assembly, on one hand, the silicon wafer loading auxiliary mechanism is arranged on the loading placement table, so that the problem that silicon wafers adhere to a tape in the transferring and machining process is solved, unnecessary operation is avoided as much as possible, and the operation intensity of workers is reduced; furthermore, the auxiliary assembly and the silicon wafer loading auxiliary mechanism are matched for use, a corresponding auxiliary effect is achieved on a silicon wafer anti-sticking belt, a certain cleaning effect is also achieved on the silicon wafer through matched use of a communicating pipe body, a conveying air pipe and a sleeve assembly, it is avoided that many impurities adhere to and accumulate on the silicon wafer to be processed, and the silicon wafer loading efficiency is improved. The positive effect of improving the processing quality of the silicon wafer is achieved; therefore, the invention provides a matched auxiliary device for the loading mechanism for silicon wafer processing so as to meet the processing requirements of the loading mechanism.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer dicing machines, and in particular to a loading mechanism for a fully automatic silicon wafer dicing machine. Background Art

[0002] Silicon wafer cutting machine is also known as silicon wafer laser cutting machine and laser scribing machine. The working principle of silicon wafer cutting machine is to use high-energy laser beam to irradiate the surface of the workpiece, so that the irradiated area is partially melted and vaporized, thereby realizing the cutting of silicon materials; silicon wafer cutting machine is mainly used for scribing and cutting of metal materials and silicon, germanium, gallium arsenide and other semiconductor substrate materials, and can process solar panels, silicon wafers, ceramic wafers, aluminum foils, etc. The workpiece is fine and beautiful, and the cutting edge is smooth, which can greatly improve the processing efficiency and optimize the processing effect.

[0003] The existing document with announcement number CN219350255U discloses a dicing machine, which includes: a main body, a first surface of which is connected to a water tank; a bubble eliminating device, including: a three-way joint, including a first port, a second port and a third port; a water outlet pipe, one end of which is connected to the first port, and the other end is connected to a spray head; a water inlet pipe, one end of which is connected to the second port, and the other end is connected to the water tank; an exhaust pipe, one end of which is connected to the third port, and the other end is connected to a waterproof breathable valve through a switching structure; each time the spray head is opened, there is a period of standing time. Since the air density is less than the density of cooling water, during the standing time, the bubbles in the water inlet pipe, the water outlet pipe and the exhaust pipe will move to the waterproof exhaust valve and be discharged, thereby avoiding the presence of bubbles in the cooling water flowing out of the spray head causing water flow interruption, improving the problem of silicon wafers cracking due to uneven cooling after heating, and reducing the fragmentation rate of silicon wafers.

[0004] The above scheme optimizes and improves the cooling process of the dicing machine during the dicing and cutting process. In the above scheme and the prior art, the transfer of silicon wafers is generally carried out through a transfer suction cup, and the transfer suction cup transfers the silicon wafers to the processing point; in this process, the silicon wafers are generally placed on the corresponding loading mechanism by the staff, that is, the transfer suction cup transfers the silicon wafers from the loading mechanism to the processing point, and the silicon wafers are generally placed in a whole stack. When the top silicon wafer is adsorbed and transferred, for thinner silicon wafers, after the top silicon wafer is adsorbed, it may stick to other silicon wafers, and it is generally handled manually by the staff, which brings inconvenience to the processing of silicon wafers; there is a lack of suitable auxiliary devices for the loading mechanism used for silicon wafer processing to meet its processing needs.

[0005] To this end, the present invention proposes a loading mechanism for a fully automatic silicon wafer dicing machine to solve the above-mentioned problem. Summary of the invention

[0006] The object of the present invention is to provide a loading mechanism for a fully automatic silicon wafer dicing machine to solve the problems raised in the above-mentioned background technology.

[0007] To achieve the above-mentioned object, the present invention provides the following technical solutions: a loading mechanism for a fully automatic silicon wafer dicing machine, comprising a loading and placing table, a supporting table, a silicon wafer loading auxiliary mechanism and an auxiliary component; A support platform is provided at the top center of the loading and placing platform, a placement cavity is provided in the support platform, and a silicon wafer is placed on the loading and placing platform; A lifting control cylinder is arranged in the placement cavity, and a supporting plate is arranged on the top of the lifting control cylinder; The silicon wafer loading auxiliary mechanism is arranged at the top side of the loading and placing platform, and the silicon wafer loading auxiliary mechanism is connected to the auxiliary component.

[0008] Preferably, the silicon wafer loading auxiliary mechanism includes a limiting body, a first electrically-controlled telescopic rod, a fixing plate, a connecting plate, an accommodating cavity, a mounting slot, a connecting hole body and an anti-sticking tape assembly; a fixing plate is fixedly provided on the side wall of the first electrically-controlled telescopic rod, and the fixing plate is fixedly connected to the loading and placement platform by screws, a fixing plate is fixedly provided at one end of the first electrically-controlled telescopic rod, the fixing plate is fixedly connected to the limiting body by fixing screws, and an accommodating cavity is penetrated through the limiting body.

[0009] Preferably, a mounting slot is provided at the cavity opening of one end of the accommodating cavity, a threaded slot is provided in the mounting slot, and a connecting hole is provided at one side of the limiting body, and the connecting hole is connected to the accommodating cavity.

[0010] Preferably, an anti-sticking tape component is provided in the accommodating cavity, and the communicating hole body is connected to the auxiliary component.

[0011] Preferably, the anti-sticking tape assembly includes an installation sealing plate, a second electrically-controlled telescopic rod, a connecting plate, a bearing plate, an auxiliary spring, a bearing body, a vent, a soft hair body and an auxiliary sphere; the installation sealing plate is provided with a second electrically-controlled telescopic rod, the installation sealing plate is clamped in the installation slot, and the installation sealing plate is fixed by installing screws, one end of the second electrically-controlled telescopic rod is fixedly provided with a connecting plate, the connecting plate is fixed to one side of the bearing plate by screws, and the other side of the bearing plate is symmetrically fixedly provided with an auxiliary spring, and the other end of the auxiliary spring is fixedly provided on one side of the bearing body.

[0012] Preferably, the carrier is arranged in the accommodating cavity, and ventilation holes are arranged equidistantly in the carrier, and the ventilation holes are arranged through the carrier. A soft fur body is arranged on one side of the carrier, and an auxiliary sphere is arranged at one end of the soft fur body.

[0013] Preferably, the soft hair bodies and the ventilation holes are arranged alternately, and one of the carriers is arranged in the accommodating cavity.

[0014] Preferably, the auxiliary component includes a connecting tube body, an air delivery pipe, a fixed baffle ring, a first auxiliary ball, a through groove body, an internal threaded connecting groove, an internal threaded limiting ring body, a second auxiliary ball, an external threaded connecting ring, a mounting ring body and a sleeve assembly; an air delivery pipe is provided on one side of the connecting tube body, and a fixed baffle ring is symmetrically fixedly provided on the outer wall of the connecting tube body, and the first auxiliary ball is equidistantly and movably provided on one side of the fixed baffle ring, and a through groove body is symmetrically provided on the side wall of the connecting tube body; a sleeve assembly is symmetrically sleeved on the connecting tube body, the internal threaded limiting ring body is threadedly connected to the outer wall of the connecting tube body, and the second auxiliary ball is equidistantly and movably provided on one side of the internal threaded limiting ring body.

[0015] Preferably, the inner walls at both ends of the connecting tube body are provided with internal threaded connecting grooves, the internal threaded connecting grooves are threadedly connected to the external threaded connecting rings, the external threaded connecting rings are fixedly arranged on one side of the mounting ring body, the mounting ring body is fixedly connected to one side of the limiting body, and the connecting tube body and the connecting hole body on the side wall of the limiting body are set in corresponding positions.

[0016] Preferably, two sleeve assemblies are symmetrically arranged on the connecting tube body, and the sleeve assembly includes a sleeve body, an auxiliary cavity groove and a ventilation mesh; the sleeve body is movably sleeved on the connecting tube body, the inner side of the sleeve body is equidistantly arranged with auxiliary cavity grooves, and the outer side of the sleeve body is evenly arranged with ventilation mesh holes.

[0017] Compared with the prior art, the present invention has the following beneficial effects: The silicon wafer loading mechanism designed in the present invention mainly avoids the problem of silicon wafer sticking during the transfer processing by arranging a silicon wafer loading auxiliary mechanism on the loading and placement table, avoids unnecessary operations as much as possible, and saves the operating intensity of the staff; secondly, through the coordinated use of the arranged auxiliary components and the silicon wafer loading auxiliary mechanism, it has a corresponding auxiliary effect on the silicon wafer anti-sticking tape, and through the coordinated use of the arranged connecting pipe body, the conveying air pipe and the sleeve component, it also has a certain cleaning effect on the silicon wafer, avoiding the adhesion and accumulation of a large number of impurities on the silicon wafer to be processed, which has a positive effect on improving the processing quality of the silicon wafer; therefore, the present invention provides a matching auxiliary device for the loading mechanism for silicon wafer processing to meet its processing needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of a loading mechanism and silicon wafers for a fully automatic silicon wafer dicing machine of the present invention; Figure 2 For the present invention Figure 1 A schematic diagram of the structure enlargement in the middle; Figure 3 It is a schematic diagram of the structural connection of the loading mechanism for the fully automatic silicon wafer dicing machine of the present invention; Figure 4 For the present invention Figure 3 A magnified schematic diagram of the structure at B in the middle; Figure 5 It is a schematic diagram of the back side of the structure connection of the silicon wafer loading auxiliary mechanism of the present invention; Figure 6 This is a schematic diagram of the front side of the structure connection of the silicon wafer loading auxiliary mechanism of the present invention; Figure 7 For the present invention Figure 6 A magnified schematic diagram of the structure at C in the middle; Figure 8 This is a schematic diagram of the explosion front side of the auxiliary component structure connection of the present invention; Fig. 9 For the present invention Figure 8 A magnified schematic diagram of the structure at D in the middle; Fig.10 This is a schematic diagram of the auxiliary component structure of the present invention connected to the explosion rear side; Fig.11 For the present invention Fig.10 The enlarged schematic diagram of the structure at E in the middle; Fig.12 For the present invention Fig.10 The enlarged schematic diagram of the structure at F in the middle; Fig.13 It is a schematic diagram of the connection structure of the sleeve assembly of the present invention; Fig.14 For the present invention Fig.13 Enlarged schematic diagram of the structure at G in the middle.

[0019] In the figure: loading and placing table 1, supporting table 2, placing cavity 3, lifting control cylinder 4, supporting plate body 5, limiting body 601, first electrically controlled telescopic rod 602, fixing plate 603, connecting plate 604, accommodating cavity 605, mounting card slot 606, connecting hole body 607, mounting sealing plate 701, second electrically controlled telescopic rod 702, connecting plate 703, bearing plate 704, auxiliary spring 705, bearing body 706, vent hole 707, soft hair body 708, auxiliary ball 709, connecting tube body 801, air delivery pipe 802, fixed baffle ring 803, first auxiliary ball 804, through groove body 805, internal thread connecting groove 806, internal thread limiting ring body 807, second auxiliary ball 808, external thread connecting ring 809, mounting ring body 810, sleeve body 901, auxiliary cavity groove 902, ventilation mesh hole 903. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention are described clearly and completely below. The embodiments of the present invention and all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figure 1-Figure 14 A loading mechanism for a fully automatic silicon wafer dicing machine comprises a loading and placing table 1, a supporting table 2, a silicon wafer loading auxiliary mechanism and an auxiliary component; wherein a supporting table 2 is arranged at the top center position of the loading and placing table 1, a placing cavity 3 is arranged in the supporting table 2, and a silicon wafer is placed on the loading and placing table 1; a whole stack of silicon wafers is placed on the supporting table 2, and when the silicon wafer dicing process is performed, the silicon wafer on the loading and placing table 1 is adsorbed and transferred by a transfer suction cup, and is placed after arriving at the processing site, and then the transfer suction cup returns to the position of the loading and placing table 1 to transfer and transport the silicon wafer. During this process, each time a silicon wafer is transported, the silicon wafer at the top of the whole stack is adsorbed and transferred, and the process is performed in sequence. After processing one piece of the whole stack, the silicon wafer can be placed again.

[0022] In addition, a lifting control cylinder 4 is arranged in the placement cavity 3, and a supporting plate 5 is arranged at the top of the lifting control cylinder 4; the silicon wafer loading auxiliary mechanism is arranged at the top side position of the loading and placement platform 1, and the silicon wafer loading auxiliary mechanism is connected with the auxiliary component; in the process of adsorption and transportation of silicon wafers, the silicon wafer loading auxiliary mechanism can avoid the top silicon wafer and the bottom silicon wafer closely attached to it from sticking to each other, thereby ensuring the stable operation of silicon wafer processing.

[0023] Therefore, the silicon wafer loading mechanism designed in the present invention mainly avoids the problem of silicon wafer sticking during the transfer processing by arranging a silicon wafer loading auxiliary mechanism on the loading and placement table 1, avoids unnecessary operations as much as possible, and saves the operating intensity of the staff; secondly, through the coordinated use of the arranged auxiliary components and the silicon wafer loading auxiliary mechanism, it has a corresponding auxiliary effect on the silicon wafer anti-sticking tape, and through the coordinated use of the arranged connecting pipe body 801, the conveying air pipe 802 and the sleeve assembly, it also has a certain cleaning effect on the silicon wafer, avoiding the adhesion and accumulation of a large number of impurities on the silicon wafer to be processed, which has a positive effect on improving the processing quality of the silicon wafer.

[0024] Example 2: Based on Example 1, please refer to Figure 4-Figure 14The wafer loading auxiliary mechanism includes a limiting body 601, a first electrically controlled telescopic rod 602, a fixing plate 603, a connecting plate 604, a receiving cavity 605, a mounting slot 606, a connecting hole 607 and an anti-adhesion tape assembly; a fixing plate 603 is fixedly provided on the side wall of the first electrically controlled telescopic rod 602, and the fixing plate 603 is fixedly connected to the loading and placing platform 1 by screws, a fixing plate 603 is fixedly provided at one end of the first electrically controlled telescopic rod 602, and the fixing plate 603 is fixedly connected to the limiting body 601 by fixing screws, and a receiving cavity 605 is provided through the limiting body 601; a mounting slot 606 is provided at the cavity opening position of one end of the receiving cavity 605, and a threaded hole is provided in the mounting slot 606 A connecting hole 607 is provided on one side of the limiting body 601, and the connecting hole 607 is connected to the accommodating chamber 605; an anti-adhesion tape component is provided in the accommodating chamber 605, and the connecting hole 607 is connected to the auxiliary component; the limiting body 601 is controlled to move by the first electrically-controlled telescopic rod 602, and an anti-adhesion tape component is provided in the limiting body 601, which can avoid the problem of silicon wafer sticking as much as possible when the silicon wafer is transported; furthermore, the limiting body 601 can be controlled in position under the control of the first electrically-controlled telescopic rod 602, that is, it can be controlled accordingly according to the size of the silicon wafer to meet the loading and placement requirements of the silicon wafer, thereby improving the adaptability and flexibility of silicon wafer loading.

[0025] The anti-adhesive tape assembly here includes a mounting cover plate 701, a second electrically-controlled telescopic rod 702, a connecting plate 703, a bearing plate 704, an auxiliary spring 705, a bearing body 706, a vent hole 707, a soft hair body 708 and an auxiliary ball 709; wherein the second electrically-controlled telescopic rod 702 is arranged in the mounting cover plate 701, the mounting cover plate 701 is stuck in the mounting card slot 606, and the mounting cover plate 701 is fixed by mounting screws, and a connecting plate 703 is fixedly arranged at one end of the second electrically-controlled telescopic rod 702, and the connecting plate 703 is fixed to the bearing plate by screws Auxiliary springs 705 are symmetrically fixedly arranged on one side of the carrier 704, and the other side of the carrier plate 704 is symmetrically fixedly arranged with auxiliary springs 705, and the other end of the auxiliary springs 705 is fixedly arranged on one side of the carrier 706; the carrier 706 here is arranged in the accommodating cavity 605, and the carrier 706 is equidistantly arranged with vents 707, and the vents 707 are arranged through the carrier 706, and a soft hair body 708 is arranged on one side of the carrier 706, and an auxiliary ball 709 is arranged at one end of the soft hair body 708; the soft hair body 708 and the vents 707 are staggered to accommodate A carrier 706 is provided in the cavity 605; in the present embodiment, when the silicon wafer is adsorbed by the transfer suction cup, the support plate 5 is firstly lifted by the lifting control cylinder 4, and then the whole stack of silicon wafers is lifted, and then the top silicon wafer is adsorbed by the transfer suction cup, and at the same time, the second electrically controlled telescopic rod 702 provided on one side of the limiting body 601 pushes the carrier plate 704, and the carrier plate 704 drives the carrier 706 to move until the soft hair body 708 provided on the other side of the carrier 706 contacts the side wall of the silicon wafer; wherein here, the soft hair body 708 is in contact with the side wall of the silicon wafer; An auxiliary sphere 709 is provided at one end of 08, and its purpose is to avoid scratching and damaging the side wall of the silicon wafer as much as possible when the soft hair body 708 contacts the side wall of the silicon wafer, and to provide a protective effect; when the transfer suction cup absorbs the topmost silicon wafer, if the topmost silicon wafer and the bottom silicon wafer in contact with it have a sticky problem, the set soft hair body 708 can block the silicon wafer adhering to the bottom side, that is, after the transfer suction cup absorbs the topmost silicon wafer, the transfer suction cup drives the silicon wafer to rise, and the soft hair body 708 on the side wall of the carrier 706 blocks the sticky silicon wafer.

[0026] The auxiliary components include a connecting tube 801, a gas delivery pipe 802, a fixed baffle ring 803, a first auxiliary ball 804, a through groove body 805, an internal thread connection groove 806, an internal thread limit ring body 807, a second auxiliary ball 808, an external thread connection ring 809, a mounting ring body 810 and a sleeve assembly; a gas delivery pipe 802 is arranged on one side of the connecting tube 801, and a fixed baffle ring 803 is symmetrically fixedly arranged on the outer side wall of the connecting tube 801, and a first auxiliary ball 804 is equidistantly and movably arranged on one side of the fixed baffle ring 803, and a through groove body 805 is symmetrically arranged on the side wall of the connecting tube 801; 01 is symmetrically sleeved with a sleeve assembly, the internal thread limit ring body 807 is threadedly connected to the outer wall of the connecting tube body 801, and a second auxiliary ball 808 is equidistantly and movably arranged on one side of the internal thread limit ring body 807; here, internal thread connection grooves 806 are arranged on the inner side walls at both ends of the connecting tube body 801, the internal thread connection grooves 806 are threadedly connected to the external thread connection ring 809, and the external thread connection ring 809 is fixedly arranged on one side of the mounting ring body 810, and the mounting ring body 810 is fixedly connected to one side of the limiting body 601, and the connecting hole body 607 on the side wall of the connecting tube body 801 corresponds to the setting position of ; Two sleeve assemblies are symmetrically arranged on the connecting tube body 801, and the sleeve assemblies include a sleeve body 901, an auxiliary cavity groove 902 and a ventilation mesh 903; the sleeve body 901 is movably sleeved on the connecting tube body 801, and the inner side of the sleeve body 901 is equidistantly provided with auxiliary cavity grooves 902, and the outer side of the sleeve body 901 is evenly provided with ventilation mesh holes 903; the auxiliary assembly arranged here and the silicon wafer loading auxiliary mechanism have a coordinated effect, that is, the gas in the gas pipe 802 enters the connecting tube body 801, on the one hand, the gas entering the connecting tube body 801 is discharged from the through groove body 801 on the side wall of the connecting tube body 801 05 flows out, and then is ejected through the ventilation mesh 903 on the sleeve body 901, and is ejected toward the direction of the silicon wafer; on the other hand, a part of the gas entering the connecting tube body 801 enters the limiting body 601 from the end of the connecting tube body 801, and then is ejected outward from the ventilation hole 707 in the carrier 706. Here, by arranging the corresponding gas delivery, on the one hand, it can have a corresponding auxiliary effect on preventing the silicon wafer from sticking; on the other hand, it can provide a corresponding cleaning effect on the silicon wafer, and try to avoid the external dust and impurities from adhering and accumulating on the silicon wafer, which has a positive effect on improving its dicing processing quality.

[0027] In this embodiment, the anti-sticking tape assembly provided on the limiting body 601 is detachably provided, that is, for the installation and use of the anti-sticking tape assembly, the connecting plate 703 and the supporting plate 704 are first fixedly connected by screws, and then the supporting body 706 is placed into the accommodating cavity 605 in the limiting body 601 until the set installation sealing plate 701 is stuck in the installation slot 606 at the cavity opening of the accommodating cavity 605, and then fixed with the installation screws.

[0028] The auxiliary components and the limiting body 601 provided in this embodiment can also be disassembled and assembled, which is convenient for subsequent replacement and maintenance. For the installation of the auxiliary components, the sleeve body 901 is first sleeved on the connecting tube body 801. The fixed retaining ring 803 provided on the connecting tube body 801 limits one end of the sleeve body 901. Then, the internal thread limiting ring body 807 is threadedly connected to the connecting tube body 801. The internal thread limiting ring body 807 limits the other end of the sleeve body 901. A first auxiliary ball 804 is provided on one side of the fixed retaining ring 803, and a second auxiliary ball 808 is provided on one side of the internal thread limiting ring body 807. The purpose is to avoid hindering the rotation of the sleeve body 901, that is, the sleeve body 901 provided here contacts the side wall of the entire stack of silicon wafers. When the entire stack of silicon wafers is lifted and lowered by the lifting control cylinder 4, the sleeve body 901 that can be rotated There will not be too much friction with the side walls of the whole stack of silicon wafers, and corresponding friction damage should be avoided as much as possible to ensure the processing quality of the silicon wafer products; here, after the sleeve main body 901 is installed, the mounting ring body 810 is installed on the end of the connecting tube body 801, that is, the external threaded connecting ring 809 on the mounting ring body 810 is threadedly connected with the internal threaded connecting groove 806 at the end of the connecting tube body 801, and then the mounting ring body 810 is fixedly connected to one side of the limiter 601 by screws, and the installation of the auxiliary components can be completed. Here, part of the gas introduced from the air delivery pipe 802 is ejected from the end of the connecting tube body 801, and then enters the accommodating cavity 605 of the limiter 601 from the connecting hole body 607 on the side wall of the limiter 601, and then ejected from the vent hole 707 on the carrier 706, which can be used in conjunction with the soft hair body 708 on one side of the carrier 706.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A loading mechanism for a fully automatic silicon wafer dicing machine, characterized in that: It comprises a loading and placing table (1), a supporting table (2), a silicon wafer loading auxiliary mechanism and auxiliary components; A support platform (2) is arranged at the top center position of the loading and placing platform (1), a placement cavity (3) is arranged in the support platform (2), and a silicon wafer is placed on the loading and placing platform (1); A lifting control cylinder (4) is arranged in the placement cavity (3), and a supporting plate (5) is arranged at the top end of the lifting control cylinder (4); The silicon wafer loading auxiliary mechanism is arranged at a top side position of the loading and placing platform (1), and the silicon wafer loading auxiliary mechanism is connected to the auxiliary component.

2. The loading mechanism for a fully automatic silicon wafer dicing machine according to claim 1, characterized in that: The silicon wafer loading auxiliary mechanism comprises a limiting body (601), a first electrically controlled telescopic rod (602), a fixing plate (603), a connecting plate (604), a receiving cavity (605), a mounting slot (606), a connecting hole (607) and an anti-adhesion tape assembly; a fixing plate (603) is fixedly provided on a side wall of the first electrically controlled telescopic rod (602), and the fixing plate (603) is fixedly connected to the loading and placing platform (1) by means of screws; a fixing plate (603) is fixedly provided on one end of the first electrically controlled telescopic rod (602), and the fixing plate (603) is fixedly connected to the limiting body (601) by means of fixing screws; and a receiving cavity (605) is provided through the limiting body (601).

3. The loading mechanism for a fully automatic silicon wafer dicing machine according to claim 2, characterized in that: A mounting slot (606) is provided at the opening of one end of the accommodating cavity (605), a threaded groove is provided in the mounting slot (606), and a connecting hole (607) is provided on one side of the limiting body (601), the connecting hole (607) being connected to the accommodating cavity (605).

4. The loading mechanism for a fully automatic silicon wafer dicing machine according to claim 2, characterized in that: An anti-adhesion tape component is arranged in the accommodating cavity (605), and the communicating hole body (607) is connected to the auxiliary component.

5. The loading mechanism for a fully automatic silicon wafer dicing machine according to claim 2, characterized in that: The anti-adhesion tape assembly comprises an installation sealing plate (701), a second electrically-controlled telescopic rod (702), a connecting plate (703), a bearing plate (704), an auxiliary spring (705), a bearing body (706), a vent (707), a soft hair body (708) and an auxiliary sphere (709); the installation sealing plate (701) is provided with the second electrically-controlled telescopic rod (702), the installation sealing plate (701) is clamped in the installation slot (606), and the installation sealing plate (701) is fixed by means of installation screws, one end of the second electrically-controlled telescopic rod (702) is fixedly provided with a connecting plate (703), the connecting plate (703) is fixed to one side of the bearing plate (704) by means of screws, the other side of the bearing plate (704) is symmetrically fixedly provided with an auxiliary spring (705), and the other end of the auxiliary spring (705) is fixedly provided on one side of the bearing body (706).

6. The loading mechanism for a fully automatic silicon wafer dicing machine according to claim 5, characterized in that: The carrier (706) is arranged in the accommodating cavity (605), and vent holes (707) are arranged at equal intervals in the carrier (706), and the vent holes (707) are arranged to penetrate the carrier (706). A soft hair body (708) is arranged on one side of the carrier (706), and an auxiliary ball (709) is arranged at one end of the soft hair body (708).

7. The loading mechanism for a fully automatic silicon wafer dicing machine according to claim 5, characterized in that: The soft hair bodies (708) and the ventilation holes (707) are arranged in an alternating manner, and a carrier body (706) is arranged in the accommodating cavity (605).

8. The loading mechanism for a fully automatic silicon wafer dicing machine according to claim 1, characterized in that: The auxiliary component comprises a connecting tube body (801), an air delivery tube (802), a fixed baffle ring (803), a first auxiliary ball (804), a through groove body (805), an internal thread connection groove (806), an internal thread limit ring body (807), a second auxiliary ball (808), an external thread connection ring (809), a mounting ring body (810) and a sleeve assembly; a conveying air tube (802) is arranged on one side of the connecting tube body (801), and a symmetrical fixed outer wall of the connecting tube body (801) is provided. A fixed retaining ring (803) is provided, and a first auxiliary ball (804) is movably and equidistantly embedded on one side of the fixed retaining ring (803); a through groove body (805) is symmetrically provided on the side wall of the connecting tube body (801); a sleeve assembly is symmetrically sleeved on the connecting tube body (801); the internal threaded limiting ring body (807) is threadedly connected to the outer side wall of the connecting tube body (801), and a second auxiliary ball (808) is movably and equidistantly embedded on one side of the internal threaded limiting ring body (807).

9. The loading mechanism for a fully automatic silicon wafer dicing machine according to claim 8, characterized in that: Internal thread connection grooves (806) are provided on the inner side walls at both ends of the connecting tube body (801), and the internal thread connection grooves (806) are threadedly connected to the external thread connection ring (809). The external thread connection ring (809) is fixedly arranged on one side of the mounting ring body (810), and the mounting ring body (810) is fixedly connected to one side of the limiting body (601). The connecting tube body (801) and the connecting hole body (607) on the side wall of the limiting body (601) are arranged at corresponding positions.

10. The loading mechanism for a fully automatic silicon wafer dicing machine according to claim 8, characterized in that: Two sleeve assemblies are symmetrically arranged on the connecting tube body (801), and the sleeve assembly comprises a sleeve body (901), an auxiliary cavity groove (902) and a ventilation mesh hole (903); the sleeve body (901) is movably sleeved on the connecting tube body (801), the auxiliary cavity grooves (902) are equidistantly arranged on the inner side of the sleeve body (901), and the ventilation mesh holes (903) are evenly arranged on the outer side of the sleeve body (901).

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