Heating body calibration test method and heating body calibration test system

Abstract

According to the heating body calibration test method and the heating body calibration test system provided by the invention, the heating body is modularized, so that full detection of incoming material detection is carried out on the heating body while calibration is carried out, that is, in the calibration process, the upper computer can limit the range of the resistance value, TCR and the like of the heating body, and the heating body module exceeding the abnormal value is directly turned back; normal heating body modules can flow into the assembly appliance, the problem of heating bodies can be basically eliminated when heating abnormities occur subsequently, production efficiency is greatly improved, meanwhile, calibration inspection of the heating bodies can be independently carried out in advance, and when the same type of heating bodies are used in different items, the production efficiency is greatly improved. In addition, the heating bodies can be produced, calibrated and inspected in batches at the same time, only the heating bodies which are successfully calibrated need to be connected to the appliance main body during subsequent finished product manufacturing, a plurality of production steps are omitted, and the production efficiency is effectively improved.

Description

Technical Field

[0001] The present application relates to the field of calibration and testing technology, and in particular to a heating element calibration and testing method and a heating element calibration and testing system. Background Art

[0002] At present, when heating-without-burning appliances are produced, the heating element is directly soldered to the mainboard. When calibrating heating-without-burning appliances, the entire appliance is calibrated. This means that when a defective product is calibrated, the machine will also be defective, thereby wasting the rest of the components on the machine. Moreover, the calibration result cannot distinguish whether the defective source is the heating element or the hardware circuit or welding problem. In addition, when calibrating the entire appliance, the heating element incoming materials are not fully tested, which makes it impossible to control the heating element incoming materials, thereby extending the production cycle. Summary of the invention

[0003] The purpose of this application is to solve at least one of the above-mentioned technical defects, especially the technical defect that when the existing technology calibrates the heating non-combustion appliance as a whole, it is impossible to distinguish whether the source of the defect is the heating element or the hardware circuit or welding problem, and it is impossible to fully detect the incoming heating element materials, which leads to low production efficiency.

[0004] The present application provides a heating element calibration test method, which is applied to a host computer, and the method includes:

[0005] After being respectively communicated and connected with each control circuit board and the modularized heating element on each control circuit board, each control circuit board is controlled to calibrate the heating element connected thereto;

[0006] The calibration results returned by each control circuit board are received, and one or more calibration results are stored in the storage chip of the corresponding heating element.

[0007] Optionally, the controlling each control circuit board to calibrate the heating element connected thereto includes:

[0008] When calibration is performed, a calibration instruction is sent to each control circuit board, so that after each control circuit board receives the calibration instruction, it calibrates the heating element connected thereto according to the calibration instruction.

[0009] Optionally, each control circuit board is arranged on a production jig, and an infrared instrument is also arranged on the production jig, and the infrared instrument is communicatively connected with the host computer;

[0010] When performing calibration, sending calibration instructions to each control circuit board includes:

[0011] During calibration, the real-time temperature of the heating element sent by the infrared instrument and the pre-configured initial temperature and initial resistance of the heating element are used to form a calibration instruction, which is then sent to each control circuit board.

[0012] Optionally, the calibration result includes a resistance temperature coefficient of a heating element connected to each control circuit board;

[0013] The receiving of the calibration results returned by each control circuit board and storing one or more of the calibration results in a storage chip of the corresponding heating element includes:

[0014] After receiving the resistance temperature coefficient of the heating element connected to each control circuit board and returned by each control circuit board, each resistance temperature coefficient is compared with the preset coefficient range respectively;

[0015] If one or more resistance temperature coefficients do not exceed the preset coefficient range, the resistance temperature coefficients that do not exceed the preset coefficient range are saved in the storage chip of the corresponding heating element.

[0016] Optionally, the method further comprises:

[0017] The calibration state of the heating element that does not exceed the preset coefficient range is adjusted to calibration success, and the calibration state of the heating element that exceeds the preset coefficient range is adjusted to calibration failure.

[0018] The present application also provides a heating element calibration test method, which is applied to a control circuit board, and the method comprises:

[0019] The connected heating element is calibrated according to the calibration instruction sent by the host computer, and the calibration result is sent to the host computer.

[0020] Optionally, the calibration instruction includes the real-time temperature, initial temperature and initial resistance of the heating element;

[0021] The method of calibrating the connected heating element according to the calibration instruction sent by the host computer and sending the calibration result to the host computer includes:

[0022] After receiving the calibration command sent by the host computer, the real-time resistance of the heating element connected thereto is detected;

[0023] Calculate the resistance temperature coefficient of the heating element connected thereto according to the real-time temperature, initial temperature and initial resistance of the heating element contained in the calibration instruction, and the detected real-time resistance;

[0024] The calculated resistance temperature coefficient is sent to the host computer.

[0025] The present application also provides a heating element calibration and testing system, the system comprising a host computer and a production jig;

[0026] The production jig includes a plurality of control circuit boards, each of which is connected to a modularized heating element, and a storage chip is provided in the heating element;

[0027] The host computer is respectively connected to each control circuit board and the heating element on each control circuit board for controlling each control circuit board to calibrate the heating element connected thereto, and after receiving the calibration results returned by each control circuit board, saves one or more calibration results into the corresponding storage chip.

[0028] Optionally, the production jig is provided with a base adapted to the modularized heating element, and the base is used to fix the heating element.

[0029] Optionally, the storage chip is welded in the heating body through a mainboard.

[0030] Optionally, a heat insulation structure is provided between the heating element and the main board.

[0031] Optionally, the production jig is further provided with an infrared instrument, which is connected to the host computer and is used to send the detected real-time temperature of the heating element to the host computer.

[0032] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0033] The present application provides a heating element calibration test method and heating element calibration test system, wherein the host computer communicates and connects with each control circuit board and the modularized heating element on each control circuit board, thereby controlling each control circuit board to calibrate the heating element connected thereto, and after receiving the calibration results returned by each control circuit board, one or more calibration results are saved in the storage chip of the corresponding heating element. The present application modularizes the heating element, and then performs a full inspection of the incoming material detection on the heating element while calibrating it, that is, during the calibration process, the host computer can limit the range of the heating element resistance and TCR, and the heating element module that exceeds the abnormality is directly returned, and the normal heating element module can flow into the assembly device, and the subsequent heating abnormality can basically exclude the problem of the heating element, thereby greatly improving the production efficiency. At the same time, the calibration inspection of the heating element in the present application can be carried out separately in advance, and when different projects use the same heating element, the heating element can also be produced and calibrated in batches at the same time. When the finished product is subsequently produced, it is only necessary to connect the successfully calibrated heating element to the main body of the device, thereby saving many production steps and effectively improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0035] Figure 1 A schematic diagram of a flow chart of a heating element calibration test method provided in an embodiment of the present application;

[0036] Figure 2 A schematic diagram of the calibration results of each heating element displayed in the host computer provided in the embodiment of the present application;

[0037] Figure 3 A system architecture diagram of a heating element calibration test system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] In one embodiment, Figure 1 As shown, Figure 1 A flow chart of a heating element calibration test method provided in an embodiment of the present application; the present application provides a heating element calibration test method, which is applied to a host computer, and the method may include:

[0040] S110: After being respectively connected to and communicated with each control circuit board and the modularized heating element on each control circuit board, each control circuit board is controlled to calibrate the heating element connected thereto.

[0041] S120: receiving calibration results returned by each control circuit board, and saving one or more calibration results into a storage chip of a corresponding heating element.

[0042] In this embodiment, each control circuit board 130 can be connected to the modularized heating element, and a storage chip is also provided in each heating element, and the host computer 110 can be communicated with each control circuit board 130 and the heating element. In this way, it can control each control circuit board 130 to calibrate the heating element, receive the calibration results returned by each control circuit board 130, and save one or more calibration results in the corresponding storage chip.

[0043] Among them, the control circuit board 130 of the present application can be designed according to the mainboard structure in the heating non-combustion appliance, so that after the heating element is connected to the control circuit board 130, it can be calibrated according to the instructions of the host computer 110, and the real-time resistance value of the heating element can be collected through the communication pin of the heating element, and the calibration result of the heating element can be calculated, and the calibration result can be sent to the host computer 110, so that the host computer 110 can determine whether the heating element is calibrated successfully based on the calibration result.

[0044] The heating element of the present application is a modular heating element, which has a built-in storage chip. When the calibration is successful, the host computer 110 can send the calibration result to the storage chip for storage, so that when the heating element is subsequently installed on the heating without burning appliance, the main board on the heating without burning appliance can directly read the calibration result stored in the storage chip in the heating element, and heat and control the temperature of the heating element according to the calibration result.

[0045] Furthermore, the heating element of the present application can be provided with four pins, one of which is GND, one is for single-line communication and connected to a storage chip, and the calibration result sent by the host computer 110 can be written into the storage chip, and the other two are leads of the heating element, which can be connected to the control circuit board 130.

[0046] In addition, the present application can calibrate multiple heating elements at the same time. For example, if eight heating element modules are inserted into a computer at the same time, calibration and inspection can be performed after setting the corresponding calibration parameters in the host computer 110. After the calibration is passed, it can be saved and wait for the whole machine to be assembled. At this time, the host computer 110 can send the calibration information of each heating element to the storage chip for reading and use by the main board in the heating non-combustion appliance.

[0047] It is understandable that since the information required for calibration of the same project is the same, this part of information can be stored in the configuration file inside the host computer 110 and called when used, and can be changed by R&D personnel when adjustment is needed, thereby preventing calibration problems caused by misoperation of production line employees.

[0048] In the above embodiment, the host computer 110 is respectively connected to each control circuit board 130 and the modularized heating element on each control circuit board 130, so as to control each control circuit board 130 to calibrate the heating element connected thereto, and after receiving the calibration results returned by each control circuit board 130, one or more calibration results are saved in the storage chip of the corresponding heating element. The present application modularizes the heating element, and then performs a full inspection of the incoming material detection on the heating element while calibrating it, that is, during the calibration process, the host computer 110 can limit the range of the heating element resistance and TCR, and the heating element module that exceeds the abnormality is directly returned, and the normal heating element module can flow into the assembly device, and the subsequent heating abnormality can basically be ruled out as a problem of the heating element, thereby greatly improving the production efficiency. At the same time, the calibration inspection of the heating element in the present application can be carried out separately in advance, and when different projects use the same heating element, the heating element can also be produced and calibrated in batches at the same time. When the finished product is subsequently produced, it is only necessary to connect the successfully calibrated heating element to the main body of the device, thereby saving many production steps and effectively improving the production efficiency.

[0049] In one embodiment, controlling each control circuit board 130 to calibrate the heating element connected thereto in S110 may include:

[0050] S111: When performing calibration, a calibration instruction is sent to each control circuit board 130, so that each control circuit board 130 calibrates the heating element connected thereto according to the calibration instruction after receiving the calibration instruction.

[0051] In this embodiment, when the upper computer 110 calibrates the heating element through the control circuit board 130, it can first send a calibration instruction to each control circuit board 130. After receiving the calibration instruction, the control circuit board 130 can calibrate the heating element connected to it according to the calibration instruction, and after obtaining the calibration result, send the calibration result to the upper computer 110. After receiving the calibration result sent by each control circuit board 130, the upper computer 110 can verify each calibration result to determine whether the calibration result is successful, and save the calibration result to the corresponding storage chip if the calibration is successful. In this way, the heating element can be fully inspected during the calibration process, and the heating element modules that exceed the abnormality are directly returned, and the normal heating element modules can flow into the assembly equipment, thereby greatly improving the production efficiency.

[0052] In one embodiment, each control circuit board 130 is disposed on a production jig 120 , and an infrared instrument is also disposed on the production jig 120 , and the infrared instrument is communicatively connected with the host computer 110 .

[0053] When performing calibration in S111, a calibration instruction is sent to each control circuit: 130, which may include:

[0054] S1111: When calibrating, the real-time temperature of the heating element sent by the infrared instrument and the pre-configured initial temperature and initial resistance of the heating element are used to form a calibration instruction, and the calibration instruction is sent to each control circuit board 130 .

[0055] In this embodiment, the production jig 120 is not only provided with a plurality of control circuit boards 130, but also with an infrared meter, which can detect the real-time temperature of each heating element and send it to the host computer 110. After the host computer 110 receives the real-time temperature of the heating element sent by the infrared meter, it can call the initial temperature and initial resistance corresponding to the batch of heating elements in the pre-stored configuration file, and then combine it with the real-time temperature sent by the infrared meter to form a calibration instruction. After the host computer 110 sends the calibration instruction to each control circuit board 130, each control circuit board 130 can calibrate the corresponding heating element according to the calibration instruction.

[0056] In one embodiment, the calibration result may include a resistance temperature coefficient of a heating element connected to each control circuit board 130 .

[0057] Receiving the calibration results returned by each control circuit board 130 in S120 and saving one or more of the calibration results to the storage chip of the corresponding heating element may include:

[0058] S121: After receiving the resistance temperature coefficient of the heating element connected to each control circuit board 130 and returned thereto, each resistance temperature coefficient is compared with a preset coefficient range.

[0059] S122: If one or more resistance temperature coefficients do not exceed the preset coefficient range, the resistance temperature coefficients that do not exceed the preset coefficient range are stored in a storage chip of the corresponding heating element.

[0060] In this embodiment, the calibration result calculated by the control circuit board 130 may be the resistance temperature coefficient of the heating element connected thereto. After the upper computer 110 receives the resistance temperature coefficients sent by each control circuit board 130, each resistance temperature coefficient may be compared with a preset coefficient range respectively. If one or more resistance temperature coefficients do not exceed the preset coefficient range, it indicates that the corresponding heating element has been calibrated successfully. At this time, the resistance temperature coefficients that do not exceed the preset coefficient range may be saved in the corresponding storage chip. If one or more resistance temperature coefficients exceed the preset coefficient range, it indicates that the corresponding heating element has failed in calibration, thereby realizing a full inspection process for incoming material inspection of the heating element.

[0061] In one embodiment, Figure 2 As shown, Figure 2A schematic diagram of calibration results of each heating element displayed in the host computer 110 provided in an embodiment of the present application; the method may also include:

[0062] S123: adjusting the calibration status of the heating element within the preset coefficient range to calibration success, and adjusting the calibration status of the heating element beyond the preset coefficient range to calibration failure.

[0063] In this embodiment, Figure 2 As shown, in the present application, after comparing each resistance temperature coefficient with the preset coefficient range respectively, the upper computer 110 can determine whether the resistance temperature coefficient of each heating element exceeds the preset coefficient range. If not, the calibration status of the corresponding heating element can be adjusted to calibration success. If exceeded, the calibration status of the corresponding heating element can be adjusted to calibration failure, and the current resistance temperature coefficient can be displayed so that R&D personnel can understand the calibration status in a timely manner.

[0064] In one embodiment, the present application further provides a heating element calibration test method, which is applied to a control circuit board. The method may include:

[0065] S210 : Calibrate the connected heating element according to the calibration instruction sent by the host computer 110 , and send the calibration result to the host computer 110 .

[0066] In this embodiment, the control circuit board 130 can be designed according to the mainboard structure in the heating non-combustion appliance, so that after the heating element is connected to the control circuit board 130, it can be calibrated according to the instructions of the host computer 110, and the real-time resistance value of the heating element can be collected through the communication pin of the heating element, and the calibration result of the heating element can be calculated, and the calibration result can be sent to the host computer 110, so that the host computer 110 can determine whether the heating element is calibrated successfully based on the calibration result.

[0067] In one embodiment, the calibration instruction may include the real-time temperature, initial temperature and initial resistance value of the heating element.

[0068] The step of calibrating the connected heating element according to the calibration instruction sent by the host computer and sending the calibration result to the host computer in S210 may include:

[0069] S211: After receiving the calibration instruction sent by the host computer, the real-time resistance of the heating element connected thereto is detected.

[0070] S212: Calculate the resistance temperature coefficient of the heating element connected thereto according to the real-time temperature, initial temperature and initial resistance of the heating element contained in the calibration instruction, and the detected real-time resistance.

[0071] S213: Send the calculated resistance temperature coefficient to the host computer.

[0072] In this embodiment, an infrared meter can be set on the production jig 120. The infrared meter can detect the real-time temperature of the heating element and send it to the host computer 110. After the host computer 110 receives the real-time temperature of the heating element sent by the infrared meter, it can call the initial temperature and initial resistance corresponding to the batch of heating elements in the pre-stored configuration file, and then combine it with the real-time temperature sent by the infrared meter to form a calibration instruction. Then, the host computer 110 in this application can send the calibration instruction to each control circuit board 130, and each control circuit board 130 can calibrate the corresponding heating element according to the calibration instruction.

[0073] Specifically, after each control circuit board 130 in the present application receives the calibration instruction sent by the host computer 110, it can detect the real-time resistance of the heating element through the pin connected to the heating element, and calculate the resistance temperature coefficient of the heating element according to the real-time temperature, initial temperature and initial resistance of the heating element contained in the calibration instruction, and send the calculated resistance temperature coefficient to the host computer 110.

[0074] When the control circuit board 130 of the present application calculates the resistance temperature coefficient of the heating element, the calculation formula is as follows:

[0075] TCR = (R2 - R1) / (R1*(T2 - T1))

[0076] In the above formula, TCR is the resistance temperature coefficient of the heating element, R1 is the initial resistance of the heating element, T1 is the initial temperature of the heating element, T2 is the real-time temperature of the heating element, and R2 is the real-time resistance of the heating element.

[0077] In one embodiment, Figure 3 As shown, Figure 3 This is a system architecture diagram of a heating element calibration and testing system provided in an embodiment of the present application; the present application provides a heating element calibration and testing system, the system comprising a host computer 110 and a production fixture 120.

[0078] The production jig 120 includes a plurality of control circuit boards 130 , each of which is connected to a modularized heating element, and a storage chip is disposed in the heating element.

[0079] The host computer 110 is respectively communicated with each control circuit board 130 and the heating element on each control circuit board 130, and is used to control each control circuit board 130 to calibrate the heating element connected to it, and after receiving the calibration results returned by each control circuit board 130, save one or more calibration results into the corresponding storage chip.

[0080] In the above embodiment, the system includes a host computer 110 and a production jig 120; wherein the production jig 120 includes a plurality of control circuit boards 130, each of which is connected to a modularized heating element, and a storage chip is provided in the heating element; the host computer 110 is respectively communicated with each of the control circuit boards 130 and the heating elements on each of the control circuit boards 130, for controlling each of the control circuit boards 130 to calibrate the heating elements connected thereto, and after receiving the calibration results returned by each of the control circuit boards 130, one or more of the calibration results are saved in the corresponding storage chip. The present application modularizes the heating element, and then performs a full inspection of the incoming materials on the heating element during calibration. That is, during the calibration process, the host computer 110 can limit the range of the heating element resistance and TCR, and the heating element modules that exceed the abnormality will be directly returned, and the normal heating element modules can be flowed into the assembly device. Subsequent heating abnormalities can basically be ruled out as problems with the heating element, thereby greatly improving production efficiency. At the same time, the calibration and inspection of the heating element in the present application can be carried out separately in advance, and when different projects use the same heating element, the heating element can also be produced in batches for calibration and inspection at the same time. When the finished product is subsequently produced, it is only necessary to connect the successfully calibrated heating element to the device body, thereby saving many production steps and effectively improving production efficiency.

[0081] In one embodiment, the production jig 120 is provided with a base adapted to the modularized heating element, and the base is used to fix the heating element.

[0082] In this embodiment, when the control circuit board 130 is used to connect with the modularized heating element, the present application can also set one or more bases on the production jig 120, which are adapted to the modularized heating element, and then the heating element can be fixed for calibration testing.

[0083] Among them, when the present application fixes the heating element through the base, it can be fixed by magnet adsorption, or it can be fixed by plugging and unplugging, or it can be fixed by other fixable methods. The specific settings can be made according to the actual situation and are not limited here.

[0084] In one embodiment, the memory chip is soldered in the heating element via a mainboard, which can avoid damage to the memory chip and extend the service life of the memory chip.

[0085] In one embodiment, a heat insulation structure is provided between the heating element and the mainboard to prevent the storage chip from being damaged due to excessive temperature of the heating element during the heating process.

[0086] In one embodiment, the production jig 120 is further provided with an infrared instrument, which is connected to the host computer 110 and is used to send the detected real-time temperature of the heating element to the host computer 110 .

[0087] In this embodiment, the production jig 120 is not only provided with a plurality of control circuit boards 130, but also with an infrared meter, which can detect the real-time temperature of each heating element and send it to the host computer 110. After the host computer 110 receives the real-time temperature of the heating element sent by the infrared meter, it can call the initial temperature and initial resistance corresponding to the batch of heating elements in the pre-stored configuration file, and then combine it with the real-time temperature sent by the infrared meter to form a calibration instruction. After the host computer 110 sends the calibration instruction to each control circuit board 130, each control circuit board 130 can calibrate the corresponding heating element according to the calibration instruction.

[0088] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0089] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The various embodiments can be combined as needed, and the same or similar parts can refer to each other.

[0090] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heating element calibration test method, applied to a host computer, characterized in that: The method comprises: After being respectively communicated and connected with each control circuit board and the modularized heating element on each control circuit board, each control circuit board is controlled to calibrate the heating element connected thereto; The calibration results returned by each control circuit board are received, and one or more calibration results are stored in the storage chip of the corresponding heating element.

2. The heating element calibration test method according to claim 1, characterized in that: The controlling each control circuit board to calibrate the heating element connected thereto comprises: When calibration is performed, a calibration instruction is sent to each control circuit board, so that after each control circuit board receives the calibration instruction, it calibrates the heating element connected thereto according to the calibration instruction.

3. The heating element calibration test method according to claim 2, characterized in that: Each control circuit board is arranged on a production jig, and an infrared instrument is also arranged on the production jig, and the infrared instrument is communicatively connected with the host computer; When performing calibration, sending calibration instructions to each control circuit board includes: During calibration, the real-time temperature of the heating element sent by the infrared instrument and the pre-configured initial temperature and initial resistance of the heating element are used to form a calibration instruction, which is then sent to each control circuit board.

4. The heating element calibration test method according to claim 1, characterized in that: The calibration results include the resistance temperature coefficient of the heating element connected to each control circuit board; The receiving of the calibration results returned by each control circuit board and storing one or more of the calibration results in a storage chip of the corresponding heating element includes: After receiving the resistance temperature coefficient of the heating element connected to each control circuit board and returned by each control circuit board, each resistance temperature coefficient is compared with the preset coefficient range respectively; If one or more resistance temperature coefficients do not exceed the preset coefficient range, the resistance temperature coefficients that do not exceed the preset coefficient range are saved in the storage chip of the corresponding heating element.

5. The heating element calibration test method according to claim 4, characterized in that: The method further comprises: The calibration state of the heating element that does not exceed the preset coefficient range is adjusted to calibration success, and the calibration state of the heating element that exceeds the preset coefficient range is adjusted to calibration failure.

6. A heating element calibration test method, applied to a control circuit board, characterized in that: The method comprises: The connected heating element is calibrated according to the calibration instruction sent by the host computer, and the calibration result is sent to the host computer.

7. The heating element calibration test method according to claim 6, characterized in that: The calibration instruction includes the real-time temperature, initial temperature and initial resistance value of the heating element; The method of calibrating the connected heating element according to the calibration instruction sent by the host computer and sending the calibration result to the host computer includes: After receiving the calibration command sent by the host computer, the real-time resistance of the heating element connected thereto is detected; Calculate the resistance temperature coefficient of the heating element connected thereto according to the real-time temperature, initial temperature and initial resistance of the heating element contained in the calibration instruction, and the detected real-time resistance; The calculated resistance temperature coefficient is sent to the host computer.

8. A heating element calibration test system, characterized in that: The system includes a host computer and a production jig; The production jig includes a plurality of control circuit boards, each of which is connected to a modularized heating element, and a storage chip is provided in the heating element; The host computer is respectively connected to each control circuit board and the heating element on each control circuit board for controlling each control circuit board to calibrate the heating element connected thereto, and after receiving the calibration results returned by each control circuit board, saves one or more calibration results into the corresponding storage chip.

9. The heating element calibration test system according to claim 8, characterized in that: The production jig is provided with a base adapted to the modularized heating element, and the base is used to fix the heating element.

10. The heating element calibration test system according to claim 8, characterized in that: The storage chip is welded in the heating body through the mainboard.

11. The heating element calibration test system according to claim 10, characterized in that: A heat insulation structure is arranged between the heating element and the main board.

12. The heating element calibration test system according to any one of claims 8 to 11, characterized in that: The production jig is also provided with an infrared instrument, which is connected to the host computer and is used to send the detected real-time temperature of the heating element to the host computer.

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